Heat source unit and refrigeration system

Abstract

To improve safety against leaks of flammable refrigerants. [Solution] The heat source unit 10 comprises a casing 50, a first partition plate 60, a plurality of refrigerant circuit components, and a plurality of electrical circuit components 80 including a power semiconductor element 84. The bottom plate 52 of the casing 50 has a first side, a second side, a third side, and a fourth side. The first partition plate 60 extends at least from the first side to the second side b and at least from the third side to the fourth side in a plan view, and has a first recess 61. The first recess 61 has a first bottom surface B1. The first partition plate 60 divides the internal space S of the casing 50 into an upper space S1 and a lower space S2. At least a portion of the plurality of electrical circuit components 80 are arranged in the first recess 61. The upper end 13H of the heat source heat exchanger 13 is located higher than both the lowest end 60L of the first partition plate 60 and the lowest end 80L of the plurality of electrical circuit components 80.

Description

Technical Field

[0001] The present disclosure relates to a heat source unit handling a flammable refrigerant and a refrigeration apparatus having the same.

Background Art

[0002] In the refrigeration apparatus disclosed in Patent Document 1 (Japanese Patent Application Laid-Open No. 2014-055705), R32, which is a flammable refrigerant, is used.

Summary of the Invention

Problems to be Solved by the Invention

[0003] When a high-concentration flammable refrigerant leaks from the refrigerant circuit of a refrigeration apparatus, it is required to improve user safety by isolating the electric circuit of the refrigeration apparatus from a space where the refrigerant may float.

Means for Solving the Problems

[0004] The heat source unit of the first aspect includes a casing, a first partition plate, a heat source heat exchanger, a heat source fan, a compressor, and a plurality of electric circuit components. The casing has a bottom plate. The bottom plate has a first side on the front side, a second side on the rear side, a third side on the left side, and a fourth side on the right side. The casing has an internal space. The first partition plate extends at least from the first side to the second side and at least from the third side to the fourth side in a plan view. The first partition plate partitions the internal space into an upper space and a lower space. The heat source heat exchanger, the heat source fan, and the compressor are arranged in the lower space. The compressor compresses a flammable refrigerant. The plurality of electric circuit components are arranged in the upper space. The plurality of electric circuit components include power semiconductor elements. The first partition plate has a first recess. The first recess has a first bottom surface. At least a part of the plurality of electric circuit components is arranged in the first recess. The upper end of the heat source heat exchanger is positioned higher than both the lowermost end of the first partition plate and the lowermost end of the plurality of electric circuit components.

[0005] In this configuration, the electrical system in the upper space and the refrigerant circuit in the lower space are separated by a first partition plate. This prevents the electrical system from causing the refrigerant to ignite.

[0006] The heat source unit in the second perspective is the heat source unit in the first perspective, wherein the upper end of the heat source fan is positioned higher than both the lowest end of the first partition plate and the lowest end of the multiple electrical circuit components.

[0007] In this configuration, the first partition plate and electrical circuit components are positioned at least partially below the top of the heat source fan. Therefore, the height dimension of the heat source unit can be reduced.

[0008] The third-viewpoint heat source unit is a heat source unit according to the first or second view, further comprising a circuit board. Power semiconductor elements and electrical circuit components located in the first recess are mounted on the circuit board.

[0009] In this configuration, power semiconductor elements and electrical circuit components are mounted on the same circuit board. Therefore, the assembly of the heat source unit is easy.

[0010] A heat source unit in the fourth view is a heat source unit in any one of the first, third, or fourth views, wherein the partition plate further has a second recess. The second recess has a second bottom surface. The second bottom surface is at the same height as the first bottom surface or lower than the first bottom surface. Multiple electrical circuit components include a reactor located in the second recess.

[0011] In this configuration, the height of the second bottom surface of the second recess is less than or equal to the height of the first bottom surface of the first recess. Therefore, a large reactor can be placed in the second recess.

[0012] The fifth heat source unit is one of the heat source units from the first to the fourth perspective, further comprising a heat sink. The heat sink is attached to a power semiconductor element. The first partition plate further has an opening. The heat sink protrudes from the opening into the lower space.

[0013] In this configuration, a portion of the heatsink, which is located in the upper space but less likely to ignite, is housed in the lower space. Therefore, the height dimension of the heat source unit can be reduced.

[0014] The heat source unit of the sixth perspective is the heat source unit of the fifth perspective, further comprising a second partition plate. The second partition plate divides the lower space into a fan room and a machine room. The heat source heat exchanger and heat source fan are located in the fan room. The compressor is located in the machine room. The heat sink protrudes into the fan room.

[0015] In this configuration, the heatsink protrudes into the fan chamber. Therefore, the airflow generated by the heat source fan hits the heatsink, allowing for effective cooling of the power semiconductor elements.

[0016] The heat source unit of the seventh aspect is a heat source unit of the fifth or sixth aspect, further comprising a first sealing member. The first sealing member is positioned in the opening. The first sealing member fills the gap between the heat sink and the first partition plate.

[0017] With this configuration, the gap between the heat sink and the first partition plate at the opening is filled. Therefore, the isolation between the upper and lower spaces becomes more effective, further suppressing the occurrence of electrical systems causing refrigerant ignition.

[0018] The heat source unit of the eighth perspective is one of the heat source units of the fifth to seventh perspectives, wherein the opening is provided in the first partition plate at a location other than the first recess and the second recess.

[0019] In this configuration, the opening is provided in the first partition plate at locations other than the first and second recesses. Therefore, since the heat sink protrudes a long distance into the lower space, the power semiconductor elements can be cooled effectively.

[0020] The heat source unit of the ninth aspect is a heat source unit of any one of the first to eighth aspects, further comprising a third partition plate. The third partition plate supports the first partition plate. The third partition plate divides the internal space into an upper space and a lower space. The first partition plate is fixed to the casing. The third partition plate can be removed from the first partition plate and the casing while a plurality of electrical circuit components are mounted on it.

[0021] In this configuration, the function of separating the upper and lower spaces is performed collaboratively by the first and third partition plates. Therefore, the electrical system in the upper space and the refrigerant circuit in the lower space are isolated not only by the first partition plate but also by the third partition plate, thus further suppressing the possibility of the electrical system causing refrigerant ignition. In addition, by removing the third partition plate from the first partition plate, multiple electrical circuit components can be removed from the casing together. Therefore, manufacturing and repair are easier.

[0022] The heat source unit of the tenth perspective is one of the heat source units of the first to ninth perspectives, further comprising a lid member. The lid member is attached to the first partition plate. Multiple electrical circuit components are surrounded by the first partition plate and the lid member.

[0023] In this configuration, the electrical circuit components are surrounded by the first partition plate and the cover member. This effectively suppresses the possibility of the electrical system causing the refrigerant to ignite.

[0024] The heat source unit of the eleventh view is a heat source unit of any one of the first to tenth views, further comprising compressor wiring. The compressor wiring is connected to a compressor. The partition plate further has a wiring opening through which the compressor wiring passes. A second sealing member is disposed in the wiring opening. The second sealing member fills the gap between the compressor wiring and the first partition plate.

[0025] With this configuration, the gap between the compressor wiring and the first partition plate is filled in the wiring opening. Therefore, the isolation between the upper and lower spaces becomes more effective, further suppressing the occurrence of electrical systems causing refrigerant ignition.

[0026] The refrigeration device according to the 12th aspect includes a heat source unit and a utilization unit. The heat source unit is any one of those according to the 1st aspect to the 11th aspect. The utilization unit provides the user with the cold or warm heat acquired by the heat source unit.

[0027] According to this configuration, in the heat source unit included in the refrigeration device, ignition of the leaked refrigerant is unlikely to occur. Therefore, the safety of the refrigeration device can be improved.

Brief Description of the Drawings

[0028] [Figure 1] It is a schematic diagram showing the configuration of the refrigeration device 100 of the first embodiment. [Figure 2A] It is a perspective view showing the appearance of the heat source unit 10 of the first embodiment. [Figure 2B] It is a perspective view showing the appearance of the heat source unit 10 of the first embodiment. [Figure 3A] It is a perspective view of the heat source unit 10 of the first embodiment with some parts removed. [Figure 3B] It is a perspective view of the heat source unit 10 of the first embodiment with some parts removed. [Figure 4A] It is a front view schematically showing the structure of the heat source unit 10 of the first embodiment. [Figure 4B] It is a plan view schematically showing the structure of the heat source unit 10 of the first embodiment. [Figure 5A] It is a perspective view of the heat source unit 10 of the first embodiment with some parts removed. [Figure 5B] It is a plan view of the heat source unit 10 of the first embodiment with some parts removed. [Figure 5C] It is a side view of the heat source unit 10 of the first embodiment with some parts removed. <00001​​​​ [Figure 8] This is a front view of the heat source unit 10 of the first embodiment with some parts removed. [Figure 9] This is a plan view of the heat source unit 10 of the first embodiment with some parts removed. [Figure 10] This is a perspective view of the heat source unit 10 of the first embodiment with some parts removed. [Figure 11A] This is a schematic plan view showing the structure of the heat source unit 10 of the first modified example of the first embodiment. [Figure 11B] This is a schematic plan view showing the structure of the heat source unit 10 of the first modified example of the first embodiment. [Figure 11C] This is a schematic plan view showing the structure of the heat source unit 10 of the first modified example of the first embodiment. [Figure 12] This is a perspective view of the first partition plate 60 and the lid member 75 of the second embodiment. [Figure 13] This is a schematic front view showing the electrical system of the heat source unit 10 of the second embodiment. [Modes for carrying out the invention]

[0029] <First Embodiment> (1) Overall structure Figure 1 shows the configuration of a refrigeration system 100 in a first embodiment of this disclosure. The refrigeration system 100 provides the user with cold heat or hot heat obtained from a heat source by circulating a refrigerant R. In cold heat utilization operation, the refrigeration system 100 provides the user with cold heat. In hot heat utilization operation, the refrigeration system 100 provides the user with cold heat. The refrigeration system 100 can be configured in the form of an air conditioner, refrigerator, freezer, water heater, floor heating system, etc. If the refrigeration system 100 is an air conditioner, cold heat utilization operation and hot heat utilization operation correspond to cooling operation and heating operation, respectively. The refrigeration system 100 has a heat source unit 10, a utilization unit 20, a group of connecting pipes 30, and a communication line 35.

[0030] (2) Detailed configuration (2-1) Refrigerant R Refrigerant R is a flammable refrigerant. Examples of flammable refrigerants include the highly flammable refrigerant R290 (propane). The specific gravity of refrigerant R is greater than that of air. To protect the user of the refrigeration unit 100, it is important to effectively isolate the space where refrigerant R may be present from the location of electrical circuits, where it is difficult to completely rule out the risk of ignition.

[0031] (2-2) Heat source unit 10 The heat source unit 10 obtains cooling or heating from the air, which is the heat source. The heat source unit 10 includes a casing 50, a compressor 11, a four-way switching valve 12, a heat source heat exchanger 13, a heat source fan 14, a heat source expansion valve 15, an accumulator 16, a liquid shut-off valve 17, a gas shut-off valve 18, a refrigerant sensor 41, and a heat source control unit 19.

[0032] (2-2-1) Casing 50 The casing 50 houses the components of the heat source unit 10, including the compressor 11. As shown in Figures 2A and 2B, the casing 50 has a top plate 51, a bottom plate 52, a first side plate 53, a second side plate 54, a front plate 55, and a front grille 57. In this embodiment, the front grille 57 overlaps the front plate 55 to form two layers, but the front grille 57 and the front plate 55 may be provided on the same plane. In either design, the front grille 57 may be considered to constitute a part of the front plate 55. As shown in Figure 2B, the heat source heat exchanger 13 is exposed at the rear of the casing 50.

[0033] In Figures 2A and 2B, the horizontal longitudinal direction x, the horizontal short direction y, and the vertical direction z are orthogonal to each other. The top plate 51 and the bottom plate 52 extend in the horizontal longitudinal direction x and the horizontal short direction y. The first side plate 53 and the second side plate 54 extend in the horizontal short direction y and the vertical direction z. The front plate 55 extends in the horizontal longitudinal direction x and the vertical direction z. The top plate 51 and the bottom plate 52 are separated in the vertical direction z. The first side plate 53 and the second side plate 54 are separated in the horizontal longitudinal direction x. The front plate 55 and the rear side of the casing 50 are separated in the horizontal short direction y.

[0034] Figures 3A and 3B show the state with the top plate 51 and front grille 57 removed. As shown in Figures 3A and 3B, when the top plate 51 is removed, the first partition plate 60 is exposed. As shown in Figure 3A, when the front grille 57 is removed, the front panel 55 is exposed. The second side panel 54 has no openings at all, or if it has an opening, the size of the opening does not exceed 5 mm.

[0035] As shown in Figure 4A, the casing 50 has an internal space S. The internal space S is provided with a first partition plate 60 and a second partition plate 70. The first partition plate 60 is a plate-like member that extends horizontally, although it has irregularities or openings. The first partition plate 60 divides the internal space S into an upper space S1 and a lower space S2. The first partition plate 60 does not necessarily have to airtightly separate the upper space S1 and the lower space S2. The second partition plate 70 is a plate-like member that extends vertically. The second partition plate 70 divides the lower space S2 into a fan room S3 and a machine room S4. The fan room S3 is located on the side of the first side plate 53. The machine room S4 is located on the side of the second side plate 54.

[0036] Figure 4B is a schematic plan view showing the dimensions of the casing 50 and the first partition plate 60. The bottom plate 52 has a first side 52a on the front, a second side 52b on the rear, a third side 52c on the left, and a fourth side 52d on the right. The first partition plate 60 has a front side 60a on the front, a rear side 60b on the rear, a left side 60c on the left, and a right side 60d on the right. The size of the first partition plate 60 is larger than the size of the bottom plate 52. In a plan view, the first partition plate 60 extends at least from the first side 52a to the second side 52b, and also extends at least from the third side 52c to the fourth side 52d in a plan view.

[0037] The front edge 60a is located in front of the first edge 52a, i.e., on the (-y) side. The rear edge 60b is located behind the second edge 52b, i.e., on the (+y) side. The left edge 60c is located to the left of the third edge 52c, i.e., on the (-x) side. The right edge 60d is located to the right of the fourth edge 52d, i.e., on the (+x) side.

[0038] At the rear of the casing 50, the first side plate 53 has a first bend 53q, and the second side plate 54 has a second bend 54q. The portion of the first partition plate 60 near the front edge 60a is supported by the front plate 55 of the casing 50. The portion of the first partition plate 60 near the rear edge 60b is supported by the first bend 53q and the second bend 54q of the casing 50. The portion of the first partition plate 60 near the left edge 60c is supported by the first side plate 53 of the casing 50. The portion of the first partition plate 60 near the right edge 60d is supported by the second side plate 54 of the casing 50.

[0039] The portion of the first partition plate 60 near its rear edge 60b may be further supported via the heat source heat exchanger 13. In this case, the heat source heat exchanger 13 may support the portion near the rear edge 60b via a buffer material.

[0040] (2-2-2) Compressor 11 As shown in Figure 1, the compressor 11 has an intake pipe 11a and a discharge pipe 11b. The compressor 11 draws in refrigerant R in a low-pressure gas state from the intake pipe 11a, compresses the refrigerant R, and discharges the refrigerant R in a high-pressure gas state from the discharge pipe 11b. As shown in Figure 4, the compressor 11 is located in the machine room S4 of the lower space S2.

[0041] (2-2-3) Four-way switching valve 12 The four-way switching valve 12 shown in Figure 1 switches between cooling operation and heating operation by switching the direction of travel of the refrigerant R. When operating in cooling operation mode, the four-way switching valve 12 forms the connection shown by the solid line in Figure 1, and the refrigerant R travels in the direction indicated by the arrow CO. When operating in heating operation mode, the four-way switching valve 12 forms the connection shown by the dashed line in Figure 1, and the refrigerant R travels in the direction indicated by the arrow HO. The four-way switching valve 12 is located in the machine room S4 of the lower space S2.

[0042] (2-2-4) Heat source heat exchanger 13 The heat source heat exchanger 13 shown in Figure 1 performs heat exchange between the air, which is the heat source, and the refrigerant R, thereby allowing the refrigerant R to acquire cooling or heating energy. When operating for cooling, the heat source heat exchanger 13 functions as a condenser or radiator for the refrigerant R, allowing the refrigerant R to acquire cooling energy. When operating for heating, the heat source heat exchanger 13 functions as an evaporator or absorber for the refrigerant R, allowing the refrigerant R to acquire heating energy. As shown in Figure 5A, the heat source heat exchanger 13 is located in the fan chamber S3 of the lower space S2. As shown in Figures 5B and 5C, the rear end 13b of the heat source heat exchanger 13 is located in front of the second side 52b of the bottom plate 52, i.e., in the (-y) direction.

[0043] (2-2-5) Heat source fan 14 The heat source fan 14 shown in Figure 1 promotes heat exchange between air and refrigerant R by generating an airflow that passes through the heat source heat exchanger 13. The heat source fan 14 has heat source fan blades 141 and a heat source fan motor 142. The heat source fan blades 141 generate an airflow. The heat source fan motor 142 rotates the heat source fan blades 141. As shown in Figure 5A, the heat source fan 14 is located in the fan chamber S3 of the lower space S2.

[0044] (2-2-6) Heat source expansion valve 15 The heat source expansion valve 15 shown in Figure 1 reduces the pressure of the refrigerant R. The heat source expansion valve 15 is composed of an electrically operated valve whose opening degree can be adjusted. When the opening degree of the heat source expansion valve 15 is set to a small value, the amount of refrigerant R that can pass through the heat source expansion valve 15 decreases, and the pressure of the refrigerant R after passing through the heat source expansion valve 15 decreases. The heat source expansion valve 15 is located in the machine room S4 in the lower space S2.

[0045] (2-2-7) Accumulator 16 The accumulator 16 stores only the liquid component of the refrigerant R inside, allowing only the gaseous component to pass through. The accumulator 16 is connected to the suction pipe 11a of the compressor 11 to prevent the liquid component of the refrigerant R from damaging the compressor 11. The accumulator 16 is located in the machine room S4 of the lower space S2.

[0046] (2-2-8) Liquid shut-off valve 17 and gas shut-off valve 18 The liquid shut-off valve 17 and the gas shut-off valve 18 are for blocking the movement of the refrigerant R during installation work of the refrigeration system 100. The liquid shut-off valve 17 and the gas shut-off valve 18 are opened and closed manually by the installer of the refrigeration system 100.

[0047] (2-2-9) Refrigerant sensor 41 The refrigerant sensor 41 detects the refrigerant R that has leaked from the refrigerant circuit that makes up the heat source unit 10.

[0048] (2-2-10) Heat source control unit 19 The heat source control unit 19 is a computer that performs various calculations. The heat source control unit 19 acquires signals from various sensors, including the refrigerant sensor 41, as well as temperature sensors and pressure sensors. Furthermore, the heat source control unit 19 controls actuators mounted on the compressor 11, the four-way switching valve 12, the heat source fan 14, the heat source expansion valve 15, and other components.

[0049] (2-3) Unit 20 The utilization unit 20 shown in Figure 1 provides the user with the cold or heat acquired by the heat source unit 10 from the heat source. The utilization unit 20 includes a casing 21, a utilization heat exchanger 23, a utilization fan 24, and a utilization control unit 29.

[0050] (2-3-1) Casing 21 The casing 21 houses the components of the utilization unit 20, including the utilization heat exchanger 23.

[0051] (2-3-2) Utilized heat exchanger 23 The utilization heat exchanger 23 provides cooling or heating to the user by exchanging heat with the refrigerant R, such as the air in the user's environment or the water used by the user. When operating for cooling, the utilization heat exchanger 23 functions as an evaporator or absorber for the refrigerant R, providing cooling to the user. When operating for heating, the utilization heat exchanger 23 functions as an evaporator or absorber for the refrigerant R, providing heating to the user.

[0052] (2-3-3) Fan 24 The utilization fan 24 is provided when the user utilizes cooling or heating through the air. The utilization fan 24 promotes heat exchange between the air and the refrigerant R by generating an airflow that passes through the utilization heat exchanger 23.

[0053] (2-3-4) User control unit 29 The utilization control unit 29 is a computer that performs various calculations. The utilization control unit 29 acquires signals from various sensors. Furthermore, the utilization control unit 29 controls the motor mounted on the utilization fan 24. In addition, the utilization control unit 29 exchanges information with the heat source control unit 19 by communicating with it.

[0054] (2-4) Connecting piping group 30 The connecting piping group 30 constitutes a circulation path for the refrigerant R by connecting the heat source unit 10 and the utilization unit 20. The connecting piping group 30 includes a liquid connecting pipe 31 and a gas connecting pipe 32. The liquid connecting pipe 31 mainly allows the refrigerant R to pass through in a liquid state or a gas-liquid two-phase state. The liquid connecting pipe 31 connects the liquid shut-off valve 17 to the utilization heat exchanger 23. The gas connecting pipe 32 mainly allows the refrigerant R to pass through in a high-pressure gas state or a low-pressure gas state. The gas connecting pipe 32 connects the gas shut-off valve 18 to the utilization heat exchanger 23.

[0055] (2-5) Communication line 35 The communication line 35 enables communication between the heat source control unit 19 and the utilization control unit 29.

[0056] (3) Overall operation (3-1)Cold heat utilization operation When operating using refrigeration, the four-way switching valve 12 forms the connection shown by the solid line in Figure 1, and the refrigerant R is directed in the direction indicated by the arrow CO.

[0057] The compressor 11 draws in refrigerant R in a low-pressure gas state from the suction pipe 11a and discharges refrigerant R in a high-pressure gas state from the discharge pipe 11b. The refrigerant R in a high-pressure gas state passes through the four-way switching valve 12 and reaches the heat source heat exchanger 13. In the heat source heat exchanger 13, the coldness of the air condenses the refrigerant R, generating refrigerant R in a high-pressure liquid state. The refrigerant R in a high-pressure liquid state is depressurized in the heat source expansion valve 15, becoming a gas-liquid two-phase refrigerant R. Subsequently, the refrigerant R passes through the liquid shut-off valve 17 and the liquid connecting pipe 31 and reaches the utilization heat exchanger 23. The utilization heat exchanger 23 evaporates the gas-liquid two-phase refrigerant R, providing the coldness carried by the refrigerant R to the user and generating refrigerant R in a low-pressure gas state. Subsequently, the refrigerant R passes through the gas communication pipe 32, the gas shut-off valve 18, the four-way switching valve 12, and the accumulator 16 in that order, before being drawn into the compressor 11 in the suction pipe 11a.

[0058] (3-2) Operation utilizing thermal energy When operating for thermal energy utilization, the four-way switching valve 12 forms the connection shown by the dashed line in Figure 1, and the refrigerant R is directed in the direction indicated by the arrow HO.

[0059] The compressor 11 draws in refrigerant R in a low-pressure gas state from the intake pipe 11a and discharges refrigerant R in a high-pressure gas state from the discharge pipe 11b. The refrigerant R in the high-pressure gas state passes sequentially through the four-way switching valve 12, the gas shut-off valve 18, and the gas connecting pipe 32 to reach the utilization heat exchanger 23. The utilization heat exchanger 23 condenses the refrigerant R in the high-pressure gas state, providing the heat carried by the refrigerant R to the user and generating refrigerant R in a high-pressure liquid state. Subsequently, the refrigerant R passes through the liquid connecting pipe 31 and the liquid shut-off valve 17 to reach the heat source expansion valve 15. The refrigerant R in the high-pressure liquid state is depressurized in the heat source expansion valve 15 and becomes refrigerant R in a gas-liquid two-phase state. Subsequently, the refrigerant R reaches the heat source heat exchanger 13. In the heat source heat exchanger 13, the heat from the air evaporates the refrigerant R, generating refrigerant R in a low-pressure gas state. Subsequently, the refrigerant R passes through the four-way switching valve 12 and the accumulator 16 in sequence before being drawn into the compressor 11 in the suction pipe 11a.

[0060] (4) Detailed structure of the heat source unit 10 Figure 6 shows the first partition plate 60. The first partition plate 60 is provided with a first recess 61 and a second recess 62. Furthermore, openings 65 are provided in the areas of the first partition plate 60 other than the first recess 61 and the second recess 62.

[0061] Figure 7 shows the arrangement of the electrical system in the heat source unit 10. As mentioned above, the first partition plate 60 divides the internal space S into an upper space S1 and a lower space S2, and the second partition plate 70 divides the lower space S2 into a fan room S3 and a machine room S4. The spaces where leaked refrigerant R may linger are the machine room S4, where refrigerant circuit components such as the compressor 11 are located, and the fan room S3, where refrigerant circuit components such as the heat source heat exchanger 13 are located, both of which belong to the lower space S2. In contrast, the electrical system, such as electrical circuits that could cause ignition, is located in the upper space S1. The upper space S1 is isolated from the lower space S2 by the upper space S1.

[0062] The first partition plate 60 has a reference surface B0, a first bottom surface B1, and a second bottom surface B2. An opening 65 is provided in the reference surface B0. The first bottom surface B1 is lower than the reference surface B0. The first bottom surface B1 belongs to the first recess 61. The second bottom surface B2 is at the same height as the first bottom surface B1 or lower than the first bottom surface B1. The second bottom surface B2 belongs to the second recess 62. The upper end 13H of the heat source heat exchanger is located higher than the lowest end 60L of the first partition plate 60. The upper end 14H of the heat source fan 14 is also located higher than the lowest end 60L of the first partition plate 60. The lowest end 60L of the first partition plate 60 may be the second bottom surface B2 of the second recess 62.

[0063] As shown in Figure 7, the electrical system located in the upper space S1 includes a plurality of electrical circuit components 80. The plurality of electrical circuit components 80 include a capacitor 81, a resistor 82, an integrated circuit 83, a power semiconductor element 84, and a reactor 85. A circuit board 90 is located in the upper space S1. Capacitors 81, resistors 82, integrated circuits 83, and power semiconductor elements 84 are mounted on the circuit board 90. As shown in Figures 7, 8, 9, and 10, at least some of the electrical circuit components 80 mounted on the circuit board 90 are located in the first recess 61.

[0064] The reactor 85 is a large element with a large inductance, and is used, for example, to smooth the power supply voltage. As shown in Figures 7, 8, 9, and 10, the reactor 85 is located in the second recess 62. As shown in Figure 7, the reactor 85 and the circuit board 90 are connected by reactor wiring 92.

[0065] The power semiconductor element 84 shown in Figure 7 is for controlling the current flowing to the compressor motor mounted on the compressor 11. The power semiconductor element 84 is, for example, a power transistor or a driver IC. Since the current value of the compressor motor is relatively large, the power semiconductor element 84 generates heat. As shown in Figures 7 and 8, a heat sink 91 is attached to the power semiconductor element 84 so that it can dissipate heat. The heat sink 91 is often made of a metal with good heat conductivity and has fins for heat dissipation. The heat sink 91 protrudes from the opening 65 into the fan chamber S3 of the lower space S2. As shown in Figure 7, a first sealing member 67 is placed in the opening 65. The first sealing member 67 fills the gap between the heat sink 91 and the first partition plate 60.

[0066] The upper end 13H of the heat source heat exchanger is higher than the lowest end 80L of the electrical circuit component 80. The upper end 14H of the heat source fan 14 is also higher than the lowest end 80L of the electrical circuit component 80.

[0067] As shown in Figure 7, the first partition plate 60 is provided with a wiring opening 66. The circuit board 90 in the upper space S1 and the compressor 11 in the machine room S4 are connected by compressor wiring 93. The compressor wiring 93 passes through the wiring opening 66. A second sealing member 68 is placed in the wiring opening 66. The second sealing member 68 fills the gap between the compressor wiring 93 and the first partition plate 60.

[0068] (5) Characteristics (5-1) Since the refrigerant R circulating in the refrigerant circuit is a flammable refrigerant, there is a risk that the electrical system could cause leaked refrigerant R to ignite. However, since the electrical system in the upper space S1 and the refrigerant circuit in the lower space S2 are isolated by the first partition plate 60, the event of the electrical system causing refrigerant R to ignite can be suppressed. Consequently, the safety of the heat source unit 10 can be ensured.

[0069] Furthermore, a portion of the electrical circuit component 80 is positioned in the first recess 61. Therefore, because the first partition plate 60 surrounds the electrical circuit component 80, the path connecting the electrical circuit component 80, which is the ignition source, and the leaked refrigerant R, which is the ignition destination, is forced to become longer, bypassing the side wall of the first recess 61. Thus, events that cause the electrical circuit component 80 to ignite can be effectively suppressed.

[0070] In addition, since at least a portion of the electrical circuit components 80 are housed in the first recess 61, the height dimension of the heat source unit 10 can be reduced.

[0071] (5-2) The power semiconductor element 84 and some of the other electrical circuit components 80 are mounted on the same circuit board 90. Therefore, the assembly of the heat source unit 10 is easy.

[0072] (5-3) The height of the second bottom surface B2 of the second recess 62 is less than or equal to the height of the first bottom surface B1 of the first recess 61. Therefore, a large reactor 85 can be placed in the second recess 62.

[0073] (5-4) Although positioned in the upper space S1, a portion of the heatsink 91, which is less likely to ignite, is housed in the lower space S2. Therefore, the height dimension of the heat source unit 10 can be reduced.

[0074] (5-5) The heatsink 91 protrudes into the fan chamber S3. Therefore, the airflow generated by the heat source fan 14 hits the heatsink 91, effectively cooling the power semiconductor element 84.

[0075] (5-6) The gap between the heat sink 91 and the first partition plate 60 is filled in the opening 65. Furthermore, the gap between the compressor wiring 93 and the first partition plate 60 is filled in the wiring opening 66. As a result, the isolation of the upper space S1 and the lower space S2 becomes more effective, further suppressing the occurrence of electrical systems causing refrigerant ignition.

[0076] (5-7) The opening 65 is provided in a location other than the first recess 61 and the second recess 62, in other words, it is provided on the reference plane B0. Therefore, since the length of the heat sink 91 that protrudes into the lower space S2 is long, the power semiconductor element 84 can be cooled effectively.

[0077] (6) Variant Modifications of the embodiments described so far will be explained below.

[0078] (6-1) First variation In the embodiment described above, as shown in Figure 4B, the portion of the first partition plate 60 near its rear edge 60b is supported by the first bent portion 53q and the second bent portion 54q of the casing 50. Alternatively, the portion of the first partition plate 60 near its rear edge 60b may be supported by other means.

[0079] For example, in the configuration shown in Figure 11A, the casing 50 has a rear plate 56. It is desirable that the rear plate 56 has a large number of ventilation holes. The portion of the first partition plate 60 near the rear edge 60b is supported by the rear plate 56.

[0080] Alternatively, in the configuration shown in Figure 11B, two rear plates 56 are provided on the rear side of the casing 50, spaced apart from each other. The portion of the first partition plate 60 near the rear edge 60b is supported by the two rear plates 56. On the rear side of the casing 50, the heat source heat exchanger 13 is exposed between the two rear plates 56.

[0081] Alternatively, in the configuration shown in Figure 11C, the heat source heat exchanger 13 is completely exposed at the rear of the casing 50. The first side plate 53 does not have a first bend 53q. The second side plate 54 does not have a second bend 54q. The casing 50 does not have a rear plate 56. The portion of the first partition plate 60 near the rear edge 60b may be supported by the heat source heat exchanger 13. In this case, the heat source heat exchanger 13 may support the portion near the rear edge 60b via a buffer material.

[0082] (6-2) Second variation In the above-described embodiment, the first partition plate 60 is provided with the first recess 61, the second recess 62, and the opening 65. Alternatively, the first partition plate 60 may be provided with only a portion of the first recess 61, the second recess 62, and the opening 65.

[0083] This configuration also allows for a reduction in the height of the heat source unit 10, or enables effective cooling of the heat sink 91 and power semiconductor element 84.

[0084] (6-3) Third Variation In the above-described embodiment, the heat source unit 10 has a second partition plate 70. Alternatively, the heat source unit 10 may not have a second partition plate 70, and the fan room S3 and the machine room S4 may not be separated.

[0085] This configuration also allows for a reduction in the height of the heat source unit 10, or enables effective cooling of the heat sink 91 and power semiconductor element 84.

[0086] (6-4) Fourth Variation The refrigeration system 100 according to the above embodiment has one heat source unit 10 and one utilization unit 20. Alternatively, the refrigeration system 100 may have one heat source unit 10 and multiple utilization units 20. Furthermore, the refrigeration system 100 may have multiple heat source units 10.

[0087] <Second Embodiment> (1) Overall structure Figures 12 and 13 show some of the configuration of the refrigeration device 100 in the second embodiment. The refrigeration device 100 in this embodiment differs from the first embodiment in that the heat source unit 10 has a lid member 75 and a third partition plate 78. Other elements are the same as in the first embodiment.

[0088] (2) Detailed configuration (2-1) Lid member 75 Figure 12 shows the lid member 75. The lid member 75 is attached to the first partition plate 60. The lid member 75 forms an internal space by covering the upper surface of the first partition plate 60. The circuit board 90 and the reactor 85 are housed in this internal space. Similar to the first embodiment, at least some of the electrical circuit components 80 mounted on the circuit board 90 are located in the first recess 61 of the first partition plate 60. The reactor 85, which is an electrical circuit component 80, is located in the second recess 62. The electrical circuit components 80, including the reactor 85, are surrounded by the first partition plate 60 and the lid member 75.

[0089] (2-2) Third partition plate 78 Figure 13 shows the arrangement of the electrical system in the heat source unit 10 of this embodiment. The internal space S is divided into an upper space S1 and a lower space S2 by the cooperation of the first partition plate 60 and the third partition plate 78. The third partition plate 78 is fixed to the casing 50. The first partition plate 60 is placed on top of the third partition plate 78 and is supported by the third partition plate 78. To enable this placement, the third partition plate 78 has a first housing portion 76 at a location corresponding to the first recess 61 of the first partition plate 60, and a second housing portion 77 at a location corresponding to the second recess 62. The first housing portion 76 and the second housing portion 77 may be configured as recesses capable of accommodating the first recess 61 and the second recess 62, respectively. Alternatively, the first housing portion 76 and the second housing portion 77 may be configured as holes through which the first recess 61 and the second recess 62 can pass, respectively.

[0090] The first partition plate 60 may be fixed to the third partition plate 78 by fastening means such as screws. When the fastening means are removed, the first partition plate 60 can be removed from the third partition plate 78 and the casing 50. At this time, the first partition plate 60 is removed from the third partition plate 78 with the electrical circuit components 80 placed on top of the first partition plate 60.

[0091] (3) Features (3-1) The function of separating the upper space S1 and the lower space S2 is performed by the cooperation of the first partition plate 60 and the third partition plate 78. Therefore, the electrical system of the upper space S1 and the refrigerant circuit of the lower space S2 are isolated not only by the first partition plate 60 but also by the third partition plate 78, which further suppresses the event of the electrical system causing ignition of the refrigerant R. In addition, by removing the third partition plate 78 from the first partition plate 60, multiple electrical circuit components 80 can be removed together from the casing 50. Therefore, the manufacturing and repair of the heat source unit 10 are easy.

[0092] (3-2) The electrical circuit component 80 is surrounded by the first partition plate 60 and the cover member 75. This effectively suppresses the event that the electrical system causes the refrigerant R to ignite.

[0093] (4) Variations One or more modifications of the first embodiment may be applied to this embodiment.

[0094] <Conclusion> While embodiments of this disclosure have been described above, it should be understood that various modifications to the form and details are possible without departing from the spirit and scope of this disclosure as described in the claims. [Explanation of symbols]

[0095] 10: Heat source unit 11: Compressor 13:Heat source heat exchanger 13H: Upper end 14: Heat source fan 20: Usage Unit 30: Connecting piping group 50: Casing 60: First partition plate 60L: Bottom end 61: First recess 62: Second recess 65:Aperture 66: Wiring opening 67: First sealing member 68: Second sealing member 70: Second partition plate 75: Lid component 78: Third partition plate 80: Electrical circuit components 84: Power semiconductor devices 85: Reactor 90: Circuit board 91: Heatsink 92: Reactor wiring 93: Compressor wiring 100: Refrigeration equipment B0: Reference plane B1: 1st bottom surface B2: 2nd bottom surface R: Refrigerant (flammable refrigerant) S:Internal space S1: Upper space S2: Bottom space S3: Fan Room S4: Machine Room x: horizontal longitudinal direction y: horizontal short direction z: vertical direction X1 :1st end X2: 2nd end Y1: Front end Y2: Rear end Z1: Bottom end Z2: Upper end [Prior art documents] [Patent Documents]

[0096] [Patent Document 1] Japanese Patent Publication No. 2014-055705

Claims

1. A casing (50) having an internal space (S), having a bottom plate (52) with a first front side (52a), a second rear side (52b), a third left side (52c), and a fourth right side (52d), A first partition plate (60) extends in a plan view from at least the first side to the second side and from at least the third side to the fourth side, and divides the internal space into an upper space (S1) and a lower space (S2), A heat source heat exchanger (13), a heat source fan (14), and a compressor (11) for compressing a flammable refrigerant (R) are arranged in the lower space. Arranged in the upper space are a plurality of electrical circuit components (80) including a power semiconductor element (84), Equipped with, The first partition plate has a first recess (61) having a first bottom surface (B1), At least some of the multiple electrical circuit components are arranged in the first recess, The upper end (13H) of the heat source heat exchanger is positioned higher than both the lowest end (60L) of the first partition plate and the lowest end (80L) of the plurality of electrical circuit components (80). Heat source unit (10).

2. The upper end (14H) of the heat source fan is positioned higher than both the lowest end (60L) of the first partition plate and the lowest end (80L) of the plurality of electrical circuit components (80). The heat source unit according to claim 1.

3. The power semiconductor element and the circuit board (90) on which the electrical circuit component arranged in the first recess is mounted, Furthermore, The heat source unit according to claim 1.

4. The first partition plate further has a second recess (62) having a second bottom surface (B2) that is the same height as the first bottom surface or lower than the first bottom surface. The plurality of electrical circuit components include a reactor (85) located in the second recess, The heat source unit according to claim 1.

5. A heat sink (91) attached to the power semiconductor element, Furthermore, The first partition plate further has an opening (65), The heat sink protrudes from the opening into the lower space. The heat source unit according to claim 4.

6. A second partition plate (70) divides the aforementioned lower space into a fan room (S3) and a machine room (S4). It further possesses, The heat source heat exchanger and the heat source fan are arranged in the fan chamber. The compressor is located in the machine room. The heatsink protrudes into the fan chamber. The heat source unit according to claim 5.

7. A first sealing member (67) is positioned in the opening and fills the gap between the heat sink and the first partition plate. Furthermore, The heat source unit according to claim 5 or claim 6.

8. The opening is provided in the first partition plate at a location other than the first recess and the second recess. The heat source unit according to claim 5 or claim 6.

9. A third partition plate (78) supports the first partition plate (60) and divides the internal space into the upper space (S1) and the lower space (S2). Furthermore, The third partition plate (78) is fixed to the casing, The first partition plate (60) can be removed from the third partition plate (78) and the casing while the plurality of electrical circuit components (80) are placed on it. A heat source unit according to any one of claims 1 to 6.

10. A lid member (75) attached to the first partition plate (60), Furthermore, Multiple electrical circuit components (80) are surrounded by the first partition plate (60) and the cover member (75). A heat source unit according to any one of claims 1 to 6.

11. The compressor wiring (93) connected to the compressor, Furthermore, The first partition plate further has a wiring opening (66) through which the compressor wiring passes, A second sealing member (68) is provided in the wiring opening to fill the gap between the compressor wiring and the first partition plate. A heat source unit according to any one of claims 1 to 6.

12. A heat source unit (10) according to any one of claims 1 to 6, A utilization unit (20) that provides the user with the cold or heat acquired by the heat source unit, A refrigeration device (100) equipped with the following.

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