Multilayer ceramic capacitor

Abstract

One embodiment provides a multilayer ceramic capacitor including external electrodes with reduced plating cracking. [Solution] The multilayer ceramic capacitor 1000 includes a body 110 which includes a plurality of internal electrodes (first internal electrode 150, second internal electrode 160) and a dielectric layer 150 disposed between the plurality of internal electrodes, and external electrodes (first external electrode 200, second external electrode 300) disposed outside the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, and includes an electrode layer (first electrode layer 210, second electrode layer 310) which includes a first metal and glass, a plating layer (first plating layer 230, second plating layer 330) disposed on the electrode layer, and a conductive intervening portion (first conductive intervening portion 250, second conductive intervening portion 350) which is disposed at the interface between the electrode layer and the plating layer.

Description

[Technical Field]

[0001] This disclosure relates to multilayer ceramic capacitors. [Background technology]

[0002] Electronic components that use ceramic materials include capacitors, inductors, piezoelectric elements, varistors, and thermistors. Among these ceramic electronic components, multilayer ceramic capacitors (MLCCs) can be used in a wide variety of electronic devices due to their advantages of being small, having guaranteed high capacitance, and being easy to mount.

[0003] For example, multilayer ceramic capacitors can be used as chip-type capacitors mounted on the substrates of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), organic light-emitting diodes (OLEDs), computers, personal portable devices, and smartphones, playing a role in charging or discharging electricity.

[0004] A multilayer ceramic capacitor may include internal electrodes located inside the main body and external electrodes located outside the main body and connected to the internal electrodes. The external electrodes can be formed by applying a paste containing metal and glass to the main body, firing it to form an electrode layer, and then forming a plating layer on top of the electrode layer. If the electrode layer is too thin or the conductive paste is fired excessively, the glass may dissolve onto the surface of the electrode layer, leading to plating cracks. [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] One embodiment provides a multilayer ceramic capacitor including external electrodes with reduced plating cracking.

[0006] However, the problems that the embodiments of the present invention aim to solve are not limited to those described above, and can be broadly expanded within the scope of the technical ideas included in the present invention. [Means for solving the problem]

[0007] A multilayer ceramic capacitor according to one embodiment includes a body comprising a plurality of internal electrodes and a dielectric layer disposed between the plurality of internal electrodes, and an external electrode disposed outside the body, wherein the external electrode may include an electrode layer comprising a first metal and glass, a plating layer disposed on the electrode layer, and a conductive inclusion disposed at the interface between the electrode layer and the plating layer.

[0008] The conductive intervening portion may be in the shape of an island.

[0009] The conductive intervening portion may include metal particles or a metal layer.

[0010] The aforementioned metal particles or metal layer may contain a second metal.

[0011] The conductive intervening portion may contain an intermetallic compound (IMC).

[0012] The conductive intervening portion includes a conductive connecting portion containing metal particles or a metal layer, and a first interface layer disposed at the interface between the conductive connecting portion and the plating layer, the first interface layer may contain a first intermetallic compound.

[0013] The first intermetallic compound may contain copper (Cu) and tin (Sn).

[0014] The first intermetallic compound may also contain Cu6Sn5 and / or Cu3Sn.

[0015] The first intermetallic compound may contain silver (Ag) and tin (Sn).

[0016] The first intermetallic compound may contain Ag3Sn.

[0017] The first intermetallic compound may contain nickel (Ni) and tin (Sn).

[0018] The first intermetallic compound may contain Ni3Sn.

[0019] The conductive intervening portion includes a conductive connecting portion containing metal particles or a metal layer, and a second interface layer disposed at an interface between the conductive connecting portion and the electrode layer. The second interface layer may contain a second intermetallic compound.

[0020] The second intermetallic compound may contain copper (Cu) and tin (Sn).

[0021] The second intermetallic compound may contain Cu6Sn and / or Cu3Sn.

[0022] The second intermetallic compound may contain gold (Au) and tin (Sn).

[0023] The second intermetallic compound may contain AuSn4, AuSn2 or AuSn.

[0024] The second intermetallic compound may contain lead (Pb) and bismuth (Bi).

[0025] The second intermetallic compound may contain Pb7Bi3.

[0026] The conductive intervening portion may include a conductive connecting portion containing metal particles or a metal layer, and a resin in contact with the conductive connecting portion.

[0027] The conductive connecting portion can be dispersed in the resin.

[0028] The length ratio of the conductive intervening portion may be greater than 0% and 84.86% or less.

[0029] The body includes a first surface and a second surface which are opposite to each other in a first direction intersecting the plurality of internal electrodes, and the electrode layer may include a connecting portion connected to the internal electrodes, and a band portion extending from the connecting portion and covering a portion of the first surface and a portion of the second surface.

[0030] The external electrode further includes a conductive resin layer covering at least a portion of the band portion, and the plating layer can cover the conductive resin layer.

[0031] The electrode layer includes a corner portion to which the connecting portion and two band portions adjacent to the connecting portion are connected to each other, and the conductive resin layer can cover the corner portion.

[0032] The external electrode may further include a residual conductive resin layer arranged in an island shape on the connection portion.

[0033] When the surface of the connection portion is divided equally into nine regions, the conductive resin layer can cover at least a portion of the connection portion in the region including the corner portion.

[0034] The conductive resin layer can extend from the band portion to the connection portion and cover a portion of the connection portion.

[0035] When the surface of the connection portion is divided equally into nine regions, the conductive resin layer can cover at least a portion of the connection portion in the remaining regions excluding the central region.

[0036] A multilayer ceramic capacitor according to one embodiment includes a body comprising a plurality of internal electrodes and a plurality of dielectric layers stacked in a first direction, and an external electrode disposed outside the body, wherein the external electrode may include an electrode layer connected to the internal electrodes and having recesses on its surface, a conductive inclusion filling the recesses, and a plating layer covering the electrode layer and the conductive inclusion.

[0037] In a cross-section along the first direction, the conductive intervening portion includes an inner portion in contact with the electrode layer and an outer portion in contact with the plating layer, with reference to a straight line connecting a first point and a second point where the electrode layer, the plating layer, and the conductive intervening portion are in contact, and the area of ​​the inner portion may be larger than the area of ​​the outer portion.

[0038] In a cross-section along the first direction, the conductive intervening portion includes an inner portion in contact with the electrode layer and an outer portion in contact with the plating layer, with respect to a straight line connecting a first point and a second point where the electrode layer, the plating layer, and the conductive intervening portion are in contact. The maximum distance between the straight line and the edge of the inner portion may be greater than the maximum distance between the straight line and the edge of the outer portion. [Effects of the Invention]

[0039] According to the multilayer ceramic capacitor of the embodiment, plating cracks can be prevented by forming a conductive intervening portion on the surface of the electrode layer of the external electrode, and then forming a plating layer. [Brief explanation of the drawing]

[0040] [Figure 1] Figure 1 is a schematic perspective view showing a multilayer ceramic capacitor according to one embodiment. [Figure 2] Figure 2 is a cross-sectional view taken along the line I-I' in Figure 1. [Figure 3] Figure 3 is a separated perspective view showing the layered structure of the internal electrodes in the multilayer ceramic capacitor shown in Figure 1. [Figure 4] Figure 4 is an enlarged view of area A in Figure 2. [Figure 5] Figure 5 is another enlarged view of area A in Figure 2. [Figure 6] Figure 6 is another enlarged view of area A in Figure 2. [Figure 7] Figure 7 is a schematic diagram illustrating the process of forming the conductive intervening portion of the multilayer ceramic capacitor according to the embodiment. [Figure 8] Figure 8 is a schematic diagram illustrating the process of forming the conductive intervening portion of the multilayer ceramic capacitor according to the embodiment. [Figure 9] Figure 9 is a schematic diagram illustrating the process of forming the conductive intervening portion of the multilayer ceramic capacitor according to the embodiment. [Figure 10] Figure 10 is a schematic diagram illustrating the process of forming the conductive intervening portion and the plating layer of a multilayer ceramic capacitor according to an embodiment. [Figure 11] Figure 11 is an image of a scanning electron microscope (SEM) taken of a cross-section of the central part of the thickness direction T of the external electrode of the multilayer ceramic capacitor according to the embodiment. [Figure 12] Figure 12 is an image showing the measurement area E in Figure 11. [Figure 13] Figure 13 is an image showing the region in measurement area E where a conductive intervening part was formed, highlighted in color. [Figure 14] Figure 14 is a black and white image of the measurement area E. [Figure 15] Figure 15 is a schematic diagram illustrating a method for measuring the length ratio of the first conductive intervening in measurement region E. [Figure 16] Figure 16 is a schematic perspective view showing a multilayer ceramic capacitor according to another embodiment. [Figure 17] Figure 17 is a cross-sectional view taken along the line II-II' in Figure 16. [Figure 18] Figure 18 is a cross-sectional view taken along the line III-III' in Figure 16. [Figure 19]Figure 19 is a schematic diagram showing the first external electrode of the multilayer ceramic capacitor shown in Figure 16. [Figure 20] Figure 20 is a schematic diagram showing the second external electrode of the multilayer ceramic capacitor shown in Figure 16. [Figure 21] Figure 21 is a schematic diagram showing the first external electrode of the multilayer ceramic capacitor shown in Figure 16. [Figure 22] Figure 22 is a schematic diagram showing the first external electrode of a multilayer ceramic capacitor according to another embodiment. [Figure 23] Figure 23 is a schematic diagram showing the first external electrode of a multilayer ceramic capacitor according to another embodiment. [Figure 24] Figure 24 is a schematic diagram showing the first external electrode of a multilayer ceramic capacitor according to another embodiment. [Figure 25] Figure 25 is a schematic diagram showing the first external electrode of a multilayer ceramic capacitor according to another embodiment. [Modes for carrying out the invention]

[0041] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that they can be easily implemented by a person with ordinary skill in the art to which the present invention pertains. In the drawings, parts that are not necessary for the clear explanation of the present invention have been omitted, and the same or similar components are denoted by the same reference numerals throughout the specification. In addition, some components in the attached drawings are exaggerated, omitted, or shown schematically, and the size of each component does not fully reflect its actual size.

[0042] The accompanying drawings are provided solely to facilitate understanding of the embodiments disclosed herein, and should not be understood as limiting the technical ideas disclosed herein, and should be understood to include any modifications, equivalents, or substitutions that fall within the concept and scope of the invention.

[0043] Terms including ordinal numbers, such as "first," "second," etc., can be used to describe a variety of components, but the components are not limited by such terms. These terms are used solely for the purpose of distinguishing one component from another.

[0044] Furthermore, when we say that a layer, membrane, region, plate, or other part is "on top of" another part, this includes not only the case where it is "directly above" the other part, but also the case where the other part is in between. Conversely, when we say that one part is "directly above" another part, it means that there is no other part in between. Also, being "on top of" a reference part means being located above or below the reference part, and does not necessarily mean being located "above" in the opposite direction of gravity.

[0045] Throughout the specification, terms such as “includes” or “have” are intended to specify the presence of features, figures, steps, actions, components, parts, or combinations thereof described in the specification, and should not be understood to preemptively exclude the presence or possibility of adding one or more other features, figures, steps, actions, components, parts, or combinations thereof. Therefore, when a part “includes” a component, this means that, unless otherwise stated, it does not exclude other components and may further include other components.

[0046] Furthermore, throughout the specification, "on a plane" refers to the view of the part in question from above, and "on a cross-section" refers to the view of the cross-section of the part in question, obtained by cutting it perpendicularly, from the side.

[0047] Furthermore, throughout the specification, the term "connected" does not only mean that two or more components are directly connected, but may also mean that two or more components are indirectly connected through other components, that they are not only physically connected but also electrically connected, or that they are a single unit, even though they are referred to by different names depending on their location or function.

[0048] Figure 1 is a schematic perspective view showing a multilayer ceramic capacitor according to one embodiment.

[0049] Referring to Figure 1, the multilayer ceramic capacitor 1000 according to this embodiment includes a body 110, a first external electrode 200, and a second external electrode 300.

[0050] First, to clearly explain this embodiment, the directions are defined as follows: the T-axis, L-axis, and W-axis shown in the drawing represent the first, second, and third directions of the multilayer ceramic capacitor 1000, respectively.

[0051] The first direction T may be perpendicular to the broad surface (main surface) of the sheet-shaped component. For example, the first direction T can be used as the same concept as the direction in which the dielectric layer 140 is stacked. Hereafter, the first direction will be referred to as the "thickness direction" as needed.

[0052] The second direction L is a direction parallel to the broad surface (main surface) of the sheet-shaped component and may intersect (or be perpendicular to) the thickness direction T. For example, the second direction L may be the direction in which the first external electrode 200 and the second external electrode 300 face each other. Hereafter, the second direction will be referred to as the "length direction" as necessary.

[0053] The third direction W is a direction parallel to the broad surface (main surface) of the sheet-shaped component, and may intersect (or be perpendicular to) the first direction T and the second direction L simultaneously. Hereafter, the third direction will be referred to as the "width direction" as necessary.

[0054] The body 110 may be substantially hexahedral in shape, but this embodiment is not limited to this. Due to shrinkage during sintering, the body 110 may not be a perfect hexahedron, but may have a substantially hexahedral shape. For example, the body 110 may be roughly a right hexahedron, but the corners and vertices may have a rounded shape.

[0055] In this embodiment, for the sake of explanation, the surfaces of the body 110 that face each other in the thickness direction T are defined as the first surface S1 and the second surface S2, the surfaces of the body 110 that face each other in the length direction L and connect the first surface S1 and the second surface S2 are defined as the third surface S3 and the fourth surface S4, and the surfaces of the body 110 that face each other in the width direction W and connect the first surface S1 and the second surface S2 are defined as the fifth surface S5 and the sixth surface S6.

[0056] Therefore, the first direction, which is the direction in which the first surface S1 and the second surface S2 face each other, may be the thickness direction T, and the second and third directions, which are perpendicular to the first direction and perpendicular to each other, may be the length direction L and the width direction W or the width direction W and the length direction L, respectively.

[0057] The length of body 110 may represent the maximum length of a plurality of line segments parallel to the length direction L, obtained by connecting the two outermost boundary lines opposite to the length direction L of body 110 as shown in the aforementioned cross-sectional photograph of body 110 in the length direction L-thickness direction T at the center of the width direction W of body 110, based on an optical microscope or scanning electron microscope (SEM) photograph. On the other hand, the length of body 110 may represent the minimum length of a plurality of line segments parallel to the length direction L, obtained by connecting the two outermost boundary lines opposite to the length direction L of body 110 as shown in the aforementioned cross-sectional photograph. On the other hand, the length of body 110 may represent the arithmetic mean of the lengths of at least two line segments parallel to the length direction L, obtained by connecting the two outermost boundary lines opposite to the length direction L of body 110 as shown in the aforementioned cross-sectional photograph.

[0058] The thickness of body 110 may represent the maximum length of a plurality of line segments parallel to the thickness direction T, obtained by connecting the two outermost boundary lines of body 110 facing the thickness direction T as shown in the aforementioned cross-sectional photograph of body 110 at the center of the width direction W of body 110, using an optical microscope or scanning electron microscope (SEM) image as a reference. On the other hand, the thickness of body 110 may represent the minimum length of a plurality of line segments parallel to the thickness direction T, obtained by connecting the two outermost boundary lines of body 110 facing the thickness direction T as shown in the aforementioned cross-sectional photograph. On the other hand, the thickness of body 110 may represent the arithmetic mean of the lengths of at least two line segments parallel to the thickness direction T, obtained by connecting the two outermost boundary lines of body 110 facing the thickness direction T as shown in the aforementioned cross-sectional photograph.

[0059] The width of body 110 may represent the maximum length of a plurality of line segments parallel to the width direction W, obtained by connecting the two outermost boundary lines of body 110 facing the width direction W as shown in the aforementioned cross-sectional photograph of body 110 at the center of the thickness direction T of body 110, based on an optical microscope or scanning electron microscope (SEM) photograph of the cross-section (L-W) in the length direction at the center of body 110. On the other hand, the width of body 110 may represent the minimum length of a plurality of line segments parallel to the width direction W, obtained by connecting the two outermost boundary lines of body 110 facing the width direction W as shown in the aforementioned cross-sectional photograph. On the other hand, the width of body 110 may represent the arithmetic mean of the lengths of at least two line segments parallel to the width direction W, obtained by connecting the two outermost boundary lines of body 110 facing the width direction W as shown in the aforementioned cross-sectional photograph.

[0060] Figure 2 is a cross-sectional view taken along the line II-II' in Figure 1, and Figure 3 is a separated perspective view showing the layered structure of the internal electrodes in the multilayer ceramic capacitor of Figure 1.

[0061] Referring to FIGS. 2 and 3, the body 110 can include a plurality of dielectric layers 140, a first internal electrode 150, and a second internal electrode 160.

[0062] The plurality of dielectric layers 140 are laminated in the thickness direction T of the body 110. The boundary between the dielectric layers 140 may be unclear. For example, the boundary between the dielectric layers 140 is difficult to confirm without using a scanning electron microscope (SEM), and the plurality of dielectric layers 140 may appear as an integral structure.

[0063] The dielectric layer 140 can include a ceramic material. For example, the ceramic material can include a dielectric ceramic containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3. Further, these components can further include auxiliary components such as manganese (Mn) compounds, iron (Fe) compounds, chromium (Cr) compounds, cobalt (Co) compounds, nickel (Ni) compounds, etc. For example, the dielectric layer is (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc., but the present invention is not limited thereto.

[0064] The dielectric layer 140 can further include any one or more of a ceramic additive, an organic solvent, a plasticizer, a binder, and a dispersant. The ceramic additive may be, for example, a transition metal oxide or carbide, a rare earth element, magnesium (Mg), aluminum (Al), or the like.

[0065] The first internal electrode 150 and the second internal electrode 160 may be stacked alternately with a dielectric layer 140 in between. Such a stacked structure may be repeated within the body 110, and the internal electrode closest to the first surface S1 of the body 110 may be either the first internal electrode 150 or the second internal electrode 160, and the internal electrode closest to the second surface S2 may be either the first internal electrode 150 or the second internal electrode 160.

[0066] The first internal electrode 150 and the second internal electrode 160 have different polarities, but they can be electrically insulated from each other by the dielectric layer 140 placed between them.

[0067] The first internal electrode 150 and the second internal electrode 160 may be arranged so as to be offset from each other in the longitudinal direction L across the dielectric layer 140. One end of the first internal electrode 150 can be exposed through the third surface S3 of the body 110, and one end of the second internal electrode 160 can be exposed through the fourth surface S4 of the body 110. The end of the first internal electrode 150 exposed from the third surface S3 of the body 110 may be connected to the first external electrode 200. The end of the second internal electrode 160 exposed from the fourth surface S4 of the body 110 may be connected to the second external electrode 300.

[0068] The first internal electrode 150 and the second internal electrode 160 may be formed by printing a conductive paste containing metal onto the surface of the dielectric layer 140. For example, the internal electrodes can be formed by printing a conductive paste containing nickel (Ni) or a nickel (Ni) alloy onto the surface of the dielectric layer using screen printing or gravure printing. However, this embodiment is not limited to this.

[0069] When a voltage is applied to the first external electrode 200 and the second external electrode 300, charge accumulates between the first internal electrode 150 and the second internal electrode 160. In other words, capacitance can be obtained between the first internal electrode 150, which is electrically connected to the first external electrode 200, and the second internal electrode 160, which is electrically connected to the second external electrode 300. The capacitance of the multilayer ceramic capacitor 1000 is proportional to the overlapping area of ​​the first internal electrode 150 and the second internal electrode 160, which overlap each other along the thickness direction T.

[0070] A first cover layer 143 and a second cover layer 145 may be placed on the outermost part of the body 110 in the thickness direction T.

[0071] The first cover layer 143 is positioned between the first surface S1 of the body 110 and the internal electrode closest to it. The second cover layer 145 is positioned between the second surface S2 of the body 110 and the internal electrode closest to it.

[0072] In other words, the first cover layer 143 may be placed on top of the uppermost internal electrode within the body 110, and the second cover layer 145 may be placed on top of the lowermost internal electrode. The first cover layer 143 and the second cover layer 145 may have the same composition as the dielectric layer 140. The first cover layer 143 and the second cover layer 145 can be formed by laminating one or more dielectric layers on the outer surface of the uppermost internal electrode and the outer surface of the lowermost internal electrode, respectively. On the other hand, the first cover layer 143 and the second cover layer 145 may have a different composition from the dielectric layer 140.

[0073] The first cover layer 143 and the second cover layer 145 can serve to prevent damage to the first internal electrode 150 and the second internal electrode 160 due to physical or chemical stress.

[0074] The first external electrode 200 and the second external electrode 300 are positioned outside the body 110.

[0075] The first external electrode 200 is positioned on the third surface S3 of the body 110 and can extend to the first surface S1, the second surface S2, the fifth surface S5, and the sixth surface S6. The second external electrode 300 is positioned on the fourth surface S4 of the body 110 and can extend to the first surface S1, the second surface S2, the fifth surface S5, and the sixth surface S6.

[0076] The first external electrode 200 includes a first electrode layer 210, a first plating layer 230, and a first conductive intervening portion 250.

[0077] The first electrode layer 210 covers the third surface S3 of the body 110 and is connected to and electrically coupled with the exposed ends of the multiple first internal electrodes 150. The first electrode layer 210 can extend from the third surface S3 of the body 110 and cover at least one portion of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0078] The first electrode layer 210 may include metal and glass.

[0079] The metal contained in the first electrode layer 210 may be nickel (Ni), copper (Cu), palladium (Pd), gold (Au), or an alloy thereof, but this embodiment is not limited thereto.

[0080] The glass included in the first electrode layer 210 may be SiO2-based or B2O3-based glass, and may contain both SiO2 and B2O3, but this embodiment is not limited thereto.

[0081] The first electrode layer 210 may be a baked electrode formed by applying a conductive paste containing metal and glass to the third surface S3 of the body 110 and then firing it. The glass contained in the conductive paste may be in the form of glass frit.

[0082] The first plating layer 230 is placed on the first electrode layer 210.

[0083] The first plating layer 230 may include a first layer 231 and a second layer 233. The first layer 231 may be placed on the first electrode layer 210, and the second layer 233 may be placed on the first layer 231.

[0084] The first layer 231 may contain nickel (Ni), and the second layer 233 may contain tin (Sn), but this embodiment is not limited thereto.

[0085] Figure 4 is an enlarged view of area A in Figure 2.

[0086] Referring to Figures 2 and 4, the first conductive intervening portion 250 may be positioned at the interface between the first electrode layer 210 and the first plating layer 230.

[0087] The first conductive intervening portion 250 may be discontinuously arranged at the interface between the first electrode layer 210 and the first plating layer 230. For example, the first conductive intervening portion 250 may be arranged in a plurality of island shapes.

[0088] The first conductive intervening portion 250 may include a first conductive connecting portion 260 and a first resin 270.

[0089] The first resin 270 may be any known thermosetting resin, such as epoxy resin, phenolic resin, urethane resin, silicone resin, or polyimide resin.

[0090] On the other hand, the first resin 270 may contain a metal as a filler. For example, the filler may include copper (Cu), silver (Ag), nickel (Ni), tin (Sn), or alloys thereof.

[0091] The first conductive connecting portion 260 may include a plurality of metal particles (or metal layers) 261 and an intermetallic compound (IMC) 263.

[0092] The multiple metal particles (or metal layers) 261 may include, but are not limited to, copper (Cu), silver (Ag), nickel (Ni), tin (Sn), or alloys thereof. For example, the metal particles or metal layers of the first conductive connecting portion 260 may include metals different from those contained in the first electrode layer 210.

[0093] The intermetallic compound 263 refers to a compound in which two or more metals are bonded in a simple integer ratio. The intermetallic compound may be formed by the interaction of at least one of the high-melting-point metals contained in the conductive resin composition forming the first conductive intervening portion 250—copper (Cu), silver (Ag), silver (Ag)-coated copper (Cu), tin (Sn)-coated copper (Cu), and nickel (Ni)—with a low-melting-point metal—tin (Sn), tin (Sn) alloy, bismuth (Bi), or bismuth (Bi) alloy. The intermetallic compound thus formed may include at least one of Cu6Sn5, Cu3Sn, Ni3Sn, and Ag3Sn. Although bismuth (Bi) does not directly form the intermetallic compound, it can play a role in further lowering the melting point of tin (Sn) during the formation process of the intermetallic compound. In other words, the melting point of tin (Sn) may decrease as the bismuth (Bi) content increases. On the other hand, after the intermetallic compound is formed, the remaining low-melting-point metal and the intermetallic compound may be included in the first conductive connecting portion 260. In other words, the first conductive connecting portion 260 may include a low-melting-point metal having a melting point lower than the curing temperature of the first resin 270. For example, the low-melting-point metal may have a melting point of 300°C or less, and more specifically, a melting point of 200°C to 250°C.

[0094] On the other hand, in other embodiments, the first conductive intervening portion 250 may consist of metal particles or a metal layer. In this case, the first conductive intervening portion 250 does not contain the first resin.

[0095] Figure 5 is another enlarged view of area A in Figure 2.

[0096] Referring to Figure 5, the first conductive intervening portion 250' may further include a first interface layer 280 and a second interface layer 290 in addition to the first conductive connecting portion 260 and the first resin 270.

[0097] The first interface layer 280 may be disposed at the interface between the first conductive connecting portion 260 and the first plating layer 230. The first interface layer 280 may contain a first intermetallic compound formed by the interaction of the metal contained in the first conductive connecting portion 260 and the metal contained in the first plating layer 230.

[0098] The first interface layer 280 may contain copper (Cu) and tin (Sn), for example Cu6Sn5 and / or Cu3Sn. The first interface layer 280 may also contain silver (Ag) and tin (Sn), for example Ag3Sn. Furthermore, the first interface layer 280 may contain nickel (Ni) and tin (Sn), for example Ni3Sn.

[0099] The second interface layer 290 may be disposed at the interface between the first conductive connecting portion 260 and the first electrode layer 210. The second interface layer 290 may include a second intermetallic compound formed by the interaction of the metal contained in the first conductive connecting portion 260 and the metal contained in the first electrode layer 210.

[0100] The second interface layer 290 may contain copper (Cu) and tin (Sn), for example Cu6Sn and / or Cu3Sn. The second interface layer 290 may also contain gold (Au) and tin (Sn), for example AuSn4, AuSn2, or AuSn. Furthermore, the second interface layer 290 may contain lead (Pb) and bismuth (Bi), for example Pb7Bi3.

[0101] Figure 6 is another enlarged view of area A in Figure 2.

[0102] Referring to Figure 6, the first conductive intervening portion 250 may include an inner portion 251 and an outer portion 253.

[0103] The inner portion 251 and the outer portion 253 may be separated based on a hypothetical straight line C connecting a first point P1 and a second point P2 where the first electrode layer 210, the first plating layer 230, and the first conductive intervening portion 250 are in contact with each other.

[0104] The inner portion 251 is a region that includes the part in contact with the first electrode layer 210 with respect to the straight line C. In other words, the inner portion 251 may be a region enclosed by the interface 252 between the first conductive intervening portion 250 and the first electrode layer 210 and the straight line C.

[0105] The outer portion 253 is a region that includes the part in contact with the first plating layer 230 of the first conductive intervening portion 250 with respect to the straight line C. In other words, the outer portion 253 may be a region enclosed by the interface 254 between the first conductive intervening portion 250 and the first plating layer 230 and the straight line C.

[0106] The area of ​​the inner portion 251 may be larger than the area of ​​the outer portion 253.

[0107] Here, the area of ​​the inner portion 251 and the area of ​​the outer portion 253 can be measured based on an optical microscope or scanning electron microscope (SEM) image of the cross section in the length direction L-thickness direction T at the center of the width direction W of the multilayer ceramic capacitor 1000. The area of ​​the inner portion 251 and the area of ​​the outer portion 253 can be obtained by measuring the aforementioned cross section image with a scanning electron microscope-energy dispersive X-ray spectroscopy (hereinafter referred to as "SEM-EDX").

[0108] Furthermore, using publicly available image analysis software, the area of ​​the inner portion 251 and the area of ​​the outer portion 253 shown in the aforementioned cross-sectional photograph can be accurately measured.

[0109] On the other hand, the first maximum distance between the straight line C and the edge of the inner portion 251 may be greater than the second maximum distance between the straight line C and the edge of the outer portion 253.

[0110] Here, the first maximum distance and the second maximum distance can be measured based on an optical microscope or scanning electron microscope (SEM) image of the cross section of the multilayer ceramic capacitor 1000 in the length direction L-thickness direction T at the center of the width direction W. The first maximum distance can be taken as the maximum length of a plurality of line segments that are perpendicular to the straight line C connecting the first point P1 and the second point P2 where the first conductive intervening, the first electrode layer, and the first plating layer touch each other, as shown in the aforementioned cross-sectional image, and that pass through the interface 252 between the first conductive intervening and the first electrode layer. The second maximum distance can be taken as the maximum length of a plurality of line segments that are perpendicular to the straight line C connecting the first point P1 and the second point P2 where the first conductive intervening, the first electrode layer, and the first plating layer touch each other, as shown in the aforementioned cross-sectional image, and that pass through the interface 254 between the first conductive intervening and the first plating layer.

[0111] As described above, the area of ​​the inner portion 251 may be larger than the area of ​​the outer portion 253, and the first maximum distance between the straight line C and the edge of the inner portion 251 may be larger than the second maximum distance between the straight line C and the edge of the outer portion 253. In other words, with respect to the straight line C, the first conductive intervening portion 250 can have a shape that protrudes toward the first plating layer 230 and the first electrode layer 210, respectively, but it can also have a shape that protrudes even further toward the first electrode layer 210.

[0112] Figures 7, 8, 9, and 10 are schematic diagrams illustrating the process of forming the conductive intervening portion and the plating layer of a multilayer ceramic capacitor according to an embodiment.

[0113] Referring to Figure 7, a recess 212 exists on the surface of the first electrode layer 210. Therefore, the surface of the first electrode layer 210 contains irregularities.

[0114] The first electrode layer 210 may be a baked electrode formed by applying a conductive paste containing metal and glass to the third surface S3 of the body 110 and then firing it. In this case, during the firing process, a recess 212 may be formed in the first electrode layer 210, and the glass G inside the first electrode layer 210 may dissolve to the surface.

[0115] Since glass G is not conductive, if a metal is plated onto the surface of the first electrode layer 210 in this state, the plating layer may not form in the recesses 212, resulting in insufficient plating and the possibility of plating cracking.

[0116] Referring to Figure 8, the conductive resin composition 214 is applied to the surface of the first electrode layer 210. The conductive resin composition 214 may contain a plurality of metal particles 216 and resin 218. The conductive resin composition 214 can cover the surface of the first electrode layer 210 and fill the recesses 212. Since the conductive resin composition 214 fills the recesses 212, the surface irregularities of the first electrode layer 210 can be reduced. In other words, the flatness of the surface of the first electrode layer 210 can be increased.

[0117] Referring to Figure 9, the conductive resin composition 214 is removed from the surface of the first electrode layer 210, leaving the conductive resin composition 214 filling the recess 212. Subsequently, the conductive resin composition 214 undergoes a drying or curing process to form the first conductive intervening portion 250 (see Figure 9).

[0118] Referring to Figure 10, a first plating layer 230 is formed. The first plating layer 230 simultaneously covers the surface of the first electrode layer 210 and the first conductive intervening portion 250 in the recess 212. Since the recess 212 is filled by the first conductive intervening portion 250, the first plating layer 230 can be formed more easily than when the glass is exposed. Also, since the first conductive intervening portion 250 fills the recess 212, the surface irregularities of the first electrode layer 210 are reduced, and the flatness can be improved. Therefore, plating cracks in the first plating layer 230 can be reduced.

[0119] On the other hand, the ratio of the length of the first conductive intervening portion 250 to the length of the interface between the first electrode layer 210 and the first plating layer 230 (hereinafter referred to as the "length ratio") may be greater than 0% and 84.86% or less.

[0120] If the length ratio of the first conductive intervening portion 250 exceeds 84.86%, plating cracks may occur.

[0121] The method for measuring the length ratio of the first conductive intervening portion will be described below with reference to Figures 10, 11, 12, 13, and 14.

[0122] Figure 11 is an image of a scanning electron microscope (SEM) taken of a cross-section of the central part in the thickness direction T of the external electrode of the multilayer ceramic capacitor according to the embodiment, and Figure 12 is an image of Figure 11 with the measurement area E shown. Figure 13 is an image of the measurement area E with the area where the conductive intervening part is formed colored, and Figure 14 is an image of the measurement area E processed in black and white. Figure 15 is a schematic diagram for explaining the method of measuring the length ratio of the first conductive intervening part in the measurement area E.

[0123] The length ratio of the first conductive intervening portion is measured based on a scanning electron microscope (SEM) image (see Figure 11) of the cross section (length direction L - thickness direction T) at the center of the width direction W of the multilayer ceramic capacitor 1000. The length ratio of the first conductive intervening portion can be derived by measuring the size of the metal particles or the length of the resin layer present between the first electrode layer and the first plating layer at the center of the thickness direction T of the first external electrode shown in the aforementioned cross-sectional image. Referring to Figures 12 and 13, the Image J program is used to extract a measurement region E where the length in the thickness direction T is 250 μm and the length in the length direction L is 20 μm, based on the center point in the thickness direction T and length direction L of the first external electrode in the aforementioned cross-sectional image. The measurement region E is selected so that the entire first conductive intervening portion formed at the interface between the first electrode layer and the first plating layer is shown. Referring to Figure 14, the Image J program is used to process the measurement region E in black and white. In other words, the first electrode layer and the first plating layer are shown in white, and the metal particles (or resin layer) between the first electrode layer and the first plating layer are shown in black. Referring to Figure 15, the area shown in black is projected perpendicular to the length of the measurement area E (in the direction of the arrow). Thereafter, the sum of the lengths of the projected portions divided by the total length of the measurement area E is taken as the length ratio of the first conductive intervening portion.

[0124] On the other hand, plating cracks are determined by peeling off the second layer of the first plating layer from the widthwise W-thickness T surface of the first external electrode of the multilayer ceramic capacitor and judging based on scanning electron microscope (SEM) images of the surface. If the maximum length of the exposed portion of the first electrode layer on the surface of the first external electrode shown in the aforementioned image is 30 μm or more, it is determined that "plating cracks" have occurred. Alternatively, after removing the second layer of the first plating layer (e.g., the tin (Sn) plating layer) through destructive physical analysis (DPA) of the multilayer ceramic capacitor to expose the first layer (e.g., the nickel (Ni) plating layer), it is determined that "plating cracks" have occurred if the maximum length of the exposed portion of the first electrode layer is 30 μm or more, or if the maximum thickness of the first layer in that portion is 30 μm or more.

[0125] The second external electrode 300 includes a second electrode layer 310, a second plating layer 330, and a second conductive intervening portion 350.

[0126] The second electrode layer 310 covers the fourth surface S4 of the body 110 and is connected to and electrically coupled with the exposed ends of the multiple second internal electrodes 160. The second electrode layer 310 can extend from the fourth surface S4 of the body 110 and cover at least one portion of the first surface S1, the second surface S2, the fifth surface S5, and the sixth surface S6.

[0127] The second electrode layer 310 can be formed by dipping and blotting the fourth surface S4 of the body 110 into a conductive paste containing a metal (for example, copper (Cu) or nickel (Ni)) and glass.

[0128] The second plating layer 330 is placed on the second electrode layer 310.

[0129] The second plating layer 330 may include a third layer 331 and a fourth layer 333. The third layer 331 may be placed on the second electrode layer 310, and the fourth layer 333 may be placed on the third layer 331. The third layer 331 may contain nickel (Ni), and the fourth layer 333 may contain tin (Sn), but this embodiment is not limited thereto.

[0130] The second conductive intervening portion 350 has the same structure and function as, or a corresponding structure and function to, the first conductive intervening portion 250, except for its position, so a description thereof will be omitted.

[0131] Figure 16 is a schematic perspective view of a multilayer ceramic capacitor according to another embodiment, Figure 17 is a cross-sectional view taken along line II-II' in Figure 16, and Figure 18 is a cross-sectional view taken along line III-III' in Figure 16. Figure 19 is a schematic diagram showing the first external electrode of the multilayer ceramic capacitor of Figure 16, and Figure 20 is a schematic diagram showing the second external electrode of the multilayer ceramic capacitor of Figure 16. For convenience of explanation, Figure 19 shows the first external electrode with a portion of the first plating layer removed, and Figure 20 shows the second external electrode with a portion of the second plating layer removed.

[0132] Referring to Figures 16, 17, 18, 19, and 20, the multilayer ceramic capacitor 2000 includes a body 110, a first external electrode 1200, a second external electrode 1300, a plurality of first internal electrodes 150, and a plurality of second internal electrodes 160.

[0133] The first external electrode 1200 may include a first electrode layer 1210, a first conductive resin layer 1220, a second conductive resin layer 1230, a third conductive resin layer 1240, a fourth conductive resin layer 1250, a first plating layer 230, and a first conductive intervening portion 250.

[0134] The first electrode layer 1210 contains a metal. The first electrode layer 1210 may include one or more of the following: silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), copper (Cu), and alloys thereof.

[0135] The first electrode layer 1210 may include a first connection portion 1211, a first band portion 1212, a second band portion 1213, a third band portion 1214, a fourth band portion 1215, a first corner portion 1216, a second corner portion 1217, a third corner portion 1218, and a fourth corner portion 1219.

[0136] The first connection portion 1211 covers the third surface S3 of the body 110 and is connected to the exposed ends of the multiple first internal electrodes 150, thereby being electrically coupled.

[0137] The first band portion 1212 extends from the first connecting portion 1211 and covers a portion of the first surface S1 of the body 110, and the second band portion 1213 extends from the first connecting portion 1211 and covers a portion of the second surface S2 of the body 110.

[0138] The third band portion 1214 extends from the first connecting portion 1211 and covers a part of the fifth surface S5 of the body 110, and the fourth band portion 1215 extends from the first connecting portion 1211 and covers a part of the sixth surface S6 of the body 110.

[0139] The first conductive resin layer 1220 covers the first band portion 1212 and exposes the first connection portion 1211. In other words, the first conductive resin layer 1220 may be positioned on the first band portion 1212 and not on the first connection portion 1211, or it may be positioned only partially on the first connection portion 1211. For example, the first conductive resin layer 1220 can extend from the first band portion 1212 to the first connection portion 1211 and cover a portion of the first connection portion 1211.

[0140] For example, the first conductive resin layer 1220 can cover a part or all of the first band portion 1212. Alternatively, the first conductive resin layer 1220 can cover a part of the first surface S1 of the body 110.

[0141] The second conductive resin layer 1230 covers the second band portion 1213 and exposes the first connection portion 1211. In other words, the second conductive resin layer 1230 may be positioned on the second band portion 1213 and not on the first connection portion 1211, or it may be positioned only partially on the first connection portion 1211. For example, the second conductive resin layer 1230 can extend from the second band portion 1213 to the first connection portion 1211 and cover a portion of the first connection portion 1211.

[0142] For example, the second conductive resin layer 1230 can cover a part or all of the second band portion 1213. Alternatively, the second conductive resin layer 1230 can cover a part of the second surface S2 of the body 110.

[0143] The third conductive resin layer 1240 covers the third band portion 1214 and exposes the first connection portion 1211. In other words, the third conductive resin layer 1240 may be positioned on the third band portion 1214 and not on the first connection portion 1211, or it may be positioned only partially on the first connection portion 1211. For example, the third conductive resin layer 1240 can extend from the third band portion 1214 to the first connection portion 1211 and cover a portion of the first connection portion 1211.

[0144] For example, the third conductive resin layer 1240 can cover part or all of the third band portion 1214. Alternatively, the third conductive resin layer 1240 can cover part of the fifth surface S5 of the body 110.

[0145] The fourth conductive resin layer 1250 covers the fourth band portion 1215 and exposes the first connection portion 1211. In other words, the fourth conductive resin layer 1250 may be positioned on the fourth band portion 1215 and not on the first connection portion 1211, or it may be positioned partially on the first connection portion 1211. For example, the fourth conductive resin layer 1250 can extend from the fourth band portion 1215 to the first connection portion 1211 and cover a portion of the first connection portion 1211.

[0146] For example, the fourth conductive resin layer 1250 can cover a part or all of the fourth band portion 1215. Alternatively, the fourth conductive resin layer 1250 can cover a part of the sixth surface S6 of the body 110.

[0147] The first conductive resin layer 1220 may include a metal and a resin.

[0148] The metal contained in the first conductive resin layer 1220 may include, for example, copper (Cu), silver (Ag), nickel (Ni), tin (Sn), or alloys thereof.

[0149] The resin contained in the first conductive resin layer 1220 may be a variety of known thermosetting resins, such as epoxy resin, phenolic resin, urethane resin, silicone resin, or polyimide resin.

[0150] After the first electrode layer 1210 is formed, a conductive resin composition containing metal powder and a thermosetting resin can be applied onto the first electrode layer 1210. Here, the thermosetting resin may be, but is not limited to, a resin with a small molecular weight and liquid at room temperature, such as bisphenol A resin, glycol epoxy resin, novolac epoxy resin, or derivatives thereof. For example, the conductive resin composition can be produced by mixing silver (Ag) powder, copper (Cu) powder, silver (Ag) coated copper (Cu) powder, tin (Sn)-based solder powder, and a thermosetting resin, and then dispersing them using a 3-roll mill. The tin (Sn)-based solder powder is tin (Sn), Sn 96.5 Ag 3.0 Cu 0.5 Sn 42 Bi 58 and Sn 72 Bi 28 The present disclosure may include, but is not limited to, at least one of the above. Subsequently, after removing the conductive resin composition on the first connection portion 1211, the first conductive resin layer 1220 can be formed on the first band portion 1212 by curing heat treatment. Therefore, the first connection portion 1211 may be arranged on the third surface S3 of the body 110, and the first band portion 1212 and the first conductive resin layer 1220 may be arranged on the first surface S1, the second surface S2, the fifth surface S5, and the sixth surface S6.

[0151] Unlike this embodiment, if the electrode layer and the resin layer covering it are both arranged on the third surface S3 of the body 110, the resin layer has lower electrical connectivity than the electrode layer, which may lead to an increase in the equivalent series resistance (ESR) of the first external electrode. There is also a risk of floating occurring due to gas outflow from the resin layer during the high-temperature reflow process. Furthermore, because the resin layer is present on the electrode layer, the thickness of the external electrode is greater and the relative volume of the ceramic body is smaller compared to when only the electrode layer is present, which leads to a decrease in the effective capacitance of the multilayer ceramic capacitor.

[0152] In contrast, according to this embodiment, the first connecting portion 1211 is arranged on the third surface S3 of the body 110, and the first conductive resin layer 1220 is not arranged on the third surface S3, so the aforementioned problem may not occur.

[0153] The second conductive resin layer 1230, the third conductive resin layer 1240, and the fourth conductive resin layer 1250 contain the same or similar components as those of the first conductive resin layer 1220 described above, so a repeated explanation regarding them will be omitted.

[0154] The first corner section 1216 is the part where the first connecting section 1211, the first band section 1212, and the fourth band section 1215 are connected to each other. In other words, the first corner section 1216 is the part located at the corner where the first surface S1, the third surface S3, and the sixth surface S6 of the body 110 are connected to each other.

[0155] The second corner section 1217 is the part where the first connecting section 1211, the second band section 1213, and the fourth band section 1215 are connected to each other. In other words, the second corner section 1217 is the part located at the corner where the second surface S2, the third surface S3, and the sixth surface S6 of the body 110 are connected to each other.

[0156] The third corner section 1218 is the part where the first connecting section 1211, the second band section 1213, and the third band section 1214 are connected to each other. In other words, the third corner section 1218 is the part located at the corner where the second surface S2, the third surface S3, and the fifth surface S5 of the body 110 are connected to each other.

[0157] The fourth corner section 1219 is the part where the first connecting section 1211, the first band section 1212, and the third band section 1214 are connected to each other. In other words, the fourth corner section 1219 is the part located at the corner where the first surface S1, the third surface S3, and the fifth surface S5 of the body 110 are connected to each other.

[0158] Figure 21 is a schematic diagram showing the first external electrode of the multilayer ceramic capacitor shown in Figure 16. For ease of explanation, the first plating layer of the first external electrode is partially omitted.

[0159] Referring to Figure 21, when the surface of the first connection portion 1211 viewed from the length direction L is divided into three equal parts in the width direction W and the thickness direction T, and then divided equally into nine regions, each region can be defined as the left side region 1 in the width direction W at the top of the thickness direction T, the middle region 2 in the width direction at the top of the thickness direction T, the right side region 3 in the width direction W at the top of the thickness direction T, the left side region 4 in the width direction W at the middle of the thickness direction T, the middle region 5 in the width direction W at the middle of the thickness direction T, the right side region 6 in the width direction W at the middle of the thickness direction T, the left side region 7 in the width direction W at the bottom of the thickness direction T, the middle region 8 in the width direction W at the bottom of the thickness direction T, and the right side region 9 in the width direction W at the bottom of the thickness direction T.

[0160] Figure 22 is a schematic diagram showing the first external electrode of a multilayer ceramic capacitor according to another embodiment, and Figure 23 is a schematic diagram showing the first external electrode of a multilayer ceramic capacitor according to another embodiment.

[0161] Referring to Figures 22 and 23, the first conductive resin layer 1220 and the third conductive resin layer 1240 can cover at least a portion of the left side region 1 in the width direction W above the thickness direction T, extending from the first band portion 1212 and the third band portion 1214. For example, the first conductive resin layer 1220 and the third conductive resin layer 1240 can cover at least a portion of the fourth corner portion 1219.

[0162] Furthermore, the first conductive resin layer 1220 and the fourth conductive resin layer 1250 can cover at least a portion of the right-side region 3 in the width direction W above the thickness direction T, extending from the first band portion 1212 and the fourth band portion 1215. For example, the first conductive resin layer 1220 and the fourth conductive resin layer 1250 can cover at least a portion of the first corner portion 1216.

[0163] Furthermore, the second conductive resin layer 1230 and the third conductive resin layer 1240 can cover at least a portion of the left side region 7 in the width direction W below the thickness direction T, extending from the second band portion 1213 and the third band portion 1214. For example, the second conductive resin layer 1230 and the third conductive resin layer 1240 can cover at least a portion of the third corner portion 1218.

[0164] Furthermore, the second conductive resin layer 1230 and the fourth conductive resin layer 1250 can cover at least a portion of the right-side region 9 in the width direction W below the thickness direction T, extending from the second band portion 1213 and the fourth band portion 1215. For example, the second conductive resin layer 1230 and the fourth conductive resin layer 1250 can cover at least a portion of the second corner portion 1217.

[0165] When the corners 1216, 1217, 1218, and 1219 of the first electrode layer 1210 are covered with conductive resin layers 2220, 2230, 2240, and 2250 in this manner, the capacitor becomes more resistant to external impacts that may be applied in subsequent processes. This prevents plating cracks on the first, second, third, and fourth corners 1216, 1217, 1218, and 1219, thereby improving the reliability of the multilayer ceramic capacitor.

[0166] Figure 24 is a schematic diagram showing the first external electrode of a multilayer ceramic capacitor according to another embodiment.

[0167] Referring to Figure 24, the first conductive resin layer 1220, the second conductive resin layer 1230, the third conductive resin layer 1240, and the fourth conductive resin layer 1250 can each cover at least a portion of the remaining regions 1, 2, 3, 4, 6, 7, 8, and 9, excluding the intermediate region 5 in the width direction W of the intermediate portion in the thickness direction T, extending from the first band portion 1212, the second band portion 1213, the third band portion 1214, and the fourth band portion 1215. For example, the corners where the first connecting portion 1211 and the band portions 2212, 2213, 2214, and 2215 are connected may be covered by the conductive resin layers 2220, 2230, 2240, and 2250. In this case, the material becomes more resistant to external impacts that may be applied in subsequent processes. This prevents plating cracks on the corners where the first connection part 1211 and the band parts 2212, 2213, 2214, and 2215 are connected, thereby improving the reliability of the multilayer ceramic capacitor.

[0168] Figure 25 is a schematic diagram showing the first external electrode of a multilayer ceramic capacitor according to another embodiment.

[0169] Referring to Figure 25, the residual conductive resin layer 1260 may be arranged in a multiple island shape on the surface of the first connection portion 1211. If the conductive resin composition on the first connection portion 1211 is not completely removed during the conductive resin layer formation process described above, the residual conductive resin layer 1260 may be present.

[0170] In particular, if a portion of the residual conductive resin layer 1260 fills the recess 212 of the first connection portion 1211 (see Figure 7), a conductive intervening portion 250 can be formed. In other words, the residual conductive resin layer 1260 and the conductive intervening portion 250 can coexist on the first connection portion 1211. In this case, the conductive intervening portion 250 may contain the same components as the first conductive resin layer 1220, the second conductive resin layer 1230, the third conductive resin layer 1240, and the fourth conductive resin layer 1250.

[0171] In other embodiments, if all residual conductive resin layers 1260 fill the recess of the first connection portion 1211, then the residual conductive resin layers 1260 may not exist on the first connection portion 1211, and only the conductive intervening portion 250 may exist.

[0172] This disclosure is not limited to the embodiments described above; therefore, embodiments combining the embodiments shown in Figures 20, 21, 22, or 23 with the embodiment shown in Figure 24 are also possible.

[0173] The components other than those mentioned above are identical to or correspond to the components of the multilayer ceramic capacitor shown in Figure 1, so repeated explanations regarding them will be omitted.

[0174] The second external electrode 1300 may include a second electrode layer 1310, a fifth conductive resin layer 1320, a sixth conductive resin layer 1330, a seventh conductive resin layer 1340, an eighth conductive resin layer 1350, a second plating layer 330, and a second conductive intervening portion 350.

[0175] The second electrode layer 1310 contains a metal. The second electrode layer 1310 may contain one or more of the following: silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), copper (Cu), and alloys thereof.

[0176] The second electrode layer 1310 includes a second connecting portion 1311, a fifth band portion 1312, a sixth band portion 1313, a seventh band portion 1314, an eighth band portion 1315, a fifth corner portion 1316, a sixth corner portion 1317, a seventh corner portion 1318, and an eighth corner portion 1319.

[0177] The second connection portion 1311 covers the fourth surface S4 of the body 110 and is connected to the exposed ends of the multiple second internal electrodes 160, thereby being electrically coupled.

[0178] The fifth band portion 1312 extends from the second connecting portion 1311 and covers a portion of the first surface S1 of the body 110, and the sixth band portion 1313 extends from the second connecting portion 1311 and covers a portion of the second surface S2 of the body 110.

[0179] The seventh band portion 1314 extends from the second connecting portion 1311 and covers a part of the fifth surface S5 of the body 110, and the eighth band portion 1315 extends from the second connecting portion 1311 and covers a part of the sixth surface S6 of the body 110.

[0180] The fifth conductive resin layer 1320 covers the fifth band portion 1312 and exposes the second connection portion 1311. For example, the fifth conductive resin layer 1320 can cover part or all of the fifth band portion 1312. Alternatively, the fifth conductive resin layer 1320 can cover part of the first surface S1 of the body 110.

[0181] The sixth conductive resin layer 1330 covers the sixth band portion 1313 and exposes the second connection portion 1311. For example, the sixth conductive resin layer 1330 can cover part or all of the sixth band portion 1313. Also, the sixth conductive resin layer 1330 can cover part of the second surface S2 of the body 110.

[0182] The fifth conductive resin layer 1320 may contain metal and resin.

[0183] The metal contained in the fifth conductive resin layer 1320 may include, for example, copper (Cu), silver (Ag), nickel (Ni), tin (Sn), or alloys thereof.

[0184] The resin contained in the fifth conductive resin layer 1320 may be a variety of known thermosetting resins, such as epoxy resin, phenolic resin, urethane resin, silicone resin, or polyimide resin.

[0185] The sixth conductive resin layer 1330, the seventh conductive resin layer 1340, and the eighth conductive resin layer 1350 contain the same or similar components as the fifth conductive resin layer 1320 described above, so a repeated explanation regarding them will be omitted.

[0186] Since the second external electrode 1300 corresponds to the first external electrode 1200 except for its position, repeated explanations regarding the remaining components are omitted.

[0187] The following are specific embodiments of this disclosure. However, the embodiments described below are for illustrative purposes only and should not limit the scope of the invention.

[0188] [Manufacturing example: Manufacturing of multilayer ceramic capacitors] A paste containing barium titanate (BaTiO3) powder is applied to a carrier film, and then dried to produce multiple dielectric green sheets.

[0189] A conductive paste containing nickel (Ni) is applied onto a dielectric green sheet using screen printing to form a conductive paste layer.

[0190] A dielectric green sheet laminate is manufactured by stacking multiple dielectric green sheets so that at least a portion of the conductive paste layer overlaps.

[0191] After cutting the dielectric green sheet laminate into individual chip shapes, the binder is removed by maintaining it at 350°C for 66 hours in an air atmosphere, and then the body is manufactured by firing at 1165°C.

[0192] A paste containing glass frit and copper (Cu) is applied to the outer surface of the body by dipping, dried, and then sintered to form the electrode layer.

[0193] The body is dipped in a conductive resin composition containing epoxy resin, tin (Sn), bismuth (Bi), and copper (Cu).

[0194] After removing the conductive resin composition from the third and fourth surfaces of the body using a porous nonwoven fabric, the material is cured to form a conductive resin layer.

[0195] Subsequently, nickel (Ni) and tin (Sn) plating is performed, followed by heat treatment at 160°C for 1 hour to manufacture a multilayer ceramic capacitor.

[0196] [Experimental example: Presence or absence of plating cracking] The tin (Sn) plating layer was peeled off from the widthwise (W) and thicknesswise (T) surfaces of the external electrode of the sample. After imaging the surface with a scanning electron microscope, it was determined that "plating cracking" had occurred if the maximum length of the exposed portion of the first electrode layer on the external electrode surface was 30 μm or more. For 30 samples per sample number, (NG) was indicated if plating cracking occurred, and (OK) if it did not occur.

[0197] On the other hand, after cutting the external electrode of each sample in the length direction L and the thickness direction T, the central part of the external electrode for each sample was photographed with a scanning electron microscope. Subsequently, using the ImageJ program, a measurement region E was extracted with a thickness direction T of 250 μm and a length direction L of 20 μm, based on the midpoint of the thickness direction T and length direction L of the external electrode in the aforementioned scanning electron microscope image. The measurement region E was processed in black and white using the ImageJ program. The electrode layer and plating layer were shown in white, and the metal particles (or resin layer) present between the electrode layer and the plating layer were shown in black. The area shown in black was projected perpendicular to the length of the measurement region E. Subsequently, the sum of the lengths of the projected parts divided by the total length of the measurement region E was taken as the length ratio of the conductive intervening part.

[0198] The results of the above checks are shown in Table 1.

[0199] [Table 1]

[0200] * indicates a comparative example. Referring to Table 1, it can be seen that in the case of samples 1 to 16, the length ratio of the conductive intervening portion was 84.86% or less, and no plating cracks occurred. In the case of samples 17 to 19, the length ratio of the conductive intervening portion exceeded 84.86%, and plating cracks occurred. When the length ratio of the conductive intervening portion exceeds 84.86%, it is thought that the conductive intervening portion almost completely covers the electrode layer, or protrudes excessively from the electrode layer, which in turn causes plating cracks.

[0201] As described above, embodiments of the present invention have been explained, but the present invention is not limited thereto, and can be implemented in various ways within the scope of the claims, description of the invention, and attached drawings, and these also naturally fall within the scope of the present invention. [Explanation of Symbols]

[0202] 1000: Multilayer ceramic capacitor 110: Body 200: 1st external electrode 210: 1st electrode layer 230: First plating layer 250: First conductive intervening part 300: 2nd external electrode 310: Second electrode layer 330: Second plating layer 350: Second conductive intervening part 140: Dielectric layer 143: First Cover Layer 145: Second Cover Layer 150: 1st internal electrode 160: 2nd internal electrode

Claims

1. A body including a plurality of internal electrodes and a dielectric layer disposed between the plurality of internal electrodes, The body includes an external electrode located outside the body, The external electrode is connected to the internal electrode and comprises an electrode layer including a first metal and glass, A plating layer disposed on the electrode layer, A conductive inclusion is disposed at the interface between the electrode layer and the plating layer, Multilayer ceramic capacitors, including those mentioned above.

2. The multilayer ceramic capacitor according to claim 1, wherein the conductive intervening portion is island-shaped.

3. The multilayer ceramic capacitor according to claim 1, wherein the conductive intervening portion includes metal particles or a metal layer.

4. The multilayer ceramic capacitor according to claim 3, wherein the metal particles or metal layer comprises a second metal.

5. The multilayer ceramic capacitor according to claim 1, wherein the conductive intervening portion includes an intermetallic compound (IMC).

6. The conductive intervening portion comprises a conductive connecting portion including metal particles or a metal layer, It includes a first interface layer disposed at the interface between the conductive connecting portion and the plating layer, The multilayer ceramic capacitor according to claim 1, wherein the first interface layer comprises a first intermetallic compound.

7. The multilayer ceramic capacitor according to claim 6, wherein the first intermetallic compound comprises copper (Cu) and tin (Sn).

8. The first intermetallic compound is Cu ６ Sn ５ and / or Cu ３ A multilayer ceramic capacitor according to claim 7, comprising Sn.

9. The multilayer ceramic capacitor according to claim 6, wherein the first intermetallic compound comprises silver (Ag) and tin (Sn).

10. The first intermetallic compound is Ag ３ A multilayer ceramic capacitor according to claim 9, comprising Sn.

11. The multilayer ceramic capacitor according to claim 6, wherein the first intermetallic compound comprises nickel (Ni) and tin (Sn).

12. The first intermetallic compound, Ni ３ A multilayer ceramic capacitor according to claim 11, comprising Sn.

13. The conductive intervening portion comprises a conductive connecting portion including metal particles or a metal layer, It includes a second interface layer disposed at the interface between the conductive connecting portion and the electrode layer, The multilayer ceramic capacitor according to claim 1, wherein the second interface layer comprises a second intermetallic compound.

14. The multilayer ceramic capacitor according to claim 13, wherein the second intermetallic compound comprises copper (Cu) and tin (Sn).

15. The second intermetallic compound is Cu ６ Sn and / or Cu ３ A multilayer ceramic capacitor according to claim 14, comprising Sn.

16. The multilayer ceramic capacitor according to claim 13, wherein the second intermetallic compound comprises gold (Au) and tin (Sn).

17. The second intermetallic compound is AuSn ４ , AuSn ２ or the multilayer ceramic capacitor according to claim 16, which contains AuSn

18. The multilayer ceramic capacitor according to claim 13, wherein the second intermetallic compound comprises lead (Pb) and bismuth (Bi).

19. The second intermetallic compound is Pb ７ Bi ３ A multilayer ceramic capacitor according to claim 18, including the above.

20. The conductive intervening portion comprises a conductive connecting portion including metal particles or a metal layer, The resin in contact with the conductive connecting portion, A multilayer ceramic capacitor according to claim 1, comprising:

21. The conductive connecting portion is dispersed within the resin, as described in claim 20, for the multilayer ceramic capacitor.

22. The multilayer ceramic capacitor according to claim 1, wherein the length ratio of the conductive intervening portion is greater than 0% and 84.86% or less.

23. The body includes a first surface and a second surface which are opposite to each other in a first direction that intersects with the plurality of internal electrodes, The electrode layer has a connecting portion connected to the internal electrode, The multilayer ceramic capacitor according to claim 1, further comprising a band portion extending from the connection portion and covering a portion of the first surface and a portion of the second surface.

24. The external electrode further includes a conductive resin layer covering at least a portion of the band portion, The multilayer ceramic capacitor according to claim 23, wherein the plating layer covers the conductive resin layer.

25. The electrode layer includes a corner portion where the connecting portion and two band portions adjacent to the connecting portion are connected to each other. The conductive resin layer covers the corner portion, as described in claim 24 of the multilayer ceramic capacitor.

26. The multilayer ceramic capacitor according to claim 25, wherein the external electrode further includes a residual conductive resin layer arranged in an island shape on the connection portion.

27. The multilayer ceramic capacitor according to claim 25, wherein when the surface of the connection portion is equally divided into nine regions, the conductive resin layer covers at least a portion of the connection portion in the region including the corner portion.

28. The multilayer ceramic capacitor according to claim 24, wherein the conductive resin layer extends from the band portion to the connection portion and covers a portion of the connection portion.

29. The multilayer ceramic capacitor according to claim 28, wherein when the surface of the connection portion is equally divided into nine regions, the conductive resin layer covers at least a portion of the connection portion in the remaining regions excluding the central region.

30. A body comprising multiple internal electrodes and multiple dielectric layers stacked in a first direction, The body includes an external electrode located outside the body, The aforementioned external electrode is An electrode layer connected to the internal electrode and having a recess on its surface, A conductive inclusion filling the recess, A plating layer covering the electrode layer and the conductive intervening portion, Multilayer ceramic capacitors, including those mentioned above.

31. In a cross-section along the first direction, The conductive intervening portion is, With respect to a straight line connecting the first point and the second point where the electrode layer, the plating layer, and the conductive intervening portion are in contact, the structure includes an inner portion in contact with the electrode layer and an outer portion in contact with the plating layer. The multilayer ceramic capacitor according to claim 30, wherein the area of ​​the inner portion is larger than the area of ​​the outer portion.

32. In a cross-section along the first direction, The conductive intervening portion is, With respect to a straight line connecting the first point and the second point where the electrode layer, the plating layer, and the conductive intervening portion are in contact, the structure includes an inner portion in contact with the electrode layer and an outer portion in contact with the plating layer. The multilayer ceramic capacitor according to claim 30, wherein the maximum distance between the straight line and the edge of the inner portion is greater than the maximum distance between the straight line and the edge of the outer portion.

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