Valve and chamber matching

Abstract

A method is provided for providing secondary control parameters for controlling a secondary vacuum valve. [Solution] The invention provides primary control parameters for controlling a primary vacuum valve (10), a first process chamber (1) equipped with a primary vacuum valve (10) to control the fluid flow in and out of the first process chamber (1), a reference processing cycle to be executed by changing the valve position of the valve closing portion of the primary vacuum valve according to the target processing information by adjusting the valve position based on a comparison of first processing information and target processing information, and a second process chamber equipped with a secondary vacuum valve to control the fluid flow in and out of the second process chamber, and controls the secondary vacuum valve based on the primary control parameters.

Description

Technical Field

[0005] ,

[0004] ,

[0001] The present invention relates to a method and a controller for providing regulated pressure control for a vacuum application process cycle performed using several valves or process chambers.

Background Art

[0002] Generally, vacuum valves for adjusting volume or mass flow rate and substantially airtightly closing a flow path passing through an opening formed in a valve housing are known in various embodiments from the prior art, and are particularly used in vacuum chamber systems in the field of manufacturing ICs, semiconductors or substrates that must be performed in an atmosphere protected as much as possible without the presence of contaminating particles.

[0003] Such a vacuum chamber system comprises at least one vacuum evacuable vacuum chamber for receiving a semiconductor element or substrate to be processed or manufactured, having at least one vacuum chamber opening for guiding a semiconductor element or other substrate into and out of the vacuum chamber, and at least one vacuum pump for evacuating the vacuum chamber. For example, in a semiconductor wafer or liquid crystal substrate manufacturing plant, sensitive semiconductor or liquid crystal elements sequentially pass through a plurality of process vacuum chambers, and components located within the process vacuum chambers are each processed by a processing apparatus. During both the processing process within the process vacuum chamber and the transfer from chamber to chamber, sensitive semiconductor elements or substrates must always be placed in a protected atmosphere, particularly an airless environment.

[0004] On the one hand, peripheral valves for opening and closing the supply or discharge of gas, and on the other hand, transfer valves for opening and closing the transfer opening of the vacuum chamber, are used for the purpose of introducing and removing components.

[0005] The type of vacuum valve through which semiconductor components pass is called a vacuum transfer valve.

[0006] Peripheral valves are used, in particular, to control or regulate the gas flow between a vacuum chamber and a vacuum pump or another vacuum chamber.

[0007] Peripheral valves are located, for example, within a piping system between a process vacuum chamber or transfer chamber and a vacuum pump, the atmosphere, or another process vacuum chamber. The opening cross-section of such valves, also known as pump valves, is typically smaller than that of vacuum transfer valves. Peripheral valves are also called regulating valves because, depending on the application, they are used not only for the complete opening and closing of the opening, but also to control or regulate flow through continuous adjustment of the opening cross-section between a fully open position and an airtight closed position. A possible peripheral valve for controlling or regulating gas flow is a pendulum valve.

[0008] For example, in a typical pendulum valve, as known from U.S. Patent No. 6,089,537 (Olmsted), in the first step, a valve disc, usually round, is pivoted rotatably over the opening, usually round, from a position that exposes the opening to an intermediate position that covers the opening. In the case of a slide valve, as described in U.S. Patent No. 6,416,037 (Geiser) or U.S. Patent No. 6,056,266 (Blecha), the valve disc and opening are usually rectangular, and in this first step, they are pushed linearly from a position that exposes the opening to an intermediate position that covers the opening. At this intermediate position, the valve disc of the pendulum valve or slide valve is positioned opposite the valve seat that surrounds the opening, with a gap between them. In the second step, the distance between the valve disc and the valve seat is reduced, resulting in the valve disc and valve seat being pressed evenly against each other, and the opening being substantially airtightly closed. This second movement is preferably performed at a position substantially perpendicular to the valve seat.

[0009] Sealing can be achieved, for example, via a sealing ring positioned on the closed side of the valve disc that is pressed against the valve seat passing around the opening, or via a sealing ring on the valve seat against which the closed side of the valve disc is pressed. As a result of the closing process carried out in two steps, the movement of the valve disc in the second step occurs substantially linearly and perpendicular to the valve seat, so the sealing ring is subjected to little shear force that would break the sealing ring between the valve disc and the valve seat.

[0010] Various sealing devices are known from the prior art, for example from U.S. Patent No. 6,629,682 (Duelli). Suitable materials for sealing rings and seals in vacuum valves include, for example, fluororubber, also known as FKM, particularly fluoroelastomers and perfluororubber, abbreviated as FFKM, known by the trade name "Viton".

[0011] Since the aforementioned valves are applied, in particular, to the manufacture of highly sensitive semiconductor devices, the generation of particles caused by the operation of the valve and the mechanical load of the valve shutter member, as well as the number of free particles in the valve chamber, must be kept as small as possible. Particle generation is mainly a result of friction, for example, as a result of metal / metal contact and as a result of wear.

[0012] As described above, vacuum regulating valves are used to regulate a specified process environment within a process chamber. The regulation is typically achieved here by a pressure signal providing information about the chamber pressure and by a target value, i.e., the desired pressure to be achieved by the regulation. The position of the valve closing portion (valve disc) is then changed during the regulation process, for example, in closed-loop regulation, so that the desired pressure is achieved within a specific time interval.

[0013] In contrast to adjustment, a vacuum adjustment valve can also be operated in a manner controlled by known process parameters, such as a desired pressure to be achieved in the process chamber within a given time. For this purpose, for example, a relevant desired position of the valve disc is provided, and this position is approached within a given time.

[0014] Both of the above methods have their own specific advantages and disadvantages. Therefore, while the desired pressure in the process chamber can be set relatively quickly by predetermined controls, the prediction of the currently dominant pressure is limited, typically due to a lack of feedback (e.g., current pressure information). Undesirable effects on the manufacturing process, such as altered gas inlets or leaks in the process chamber, remain unidentified and usually result in reduced manufacturing quality.

[0015] In the field of vacuum processing applications, operators intend to have multiple process chambers to provide a specific (high) productivity. Therefore, workpieces or substrates can be manufactured in parallel to increase output. Naturally, all workpieces or substrates manufactured should have at least nearly identical product characteristics and properties. Here, the desired pressure within the process chamber is typically set and modified by predetermined control parameters used for the chamber.

[0016] One problem with such parallel processing is the fact that process chambers and peripheral equipment such as gas inlet valves or plasma sources can typically differ, at least minimally, from chamber to chamber. As a result, process conditions in different chambers can vary accordingly. Such deviations can lead to products with different characteristics, such as different surface states. [Overview of the project] [Problems that the invention aims to solve]

[0017] Therefore, an object of the present invention is to provide an improved method or controller for overcoming possible deviations between parallel processes.

[0018] In particular, an object of the present invention is to provide an improved method or controller for controlling a set of vacuum valves to provide identical processing performance.

[0019] In particular, an object of the present invention is to provide an improved method that enables the processing performance of one process to be adjusted in relation to the processing performance of another process.

[0020] These objectives are addressed by implementing the distinctive features of the independent claims. Features that further develop the invention in alternative or advantageous ways can be inferred from the dependent claims. [Means for solving the problem]

[0021] The present invention relates to a method for controlling fluid flow in a process chamber using vacuum valves. The method aims to provide such control for at least two different valves, the control parameters for each valve being provided and aligned with each other so that the processes in the respective connected process chambers can be run under the same process conditions to achieve the same process results in the different chambers.

[0022] The present invention relates to a method for providing secondary control parameters for controlling a secondary vacuum valve. The method includes generating primary control parameters for controlling a primary vacuum valve.

[0023] The primary control parameters are generated by providing target processing information, such as a target pressure profile, target pressure, and target settling time, and by providing a first process chamber including a primary vacuum valve to control the fluid flow entering and leaving the first process chamber, particularly to control the downstream gas outlet flow from the first process chamber.

[0024] Furthermore, the reference processing cycle is executed by deriving first processing information related to the first process chamber and changing the valve position of the valve closing portion of the primary vacuum valve according to the target processing information by adjusting the valve position based on the comparison between the first processing information and the target processing information.

[0025] The change in the valve position of the valve closing portion can be provided based at least on a defined control parameter for controlling or setting the position of the valve closing portion.

[0026] The valve position is the position of the valve closing portion relative to the valve seat, that is, the actual flow rate can be changed and set by changing or setting the valve position. Therefore, the cross-sectional area of the opening depends on the valve position.

[0027] The primary control parameter for the primary vacuum valve is derived based at least on the derived first processing information and the related valve position.

[0028] In particular, a second process chamber is provided with a secondary vacuum valve for controlling the fluid flow entering and leaving the second process chamber in order to control the downstream gas outlet flow from the second process chamber.

[0029] The secondary vacuum valve is controlled based on the primary control parameter, and the primary control parameter is provided as a secondary control parameter.

[0030] Therefore, the method enables the secondary vacuum valve to be controlled according to the primary vacuum valve, that is, by applying the same control parameter.

[0031] In one embodiment, the second process chamber can be provided by the first process chamber, and in particular, the first and second process chambers are identical. In other words, the primary and secondary vacuum valves are provided in the same process chamber. This is important, for example, when the vacuum valve of a chamber needs to be replaced or swapped and processing needs to continue with the new valve in the same manner. The new valve can be operated with the control parameters of the old, replaced valve.

[0032] In one embodiment, the generation of primary control parameters can be provided by simulating changes in first processing information in response to adjustments in valve positions based on a digital model providing information about a first process chamber and a primary vacuum valve. This allows for the derivation of ideal process behavior and its respective control parameters, which can then be used as a basis for aligning the controls of other actual valves.

[0033] According to one embodiment, the first processing information is • Valve position or valve position profile, • Pressure or pressure profile within the process chamber, ·Settling time, • Adjustment time, • Pressure overshoot or undershoot, • Pressure error, • Maximum pressure deviation, and • Temperature, especially the actual temperature inside the process chamber. It can include at least one of the following.

[0034] Therefore, the first processing information can be used as a basis for determining (further) changes to the valve position to alter the fluid flow. For example, the pressure in the process chamber depends on the temperature in the chamber, and the flow rate through the vacuum valve can be adjusted according to the temperature to compensate for the pressure deviation. Furthermore, changes to the valve position may be made in accordance with the pressure deviation.

[0035] In one embodiment, secondary control parameters for controlling a secondary vacuum valve can be adjusted by providing target processing information, deriving second processing information related to a second process chamber, adjusting the valve position based on primary control parameters, comparing the second processing information with the target processing information to change the valve position of the valve closing portion of the secondary vacuum valve according to the target processing information and perform an adjustment processing cycle, and deriving adjusted secondary control parameters for the secondary vacuum valve based on at least the derived second processing information and the associated valve position.

[0036] Therefore, the secondary control parameters can be adjusted according to the characteristics of the second process chamber to provide the same performance as the first process chamber. This step can further improve and guarantee the same performance.

[0037] The present invention also relates to a method for matching the processing performance of a first process chamber with the processing performance of a second process chamber.

[0038] The method includes providing a first process chamber equipped with a first vacuum valve for controlling fluid flow in and out of the first process chamber in order to provide target processing information and, in particular, control the downstream gas outlet flow from the first process chamber, and providing a second process chamber equipped with a second vacuum valve for controlling fluid flow in and out of the second process chamber in order to control the downstream gas outlet flow from the second process chamber.

[0039] A first control parameter for controlling a first vacuum valve is generated by deriving first processing information related to a first process chamber, performing a first processing cycle by changing the valve position of the valve closing portion of the first vacuum valve according to the target processing information by adjusting the valve position based on a comparison of the first processing information and target processing information, and deriving a first control parameter for the first vacuum valve based on at least the derived first processing information and the associated valve position.

[0040] The second control parameters for controlling the second vacuum valve are generated by deriving second processing information related to the second process chamber, performing a second processing cycle by changing the valve position of the valve closing portion of the second vacuum valve according to the target processing information by adjusting the valve position based on a comparison of the second processing information and the target processing information, and deriving the second control parameters for the second vacuum valve based on at least the derived second processing information and the associated valve position.

[0041] The first and second processing information are compared, and based on the comparison of the first and second processing information, commonly applicable processing information is derived.

[0042] This method aims to provide identical performance for process chambers without assuming that one of the chambers is the basis for relative performance matching. A process chamber operating at a higher speed may preferably be matched to the performance or profile of a chamber operating at a lower speed.

[0043] In one embodiment, commonly applicable processing information can be compared with first processing information, and based on this, the first control parameter can be adjusted.

[0044] Such adjustment of the first control parameter may include, in particular, deriving updated first processing information related to the first process chamber, performing an adjustment processing cycle by changing the valve position of the valve closing portion of the first vacuum valve in accordance with commonly applicable processing information, and adjusting the valve position based on the first control parameter and based on comparing the updated first processing information with commonly applicable processing information. The primary control parameter for the first vacuum valve is adjusted based on at least the derived updated first processing information and the associated valve position.

[0045] In one embodiment, commonly applicable processing information can be compared with second processing information, and based on this, the second control parameter is adjusted.

[0046] In one embodiment, the adjustment of the second control parameter may include deriving updated second processing information related to the second process chamber, adjusting the valve position based on the second control parameter and based on a comparison of the updated second processing information with commonly applicable processing information, thereby performing an adjustment processing cycle by changing the valve position of the valve closing portion of the second vacuum valve in accordance with commonly applicable processing information, and adjusting the second control parameter for the second vacuum valve based on at least the derived updated second processing information and the associated valve position.

[0047] In one embodiment, the first processing information, the second processing information, and / or target processing information may include at least one of the following: valve position or valve position profile, process chamber pressure or pressure profile, settling time, adjustment time, pressure overshoot or undershoot, pressure error, maximum pressure deviation, and temperature, in particular the actual temperature inside the process chamber.

[0048] Furthermore, at least one of the processing pieces of information may include a trajectory derived by comparing or processing several trajectories of several valves. By processing several trajectories, a desired trajectory can be calculated, which represents the trajectory that is feasible by each of the valves or by the valves that are matched to other valves. For example, the desired trajectory may essentially correspond to the trajectory of one of the valves, but may be slightly adjusted to compensate for overshoot.

[0049] The present invention also relates to a controller for controlling at least one vacuum valve to control the pressure in at least one process chamber by the vacuum valve, wherein the controller is configured to control at least one vacuum valve based on the respective control parameters assigned to the at least one vacuum valve.

[0050] In one embodiment, at least one vacuum valve may be a secondary vacuum valve, and each control parameter is a secondary control parameter for controlling the secondary vacuum valve. The controller is configured to derive the secondary control parameter by receiving a primary control parameter for controlling the primary vacuum valve and deriving the secondary control parameter for controlling the secondary vacuum valve. The deriving of the secondary control parameter includes providing target processing information and deriving second processing information related to a second process chamber, adjusting the valve position based on the primary control parameter, and comparing the second processing information with the target processing information to change the valve position of the valve closing portion of the secondary vacuum valve according to the target processing information and perform an adjustment processing cycle. The adjusted secondary control parameter of the secondary vacuum valve is derived based on at least the derived second processing information and the associated valve position.

[0051] In one embodiment, at least one vacuum valve may be a first vacuum valve of a first process chamber, each control parameter being a first control parameter for controlling the first vacuum valve, and the controller is configured to control a second vacuum valve of a second process chamber based on a second control parameter, and the controller is configured to match the processing performance of the first process chamber with the processing performance of the second process chamber.

[0052] Matching the processing performance of the first process chamber with the processing performance of the second process chamber includes providing target processing information (e.g., pressure profile, settling time, etc.), generating first control parameters for controlling the first vacuum valve by deriving first processing information relating to the first process chamber, and executing a first processing cycle by changing the valve position of the valve closing portion of the first vacuum valve according to the target processing information by adjusting the valve position based on a comparison of the first processing information with the target processing information, and deriving first control parameters for the first vacuum valve based on at least the derived first processing information and associated valve position.

[0053] Furthermore, the second control parameters for controlling the second vacuum valve are generated by deriving second processing information related to the second process chamber, performing a second processing cycle by changing the valve position of the valve closing portion of the second vacuum valve according to the target processing information by adjusting the valve position based on a comparison of the second processing information and the target processing information, and deriving the second control parameters for the second vacuum valve based on at least the derived second processing information and the associated valve position.

[0054] The first and second processing information are compared, and based on the comparison of the first and second processing information, commonly applicable processing information is derived.

[0055] In one embodiment, the controller may be configured to compare commonly applicable processing information with first processing information and adjust the first control parameter based on that comparison.

[0056] In one embodiment, the adjustment of the first control parameter may include deriving updated first processing information related to the first process chamber, performing an adjustment process cycle by changing the valve position of the valve closing portion of the first vacuum valve in accordance with the commonly applicable processing information, by adjusting the valve position based on the first control parameter and by comparing the updated first processing information with commonly applicable processing information, and adjusting the first control parameter for the first vacuum valve based on at least the derived updated first processing information and the associated valve position.

[0057] The apparatus and method according to the present invention will be described in detail below merely as an example, with reference to certain exemplary embodiments schematically shown in the drawings, and further advantages of the present invention will also be discussed. [Brief explanation of the drawing]

[0058] [Figure 1] A schematic embodiment of a processing system for processing or manufacturing objects under vacuum conditions according to the present invention is shown. [Figure 2] A schematic embodiment of a processing system for processing or manufacturing objects under vacuum conditions according to the present invention is shown. [Figure 3a] This shows the pressure control profile and the alignment of the profiles. [Figure 3b] This shows the pressure control profile and the alignment of the profiles. [Figure 4] The steps of a method for providing control parameters for controlling a vacuum valve based on a desired profile are shown. [Modes for carrying out the invention]

[0059] Figure 1 schematically shows one embodiment of a processing system for processing or manufacturing objects under vacuum conditions. The system comprises two process chambers 1 and 1'. Each process chamber 1 and 1' is connected to a supply line for supplying fluid to its respective process chamber (upstream). The supply line is equipped with peripheral devices such as gas flow meters 2 and 2', a mass flow controller, and inlet valves, which can be used to measure a specified amount of a particular fluid, such as a process gas or precursor gas, flowing into the process chambers 1 and 1', or to appropriately adjust the amount of fluid flowing in. Furthermore, pressure sensors 3 and 3' are provided to enable the determination of the internal pressure (chamber pressure) of each process chamber 1 and 1'.

[0060] At the outlets of process chambers 1 and 1', vacuum pumps 4 and 4' are connected to chambers 1 and 1' for exhaust. Adjustable vacuum valves 10 and 10', each for controlling or regulating the outflow mass flow rate of chambers 1 and 1', are located between the vacuum pumps 4 and 4' and chambers 1 and 1' (downstream). The (controlled) setting of valves 10 and 10' can be achieved, for example, by electric, pneumatic, or hydraulic drive of the valves.

[0061] According to the present invention, the system has a controller 20 (control unit) connected to vacuum valves 10 and 10', which provides controlled changes in the respective valve positions, i.e., the position of the valve closing portion relative to the valve seat, by a control signal.

[0062] Furthermore, the controller 20 is connected to pressure sensors 3 and 3' to receive and process the pressure signals from sensors 3 and 3'. Thus, pressure sensors 3 and 3' are arranged to derive (first and / or second) processing information related to their respective process chambers 1 and 1'.

[0063] In an alternative embodiment, the controller 20 may also be connected to peripheral devices 2, 2' to control or measure the amount of processing fluid supplied into the process chambers 1, 1'.

[0064] The process chambers 1, 1' and connected devices and components are intended to provide identical processing characteristics for the two chambers 1 and 1'. These processing characteristics are defined by the proper control of at least the vacuum valves 10 and 10'. This allows for the provision of a specified or desired pressure profile within each chamber 1, 1' for the processing cycle.

[0065] Vacuum valves 10 and 10' can preferably be controlled in an open-loop manner during processing of a substrate or other workpiece. This means that in such cases there is no feedback information to be processed to provide closed-loop adjustment of the chamber pressure.

[0066] Therefore, in alternative embodiments, at least one of the pressure sensors 3, 3' can be omitted, particularly after the control parameters have been set and the process chamber has been operated to process the substrate or workpiece.

[0067] To provide identical processing characteristics, the pressure profiles of the two chambers 1 and 1' can be matched to each other. To this end, according to the present invention, specific (secondary) control parameters for controlling the (secondary) vacuum valve 10' are derived. Then, by applying the secondary control parameters, a pressure profile in the second chamber 1' is provided that is at least substantially identical to the pressure profile in the first chamber 1 when the primary control parameters are applied to control the primary valve 10.

[0068] In the preceding stage, the primary control parameters can be derived based on learning or optimization using the first chamber 1, using a known target pressure profile.

[0069] In one embodiment, these parameters may be derived by performing a model-based simulation.

[0070] A method for providing secondary control parameters for controlling a secondary vacuum valve 10' includes generating primary control parameters for controlling a primary vacuum valve 10 by providing target processing information. The target processing information may include a target pressure trajectory, target pressure, settling time, desired processing time, etc.

[0071] Next, a baseline processing cycle is performed by the first process chamber 1. The first process chamber 1 has a primary vacuum valve 10 for controlling the downstream gas outlet flow from the first process chamber. Performing the baseline processing cycle includes changing the valve position of the valve closing portion of the primary vacuum valve 10 according to target processing information.

[0072] During a standard processing cycle, first processing information related to the first process chamber 1 is derived or measured, and the valve position is adjusted based on a comparison of the first processing information with target processing information. The first processing information may include the actual chamber pressure and / or the chamber or fluid temperature.

[0073] The primary control parameters for the primary vacuum valve 10 are derived based on at least the derived first processing information and the associated valve position. The combined knowledge of the valve position and the first processing information resulting from the valve position provides control of the primary valve 10 so that target processing information can be provided.

[0074] The secondary vacuum valve 10' can be controlled based on primary control parameters, which are then provided as secondary control parameters. In other words, the secondary valve 10' can be controlled using the optimized control parameters of the primary valve 10.

[0075] However, due to natural deviations from chamber to chamber, such as structural differences or differences in fluid conductance, secondary control parameters typically need to be adjusted or optimized in additional steps to provide identical processing.

[0076] Therefore, the secondary control parameters for controlling the secondary vacuum valve 10' can be adjusted by providing target processing information and executing an adjustment processing cycle by changing the valve position of the valve closing portion of the secondary vacuum valve 10' according to the target processing information.

[0077] This derives second processing information related to the second process chamber, and the valve position is adjusted based on the primary control parameters and by comparing the second processing information with the target processing information. The adjusted secondary control parameters for the secondary vacuum valve 10' are derived based on at least the derived second processing information and the associated secondary valve position.

[0078] In other words, the control parameters for the secondary valve 10' and the secondary chamber 1' are generated based on the control parameters for the primary valve 10 and by adjusting the control parameters according to the given conditions of the secondary process chamber 1'.

[0079] Figure 2 shows one embodiment of a processing system for handling or processing substrates under vacuum conditions. The embodiment in Figure 2 is distinguished from the embodiment in Figure 1 by control units 20 and 20'.

[0080] As shown in Figure 2, there is no central control unit, and each process chamber and each device is controlled by separate controllers 20, 20'. This means that primary control parameters are derived on the first control unit 20 side and transferred to the second control unit 20' for use, or further processed to control the secondary vacuum valve 10'.

[0081] Figures 3a and 3b show the pressure profiles for two process chambers controlled by two vacuum valves.

[0082] Figure 3a shows a first pressure trajectory 31 representing a desired pressure trajectory. Such a profile 31 can be that of a standard chamber, i.e., the control performance of each chamber whose performance should be transmitted to other process chambers. Alternatively, such a profile 31 can be derived based on a simulation of a desired processing cycle.

[0083] The second pressure trajectory 32 represents the initial chamber pressure control of the chamber, whose performance should be adapted to a standard chamber.

[0084] As can be seen, there is a significant discrepancy between profiles 31 and 32. This discrepancy can typically be due to different structural characteristics of the chamber and / or its peripheral equipment, even when the valves of the matched chamber are driven with the control parameters for a standard chamber.

[0085] Figure 3b shows the chamber's process trajectory after the control parameters have been adjusted to drive the chamber. To achieve this, an optimization routine (which modifies the control parameters) can be run to match the desired pressure control behavior as closely as possible.

[0086] Figure 4 shows a method for providing specific control parameters for controlling a (secondary) vacuum valve.

[0087] In the first sequence 41, primary control parameters for controlling the primary vacuum valve are generated. For this purpose, target processing information is provided, such as a target pressure profile, target pressure, settling time, target valve position or valve position profile, target adjustment time, and maximum pressure deviation (42).

[0088] A first process chamber is provided, comprising a primary vacuum valve for controlling the fluid flow in and out of the first process chamber (43). The provided primary vacuum valve is considered to be a valve to which other valves should be fitted.

[0089] The baseline processing cycle is performed by changing the valve position of the valve closing section of the primary vacuum valve according to the target processing information (44). During the execution of the baseline processing cycle, first processing information related to the first process chamber is derived (45), and the valve position is adjusted based on a comparison between the first processing information and the target processing information (46).

[0090] The primary control parameters for the primary vacuum valve are derived based on at least the derived first processing information and the associated valve position (47).

[0091] A second process chamber is provided, which includes a secondary vacuum valve for controlling the fluid flow in and out of the second process chamber (48).

[0092] The secondary vacuum valve is controlled based on the primary control parameters, which are provided as secondary control parameters (49).

[0093] In a further optional step 50, the secondary control parameters can be adjusted by performing the adjustment process cycle described above.

[0094] It should be understood that the illustrated figures only schematically represent possible exemplary embodiments. The various methods according to the present invention can also be combined with each other and with prior art methods and apparatus for pressure control for vacuum processes.

Claims

1. A method for providing secondary control parameters for controlling a secondary vacuum valve (10'), - Primary control parameters for controlling the primary vacuum valve (10) Provide target processing information, To control the fluid flow entering and leaving the first process chamber (1), the first process chamber (1) is provided, which includes the primary vacuum valve (10). First processing information related to the first process chamber (1) is derived, and the valve position is adjusted based on a comparison of the first processing information and the target processing information, thereby changing the valve position of the valve closing portion of the primary vacuum valve (10) according to the target processing information and executing a reference processing cycle. Based at least the derived first processing information and the associated valve position, the primary control parameters for the primary vacuum valve (10) are derived. By generating, - The second process chamber (1') is provided, which includes the secondary vacuum valve (10') for controlling the fluid flow entering and leaving the second process chamber (1'). - Control the secondary vacuum valve (10') based on the primary control parameters provided as secondary control parameters. A method that includes the act of doing so.

2. The method according to claim 1, wherein the second process chamber (1') is provided by the first process chamber (1).

3. The method according to claim 1 or 2, wherein the generation of the primary control parameters is provided by simulating changes in the first processing information in response to adjustments of the valve position based on a digital model providing information about the first process chamber (1) and the primary vacuum valve (10).

4. The first processing information is • Valve position or valve position profile, - Pressure or pressure profile within the process chamber, ・Settling time, • Adjustment time, - Pressure overshoot or undershoot, • Pressure error, - Maximum pressure deviation, and ·temperature The method according to any one of claims 1 to 3, comprising at least one of the following.

5. The secondary control parameter for controlling the secondary vacuum valve (10') is, - Provide the aforementioned target processing information, - Second processing information related to the second process chamber (1') is derived, and the valve position is adjusted based on the primary control parameters and a comparison between the second processing information and the target processing information, thereby changing the valve position of the valve closing portion of the secondary vacuum valve (10') according to the target processing information and executing an adjustment processing cycle. - Based at least the derived second processing information and the associated valve position, adjusted secondary control parameters for the secondary vacuum valve (10') are derived. The method according to any one of claims 1 to 4, which is adjusted by...

6. A method for matching the processing performance of a first process chamber (1) with the processing performance of a second process chamber (2), - Provide target processing information, - The first process chamber (1) is provided, which includes a first vacuum valve (10) for controlling the fluid flow entering and leaving the first process chamber (1). - The second process chamber (1') is provided, which includes the second vacuum valve (10') for controlling the fluid flow entering and leaving the second process chamber (1'). - A first control parameter for controlling the first vacuum valve (10) is defined as The first processing information related to the first process chamber (1) is derived, and the valve position is adjusted based on a comparison of the first processing information and the target processing information, thereby changing the valve position of the valve closing portion of the first vacuum valve (10) according to the target processing information and executing the first processing cycle. Based at least the derived first processing information and the associated valve position, the first control parameters for the first vacuum valve (10) are derived. By generating, - A second control parameter for controlling the second vacuum valve (10') is defined as follows: The second processing information related to the second process chamber (1') is derived, and the valve position is adjusted based on a comparison of the second processing information and the target processing information, thereby changing the valve position of the valve closing portion of the second vacuum valve (10') according to the target processing information and executing the second processing cycle. Based at least the derived second processing information and the associated valve position, a second control parameter for the second vacuum valve (10') is derived. By generating, - Compare the first processing information and the second processing information, Based on a comparison of the first processing information and the second processing information, commonly applicable processing information is derived. A method that includes the act of doing so.

7. The method according to claim 6, wherein the commonly applicable processing information is compared with the first processing information, and the first control parameter is adjusted based on the comparison.

8. The adjustment of the first control parameter is - To derive updated first processing information related to the first process chamber (1), and to adjust the valve position based on the first control parameters and a comparison between the updated first processing information and the commonly applicable processing information, thereby changing the valve position of the valve closing portion of the first vacuum valve (10) according to the commonly applicable processing information and executing an adjustment processing cycle, - Adjusting the first control parameter for the first vacuum valve (10) based at least on the derived updated first processing information and the associated valve position, The method according to claim 7, including the method described in claim 7.

9. The method according to any one of claims 6 to 8, wherein the commonly applicable processing information is compared with the second processing information, and the second control parameter is adjusted based on the comparison.

10. The adjustment of the second control parameter is - To derive updated second processing information related to the second process chamber (1'), and to adjust the valve position based on the second control parameter and a comparison between the updated second processing information and the commonly applicable processing information, thereby changing the valve position of the valve closing portion of the second vacuum valve (10') according to the commonly applicable processing information and executing an adjustment processing cycle, - Adjusting the second control parameter for the second vacuum valve (10') based at least on the derived updated second processing information and the associated valve position, The method according to claim 9, including the method described in claim 9.

11. A controller (20, 20') for controlling at least one vacuum valve (10, 10') to control the pressure in at least one process chamber (1, 1') by the vacuum valve (10, 10'), wherein the controller (20, 20') is configured to control the at least one vacuum valve (10, 10') based on the respective control parameters assigned to the at least one vacuum valve (10, 10').

12. The at least one vacuum valve is a secondary vacuum valve (10'), and each of the control parameters is a secondary control parameter for controlling the secondary vacuum valve (10'), and the controller is - Receive primary control parameters for controlling the primary vacuum valve (10), - Provide target processing information, The second processing information related to the second process chamber (1') is derived, and the valve position is adjusted based on (i) the primary control parameters and (ii) a comparison of the second processing information and the target processing information, thereby changing the valve position of the valve closing portion of the secondary vacuum valve (10') according to the target processing information and executing an adjustment processing cycle. Based at least the derived second processing information and the associated valve position, adjusted secondary control parameters for the secondary vacuum valve (10') are derived. The controller (20, 20') according to claim 11, configured to derive the secondary control parameters by doing so.

13. The at least one vacuum valve is a first vacuum valve (10) of a first process chamber, the respective control parameters are first control parameters for controlling the first vacuum valve (10), the controller (20, 20') is configured to control a second vacuum valve (10') of a second process chamber (1') based on a second control parameter, and the controller - Provide target processing information, - First processing information related to the first process chamber (1) is derived, and the valve position is adjusted based on a comparison of the first processing information and the target processing information, thereby changing the valve position of the valve closing portion of the first vacuum valve (10) according to the target processing information and executing the first processing cycle. Based at least the derived first processing information and the associated valve position, the first control parameters for the first vacuum valve (10) are derived. By doing so, a first control parameter for controlling the first vacuum valve (10) is generated, - Second processing information related to the second process chamber (1') is derived, and the valve position is adjusted based on a comparison of the second processing information and the target processing information, thereby executing a second processing cycle by changing the valve position of the valve closing portion of the second vacuum valve (10') according to the target processing information. Based at least the derived second processing information and the associated valve position, the second control parameter for the second vacuum valve (10') is derived. By doing so, a second control parameter for controlling the second vacuum valve (10') is generated, - Compare the first processing information and the second processing information, Based on a comparison of the first processing information and the second processing information, commonly applicable processing information is derived. The controller (20, 20') according to claim 11, configured to match the processing performance of the first process chamber (1) with the processing performance of the second process chamber (1').

14. The controller (20, 20') according to claim 13, wherein the controller (20, 20') is configured to compare the commonly applicable processing information with the first processing information and adjust the first control parameter based thereon.

15. The adjustment of the first control parameter is - To derive updated first processing information related to the first process chamber (1), and to adjust the valve position based on the first control parameters and a comparison between the updated first processing information and the commonly applicable processing information, thereby changing the valve position of the valve closing portion of the first vacuum valve (10) according to the commonly applicable processing information and executing an adjustment processing cycle, - Adjusting the first control parameter for the first vacuum valve (10) based at least on the derived updated first processing information and the associated valve position, The controller (20, 20') according to claim 14, including the above.

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