Film forming device

Abstract

The present invention provides a film deposition apparatus that prevents the breakage of heating elements such as heaters within a vacuum chamber and allows for automatic adjustment of the distance between the target and the workpiece. [Solution] The film deposition apparatus of the embodiment is provided in a vacuum chamber for performing film deposition and includes a table on which a workpiece is placed, a target provided opposite to the table and formed with a film deposition material, a rotating shaft that penetrates to the outside of the vacuum chamber and is provided to be movable in a direction toward or toward the target and rotates the table, a heater that heats the workpiece placed on the table, a first pipe that penetrates to the outside of the vacuum chamber and is provided to be movable in a direction toward or toward the target and houses wiring that supplies power to the heater or a sheath that houses the wiring, an arm provided outside the vacuum chamber that is connected to the rotating shaft and supports the first pipe, and a linear drive mechanism provided outside the vacuum chamber that moves the table toward or toward the target, with the rotating shaft and the first pipe as a single unit.

Description

Technical Field

[0001] Embodiments of the present invention relate to a film forming apparatus.

Background Art

[0002] As an apparatus for forming a film on the surface of a workpiece such as a substrate, a film forming apparatus by sputtering is widely used. Sputtering generates ions by plasmaizing an inert gas introduced into an evacuated vacuum chamber, and the generated ions collide with the surface of a target which is a film forming material, so that the film forming material flies and adheres to the workpiece on the rotating table. This is a technique utilizing such phenomenon.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above-described film forming apparatus, a workpiece such as a substrate to be film formed is carried into a rotating table in a vacuum chamber, and a film forming process is performed. At this time, by heating the workpiece on the table at an appropriate temperature, the adhesion of the film forming material to the workpiece is improved, the crystallinity of the film forming material is improved, and a desired film thickness can be obtained. Since the heating temperature varies depending on the material of the workpiece, the surface state, or the film forming material, a heating mechanism is provided on the lower surface side of the table, and an appropriate temperature is maintained by changing the distance between the target and the workpiece.

[0005] Also, when changing the distance between the target and the workpiece, it is common to provide a spacer on the target side and adjust the distance by manually replacing this spacer.

[0006] As shown in Figure 15, in the comparative example, a heating section 120 is provided on the lower side of the rotary table 100, and the heating element 130a connected to the heater 130 may bend and subjected to load. In addition, in the film deposition apparatus 1 of the comparative example, a spacer 191 is provided between the lid 10a and the target 190 to adjust the T / S distance.

[0007] If the rotary table 100 on which the workpiece W is placed is made movable in order to adjust the distance between the target 190 and the workpiece W in the Y direction, the heating element 130a of the heater 130 will have to be moved simultaneously so that the distance to which the rotary table 100 is heated does not change. However, this heating element may bend and break due to the movement.

[0008] Therefore, an embodiment of the present invention provides a film deposition apparatus that prevents the breakage of the heating element portion of the heating element 130a in a vacuum chamber and allows for automatic adjustment of the distance between the target and the workpiece. [Means for solving the problem]

[0009] The film deposition apparatus of the embodiment is characterized by comprising: a table provided in a vacuum chamber for performing film deposition and on which a workpiece to be processed is placed; a target disposed in the vacuum chamber and opposite to the table, formed including a film deposition material to be deposited on the workpiece by sputtering; a rotating shaft that penetrates to the outside of the vacuum chamber and is provided to be movable in a direction toward or toward the target, and rotates the table; a heater for heating the workpiece placed on the table; one or more first pipes that penetrate to the outside of the vacuum chamber and are provided to be movable in a direction toward or toward the target, and house wiring that supplies power to the heater or a sheath housing the wiring; one or more arms connected to the rotating shaft outside the vacuum chamber and supporting one or more of the first pipes; and a linear drive mechanism provided outside the vacuum chamber that moves the table toward or toward the target, with the rotating shaft and one or more of the first pipes as a single unit. [Brief explanation of the drawing]

[0010] [Figure 1] This is a block diagram of the film deposition apparatus in this embodiment. [Figure 2] This figure shows the schematic configuration of the film deposition apparatus in this embodiment. [Figure 3] This figure shows the cross-sectional shape of the film deposition chamber in this embodiment. [Figure 4] This figure shows the structure of the linear drive mechanism in this embodiment. [Figure 5] This is an enlarged view of the area near the partition wall in this embodiment. [Figure 6] This is a diagram showing the schematic configuration of the heating section in this embodiment. [Figure 7] This figure shows the schematic configuration of the linear drive mechanism in this embodiment. [Figure 8] This figure shows the schematic configuration of the heater in this embodiment. [Figure 9] This figure shows the state of the heater in this embodiment before and after the operation of the linear drive mechanism. [Figure 10] This figure illustrates the pressure generated in the rotating shaft and the like in this embodiment. [Figure 11] This diagram illustrates the pressure generated on the rotating shaft and other components in the comparative example. [Figure 12] This is a block diagram of the control unit in this embodiment. [Figure 13] This is an example of a flowchart for the film deposition apparatus in this embodiment. [Figure 14] This is a hardware configuration diagram of the control unit in this embodiment. [Figure 15] This figure shows the cross-sectional shape of the film deposition chamber in the comparative example. [Modes for carrying out the invention]

[0011] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. These embodiments do not limit the present invention. The drawings are schematic or conceptual, and the ratios of each part are not necessarily the same as the actual ones. In the specification and drawings, the same reference numerals are assigned to the same elements as those described above with respect to the previous drawings, and detailed descriptions are appropriately omitted.

[0012] In the present disclosure, the terms "above" and "below" can be appropriately read as "more than" and "less than", respectively. Also, the terms "more than" and "less than" can be appropriately read as "above" and "below", respectively.

[0013] Also, the X-axis, Y-axis, and Z-axis described below indicate axes perpendicular to each other. The X-direction and Y-direction intersect each other and correspond to the lateral direction (horizontal direction) perpendicular to the gravitational direction. The Z-direction corresponds to the longitudinal direction (vertical direction) intersecting the X-direction and Y-direction. Also, the +Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction. Also, the θ direction corresponds to the rotational direction with the Z-axis as the rotation axis. The X-direction is an example of the first direction, the Y-direction is an example of the second direction, and the Z-direction is an example of the third direction.

[0014] FIG. 1 is a block diagram of a film forming apparatus 1 in the present embodiment.

[0015] The film forming apparatus 1 in the present embodiment is an apparatus that forms a film on the surface of a workpiece to be processed, such as a substrate (also referred to as a substrate S), by sputtering. The film forming apparatus 1 includes a film forming chamber 10, a load lock chamber 20, and a control unit 30, and the processing in each chamber is performed by the control unit 30.

[0016] In the present embodiment, after an unprocessed substrate S is carried into the load lock chamber 20 by manual input or a robot, the inside of the chamber is evacuated. After the load lock chamber 20 reaches a predetermined pressure, the substrate S is carried from the load lock chamber 20 into the film forming chamber 10, and a film forming process is performed.

[0017] The load lock chamber 20 is designed to maintain an atmosphere at a pressure lower than atmospheric pressure through exhaust. The load lock chamber 20 is also provided with an exhaust line, which is connected to a pneumatic circuit (not shown) and is a path for reducing the pressure inside the sealed load lock chamber 20, as well as a vent line connected to a valve, etc., for breaking the vacuum in the load lock chamber 20. The load lock chamber 20 and the film deposition chamber 10 are sealed and connected. After the pressure inside the load lock chamber 20 is reached by exhaust, the work holder WH is transported into the film deposition chamber 10 by a transport mechanism provided inside the chamber.

[0018] The detailed structure will be described later using Figure 2, but the substrate S is brought into the deposition chamber 10 from the load lock chamber 20 so as to face the target 190, which will be the material to be deposited on. After the substrate S (workpiece) is brought into the deposition chamber 10 from the load lock chamber 20 in this embodiment, the distance between T (target) and S (substrate) (hereinafter referred to as the T / S distance) is adjusted. Details of the adjustment of the T / S distance will be described later. The T / S distance is an example of the distance between the target 190 and the workpiece.

[0019] After adjusting the T / S distance, a film deposition process is performed on the substrate S in the deposition chamber 10. The deposition apparatus 1 applies power to a target placed in the deposition chamber 10, thereby plasma-generating the sputtering gas G and depositing the deposition material onto the substrate S. The power supply voltage used in this embodiment is, for example, an RF power supply that applies a high-frequency voltage, but it may also be configured to apply a DC voltage. Furthermore, the deposition apparatus 1 may be configured to switch between an RF mode, which applies power using an RF power supply, and a DC mode, which applies a DC voltage.

[0020] After the film deposition process is complete, the processed substrate S is removed from the deposition chamber 10 to the load lock chamber 20. The substrate S removed from the load lock chamber 20 is then removed from the deposition apparatus 1 by human power or robot.

[0021] In this embodiment, for the sake of simplicity, an example in which the film deposition apparatus 1 is equipped with one film deposition chamber 10 will be described, but the configuration of the film deposition apparatus 1 is not limited to this. For example, the film deposition apparatus 1 may have a multi-chamber configuration with multiple film deposition chambers 10. The technology of this embodiment can be applied to various film deposition chambers 10 that adjust the distance between the target and the workpiece. Furthermore, the film deposition apparatus 1 may include processes other than those described in this embodiment, such as surface treatment.

[0022] Figure 2 shows a schematic configuration of the film deposition apparatus 1 in this embodiment.

[0023] This figure shows a schematic configuration of the load lock chamber 20 and the deposition chamber 10 of the deposition apparatus 1, viewed from the -Y direction. In this embodiment, an example in which the deposition chamber 10 has a horizontal configuration is used for explanation, but the technology of this embodiment can be applied similarly to a vertical configuration. The load lock chamber 20 and the deposition chamber 10 are separated by a door-like partition 15.

[0024] The load lock chamber 20 is equipped with a transport mechanism 200. The transport mechanism 200 includes a hand 210, fingers 220, and a hand drive mechanism 230. Unprocessed substrate S is brought into the transport mechanism 200 of the load lock chamber 20 by human power or robot. The loading into the load lock chamber 20 is completed by opening the load lock door 16, which is a door that allows the inside of the load lock chamber 20 to communicate with the outside, with the film deposition chamber 10, which has a continuous space, sealed and depressurized by a partition 15, having the work holder WH on which the substrate S is placed held by the hand 210 and fingers 220, and then closing the load lock door 16. After the loading of the substrate S is completed, the control unit 30 evacuates the chamber using a vacuum pump (not shown).

[0025] After the load lock chamber 20 reaches the same predetermined pressure as the deposition chamber 10 due to exhaust, the partition 15 opens, and the hand drive mechanism 230 moves the hand 210 in the +X direction in the figure. At this time, the deposition apparatus 1 transports the substrate S into the deposition chamber 10 while maintaining the predetermined pressure.

[0026] The hand 210 and finger 220 have a curved plate shape and a rod shape, respectively, and are members that hold the disc-shaped work holder WH. For example, the entire side surface of the work holder WH is provided with recesses, and the hand 210 and finger 220 are fitted into these recesses to hold it. To hold the work holder WH, the finger 220 is rotated in the direction of the arrow, with axis A as the axis of rotation (with the Y axis as the axis of rotation), and the work holder WH is inserted into the inside of the hand 210 and finger 220.

[0027] The hand drive mechanism 230 is a drive mechanism provided in the hand. The hand drive mechanism 230 transports the work holder WH, held by the hand 210 and fingers 220, into the deposition chamber 10. After processing the substrate S, it also transports the work holder WH out of the deposition chamber 10. The hand drive mechanism 230 is configured, for example, by a rack and pinion and operates under the control of the control unit 30, realizing linear movement (movement in the -X direction in Figure 2) from the load lock chamber 20 to the deposition chamber 10. The hand drive mechanism 230 is an example of a first movement mechanism. The transport mechanism 200 may also include a second movement mechanism, which is not shown. The first movement mechanism transports the work holder WH by moving in the X direction, while the second movement mechanism transports the work holder WH by moving in the Y direction. For example, the second movement mechanism is realized by a linear movement mechanism such as a linear guide.

[0028] The deposition chamber 10 is equipped with a rotary table 100 and the like. This section describes the operation of loading and unloading the work holder WH, and the detailed configuration of the deposition chamber 10 will be described later.

[0029] The hand drive mechanism 230 loads the work holder WH into the deposition chamber 10 and positions it in a predetermined position. At this time, positioning may be performed not only in the X direction but also in the Y direction. After the work holder WH has been aligned, the chuck mechanism 110 fixes the work holder WH on the rotary table 100 using a mechanical chuck, completing the loading process. After the loading of the work holder WH is complete, the transport mechanism 200 releases the work holder WH, moves it into the load lock chamber, and closes the partition 15.

[0030] Furthermore, after the processing of the substrate S is completed, the partition section 15 is opened and the transport mechanism 200 unloads the work holder WH. The transport mechanism 200 controls the hand 210 and finger 220 to hold the work holder WH, and then controls the chuck mechanism 110 to release the work holder WH from the rotary table 100.

[0031] Subsequently, the hand drive mechanism 230 controls the movement of the work holder WH into the load lock chamber 20, closes the partition 15, and opens the load lock chamber 20 to the atmosphere. After the load lock chamber 20 reaches atmospheric pressure, the processed substrate S is removed from the film deposition apparatus 1 by human power or robot.

[0032] Figure 3 shows the cross-sectional shape of the film deposition chamber 10 in this embodiment.

[0033] Figure 3 shows a cross-sectional view of the deposition chamber 10 as seen from the -X direction. The deposition chamber 10 mainly comprises a lid 10a, a partition wall 10b, a rotary table 100, a table 100a, a rotating shaft 100b, a motor for the table 100c, a chuck mechanism 110 (see Figure 2), a heating section 120, a heater 130, a pipe 140, an arm 150, an exhaust section 170, a linear drive mechanism 180, and a target 190. The deposition chamber 10 is also equipped with support parts, sliding bearings, a shaft, and a sheath-type thermometer (not shown), which will be explained using the drawings described later.

[0034] The space enclosed by the lid 10a and the partition wall 10b is also called a vacuum chamber. Furthermore, in Figure 3, for the sake of simplicity, the work holder WH is included in the table 100a, and the substrate S is placed on the table 100a.

[0035] In this embodiment, the film deposition chamber 10 is configured to allow adjustment of the distance between the target 190 and the substrate S. More specifically, a linear drive mechanism 180 is provided outside the vacuum chamber of the film deposition chamber 10, separated by a partition wall 10b. This drive mechanism allows a rotating shaft 100b, which is positioned to penetrate the inside of the vacuum chamber, and a table 100a attached to its tip, to move in the Y direction. Furthermore, during the film deposition process, a heater 130 connected to a heating section 120 moves in the Y direction in order to heat the table 100a while maintaining a predetermined distance.

[0036] When the table 100a is moved by the linear drive mechanism 180, in the configuration of the comparative example described above, the heating element 130a of the heater 130 bends and is subjected to load. In such a case, if the table 100a is repeatedly moved by the linear drive mechanism 180, it is conceivable that the heating element 130a may break, or that the heating element 130a may come into contact with any part inside the film deposition chamber 10, causing a ground fault.

[0037] Therefore, in this embodiment, a pipe 140 is provided on the outside of the non-heating part 130b of the heater 130, and the pipe 140 is held by an arm 150 provided on the side of the rotating shaft 100b. The pipe 140 penetrates into the inside of the vacuum chamber and is slidably provided inside the vacuum chamber, and the pipe 140 is pushed into the vacuum chamber by the arm 150 provided on the side of the rotating shaft 100b, so that the rotating shaft 100b and the pipe 140 move together as a single unit. For example, the rotating shaft 100b and the pipe 140 move simultaneously.

[0038] In this embodiment, the partition wall 10b is provided with an outer cylinder 141 which serves as the insertion point for the pipe 140. The pipe 140 slides against the outer cylinder 141 and is inserted into the vacuum chamber. In addition, to maintain the sealing performance inside the vacuum chamber, sealing materials 141a and 141b, such as O-rings, are provided on the inner circumference of the outer cylinder 141, that is, between the pipe 140 and the outer cylinder 141. Similarly, sealing materials 140a and 140b are also provided between the non-heating section 130b and the pipe 140. The outer cylinder 141 is an example of a first insertion section.

[0039] The rotary table 100 comprises a table 100a, a rotating shaft 100b, a motor 100c for the table, and a casing 100f.

[0040] Table 100a is equipped with a chuck mechanism 110 at its center for mounting and fixing the work holder WH. Based on the control of the control unit 30, the table motor 100c is driven, and the rotation axis 100b moves in a rotational direction about the Y direction. Due to the movement of the rotation axis 100b, table 100a rotates at a predetermined speed (for example, a speed of about 20 rpm to 30 rpm).

[0041] Furthermore, a linear drive mechanism 180 is attached to the casing 100f of the rotating shaft 100b, allowing the table 100a, rotating shaft 100b, casing 100f, and table motor 100c to move in the Y direction. Therefore, the distance between T and S can be adjusted. In this embodiment, the partition wall 10b is provided with an outer cylinder 101 which serves as the insertion part for the casing 100f. The casing 100f slides against the outer cylinder 101 and is inserted into the vacuum chamber. To maintain the sealing performance inside the vacuum chamber, sealing materials 101a and 101b are provided on the inner circumference of the outer cylinder 101, that is, between the rotating shaft 100b and the outer cylinder 101. Hereinafter, the rotating shaft 100b including the casing 100f will also be simply referred to as the rotating shaft 100b. The outer cylinder 101 is an example of a second insertion part.

[0042] The heating element 120 is attached to the casing 100f of the rotating shaft 100b. The heating element 120 is also positioned on the underside of the table 100a and heats the substrate S on the table 100a by radiant heating. The heating element 120 is circular in shape, similar to the table, and the heating elements 130a of the heater 130 are arranged spirally on its surface. In adjusting the distance between T and S, the heating element 120 moves in the Y direction in conjunction with the rotating shaft 100b while maintaining a predetermined distance from the table 100a.

[0043] The heater 130 comprises a heating element 130a, a non-heating element 130b, and external wiring 132. The heating element 130a is heated by power supplied from a power supply unit (not shown) via the external wiring 132, and the entire heating area 120 is heated. The heater 130 is, for example, a sheathed heater. The temperature of the heater 130 is measured by a sheathed thermocouple, which will be described later. The heating element 130a is, for example, a heating wire, and the non-heating element 130b is a sheath that houses the heating wire in the portion where the heating wire penetrates the partition wall 10b. Alternatively, it may be wiring that supplies power to the heating element 130a. Since the sheathed heater is wire-like and easily bendable, it is easy to process into the desired shape. In this embodiment, one heater 130 is processed into a spiral shape so as to extend from the positive electrode side to the negative electrode side and is attached to the heating area 120. In this embodiment, a sheathed heater is given as an example of the heater 130, but other heaters incorporating sheathed components, such as a sheathed thermocouple type heater, may also be used.

[0044] The pipe 140 houses the non-heating portion 130b of the heater 130, from the standpoint of heat resistance and strength. Furthermore, as described above, the pipe 140 is slidable inside the vacuum chamber. The pipe 140 located outside the non-heating portion 130b is also referred to as the first pipe.

[0045] The arm 150 is mounted outside the vacuum chamber and outside the rotating shaft 100b, and also holds the pipe 140. The detailed structure of the arm 150 will be described later.

[0046] The linear drive mechanism 180 includes a linear guide 180a, a linear guide motor 180b, and a rotating shaft support section 180c, etc. The linear drive mechanism 180 supports a casing 100f containing the rotating shaft 100b via the rotating shaft support section 180c. The linear drive mechanism 180 is also installed outside the vacuum chamber and moves the rotating shaft 100b and the pipe 140 as a single unit. The detailed configuration of the linear drive mechanism 180 will be described later.

[0047] Furthermore, in this embodiment, sealing materials 10c, 141c, and 101c are provided between the lid 10a and the partition wall 10b, between the outer cylinder 141 and the partition wall 10b, and between the outer cylinder 101 and the partition wall 10b, respectively, to maintain the sealing performance within the vacuum chamber. In addition, sealing materials 100d and 100e are provided in the gap between the rotating shaft 100b and the casing 100f to maintain the sealing performance within the vacuum chamber.

[0048] Next, the schematic configuration of the heater 130 in this embodiment will be described using Figure 8. Figure 8 shows the schematic configuration of the heater 130 as viewed from the -X direction, and the structures of the heating part 130a and the non-heating part 130b are shown separately. The heating part 130a is, for example, a heating wire, and the non-heating part 130b is a sheath that houses the heating wire. In addition, an electrical insulating material such as magnesium oxide (MgO) powder is provided around the heating wire in the non-heating part 130b to insulate the non-heating part 130b. With this structure, current flows through the heating part 130a, but no current flows through the non-heating part 130b.

[0049] Figure 4 shows the structure of the linear drive mechanism 180 in this embodiment. Figure 5 is an enlarged view of the area around the partition wall 10b in this embodiment.

[0050] Figure 4 primarily illustrates the structure of the support section 160, the sliding bearing 161, the shaft 162, and the sheathed thermocouple 131.

[0051] As described above, the heater 130 comprises a heating element 130a and a non-heating element 130b. The heating element 130a is, for example, a resistance wire, which is covered by a sheath, and the non-heating element 130b is a resistance wire, which is covered by a sheath. The heating element 130a is connected to the external wiring 132 outside the vacuum chamber. The heater 130 heats the heating element 130a with power supplied via the external wiring 132, thereby heating the entire heating area 120. The temperature of the heating area 120 is measured by a sheath thermocouple 131.

[0052] Next, the structure around pipe 140 will be described using Figure 5. Pipe 140 penetrates the inside of the vacuum chamber and is slidably mounted inside the vacuum chamber. An arm 150 provided on the side of the rotating shaft 100b pushes pipe 140 into the vacuum chamber while the heating element 130a maintains its shape. The partition wall 10b is provided with an outer cylinder 141 which serves as the insertion point for pipe 140, and pipe 140 slides inside the outer cylinder 141 to be inserted into the vacuum chamber. Metal bearings 142 and sealing material 141b may also be provided at the contact surface between the outer cylinder 141 and the pipe. A packing may also be provided at the contact surface between pipe 140 and the non-heating element 130b. In this figure, a corner packing is provided at the corner of pipe 140.

[0053] As shown again in Figure 4, outside the vacuum chamber, a support portion 160 extending in the Z direction is provided outside the rotating shaft 100b. The support portion 160 has a fork-shaped notch at its tip and supports a sliding bearing 161 provided on a shaft 162 that extends from the partition wall 10b in a direction parallel to the direction of movement of the linear drive mechanism 180. The sliding bearing 161 is mounted on the outside of the shaft 162 and moves in the Y direction together with the support portion 160 when the rotating shaft 100b moves. In other words, the rotating shaft 100b, pipe 140 and sliding bearing 161 move together in the Y direction. The tip of the support portion 160 has a fork-shaped notch. It is desirable that the support portion 160 be provided at the center of the rotating shaft and extend in the Z direction. The sliding bearing 161 is an example of a bearing.

[0054] Furthermore, an arm 150 is provided outside the rotating shaft 100b, and a pipe 140 that houses the sheath portion of the sheathed thermocouple 131 is supported on the arm 150. The sheathed thermocouple 131 measures the temperature of the heating area 120. The pipe 140 provided outside the sheathed thermocouple 131 moves in the Y direction in conjunction with the rotating shaft 100b. The pipe 140 provided outside the sheathed thermocouple 131 is also called the second pipe. Note that the second pipe housing the sheathed thermocouple 131 and the first pipe described above are different pipes. The placement and number of sheathed thermocouples 131 can be arbitrary. The number of pipes 140 and arms 150 may be increased according to the number of sheathed thermocouples 131.

[0055] In this embodiment, the heater 130 has a heating element 130a on the positive electrode side connected to the external wiring 132 outside the vacuum chamber, and a heating element 130a on the negative electrode side also connected to the external wiring 132 outside the vacuum chamber. The arrangement of the heater 130 and the sheathed thermocouple 131 is not limited to this and may be arranged in any position. The non-heating elements 130b on the positive and negative electrode sides may also be passed through a single pipe.

[0056] Figure 6 shows a schematic configuration of the heating section 120 in this embodiment.

[0057] This figure shows the schematic configuration of the heating section 120 as shown in the cross-sectional view AA of Figure 3. The heating section 120 has a configuration in which a heat-generating element 130a is arranged in a spiral pattern on a disc-shaped heat sink 120a that is positioned opposite the table 100a. This heat sink is larger than the diameter of 120a, the table 100a. The heating section 120 is fixed to the casing 100f and does not rotate. For example, the heat-generating element 130a is bent and positioned on the heating section 120, and the heat generated by the heat-generating element 130a heats the heat sink 120a. The table 100a opposite the heat sink is heated by the radiant heat from the heated heat sink 120a. One end of the heat-generating element 130a is the positive electrode side, and the other end is the negative electrode side.

[0058] Figure 7 shows a schematic configuration of the linear drive mechanism 180 in this embodiment.

[0059] This figure shows the schematic configuration of the linear drive mechanism 180 as viewed from the -X direction. The linear drive mechanism 180 comprises a linear guide 180a, a linear guide motor 180b, a rotating shaft support 180c, a slider 180d, and a ball screw 180e. A portion of the rotating shaft support 180c has a fork-shaped notch 180f, which holds the contact element 100g provided on the side of the casing 100f.

[0060] The rotating shaft support 180c is mounted on the slider 180d. The rotational motion of the linear guide motor 180b is converted into linear motion by the ball screw 180e, and the rotating shaft 100b and the pipe 140 held by the arm 150 move together in the Y direction along the linear guide 180a. When the rotating shaft 100b moves in the Y direction, the contact element 100g of the rotating shaft 100b moves while in contact with the notch 180f. At this time, the contact element 100g moves while in contact with the notch 180f with some play. In this embodiment, the notch 180f is fork-shaped, but it is not limited to this shape and may be other shapes such as a hole larger than the contact element 100g.

[0061] The shape of the arm 150 will be explained again using Figure 4. The arm 150 is trapezoidal in shape, but it may have various shapes for holding the pipe 140. The tip of the arm 150 has a fork-shaped notch 150a. For example, a recess is provided around the pipe 140, and the fork-shaped notch 150a is fitted into it to hold the pipe 140. In this embodiment, one arm 150 is configured to hold one pipe 140, but for example, one arm 150 may be configured to hold multiple pipes 140.

[0062] Furthermore, although the arm 150 has a rectangular shape, it may have various shapes to hold the sliding bearing 161. The tip of the support portion 160 has a fork-shaped notch 160a. For example, a recess is provided around the sliding bearing 161, and the fork-shaped notch 160a is fitted into it to hold the sliding bearing 161.

[0063] Next, the state of the heater 130 in this embodiment before and after the operation of the linear drive mechanism 180 will be explained with reference to Figure 9.

[0064] Figure 9(A) shows the state of the heater 130 in this embodiment before the linear drive mechanism 180 is operated in the -Y direction, and Figure 9(B) shows the state of the heater 130 in this embodiment after the linear drive mechanism 180 is operated in the -Y direction.

[0065] The rotating shaft 100b and the pipe 140 held by the arm 150 move together in the Y direction along the linear guide 180a. Figure 9(B) shows the stroke at this time as L. Even when the pipe 140 moves by L in the -Y direction, bending due to expansion and contraction of the heating element 130a does not occur, and its shape is maintained.

[0066] The pressure generated on the rotating shaft 100b, etc., will be explained using Figures 10 and 11.

[0067] As shown in Figure 11, in the comparative example, the linear drive mechanism 180 and the partition wall 10b are connected via the connection mechanism 181, and the entire partition wall 10b is moved in the -Y direction via the linear drive mechanism. If the T / S distance in the deposition chamber 10 were to be adjusted by moving the entire partition wall 10b in the -Y direction, a large pressure difference would be generated between the inside and outside of the vacuum chamber because the vacuum and the atmosphere are separated by the partition wall 10b, and a large force would be required to move the entire partition wall 10b. In this case, a force corresponding to the atmospheric pressure generated across the entire partition wall 10b would be required. For example, if the size of the partition wall 10b is 500 mm × 500 mm, a force of approximately 2,500 kgf would be required to move the entire partition wall 10b. Therefore, a structure that moves the entire partition wall 10b in the -Y direction is not practical.

[0068] On the other hand, as shown in Figure 10, in this embodiment, the linear drive mechanism 180 pushes out a total of four shafts by the arm 150: the rotating shaft 100b (1 shaft), the two pipes 140 provided on the outside of the non-heating section 130b, and the one pipe 140 provided on the outside of the sheath thermocouple 131, and they move together in the -Y direction. In Figure 10, three of the four shafts, the rotating shaft 100b and the two pipes 140 provided on the outside of the non-heating section 130b, are shown in cross-section.

[0069] In this embodiment, adjusting the T / S distance requires a force corresponding to the area of ​​the three pipes 140 and the atmospheric pressure generated on the one rotating shaft 100b. For example, if each pipe 140 is a φ20 shaft and the rotating shaft 100b is a φ80 shaft, the force pushing from the atmospheric side to the vacuum side is 1 kgf / 1 cm^2, so the total pushing force is approximately 3 kgf × 3 (pipes 140) + 50 kgf × 1 (rotating shaft 100b) ≈ 59 kgf, and the force required to move these shafts becomes small enough to be practical.

[0070] Figure 12 is a block diagram of the control unit 30 in this embodiment.

[0071] The control unit 30 can be implemented, for example, by installing a program for the control unit 30 on a PC (Programmable Controller). The CPU within the control unit 30 executes the program for the control unit 30, thereby realizing the functions of the transport mechanism control unit 31, distance control unit 32, film deposition control unit 33, and storage unit 34. The storage unit 34 is built on an auxiliary storage device, for example, an HDD (Hard Disk Drive).

[0072] The transport mechanism control unit 31 controls the operation of the transport mechanism 200. For example, the transport mechanism control unit 31 drives the hand drive mechanism 230 to transport a work holder WH with an untreated substrate S into the deposition chamber 10, and to transport out a work holder WH with a processed substrate S.

[0073] The distance control unit 32 controls the operation of the linear drive mechanism 180. For example, the distance control unit 32 drives the linear guide motor 180b to move the rotation axis 100b in the Y direction to adjust the distance between T and S. At this time, the pipe 140 held by the arm 150 also moves together with it.

[0074] The film deposition control unit 33 controls the operation of the entire film deposition chamber 10. For example, it introduces a process gas into the vacuum chamber to create a plasma. The film deposition material constituting the target 190 is knocked out by the ions generated at this time and deposited on the surface of the substrate S.

[0075] The memory unit 34 stores information used for control in this embodiment. For example, the memory unit 34 stores information about the T / S distance set by the operator.

[0076] Figure 13 is an example of a flowchart of the film deposition apparatus 1 in this embodiment.

[0077] This flowchart describes the process from when the work holder WH, on which the unprocessed substrate S is placed, is brought into the load lock chamber 20 and held by the hand 210 and finger 220, to when the processed substrate S is removed from the film deposition apparatus 1. Furthermore, the load lock chamber 20 is depressurized to a predetermined pressure by vacuum evacuation, and the partition 15 is opened.

[0078] In step S1, the transport mechanism control unit 31 drives the hand drive mechanism 230 to move the hand 210 in the X direction. This allows the film deposition apparatus 1 to transport the substrate S into the film deposition chamber 10 while maintaining a predetermined pressure. Alternatively, the transport mechanism control unit 31 may move the hand 210 in the X direction to align it on the rotary table 100, and then move the hand 210 in the Y direction to further align it. In step S2, the transport mechanism control unit 31 determines whether the loading of the work holder WH is complete. For example, the transport mechanism control unit 31 determines whether the work holder WH is positioned in a position where it can be chucked by the chuck mechanism 110 by driving the hand drive mechanism 230.

[0079] If the transport mechanism control unit 31 determines that the work holder WH is not positioned in a location where it can be chucked by the chuck mechanism 110 (NO in step S2), the process returns to step S1, and the transport mechanism control unit 31 continues to align the work holder WH. If the transport mechanism control unit 31 determines that the work holder WH is positioned in a location where it can be chucked by the chuck mechanism 110 (YES in step S2), in step S3, the transport mechanism control unit 31 controls the chuck mechanism 110 to fix the work holder WH on the rotary table 100. After fixing the work holder WH, the transport mechanism control unit 31 drives the hand drive mechanism 230 to retract the hand 210 into the load lock chamber 20.

[0080] In step S4, the distance control unit 32 controls the linear drive mechanism 180 to move the rotation axis 100b on the linear guide 180a in the Y direction to adjust the distance between T and S. The distance moved at this time is determined, for example, based on information stored in the memory unit 34. In step S5, the film deposition control unit 33 introduces a process gas to create a plasma. The film deposition material constituting the target 190 is knocked out by the ions generated at this time and deposited on the surface of the substrate S.

[0081] In step S6, the distance control unit 32 controls the linear drive mechanism 180 to move the rotation axis 100b on the linear guide 180a in the Y direction, returning the T / S distance to its initial position. In step S7, the transport mechanism control unit 31 opens the partition 15 and then drives the hand drive mechanism 230 to unload the work holder WH on which the processed substrate S is placed from the deposition chamber 10. The unloading of the work holder WH is performed in the reverse order of loading.

[0082] Figure 14 is a hardware configuration diagram of the control unit 30 in this embodiment.

[0083] The control unit 30 in Figure 14 includes a processor 300 such as a CPU, a main memory 301 such as RAM, an auxiliary storage device 302 such as an HDD, a network interface 303 such as a LAN (Local Area Network) board, a device interface 304 such as memory slots and memory ports, and a bus 305 that connects these devices to each other. The control unit 30 is, for example, a computer such as a PC, and includes an input unit such as a keyboard and mouse, and an output unit such as a display.

[0084] The control unit 30 may include, for example, multiple processors. This allows multiple operations to be performed in parallel.

[0085] In this embodiment, a program for causing a computer to execute information processing by the control unit 30 is installed in the auxiliary storage device 302. The control unit 30 loads this program into the main memory 301 and executes it using the processor 300. This enables the functions of each block shown in Figure 11 to be realized within the control unit 30, making the above-described attachment process possible. The storage unit 34 is built on the auxiliary storage device 302. The data generated by this information processing is either temporarily held in the main memory 301 or stored and saved in the auxiliary storage device 302.

[0086] This program can be installed, for example, by connecting an external device 306 containing this program to the device interface 304, and then storing the program from the external device 306 to the auxiliary storage device 302. An example of the external device 306 is a computer-readable recording medium or a recording device that incorporates such a recording medium. Examples of recording media include CD-ROM (Compact Disk Read Only Memory), CD-R (Compact Disk Recordable), flexible disk, DVD-ROM (Digital Versatile Disk Read Only Memory), and DVD-R (Digital Versatile Disk Recordable), while an example of a recording device is an HDD. Alternatively, this program can be installed, for example, by downloading it via the network interface 303.

[0087] Figure 15 shows the cross-sectional shape of the film deposition chamber 10 in the comparative example.

[0088] Unlike the film deposition apparatus 1 in this embodiment, the film deposition apparatus 1 of the comparative example does not have a linear drive mechanism 180 in the film deposition chamber 10, and the rotating shaft 100b does not move in the Y direction. Similarly, the arms 150 and pipes 140 on the side of the rotating shaft 100b are not provided. Instead, the film deposition apparatus 1 of the comparative example is configured to adjust the T / S distance by providing a spacer 191 between the lid 10a and the target 190.

[0089] In the comparative example, the T / S distance is adjusted by manually replacing the spacer 191. Therefore, the spacer 191 is replaced after the deposition chamber 10 is opened to the atmosphere. When the deposition chamber 10 is opened to the atmosphere, moisture adheres to the inside of the deposition chamber 10, and in order to perform the deposition process again, this moisture must be removed, which takes a lot of time. In addition, after opening to the atmosphere, it is necessary to return the inside of the deposition chamber 10 to a reduced pressure atmosphere, and this process also takes a lot of time.

[0090] According to this embodiment, the film deposition apparatus 1 is equipped with a linear drive mechanism 180 that can adjust the T / S distance, and a pipe 140 that is located outside the heater 130 and moves integrally with the rotating shaft 100b. Therefore, the film deposition apparatus 1 can automatically adjust the T / S distance. Furthermore, since the heater 130 moves integrally with the rotating shaft 100b, bending of the heating element 130a does not occur, and its shape is maintained, thus preventing breakage. In addition, since a sealing material is provided between the pipe 140 and the partition wall 10b, the sealing performance of the vacuum chamber is not impaired.

[0091] Furthermore, according to this embodiment, since the film deposition apparatus 1 moves the heating section 120 integrally with the rotating shaft 100b, it is possible to prevent temperature changes in the table 100a due to adjustment of the T / S distance and maintain a constant temperature.

[0092] Furthermore, according to this embodiment, by making the shafts of movable parts such as the rotating shaft 100b and the pipe 140 smaller in diameter, the force received by the pressure difference between the inside and outside of the vacuum chamber is reduced, and the driving force of the linear drive mechanism 180 can be reduced.

[0093] Although several embodiments have been described above, these embodiments are presented only as examples and are not intended to limit the scope of the invention. The novel film deposition apparatus 1 described herein can be implemented in various other forms. Furthermore, various omissions, substitutions, and modifications can be made to the forms of film deposition apparatus 1 described herein without departing from the spirit of the invention. The appended claims and equivalents are intended to include such forms and modifications included in the scope and spirit of the invention. [Explanation of symbols]

[0094] 1: Film forming apparatus, 10: Film forming chamber, 10a: Lid, 10b: Partition wall, 10c: Sealing material, 15: Partition section, 16: Load lock door, 20: Load lock room, 30: Control unit, 31: Transport mechanism control unit, 32: Distance control unit, 33: Film deposition control unit, 34: Memory unit, 100: Rotary table, 100a: Table, 100b: Rotary axis, 100c: Motor for table, 100d: Encapsulating material, 100e: Encapsulating material, 100f: Casing, 100g: Contact element, 101: Outer cylinder, 101a: Sealing material 101b: Sealing material, 101c: Sealing material, 110: Chuck mechanism, 120: heating element, 120a: heat sink, 130: heater, 130a: heating element 130b: Non-heating part, 131: Sheathed thermocouple, 132: External wiring 140: Pipe, 140a: Sealing material, 140b: Sealing material, 141: Outer cylinder, 141a: Sealing material, 141b: Sealing material, 141c: Sealing material, 142: Metal bearing, 143: Square packing, 150: Arm, 150a: Notch, 160: Support part, 160a: Notch 161: Plain bearing, 162: Shaft, 170: Exhaust section, 180: Linear drive mechanism, 180a: Linear guide, 180b: Motor for linear guide, 180c: Rotating shaft support part, 180d: Slider, 180e: Ball screw, 180f: Notch 181: Connection mechanism, 190: Target, 191: Spacer, 200: Conveying mechanism, 210: Hand, 220: Finger, 230: Hand drive mechanism, 300: Processor 301: Main memory, 302: Secondary memory, 303: Network interface, 304: Device interface, 305: Bus, 306: External device, S: Substrate, WH: Work holder

Claims

1. A table is provided inside the vacuum chamber where the film deposition process is performed, on which the workpiece to be processed is placed. A target is placed in the vacuum chamber, facing the table, and is formed by including a film-forming material that is deposited on the workpiece by sputtering, A rotating shaft that penetrates the outside of the vacuum chamber and is movable in a direction toward and away from the target, and rotates the table, A heater for heating the workpiece placed on the table, One or more first pipes that penetrate the outside of the vacuum chamber and are movable toward and toward the target, and which house wiring that supplies power to the heater or a sheath that houses the wiring, One or more arms connected to the rotating shaft outside the vacuum chamber and supporting one or more of the first pipes, The vacuum chamber is provided with a linear drive mechanism that moves the table toward and toward the target, with the rotating shaft and one or more of the first pipes as a single unit. A film deposition apparatus characterized by the following features.

2. The system further includes one or more second pipes that are movable toward and toward the target and house thermocouples for measuring the temperature of the heater, The linear drive mechanism moves the rotating shaft, one or more of the first pipes, and one or more of the second pipes as a single unit. The film deposition apparatus according to feature 1.

3. The film-forming apparatus according to claim 1, characterized in that a sealing material is provided around one or more first insertion parts provided in the vacuum chamber, which serve as insertion parts for one or more of the first pipes, and around a second insertion part provided in the vacuum chamber, which serves as an insertion part for the rotating shaft.

4. A shaft provided outside the vacuum chamber and extending in a direction parallel to the direction of movement of the linear drive mechanism, A bearing is provided along the shaft so as to be movable in a direction toward and away from the target, The vacuum chamber further includes a support portion that supports the bearing outside the vacuum chamber, The linear drive mechanism moves the table, the rotating shaft, one or more of the first pipes, and the bearing as a single unit. The film deposition apparatus according to feature 1.

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