Suscepta heater

The susceptor heater design addresses plasma instability and poor film uniformity by using diffusion bonding and electric beam welding, ensuring stable plasma behavior and improved film uniformity in semiconductor processing.

JP2026062551APending Publication Date: 2026-04-09ASM IP HLDG BV
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-09-26
Publication Date
2026-04-09

AI Technical Summary

Technical Problem

Brazed regions in susceptor heaters cause plasma instability and poor film uniformity during PECVD and PEALD processes due to differences in material characteristics, leading to particle generation and abnormal plasma behavior.

Method used

The susceptor heater design avoids exposing brazed regions by using diffusion bonding and electric beam welding, with an anodic oxide film covering the outer surfaces to maintain uniformity and stability.

Benefits of technology

The solution ensures stable plasma behavior and improved film uniformity by eliminating brazed surface exposure, enhancing the performance of susceptor heaters in semiconductor processing.

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Abstract

I will present a susceptor heater. [Solution] To avoid exposing different materials of the susceptor to the plasma environment, the Disclosure presents a susceptor heater comprising a susceptor section having an upper part, a lower part, and a plurality of heating elements disposed between the upper part and the lower part, and a shaft section, wherein the upper part and the lower part are joined by diffusion bonding. In another embodiment, the Disclosure also presents a susceptor heater comprising a susceptor section having an upper part that is recessed upward in the center, a lower part that is shaped to fit into the recessed area of ​​the upper part, and a plurality of heating elements disposed on the lower part between the upper part and the lower part, and a shaft section, wherein the upper part and the lower part are joined horizontally by brazing and vertically by electric beam welding.
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Description

Technical Field

[0001] This disclosure generally relates to susceptor heaters used in semiconductor processing, and more specifically to susceptor heaters having no brazed portions exposed on their surfaces.

Background Art

[0002] When manufacturing a metal susceptor heater, it is common to sandwich heater wires between two metal pieces and brazed them. Further, to enhance corrosion resistance, the material is anodized after brazing.

[0003] However, the characteristics of the anodic oxide film on the brazed surface are different from those of other parts. This is because in the case of brazing, the materials of the metals to be joined and the brazing material are different, as shown in FIG. 1.

[0004] In PECVD (Plasma Enhanced Chemical Vapor Deposition) and PEALD (Plasma Enhanced Atomic Layer Deposition) processes, the plasma becomes unstable only around the brazed regions (A, B) during film formation, causing problems such as particle generation, abnormal plasma behavior, and poor film uniformity.

[0005] Therefore, this disclosure provides a susceptor heater structure such that the brazed regions are not exposed on the surface.

Summary of the Invention

[0006] This summary is provided to introduce some concepts in a simplified form. These concepts are further described in more detail in the detailed description of the exemplary embodiments of the present disclosure below. This summary is not intended to identify the main features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0007] According to one embodiment, a susceptor heater can be provided, comprising a susceptor section having an upper part, a lower part, and a plurality of heating elements disposed between the upper part and the lower part, and a shaft section, wherein the upper part and the lower part are joined by diffusion bonding.

[0008] In one embodiment, the susceptor heater further comprises an anodic oxide film layer configured to cover the outer surfaces of the susceptor portion and the shaft portion.

[0009] According to another embodiment, a susceptor heater can be provided, comprising a susceptor portion having an upper part that is recessed upward in the center, a lower part that is shaped to fit into the recessed area of ​​the upper part, and a plurality of heating elements positioned on the lower part between the upper and lower parts, and a shaft portion, wherein the upper and lower parts are joined horizontally by brazing and vertically by electric beam welding.

[0010] In one embodiment, the susceptor heater further comprises an anodic oxide film layer configured to cover the outer surfaces of the susceptor portion and the shaft portion.

[0011] According to another embodiment, a susceptor heater can be provided, comprising a susceptor part having an upper part shaped to bulge in the middle, a lower part shaped to be hollow in the middle, and a plurality of heating elements positioned on the lower part between the upper and lower parts, and a shaft part, wherein the upper and lower parts are joined by brazing in the middle and the outer rim is joined by electric beam welding.

[0012] In one embodiment, the susceptor heater further comprises an anodic oxide film layer configured to cover the outer surfaces of the susceptor portion and the shaft portion.

[0013] It will be understood that the elements in the figures are illustrated for simplicity and clarity and are not necessarily drawn to actual size. For example, the dimensions of some of the elements in the figures may be exaggerated relative to others to help improve understanding of the illustrated embodiments of this disclosure. [Brief explanation of the drawing]

[0014] [Figure 1] A diagram illustrating conventional susceptor heater technology is shown. [Figure 2] An embodiment of the susceptor heater according to this disclosure is illustrated. [Figure 3] Another embodiment of the susceptor heater according to this disclosure is illustrated. [Figure 4] Another embodiment of the susceptor heater according to this disclosure is illustrated. [Modes for carrying out the invention]

[0015] While certain embodiments and examples are disclosed below, it will be understood by those skilled in the art that the scope of the invention extends beyond the specifically disclosed embodiments and / or uses of the invention, as well as their obvious modifications and equivalents. Therefore, the scope of the invention disclosed is not intended to be limited by the specific disclosed embodiments described below.

[0016] Where used in this disclosure, the term “substrate” may refer to one or more arbitrary substrate materials, such as one or more arbitrary substrate materials, which may be modified or on which devices, circuits, or films may be formed. “Substrate” can be continuous or discontinuous, rigid or flexible, solid or porous, or a combination thereof. A substrate can be in any form, such as powder, plate, or workpiece. Examples of substrates in plate form include wafers of various shapes and sizes. A substrate may be made from semiconductor materials, including, for example, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.

[0017] For example, substrates in powder form may have applications in pharmaceutical manufacturing. Porous substrates may also contain polymers. Examples of workpieces include medical devices (e.g., stents and syringes), jewelry, tooling devices, components for battery manufacturing (e.g., anodes, cathodes, or separators), or components for photovoltaic batteries.

[0018] The continuous substrate may be configured to extend beyond the boundary of the process chamber in which the deposition process takes place. In some processes, the continuous substrate may move through the process chamber, thereby allowing the process to continue until it reaches the end of the substrate. The continuous substrate may be supplied from a continuous substrate supply system to enable the manufacture and production of the continuous substrate in any suitable form.

[0019] Non-limiting examples of continuous substrates include sheets, nonwoven films, rolls, foils, webs, flexible materials, and bundles of continuous filaments or fibers (e.g., ceramic fibers or polymer fibers). The continuous substrate may also include a carrier or sheet on which a discontinuous substrate is placed.

[0020] The examples presented herein are not intended to represent the actual appearance of any particular material, structure, or device, but are merely idealized representations used to illustrate embodiments of the disclosure.

[0021] The specific embodiments illustrated and described are illustrative of the present invention and its best mode, and are not intended to limit the embodiments and scope of the invention in any way. In fact, for the sake of brevity, conventional manufacturing, association, preparation, and other functional aspects of the system may not be described in detail. Furthermore, the connecting lines shown in various figures are intended to represent exemplary functional relationships and / or physical connections between various elements. Many alternative or additional functional relationships or physical connections may exist in the actual system and / or may not exist in some embodiments.

[0022] The configurations and / or approaches described in this specification are essentially exemplary, and it should be understood that these specific embodiments or examples should not be considered to have a limiting meaning because numerous variations are possible. The specific routines or methods described in this specification may represent one or more of any number of processing strategies. Accordingly, the various operations illustrated may be performed in the order illustrated, or in other orders, or in some cases, may be omitted.

[0023] The subject matter of the present disclosure includes not only all novel and non-obvious combinations and sub-combinations of the various processes, systems, and configurations, as well as other features, functions, operations, and / or characteristics disclosed herein, but also any and all equivalents thereof.

[0024] FIG. 2 illustrates an embodiment of a susceptor heater according to the present disclosure.

[0025] The susceptor heater 200 may be configured to include a susceptor portion 210A and a shaft portion 210B. The susceptor portion 210A may be configured to include an upper portion 210 and a lower portion 220. The susceptor heater 200 may also be configured to include a heating element 230 disposed between the upper portion 210 and the lower portion 220. The shaft portion 210B may be disposed below the susceptor portion 210A.

[0026] In this embodiment, the upper portion 210 and the lower portion 220 may be joined by diffusion bonding. Diffusion bonding does not use any foreign substances, such as those used for brazing. The material of the joined portion is the same as the materials of the upper portion 210 and the lower portion 220.

[0027] After diffusion bonding, an anodic oxide film layer may be coated over the entire outer surfaces of the susceptor portion 210A and the shaft portion 210B.

[0028] Figure 3 illustrates another embodiment of the susceptor heater according to this disclosure.

[0029] The susceptor heater 300 may be configured to include a susceptor section 310A and a shaft section 310B. The susceptor section 310A may be configured to include an upper section 310 and a lower section 320. The susceptor heater 300 may also be configured to include a heating element 330 positioned on the lower section 320 and between the upper section 310 and the lower section 320. The shaft section 310B may be positioned below the susceptor section 310A.

[0030] The upper part 310 may be shaped like a cylinder with a hollow (or recess) in the central region of its bottom side, and the lower part 320 may be shaped so that it can fit perfectly into the hollow region of the upper part 310.

[0031] In this embodiment, the upper 310 and lower 320 may be joined horizontally by brazing 340 and vertically by electric beam welding 360. The area where brazing is used may be confined to the inside of the susceptor heater 300, and only the area of ​​electric beam welding may be exposed on its surface.

[0032] After brazing and electric beam welding, the anodic oxide film layer may cover the entire outer surface of the susceptor portion 310A and the shaft portion 310B.

[0033] Figure 4 illustrates another embodiment of the susceptor heater according to the present disclosure, which is an embodiment in which the shape of the upper 410 and lower 420 differs.

[0034] The susceptor heater 400 may be configured to include a susceptor section 410A and a shaft section 410B. The susceptor section 410A may be configured to include an upper section 410 and a lower section 420. The susceptor heater 400 may also be configured to include a heating element 430 positioned on the lower section 420 and between the upper section 410 and the lower section 420. The shaft section 410B may be positioned below the susceptor section 410A.

[0035] The upper part 410 may be shaped like a cylinder with a bulge in the central region on its bottom side, and the lower part 420 may be shaped like a cylinder with a hollow in the central region on its upper side so that the bulge of the upper part 410 can fit completely into the hollow region of the lower part 420.

[0036] In this embodiment, the upper 410 and lower 420 may be joined horizontally by brazing 440 in the central region and by electric beam welding (electric beam welded region 460) around the outer rim, as shown in Figure 4. The vertical contact 465 between the upper 410 and lower 420 may not be subjected to any treatment. The area where brazing is used may be limited to the inside of the susceptor heater 400, and only the electric beam welded region 460 may be exposed on its surface.

[0037] After brazing and electric beam welding, the anodic oxide film layer may be configured to cover the entire outer surface of the susceptor portion 410A and the shaft portion 410B.

[0038] The upper and lower parts of the susceptor may have other shapes, and in any other shape, the brazing is not exposed on the surface.

[0039] The above-described arrangement of the apparatus is merely illustrative of the application of the principles of the present invention, and numerous other embodiments and modifications may be made without departing from the spirit and scope of the invention, as defined in the claims. Accordingly, the scope of the invention should not be determined by reference to the above description, but rather by reference to the appended claims together with the entire scope of their equivalents. [Explanation of Symbols]

[0040] 200, 300, 400 Suscepter Heater 210, 310, 410 Top 210A, 310A, 410A Susceptor Section 210B, 310B, 410B shaft section 220, 320, 420 lower 230, 330, 430 heating element

Claims

1. It is the susceptor part, The top and, The bottom and A plurality of heating elements are arranged between the upper and lower parts, A susceptor section equipped with, The shaft part, A susceptor heater comprising the upper and lower parts joined by a diffusion bond.

2. The susceptor heater according to claim 1, further comprising an anodic oxide film layer configured to cover the outer surfaces of the susceptor portion and the shaft portion.

3. It is the susceptor part, The upper part is indented upwards in the center, A lower part shaped to fit into the aforementioned recessed area at the upper part, The lower part includes a plurality of heating elements arranged between the upper part and the lower part, A susceptor section equipped with, The shaft part, A susceptor heater comprising the upper and lower parts, which are joined horizontally by brazing and vertically by electric beam welding.

4. The susceptor heater according to claim 3, further comprising an anodic oxide film layer configured to cover the outer surfaces of the susceptor portion and the shaft portion.

5. It is the susceptor part, The upper part is shaped to bulge in the center, The lower part is shaped to be hollow in the center, The lower part includes a plurality of heating elements arranged between the upper part and the lower part, A susceptor section equipped with, The shaft part, A susceptor heater comprising the upper and lower parts joined by brazing at the center and joined at the outer rim by electric beam welding.

6. The susceptor heater according to claim 5, further comprising an anodic oxide film layer configured to cover the outer surfaces of the susceptor portion and the shaft portion.