Susceptor for processing substrate
The susceptor addresses cooling and ESC limitations by integrating thermal control and electrostatic chucking features, enhancing temperature stability and film quality in low-temperature processes.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-09-26
- Publication Date
- 2026-04-09
AI Technical Summary
Conventional AlN susceptors used in low-temperature processes face insufficient cooling performance and lack of electrostatic chucking (ESC) functionality, leading to wafer temperature rise and lower film quality.
A susceptor with integrated thermal control and ESC capabilities, featuring a conductive metal support portion, heating and cooling channels, and electrostatic chucking components, including a heating coil, thermocouple, and coolant channels, with insulating layers and power supplies for precise temperature management.
The susceptor provides efficient temperature control and ESC functionality, ensuring stable wafer temperature and improved film quality during processing.
Smart Images
Figure 2026062552000001_ABST
Abstract
Description
Technical Field
[0001] This disclosure generally relates to susceptors used in semiconductor manufacturing, and more specifically to metal susceptors having electrostatic chucking capabilities.
Background Art
[0002] Conventionally, when an AlN susceptor heater is used in a low-temperature process, the cooling performance during deposition becomes insufficient, and the heater surface temperature cannot be controlled. This may cause the temperature of the wafer to rise, and may also lead to lower film quality and throughput.
[0003] When an aluminum susceptor heater is used in such a low-temperature process, it is difficult to add an electrostatic chucking (ESC) function, and the cooling performance is insufficient under high-power conditions, so the wafer temperature rises during film deposition.
Summary of the Invention
Problems to be Solved by the Invention
[0004] Therefore, this disclosure provides a new susceptor having thermal control and ESC functions.
Means for Solving the Problems
[0005] This summary is provided to introduce some concepts in a simplified form. These concepts are further described in more detail in the detailed description of the exemplary embodiments of the present disclosure below. This summary is not intended to identify the main features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.
[0006] According to one embodiment, a susceptor for processing a substrate is provided, comprising: a support portion configured to support the substrate; a heating coil disposed within the support portion and configured to heat the temperature of the support portion; a thermocouple (TC) disposed within the support portion to monitor the temperature of the support portion; a shaft disposed below the support portion; an insulating portion disposed within the shaft; a plurality of cooling channels disposed within the insulating portion; and an insulating layer disposed on the surfaces of the support portion and the insulating portion, wherein the insulating layer is made of a conductive metal.
[0007] In one embodiment, the susceptor further comprises a heating power supply connected to a heating coil and configured to supply power to heat the heating coil, and a chuck power supply connected to a support and configured to supply power to provide the support with an electrostatic chuck (ESC) function.
[0008] In one embodiment, the conductive metal includes one of copper (Cu), aluminum (Al), iron (Fe), zinc (Zn), nickel (Ni), tungsten (W), and tin (Sn), or a mixture thereof.
[0009] In one embodiment, the susceptor further comprises a TC tube including a TC line that extends from the TC to the bottom of the insulating part and electrically connects the TC and the sensor; a heating tube including a heating wire that extends from the heating coil to the bottom of the insulating part and electrically connects the heating coil and the heating power supply; a chuck tube including a heating wire that extends from the support part to the bottom of the insulating part and electrically connects the support part and the chuck power supply; and a pair of cooling tubes for supplying and discharging coolant to the cooling channel, respectively.
[0010] In one embodiment, the heating power supply further comprises an alternating current (AC) transformer for generating power, and a thyristor connected to a heating coil, with one end of the AC transformer connected to the AC transformer.
[0011] In one embodiment, the chuck power supply further comprises a generator and a resistor configured to block radio frequency (RF) elements, wherein the generator is connected to earth and the generator and resistor are connected in series.
[0012] In one embodiment, a capacitor is connected in parallel with a generator and a resistor, and the capacitor is connected to another ground.
[0013] In one embodiment, the TC tube, heating tube, chuck tube, and cooling tube are covered with an insulating material.
[0014] According to another embodiment, a susceptor for processing a substrate is provided, comprising: a support portion configured to support the substrate; a heating coil disposed within the support portion and configured to heat the temperature of the support portion; a thermocouple (TC) disposed within the support portion to monitor the temperature of the support portion; a plurality of cooling channels disposed within the support portion; a shaft disposed below the support portion; an insulating portion disposed below the shaft; an adapter disposed below the insulating portion; and an insulating layer disposed on the surfaces of the support portion, the insulating portion, and the adapter, wherein the insulating layer is made of a conductive metal.
[0015] In one embodiment, the susceptor further comprises a heating power supply connected to a heating coil and configured to supply power to heat the heating coil, and a chuck power supply connected to a support and configured to supply power to provide the support with an electrostatic chuck (ESC) function.
[0016] In one embodiment, the conductive metal includes one of copper (Cu), aluminum (Al), iron (Fe), zinc (Zn), nickel (Ni), tungsten (W), and tin (Sn), or a mixture thereof.
[0017] In one embodiment, the susceptor further comprises a TC tube including a TC line that extends from the TC to the bottom of the insulating part and electrically connects the TC and the sensor; a heating tube including a heating wire that extends from the heating coil to the bottom of the insulating part and electrically connects the heating coil and the heating power supply; a chuck tube including a heating wire that extends from the support part to the bottom of the insulating part and electrically connects the support part and the chuck power supply; and a pair of cooling tubes for supplying and discharging coolant to the cooling channel, respectively.
[0018] In one embodiment, the heating power supply further comprises an alternating current (AC) transformer for generating electricity, and a thyristor connected to a heating coil, with one end of the AC transformer connected to the AC transformer.
[0019] In one embodiment, the chuck power supply further comprises a generator and a resistor configured to block radio frequency (RF) elements, wherein the generator is connected to earth and the generator and resistor are connected in series.
[0020] In one embodiment, a capacitor is connected in parallel with a generator and a resistor, and the capacitor is connected to another ground.
[0021] In one embodiment, the TC tube, heating tube, chuck tube, and cooling tube are covered with an insulating material.
[0022] It will be understood that the elements in the figures are illustrated for simplicity and clarity and are not necessarily drawn to actual size. For example, the dimensions of some of the elements in the figures may be exaggerated relative to others to help improve understanding of the illustrated embodiments of this disclosure. [Brief explanation of the drawing]
[0023] [Figure 1] An overview of a susceptor according to one embodiment of the present disclosure is shown. [Figure 2] An overview of a susceptor according to another embodiment of the present disclosure is shown. [Modes for carrying out the invention]
[0024] Certain specific embodiments and examples are disclosed below, but it will be understood by those skilled in the art that the scope of the present invention extends beyond the specifically disclosed embodiments and / or uses of the present invention, as well as their obvious modifications and equivalents. Therefore, it is intended that the scope of the disclosed invention should not be limited by the specific disclosed embodiments described hereinafter.
[0025] As used in this disclosure, the term "substrate" may refer to any single or plurality of underlying materials, such as any single or plurality of underlying materials that may be modified or on which a device, circuit, or film may be formed. A "substrate" can be continuous or discontinuous, rigid or flexible, solid or porous, and combinations thereof. The substrate can be in any form, such as a powder, plate, or workpiece. Examples of substrates in the form of plates can include wafers of various shapes and sizes. The substrate can be made from semiconductor materials, including, for example, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.
[0026] As an example, a substrate in the form of a powder can have applications for pharmaceutical manufacturing. A porous substrate can include a polymer. Examples of workpieces can include medical devices (such as stents and syringes), jewelry, tour devices, components for battery manufacturing (such as anodes, cathodes, or separators), or components of a photovoltaic cell, etc.
[0027] A continuous substrate can extend beyond the boundaries of the process chamber in which the deposition process occurs. In some processes, the continuous substrate can move through the process chamber, whereby the process is continued until it reaches the end of the substrate. The continuous substrate can be supplied from a continuous substrate supply system in any suitable form to enable the manufacture and production of the continuous substrate.
[0028] Non-limiting examples of continuous substrates include sheets, nonwoven films, rolls, foils, webs, flexible materials, and bundles of continuous filaments or fibers (e.g., ceramic fibers or polymer fibers). Continuous substrates may also include carriers or sheets on which discontinuous substrates are placed.
[0029] The examples presented herein are not intended to represent the actual appearance of any particular material, structure, or device, but are merely idealized representations used to illustrate embodiments of the disclosure.
[0030] The specific embodiments illustrated and described are illustrative of the present invention and its best mode, and are not intended to limit the embodiments and scope of the invention in any way. Furthermore, for the sake of brevity, other functional aspects of conventional manufacturing, association, preparation, and systems may not be described in detail. Additionally, the connecting lines shown in various figures are intended to represent exemplary functional relationships and / or physical connections between various elements. Many alternative or additional functional relationships or physical connections may exist in actual systems and / or may not exist in some embodiments.
[0031] It will be understood that the configurations and / or approaches described herein are essentially illustrative, and these particular embodiments or examples should not be considered limiting, as numerous variations are possible. The specific routines or methods described herein may represent one or more of any number of processing strategies. Therefore, the various operations illustrated may be performed in the order illustrated, or in other orders, or, in some cases, omitted.
[0032] The subject matter of this disclosure includes all novel and non-obvious combinations and partial combinations of the various processes, systems, and configurations disclosed herein, as well as any and all equivalents thereof, and other features, functions, operations, and / or characteristics.
[0033] Figure 1 illustrates a susceptor for processing a substrate according to one embodiment of the present disclosure. The susceptor 100 may be configured to include a support portion 110, a heating coil 120, a shaft 150, and an insulating portion 160.
[0034] The support portion 110 may be made of a conductive material such as a metal, or a mixture of one or more of these, such as copper (Cu), aluminum (Al), iron (Fe), zinc (Zn), nickel (Ni), tungsten (W), and tin (Sn).
[0035] A heating coil 120 and a thermocouple (TC) 140 may be arranged in the support portion 110. The heating coil 120 is used to heat the support portion 110 during substrate processing, and the TC 140 may be used to monitor the temperature of the support portion 110.
[0036] A coolant may be used in the coolant channel 130 to cool the support section 110. However, if water is used as the coolant, the water will evaporate within the coolant channel 130 if the coolant channel 130 is located near the heating coil 120. When water is used as the coolant, the coolant channel 130 is placed within the insulating section 160, as shown in Figure 1, to prevent the coolant from evaporating. The insulating section 160 may be located some distance from the heating coil 120, and the coolant channel 130 may be separated from the support section 110.
[0037] The coolant may be supplied to the coolant channel 130 by a cooling tube 131, and the TC tube 141 may be configured to protect the TC 140 and the link between the TC 140 and the sensor 140A used to monitor the temperature of the support 110.
[0038] The heating coil 120 may be connected to a heating power supply 122, and the connection is protected by a heating tube 121 from the heating coil 120 to the bottom of the insulating section 160. The heating power supply 122 may be configured to include an AC transformer 124 for power generation and a thyristor 123 for rectifying the power input from the transformer 124.
[0039] As described above, the support portion 110 may be made of conductive metal(s) for the electrostatic chuck (ESC) function. For the ESC, the support portion 110 may be connected to a chuck power supply 171, which may be configured to be protected by a chuck tube 170. The chuck power supply 171 may be configured to include a generator 173 and a resistor 172 connected in series, the resistor 172 may be configured to block transmitted radio frequency (RF) elements.
[0040] The capacitor 175 may be connected in parallel with the generator 173 and the resistor 172, or it may be connected to the ground 176, and the capacitor may be used to isolate the direct current (DC) of the support 110.
[0041] The insulating layer 111 may be configured to cover the surfaces of the support portion 110, the shaft 150, and even the insulating portion 160. The insulating layer 111 can provide the support portion 110 with ESC functionality. In addition, the surfaces of the tubes, namely the TC tube 141, the cooling tube 131, the heating tube 121, and the chuck tube 170, may be covered with insulating material.
[0042] Figure 2 illustrates a susceptor for processing a substrate according to another embodiment of the present disclosure. The susceptor 200 may be configured to include a support 210, a heating coil 220, a shaft 250, and an insulating section 260 and an adapter 270.
[0043] The support portion 210 may be made of a conductive material such as a metal, or a mixture of one or more of these, such as copper (Cu), aluminum (Al), iron (Fe), zinc (Zn), nickel (Ni), tungsten (W), and tin (Sn).
[0044] The support portion 210 may include a heating coil 220 and a thermocouple (TC) 240. The heating coil 220 may be used to heat the support portion 210 during substrate processing, and the TC 240 may be used to monitor the temperature of the support portion 210.
[0045] To cool the support portion 210, a coolant may be used in the coolant channel 230. In Figure 2, a coolant with a higher boiling point (than water) may be used, thereby preventing evaporation problems. Therefore, the coolant channel 230 is positioned within the support portion 210 as shown in Figure 2. An insulating portion 260 may be positioned on the shaft 250 to provide electrical insulation from the support portion 210.
[0046] The coolant may be supplied to the coolant channel 230 by a cooling tube 231, and the TC tube 241 may be configured to protect the TC 240 and the link between the TC 240 and the sensor 240A used to monitor the temperature of the support 210.
[0047] The heating coil 220 may be connected to a heating power supply 222, the connection protected by a heating tube 221 from the heating coil 220 to the bottom of the adapter 270. The heating power supply 222 may be configured to include an alternating current (AC) transformer 224 for generating power and a thyristor 223 for rectifying the power input from the transformer 224.
[0048] As described above, the support portion 210 may be made of conductive metal(s) for the electrostatic chuck (ESC) function. For the ESC, the support portion 210 may be connected to a chuck power supply 281, and this connection may be protected by a chuck tube 280. The chuck power supply 281 may be configured to include a generator 283 and a resistor 282 connected in series, the resistor 282 may be used to block transmitted radio frequency (RF) elements.
[0049] The capacitor 285 may be connected in parallel with the generator 283 and the resistor 282, or it may be connected to the ground 286, and the capacitor may be used to isolate the direct current (DC) of the support 210.
[0050] The insulating layer 211 may be configured to cover the surfaces of the support portion 210, the shaft 250, and even the insulating portion 260. The insulating layer 211 can provide the support portion 210 with ESC functionality. In addition, the surfaces of the tubes, namely the TC tube 241, the cooling tube 231, the heating tube 221, and the chuck tube 280, may be covered with insulating material.
[0051] The susceptors 100 and 200 having metal support parts 110 and 210 having insulating layers 111 and 211 according to this disclosure have a metal (i.e., highly conductive) body, which allows for efficient temperature control during substrate processing and may also provide ESC capabilities.
[0052] The above-described arrangement of the apparatus is merely illustrative of the application of the principles of the present invention, and numerous other embodiments and modifications may be made without departing from the spirit and scope of the invention, as defined in the claims. Accordingly, the scope of the invention should not be determined by reference to the above description, but rather by reference to the appended claims together with the entire scope of their equivalents. [Explanation of symbols]
[0053] 100 Susceptors 110 Metal support part 110 Support part 111 Insulating layer 120 heating coils 121 Heating tube 122 Heating power supply 123 Thyristor 124 Transformer 130 Coolant Channels 131 Cooling pipe 140 Thermocouple (TC) 141 TC tube 150 shaft 160 Insulation part 170 Chuck tube 171 Chuck Power Supply 172 Resistor 173 Generator 175 Capacitors 176 Earth 200 Susceptors 210 Metal support part 211 Insulating layer 220 heating coil 221 Heating tube 222 Heating power supply 223 Thyristor 224 AC Transformer 230 coolant channels 231 Cooling pipe 240 Thermocouple (TC) 241 TC tube 250 shaft 260 Insulation part 270 Adapter 280 Chuck tube 281 Chuck Power Supply 282 Resistor 283 Generator 285 Capacitors 286 Earth
Claims
1. A susceptor for processing a substrate, A support part configured to support the base material, A heating coil disposed within the support portion, configured to heat the temperature of the support portion, A thermocouple is placed inside the support portion to monitor the temperature of the support portion, A shaft positioned below the support portion, An insulating part arranged inside the shaft, Multiple cooling channels arranged within the insulating portion, An insulating layer disposed on the surface of the support portion and the insulating portion, wherein the insulating layer of the support portion is made of a conductive metal, A susceptor equipped with this feature.
2. A heating power supply connected to the heating coil and configured to supply power to heat the heating coil, A chuck power supply connected to the support portion and configured to supply power to the support portion in order to provide an electrostatic chuck function, The susceptor according to claim 1, further comprising:
3. The susceptor according to claim 1, wherein the conductive metal comprises one of copper (Cu), aluminum (Al), iron (Fe), zinc (Zn), nickel (Ni), tungsten (W), and tin (Sn), or a mixture thereof.
4. A thermocouple tube is provided, which is positioned from the thermocouple to the bottom of the insulating part and includes a thermocouple line that electrically connects the thermocouple and the sensor. A heating tube is provided, which is positioned from the heating coil to the bottom of the insulating section and includes a heating wire that electrically connects the heating coil and the heating power supply. A chuck tube is provided, which is positioned from the support portion to the bottom of the insulating portion and includes a heating element that electrically connects the support portion and the chuck power supply. A pair of cooling pipes for supplying and discharging coolant to the cooling channel, The susceptor according to claim 2, further comprising:
5. The aforementioned heating power supply is AC transformers for generating electricity, A thyristor connected to the AC transformer and the heating coil on one side, The susceptor according to claim 2, further comprising:
6. The aforementioned chuck power supply is A generator and A resistor configured to block radio frequency elements, Furthermore, The susceptor according to claim 2, wherein the generator is connected to earth, and the generator and the resistor are connected in series.
7. The susceptor according to claim 6, wherein the capacitor is connected in parallel with the generator and the resistor, and the capacitor is connected to another ground.
8. The susceptor according to claim 4, wherein the thermocouple tube, the heating tube, the chuck tube, and the cooling tube are covered with an insulating material.
9. A susceptor for processing a substrate, A support part configured to support the base material, A heating coil disposed within the support portion, configured to heat the temperature of the support portion, A thermocouple is placed inside the support portion to monitor the temperature of the support portion, Multiple cooling channels arranged within the support portion, A shaft positioned below the support portion, An insulating part located below the shaft, An adapter positioned below the aforementioned insulating portion, The support portion, the insulating portion, and the insulating layer disposed on the surface of the adapter, wherein the support portion has an insulating layer made of a conductive metal, A susceptor equipped with this feature.
10. A heating power supply connected to the heating coil and configured to supply power to heat the heating coil, A chuck power supply connected to the support portion and configured to supply power to the support portion in order to provide an electrostatic chuck function, The susceptor according to claim 9, further comprising:
11. The susceptor according to claim 9, wherein the conductive metal comprises one of copper (Cu), aluminum (Al), iron (Fe), zinc (Zn), nickel (Ni), tungsten (W), and tin (Sn), or a mixture thereof.
12. A thermocouple tube is provided, which is positioned from the thermocouple to the bottom of the insulating part and includes a thermocouple line that electrically connects the thermocouple and the sensor. A heating tube is provided, which is positioned from the heating coil to the bottom of the insulating section and includes a heating wire that electrically connects the heating coil and the heating power supply. A chuck tube is provided, which is positioned from the support portion to the bottom of the insulating portion and includes a heating element that electrically connects the support portion and the chuck power supply. A pair of cooling pipes for supplying and discharging coolant to the cooling channel, The susceptor according to claim 10, further comprising:
13. The aforementioned heating power supply is AC transformers for generating electricity, A thyristor connected to the AC transformer and the heating coil on one side, The susceptor according to claim 10, further comprising:
14. The aforementioned chuck power supply is A generator and A resistor configured to block radio frequency elements, Furthermore, The susceptor according to claim 10, wherein the generator is connected to earth, and the generator and the resistor are connected in series.
15. The susceptor according to claim 14, wherein the capacitor is connected in parallel with the generator and the resistor, and the capacitor is connected to another ground.
16. The susceptor according to claim 12, wherein the thermocouple tube, the heating tube, the chuck tube, and the cooling tube are covered with an insulating material.