Power converter

Abstract

This prevents or suppresses unintended displacement of the winding portion due to the molding pressure of the sealing resin, and also prevents the occurrence of short molds. [Solution] The power converter 1 comprises a primary side substrate 31 having a primary side mounting section 312 and a primary side winding section 311 on which primary side electronic components are mounted; a secondary side substrate 32 having a secondary side mounting section 322 and a secondary side winding section 321 on which secondary side electronic components are mounted, with the secondary side winding section 321 arranged coaxially with the primary side winding section 311; a first insulating member 361 and a second insulating member 362 arranged with the primary side winding section 311 in between and connected to each other; and a sealing resin that seals the primary side winding section 311, the secondary side winding section 321, the first insulating member 361 and the second insulating member 362. The first insulating member 361 and the second insulating member 362 have a plurality of ribs R1 and R3 on the surface facing the primary side winding section 311.

Description

Technical Field

[0001] The present invention relates to a power conversion device.

Background Art

[0002] The power conversion device disclosed in Patent Document 1 below includes a first substrate (primary substrate) provided with a first coil (primary winding part), a second substrate (secondary substrate) provided with a second coil (secondary winding part), a pair of insulating members that are coupled to each other while sandwiching the first winding part from both sides in the plate thickness direction of the primary substrate and supported by the primary substrate, and a core that constitutes a transformer together with the primary winding part, the secondary winding part, and the pair of insulating members.

[0003] The power conversion device disclosed in Patent Document 2 below includes a primary substrate having a primary mounting part on which primary electronic components are mounted and a primary coil (primary winding part), and a secondary substrate having a secondary mounting part on which secondary electronic components are mounted and a secondary winding part (secondary winding part). The primary winding part and the secondary winding part are arranged to face each other in the axial direction and are sealed with a sealing resin.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the power converter disclosed in Patent Document 1 mentioned above, the primary winding section, the secondary winding section, and the pair of insulating members may be sealed with sealing resin. Furthermore, enameled wire, conductor patterns, conductor plates, etc., can be used as the material for the primary winding section. Changing the material for the primary winding section changes the thickness and volume of the primary winding section, which in turn changes the spacing between the primary winding section and the pair of insulating members and the amount of sealing resin required. As a result, two problems may occur: (1) the primary winding section may be displaced from its normal position due to the molding pressure of the sealing resin, and (2) short molds may occur.

[0006] In consideration of the above facts, the present invention aims to provide a power conversion device that can prevent or suppress inadvertent displacement of the winding portion due to the molding pressure of the sealing resin, and the occurrence of short molds. [Means for solving the problem]

[0007] The power conversion device according to the present invention comprises a primary side substrate having a primary side mounting section and a primary side winding section on which primary side electronic components are mounted; a secondary side substrate having a secondary side mounting section and a secondary side winding section on which secondary side electronic components are mounted, wherein the secondary side winding section is arranged coaxially with the primary side winding section; a pair of insulating members arranged with one of the winding sections of the primary side winding section and the secondary side winding section sandwiched between them and coupled to each other; and a sealing resin that seals the primary side winding section, the secondary side winding section and the pair of insulating members, wherein at least one of the pair of insulating members has a plurality of protrusions on the surface facing the one winding section. [Effects of the Invention]

[0008] According to the present invention, if the thickness or volume of one of the winding portions is changed, the size and number of the multiple protrusions can be changed to prevent or suppress unintended displacement of one of the winding portions and the occurrence of short molds during molding of the sealing resin. [Brief explanation of the drawing]

[0009] [Figure 1] This is an exploded perspective view showing the overall configuration of the power conversion device according to the embodiment. [Figure 2] This is a cross-sectional view showing a partial configuration of a power conversion device according to an embodiment. [Figure 3] This is a cross-sectional view showing the cross-section along line III-III in Figure 2. [Figure 4] This is a block diagram showing the overall configuration of the power conversion device according to this embodiment. [Figure 5] This is a perspective view showing the main parts of the power conversion device according to the embodiment. [Figure 6] This is a perspective view showing the primary side substrate, secondary side substrate, and a pair of insulating members included in the power conversion device according to the embodiment. [Figure 7] This is a cross-sectional view showing the cross-section along the line VII-VII in Figure 6. [Figure 8] This is an exploded perspective view showing the primary side substrate, secondary side substrate, and a pair of insulating members included in the power conversion device according to the embodiment. [Figure 9] This is a perspective view showing the primary side substrate of a power conversion device according to an embodiment. [Figure 10] This is a perspective view showing the secondary side substrate of a power conversion device according to an embodiment. [Figure 11] This is a perspective view showing a bracket included in the power conversion device according to the embodiment. [Figure 12] This is a perspective view showing the control board included in the power conversion device according to this embodiment. [Figure 13] This is an explanatory diagram illustrating the types of primary and secondary substrates. [Figure 14] This is a circuit diagram showing a first example of a power conversion circuit included in a power conversion device according to an embodiment. [Figure 15] This is a circuit diagram showing a second example of a power conversion circuit included in a power conversion device according to the embodiment. [Figure 16] This is a circuit diagram showing a third example of a power conversion circuit included in a power conversion device according to the embodiment. [Figure 17] This is a perspective view showing the first insulating member of the power conversion device according to the embodiment. [Figure 18]It is a perspective view showing a first insulating member included in the power conversion device according to the embodiment. [Figure 19] It is a perspective view showing a second insulating member included in the power conversion device according to the embodiment. [Figure 20] It is a perspective view showing a second insulating member included in the power conversion device according to the embodiment. [Figure 21] It is an exploded perspective view showing a primary side substrate, a secondary side substrate, and a pair of insulating members included in a modified example of the power conversion device according to the embodiment. [Figure 22] It is a cross-sectional view showing a part of the power conversion device according to the comparative example. [Figure 23] It is a cross-sectional view showing a part of the power conversion device according to the embodiment. [Figure 24] It is a plan view showing a part of the power conversion device according to the comparative example.

Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 24. In the present embodiment, for convenience of explanation, the directions indicated by the arrows of up and down, left and right, and front and back appropriately marked in each figure are defined as the up and down direction, the left and right direction, and the front and back direction, and the positions and orientations of the components are described. Also, in each figure, some reference numerals may be omitted for easy viewing of the drawing. As shown in FIG. 1, the power conversion device 1 according to the present embodiment includes a case 2, a transformer 3, an input connector 4, a smoothing circuit section 5, an output connector 6, a control board 7, and a cover 8.

[0011] Case 2 is made of a material with high thermal conductivity, such as aluminum, and is formed in a plate shape with the thickness in the vertical direction. As shown in Figures 1 and 2, Case 2 has a mounting surface 20 facing upwards. The mounting surface 20 is provided with three mounting areas 21 to 23 for mounting the transformer 3. The first mounting area 21, the second mounting area 22, and the third mounting area 23 are arranged in this order from rear to front. The first mounting area 21 is a flat area at approximately the same height as the mounting surface 20. The second mounting area 22 is a flat area one step higher than the first mounting area 21. The third mounting area 23 is a flat area one step higher than the second mounting area 22. The first to third mounting areas 21 to 23 are arranged in a stepped manner, with the first mounting area 21 being the lowest, and the second mounting area 22 and the third mounting area 23 being one step higher in that order. The second mounting area 22 has a core mounting recess 24 for mounting the transformer core 34, which will be described later. The core mounting recess 24 is a recess that extends in the left-right direction, and extends to both the left and right ends of the second mounting area 22, opening in the left-right direction as well. The bottom surface of the core mounting recess 24 is a flat surface at approximately the same height as the mounting surface 20 and the first mounting area 21. Case 2 has the function of a heat sink that dissipates heat from the transformer 3 and other components mounted on the mounting surface 20 to cool them. Case 2 is an air-cooled heat sink that utilizes air convection, but it may also be a refrigerant-type heat sink that utilizes a cooling medium such as water.

[0012] In the first mounting area 21 of case 2, a cylindrical substrate support portion 212 is formed. The substrate support portion 212 is cylindrical and extends vertically, and a screw hole 211 is formed on its upper surface. The height of the upper surface of the substrate support portion 212 is approximately the same as that of the second mounting area 22. At the left end of the second mounting area 22, a screw hole 221 is formed in the area closer to the first mounting area 21 than the core mounting recess 24. The screw hole 211 of the substrate support portion 212 and the screw hole 221 of the second mounting area 22 are offset from each other in the front-rear direction. At the right end of the second mounting area 22, a convex projection 222 is formed in the area closer to the first mounting area 21 than the core mounting recess 24. In the third mounting area 23, two screw holes 231 (only one is shown in Figure 1) are formed spaced apart in the left-right direction. A convex projection 232 is formed at the left end of the third mounting area 23, in the area further from the core mounting recess 24 than the screw hole 231. Two screw holes 241 are formed on the upper surface of the case 2 on both sides in the left-right direction of the core mounting recess 24. The two screw holes 241 are offset from each other in the front-rear direction.

[0013] The transformer 3 comprises a primary substrate 31, a secondary substrate 32, a sealing resin 33, an insulating member 36, and a transformer core 34. In the following description, the thickness direction of the primary substrate 31 and the secondary substrate 32 will be described as the vertical direction.

[0014] As shown in Figures 1, 5 to 9, the primary side substrate 31 has a primary side winding section 311 provided on the front side of the substrate and a primary side mounting section 312 provided on the rear side of the substrate. The primary side winding section 311 and the primary side mounting section 312 are formed on a single substrate. The primary side winding section 311 has a primary side winding 3111 formed on it, consisting of a strip-shaped conductor pattern. The primary side winding 3111 has a coil formed in a spiral shape with one turn (one rotation) on the upper surface of the primary side winding section 311, and a coil of another spiral shape with one turn is formed on the lower surface of the primary side winding section 311, connected to that coil, resulting in a total of two turns of coil. The axial direction of the primary side winding 3111 coincides with the thickness direction of the substrate. The primary side winding 3111 has a configuration in which two layers of spiral-shaped one-turn coils are connected in the thickness direction of the substrate. The outer circumference end of the primary winding 3111 on the upper surface of the primary winding section 311 extends to the primary mounting section 312 and is connected to the conductor pattern 3125 (wiring pattern) formed on the primary mounting section 312. On the other hand, the inner circumference end of the primary winding 3111 on the upper surface of the primary winding section 311 is connected to the second layer coil in the thickness direction, and the end of this second layer coil extends to the primary mounting section 312 and is connected to the conductor pattern 3126 (wiring pattern) formed on the primary mounting section 312. The second layer coil of the primary winding 3111 may be formed in a spiral shape inside the primary winding section 311. Furthermore, by using a multilayer substrate with four or more layers as the primary substrate 31, the number of turns of the primary winding 3111 may be increased.

[0015] The primary winding portion 311 has a through hole 3112 that penetrates vertically through the inside of the primary winding 3111. The outer shape of the primary winding portion 311 is circular, matching the outer shape of the primary winding 3111 formed on the primary winding portion 311. The primary substrate 31 may have a primary winding portion made of a conductive plate instead of the primary winding portion 311 described above. In that case, the primary winding portion made of a conductive plate is joined to the substrate on which the primary mounting portion 312 is provided. In that case, the primary winding portion made of a conductive plate constitutes a part of the primary substrate 31. The primary substrate 31 may also have a primary winding portion made of an α winding instead of the primary winding portion 311 described above. In that case, the primary winding portion made of an α winding is joined to the substrate on which the primary mounting portion 312 is provided. In that case, the primary winding section, which consists of α-windings, will constitute a part of the primary substrate 31.

[0016] The primary side mounting section 312 is formed in the shape of a rectangular plate when viewed from above. The primary side winding section 311 is connected to the front side edge of the primary side mounting section 312 and is integrated with it. One FET module 3121 (primary side electronic component; not shown except in Figures 2, 14-16) is mounted on the lower surface of the primary side mounting section 312. The FET module 3121 has four FETs 3122 (electrolytic effect transistors) and a circuit board (see Figures 14-16) that constitute a bridge circuit as the primary side circuit, a rectangular parallelepiped-shaped sealing resin that houses these bridge circuits inside, and a plurality of connection terminals that are connected to the bridge circuits and extend to the outside of the sealing resin. The FET module 3121 is mounted on the lower surface of the primary side mounting section 312 by inserting the plurality of connection terminals through through holes formed in the primary side mounting section 312 from the lower side and soldering them. The FET module 3121, implemented in this manner, is connected to the primary winding 3111 via conductor patterns 3125 and 3126 (wiring patterns) formed on the primary mounting section 312 (see Figure 4), and converts the DC current input to the FET module 3121 into AC current, which is then output to the primary winding 3111.

[0017] Multiple connection pins 3123 are mounted on the upper surface of the primary side mounting section 312, extending upward for electrically connecting the primary side substrate 31 to the control board 7. Each of the multiple connection pins 3123 is connected to a wiring pattern formed on the primary side mounting section 312, and via this wiring pattern, is electrically connected to the FET module 3121 mounted on the primary side mounting section 312.

[0018] The primary mounting section 312 has two fixing holes 3124a that penetrate vertically through it. The two fixing holes 3124a are holes through which screws (not shown) for fixing the primary substrate 31 to the case 2 pass, and correspond to screw holes 211 and 221 formed in the first mounting area 21 and the second mounting area 22 of the case 2. The two fixing holes 3124a are located on the left and right ends of the primary mounting section 312, respectively. The positioning hole 3124b corresponds to the convex projection 222 formed in the second mounting area 22 and is located on the right front end of the primary mounting section 312.

[0019] As shown in Figures 1, 5-8, and 10, the secondary substrate 32 has a secondary winding section 321 provided on the rear side of the substrate and a secondary mounting section 322 provided on the front side of the substrate. The secondary winding section 321 is manufactured by press-forming a single conductor plate, and the secondary mounting section 322 is formed on the substrate. The secondary winding section 321 has a pair of winding sections 3211 and 3212, each consisting of one turn. The axial direction of the secondary winding section 321 coincides with the thickness direction of the plate. The pair of winding sections 3211 and 3212 have a roughly C-shape with the front side open when viewed from above. Circular openings 3213 and 3214 are formed in the center of the pair of winding sections 3211 and 3212 when viewed from above. The pair of winding sections 3211 and 3212 are arranged coaxially with an axial gap between them, and are connected in series by connecting one end of each section in the circumferential direction. A first lead section 3215 extends from the other circumferential end of one (upper) winding section 3211, and a second lead section 3216 extends from the other (lower) winding section 3212. The ends of the pair of winding sections 3211 and 3212 opposite to the first lead section 3215 and the second lead section 3216 are connected in series. A third lead section 3218 extends from near this connection point. The first lead section 3215, the second lead section 3216, and the third lead section 3218 each extend to the secondary side mounting section 322 and are connected to the wiring pattern (not shown) formed on the secondary side mounting section 322. The first lead portion 3215, the second lead portion 3216, and the third lead portion 3218 all correspond to the "lead portion" in the present invention. The secondary winding portion 321 may consist of a conductor pattern formed on a substrate. In that case, the secondary winding portion 321 and the secondary mounting portion 322 may be formed on a single substrate. Alternatively, the secondary substrate 32 may have a secondary winding portion consisting of an α-winding instead of the secondary winding portion 321 described above. In that case, the secondary winding portion consisting of an α-winding is joined to the substrate on which the secondary mounting portion 322 is provided. In that case, the secondary winding portion consisting of an α-winding constitutes a part of the secondary substrate 32. The secondary winding portion 321 will be described in detail later.

[0020] The secondary mounting section 322 is formed in a rectangular plate shape when viewed from above. The first lead portion 3215 and the second lead portion 3216 of the secondary winding section 321 are connected to the rear end side of the upper surface of the secondary mounting section 322, so that the secondary winding section 321 and the secondary mounting section 322 are connected and integrated. Two FETs 3221 (electrolytic effect transistors; secondary electronic components) are mounted on the upper surface of the secondary mounting section 322. The FETs 3221 are connected to wiring patterns formed on the secondary mounting section 322, and together with these wiring patterns they constitute a secondary circuit (bridge circuit). This secondary circuit is connected to the secondary winding section 3211.

[0021] Multiple connection pins 3223 are mounted on the upper surface of the secondary side mounting section 322, extending upward for electrically connecting the secondary side substrate 32 to the control board 7. The ends of the winding sections 3211 and 3212 of the multiple connection pins 3223, opposite to the first lead section 3215 and the second lead section 3216, are connected in series with each other. A third lead section 3218 extends from near this connection section. The first lead section 3215, the second lead section 3216, and the third lead section 3218 are each connected to a wiring pattern formed on the secondary side mounting section 322, and are electrically connected to the FET 3221 mounted on the secondary side mounting section 322 via this wiring pattern.

[0022] The secondary mounting section 322 has three fixing holes 3224a and one positioning hole 3224b that penetrate the secondary mounting section 322 vertically. The three fixing holes 3224a are holes through which screws (not shown) for fixing the secondary substrate 32 to the case 2 pass, and correspond to three screw holes 231 formed in the third mounting area 23 of the case 2. The three fixing holes 3224a are spaced apart in the left-right direction. The positioning hole 3224b corresponds to a convex projection 232 formed in the third mounting area 23 and is located at the left end of the primary mounting section 312. The secondary mounting section 322 also has one connection hole 3225 that penetrates the secondary mounting section 322 vertically. The connection hole 3225 is formed on the secondary mounting section 322 on the side opposite to the secondary winding section 321. The connection holes 3225 are for fixing busbars (not shown) by screws or the like, to electrically connect the wiring pattern (secondary circuit) formed on the secondary mounting section 322 to the smoothing circuit section 5.

[0023] As shown in Figures 2, 3, and 6-8, the insulating member 36 is composed of a first insulating member 361 and a second insulating member 362. The first insulating member 361 and the second insulating member 362 correspond to the "pair of insulating members" in the present invention. The first insulating member 361 and the second insulating member 362 are made of a material having electrical insulating properties. In particular, the first insulating member 331 and the second insulating member 332 are, for example, made of a resin to which a thermally conductive filler having insulating and thermal conductive properties has been added. Examples of thermally conductive fillers include aluminum oxide, silicon oxide, magnesium oxide, boron nitride, and aluminum nitride.

[0024] As shown in Figures 17 and 18, the first insulating member 361 has a main body portion 3611 that is formed in a substantially disc shape with the vertical direction being the thickness direction. A circular through hole 3612 is formed in the center of the main body portion 3611. A peripheral wall portion 3613 that protrudes upward is formed at the rear edge of the main body portion 3611. The peripheral wall portion 3613 has a curved arc shape that is convex towards the rear when viewed from the vertical direction. Projections 3615 that protrude upward are formed at both the left and right ends of the peripheral wall portion 3613. A boss portion 3614 that protrudes upward is formed at the edge of the through hole 3612 in the main body portion 3611. The boss portion 3614 has a cylindrical shape with the vertical direction being the axial direction.

[0025] A locking portion 3616 extends forward from the left and right center of the front end of the main body portion 3611. The front part of the locking portion 3616 is bent upward and fits into a slit-shaped elongated hole 3127 (see Figure 9) formed in the primary mounting portion 312 of the primary substrate 31. An elastically deformable claw N1 is provided on the front part of the locking portion 3616, and this claw N1 hooks onto the edge of the elongated hole 3127.

[0026] From both the left and right ends of the front end of the main body 3611, substrate retaining portions 3617 extend forward. The left and right substrate retaining portions 3617 each have an inner portion IP that extends forward and downward from both the left and right ends of the front end of the main body 3611, and an outer portion OP that extends outward in the left-right direction from the lower end of the inner portion IP, and then extends upward and rearward. The outer portion OP extends upward from the main body 3611. The outer portions OP of the left and right substrate retaining portions 3617 are inserted into two left and right notches 3128 (see Figure 9) formed on the rear edge of the primary side mounting portion 312. The upper end of the outer portion OP is provided with a claw N2 that protrudes towards the center in the left-right direction, and these claws N2 hook onto the edge of the notch 3128. On the rear side of the outer portion OP of the left and right substrate holding portions 3617, protruding portions 3618 are formed on both the left and right ends of the front end of the main body portion 3611, projecting upward. The left and right protruding portions 3618 are in contact with or close to the rear edge of the primary side mounting portion 312.

[0027] Multiple (eight in this case) ribs R1 are formed on the upper surface of the main body 3611. The eight ribs R1 are arranged in the circumferential direction of the main body 3611 and are positioned around the boss portion 3614. The eight ribs R1 protrude upward from the main body 3611 and have an elongated shape with the radial direction of the main body 3611 as their longitudinal side. Multiple (seven in this case) ribs R2 are formed on the lower surface of the main body 3611. The seven ribs R2 are arranged in the circumferential direction of the main body 3611 and are positioned around the through hole 3612. The seven ribs R2 protrude downward from the main body 3611 and have an elongated shape with the radial direction of the main body 3611 as their longitudinal side. These ribs R2 are not formed in the left-right center of the front part of the lower surface of the main body 3611. In addition, two winding engagement portions 3619 are formed on the upper surface of the main body 3611, one on the left and one on the right. The two left and right winding engagement portions 3619 extend in the front-rear direction at both left and right ends of the upper surface of the main body portion 3611, and also extend towards the center in the left-right direction at the front end of the upper surface of the main body portion 3611.

[0028] As shown in Figures 19 and 20, the second insulating member 362 has a disc-shaped main body portion 3621 with the vertical direction being the thickness direction. A circular through hole 3622 is formed in the center of the main body portion 3621. A peripheral wall portion 3623 that protrudes downward is formed on the rear edge of the main body portion 3621. The peripheral wall portion 3623 has a curved arc shape that is convex towards the front when viewed from the vertical direction. A boss portion 3624 that protrudes downward is formed on the edge of the through hole 3622 in the main body portion 3621. The boss portion 3624 has a ring shape with the vertical direction being the axial direction.

[0029] Multiple (eight in this case) ribs R3 are formed on the lower surface of the main body 3621. The eight ribs R3 are arranged in the circumferential direction of the main body 3621 and around the boss portion 3624. The eight ribs R3 protrude downward from the main body 3621 and have an elongated shape with the radial direction of the main body 3621 as their longitudinal side. Multiple (eight in this case) ribs R4 are formed on the upper surface of the main body 3621. The eight ribs R4 are arranged in the circumferential direction of the main body 3621 and around the through hole 3622. The eight ribs R4 protrude upward from the main body 3621 and have an elongated shape with the radial direction of the main body 3621 as their longitudinal side. The above-mentioned ribs R1 and R3 correspond to the "protrusions" in this invention. In addition, multiple (three in this case) winding engagement portions 3625 are provided on the upper surface of the main body 3621. The three winding engagement portions 3625 are formed on the left end, right end, and rear end of the upper surface of the main body portion 3621. The three winding engagement portions 3625 protrude upward from the main body portion 3621 and have an elongated shape with the circumferential direction of the main body portion 3621 as their longitudinal side.

[0030] The first insulating member 361 and the second insulating member 362 in the above configuration are joined to each other and mounted on the primary side substrate 31, sandwiching the primary side winding portion 311 of the primary side substrate 31 from both sides in the thickness direction. The manufacturing method of the transformer 3 will be described below, including the method of attaching the first insulating member 361 and the second insulating member 362 to the primary side substrate 31.

[0031] When the transformer 3 is assembled, the first insulating member 361 and the second insulating member 362 are first attached to the primary side circuit board 31. During this attachment, the first insulating member 361 is approached from below to the primary side winding section 311, and the lower surface of the primary side winding section 311 engages with (contacts or is in close proximity to) the eight ribs R1 of the first insulating member 361. At this time, the boss portion 3614 of the first insulating member 361 is fitted into the through hole 3112 of the primary side winding section 311, and the primary side winding section 311 is covered from the rear by the peripheral wall portion 3613 of the first insulating member 361. In this case, the locking portion 3616 of the first insulating member 361 is inserted into the elongated hole 3127 of the primary mounting portion 312, the claws N1 of the locking portion 3616 catch on the edge of the elongated hole 3127, and the claws N2 of the outer portions OP of the left and right substrate holding portions 3617 catch on the edge of the notch 3128 of the primary mounting portion 312.

[0032] Furthermore, during the above installation, the second insulating member 362 approaches the primary winding portion 311 from above, and the upper surface of the primary winding portion 311 engages with (contacts or is in close proximity to) the eight ribs R3 of the second insulating member 362. At this time, the boss portion 3614 of the first insulating member 361 is fitted into the through hole 3622 of the second insulating member 362, and the peripheral wall portion 3613 of the first insulating member 361 engages with the front side of the peripheral wall portion 3623 of the second insulating member 362. In this state, the primary winding portion 311 is sandwiched vertically between the first insulating member 361 and the second insulating member 362. This completes the installation of the insulating member 36 to the primary substrate 31.

[0033] The secondary side board 32 is assembled to the primary side board 31 on which the insulating member 36 is attached. During this assembly, the primary side board 31 and the secondary side board 32 are brought closer to each other along the front-to-back direction. As a result, the primary side winding section 311, the main body 3611 of the first insulating member 361, and the main body 3621 of the second insulating member 362 are inserted between the pair of winding sections 3211 and 3212 of the secondary side winding section 321. In this state, the lower winding section 3212 engages with (contacts or faces in close proximity to) the three winding engagement sections 3625 of the first insulating member 361, and the upper winding section 3211 engages with (contacts or faces in close proximity to) the two winding engagement sections 3619 of the second insulating member 362. As a result, the pair of winding sections 3211 and 3212 are arranged concentrically with respect to the primary winding section 311, the main body 3611 of the first insulating member 361, and the main body 3621 of the second insulating member 362. In this state, the upper surface of the lower winding section 3212 engages with (contacts or is in close proximity to) the seven ribs R2 of the first insulating member 361, and the lower surface of the upper winding section 3211 engages with (contacts or is in close proximity to) the eight ribs R4 of the second insulating member 362. By attaching the secondary substrate 32 to the primary substrate assembly 35 in this way, it becomes a single assembly consisting of the primary substrate 31, the secondary substrate 32, and the insulating member 36.

[0034] Next, the sealing resin 33 is molded. As shown in Figures 1 to 3 and Figures 5 to 7, the sealing resin 33 seals the primary coil 311 of the primary substrate 31, the secondary winding portion 321 of the secondary substrate 32, and the insulating member 36. This sealing resin 33 is a molded resin formed, for example, by transfer molding, and is made of a material that has electrical insulating properties. The resin constituting the sealing resin 33 is, as an example, a resin to which a thermally conductive filler having insulating and thermal conductive properties has been added. Examples of thermally conductive fillers include aluminum oxide, silicon oxide, magnesium oxide, boron nitride, and aluminum nitride.

[0035] The sealing resin 33 covers the entire primary winding section 311, the secondary winding section 321, and the insulating member 36. As described above, the secondary winding section 321 integrally includes a pair of winding sections 3211 and 3212 and a plurality of lead sections 3215, 3216, and 3218 connected to the secondary mounting section 322. The sealing resin 33 covers the pair of winding sections 3211 and 3212 and the lead sections 3215, 3216, and 3218. A circular through hole 336 is formed in the center of the sealing resin 33.

[0036] In the primary mounting section 312, a portion of the primary winding section 311 is embedded in the sealing resin 33, and in the secondary mounting section 322, a portion of the secondary winding section 321 is embedded in the sealing resin 33. In the primary mounting section 312 and the secondary mounting section 322, no electronic components are mounted in the areas near the sealing resin 33. These areas are in contact with the mold for transfer molding. The mounting of electronic components to the primary mounting section 312 and the secondary mounting section 322 is performed before the transfer molding of the sealing resin 33. This makes, for example, the soldering of electronic components easier. When the sealing resin 33 is molded, the primary substrate 31, the secondary substrate 32, and the insulating member 36 are integrated via the sealing resin 33. As a result, the primary substrate 31, the secondary substrate 32, the insulating member 36, and the sealing resin 33 are assembled together to form the substrate assembly 35.

[0037] The transformer core 34 has an E-shaped first core member 341 made of a magnetic material and an I-shaped second core member 342 made of a magnetic material. The first core member 341 has a flat plate-shaped base portion 3411 with the vertical direction being the thickness direction, a cylindrical insertion portion 3412 extending downward from the center of the lower surface of the base portion 3411, and two wall portions 3413 extending downward from the left and right ends of the base portion 3411, respectively. The second core member 342 is formed in a flat plate shape with the vertical direction being the thickness direction. The transformer core 34 is constructed by combining the lower surface of the insertion portion 3412 and the lower surfaces of the left and right wall portions 3413 of the first core member 341 with the upper surface of the second core member 342 in surface contact.

[0038] This transformer core 34 is assembled to the substrate assembly 35 to form the transformer 3. Specifically, as described above, the insertion portion 3412 of the first core member 341 is inserted through the concentrically arranged through holes 3112 and openings 3213, 3214, and the left and right wall portions 3413 of the first core member 341 are positioned on the left and right sides of the primary winding portion 311, the secondary winding portion 321, and the sealing resin 33, respectively. The lower surface of the insertion portion 3412 and the lower surfaces of the left and right wall portions 3413 of the first core member 341 are in surface contact with the upper surface of the second core member 342. This completes the assembly of the transformer core 34 to the substrate assembly 35.

[0039] In the transformer 3 configured in this way, as shown in Figures 1 to 3, the second core member 342 of the transformer core 34 is inserted from above into the core mounting recess 24 of the case 2 and placed thereon. The thickness of the second core member 342 is approximately the same as the depth of the core mounting recess 24, so that the upper surface of the second core member 342 placed in the core mounting recess 24 is flush with the upper surface of the second mounting area 22 of the case 2. The front and rear ends of the second core member 342 are each constricted inward, and correspondingly the front and rear walls of the core mounting recess 24 are convex inward. The engagement of these convex and concave parts restricts the lateral movement of the second core member 342 placed in the core mounting recess 24.

[0040] The primary side substrate 31 is placed on the mounting surface 20 of the case 2 such that the lower surface of the FET module 3121 (not shown except in Figures 2, 14 to 16), which is mounted on the lower surface of the primary side mounting section 312, makes surface contact with the first mounting area 21 of the case 2. The upper surfaces of the two substrate support sections 212 formed on the first mounting area 21 make surface contact with the lower surface of the primary side mounting section 312, and the primary side substrate 31 is also supported by the two substrate support sections 212. The primary side substrate 31, thus mounted, is fixed to the case 2 by inserting the convex projection 222 of the second mounting area 22 into the positioning hole 3214b, and screwing screws inserted from above into the two fixing holes 3124a, respectively, into the screw holes 211 and 221 of the first mounting area 21 and the second mounting area 22.

[0041] The secondary substrate 32 is placed on the mounting surface 20 of the case 2 such that the lower surface of the secondary mounting portion 322 is in surface contact with the third mounting area 23 of the case 2. The secondary substrate 32, placed in this manner, is fixed to the case 2 by inserting the convex projection 232 of the third mounting area 23 into the positioning hole 3224b, and screwing screws inserted from above into the two fixing holes 3224a into the two screw holes 231 of the third mounting area 23.

[0042] After the transformer 3 is placed on the case 2, the transformer core 34 is fixed to the case 2 by the bracket 9 shown in Figure 11. The bracket 9 is formed by bending a metal plate member and has a rectangular base portion 91, left and right side wall portions 92 extending downward from the left and right ends of the base portion 91, left and right fixing portions 93 extending outward in the left and right direction from the lower ends of the left and right side wall portions 92, and two core pressing portions 94 provided on the inside of the base portion 91. The left and right fixing portions 93 are offset from each other in the front-rear direction. Screw insertion holes 931 that penetrate in the vertical direction are formed in the left and right fixing portions 93.

[0043] Each of the two core pressing portions 94 is formed by cutting out a U-shape from the base portion 91, and is plate-shaped, extending diagonally downward from the center of the base portion 91 in the left-right direction. The two core pressing portions 94 are leaf springs that can elastically deform in the vertical direction with their base ends connected to the base portion 91 as a fulcrum.

[0044] After the transformer 3 is placed on the case 2 as described above, the bracket 9 is placed on the first core member 341 such that the lower surfaces of the left and right fixing portions 93 of the bracket 9 make surface contact with the upper surface of the case 2 on both sides in the left-right direction of the core mounting recess 24, and the screw insertion holes 931 of the left and right fixing portions 93 communicate with the two left and right screw holes 241 formed in the case 2. The bracket 9, placed in this manner, is fixed to the case 2 by screwing screws inserted from above into the left and right screw insertion holes 931 into the two screw holes 221 of the case 2.

[0045] When the bracket 9 is fixed to the case 2, the base portion 91 is positioned above the transformer core 34, and the tips of the two core pressing portions 94 are pressed against the upper surface of the first core member 341, causing the two core pressing portions 94 to elastically deform. The elastic force of these two core pressing portions 94 presses the first core member 341 against the second core member 342, and the second core member 342 is pressed against the core mounting recess 24 of the case 2, thereby fixing the transformer core 34 to the case 2.

[0046] In the transformer 3 fixed to case 2 as shown in Figures 1 to 3, the primary mounting portion 312 of the primary substrate 31 is positioned above the first mounting area 21 of case 2. The lower surface of the FET module 3121 mounted on the lower surface of the primary mounting portion 312 is in surface contact with the first mounting area 21. Above the second mounting area 22 of case 2, a sealing resin 33 is positioned to seal the primary winding portion 311 and the secondary winding portion 321. The lower surface of the sealing resin 33 is in surface contact with the second mounting area 22 via an insulating sheet (not shown). Above the third mounting area 23 of case 2, the secondary mounting portion 322 of the secondary substrate 32 is positioned. The lower surface of the secondary mounting portion 322 is in surface contact with the third mounting area 23 via an insulating sheet (not shown). Note that instead of the insulating sheet, a thermally conductive sheet or thermally conductive grease may be used.

[0047] As shown in Figure 1, the input connector 4 has a housing 41 with a connection opening and a plurality of connection terminals 42 provided inside the housing 41. The input connector 4 is inserted through a through hole in the rear wall of the case 2 from the inside of the case 2 and is provided near the first mounting area 21 where the primary side mounting portion 312 of the primary side substrate 31 is located. In the input connector 4 attached to the case 2, the ends of the plurality of connection terminals 42 protrude from the housing 41 and extend inward (forward) of the case 2, and their tip ends are further bent upward and extend. These tip ends of the plurality of connection terminals 42 are connected to the control board 7.

[0048] The smoothing circuit section 5 includes an output-side choke coil 51 and an output-side capacitor 52. The smoothing circuit section 5 is provided on the front end side of the mounting surface 20 of the case 2. The output-side choke coil 51 is electrically connected to the secondary circuit of the secondary circuit board 32 via a busbar (not shown) fixed using a connection hole 3225 in the secondary mounting section 322 of the secondary circuit board 32. The smoothing circuit section 5 is designed to smooth the waveform of the current output from the secondary circuit of the secondary circuit board 32. The output connector 6 is provided so as to extend forward from the front end of the case 2 and is electrically connected to the smoothing circuit section 5 (see Figure 4).

[0049] As shown in Figures 1, 2, and 12, the control board 7 is formed in a plate shape with the vertical direction being the thickness direction. Multiple control electronic components 71 are mounted on the lower surface 70 of the control board 7. The multiple control electronic components 71 constitute a control circuit that controls the operation of the FET module 3121 mounted on the primary side board 31 and the two FETs 3221 mounted on the secondary side board 32. The control board 7 is positioned above the mounting surface 20 and the transformer 3 located on the mounting surface 20, such that the lower surface 70 of the control board 7 faces the mounting surface 20 of the case 2. Multiple connection pins 3123 provided on the primary side mounting portion 312 of the primary side board 31, multiple connection pins 3223 provided on the secondary side mounting portion 322 of the secondary side board 32, and multiple connection terminals 42 (not shown except in Figure 1) of the input connector 4 are connected to the control board 7 positioned above the transformer 3. These connections electrically connect the input connector 4, the control board 7, the primary side board 31, and the secondary side board 32. Multiple control electronic components 71 are mounted on the lower surface 70 of the control board 7, excluding the area 701 facing the transformer 3. This allows for a small gap between the mounting surface 20 of the case 2 and the transformer 3 and the control board 7, thereby enabling a thinner power converter 1.

[0050] As shown in Figures 1 and 2, the cover 8 is formed in a box shape with an opening at the bottom. The cover 8 can be mounted on the case 2 so as to cover the mounting surface 20 of the case 2, the transformer 3 and smoothing circuit section 5 located on the mounting surface 20, and the control board 7 located above the mounting surface 20 and the transformer 3. A notch 81 is formed in the rear wall of the cover 8 to prevent interference with the input connector 4 when the cover 8 is mounted on the case 2. Similarly, a notch (not shown) is formed in the front wall of the cover 8 to prevent interference with the output connector 6.

[0051] As shown in Figure 4, in the power converter 1, a DC current of a predetermined voltage is input from the input connector 4 through the control board 7 to the FET module 3121 on the primary side board 31, where it is converted to AC current and output to the primary side winding 3111. When AC current flows through the primary side winding 3111, AC current flows through the secondary side winding section 321 due to electromagnetic induction. Because the number of turns in the primary side winding 3111 and the secondary side winding section 321 are different, the voltage of the AC current flowing through the secondary side winding section 3211 is different from the voltage of the AC current flowing through the primary side winding 3111. For example, if the number of turns in the secondary side winding section 321 is less than the number of turns in the primary side winding 3111, the voltage of the AC current flowing through the secondary side winding section 321 will be lower than the voltage of the AC current flowing through the primary side winding 3111. The alternating current flowing through the secondary winding section 321 is converted to a direct current by the FET 3221 on the secondary circuit board 32, and the waveform of this direct current is smoothed by the smoothing circuit section 5. The voltage of the smoothed direct current is different from the voltage of the direct current input from the input connector 4. The smoothed direct current is output to the outside from the output connector 6.

[0052] As described above, when the power converter 1 operates, the primary winding 3111 of the primary substrate 31, the FET module 3121, the secondary winding section 321 of the secondary substrate 32, the FET 3221, and the transformer core 34 generate heat, but this heat can be dissipated to the case 2 on which the transformer 3 is mounted. In particular, because the sealing resin 33 has thermal conductivity, it can transfer the heat generated by the upper winding section 3211 of the secondary winding section 321 and the primary winding 3111 to the case 2. Moreover, since the FET module 3121 is in direct surface contact with the first mounting area 21 without going through the primary mounting section 312, the heat from the FET module 3121 can be efficiently dissipated to the case 2.

[0053] In the power converter 1, the primary side board 31 and secondary side board 32 of the transformer 3 can be selected and changed from multiple types of primary and secondary side boards that differ in the number of coil turns, mounted components, etc. These selections and changes are made according to the required specifications such as input voltage and output voltage, making the power converter 1 capable of handling various specifications. As illustrated in Figure 13, the primary side board can be appropriately selected from multiple types of primary side boards in addition to the primary side board 31 described above. The four types of primary side boards shown in Figure 13 have the same external shape and dimensions, and the FET module 3121 is mounted on the same board, but the configuration of the primary side coil formed in the primary side winding section 311 is different.

[0054] The primary winding 3111-1 of the first primary substrate 31-1 has a coil formed in a spiral shape with 2 turns (2 rotations) on the upper surface of the primary winding section 311, and a further coil of 2 turns in a spiral shape is formed on the lower surface of the primary winding section 311 connected to that coil, resulting in a total of 4 turns of coil. The primary winding 3111-2 of the second primary substrate 31-2 has a coil formed in a spiral shape with 2 turns (2 rotations) on the upper surface of the primary winding section 311, and a further coil of 2 turns in a spiral shape is formed in 3 layers on the inside and bottom surface of the primary winding section 311 connected to that coil, resulting in a total of 8 turns of coil. The primary winding 3111-2 is constructed by connecting 4 layers of spiral 2-turn coils in the thickness direction of the board. The primary winding 3111-3 of the third primary substrate 31-3 has a 3-turn coil formed in a spiral pattern on the upper surface of the primary winding section 311, and connected to this coil, two 2-turn coils and one 3-turn coil are further formed in a spiral pattern in three layers on the inside and bottom surface of the primary winding section 311, resulting in a total of 10 turns of coil. The primary winding 3111-3 is formed by connecting two 3-turn coils and two 2-turn coils in a spiral pattern in four layers in the thickness direction of the board. The primary winding 3111-4 of the fourth primary substrate 31-4 has a 4-turn coil formed in a spiral pattern on the upper surface of the primary winding section 311, and connected to this coil, three 3-turn coils are further formed in a spiral pattern in three layers on the inside and bottom surface of the primary winding section 311, resulting in a total of 13 turns of coil. The primary winding 3111-4 is formed by connecting four layers in the thickness direction of the sheet, consisting of a spiral-shaped 4-turn coil and three 3-turn coils.

[0055] The secondary circuit board can be selected from several types of secondary circuit boards, in addition to the secondary circuit board 32 described above. The four types of secondary circuit boards shown in Figure 13 have the same external shape and dimensions, but differ in the configuration of the secondary winding section 321 and the types of electronic components mounted on the secondary mounting section 322. The first secondary circuit board 32-1 has a 2-turn secondary winding section, similar to the secondary circuit board 32 described above, and two FETs 3221 and two diodes 3222 (secondary electronic components) are mounted on the upper surface of the secondary mounting section 322. The two FETs 3221 and the two diodes 3222 are each connected to a wiring pattern formed on the secondary mounting section 322, and together with these wiring patterns, they constitute a secondary circuit (bridge circuit). This secondary circuit is connected to the secondary winding section 3211 and is a rectifier circuit that converts the AC current flowing through the secondary winding section 3211 into DC current.

[0056] The second secondary circuit board 32-2 differs from the secondary circuit board 32-1 described above only in the configuration of the secondary winding section 321. In the secondary winding section 321-2 of the second secondary circuit board 32-2, a pair of winding sections 3211 and 3212 are connected in parallel to each other, forming a coil with a total of one turn. With this one-turn configuration, the output voltage of the second secondary circuit board 32-2 can be halved compared to the two-turn configuration of the first secondary circuit board 32-1. Furthermore, the second secondary circuit board 32-2, like the first secondary circuit board 32-1, can handle a wide range of input voltages and ensure high safety.

[0057] The third secondary circuit board 32-3 differs from the secondary circuit board 32-2 described above only in the types of electronic components mounted on the secondary mounting section 322. Four FETs 3221 are mounted on the upper surface of the secondary mounting section 322 of the third secondary circuit board 32-3. As shown in Figure 15, these four FETs 3221 constitute a bridge circuit as the secondary circuit. The four FETs 3221 are used as rectifier elements for both the low-side and high-side of the bridge circuit. In the third secondary circuit board 32-3, the secondary circuit is a synchronous rectification type circuit using only FETs 3221, so higher efficiency can be achieved than in the first and second secondary circuit boards 32-1 and 32-2. Furthermore, because the secondary circuit is a synchronous rectification type circuit, a bidirectional transformer can be configured with the secondary side as the input and the primary side as the output.

[0058] In the fourth secondary circuit board 32-4, as shown in Figures 13 and 16, the secondary circuit configured in the secondary mounting section 322 is a center-tapped circuit. In the secondary winding section 321-1 of the fourth secondary circuit board 32-4, a pair of winding sections 3211 and 3212 are connected in series with each other. A third lead section 3218 extends from the vicinity of this connection. The first output terminal 3228 of the secondary circuit is electrically connected to the third lead section 3218. The second output terminal 3229 of the secondary circuit is electrically connected to both ends of the series-connected pair of winding sections 3211 and 3212, i.e., the first lead section 3215 and the second lead section 3216. Between the first lead section 3215 and the second lead section 3216 and the second output terminal 3229, an FET unit is provided, each consisting of two FETs 3221 connected in parallel. The fourth secondary circuit board 32-4 can reduce power loss in the secondary circuit, thereby achieving higher efficiency and enabling support for high current output. Furthermore, the fourth secondary circuit board 32-4 can reduce the number of FETs 3221 in each FET unit to one, and the FETs 3221 in the secondary circuit can be replaced with diodes, thus reducing the manufacturing cost of the fourth secondary circuit board 32-4.

[0059] Next, the operation and effects of this embodiment will be described. In the power converter 1 according to this embodiment, the DC current input to the input connector 4 is converted into a DC current of a different voltage in the transformer 3. The converted DC current is smoothed in the smoothing circuit 5 and output to the outside from the output connector 6. The transformer 3 is composed of a primary side substrate 31, a secondary side substrate 32, an insulating member 36, a sealing resin 33, and a transformer core 34.

[0060] The primary side substrate 31 has a primary side mounting section 312 on which primary side electronic components are mounted, and a primary side winding section 311. The secondary side substrate 32 has a secondary side mounting section 322 on which secondary side electronic components are mounted, and a secondary side winding section 321, with the secondary side winding section 321 arranged coaxially with the primary side winding section 311. The insulating member 36 has a first insulating member 361 and a second insulating member 362 that are arranged with the primary side winding section 311 in between and are connected to each other. The sealing resin 33 seals the primary side winding section 311, the secondary side winding section 321, and the insulating member 36.

[0061] The first insulating member 361 and the second insulating member 362 have multiple ribs R1 and R3 on the surface facing the primary winding portion 311. This makes it possible to prevent unintentional displacement of the primary winding portion 311 and the occurrence of short molds during molding of the sealing resin 33 by changing the size and number of the multiple ribs R1 and R3, even if the thickness or volume of the primary winding portion 311 is changed.

[0062] In other words, in this embodiment, the primary winding portion 311 of the primary substrate 31 can be made not only of a substrate with a conductor pattern formed on it, but also of an enamel wire coil EC as shown in Figure 21, or of a conductor plate. By changing the material of the primary winding portion 311 in this way, if the thickness or volume of the primary winding portion 311 is reduced, the molding pressure during the transfer molding of the sealing resin 33 will push the primary winding portion 311 downward from its normal position (see the dashed line in Figure 22) (see the primary winding portion 311 shown by the solid line in Figure 22). In this embodiment, however, the downward pushing of the primary winding portion 311 as described above can be prevented by the rib R1 of the first insulating member 361 (see Figure 23).

[0063] Furthermore, if the volume of the primary winding section 311 becomes smaller, the required amount of sealing resin 33 will be insufficient, resulting in a short mold as shown in Figure 24. In this embodiment, however, the occurrence of such a short mold can be prevented by changing the size and number of ribs R1 and R3 to compensate for the volume difference of the primary winding section 311.

[0064] Furthermore, since the first insulating member 361 and the second insulating member 362 have multiple ribs R1, R2, R3, and R4 (protrusions) formed on them with their longitudinal direction in the radial direction of the primary winding portion 311 and the secondary winding portion 321, the movement of the primary substrate 31 during transfer molding can be suppressed over a wide range along the radial direction of the primary winding portion 311.

[0065] Furthermore, since the first insulating member 361 and the second insulating member 362 have multiple protrusions, which are multiple ribs R1, R2, R3, and R4, arranged in the circumferential direction of the primary winding portion 311 and the secondary winding portion 321, the movement of the primary substrate 31 and the secondary substrate 32 during transfer molding can be suppressed over a wide area along the circumferential direction of each winding portion 311 and 321.

[0066] Furthermore, since the resin constituting the sealing resin 33 and the resin constituting the insulating member 36 have thermal conductivity, and the sealing resin 33 adheres tightly to the primary winding 3111, the secondary winding section 321, and the insulating member 36 without any gaps, the heat generated by the primary winding 3111 and the secondary winding section 321 when the power converter 1 is operating can be effectively transferred to the case 2 and dissipated.

[0067] Furthermore, since the insulating member 36 is attached to the primary side substrate 31 and assembled, the primary side substrate 31 and the insulating member 36 can be treated as a single component, making manufacturing management easier.

[0068] Furthermore, in this embodiment, the primary substrate 31, the secondary substrate 32, and the insulating member 36 are integrated by a sealing resin 33 and assembled as a substrate assembly 35. Therefore, the primary substrate 31, the secondary substrate 32, the insulating member 36, and the sealing resin 33 can be treated as a single component, making manufacturing management easier.

[0069] In the above embodiment, the first insulating member 361 and the second insulating member 362 are configured such that multiple ribs R1, R2, R3, and R4, which are protrusions, are formed along the radial direction of each winding portion 311 and 321 and are arranged in the circumferential direction of each winding portion 311 and 321. However, the embodiment is not limited to this configuration. The shape, arrangement, number, etc., of the protrusions can be changed as appropriate.

[0070] Furthermore, in the above embodiment, the first insulating member 361 and the second insulating member 362 are arranged with the primary winding portion 311 in between, but the configuration is not limited to this, and the first insulating member 361 and the second insulating member 362 may be arranged with the secondary winding portion 321 in between.

[0071] Furthermore, in the above embodiment, multiple ribs R1, R2, R3, and R4 are formed on both the first insulating member 361 and the second insulating member 362. However, the configuration is not limited to this, and multiple ribs may be formed on only one of the first insulating member 361 or the second insulating member 362.

[0072] Furthermore, the present invention can be implemented with various modifications without departing from its spirit. Of course, the scope of the present invention is not limited to the embodiments described above. [Explanation of symbols]

[0073] 1. Power converter 31 Primary side substrate 311 Primary winding section 312 Primary side implementation section 3121 FET Module (Primary Side Electronic Component) 32 Secondary side substrate 321 Secondary winding section 322 Secondary side mounting section 3221 FET (Secondary-side Electronic Component) 3222 Diode (Secondary Electronic Component) 361 First insulating member 362 Second insulating member R1, R3 Ribs (protruding parts)

Claims

1. A primary side substrate having a primary side mounting section and a primary side winding section on which primary side electronic components are mounted, A secondary substrate having a secondary mounting section and a secondary winding section on which secondary electronic components are mounted, wherein the secondary winding section is arranged coaxially with the primary winding section, A pair of insulating members are arranged with one of the winding sections, the primary winding section and the secondary winding section, sandwiched between them and connected to each other, The sealing resin that seals the primary winding portion, the secondary winding portion, and the pair of insulating members, Equipped with, A power conversion device in which at least one of the pair of insulating members has a plurality of protrusions on the surface facing the winding portion of the one member.

2. The power conversion device according to claim 1, wherein the plurality of protrusions are ribs whose longitudinal direction is in the radial direction of each winding portion.

3. The power conversion device according to claim 1 or claim 2, wherein the plurality of protrusions are arranged in the circumferential direction of each winding portion.

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