Curable composition, cured film, and display device

Abstract

The present invention aims to provide a curable composition with improved storage stability, a cured film formed from the curable composition, and a display device containing the cured film. [Solution] A curable composition comprising semiconductor particles (A) and a polymerizable compound (B), wherein the polymerizable compound (B) comprises two or more difunctional acrylate compounds and one or more trifunctional or greater (meth)acrylate compounds.

Description

[Technical Field]

[0001] The present invention relates to a curable composition comprising semiconductor particles and a polymerizable compound, a cured film formed from the curable composition, and a display device comprising the cured film. [Background technology]

[0002] Patent Document 1 describes a curable composition containing semiconductor particles and a polymerizable compound. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2021-113311 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] In conventional curable compositions containing semiconductor particles and polymerizable compounds, we have found that when two or more bifunctional acrylate compounds are used as the polymerizable compounds, weight loss and viscosity changes occur during storage, posing a challenge to storage stability. Therefore, the present invention aims to provide a curable composition with improved storage stability, a cured film formed from the curable composition, and a display device containing the cured film. [Means for solving the problem]

[0005] The gist of this invention is as follows: [1] A curable composition comprising semiconductor particles (A) and a polymerizable compound (B), wherein the polymerizable compound (B) comprises two or more difunctional acrylate compounds and one or more trifunctional (meth)acrylate compounds. [2] The difunctional acrylate compound has a topological polar surface area of ​​55 Å. 2 The curable composition according to [1], comprising at least one of the above-mentioned compounds (B-2A). [3] The difunctional acrylate compound has a topological polar surface area of ​​55 Å. 2 A curable composition according to [1] or [2], comprising at least one compound (B-2B) that is less than [1]. [4] The difunctional acrylate compound has a topological polar surface area of ​​55 Å. 2 The above describes the compound (B-2A), and its topological polar surface area is 55 Å. 2 A curable composition according to any one of [1] to [3], comprising compound (B-2B) which is less than [1], wherein the content of compound (B-2A) is 30% by mass or more of the total 100% by mass of compound (B-2A) and compound (B-2B). [5] The curable composition according to any one of [1] to [4], wherein the content of the semiconductor particles (A) is 20% by mass or more with respect to the total amount of solids in the curable composition. [6] A curable composition according to any one of [1] to [5], further comprising a light scattering agent (E). [7] A curable composition according to any one of [1] to [6], further comprising an antioxidant (D). [8] The curable composition according to any one of [1] to [7], wherein the content of solvent (F) is 0 to 1% by mass with respect to the total amount of the curable composition. [9] A curable composition according to any one of [1] to [8], wherein the viscosity at 40°C is 20 cP or less.

[10] A curable composition according to any one of [1] to [9], which is an ink for inkjet printers.

[11] A cured film formed from any of the curable compositions described in [1] to

[10] .

[12] A display device comprising the cured film described in

[11] . [Effects of the Invention]

[0006] According to the present invention, it is possible to provide a curable composition with improved storage stability, a cured film formed from the curable composition, and a display device containing the cured film. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic cross-sectional view showing an example of a display component. [Modes for carrying out the invention]

[0008] <Curable composition> The curable composition of the present invention (hereinafter also simply referred to as "curable composition") comprises semiconductor particles (A) and a polymerizable compound (B), and preferably also comprises at least one selected from the group consisting of polymerization initiators (C), antioxidants (D), and light scattering agents (E), as needed.

[0009] In this specification, unless otherwise specified, the compounds exemplified as components may be used individually or in combination of two or more. Furthermore, when using multiple types of components, unless otherwise specified, the content should be adjusted by the total amount of all components used.

[0010] [1] Semiconductor particle (A) The semiconductor particle (A) is preferably a light-emitting inorganic semiconductor particle that absorbs primary light and emits light of a different wavelength than the primary light, and it is preferable that the light-emitting inorganic semiconductor particle converts the wavelength of blue light, which is the primary light, to the wavelength of light of a different color. The semiconductor particle (A) preferably emits green or red light, and it is more preferable that it absorbs blue light and emits green or red light.

[0011] In this specification, "blue" refers to all light that is perceived as blue (all light with intensity in the blue wavelength range, e.g., 380 nm to 495 nm), and is not limited to light of a single wavelength. "Green" refers to all light that is perceived as green (all light with intensity in the green wavelength range, e.g., 495 nm to 585 nm), and is not limited to light of a single wavelength. "Red" refers to all light that is perceived as red (all light with intensity in the red wavelength range, e.g., 585 nm to 780 nm), and is not limited to light of a single wavelength.

[0012] The emission spectrum of the green-emitting semiconductor particle (A) preferably includes a peak with a maximum value in the wavelength range of 500 nm to 560 nm, more preferably a peak with a maximum value in the wavelength range of 510 nm to 550 nm, and even more preferably a peak with a maximum value in the wavelength range of 520 nm to 540 nm. This expands the displayable color gamut of the green light of the display device. The peak preferably has a full width at half maximum of 15 nm to 80 nm, more preferably 15 nm to 60 nm, even more preferably 15 nm to 50 nm, and even more preferably 15 nm to 45 nm. This expands the displayable color gamut of the green light of the display device.

[0013] The emission spectrum of the red-emitting semiconductor particle (A) preferably includes a peak with a maximum value in the wavelength range of 590 nm to 750 nm, more preferably a peak with a maximum value in the wavelength range of 610 nm to 700 nm, and even more preferably a peak with a maximum value in the wavelength range of 615 nm to 650 nm. This expands the displayable color gamut of the red light of the display device. The peak preferably has a full width at half maximum of 15 nm to 80 nm, more preferably 15 nm to 60 nm, even more preferably 15 nm to 50 nm, and even more preferably 15 nm to 45 nm. This expands the displayable color gamut of the red light of the display device.

[0014] Examples of semiconductor particles (A) include quantum dots and particles composed of compounds having a perovskite crystal structure (hereinafter also referred to as "perovskite compounds"), with quantum dots being preferred. Quantum dots are luminescent semiconductor nanoparticles with a particle diameter of 1 nm to 100 nm (preferably 1 nm to 50 nm, more preferably 1 nm to 30 nm), which utilize the band gap of the semiconductor to absorb ultraviolet light or visible light (e.g., blue light) and emit light.

[0015] Examples of quantum dots include CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, CdHgTe, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZn Examples include compounds of group 12 elements and group 16 elements such as SeTe and HgZnSTe; compounds of group 13 elements and group 15 elements such as GaN, GaP, GaAs, AlN, AlP, AlAs, InN, InP, InAs, GaNP, GaNAs, GaPAs, AlNP, AlNAs, AlPAs, InNP, InNAs, InPAs, GaAlNP, GaAlNAs, GaAlPAs, GaInNP, GaInNAs, GaInPAs, InAlNP, InAlNAs, InAlPAs; and compounds of group 14 elements and group 16 elements such as PdS and PbSe.

[0016] If the quantum dots contain sulfur (S) or senium (Se), quantum dots that have been surface-modified with metal oxides or organic materials may be used. Using surface-modified quantum dots prevents the extraction of S or Se by reactive components contained in or potentially contained in the curable composition. Furthermore, quantum dots may form a core-shell structure by combining the above-mentioned compounds. Examples of such combinations include nanoparticles where the core is CdSe and the shell is ZnS, and nanoparticles where the core is InP and the shell is ZnSeS.

[0017] Since the energy state of a quantum dot depends on its size, the emission wavelength can be freely selected by changing the particle size. Furthermore, because the light emitted from quantum dots has a narrow spectral width, it is advantageous for widening the color gamut of display devices. In addition, quantum dots have high responsiveness, which is advantageous in terms of primary light utilization efficiency.

[0018] The curable composition may contain two or more types of semiconductor particles (A). For example, the curable composition may contain only one type of semiconductor particle (A) that absorbs primary light and emits green light, or it may contain two or more types in combination. Similarly, the curable composition may contain only one type of semiconductor particle (A) that absorbs primary light and emits red light, or it may contain two or more types in combination.

[0019] The semiconductor particles (A) may be ligand-containing semiconductor particles that include an organic ligand (G) that coordinates to the semiconductor particles. The organic ligand (G) is, for example, an organic compound having a polar group that exhibits coordinating ability to semiconductor particles. The organic ligand (G) can coordinate to the surface of the semiconductor particles. The organic ligand (G) usually coordinates to the semiconductor particles via its polar group. Preferably, at least some of the molecules of the organic ligand (G) are coordinated to the semiconductor particles, and all or almost all of the molecules may be coordinated to the semiconductor particles. The semiconductor particles (A) may contain one or more organic ligands (G). When the semiconductor particles (A) contain organic ligands (G), the stability and dispersibility of the semiconductor particles (A), as well as the luminescence intensity of the curable composition and cured film, can be improved. The coordination of the organic ligand (G) to the semiconductor particles can be confirmed by the uniform dispersion of the semiconductor particles (A) in a dispersion medium suitable for organic ligands.

[0020] The polar group of the organic ligand (G) is preferably at least one group selected from the group consisting of a thiol group (-SH), a carboxyl group (-COOH), and an amino group (-NH2), and more preferably at least one group selected from the group consisting of a thiol group and a carboxyl group. Having these polar groups improves the coordination to semiconductor particles, improving the stability and dispersibility of semiconductor particles (A) in the curable composition, and improving the luminescence intensity of the curable composition and cured film. The organic ligand (G) may have one or more polar groups.

[0021] The organic ligand (G) is given by the following formula (x): X A-R X (x) Examples of the organic compound represented by the formula include those in which X A is the above polar group, and R X is a monovalent hydrocarbon group which may contain heteroatoms (such as N, O, S, halogen atoms, etc.). The hydrocarbon group may have one or more unsaturated bonds such as a carbon-carbon double bond. The hydrocarbon group may have a linear, branched or cyclic structure. The number of carbon atoms of the hydrocarbon group is, for example, 1 or more and 40 or less, and may be 1 or more and 30 or less. The methylene group contained in the hydrocarbon group may be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -O-C(=O)-, -C(=O)-NH-, -NH-, etc.

[0022] R X may contain the polar group exemplified above.

[0023] X A Specific examples of the organic ligand having a carboxy group as X include formic acid, acetic acid, propionic acid, and saturated or unsaturated fatty acids. Specific examples of saturated or unsaturated fatty acids include saturated fatty acids such as butyric acid, pentanoic acid, caproic acid, caprylic acid, capric acid, lauric acid, myristic acid, pentadecanoic acid, palmitic acid, margaric acid, stearic acid, arachidic acid, behenic acid, lignoceric acid; monounsaturated fatty acids such as myristoleic acid, palmitoleic acid, oleic acid, icosenoic acid, erucic acid, nervonic acid; polyunsaturated fatty acids such as linoleic acid, α-linolenic acid, γ-linolenic acid, stearidonic acid, dihomo-γ-linolenic acid, arachidonic acid, eicosatetraenoic acid, docosadienoic acid, adrenic acid (eicosatetraenoic acid).

[0024] X A Specific examples of the organic ligand having a thiol group or an amino group as X include organic ligands in which the carboxy group of the organic ligand having a carboxy group as X A is substituted with a thiol group or an amino group.

[0025] In addition to the above, examples of organic ligands represented by formula (x) include compound (G-1) and compound (G-2).

[0026] [Compound (G-1)] Compound (G-1) is a compound having a first functional group and a second functional group. The first functional group is a carboxyl group (-COOH), and the second functional group is a carboxyl group or a thiol group (-SH). The semiconductor particle (A) may contain only one type of compound (G-1) or two or more types.

[0027] Examples of compound (G-1) include the compound represented by the following formula (G-1a). Compound (G-1) may also be the acid anhydride of the compound represented by formula (G-1a).

[0028] [ka] [In formula (G-1a), R B R represents a divalent hydrocarbon group. B If present, they may be the same or different. The hydrocarbon group may have one or more substituents. If there are multiple substituents, they may be the same or different, and they may be bonded to each other to form a ring with the atom to which each substituent is bonded. The alkylene group contained in the hydrocarbon group may be interrupted by at least one of -O-, -S-, -SO2-, -CO-, and -NH-. p represents an integer between 1 and 10.

[0029] R B Examples of divalent hydrocarbon groups represented by this symbol include chain hydrocarbon groups, alicyclic hydrocarbon groups, aromatic hydrocarbon groups, and groups that combine these.

[0030] Examples of linear hydrocarbon groups include linear or branched alkanediyl groups, which typically have 1 to 50 carbon atoms, preferably 1 to 20, and more preferably 1 to 10. Examples of alicyclic hydrocarbon groups include monocyclic or polycyclic cycloalkanediyl groups, which typically have 3 to 50 carbon atoms, preferably 3 to 20, and more preferably 3 to 10. Examples of aromatic hydrocarbon groups include monocyclic or polycyclic arenediyl groups, which typically have 6 to 20 carbon atoms.

[0031] Examples of substituents that the hydrocarbon group may have include C1-C50 alkyl groups, C3-C50 cycloalkyl groups, C6-C20 aryl groups, carboxyl groups, amino groups, halogen atoms, etc., with carboxyl groups, amino groups, or halogen atoms being preferred.

[0032] The divalent group to which the alkylene group contained in the hydrocarbon group is substituted is preferably at least one of -O-, -CO-, and -NH-, more preferably at least one of -CO- and -NH-, and even more preferably -NH-. p is preferably 1 or 2.

[0033] Examples of compounds represented by formula (G-1a) include those represented by the following formulas (1-1) to (1-9).

[0034] [ka]

[0035] Examples of compounds represented by formula (G-1a) include mercaptoacetic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutanoic acid, 4-mercaptobutanoic acid, mercaptosuccinic acid, mercaptostearic acid, mercaptooctanoic acid, 4-mercaptobenzoic acid, 2,3,5,6-tetrafluoro-4-mercaptobenzoic acid, L-cysteine, N-acetyl-L-cysteine, 3-methoxybutyl 3-mercaptopropionic acid, and 3-mercapto-2-methylpropionic acid. Among these, 3-mercaptopropionic acid and mercaptosuccinic acid are preferred.

[0036] Another example of compound (G-1) is a polycarboxylic acid compound, preferably compound (G-1b) in which -SH in formula (G-1a) is substituted with a carboxyl group (-COOH).

[0037] Examples of compounds (G-1b) include succinic acid, glutaric acid, adipic acid, octafluoroadipic acid, azelaic acid, dodecanediic acid, tetradecanediic acid, hexadecanedioic acid, heptadecanedioic acid, octadecanediic acid, nonadecanedioic acid, dodecafluorosveric acid, 3-ethyl-3-methylglutaric acid, hexafluoroglutaric acid, trans-3-hexenodioic acid, sebacic acid, hexadecafluorosebacic acid, acetylenedicarboxylic acid, trans-aconitic acid, 1,3-adamantanedicarboxylic acid, bicyclo[2.2.2]octane-1,4- Dicarboxylic acids, cis-4-cyclohexene-1,2-dicarboxylic acid, 1,1-cyclopropanedicarboxylic acid, 1,1-cyclobutanedicarboxylic acid, cis- or trans-1,3-cyclohexanedicarboxylic acid, cis- or trans-1,4-cyclohexanedicarboxylic acid, 1,1-cyclopentanediacetic acid, 1,2,3,4-cyclopentanetetracarboxylic acid, decahydro-1,4-naphthalenedicarboxylic acid, 2,3-norbornanedicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid, phthalic acid, 3-fluorophthalic acid, isophthalic acid, Tetrafluoroisophthalic acid, terephthalic acid, tetrafluoroterephthalic acid, 2,5-dimethylterephthalic acid, 2,6-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,1'-ferrocenedicarboxylic acid, 2,2'-biphenyldicarboxylic acid, 4,4'-biphenyldicarboxylic acid, 2,5-franzicarboxylic acid, benzophenone-2,4'-dicarboxylic acid monohydrate, benzophenone-4,4'-dicarboxylic acid, 2,3-pyrazinedicarboxylic acid, 2,3-pyridinedicarboxylic acid, 2,4-pyridinedicarboxylic acid Rubonic acid, 3,5-pyridinedicarboxylic acid, 2,5-pyridinedicarboxylic acid, 2,6-pyridinedicarboxylic acid, 3,4-pyridinedicarboxylic acid, pyrazole-3,5-dicarboxylic acid monohydrate, 4,4'-stilbendicarboxylic acid, anthraquinone-2,3-dicarboxylic acid, 4-(carboxymethyl)benzoic acid, chelidonic acid monohydrate, azobenzene-4,4'-dicarboxylic acid, azobenzene-3,3'-dicarboxylic acid, chlorendic acid, 1H-imidazole-4,5-dicarboxylic acid, 2,2-bis(4-carboxyphenyl)hexafluoropropane, 1,Examples include 10-bis(4-carboxyphenoxy)decane, dipropylmalonic acid, dithiodiglycolic acid, 3,3'-dithiodipropionic acid, 4,4'-dithiodibutanoic acid, 4,4'-dicarboxydiphenyl ether, 4,4'-dicarboxydiphenyl sulfone, ethylene glycol bis(4-carboxyphenyl) ether, 3,4-ethylenedioxythiophene-2,5-dicarboxylic acid, 4,4'-isopropylidene diphenoxyacetic acid, 1,3-acetonedicarboxylic acid, methylenedisalicylic acid, 5,5'-thiodisalicylic acid, tris(2-carboxyethyl)isocyanurate, tetrafluorosuccinic acid, α,α,α',α'-tetramethyl-1,3-benzenedipropionic acid, and 1,3,5-benzenetricarboxylic acid.

[0038] The molecular weight of compound (G-1) is preferably 3000 or less, more preferably 2500 or less, even more preferably 2000 or less, even more preferably 1000 or less, even more preferably 800 or less, and even more preferably 500 or less. The molecular weight of compound (G-1) is usually 100 or more.

[0039] The above molecular weight may be either a number-average molecular weight or a weight-average molecular weight. The number-average molecular weight and weight-average molecular weight are the number-average molecular weight and weight-average molecular weight, respectively, measured on a standard polystyrene basis by gel permeation chromatography (GPC).

[0040] The content ratio of compound (G-1) to semiconductor particles is preferably 0.001 or more and 1 or less by mass, more preferably 0.01 or more and 0.5 or less, and even more preferably 0.02 or more and 0.45 or less.

[0041] When the semiconductor particles (A) contain compound (G-1), the content of compound (G-1) in the curable composition is preferably 0.1% to 20% by mass, more preferably 0.2% to 20% by mass, even more preferably 0.2% to 10% by mass, even more preferably 0.5% to 10% by mass, and even more preferably 0.5% to 8% by mass, relative to the total amount of solids in the curable composition.

[0042] In this specification, the total amount of solids in a curable composition means the sum of the components contained in the curable composition, excluding the solvent (F). The content of each component in the solids of a curable composition can be measured by known analytical means such as liquid chromatography or gas chromatography. The content of each component in the solids of a curable composition may be calculated from the formulation at the time of preparation of the curable composition.

[0043] [Compound (G-2)] Compound (G-2) is a compound different from compound (G-1), containing a polyalkylene glycol structure and having polar groups at its molecular ends. Preferably, the molecular ends are those of the longest carbon chain in compound (G-2) (the carbon atoms in the carbon chain may be replaced by other atoms such as oxygen atoms). The semiconductor particle (A) may contain only one compound (G-2) or two or more compounds. The semiconductor particle (A) may contain compound (G-1) or compound (G-2), or may contain compound (G-1) and compound (G-2). Compounds containing a polyalkylene glycol structure and having the above-mentioned first and second functional groups shall be classified as compound (G-1).

[0044] The polyalkylene glycol structure is defined by the following formula:

[0045] [ka] This refers to a structure represented by the formula. In the formula, n is an integer greater than or equal to 2, and RC This refers to an alkylene group, such as an ethylene group or a propylene group.

[0046] Examples of compound (G-2) include polyalkylene glycol compounds represented by the following formula (G-2a).

[0047] [ka]

[0048] In formula (G-2a), X is a polar group, Y is a monovalent group, and Z C is a divalent or trivalent base, n is an integer greater than or equal to 2, m is 1 or 2, and R C This is an alkylene group.

[0049] X is preferably at least one group selected from the group consisting of a thiol group (-SH), a carboxyl group (-COOH), and an amino group (-NH2), and more preferably at least one group selected from the group consisting of a thiol group and a carboxyl group.

[0050] Y is a monovalent group. Examples of group Y include monovalent hydrocarbon groups which may have substituents (N, O, S, halogen atoms, etc.). The alkylene group contained in the hydrocarbon group may be interrupted by -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc. The number of carbon atoms in the hydrocarbon group is between 1 and 12. The hydrocarbon group may have unsaturated bonds.

[0051] Examples of Y include alkyl groups having 1 to 12 carbon atoms and having a linear, branched, or cyclic structure; alkoxy groups having 1 to 12 carbon atoms and having a linear, branched, or cyclic structure. The number of carbon atoms in the alkyl and alkoxy groups is preferably 1 to 8, more preferably 1 to 6, and even more preferably 1 to 4. The alkylene groups contained in the alkyl and alkoxy groups may be interrupted by -O- and -S-. Y is preferably a linear or branched alkoxy group having 1 to 4 carbon atoms, and more preferably a linear alkoxy group having 1 to 4 carbon atoms.

[0052] Y may contain a polar group. The polar group may be at least one group selected from the group consisting of a thiol group (-SH), a carboxyl group (-COOH), and an amino group (-NH2). The polar group is preferably located at the terminal end of group Y.

[0053] Z C It is a divalent or trivalent group. Group Z C Examples include divalent or trivalent hydrocarbon groups that may contain heteroatoms (such as N, O, S, or halogen atoms). The hydrocarbon group preferably has 1 to 24 carbon atoms. The hydrocarbon group may have unsaturated bonds.

[0054] divalent Z C Examples include alkylene groups having 1 to 24 carbon atoms and having a linear, branched, or cyclic structure; and alkenylene groups having 1 to 24 carbon atoms and having a linear, branched, or cyclic structure. The number of carbon atoms in the alkylene group and alkenylene group is preferably 1 to 12, more preferably 1 to 8, and even more preferably 1 to 4. The alkylene groups contained in the alkylene group and alkenylene group may be interrupted by -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc. Trivalent group Z C As for the divalent group Z mentioned above, C We can give an example of a group obtained by removing one hydrogen atom from the same group.

[0055] Z C The group Z may have a branched structure. C In a branch chain separate from the branch chain containing the polyalkylene glycol structure shown in formula (G-2a) above, the branch chain may have a polyalkylene glycol structure separate from the polyalkylene glycol structure shown in formula (G-2a) above.

[0056] Z C Preferably, it is a linear or branched alkylene group having 1 to 6 carbon atoms, and more preferably a linear alkylene group having 1 to 4 carbon atoms.

[0057] R C The group is an alkylene group, preferably a linear or branched alkylene group having 1 to 6 carbon atoms, and more preferably a linear alkylene group having 1 to 4 carbon atoms.

[0058] In formula (G-2a), n is an integer greater than or equal to 2, preferably between 2 and 540, more preferably between 2 and 120, and even more preferably between 2 and 60.

[0059] The molecular weight of compound (G-2) is preferably 150 to 10,000, more preferably 150 to 5,000, and even more preferably 150 to 4,000. Within this range, the stability and dispersibility of the semiconductor particles (A), as well as the luminescence intensity of the curable composition and cured film, can be improved. The molecular weight may be either a number-average molecular weight or a weight-average molecular weight. The number-average molecular weight and weight-average molecular weight are the number-average molecular weight and weight-average molecular weight on a standard polystyrene basis, measured by GPC, respectively.

[0060] When the semiconductor particles (A) contain compound (G-2), the content ratio of compound (G-2) to semiconductor particles in the curable composition is preferably 0.001 to 2 by mass, more preferably 0.01 to 1.5, and even more preferably 0.1 to 1. When the content ratio is within this range, the stability and dispersibility of the semiconductor particles (A), as well as the luminescence intensity of the curable composition and cured film, can be improved.

[0061] When the semiconductor particles (A) contain compound (G-2), the content of compound (G-2) in the curable composition is preferably 0.1% to 40% by mass, more preferably 0.1% to 20% by mass, even more preferably 1% to 15% by mass, and even more preferably 2% to 12% by mass, relative to the total amount of solids in the curable composition. Within this range, the stability and dispersibility of the semiconductor particles (A), as well as the luminescence intensity of the curable composition and cured film, can be improved.

[0062] When semiconductor particles (A) contain organic ligands (G), the ratio of the content of organic ligands (G) to semiconductor particles in the curable composition is preferably 0.001 to 1 by mass, more preferably 0.01 to 0.8, and even more preferably 0.02 to 0.5. When this content ratio is within this range, the stability and dispersibility of the semiconductor particles (A), as well as the luminescence intensity of the curable composition and cured film, can be improved. The content of organic ligands (G) refers to the total content of all organic ligands contained in the curable composition.

[0063] The content of semiconductor particles (A) in the curable composition is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, even more preferably 18% by mass or more, even more preferably 20% by mass or more, and also preferably 60% by mass or less, more preferably 50% by mass or less, and even more preferably 40% by mass or less, based on the total amount of solids in the curable composition. When the content of semiconductor particles (A) is within the above range, the stability and dispersibility of the semiconductor particles (A) in the curable composition and cured film, as well as the luminescence intensity of the curable composition and cured film, can be improved. The content of semiconductor particles (A) refers to the total content of all semiconductor particles (A) contained in the curable composition, and if the semiconductor particles (A) contain organic ligands (G), it refers to the total content of ligand-containing semiconductor particles.

[0064] [2] Polymerizable compound (B) Polymerizable compound (B) is a compound that can be polymerized by active radicals, acids, etc., generated from the polymerization initiator (C) described later. Polymerizable compound (B) contains at least two types of difunctional acrylate compounds and one type of trifunctional or higher (meth)acrylate compound. By including two or more types of difunctional acrylate compounds and one type of trifunctional or higher (meth)acrylate compound as polymerizable compound (B), a curable composition with improved storage stability (especially storage stability under high-temperature conditions) can be obtained.

[0065] Examples of polymerizable compounds (B) include photopolymerizable compounds that harden upon irradiation with light, and thermopolymerizable compounds that harden upon heat, with photopolymerizable compounds being preferred. The weight-average molecular weight of the photopolymerizable compound is, for example, 100 to 3000, preferably 150 to 2900, and more preferably 180 to 1500.

[0066] Examples of photopolymerizable compounds include photoradical polymerizable compounds that harden by radical polymerization reactions upon irradiation with light, and photocationic polymerizable compounds that harden by cationic polymerization reactions upon irradiation with light. Specifically, as photocationic polymerizable compounds, oxetane compounds, epoxy compounds, and vinyl ether compounds described in Japanese Patent Application Publication No. 2024-61630 can be used. The photopolymerizable compound is preferably a photoradical polymerizable compound.

[0067] Examples of photoradical polymerizable compounds include compounds having polymerizable ethylenically unsaturated bonds, and are preferably (meth)acrylate compounds. Examples of (meth)acrylate compounds include monofunctional (meth)acrylate compounds having one (meth)acryloyloxy group in the molecule (hereinafter also referred to as "compound (B-1)"), difunctional (meth)acrylate compounds having two (meth)acryloyloxy groups in the molecule (hereinafter also referred to as "compound (B-2)"), and polyfunctional (meth)acrylate compounds having three or more (meth)acryloyloxy groups in the molecule (hereinafter also referred to as "compound (B-3)"). Note that "(meth)acrylate" means acrylate and / or methacrylate. The same applies to "(meth)acryloyl," "(meth)acrylic acid," etc.

[0068] Compound (B-1) includes methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, amyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, nonyl (meth)acrylate, dodecyl (meth)acrylate (lauryl (meth)acrylate), hexadecyl (meth)acrylate, octadecyl (meth)acrylate, cyclohexyl (meth)acrylate, methoxyethyl (meth)acrylate, butoxyethyl (meth)acrylate, phenoxyethyl (meth)acrylate, nonylphenoxyethyl (meth)acrylate, glycidyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, isobornyl (meth)acrylate, di Examples include cyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, benzyl (meth)acrylate, phenyl (meth)acrylate, mono(2-acryloyloxyethyl) succinate, N-[2-(acryloyloxy)ethyl]phthalimide, N-[2-(acryloyloxy)ethyl]tetrahydrophthalimide, 2-(2-vinyloxyethoxy)ethyl (meth)acrylate, ω-carboxy-polycaprolactone monoacrylate, ethyl carbitol (meth)acrylate (ethoxyethoxyethyl (meth)acrylate), 3,3,5-trimethylcyclohexyl (meth)acrylate, etc. As compound (B-1), a monofunctional acrylate compound having one acryloyloxy group in the molecule is preferred. Alternatively, as compound (B-1), a (meth)acrylate compound (a compound belonging to compound (B-4) described later) having a vinyl ether group (preferably 1 to 4 vinyl ether groups, more preferably 1 vinyl ether group) and one (meth)acryloyl group (preferably a (meth)acryloyloxy group, more preferably an acryloyloxy group) in the same molecule is preferred.

[0069] The content of compound (B-1) is preferably 0% to 18% by mass, more preferably 0.7% to 15% by mass, and even more preferably 1.2% to 10% by mass, relative to the total amount of polymerizable compound (B). The content of compound (B-1) is preferably 0% to 15% by mass, more preferably 0.5% to 10% by mass, and even more preferably 1.0% to 8% by mass, relative to the total amount of solids in the curable composition. When the content of compound (B-1) is within the above range, a curable composition with improved storage stability can be obtained.

[0070] Compound (B-2) includes 1,3-butylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,5-pentanediol di(meth)acrylate, 3-methyl-1,5-pentanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, tricyclodecanedimethanol di(meth)acrylate, and ethylene glycol. Di(meth)acrylates of aliphatic hydrocarbon compounds having 2 to 20 carbon atoms and having two or more hydroxyl groups, such as di(meth)acrylate and propylene glycol di(meth)acrylate; diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, neopentyl glycol, 4 moles or more per mole Di(meth)acrylates obtained by adding ethylene oxide or propylene oxide to a diol in which two hydroxyl groups are replaced by (meth)acryloyloxy groups; di(meth)acrylates obtained by adding 2 to 4 moles or more of ethylene oxide or propylene oxide to 1 mole of bisphenol A in which two hydroxyl groups are replaced by (meth)acryloyloxy groups; and two triols obtained by adding 3 moles or more of ethylene oxide or propylene oxide to 1 mole of trimethylolpropane. Examples include di(meth)acrylates of polyols having intramolecular ether bonds, such as di(meth)acrylates in which the hydroxyl groups of are replaced by (meth)acryloyloxy groups; di(meth)acrylates of polyols having intramolecular ester bonds, such as neopentyl glycol hydroxypivalate di(meth)acrylate; and di(meth)acrylates of heterocyclic polyols, such as di(meth)acrylate in which the two hydroxyl groups of tris(2-hydroxyethyl) isocyanurate are replaced by (meth)acryloyloxy groups.

[0071] From the viewpoint of storage stability of the curable composition, the content of compound (B-2) is preferably 20% to 99.5% by mass, more preferably 25% to 99% by mass, even more preferably 30% to 97% by mass, even more preferably 30% to 95% by mass, and particularly preferably 30% to 93% by mass, relative to the total amount of polymerizable compound (B). From the viewpoint of storage stability of the curable composition, the content of compound (B-2) is preferably 10% to 99% by mass, more preferably 20% to 97% by mass, even more preferably 30% to 95% by mass, and even more preferably 30% to 60% by mass, relative to the total amount of solids in the curable composition. When the content of compound (B-2) is within the above range, a curable composition with improved storage stability can be obtained.

[0072] Compound (B-3) includes glycerin tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol octa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, tetrapentaerythritol deca(meth)acrylate, tetrapentaerythritol nona(meth)acrylate, tris(2-(meth)acryloyloxyethyl) isocyanurate, ethylene glycol-modified pentaerythritol tetra(meth)acrylate, ethylene glycol-modified trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, and propylene glycol-modified trimethylol Examples include propane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, propoxylated glycerin tri(meth)acrylate, ethylene glycol-modified dipentaerythritol hexa(meth)acrylate, ethoxylated dipentaerythritol hexa(meth)acrylate, propylene glycol-modified pentaerythritol tetra(meth)acrylate, propylene glycol-modified dipentaerythritol hexa(meth)acrylate, caprolactone-modified pentaerythritol tetra(meth)acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate, pentaerythritol triacrylate succinate monoester, dipentaerythritol pentaacrylate succinate monoester, pentaerythritol triacrylate maleate monoester, and dipentaerythritol pentaacrylate maleate monoester.

[0073] The number of (meth)acryloyloxy groups in one molecule of compound (B-3) is preferably 3 to 12, more preferably 3 to 10, and even more preferably 3.

[0074] From the viewpoint of storage stability of the curable composition, the content of compound (B-3) is preferably 0.5% to 40% by mass, more preferably 0.8% to 30% by mass, even more preferably 1.0% to 20% by mass, even more preferably 2% to 20% by mass, and particularly preferably 4% to 20% by mass, relative to the total amount of polymerizable compound (B). From the viewpoint of suppressing viscosity changes of the curable composition, the content is most preferably 4% to 15% by mass. From the viewpoint of storage stability of the curable composition, the content of compound (B-3) is preferably 0.1% to 30% by mass, more preferably 0.2% to 20% by mass, even more preferably 0.5% to 10% by mass, even more preferably 1.5% to 10% by mass, and particularly preferably 2.6% to 10% by mass, relative to the total amount of solids in the curable composition. From the viewpoint of suppressing viscosity changes in the curable composition, the most preferred content is 2.6% to 8% by mass. When the content of compound (B-3) is within the above range, a curable composition with improved storage stability can be obtained. If the content of compound (B-3), which is a polyfunctional (meth)acrylate compound, is too high, the viscosity of the curable composition may increase. Also, if the content of compound (B-3) is too high, polymerization of the polymerizable compound is more likely to proceed during storage, or polymerization of the polymerizable compound is more likely to proceed due to heat, resulting in a large change in the viscosity of the curable composition and a high viscosity. For example, when applying the curable composition by inkjet or other methods, nozzle clogging is more likely to occur near the discharge port.

[0075] Examples of photoradical polymerizable compounds include (meth)acrylate compounds (hereinafter also referred to as "compound (B-4)") that have a vinyl ether group and a (meth)acryloyl group (preferably a (meth)acryloyloxy group, more preferably an acryloyloxy group) in the same molecule. Compound (B-4) may be a compound belonging to any of compounds (B-1) to (B-3).

[0076] The number of vinyl ether groups in compound (B-4) is preferably 1 to 4, more preferably 1 to 2, and even more preferably 1. The number of (meth)acryloyl groups in compound (B-4) is preferably 1 to 4, more preferably 1 to 2, and even more preferably 1.

[0077] Compound (B-4) includes 2-vinyloxyethyl (meth)acrylate, 3-vinyloxypropyl (meth)acrylate, 2-vinyloxypropyl (meth)acrylate, 1-vinyloxypropyl (meth)acrylate, 1-methyl-2-vinyloxyethyl (meth)acrylate, 4-vinyloxybutyl (meth)acrylate, 3-vinyloxybutyl (meth)acrylate, 2-vinyloxybutyl (meth)acrylate, 1-methyl-3-vinyloxypropyl (meth)acrylate, and 2-methyl-3-vinyloxypropyl (meth)acrylate. Rate, 1-methyl-2-vinyloxypropyl (meth)acrylate, 1,1-dimethyl-2-vinyloxyethyl (meth)acrylate, 6-vinyloxyhexyl (meth)acrylate, 4-vinyloxycyclohexyl (meth)acrylate, (4-vinyloxymethylcyclohexyl)methyl (meth)acrylate, (3-vinyloxymethylcyclohexyl)methyl (meth)acrylate, (2-vinyloxymethylcyclohexyl)methyl (meth)acrylate, (4-vinyloxymethylphenyl)methyl (meth)acrylate, (3- Niroxymethylphenyl)methyl (meth)acrylate, 2-vinyloxymethylphenyl methyl (meth)acrylate, 2-(2-vinyloxyisopropoxy)ethyl (meth)acrylate, 2-(2-vinyloxyethoxy)ethyl (meth)acrylate, 2-(2-vinyloxyethoxy)propyl (meth)acrylate, 2-(2-vinyloxyisopropoxy)propyl (meth)acrylate, 2-(2-vinyloxyethoxy)isopropyl (meth)acrylate, 2-(2-vinyloxyisopropoxy)isopropyl (meth)acrylate 2-{2-(2-vinyloxyethoxy)ethoxy}ethyl (meth)acrylate, 2-{2-(2-vinyloxyisopropoxy)ethoxy}ethyl (meth)acrylate, 2-{2-(2-vinyloxyisopropoxy)isopropoxy}ethyl (meth)acrylate, 2-{2-(2-vinyloxyethoxy)ethoxy}propyl (meth)acrylate, 2-{2-(2-vinyloxyethoxy)isopropoxy}propyl (meth)acrylate, 2-{2-(2-vinyloxyisopropoxy)ethoxy}propyl (meth)acrylate,2-{2-(2-vinyloxyisopropoxy)isopropoxy}propyl (meth)acrylate, 2-{2-(2-vinyloxyethoxy)ethoxy}isopropyl (meth)acrylate, 2-{2-(2-vinyloxyethoxy)isopropoxy}isopropyl (meth)acrylate, 2-{2-(2-vinyloxyisopropoxy)ethoxy}isopropyl (meth)acrylate, 2-{2-(2-vinyloxy Examples include sopropoxy)isopropoxy}isopropyl(meth)acrylate, 2-[2-{2-(2-vinyloxyethoxy)ethoxy}ethoxy]ethyl(meth)acrylate, 2-[2-{2-(2-vinyloxyisopropoxy)ethoxy}ethoxy]ethyl(meth)acrylate, and 2-(2-[2-{2-(2-vinyloxyethoxy)ethoxy}ethoxy]ethoxy]ethyl(meth)acrylate.

[0078] The compound (B-4) is preferably vinyloxy C 1-6 Alkyl (meth)acrylate or (vinyloxy C 1-4 Alkoxy)C 1-4 Alkyl (meth)acrylate, more preferably (vinyloxy C 1-4 Alkoxy)C 1-4 Alkyl (meth)acrylate, more preferably 2-(2-vinyloxyethoxy)ethyl (meth)acrylate. Furthermore, as compound (B-4), an acrylate compound having a vinyl ether group and an acryloyloxy group in the same molecule is preferred, and more preferably vinyloxy C 1-6 Alkyl acrylate or (vinyloxy C 1-4 Alkoxy)C 1-4 It is an alkyl acrylate, and more preferably (vinyloxy C 1-4 Alkoxy)C 1-4 Alkyl acrylates, more preferably 2-(2-vinyloxyethoxy)ethyl acrylate.

[0079] Examples of two bifunctional acrylate compounds containing at least polymerizable compound (B) include the acrylate compounds in the example of compound (B-2) above, and may be selected based on the value of the topological polar surface area.

[0080] The topological polar surface area of ​​a bifunctional acrylate compound is not particularly limited, but polymerizable compound (B) has a topological polar surface area of ​​55 Å. 2 The above-mentioned difunctional acrylate compound (hereinafter also referred to as "compound (B-2A)") is included in at least one of these compounds, and / or has a topological polar surface area of ​​55 Å. 2 It is preferable that the polymerizable compound (B) contains at least one difunctional acrylate compound (hereinafter also referred to as "compound (B-2B)") which is less than 1, and it is more preferable that it contains at least one compound (B-2A) and at least one compound (B-2B). When polymerizable compound (B) contains at least one compound (B-2A) and at least one compound (B-2B), both compounds having a hydrophilic structure and compounds having a hydrophobic structure are present in the curable composition, which suppresses the decrease in dispersibility of semiconductor particles (A) due to compositional changes associated with adjusting the composition of the composition, and thus improves the storage stability of the curable composition. Topological polarity surface area is a calculated value representing the surface area of ​​the polarized portion of a molecule, and can be calculated based on the method described in Ertl P. et al., J. Med. Chem. 2000, 43, 3714. Specifically, it can be calculated using software such as ChemDraw 22.0 (Cambridge Soft).

[0081] The compound (B-2A) is preferably diethylene glycol diacrylate (61.8 Å). 2 ), triethylene glycol diacrylate (71.1 Å 2 ), polyethylene glycol diacrylate (80Å 2 (The above), dipropylene glycol diacrylate (61.8 Å 2 ), tripropylene glycol diacrylate (71.1 Å 2), polypropylene glycol diacrylate (80Å 2 (The above) Diacrylate (90Å) obtained by adding 4 moles or more of ethylene oxide or propylene oxide to 1 mole of neopentyl glycol, in which two hydroxyl groups of the diol are replaced by acryloyloxy groups. 2 (The above) Diacrylates obtained by adding 2 to 4 moles or more of ethylene oxide or propylene oxide to 1 mole of bisphenol A, in which two hydroxyl groups of the diol are substituted with acryloyloxy groups (71.6 to 89.5 Å 2 (100 Å) Diacrylate (100 Å) obtained by adding 3 moles or more of ethylene oxide or propylene oxide to 1 mole of trimethylolpropane, in which two hydroxyl groups of the triol are substituted with acryloyloxy groups. 2 Diacrylates of polyols having intramolecular ether bonds (as described above); neopentyl glycol hydroxypivalate diacrylate (78.9 Å 2 Diacrylates of polyols having intramolecular ester bonds, such as (133.8 Å); diacrylates in which two hydroxyl groups of tris(2-hydroxyethyl)isocyanurate are replaced by acryloyloxy groups (133.8 Å) 2 Examples include diacrylates of heterocyclic polyols such as ); and more preferably diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, ethylene glycol diacrylate, propylene glycol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, polypropylene glycol diacrylate, etc. 2-4 This is a diacrylate of a diol formed by the polyetherization of two or more alkanediols.

[0082] The topological polar surface area of ​​compound (B-2A) is 55 Å. 2 That's all. 55 Å 2 Above 150 Å 2 The following is preferred: 55 Å 2 Above 120 Å 2The following is more preferable: 55 Å 2 Above 100 Å 2 The following is even more preferable: 60 Å 2 The above 80Å 2 The following are even more preferable.

[0083] The content of compound (B-2A) is preferably 30% by mass or more and 98% by mass or less, more preferably 35% by mass or more and 95% by mass or less, even more preferably 40% by mass or more and 90% by mass or less, and even more preferably 45% by mass or more and 85% by mass or less, relative to the total amount of compound (B-2). The content of compound (B-2A) is preferably 5% by mass or more and 95% by mass or less, more preferably 10% by mass or more and 90% by mass or less, and even more preferably 20% by mass or more and 80% by mass or less, relative to the total amount of polymerizable compound (B). The content ratio of compound (B-2A):compound (B-3) is preferably 0.1 to 60:1, more preferably 0.5 to 50:1, even more preferably 1.0 to 40:1, and even more preferably 1.0 to 17:1 by mass, from the viewpoint of storage stability of the curable composition, and particularly preferably 5.0 to 17:1 from the viewpoint of suppressing viscosity change of the curable composition. The content of compound (B-2A) is preferably 1% by mass or more and 80% by mass or less, more preferably 2.5% by mass or more and 70% by mass or less, and even more preferably 5% by mass or more and 65% by mass or less, relative to the total amount of solids in the curable composition. When the content (content rate, content ratio) of compound (B-2A) is within the above range, a curable composition with improved storage stability can be obtained. If the content of compound (B-2A) is too low, the stability and dispersibility of the semiconductor particles (A) in the curable composition may decrease, and if the content of compound (B-2A) is too high, the volatility per unit weight of the curable composition may increase, potentially leading to a larger change in viscosity during storage.

[0084] The compound (B-2B) is preferably ethylene glycol diacrylate (52.6 Å). 2 ), propylene glycol diacrylate (52.6Å2 ), 1,3-butylene glycol diacrylate (52.6 Å 2 ), 1,4-butanediol diacrylate (52.6Å 2 ), 1,5-pentanediol diacrylate (52.6 Å 2 ), 3-methyl-1,5-pentanediol diacrylate (52.6 Å 2 ), 1,6-hexanediol diacrylate (52.6Å 2 ), neopentyl glycol diacrylate (52.6Å 2 ), 1,8-octanediol diacrylate (52.6 Å 2 ), 1,9-nonanediol diacrylate (52.6Å 2 ), tricyclodecane dimethanol diacrylate (52.6 Å 2 The diacrylate is a C2-C20 aliphatic hydrocarbon compound having two or more hydroxyl groups, such as 1,3-butylene glycol diacrylate, 1,4-butanediol diacrylate, 1,5-pentanediol diacrylate, 3-methyl-1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, etc. 3-10 It is a diacrylate of an alkanediol.

[0085] The topological polar surface area of ​​compound (B-2B) is 55 Å. 2 It is less than 10 Å 2 The above 55Å 2 Preferably less than 20 Å 2 The above 55Å 2 Less than 30 Å is more preferable. 2 The above 55Å 2 Less than is even preferable.

[0086] The content of compound (B-2B) is preferably 2% by mass or more and 70% by mass or less, more preferably 5% by mass or more and 65% by mass or less, even more preferably 10% by mass or more and 60% by mass or less, and even more preferably 15% by mass or more and 55% by mass or less, relative to the total amount of compound (B-2). From the viewpoint of storage stability of the curable composition, the content of compound (B-2B) is preferably 2% by mass or more and 75% by mass or less, more preferably 5% by mass or more and 70% by mass or less, even more preferably 8% by mass or more and 65% by mass or less, even more preferably 10% by mass or more and 23.5% by mass or less, and particularly preferably 10% by mass or more and 23.0% by mass or less, relative to the total amount of polymerizable compound (B). The content ratio of compound (B-2B):compound (B-3) (compound (B-2B):compound (B-3)) is preferably 0.1 to 50:1, more preferably 0.5 to 40:1, even more preferably 0.8 to 30:1, even more preferably 1.0 to 15:1, and particularly preferably 1.0 to 5.5:1 by mass ratio, from the viewpoint of storage stability of the curable composition, and most preferably 1.5 to 5.5:1 from the viewpoint of suppressing viscosity change of the curable composition. The content of compound (B-2B) is preferably 1% by mass or more and 70% by mass or less, more preferably 2% by mass or more and 65% by mass or less, and even more preferably 4% by mass or more and 60% by mass or less, based on the total amount of solids in the curable composition. When the content (content rate, content ratio) of compound (B-2B) is within the above range, a curable composition with improved storage stability can be obtained. If the content of compound (B-2B) is too low, the stability and dispersibility of the semiconductor particles (A) in the curable composition may decrease, and if the content of compound (B-2B) is too high, the volatility per unit weight of the curable composition may increase, potentially leading to a larger change in viscosity during storage.

[0087] The total content of compound (B-2A) and compound (B-2B) is preferably 60% by mass or more and 100% by mass or less, more preferably 80% by mass or more and 100% by mass or less, even more preferably 90% by mass or more and 100% by mass or less, and even more preferably 95% by mass or more and 100% by mass or less, with 100% by mass being particularly preferred, relative to the total amount of compound (B-2). The total content of compound (B-2A) and compound (B-2B) is preferably 20% by mass or more and 99% by mass or less, more preferably 25% by mass or more and 97% by mass or less, and even more preferably 30% by mass or more and 95% by mass or less, relative to the total amount of polymerizable compound (B). The ratio of the total content of compound (B-2A) and compound (B-2B) to the content of compound (B-3) ((compound (B-2A) + compound (B-2B)): compound (B-3)) is preferably 0.2 to 100:1, more preferably 1.0 to 80:1, even more preferably 1.5 to 60:1, and even more preferably 1.5 to 23:1 in mass ratio from the viewpoint of storage stability of the curable composition, and particularly preferably 5.5 to 23:1 from the viewpoint of suppressing viscosity change of the curable composition. From the viewpoint of storage stability of the curable composition, the total content of compound (B-2A) and compound (B-2B) is preferably 10% to 97% by mass, more preferably 20% to 95% by mass, even more preferably 30% to 90% by mass, even more preferably 30% to 60% by mass, and particularly preferably 30% to 59% by mass, relative to the total amount of solids in the curable composition. When the total content (content rate, content ratio) of compound (B-2A) and compound (B-2B) falls within the above range, a curable composition with improved storage stability can be obtained.

[0088] The content of compound (B-2A) is preferably 30% by mass or more, more preferably 35% by mass or more and 95% by mass or less, even more preferably 40% by mass or more and 90% by mass or less, and even more preferably 45% by mass or more and 85% by mass or less. When the content of compound (B-2A) relative to the total amount of compound (B-2A) and compound (B-2B) is within the above range, a curable composition with improved storage stability can be obtained. If the content of compound (B-2A) relative to the total amount of compound (B-2A) and compound (B-2B) is too low, the amount of volatilization per unit weight of the curable composition may increase, potentially leading to a large change in viscosity during storage. Conversely, if the content is too high, the viscosity of the curable composition may increase.

[0089] Examples of a (meth)acrylate compound containing at least one trifunctional or more polymerizable compound (B) include the (meth)acrylate compound exemplified as compound (B-3) above, and from the viewpoint of film formation of the cured film, a polyfunctional acrylate compound having three or more acryloyloxy groups in the molecule (hereinafter also referred to as "compound (B-3A)") is preferred. Examples of compound (B-3A) include the acrylate compound in compound (B-3) above.

[0090] The compound (B-3A) is preferably glycerin triacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, tris(2-acryloyloxyethyl) isocyanurate, ethylene glycol-modified pentaerythritol tetraacrylate, ethylene glycol-modified trimethylolpropane triacrylate, or ethoxylated trimethylolpropane triacrylate. Propylene glycol-modified trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, propoxylated glycerin triacrylate, ethylene glycol-modified dipentaerythritol hexaacrylate, ethoxylated dipentaerythritol hexaacrylate, propylene glycol-modified pentaerythritol tetraacrylate, propylene glycol-modified dipentaerythritol hexaacrylate, caprolactone-modified pentaerythritol tetraacrylate, caprolactone-modified dipentaerythritol The more preferable are thritol hexaacrylate, pentaerythritol triacrylate succinate monoester, dipentaerythritol pentaacrylate succinate monoester, pentaerythritol triacrylate maleate monoester, and dipentaerythritol pentaacrylate maleate monoester, and more preferably glycerin triacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, and tris(2- Acryloyloxyethyl isocyanurate, ethylene glycol-modified pentaerythritol tetraacrylate, ethylene glycol-modified trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, propylene glycol-modified trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, propoxylated glycerin triacrylate, propylene glycol-modified pentaerythritol tetraacrylate, caprolactone-modified pentaerythritol tetraacrylate,Pentaerythritol triacrylate succinate monoester, dipentaerythritol pentaacrylate succinate monoester, pentaerythritol triacrylate maleate monoester, dipentaerythritol pentaacrylate maleate monoester, and more preferably trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, tris(2-acryloyloxyethyl) isocyanurate, ethylene glycol-modified pentaerythritol tetraacrylate, ethylene glycol-modified trimethylolpropane triacrylate These include tyrolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, propylene glycol-modified trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, propylene glycol-modified pentaerythritol tetraacrylate, caprolactone-modified pentaerythritol tetraacrylate, pentaerythritol triacrylate succinate monoester, dipentaerythritol pentaacrylate succinate monoester, pentaerythritol triacrylate maleate monoester, and dipentaerythritol pentaacrylate maleate monoester.

[0091] The number of acryloyloxy groups in one molecule of compound (B-3A) is preferably 3 to 12, more preferably 3 to 10, and even more preferably 3.

[0092] The content of compound (B-3A) is preferably 50% to 100% by mass, more preferably 70% to 100% by mass, and even more preferably 90% to 100% by mass, relative to the total amount of compound (B-3). The content of compound (B-3A) is preferably 0.5% to 30% by mass, more preferably 0.8% to 20% by mass, and even more preferably 1.0% to 10% by mass, relative to the total amount of polymerizable compound (B). Furthermore, from the viewpoint of storage stability of the curable composition, it is preferably 2.0% to 20% by mass, more preferably 4.0% to 20% by mass, and from the viewpoint of suppressing viscosity changes of the curable composition, it is even more preferably 4.0% to 15% by mass. The content of compound (B-3A) is preferably 0.1% to 20% by mass, more preferably 0.2% to 10% by mass, and even more preferably 0.5% to 7.5% by mass, relative to the total amount of solids in the curable composition. Furthermore, from the viewpoint of storage stability of the curable composition, it is preferably 1.5% to 10% by mass, more preferably 2.6% to 10% by mass, and from the viewpoint of suppressing viscosity changes of the curable composition, it is most preferably 2.6% to 8% by mass. When the content of compound (B-3A) is within the above range, a curable composition with improved storage stability can be obtained. If the content of compound (B-3A) is too low, the amount of volatilization per unit weight of the curable composition increases, which may lead to a large change in viscosity during storage. If the content of compound (B-3A) is too high, the viscosity of the curable composition may become high. Furthermore, if the content of compound (B-3A) is too high, polymerization of the polymerizable compound is likely to proceed during storage, or polymerization of the polymerizable compound is likely to proceed due to heat, resulting in a large change in viscosity of the curable composition and a high viscosity. For example, when applying the curable composition by inkjet or other methods, nozzle clogging is likely to occur near the discharge port.

[0093] The content of polymerizable compound (B) is preferably 5% to 90% by mass, more preferably 10% to 85% by mass, even more preferably 15% to 82% by mass, and even more preferably 20% to 80% by mass, relative to the total amount of solids in the curable composition, and may be 79% or less by mass, 75% or less by mass, or 70% or less by mass. When the content of polymerizable compound (B) is within the above range, a curable composition with improved storage stability can be obtained.

[0094] [3] Polymerization initiator (C) The curable composition may further contain a polymerization initiator (C). The polymerization initiator (C) is a compound that generates active radicals, acids, etc., upon the action of light or heat, and can initiate the polymerization of the polymerizable compound (B). The curable composition may contain one or more polymerization initiators (C). Examples of polymerization initiators (C) include photopolymerization initiators such as oxime compounds, alkylphenone compounds, biimidazole compounds, triazine compounds, acylphosphine compounds, benzoin compounds, benzophenone compounds, quinone compounds, 10-butyl-2-chloroacridone, benzyl, methyl phenylglyoxylate, and titanocene compounds; and thermal polymerization initiators such as azo compounds and organic peroxides. Specifically, as the oxime compounds, alkylphenone compounds, biimidazole compounds, triazine compounds, benzoin compounds, benzophenone compounds, and quinone compounds, compounds exemplified in Japanese Patent Application Publication No. 2024-61630 can be used.

[0095] Acylphosphine compounds are compounds having a substructure represented by the following formula (1) (where * indicates a bond).

[0096] [ka]

[0097] The acylphosphine compound may be an acylphosphine oxide compound such as a monoacylphosphine oxide compound, a bisacylphosphine oxide compound, or a triacylphosphine oxide compound, with monoacylphosphine oxide compounds or bisacylphosphine oxide compounds being preferred, and bisacylphosphine oxide compounds being more preferred.

[0098] Examples of acylphosphine compounds include the compound represented by the following formula (1A).

[0099] [ka] [In formula (1A), 'a' represents an integer between 1 and 3. R 1 and R 2 Each of these independently represents a hydrocarbon group having 1 to 25 carbon atoms, which may have substituents, and the -CH2- contained in the hydrocarbon group may be replaced with -O-, -CO-, or -OCO-. 1 If they exist, they may be the same or different, and multiple R 2 If they exist, they may be identical or different.

[0100] R 1 and R 2 Examples of hydrocarbon groups having 1 to 25 carbon atoms represented by this formula include saturated hydrocarbon groups having 1 to 25 carbon atoms, unsaturated hydrocarbon groups having 2 to 25 carbon atoms, and aromatic hydrocarbon groups having 6 to 25 carbon atoms.

[0101] Examples of the saturated hydrocarbon groups having 1 to 25 carbon atoms include linear alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, dodecyl, hexadecyl, and eicosyl groups; branched alkyl groups such as isopropyl, isobutyl, isopentyl, neopentyl, and 2-ethylhexyl groups; and alicyclic saturated hydrocarbon groups having 3 to 20 carbon atoms such as cyclopropyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, and tricyclodecyl groups. The number of carbon atoms in the saturated hydrocarbon group is preferably 1 to 20, more preferably 1 to 15, and even more preferably 1 to 10.

[0102] Examples of the C2-C25 unsaturated hydrocarbon group include alkenyl groups such as vinyl, allyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, undecenyl, dodecenyl, hexadecenyl, octadecenyl, and eicosenyl groups; alkynyl groups such as ethynyl, propynyl, hexynyl, desinyl, and eicosinyl groups; and cycloalkenyl groups such as cyclopentenyl, cyclohexenyl, and cycloheptenyl groups. The number of carbon atoms in the unsaturated hydrocarbon group is preferably 2-20, more preferably 2-15, and even more preferably 2-10.

[0103] Examples of the aromatic hydrocarbon group having 6 to 25 carbon atoms include phenyl group, xylyl group, dimethylphenyl group, trimethylphenyl group, dipropylphenyl group, di(2,2-dimethylpropyl)phenyl group, naphthyl group, benzyl group, phenylethyl group, and phenylbutyl group. The number of carbon atoms in the aromatic hydrocarbon group is preferably 6 to 20, more preferably 6 to 18, even more preferably 6 to 15, and even more preferably 6 to 12.

[0104] R 1 and R 2 The hydrocarbon group represented by may have substituents such as halogen atoms, cyano groups, and nitro groups. The halogen atom is preferably a fluorine atom, a bromine atom, a chlorine atom, or an iodine atom.

[0105] The -CH2- contained in the hydrocarbon group may be replaced with -O-, -CO-, or -OCO-, and adjacent -CH2- will not be substituted with the same type of group at the same time, nor will terminal -CH2- be substituted.

[0106] a represents an integer from 1 to 3, preferably 1 or 2, more preferably 2.

[0107] R 1 and R 2 The hydrocarbon group having 1 to 25 carbon atoms represented is preferably an aromatic hydrocarbon group having 6 to 25 carbon atoms, more preferably an aromatic hydrocarbon group having 6 to 20 carbon atoms, even more preferably an aromatic hydrocarbon group having 6 to 12 carbon atoms, even more preferably a phenyl group, a xylyl group, a dimethylphenyl group, or a trimethylphenyl group, even more preferably a phenyl group, a dimethylphenyl group, or a trimethylphenyl group, and even more preferably a phenyl group or a trimethylphenyl group.

[0108] Examples of acylphosphine compounds include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-(2,4-dipentyloxyphenyl), and (2,4,6-trimethylbenzoyl)diphenylphosphine oxide, with bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and (2,4,6-trimethylbenzoyl)diphenylphosphine oxide being preferred. Commercially available acylphosphine compounds such as OMNIRAD® 819 (manufactured by IGM Resins) may also be used.

[0109] From the viewpoint of increasing the luminescence intensity of the curable composition and cured film, it is preferable that the photopolymerization initiator contains at least an acylphosphine oxide compound.

[0110] The content of polymerization initiator (C) is preferably 0.1% to 20% by mass, more preferably 0.2% to 15% by mass, even more preferably 0.5% to 10% by mass, even more preferably 1% to less than 10% by mass, even more preferably 1% to 9% by mass, and even more preferably 1% to 8% by mass, and may also be 6% or less by mass or 5% or less by mass, based on the total amount of solids in the curable composition.

[0111] [4] Polymerization initiator (C1) The curable composition may further contain polymerization initiators (C1) along with a polymerization initiator (C), and may contain two or more polymerization initiators (C1). The polymerization initiator (C1) is a compound or sensitizer used to promote the polymerization of a polymerizable compound (B) initiated by the polymerization initiator (C). Examples of polymerization initiators (C1) include photopolymerization initiators such as amine compounds, alkoxyanthracene compounds, thioxanthone compounds, and carboxylic acid compounds, as well as thermal polymerization initiators. Specifically, polymerization initiators described in Japanese Patent Application Publication No. 2024-61630 can be used.

[0112] When the curable composition contains a polymerization initiator (C1), the content of the polymerization initiator (C1) in the curable composition is preferably 0.1 parts by mass or more and 300 parts by mass or less, more preferably 0.1 parts by mass or more and 200 parts by mass or less, per 100 parts by mass of the polymerizable compound (B). When the content of the polymerization initiator (C1) is within the above range, the sensitivity of the curable composition can be further improved.

[0113] [5] Antioxidant (D) The curable composition may contain an antioxidant (D), and there are no particular limitations on the antioxidant (D) as long as it is an antioxidant commonly used in industry. Phenolic antioxidants, phosphorus-based antioxidants, sulfur-based antioxidants, etc., can be used. For example, antioxidants described in Japanese Patent Publication No. 2024-61630 can be used. The curable composition may contain two or more types of antioxidants (D).

[0114] As the phenolic antioxidant, an antioxidant having a hindered phenol structure in which a bulky organic group is bonded to at least one ortho-position of the phenolic hydroxy group is preferable. As the bulky organic group, a secondary or tertiary alkyl group is preferable, and specifically, an isopropyl group, s-butyl group, t-butyl group, s-amyl group, t-amyl group, etc. may be mentioned. Among them, a tertiary alkyl group is preferable, and a t-butyl group or t-amyl group is particularly preferable.

[0115] As the phosphorus-based antioxidant, an antioxidant having a group represented by the following formula (e1) is preferable.

[0116]

Chemical formula

[0117] R e1 is preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, more preferably a hydrogen atom, a methyl group, an ethyl group, or a t-butyl group. R e2 and R e4 are each independently preferably a methyl group or a hydrogen atom, more preferably a hydrogen atom. R e3 and R e5 are each independently preferably an alkyl group, more preferably a secondary or tertiary alkyl group, still more preferably a t-butyl group or a t-amyl group. The two units enclosed by parentheses may be bonded to each other to form a ring. The bonding of R e1 to each other means a mode in which the groups obtained by removing hydrogen atoms from R e1 are bonded to each other. When both of the two R e1 are hydrogen atoms, the carbon atom to which R e1 in one benzene ring is bonded and the R e1 in the other benzene ring...e1 This refers to a form of bonding where carbon atoms are directly bonded to each other.

[0118] As the antioxidant (D), a phenolic antioxidant or a phosphorus-based antioxidant is preferred, more preferably an antioxidant having at least one of the above-mentioned hindered phenol structure and the group represented by formula (e1), even more preferably an antioxidant having both the above-mentioned hindered phenol structure and the group represented by formula (e1), and Smirizer® GP is particularly preferred.

[0119] The content of antioxidant (D) is preferably 0.01% by mass or more and 60% by mass or less with respect to the total amount of solids in the curable composition, and more preferably 0.1% by mass or more and 50% by mass or less, even more preferably 0.2% by mass or more and 40% by mass or less, and even more preferably 0.5% by mass or more and 30% by mass or less, and may also be 20% by mass or less, 10% by mass or less, 5% by mass or less, or 2% by mass or less.

[0120] [6] Light scattering agent (E) The curable composition may further contain a light scattering agent (E). The inclusion of a light scattering agent (E) improves the scattering of light from a light source irradiated onto the cured film formed from the curable composition. The curable composition may contain two or more types of light scattering agents (E).

[0121] Examples of light scattering agents (E) include metal or metal oxide particles, and inorganic particles such as glass particles. Examples of metal oxides include TiO2, SiO2, BaTiO3, and ZnO, and TiO2 particles are preferred because they efficiently scatter light.

[0122] When the curable composition contains a light scattering agent (E), the content of the light scattering agent (E) in the curable composition is, for example, 0.001% by mass or more and 50% by mass or less, relative to the total amount of solids in the curable composition. From the viewpoint of improving the light scattering ability and luminescence intensity of the curable composition and cured film, it is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 1% by mass or more, and also preferably 30% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less.

[0123] [7] Solvent (F) The curable composition may contain a solvent (F), but if it contains a solvent (F), it is preferable that the content be low, and even more preferable that it does not contain a solvent (F). The content of solvent (F) in the curable composition is preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 3% by mass or less, even more preferably 2% by mass or less, and particularly preferably 1% by mass or less, and may also be 0% by mass or 0.5% by mass or more. By reducing the content of solvent (F), it becomes easier to control the film thickness when forming a cured film, and it is possible to reduce manufacturing costs and the burden on the global environment and the working environment due to solvents. The curable composition may contain two or more types of solvents (F).

[0124] As the solvent (F), solvents described in Japanese Patent Publication No. 2024-61630 can be used.

[0125] [8] Leveling agent (H) The curable composition may contain a leveling agent (H), and may contain two or more types of leveling agents (H). Examples of leveling agents (H) include silicone surfactants, fluorine surfactants, and silicone surfactants having a fluorine atom, which may have polymerizable groups in their side chains. Specifically, as leveling agents (H), those described in Japanese Patent Application Publication No. 2024-61630 can be used.

[0126] When the curable composition contains a leveling agent (H), the content of the leveling agent (H) in the curable composition is, for example, 0.001% by mass or more and 1.0% by mass or less, preferably 0.005% by mass or more and 0.75% by mass or less, more preferably 0.01% by mass or more and 0.5% by mass or less, and even more preferably 0.05% by mass or more and 0.5% by mass or less, relative to the total amount of solids in the curable composition. When the content of the leveling agent (H) is within the above range, the flatness of the cured film can be further improved.

[0127] [9] Resin (I) The curable composition may contain resin(I), but a low content is preferable. The resin(I) content is preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 3% by mass or less, even more preferably 2% by mass or less, particularly preferably 1% by mass or less, and may also be 0% by mass or 0.5% by mass or more, based on the total amount of solids in the curable composition. By reducing the resin(I) content, the viscosity of the curable composition can be reduced, which in turn can improve the ejectability, particularly the ejectability when ejected from the ejection head of an inkjet printer. The curable composition may contain two or more types of resin(I).

[0128] As resin (I), resins such as those described in Japanese Patent Publication No. 2024-61630 can be used.

[0129]

[10] Other ingredients The curable composition may optionally contain other additives such as dispersants, plasticizers, and fillers.

[0130] Examples of dispersants include, but are not limited to, cationic, anionic, nonionic, amphoteric, polyester, polyamine, and acrylic surfactants. Dispersants are preferably used in combination when the curable composition contains a light scattering agent (E). The inclusion of a dispersant in the curable composition improves the dispersibility of the light scattering agent (E) in the curable composition.

[0131] The dispersant content in the curable composition is preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 3% by mass or less, and particularly preferably 1% by mass or less, relative to the total amount of solids in the curable composition. It may also be 0% by mass, 0.1% by mass or more, or 0.2% by mass or more. Furthermore, from the viewpoint of viscosity reduction, it is preferably 3% by mass or less, more preferably 2% by mass or less, and particularly preferably 1% by mass or less.

[0132] The additive content in the curable composition is preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 3% by mass or less, particularly preferably 1% by mass or less, and may also be 0% by mass, based on the total amount of solids in the curable composition.

[0133] <Method for producing a curable composition and viscosity> The curable composition can be manufactured by a method that includes a step of mixing a predetermined component with other components used as needed.

[0134] The mixing order of each component is not particularly limited, but after mixing semiconductor particles (A) and polymerizable compound (B) to obtain a dispersion, a curable composition can be prepared by mixing the dispersion with a polymerization initiator (C), an antioxidant (D), and other components.

[0135] The ligand-containing semiconductor particle (A) may be prepared by preparing or creating semiconductor particles to which organic ligands are coordinated, and then subjecting them to a ligand reduction treatment to reduce the amount of organic ligands coordinating to the semiconductor particles. The ligand reduction treatment can be a process of extracting the organic ligands coordinated to the semiconductor particles into a suitable solvent.

[0136] The viscosity of the curable composition (especially the curable composition immediately after preparation) at 40°C is preferably 20 cP or less, more preferably 17 cP or less, even more preferably 15 cP or less, and even more preferably 14 cP or less. The lower limit is not particularly limited, but may be 2 cP or more, 3 cP or more, or 5 cP or more. The viscosity of the curable composition (especially the curable composition immediately after preparation) at 25°C is preferably 30 cP or less, more preferably 25 cP or less, and even more preferably 23 cP or less. The lower limit is not particularly limited, but may be 2 cP or more, 3 cP or more, or 5 cP or more. The viscosity of the curable composition (especially the curable composition immediately after preparation) at 50°C is preferably 15 cP or less, more preferably 13 cP or less, even more preferably 11 cP or less, and even more preferably 9 cP or less. The lower limit is not particularly limited, but may be 1 cP or more, 2 cP or more, or 3 cP or more. By setting the viscosity of the curable composition within the above range, the discharge performance is improved. In particular, by setting the viscosity of the curable composition within the above range, the curable composition can be smoothly discharged from the ejection head of an inkjet printer, making it suitable for use as an inkjet printer ink. The viscosity of the curable composition can be measured using a Brookfield rotational viscometer (manufactured by Brookfield).

[0137] When used as an ink for inkjet printers, the curable composition can be ejected from the inkjet printer's ejection head at a temperature of 40°C or higher. The temperature of the curable composition when ejected from the inkjet printer's ejection head may be 45°C or higher, 50°C or higher, or 80°C or lower.

[0138] <Cured film> The present invention includes a cured film formed from a curable composition. A cured film containing semiconductor particles (A) can emit light of a different wavelength from the irradiated light when irradiated with ultraviolet or visible light. Therefore, a cured film containing semiconductor particles (A) can be used as a wavelength conversion film.

[0139] The thickness of the cured film is, for example, 0.5 μm to 40 μm, preferably 1 μm to 35 μm, and more preferably 5 μm to 30 μm.

[0140] <Method for manufacturing hardened film> A cured film can be obtained by curing a film (layer) made of a curable composition. Specifically, a cured film can be obtained by applying a curable composition to a substrate to form a coating film, and then exposing the obtained coating film to light. Alternatively, a cured film may be obtained by further thermal curing (post-bake) after the exposure. Thermal curing can further advance the polymerization of the polymerizable compound (B).

[0141] The curable composition of the present invention has improved storage stability (especially under high-temperature conditions) because the polymerizable compound (B) has a specific configuration, and a good cured film can be formed even when the curable composition is used after storage. The viscosity change evaluated in the examples described below is preferably 105.0% or less, more preferably 104.0% or less, even more preferably 103.0% or less, even more preferably 102.0% or less, and particularly preferably 101.5% or less. The lower limit is not particularly limited, but may be 100.0% or more, or 100.5% or more. When ink is applied by the inkjet method, the curable composition is temporarily exposed to high-temperature conditions near the discharge port, but because the viscosity change is within the above range, a constant viscosity can be maintained at the discharge port, enabling stable discharge of droplet volume and droplet flight speed. Furthermore, the weight loss rate evaluated in the examples described later is preferably 0.40% or less, more preferably 0.38% or less, even more preferably 0.36% or less, and particularly preferably 0.30% or less. The lower limit is not particularly limited, but may be 0.00% or more, 0.10% or more, or 0.20% or more. When ink is applied by the inkjet method, the curable composition is temporarily exposed to high-temperature conditions near the discharge port, but because the weight loss rate is within the above range, a constant composition ratio can be maintained even at the discharge port, thereby suppressing unevenness in the thickness and composition of the cured film and maintaining stable ink performance.

[0142] As substrates, glass plates such as quartz glass, borosilicate glass, aluminasilate glass, and soda-lime glass with a silica coating on the surface, resin plates such as polycarbonate, polymethyl methacrylate, and polyethylene terephthalate, silicone, and substrates on which aluminum, silver, or silver / copper / palladium alloy thin films are formed, or substrates on which a color filter is formed, can be used. Preferred substrates are glass plates and silicone substrates.

[0143] For applying the curable composition, various printing methods such as gravure printing, offset printing, letterpress printing, screen printing, transfer printing, electrostatic printing, and plateless printing, as well as coating methods such as gravure coating, roll coating, knife coating, air knife coating, bar coating, dip coating, kiss coating, spray coating, die coating, comma coating, inkjet, spin coating, and slit coating, or combinations thereof, can be used as appropriate.

[0144] The light source used for exposure is preferably one that generates light with a wavelength between 250 nm and 450 nm. Light below 350 nm may be filtered out using a filter that cuts out this wavelength range, or light around 436 nm, 408 nm, and 365 nm may be selectively extracted using a bandpass filter that extracts these wavelength ranges. Examples of light sources include mercury lamps, light-emitting diodes, metal halide lamps, and halogen lamps. Exposure may be performed in an atmospheric environment or in an inert gas (nitrogen, argon, etc.) atmosphere, but is preferably performed in an inert gas atmosphere. The exposure amount X in the exposure process is preferably 50 to 1000 mJ / cm². 2 More preferably, 80-800 mJ / cm² 2 And more preferably 100-700 mJ / cm² 2 And more preferably 150-700 mJ / cm² 2 The exposure amount X in the exposure process is 1000 mJ / cm². 2 The following conditions prevent excessive shrinkage of the cured film, thereby preventing the semiconductor particles (A) from coming into close proximity within the film due to shrinkage, and thus preventing a decrease in emitted light intensity. The exposure amount X is the exposure amount based on a wavelength of 365 nm and can be measured using an ultraviolet integrated light meter (UIT-250, manufactured by Ushio Inc.).

[0145] The temperature for thermosetting after exposure is preferably 100 to 220°C, and more preferably 140 to 200°C. By using this temperature range, the hardness of the cured film can be appropriately controlled. The curing time in the curing process is preferably 30 seconds to 2 hours, more preferably 3 minutes to 1.5 hours, and even more preferably 5 minutes to 1.2 hours. The curing process may be carried out in either an atmospheric or inert gas atmosphere.

[0146] Furthermore, a patterned cured film can be formed from a curable composition by patterning using methods such as photolithography, inkjet printing, or other printing methods. However, since photolithography results in the loss of expensive composition materials, it is preferable to use the inkjet method from the viewpoint of reducing material loss.

[0147] A method for manufacturing a cured film patterned by an inkjet method includes forming banks on a substrate, selectively depositing a curable composition into the areas partitioned by the banks on the substrate using an inkjet method, and curing the curable composition by exposure (and, if necessary, thermal curing). As the substrate, the substrates exemplified in the description of the method for manufacturing the cured film described above can be used.

[0148] Methods for forming a bank include photolithography and inkjet, with inkjet being preferred. Examples of inkjet methods include the bubble jet (registered trademark) method, which uses an electrothermal converter as an energy generating element, or the piezo jet method, which uses a piezoelectric element.

[0149] As the light source used for exposure, the light source exemplified in the description of the manufacturing method for the cured film described above can be used. Furthermore, the thermal curing conditions after exposure can be found in the description of the manufacturing method for the cured film described above.

[0150] <Wavelength conversion film and display device> Unpatterned or patterned cured films can be suitably used as wavelength conversion films (wavelength conversion filters) that emit light of a different wavelength than the light incident from light-emitting parts such as LEDs. In particular, it is preferable that the patterned cured film be positioned above light-emitting elements such as LEDs corresponding to each pattern. By individually converting the wavelength of each light-emitting element, the shape of the emission spectrum of red, green, blue, etc. can be appropriately controlled, and high color reproducibility can be achieved. Display members having wavelength conversion films can be suitably used in display devices such as liquid crystal displays and organic EL displays.

[0151] Figure 1 is a schematic cross-sectional view of one embodiment of a display member formed by an inkjet method. The display member 10 in Figure 1 has banks 2 formed on a substrate 1 and light-emitting elements 3 such as LEDs installed between the banks 2. The curable composition of the present invention is deposited on the light-emitting elements 3 between the banks 2 by an inkjet method, and then cured to obtain a cured film 4 (wavelength conversion film) (hereinafter, each cured film patterned to the size between the banks 2 is also called a "cured film pixel"). A color filter 5 or a gas barrier layer 6 may be placed on each cured film pixel 4, and if a color filter 5 and a gas barrier layer 6 are present, the order in which the color filter 5 and gas barrier layer 6 are placed does not matter.

[0152] By forming the cured film pixels 4 using an inkjet method, it becomes possible to pattern relatively large sizes, making it suitable for large displays such as digital signage.

[0153] When employing the inkjet method, the vertical dimension (L1) of the cured film pixel 4 formed from the curable composition of the present invention is preferably 9 μm or more, more preferably 12 μm or more, even more preferably 15 μm or more, and may be 40 μm or less, or 30 μm or less. The vertical dimension (L1) may be the same length as the horizontal dimension (L3) of the light-emitting element.

[0154] Furthermore, when employing the inkjet method, the horizontal dimension (L2) of the cured film pixel 4 formed from the curable composition of the present invention is preferably 10 μm or more, more preferably 30 μm or more, even more preferably 50 μm or more, even more preferably 80 μm or more, particularly preferably 100 μm or more, and may be 900 μm or less, 800 μm or less, or 700 μm or less.

[0155] The vertical dimension (L1) of the cured film pixel 4 is the dimension in the substrate thickness direction of a cross-section cut perpendicular to the substrate. This cross-section is cut at the location where the vertical dimension of the cured film pixel 4 is maximum. Figure 1 shows the cross-section cut perpendicular to the substrate at the location where the vertical dimension of the cured film pixel 4 is maximum. The horizontal dimension (L2) of the cured film pixel 4 is the maximum dimension of the cured film pixel 4 in a direction horizontal to the substrate, and refers to the dimension when viewing the substrate from the vertical direction (planar view dimension). The horizontal dimension (L3) of a light-emitting element refers to the maximum dimension of the light-emitting element in a direction horizontal to the substrate, and is the dimension when viewed from the vertical direction (plan view dimension) of the substrate.

[0156] The cured film has the function of converting the wavelength of irradiated light, and therefore can be used as a color conversion layer (wavelength conversion film) for display devices. Examples of such display devices include those described in Japanese Patent Publication No. 2006-309219, Japanese Patent Publication No. 2006-310303, Japanese Patent Publication No. 2013-15812, Japanese Patent Publication No. 2009-251129, Japanese Patent Publication No. 2014-2363, etc. The cured film according to the present invention is useful as a color conversion layer (wavelength conversion film) for display devices, particularly for liquid crystal display devices, organic EL display devices, or inorganic EL display devices. [Examples]

[0157] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the following examples, and it is certainly possible to implement it with appropriate modifications within the scope that is consistent with the spirit described above and below, and all such modifications are included within the technical scope of the present invention. In the following, unless otherwise specified, "parts" means "parts by mass" and "%" means "percent mass".

[0158] <Measurement, Evaluation> The measurements or evaluations in the following examples and comparative examples were performed by the methods described below.

[0159] [Topological polar surface area] The topological polar surface area of ​​polymerizable compound (B) was calculated by summing the contributions from polar substructures, based on the method described in Ertl P. et al., J. Med. Chem. 2000, 43, 3714. Specifically, the topological polar surface area was determined using ChemDraw 22.0 (Cambridge Soft).

[0160] [Viscosity of curable compositions] The viscosity of the curable composition immediately after preparation was measured at 25°C, 40°C, and 50°C using a Brookfield rotational viscometer (Brookfield) under constant temperature conditions of 25°C, 40°C, and 50°C.

[0161] [Storage stability of curable compositions] [Viscosity changes of curable compositions] The curable composition immediately after preparation was placed in a sealed container and left to stand for one day at 25°C. The viscosity (η0) of the curable composition after standing was measured at 25°C in a constant temperature environment using circulating water, using a Brookfield rotational viscometer (Brookfield). Subsequently, 2.0 g of the curable composition after standing was measured into a 6 mL screw-cap tube, the lid was closed, and it was placed on a hot plate set to 80°C for 4 hours. The viscosity (η1) of the curable composition after storage was measured at 25°C in a constant temperature environment using circulating water, using a Brookfield rotational viscometer (Brookfield). The change in viscosity of the curable composition was calculated from the viscosity before storage (η0) and the viscosity after 4 hours of storage at 80°C (η1) according to the following formula. Viscosity change (%) = 100 × η1 / η0

[0162] [Weight reduction rate of curable composition] The curable composition, immediately after preparation, was placed in a sealed container and left to stand for one day at 25°C. Then, 2.0 g of the curable composition was measured into a 6 mL screw-cap tube, the lid was closed, and the tube was placed on a hot plate set to 80°C for 4 hours. The weight loss rate of the curable composition was calculated from the weight before (W0) and after (W1) storage at 80°C for 4 hours, according to the following formula. Weight reduction rate (%)=100×(W0-W1) / W0

[0163] (Examples 1-5, Comparative Example 1) A polymerizable compound (B) was added to semiconductor particles (A), and the mixture was stirred using an ultrasonic cleaner and a touch mixer until all solid matter disappeared to obtain a dispersion. A polymerization initiator (C), an antioxidant (D), a light scattering agent (E), and a dispersant were added to the obtained dispersion, and the mixture was stirred using a touch mixer to obtain a curable composition. Table 1 shows the components used in the preparation of the curable composition, and Table 2 shows the mixing ratios of each component. In Table 2, the parts of each component are shown as solid content equivalents.

[0164] [Table 1]

[0165] [Table 2]

[0166] Table 3 shows the measurement and evaluation results using the curable compositions obtained in Examples 1-5 and Comparative Example 1.

[0167] [Table 3]

[0168] The curable compositions obtained in Examples 1-5 showed lower viscosity change (%) and weight loss rate (%) than the curable composition obtained in Comparative Example 1, indicating improved storage stability. Furthermore, the curable compositions obtained in Examples 1-5 were able to form a good cured film. [Explanation of symbols]

[0169] 1 Substrate, 2 Bank, 3 Light-emitting element, 4 Cured film (wavelength conversion film), 5 Color filter, 6 Gas barrier layer, 10 Display component, L1 Vertical dimension, L2 Horizontal dimension, L3 Horizontal dimension of light-emitting element.

Claims

1. A curable composition comprising semiconductor particles (A) and a polymerizable compound (B), A curable composition in which the polymerizable compound (B) comprises two or more difunctional acrylate compounds and one or more trifunctional or greater (meth)acrylate compounds.

2. The aforementioned bifunctional acrylate compound has a topological polar surface area of ​​55 Å. ２ The curable composition according to claim 1, comprising at least one of the above-mentioned compounds (B-2A).

3. The aforementioned bifunctional acrylate compound has a topological polar surface area of ​​55 Å. ２ The curable composition according to claim 1, comprising at least one compound (B-2B) that is less than [amount missing].

4. The aforementioned bifunctional acrylate compound has a topological polar surface area of ​​55 Å. ２ The above describes the compound (B-2A), and its topological polar surface area is 55 Å. ２ It contains a compound (B-2B) that is less than, The curable composition according to claim 1, wherein the content of compound (B-2A) is 30% by mass or more of the total of compound (B-2A) and compound (B-2B) in 100% by mass.

5. The curable composition according to claim 1, wherein the content of the semiconductor particles (A) is 20% by mass or more with respect to the total amount of solids in the curable composition.

6. The curable composition according to claim 1, further comprising a light scattering agent (E).

7. The curable composition according to claim 1, further comprising an antioxidant (D).

8. The curable composition according to claim 1, wherein the content of solvent (F) is 0 to 1% by mass relative to the total amount of the curable composition.

9. The curable composition according to claim 1, wherein the viscosity at 40°C is 20 cP or less.

10. The curable composition according to claim 1, which is an ink for inkjet printers.

11. A cured film formed from the curable composition according to any one of claims 1 to 10.

12. A display device comprising the cured film described in claim 11.

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