Substrate transport apparatus and substrate transport method

Abstract

This reduces damage to the circuit board when it comes into contact with components of the circuit board transport device. [Solution] Move the hand 140 of the substrate transport device 100 to the bottom of the substrate W. Move the plunger 150 so that the distance between the substrate contact parts 141A and 141B included in the hand 140 and the plunger 150 of the substrate transport device 100 is increased. Pick up the substrate W. Move the plunger 150 to a position where the distance between the substrate contact parts 141A and 141B and the plunger 150 of the substrate transport device 100 is shortened and lengthened, and the substrate W is not gripped.

Description

Technical Field

[0001] The present disclosure relates to a substrate transfer device and a substrate transfer method, and particularly to a substrate transfer device that grips and transfers a semiconductor substrate or the like.

Background Art

[0002] When manufacturing a semiconductor substrate, a liquid crystal substrate, a panel, etc. (hereinafter, these may be collectively simply referred to as a substrate), a plurality of manufacturing apparatuses are used. A transfer device for transferring a substrate between these manufacturing apparatuses is used. The transfer device includes an industrial robot.

[0003] Patent Document 1 discloses a substrate gripping hand, which includes a base plate and a guide member provided on the base plate. When viewed from the horizontal direction, the guide member is formed in an L shape, a horizontal portion is provided at the base end of the bottom surface of the guide member, and a first corner formed by the bottom surface and the inner wall surface of the guide member is formed in a curved shape. A substrate gripping hand for gripping a disk-shaped substrate provided with a guide member is disclosed.

[0004] Patent Document 2 discloses a clamp device capable of holding and releasing a workpiece. This clamp device includes a tip-side fixed block provided on the tip side, a base-end-side fixed block provided on the base end side, and a movable block on a workpiece holding table. Each fixed block has an upward fixed inclined surface formed, and the movable block has a downward movable inclined surface formed. When holding a workpiece, with the workpiece placed across the upward fixed inclined surface, the movable block is advanced so that the downward movable inclined surface abuts against the side surface of the workpiece. When releasing the workpiece on the workpiece holding table, a clamp device that retracts the movable block in a direction opposite to the workpiece is disclosed.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

[0006] When a substrate transport device transports a substrate, the contact points of the device move to grip the substrate and come into contact with it. During this process, the contact points move at a predetermined speed, which can potentially damage the substrate. For example, if the contact points come into contact with the edge of the substrate, chipping or other damage to the edge of the substrate may occur. [Means for solving the problem]

[0007] In one or more embodiments of the substrate transport method, the hand of the substrate transport device may move to the bottom of the substrate, the plunger may move so that the pocket size, which is the distance between the substrate contact portion included in the hand and the plunger of the substrate transport device, increases, the hand may pick up the substrate, and the plunger may move to a position where it does not grip the substrate, and the distance between the substrate contact portion and the plunger of the substrate transport device decreases.

[0008] In one or more embodiments of the substrate transport method, the handle of the substrate transport device moves to the bottom of the substrate, the handle picks up the substrate, determines whether the substrate is placed on the handle, grips the substrate if it is determined that the substrate is placed on the handle, and proceeds to the next process if it is determined that the substrate is placed on the handle.

[0009] A substrate transport device according to one or more embodiments may include an end effector which includes a handle for gripping a substrate, and a plunger that contacts the substrate and aligns the substrate. The plunger may include a contact portion that contacts the substrate by moving in the direction of the substrate, and the plunger may pick up the substrate by increasing the distance between the substrate contact portion and the contact portion. [Effects of the Invention]

[0010] This reduces the impact generated when the substrate comes into contact with the contact point. This can sometimes reduce damage to the substrate when the contact point comes into contact with it. [Brief explanation of the drawing]

[0011] [Figure 1] This figure shows the top view of a substrate transport device according to one or more embodiments. [Figure 2] This is a flowchart showing a substrate transport method according to one or more embodiments. [Figure 3] This is a cross-sectional view illustrating the operation of a substrate transport method according to one or more embodiments. [Figure 4] This is a flowchart showing a substrate transport method according to one or more embodiments. [Figure 5] This is a top view showing a portion of the end effector of a substrate transport device according to one or more embodiments. [Figure 6] This is a diagram illustrating the operation of a substrate transport method according to one or more embodiments. [Figure 7] This figure shows the top view of a substrate transport device according to one or more embodiments. [Modes for carrying out the invention]

[0012] A substrate transport device according to one or more embodiments will be described in detail with reference to the drawings. In the drawings, identical or similar parts may be denoted by the same or similar reference numerals. The drawings are schematic, and the relationship between thickness and dimensions, and the ratios of length and thickness of each part are examples only and do not limit the scope of the technical concept. The relationships and ratios of dimensions may differ between drawings. In the following description, when describing the positional relationship of each component, terms such as "top," "bottom," "right side," and "left side" will be used as appropriate based on the orientation of the referenced drawing or a specific object, but these indications do not limit the scope of the technical concept. Expressions such as "top," "bottom," "right side," and "left side" may be used even if the parts are not touching each other. "Length direction" may mean the direction of the longer side on the main surface of the component. "Width direction" may mean the direction of the shorter side on the main surface of the component. "Height direction" and "up and down direction" may mean the direction related to the thickness of the main surface of the component. Furthermore, the X-axis, Y-axis, Z-axis, or combinations thereof may be displayed in the figures, and the terms "X-axis direction," "Y-axis direction," and "Z-axis direction" may be used in the specification or drawings to describe the direction.

[0013] Figure 1 shows a top view of a substrate transport device 100 according to one or more embodiments. This substrate transport device 100 includes a base 300, a link 600 rotatably connected to the base 300, and an end effector 130 rotatably connected around a rotation axis 601 for transporting substrates W. The substrate transport device 100 may also have an extendable elevator (not shown) that allows the link 600 and the end effector 130 to move vertically (in the Z direction shown). Although only one link 600 is shown in Figure 1, the substrate transport device 100 is not limited to this and may include two, three, four, or five links 600. Furthermore, the substrate transport device 100 may not include a link 600, and the end effector 130 may be directly connected to the elevator. Furthermore, the substrate transport device 100 may not include an elevator, and one or more links 600 may be directly connected to the base 300. The substrate transport device 100 in Figure 1 specifically shows a horizontal articulated substrate transport device 100, but is not limited to this, and so-called linear-type substrate transport devices without joints or rotational mechanisms can also be implemented. Various operations of the substrate transport device 100 are controlled by a controller (not shown). The controller controls various operations, including the lifting and lowering and rotational movements of the elevator, link 600, and end effector 130.

[0014] The end effector 130 includes a hand 140 for gripping substrates W, including semiconductor substrates and liquid crystal substrates, and various panels (hereinafter collectively referred to simply as substrates W), and a plunger 150 that contacts the substrate W to grip and align the substrate W. The hand 140 includes substrate contact portions 141A, 141B, 142A, and 142B. The plunger 150 includes a movable contact portion 151 for gripping the substrate W, and a holder 153 connected to the contact portion 151 that moves the contact portion 151 based on the drive of a drive unit (not shown). Under the control of a controller, the end effector 130 acquires the substrate W from a predetermined position using the hand 140 and transports the substrate W to a predetermined position. When acquiring a substrate W stored in a FOUP (Front Opening Unified Pod) or the like, the hand 140 moves above or below the substrate W, and when it is recognized that the hand 140 has moved to a predetermined position on the substrate W, the hand 140 stops moving. After that, the hand 140 performs a gripping operation on the substrate W. At this time, the contact portion 151 of the plunger 150 moves and grips the substrate W. As a method for the hand 140 to grip the substrate W, a so-called edge gripping method may be used. In the edge gripping method, the substrate W is held to some extent by the substrate contact portions 141A, 141B, 142A, and 142B, and the contact portion 151 moves and comes into contact with the substrate W. As a result, the contact portion 151 grips the substrate W.

[0015] The substrate W includes substrates such as semiconductor substrates and liquid crystal substrates, as well as various types of panels. For example, the substrate W shown in Figure 1 is circular, but is not limited to this. The substrate W may be made of a transparent material containing a light-transmitting material, or it may be semi-transparent or opaque.

[0016] Figure 2 is a flowchart illustrating a substrate transport method according to one or more embodiments. The substrate transport method according to one or more embodiments will be explained using the substrate transport device 100 shown in Figure 1 and the flowchart in Figure 2. First, the hand 140 moves to the bottom of the substrate W (step S101). Next, the plunger 150 retracts, and the contact portion 151 moves away from the substrate W (opposite direction to the X direction in Figure 1) (step S103). The contact portion 151 of the plunger 150 is connected to the holder 153. The holder 153 may be connected to a shaft portion (not shown). The holder 153 or the shaft portion may be connected to a drive unit (not shown) that generates a driving force. The drive unit provides power to the holder 153 or the shaft portion, causing the holder 153 or the shaft portion to reciprocate, for example, in the longitudinal direction of the holder 153 (X direction in Figure 1). Along with the reciprocating motion of the shaft portion, the shaft portion or the holder 153 also reciprocates. As a result, the contact portion 151 reciprocates in the X direction in Figure 1. The contact portion 151 is driven by the drive unit and retracts in the opposite direction to the X direction shown in the figure. As a result, the contact portion 151 of the plunger 150 moves away from the substrate W. Because the contact portion 151 has moved away from the substrate W, the distance (sometimes referred to as pocket size) between the contact portion 151 and the substrate contact portions 141A and 141B increases. Next, the substrate transport device 100 picks up the substrate W (step S105). Picking up the substrate W involves the end effector 130 moving upward (Z direction in Figure 1). The movement of the end effector 130 may be performed by an elevator for moving the end effector 130 vertically. Alternatively, a separate moving device may be provided for the vertical movement of the end effector 130. In step S103, the pocket size is increased, which reduces the risk of collision between the substrate W and the substrate contact parts 141A and 141B or the contact part 151 when the substrate W is picked up. Next, it is detected whether or not the substrate W is placed on the end effector 130 (step S107). The method for detecting the substrate W may be the method described later, or another method may be used. If it is detected in step S107 that the substrate W is not placed on the end effector 130, an error is processed (step S108).When step S107 detects that the substrate W is placed on the end effector 130, the plunger 150 extends, and the contact portion 151 moves toward the substrate W (X direction in Figure 1) (step S109). The contact portion 151 of the plunger 150 is driven by the drive unit and moves in the X direction as shown in the figure. As a result, the contact portion 151 of the plunger 150 moves toward the substrate W. Because the contact portion 151 has moved toward the substrate W, the pocket size between the contact portion 151 and the substrate contact portions 141A and 141B becomes shorter. At this time, the pocket size may be shortened to the extent that it does not grip the substrate W. Alternatively, when moving the plunger 150 toward the substrate W, the plunger 150 may be stopped after the pocket size has been shortened to the extent that it does not grip the substrate W. Specifically, for example, if the substrate W is circular and has a diameter of 300 mm, the pocket size may be between 0.1 mm and 0.8 mm, or between 0.2 mm and 0.5 mm. After that, the process proceeds to the next step (step S111).

[0017] Thus, in one or more embodiments, during the pick-up operation of the substrate W, the plunger 150 moves to expand the pocket size and pick up the substrate W. Then, the plunger 150 moves to reduce the pocket size. In this way, by expanding the pocket size, damage to the substrate W due to the collision between the substrate W and the plunger 150 when picking up the substrate W can be reduced. Also, during the pick-up operation of the substrate W, the plunger 150 moves to expand the pocket size and pick up the substrate W. Therefore, the contact portion 151 of the plunger 150 and the substrate contact portions 141A, 141B of the hand 140 do not need to extend in the height direction (Z direction in FIG. 3(A)). Therefore, the thickness of the end effector 130 can be reduced. On the other hand, after the hand 140 picks up the substrate W, by reducing the pocket size, the gap between the contact portion 151 of the plunger 150 and the substrate contact portions 141A, 141B of the hand 140 and the substrate W is reduced. Thereby, damage to the substrate W due to contact with the plunger 150, the substrate contact portion 141A, etc. when the substrate W is moved or the like can be reduced. Also, by reducing the gap between the plunger 150 and the substrate W, the flutter of the substrate W when the substrate W is moved can be reduced. Generally, in the gripping operation of the substrate W, after the plunger 150 contacts the substrate W, the plunger 150 further moves in the direction of the substrate W so that the contact portion 151 of the plunger 150 and the substrate contact portions 141A and 141B of the hand 140 securely grip the substrate W. In this case, damage to the substrate W is a concern. According to the substrate transfer device according to one or more embodiments, by reducing the pocket size to the extent that reduces the flutter of the substrate W when moving the substrate W, damage to the substrate W due to contact with the plunger 150, the substrate contact portion 141A, etc. when the substrate W is moved or the like can be reduced.

[0018] Figures 3(A) and 3(B) are cross-sectional views illustrating the operation of a substrate transport method according to one or more embodiments. The operation of a substrate transport device according to one or more embodiments will be explained using the flowchart shown in Figure 2. First, the hand 140 moves to the bottom of the substrate W (step S101), and then the plunger 150 retracts (step S103). As the plunger 150 retracts, the contact portion 151A connected to the holder 153 moves away from the substrate W (opposite direction to the X direction in Figure 1). The holder 153 may be connected to a shaft portion (not shown). The holder 153 or the shaft portion may be connected to a drive unit (not shown) that generates driving force. The drive unit provides power to the holder 153 or the shaft portion, causing the holder 153 or the shaft portion to reciprocate, for example, in the longitudinal direction of the shaft portion (X direction in Figure 1). As the holder 153 or the shaft portion reciprocates, the contact portion 151 reciprocates in the X direction in Figure 3(A). In this way, the contact portion 151A retracts in the opposite direction to the X direction shown in the figure (the direction of the arrow in Figure 3(A)) due to the driving force of the drive unit. Since the contact portion 151A has moved away from the substrate W, the pocket size, which is the distance between the contact portion 151A and the substrate contact portion 141C, becomes longer. In this state, the pocket size between the contact portion 151A and the substrate contact portion 141C is defined as L1. Next, the substrate W is picked up (step S105). Picking up the substrate W involves the end effector 130 moving upward (the Z direction in Figure 3(A)). Since the pocket size L1 has increased in step S103, the risk of collision between the substrate W and the substrate contact portion 141C or contact portion 151 during the pickup of the substrate W can be reduced. Next, the plunger 150 extends (step S107). As the plunger 150 extends, the contact portion 151A moves toward the substrate W (in the X direction in Figure 3(B)). The contact portion 151A is driven by the drive unit and moves in the X direction shown (in the direction of the arrow in Figure 3(B)). As a result, the contact portion 151A moves toward the substrate W. Because the contact portion 151A has moved toward the substrate W, the pocket size between the contact portion 151A and the substrate contact portions 141A and 141B becomes shorter.In this state, the pocket size between the contact portion 151A and the substrate contact portion 141C is set to a pocket size L2 that is shorter than the pocket size L1. The pocket size L2 between the contact portion 151A and the substrate contact portion 141C may be such a distance that the contact portion 151A and the substrate contact portion 141C do not grip the substrate W. Alternatively, when moving the contact portion 151A toward the substrate W, the plunger 150 may be stopped just before it makes contact with the substrate W. For example, when shortening the pocket size, the forward movement of the plunger 150 may be stopped just before the contact portion 151A or the substrate contact portions 141A and 141B touch the substrate W. Or, when shortening the pocket size, the forward movement of the plunger 150 may be stopped when either the contact portion 151A or the substrate contact portion 141C touches the substrate W. Regarding the stopping position of the plunger 150, for example, if the substrate W is circular, the plunger 150 may stop at a location where the pocket size is 0.03% or more and 0.3% or less of the diameter of the substrate W, or it may be 0.06% or more and 0.2% or less of the diameter of the substrate W. For example, if the substrate W is circular and has a diameter of 300 mm, the pocket size may be 300.1 mm or more and 300.8 mm or less, or 300.2 mm or more and 300.5 mm or less. After that, the next operation is performed (step S109). The plunger 150 shown in Figures 3(A) and (B) includes a holder 153 and a contact portion 151A connected to the holder 153, but the plunger 150 can be implemented without being limited to this configuration. For example, the holder 153 and the contact portion 151A may be integrally formed, or the plunger 150 may be made into a rod shape and the drive from the drive unit may be directly transmitted to the substrate W. In this case, the plunger 150 may be rod-shaped, for example, cylindrical, and its cross-section can be circular, elliptical, triangular, square, pentagonal, etc. Also, the contact portion 151A is not limited to the shape shown in Figure 3(A). For example, the contact portion 151A may be cylindrical with a circular top surface when viewed from the opposite direction to the Z direction in Figure 3(A). If the contact portion 151A is cylindrical, it may have a shape like an hourglass, with the center of the side surface being concave from the top surface to the bottom surface of the cylinder.By having the contact portion 151A with a cylindrical shape having a constriction in the central portion of the side surface as described above, it becomes easier to receive the substrate W, and the damage given to the substrate W can be reduced.

[0019] In the contact portion 151A according to one or more embodiments, it includes a contact bottom surface which is the bottom surface where the substrate W contacts, a contact side surface which is the side surface where the substrate W contacts, and a contact boundary surface connecting the contact bottom surface and the contact side surface. As shown in FIGS. 3(A) and (B), the contact bottom surface of the contact portion 151A is inclined so that its thickness decreases as it goes in the tip direction (X direction). In other words, the contact bottom surface is inclined in the direction opposite to the Z direction as it goes in the tip direction. The contact side surface extends in a substantially vertical direction (Z direction). The contact boundary surface is curved so as to draw an arc. The contact portion 151A is not limited to this shape. For example, the contact side surface of the contact portion 151A may be directed in a substantially vertical direction (Z direction) and then gently curved in the X direction. In other words, the apex in the Z direction of the contact side surface of the contact portion 151A may be positioned in the X direction relative to the contact boundary surface. Also, the contact bottom surface of the contact portion 151A may be inclined so that its thickness decreases while gently curving as it goes in the tip direction (X direction). In other words, the contact bottom surface may be inclined in the direction opposite to the Z direction while gently curving as it goes in the tip direction.

[0020] As described above, according to the movement method of the substrate transport device according to one or more embodiments, when picking up a substrate W, the plunger 150 retracts to enlarge the pocket size. This reduces the chance of damage to the substrate W due to contact between the contact portion 151C and the substrate W caused by storage errors of the substrate W stored in the FOUP, etc. Furthermore, after picking up the substrate W, the plunger 150 may temporarily stop moving forward just before gripping the substrate W. This reduces damage to the substrate W when the contact portion 151C and the substrate W collide. In addition, after the hand 140 picks up the substrate W, the pocket size is reduced to reduce the gap between the plunger 150 and the substrate W. This reduces damage to the substrate W due to contact with the contact portion 151C or the substrate contact portion 141A, etc. when the substrate W is moved. Also, by reducing the gap between the contact portion 151C and the substrate W, the flapping of the substrate W when the substrate W is moved can be reduced.

[0021] Figure 4 is a flowchart illustrating a substrate transport method according to one or more embodiments. The substrate transport method according to one or more embodiments will be explained using the substrate transport device 100 shown in Figure 1 and the flowchart in Figure 4. First, the hand 140 moves to the bottom of the substrate W (step S201). Next, the hand 140 picks up the substrate W (step S203). When the hand 140 picks up the substrate W, it may perform the operation of step S103 in the flowchart of Figure 2. That is, the plunger 150 may retract to widen the pocket size. Next, after the substrate W is picked up (step S203), it is detected whether or not the substrate W is placed on the end effector 130 (step S207). If step S207 detects that the substrate W is not placed on the end effector 130, error processing is performed (step S209). If step S207 detects that the substrate W is placed on the end effector 130, the operation proceeds to the next step (step S211). Furthermore, the plunger 150 of the substrate transport device 100 moves forward to reduce the pocket size. As a result, the substrate transport device 100 grips the substrate W (step S210). Here, "gripping the substrate W" includes holding the substrate W by applying a predetermined pressure from the side (thickness side) of the substrate W with the contact portion 151 of the plunger 150 and the substrate contact portions 141A and 141B of the hand 140.

[0022] In one or more embodiments of the substrate transport method, the operation of step S211 and the operation of step S210 may be performed in parallel. For example, the operation of step S211 and the operation of step S210 may be started simultaneously. Alternatively, the operation of step S211 may be started first, and the operation of step S210 may be started without waiting for the completion of the operation of step S211, or the operation of step S210 may be started first, and the operation of step S211 may be started without waiting for the completion of the operation of step S210. The operations of these steps will be described below. In step S211, the plunger 150 grips the substrate W. Before gripping the substrate W, the operation of step S109 in the flowchart of Figure 2 may be performed. That is, the plunger 150 may extend to shorten the pocket size, and the extension of the plunger 150 may be temporarily stopped before gripping. When the plunger 150 grips, the gripping speed of the plunger 150 may be reduced. In other words, when the plunger 150 grips, the plunger 150 may move slowly. Specifically, the time from step S207, when it is detected that the substrate W is placed on the end effector 130, until the plunger 150 grips it may be 0.2 seconds or more and 2 seconds or less, preferably 0.4 seconds or more and 1 second or less.

[0023] Figure 5 is a top view showing a part of the end effector 130 of a substrate transport device 100 according to one or more embodiments. The end effector 130 shown in Figure 5 includes sensors 143A and 143B in the hand 140. Sensor 143A is electrically connected to the controller 155 via wiring 145A. Sensor 143B is also electrically connected to the controller 155 via wiring 145B. The controller 155 controls sensors 143A and 143B, and sensors 143A and 143B communicate with each other. Communication methods between sensors 143A and 143B include communication using light beam sensors, infrared sensors, radio wave sensors, ultrasonic sensors, microwave sensors, etc. For example, based on the control of the controller 155, sensor 143A emits light 147, and sensor 143B detects the light 147. When a substrate W is placed between sensor 143A and sensor 143B, the light 147 is blocked and sensor 143B cannot detect the light 147. Sensor 143B can detect whether or not the substrate W is mounted on the end effector 130 based on whether or not it detects light 147. Here, sensors 143A and 143B may include WOB (Wafer on board) sensors.

[0024] Figures 6(A) and (B) are diagrams illustrating the operation of a substrate transport method according to one or more embodiments. Using Figures 6(A) and (B), the method for determining whether or not a substrate W is placed on the end effector 130, which is the operation of step S207 in the flowchart shown in Figure 4, will be explained. In Figure 6(A), the end effector 130 includes a hand 140, sensors 143A and 143B that detect whether or not a substrate W is placed on the end effector 130, and a controller 155 that controls sensors 143A and 143B. Sensor 143A is built into the hand 140. This reduces the possibility of the substrate W interfering with sensor 143A when the substrate W is gripped. Sensor 143B is located on the hand 140 in a position where it can communicate with sensor 143A. Sensors 143A and 143B are located in positions where the placement of the substrate W is detected. Sensor 143B can communicate with sensor 143A and does not need to be placed on the hand 140 as long as it is in a position where the placement of the substrate W can be detected. Here, sensor 143A may be a transmitter that sends light 147 and sensor 143B may be a receiver that receives light 147. Alternatively, sensor 143B may be a transmitter that sends light 147 and sensor 143A may be a receiver that receives light 147. As shown in Figure 6(A), sensors 143A and 143B communicate using light 147 based on the control of controller 155. When acquiring substrate W stored in FOUP (Front Opening Unified Pod), etc., the hand 140 moves below substrate W. After that, the hand 140 performs a pickup operation of substrate W. During the pickup operation, the end effector 130 moves upward (Z direction in the figure). In this case, as shown in Figure 6(B), when the end effector 130 moves upward, the substrate W blocks the light 147, and sensors 143A and 143B detect the placement of the substrate W.

[0025] If the placement of the substrate W is detected in step S207, the process proceeds to step S211 and moves to the next operation. On the other hand, if the light 147 is not obstructed even when the hand 140 moves to a predetermined position, sensors 143A and 143B detect that the substrate W is not placed. If the absence of the substrate W is detected, the process proceeds to step S209 and error processing is performed.

[0026] As described above, in the substrate transport method according to one or more embodiments, steps S210 and S211 are performed when the detection by sensors 143A and 143B of whether or not a substrate W has been placed is completed. This allows the system to move to the next operation S211 before the gripping operation is completed, thus reducing the impact on throughput. Furthermore, since the gripping operation has a reduced impact on throughput, there is more time to grip the substrate W. Therefore, the movement of the plunger 150 can be slowed down, reducing the possibility of damage to the substrate W. As described above, according to the substrate transport method and substrate transport apparatus according to one or more embodiments, it is possible to perform the substrate gripping operation on the substrate W while reducing damage to the substrate W without reducing the throughput of the substrate gripping operation of the substrate transport apparatus.

[0027] Figure 7 shows a top view of a substrate transport device 101 according to one or more embodiments. This substrate transport device 101 includes a base 300, a link 600 rotatably connected to the base 300, and an end effector 130 rotatably connected around a rotation axis 601 for transporting substrates W. The substrate transport device 101 may also have an extendable elevator (not shown) that can move the link 600 and the end effector 130 vertically (in the Z direction shown). Although Figure 7 shows only one link 600 in the substrate transport device 101, it is not limited to this and may include two, three, four, or five links 600. Furthermore, the substrate transport device 101 may not include a link 600 and may have the end effector 130 directly connected to an elevator (not shown). Furthermore, the substrate transport device 101 may not include an elevator and may have one or more links 600 directly connected to the base 300. Figure 7 shows a substrate transport device 101, specifically a horizontal articulated type, but is not limited to this; so-called linear-type substrate transport devices without joints or rotational mechanisms can also be implemented. The substrate transport device 101 is controlled by a controller (not shown). The controller controls various movements, including the lifting and rotating movements of the elevator, link 600, and end effector 130.

[0028] The end effector 130 includes a hand 140 for gripping substrates W, including semiconductor substrates and liquid crystal substrates, and various panels, and a plunger 150 that contacts the substrate W to grip and align the substrate. The hand 140 includes substrate contact portions 141A and 141B. The plunger 150 includes a plurality of movable contact portions 151B and 151C for gripping the substrate W. Under the control of the controller, the end effector 130 acquires the substrate W from a predetermined position using the hand 140 and transports the substrate W to a predetermined position. When acquiring a substrate W stored in a FOUP (Front Opening Unified Pod) or the like, the hand 140 moves above or below the substrate W. When it is recognized that the hand 140 has moved to a predetermined position on the substrate W, the hand 140 stops moving. After that, the hand 140 performs a gripping operation on the substrate W. At this time, multiple contact portions 151B and 151C of the plunger 150 move and grip the substrate W. As a method for the hand 140 to grip the substrate W, a so-called edge grip method may be used. In the edge grip method, the contact portions 151B, 151C and the substrate contact portions 141A, 141B hold the substrate W to some extent, and the contact portions 151B and 151C move and come into contact with the substrate W. As a result, the contact portions 151B and 151C of the hand 140 grip the substrate W.

[0029] One or more embodiments described herein can be combined with one another insofar as they are practicable within the scope of the intended embodiments. The embodiments described herein should be considered in all respects to be illustrative and not limiting. The illustrated and described embodiments can be extended to include other embodiments in addition to those specifically described without departing from the technical scope. The technical scope should be determined not by the foregoing description alone, but in light of the specification including its equivalents. Accordingly, all configurations including the technical scope and the scope of equivalents are intended to be included in the technical scope.

[0030] The one or more exemplary embodiments described above are specific examples of the following embodiments.

[0031] (Aspect 1) In a method for transporting substrates, The handle of the substrate transport device moves to the bottom of the substrate, The plunger moves such that the pocket size, which is the distance between the substrate contact portion included in the hand and the plunger of the substrate transport device, becomes longer. The hand picks up the substrate, A substrate transport method comprising: moving the plunger to a position where it does not grip the substrate, thereby shortening the distance between the substrate contact portion and the plunger. (Aspect 2) A substrate transport method according to embodiment 1, wherein the plunger is moved so that the distance between the substrate contact portion and the plunger is shortened, and then the plunger stops moving. (Aspect 3) The substrate transport method according to embodiment 2, wherein, when shortening the distance between the substrate contact portion and the plunger, the movement of the plunger is stopped at a position where at least one of the substrate contact portion and the plunger does not touch the substrate. (Aspect 4) In a method for transporting substrates, The handle of the substrate transport device moves to the bottom of the substrate, The hand picks up the substrate, Determine whether the substrate is placed on the hand, When it is determined that the substrate is placed on the hand, the hand grips the substrate, A substrate transport method that proceeds to the next process when it is determined that the substrate is placed on the hand. (Aspect 5) A substrate transport method according to embodiment 4, wherein after moving the hand to the lower part of the substrate, the plunger is moved so that the distance between the substrate contact portion included in the hand and the plunger increases. (Aspect 6) The substrate transport method according to embodiment 5, further comprising moving the plunger such that the distance between the substrate contact portion and the plunger is shortened. (Aspect 7) The contact portion of the plunger that contacts the substrate is The contact bottom surface is the bottom surface that the substrate contacts, The contact surface is the side surface that the substrate contacts, Including the contact bottom surface and the contact side surface, The substrate transport method according to either embodiment 1 or 5, wherein the contact bottom surface is inclined such that its thickness decreases towards the tip. (Pattern 8) The substrate transport method according to embodiment 7, wherein the contact interface includes a curved surface. (Aspect 9) In a device for transporting substrates, The end effector includes a hand that grips the substrate and includes a substrate contact portion, and a plunger that contacts the substrate and aligns the substrate, The plunger includes a contact portion that contacts the substrate by moving in the substrate direction, which is the direction toward the substrate, The plunger is a substrate transport device that picks up the substrate by increasing the distance between the substrate contact portions. (Aspect 10) The substrate transport apparatus according to embodiment 9, wherein the plunger, after picking up the substrate, shortens the distance between the substrate contact portion and the contact portion, and then grips the substrate. (Aspect 11) The end effector further includes a sensor for detecting the placement of the substrate, A substrate transport device according to embodiment 9, wherein gripping of the substrate is initiated before the detection of the substrate placement by the sensor is completed. (Aspect 12) The contact portion of the plunger that contacts the substrate is The contact bottom surface is the bottom surface that the substrate contacts, The contact surface is the side surface that the substrate contacts, Including the contact bottom surface and the contact side surface, The substrate transport apparatus according to embodiment 11, wherein the contact bottom surface is inclined such that its thickness decreases towards the tip. (Aspect 13) The substrate transport apparatus according to embodiment 12, wherein the contact interface surface includes a curved surface. [Explanation of Symbols]

[0032] W board 100,101 Substrate transport device 130 End Effector 140 hands 141A, 141B, 141C, 142A, 142B Board contact part 143A, 143B Sensor 145A, 145B wiring 147 light 150 plungers 151,151A,151B,151C Contact part 153 Holder 155 Controller 300 base 600 links 601 Rotation axis L1, L2 pocket size

Claims

1. In a method for transporting substrates, The handle of the substrate transport device moves to the bottom of the substrate, The plunger moves such that the pocket size, which is the distance between the substrate contact portion included in the hand and the plunger of the substrate transport device, becomes longer. The hand picks up the substrate, A substrate transport method comprising: moving the plunger to a position where it does not grip the substrate, thereby shortening the distance between the substrate contact portion and the plunger.

2. The substrate transport method according to claim 1, wherein the plunger is moved so that the distance between the substrate contact portion and the plunger is shortened, and then the plunger stops moving.

3. The substrate transport method according to claim 2, wherein when shortening the distance between the substrate contact portion and the plunger, the movement of the plunger is stopped at a position where at least one of the substrate contact portion and the plunger does not touch the substrate.

4. In a method for transporting substrates, The handle of the substrate transport device moves to the bottom of the substrate, The hand picks up the substrate, Determine whether the substrate is placed on the hand, When it is determined that the substrate is placed on the hand, the hand grips the substrate, A substrate transport method that proceeds to the next process when it is determined that the substrate is placed on the hand.

5. The substrate transport method according to claim 4, wherein after moving the hand to the lower part of the substrate, the plunger is moved so that the distance between the substrate contact portion included in the hand and the plunger increases.

6. The substrate transport method according to claim 5, further comprising the plunger moving such that the distance between the substrate contact portion and the plunger is shortened.

7. The contact portion of the plunger that contacts the substrate is The contact bottom surface is the bottom surface that the substrate contacts, The contact surface is the side surface that the substrate contacts, Including the contact bottom surface and the contact side surface, The substrate transport method according to claim 1 or 5, wherein the contact bottom surface is inclined such that its thickness decreases towards the tip.

8. The substrate transport method according to claim 7, wherein the contact interface includes a curved surface.

9. In a device for transporting substrates, The end effector includes a hand that grips the substrate and includes a substrate contact portion, and a plunger that contacts the substrate and aligns the substrate, The plunger includes a contact portion that contacts the substrate by moving in the substrate direction, which is the direction toward the substrate, The plunger is a substrate transport device that picks up the substrate by increasing the distance between the substrate contact portions.

10. The substrate transport device according to claim 9, wherein the plunger, after picking up the substrate, shortens the distance between the substrate contact portion and the contact portion, and then grips the substrate.

11. The end effector further includes a sensor for detecting the placement of the substrate, The substrate transport device according to claim 9, wherein gripping of the substrate is initiated before the detection of the substrate placement by the sensor is completed.

12. The contact portion of the plunger that contacts the substrate is The contact bottom surface is the bottom surface that the substrate contacts, The contact surface is the side surface that the substrate contacts, Including the contact bottom surface and the contact side surface, The substrate transport device according to claim 11, wherein the contact bottom surface is inclined such that its thickness decreases towards the tip.

13. The substrate transport apparatus according to claim 12, wherein the contact interface surface includes a curved surface.

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