PCB Processing System Carrier

Abstract

This invention provides a carrier and method for transporting contents such as process kit rings within a substrate processing system. [Solution] The carrier 200 includes a rigid body 210 forming a plurality of openings, and a plurality of fasteners 230 that are detachably attached to the rigid body via a plurality of threaded openings for receiving fasteners. A first set of fingers 240 (e.g., three fingers) is detachably attached to the rigid body via the plurality of fasteners and the plurality of openings. The first set of fingers supports a first content during the first transport of the carrier in the substrate processing system. A second set of fingers 240 (e.g., three different fingers) is detachably attached to the rigid body via the plurality of fasteners and the plurality of openings and supports a second content during the second transport of the carrier in the substrate processing system.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to an apparatus and method for transporting content, and more particularly, to a carrier for transporting content such as a process kit ring within a substrate processing system. Background

[0002] In semiconductor processing and other electronic processing, platforms that use robotic arms to transport objects (e.g., wafers, etc.) between processing chambers, from storage areas (e.g., front opening unified pods (FOUPs)) to processing chambers, from processing chambers to storage areas, etc. are often used. Summary

[0003] The following is a simplified summary of the disclosure to provide a basic understanding of some aspects of the present disclosure. This summary is not an extensive overview of the disclosure. It is not intended to identify key or critical elements of the disclosure, nor to define the scope of specific implementations or claims of the disclosure. Its sole purpose is to present some concepts of the present disclosure in a simplified form as a prelude to the more detailed description presented later.

[0004] In one aspect of the present disclosure, a carrier includes a rigid body forming a plurality of openings and a plurality of fasteners configured to be removably attached to the rigid body via the plurality of openings. A first set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The first set of fingers is configured to support a first content during a first transport of the carrier within the substrate processing system. A second set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The second set of fingers is configured to support a second content during a second transport of the carrier within the substrate processing system.

[0005] In other embodiments of the present disclosure, the finger is configured to be detachably attached to a carrier of a substrate processing system. The finger includes a first upper surface substantially located in a first plane and a second upper surface located in a second plane substantially above the first plane. The first upper surface is configured to support the contents during transport of the carrier. The finger further includes a side wall located between the first and second upper surfaces. The finger further includes a lower surface. A first opening is formed through the finger from the second upper surface to the lower surface. The lower surface forms a recess for receiving a portion of the carrier that forms a second opening. The finger is attached to the carrier via fasteners inserted through the first opening of the finger and the second opening of the carrier.

[0006] In other aspects of the present disclosure, the method includes determining a first condition related to a first transport in a substrate processing system and identifying a first set of fingers corresponding to the first condition. Furthermore, the method includes attaching the first set of fingers to a rigid body of a carrier via a plurality of fasteners and placing a first content on the first set of fingers that are transported within the substrate processing system via the carrier. [Brief explanation of the drawing]

[0007] This disclosure is shown as an example, not as an limitation, in the drawings of the accompanying drawings where similar references show similar elements. It should be noted that different references to “a certain” or “one” embodiment in this disclosure do not necessarily refer to the same embodiment, and such references mean at least one. [Figure 1] This shows a processing system according to a specific embodiment. [Figure 2A] ~ [Figure 2N] A diagram of a carrier according to a specific embodiment is shown. [Figure 3A] ~ [Figure 3B] This figure shows the fingers of a carrier according to a specific embodiment. [Figure 4A] ~ [Figure 4F] This figure shows the fingers and fasteners of a carrier according to a specific embodiment. [Figure 5] This describes a method of using a carrier according to a specific embodiment. Detailed description of the embodiment

[0008] The embodiments described herein relate to substrate processing system carriers. Certain embodiments relate to carriers configured to transport process kit rings (e.g., edge rings) and / or other chamber components between stations within a substrate processing system. The carrier is picked up, moved, and positioned by a robotic arm configured to pick up, move, and position substrates such as wafers. The carrier allows other types of objects (e.g., process kit rings) to be processed by the robotic arm configured to process substrates.

[0009] A processing system (such as a wafer processing system) has one or more processing chambers for processing a substrate. Gas is used to etch the substrate within the processing chamber (for example, the substrate is etched while electrostatically clamped in place within the etching chamber). The substrate support assembly generally includes one or more process kit rings surrounding the substrate (for example, one or more parts of the processing chamber, to protect the substrate). For example, a circular component called an edge ring or process kit ring is positioned just outside the outer diameter of the substrate to prevent the top surface of the chuck supporting the substrate (e.g., an electrostatic chuck) from being etched by etchantochemistry. Process kit rings can be manufactured from several different materials and have different shapes, both of which affect the uniformity of the process near the process kit ring. During processing, the process kit ring and other components of the processing chamber are etched over time, resulting in changes in shape and changes in processing uniformity.

[0010] To address changes in processing uniformity due to degradation of the process kit ring and other components, the process kit ring and other components are replaced. Several components (e.g., the process kit ring) are replaced according to a schedule. Traditionally, replacing components (e.g., the process kit ring) involves an operator opening the processing chamber to access the internal components, manually removing and replacing the components, and then closing the processing chamber. While the processing chamber is open, the processing chamber and processing system may be contaminated with cells, hair, dust, etc. After opening, the processing chamber and / or processing system undergo a recertification process, which involves removing the processing chamber and / or processing system from operation for several days to several weeks. The recertification process affects production line yield, scheduling, quality (e.g., if variables are added to the system), user time, energy consumption, etc.

[0011] The devices, systems, and methods disclosed herein provide a substrate processing system carrier (also referred herein as a chamber component carrier or simply a carrier). The carrier enables the automatic exchange of various types of contents under various types of conditions (e.g., without opening the process chamber while maintaining a sealed environment). The carrier includes a rigid body forming an opening and a fastener configured to be detachably attached to the rigid body through the opening. A first set of fingers (e.g., three fingers) is configured to be detachably attached to the rigid body via the fastener and the opening. The first set of fingers is configured to support a first content during a first transport of the carrier within the substrate processing system (e.g., via a robotic arm). A second set of fingers (e.g., three fingers) is configured to be detachably attached to the rigid body via the fastener and the opening. The second set of fingers is configured to support a second content during a second transport of the carrier within the substrate processing system (e.g., via a robotic arm). In some embodiments, the first content and the second content are different types of contents. In some examples, the content may include one or more items such as a new process kit ring, a used process kit ring, a new chamber component of a substrate processing system, or a used chamber component of a substrate processing system.

[0012] In some embodiments, the first and second conveying processes are under different conditions. In some embodiments, each finger of the first set of fingers contains a first material configured for the first condition, and each finger of the second set of fingers contains a second material configured for a second condition different from the first condition. In some examples, the conditions include one or more of the following: corrosive conditions, clean conditions, electrostatic conditions, high temperature, high pressure, atmospheric pressure, vacuum, etc.

[0013] In some embodiments, each finger has a first upper surface, a second upper surface, a side wall, and a lower surface. The first upper surface is substantially located in a first plane and is configured to support the content during carrier transport. The second upper surface is substantially located in a second plane above the first plane. The side wall is located between the first and second upper surfaces. A first opening is formed through the finger from the second upper surface to the lower surface. The lower surface forms a recess that receives a portion of the carrier forming the second opening. The finger is detachably attached to the carrier via fasteners inserted through the first opening of the finger and the second opening of the carrier. In some embodiments, the content comes into contact with the set of fingers without coming into contact with the rigid body during carrier transport. In some embodiments, the opening formed by the rigid body is a slot, and each finger is adjustablely positioned on the rigid body via the slot. In some examples, the position of the finger is adjusted based on finger wear. In some examples, the position of the finger is adjusted based on the type (e.g., size) of the content being transported by the carrier.

[0014] In some embodiments, the sidewall of the finger has an upper portion having an angle of about 100–110° (e.g., about 15° from orthogonal) with respect to the first upper surface and a lower portion having an angle of about 90–100° (e.g., about 5° from right angle). In some embodiments, the finger further includes a chamfer between the first upper surface and the sidewall. In some embodiments, the finger is configured to dissipate static charge.

[0015] The carrier (e.g., a rigid body) includes one or more lower surfaces configured to interface with the end effector of the robot arm. The carrier (e.g., a rigid body) includes one or more lower surfaces (e.g., a solid planar central region) configured to interface with the vacuum chuck.

[0016] The devices, systems, and methods disclosed herein offer advantages over conventional solutions. The substrate processing system carrier enables the automatic exchange of various types of contents under various conditions without opening the process chamber and without subsequent re-certification processes. The substrate processing system carrier is configured to interface with equipment used for wafer transport (e.g., end effectors for robot arms, vacuum chucks, lift pins, etc.). The use of the substrate processing system carrier allows wafer handling components of a wafer processing system (e.g., vacuum chucks, end effectors, robot arms, slit valves, load ports, etc.) to handle process kit rings and other components with no or minimal adaptation. Using the substrate processing system carrier for component exchange results in less impact on line yield, scheduling, substrate quality, user time, energy consumption, etc., compared to conventional solutions. Furthermore, the use of the substrate processing system carrier allows robots and / or stations configured for substrate handling to handle other types of objects (e.g., chamber components) without modification. This reduces the total cost of ownership of the substrate processing system.

[0017] While this description refers to process kit rings in part, it can be applied to different types of content (for example, in addition to process kit rings, different types of chamber components such as edge rings, showerheads, masks, mask handlers, and half rings). While this description refers to substrate processing systems in part, it can be applied to other types of systems.

[0018] Figure 1 shows a processing system 100 (e.g., a wafer processing system, a substrate processing system, a semiconductor processing system) according to a specific embodiment. The processing system 100 includes a factory interface 101 and load ports 128 (e.g., load ports 128A-D). In some embodiments, load ports 128A-D are directly attached to the factory interface 101 (e.g., sealed). Enclosure systems 130 (e.g., cassettes, FOUPs, process kit enclosure systems, etc.) are configured to be detachably coupled (e.g., docked) to load ports 128A-D. In Figure 1, enclosure system 130A is coupled to load port 128A, enclosure system 130B is coupled to load port 128B, enclosure system 130C is coupled to load port 128C, and enclosure system 130D is coupled to load port 128D. In some embodiments, one or more enclosure systems 130 are coupled to a load port 128 to transport wafers and / or other substrates to and from the processing system 100. Each enclosure system 130 is sealed to its respective load port 128. In some embodiments, a first enclosure system 130A is docked to the load port 128A (e.g., for the replacement of a used process kit ring). Once one or more such operations are performed, the first enclosure system 130A is undocked from the load port 128A, and then a second enclosure system 130 (e.g., a FOUP containing a wafer) is docked to the same load port 128A. In some embodiments, carriers (e.g., configured to use different types of fingers) are used to transport different types of content between the enclosure systems 130 and other parts of the processing system 100.

[0019] In some embodiments, the load port 128 includes a front interface that forms a vertical opening (or substantially vertical opening). Additionally, the load port 128 includes a horizontal plane for supporting enclosure systems 130 (e.g., cassette, process kit enclosure systems). Each enclosure system 130 (e.g., wafer FOUP, process kit enclosure system) has a front interface that forms a vertical opening. The front interface of the enclosure system 130 is sized to interface (e.g., seal) with the front interface of the load port 128 (e.g., the vertical opening of the enclosure system 130 is approximately the same size as the vertical opening of the load port 128). The enclosure system 130 is positioned on the horizontal plane of the load port 128, and the vertical opening of the enclosure system 130 is aligned with the vertical opening of the load port 128. The front interface of the enclosure system 130 interconnects (e.g., clamps, fastens, seals, etc.) with the front interface of the load port 128. The bottom plate (e.g., base plate) of the enclosure system 130 has features that engage with the horizontal plane of the load port 128 (e.g., load port dynamic pin features such as recesses or receptacles, load port features for pin clearance, and / or enclosure system docking tray latch clamp features). The same load port 128 is used in different types of enclosures (e.g., process kit enclosure systems, wafer cassettes, etc.).

[0020] In some embodiments, the enclosure system 130 (e.g., a process kit enclosure system) includes one or more items of the contents 110 (e.g., one or more process kit rings, an empty process kit ring carrier, process kit rings placed on the process kit ring carrier, a placement verification wafer, components of the processing system 100, etc.). In some examples, the enclosure system 130 is coupled to a factory interface 101 (e.g., via a load port 128) to automatically transport the process kit rings on the process kit ring carrier to the process system 100 for replacement of used process kits.

[0021] In some embodiments, the processing system 100 also includes first vacuum ports 103a, 103b that connect the factory interface 101 to each of the degassing chambers 104a, 104b. Second vacuum ports 105a, 105b are connected to each of the degassing chambers 104a, 104b and are located between the degassing chambers 104a, 104b and the transport chamber 106 to facilitate the transport of wafers and contents 110 (e.g., process kit rings) to the transport chamber 106. In some embodiments, the processing system 100 includes and / or uses one or more degassing chambers 104 and a corresponding number of vacuum ports 103, 105 (e.g., the processing system 100 includes a single degassing chamber 104, a single first vacuum port 103, and a single second vacuum port 105). The transport chamber 106 includes a plurality of processing chambers 107 (e.g., four processing chambers 107, six processing chambers 107, etc.) arranged around it and connected. The processing chamber 107 is coupled to the transport chamber 106 via its respective ports 108 (e.g., slit valves). In some embodiments, the factory interface 101 is under high pressure (e.g., atmospheric pressure), and the transport chamber 106 is under low pressure (e.g., vacuum). Each degassing chamber 104 (e.g., load lock, pressure chamber) has a first door (e.g., a first vacuum port 103) for sealing the degassing chamber 104 from the factory interface 101 and a second door (e.g., a second vacuum port 105) for sealing the degassing chamber 104 from the transport chamber 106. While the first door is open and the second door is closed, the contents are transported from the factory interface 101 to the degassing chamber 104. When the first door is closed, the pressure in the degassing chamber decreases to match that of the transport chamber 106, and when the second door is opened, the contents are transported from the degassing chamber 104. A local center finder (LCF) device is used to align the contents within the transport chamber 106 (for example, before entering the processing chamber 107 and after leaving the processing chamber 107).

[0022] In some embodiments, the processing chamber 107 includes one or more of an etching chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma enhanced versions thereof), an annealing chamber, etc.

[0023] The factory interface 101 includes a factory interface robot 111. The factory interface robot 111 includes a robotic arm (including, for example, a Selective Compliance Assembly Robot Arm (SCARA)). Examples of SCARA robots include 2-link SCARA robots, 3-link SCARA robots, 4-link SCARA robots, etc. The factory interface robot 111 includes an end effector at the end of the robotic arm. The end effector is configured to lift and process a specific object (such as a wafer, etc.). Alternatively or additionally, the end effector is configured to handle objects (such as carriers and / or process kit rings (edge rings), etc.). The robotic arm has one or more links or members (such as a wrist member, an upper arm member, a forearm member, etc.) configured to be moved to move the end effector to different orientations and different positions.

[0024] The factory interface robot 111 is configured to transfer objects between an enclosure system 130 (such as a cassette, FOUP) and the degassing chambers 104a, 104b (or load ports). Conventional systems are associated with openings (such as disassembly, seal breakage, contamination) of processing systems (such as factory interfaces, transfer chambers, processing chambers) to exchange different types of contents, but the processing system 100 is configured to facilitate the transfer and exchange of contents without openings (such as disassembly, seal breakage, contamination) of the processing system 100 by an operator. Thus, in some embodiments, a sealed environment including the internal volume of the enclosure system 130 and the internal volume of the factory interface 101 is maintained during the exchange of contents (such as via a carrier having replaceable fingers).

[0025] The transfer chamber 106 includes a transfer chamber robot 112. The transfer chamber robot 112 includes a robotic arm having an end effector at its end. The end effector is configured to handle a specific object (e.g., a wafer, etc.). In some embodiments, the transfer chamber robot 112 is a SCARA robot, but in some embodiments, it has fewer links and / or fewer degrees of freedom than the factory interface robot 111.

[0026] The controller 109 controls various aspects of the processing system 100. The controller 109 is a computing device (e.g., a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, etc.) and / or includes the same. The controller 109 includes one or more processing devices, which in some embodiments are general-purpose processing devices (e.g., a microprocessor, a central processing unit, etc.). More specifically, in some embodiments, the processing device is a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor that executes other instruction sets or a combination of instruction sets.

[0027] In some embodiments, the processing device is one or more dedicated processing devices (e.g., application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, etc.). In some embodiments, the controller 109 includes data storage (e.g., one or more disk drives and / or solid-state drives), main memory, static memory, a network interface, and / or other components. In some embodiments, the controller 109 executes instructions for performing any one or more of the methods or processes described herein. The instructions are stored in a computer-readable storage medium, which includes one or more main memory, static memory, secondary storage, and / or processing units (during the execution of the instructions). In some embodiments, the controller 109 receives signals from the factory interface robot 111 and the wafer transfer chamber robot 112 and transmits controls to them.

[0028] Figure 1 schematically illustrates the transport of content 110 (e.g., process kit rings coupled to a process kit ring carrier) to the processing chamber 107. According to one aspect of the present disclosure, content 110 is removed from the enclosure system 130 via a factory interface robot 111 located within the factory interface 101. The factory interface robot 111 transports content 110 into the respective degassing chambers 104a, 104b via one of the first vacuum ports 103a, 103b. A transport chamber robot 112 located within the transport chamber 106 removes content 110 from one of the degassing chambers 104a, 104b via a second vacuum port 105a or 105b. The transport chamber robot 112 moves content 110 into the transport chamber 106, where content 110 is transported to the processing chamber 107 via the respective ports 108. Although not clearly shown in Figure 1, the transport of content 110 includes the transport of process kit rings placed on the process kit ring carrier, the transport of empty process kit ring carriers, the transport of placement verification wafers, and so on.

[0029] Figure 1 shows an example of content 110 transport, but other examples are possible. In some examples, the enclosure system 130 may be coupled to the transport chamber 106 (for example, via a load port attached to the transport chamber 106). From the transport chamber 106, the content 110 is loaded into the processing chamber 107 by the transport chamber robot 112. Furthermore, in some embodiments, the content 110 is loaded into a substrate support pedestal (SSP). In some embodiments, an additional SSP is positioned to communicate with a factory interface 101 on the opposite side of the illustrated SSP. The processed content 110 (e.g., used process kit rings) is removed from the processing system 100 in the reverse manner to the method described herein. Multiple enclosure systems 130 or combinations of enclosure systems 130 and SSPs are used, but in some embodiments, one SSP or enclosure system 130 is used for unprocessed content 110 (e.g., new process kit rings), and other SSPs or enclosure systems 130 are used to receive processed content 110 (e.g., used process kit rings).

[0030] The processing system 100 includes a factory interface 101 (e.g., an equipment front-end module (EFEM)) and chambers adjacent to the factory interface 101 (e.g., a degassing chamber 104 such as a load port 128, an enclosure system 130, an SSP, a load lock 102, etc.). One or more chambers are sealed (e.g., each chamber is sealed). The adjacent chambers are sealed to the factory interface 101. In some embodiments, an inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) is supplied to one or more chambers (e.g., the factory interface 101 and / or adjacent chambers) to provide one or more inert environments. In some examples, the factory interface 101 is an inactive EFEM that maintains an inactive environment (e.g., an inactive EFEM mini-environment) within the factory interface 101, thereby eliminating the need for the user to enter the factory interface 101 (for example, the processing system 100 is configured so that there is no manual access within the factory interface 101).

[0031] In some embodiments, a gas flow (e.g., inert gas, nitrogen) is supplied to one or more chambers (e.g., factory interface 101) of the processing system 100. In some embodiments, the gas flow is greater than the leakage through one or more chambers, maintaining positive pressure within one or more chambers. In some embodiments, the inert gas in the factory interface 101 is recirculated. In some embodiments, a portion of the inert gas is discharged. In some embodiments, the gas flow of non-recirculated gas into the factory interface 101 is greater than the exhaust gas flow and gas leak, maintaining positive pressure of the inert gas in the factory interface 101. In some embodiments, the factory interface 101 is coupled to one or more valves and / or pumps to provide gas flow into and out of the factory interface 101. A processing unit (e.g., controller 109) controls the gas flow in and out of the factory interface 101. In some embodiments, the processing device receives sensor data from one or more sensors (e.g., an oxygen sensor, a moisture sensor, a motion sensor, a door operation sensor, a temperature sensor, a pressure sensor, etc.) and determines the flow rate of the inert gas flow entering and leaving the factory interface 101 based on the sensor data.

[0032] The enclosure system 130 allows for the transport and exchange of different types of contents 110 without opening the factory interface 101 and the sealed environment in the adjacent chamber (e.g., via a carrier with interchangeable fingers). The enclosure system 130 seals the load port 128 in response to docking to it. The enclosure system 130 provides access to a purge port, which allows for the purging of the interior of the enclosure system 130 before opening it, minimizing the adverse effects of the inert environment in the factory interface 101.

[0033] Figures 2A to 2N show diagrams of the carrier 200 according to a specific embodiment.

[0034] Figures 2A-D and 2G-L show the carrier 200. Figure 2A shows a top perspective view of the carrier 200 including a rigid body 210, fasteners 230, and fingers 240 according to a particular embodiment. Figure 2B shows a bottom perspective view of the carrier 200 including a rigid body 210, fasteners 230, and fingers 240 according to a particular embodiment. Figure 2C shows a top view of the rigid body 210 of the carrier 200 (e.g., without fasteners 230 and fingers 240) according to a particular embodiment. Figure 2D shows a bottom view of the rigid body 210 of the carrier 200 (e.g., without fasteners 230 and fingers 240) according to a particular embodiment. Figure 2G shows a top view of the carrier 200 including a rigid body 210, fasteners 230, and fingers 240 according to a particular embodiment. Figure 2H shows a bottom view of a carrier 200 including a rigid body 210, a fastener 230, and a finger 240 according to a particular embodiment. Figure 2I shows a front view of a carrier 200 including a rigid body 210, a fastener 230, and a finger 240 according to a particular embodiment. Figure 2J shows a rear view of a carrier 200 including a rigid body 210, a fastener 230, and a finger 240 according to a particular embodiment. Figure 2K shows a left elevation view of a carrier 200 including a rigid body 210, a fastener 230, and a finger 240 according to a particular embodiment. Figure 2L shows a right elevation view of a carrier 200 including a rigid body 210, a fastener 230, and a finger 240 according to a particular embodiment.

[0035] The carrier 200 includes a rigid body 210 having an opening 220 (see, for example, Figures 2C-D). In some embodiments, the opening 220 is threaded to receive a threaded fastener 230. The carrier 200 further includes fasteners 230 (e.g., screws, bolts, rivets, etc.) configured to be detachably attached to the rigid body 210 through the opening 220. In some embodiments, the fasteners 230 are threaded to fasten to the threaded opening 220. In some embodiments, the fasteners 230 are threaded to fasten to threaded fingers 240. In some embodiments, each fastener 230 includes a first part and a second part (e.g., a bolt and a nut, etc.) configured to fasten to each other to fasten the fingers 240 to the rigid body 210.

[0036] The fingers 240 are configured to be detachably attached to the rigid body 210 via a fastener 230 and an opening 220. In some embodiments, each finger 240 forms an opening, and the fastener 230 is inserted through the opening in the finger 240 and the opening 220 in the rigid body 210 to detachably attach the finger 240 to the rigid body 210.

[0037] A pair of fingers 240 (e.g., three fingers 240) is configured to be detachably attached to a rigid body 210. The pair of fingers 240 is configured to support the contents (e.g., process kit rings) during carrier transport within the substrate processing system (e.g., via a robot). In some embodiments, the contents come into contact with the pair of fingers 240 without coming into contact with the rigid body 210 during transport within the substrate processing system.

[0038] In some embodiments, a first set of fingers 240 (e.g., three fingers) is detachably attached to a rigid body 210 via a fastener 230 and an opening 220 and configured to support a first content during a first transport within a substrate processing system (e.g., via a robotic arm), and a second set of fingers 240 (e.g., three different fingers) is detachably attached to the rigid body 210 (e.g., via the same fastener 230 and the same opening 220 used with the first set) and configured to support a second content during a second transport of the carrier 200 within a substrate processing system (e.g., via the same robotic arm).

[0039] In some embodiments, different sets of fingers 240 are used for different types of content. In some examples, different types of content include new content and used content (e.g., a first set of fingers 240 fixed to a rigid body 210 for transporting used content and a second set of fingers 240 fixed to the same rigid body 210 for transporting new content). In some examples, different types of content include different sizes and / or shapes of content (e.g., a first set of fingers 240 fixed to a rigid body 210 for transporting content of a first size and / or shape and a second set of fingers fixed to the same rigid body 210 for transporting content of a different size and / or shape). In some examples, different types of content include process kit rings, chamber components of a substrate processing system, used chamber components of a substrate processing system, shower heads, components having a substantially round circumference (e.g., inner circumference, outer circumference), etc.

[0040] In some embodiments, different sets of fingers 240 are used for different conditions. In some embodiments, each finger 240 of a first set of fingers 240 comprises a first material configured for a first condition, and each finger of a second set of fingers comprises a second material configured for a second condition different from the first condition. In some examples, the material of the fingers 240 includes one or more materials such as polyethylene terephthalate (PET), ceramic materials, polytetrafluoroethylene (PTFE) (e.g., Teflon®), ultra-high molecular weight (UHMW) polyethylene, absorbent materials, non-absorbent materials, coated materials, deformable materials, electrostatic dissipation materials, etc. In some embodiments, the fingers 240 have a specific conductivity (e.g., imperfect conductivity, some conductivity allowing dissipation at a controlled rate, prevention of conductive paths for high arc discharge, about 10 5 From about 10 9 The different conditions include the dissipation range of ohms, etc. In some examples, different conditions include one or more of the following: corrosive conditions, clean conditions, electrostatic conditions, specific processes (e.g., substrate manufacturing processes, atomic layer deposition, chemical vapor deposition, physical vapor deposition, plasma-enhanced versions thereof, etc.), specific chemicals (e.g., fluorine, acids, bases, etc.), specific temperature ranges (e.g., high temperature), specific pressure ranges (e.g., high pressure), atmospheric pressure, vacuum pressure, etc.

[0041] In some embodiments, the carrier 200 is a customized mechanical adapter that enables automated handling of process kit rings, moved via tools designed for wafer handling. Interchangeable fingers 240 allow for maintenance of the carrier 200 and replacement of different finger material types, depending on the requirements of a particular process kit ring. The carrier 200 with interchangeable fingers 240 enables current process kit rings and future compatibility with various sizes and material types of process kit rings.

[0042] In some embodiments, different rigid bodies 210 are used for different content and / or different conditions. In some embodiments, each rigid body 210 is made of a different type of material. In some examples, the rigid body 210 is made of one or more of the following: carbon fiber, aluminum, cast aluminum plate (e.g., MIC-6®), hard anodized aluminum, ceramic material, titanium, etc. In some embodiments, the rigid body 210 is made of the same or similar material as the robot blade (e.g., end effector). In some embodiments, the carrier 200 has no bonded components at all (e.g., no adhesive). In some embodiments, the carrier 200 has no hot-pressed components at all. In some embodiments, all components of the carrier 200 are mechanically engaged (e.g., via fasteners 230) or machined into the rigid body 210.

[0043] In some embodiments, the carrier 200 has pads 250 (e.g., mushroom pads, perfluoroelastomer pads, Kalrez® friction pads, nine Kalrez mushroom pads, calibration mushrooms, pads integrated into the rigid body 210, etc.) for anti-slip interfaces (e.g., automated marking surfaces) of atmospheric robot end effectors (e.g., factory interface robot 111 in Figure 1) and vacuum robot end effectors (e.g., transport chamber robot 112 in Figure 1). In some embodiments, the pads 250 are used for one or more anti-slip interfaces such as LCF devices and aligner devices.

[0044] In some embodiments, the carrier 200 has pads 260 (aluminum pads, pads integrated into a rigid body, etc.) for positioning the carrier 200 within an enclosure system (e.g., enclosure system 130, FOUP in Figure 1) and a load lock (e.g., degassing chamber 104 in Figure 1).

[0045] In some embodiments, the rigid body 210 forms a window 270 (e.g., an opening, a slot, etc.). In some embodiments, the window 270 is used by tool automation (e.g., by an aligner device, by an LCF device) to observe the accuracy of the placement through the carrier 200 (e.g., to observe an object on the opposite side of the carrier 200). In some embodiments, the window 270 is used to reduce the mass of the carrier 200 (e.g., the rigid body 210).

[0046] In some embodiments, the rigid body 210 has a bottom surface that is substantially planar (e.g., substantially flat). In some embodiments, the bottom surface of the rigid body 210 is substantially flat except for the pads 250 and 260 on the bottom surface of the rigid body 210. In some embodiments, the carrier 200 (e.g., the rigid body 210) does not have dynamic positioning features (e.g., the bottom surface of the rigid body 210 does not have dynamic positioning features). In some embodiments, the rigid body 210 and / or the fingers 240 have one or more coatings. In some examples, the fingers 240 have a coating configured to transport content under specific conditions (e.g., adapted to a specific chemical and / or process). In some embodiments, the fingers 240 have one or more coatings that provide one or more coefficients of friction, allowing the content to be aligned on the fingers. In some examples, the sidewalls of each finger 240 have a lower coefficient of friction than the first top surface of each finger, allowing the content to slide down the sidewalls and stop at the first top surface. In some examples, the upper part of the side wall of each finger 240 has a lower coefficient of friction than the lower part of the side wall of each finger 240, allowing the contents to slide down the upper part of each side wall and decelerate at the lower part of the side wall.

[0047] In some embodiments, the external shape of the rigid body 210 differs from the external shape shown in Figures 2A to D. In some embodiments, the size, shape, number, etc., of the opening 220 (e.g., receiving the fastener 230), pad 250, pad 260, and / or window 270 differ from those shown in Figures 2A to D.

[0048] In some embodiments, the fingers 240 are machined to have marks indicating their position on the carrier 200 (e.g., rigid body) (for example, after assembly to the rigid body 210, or after being detachably attached to the rigid body 210 via fasteners 230 when assembled on the rigid body 210). In some examples, the first finger 240 is machined to have a first mark (e.g., a first identifier) ​​indicating a first position on the rigid body 210, the second finger is machined to have a second mark (e.g., a second identifier) ​​indicating a second position on the rigid body 210, and the third finger is machined to have a third mark (e.g., a third identifier) ​​indicating a third position on the rigid body 210. In some embodiments, different positions on the rigid body 210 are machined to have marks (e.g., identifiers) similar to those machined on different fingers 240. The markings on the rigid body 210 and / or fingers 240 indicate the mounting pattern. In some examples, the identifier includes one or more such as hash marks (e.g., I, II, III), numbers, letters, colors, symbols, etc. By matching the identifier on the rigid body 210 with the identifier on the finger 240, one opening 220 of the rigid body 210 corresponds to a specific finger 240, and tolerance stacking (e.g., of a boss on the rigid body 210) is avoided by using different fingers 240 for the same opening of the rigid body 210. In some embodiments, any finger 240 of the set of fingers 240 can be used for any opening 220 of the rigid body 210 (e.g., any boss).

[0049] In some embodiments, one or more fingers 240 are attached to the rigid body 210 to support content. In some embodiments, two or more fingers 240 are attached to the rigid body 210 to support content. In some embodiments, three or more fingers 240 are attached to the rigid body 210 to support content. In some embodiments, each of the fingers 240 is arranged substantially equally spaced around the rigid body 210 (for example, about 120° between each of the three fingers 240). In some embodiments, the first and second fingers 240 are arranged symmetrically on the rigid body 210, and the third finger 240 is arranged equally spaced from the first and second fingers 240.

[0050] In some embodiments, the finger 240 supports content (e.g., a process kit ring) that is close to the inner circumference (e.g., the inner side wall) of the content. In some embodiments, the finger 240 supports content (e.g., a process kit ring) that is close to the outer circumference (e.g., the outer side wall) of the content.

[0051] In some embodiments, different fasteners 230 are used for one or more different rigid bodies 210, openings 220, fingers 240, states, etc. In some embodiments, the different fasteners 230 are one or more different sizes, different shapes, different materials, etc. In some embodiments, the material of the fastener 230 includes one or more aluminum, ceramic, stainless steel, electropolished (EP) stainless steel, etc.

[0052] In some embodiments, the finger 240 has a lip that descends to support the content. In some embodiments, the finger 240 is positioned around a rigid body 210 to support content having a circular perimeter (e.g., a process kit ring, a shower head, etc.). In some embodiments, the finger 240 is interchangeable to support perimeter content of different sizes. In some embodiments, the finger 240 is attached to the rigid body 210 via slots that make the position of the finger 240 adjustable (e.g., radially from the central portion of the rigid body 210) to support perimeter content of different sizes. In some embodiments, as the finger 240 wears down over time, the position of the finger 240 becomes adjustable (e.g., radially from the central region 280 of the rigid body 210) to continue supporting perimeter content of the same size. In some embodiments, when the finger 240 wears down and can no longer continue to support perimeter content of the same size, the worn finger 240 is replaced with a new finger 240.

[0053] The carrier 200 includes one or more lower surfaces (e.g., pads 250) configured to interface with the end effector of the robot arm. The carrier 200 (e.g., rigid body 210) includes one or more lower surfaces (e.g., solid planar central region 280) configured to interface with a vacuum chuck.

[0054] In some embodiments, the rigid body 210 forms bosses 222 around each opening 220. In some embodiments, the bosses 222 are protruding features of the rigid body 210. In some embodiments, the bosses 222 are used to position the fingers 240 on the rigid body 210. In some embodiments, the fingers 240 have recesses that coincide with the protruding bosses 222. In some embodiments, the bosses 222 are used to mount the fingers 240 on the rigid body 210 in the correct orientation.

[0055] Figures 2E-2F and 2M show a carrier 200 supporting a process kit ring 290 according to a specific embodiment. Figure 2E shows a top view of the carrier 200 supporting the process kit ring 290 according to a specific embodiment. Figure 2F shows a side cross-sectional view of the carrier 200 supporting the process kit ring 290 according to a specific embodiment. Figure 2M shows a top perspective view of the carrier 200 supporting the process kit ring 290 according to a specific embodiment.

[0056] The carrier 200 includes a rigid body 210 and fingers 240 attached to the rigid body 210 via fasteners 230. The process kit ring 290 is positioned on the fingers 240.

[0057] In some embodiments, the carrier 200 is sized and shaped such that it provides one or more gaps between the process kit ring 290 and one or more portions around the carrier 200. In some embodiments, one or more gaps are used by an aligner device (LCF device) to align the carrier 200 and / or the process kit ring 290. In some examples, one or more gaps allow a light beam to be used to detect flat inner wall features or other registered features of the process kit ring 290. In some embodiments, one or more gaps allow lift pins to be used to lift the process kit ring 290 from the carrier 200 (e.g., within a processing chamber). In some embodiments, the periphery of the carrier 200 is configured to interface with shelves of an enclosure system (e.g., FOUP) of the substrate processing system.

[0058] Figure 2N shows a carrier 200 positioned on a shelf 294 within an enclosure system 292 (e.g., FOUP) according to a particular embodiment. The enclosure system 292 includes one or more shelves 294. In some embodiments, each shelf 294 is configured to receive the carrier 200 and a process kit ring 290 positioned on the carrier 200. In some embodiments, a robotic arm lowers the carrier 200 supporting the process kit ring 290 onto the shelf 294 within the enclosure system 292. In some embodiments, as the robotic arm lowers the carrier 200 supporting the process kit ring 290 onto the shelf 294, a first portion of the shelf 294 supports the process kit ring 290. Next, a second portion of the shelf 294 supports the carrier 200, thereby supporting the process kit ring 290 above the carrier 200 on the shelf 294 (e.g., the process kit ring 290 does not contact the carrier 200).

[0059] Figures 3A-B show fingers 340A-B (e.g., finger 240 in Figures 2A-F) of a carrier (e.g., carrier 200 in Figures 2A-F) according to a particular embodiment. In some embodiments, fingers 340A and 340B are configured to be detachably attached to the same rigid body (e.g., rigid body 210 in Figures 2A-F). For example, finger 340A is detachably attached to the rigid body and configured to transport a first content under a first condition, and finger 340B is detachably attached to the same rigid body and configured to transport one or more second contents different from the first content, and / or under a second condition different from the first condition.

[0060] In some embodiments, each finger 340 has a first upper surface 342A, a second upper surface 342B, a side wall 350, and a lower surface 360. The first upper surface 342A is substantially located in a first plane and is configured to support the contents during carrier transport. The second upper surface 342B is substantially located in a second plane above the first plane. The side wall 350 is located between the first upper surface 342A and the second upper surface 342B. A first opening 362 is formed through the finger 340 from the second upper surface 342B to the lower surface 360. In some embodiments, the lower surface 360 ​​forms a recess (see, for example, Figure 4A) to receive a portion of the carrier that forms a second opening (for example, to receive a protruding boss 222 located around the opening 220 of the rigid body 210 in Figures 2A-F). The fingers 340 are detachably attached to the carrier via fasteners inserted through a first opening in the finger and a second opening in the carrier. In some embodiments, the contents come into contact with the set of fingers without coming into contact with the rigid body during transport by the carrier. In some embodiments, the openings formed by the rigid body are slots, and each finger 340 is adjustablely positioned on the rigid body through the slots. In some examples, the position of the fingers 340 is adjusted based on the wear of the fingers 340. In some examples, the position of the fingers 340 is adjusted based on the type (e.g., size) of the contents being transported by the carrier.

[0061] In some embodiments, the side wall 350 of the finger 340 has an upper part 352A having a first angle 354A with respect to the first upper surface 342A (e.g., an angle of about 100° to 110°, about 15° from right). The side wall 350 has a lower part 352B having a second angle 354B with respect to the first upper surface 342A (e.g., an angle of about 90° to 100°, about 5° from orthogonal). Furthermore, in some embodiments, the side wall 350 includes a substantially vertical portion 352C that is substantially orthogonal to the first upper surface 342A (e.g., an angle of about 85 to 95°). Furthermore, in some embodiments, the finger 340 includes a chamfer 356 between the first upper surface 342A and the side wall 350. In some embodiments, the chamfer 356 of the finger 340 matches (e.g., substantially the same size, non-interfering) the chamfer of the content (e.g., process kit ring) placed on the finger 340. In some embodiments, the lower surface of the content (e.g., process kit ring) placed on the finger contacts the first upper surface 342A of the finger 340. In some embodiments, the angle 354 of the side wall 350 (e.g., upper 352A, lower 352B, and / or substantially vertical portion 352C) is configured to guide (e.g., align) the content (e.g., process kit ring) onto the finger 340 for transport. Conventional carriers transport content misaligned within the substrate processing system, causing the content to fall. The angle 354 of the side wall 350 of the finger 340 prevents the content from becoming one or more of a misalignment, bending, non-parallel, or unstable (e.g., falling) on ​​the carrier.

[0062] In some embodiments, the first upper surface 342A has a first coefficient of friction greater than the second coefficient of friction of one or more portions of the side wall 350 (for example, to help secure the content to the finger 340 and to help align the content on the finger 340).

[0063] Figures 4A-F show a carrier 400 (e.g., carrier 200 in Figures 2A-F) including a rigid body 410 (e.g., rigid body 210 in Figures 2A-F) according to a particular embodiment. Figure 4A is a side cross-sectional view of the carrier 400 including fingers 440 (e.g., fingers 240 in Figures 2A-F, fingers 340 in Figures 3A-B) positioned on a boss 422 (e.g., boss 222 in Figures 2A-F) of the rigid body 410. Figure 4B is a perspective view of the carrier 400 including fingers 440 (e.g., fingers 240 in Figures 2A-F, fingers 340 in Figures 3A-B) detachably attached to the rigid body 410. Figure 4C is a top view of the rigid body 410 of the carrier 400 including a boss 422 (e.g., boss 222 in Figures 2A-F) positioned around an opening 420 (e.g., opening 220 in Figures 2A-F). Figure 4D is a side cross-sectional view of the carrier 400 including fingers 440 (e.g., fingers 240 in Figures 2A-F, fingers 340 in Figures 3A-B) positioned on bosses 422 (e.g., bosses 222 in Figures 2A-F) of the rigid body 410. Figure 4E is a side cross-sectional view of the carrier 400 including fingers 440 (e.g., fingers 240 in Figures 2A-F, fingers 340 in Figures 3A-B) positioned on bosses 422 (e.g., bosses 222 in Figures 2A-F) of the rigid body 410. Figure 4F is a perspective view of the carrier 400 including fingers 440 (e.g., fingers 240 in Figures 2A-F, fingers 340 in Figures 3A-B) detachably attached to the rigid body 410.

[0064] In some embodiments, features on the rigid body 410 (e.g., boss 422, protruding feature 412, etc.) are configured to orient (e.g., align) the finger 440 on the rigid body 410. In some embodiments, the lower surface of the finger 440 forms a recess configured to receive the boss 422. In some embodiments, the left, right, and / or rear sides of the finger 440 are positioned close to (e.g., adjacent to) the protruding feature 412 on the upper surface of the rigid body 410. In some embodiments, the protruding feature 412 and / or boss 422 on the upper surface orient the finger 440 (e.g., precisely position the finger on the rigid body 410, precisely align the opening of the finger with the opening on the rigid body 210 to receive the fastener 430, etc.).

[0065] In some embodiments, the fingers 440 of the carrier 400 support one or more process kit rings 490 (e.g., process kit ring 290 in Figures 2E, 2F, and / or 2M). Referring to Figures 4D-F, in some embodiments, the fingers 440 support process kit ring 490A, and process kit ring 490B is positioned on process kit ring 490A. The process kit ring 490A may include a first upper surface, a second upper surface lower than the first upper surface, an inner side wall, an outer side wall, and a bottom surface. The first upper surface may be substantially parallel to the second upper surface. The outer side wall may connect the first upper surface and the second upper surface. The inner side wall may connect the first upper surface and the bottom surface. The inner side wall may contact at least a portion of the side wall of the finger 440 (e.g., the side wall 350 in Figures 3A-B). The bottom surface of the process kit ring 490A can contact the top surface of the finger 440 (for example, the first top surface 342A in Figures 3A-B).

[0066] The process kit ring 490B may include a top surface, a bottom surface, an internal side wall connecting the top and bottom surfaces, and an external side wall connecting the top and bottom surfaces. In some embodiments, the process kit ring 490B is positioned on the underside of the first top surface and the second top surface of the process kit ring 490A. In some embodiments, the internal side wall of the process kit ring 490B may contact the external side wall of the process kit ring 490A. In some embodiments, the process kit ring 490A is a support ring and the process kit ring 490B is an insert ring.

[0067] Referring to Figure 4D, in some embodiments, the finger 440 extends beneath a portion of the process kit ring 490A. Referring to Figures 4E-F, in some embodiments, the finger 440 extends beneath the process kit rings 490A-B. The finger 440 can form a recess that receives one or more process kit rings 490. The recess of the finger 440 may have a first side wall (e.g., side wall 350 in Figures 3A-B), a top surface (e.g., the first top surface in Figures 3A-B), and a second side wall (e.g., the opposite side of the first side wall). The first side wall of the finger 440 contacts the inner side wall of the process kit ring 490A, and the second side wall of the finger 440 contacts the outer side wall of the process kit ring 490B.

[0068] In some embodiments, each of the fingers 440 of the carrier 400 (e.g., three fingers 440) includes the formation of a recess for receiving one or more process kit rings 490 (see, for example, Figures 4E-F). In some embodiments, one or more of the fingers 440 of the carrier 400 includes a recess for receiving one or more process kit rings 490 (see, for example, Figures 4E-F), and one or more of the fingers 440 of the carrier 400 is partially positioned beneath at least one of the one or more process kit rings 490 (see, for example, Figure 4D).

[0069] In some embodiments, the carrier 400 can control the concentricity of the process kit rings 490. The carrier 400 can hold stacked process rings concentrically during transport (e.g., overhead transport (OHT) and manual FOUP loading and / or vibration). The carrier 400 can hold stacked process kit rings concentrically during robotic transport to a process chamber (e.g., factory interface (FI), mainframe (MF), transport chamber, etc.). In some embodiments, the carrier 400 supports one or more process kit rings 490. In some embodiments, the carrier 400 supports two or more stacked process kit rings 490 (e.g., a ring stack). In some embodiments, the carrier 400 supports two or three stacked process kit rings 490. In some embodiments, the carrier maintains the same gap all around (e.g., the gap between the process kit rings 490 and the carrier 400) while the process kit rings 490 are being transported by automation (e.g., FI, MF, transport chamber, etc.). In some embodiments, the lower surface of the carrier 400 is configured to interface with FI blades, MF robot blades, FOUPs (e.g., FOUP shelves), load lock fins, LCFs, aligners (e.g., FI aligners), lift pins of the processing chamber, etc.

[0070] In some embodiments, the fingers 440 of the carrier 400 are interchangeable. In some embodiments, different sets of fingers 440 are made of different materials (e.g., different temperatures, processes, chemicals, thermal expansion, etc.). In some embodiments, the set of fingers 440 is made of one or more of the following: ceramic, titanium, and / or similar. In some embodiments, the thermal expansion of the set of fingers 440 matches the thermal expansion of the rigid body 410, one or more process kit rings 490, fasteners 430, etc. (e.g., at the temperature of the carrier 400).

[0071] Figure 5 shows a method 500 using a carrier for a substrate processing system according to a particular embodiment. In some embodiments, one or more operations of method 500 are performed by a robotic arm (e.g., the robotic arm of the factory interface robot 111 in Figure 1) and / or a controller (e.g., the controller 109 in Figure 1). Although shown in a particular order or sequence, the order of the processes can be changed unless otherwise specified. Thus, the illustrated embodiments should be understood as examples only, the illustrated processes can be performed in a different order, and some processes can be performed in parallel. Furthermore, in various embodiments, one or more processes can be omitted. Thus, not all processes are required in all embodiments.

[0072] Referring to method 500 in Figure 5, block 502 determines a first condition related to the first transport in the substrate processing system. In some embodiments, the first condition includes one or more of the following: substrate processing operation, chemicals, type of content being transported, temperature, pressure, available clearance for the carrier, etc. In some embodiments, the first condition is determined based on a recipe (e.g., future operations of the substrate processing system). In some embodiments, the first condition is determined based on the current condition of one or more parts of the substrate processing system.

[0073] In block 504, a first set of fingers corresponding to a first condition is identified. In some embodiments, the first set of fingers has one or more characteristics such as material, roughness, coating, size, sidewall height, sidewall angle, shape, and quantity that conform to the first condition.

[0074] In block 506, a first set of fingers is attached to the rigid body of the carrier via fasteners. In some embodiments, the first set of fingers is attached to the rigid body autonomously (e.g., via a robot). In some embodiments, the first set of fingers is attached to the rigid body manually. In some embodiments, the first set of fingers is attached to the rigid body outside the substrate processing system. In some embodiments, the first set of fingers is attached to the rigid body within the substrate processing system. In some embodiments, the fingers, fasteners, and rigid body are housed inside one or more enclosure systems (e.g., FOUP), SSP, factory interface, etc. In some embodiments, the fingers are attached to the rigid body via fasteners using a fastening device (e.g., a fastening robot). In some embodiments, a controller determines conditions within the substrate processing system, selects one or more fingers, fasteners, and / or rigid bodies based on the conditions, fixes the fingers, fasteners, and / or rigid bodies to a fastening device, and causes the fastening device to attach the fingers to the rigid bodies using the fasteners. In some embodiments, a first set of fingers is attached to the rigid bodies based on a first condition. In some examples, the orientation, position, inversion, number, etc., of the set of fingers are based on the first condition.

[0075] In block 508, the position of a first set of fingers on a rigid body is adjusted via fasteners. In some embodiments, the fasteners attach the fingers to slots in the rigid body. In some embodiments, the position of the fingers is measured and adjusted. In some examples, process kit rings are placed on the fingers, and the gap width between the sidewalls of the fingers and the process kit rings is measured (e.g., via a gap gauge, imaging device, visual inspection, determination of radial play of the process kit rings on the fingers, etc.). In response to the determination that the gap width is greater than a threshold width (e.g., in response to finger wear), the position of the fingers is adjusted. In some embodiments, to adjust the position of the fingers, the fingers are moved radially through the slots relative to the central region of the rigid body. In some embodiments, to adjust the position of the fingers, set screws are adjusted to move the fingers radially.

[0076] In block 510, the first content is placed on a first set of fingers that are transported into the substrate processing system via a carrier. In some embodiments, the first content includes one or more of the following: a process kit ring, an edge ring, a showerhead, a mask, a mask handler, a half ring, a stack of two or more process kit rings, etc.

[0077] In block 512, a second condition related to the second transport in the substrate processing system is determined. In some embodiments, the second condition is different from the first condition. In some examples, the second condition is one or more of the following that are different from the first condition: substrate processing operation, chemicals, type of content being transported, temperature, pressure, etc.

[0078] In block 514, a second set of fingers corresponding to a second condition is identified. In some embodiments, the second set of fingers differs from the first set of fingers. In some examples, the second set of fingers has one or more characteristics that are suitable for the second condition and differ from the first set of fingers, such as material, size, shape, quantity, etc.

[0079] In block 516, a second set of fingers is attached to the carrier rigid body via fasteners. In some embodiments, block 516 is similar to block 506. In some embodiments, the rigid body is the same as that of block 506. In some embodiments, the rigid body is different from that of block 506. In some embodiments, the fastener is different from that of block 506. In some embodiments, the rigid body is different from that of block 506.

[0080] In block 518, the position of a second set of fingers on a rigid body is adjusted via a fastener. In some embodiments, block 516 is similar to block 508.

[0081] In block 520, the second content is placed on a second set of fingers that are transported into the substrate processing system via a carrier. In some embodiments, block 516 is similar to block 510. In some embodiments, the second content differs from that of block 510.

[0082] In some embodiments, each operation of Method 500 is performed while maintaining a sealed environment (for example, without opening the factory interface or the enclosure system).

[0083] Unless otherwise specified, in some embodiments, terms such as “determine,” “specify,” “install,” “adjust,” “position,” “transport,” “move,” “lower,” “raise,” “remove,” “position,” and “locate” mean actions and processes performed or implemented by a computer system to manipulate and convert data represented as physical (electrical) quantities in computer system registers and memory into other data similarly represented as physical quantities in the computer system’s memory or registers, or other information storage, transmission, or display devices. Furthermore, terms such as “first,” “second,” “third,” and “fourth” as used herein mean labels to distinguish different elements and do not have an ordinal meaning due to their numerical designation.

[0084] The examples described herein also relate to apparatus for carrying out the methods described herein. In some embodiments, the apparatus includes a general-purpose computer system that is specifically constructed for carrying out the methods described herein or is selectively programmed by a computer program stored in the computer system. In some embodiments, such a computer program is stored in a computer-readable tangible storage medium.

[0085] The methods and exemplary examples described herein are not inherently related to any particular computer or other device. Various general-purpose systems can be used in accordance with the teachings provided herein, or more specialized devices can be constructed to perform each of the methods and / or their individual functions, routines, subroutines, or operations described herein. Examples of the construction of various such systems are described above.

[0086] The above description provides numerous specific details, such as examples of particular systems, components, and methods, in order to provide a full understanding of some embodiments of the Disclosure. However, it will be apparent to those skilled in the art that at least some embodiments of the Disclosure can be implemented without these specific details. In other examples, well-known components or methods are not described in detail or are presented in simple block diagram form to avoid unnecessarily obscuring the Disclosure. Accordingly, the specific details described are merely illustrative. Specific implementations may be modified from these exemplary details, and such modifications are still considered to be within the scope of the Disclosure.

[0087] Throughout this specification, any reference to “one embodiment” or “one embodiment” means that a particular feature, structure, or characteristic described in relation to that embodiment is included in at least one embodiment. Therefore, occurrences of the phrase “in one embodiment” or “in one embodiment” in various places throughout this specification do not necessarily all refer to the same embodiment. Furthermore, the term “or” is intended to mean inclusive, not exclusive. Where the terms “about” or “approximately” are used herein, it is intended that the presented nominal values ​​are accurate within ±10%.

[0088] Although the operations of the methods described herein are shown and described in a specific order, the order of the operations of each method can be modified so that certain operations are performed in reverse order, or so that certain operations are performed at least partially simultaneously. In other embodiments, the instructions or sub-operations of separate operations are performed intermittently and / or alternately.

[0089] The above description should be understood to be illustrative and not limiting. Many other embodiments will become apparent to those skilled in the art upon reading and understanding the above description. Therefore, the scope of the disclosure should be determined with reference to the appended claims, along with the entire scope of equivalents to which such claims are entitled.

Claims

[Claim 1] It is a career, A rigid body that forms multiple openings, Multiple fasteners configured to be detachably attached to a rigid body through multiple openings, A first set of fingers is configured to be detachably attached to a rigid body via a plurality of fasteners and a plurality of openings, and the first set of fingers is configured to support a first content during the first transport of a carrier within a substrate processing system. A carrier comprising fasteners configured such that a second set of fingers is detachably attached to a rigid body via a plurality of fasteners and a plurality of openings, the second set of fingers being configured to support a second content during a second transport of the carrier within a substrate processing system.

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