Coil components

Abstract

To provide a coil component that is less prone to flash phenomena on a circuit board. [Solution] The coil component 100 comprises a base body 110 having a mounting surface 111, a coil portion consisting of conductor layers L1 to L4 embedded in the base body 110 and stacked in the Z direction parallel to the mounting surface 111, an insulating resin 130 located between the base body 110 and the coil portion, a terminal electrode 121 protruding from the mounting surface 111 and connected to one end of the coil portion, and a terminal electrode 122 protruding from the mounting surface 111 and connected to the other end of the coil portion. The insulating resin 130 is located on the mounting surface 111 between the terminal electrodes 121 and 122 and has an exposed portion 131 that protrudes from the mounting surface 111.

Description

Technical Field

[0001] The present disclosure relates to coil components, and particularly to chip-type coil components that can be surface-mounted.

Background Art

[0002] Patent Document 1 discloses a chip-type coil component that can be surface-mounted.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] A circuit board on which this type of coil component is mounted may be modularized by sealing the surface with a molding resin. However, when sealing the surface of the circuit board with a molding resin, the solder may remelt due to heat, and a flash phenomenon may occur where the terminals of the coil component are short-circuited by the flowing solder.

[0005] In the present disclosure, a coil component that is less likely to cause a flash phenomenon on a circuit board is described.

Means for Solving the Problems

[0006] A coil component according to one aspect of the present disclosure comprises a base body having a mounting surface, a coil portion consisting of a plurality of conductor layers embedded in the base body and stacked in a stacking direction parallel to the mounting surface, an insulating resin located between the base body and the coil portion, a first terminal electrode provided protruding from the mounting surface and connected to one end of the coil portion, and a second terminal electrode provided protruding from the mounting surface and connected to the other end of the coil portion, wherein the insulating resin is located between the first terminal electrode and the second terminal electrode on the mounting surface and has a first exposed portion that is exposed so as to protrude from the mounting surface. [Effects of the Invention]

[0007] According to this disclosure, a coil component that is less prone to flash phenomena on a circuit board is provided. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic perspective view showing the appearance of a coil component 100 according to one embodiment of the technology described herein. [Figure 2] Figure 2 is a schematic plan view of the coil component 100. [Figure 3] Figure 3 is a schematic plan view illustrating the structure of the conductor layer L1. [Figure 4] Figure 4 is a schematic plan view illustrating the structure of the conductor layer L2. [Figure 5] Figure 5 is a schematic plan view illustrating the structure of the conductor layer L3. [Figure 6] Figure 6 is a schematic plan view illustrating the structure of the conductor layer L4. [Figure 7] Figure 7 is a schematic cross-sectional view showing the coil component 100 mounted on the circuit board 200. [Figure 8] Figure 8 is a schematic plan view illustrating the pattern shape of the conductive layer L1 immediately after formation. [Figure 9] Figure 9 is a schematic plan view illustrating the pattern shape of the conductive layer L2 immediately after formation. [Figure 10]Figure 10 is a schematic plan view illustrating the pattern shape of the conductive layer L3 immediately after formation. [Figure 11] Figure 11 is a schematic plan view illustrating the pattern shape of the conductive layer L4 immediately after formation. [Figure 12] Figure 12 is a schematic plan view of the coil component 100A according to the first modified example. [Figure 13] Figure 13 is a schematic plan view of the coil component 100B according to the second modified example. [Modes for carrying out the invention]

[0009] The embodiments of the technology described herein will be described in detail below with reference to the attached drawings.

[0010] Figure 1 is a schematic perspective view showing the external appearance of a coil component 100 according to one embodiment of the technology described herein. Figure 2 is a schematic plan view of the coil component 100.

[0011] As shown in Figures 1 and 2, the coil component 100 according to this embodiment comprises a base body 110 having a mounting surface 111, and a pair of terminal electrodes 121 and 122 provided on the mounting surface 111. As will be described later, a coil portion consisting of conductor layers L1 to L4 is embedded in the base body 110, one end of the coil portion is connected to the terminal electrode 121, and the other end of the coil portion is connected to the terminal electrode 122.

[0012] The base body 110 may be made of a composite magnetic material in which a magnetic filler made of a high-permeability material such as ferrite or permalloy is solidified with a resin binder. The base body 110 has mounting surfaces 111 and a top surface 112 that constitute the XZ plane and are located on opposite sides of each other, side surfaces 113 and 114 that constitute the YZ plane and are located on opposite sides of each other, and side surfaces 115 and 116 that constitute the XY plane and are located on opposite sides of each other.

[0013] The terminal electrode 121 is provided at the end in the -X direction of the mounting surface 111 so as to protrude in the -Y direction from the mounting surface 111 of the base body 110. The terminal electrode 122 is provided at the end in the +X direction of the mounting surface 111 so as to protrude in the -Y direction from the mounting surface 111 of the base body 110. The width of the terminal electrodes 121 and 122 in the Z direction may be the same as the width of the mounting surface 111 in the Z direction. Also, a part of the terminal electrodes 121 and 122 may extend around the side surfaces 115 and 116 of the base body 110.

[0014] On the mounting surface 111 located between the terminal electrode 121 and the terminal electrode 122, an exposed portion 131 of an insulating resin protruding from the mounting surface 111 is exposed. The exposed portion 131 is located at a substantially central portion of the mounting surface 111. Also, the width of the exposed portion 131 in the X direction is smaller than the distance between the terminal electrode 121 and the terminal electrode 122 in the X direction. Also, the width of the exposed portion 131 in the Z direction is smaller than the width of the mounting surface 111 in the Z direction. Therefore, in a plan view seen from the Y direction, the exposed portion 131 is surrounded by the mounting surface 111 of the base body 110.

[0015] The coil component 100 according to the present embodiment has a configuration in which four conductor layers L1 to L4 constituting the coil portion are embedded in the base body 110. These conductor layers L1 to L4 are laminated in the Z direction, which is the lamination direction parallel to the mounting surface 111.

[0016] FIGS. 3 to 6 are schematic plan views for explaining the structures of the conductor layers L1 to L4, respectively.

[0017] The conductor layer L1 is a conductor layer located at the end in the -Z direction and is formed first during manufacturing. In the example shown in Figure 3, the conductor layer L1 includes a coil pattern 10 that makes approximately one turn, a terminal pattern 11 connected to the outer peripheral end of the coil pattern 10, and a terminal pattern 12 provided separately from the coil pattern 10 and terminal pattern 11 in the plane. The terminal pattern 11 is exposed from the mounting surface 111 and side surface 113 of the base body 110. The terminal pattern 12 is exposed from the mounting surface 111 and side surface 114 of the base body 110. An insulating resin 130 is provided between the conductor layer L1 and the base body 110, thereby preventing contact between the conductor layer L1 and the base body 110. The insulating resin 130 may be made of a composite magnetic material in which an inorganic filler made of an insulating material such as silica is solidified with a resin binder.

[0018] Conductor layer L2 is the second conductor layer from the edge in the -Z direction, and is formed after conductor layer L1 via the insulating resin 130 during manufacturing. In the example shown in Figure 4, conductor layer L2 includes a coil pattern 20 that makes approximately two turns and terminal patterns 21 and 22 that are provided separately from the coil pattern 20 in the plane. The inner circumferential end of the coil pattern 20 is connected to the inner circumferential end of the coil pattern 10 located in conductor layer L1 via vias provided in the insulating resin 130. Terminal patterns 21 and 22 are connected to terminal patterns 11 and 12 of conductor layer L1, respectively, via vias provided in the insulating resin 130. Terminal pattern 21 is exposed from the mounting surface 111 and side surface 113 of the base body 110. Terminal pattern 22 is exposed from the mounting surface 111 and side surface 114 of the base body 110. An insulating resin 130 is provided between the conductor layer L2 and the base body 110, and between the conductor layer L1 and the conductor layer L2. This separates the conductor layer L2 and the conductor layer L1, and prevents contact between the conductor layer L2 and the base body 110.

[0019] Conductor layer L3 is the third conductor layer from the end in the -Z direction, and is formed after conductor layer L2 via the insulating resin 130 during manufacturing. In the example shown in Figure 5, conductor layer L3 includes a coil pattern 30 that makes approximately two turns and terminal patterns 31 and 32 that are provided separately from the coil pattern 30 in the plane. The outer periphery of the coil pattern 30 is connected to the outer periphery of the coil pattern 20 located in conductor layer L2 via vias provided in the insulating resin 130. Terminal patterns 31 and 32 are connected to terminal patterns 21 and 22 of conductor layer L2, respectively, via vias provided in the insulating resin 130. Terminal pattern 31 is exposed from the mounting surface 111 and side surface 113 of the base body 110. Terminal pattern 32 is exposed from the mounting surface 111 and side surface 114 of the base body 110. An insulating resin 130 is provided between the conductor layer L3 and the base body 110, and between the conductor layer L2 and the conductor layer L3. This separates the conductor layer L3 and the conductor layer L2, and prevents contact between the conductor layer L3 and the base body 110.

[0020] The conductor layer L4 is a conductor layer located at the end in the +Z direction, and during manufacturing, it is formed after the conductor layer L3 via the insulating resin 130. In the example shown in Figure 6, the conductor layer L4 includes a coil pattern 40 that circles approximately 1.5 turns, a terminal pattern 42 connected to the outer peripheral end of the coil pattern 40, and a terminal pattern 41 provided separately from the coil pattern 40 in the plane. The inner peripheral end of the coil pattern 40 is connected to the inner peripheral end of the coil pattern 30 located in the conductor layer L3 via vias provided in the insulating resin 130. The terminal patterns 41 and 42 are connected to the terminal patterns 31 and 32 of the conductor layer L3, respectively, via vias provided in the insulating resin 130. The terminal pattern 41 is exposed from the mounting surface 111 and side surface 113 of the base body 110. The terminal pattern 42 is exposed from the mounting surface 111 and side surface 114 of the base body 110. An insulating resin 130 is provided between the conductor layer L4 and the base body 110, and between the conductor layer L3 and the conductor layer L4. This separates the conductor layer L4 and the conductor layer L3, and prevents contact between the conductor layer L4 and the base body 110.

[0021] As shown in Figures 3 to 6, the surfaces of terminal patterns 11, 21, 31, and 41 exposed from the mounting surface 111 are covered by terminal electrode 121. Similarly, the surfaces of terminal patterns 12, 22, 32, and 42 exposed from the mounting surface 111 are covered by terminal electrode 122. This results in a coil section of approximately 6.5 turns, consisting of coil patterns 10, 20, 30, and 40, being connected between terminal electrode 121 and terminal electrode 122. Furthermore, the XZ surfaces of terminal electrodes 121 and 122 protrude from the mounting surface 111 in the -Y direction. The amount of protrusion of the XZ surfaces of terminal electrodes 121 and 122 in the Y direction relative to the mounting surface 111 is T1.

[0022] Furthermore, as shown in Figures 3 to 6, a portion of the insulating resin 130 constitutes an exposed portion 131 that protrudes in the -Y direction from the mounting surface 111 of the base body 110. The amount of protrusion in the Y direction of the XZ surface of the exposed portion 131 relative to the mounting surface 111 is T2. Alternatively, another portion of the insulating resin 130 may constitute an exposed portion 132 that protrudes in the +Y direction from the upper surface 112 of the base body 110.

[0023] Figure 7 is a schematic cross-sectional view showing the coil component 100 according to this embodiment mounted on a circuit board 200.

[0024] As shown in Figure 7, the circuit board 200 is provided with land patterns 201 and 202. When the coil component 100 according to this embodiment is mounted on the circuit board 200, the terminal electrodes 121 and 122 of the coil component 100 are connected to the land patterns 201 and 202, respectively, via solder 300. As a result, a space S is formed between the coil component 100 and the circuit board 200. Space S consists of space S1 located between the surface of the circuit board 200 and the mounting surface 111 of the base body 110, and space S2 located between the surface of the circuit board 200 and the exposed portion 131 of the insulating resin 130. The width of space S2 in the Y direction is smaller than the width of space S1 in the Y direction. The difference between space S2 and space S1 corresponds to the protrusion amount T2 shown in Figure 3. That is, S1 - S2 = T2.

[0025] After surface mounting the coil component 100 onto the circuit board 200 in this manner, the surface of the circuit board 200 is sealed with molding resin. The molding resin then penetrates into spaces S1 and S2, and spaces S1 and S2 are filled by the molding resin. As explained using Figures 3 to 6, since the surfaces of the terminal electrodes 121 and 122 protrude from the mounting surface 111, space S1 is sufficiently secured, and the penetration of the molding resin is facilitated.

[0026] Furthermore, if the solder 300 remelts due to the heat generated during molding, the flow of the solder 300 may cause a flash phenomenon in which terminal electrodes 121 and 122 short-circuit. However, in the coil component 100 according to this embodiment, the surface facing the surface of the circuit board 200 is not flat, and there is an exposed portion 131 that protrudes from the mounting surface 111 in the area located between terminal electrodes 121 and 122. The presence of this exposed portion 131 suppresses excessive flow of the remelted solder 300, and as a result, the flash phenomenon is less likely to occur.

[0027] Here, although space S2 is narrower than space S1, the surface of the exposed portion 131 made of insulating resin 130 is flatter than the mounting surface 111 of the base body 110, so the mold resin can easily penetrate even into the narrow space S2. As a result, the embedding ability of the mold resin is not significantly impaired by the presence of the exposed portion 131 protruding from the mounting surface 111. To improve the flatness of the surface of the exposed portion 131, a filler with an average particle size smaller than the average particle size of the filler contained in the base body 110 can be used as the filler contained in the insulating resin 130. Furthermore, if the amount of protrusion T1 of the terminal electrodes 121 and 122 relative to the mounting surface 111 is made larger than the amount of protrusion T2 of the exposed portion 131 relative to the mounting surface 111, space S2 will be further expanded, making it possible to further improve the embedding ability of the mold resin.

[0028] Furthermore, as explained using Figure 2, if the width of the exposed portion 131 in the X direction is made smaller than the distance between terminal electrodes 121 and 122 in the X direction, the flow of the molded resin that has entered space S1 in the Z direction is ensured, making it less likely for voids to form in space S1. Also, if the width of the exposed portion 131 in the Z direction is made smaller than the width of the mounting surface 111 in the Z direction, the molded resin will be able to enter the space S between the coil component 100 and the circuit board 200 more easily.

[0029] Next, a method for manufacturing the coil component 100 according to this embodiment will be described.

[0030] First, as shown in Figure 8, a conductor layer L1 is formed on the substrate via an insulating resin 130. At this stage, the conductor layer L1 includes not only the coil pattern 10 and terminal patterns 11,12, but also sacrificial patterns 13-16. Of these, sacrificial patterns 13-15 are located radially outside the coil pattern 10, and sacrificial pattern 16 is located in the region surrounded by the coil pattern 10. Here, with respect to the center of the coil pattern 10, sacrificial patterns 13 and 15 are located on the -X side, and sacrificial pattern 14 is located on the +X side. Sacrificial patterns 15 and 14 are not integrated and are separated by region 17. Sacrificial patterns 13 and 14 are not integrated and are separated by region 18. Subsequently, the insulating resin 130 is formed to cover the conductor layer L1. As a result, the space between the coil pattern 10 and terminal patterns 11,12 and the sacrificial patterns 13-16 is filled by the insulating resin 130. Regions 17 and 18 are also filled by the insulating resin 130.

[0031] Next, as shown in Figure 9, a conductor layer L2 is formed on the conductor layer L1 via an insulating resin 130. At this stage, the conductor layer L2 includes not only the coil pattern 20 and terminal patterns 21, 22, but also sacrificial patterns 23-26. Of these, sacrificial patterns 23-25 ​​are located radially outside the coil pattern 20, and sacrificial pattern 26 is located in the region surrounded by the coil pattern 20. Here, with respect to the center of the coil pattern 20, sacrificial patterns 23 and 25 are located on the -X side, and sacrificial pattern 24 is located on the +X side. Sacrificial patterns 25 and 24 are not integrated and are separated by region 27. Sacrificial patterns 23 and 24 are not integrated and are separated by region 28. Subsequently, the insulating resin 130 is formed to cover the conductor layer L2. As a result, the space between the coil pattern 20 and terminal patterns 21, 22 and the sacrificial patterns 23-26 is filled by the insulating resin 130. Regions 27 and 28 are also filled by the insulating resin 130.

[0032] Next, as shown in Figure 10, a conductor layer L3 is formed on the conductor layer L2 via an insulating resin 130. At this stage, the conductor layer L3 includes not only the coil pattern 30 and terminal patterns 31, 32, but also sacrificial patterns 33-36. Of these, sacrificial patterns 33-35 are located radially outside the coil pattern 30, and sacrificial pattern 36 is located in the region surrounded by the coil pattern 30. Here, with respect to the center of the coil pattern 30, sacrificial patterns 33 and 35 are located on the -X side, and sacrificial pattern 34 is located on the +X side. Sacrificial patterns 35 and 34 are not integrated and are separated by region 37. Sacrificial patterns 33 and 34 are not integrated and are separated by region 38. Subsequently, the insulating resin 130 is formed to cover the conductor layer L3. As a result, the space between the coil pattern 30 and terminal patterns 31, 32 and the sacrificial patterns 33-36 is filled by the insulating resin 130. Regions 37 and 38 are also filled by the insulating resin 130.

[0033] Next, as shown in Figure 11, a conductor layer L4 is formed on the conductor layer L3 via an insulating resin 130. At this stage, the conductor layer L4 includes not only the coil pattern 40 and terminal patterns 41, 42, but also sacrificial patterns 43-46. Of these, sacrificial patterns 43-45 are located radially outside the coil pattern 40, and sacrificial pattern 46 is located in the region surrounded by the coil pattern 40. Here, with respect to the center of the coil pattern 40, sacrificial pattern 43 is located on the -X side, and sacrificial patterns 44, 45 are located on the +X side. Sacrificial patterns 43 and 45 are not integrated and are separated by region 47. Sacrificial patterns 43 and 44 are not integrated and are separated by region 48. Subsequently, the insulating resin 130 is formed to cover the conductor layer L4. As a result, the space between the coil pattern 40 and terminal patterns 41, 42 and the sacrificial patterns 43-46 is filled by the insulating resin 130. Regions 47 and 48 are also filled by the insulating resin 130.

[0034] Next, sacrificial patterns 13-16, 23-26, 33-36, and 43-46 are removed using an acid or the like. This creates a space in the region where sacrificial patterns 13-16, 23-26, 33-36, and 43-46 were located. In this state, when the conductive layers L1-L4 are filled with the base material 110, the region where sacrificial patterns 13-16, 23-26, 33-36, and 43-46 were located is filled with the base material 110. After that, the precursors of the coil component 100 are separated into individual pieces by dicing.

[0035] When the precursor of the coil component 100 is divided into individual pieces by dicing, the insulating resin 130 embedded in regions 17, 27, 37, and 47 is exposed from the mounting surface 111 of the base body 110, and the insulating resin 130 embedded in regions 18, 28, 38, and 48 is exposed from the upper surface 112 of the base body 110. Immediately after dicing, the filler exposed on the surface of the base body 110 is prone to falling off. To prevent such fall-off of the filler, selective etching is performed on the surface of the base body 110. As a result, the surface layer of the base body 110 is removed, and as shown in Figures 3 to 6, the terminal patterns 11, 12, 21, 22, 31, 32, 41, and 42 protrude from the mounting surface 111, and the exposed portion 131 of the insulating resin 130 protrudes from the mounting surface 111. On the upper side of the base body 110, the exposed portion 132 of the insulating resin 130 protrudes relative to the upper surface 112.

[0036] Subsequently, terminal electrodes 121 are formed so as to contact terminal patterns 11, 21, 31, and 41, and terminal electrodes 122 are formed so as to contact terminal patterns 12, 22, 32, and 42, thereby completing the coil component 100 according to this embodiment.

[0037] Thus, in the manufacturing process of the coil component 100 according to this embodiment, regions 17, 27, 37, and 47 are provided in the conductor layers L1 to L4 where no sacrificial patterns are formed. As shown in Figure 2, this makes it possible to expose the insulating resin 130 embedded in these regions 17, 27, 37, and 47 from the mounting surface 111 of the base body 110. Furthermore, by selectively etching the surface layer of the base body 110 after dicing, it is possible to obtain a structure in which terminal patterns 11, 12, 21, 22, 31, 32, 41, and 42 protrude from the mounting surface 111, and the exposed portion 131 of the insulating resin 130 protrudes from the mounting surface 111.

[0038] Furthermore, since regions 17, 27, 37, and 47 have a small thickness in the Y direction, if the base body 110 is placed in these regions, the thickness of the base body 110 in the Y direction will be insufficient in these areas, and there is a risk of cracks occurring in the base body 110 in these areas. In contrast, the insulating resin 130 is less prone to such cracks, so by filling regions 17, 27, 37, and 47 with thin insulating resin 130, it becomes possible to further enlarge the outer diameter size of the coil patterns 10, 20, 30, and 40 within the limited XY plane size, and to obtain higher inductance. The same applies to regions 18, 28, 38, and 48.

[0039] Figure 12 is a schematic plan view of coil component 100A according to the first modification. Figure 13 is a schematic plan view of coil component 100B according to the second modification.

[0040] As shown in Figures 12 and 13, the coil component 100A according to the first modification and the coil component 100B according to the second modification both differ from the coil component 100 according to the above embodiment in the shape of the exposed portion 131 of the insulating resin 130. Since the other basic configurations are the same as those of the coil component 100 according to the above embodiment, the same reference numerals are used for the same elements, and redundant explanations are omitted.

[0041] In the coil component 100A according to the first modification, the exposed width W2 of the exposed portion 131 of the insulating resin 130 located at the same lamination position as the conductor layers L2 and L3, i.e., in regions 27 and 37, is larger than the exposed width W1 of the exposed portion 131 located at the same lamination position as the conductor layers L1 and L4, i.e., in regions 17 and 47. The exposed widths W1 and W2 refer to the width in the X direction perpendicular to the lamination direction. This configuration is obtained by making the diameters of the coil patterns 10 and 40 larger than the diameters of the coil patterns 20 and 30. By making the diameters of the coil patterns 10 and 40 larger than the diameters of the coil patterns 20 and 30, the base body 110 can easily enter the region surrounded by the coil patterns 10, 20, 30, and 40 (the space formed by the removal of the sacrificial patterns 16, 26, 36, and 46), thereby reducing the difficulty of the manufacturing process.

[0042] In the coil component 100B according to the second modification, the exposed portion 131 of the insulating resin 130 exposes not only the insulating resin 130 located at the same lamination positions as the conductor layers L1 to L4, i.e., regions 17, 27, 37, and 47, but also the insulating resin 130 located above and below these regions, i.e., in the interlayer region 50. In the exposed portion 131 of the second modification, the exposed width in the X direction of the insulating resin 130 located in the interlayer region 50 is greater than the exposed width in the X direction of the insulating resin 130 located in regions 17, 27, 37, and 47. As a result, the boundary between the mounting surface 111 and the exposed portion 131 along the Z direction is not linear, but has an uneven shape (zigzag or meander shape). Consequently, the anchoring effect of the uneven shape enhances the adhesion of the molded resin that has entered the space S1.

[0043] While embodiments of the technology described herein have been explained above, it goes without saying that the technology described herein is not limited to the embodiments described above, and various modifications are possible without departing from its spirit, and these modifications are also included within the scope of the technology described herein.

[0044] For example, the coil component 100 according to the above embodiment has a configuration in which four conductor layers L1 to L4 are embedded in the base body 110, but the number of layers of conductors embedded in the base body is not limited to this.

[0045] The technology relating to this disclosure includes, but is not limited to, the following configuration examples.

[0046] A coil component according to one aspect of this disclosure comprises a base body having a mounting surface, a coil portion consisting of a plurality of conductor layers embedded in the base body and stacked in a stacking direction parallel to the mounting surface, an insulating resin located between the base body and the coil portion, a first terminal electrode protruding from the mounting surface and connected to one end of the coil portion, and a second terminal electrode protruding from the mounting surface and connected to the other end of the coil portion, wherein the insulating resin is located between the first and second terminal electrodes on the mounting surface and has a first exposed portion that protrudes from the mounting surface. As a result, excessive solder flow is suppressed by the first exposed portion protruding from the mounting surface, making flash phenomena less likely to occur.

[0047] In the above coil component, the base material may include a first filler made of a magnetic material, and the insulating resin may include a second filler with a smaller average particle size than the first filler. This improves the flatness of the surface of the first exposed portion, making it easier for the molding resin to penetrate the space between the circuit board and the first exposed portion when the coil component is mounted on a circuit board.

[0048] In the above-described coil component, the amount of protrusion of the first and second terminal electrodes relative to the mounting surface may be greater than the amount of protrusion of the first exposed portion relative to the mounting surface. This allows the space between the circuit board and the coil component to be increased when the coil component is mounted on the circuit board, making it easier for the molding resin to penetrate.

[0049] In the above-described coil component, the multiple conductor layers include a first conductor layer located at one end in the stacking direction, a second conductor layer located at the other end in the stacking direction, and one or more third conductor layers located between the first and second conductor layers. The first exposed portion may have a larger exposed width at the same stacking position as the third conductor layer than the exposed width at the same stacking position as the first and second conductor layers. This facilitates the formation of the base body.

[0050] In the above-described coil component, the boundary between the mounting surface and the first exposed portion along the stacking direction may have an uneven shape. This improves the adhesion of the molded resin embedded between the circuit board and the coil component.

[0051] In the above coil component, the base body may further have an upper surface located on the opposite side of the mounting surface, and the insulating resin may further have a second exposed portion exposed from the upper surface. This makes it possible to enlarge the diameter of the coil pattern constituting the coil portion. [Explanation of Symbols]

[0052] 10, 20, 30, 40 coil patterns Terminal patterns 11, 12, 21, 22, 31, 32, 41, 42 13-16, 23-26, 33-36, 43-46 Sacrifice Patterns 17,18,27,28,37,38,47,48 area 50 Interlayer area 100, 100A, 100B coil components 110 Base Body 111 Implementation aspects 112 Top surface 113-116 Side view 121,122 terminal electrode 130 Insulating resin 131,132 Exposed part 200 circuit boards 201,202 Land Pattern 300 solder L1~L4 Conductor Layers S, S1, S2 space

Claims

1. A base body having an implementation surface, A coil portion consisting of a plurality of conductor layers embedded in the base body and stacked in a stacking direction parallel to the mounting surface, An insulating resin located between the aforementioned base body and the aforementioned coil portion, A first terminal electrode is provided protruding from the mounting surface and connected to one end of the coil portion, A second terminal electrode is provided protruding from the aforementioned mounting surface and connected to the other end of the coil portion, Equipped with, The insulating resin is located between the first terminal electrode and the second terminal electrode on the mounting surface and has a first exposed portion that protrudes from the mounting surface. Coil components.

2. The aforementioned substrate includes a first filler made of a magnetic material, The insulating resin includes a second filler having a smaller average particle size than the first filler. The coil component according to claim 1.

3. The amount of protrusion of the first and second terminal electrodes relative to the mounting surface is greater than the amount of protrusion of the first exposed portion relative to the mounting surface. The coil component according to claim 1.

4. The plurality of conductor layers include a first conductor layer located at one end in the stacking direction, a second conductor layer located at the other end in the stacking direction, and one or more third conductor layers located between the first conductor layer and the second conductor layer. The exposed width of the first exposed portion is greater at the same stacking position as the third conductor layer than at the same stacking position as the first and second conductor layers. The coil component according to claim 1.

5. The boundary between the mounting surface and the first exposed portion along the stacking direction has an uneven shape. The coil component according to claim 1.

6. The aforementioned body further has an upper surface located on the opposite side of the mounting surface, The insulating resin further has a second exposed portion that is exposed from the upper surface. A coil component according to any one of claims 1 to 5.

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