Detachable cover with built-in heater

Abstract

When attaching a removable cover with an external cover and built-in heater to the piping of a circuit board processing device, the inner circumference is securely tightened while maintaining heat insulation without tightening the outer circumference. [Solution] A heater-integrated detachable cover for attachment to piping of a substrate processing apparatus for processing substrates, comprising: an inner skin portion disposed in close proximity to the outer circumferential surface of the piping; and an outer skin portion disposed outside the inner skin portion such that it has a space inside, wherein the space is provided with a heater portion disposed to cover the circumferential surface of the inner skin portion and an elastically deformable heat insulating material, and further comprising: an inner tightening member configured to integrally tighten the inner skin portion and the heater portion to the piping; and an outer tightening member configured to tighten the outer skin portion to the piping and fix it to the piping.

Description

Technical Field

[0001] The present disclosure relates to a heat - built - in detachable cover attached to a pipe of, for example, a substrate processing apparatus.

Background Art

[0002] Patent Document 1 discloses a heater - built - in detachable cover with an exterior cover, which is composed of a bag body formed by sewing a heating element and a heat - insulating material, an inner heating element inserted into a heat - resistant cloth of the bag body, and an exterior cover detachably attached to the heating element.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The technology according to the present disclosure, when attaching a heater - built - in detachable cover with an exterior cover to a pipe of a substrate processing apparatus, securely tightens the inner peripheral side and maintains heat insulation without tightening the outer peripheral side.

Means for Solving the Problems

[0005] One aspect of the present disclosure is a heat - built - in detachable cover attached to a pipe of a substrate processing apparatus for processing a substrate, including an inner skin portion disposed close to the outer peripheral surface of the pipe, and an outer skin portion disposed outside the inner skin portion so as to have a space inside. In the space, a heater portion disposed so as to cover the peripheral surface of the inner skin portion and an elastically deformable heat - insulating material are provided. An inner tightening member configured to integrally tighten the inner skin portion and the heater portion with respect to the pipe, and an outer tightening member configured to tighten the outer skin portion with respect to the pipe and fix it to the pipe are provided.

Effects of the Invention

[0006] According to this disclosure, when attaching a removable cover with an external cover and built-in heater to the piping of a substrate processing device, it is possible to securely tighten the inner circumference while maintaining heat insulation without tightening the outer circumference. [Brief explanation of the drawing]

[0007] [Figure 1] This is a longitudinal cross-sectional view showing a schematic configuration of the wafer processing apparatus according to this embodiment. [Figure 2] This is a schematic diagram illustrating a conventional heater-integrated detachable cover. [Figure 3] This is a schematic diagram illustrating the heater-integrated detachable cover according to this embodiment. [Figure 4] This is a schematic diagram illustrating the tightening method for the heater-integrated detachable cover according to this embodiment. [Figure 5] This is a schematic diagram illustrating the tightening method for the heater-integrated detachable cover according to this embodiment. [Figure 6] This is an explanatory diagram of other forms of the internal clamping member. [Figure 7] This is an explanatory diagram of another form of the fixing means for the internal fixing part. [Figure 8] This is an explanatory diagram of another form of the fixing means for the internal fixing part. [Figure 9] This is an explanatory diagram illustrating specific shapes of the internal fixing parts and how to fasten them. [Figure 10] This is an explanatory diagram illustrating specific shapes of the internal fixing parts and how to fasten them. [Figure 11] This is an explanatory diagram illustrating specific shapes of the internal fixing parts and how to fasten them. [Modes for carrying out the invention]

[0008] Hereinafter, the wafer processing apparatus as a substrate processing apparatus and the wafer processing method as a substrate processing method according to this embodiment will be described with reference to the drawings. In this specification, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant explanations will be omitted.

[0009] <Wafer Processing Equipment> Figure 1 is a longitudinal cross-sectional view showing a schematic configuration of the wafer processing apparatus 1 according to this embodiment. In this embodiment, the case in which the wafer processing apparatus 1 is a COR (Chemical Oxide Removal) processing apparatus that performs COR processing on a wafer W as a substrate will be described.

[0010] As shown in Figure 1, the wafer processing apparatus 1 includes a chamber 10 that is airtightly configured to house a wafer W, a plurality of mounting platforms 11a and 11b in the chamber 10 on which the wafer W is placed, two mounting platforms 11a and 11b in this embodiment, lifting mechanisms 12a and 12b that independently raise and lower each mounting platform 11a and 11b, a gas supply unit 13 that supplies processing gas from above each mounting platform 11a and 11b toward the mounting platforms 11a and 11b, inner walls 14a and 14b fixed to the bottom of the chamber 10 and individually surrounding the outside of each mounting platform 11a and 11b, a partition wall 15 that surrounds the outside of each mounting platform 11a and 11b and is configured to be able to move up and down, a lifting mechanism 16 that raises and lowers the partition wall 15, and an exhaust unit 17 that exhausts the inside of the chamber 10.

[0011] Chamber 10 is a container, for example, roughly rectangular in shape, made of a metal such as aluminum or stainless steel. Chamber 10 has a roughly rectangular shape in plan view and includes cylindrical side walls 20 with open top and bottom surfaces, a ceiling plate 21 that airtightly covers the top surface of the side walls 20, and a bottom plate 22 that covers the bottom surface of the side walls 20. A sealing member (not shown) is provided between the upper end surface of the side walls 20 and the ceiling plate 21 to maintain airtightness inside the chamber 10. A heater (not shown) is also provided in the chamber 10, and an insulating material (not shown) is provided on the bottom plate 22. Furthermore, the inside of the chamber 10 may be coated with a protective material.

[0012] The mounting tables 11a and 11b are formed in a substantially cylindrical shape, and include stages 30a and 30b having a mounting surface for mounting the wafer W, and support portions 31a and 31b for supporting the stages 30a and 30b. The upper sides of the stages 30a and 30b are configured as electrostatic chucks, and adsorb and hold the wafer W placed on the mounting surfaces of the stages 30a and 30b.

[0013] Inside the stages 30a and 30b, temperature adjustment mechanisms 32a and 32b for adjusting the temperatures of the stages 30a and 30b and the wafer W placed on the stages 30a and 30b are provided. The temperature adjustment mechanisms 32a and 32b are provided in the respective stages 30a and 30b, and independently adjust the temperatures of the stages 30a and 30b. The temperature adjustment mechanisms 32a and 32b include heaters 33a and 33b, and flow paths 34a and 34b through which a refrigerant circulates.

[0014] Power supplies (not shown) are connected to the heaters 33a and 33b. By supplying power from the power supplies to the heaters 33a and 33b, the temperatures of the stages 30a and 30b are adjusted. For example, the power supply may be common to the heaters 33a and 33b, and the control unit 100 described later may individually control the power from the power supply to the heaters 33a and 33b. Alternatively, individual power supplies may be connected to the heaters 33a and 33b. Note that the adjustment range of the temperatures of the stages 30a and 30b by the heaters 33a and 33b is arbitrary, but is, for example, 0.1°C.

[0015] Chillers (not shown) are connected to the flow paths 34a and 34b. By supplying the refrigerant adjusted to a desired temperature from the chillers to the flow paths 34a and 34b and circulating through the flow paths 34a and 34b, the temperatures of the stages 30a and 30b are adjusted. For example, the chillers may be individually connected to the flow paths 34a and 34b.

[0016] The support parts 31a and 31b support the lower parts of the stages 30a and 30b. The support parts 31a and 31b have a hollow structure, and a sealed space (not shown) surrounded by the interiors of the support parts 31a and 31b and the lower surfaces of the stages 30a and 30b is formed. A support pin unit (not shown) that is driven up and down is provided in the sealed space. By inserting the support pins of the support pin unit through the through holes of the stages 30a and 30b and moving up and down, the wafer W is transferred between the stages 30a and 30b and a transfer mechanism (not shown) provided outside the wafer processing apparatus 1.

[0017] The elevating mechanisms 12a and 12b are provided on the respective mounting tables 11a and 11b and independently raise and lower the mounting tables 11a and 11b. Therefore, the mounting tables 11a and 11b can independently adjust their heights. Note that the adjustment range of the heights of the mounting tables 11a and 11b by the elevating mechanisms 12a and 12b is arbitrary, but for example, it is 1 mm.

[0018] When the elevating mechanisms 12a and 12b raise the mounting tables 11a and 11b (stages 30a and 30b) to the wafer processing position at a desired height, the wafer W placed on the mounting tables 11a and 11b is processed. Also, when the mounting tables 11a and 11b (stages 30a and 30b) are lowered to the wafer transfer position by the elevating mechanisms 12a and 12b, the wafer W lifted from the upper surfaces of the mounting tables 11a and 11b by the above-described support pin unit can be accessed from outside the chamber 10.

[0019] The elevating mechanisms 12a and 12b have drive parts 40a and 40b arranged outside the chamber 10, and drive shafts 41a and 41b that connect between the drive parts 40a and 40b and the lower surfaces of the support parts 31a and 31b, penetrate the bottom plate 22 of the chamber 10, and extend vertically upward in the chamber 10. For example, an actuator is used for the drive parts 40a and 40b.

[0020] Inside the chamber 10, bellows 42a and 42b are provided that can extend and retract vertically, surrounding the drive shafts 41a and 41b. The upper ends of the bellows 42a and 42b are airtightly connected to the lower surfaces of the support parts 31a and 31b, and the lower ends of the bellows 42a and 42b are airtightly connected to the upper surface of the bottom plate 22. Therefore, when the mounting tables 11a and 11b are raised and lowered via the drive shafts 41a and 41b, the bellows 42a and 42b extend and retract vertically, thereby maintaining airtightness inside the chamber 10.

[0021] The gas supply unit 13 has a shower head 50 that supplies processing gas to wafers W placed on mounting tables 11a and 11b. The shower head 50 is individually provided on the lower surface of the ceiling plate 21 of the chamber 10, facing each mounting table 11a and 11b. The shower head 50 has, for example, a substantially cylindrical frame 51 with an open bottom and supported on the lower surface of the ceiling plate 21, and a substantially disc-shaped shower plate 52 fitted into the inner surface of the frame 51. It is preferable that the shower plate 52 has a diameter at least larger than the diameter of the wafer W in order to uniformly supply processing gas to the entire surface of the wafer W placed on the mounting tables 11a and 11b. The shower plate 52 is also provided at a predetermined distance from the ceiling portion of the frame 51. As a result, a space 53 is formed between the ceiling portion of the frame 51 and the upper surface of the shower plate 52. The shower plate 52 is also provided with a plurality of openings 54 that penetrate through the shower plate 52 in the thickness direction.

[0022] A gas supply source 56 is connected to the space 53 between the ceiling of the frame 51 and the shower plate 52 via a gas supply pipe 55. The gas supply source 56 is configured to supply, for example, fluorine (F2) gas, hydrogen fluoride (HF) gas, or ammonia (NH3) gas as a processing gas, or argon (Ar) gas as a diluent or purge gas. The gas supplied from the gas supply source 56 is uniformly supplied to the wafers W placed on the mounting tables 11a and 11b via the space 53 and the shower plate 52. The gas supply pipe 55 is also provided with a flow rate adjustment mechanism 57 to adjust the amount of processing gas supplied, and is configured to individually control the amount of processing gas supplied to each wafer W. The shower head 50 may be a post-mix type that can supply multiple types of processing gases individually without mixing them.

[0023] Each inner wall 14a, 14b has a substantially cylindrical main body portion 60a, 60b and flange portions 61a, 61b provided at the upper ends of the main body portion 60a, 60b, which project horizontally toward the outer circumference of the inner wall 14a, 14b. The inner walls 14a, 14b are arranged to individually surround the support portions 31a, 31b of the mounting bases 11a, 11b and the bellows 42a, 42b of the lifting mechanisms 12a, 12b. The inner diameter of the main body portion 60a, 60b of the inner walls 14a, 14b is set to be larger than the outer diameter of the support portions 31a, 31b and the bellows 42a, 42b, and exhaust spaces V are formed between the inner walls 14a, 14b and the support portions 31a, 31b and the bellows 42a, 42b, respectively.

[0024] Multiple slits (not shown) are formed at the lower ends of the inner walls 14a and 14b. The slits are exhaust ports through which the processed gas is discharged. In this embodiment, the slits are formed at approximately equal intervals along the circumferential direction of the inner walls 14a and 14b.

[0025] The partition wall 15 has two cylindrical sections 70a and 70b that individually surround the two mounting bases 11a and 11b, an upper flange section 71 provided at the upper ends of the cylindrical sections 70a and 70b, and a lower flange section 72 provided at the lower ends of the cylindrical sections 70a and 70b. The inner diameter of the cylindrical sections 70a and 70b is set to be larger than the outer surface of the mounting bases 11a and 11b, so that a gap is formed between the cylindrical sections 70a and 70b and the mounting bases 11a and 11b.

[0026] In one embodiment, heaters (not shown) are provided in the cylindrical portions 70a and 70b of the partition wall 15, and are heated to, for example, 100°C to 150°C. This heating prevents foreign matter contained in the processing gas from adhering to the partition wall 15.

[0027] As shown in Figure 1, a sealing member 73, such as an O-ring, is provided on the upper surface of the upper flange portion 71. The sealing member 73 airtightly seals the space between the upper flange portion 71 and the frame 51 when the partition wall 15 is raised to the wafer processing position by the lifting mechanism 16 and the frame 51 comes into contact with it. A sealing member 73 is provided on each of the mounting tables 11a and 11b. By raising the partition wall 15 and bringing the frame 51 into contact with the sealing member 73, a processing space S is formed, surrounded by the mounting tables 11a and 11b, the partition wall 15, and the shower head 50.

[0028] Furthermore, when the partition wall 15 is lowered to the wafer transport position by the lifting mechanism 16, the wafer W, which has been lifted from the upper surfaces of the mounting tables 11a and 11b by the support pin unit described above, becomes accessible from outside the chamber 10.

[0029] The lifting mechanism 16 raises and lowers the bulkhead 15. The lifting mechanism 16 has a drive unit 80 located outside the chamber 10, a drive shaft 81 connected to the drive unit 80 and extending vertically upward inside the chamber 10 through the bottom plate 22 of the chamber 10, and a plurality of guide shafts 82, the tip of which is connected to the bulkhead 15 and the other end which extends outside the chamber 10. For example, an actuator is used for the drive unit 80. The guide shafts 82 prevent the bulkhead 15 from tilting when the bulkhead 15 is raised and lowered by the drive shaft 81.

[0030] The lower end of the extendable bellows 83 is airtightly connected to the drive shaft 81. The upper end of the bellows 83 is airtightly connected to the lower surface of the bottom plate 22. Therefore, when the drive shaft 81 moves up and down, the bellows 83 extends and retracts along the vertical direction, maintaining airtightness inside the chamber 10. A sleeve (not shown), for example, fixed to the bottom plate 22, is provided between the drive shaft 81 and the bellows 83 to function as a guide during the up and down movement.

[0031] A bellows 84, which is extendable and retractable, is connected to the guide shaft 82, similar to the drive shaft 81. The upper end of the bellows 84 is airtightly connected to both the bottom plate 22 and the side wall 20, spanning across both. Therefore, when the guide shaft 82 moves up and down in conjunction with the raising and lowering movement of the partition wall 15 by the drive shaft 81, the bellows 84 extends and retracts vertically, thereby maintaining airtightness inside the chamber 10. In addition, a sleeve (not shown) that functions as a guide during the raising and lowering movement is provided between the guide shaft 82 and the bellows 84, similar to the case of the drive shaft 81.

[0032] Furthermore, since the upper end of the bellows 84 is the fixed end and the lower end of the bellows 84 connected to the guide shaft 82 is the free end, when negative pressure is created inside the chamber 10, a force acts to compress the bellows 84 vertically due to the pressure difference between the inside and outside of the bellows 84. As a result, the guide shaft 82 connected to the free end of the bellows 84 rises vertically upward as the bellows 84 contracts. This causes the partition wall 15 to rise evenly, ensuring proper contact between the sealing member 73 and the frame 51, thereby ensuring a seal between the partition wall 15 and the frame 51. Similarly, by ensuring proper contact between the sealing member 74 and the flange portions 61a and 61b, a seal between the partition wall 15 and the flange portions 61a and 61b can be ensured. Furthermore, the guide shaft 82 is subjected to downward forces due to the reaction force from the bellows 84, which acts as an elastic member, and the weight of the guide shaft 82 itself. However, the differential pressure acting on the guide shaft 82 can be adjusted by appropriately setting the diameter of the bellows 84.

[0033] The exhaust section 17 includes an exhaust mechanism 90 for exhausting air from inside the chamber 10, and an exhaust port 91 provided on the bottom plate 22 of the chamber 10, outside the partition wall 15. That is, the exhaust port 91 is provided on the bottom plate 22 outside the partition wall 15, at a position that does not overlap with the partition wall 15 in a plan view. The exhaust port 91 is in communication with the exhaust pipe 92.

[0034] These exhaust mechanisms 90, exhaust ports 91, and exhaust pipes 92 are shared by the two processing spaces S. That is, the two processing spaces S communicate with a common exhaust space V formed at the bottom of the chamber 10, and the processed gas flowing out into this exhaust space V is discharged by the exhaust mechanism 90 via the common exhaust pipe 92. The exhaust pipe 92 is equipped with a control valve 93 for adjusting the amount of exhaust by the exhaust mechanism 90. In addition, the ceiling plate 21 is equipped with a pressure measuring mechanism (not shown) for measuring the pressure in each of the processing spaces S of the mounting platforms 11a and 11b. The opening of the control valve 93 is controlled, for example, based on the measurement value from this pressure measuring mechanism.

[0035] The wafer processing apparatus 1 described above is provided with at least one control unit 100. The control unit 100 processes computer-executable instructions that cause the wafer processing apparatus 1 to perform the various processes described herein. The control unit 100 may be configured to control each element of the wafer processing apparatus 1 to perform the various processes described herein. In one embodiment, some or all of the control unit 100 may be included in the wafer processing apparatus 1. The control unit 100 may include a processing unit, a storage unit, and a communication interface. The control unit 100 is implemented, for example, by a computer. The processing unit may be configured to read a program from the storage unit that provides logic or routines that enable various control operations, and to perform various control operations by executing the read program. This program may be stored in the storage unit in advance, or it may be retrieved via a medium when needed. The retrieved program is stored in the storage unit and read from the storage unit and executed by the processing unit. The medium may be various storage media readable by a computer, or it may be a communication line connected to a communication interface. The storage medium may be temporary or non-temporary. The processing unit may be a CPU (Central Processing Unit), or it may be one or more circuits. The storage unit may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with the wafer processing device 1 via a communication line such as a LAN (Local Area Network).

[0036] <Removable cover with built-in heater> In the wafer processing apparatus 1 according to this embodiment, piping is provided in various parts of the apparatus, such as the gas supply section 13 and the exhaust section 17, which are located upstream of the apparatus, through which gases including processing gas and purge gas flow. For example, as shown in Figure 1, there is a gas supply pipe 13a that connects the gas supply source 56 to the space 53, and an exhaust pipe 17a that connects the chamber 10 to the exhaust mechanism 90 and exhausts the inside of the chamber.

[0037] In the upstream piping 13a of the wafer processing apparatus 1, it is required to maintain the piping 13a at a predetermined temperature in order to suppress the liquefaction of the flowing processing gas and the formation of deposits that may occur when multiple gases are mixed. Similarly, in the downstream piping 17a of the wafer processing apparatus 1, it is required to maintain the piping 17a at a predetermined temperature in order to suppress the adhesion of components contained in the exhausted gas as deposits, just as with piping 13a.

[0038] Therefore, various piping in substrate processing equipment, such as wafer processing equipment 1, is fitted with a heater-integrated detachable cover that includes a heater, which is a heat-generating element, and an outer cover to prevent the heat from escaping to the outside. In the following explanation, various types of piping may be collectively referred to as "piping P" in the diagrams and descriptions.

[0039] (Conventional heater-integrated detachable cover) Figure 2 is a schematic diagram illustrating a conventional heater-integrated detachable cover 120, and is a schematic cross-sectional view showing an example of the configuration of a heater-integrated detachable cover, commonly known as a mantle heater (jacket heater). As shown in Figure 2, the heater-integrated detachable cover 120 includes an inner skin portion 130 positioned to cover the outer surface of the piping P in close proximity, and an outer skin portion 140 positioned outside the inner skin portion 130, with a heater and insulation material (described later) in between. When the heater-integrated detachable cover 120 is positioned to cover the piping P, a gap portion 150 is formed at least at one location in the circumferential direction. The inner skin portion 130 and the outer skin portion 140 are connected radially to form the gap portion 150, and the inner skin portion 130 and the outer skin portion 140 constitute a bag-like body 155 with an internal space S.

[0040] Within the space S inside the bag 155, a heater section 133 is provided as a heating element so as to cover the circumferential surface of the inner skin 130. The heater section 133 includes a sheet section 135 extending longitudinally on the circumferential surface of the inner skin 130 and a plurality of heating wires 136. In addition, a heat insulating material 160 is provided in the space S outside the heater section 133. The material of the heat insulating material 160 is arbitrary, but for example, it may be made of glass fiber, have a certain thickness, and be an elastically deformable member.

[0041] Furthermore, the outer shell portion 140 is provided with a tightening member 170 configured to connect the outer surface ends 150a and 150b of the gap portion 150, and to tighten the outer shell portion 140 in a direction that closes the gap portion 150. This tightening member 170 is configured to allow the heater-integrated detachable cover 120 to be fixed to the pipe P by tightening and securing it. The tightening member 170 may include, for example, Velcro® or a band, and the heater-integrated detachable cover 120 may be fixed to the pipe P by tightening and securing it in the direction of the arrow in the figure.

[0042] When a conventional heater-integrated detachable cover 120 configured in this way is attached to a pipe P for temperature control, if the tightening member 170 is tightened too firmly, or if it is overtightened, the insulation material 160 may be crushed and elastically deformed, raising concerns about a decrease in insulation performance. On the other hand, if the tightening member 170 is not tightened sufficiently, the degree of contact between the heater part 133 and the pipe P decreases, raising concerns about a decrease in heating performance.

[0043] (Heater-integrated detachable cover according to this embodiment) Figure 3 is a schematic diagram illustrating the heater-integrated detachable cover 200 according to this embodiment, and is a schematic cross-sectional view showing an example of its configuration. Note that components having the same functional configuration as the conventional heater-integrated detachable cover 120 described above with reference to Figure 2 are denoted by the same reference numerals, and their descriptions may be omitted.

[0044] As shown in Figure 3, the heater-integrated detachable cover 200 according to this embodiment is provided with an inner tightening member 210 that connects the inner surface ends 150c and 150d of the gap 150 and tightens in the inner skin portion 130 in a direction that closes the gap 150. This inner tightening member 210 is configured to fix the heater portion 133 in close contact with the piping P by tightening and securing it.

[0045] Furthermore, the outer shell portion 140 is provided with an outer tightening member 220 that is configured to connect the outer ends 150a and 150b of the gap portion 150, and which allows the heater-integrated detachable cover 200 to be fixed to the piping P by tightening the outer shell portion 140 in a direction that closes the gap portion 150.

[0046] The configuration of the inner tightening member 210 and the outer tightening member 220 is arbitrary; they may be configured to tighten continuously in a single operation, or they may be configured to tighten independently by separate operations. The inner tightening member 210 may be provided on a part of the circumferential direction of the inner skin portion 130, or it may be configured to cover the entire circumferential surface of the inner skin portion 130. The means for fixing the inner tightening member 210 and the outer tightening member 220 is also arbitrary; for example, Velcro, bands, clips, etc., may be used.

[0047] <An example of how to tighten a removable cover with a built-in heater> Figures 4 and 5 are schematic diagrams illustrating the tightening method of the heater-integrated detachable cover 200 according to this embodiment, showing an example of a tightening method when the inner tightening member 210 covers the entire circumferential surface of the inner skin portion 130. Figure 4 is a view from an oblique side, and Figure 5 is a cross-sectional view. For the sake of simplicity in the illustration, some parts such as the piping P and the internal structure of the heater-integrated detachable cover 200 are omitted from the illustration, and the illustration focuses on the inner tightening member 210 and the outer tightening member 220.

[0048] As shown in Figures 4 and 5, in one embodiment, the inner tightening member 210 is a string-like or belt-like member arranged to surround the circumferential surface of the inner skin portion 130. This inner tightening member 210 includes a belt portion 210a that can be pulled to integrally tighten the inner skin portion 130 and the heater portion 133 to the piping P, and an inner fixing portion 210b configured to protrude outward from the gap portion 150. The inner fixing portion 210b can be attached to an inner adhesive portion 210c provided on the outer circumferential surface of the heater-integrated detachable cover 200 (the outer circumferential surface of the outer skin portion 140), thereby fixing the inner tightening member 210. In another embodiment, the outer tightening member 220 includes an outer fixing portion 220a provided on the side end portion 150a of the gap portion 150, and an outer adhesive portion 220b provided on the side end portion 150b.

[0049] As an example of a tightening method, first, as shown in Figure 5(a), the inner fixing portion 210b of the inner tightening member 210 is pulled outward (see arrow in the figure), which constricts the inner circumference of the belt portion 210a. In other words, the inner skin portion 130 and the heater portion 133 are tightened and made tightly attached to the pipe P.

[0050] Next, as shown in Figure 5(b), the inner fixing portion 210b is bent and attached to the inner adhesive portion 210c provided on the outer surface of the heater-integrated detachable cover 200. This fixes the inner tightening member 210 in a state where the inner skin portion 130 and the heater portion 133 are tightened and in close contact with the piping P (not shown in Figure 5). Note that the means for attaching the inner fixing portion 210b to the inner adhesive portion 210c is arbitrary, and for example, Velcro may be used.

[0051] Next, as shown in Figure 5(c), the outer fixing part 220a is pulled in the direction that closes the gap 150 (see arrow in the figure) and attached to the outer adhesive part 220b. This securely attaches the heater-integrated detachable cover 200 to the piping P (not shown in Figure 5). Note that the means for attaching the outer fixing part 220a to the outer adhesive part 220b is arbitrary, and for example, Velcro may be used.

[0052] As described above, in the tightening method for the heater-integrated detachable cover 200 according to this embodiment, the inner tightening member 210 and the outer tightening member 220 are installed separately, and the outer tightening member 220 is fixed after the inner tightening member 210 is fixed. In other words, the degree of tightening by the inner tightening member 210 and the degree of tightening by the outer tightening member 220 can be adjusted independently. For example, the tightening by the inner tightening member 210 to ensure tight contact between the inner skin portion 130 and the heater portion 133 and the pipe P can be made strong. On the other hand, the tightening by the outer tightening member 220 to attach the heater-integrated detachable cover 200 to the pipe P can be made looser.

[0053] <Other forms of internal fastening members> Figure 6 is an explanatory diagram of another form of the inner clamping member 210. As shown in Figure 6, the inner clamping member 210 may have a clip portion 211 provided at the tip of the inner fixing portion 210b. That is, in one embodiment, the inner clamping member 210 may be fixed by fixing the clip portion 211 to an arbitrary position on the outside of the heater-integrated detachable cover 200 (for example, the outer circumferential surface of the outer skin portion 140).

[0054] (Other forms of fixing means for the internal fixing part) Figures 7 and 8 are explanatory diagrams of other configurations of the fixing means for the internal fixing part 210b. Note that here, the illustrations focus on the internal fixing part 210b, and other components are not shown.

[0055] As shown in Figure 7(a), fixed shaft members 214, 214 may be provided at both inner surface ends 150c, 150d of the gap 150, and the string-like or belt-like inner fixing part 210b may be pulled via the fixed shaft members 214, 214. Alternatively, as shown in Figure 7(b), a fixed shaft member 214 may be provided at either one of the inner surface ends 150c, 150d of the gap 150 (in this case, 150c), and the string-like or belt-like inner fixing part 210b may be pulled via the fixed shaft member 214.

[0056] Furthermore, as shown in Figure 8, in addition to the fixed shaft member 214 described above, a fixed shaft member 215 may also be provided on either one of the outer ends 150a and 150b of the gap 150, and the string-like or belt-like inner fixing part 210b may be passed through this fixed shaft member 215. In this case, the inner fixing part 210b may be passed so as to straddle the gap 150 as shown in Figure 8(a), or it may be passed so as not to straddle the gap 150 as shown in Figure 8(b). The inner fixing part 210b, which is passed through the fixed shaft member 215, may be fixed by a fastener 230 provided at any position on the outside of the heater-integrated detachable cover 200 (for example, on the outer circumferential surface of the outer skin 140).

[0057] As shown in Figure 8, the configuration may also involve fixing the inner tightening member 210 in addition to tightening the outer sheath 140 in a way that closes the gap 150 during a single installation. For example, in the configuration shown in Figure 8, a first latch mechanism 217 may be provided near the fixing shaft member 214. This allows the inner sheath 130 and heater section 133 to be fixed to the pipe P with better adhesion. Alternatively, a second latch mechanism 218 may be provided near the fastener 230. This allows the insulation material 160 to be fixed without compression. By providing the first latch mechanism 217 and the second latch mechanism 218 in this way, the adhesion between the inner sheath 130 and heater section 133 and the pipe P can be further improved, and the insulation material 160 can be fixed without compression, maximizing energy efficiency during fixing. Furthermore, since tightening is performed all at once during a single installation, work efficiency is improved, the time required for fixing is reduced, and the fixing work can be easily performed regardless of the worker's skill level. The configurations of the first latch mechanism 217 and the second latch mechanism 218 are arbitrary, and a fastening means such as Velcro may be used instead of the second latch mechanism 218.

[0058] <Specific examples of the shape of the internal fixing part and how to fasten it> Figures 9 to 11 are explanatory diagrams illustrating specific shapes of the inner fixing portion 210b and how to fasten them. As an example of the inner fixing portion 210b, as shown in Figure 9, it may have a configuration in which bulging portions 240 and constricted portions 242 are alternately formed in a string-like member. Furthermore, the fastener 230 for fixing the inner fixing portion 210b may have a hole 232 with a diameter smaller than the bulging portion 240, and the inner fixing portion 210b may be fixed at any position by pulling it so that it passes through the hole 23. In this configuration, the bulging portion 240 at a predetermined position can be marked in advance to easily fix it at the predetermined position.

[0059] Furthermore, as shown in Figure 10, an example of the inner fixing portion 210b may be a belt-shaped member with a tapered protrusion 244 formed only on one surface (in this case, the upper surface). The fastener 230 for fixing the inner fixing portion 210b may also have a receiving portion 246 that can fix the protrusion 244 at any position, thus providing a so-called latch structure for fixing. In this configuration, the protrusion 244 at a predetermined position can be marked in advance, making it easy to fix it in that position.

[0060] Furthermore, as shown in Figure 11, as an example of the internal fixing part 210b, belt holes 248 may be formed in a belt-shaped member, and a belt fastener may be used as the fastener 230, thus creating a so-called belt structure that can be fixed at any position.

[0061] <Effects and Effects of the Technology Disclosed in This Disclosure> As described above, the heater-integrated detachable cover 200 according to this embodiment includes an inner tightening member 210 that tightens on the inner circumference side close to the pipe P, and an outer tightening member 220 that tightens on the outer circumference side away from the pipe P. These inner tightening member 210 and outer tightening member 220 can tighten independently of each other by separate operations, and the degree of tightening can be adjusted independently. With this configuration, the inner tightening member 210 can tighten the inner skin portion 130 and the heater portion 133 to the pipe P in close contact, and the outer tightening member 220 can tighten without compressing the insulation material 160. This improves the heating performance for the pipe P and prevents a decrease in the insulation performance due to compression of the insulation material 160.

[0062] In the embodiments described above, the wafer processing apparatus 1 is shown and explained as a COR processing apparatus that performs COR processing on a wafer W, but the scope of application of this disclosure is not limited to this. That is, the technology of this disclosure is applicable to any substrate processing apparatus having piping, and can be applied, for example, when performing film deposition processing or etching processing on a wafer W in the wafer processing apparatus 1.

[0063] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the constituent elements of the embodiments described above can be combined in any way. Such any combination will naturally yield the functions and effects of each constituent element in the combination, as well as other functions and effects that will be apparent to those skilled in the art from the description herein.

[0064] Furthermore, the effects described herein are merely descriptive or illustrative and not limiting. In other words, the technology relating to this disclosure may produce other effects that are obvious to those skilled in the art from the description herein, in addition to or instead of the effects described herein. [Explanation of Symbols]

[0065] 1. Wafer processing equipment 200 Heater-integrated detachable cover 130 Endothelium 133 Heater section 140 Outer skin part 160 Insulation 210 Internal fastening member 220 External fastening member P piping W wafer

Claims

1. A removable cover with a built-in heater, which is attached to the piping of a circuit board processing apparatus that processes circuit boards, The pipe includes an inner shell portion positioned close to the outer surface of the pipe, and an outer shell portion positioned outside the inner shell portion so as to have a space inside. The space is provided with a heater unit positioned to cover the circumferential surface of the inner skin and an elastically deformable heat insulating material. An inner clamping member configured to integrally clamp the inner skin portion and the heater portion to the piping, A heater-integrated detachable cover comprising an outer tightening member configured to allow the outer sheath to be tightened against the pipe and fixed to the pipe.

2. With the pipe positioned to cover it, a gap is formed at least at one location in the circumferential direction. The aforementioned inner tightening member is configured to connect both ends on the inner side of the gap and to tighten in a direction that closes the gap. The heater-integrated detachable cover according to claim 1, wherein the outer tightening member is configured to connect both ends on the outer surface side of the gap and to tighten in a direction that closes the gap.

3. The inner tightening member includes a belt portion arranged to surround the circumferential surface of the inner skin portion, and an inner fixing portion configured to protrude outward from the gap portion. The heater-integrated detachable cover according to claim 2, wherein the inner fixing part is fixed to the outer circumferential surface of the outer shell and tightened.

4. A clip portion is provided at the tip of the aforementioned internal fixing portion. The heater-integrated detachable cover according to claim 3, wherein the clip portion is fixed to the outer circumferential surface of the outer shell portion and tightened.

5. A fixed shaft member is provided at at least one of the inner ends of both sides of the gap, A heater-integrated detachable cover according to claim 3 or 4, configured such that the internal fixing portion is fastened by passing it through the fixing shaft member.

6. A fixed shaft member is provided at least one of the inner surface ends and one of the outer surface ends of the gap. The heater-integrated detachable cover according to claim 5, wherein the inner fixing portion is routed through fixing shaft members at both ends of the inner surface and fixing shaft members at both ends of the outer surface, and the tightening of the inner skin portion and the heater portion and the tightening of the outer skin portion are performed in a single operation.

7. The aforementioned inner fixing portion has a string-like member in which bulging portions and constricted portions are formed alternately. A heater-integrated detachable cover according to claim 3, wherein a hole smaller in diameter than the bulging portion is formed in a fastener provided on the outer circumferential surface of the outer shell portion, and the inner fixing portion is passed through the hole and fixed and tightened.

8. The aforementioned inner fixing portion has a belt-shaped member in which a tapered convex portion is formed on only one side. A heater-integrated detachable cover according to claim 3, wherein a fastener provided on the outer circumferential surface of the outer shell has a receiving seat portion that can fix the protrusion at any position, and the protrusion is fixed to the receiving seat portion and tightened.

9. The aforementioned inner fixing portion is a belt-shaped member with belt holes formed therein. A heater-integrated detachable cover according to claim 3, wherein a belt fastener is used as a fastener provided on the outer circumferential surface of the outer shell to secure and tighten the inner fixing part.

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