Electronic devices

Abstract

To provide an electronic device that can be miniaturized while suppressing discharge between multiple terminals. [Solution] The electronic device A10 comprises a first electronic component 51, a second electronic component 52, a sealing resin 7 covering the first electronic component 51 and the second electronic component 52, a first lead 11, a second lead 12, a third lead 13, a fourth lead 14, a first die pad 41 supporting the first electronic component 51, and a second die pad 42 supporting the second electronic component 52. The sealing resin 7 has a plurality of resin sides 73, each facing an orthogonal direction perpendicular to the thickness direction z of the sealing resin 7. The first outer portion 31 of the first lead 11, the second outer portion 32 of the second lead 12, and the third outer portion 33 of the third lead 13 are each exposed by a resin side 73 different from the fourth outer portion 34 of the fourth lead 14.

Description

Technical Field

[0001] This disclosure relates to an electronic device.

Background Art

[0002] In recent years, electric vehicles have been increasingly popular. Patent Document 1 discloses an example of a circuit for monitoring the voltage of a battery mounted in an electric vehicle and controlling an inverter. This circuit can prevent an overvoltage from being supplied to the inverter for driving a motor.

[0003] The motor control device described in Patent Document 1 includes a voltage detection circuit (high-voltage battery voltage detection circuit) for monitoring the voltage of the battery. This voltage detection circuit is, for example, packaged as one electronic device and can be mounted on a circuit board of an electric vehicle. In this packaging, when, for example, an SOP (Small Outline Package) type package structure is adopted, a plurality of lead terminals protruding from the sealing resin are arranged at equal intervals.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

[0005] [Summary] When attempting to miniaturize an electronic device adopting an SOP type package structure, the interval between adjacent lead terminals is reduced. On the other hand, in a high-voltage battery voltage detection circuit as disclosed in Patent Document 1, a relatively high voltage is applied to the lead terminal connected to the battery. Therefore, with the miniaturization of the electronic device, there is a risk of discharge occurring between the plurality of lead terminals.

[0006] This disclosure has been conceived in view of the above circumstances, and an object thereof is to provide an electronic device capable of suppressing discharge between a plurality of terminals while achieving miniaturization of the device.

[0007] The electronic device provided by this disclosure comprises a first electronic component, a second electronic component, a sealing resin covering the first and second electronic components, a first lead including a first inner portion covered by the sealing resin and a first outer portion exposed from the sealing resin, a second lead including a second inner portion covered by the sealing resin and a second outer portion exposed from the sealing resin, a third lead including a third inner portion covered by the sealing resin and a third outer portion exposed from the sealing resin, a fourth lead including a fourth inner portion covered by the sealing resin and a fourth outer portion exposed from the sealing resin, a first die pad supporting the first electronic component, and a second die pad supporting the second electronic component, wherein the sealing resin has a plurality of resin sides facing in orthogonal directions perpendicular to the thickness direction of the sealing resin, and each of the first outer portion, the second outer portion, and the third outer portion is exposed by a resin side different from the fourth outer portion.

[0008] Other features and advantages of this disclosure will become more apparent from the detailed description below, based on the accompanying drawings. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a plan view showing an electronic device according to the first embodiment. [Figure 2] Figure 2 is a plan view of Figure 1, with the sealing resin indicated by dashed lines. [Figure 3] Figure 3 is a front view showing an electronic device according to the first embodiment. [Figure 4] Figure 4 is a rear view showing an electronic device according to the first embodiment. [Figure 5] Figure 5 is a left side view showing an electronic device according to the first embodiment. [Figure 6] Figure 6 is a right side view showing an electronic device according to the first embodiment. [Figure 7] Figure 7 is a cross-sectional view along the line VII-VII in Figure 2. [Figure 8] Figure 8 is a cross-sectional view along the line VIII-VIII in Figure 2. [Figure 9] Figure 9 is a cross-sectional view along the line IX-IX in Figure 2. [Figure 10] Figure 10 shows an example of the circuit configuration of an electronic device according to the first embodiment. [Figure 11] Figure 11 is a plan view showing an electronic device according to a modified example of the first embodiment, in which the sealing resin is indicated by dashed lines. [Figure 12] Figure 12 is a plan view showing an electronic device according to the second embodiment, in which the sealing resin is indicated by dashed lines. [Figure 13] Figure 13 is a plan view showing an electronic device according to the third embodiment, in which the sealing resin is indicated by dashed lines. [Figure 14] Figure 14 is a plan view showing an electronic device according to a first modification of the third embodiment, in which the sealing resin is indicated by dashed lines. [Figure 15] Figure 15 is a plan view showing an electronic device according to a second modification of the third embodiment, in which the sealing resin is indicated by dashed lines. [Figure 16] Figure 16 is a plan view showing an electronic device according to the fourth embodiment, in which the sealing resin is indicated by dashed lines. [Figure 17] Figure 17 is a plan view showing an electronic device according to a modified example of the fourth embodiment, in which the sealing resin is indicated by dashed lines. [Figure 18] Figure 18 is a plan view showing another configuration example of the electronic device shown in Figure 17, with the sealing resin indicated by dashed lines. [Figure 19] Figure 19 is a plan view showing another configuration example (part 1) of the electronic device of this disclosure, in which the sealing resin is indicated by dashed lines. [Figure 20] Figure 20 shows an example of the circuit configuration of the electronic device shown in Figure 19. [Figure 21] Figure 21 is a plan view showing another configuration example (part 2) of the electronic device of this disclosure, in which the sealing resin is indicated by dashed lines. [Figure 22] Figure 22 shows an example of the circuit configuration of the electronic device shown in Figure 21. [Figure 23] FIG. 23 is a plan view showing another configuration example (No. 3) of the electronic device of the present disclosure, with the encapsulating resin shown by phantom lines. [Figure 24] FIG. 24 is a plan view showing another configuration example (No. 4) of the electronic device of the present disclosure, with the encapsulating resin shown by phantom lines. [Figure 25] FIG. 25 is a plan view showing another configuration example (No. 5) of the electronic device of the present disclosure, with the encapsulating resin shown by phantom lines. [Figure 26] FIG. 26 is a plan view showing another configuration example (No. 6) of the electronic device of the present disclosure, with the encapsulating resin shown by phantom lines. [Figure 27] FIG. 27 is a plan view showing another configuration example (No. 7) of the electronic device of the present disclosure, with the encapsulating resin shown by phantom lines. [Figure 28] FIG. 28 is a cross-sectional view taken along line XXVIII-XXVIII of FIG. 27.

[0010] [Detailed Description] Preferred embodiments of the electronic device of the present disclosure will be described below with reference to the drawings. Hereinafter, the same or similar components will be denoted by the same reference numerals, and redundant descriptions will be omitted. Terms such as "first", "second", "third", etc. in the present disclosure are merely used as labels and are not necessarily intended to assign an order to their objects.

[0011] In this disclosure, "object A is formed on object B" and "object A is formed on object B" include, unless otherwise specified, "object A is directly formed on object B" and "object A is formed on object B with another object interposed between object A and object B." Similarly, "object A is located on object B" and "object A is located on object B" include, unless otherwise specified, "object A is directly located on object B" and "object A is located on object B with another object interposed between object A and object B." Similarly, "object A is located on object B" includes, unless otherwise specified, "object A is located on object B in contact with object B" and "object A is located on object B with another object interposed between object A and object B." Furthermore, "object A overlaps with object B when viewed in a certain direction" includes, unless otherwise specified, "object A overlaps with all of object B" and "object A overlaps with a part of object B." Also, "object A (or its material) contains material C" includes "object A (or its material) consists of material C" and "the main component of object A (or its material) is material C." Furthermore, "a surface A faces a certain direction B (one side or the other side)" is not limited to cases where the angle of surface A with respect to direction B is 90°, but also includes cases where surface A is inclined with respect to direction B. Furthermore, "a surface A is perpendicular to surface B" is not limited to cases where the angle of surface A with respect to surface B is 90°, but also includes cases where surface A is inclined with respect to surface B.

[0012] <First Embodiment> Figures 1 to 10 show an electronic device A10 according to the first embodiment. The electronic device A10 comprises a first lead 11, two second leads 12, a third lead 13, a plurality of fourth leads 14, a first die pad 41, a second die pad 42, a first electronic component 51, a second electronic component 52, a third electronic component 53, a plurality of connecting members 61 to 67, and a sealing resin 7. The specific applications of the electronic device A10 are not limited in any way, but for example, it is used to detect the battery voltage of an electric vehicle. Note that the electronic device A10 does not detect the battery voltage of an electric vehicle, but may also detect other voltages of an electric vehicle, or it may detect voltages used in industrial equipment, home appliances, or power supply devices instead of electric vehicles. The electronic device A10 is a surface mount type semiconductor package, and in this embodiment, as can be seen from Figures 1 to 9, it is an SOP (Small Outline Package) type.

[0013] For the sake of explanation, we will refer to the mutually orthogonal thickness direction z, the first direction x, and the second direction y. The thickness direction z corresponds to the thickness direction of the electronic device A10. Also, "plan view" refers to the view in the thickness direction z. The first direction x is orthogonal to the thickness direction z. The second direction y is orthogonal to both the thickness direction z and the first direction x. In the following explanation, one direction in the thickness direction z may be referred to as "up" and the other direction in the thickness direction z may be referred to as "down". Note that terms such as "up," "down," "upper," "downward," "upper surface," and "lower surface" indicate the relative positional relationship of each component in the thickness direction z, and do not necessarily define a relationship with the direction of gravity.

[0014] The first lead 11, the two second leads 12, the third lead 13, the multiple fourth leads 14, the first die pad 41, and the second die pad 42 each contain a metal such as Cu (copper), Ni (nickel), and Fe (iron). The metals used as these constituent materials are not limited to those exemplified. The first lead 11, the two second leads 12, the third lead 13, the multiple fourth leads 14, the first die pad 41, and the second die pad 42 are obtained from the same lead frame. The first lead 11, the two second leads 12, the third lead 13, the multiple fourth leads 14, the first die pad 41, and the second die pad 42 are formed, for example, by subjecting a metal sheet material to a process selected from punching, bending, or etching. Furthermore, a plating layer made of Ag (silver), Ni, Au (gold), etc. may be provided as needed at appropriate locations on each of the first lead 11, the two second leads 12, the third lead 13, the multiple fourth leads 14, the first die pad 41, and the second die pad 42.

[0015] The first lead 11, the two second leads 12, the third lead 13, and the multiple fourth leads 14 each conduct to one of the first electronic component 51, the second electronic component 52, and the third electronic component 53, forming a conductive path in the electronic device A10. The multiple fourth leads 14 may include some that do not conduct to any of the first electronic component 51, the second electronic component 52, and the third electronic component 53. The first lead 11, the two second leads 12, the third lead 13, and the multiple fourth leads 14 are spaced apart from each other. Each of the first lead 11, the two second leads 12, the third lead 13, and the multiple fourth leads 14 has a portion covered by the sealing resin 7 and a portion exposed from the sealing resin 7.

[0016] The first lead 11 includes a first inner portion 21 and a first outer portion 31. The first inner portion 21 and the first outer portion 31 are connected to each other and are integrally formed. In a plan view, the boundary between the first inner portion 21 and the first outer portion 31 overlaps with the periphery of the sealing resin 7.

[0017] The first inner portion 21 is the part of the first lead 11 that is covered by the sealing resin 7. The first inner portion 21 is connected to the first outer portion 31 and extends inward from the first outer portion 31 into the sealing resin 7. The first inner portion 21 is separated from the first die pad 41. In the illustrated example, the first inner portion 21 extends from the first outer portion 31 along the first direction x and then bends toward the first die pad 41. Note that the plan view shape of the first inner portion 21 is not limited to the illustrated example.

[0018] The first outer portion 31 is the part of the first lead 11 that is exposed from the sealing resin 7. In this embodiment, the first outer portion 31 protrudes from the sealing resin 7 in a first direction x when viewed from above. The first outer portion 31 is a rectangle with the first direction x as its longitudinal direction when viewed from above. The first outer portion 31 is bent in a gull-wing shape when viewed in a second direction y. The width W11 of the first outer portion 31 (see Figure 1) is not limited in any way, but is for example 0.1 mm or more and 1.5 mm or less. In the illustrated example, the width W11 corresponds to the dimension along the second direction y. The first outer portion 31 includes a first mounting portion 311, a first root portion 312, and a first relay portion 313.

[0019] The first mounting portion 311 is the tip portion of the first outer portion 31. The first mounting portion 311 is the part that is joined to the circuit board when the electronic device A10 is mounted on the circuit board. As shown in Figures 1 and 2, the first mounting portion 311 is located at the end opposite to the sealing resin 7 in the first direction x. Therefore, the first mounting portion 311 is located further from the sealing resin 7 than the first root portion 312 and the first relay portion 313 in the first direction x. The first mounting portion 311 is located below the first root portion 312 in the thickness direction z.

[0020] The first root portion 312 is the root portion of the first outer portion 31. As shown in Figures 1 and 2, the first root portion 312 is located at the end of the first outer portion 31 that is closer to the sealing resin 7, with respect to the first direction x. Therefore, the first root portion 312 is located closer to the sealing resin 7 than the first mounting portion 311 and the first relay portion 313, with respect to the first direction x. The first root portion 312 is located above the first mounting portion 311 in the thickness direction z and protrudes from the center of the sealing resin 7 in the thickness direction z.

[0021] The first relay section 313 connects the first mounting section 311 and the first root section 312. The first relay section 313 is inclined with respect to the first mounting section 311 and the first root section 312 when viewed in the second direction y. In this embodiment, the first relay section 313 is inclined with respect to the thickness direction z.

[0022] Each of the two second leads 12 includes a second inner portion 22 and a second outer portion 32. In each second lead 12, the second inner portion 22 and the second outer portion 32 are connected to each other and formed integrally. In each second lead 12, the boundary between the second inner portion 22 and the second outer portion 32 overlaps with the periphery of the sealing resin 7 in a plan view. The second inner portion 22 and the second outer portion 32 described below are common to each second lead 12 unless otherwise specified.

[0023] The second inner portion 22 is the part of the second lead 12 that is covered by the sealing resin 7. The second inner portion 22 connects to the second outer portion 32 and extends inward from the second outer portion 32 into the sealing resin 7. In this embodiment, the second inner portion 22 connects to the first die pad 41. In the illustrated example, the second inner portion 22 connects to the corners of the first die pad 41 in a plan view, which are the corners closest to the second outer portion 32.

[0024] The second outer portion 32 is the part of the second lead 12 that is exposed from the sealing resin 7. In this embodiment, the second outer portion 32 protrudes from the sealing resin 7 in the first direction x when viewed from above. The second outer portion 32 is a rectangle with the first direction x as its longitudinal direction when viewed from above. The second outer portion 32 is bent in a gull-wing shape when viewed in the second direction y. The second outer portions 32 of the two second leads 12 are aligned in the second direction y. The width W12 of the second outer portion 32 (see Figure 1) is not limited in any way, but is for example 0.1 mm or more and 1.5 mm or less. In the illustrated example, the width W12 corresponds to the dimension along the second direction y. The second outer portion 32 includes a second mounting portion 321, a second root portion 322, and a second relay portion 323.

[0025] The second mounting portion 321 is the tip portion of the second outer portion 32. The second mounting portion 321 is the part that is joined to the circuit board when the electronic device A10 is mounted on the circuit board. As shown in Figures 1 and 2, the second mounting portion 321 is located at the end opposite to the sealing resin 7 in the first direction x. Therefore, the second mounting portion 321 is located further from the sealing resin 7 than the second root portion 322 and the second relay portion 323 in the first direction x. The second mounting portion 321 is located below the second root portion 322 in the thickness direction z.

[0026] The second root portion 322 is the root portion of the second outer portion 32. As shown in Figures 1 and 2, the second root portion 322 is located at the end of the corresponding second outer portion 32 that is closer to the sealing resin 7, with respect to the first direction x. Therefore, the second root portion 322 is located closer to the sealing resin 7 than the second mounting portion 321 and the second relay portion 323, with respect to the first direction x. The second root portion 322 is located above the second mounting portion 321 in the thickness direction z and protrudes from the center of the sealing resin 7 in the thickness direction z. In the illustrated example, the third root portion 332 of one of the two second leads 12 overlaps the first die pad 41 when viewed in the first direction x, while the third root portion 332 of the other of the two second leads 12 does not overlap the first die pad 41 when viewed in the first direction x. Unlike this example, the third root portions 332 of both second leads 12 may or may not overlap the first die pad 41 when viewed in the first direction x.

[0027] The second relay section 323 connects the second mounting section 321 and the second root section 322. The second relay section 323 is inclined with respect to the second mounting section 321 and the second root section 322 when viewed in the second direction y. In this embodiment, the second relay section 323 is inclined with respect to the thickness direction z.

[0028] The third lead 13 includes a third inner portion 23 and a third outer portion 33. The third inner portion 23 and the third outer portion 33 are connected to each other and are integrally formed. In a plan view, the boundary between the third inner portion 23 and the third outer portion 33 overlaps with the periphery of the sealing resin 7.

[0029] The third inner portion 23 is the part of the third lead 13 that is covered by the sealing resin 7. The third inner portion 23 is connected to the third outer portion 33 and extends inward from the third outer portion 33 into the sealing resin 7. The third inner portion 23 is separated from the first die pad 41.

[0030] The third outer portion 33 is the part of the third lead 13 that is exposed from the sealing resin 7. In this embodiment, the third outer portion 33 protrudes from the sealing resin 7 in a first direction x when viewed from above. The third outer portion 33 is a rectangle with the first direction x as its longitudinal direction when viewed from above. The third outer portion 33 is bent in a gull-wing shape when viewed in a second direction y. The width W13 of the third outer portion 33 (see Figure 1) is not limited in any way, but is for example 0.1 mm or more and 1.5 mm or less. In the illustrated example, the width W13 corresponds to the dimension along the second direction y. The third outer portion 33 includes a third mounting portion 331, a third root portion 332, and a third relay portion 333.

[0031] The third mounting portion 331 is the tip portion of the third outer portion 33. The third mounting portion 331 is the part that is joined to the circuit board when the electronic device A10 is mounted on the circuit board. As shown in Figures 1 and 2, the third mounting portion 331 is located at the end opposite to the sealing resin 7 in the first direction x. Therefore, the third mounting portion 331 is located further from the sealing resin 7 than the third root portion 332 and the third relay portion 333 in the first direction x. The third mounting portion 331 is located below the third root portion 332 in the thickness direction z.

[0032] The third root portion 332 is the root portion of the third outer portion 33. As shown in Figures 1 and 2, the third root portion 332 is located at the end of the third outer portion 33 that is closer to the sealing resin 7, with respect to the first direction x. Therefore, the third root portion 332 is located closer to the sealing resin 7 than the third mounting portion 331 and the third relay portion 333, with respect to the first direction x. The third root portion 332 is located above the third mounting portion 331 in the thickness direction z and protrudes from the center of the sealing resin 7 in the thickness direction z.

[0033] The third relay section 333 connects the third mounting section 331 and the third root section 332. The third relay section 333 is inclined with respect to the third mounting section 331 and the third root section 332 when viewed in the second direction y. In this embodiment, the third relay section 333 is inclined with respect to the thickness direction z.

[0034] The multiple fourth leads 14 include two support leads 14A and multiple signal leads 14B, as shown in Figure 1. The two support leads 14A are connected to the second die pad 42. Each of the multiple signal leads 14B is away from the second die pad 42. In the illustrated example, the multiple fourth leads 14 include two support leads 14A and thirteen signal leads 14B, but the number of support leads 14A and the number of signal leads 14B are not limited to thirteen.

[0035] Each of the multiple fourth leads 14 (two support leads 14A and multiple signal leads 14B) includes a fourth inner portion 24 and a fourth outer portion 34. In each fourth lead 14, the fourth inner portion 24 and the fourth outer portion 34 are connected to each other and formed integrally. In each fourth lead 14, the boundary between the fourth inner portion 24 and the fourth outer portion 34 overlaps the periphery of the sealing resin 7 in a plan view. The fourth inner portion 24 and the fourth outer portion 34 described below are common to each fourth lead 14 unless otherwise specified.

[0036] The fourth inner portion 24 is the part of the fourth lead 14 that is covered by the sealing resin 7. The fourth inner portion 24 is connected to the fourth outer portion 34 and extends from the fourth outer portion 34 into the contents of the sealing resin 7. As shown in Figure 2, the fourth inner portion 24 of each of the two support leads 14A is connected to the second die pad 42, while the fourth inner portion 24 of each of the multiple signal leads 14B is separated from the second die pad 42.

[0037] The fourth outer portion 34 is the part of the fourth lead 14 that is exposed from the sealing resin 7. In this embodiment, the fourth outer portion 34 protrudes from the sealing resin 7 in the first direction x when viewed from above. In a plan view, the fourth outer portion 34 is a rectangle with the first direction x as its longitudinal direction. The fourth outer portion 34 is bent in a gull-wing shape when viewed in the second direction y. The fourth outer portions 34 of multiple fourth leads 14 are arranged along the second direction y. In this embodiment, the width W141 (see Figure 1) of the fourth outer portion 34 of each support lead 14A and the width W142 (see Figure 1) of the fourth outer portion 34 of each signal lead 14B are the same. These widths W141 and W142 (see Figure 1) are not limited in any way, but for example, they are between 0.1 mm and 1.5 mm. In the illustrated example, these widths W141 and W142 correspond to the dimensions along the second direction y. In the electronic device A10, the fourth outer portion 34 of one of the two support leads 14A overlaps the first outer portion 31 of the first lead 11 when viewed in the first direction x, and the other fourth outer portion 34 of the two support leads 14A overlaps the other second outer portion 32 of the two second leads 12 when viewed in the first direction x. The fourth outer portion 34 includes a fourth mounting portion 341, a fourth root portion 342, and a fourth relay portion 343.

[0038] The fourth mounting portion 341 is the tip portion of the fourth outer portion 34. The fourth mounting portion 341 is the part that is joined to the circuit board when the electronic device A10 is mounted on the circuit board. As shown in Figures 1 and 2, the fourth mounting portion 341 is located at the end opposite to the sealing resin 7 in the first direction x. Therefore, the fourth mounting portion 341 is located further from the sealing resin 7 than the fourth root portion 342 and the fourth relay portion 343 in the first direction x. The fourth mounting portion 341 is located below the fourth root portion 342 in the thickness direction z.

[0039] The fourth root portion 342 is the root portion of the fourth outer portion 34. As shown in Figures 1 and 2, the fourth root portion 342 is located at the end of the corresponding fourth outer portion 34 that is closer to the sealing resin 7, in the first direction x. Therefore, the fourth root portion 342 is located closer to the sealing resin 7 than the fourth mounting portion 341 and the fourth relay portion 343, in the first direction x. The fourth root portion 342 is located above the fourth mounting portion 341 in the thickness direction z and protrudes from the center of the sealing resin 7 in the thickness direction z.

[0040] The fourth relay section 343 connects the fourth mounting section 341 and the fourth root section 342. The fourth relay section 343 is inclined with respect to the fourth mounting section 341 and the fourth root section 342 when viewed in the second direction y. In this embodiment, the fourth relay section 343 is inclined with respect to the thickness direction z.

[0041] In the multiple fourth leads 14, the fourth outer portions 34 of the multiple signal leads 14B are arranged along the second direction y. The fourth outer portions 34 of the two support leads 14A are arranged one on each side of the fourth outer portions 34 of the multiple signal leads 14B with respect to the second direction y. In a plan view, the fourth outer portions 34 of the multiple fourth leads 14 (the two support leads 14A and the multiple signal leads 14B) are parallel to each other.

[0042] In electronic device A10, the adjacent first outer section 31 and third outer section 33 are spaced apart in the first direction x by a gap d13 (see Figure 5). The adjacent third outer section 33 and one of the two second outer sections 32 (the second outer section 32 closest to the third outer section 33) are spaced apart by a gap d23 (see Figure 5). The two adjacent second outer sections 32 are spaced apart in the first direction x by a gap d2 (see Figure 5). The first outer section 31 and the second outer section 32 are spaced apart in the first direction x by a gap d12 (see Figure 5). Furthermore, in electronic device A10, the fourth outer section 34 of each of the two support leads 14A and the fourth outer section 34 of the signal lead 14B closest to them are spaced apart in the first direction x by a gap d44 (see Figure 6). The fourth outer portions 34 of two adjacent signal leads 14B are spaced apart in the first direction x by a gap d42 (see Figure 6). In this embodiment, gaps d2, d23, d42, and d44 are the same. The specific values ​​of these gaps d2, d23, d42, and d44 are not limited, but are, for example, 5 mm or more and 10 mm or less. The gap d13 is larger than these gaps d2, d23, d42, and d44. For example, the gap d13 is 10 to 20 times larger than the gap d42, etc. The specific value of the gap d13 is not limited, but is, for example, 0.25 mm or more and 5 mm or less. When the potential difference between the first outer portion 31 and the second outer portion 32 is about 800 V, it is preferable that the gap d12 be 4 mm or more in order to suppress short circuits between the first outer portion 31 and the second outer portion 32.

[0043] The first die pad 41 and the second die pad 42 are separated from each other. The plan view shapes of the first die pad 41 and the second die pad 42 are not limited, but are rectangular in the illustrated example. The first die pad 41 and the second die pad 42 are aligned in a first direction x, for example, as shown in Figures 2 and 7. With respect to the first direction x, the first die pad 41 is located further toward the first lead 11, the two second leads 12, and the third lead 13 than the second die pad 42.

[0044] A first electronic component 51 is bonded to the first die pad 41. The first die pad 41 supports the first electronic component 51. The first die pad 41 is connected to each of the two second leads 12. The first die pad 41 and the two second leads 12 are integrally formed. In the example where the first die pad 41 is rectangular in plan view, as shown in Figure 2, in plan view, the first die pad 41 has two edges 41a, 41b spaced apart in a first direction x and two edges 41c, 41d spaced apart in a second direction y. The two edges 41a, 41b extend along the second direction y and are, for example, substantially parallel to each other. The two edges 41c, 41d extend along the first direction x and are, for example, substantially parallel to each other. In the illustrated example, the first die pad 41 has four corners corresponding to the four corners in a plan view, and the two second leads 12 each connect to the corner closest to the corresponding second outer portion 32 (the corner formed by the two edges 41a and 41c).

[0045] A second electronic component 52 is bonded to the second die pad 42. The second die pad 42 supports the second electronic component 52. The second die pad 42 is connected to each of the two support leads 14A. The second die pad 42 and the two support leads 14A are integrally formed. In the example where the second die pad 42 is rectangular in plan view, as shown in Figure 2, in plan view, the second die pad 42 has two edges 42a, 42b spaced apart in a first direction x and two edges 42c, 42d spaced apart in a second direction y. The two edges 42a, 42b extend along the second direction y and are, for example, substantially parallel to each other. The two edges 42c, 42d extend along the first direction x and are, for example, substantially parallel to each other. In the illustrated example, the two support leads 14A are connected individually to the center of each of the two edges 42a, 42b in the first direction x.

[0046] The first electronic component 51 and the second electronic component 52 are elements that perform electrical functions in the electronic device A10. The specific functions of the first electronic component 51 and the second electronic component 52 are not limited in any way, but the electronic device A10 of this embodiment has the function of detecting voltage by the first electronic component 51 and the second electronic component 52.

[0047] The first electronic component 51 is mounted on the first die pad 41. In this embodiment, the first electronic component 51 outputs a signal (first signal) for detecting the potential difference between the first lead 11 and each second lead 12 to the second electronic component 52 via the third electronic component 53.

[0048] As shown in Figure 2, the first electronic component 51 has a plurality of electrode pads 511, 512, 513, and 514. Each of the electrode pads 511, 512, 513, and 514 is arranged on the upper surface (the surface facing upward in the thickness direction z) of the first electronic component 51. The composition of each of the electrode pads 511, 512, 513, and 514 is not limited in any way, but includes, for example, aluminum.

[0049] The second electronic component 52 is mounted on the second die pad 42. In this embodiment, the second electronic component 52 receives the first signal via the third electronic component 53 and outputs a signal (second signal) corresponding to the potential difference between the first lead 11 and each of the second leads 12. In other words, the second electronic component 52 outputs a detection signal for the voltage applied between the first lead 11 and each of the two second leads 12 as the second signal.

[0050] As shown in Figure 2, the second electronic component 52 has a plurality of electrode pads 521, 522, and 523. Each of the electrode pads 521, 522, and 523 is arranged on the upper surface (the surface facing upward in the thickness direction z) of the second electronic component 52. The composition of each of the electrode pads 521, 522, and 523 is not limited, but includes, for example, aluminum.

[0051] The third electronic component 53 relays the signal between the first electronic component 51 and the second electronic component 52. In this embodiment, the third electronic component 53 is an insulating element that transmits electrical signals in an isolated state. The third electronic component 53 is, for example, an inductor-coupled insulating element (for example, a transformer chip), and transmits electrical signals in an isolated state by inductively coupling two coils (inductors). The third electronic component 53 may be a capacitive insulating element (for example, a capacitor) or a photocoupler, rather than an inductor-coupled insulating element. In the illustrated example, the third electronic component 53 is mounted on the first die pad 41. In this embodiment, the third electronic component 53 receives the first signal from the first electronic component 51 and outputs the second signal to the second electronic component 52. In the illustrated example, the third electronic component 53 is located between the first electronic component 51 and the second electronic component 52 in the first direction x.

[0052] As shown in Figure 2, the third electronic component 53 has a plurality of electrode pads 531 and 532. Each of the electrode pads 531 and 532 is arranged on the upper surface (the surface facing upward in the thickness direction z) of the third electronic component 53. Each of the electrode pads 531 is electrically connected to one of the two coils inside the third electronic component 53, and each of the electrode pads 532 is electrically connected to the other of the two coils inside the third electronic component 53. The composition of each of the electrode pads 531 and 532 is not limited, but includes, for example, aluminum.

[0053] In the electronic device A10, the first electronic component 51, the second electronic component 52, and the third electronic component 53 have a circuit configuration as shown in Figure 10, for example. As shown in Figure 10, the first electronic component 51 includes a voltage divider circuit 51A and an AD conversion circuit 51B, and the second electronic component 52 includes a DA conversion circuit 52A. The third electronic component 53 is an inductor-coupled isolation element (transformer), as described above. The voltage divider circuit 51A is an example of the "second circuit" described in the claims, and the AD conversion circuit 51B is an example of the "first circuit" described in the claims. Note that the circuit configuration of the electronic device of this disclosure is not limited to the example shown in Figure 10 and can be modified in various ways.

[0054] The voltage divider circuit 51A divides the voltage Vin to be detected and generates a voltage signal obtained by dividing the voltage Vin to be detected. In this embodiment, the voltage divider circuit 51A generates a voltage signal (the first signal) for detecting the potential difference between the potential of the first lead 11 and the potentials of each of the two second leads 12. In this embodiment, the voltage divider circuit 51A divides the first voltage (voltage Vin) input to the first lead 11 and generates a voltage signal (the first signal) corresponding to the first voltage. In the example shown in Figure 10, the voltage divider circuit 51A includes four resistors R1 to R4, and generates a voltage signal (the first signal) by voltage division by the four resistors R1 to R4. Note that the number of resistors is not limited to four. The four resistors R1 to R4 are connected in series. Specifically, one end of resistor R1 is electrically connected to the electrode pad 511, and the other end of resistor R1 is electrically connected to one end of resistor R2. The other end of resistor R2 is electrically connected to one end of resistor R3, and the other end of resistor R3 is electrically connected to one end of resistor R4. The other end of resistor R4 is electrically connected to the electrode pad 512. The connection point between resistor R3 and resistor R4 is connected to the AD conversion circuit 51B. Note that the connection to the AD conversion circuit 51B may be at the connection point between resistor R1 and resistor R2, or at the connection point between resistor R2 and resistor R3. For example, if the potential difference between the first lead 11 and the second lead 12 (i.e., the voltage Vin mentioned above) is about 800V, and the resistance values ​​of the four resistors R1 to R4 are the same, then the potential at the connection point between resistor R1 and resistor R2 will be 600V, the potential at the connection point between resistor R2 and resistor R3 will be 400V, and the potential at the connection point between resistor R3 and resistor R4 will be 200V. Therefore, considering the voltage rating of the AD conversion circuit 51B, you should appropriately select which connection point between multiple resistor elements to connect to.

[0055] The voltage divider circuit 51A divides the potential difference between the potential of the first lead 11 and the potential of each second lead 12 using three resistors R1, R2, and R3 and resistor R4, and outputs the divided voltage as a voltage signal (the first signal mentioned above) to the AD conversion circuit 51B. Therefore, the voltage divider circuit 51A does not require a power supply voltage to generate the voltage signal. In other words, the voltage divider circuit 51A is a circuit that does not require a power supply voltage.

[0056] The AD conversion circuit 51B converts the voltage signal (the first signal) generated by the voltage divider circuit 51A from an analog signal to a digital signal. As shown in Figure 10, the AD conversion circuit 51B receives the voltage signal (first signal) from the connection point of the two resistors R3 and R4 of the voltage divider circuit 51A. The AD conversion circuit 51B is connected to an electrode pad 513 and is supplied with a power supply voltage VCC1 (for example, about 5V to 24V) from the electrode pad 513 (third lead 13). The AD conversion circuit 51B is supplied with the power supply voltage VCC1 for the conversion from an analog signal to a digital signal. The AD conversion circuit 51B outputs the digitally converted first signal to the second electronic component 52 via the third electronic component 53. The AD conversion circuit 51B is connected to one of the multiple electrode pads 512 and is grounded to a reference potential GND1 from the electrode pad 512 (the second lead 12 electrically connected to the electrode pad 512).

[0057] The DA conversion circuit 52A converts the first signal input from the first electronic component 51 (AD conversion circuit 51B) to an analog signal via the third electronic component 53, generating a voltage signal Vout (the second signal). The DA conversion circuit 52A is connected to one of the multiple electrode pads 522, and outputs the voltage signal Vout (the second signal) from one of the connected electrode pads 522 (or the signal lead 14B electrically connected to the electrode pad 522), and is also supplied with a power supply voltage VCC2 (for example, about 5V to 24V) from one of the connected electrode pads 522 (or the signal lead 14B electrically connected to the electrode pad 522). Therefore, the DA conversion circuit 52A is supplied with a power supply voltage VCC2 for the conversion from a digital signal to an analog signal. The DA conversion circuit 52A outputs the second signal after analog conversion from one of the multiple electrode pads 522 (or the signal lead 14B electrically connected to the electrode pad 522). The DA conversion circuit 52A is connected to one of several electrode pads 521 and is grounded to the reference potential GND2 from the electrode pad 521 (support lead 14A electrically connected to the electrode pad 521).

[0058] Each of the connecting members 61-67 electrically connects parts that are separated from each other. In the illustrated example, each of the connecting members 61-67 is a bonding wire. Each of the connecting members 61-67 may be a bonding ribbon or a metal plate (metal clip) instead of a bonding wire. Each of the connecting members 61-67 contains either Au, Al (aluminum), or Cu.

[0059] As shown in Figure 2, the connecting member 61 is joined to the electrode pad 511 of the first electronic component 51 and the first inner portion 21 of the first lead 11. The connecting member 61 electrically connects the electrode pad 511 and the first inner portion 21. Therefore, the first outer portion 31 of the first lead 11 is electrically connected to the first electronic component 51 via the connecting member 61 and the like.

[0060] As shown in Figure 2, the connecting member 62 is joined to the electrode pad 512 of the first electronic component 51 and to the first die pad 41. The connecting member 62 electrically connects the electrode pad 512 and the first die pad 41. Therefore, the second outer portion 32 of each second lead 12 is electrically connected to the first electronic component 51 via the connecting member 62, etc. Note that the connecting member 62 may be joined to the second inner portion 22 of either of the two second leads 12 instead of the first die pad 41.

[0061] As shown in Figure 2, the connecting member 63 is joined to the electrode pad 513 of the first electronic component 51 and the third inner portion 23 of the third lead 13. The connecting member 63 electrically connects the electrode pad 513 and the third inner portion 23. Therefore, the third outer portion 33 of the third lead 13 is electrically connected to the first electronic component 51 via the connecting member 63 and the like.

[0062] As shown in Figure 2, the two connecting members 64 are joined to the electrode pad 521 and the second die pad 42 of the second electronic component 52, respectively. The two connecting members 64 electrically connect the electrode pad 521 and the second die pad 42. Therefore, the fourth outer portion 34 of each support lead 14A is electrically connected to the second electronic component 52 via the two connecting members 64, etc. Note that each connecting member 64 may be joined to the fourth inner portion 24 of either of the two support leads 14A instead of the second die pad 42.

[0063] Each of the multiple connecting members 65 is joined to the electrode pad 522 of the second electronic component 52 and to the fourth inner portion 24 of one of the multiple signal leads 14B, as shown in Figure 2. Each of the multiple connecting members 65 electrically connects the electrode pad 522 to the fourth outer portion 34 of one of the multiple signal leads 14B. Therefore, the fourth outer portion 34 of each signal lead 14B is electrically connected to the second electronic component 52 via the connecting members 65, etc. Note that Figure 2 shows an example in which all of the multiple signal leads 14B are electrically connected to one of the multiple electrode pads 522 by the multiple connecting members 65, but some of the multiple signal leads 14B may not be electrically connected to the second electronic component 52 if some of the multiple connecting members 65 are omitted.

[0064] As shown in Figure 2, each of the multiple connecting members 66 is joined to the electrode pad 514 of the first electronic component 51 and the electrode pad 531 of the third electronic component 53. Each of the multiple connecting members 66 electrically connects the electrode pad 514 and the electrode pad 531. Therefore, the first electronic component 51 and the third electronic component 53 are electrically connected to each other via the connecting members 66.

[0065] As shown in Figure 2, each of the multiple connecting members 67 is joined to the electrode pad 523 of the second electronic component 52 and the electrode pad 532 of the third electronic component 53. Each of the multiple connecting members 67 electrically connects the electrode pad 523 and the electrode pad 532. Therefore, the second electronic component 52 and the third electronic component 53 are electrically connected to each other via the connecting members 67.

[0066] The sealing resin 7 covers the first electronic component 51 and the second electronic component 52. The sealing resin 7 covers the third electronic component 53. The sealing resin 7 covers a portion of the first lead 11, the two second leads 12, the third lead 13, and the multiple fourth leads 14 (two support leads 14A and multiple signal leads 14B). The sealing resin 7 covers the first die pad 41 and the second die pad 42. The sealing resin 7 covers the multiple connecting members 61 to 67. The sealing resin 7 includes an insulating material such as epoxy resin. Preferably, the sealing resin 7 is made of a resin material with a CTI (Comparative Tracking Index) of 600V or higher. The sealing resin 7 is, for example, rectangular. The dimensions of the sealing resin 7 along the first direction x are, for example, 5 mm to 10 mm, and the dimensions along the second direction y are, for example, 3 mm to 13 mm. The dimensions of the sealing resin 7 along the first direction x and the dimensions along the second direction y are not limited to these. The sealing resin 7 has a resin main surface 71, a resin back surface 72, and a plurality of resin side surfaces 73.

[0067] The resin main surface 71 and the resin back surface 72 are separated from each other in the thickness direction z. The resin main surface 71 faces one direction (up) in the thickness direction z, and the resin back surface 72 faces the other direction (down) in the thickness direction z. The resin main surface 71 is the upper surface of the sealing resin 7, and the resin back surface 72 is the lower surface of the sealing resin 7.

[0068] Each of the multiple resin side surfaces 73 faces an orthogonal direction perpendicular to the thickness direction z. This orthogonal direction includes a first direction x and a second direction y. Each of the multiple resin side surfaces 73 is interposed between the resin main surface 71 and the resin back surface 72 in the thickness direction z, and connects to them. In the illustrated example, the multiple resin side surfaces 73 include a first resin side surface 731, a second resin side surface 732, a third resin side surface 733, and a fourth resin side surface 734.

[0069] The first resin side surface 731 and the second resin side surface 732 are separated from each other in the first direction x. The first resin side surface 731 faces one side of the first direction x, and the second resin side surface 732 faces the other side of the first direction x. The third resin side surface 733 and the fourth resin side surface 734 are separated from each other in the second direction y. The third resin side surface 733 faces one side of the second direction y, and the fourth resin side surface 734 faces the other side of the second direction y.

[0070] As shown in Figures 1 and 2, in the electronic device A10, the first outer portion 31 of the first lead 11, the second outer portions 32 of each of the two second leads 12, and the third outer portion 33 of the third lead 13 each protrude from the first resin side surface 731. In the electronic device A10, as shown in Figure 2, the first outer portion 31, the third lead 13, and the two second leads 12 are arranged in this order along the first resin side surface 731 in the second direction y, from the fourth resin side surface 734 toward the third resin side surface 733. Alternatively, the first outer portion 31, the third lead 13, and the two second leads 12 may be arranged in this order along the first resin side surface 731 in the second direction y, from the third resin side surface 733 toward the fourth resin side surface 734. As shown in Figures 1 and 2, the fourth outer portion 34 of each of the multiple fourth leads 14 (two support leads 14A and multiple signal leads 14B) protrudes from the second resin side surface 732. In the electronic device A10, as shown in Figure 2, one of the two support leads 14A, the multiple signal leads 14B, and the other of the two support leads 14A are arranged in the second direction y along the second resin side surface 732, in this order from the fourth resin side surface 734 toward the third resin side surface 733.

[0071] The operation and effects of electronic device A10 are as follows:

[0072] In the electronic device A10, the first outer portion 31 of the first lead 11 that is conductive to the first electronic component 51, the second outer portion 32 of the second lead 12, and the third outer portion 33 of the third lead 13 are exposed on different resin sides 73 of the sealing resin 7 to the fourth outer portion 34 of the fourth lead 14 that is conductive to the second electronic component 52. With this configuration, the creepage distance (distance along the resin side 73 of the sealing resin 7) between the first outer portion 31, second outer portion 32, and third outer portion 33 that are conductive to the first electronic component 51 and the fourth outer portion 34 that is conductive to the second electronic component 52 becomes large. Therefore, even if the voltage difference applied to the first electronic component 51 and the second electronic component 52 is large and a high voltage is applied, discharge between the first outer portion 31, second outer portion 32, and third outer portion 33 and the fourth outer portion 34 becomes less likely to occur. In other words, the electronic device A10 is able to reduce the size of the device while suppressing discharge between the first outer section 31, the second outer section 32, and the third outer section 33 and the fourth outer section 34. That is, the electronic device A10 has a favorable package structure for suppressing discharge between the first lead 11, the second lead 12, and the third lead 13 and the fourth lead 14.

[0073] In the electronic device A10, the first outer portion 31 of the first lead 11 and the second outer portion 32 of the second lead 12 are arranged with a gap d12 in the second direction y, and the fourth outer portions 34 of the multiple fourth leads 14 are arranged with a gap d42 or gap d44 in the second direction y. The gap d12 is larger than each of the gaps d42 and d44. With this configuration, the creepage distance between the first outer portion 31 and the second outer portion 32 is larger than the creepage distance between the multiple fourth outer portions 34, so even when a high voltage is applied between the first outer portion 31 and the second outer portion 32, discharge between the first outer portion 31 and the second outer portion 32 becomes less likely. Therefore, with the electronic device A10, it is possible to suppress discharge between the first outer portion 31 and the second outer portion 32 while miniaturizing the device. In other words, the electronic device A10 has a preferred package structure for suppressing discharge between the first outer portion 31 and the second outer portion 32.

[0074] In the electronic device A10, the third outer portion 33 of the third lead 13 is positioned between the first outer portion 31 of the first lead 11 and each of the second outer portions 32 of the two second leads 12. With this configuration, the third outer portion 33, which can be at a potential between the first outer portion 31 and the two second outer portions 32, is positioned between the first outer portion 31 and the two second outer portions 32, so the distance along the second direction y between the first outer portion 31 and one of the two second outer portions 32 (the second outer portion 32 closer to the first outer portion 31) can be increased. In particular, since the third outer portion 33 is closer to the two second outer portions 32 than to the first outer portion 31, it is preferable for suppressing discharge between the first outer portion 31, the two second outer portions 32, and the third outer portion 33.

[0075] In the electronic device A10, the first outer portion 31, each of the two second outer portions 32, and the third outer portion 33 are exposed on the first resin side surface 731, and each of the multiple fourth outer portions 34 is exposed on the second resin side surface 732. With this configuration, the creepage distance along the sealing resin 7 between the first outer portion 31, each of the two second outer portions 32, and the third outer portion 33 and each of the multiple fourth outer portions 34 can be ensured to be at least the length of the third resin side surface 733 (or the fourth resin side surface 734). Therefore, the electronic device A10 has a favorable package structure for suppressing discharge between the first outer portion 31, each of the two second outer portions 32, and the third outer portion 33, which are electrically connected to the first electronic component 51, and the multiple fourth outer portions 34.

[0076] Other embodiments and modifications of the electronic device of this disclosure are described below. The configurations of the parts in each embodiment and each modification are interchangeable to the extent that no technical inconsistencies arise.

[0077] Figure 11 shows an electronic device A11 according to a modified example of the first embodiment. Electronic device A11 differs from electronic device A10 in the following respect: the connection position of the second inner portion 22 of the second lead 12 to the first die pad 41 is different. In the example shown in Figure 11, electronic device A11 is shown to have one second lead 12, but like electronic device A10, it may have two or more second leads 12.

[0078] In the electronic device A11, the second inner portion 22 is connected to the center of the edge 41c of the first die pad 41 in the first direction x. However, the connection position of the second inner portion 22 is not limited to the center of the first direction x, as long as it is on the edge 41c.

[0079] The same effect as in the electronic device A10 is achieved in the electronic device A11. Furthermore, as can be seen from this modified example, the second inner portion 22 is not limited to being connected to the corner of the first die pad 41 in a plan view (the corner formed by the two edges 41a and 41c), but may also be connected to the edge 41c.

[0080] <Second Embodiment> Figure 12 shows an electronic device A20 according to the second embodiment. Electronic device A20 differs from electronic device A10 in the following respect: In electronic device A20, the third lead 13 (third outer portion 33) is positioned outward in the second direction y compared to the two second leads 12 (two second outer portions 32).

[0081] In the electronic device A20, as shown in Figure 12, the third outer portion 33 of the third lead 13 is located closer to the third resin side surface 733 in the second direction y than the third inner portions 23 of each of the two second leads 12. In the illustrated example, the third outer portion 33 (third root portion 332) of the third lead 13 does not overlap the first die pad 41 when viewed in the first direction x, but it may overlap the first die pad 41. Also, in the illustrated example, the third inner portion 23 of the third lead 13 extends until it overlaps the first die pad 41 when viewed in the second direction y, but it does not have to overlap the first die pad 41 when viewed in the second direction y.

[0082] In the example shown in Figure 12, the second inner portion 22 of one of the two second leads 12 connects to the corner formed by the two edges 41a and 41c of the first die pad 41, and the second inner portion 22 of the other of the two second leads 12 connects to the edge 41a of the first die pad 41. In the illustrated example, a portion of the second outer portion 32 (third root portion 332) of both second leads 12 overlaps the first die pad 41 when viewed in the first direction x.

[0083] In electronic device A20, similar to electronic device A10, the first outer portion 31, the second outer portion 32, and the third outer portion 33 are exposed to the fourth outer portion 34 on different resin sides 73 of the sealing resin 7. Therefore, similar to electronic device A10, electronic device A20 makes it less likely for discharge to occur between the first outer portion 31, the second outer portion 32, and the third outer portion 33 and the fourth outer portion 34, thus enabling miniaturization of the device while suppressing discharge between them. In other words, electronic device A20 has a favorable package structure for suppressing discharge between the first outer portion 31, the second outer portion 32, and the third outer portion 33 and the fourth outer portion 34. Furthermore, electronic device A20 has a configuration common to the other electronic devices A10 and A11, and thus achieves the same effects as those electronic devices A10 and A11.

[0084] As can be understood from electronic device A20, the third lead 13 may be located outward or inward in the second direction y with respect to at least one second lead 12. However, since the potential difference between the first lead 11 and the second lead 12 is greater than the potential difference between the first lead 11 and the third lead 13, electronic device A10 is preferred over electronic device A20 in terms of increasing the creepage distance along the first resin side surface 731 between the first lead 11 (first outer portion 31) and the second lead 12 (second outer portion 32) (in terms of suppressing discharge between the first outer portion 31 and the second outer portion 32).

[0085] <Third Embodiment> Figure 13 shows an electronic device A30 according to the third embodiment. Electronic device A30 differs from electronic device A10 in the following respect: In electronic device A30, the connection position of the second lead 12 to the first die pad 41 is different. Note that the example shown in Figure 13 shows the case in which electronic device A30 has one second lead 12.

[0086] In the electronic device A30, the second inner portion 22 of the second lead 12 is connected to the center of the edge 41a of the first die pad 41. In other words, the second inner portion 22 is located on one side of the first die pad 41 in the first direction x (the side closer to the first resin side surface 731) and is connected to the center of the edge extending in the second direction y. The second inner portion 22 extends from the first die pad 41 along the first direction x.

[0087] In electronic device A30, similar to electronic device A10, the first outer portion 31, the second outer portion 32, and the third outer portion 33 are exposed to the fourth outer portion 34 on different resin sides 73 of the sealing resin 7. Therefore, similar to electronic device A10, electronic device A30 makes it less likely for discharge to occur between the first outer portion 31, the second outer portion 32, and the third outer portion 33 and the fourth outer portion 34, thus enabling miniaturization of the device while suppressing discharge between them. In other words, electronic device A30 has a favorable package structure for suppressing discharge between the first outer portion 31, the second outer portion 32, and the third outer portion 33 and the fourth outer portion 34. Furthermore, electronic device A30 has a configuration common to the other electronic devices A10, A11, and A20, and thus achieves the same effects as those electronic devices A10, A11, and A20.

[0088] Figure 14 shows an electronic device A31 according to a first modification of the third embodiment. Electronic device A31 differs from electronic device A30 in the number of second leads 12. In the illustrated example, it has three second leads 12.

[0089] In the electronic device A31, the second inner portion 22 of each of the three second leads 12 is connected to the edge 41a of the first die pad 41. The second outer portion 32 of each of the three second leads 12 protrudes from the center of the first resin side surface 731 in the second direction y and is aligned with each other in the second direction y. The three second outer portions 32 are in approximately the same position in the first direction x as the three fourth outer portions 34 located in the center of the multiple signal leads 14B in the second direction y.

[0090] Electronic device A31 has the same effect as electronic device A30. As can be seen from electronic device A31, the number of second leads 12 in the electronic devices of this disclosure is not limited in any way.

[0091] Figure 15 shows an electronic device A32 according to a second modification of the third embodiment. Electronic device A32 differs from electronic device A30 in the following respect: Electronic device A32 is equipped with a sixth lead 16.

[0092] A second voltage may be input to the sixth lead 16 from the circuit board on which the electronic device A32 is mounted. This second voltage is different from the first voltage (voltage Vin) input to the first lead 11, the ground voltage input to the second lead 12, and the power supply voltage VCC1 input to the third lead 13. The second voltage is not limited in any way, but could be, for example, a negative voltage corresponding to the first voltage (e.g., -800V) or a negative power supply voltage corresponding to the power supply voltage VCC1 (e.g., -5V to -24V).

[0093] The sixth lead 16 includes a sixth inner portion 26 and a sixth outer portion 36. The sixth inner portion 26 and the sixth outer portion 36 are connected to each other and are integrally formed. In a plan view, the boundary between the sixth inner portion 26 and the sixth outer portion 36 overlaps with the periphery of the sealing resin 7.

[0094] The sixth inner portion 26 is the part of the sixth lead 16 that is covered by the sealing resin 7. The sixth inner portion 26 is connected to the sixth outer portion 36 and extends inward from the sixth outer portion 36 into the sealing resin 7. With respect to the first direction x, the sixth inner portion 26 is located closer to the first resin side surface 731 than to the first die pad 41. The sixth inner portion 26 is separated from the first die pad 41.

[0095] The sixth outer portion 36 is the part of the sixth lead 16 that is exposed from the sealing resin 7. In this embodiment, the sixth outer portion 36 protrudes in the first direction x from the sealing resin 7 (first resin side surface 731) in a plan view. The sixth outer portion 36 is a rectangle with the first direction x as its longitudinal direction in a plan view. The sixth outer portion 36 is bent in a gull-wing shape when viewed in the second direction y. The width of the sixth outer portion 36 (the dimension in the second direction y in the illustrated example) is not limited in any way, but is for example the same as the width W11 of the first outer portion 31, the width W12 of the second outer portion 32, the width W13 of the third outer portion 33, and the widths W141, W142 of the fourth outer portion 34. The sixth outer portion 36 includes the sixth mounting portion 361, the sixth root portion 362, and the sixth relay portion 363.

[0096] The sixth mounting portion 361 is the tip portion of the sixth outer portion 36. The sixth mounting portion 361 is the part that is joined to the circuit board when the electronic device A32 is mounted to the circuit board. As shown in Figure 15, the sixth mounting portion 361 is located at the end opposite to the sealing resin 7 in the first direction x. Therefore, the sixth mounting portion 361 is located further from the sealing resin 7 than the sixth root portion 362 and the sixth relay portion 363 in the first direction x. The sixth mounting portion 361 is located below the sixth root portion 362 in the thickness direction z.

[0097] The sixth root portion 362 is the root portion of the sixth outer portion 36. As shown in Figure 15, the sixth root portion 362 is located at the end of the sixth outer portion 36 that is closer to the sealing resin 7, with respect to the first direction x. Therefore, the sixth root portion 362 is located closer to the sealing resin 7 than the sixth mounting portion 361 and the sixth relay portion 363, with respect to the first direction x. The sixth root portion 362 is located above the sixth mounting portion 361 in the thickness direction z and protrudes from the center of the sealing resin 7 in the thickness direction z.

[0098] The sixth relay section 363 connects the sixth mounting section 361 and the sixth root section 362. For example, the sixth relay section 363 is inclined with respect to the sixth mounting section 361 and the sixth root section 362 when viewed in the second direction y. In this embodiment, the sixth relay section 363 is inclined with respect to the thickness direction z.

[0099] In the electronic device A32, as shown in Figure 15, the first electronic component 51 has an electrode pad 515. In the illustrated example, there is one electrode pad 515, but there may be more. The electrode pad 515 is located on the top surface (the surface facing upward in the thickness direction z) of the first electronic component 51, similar to the other electrode pads 511 to 514. The composition of the electrode pad 515 is not limited, but for example, it contains aluminum, similar to the other electrode pads 511 to 514. The electrode pad 515 is the input terminal for the second voltage.

[0100] The electronic device A32 includes a connecting member 68. Like the other connecting members 61 to 67, the connecting member 68 is a bonding wire, but it may also be a bonding ribbon or a metal plate (metal clip). Also, like the other connecting members 61 to 67, the connecting member 68 contains either Au, Al (aluminum), or Cu. As shown in Figure 15, the connecting member 68 is joined to the sixth inner portion 26 of the sixth lead 16 and the electrode pad 515 of the first electronic component 51, electrically connecting them.

[0101] Electronic device A32 has the same effect as electronic device A30. Electronic device A32 is equipped with a sixth lead 16. In this configuration, it is possible to input not only a first voltage but also a second voltage to the first electronic component 51. In other words, the electronic device of this disclosure is able to input not only a first voltage but also a second voltage (for example, a voltage with the sign of the first voltage reversed or a voltage with the sign of the power supply voltage VCC1 reversed) to the first electronic component 51.

[0102] <Fourth Embodiment> Figure 16 shows an electronic device A40 according to a fourth embodiment. Electronic device A40 differs from electronic device A10 in the following respect: In electronic device A40, each of the two second leads 12 is exposed on either the third resin side surface 733 or the fourth resin side surface 734. In the illustrated example, the two second leads 12 are exposed individually from the third resin side surface 733 and the fourth resin side surface 734, respectively.

[0103] In the electronic device A40, the second inner portion 22 of one of the two second leads 12 is connected to the center of the edge 41c of the first die pad 41 (i.e., the edge that is close to the third resin side surface 733 in the second direction y and extends in the first direction x), and the second inner portion 22 of the other of the two second leads 12 is connected to the edge 41d of the first die pad 41 (i.e., the edge that is close to the fourth resin side surface 734 in the second direction y and extends in the first direction x). Each second inner portion 22 extends from the first die pad 41 along the second direction y. The second outer portion 32 of one of the two second leads 12 is exposed at the third resin side surface 733, and the second outer portion 32 of the other of the two second leads 12 is exposed at the fourth resin side surface 734. In the illustrated example, the two second leads 12 each protrude from the corresponding third resin side surface 733 or fourth resin side surface 734 and are bent in a gull-wing shape.

[0104] In electronic device A40, similar to electronic device A10, the first outer portion 31, the second outer portion 32, and the third outer portion 33 are exposed to the fourth outer portion 34 on different resin sides 73 of the sealing resin 7. Therefore, similar to electronic device A10, electronic device A40 makes it less likely for discharge to occur between the first outer portion 31, the second outer portion 32, and the third outer portion 33 and the fourth outer portion 34, thus enabling miniaturization of the device while suppressing discharge between them. In other words, electronic device A40 has a favorable package structure for suppressing discharge between the first outer portion 31, the second outer portion 32, and the third outer portion 33 and the fourth outer portion 34. Furthermore, electronic device A40 has a configuration common to the other electronic devices A10, A11, A20, A30-A32, and thus achieves the same effects as those electronic devices A10, A11, A20, A30-A32.

[0105] As can be understood from electronic device A40, the electronic device of this disclosure is not limited to a configuration in which the second lead 12 connected to the first die pad 41 is exposed on the first resin side surface 731, but may also be exposed on the third resin side surface 733 or on the fourth resin side surface 734.

[0106] Figure 17 shows an electronic device A41 according to a first modification of the fourth embodiment. Electronic device A41 differs from electronic device A40 in the following respect: electronic device A41 is equipped with a fifth lead 15.

[0107] The fifth lead 15 is separated from the first die pad 41, but is at the same potential as the first die pad 41. In other words, the fifth lead 15 is at the same potential as the second lead 12.

[0108] The fifth lead 15 includes a fifth inner portion 25 and a fifth outer portion 35. The fifth inner portion 25 and the fifth outer portion 35 are connected to each other and are integrally formed. In a plan view, the boundary between the fifth inner portion 25 and the fifth outer portion 35 overlaps with the periphery of the sealing resin 7.

[0109] The fifth inner portion 25 is the part of the fifth lead 15 that is covered by the sealing resin 7. The fifth inner portion 25 is connected to the fifth outer portion 35 and extends inward from the fifth outer portion 35 into the sealing resin 7. With respect to the first direction x, the fifth inner portion 25 is located closer to the first resin side surface 731 than to the first die pad 41. The fifth inner portion 25 is separated from the first die pad 41. A connecting member 62 is joined to the fifth inner portion 25. The fifth inner portion 25 is electrically connected to the electrode pad 512 of the first electronic component 51 via the connecting member 62.

[0110] The fifth outer portion 35 is the portion of the fifth lead 15 that is exposed from the sealing resin 7. In this embodiment, the fifth outer portion 35 protrudes in the first direction x from the sealing resin 7 (first resin side surface 731) in a plan view. The fifth outer portion 35 is a rectangle with the first direction x as its longitudinal direction in a plan view. The fifth outer portion 35 is bent in a gull-wing shape when viewed in the second direction y. The width of the fifth outer portion 35 (the dimension in the second direction y in the illustrated example) is not limited in any way, but is for example the same as the width W11 of the first outer portion 31, the width W12 of the second outer portion 32, the width W13 of the third outer portion 33, and the widths W141, W142 of the fourth outer portion 34. The fifth outer portion 35 includes the fifth mounting portion 351, the fifth root portion 352, and the fifth relay portion 353.

[0111] The fifth mounting portion 351 is the tip portion of the fifth outer portion 35. The fifth mounting portion 351 is the part that is joined to the circuit board when the electronic device A41 is mounted to the circuit board. As shown in Figure 17, the fifth mounting portion 351 is located at the end opposite to the sealing resin 7 in the first direction x. Therefore, the fifth mounting portion 351 is located further from the sealing resin 7 than the fifth root portion 352 and the fifth relay portion 353 in the first direction x. The fifth mounting portion 351 is located below the fifth root portion 352 in the thickness direction z.

[0112] The fifth root portion 352 is the root portion of the fifth outer portion 35. As shown in Figure 17, the fifth root portion 352 is located at the end of the fifth outer portion 35 that is closer to the sealing resin 7, with respect to the first direction x. Therefore, the fifth root portion 352 is located closer to the sealing resin 7 than the fifth mounting portion 351 and the fifth relay portion 353, with respect to the first direction x. The fifth root portion 352 is located above the fifth mounting portion 351 in the thickness direction z and protrudes from the center of the sealing resin 7 in the thickness direction z.

[0113] The fifth relay section 353 connects the fifth mounting section 351 and the fifth root section 352. For example, the fifth relay section 353 is inclined with respect to the fifth mounting section 351 and the fifth root section 352 when viewed in the second direction y. In this embodiment, the fifth relay section 353 is inclined with respect to the thickness direction z.

[0114] Electronic device A41 achieves the same effect as electronic device A40. In electronic device A41, the fifth lead 15 becomes the input terminal for the reference potential GND1. With this configuration, the second lead 12 does not need to protrude from the sealing resin 7 in a plan view. Therefore, electronic device A41 can reduce the dimension in the second direction y compared to electronic device A40.

[0115] In a configuration different from electronic device A41, the electronic device of this disclosure may include two connecting members 62, as shown in Figure 18, wherein one of the two connecting members 62 electrically connects the first die pad 41 and the fifth inner portion 25, and the other of the two connecting members 62 electrically connects the electrode pad 512 of the first electronic component 51 and the first die pad 41. However, if the electrode pad 512 is located on the back surface (the surface facing downward in the thickness direction z) of the first electronic component 51, and the first die pad 41 and the electrode pad 512 are electrically connected by a conductive bonding material that joins the first electronic component 51, then it is not necessary to provide a connecting member 62 that electrically connects the electrode pad 512 of the first electronic component 51 and the first die pad 41. Even with such a configuration, the fifth lead 15 is at the same potential as the second lead 12, so it is possible to reduce the dimension of the device in the second direction y and to secure a ground terminal (a terminal that becomes the reference potential GND1).

[0116] Figures 19 to 28 show other configuration examples of the electronic device of this disclosure. Each configuration shown in Figures 19 to 28 can be applied to the first to fourth embodiments (including their variations) described above. The electronic devices shown in Figures 19 to 28 have the same effects as electronic device A10.

[0117] The electronic device of this disclosure may not include the third electronic component 53, and may instead consist of a first electronic component 51 and a second electronic component 52. For example, the electronic device of this disclosure may have the functional configuration of the third electronic component 53 built into the first electronic component 51, as shown in electronic device A50 in Figures 19 and 20. In electronic device A50, as shown in Figure 20, the first electronic component 51 includes an isolated transmission circuit 51C corresponding to the functional configuration of the third electronic component 53. The isolated transmission circuit 51C is connected to an AD conversion circuit 51B inside the first electronic component 51. Each electrode pad 514 of the first electronic component 51 is electrically connected to the output side of the isolated transmission circuit 51C. In electronic device A50, each connecting member 66 electrically connects one of the plurality of electrode pads 514 of the first electronic component 51 to one of the plurality of electrode pads 523 of the second electronic component 52. In an example different from electronic device A50, for example, the electronic device of this disclosure may not have the functional configuration of the third electronic component 53, as shown in electronic device A51 in Figures 21 and 22. In electronic device A51, as shown in Figure 22, the AD conversion circuit 51B of the first electronic component 51 is electrically connected to the DA conversion circuit 52A of the second electronic component 52, without going through the third electronic component 53 or an isolated transmission circuit 51C.

[0118] In the electronic device of this disclosure, the third electronic component 53 may be mounted on the second die pad 42 instead of the first die pad 41. For example, the electronic device of this disclosure may be bonded to the second die pad 42 together with the second electronic component 52, as shown in the electronic device A52 in Figure 23.

[0119] In the electronic devices of this disclosure, the number and arrangement of the support leads 14A and signal leads 14B of the plurality of fourth leads 14 are not limited. For example, in the electronic devices of this disclosure, as shown in electronic device A53 in Figure 24, one or more signal leads 14B may be arranged outside the two support leads 14A in the second direction y. In electronic device A53, as shown in Figure 24, one signal lead 14B is arranged outside each support lead 14A in the second direction y.

[0120] In the electronic devices of this disclosure, the configuration of the first lead 11 (size, shape, number, etc.) and the configuration of the second lead 12 (size, shape, number, etc.) are not limited to the illustrated examples. For example, in the electronic devices of this disclosure, as shown in electronic device A54 in Figure 25, the width W11 of the first outer portion 31 of the first lead 11 and the width W12 of the second outer portion 32 of the second lead 12 may be larger than the widths W141 and W142 of the fourth outer portions 34 of the multiple fourth leads 14. Alternatively, in an example different from electronic device A54, the electronic devices of this disclosure may, as shown in electronic device A55 in Figure 26, have multiple (two in the illustrated example) first outer portions 31 connected to one first inner portion 21, and multiple (two in the illustrated example) second outer portions 32 connected to one second inner portion 22. In the examples shown in Figures 25 and 26, the third lead 13 is shown to be configured in the same way as the electronic device A10. However, in the third lead 13 as well, the width of the third outer portion 33 may be increased, or multiple third outer portions 33 may be connected to one third inner portion 23.

[0121] The modified electronic devices A54 and A55 can suppress delamination from the circuit board when mounted on the circuit board, thereby improving the mounting reliability of the devices. For example, when current is applied to the circuit board, thermal stress is applied to the mounting portion (soldered portion) of the electronic devices A54 and A55 on the circuit board. If there is an imbalance between the number of leads protruding from the first resin side surface 731 and the number of leads protruding from the second resin side surface 732, this thermal stress may concentrate on the lead with fewer leads. In other words, in the case of each electronic device A54 and A55, thermal stress may concentrate on the first lead 11 and the second lead 12, etc. In contrast, in electronic device A54, the width W11 of the first outer portion 31 of the first lead 11 and the width W12 of the second outer portion 32 of the second lead 12 are increased to increase the bonding strength to the circuit board. This suppresses delamination from the circuit board. On the other hand, in the electronic device A55, the thermal stress on each of the first outer parts 31 and each of the second outer parts 32 is distributed by including two first outer parts 31 in the first lead 11 and two second outer parts 32 in the second lead 12. This suppresses delamination from the circuit board.

[0122] The electronic device of this disclosure is not limited to an SOP type package structure, and other package structures may be employed. For example, the electronic device of this disclosure may have a leadless package structure, as shown in electronic device A56 in Figures 27 and 28. In electronic device A56, the first lead 11, the two second leads 12, the third lead 13, and the multiple fourth leads 14 do not protrude from the sealing resin 7 in a plan view, as shown in Figure 27. Also, the first lead 11, the two second leads 12, the third lead 13, and the multiple fourth leads 14 are flush with the corresponding resin side surface 73 (first resin side surface 731 or second resin side surface 732), as shown in Figure 28. In this example, the first outer portion 31 of the first lead 11, the second outer portions 32 of each of the two second leads 12, the third outer portion 33 of the third lead 13, and the fourth outer portions 34 of each of the multiple fourth leads 14 are end faces exposed from the corresponding resin side surface 73 (first resin side surface 731 or second resin side surface 732). In the illustrated example, the first inner portion 21 of the first lead 11, the second inner portions 22 of each of the two second leads 12, and the third inner portion 23 of the third lead 13 are each thicker (larger in the thickness direction z) at the end closer to the first resin side surface 731, as can be seen from Figure 28. Similarly, each of the fourth inner portions 24 of the multiple fourth leads 14 has a thicker end (larger dimension in the thickness direction z) on the side closer to the second resin side surface 732, as can be seen from Figure 28. This configuration suppresses exposure of the lower surfaces of the first die pad 41 and the second die pad 42 from the sealing resin 7 (resin back surface 72), thereby suppressing discharge between the first die pad 41 and the second die pad 42.

[0123] In the electronic device of this disclosure, the functional configuration of the first electronic component 51 and the second electronic component 52 is not limited to voltage detection. For example, they may be used to control the switching operation of a switching element such as an IGBT or MOSFET. In other words, the electronic device of this disclosure is mounted on a wiring board of an inverter device such as an electric vehicle or a hybrid vehicle, and controls the switching operation of a switching element (such as an IGBT or MOSFET) provided in the inverter device. In this example, the second electronic component 52 is a controller (control element) of a gate driver that drives a switching element such as an IGBT or MOSFET. The second electronic component 52 has a circuit that converts a control signal input from an ECU or the like into a PWM control signal, a transmitting circuit for transmitting the PWM control signal to the first electronic component 51 (via the third electronic component 53), and a receiving circuit that receives an electrical signal from the first electronic component 51 (via the third electronic component 53). The first electronic component 51 is a gate driver (driving element) for driving a switching element. The first electronic component 51 includes a receiving circuit that receives a PWM control signal from the second electronic component 52 (via the third electronic component 53), a circuit for driving a switching element based on the PWM control signal, and a transmitting circuit for transmitting an electrical signal to the second electronic component 52 (via the third electronic component 53). The electrical signal may be, for example, an output signal from a temperature sensor located near the motor.

[0124] The electronic devices relating to this disclosure are not limited to the embodiments described above. The specific configuration of each part of the electronic devices relating to this disclosure can be modified in various ways. For example, the electronic devices relating to this disclosure include embodiments relating to the following appendices. Examples of each component in the following appendices are shown in parentheses using the reference numerals from the embodiments (including modified examples) described above, but are not limited thereto. Note 1. First electronic component (51) and, Second electronic component (52), A sealing resin (7) covering the first electronic component (51) and the second electronic component (52), The first lead (11) includes a first inner portion (21) covered by the sealing resin (7) and a first outer portion (31) exposed from the sealing resin (7), and is electrically connected to the first electronic component (51), The second lead (12) includes a second inner portion (22) covered by the sealing resin (7) and a second outer portion (32) exposed from the sealing resin (7), and is electrically connected to the first electronic component (51). The third lead (13) includes a third inner portion (23) covered by the sealing resin (7) and a third outer portion (33) exposed from the sealing resin (7), and is electrically connected to the first electronic component (51). The fourth lead (14) includes a fourth inner portion (24) covered by the sealing resin (7) and a fourth outer portion (34) exposed from the sealing resin (7), and is electrically connected to the second electronic component (52). A first die pad (41) supporting the first electronic component (51), A second die pad (42) supporting the second electronic component (52), Equipped with, The sealing resin (7) has a plurality of resin sides (73) each facing in an orthogonal direction perpendicular to the thickness direction (z) of the sealing resin (7), Each of the first outer portion (31), the second outer portion (32), and the third outer portion (33) is exposed on a resin side surface (73) different from the fourth outer portion (34) in an electronic device (A10, A11, A20, A30, A31, A32, A40, A41, A50~A56). Note 2. The second inner portion (22) is connected to the first die pad (41) and is an electronic device (A10, A11, A20, A30, A31, A32, A40, A41, A50~A56) as described in Appendix 1. Note 3. The aforementioned orthogonal direction includes the first direction (x), The plurality of resin sides (73) include a first resin side (731) and a second resin side (732) that face opposite each other with respect to the first direction (x), The first outer portion (31), the second outer portion (32), and the third outer portion (33) are exposed on the first resin side surface (731), The fourth outer portion (34) is exposed on the second resin side surface (732) and contains the electronic devices described in Appendix 2 (A10, A11, A20, A30, A31, A32, A50~A56). Note 4. The aforementioned orthogonal direction includes a second direction (y) that is different from the first direction (x), The first die pad (41) has a first edge (41a) that is close to the first resin side surface (731) when viewed in the thickness direction (z) and extends in the second direction (y) when viewed in the thickness direction (z), The second inner portion (22) is connected to the end of the first edge (41a) of the first die pad (41) in the second direction (y), and is an electronic device (A10, A11, A20, A50~A56) as described in Appendix 3. Note 5. The third outer portion (33) is an electronic device (A10, A11, A50~A56) located between the first outer portion (31) and the second outer portion (32), as described in Appendix 4. Note 5-1. The third outer portion (33) is located closer to the second outer portion (32) than to the first outer portion (31) in the second direction (y), and is an electronic device (A10, A11, A50~A56) as described in Appendix 5. Note 6. The second outer portion (32) is the electronic device (A20) described in Appendix 4, located between the first outer portion (31) and the third outer portion (33). Note 7. The aforementioned orthogonal direction includes a second direction (y) that is different from the first direction (x), The first die pad (41) has a first edge (41a) that is close to the first resin side surface (731) when viewed in the thickness direction (z) and extends in the second direction (y) when viewed in the thickness direction (z), The second inner portion (22) is connected to the center of the first edge (41a) of the first die pad (41) in the second direction (y), and is an electronic device (A30, A31, A32) as described in Appendix 3. Note 8. The aforementioned orthogonal direction includes the second direction (y), The plurality of resin sides (73) include a third resin side (733) and a fourth resin side (734) that face opposite each other in the second direction (y), The second outer portion (32) is exposed on at least one of the third resin side surface (733) and the fourth resin side surface (734) of the electronic device (A40, A41) as described in Appendix 2. Note 9. The fifth lead (15) further comprises a fifth inner portion (25) covered by the sealing resin (7) and a fifth outer portion (35) exposed from the sealing resin (7), The fifth lead (15) is separated from the first die pad (41) of the electronic device (A41) described in Appendix 8. Note 10. The system further comprises a connecting member (62) with one end joined to the fifth lead (15), The other end of the connecting member (62) is joined to the first electronic component (51), as described in Appendix 9, for the electronic device (A41). Note 10-1. The fifth lead (15) is at the same potential as the second lead (12), as described in Appendix 9 or Appendix 10, for the electronic device (A41). Note 11. The fourth inner portion (24) is connected to the second die pad (42) and is an electronic device (A10, A11, A20, A30, A31, A32, A40, A41, A50~A56) as described in any of the appendices 1 to 10. Note 11-1. By having at least one additional fourth lead (14), and by having multiple fourth leads (14), The plurality of fourth leads (14) include at least one support lead (14A) connected to the second die pad (42) and at least one signal lead (14B) that is not connected to the second die pad (42). Electronic devices as described in Appendix 1 to Appendix 11 (A10, A11, A20, A30, A31, A32, A40, A41, A50~A56). Appendix 11-2. The separation distance between the first outer portion (31) of the first lead (11) and the second outer portion (32) of the second lead (12) is greater than the separation distance between the fourth outer portions (34) of the plurality of fourth leads (14), as described in Appendix 11-1 (A10, A11, A20, A30, A31, A32, A40, A41, A50~A56). Appendix 11-3. The electronic device described in Appendix 1 to 11 (A10, A11, A20, A30, A31, A32, A40, A41, A50~A52, A54~A56) wherein the at least one support lead (14A) is located outside the sealing resin (7) along the exposed resin side surface (73) than the at least one signal lead (14B). Note 12. The sixth lead (16) further includes a sixth outer portion (36) exposed from the sealing resin (7), The sixth outer portion (36) is exposed on a resin side (73) that is different from the fourth outer portion (34) among the plurality of resin side surfaces (73), as described in any of Appendix 1 to Appendix 11, in the electronic device (A32). Note 12-1. The sixth lead (16) is at a different potential from the first lead (11), the second lead (12), and the third lead (13) in the electronic device (A32) described in Appendix 12. Note 13. An electronic device according to any of the appendices 1 to 12 (A10, A20, A31, A40, A41, A50~A53, A55, A56), further comprising a plurality of second leads (12) by further comprising at least one additional second lead (12). Note 14. The first electronic component (51) is an electronic device (A10, A11, A20, A30, A31, A32, A40, A41, A50~A56) described in any of Appendix 1 to Appendix 13, which includes a first circuit powered by the third lead (13). Note 15. The first electronic component (51) is an electronic device (A10, A11, A20, A30, A31, A32, A40, A41, A50~A56) as described in Appendix 14, which includes a second circuit that does not require a power supply. Note 15-1. The second circuit is a voltage divider circuit (51A) that divides the voltage applied between the first lead (11) and the second lead (12), as described in Appendix 15 (A10, A11, A20, A30, A31, A32, A40, A41, A50~A56). Appendix 15-2. The second circuit generates a voltage signal for detecting the potential difference between the first lead (11) and the second lead (12) by dividing the voltage, and outputs the said voltage signal to the first circuit, as described in Appendix 15-1 (A10, A11, A20, A30, A31, A32, A40, A41, A50~A56). Note 16. The first circuit is an AD conversion circuit (51B), The second electronic component (52) is an electronic device (A10, A11, A20, A30, A31, A32, A40, A41, A50~A56) as described in Appendix 14 or Appendix 15, including a DA conversion circuit (52A). Note 17. An electronic device as described in any of Appendix 1 to Appendix 16 (A10, A11, A20, A30, A31, A32, A40, A41, A52~A56), further comprising a third electronic component (53) that relays the signals between the first electronic component (51) and the second electronic component (52) in an isolated state. Note 18. The third electronic component (53) is supported by either the first die pad (41) or the second die pad (42) in the electronic device described in Appendix 17 (A10, A11, A20, A30, A31, A32, A40, A41, A52~A56). Appendix 18-1. The third electronic component (53) is a transformer chip, as described in Appendix 17 or Appendix 18 (A10, A11, A20, A30, A31, A32, A40, A41, A52~A56). [Explanation of symbols]

[0125] A10,A11,A20,A30,A31,A32,A40,A41:Electronic equipment A50~A56: Electronic equipment 11: First lead 12: Second lead 13: Third lead 14: Fourth lead 14A: Support lead 14B: Signal lead 15: Fifth lead 16: 6th lead 21: First inner section 22: Second inner section 23: Third inner section 24: Fourth inner section 25: Fifth inner section 26: 6th inner section 31: First outer section 311: First Implementation Section 312: First root portion 313: First relay unit 32: Second outer section 321: Second Implementation Section 322: Second root portion 323: Second relay unit 33: Third Outer Section 331: Third Implementation Section 332: Third root portion 333: Third relay unit 34: Fourth Outer Section 341: Fourth Implementation Section 342: Fourth root section 343: 4th Relay Unit 35: Fifth Outer Section 351: Fifth Implementation Section 352: Fifth root section 353: 5th Relay Unit 36: Sixth Outer Section 361: Sixth Implementation Section 362: Sixth root section 363: 6th Relay Unit 41: First die pad 41a~41d: Edge 42: Second die pad 42a~42d: ​​Edge 51: First Electronic Components 51A: Voltage divider circuit 51B: AD conversion circuit 51C: Transmission Circuit 511~515: Electrode pads 52: Second Electronic Components 52A: DA conversion circuit 521, 522, 523: Electrode pads 53: Third Electronic Components 531, 532: Electrode pads 61-68: Connecting members 7: Sealing resin 71: Resin main surface 72: Resin back 73: Resin side 731: First resin side 732: Second resin side 733: Third resin side 734: Fourth resin side R1~R4: Resistor elements

Claims

1. First electronic component and, The second electronic component, A sealing resin covering the first electronic component and the second electronic component, A first lead is provided which is electrically connected to the first electronic component, and which includes a first inner portion covered by the sealing resin and a first outer portion exposed from the sealing resin. The second lead includes a second inner portion covered by the sealing resin and a second outer portion exposed from the sealing resin, and is electrically connected to the first electronic component. A third lead includes a third inner portion covered by the sealing resin and a third outer portion exposed from the sealing resin, and is electrically connected to the first electronic component, The fourth lead includes a fourth inner portion covered by the sealing resin and a fourth outer portion exposed from the sealing resin, and is electrically connected to the second electronic component. A first die pad supporting the first electronic component, A second die pad supporting the second electronic component, Equipped with, The sealing resin has a plurality of resin sides, each facing in an orthogonal direction perpendicular to the thickness direction of the sealing resin, An electronic device in which each of the first outer portion, the second outer portion, and the third outer portion is exposed on a resin side surface different from that of the fourth outer portion.

2. The electronic device according to claim 1, wherein the second inner portion is connected to the first die pad.

3. The aforementioned orthogonal direction includes the first direction, The plurality of resin sides include a first resin side and a second resin side that face opposite each other with respect to the first direction. The first outer portion, the second outer portion, and the third outer portion are exposed on the first resin side surface, The electronic device according to claim 2, wherein the fourth outer portion is exposed on the second resin side surface.

4. The aforementioned orthogonal direction includes a second direction different from the first direction, The first die pad has a first edge that is close to the first resin side surface when viewed in the thickness direction and extends in the second direction when viewed in the thickness direction, The electronic device according to claim 3, wherein the second inner portion is connected to the end of the first edge of the first die pad in the second direction.

5. The electronic device according to claim 4, wherein the third outer portion is located between the first outer portion and the second outer portion.

6. The electronic device according to claim 4, wherein the second outer portion is located between the first outer portion and the third outer portion.

7. The aforementioned orthogonal direction includes a second direction different from the first direction, The first die pad has a first edge that is close to the first resin side surface when viewed in the thickness direction and extends in the second direction when viewed in the thickness direction, The electronic device according to claim 3, wherein the second inner portion is connected to the center of the first edge of the first die pad in the second direction.

8. The aforementioned orthogonal direction includes a second direction, The plurality of resin sides include a third resin side and a fourth resin side that face opposite each other in the second direction. The electronic device according to claim 2, wherein the second outer portion is exposed on at least one of the third resin side surface and the fourth resin side surface.

9. The fifth lead further comprises a fifth inner portion covered by the sealing resin and a fifth outer portion exposed from the sealing resin, The electronic device according to claim 8, wherein the fifth lead is separated from the first die pad.

10. The system further comprises a connecting member, one end of which is joined to the fifth lead, The electronic device according to claim 9, wherein the other end of the connecting member is joined to the first electronic component.

11. The electronic device according to any one of claims 1 to 10, wherein the fourth inner portion is connected to the second die pad.

12. The sixth lead further includes a sixth outer portion exposed from the sealing resin, The electronic device according to any one of claims 1 to 10, wherein the sixth outer portion is exposed on a resin side of the plurality of resin sides that is different from the fourth outer portion.

13. The electronic device according to any one of claims 1 to 10, further comprising a plurality of second leads by comprising at least one additional second lead.

14. The electronic device according to claim 1, wherein the first electronic component includes a first circuit powered by the third lead.

15. The electronic device according to claim 14, wherein the first electronic component includes a second circuit that does not require the power supply.

16. The first circuit is an AD conversion circuit, The electronic device according to claim 14 or claim 15, wherein the second electronic component includes a D / A conversion circuit.

17. The electronic device according to claim 16, further comprising a third electronic component that relays signals between the first electronic component and the second electronic component in an isolated manner.

18. The electronic device according to claim 17, wherein the third electronic component is supported on either the first die pad or the second die pad.

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