Mounting equipment, semiconductor manufacturing equipment, and semiconductor device manufacturing method

Abstract

The objective is to provide a technology that enables the driving of a moving object without waiting for recognition results. [Solution] The mounting device comprises a moving body, a drive unit for driving the moving body, an imaging device for capturing a target position of the moving body, and a control unit configured to drive the moving body with the drive unit based on a base target position, in parallel with the calculation of the target position based on the image captured by the imaging device, and to always set the base target position to a position in front of the calculated target position.

Description

Technical Field

[0001] The present disclosure relates to a mounting device and is applicable to, for example, a die bonder that aligns dies.

Background Art

[0002] As one step in the manufacturing process of a semiconductor device, there is a step in which a pickup head or a bond head (a moving body) provided with a collet picks up a die and moves it, and places the picked-up die.

[0003] Before picking up the die, the surface of the die is imaged by a camera, the center position of the die is detected from the captured image by image recognition, the deviation amount is calculated and corrected, and the collet picks it up. That is, the position of the die is recognized, and the collet is moved so that the center position of the collet coincides with the center position of the die and picked up (Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] An object of the present disclosure is to provide a technique capable of driving a moving body without waiting for a recognition result. Other problems and novel features will become apparent from the description of this specification and the accompanying drawings.

Means for Solving the Problems

[0006] The outline of a typical example in the present disclosure will be briefly described as follows. In other words, the mounting device comprises a moving body, a drive unit for driving the moving body, an imaging device for capturing a target position of the moving body, and a control unit configured to drive the moving body using the drive unit based on a base target position, in parallel with the calculation of the target position based on the image captured by the imaging device, and to always set the base target position to a position in front of the calculated target position. [Effects of the Invention]

[0007] According to this disclosure, it is possible to drive the moving object without waiting for the recognition result. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic top view showing an example of the configuration of a die bonder in an embodiment. [Figure 2] Figure 2 is a diagram illustrating the schematic configuration as seen from the direction of arrow A in Figure 1. [Figure 3] Figure 3 is a block diagram showing the schematic configuration of the die bonder control system shown in Figure 1. [Figure 4] Figure 4 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in Figure 1. [Figure 5] Figure 5 is a block diagram showing an example configuration of the motor control device shown in Figure 3. [Figure 6] Figure 6 illustrates the generation of the command waveform in the ideal waveform generation unit shown in Figure 5. [Figure 7] Figure 7 is a diagram illustrating the pickup operation. [Figure 8] Figure 8 shows the operation flow during the pickup operation. [Figure 9] Figure 9 shows an example of a command jerk waveform during two-stage operation. [Figure 10] Figure 10 shows the command waveform when a speed reversal occurs during two-stage operation. [Figure 11] Figure 11 is a block diagram showing an example of the configuration of a motor control device in another embodiment. [Figure 12]Figure 12 illustrates the generation of the command waveform in the ideal waveform generation unit shown in Figure 11. [Figure 13] Figure 13 is a diagram illustrating the effects of other embodiments. [Figure 14] Figure 14 illustrates the timing of target position changes. [Figure 15] Figure 15 shows examples of command jerk waveform, command acceleration waveform, and command velocity waveform when the target position change timing is CT1. [Figure 16] Figure 16 shows examples of command jerk waveform, command acceleration waveform, and command velocity waveform when the target position change timing is CT2. [Figure 17] Figure 17 shows examples of command jerk waveform, command acceleration waveform, and command velocity waveform when the target position change timing is CT3. [Modes for carrying out the invention]

[0009] Embodiments and modified examples will be described below with reference to the drawings. However, in the following description, the same reference numerals will be used for identical components, and repeated explanations may be omitted. In addition, to make the explanation clearer, the drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual embodiment. Furthermore, the dimensional relationships and ratios of each element do not necessarily match between multiple drawings.

[0010] The configuration of a die bonder, which is one embodiment of a mounting device and semiconductor manufacturing device, will be described using Figures 1 and 2. Figure 1 is a schematic top view showing an example of the configuration of a die bonder in the embodiment. Figure 2 is a diagram illustrating the schematic configuration as seen from the direction of arrow A in Figure 1.

[0011] The die bonder 1 generally includes a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a bonding unit 40, a transfer unit 50, a substrate supply unit 60, a substrate discharge unit 70, and a control unit (control device) 80. The Y2 - Y1 direction is the front - rear direction of the die bonder 1, the X2 - X1 direction is the left - right direction, and the Z1 - Z2 direction is the up - down direction. The wafer supply unit 10 is arranged on the front side of the die bonder 1, and the bonding unit 40 is arranged on the rear side.

[0012] The wafer supply unit 10 includes a wafer cassette lifter 11, a wafer holding stage 12, a peeling unit 13, and a wafer recognition camera 14.

[0013] The wafer cassette lifter 11 moves a wafer cassette (not shown) in which a plurality of wafer rings WR are stored up and down to the wafer transfer height. A wafer alignment chute (not shown) aligns the wafer ring WR supplied from the wafer cassette lifter 11. A wafer extractor (not shown) takes out the wafer ring WR from the wafer cassette and supplies it to the wafer holding stage 12, or takes it out from the wafer holding stage 12 and stores it in the wafer cassette.

[0014] A wafer W is adhered (stuck) on a dicing tape DT, and the wafer W is divided into a plurality of dies D. The dicing tape DT is held by the wafer ring WR. The wafer W is, for example, a semiconductor wafer or a glass wafer, and the die D is a semiconductor chip or a glass chip. A film - like adhesive material DF called a die attach film (DAF) may be pasted between the wafer W and the dicing tape DT. The adhesive material DF cures by heating.

[0015] The wafer holding stage 12 is moved in the X1 - X2 direction and the Y1 - Y2 direction by a drive unit (not shown) to move the die D to be picked up to the position of the peeling unit 13. Also, the wafer holding stage 12 rotates the wafer ring WR in the XY plane by a drive unit (not shown). The peeling unit 13 is moved in the up - down direction by a drive unit (not shown). The peeling unit 13 peels the die D from the dicing tape DT.

[0016] The wafer recognition camera 14 recognizes the pickup position of the die D to be picked up from the wafer W and performs surface inspection of the die D.

[0017] The pickup unit 20 includes a pickup head 21 and a pickup head table 23 as an operating unit. The pickup head 21 is provided with a collet 22 that adsorbs and holds the peeled die D at its tip. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The pickup head table 23 moves the pickup head 21 in the Y1-Y2 direction and the X1-X2 direction.

[0018] The intermediate stage section 30 includes an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 is equipped with suction holes for attracting the placed die D. The placed die D is temporarily held on the intermediate stage 31. The intermediate stage 31 is both a placement stage on which the die D is placed and a pickup stage on which the die D is picked up.

[0019] The bonding unit 40 includes a bond head 41, a bond head table 43 as an operating unit, a substrate recognition camera 44, and a bond stage 46. The bond head 41 is provided with a collet 2 for adsorbing and holding the die D at its tip. The bond head table 43 moves the bond head 41 in the Y1-Y2 direction and the X1-X2 direction. The substrate recognition camera 44 images the substrate S and recognizes the bond position. Here, the substrate S is, for example, a wiring board, a lead frame, a glass substrate, etc. Multiple product areas are formed on the substrate S. The product areas are package areas P, and ultimately become one package. Also, position recognition marks (not shown) for the package area P are formed on the substrate S. The bond stage 46 is raised when the die D is placed on the substrate S, supporting the substrate S from below. The bond stage 46 has a suction port (not shown) for vacuum adsorption of the substrate S, and can fix the substrate S in place. The bond stage 46 has a heating section (not shown) for heating the substrate S.

[0020] With this configuration, the bond head 41 corrects its pickup position and orientation based on the image data from the stage recognition camera 34 and picks up the die D from the intermediate stage 31. Then, the bond head 41 bonds the die D onto the package area P of the substrate S based on the image data from the substrate recognition camera 44, or bonds it in a stacking manner on top of a die that has already been bonded to the package area P of the substrate S.

[0021] The transport unit 50 includes transport claws 51 that grasp and transport the substrate S, and a transport lane 52 on which the substrate S moves. The substrate S moves in the X1 direction by driving nuts (not shown) of the transport claws 51, which are provided on the transport lane 52, with ball screws (not shown) provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply unit 60 along the transport lane 52 to the bonding position, and after bonding, moves to the substrate discharge unit 70 and hands over the substrate S to the substrate discharge unit 70.

[0022] The substrate supply unit 60 takes the substrates S that have been stored in the transport jig and brought in, and supplies them to the transport unit 50. The substrate discharge unit 70 stores the substrates S that have been transported by the transport unit 50 into the transport jig.

[0023] Next, the control unit 80 will be explained using Figure 3. Figure 3 is a block diagram showing the schematic configuration of the die bonder control system shown in Figure 1.

[0024] The control system 8 comprises a control unit 80, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 80 is broadly configured as a computer comprising a control / arithmetic unit 81 mainly composed of a CPU (Central Processing Unit), a storage device 82, an input / output device 83, a bus line 84, and a power supply unit 85. The storage device 82 has a main memory 82a and an auxiliary storage device 82b. The main memory 82a is composed of RAM (Random Access Memory) that stores processing programs, etc. The auxiliary storage device 82b is composed of an HDD (Hard Disk Drive) or SSD (Solid State Drive) etc. that stores control data and image data necessary for control. In addition, it is possible to connect an external storage device to the control unit 80.

[0025] The input / output device 83 includes a monitor 83a that displays the device status and information, a pointing device such as a touch panel 83b for inputting operator instructions and a mouse 83c for operating the monitor 83a, and an image acquisition device 83d for acquiring image data from the optical system 88. The input / output device 83 further includes a motor control device 83e and an I / O signal control device 83f. The motor control device 83e controls the drive unit 86, which includes drive units such as the XY table (not shown), pickup head table 23, and bond head table 43 of the wafer supply unit 10. The I / O signal control device 83f acquires signals from various sensors in the signal unit 87 and controls switches and volumes that control the brightness of lighting devices in the signal unit 87, valves that control vacuum suction, etc. The optical system 88 includes a wafer recognition camera 14, a stage recognition camera 34, and a substrate recognition camera 44 as imaging devices. The wafer recognition camera 14, stage recognition camera 34, and substrate recognition camera 44 quantify light intensity and color. The control and calculation unit 81 receives necessary data via the bus line 84, performs calculations, and sends information to control the pickup head 21, bond head 41, etc., and to the monitor 83a, etc.

[0026] The control unit 80 stores image data captured by the wafer recognition camera 14, stage recognition camera 34, and substrate recognition camera 44 via the image acquisition device 83d in the storage device 82. Based on the stored image data, the control / calculation device 81 uses programmed software to recognize the positions of the die D and the package area P of the substrate S, and to perform visual inspection of the die D and the substrate S. Based on the positions of the die D and the package area P of the substrate S calculated by the control / calculation device 81, the software moves the drive unit 86 via the motor control device 83e. Through this process, the position of the die on the wafer is recognized, the pickup head table 23 and the bond head table 43 operate, and the die D is bonded onto the package area P of the substrate S.

[0027] The control unit 80 can be configured by installing the above-mentioned program stored in an external storage device onto a computer. The external storage device includes, for example, an HDD, USB memory, or SSD. The auxiliary storage device 82b and the external storage device are configured as computer-readable recording media. Hereinafter, these will be collectively referred to simply as recording media. In this specification, when the term recording media is used, it may include only the auxiliary storage device 82b, only the external storage device, or both. Note that the provision of programs and data to the computer and the provision of programs and data from the computer to the external device may be performed using communication means such as the internet or a dedicated line, without using external storage devices.

[0028] A part of the semiconductor device manufacturing process using die bonder 1 (method of manufacturing a semiconductor device) will be explained with reference to Figure 4. Figure 4 is a flowchart of the method of manufacturing a semiconductor device using die bonder shown in Figure 1. In the following explanation, control unit 80 controls the operation of each part that makes up die bonder 1.

[0029] (Wafer loading process: Process S1) A wafer cassette containing wafer rings WR is loaded into the wafer cassette lifter 11. The loaded wafer rings WR are then supplied (transported) to the wafer holder 12.

[0030] (Substrate loading process: Process S2) The transport jig containing the substrate S is fed into the substrate supply unit 60. In the substrate supply unit 60, the substrate S stored in the transport jig is removed from the transport jig. Then, the substrate S is supplied (transported) to the bonding unit 40 via the transport unit 50.

[0031] (Pickup process: Process S3) After step S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is photographed by the wafer recognition camera 14, and image data is acquired through the photography. By processing the image data, the amount of displacement (in the X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder 1 is calculated. The die position reference point is a predetermined position on the wafer holder 12, which is held as the initial setting of the device. Surface inspection of the die D is performed by processing the image data.

[0032] The die D is peeled off from the dicing tape DT by the peeling unit 13 and the pickup head 21. The die D, peeled off from the dicing tape DT, is attracted and held by the collet 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0033] The die D on the intermediate stage 31 is photographed by the stage recognition camera 34, and image data is acquired. By processing the image data, the amount of displacement (in the X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder 1 is calculated. The die position reference point is a predetermined position on the intermediate stage 31, which is stored as the initial setting of the device. Surface inspection of the die D is also performed by processing the image data.

[0034] The pickup head 21, which has transported die D to the intermediate stage 31, is returned to the wafer supply unit 10 to process the next die D. Following the procedure described above, the next die D is peeled off from the dicing tape DT, and thereafter, die D is peeled off one by one from the dicing tape DT following the same procedure.

[0035] (Bond process: Process S4) The transport unit 50 transports the substrate S to the bond stage 46. The substrate S placed on the bond stage 46 is imaged by the substrate recognition camera 44, and image data is acquired. By processing the image data, the amount of displacement of the substrate S from the substrate position reference point of the die bonder 1 (in the X, Y, and θ directions) is calculated. The substrate position reference point is a predetermined position of the bonding unit 40, which is held as the initial setting of the device.

[0036] In step S3, the suction position of the bond head 41 is corrected based on the amount of displacement of the die D on the intermediate stage 31 calculated, and the die D is picked up by the collet 42. The die D is bonded to a predetermined location on the substrate S supported by the bond stage 46 by the bond head 41, which has picked up the die D from the intermediate stage 31. The die D bonded to the substrate S is photographed by the substrate recognition camera 44, and an inspection is performed based on the acquired image data to determine whether the die D has been bonded to the desired position (relative position inspection of die D and substrate S), etc.

[0037] The bond head 41, which has bonded die D to the substrate S, is returned to the intermediate stage 31 to process the next die D. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This is repeated until die D is bonded to all package areas P on the substrate S.

[0038] (Substrate unloading process: Process S5) The transport unit 50 transports the substrate S to which the die D has been bonded from the bonding unit 40 to the substrate unloading unit 70. In the substrate unloading unit 70, the substrate S is removed, stored in a transport jig, and unloaded. The transport jig containing the substrate S is unloaded from the die bonder 1.

[0039] As described above, die D is mounted on substrate S and discharged from die bonder 1. Subsequently, for example, the transport jig containing substrate S with die D mounted on it is transported to the wire bonding process, where the electrodes of die D are electrically connected to the electrodes of substrate S via Au wire or the like. Then, substrate S is transported to the molding process, where die D and Au wire are sealed with molding resin (not shown) to complete the semiconductor package.

[0040] The basic principle of the motor control method using the motor control device 83e will be explained using Figure 5. Figure 5 is a block diagram showing an example configuration of the motor control device shown in Figure 3.

[0041] The motor control device 83e comprises a motion controller 110 and a motor driver 120, and controls the motor (M) 130. The motion controller 110 comprises an ideal waveform generation unit 111 that performs the processing of generating an ideal command waveform, a command waveform generation unit (CWG) 112, and a digital-to-analog converter (DAC) 113 as an output circuit. The motor driver 120 comprises a speed loop control unit (SLC) 122.

[0042] The motor control device 83e uses closed-loop control between the motion controller 110 and the motor driver 120. Therefore, the motion controller 110 performs speed control using the current command position and the actual position obtained from the motor 130. However, this speed control is performed by the motion controller 110 obtaining the actual position from the motor 130 and regenerating the command waveform while limiting the jerk.

[0043] The ideal waveform generation unit 111 and the command waveform generation unit 112 are composed of, for example, a CPU (Central Processing Unit) and memory that stores the program executed by the CPU. In other words, the motion controller 110 is composed of, for example, a CPU and memory.

[0044] The ideal waveform generation unit 111 is provided with target values ​​from the control and calculation unit 81, which is a higher-level control device. The target values ​​are the amplitude value of the target position (Pobj), the amplitude value of the target velocity (Vobj), the amplitude value of the target acceleration (Aobj), and the amplitude value of the target jerk (Jobj). The command waveform generation unit (CWG) 112 is then sequentially input the actual position (AP) from the motor 130 as an encoder signal (ENC).

[0045] The ideal waveform generation unit 111 generates ideal command jerk waveforms (JD), command acceleration waveforms (AD), command velocity waveforms (VD), and command position waveforms (PD) from Pobj, Vobj, Aobj, and Jobj, respectively. Here, "ideal" is used to mean suppressing vibrations of the controlled object while limiting the jerk, and smoothly controlling the controlled object within a predetermined processing time. The ideal waveform generation unit 111 outputs the ideal command waveforms to the command waveform generation unit 112. The ideal command waveforms are JD, AD, VD, and PD.

[0046] The command waveform generation unit 112 sequentially regenerates future command speed waveforms (VD''1) based on the current command position and actual position, while limiting the jerk, using the command speed waveform (VD) formed by the ideal waveform generation unit 111. The command waveform generation unit 112 then sequentially outputs the regenerated command speed waveforms (VD''1) as speed command values ​​to the DAC 113. The DAC 113 converts the input digital speed command value into an analog signal speed command value (SCV) and outputs it to the speed loop control unit (SLC) 122 of the motor driver 120. Here, the current command position is obtained from the ideal command position waveform (PD) generated by the ideal waveform generation unit 111. The actual position is obtained from the encoder signal (ENC) input from the motor 130.

[0047] The speed loop control unit 122 of the motor driver 120 controls the rotational speed of the motor 130 by adjusting the drive current based on the speed command value (SCV) input from the motion controller 110 and the encoder signal (ENC) input from the motor 130.

[0048] The motor 130 rotates at a rotational speed corresponding to the drive current input from the motor driver 120, and outputs the actual position (AP) and actual speed (AS) as encoder signals to the command waveform generation unit 112 of the motion controller 110 and the speed loop control unit 122 of the motor driver 120, respectively.

[0049] Next, the control by the motor control device 83e in the bonding process described above will be explained in detail using Figures 2, 5, and 6. Figure 6 is a diagram illustrating the generation of the command waveform in the ideal waveform generation unit shown in Figure 5.

[0050] In the bonding process, for example, the following actions (a) to (c) are performed.

[0051] (a) The bond head 41 picks up the die D from the intermediate stage 31 and rises, moves linearly in the Y1 direction to above the substrate S to be mounted, and then descends to mount the die D onto the substrate S (mounting operation).

[0052] (b) After implementation, the bond head 41 performs the reverse operation and returns to the intermediate stage 31 to pick up die D (pickup operation).

[0053] (c) The bond head 41 then repeats this mounting and pickup operation.

[0054] The following description illustrates an example in which the motor control device 83e controls the linear movement of the bond head 41 in the Y direction.

[0055] For example, as shown in Figure 5, Jobj, Aobj, Vobj, and Pobj are input to the ideal waveform generation unit 111 from the control and calculation unit 81, which is a higher-level device of the motor control device 83e.

[0056] The ideal waveform generation unit 111 determines T1, T2, and T3 shown in Figure 6, and forms the JD for one cycle, so that, for example, the bond head 41 moves smoothly within a predetermined processing time in linear motion from above the starting position, which is the pickup position (e.g., intermediate stage 31), to above the target position, which is the mounting position (e.g., package area P of the substrate S). Similarly, when moving from above the mounting position to above the pickup position, T1, T2, and T3 shown in Figure 6 are determined to form the JD for one cycle. The JD is a positive value in the first period (T1) from the start of movement because the motor 130 driving the bond head 41 is gradually accelerated, and becomes a negative value just before the middle period (T2). In the middle period (T2), it is at a constant speed, so it is 0. It is formed so that it gradually decelerates and stops in the period (T3) as it approaches the final movement position. T2 is also called the constant speed portion. Then, the ideal waveform generation unit 111 generates AD from the integral of JD, generates VD from the integral of AD, and generates PD from the integral of VD.

[0057] After each command waveform is formed, the command waveform generation unit 112 outputs the command speed waveform (VD) formed by the ideal waveform generation unit 111 as a speed command value to the DAC 113, and the mounting process begins. The bond head 41 picks up the die D and begins to move from above the pickup position to above the mounting position. After the movement begins, the command waveform generation unit 112, based on the encoder signal (ENC) indicating position feedback from the motor driver 120, forms a correction value for the jerk until the next sampling time at each sampling time (Ts), within a range that does not exceed the rated value. Then, the command waveform generation unit 112 outputs the speed command waveform (VD''1) to the DAC 113 according to the formed pattern until the next sampling time. This is repeated up to above the mounting position. The configuration and operation of the command waveform generation unit 112 are the same as those of the command waveform generation unit (212) described in Japanese Patent Application Publication No. 2012-175768 or Japanese Patent Application Publication No. 2012-175768.

[0058] Next, the pickup operation will be explained using Figures 7 to 10. Figure 7 is a diagram illustrating the pickup operation. Figure 8 is a diagram showing the operation flow in the pickup operation. Figure 9 is a diagram showing an example of the command jerk waveform during two-stage operation. Figure 10 is a diagram showing the command waveform when velocity reversal occurs during two-stage operation.

[0059] The pickup operation requires accurate position determination, and the control unit 80 performs camera-based image capture and recognition processing. To clarify the pickup operation in the embodiment, the pickup operation in the comparative example will first be described. In the comparative example, as shown at O1 in Figure 8, the control unit 80 performs the following steps S11 to S13.

[0060] (Step S11) Before moving the bond head 41, the control unit 80 uses the stage recognition camera 34 to photograph the die D on the intermediate stage 31 (photography step).

[0061] (Step S12) The control unit 80 performs positioning and calculates the amount of displacement by image processing based on the captured image (recognition processing step). Based on this amount of displacement, the control unit 80 sets the target position for the movement of the bond head 41.

[0062] (Step S13) The control unit 80 provides Pobj, Vobj, Aobj, and Jobj to the motion controller 110 based on the set target position to move the bond head 41 (head movement process).

[0063] Next, the pickup operation in the embodiment will be described. In this embodiment, as shown at O2 in Figure 8, the control unit 80 performs the following steps S21 to S24.

[0064] (Step S21) Before moving the bond head 41, the control unit 80 uses the stage recognition camera 34 to photograph the die D on the intermediate stage 31 (photography step).

[0065] (Step S22) The control unit 80 calculates the amount of displacement by image processing based on the captured image (recognition processing step).

[0066] (Step S23) In parallel with the recognition process in step S22, the control unit 80 provides Pobj, Vobj, Aobj, and Jobj to the motion controller 110 based on the base target position to move the bond head 41 (head movement process). In other words, the control unit 80 starts moving the bond head 41 without waiting for the result of the recognition process in step S22.

[0067] (Step S24) The control unit 80 changes the target position of the bond head 41's movement based on the amount of displacement calculated in step S22.

[0068] The pickup operation in the embodiment will be explained in more detail with reference to Figures 7 and 9.

[0069] As the bond head 41 picks up the die D on the intermediate stage 31, when the stage recognition camera 34 photographs the die D on the intermediate stage 31, the bond head 41 is located on the bond stage 46 side, outside the field of view of the stage recognition camera 34. For example, the bond head 41 may be above the position where the die D should be bonded to the substrate S, descending toward the substrate S, bonding to the substrate S, or ascending from the substrate S. The starting position of the bond head 41's movement in the Y direction is above the die D that has been bonded to the substrate S.

[0070] The control unit 80 processes the image captured by the stage recognition camera 34 and, in parallel with recognition processing such as positioning the die D, provides the motion controller 110 with a target position, etc., to move the bond head 41 from the starting position to the target position, which is above the intermediate stage 31. The target position (base target position) at this time is a position closer to the bond stage 46 than the position on the intermediate stage 31 where the die D is placed closest to the bond stage 46.

[0071] The control unit 80 changes the target position from the base target position (BTP) to the recognized target position (RTP) based on the recognition processing result, in parallel with the movement of the bond head 41. For example, the motion controller 110 first generates a command jerk (JD) as shown in MT1 of Figure 9, causing the bond head 41 to move to the BTP and stop. Then, the motion controller 110 generates a command jerk (JD) as shown in MT2 of Figure 9, causing the bond head 41 to move from the BTP to the RTP and stop. The two operations of MT1 and MT2 are called a two-stage operation.

[0072] In this embodiment, the cycle time of the operating unit can be shortened compared to the comparative example by performing the movement of the bond head 41 and the setting of the target position in parallel.

[0073] BTP is the position in the two-stage operation MT2 where the bond head 41 does not return to the bond stage 46 side. In other words, BTP is always shorter than RTP. If BTP is longer than RTP, as shown in Figure 10, the signs of JD, AD, and VD are reversed in MT2 compared to MT1, and VD is reversed. When VD is reversed, vibrations are likely to occur.

[0074] In this embodiment, the base target position is shortened, so that the direction of operation does not reverse during the two-stage operation. In other words, the reversal of the operating speed (VD), which is prone to vibration, does not occur. Therefore, vibration caused by the reversal of the operating speed can be suppressed.

[0075] [Other forms] Other embodiments of the motor control device 83e will be described using Figures 11 to 13. Figure 11 is a block diagram showing an example configuration of the motor control device in another embodiment. Figure 12 is a diagram illustrating the generation of the command waveform in the ideal waveform generation unit shown in Figure 11. Figure 13 is a diagram illustrating the effects of the other embodiment.

[0076] In other embodiments, the ideal waveform generation unit 211 of the motion controller 110 receives Pobj, Vobj, Aobj, and Jobj from the control and calculation unit 81, similar to the embodiment. The ideal waveform generation unit 211 further receives the amplitude value of the changed target position (Pocj) from the control and calculation unit 81. The ideal waveform generation unit 211 further receives the actual position (PA0) from the command waveform generation unit 112. The actual position (PA0) is generated by the command waveform generation unit 112 based on the encoder signal (ENC). The command waveform generation unit 112 in this embodiment operates in the same manner as in the embodiment.

[0077] As shown in Figure 12, the amplitude value (Jocj) of the deceleration portion (T3) of JD is made smaller and wider than the amplitude value (Jobj) of the acceleration portion (T1). As shown in Figure 13, if the amplitude value of Jocj is the same as that of Jobj, there is a risk of exceeding the upper limit (Jmax) of the jerk-added waveform in the case of CT2, which will be described later. However, by making the amplitude value of Jocj smaller than that of Jobj, this risk is reduced, and although the operating time becomes slightly longer, it becomes easier to change the target position using the jerk-added waveform.

[0078] The ideal waveform generation unit 211 determines the relationship between the target position change timing (CT), which is the timing at which the Pocj generated based on the recognition result was obtained, and the velocity domain based on the actual position (PA0).

[0079] The target position change timing (CT) will be explained using Figure 14. Figure 14 is a diagram illustrating the target position change timing (CT).

[0080] The target position change timing is, for example, a first period (CT1), a second period (CT2), and a third period (CT3). CT1 is the period T1, which is the acceleration period (VD) of the command velocity waveform, and T2, which is the constant velocity period. CT2 is the initial period T31 of T3, which is the deceleration period (VD) of the command velocity waveform. CT3 is the middle period T32 and the final period T33 of T3, which is the deceleration period (VD) of the command velocity waveform.

[0081] The command waveforms generated by the ideal waveform generation unit 211 will be explained using Figures 15 to 17. Figure 15 shows the command jerk waveform, command acceleration waveform, and command velocity waveform when the target position change timing is CT1. Figure 16 shows the command jerk waveform, command acceleration waveform, and command velocity waveform when the target position change timing is CT2. Figure 17 shows the command jerk waveform, command acceleration waveform, and command velocity waveform when the target position change timing is CT3.

[0082] In Figures 15 to 17, the base waveform is shown as a solid line, and the modified waveform is shown as a dashed line.

[0083] As shown in Figure 15, when the target position change timing is CT1, the ideal waveform generation unit 211 generates a command jerk waveform that extends the period T2. For example, the period T2 is extended by T2a. Consequently, the start and end times of the period T3 are delayed by T2a. Therefore, one cycle becomes T2a longer. The ideal waveform generation unit 211 calculates T2a based on Pobj and Pocj.

[0084] As shown in Figure 15, the ideal waveform generation unit 211 generates a command acceleration waveform by integrating the command jerk waveform, and generates a command velocity waveform by integrating the command acceleration waveform.

[0085] As shown in Figure 16, when the target position change timing is CT2, the ideal waveform generation unit 211 generates the command jerk waveform by adding the additive jerk waveform to the command jerk waveform (JD) for the period T3. The ideal waveform generation unit 211 generates the additive jerk waveform based on Pobj and Pocj. The ideal waveform generation unit 211 adds the additive jerk waveform to the command jerk waveform (JD).

[0086] As shown in Figure 16, the ideal waveform generation unit 211 generates a command acceleration waveform by integrating the command jerk waveform, and generates a command velocity waveform by integrating the command acceleration waveform.

[0087] As shown in Figure 17, when the target position change timing is CT3, the ideal waveform generation unit 211 adds a command jerk waveform for additional movement after the movement stops. Therefore, one cycle becomes longer by the amount added.

[0088] As shown in Figure 17, the ideal waveform generation unit 211 generates a command acceleration waveform by integrating the command jerk waveform, and generates a command velocity waveform by integrating the command acceleration waveform. Similar to the embodiment, the bond head 41 moves to the BTP and stops (MT1), and then moves from the BTP to the RTP and stops (MT2), performing a two-stage operation.

[0089] Next, the pickup operation in this embodiment will be explained using Figure 12. In this embodiment, the same operation as in step S21 of the embodiment is performed. Steps S22 to S24 will be explained below.

[0090] (Step S22) The control unit 80 calculates the amount of displacement by image processing based on the captured image (recognition processing step). The motion controller 110 of the control unit 80 detects the actual position based on the encoder signal (ENC).

[0091] (Step S23) In parallel with the recognition process in step S22, the control unit 80 provides the motion controller 110 with Pobj, Vobj, Aobj, and Jobj based on the base target position. Based on Pobj, Vobj, Aobj, and Jobj, the motion controller 110 generates a base command jerk waveform (JD), a base command acceleration waveform (AD), a base command velocity waveform (VD), and a base command position waveform (PD) as shown in Figure 12, and moves the bond head 41 (head movement process). In other words, the control unit 80 starts moving the bond head 41 without waiting for the result of the recognition process in step S22.

[0092] (Step S24) The control unit 80 changes the target position of the bond head 41's movement based on the amount of displacement calculated in step S22.

[0093] For example, the control unit 80 changes the target position from the base target position (BTP) to the recognized target position (RTP). In other words, the control unit 80 changes the amplitude of the base position waveform (Pobj) to the amplitude of the recognized position waveform (Pocj) and supplies it to the motion controller 110. Based on Pocj and the target position change timing (CT), the motion controller 110 generates command jerk waveforms (JD), command acceleration waveforms (AD), command velocity waveforms (VD), etc., as shown in Figures 15 to 17.

[0094] According to this embodiment, by changing the shape of the command waveform based on the timing of recognition of the target position to be changed and the velocity range of the moving object at that time, it may be possible to change the target position with a single operation command. This makes it possible to change the target position during operation without being affected by the timing of recognition of the target position to be changed.

[0095] According to this embodiment, the jerk during deceleration may be increased so as not to exceed the jerk during acceleration. This makes it possible to change the target position without exceeding the upper limit of the jerk.

[0096] According to this embodiment, it is possible to slow down deceleration by setting the base target position using an operating distance that takes into account the recognition correction distance. This makes it possible to correct the target position without exceeding the upper limit of jerk.

[0097] According to this embodiment, by making the deceleration gradual, the period T3 becomes longer than in the embodiment, and the time of one cycle increases. However, since the motor operates in parallel with the recognition operation, it is possible to shorten the overall cycle time compared to the comparative example.

[0098] The disclosures made by the Disclosers have been described in detail based on embodiments, but the disclosures are not limited to the embodiments described above and can be modified in various ways.

[0099] For example, although the embodiment was described using the movement of the bond head 41 as an example, it can also be applied to the movement of the pickup head 21.

[0100] Although the embodiment was described using a rotating motor as an example, it is also applicable to linear motors other than rotating motors. Furthermore, it is applicable to motors that have an encoder counter function.

[0101] In the embodiment, an example was described in which the command waveform input / output unit controls the motor by outputting a speed command value. Alternatively, the motor may be controlled by outputting an acceleration command value (acceleration command waveform) or a position command value (position command waveform) instead of a speed command value (speed command waveform) as the control command value (control command waveform).

[0102] In this embodiment, an example using a die-attach film has been described, but a preform section for applying adhesive to the substrate may be provided instead of using a die-attach film. The preform section comprises a preform head for applying paste-like adhesive and a preform table for driving the preform head in the vertical and horizontal directions. The embodiment can also be applied to the movement of the preform head.

[0103] In the embodiment, a die bonder was described in which a die is picked up from a wafer supply unit with a pickup head and placed on an intermediate stage, and the die placed on the intermediate stage is bonded to a substrate with a bond head. However, the invention is not limited to this, and can also be applied to die bonders in which a die is picked up from a wafer supply unit with a bond head and bonded to a substrate.

[0104] For example, it can also be applied to die bonders that lack an intermediate stage and pickup head, and instead bond the die in the wafer supply section to the substrate using a bond head.

[0105] Furthermore, it can be applied to a flip-chip bonder that picks up a die from the wafer supply unit, inverts the flip pickup head to transfer the die to the bond head, and then bonds it to the substrate with the bond head.

[0106] In this embodiment, a die bonder was used as an example, but it can also be applied to mounting devices that adsorb and pick up workpieces such as electronic components and place the picked-up workpieces on a substrate or the like. [Explanation of Symbols]

[0107] 1. Die bonder (mounting equipment, semiconductor manufacturing equipment) 14. Wafer recognition camera (imaging device) 21. Pickup head (movable unit) 34. Stage recognition camera (imaging device) 41. Bond Head (Mobile Unit) 44. Circuit board recognition camera (imaging device) 80... Control Unit 86... Drive unit

Claims

1. Mobile and A drive unit for driving the aforementioned moving body, An imaging device for capturing the target position of the moving object, In parallel with the calculation of the target position based on the image captured by the imaging device, the control unit drives the moving body based on the base target position and is configured to always set the base target position to a position in front of the calculated target position. An implementation device equipped with the following features.

2. In the mounting apparatus of claim 1, The control unit is configured to drive the moving body using the drive unit based on the base target position and stop it, and then drive the moving body using the drive unit based on the target position.

3. In the mounting apparatus of claim 2, The control unit, Based on the aforementioned base target position, a base command jerk waveform is generated. An implementation device configured to generate a command jerk waveform based on the aforementioned target position.

4. In the mounting apparatus of claim 1, The drive unit outputs an encoder signal indicating the position of the moving body, The control unit, Based on the aforementioned base target position, a base command jerk waveform is generated. The amplitude value of the deceleration portion of the base command jerk waveform is set to be smaller than the amplitude value of the acceleration portion. An implementation device configured to change the base command jerk waveform in accordance with the target position change timing based on the encoder signal.

5. In the mounting apparatus of claim 4, The control unit is configured to extend the constant-velocity portion of the base command jerk waveform when the target position change timing is the first period of the command velocity.

6. In the mounting apparatus of claim 4, The control unit is configured to add the jerk waveform to the deceleration portion of the base command jerk waveform when the target position change timing is the second period of the command speed.

7. In the mounting apparatus of claim 4, The control unit is configured to add a command jerk waveform after the base command jerk waveform when the target position change timing is the third period of the command velocity.

8. In the mounting device according to any one of claims 1 to 7, The control unit is an implementation device comprising a motion controller, a motor driver, and a higher-level control device for the motion controller.

9. A head that picks up the die, A drive unit that drives the head, An imaging device for photographing the die, In parallel with the calculation of the target position based on the image captured by the imaging device, the control unit drives the head based on the base target position and is configured to always set the base target position to a position in front of the calculated target position. Semiconductor manufacturing equipment equipped with the following features.

10. A method for manufacturing a semiconductor device using a semiconductor manufacturing apparatus comprising a head for picking up a die, a drive unit for driving the head, and an imaging device for photographing the die, A recognition processing step for calculating the target position based on the image captured by the aforementioned imaging device, In parallel with the recognition processing step, the drive unit drives the head based on the base target position, Includes, A method for manufacturing a semiconductor device, in which the base target position is always set to a position in front of the target position calculated above.

Images