Heat dissipation structure and high-energy igniter

Abstract

The utility model relates to the field of igniter discloses a heat dissipation structure and high energy igniter. It includes shell, circuit board and heat dissipation component, and circuit board installs in the inside of shell, and the voltage increasing voltage transformation module is electrically connected on the circuit board, and the heat dissipation component includes copper sheet and heat dissipation piece, and the heat dissipation piece is aluminium material, and one side of copper sheet is pasted with the outer wall of voltage increasing voltage transformation module, and the other side is pasted with heat dissipation piece, and the side of heat dissipation piece far from copper sheet passes through shell and exposes in the air, and both sides of copper sheet pasted with voltage increasing voltage transformation module and heat dissipation piece all have daubed with heat -conducting silicone grease. The utility model discloses through heat dissipation component can make the heat of voltage increasing voltage transformation module promptly get dissipation;The heat dissipation effect of heat dissipation component is higher;The cost of igniter is low.

Description

Technical Field

[0001] This utility model relates to the field of igniter technology, and more specifically, to a heat dissipation structure and a high-energy igniter. Background Technology

[0002] High-energy igniters are mainly used in gas equipment. They contain a step-up transformer that increases the power supply voltage during ignition, then rectifies the voltage to store energy in a storage capacitor. When the voltage on the storage capacitor reaches the breakdown voltage of the connected discharge tube, the voltage through the capacitor breaks down the discharge tube, generating an electric spark on the ceramic semiconductor surface of the discharge tube, igniting the flammable gas mixture.

[0003] During the above process, the step-up transformer generates a large amount of heat, which dissipates slowly into the housing of the high-energy igniter. However, if the high-energy igniter needs to be switched on and off multiple times in a short period of time to ignite the gas stove due to the ignition needle, the heat generated by the step-up transformer in the previous cycle has not been dissipated in time, and heat will be generated again. If the heat is not dissipated in time, it will reduce the performance of related electronic components and shorten their lifespan. Utility Model Content

[0004] To address at least one of the aforementioned problems, this utility model first provides a heat dissipation structure, including a housing, a circuit board, and a heat dissipation component. The circuit board is installed inside the housing, and a boost transformer module is electrically connected to the circuit board. The heat dissipation component includes a copper sheet and a heat sink, the heat sink being made of aluminum. One side of the copper sheet is attached to the outer wall of the boost transformer module, and the other side is attached to the heat sink. The side of the heat sink away from the copper sheet passes through the housing and is exposed to the air. Thermal grease is applied to both sides of the copper sheet that are attached to the boost transformer module and the heat sink.

[0005] Optionally, the outer casing is made of plastic.

[0006] Optionally, the outer wall of the housing near the boost transformer module is provided with a cable outlet hole, which communicates with the interior of the housing.

[0007] Optionally, the heat sink includes a heat sink block located inside the housing and attached to the copper sheet, and the heat sink block has multiple airflow channels spaced apart.

[0008] Optionally, the heat sink further includes an expansion plate located on the side of the heat sink away from the copper sheet and fixedly connected to the heat sink. The expansion plate is exposed to the air, and the outer diameter of the expansion plate is larger than the outer diameter of the heat sink.

[0009] Optionally, the expansion plate is fixed on the side away from the heat sink and has multiple heat sink fins spaced apart.

[0010] Optionally, the heat dissipation fins are wavy.

[0011] Optionally, the outer wall of the housing is provided with a mounting groove, the bottom of the mounting groove is provided with a through groove, the diameter of the mounting groove is larger than the diameter of the through groove, the diameter of the through groove is smaller than the outer diameter of the expansion plate, the heat sink passes through the through groove and is located inside the housing, the expansion plate is located in the mounting groove and is fixedly connected to the housing.

[0012] Optionally, neither the expansion plate nor the heat dissipation fins protrude from the mounting groove, and an airflow groove is formed on the groove wall of the mounting groove, the airflow groove penetrating the outer shell along the opening direction.

[0013] Compared with the prior art, the beneficial technical effects of this utility model are as follows:

[0014] 1. One side of the heat dissipation component is in direct contact with the boost transformer module, while the other side is exposed to the air. The heat generated by the boost transformer module can be conducted to the outside of the housing through the heat dissipation component. The airflow outside the housing can effectively dissipate heat from the heat dissipation component, thereby ensuring that the heat generated by the boost transformer module can be dissipated in time, thus ensuring the performance and lifespan of the relevant electronic components.

[0015] 2. Copper sheets have good thermal conductivity, which can transfer the heat generated by the boost transformer module to the heat sink in a timely manner. The cable outlet is located at the boost transformer module, which helps to dissipate heat and allow external air to enter. The multiple airflow channels on the heat sink increase the contact area with the air, which helps to dissipate heat.

[0016] 3. The expansion plate increases the contact area between the heat sink and the external air. Multiple wavy heat sink fins can further increase the contact area between the expansion plate and the air, thereby further improving the heat dissipation effect.

[0017] 4. Compared to making the entire casing metal, using plastic casing and relying mainly on heat dissipation components for heat dissipation results in lower costs.

[0018] In addition, this utility model provides a high-energy igniter, including the heat dissipation structure described above.

[0019] Compared with the prior art, the high-energy igniter described in this utility model has the same advantages as the heat dissipation structure described above, and will not be repeated here. Attached Figure Description

[0020] Figure 1 This is an exploded view of the outer casing, circuit board, and heat dissipation assembly in an embodiment of this utility model;

[0021] Figure 2 This is a cross-sectional view of the outer casing, circuit board, and heat dissipation assembly in an embodiment of this utility model;

[0022] Figure 3 This is an exploded view of the heat dissipation component in an embodiment of this utility model.

[0023] Explanation of reference numerals in the attached drawings: 1. Outer casing; 11. Cable outlet hole; 12. Mounting slot; 13. Airflow channel; 2. Circuit board; 21. Boost transformer module; 3. Heat dissipation component; 31. Copper sheet; 32. Heat sink; 33. Heat sink block; 331. Airflow channel; 34. Expansion board; 35. Heat dissipation fins. Detailed Implementation

[0024] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the following description is provided in conjunction with the appendix. Figure 1-3 This application will be described in further detail.

[0025] In a first aspect, this utility model embodiment provides a heat dissipation structure, referring to... Figure 1 The heat dissipation structure includes a housing 1, a circuit board 2, and a heat dissipation component 3. The circuit board 2 is installed inside the housing 1 and is electrically connected to a boost transformer module 21. When the ignition needle on the gas stove is ignited, the boost transformer module 21 generates a significant amount of heat. One side of the heat dissipation component 3 is inserted into the housing 1 and in contact with the boost transformer module 21; the other side passes through the housing 1 and is exposed to the air outside the housing 1. The heat generated by the boost transformer module 21 can be conducted to the outside of the housing 1 through the heat dissipation component 3. The airflow outside the housing 1 effectively dissipates the heat from the heat dissipation component 3, allowing the heat generated by the boost transformer module 21 to dissipate in a timely manner.

[0026] Reference Figure 1 and Figure 2 In this embodiment, the outer casing 1 is preferably made of plastic, which reduces costs compared to using metal. A wiring hole 11 is provided on the outer wall of the outer casing 1 near the boost transformer module 21. The wiring hole 11 communicates with the interior of the outer casing 1, allowing wires on the circuit board 2 to pass through it. The wiring hole 11 and the wires on the circuit board 2 are fitted with a clearance, allowing air from outside the outer casing 1 to flow into the interior of the outer casing 1. Furthermore, because the wiring hole 11 is close to the boost transformer module 21, the airflow from outside the outer casing 1 can be directed towards the boost transformer module 21 for heat dissipation.

[0027] Reference Figures 1 to 3The heat dissipation assembly 3 includes a copper sheet 31 and a heat sink 32. One side of the copper sheet 31 is attached to the outer wall of the boost transformer module 21, and the other side is attached to the heat sink 32. The side of the heat sink 32 away from the copper sheet 31 is exposed to the air. The copper sheet 31 has good thermal conductivity, allowing the heat generated by the boost transformer module 21 to be directly conducted to the copper sheet 31, which then promptly transfers the heat to the heat sink 32 for dissipation. Furthermore, due to the good electrical conductivity of the copper sheet 31, it only contacts the side of the boost transformer module 21 away from the circuit board 2. Additionally, thermally conductive grease is applied to both the side of the copper sheet 31 that is attached to the boost transformer module 21 and the side that is attached to the heat sink 32. Thermal grease can fill the gaps between the copper plate 31 and the contact side of the boost transformer module 21, and between the copper plate 31 and the heat sink 32, allowing the boost transformer module 21 and the heat sink 32 to make more sufficient contact with the copper plate 31 and improving the heat conduction effect. To further improve the heat dissipation effect, in this embodiment, the heat sink 32 is preferably made of aluminum.

[0028] Reference Figures 1 to 3 The heat sink 32 includes a heat sink 33 and an expansion plate 34. The heat sink 33 is located inside the housing 1 and is in contact with the copper sheet 31. The expansion plate 34 is located on the side of the heat sink 33 away from the copper sheet 31, and the heat sink 33 and the expansion plate 34 are integrally formed; the outer diameter of the expansion plate 34 is larger than the outer diameter of the heat sink 33, and the expansion plate 34 passes through the housing 1 and is exposed to the air. The expansion plate 34 increases the contact area between the heat sink 33 and the external air of the housing 1, thereby improving the heat dissipation effect.

[0029] Multiple airflow channels 331 are spaced apart on the outer wall of the heat sink 33, and all the airflow channels 331 penetrate the heat sink 33 along the opening direction. When the airflow outside the outer casing 1 blows towards the heat sink 33 through the outlet hole 11, it can have a large contact area with the heat sink 33, effectively carrying away part of the heat on the upper part of the heat sink 33 and improving the heat dissipation effect.

[0030] Reference Figures 1 to 3 The expansion plate 34 has multiple heat dissipation fins 35 integrally formed on the side away from the heat sink 33. The multiple heat dissipation fins 35 are arranged at intervals on the expansion plate 34, and each heat dissipation fin 35 is wavy. The multiple wavy heat dissipation fins 35 can increase the contact area between the expansion plate 34 and the external air of the outer casing 1, thereby improving the heat dissipation effect.

[0031] Let the gap between two adjacent heat dissipation fins 35 be a channel. Since the heat dissipation fins 35 are wavy, the channel formed between two adjacent heat dissipation fins 35 is also wavy. When the airflow flows between two adjacent heat dissipation fins 35, the airflow residence time will increase, thereby carrying away more heat.

[0032] Reference Figures 1 to 3An installation groove 12 is formed on the outer wall of the outer casing 1 on one side of the vertical cable outlet 11. A through groove is formed at the bottom of the installation groove 12, and the through groove communicates with the interior of the outer casing 1. The diameter of the installation groove 12 is larger than the diameter of the through groove, and the diameter of the through groove is smaller than the outer diameter of the expansion plate 34; and the diameter of the through groove is larger than the outer diameter of the heat sink 33. The heat sink 33 is inserted into the interior of the outer casing 1 through the installation groove 12 and the through groove. The expansion plate 34 is located in the installation groove 12, and the side of the expansion plate 34 closest to the heat sink 33 abuts against the bottom of the installation groove 12 to form a limiting position. The expansion plate 34 is fixedly connected to the outer casing 1 by bolts, making assembly simple and convenient.

[0033] It is worth noting that neither the expansion plate 34 nor the heat dissipation fins 35 protrude from the mounting groove 12, making it less likely for the heat dissipation fins 35 to scratch the installer during installation. Airflow grooves 13 are formed on the two opposite walls of the mounting groove 12, extending through the outer casing 1 along their opening direction. The channels formed between any two adjacent heat dissipation fins 35 are connected to the airflow grooves 13, facilitating the flow of air from outside the outer casing 1 through the airflow grooves 13 into the multiple channels for heat dissipation.

[0034] The implementation principle of a heat dissipation structure in this application embodiment is as follows: Since the copper sheet 31 has good thermal conductivity, the heat generated by the boost transformer module 21 can be transferred to the heat sink 33 in a timely manner through the copper sheet 31. Since the heat sink 33 has multiple airflow channels 331, when the airflow outside the housing 1 blows towards the heat sink 33 through the outlet hole 11, it can have a large contact area with the heat sink 33, effectively carrying away part of the heat on the heat sink 33 and improving the heat dissipation effect.

[0035] In addition, some heat will be transferred to the expansion plate 34 and the heat dissipation fins 35 through the heat sink 33. When the airflow flows between two adjacent heat dissipation fins 35, the airflow residence time will increase, which will carry away more heat and further improve the heat dissipation effect.

[0036] Secondly, another embodiment of the present invention provides a high-energy igniter, including the heat dissipation structure as described in the first aspect.

[0037] Similarly, the components included in the "components," "mechanisms," and "devices" of this disclosure can also be flexibly combined. They can be modularly produced according to actual needs and assembled as an independent module; or they can be assembled separately to form a module in this device. The division of the above-mentioned components in this disclosure is only one embodiment for ease of reading and is not intended to limit the scope of protection of this disclosure. Any technical solution that includes the above-mentioned components and has the same function should be understood as an equivalent technical solution of this disclosure.

[0038] In the description of this disclosure, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0039] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0041] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] It should be noted that when a component is referred to as "fixed to," "set on," "fixed to," or "mounted on" another component, it can be directly on the other component or there may be an intervening component. When a component is considered to be "connected to another component," it can be directly connected to the other component or there may be an intervening component. Furthermore, when a component is considered to be "fixedly connected" to another component, the connection can be detachable or non-detachable, such as through socketing, snap-fitting, integral molding, welding, etc., which are achievable in conventional technologies and will not be elaborated upon here.

[0043] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0044] The above embodiments are merely illustrative of several implementation methods of this disclosure, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the inventive concept of this disclosure, and these modifications and improvements all fall within the protection scope of this disclosure.

Claims

1. A heat dissipation structure, characterized in that: The device includes a housing (1), a circuit board (2), and a heat dissipation assembly (3). The circuit board (2) is installed inside the housing (1). A boost transformer module (21) is electrically connected to the circuit board (2). The heat dissipation assembly (3) includes a copper sheet (31) and a heat sink (32). The heat sink (32) is made of aluminum. One side of the copper sheet (31) is attached to the outer wall of the boost transformer module (21), and the other side is attached to the heat sink (32). The side of the heat sink (32) away from the copper sheet (31) passes through the housing (1) and is exposed to the air. Thermal grease is applied to both sides of the copper sheet (31) that are attached to the boost transformer module (21) and the heat sink (32).

2. The heat dissipation structure according to claim 1, characterized in that: The outer shell (1) is made of plastic.

3. The heat dissipation structure according to claim 1, characterized in that: The outer wall of the outer casing (1) near the boost transformer module (21) has a cable outlet hole (11) that communicates with the interior of the outer casing (1).

4. The heat dissipation structure according to any one of claims 1-3, characterized in that: The heat sink (32) includes a heat sink (33), which is located inside the outer shell (1) and is attached to the copper sheet (31). The heat sink (33) has multiple airflow channels (331) spaced apart.

5. The heat dissipation structure according to claim 4, characterized in that: The heat sink (32) also includes an extension plate (34), which is located on the side of the heat sink (33) away from the copper sheet (31) and is fixedly connected to the heat sink (33). The extension plate (34) is exposed to the air and the outer diameter of the extension plate (34) is larger than the outer diameter of the heat sink (33).

6. The heat dissipation structure according to claim 5, characterized in that: The expansion plate (34) is fixed on the side away from the heat sink (33) and has a plurality of heat sink fins (35) spaced apart.

7. The heat dissipation structure according to claim 6, characterized in that: The heat dissipation fins (35) are wavy.

8. The heat dissipation structure according to claim 7, characterized in that: The outer wall of the outer shell (1) is provided with an installation groove (12), and the bottom of the installation groove (12) is provided with a through groove. The diameter of the installation groove (12) is larger than the diameter of the through groove, and the diameter of the through groove is smaller than the outer diameter of the expansion plate (34). The heat sink (33) passes through the through groove and is located inside the outer shell (1). The expansion plate (34) is located inside the installation groove (12) and is fixedly connected to the outer shell (1).

9. The heat dissipation structure according to claim 8, characterized in that: Neither the expansion plate (34) nor the heat dissipation fins (35) protrude from the mounting groove (12). An airflow groove (13) is provided on the groove wall of the mounting groove (12), and the airflow groove (13) penetrates the outer shell (1) along the opening direction.

10. A high-energy igniter, characterized in that, Includes the heat dissipation structure as described in any one of claims 1-9.

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