Spring components, camera modules, and electronic devices

Abstract

The present invention provides a spring member, a camera module, and electronic equipment that can prevent disconnection of external wiring. [Solution] The spring member includes a first surface 10S1 and a second surface 10S2 opposite to the first surface 10S1, and includes three or more thin wires 13A in a cross section perpendicular to the first surface 10S1. Of the thin wires 13A, the thin wires located at both ends are outer thin wires 13A1, and the thin wire sandwiched between the outer thin wires 13A1 is an inner thin wire 13A2. The inner thin wires 13A2 have a width of 10 μm or more on the first surface 10S1 and the second surface 10S2. The outer thin wires 13A2 have a width that is 2 μm to 8 μm thicker than the width of the inner thin wires 13A2 on the first surface 10S1 and the second surface 10S2.

Description

Technical Field

[0001] The present disclosure relates to a spring member for a camera module, a camera module, and an electronic device.

Background Art

[0002] A camera module included in an electronic device with a camera, such as a tablet terminal or a smartphone, includes a drive mechanism for enabling autofocus and zoom. Known drive mechanisms include a lens drive method and a sensor drive method. The drive mechanism of the lens drive method includes a spring member that enables changing the position of a lens in the optical axis direction of the lens. In contrast, the drive mechanism of the sensor drive method includes a spring member that enables changing the position of an image sensor in the optical axis direction of the lens (see, for example, Patent Documents 1 and 2).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, the spring member includes a first spring member having a spring portion having a polygonal line shape when viewed from a viewpoint facing the plane in which the spring member expands, and a second spring member having a spring portion composed of a plurality of springs independent of each other. The spring portion connects an inner frame portion to an outer frame portion.

[0005] Whether it is the spring portion of the first spring member or the spring portion of the second spring member, the spring portion is composed of a plurality of thin wires arranged at intervals in a plane perpendicular to the plane in which the spring member extends and perpendicular to the direction in which the spring portion extends. The plurality of thin wires include a pair of outer thin wires located at the ends in the direction in which the thin wires are arranged, and inner thin wires located between the outer thin wires. From the viewpoint of miniaturizing the spring portion, it is required that the spacing between the thin wires be narrow. On the other hand, in order to enable the driving of the spring portion, a certain distance is required between the spring portion and the outer frame, and between the spring portion and the inner frame.

[0006] The spring component is formed by wet etching of metal foil. The resist mask used for wet etching of metal foil has openings corresponding to the gaps between the fine lines and openings corresponding to the gaps between the spring portion and each frame portion. The openings corresponding to the gaps between the spring portion and each frame portion are wider than the openings corresponding to the gaps between the fine lines. Therefore, etching solution is not easily supplied to the openings corresponding to the gaps between the fine lines, while it is easily supplied to the openings corresponding to the gaps between the spring portion and each frame portion.

[0007] Therefore, in the outer fine wires, of the pair of opposing sides in the direction in which the fine wires are aligned, the side that is farther from the inner fine wire tends to have a shape in which the central part in the thickness direction of the spring member is significantly recessed compared to the side of the inner fine wire. As a result, during wet etching of the metal foil, localized penetrations may occur in the outer fine wires near the center in the thickness direction of the spring member, penetrating between the pair of sides, and if etching progresses further, the outer fine wires may break. [Means for solving the problem]

[0008] A spring member for a camera module to solve the above problem includes a first surface and a second surface opposite to the first surface. In a cross section perpendicular to the first surface, it includes three or more fine wires, of which the fine wires located at both ends are outer fine wires, and the fine wire sandwiched between the outer fine wires is an inner fine wire. The inner fine wire has a width of 10 μm or more on the first and second surfaces. The outer fine wire has a width of 2 μm to 8 μm thicker than the width of the inner fine wire on the first and second surfaces.

[0009] With the above-described spring member, the inner fine wire has a width of 10 μm or more on each surface, and the outer fine wire has a width of 2 μm or more that is thicker than the inner fine wire on each surface. This makes it possible to suppress the occurrence of localized penetrations and breakages near the center in the thickness direction of the inner and outer fine wires during etching. Furthermore, the inner fine wire has a width of 10 μm or more on each surface, and the outer fine wire has a width of 8 μm or less that is thicker than the inner fine wire on each surface. This prevents the concentration of load on the inner fine wire due to the driving of the spring member. As a result, it is possible to suppress the deformation of the inner fine wire due to the driving of the spring member.

[0010] In the spring member described above, in each thin wire, the width on the first surface is the first width, the width on the second surface is the second width, and in the thickness direction of the spring member, the first width and the second width may be the first or second largest width.

[0011] According to the above spring member, in the thickness direction of the spring member, the rigidity of the thin wire is prevented from becoming excessively high compared to the case where the inner part of the spring member is thicker than the first and second widths.

[0012] In the spring member described above, the first and second widths of each thin wire may be 20 μm or less.

[0013] With the above-described spring member, it is possible to significantly obtain the effect of having an inner thin wire of 10 μm or more on each surface, and an outer thin wire that is 2 μm to 8 μm thicker than the inner thin wire.

[0014] In the above-described spring member, in each outer thin wire, of the pair of sides extending along the thickness direction of the spring member, the side that is closer to the inner thin wire is the first side, and the side opposite to the first side is the second side, and the second side may have a V-shape that is recessed from the second side toward the first side.

[0015] According to the spring member described above, since the outer thin wire is constricted on at least one side, the rigidity of the outer thin wire is less likely to become excessively high.

[0016] In the above-described spring member, the aspect ratio of the thin wire may be 3 or more and 20 or less. According to the above spring member, it is possible to suppress the occurrence of penetrations and breakages in the fine wires during etching, as well as deformation of the fine wires during operation, over a wide range of aspect ratios of the fine wires.

[0017] In the above-mentioned spring member, the thickness of the spring member may be 120 μm or more and 200 μm or less.

[0018] The above-described spring component increases the certainty of obtaining the effect that results from the thin wire satisfying the above-described conditions.

[0019] In the above-described spring member, the spring member may include any of the following selected from the group consisting of stainless steel alloy, beryllium copper, nickel-tin copper, phosphor bronze, Corson alloy, and titanium copper.

[0020] According to the above-described spring member, it is possible to have high hardness, thereby increasing the durability of the spring member.

[0021] In the spring member, the spring member includes a base material selected from the group consisting of a stainless alloy, beryllium copper, nickel tin copper, phosphor bronze, Corson alloy, and titanium copper. The base material includes a first surface and a second surface located on the side opposite to the first surface. The spring member may further include a copper layer on at least one of the first surface of the base material and the second surface of the base material.

Advantages of the Invention

[0022] According to the present disclosure, it is possible to achieve both suppression of the occurrence of local through-holes and wire breaks in the vicinity of the central portion in the thickness direction of the thin wire during etching of the metal foil, and suppression of deformation of the thin wire during driving of the spring member.

Brief Description of the Drawings

[0023] [Figure 1] FIG. 1 is a plan view showing the structure of the spring member. [Figure 2] FIG. 2 is a cross-sectional view showing the structure along line II-II of FIG. 1. [Figure 3] FIGS. 3(A) to 3(C) are cross-sectional views showing an example of the structure of the inner thin wire. [Figure 4] FIGS. 4(A) to 4(C) are cross-sectional views showing an example of the structure of the outer thin wire. [Figure 5] FIG. 5 is a process diagram showing a step in the manufacturing method of the spring member. [Figure 6] FIG. 6 is a process diagram showing a step in the manufacturing method of the spring member. [Figure 7] FIG. 7 is a process diagram showing a step in the manufacturing method of the spring member. [Figure 8] FIG. 8 is a process diagram showing a step in the manufacturing method of the spring member. [Figure 9] FIG. 9 is a process diagram showing a step in the manufacturing method of the spring member. [Figure 10] FIG. 10 is a plan view schematically showing the shape of the resist mask. [Figure 11]Figure 11 is a table showing the evaluation results for the examples and comparative examples. [Figure 12] Figure 12 is a table showing the evaluation results for the examples and comparative examples. [Figure 13] Figure 13 is a table showing the evaluation results for the examples and comparative examples. [Modes for carrying out the invention]

[0024] An embodiment of a spring member for a camera module, a camera module, and an electronic device will be described with reference to Figures 1 to 13. [Spring component for camera module] The spring member for the camera module will be explained with reference to Figures 1 to 4. Figure 1 schematically shows the planar structure of the spring member as viewed from a viewpoint opposite to the plane in which the spring member extends.

[0025] As shown in Figure 1, the spring member 10 for the camera module includes a first surface 10S1 and a second surface 10S2 opposite to the first surface 10S1. The first surface 10S1 and the second surface 10S2 are a pair of surfaces that face each other in the thickness direction of the spring member 10. The spring member 10 comprises an outer frame portion 11, an inner frame portion 12, and a spring portion 13. The spring portion 13 is a leaf spring.

[0026] The spring portion 13 comprises a plurality of thin wires 13A. Each thin wire 13A has a straight shape that extends along the plane on which the spring member 10 expands, as viewed from a viewpoint opposite to the plane on which the spring member 10 expands. Each thin wire 13A is part of the metal foil that forms the spring member 10, and adjacent thin wires 13A are connected to each other by a bend.

[0027] In the example shown in Figure 1, the outer frame portion 11 has an octagonal shape, and the inner frame portion 12 has a circular shape. The spring portion 13 has a folded shape. Note that the outer shapes of the outer frame portion 11 and the inner frame portion 12 may be changed according to the shapes of other components of the drive mechanism of the camera module on which the spring member 10 is mounted, i.e., components other than the spring member 10. The inner frame portion 12 is located within the region defined by the outer frame portion 11. The spring portion 13 connects the inner frame portion 12 to the outer frame portion 11.

[0028] In the lens-driven mechanism, a pair of spring members 10 are arranged to sandwich the lens in the optical axis direction. By changing the position of the inner frame 12 connected to each outer frame 11 in the optical axis direction, the position of the lens in the optical axis direction changes. This makes it possible to correct camera shake using the lens-driven mechanism.

[0029] In contrast, in the sensor-driven drive mechanism, a pair of spring members 10 are arranged to sandwich the image sensor in the optical axis direction of the lens. By changing the position of the inner frame 12 connected to each outer frame 11 in the optical axis direction, the position of the image sensor in the optical axis direction of the lens changes. This makes it possible to correct camera shake with the sensor-driven drive mechanism.

[0030] The electronic device on which the camera module equipped with the spring member 10 is mounted may be, for example, a mobile phone terminal, a smartphone, a tablet terminal, or a notebook personal computer.

[0031] Figure 2 shows the cross-sectional structure of the spring portion 13 along the line II-II shown in Figure 1. That is, Figure 2 shows the cross-sectional structure of the spring member 10 along a plane perpendicular to the first surface 10S1 of the spring member 10, and perpendicular to the direction in which each thin wire 13A extends.

[0032] As shown in Figure 2, in a cross-section perpendicular to the first surface 10S1, the spring portion 13 contains three or more thin wires 13A. In this cross-section, of the thin wires 13A, the thin wires 13A located at both ends in the direction in which the thin wires 13A are aligned are the outer thin wires 13A1. The direction in which the thin wires 13A are aligned is the first direction D1. Of the multiple thin wires 13A, the thin wire 13A sandwiched between the outer thin wires 13A1 in the first direction D1 is the inner thin wire 13A2.

[0033] In the example shown in Figure 2, the spring portion 13 contains six thin wires 13A in a cross-section perpendicular to the first surface 10S1. Therefore, in the first direction D1, four inner thin wires 13A2 are sandwiched between two outer thin wires 13A1. The multiple thin wires 13A are arranged at approximately equal intervals in the first direction D1.

[0034] Of each fine wire 13A, the width on the first surface 10S1 is the first width WS1. Of each fine wire 13A, the width on the second surface 10S2 is the second width WS2. The inner fine wire 13A2 has a width of 10 μm or more on the first surface 10S1 and the second surface 10S2. The first width WS1 of the inner fine wire 13A2 is 10 μm or more, and the second width WS2 is 10 μm or more.

[0035] The outer nanowire 13A1 has a width that is 2 μm to 8 μm wider than the width of the inner nanowire 13A2 on the first surface 10S1 and the second surface 10S2. The first width WS1 of the outer nanowire 13A1 is 2 μm to 8 μm wider than the first width WS1 of the inner nanowire 13A2. The second width WS2 of the outer nanowire 13A1 is 2 μm to 8 μm wider than the second width WS2 of the inner nanowire 13A2.

[0036] Thus, the spring member 10 of this disclosure satisfies the following conditions 1 and 2. (Condition 1) The inner thin wire 13A2 has a width of 10 μm or more on the first surface 10S1 and the second surface 10S2. (Condition 2) The outer thin wire 13A1 has a width that is 2 μm to 8 μm thicker than the inner thin wire 13A2 on the first surface 10S1 and the second surface 10S2.

[0037] By satisfying condition 1 and the lower limit of condition 2, the spring member 10 can suppress the occurrence of localized penetrations and wire breakage near the center in the thickness direction of the inner fine wire 13A2 and outer fine wire 13A1 during etching. Furthermore, by satisfying condition 1 and the upper limit of condition 2, the concentration of load on the inner fine wire 13A2 due to the driving of the spring member 10 can be suppressed. As a result, it is possible to suppress the deformation of the inner fine wire 13A2 due to the driving of the spring member 10.

[0038] In each thin wire 13A, the first width WS1 and the second width WS2 in the thickness direction of the spring member 10 may be the first or second largest width. That is, in the thickness direction of the spring member 10, the first width WS1 and the second width WS2 are greater than or equal to the widths of the thin wire 13A other than the first width WS1 and the second width WS2. In the thickness direction of the spring member 10, in each thin wire 13A, the first width WS1 and the second width WS2 are greater than the width sandwiched between the first width WS1 and the second width WS2. In this case, the rigidity of the thin wire 13A is prevented from becoming excessively high compared to the case where the inside of the first width WS1 and the second width WS2 is thicker than the first width WS1 and the second width WS2 in the thickness direction of the spring member 10.

[0039] The first width WS1 and second width WS2 of each thin wire 13A may be 20 μm or less. In each thin wire 13A, all widths in the thickness direction of the spring member 10 may be 20 μm or less. By setting the upper limit of the first width WS1 and second width WS2 of each thin wire 13A to 20 μm or less, it is possible to significantly obtain the effects of the width of the thin wire 13A satisfying conditions 1 and 2. Note that the upper limit of the first width WS1 and second width WS2 of each thin wire 13A may be 40 μm or 15 μm.

[0040] Furthermore, the upper limits for each width WS1 and WS2 of the inner thin wire 13A2 may be 40 μm, 20 μm, or 15 μm. The effect of satisfying conditions 1 and 2 is greater when each width WS1 and WS2 of the inner thin wire 13A2 is 40 μm or less, and the effect of satisfying conditions 1 and 2 is further greater when each width WS1 and WS2 is 20 μm or less.

[0041] Furthermore, the upper limits for each width WS1 and WS2 of the outer nanowire 13A1 may be 40 μm, 20 μm, or 15 μm. The effect of satisfying conditions 1 and 2 is greater when each width WS1 and WS2 of the outer nanowire 13A1 is 40 μm or less, and the effect of satisfying conditions 1 and 2 is further greater when each width WS1 and WS2 is 20 μm or less.

[0042] The thickness of the spring member 10 may be between 120 μm and 200 μm. The thickness of the spring member 10 is the distance between the first surface 10S1 and the second surface 10S2. By having the thickness of the spring member 10 fall within the above range, the certainty that the thin wire 13A satisfies the above-described conditions 1 and 2 can be increased.

[0043] The ratio (T / W) of the thickness (T) of the spring member 10 to the width (W) of the thin wire 13A is the aspect ratio of the thin wire 13A. The aspect ratio of the inner thin wire 13A2 may be, for example, 3 or more and 20 or less. The lower limit of the aspect ratio of the inner thin wire 13A2 may be 6, 8, or 12. The upper limit of the aspect ratio of the inner thin wire 13A2 may be 13, 10, or 5. Note that the aspect ratio of the inner thin wire 13A2 can take on multiple values ​​in the thickness direction of the spring member 10. That is, in the thickness direction of the spring member 10, the aspect ratio at a first position, which is an arbitrary position in the thickness direction, and the aspect ratio at a second position different from the first position may be different from each other. It is sufficient that the multiple values ​​that a single inner thin wire 13A2 can take on are within the range of 3 or more and 20 or less.

[0044] The aspect ratio of the outer thin wire 13A1 may be, for example, between 3 and 20. The lower limit of the aspect ratio of the outer thin wire 13A1 may be 6, 8, or 12. The upper limit of the aspect ratio of the outer thin wire 13A1 may be 13, 10, or 5. The aspect ratio of the outer thin wire 13A1 can take on multiple values ​​in the thickness direction of the spring member 10. That is, in the thickness direction of the spring member 10, the aspect ratio at a first position, which is an arbitrary position in the thickness direction, and the aspect ratio at a second position different from the first position may be different from each other. It is sufficient that the multiple values ​​that a single outer thin wire 13A1 can take are within the range of 3 to 20.

[0045] By ensuring that the widths of the inner fine wire 13A2 and the outer fine wire 13A1 satisfy conditions 1 and 2, it is possible to suppress the occurrence of localized penetrations and breakages near the center of the thickness direction of the fine wire 13A during etching, and deformation of the fine wire 13A during operation, across a wide range of aspect ratios of the fine wire 13A.

[0046] In the direction in which the thin wires 13A are aligned, the distance between the centers of the thin wires 13A is the pitch P of the thin wires 13A. The pitch P may be the distance between the centers of the thin wires 13A on the first surface 10S1, or the distance between the centers of the thin wires 13A on the second surface 10S2. In either case, the pitch P is an equivalent value. The pitch P may be, for example, 200 μm or more and 500 μm or less, and preferably 240 μm or more and 400 μm or less.

[0047] The spring member 10 is made of a metal having a hardness high enough to achieve the required spring load or deflection. The spring member 10 may be made of, for example, a stainless steel alloy or a copper alloy. The stainless steel alloy may be, for example, a stainless steel alloy specified in JIS G 4313:2011 "Stainless steel strips for springs". The copper alloy may be, for example, a copper alloy specified in JIS H 3130:2018 "Sheets and strips of beryllium copper, titanium copper, phosphor bronze, nickel-tin copper and nickel silver for springs".

[0048] The spring member 10 may include any of the following selected materials: stainless steel alloy, beryllium copper, nickel-tin copper, phosphor bronze, Corson alloy, and titanium copper. It is preferable that the spring member 10 be formed from any of the above selected materials. Since the spring member 10 can have high hardness, it is possible to increase the durability of the spring member 10.

[0049] Figures 3(A) to 3(C) show examples of the cross-sectional shape of the inner thin wire 13A2. Note that Figures 3(A) to 3(C) are all examples of the shape of the inner thin wire 13A2 in a cross-section along the line II-II in Figure 1.

[0050] As shown in Figures 3(A) to 3(C), in each inner thin wire 13A2, of the pair of sides extending along the thickness direction of the spring member 10, one side is the first side 13A21 and the other side is the second side 13A22. In each inner thin wire 13A2, the second side 13A22 has a shape that is a left-right inversion of the first side 13A21.

[0051] Each inner fine wire 13A2 is adjacent to another fine wire 13A on both sides in the direction in which the fine wires 13A are aligned. Furthermore, the distance between fine wires 13A is approximately the same in the direction in which the fine wires 13A are aligned. Therefore, during the wet etching of the metal foil forming the spring member 10, the two sides 13A21 and 13A22 of the inner fine wire 13A2 are formed by etching solution with approximately the same amount and flow rate. As a result, in a cross-section perpendicular to the first surface 10S1, the second side surface 13A22 has a shape that is the left and right inverted of the first side surface 13A21.

[0052] In the example shown in Figure 3(A), each side surface 13A21 and 13A22 has a folded line shape with multiple bending points in the thickness direction of the spring member 10. Each side surface 13A21 and 13A22 has a shape in which two V-shapes that are recessed toward the center of the inner thin line 13A2 are connected in the thickness direction of the spring member 10.

[0053] In the example shown in Figure 3(B), each side surface 13A21, 13A22 is composed of a pair of inclined lines and a straight line sandwiched between the pair of inclined lines in the thickness direction of the spring member 10. Of the pair of inclined lines, the inclined line connected to the first surface 10S1 has an inclination that narrows the width of the inner thin wire 13A2 in the direction from the first surface 10S1 toward the second surface 10S2. Of the pair of inclined lines, the inclined line connected to the second surface 10S2 has an inclination that narrows the width of the inner thin wire 13A2 in the direction from the second surface 10S2 toward the first surface 10S1.

[0054] In the example shown in Figure 3(C), each side surface 13A21 and 13A22 has a V-shape with only one bending point in the thickness direction of the spring member 10. The first side surface 13A21 has a V-shape that curves inward from the first side surface 13A21 toward the second side surface 13A22. The second side surface 13A22 has a V-shape that curves inward from the second side surface 13A22 toward the first side surface 13A21. As a result, the inner thin wire 13A2 has a shape that is constricted approximately in the center in the thickness direction of the spring member 10.

[0055] Figures 4(A) to 4(C) show examples of the cross-sectional shape of the outer thin wire 13A1. Figures 4(A) to 4(C) are all examples of the shape of the outer thin wire 13A1 in a cross-section along the line II-II in Figure 1. Furthermore, the outer thin wire 13A1 shown in Figures 4(A) to 4(C) is an example of the outer thin wire 13A1 located on the right side of the pair of outer thin wires 13A1 in Figure 2. The outer thin wire 13A1 located on the left side in Figure 2 has a shape that is a reversed version of the outer thin wire 13A1 located on the right side.

[0056] As shown in Figures 4(A) to 4(C), in each outer thin wire 13A1, of the pair of sides extending along the thickness direction of the spring member 10, the side that is closer to the inner thin wire 13A2 is the first side 13A11, and the side opposite to the first side 13A11 is the second side 13A12. In each outer thin wire 13A1, the first side 13A11 and the second side 13A12 have different shapes from each other.

[0057] Each outer fine wire 13A1 is adjacent to an inner fine wire 13A2 on the first side surface 13A11 in the direction in which the fine wires 13A are aligned, but does not have any fine wires 13A adjacent to it on the second side surface 13A12. Therefore, during wet etching of the metal foil forming the spring member 10, the second side surface 13A12 of the outer fine wire 13A1 comes into contact with more etching solution than the first side surface 13A11 of the outer fine wire 13A1. Furthermore, the second side surface 13A12 is formed by an etching solution with a different flow than the etching solution used to form the first side surface 13A11. As a result, the first side surface 13A11 and the second side surface 13A12 of each outer fine wire 13A1 have different shapes from each other.

[0058] As shown in Figure 4(A), the second side surface 13A12 may have a V-shape that curves inward from the second side surface 13A12 toward the first side surface 13A11. In this case, since the outer thin wire 13A1 is constricted on at least one side surface, the rigidity of the outer thin wire 13A1 is less likely to become excessively high.

[0059] In the example shown in Figure 4(A), the second side surface 13A12 has a V-shape with only one inflection point in the thickness direction of the spring member 10. The second side surface 13A12 has a V-shape that curves inward from the second side surface 13A12 toward the first side surface 13A11. The valley of the V-shape is located approximately in the center in the thickness direction of the spring member 10. In contrast, the first side surface 13A11 has a folded line shape with multiple inflection points in the thickness direction of the spring member 10. The first side surface 13A11 has a shape in which two V-shapes, curved toward the center of the outer thin line 13A1, are connected in the thickness direction of the spring member 10. In the width direction of the spring member 10, the peak of the first side surface 13A11, which is the boundary between the two V-shapes, and the valley of the V-shape on the second side surface 13A12 are aligned.

[0060] In the example shown in Figure 4(B), similar to the example shown in Figure 4(A), the second side surface 13A12 has a V-shape with only one bending point in the thickness direction of the spring member 10. The second side surface 13A12 has a V-shape that curves inward from the second side surface 13A12 toward the first side surface 13A11. The valley of the V-shape is located approximately in the center in the thickness direction of the spring member 10.

[0061] In contrast, the first side surface 13A11 is composed of a pair of inclined lines and a straight line sandwiched between the pair of inclined lines in the thickness direction of the spring member 10. Of the pair of inclined lines, the inclined line connected to the first surface 10S1 has an inclination that narrows the width of the outer thin line 13A1 in the direction from the first surface 10S1 toward the second surface 10S2. Of the pair of inclined lines, the inclined line connected to the second surface 10S2 has an inclination that narrows the width of the outer thin line 13A1 in the direction from the second surface 10S2 toward the first surface 10S1.

[0062] In the example shown in Figure 4(C), the second side surface 13A12 has a concave shape that curves downward from the second side surface 13A12 toward the first side surface 13A11. The second side surface 13A12 has multiple bending points in the thickness direction of the spring member 10. In contrast, the first side surface 13A11 has a V-shape with only one bending point in the thickness direction of the spring member 10. The first side surface 13A11 has a V-shape that curves downward from the first side surface 13A11 toward the second side surface 13A12. The valley of the V-shape is located approximately in the center in the length direction of the spring member 10. In the width direction of the spring member 10, the bottom of the second side surface 13A12, which is the most concave part, and the valley of the first side surface 13A11 are aligned.

[0063] For each thin wire 13A, the variation in the thickness direction of the width of the thin wire 13A is ±2 μm or less of the average width of the thin wire 13A. For each thin wire 13A, the maximum width is less than or equal to the average width plus 2 μm, and the minimum width is greater than or equal to the average width minus 2 μm.

[0064] [Method for manufacturing spring components] The manufacturing method of the spring member 10 will be explained with reference to Figures 5 to 9. As shown in Figure 5, when manufacturing the spring member 10, first a first resist layer PR1 is formed on the first surface 21S1 of the metal foil 21, and a second resist layer PR2 is formed on the second surface 21S2. In the example explained using Figures 5 to 9, each resist layer PR1 and PR2 is formed from a positive-type photoresist, but each resist layer PR1 and PR2 may be formed from a negative-type photoresist.

[0065] Next, as shown in Figure 6, the first photomask PM1 is placed on the first resist layer PR1, and the second photomask PM2 is placed on the second resist layer PR2. Then, the first resist layer PR1 is exposed using the first photomask PM1, and the second resist layer PR2 is exposed using the second photomask PM2.

[0066] As shown in Figure 7, the exposed resist layers PR1 and PR2 are developed to form the first resist mask RM1 from the first resist layer PR1 and the second resist mask RM2 from the second resist layer PR2.

[0067] As shown in Figure 8, the metal foil 21 is wet-etched using resist masks RM1 and RM2. During this process, the metal foil 21 is etched from both the first surface 21S1 and the second surface 21S2. This forms through-holes in the metal foil 21 that penetrate along the thickness direction of the metal foil 21, resulting in the formation of an outer frame portion 11, an inner frame portion 12 separated from the outer frame portion 11, and a spring portion 13 connecting the inner frame portion 12 to the outer frame portion 11.

[0068] As a result, a spring member 10 that satisfies the above-mentioned conditions 1 and 2 is formed, making it possible to suppress both the occurrence of localized penetrations and breakages near the center in the thickness direction of each fine wire 13A during etching, and the deformation of the inner fine wire 13A2 due to the driving of the spring member 10.

[0069] As shown in Figure 9, after removing the resist masks RM1 and RM2 from the etched metal foil 21, the spring member 10 can be obtained by cutting it out from the etched metal foil 21.

[0070] The metal foil 21 for forming the spring member 10 may comprise a base material and a copper layer. The base material may include any of the following selected from the group consisting of stainless steel alloy, beryllium copper, nickel-tin copper, phosphor bronze, Corson alloy, and titanium copper. The base material comprises a first surface and a second surface opposite to the first surface. The copper layer may be located on at least one of the first and second surfaces of the base material. That is, the copper layer may be located on both the first and second surfaces, or on only the first surface or only the second surface. The method for forming the copper layer may be, for example, vacuum deposition, sputtering, and wet plating.

[0071] Furthermore, if the metal foil 21 comprises a base material and one or more copper layers, the spring member 10 comprises a base material and one or more copper layers. The base material of the spring member 10 is a part of the base material of the metal foil 21, and the copper layers of the spring member 10 are a part of the copper layers of the metal foil 21. The base material comprises a first surface and a second surface opposite to the first surface. The copper layers are located on at least one of the first surface and the second surface. That is, the copper layers may be located on both the first surface and the second surface of the base material, or only on the first surface or only on the second surface.

[0072] [Examples] Examples and comparative examples will be described with reference to Figures 10 to 13. [Comparative Example 1-1] In Comparative Example 1-1, a metal foil 21 was prepared, which was a rolled material formed from titanium copper and had a thickness of 120 μm. Next, resist masks RM1 and RM2 were formed on the first surface 21S1 and the second surface 21S2 of the metal foil 21, and the metal foil 21 was wet-etched from both the first surface 21S1 and the second surface 21S2 using the two resist masks RM1 and RM2. A ferric chloride aqueous solution was used as the etching solution during wet etching.

[0073] Furthermore, within a 280 mm square area of ​​the metal foil 21, unit areas corresponding to one spring member 10 and having a 20 mm square shape were arranged in a grid pattern so that they could be tiled in both the rolling direction and the width direction of the metal foil 21. Accordingly, each resist mask RM1 and RM2 also had a unit pattern corresponding to the shape of one spring member 10 arranged in a grid pattern so that it could be tiled in both the rolling direction and the width direction.

[0074] Figure 10 is a schematic plan view showing a portion of the unit pattern of the first resist mask RM1. Figure 10 schematically shows the portion of the unit pattern corresponding to the spring portion 13 of the spring member 10. In Figure 10, for illustrative purposes, the openings of the unit pattern are shown as rectangles. The second resist mask RM2 has a similar shape to the first resist mask RM1, but its position relative to the metal foil 21 is different. Therefore, the shape of the first resist mask RM1 will be described below, while the shape of the second resist mask RM2 will be omitted.

[0075] As shown in Figure 10, the unit pattern has multiple openings in the portion corresponding to the spring portion 13. The multiple openings consist of two first openings RM1A1 located at the ends of the arrangement direction, which is the direction in which the openings are aligned, and a second opening RM1A2 sandwiched between the two first openings RM1A1. In the arrangement direction, the width of the first opening RM1A1 is the first width WA1, and the width of the second opening RM1A2 is the second width WA2.

[0076] In the first resist mask RM1, the portion sandwiched between the first opening RM1A1 and the second opening RM1A2 in the alignment direction is the first linear portion RM11. In the alignment direction, the portion sandwiched between the two second openings RM1A2 is the second linear portion RM12. After etching the metal foil 21, the portion covered by the first linear portion RM11 is the outer fine line 13A1, and the portion covered by the second linear portion RM12 is the inner fine line 13A2. After etching the metal foil 21, a unit pattern was formed such that six fine lines 13A are included in a cross-section perpendicular to the first surface 21S1 and perpendicular to the direction in which the fine lines 13A extend.

[0077] In the first resist mask RM1, the pitch P between adjacent linear portions RM11 and RM12 in the arrangement direction was set to 240 μm. Furthermore, the first width WA1 of the first aperture RM1A1 was set to 220 μm, and the second width WA2 of the second aperture RM1A2 was set to 100 μm.

[0078] Furthermore, in a plan view facing the first surface 21S1 of the metal foil 21, multiple unit patterns were formed on each resist mask RM1 and RM2 such that the entirety of one unit pattern on the first resist mask RM1 overlaps the entirety of one unit pattern on the second resist mask RM2.

[0079] Using these resist masks RM1 and RM2, multiple etching patterns corresponding to the shape of the spring member 10 were formed on the metal foil 21.

[0080] [Comparative Examples 1-2 to 1-7] In Comparative Examples 1-2 to 1-7, the first width WA1 of the first aperture RM1A1 was narrowed and the width of the first linear portion RM11 was widened compared to Comparative Example 1-1. Otherwise, the etching patterns of Comparative Examples 1-2 to 1-7 were obtained using the same method as in Comparative Example 1-1.

[0081] [Comparative Example 1-8] In Comparative Example 1-8, the second width WA2 of the second opening RM1A2 was narrowed and the width of the second linear portion RM12 was widened compared to Comparative Example 1-1. Otherwise, the etching pattern of Comparative Example 1-8 was obtained using the same method as in Comparative Example 1-1.

[0082] [Comparative Examples 1-9, 1-10, Examples 1-1 to 1-4, Comparative Examples 1-11 to 1-13] In Comparative Examples 1-9, 1-10, Examples 1-1 to 1-4, and Comparative Examples 1-11 to 1-13, the first width WA1 of the first opening RM1A1 was narrowed and the width of the first linear portion RM11 was widened compared to Comparative Example 1-8. Otherwise, the etching patterns for Comparative Examples 1-9, 1-10, Examples 1-1 to 1-4, and Comparative Examples 1-11 to 1-13 were obtained using the same method as in Comparative Example 1-8.

[0083] [Examples 1-5] In Example 1-5, the widths WA1 and WA2 of each opening RM1A1 and RM1A2 were narrowed, and the widths of each linear portion RM11 and RM12 were widened compared to Comparative Example 1-1. Otherwise, the etching pattern of Example 1-5 was obtained using the same method as in Comparative Example 1-1.

[0084] [Examples 1-6 to 1-8, Comparative Example 1-14] In Examples 1-6 to 1-8 and Comparative Example 1-14, the first width WA1 of the first opening RM1A1 was narrowed and the width of the first linear portion RM11 was widened compared to Example 1-5. Otherwise, the etching patterns of Examples 1-6 to 1-8 and Comparative Example 1-14 were obtained using the same method as in Example 1-5.

[0085] [Comparative Example 2-1] In Comparative Example 2-1, the thickness of the metal foil 21 was changed to 150 μm, the pitch P was changed to 300 μm, and the widths WA1 and WA2 of each aperture RM1A1 and RM1A2 were widened compared to Comparative Example 1-1. Otherwise, the etching pattern of Comparative Example 2-1 was obtained by the same method as in Comparative Example 1-1.

[0086] [Comparative Examples 2-2 to 2-7] In Comparative Examples 2-2 to 2-7, the first width WA1 of the first opening RM1A1 was narrowed and the width of the first linear portion RM11 was widened compared to Comparative Example 2-1. Otherwise, the etching patterns of Comparative Examples 2-2 to 2-7 were obtained using the same method as in Comparative Example 2-1.

[0087] [Comparative Example 2-8] In Comparative Example 2-8, the second width WA2 of the second opening RM1A2 was narrowed and the width of the second linear portion RM12 was widened compared to Comparative Example 2-1. Otherwise, the etching pattern of Comparative Example 2-8 was obtained using the same method as in Comparative Example 2-1.

[0088] [Comparative Examples 2-9, 2-10, Examples 2-1 to 2-4, Comparative Examples 2-11 to 2-13] In Comparative Examples 2-9, 2-10, Examples 2-1 to 2-4, and Comparative Examples 2-11 to 2-13, the first width WA1 of the first opening RM1A1 was narrowed and the width of the first linear portion RM11 was widened compared to Comparative Example 2-8. Otherwise, the etching patterns of Comparative Examples 2-9, 2-10, Examples 2-1 to 2-4, and Comparative Examples 2-11 to 2-13 were obtained using the same method as in Comparative Example 2-8.

[0089] [Examples 2-5] In Example 2-5, the widths WA1 and WA2 of each opening RM1A1 and RM1A2 were narrowed, and the widths of each linear portion RM11 and RM12 were widened compared to Comparative Example 2-1. Otherwise, the etching pattern of Example 2-5 was obtained using the same method as in Comparative Example 2-1.

[0090] [Examples 2-6 to 2-8, Comparative Example 2-14] In Examples 2-6 to 2-8 and Comparative Example 2-14, the first width WA1 of the first opening RM1A1 was narrowed and the width of the first linear portion RM11 was widened compared to Example 2-5. Otherwise, the etching patterns of Examples 2-6 to 2-8 and Comparative Example 2-14 were obtained using the same method as in Example 2-5.

[0091] [Comparative Example 3-1] In Comparative Example 3-1, the thickness of the metal foil 21 was changed to 200 μm, the pitch P was changed to 400 μm, and the widths WA1 and WA2 of each aperture RM1A1 and RM1A2 were widened compared to Comparative Example 1-1. Otherwise, the etching pattern of Comparative Example 3-1 was obtained by the same method as in Comparative Example 1-1.

[0092] [Comparative Examples 3-2 to 3-7] In Comparative Examples 3-2 to 3-7, the first width WA1 of the first aperture RM1A1 was narrowed and the width of the first linear portion RM11 was widened compared to Comparative Example 3-1. Otherwise, the etching patterns of Comparative Examples 3-2 to 3-7 were obtained using the same method as in Comparative Example 3-1.

[0093] [Comparative Example 3-8] In Comparative Example 3-8, the second width WA2 of the second opening RM1A2 was narrowed and the width of the second linear portion RM12 was widened compared to Comparative Example 3-1. Otherwise, the etching pattern of Comparative Example 3-8 was obtained using the same method as in Comparative Example 3-1.

[0094] [Comparative Examples 3-9, 3-10, Examples 3-1 to 3-4, Comparative Examples 3-11 to 3-13] In Comparative Examples 3-9, 3-10, Examples 3-1 to 3-4, and Comparative Examples 3-11 to 3-13, the first width WA1 of the first opening RM1A1 was narrowed and the width of the first linear portion RM11 was widened compared to Comparative Example 3-8. Otherwise, the etching patterns for Comparative Examples 3-9, 3-10, Examples 3-1 to 3-4, and Comparative Examples 3-11 to 3-13 were obtained using the same method as in Comparative Example 3-8.

[0095] [Examples 3-5] In Example 3-5, the widths WA1 and WA2 of each opening RM1A1 and RM1A2 were narrowed, and the widths of each linear portion RM11 and RM12 were widened compared to Comparative Example 3-1. Otherwise, the etching pattern of Example 3-5 was obtained using the same method as in Comparative Example 3-1.

[0096] [Examples 3-6 to 3-8, Comparative Example 3-14] In Examples 3-6 to 3-8 and Comparative Example 3-14, the first width WA1 of the first opening RM1A1 was narrowed and the width of the first linear portion RM11 was widened compared to Example 3-5. Otherwise, the etching patterns of Examples 3-6 to 3-8 and Comparative Example 3-14 were obtained using the same method as in Example 3-5.

[0097] [Width of thin lines] The spring portion 13 of the etching pattern present on each metal foil 21 after etching was embedded using synthetic resin. Then, by cutting the embedded spring portion 13 using a microtome, the cross-section of the spring portion 13 in a plane perpendicular to the direction in which the fine wires contained in the spring portion 13 extend, and perpendicular to the first surface 21S1, was exposed.

[0098] The spring width of the spring portion 13 was measured at the following positions in the cross-section: the first width WS1 on the first surface 21S1 of the metal foil 21, the second width WS2 on the second surface 21S2 of the metal foil 21, and the width of the three planes between the first surface 21S1 and the second surface 21S2 of the metal foil 21, which divide the spring portion 13 into four equal parts in the thickness direction. A digital microscope (VHX-6000, manufactured by Keyence Corporation) was used to measure the width of the spring portion 13, and the magnification of the objective lens on the digital microscope was set to 100x.

[0099] In one spring section 13 of each metal foil 21, the average value of the second width WS2 was calculated from two outer thin wires 13A1, and the average value of the second width WS2 was calculated from four inner thin wires 13A2. Then, by averaging the average values ​​of the second width WS2 in 10 spring sections 13, the average values ​​of the second width WS2 for the outer thin wires 13A1 and the average values ​​of the second width WS2 for the inner thin wires 13A2 were calculated. These average values ​​were set as the second width WS2 for the thin wires 13A1 and 13A2 in each example and comparative example.

[0100] Furthermore, in one spring portion 13 of each metal foil 21, the average value of the first width WS1 was calculated from two outer thin wires 13A1, and the average value of the first width WS1 was calculated from four inner thin wires 13A2. Then, by averaging the average values ​​of the first width WS1 in the 10 spring portions 13, the average value of the first width WS1 of the outer thin wire 13A1 and the average value of the first width WS1 of the inner thin wire 13A2 were calculated. These average values ​​were set as the first width WS1 of the thin wires 13A1 and 13A2 in each example and comparative example.

[0101] Furthermore, in one spring section 13 of each metal foil 21, the average value of the width at five locations was calculated for each outer thin wire 13A1, and then the average value of the width at two outer thin wires 13A1 was calculated. This allowed the average value of the width of the outer thin wire 13A1 in one spring section 13 to be calculated. Then, by averaging the average values ​​of the widths of the outer thin wires 13A1 in 10 spring sections 13, the average value of the width of the outer thin wire 13A1 was calculated. Furthermore, in one spring section 13 of each metal foil 21, the average value of the width at five locations was calculated for each inner thin wire 13A2, and then the average value of the width at four inner thin wires 13A2 was calculated. This allowed the average value of the width of the inner thin wire 13A2 in one spring section 13 to be calculated. Then, by averaging the average values ​​of the widths of the inner thin wires 13A2 in 10 spring sections 13, the average value of the width of the inner thin wire 13A2 was calculated.

[0102] [Occurrence of localized penetrations and breakage in thin wires] After etching the metal foil 21, a digital microscope (as above) was used to confirm whether all etching patterns contained in each metal foil 21 included fine lines 13A with localized through-holes near the center in the thickness direction, or broken fine lines 13A. A localized through-hole is a through-hole that penetrates a pair of sides of the fine line 13A. Whether the etching pattern included fine lines 13A with through-holes or broken fine lines 13A was evaluated at the following two levels.

[0103] ○: The etching pattern does not contain any fine wires 13A that include localized through-holes or broken fine wires 13A that occur near the center in the thickness direction. ×: The etching pattern includes one or more thin wires 13A with localized penetrations or broken thin wires 13A that occur near the center in the thickness direction.

[0104] [Variations of thin lines] Ten etching patterns contained in each metal foil 21 were cut out as spring members 10. Then, a dynamic test was performed in which the spring part 13 was driven while the outer frame part 11 of the spring member 10 was fixed. After that, whether or not the spring member 10 contained deformed fine wires 13A was evaluated at the following two levels. When determining whether or not the spring member 10 contained deformed fine wires 13A, the spring member 10 was observed using a digital microscope (same as above).

[0105] ○: The spring member 10 does not contain any deformed thin wires 13A after dynamic testing. ×: Includes one or more thin wires 13A in which the spring member 10 has deformed after dynamic testing.

[0106] [Evaluation Results] The results of evaluating the average value of the second width WS2 of each fine wire 13A, the presence or absence of penetrations or breaks in the fine wire 13A, and the presence or absence of deformation of the fine wire 13A in the etching patterns of each example and each comparative example are shown in Figures 11 to 13.

[0107] As shown in Figures 11 to 13, when the width of the inner nanowire 13A2 falls within the range of 6.0 μm to 6.6 μm, localized penetrations were observed near the center of the inner nanowire 13A2 in the thickness direction. The inner nanowire 13A2 was found to have a localized penetration near the center of the spring member 10 in the thickness direction, specifically at its narrowest point.

[0108] Furthermore, when the width of the inner thin wire 13A2 was within the range of 6.0 μm to 6.6 μm, and the width of the outer thin wire 13A1 was less than 10 μm, localized penetrations were observed in the outer thin wire 13A1 near the center in the thickness direction. The outer thin wire 13A1 was found to have a localized penetration near the center in the thickness direction of the spring member 10, specifically at its narrowest point. On the other hand, even when the width of the inner thin wire 13A2 was within the range of 6.0 μm to 6.6 μm, when the width of the outer thin wire 13A1 was 10 μm or more, no localized penetrations or breaks were observed in the outer thin wire 13A1 near the center in the thickness direction.

[0109] Furthermore, deformation of the inner nanowire 13A2 was observed when its width fell within the range of 6.0 μm to 6.6 μm. In contrast, no deformation was observed in the outer nanowire 13A1 when the width of the inner nanowire 13A2 fell within the range of 6.0 μm to 6.6 μm.

[0110] When the width of the inner nanowire 13A2 was within the range of 10.0 μm to 10.7 μm, and the difference obtained by subtracting the width of the inner nanowire 13A2 from the width of the outer nanowire 13A1 was 2.0 μm or more, no localized penetrations or breaks were observed near the center of the outer nanowire 13A1 in the thickness direction. In contrast, when the width of the inner nanowire 13A2 was within the range of 10.0 μm to 10.7 μm, and the difference obtained by subtracting the width of the inner nanowire 13A2 from the width of the outer nanowire 13A1 was less than 2.0 μm, localized penetrations were observed near the center of the outer nanowire 13A1 in the thickness direction.

[0111] Furthermore, if the width of the inner thin wire 13A2 was within the range of 10.0 μm to 10.7 μm, and the difference obtained by subtracting the width of the inner thin wire 13A2 from the width of the outer thin wire 13A1 was 8.0 μm or less, no deformation of the inner thin wire 13A2 was observed. In contrast, if the width of the inner thin wire 13A2 was within the range of 10.0 μm to 10.7 μm, and the difference obtained by subtracting the width of the inner thin wire 13A2 from the width of the outer thin wire 13A1 exceeded 8.0 μm, deformation of the inner thin wire 13A2 was observed.

[0112] If the width of the inner nanowire 13A2 falls within the range of 40.1 μm to 40.8 μm, and the difference obtained by subtracting the width of the inner nanowire 13A2 from the width of the outer nanowire 13A1 is 2.0 μm or more, then no localized penetrations or breaks were observed in the outer nanowire 13A1 near the center in the thickness direction.

[0113] Furthermore, if the width of the inner wire 13A2 was within the range of 40.1 μm to 40.8 μm, and the difference obtained by subtracting the width of the inner wire 13A2 from the width of the outer wire 13A1 was 8.0 μm or less, no deformation of the inner wire 13A2 was observed. In contrast, if the width of the inner wire 13A2 was within the range of 40.1 μm to 40.8 μm, and the difference obtained by subtracting the width of the inner wire 13A2 from the width of the outer wire 13A1 exceeded 8.0 μm, deformation of the inner wire 13A2 was observed.

[0114] Furthermore, it was found that the average value of the first width WS1 of each thin wire 13A was equivalent to the average value of the second width WS2 shown in Figures 11 to 13. In addition, it was found that the variation in the average width of each thin wire 13A was less than ±2 μm.

[0115] These results suggest that by satisfying condition 1 above, the thin wire 13A contained in the spring portion 13 suppresses localized penetrations and breaks in the vicinity of the center of the thickness direction of the thin wire 13A during etching. Furthermore, by satisfying condition 2 above, the deformation of the thin wire 13A during the driving of the spring member 10 is suppressed.

[0116] As described above, according to one embodiment of the spring member for the camera module, the camera module, and the electronic device, the following effects can be obtained. (1) By satisfying condition 1 and the lower limit in condition 2, the spring member 10 can suppress the occurrence of through-holes and breakage in the inner fine wire 13A2 and outer fine wire 13A1 during etching. Furthermore, by satisfying condition 1 and the upper limit in condition 2, the concentration of load on the inner fine wire 13A2 due to the driving of the spring member 10 can be suppressed. As a result, it is possible to suppress the deformation of the inner fine wire 13A2 due to the driving of the spring member 10.

[0117] (2) In the thickness direction of the spring member 10, the rigidity of the thin wire 13A is suppressed to be excessively high compared to the case where the inside of the first width WS1 and the second width WS2 is thicker than the first width WS1 and the second width WS2.

[0118] (3) By ensuring that the upper limit of the width of each fine wire 13A is 20 μm or less, it is possible to significantly obtain the effects of satisfying conditions 1 and 2 for the width of the fine wire 13A. (4) Since the outer thin wire 13A1 is constricted on at least one side, the rigidity of the outer thin wire 13A1 is unlikely to become excessively high.

[0119] (5) Since the spring member 10 can have high hardness, it is possible to increase the durability of the spring member 10.

[0120] The above-described embodiment can be implemented with the following modifications. [Spring section] As described above, the spring portion 13 may have a folded shape formed by bending a single leaf spring through multiple bending portions, or it may be composed of multiple leaf springs that are independent of each other. When the spring member comprises multiple leaf springs that are independent of each other, each leaf spring is connected to the inner frame portion and the outer frame portion. [Explanation of symbols]

[0121] 10... Spring component 10S1…Side 1 10S2…Second side 13... Spring part 13A…Thin wire 13A1…Outer thin line 13A11…1st side 13A12…Second side 13A2…Inner thin line

Claims

1. A spring component for a camera module, Page 1 and, Including a second surface opposite to the first surface, In a cross-section perpendicular to the first surface, it includes three or more fine lines, wherein the fine lines located at both ends are outer fine lines, and the fine line sandwiched between the outer fine lines is an inner fine line. The inner fine wire has a width of 10 μm or more on the first and second surfaces. The outer nanowire has a width that is 2 μm to 8 μm thicker than the width of the inner nanowire on the first and second surfaces. Spring component.

2. In each thin line, the width on the first surface is the first width, and the width on the second surface is the second width. In the thickness direction of the spring member, the first width and the second width are the first or second largest width. The spring member according to claim 1.

3. The first and second widths of each thin wire are 20 μm or less. The spring member according to claim 2.

4. In each outer nanowire, of the pair of sides extending along the thickness direction of the spring member, the side that is shorter in distance from the inner nanowire is the first side, and the side opposite to the first side is the second side. The second side surface has a V-shape that is recessed from the second side surface toward the first side surface. The spring member according to any one of claims 1 to 3.

5. The aspect ratio of the aforementioned thin line is between 3 and 20. The spring member according to any one of claims 1 to 3.

6. The thickness of the spring member is 120 μm or more and 200 μm or less. The spring member according to any one of claims 1 to 3.

7. The spring member includes one selected from the group consisting of stainless steel alloy, beryllium copper, nickel-tin copper, phosphor bronze, Corson alloy, and titanium copper. The spring member according to any one of claims 1 to 3.

8. The spring member comprises a base material selected from the group consisting of stainless steel alloy, beryllium copper, nickel-tin copper, phosphor bronze, Corson alloy, and titanium copper. The base material comprises a first surface and a second surface opposite to the first surface. The spring member further comprises a copper layer on at least one of the first surface and the second surface of the base material. The spring member according to any one of claims 1 to 3.

9. The spring member is provided according to any one of claims 1 to 3. Camera module.

10. The camera module is provided as described in claim 9. electronic equipment.

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