Light-emitting device and light-emitting module

Abstract

This enables the creation of high-output light-emitting devices with excellent manufacturing stability. [Solution] A light-emitting device comprising: a base having a plurality of light-emitting elements including a first light-emitting element, a plurality of second light-emitting elements, and a plurality of third light-emitting elements; a base having first to fourth wiring sections and a mounting surface provided between two of the first to fourth wiring sections in a plan view; and a plurality of wires electrically connecting the plurality of light-emitting elements to the base, wherein the plurality of light-emitting elements are arranged on the mounting surface such that, in a plan view, the first light-emitting element is located between the plurality of second light-emitting elements and the plurality of third light-emitting elements; the first wiring section is electrically connected to the first light-emitting element on one of the two electrodes; the second wiring section is electrically connected to the plurality of second light-emitting elements on one of the two electrodes; the third wiring section is electrically connected to the plurality of third light-emitting elements on one of the two electrodes; and the fourth wiring section is electrically connected to the first light-emitting element, the plurality of second light-emitting elements, and the plurality of third light-emitting elements on the other electrode side of the two electrodes.

Description

Technical Field

[0001] The present invention relates to a light-emitting device and a light-emitting module.

Background Art

[0002] Japanese Patent Application Laid-Open No. 2022-145467 discloses a light-emitting device in which a light-emitting element that emits red light, a light-emitting element that emits blue light, and a light-emitting element that emits green light are arranged on a mounting surface of a base member, and these light-emitting elements are electrically connected to the base member by a plurality of wirings.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Disclosed is an invention that solves the problem of realizing a high-output light-emitting device with excellent manufacturing stability.

[0005] Alternatively, instead of the above problems, an invention that solves the problem of miniaturizing the light-emitting device is disclosed.

[0006] Alternatively, instead of the above problems, an invention that solves the problem of increasing the output of the light-emitting device is disclosed.

[0007] Note that in this specification, an invention that comprehensively solves a plurality of the above problems is also disclosed.

Means for Solving the Problems

[0008] The light-emitting device disclosed in the embodiment includes a first light-emitting element, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, each having two electrodes, an anode electrode and a cathode electrode; a substrate having a first wiring section, a second wiring section, a third wiring section, and a fourth wiring section, and a mounting surface provided in a plan view between two of the first, second, third, and fourth wiring sections; and a plurality of wires electrically connecting the plurality of light-emitting elements to the substrate, wherein in a plan view, the plurality of light-emitting elements are arranged on the mounting surface such that the first light-emitting element is located between the plurality of second light-emitting elements and the plurality of third light-emitting elements, the first wiring section is electrically connected to the first light-emitting element on one of the two electrodes, the second wiring section is electrically connected to the plurality of second light-emitting elements on one of the two electrodes, and the third wiring section The wire portion is electrically connected to the plurality of third light-emitting elements on the side of one of the two electrodes, and the fourth wiring portion is electrically connected to the first light-emitting element, the plurality of second light-emitting elements, and the plurality of third light-emitting elements on the side of the other of the two electrodes. A first current path is formed between the first wiring portion and the fourth wiring portion, through which the first light-emitting element passes, but not through which any of the plurality of second light-emitting elements or the plurality of third light-emitting elements pass. A second current path is formed between the second wiring portion and the fourth wiring portion, through which the plurality of second light-emitting elements pass, but not through which any of the first light-emitting elements or the plurality of third light-emitting elements pass. A third current path is formed between the third wiring portion and the fourth wiring portion, through which the plurality of third light-emitting elements pass, but not through which any of the first light-emitting elements or the plurality of second light-emitting elements pass.

[0009] The light-emitting module disclosed in the embodiment comprises the light-emitting device described above and a wiring board on which the light-emitting device is mounted.

[0010] In at least one of the one or more inventions disclosed by the embodiments, a high-power light-emitting device with excellent manufacturing stability can be realized. [Brief explanation of the drawing]

[0011] [Figure 1] Figure 1 is a perspective view of the light-emitting devices according to the first and second embodiments. [Figure 2] Figure 2 is a top view of the light-emitting device according to the first and second embodiments. [Figure 3] Figure 3 is a cross-sectional view of the light-emitting devices according to the first and second embodiments, taken along the line III-III in Figure 2. [Figure 4] Figure 4 is a perspective view showing the internal structure of the package of the light-emitting device according to the first embodiment. [Figure 5] Figure 5 is a top view showing the internal structure of the package of the light-emitting device according to the first embodiment. [Figure 6] Figure 6 is a top view showing the wiring configuration in the light-emitting device according to the first embodiment. [Figure 7] Figure 7 is a top view of the packages according to the first and second embodiments. [Figure 8] Figure 8 is a cross-sectional view of the packages according to the first and second embodiments along the section line VIII-VIII in Figure 7. [Figure 9] Figure 9 is a cross-sectional view of the substrate corresponding to the cross-sectional view of the package in Figure 8. [Figure 10] Figure 10 is a top view of the substrate according to the first and second embodiments. [Figure 11] Figure 11 is a bottom view of the substrate according to the first and second embodiments. [Figure 12] Figure 12 is a top view showing a submount on which the light-emitting element and protective element are mounted according to the first and second embodiments. [Figure 13] Figure 13 is a side view showing a submount on which the light-emitting element and protective element are mounted according to the first and second embodiments. [Figure 14A] Figure 14A is a top view of a light-emitting device that is used for comparison with the light-emitting devices according to the first and second embodiments. [Figure 14B] Figure 14B is a top view showing the wiring configuration in a light-emitting device that is a comparison of the light-emitting devices according to the first and second embodiments. [Figure 15] FIG. 15 is a top view showing a wiring connection mode in the light-emitting device according to the second embodiment. [Figure 16] FIG. 16 is a perspective view of the light-emitting module according to the third embodiment. [Figure 17] FIG. 17 is a top view of the light-emitting module according to the third embodiment. [Figure 18] FIG. 18 is a top view of the wiring board according to the third embodiment.

MODE FOR CARRYING OUT THE INVENTION

[0012] In this specification or the claims, with regard to polygons such as triangles and quadrilaterals, those having shapes obtained by processing such as rounding, chamfering, angling, or rounding at the corners of the polygon are also included in the term "polygon". Also, not limited to the corners (ends of the sides), shapes obtained by processing the middle part of the sides are similarly included in the term "polygon". That is, shapes obtained by partially processing while leaving the polygon as a base are included in the interpretation of the "polygon" described in this specification and the claims.

[0013] Also, not limited to polygons, the same applies to words representing specific shapes such as trapezoids, circles, and concavities and convexities. The same also applies when dealing with each side forming the shape. That is, even if a side has been processed at the corner or the middle part, the processed part is included in the interpretation of the "side". When distinguishing a "polygon" or a "side" without partial processing from the processed shape, "strict" is added, for example, described as "strict quadrilateral", etc.

[0014] Also, in this specification or the claims, descriptions such as up and down (upper / lower), left and right, front and back, front and rear (front / back), near and far, etc. only describe relative relationships such as position, orientation, and direction, and do not have to match the relationships during use.

[0015] Furthermore, directions such as the X, Y, and Z directions may be indicated in the drawings using arrows. The direction of these arrows is consistent across multiple drawings representing the same embodiment. In the drawings, the direction of arrows marked X, Y, and Z is considered the positive direction, and the opposite direction is considered the negative direction. For example, the direction indicated by an X at the end of the arrow is the X direction and is also the positive direction. In this specification, the direction that is both the X direction and the positive direction will be referred to as the "positive X direction," and the opposite direction will be referred to as the "negative X direction." When referring to the "X direction," both the positive and negative directions are included. The same applies to the Y and Z directions.

[0016] Furthermore, in this specification, when an object is identified as "one or more" and described accordingly, the form in which there is one object and the form in which there are multiple objects are described together. Accordingly, the description identifying an object as "one or more" supports any of the embodiments comprising one or more objects, embodiments comprising at least one object, and embodiments comprising multiple objects.

[0017] Furthermore, in this specification, descriptions describing "one or each" of an object are a combined description of one object in an embodiment having one object, one object in an embodiment having multiple objects, and each of the multiple objects in an embodiment having multiple objects. Accordingly, descriptions describing "one or each" of an object support any of the following: in an embodiment having one object, this one object provides the description; in an embodiment having multiple objects, at least one of these objects provides the description; in an embodiment having multiple objects, each of these multiple objects provides the description; and in an embodiment having one or more objects, all objects provide the description.

[0018] Furthermore, in this specification, the terms "component" and "part" may be used when describing components, for example. "Component" refers to an object that is treated as a single physical unit. An object that is treated as a single physical unit can also be an object that is treated as a single part in the manufacturing process. On the other hand, "part" refers to an object that does not necessarily have to be treated as a single physical unit. For example, "part" is used when considering a part of one component, or when considering multiple components together as a single object.

[0019] Furthermore, the distinction between "component" and "part" as described above does not indicate an intention to consciously limit the scope of rights in the interpretation of the doctrine of equivalents. In other words, even if a component is described as a "component" in the claims, this alone does not mean that the applicant recognizes that treating this component as a physical unit is indispensable for the application of the present invention.

[0020] Furthermore, in this specification or the claims, when there are multiple components and each is to be expressed separately, the components may be distinguished by adding "1st," "2nd," etc., to their names. Also, the objects being distinguished may differ between this specification and the claims. Therefore, even if a component with the same prefix as in this specification is described in the claims, the objects identified by this component may not be the same in this specification and the claims.

[0021] For example, if there are components designated as “First,” “Second,” and “Third” in this specification to distinguish them, and these components are described in the claims as “First” and “Third” in this specification, then for readability, the components may be distinguished in the claims as “First” and “Second.” In this case, the components designated as “First” and “Second” in the claims refer to the components designated as “First” and “Third” in this specification, respectively. This rule is not limited to components, but can be applied to other subjects in a reasonable and flexible manner.

[0022] The following describes embodiments for carrying out the present invention. Furthermore, specific embodiments for carrying out the present invention will be described with reference to the drawings. However, the embodiments for carrying out the present invention are not limited to these specific embodiments. In other words, the illustrated embodiments are not the only forms in which the present invention is realized. Note that the size and positional relationships of the components shown in each drawing may be exaggerated for the sake of ease of understanding.

[0023] <First Embodiment> A light-emitting device 1 according to the first embodiment will be described. Figures 1 to 13 are drawings illustrating an exemplary form of the light-emitting device 1. Figure 1 is a perspective view of the light-emitting device 1. Figure 2 is a top view of the light-emitting device 1. Figure 3 is a cross-sectional view of the light-emitting device 1 along the line III-III in Figure 2. Figure 4 is a perspective view showing the internal structure of the package of the light-emitting device 1. Figure 5 is a top view showing the internal structure of the package 10 of the light-emitting device 1. Figure 6 is a top view showing the connection configuration of the wiring 60 in the light-emitting device 1. Figure 7 is a top view of the package 10. Figure 8 is a cross-sectional view of the package 10 along the line VIII-VIII in Figure 7. Figure 9 is a cross-sectional view of the substrate 11 corresponding to the cross-sectional view of the package 10 in Figure 8. Figure 10 is a top view of the substrate 11. Figure 11 is a bottom view of the substrate 11. Figure 12 is a top view showing the submount 30 on which the light-emitting element 20 and the protective element 50 are mounted. Figure 13 is a side view showing the submount 30 on which the light-emitting element 20 and the protective element 50 are mounted.

[0024] The light-emitting device 1 comprises multiple components. These multiple components include a package 10, multiple light-emitting elements 20, one or more submounts 30, one or more reflective members 40, one or more protective elements 50, multiple wiring 60, and an optical member 70.

[0025] Furthermore, the light-emitting device 1 may have other components. For example, the light-emitting device 1 may have additional light-emitting elements in addition to the one or more light-emitting elements 20. Also, the light-emitting device 1 may not have some of the components listed here.

[0026] First, let's explain each component.

[0027] (Package 10) Package 10 comprises a base 11 and a lid 14. Package 10 is formed by joining the lid 14 to the base 11. Within package 10, an internal space is defined where other components are arranged. This internal space is a closed space surrounded by the base 11 and the lid 14. Furthermore, this internal space can be a space sealed in a vacuum or airtight state.

[0028] In a top view, the outer edge shape of package 10 is rectangular. This rectangle can have a long side and a short side. In the illustrated package 10, the direction of the long side of this rectangle is the same as the X direction, and the direction of the short side is the same as the Y direction. Note that the outer edge shape of package 10 does not have to be rectangular in a top view.

[0029] In package 10, an internal space is formed where other components are arranged. The first upper surface 11A of package 10 is part of the region that defines the internal space. In addition, each inner surface 11E and the lower surface 14B of package 10 are part of the region that defines the internal space.

[0030] The base 11 has a first upper surface 11A and a lower surface 11B. The base 11 has a second upper surface 11C. The base 11 has one or more outer surfaces 11D. The base 11 has one or more inner surfaces 11E. One or more outer surfaces 11D intersect with the second upper surface 11C. One or more outer surfaces 11D intersect with the lower surface 11B. One or more inner surfaces 11E intersect with the second upper surface 11C.

[0031] In a top view, the outer edge shape of the base 11 is rectangular. In a top view, the outer edge shape of the base 11 is the same as the outer edge shape of the package 10. In a top view, the outer edge shape of the first top surface 11A is rectangular. This rectangle can be a rectangle with a long side and a short side. The direction of the long side of the first top surface 11A is parallel to the direction of the long side of the outer edge shape of the base 11. Note that in a top view, the outer edge shape of the first top surface 11A does not have to be rectangular.

[0032] In a top view, the first top surface 11A is surrounded by the second top surface 11C. The second top surface 11C is an annular surface that surrounds the first top surface 11A in a top view. The second top surface 11C is a rectangular annular surface. Here, the frame defined by the inner edge of the second top surface 11C is called the inner frame of the second top surface 11C, and the frame defined by the outer edge of the second top surface 11C is called the outer frame of the second top surface 11C.

[0033] The base 11 has a recess surrounded by a frame formed by the second upper surface 11C. The recess defines a portion of the base 11 that is recessed below the second upper surface 11C. The first upper surface 11A is part of the recess. One or more inner surfaces 11E are part of the recess. The second upper surface 11C is located above the first upper surface 11A.

[0034] The base 11 has one or more stepped portions 11F. Each stepped portion 11F has an upper surface 11G and a side surface 11H that intersects with the upper surface 11G and extends downward from the upper surface 11G. Here, each stepped portion 11F has only one upper surface 11G and one side surface 11H. The upper surface 11G intersects with the inner side surface 11E. The side surface 11H intersects with the first upper surface 11A.

[0035] Each of the stepped portions 11F is located inside the inner frame of the second upper surface 11C when viewed from above. Each of the stepped portions 11F is formed along part or all of the inner surface 11E when viewed from above. In the base body 11, the side surface 11H is an inner surface, but side surface 11H and inner surface 11E are different surfaces. Each of the inner surfaces 11E and each of the side surfaces 11H are perpendicular to the first upper surface 11A. Perpendicularity here allows for a difference of ±3 degrees.

[0036] One or more stepped sections 11F may include a first stepped section 11F1 and a second stepped section 11F2. The first stepped section 11F1 and the second stepped section 11F2 are provided at positions where their respective side surfaces 11H face each other. The first stepped section 11F1 and the second stepped section 11F2 are provided on the short side of the inner frame of the second upper surface 11C.

[0037] The base 11 has a base portion 11M and a frame portion 11N. The base portion 11M and the frame portion 11N may be made of different materials. The base 11 may be composed of a base member corresponding to the base portion 11M and a frame member corresponding to the frame portion 11N.

[0038] The base portion 11M includes a first upper surface 11A. The frame portion 11N includes a second upper surface 11C. The frame portion 11N includes one or more outer surfaces 11D and one or more inner surfaces 11E. The frame portion 11N includes one or more stepped portions 11F.

[0039] The lower surface of the base portion 11M constitutes part or all of the area of ​​the lower surface 11B of the base body 11. If the lower surface of the base portion 11M constitutes part of the area of ​​the lower surface 11B of the base body 11, the lower surface of the frame portion 11N constitutes the remaining area of ​​the lower surface 11B of the base body.

[0040] The base body 11 has a plurality of wiring sections 12A. The plurality of wiring sections 12A include one or more wiring sections 12A (internal wiring sections) arranged in the internal space of the package 10 and one or more wiring sections 12A (external wiring sections) provided on the outer surface of the package 10.

[0041] One or each of the internal wiring sections is provided on the upper surface 11G of the stepped section 11F. The base body 11 has one or more internal wiring sections provided on the upper surface 11G of the first stepped section 11F1. The base body 11 has one or more internal wiring sections provided on the upper surface 11G of the second stepped section 11F2.

[0042] The multiple wiring sections 12A include a first wiring section 12A1, a second wiring section 12A2, a third wiring section 12A3, and a fourth wiring section 12A4. The first wiring section 12A1, the second wiring section 12A2, the third wiring section 12A3, and the fourth wiring section 12A4 are all internal wiring sections. The first wiring section 12A1, the second wiring section 12A2, the third wiring section 12A3, and the fourth wiring section 12A4 are all provided on the upper surface 11G of one or more stepped sections 11F.

[0043] The first wiring section 12A1 and the second wiring section 12A2 are arranged side by side in one direction. The first wiring section 12A1 and the second wiring section 12A2 are provided on the upper surface 11G of the first stepped section 11F1. In the illustrated light-emitting device 1, the direction in which the first wiring section 12A1 and the second wiring section 12A2 are aligned is the same direction as the Y direction.

[0044] The third wiring section 12A3 and the fourth wiring section 12A4 are arranged side by side in one direction. The third wiring section 12A3 and the fourth wiring section 12A4 are provided on the upper surface 11G of the second stepped section 11F2. In the illustrated light-emitting device 1, the direction in which the third wiring section 12A3 and the fourth wiring section 12A4 are aligned is the same direction as the Y direction.

[0045] In a top view, the first top surface 11A is provided between the first stepped portion 11F1 and the second stepped portion 11F2. In a top view, it can be said that the first top surface 11A is provided between two of the wiring portions 12A among the first wiring portion 12A1, the second wiring portion 12A2, the third wiring portion 12A3, and the fourth wiring portion 12A4. Furthermore, it can be said that the first top surface 11A is provided between the first wiring portion 12A1 and the second wiring portion 12A2, which are aligned in one direction, and the third wiring portion 12A3 and the fourth wiring portion 12A4, which are aligned in one direction.

[0046] One or each of the external wiring sections is provided on the lower surface 11B of the package 10. One or each of the external wiring sections is provided on the lower surface of the frame 11N. Note that the external wiring sections may be provided on an outer surface other than the lower surface 11B of the package 10.

[0047] In the base 11, one or each of the inner wiring sections is electrically connected to the outer wiring section. One or more inner wiring sections are electrically connected to different outer wiring sections.

[0048] The substrate 11 can be formed, for example, using ceramic as the main material. Examples of ceramics that can be used as the main material for the substrate 11 include aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide.

[0049] Here, the main material refers to the material that accounts for the largest proportion in mass or volume of the object being considered. Furthermore, if the object is formed from a single material, that material is the main material. In other words, for a material to be the main material includes the possibility of that material accounting for 100% of the total.

[0050] The base body 11 may be formed using a base member and a frame member formed using different main materials. The base member can be formed using, for example, a metal or a composite containing a metal, graphite, diamond, or other material with excellent heat dissipation properties as the main material. Examples of metals that can be used as the main material of the base member include copper, aluminum, or iron. Examples of composites containing a metal that can be used as the main material of the base member include copper molybdenum or copper tungsten. The frame member can be formed using, for example, a ceramic as the main material, as mentioned above as the main material of the base body 11.

[0051] The wiring section 12A can be formed, for example, using a metal material as the main material. Examples of the metal material that serves as the main material for the wiring section 12A include elemental metals such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, or alloys containing these metals. The wiring section 12A can be composed of, for example, one or more metal layers.

[0052] The lid 14 has an upper surface 14A and a lower surface 14B. The lid 14 also has one or more side surfaces 14C. The lid 14 is constructed in the shape of a rectangular parallelepiped. However, the shape of the lid 14 does not have to be a rectangular parallelepiped.

[0053] The lid 14 is joined to the base 11. The lower surface 14B of the lid 14 is joined to the second upper surface 11C of the base 11. The lid 14 is joined to the base 11 via adhesive.

[0054] The lid 14 is translucent, meaning it transmits light. Here, translucency means that the transmittance of light incident on the lid 14 is 80% or more. The lid 14 may also have a non-translucent region (a region that does not transmit light) in part.

[0055] The lid 14 can be formed, for example, using glass as the main material. The lid 14 can also be formed, for example, using sapphire as the main material.

[0056] (Light-emitting element 20) The light-emitting element 20 has an upper surface 21A, a lower surface 21B, and a plurality of side surfaces 21C. The shape of the upper surface 21A is rectangular. This rectangle has a long side and a short side. The external shape of the light-emitting element 20 when viewed from above is rectangular. This rectangle has a long side and a short side. However, the shape of the upper surface 21A and the external shape of the light-emitting element 20 when viewed from above are not limited to these.

[0057] The light-emitting element 20 has a light-emitting surface 22 that emits light. For example, the side surface 21C can be the light-emitting surface 22. The side surface 21C that becomes the light-emitting surface 22 intersects with the short side of the top surface 21A. Alternatively, for example, the top surface 21A can be the light-emitting surface 22. The light-emitting element 20 has one or more light-emitting surfaces 22.

[0058] The light-emitting element 20 has two electrodes: an anode electrode and a cathode electrode. The two electrodes can be provided on two surfaces that are opposite to each other, for example. For example, one electrode may be provided on the upper surface 21A and the other electrode on the lower surface 21B. Alternatively, the two electrodes may be provided on a single surface.

[0059] For example, the light-emitting element 20 may be a light-emitting element that emits blue light. Alternatively, the light-emitting element 20 may be a light-emitting element that emits green light. Alternatively, the light-emitting element 20 may be a light-emitting element that emits red light. In addition, the light-emitting element 20 may be a light-emitting element that emits light of other colors or wavelengths.

[0060] Here, blue light is defined as light whose emission peak wavelength is in the range of 420 nm to 494 nm. Green light is defined as light whose emission peak wavelength is in the range of 495 nm to 570 nm. Red light is defined as light whose emission peak wavelength is in the range of 605 nm to 750 nm.

[0061] Examples of light-emitting elements 20 that emit blue light or green light include light-emitting elements containing nitride semiconductors. Examples of nitride semiconductors include GaN-based semiconductors such as GaN, InGaN, and AlGaN. Examples of light-emitting elements 20 that emit red light include light-emitting elements containing InAlGaP-based, GaInP-based, and GaAs-based semiconductors such as GaAs and AlGaAs.

[0062] The light-emitting element 20 can be, for example, a semiconductor laser element. Furthermore, the light-emitting element 20 can be a single-emitter semiconductor laser element consisting of one emitter. Alternatively, the light-emitting element 20 can be a multi-emitter semiconductor laser element consisting of multiple emitters. Note that the light-emitting element 20 is not limited to a semiconductor laser element; it may also be a light-emitting diode or the like.

[0063] Here, we will describe a semiconductor laser element, which is an example of a light-emitting element 20.

[0064] A semiconductor laser element emits directional laser light. Divergent light with a broad spread is emitted from the light-emitting surface 22 of the semiconductor laser element. The light emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light-emitting surface 22. FFP is the shape and light intensity distribution of the emitted light at a position away from the light-emitting surface of the semiconductor laser element.

[0065] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the FFP's light intensity distribution, is referred to as light traveling along the optical axis, or light passing through the optical axis. Furthermore, in the FFP's light intensity distribution, 1 / e is applied to the peak intensity value. 2 Light with the above intensity will be referred to as the main part of the light.

[0066] The shape of the FFP (Fiber Focused Plane) of the light emitted from the semiconductor laser element is an ellipse, with the stacking direction being longer than the direction perpendicular to the stacking direction, in a plane parallel to the light emission surface 22. The stacking direction refers to the direction in which multiple semiconductor layers, including the active layer, are stacked in the semiconductor laser element. The direction perpendicular to the stacking direction can also be called the plane direction of the semiconductor layer. Furthermore, the major axis direction of the elliptical shape of the FFP can be called the speed axis direction of the semiconductor laser element, and the minor axis direction can be called the slow axis direction of the semiconductor laser element.

[0067] Based on the light intensity distribution of FFP, 1 / e of the peak light intensity 2 The angle at which light of a certain intensity spreads is defined as the divergence angle of the semiconductor laser element. Here, the divergence angle is calculated by dividing the light of peak intensity (light passing through the optical axis) by 1 / e of the peak intensity. 2 The angle of light divergence is expressed as the angle formed by light of intensity 1 / e of the peak light intensity. 2 In addition to the light intensity, it can also be determined from, for example, the light intensity at half the peak light intensity. In this specification, when we simply refer to the "angle of light divergence," we mean 1 / e of the peak light intensity. 2 This refers to the angle of light divergence at a given light intensity.

[0068] The divergence angle in the speed axis direction of light emitted from a semiconductor laser element can be between 15 degrees and 40 degrees. The divergence angle in the slow axis direction of this light can be greater than 0 degrees and less than or equal to 10 degrees. Furthermore, the divergence angle in the speed axis direction is greater than the divergence angle in the slow axis direction.

[0069] For example, the divergence angle in the fast axis direction of blue light emitted from a semiconductor laser element may be between 15 degrees and 30 degrees, while the divergence angle in the slow axis direction may be greater than 0 degrees and less than 10 degrees. Similarly, the divergence angle in the fast axis direction of green light emitted from a semiconductor laser element may be between 15 degrees and 30 degrees, while the divergence angle in the slow axis direction may be greater than 0 degrees and less than 10 degrees. Furthermore, the divergence angle in the fast axis direction of red light emitted from a semiconductor laser element may be between 20 degrees and 40 degrees, while the divergence angle in the slow axis direction may be greater than 0 degrees and less than 10 degrees.

[0070] (Submount 30) The submount 30 has an upper surface 31A, a lower surface 31B, and one or more side surfaces 31C. The upper surface 31A can be considered the mounting surface on which other components are mounted. The shape of the upper surface 31A is rectangular. This rectangle of the upper surface 31A may have a short side and a long side. However, the shape of the upper surface 31A does not have to be rectangular.

[0071] The external shape of the submount 30 in a top view is rectangular. This rectangle of the submount 30 may have a short side and a long side. However, the external shape of the submount 30 in a top view does not have to be rectangular. In a top view, the submount 30 may have an external shape in which the length in one direction (hereinafter referred to as the short side direction of the submount 30) is smaller than the length in the direction perpendicular to it (hereinafter referred to as the long side direction of the submount 30). In the illustrated submount 30, the short side direction is the same direction as the X direction, and the long side direction is the same direction as the Y direction.

[0072] The submount 30 may be composed of a substrate 32A and an upper metal member 32B. The submount 30 may also be composed of a lower metal member 32C. The upper metal member 32B is provided on the upper side of the substrate 32A. The lower metal member 32C is provided on the lower side of the substrate 32A. The submount 30 may also have a wiring layer 33. The wiring layer 33 is provided on top of the upper metal member 32B.

[0073] The substrate 32A is insulating. The substrate 32A is formed from, for example, silicon nitride, aluminum nitride, or silicon carbide. For the main material of the substrate 32A, it is preferable to select a ceramic with relatively good heat dissipation (high thermal conductivity).

[0074] The main material of the upper metal member 32B is a metal such as copper or aluminum. The upper metal member 32B has one or more metal layers. The upper metal member 32B may have multiple metal layers, each primarily made of a different metal.

[0075] The main material of the lower metal member 32C is a metal such as copper or aluminum. The lower metal member 32C has one or more metal layers. The lower metal member 32C may have multiple metal layers, each primarily made of a different metal.

[0076] The wiring layer 33 can be formed using metal. For example, the wiring layer 33 can be formed using AuSn solder (a metal layer of AuSn).

[0077] For example, the length of the submount 30 in the short side direction is 500 μm or more and 1000 μm or less. Also, the length of the submount 30 in the long side direction is 1500 μm or more and 2500 μm or less. Furthermore, the difference between the length in the long side direction and the length in the short side direction of the submount 30 is 500 μm or more and 1000 μm or less.

[0078] For example, the thickness of the submount 30 (width in the direction perpendicular to the top surface 31A) is 200 μm or more and 400 μm or less. Also, for example, the thickness of the substrate 32A is 100 μm or more and 300 μm or less. Also, for example, the thickness of the upper metal member 32B is 30 μm or more and 100 μm or less. Also, for example, the thickness of the lower metal member 32C is 30 μm or more and 100 μm or less. Also, for example, the thickness of the wiring layer 33 is 1 μm or more and 10 μm or less.

[0079] (Reflective member 40) The reflective member 40 has a lower surface 41A and a light-reflecting surface 41B that reflects light. The light-reflecting surface 41B is inclined with respect to the lower surface 41A. The straight line connecting the lower end and upper end of the light-reflecting surface 41B is inclined with respect to the lower surface 41A. The angle at which the light-reflecting surface 41B is inclined with respect to the lower surface 41A is called the inclination angle of the light-reflecting surface 41B.

[0080] The light-reflecting surface 41B is flat. However, the light-reflecting surface 41B may be curved. The inclination angle of the light-reflecting surface 41B is 45 degrees. However, the inclination angle of the light-reflecting surface 41B does not have to be 45 degrees.

[0081] The main material of the reflective member 40 can be glass or metal. It is preferable to use a heat-resistant material as the main material of the reflective member 40. For example, the main material can be glass such as quartz or BK7 (borosilicate glass), or metal such as Al. The reflective member 40 can also be formed using Si as the main material.

[0082] If the main material is a reflective material such as Al, the light-reflecting surface 41B can be formed from the main material. Alternatively, instead of forming the light-reflecting surface 41B with the main material, the general shape of the reflective member 40 may be formed with the main material, and the light-reflecting surface 41B may be formed on the surface of the general shape. In this case, the light-reflecting surface 41B can be formed using, for example, a metal layer such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0083] The light-reflecting surface 41B has a reflectance of 90% or more with respect to the peak wavelength of light irradiated onto it. This reflectance may also be 95% or more. Furthermore, this reflectance may be 99% or more. The light reflectance is 100% or less, or less than 100%.

[0084] (Protection element 50) The protective element 50 has an upper surface 51A, a lower surface 51B, and one or more side surfaces 51C. The protective element 50 is shaped like a rectangular parallelepiped. However, the protective element 50 does not have to be shaped like a rectangular parallelepiped.

[0085] The protective element 50 is designed to prevent excessive current from flowing through a specific element (such as a semiconductor laser element) and causing it to be damaged. An example of the protective element 50 is a Zener diode. Furthermore, a Zener diode made of silicon can be used.

[0086] (Wiring 60) The wiring 60 is a linear conductive material with joints at both ends. The joints at both ends become connection points with other components. The wiring 60 is used for electrical connection between two components. The wiring 60 is, for example, a metal wire. The metal can be, for example, gold, aluminum, silver, copper, etc.

[0087] (Optical component 70) The optical member 70 has an upper surface 71A, a lower surface 71B, and one or more side surfaces 71C. The optical component 70 exerts an optical effect on the light incident upon it. Examples of optical effects exerted on light by the optical component 70 include focusing, collimation, diffusion, polarization, diffraction, multiplexing, light guidance, reflection, and wavelength conversion.

[0088] The optical member 70 has an optical surface that provides an optical effect. The upper surface 71A, the lower surface 71B, or the side surface 71C can be the optical surface. Alternatively, the optical surface may be located at a position different from the upper surface 71A, the lower surface 71B, and the side surface 71C. For example, the optical surface may be formed inside the optical member 70 rather than on its surface.

[0089] The optical component 70 may have one or more lens surfaces 71D. The lens surface 71D is the optical working surface of the optical component 70. The optical component 70 having a lens surface 71D may also be called a lens component. Light that passes through the lens surface 71D and is emitted from the optical component 70 is subjected to optical effects such as focusing, diffusion, or collimation by the optical component 70. For example, the optical component 70 is a collimating lens that emits collimated light after light incident on the optical component 70.

[0090] One or each lens surface 71D is located on the upper surface 71A side. Alternatively, the lens surface 71D may be located on the lower surface 71B side. The upper surface 71A and the lower surface 71B are flat. One or each lens surface 71D intersects with the upper surface 71A. In a top view, one or each lens surface 71D is surrounded by the upper surface 71A.

[0091] In a top view, the outer shape of the optical element 70 is rectangular. However, the outer shape of the optical element 70 in a top view does not have to be rectangular. The bottom surface 71B is flat. No lens surface 71D is formed on the bottom surface 71B side of the optical element 70. The shape of the bottom surface 71B is rectangular. However, the shape of the bottom surface 71B does not have to be rectangular.

[0092] In the optical member 70, the portion that overlaps with the lens surface 71D when viewed from above is defined as the lens portion 72A. In the optical member 70, the portion that overlaps with the upper surface 71A when viewed from above is defined as the non-lens portion 72B. The lower surface 71B has a region that constitutes the lower surface of one or each of the lens portions 72A and a region that constitutes the lower surface of the non-lens portion 72B.

[0093] The optical member 70 may have a plurality of lens surfaces 71D formed in a continuous line in one direction. In a top view, the direction in which the plurality of lens surfaces 71D are aligned is called the lens connection direction. In the illustrated optical member 70, the connection direction is the same direction as the X direction.

[0094] The multiple lens surfaces 71D are formed such that the vertices of each lens surface 71D lie on a straight line. This imaginary line connecting the vertices is parallel to the lower surface 71B of the optical member 70. Note that this parallelism includes a difference of ±5 degrees.

[0095] Some or all of the multiple lens surfaces 71D may have the same curvature, and two or more of these lens surfaces 71D may have the same curvature. All of the multiple lens surfaces 71D may have the same curvature.

[0096] The optical component 70 is translucent. The optical component 70 has a transmittance of 80% or more for the peak wavelength of light incident on it. The optical component 70 may have a translucent region and a non-translucent region (hereinafter referred to as the non-translucent region). In the non-translucent region, the transmittance for the peak wavelength of light incident on the optical component 70 is 50% or less. The optical component 70 can be formed using glass such as BK7, for example.

[0097] Next, the light-emitting device 1 will be described.

[0098] (Light-emitting device 1) In the light-emitting device 1, multiple light-emitting elements 20 are arranged in the internal space of the package 10. The multiple light-emitting elements 20 are arranged on the substrate 11. The multiple light-emitting elements 20 are arranged on the first upper surface 11A. The first upper surface 11A can be described as the mounting surface on which the multiple light-emitting elements 20 are arranged.

[0099] The multiple light-emitting elements 20 include a first light-emitting element 20A, multiple second light-emitting elements 20B, and multiple third light-emitting elements 20C. All light-emitting elements mounted on the light-emitting device 1 may consist of a first light-emitting element 20A, multiple second light-emitting elements 20B, and multiple third light-emitting elements 20C. Alternatively, all light-emitting elements mounted on the light-emitting device 1 may consist of a first light-emitting element 20A, two second light-emitting elements 20B, and two third light-emitting elements 20C.

[0100] The first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C emit light with different peak wavelengths from each other. The first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C emit light of one of the following colors: red, green, or blue. In the illustrated example of the light-emitting device 1, the first light-emitting element 20A emits blue light, the second light-emitting element 20B emits green light, and the third light-emitting element 20C emits red light.

[0101] An RGB light source can be realized without using phosphor excitation technology by a light-emitting device 1 equipped with multiple light-emitting elements 20 that emit red light, green light, and blue light. However, this disclosure does not negate the use of phosphor excitation technology.

[0102] At the time of filing this application, among semiconductor laser elements used as light-emitting elements 20, semiconductor laser elements that emit blue light have the highest light output efficiency. When using an RGB light source for image display such as a projector, it is desirable to increase the output of each of the RGB light sources, rather than increasing the output of only one color of light.

[0103] For example, if you add one more semiconductor laser element to a light-emitting device that originally consisted of four semiconductor laser elements (one blue laser element, one green laser element, and two red laser elements), a projector with five semiconductor laser elements (one blue laser element, two green laser elements, and two red laser elements) may exhibit higher performance (e.g., luminous flux [lm]) than one with five semiconductor laser elements (one blue laser element, one green laser element, and three red laser elements).

[0104] In the light-emitting device 1, the number of second light-emitting elements 20B is greater than the number of first light-emitting elements 20A. Furthermore, the number of third light-emitting elements 20C is greater than the number of first light-emitting elements 20A. By configuring multiple light-emitting elements 20 in this way, the overall light output of the light-emitting device 1, for example, when used as an RGB light source, becomes higher. In other words, a light-emitting device 1 with effectively high output is realized.

[0105] In a top view, the multiple light-emitting elements 20 are arranged in a line in the first direction. The top view can also be described as a plan view of the mounting surface when viewed from a direction perpendicular to the mounting surface. In the illustrated light-emitting device 1, the first direction is the same direction as the X direction. The multiple light-emitting elements 20 are arranged between the first wiring section 12A1 and the second wiring section 12A2, which are aligned in one direction, and the third wiring section 12A3 and the fourth wiring section 12A4, which are aligned in one direction.

[0106] The multiple light-emitting elements 20 are arranged such that, when viewed from above, the first light-emitting element 20A is positioned between the multiple second light-emitting elements 20B and the multiple third light-emitting elements 20C. This makes it possible to realize a light-emitting device 1 with excellent manufacturing stability, but the details will be described later. Of the first light-emitting element 20A and the multiple second light-emitting elements 20B, the multiple second light-emitting elements 20B are closer to the first wiring section 12A1. Of the first light-emitting element 20A and the multiple third light-emitting elements 20C, the multiple third light-emitting elements 20C are closer to the fourth wiring section 12A4.

[0107] Each of the multiple light-emitting elements 20 emits light in a second direction. The second direction is perpendicular to the first direction. The second direction is also parallel to the first upper surface 11A. In the illustrated light-emitting device 1, the second direction is the same direction as the positive direction of Y. When the light-emitting elements 20 are semiconductor laser elements, each of the multiple light-emitting elements 20 emits FFP light from the light-emitting surface 22 with the first direction as the slow axis direction and the direction perpendicular to the first upper surface 11A as the fast axis direction.

[0108] Multiple light-emitting elements 20 are arranged on one or more submounts 30. Each of the multiple light-emitting elements 20 is arranged on a different submount 30. One or more submounts 30 may consist of a first submount 30A on which a first light-emitting element 20A is arranged, a plurality of second submounts 30B, each on which a second light-emitting element 20B is arranged, and a third submount 30C, each on which a third light-emitting element 20C is arranged. The height of the light-emitting elements 20 can be adjusted by arranging the light-emitting elements 20 on the substrate 11 via the submounts 30.

[0109] With respect to the first direction, the distance from the first submount 30A to the third submount 30C located next to the first submount 30A is greater than the distance from the first submount 30A to the second submount 30B located next to the first submount 30A. Furthermore, the second light-emitting element 20B, which is a semiconductor laser element, has superior temperature characteristics at 45°C compared to the third light-emitting element 20C, which is also a semiconductor laser element. This arrangement of submounts 30 contributes to the substantial high output of the light-emitting device 1. Note that 45°C is within the typical operating temperature range of the light-emitting device 1.

[0110] The width of the third light-emitting element 20C in the first direction is greater than the width of the first light-emitting element 20A in the first direction. Also, the difference between the width of the first submount 30A in the first direction and the width of the third submount 30C in the first direction is smaller than the difference between the width of the first light-emitting element 20A in the first direction and the width of the third light-emitting element 20C in the first direction. Furthermore, in a top view, with respect to the direction perpendicular to the first direction, the width of the third submount 30C is greater than the width of the first submount 30A. This allows for increasing the number of light-emitting elements 20 arranged in the first direction while simultaneously widening the third submount 30C, which is narrow in the first direction, in the direction perpendicular to the first direction, thereby achieving a heat dissipation balance and contributing to higher output of the light-emitting device 1.

[0111] In the light-emitting device 1, the plurality of light-emitting elements 20 include two light-emitting elements 20 with different widths in the first direction. In the illustrated light-emitting device 1, the first light-emitting element 20A and the third light-emitting element 20C have different widths in the first direction.

[0112] The width of the first light-emitting element 20A in the first direction is smaller than the width of the third light-emitting element 20C in the first direction. The width of the third light-emitting element 20C in the first direction is 50 μm or more larger than the width of the first light-emitting element 20C in the first direction, or 100 μm or more larger. The width of the third light-emitting element 20C in the first direction may be 1.5 times or more the width of the first light-emitting element 20C in the first direction.

[0113] The difference between the width of the first submount 30A in the first direction and the width of the first light-emitting element 20A in the first direction is greater than the difference between the width of the third submount 30C in the first direction and the width of the third light-emitting element 20C in the first direction. For the third light-emitting element 20C, whose width in the first direction is greater than that of the first light-emitting element 20A, reducing the margin of the submount 30 in the first direction allows for an increase in the number of light-emitting elements 20 arranged in the first direction, which contributes to increasing the output power of the light-emitting device 1.

[0114] In the light-emitting device 1, the first light-emitting element 20A may be a single-emitter semiconductor laser element, and the third light-emitting element 20C may be a multi-emitter semiconductor laser element. The difference in the number of emitters may affect the difference in the width of the light-emitting element 20 in the first direction. The third light-emitting element 20C may be a multi-emitter semiconductor laser element composed of two emitters. The second light-emitting element 20B may be a single-emitter semiconductor laser element.

[0115] Multiple wirings 60 electrically connect multiple light-emitting elements 20 to the base 11. Multiple wirings 60 are connected to the light-emitting elements 20, the submount 30, or the base 11, thereby electrically connecting the multiple light-emitting elements 20 to the base 11.

[0116] Multiple wires 60 form a first current path that supplies current to the first light-emitting element 20A. Multiple wires 60 also form a second current path that supplies current to the second light-emitting element 20B. Multiple wires 60 also form a third current path that supplies current to the third light-emitting element 20C.

[0117] The first current path is a current path through which the first light-emitting element 20A passes, but through which none of the multiple second light-emitting elements 20B and multiple third light-emitting elements 20C pass. Here, "a light-emitting element passing through the current path" means that when current flows through this current path, current flows through this light-emitting element and drives it, and "a light-emitting element not passing through the current path" means that even if current flows through this current path, current does not flow through this light-emitting element and drive it.

[0118] The second current path is a current path through which multiple second light-emitting elements 20B pass, but through which none of the first light-emitting elements 20A and multiple third light-emitting elements 20C pass. The third current path is a current path through which multiple third light-emitting elements 20C pass, but through which none of the first light-emitting elements 20A and multiple second light-emitting elements 20B pass. By forming the first current path, the second current path, and the third current path, the first light-emitting element 20A, multiple second light-emitting elements 20B, and multiple third light-emitting elements 20C can be driven individually.

[0119] The first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C are electrically connected to a common wiring section 12A with respect to one of their two electrodes. This allows the four wiring sections 12A to individually drive the first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C.

[0120] In the light-emitting device 1, the first wiring section 12A1 is electrically connected to the first light-emitting element 20A on one of its two electrodes. The fourth wiring section 12A4 is electrically connected to the first light-emitting element 20A on the other of its two electrodes. Here, "electrically connected on one / other electrode side" means that in the current path, one electrode is closer than the other electrode.

[0121] In the light-emitting device 1, the second wiring section 12A2 is electrically connected to multiple second light-emitting elements 20B on one of the two electrodes of the second light-emitting element 20B. The fourth wiring section 12A4 is electrically connected to multiple second light-emitting elements 20B on the other electrode of the second light-emitting element 20B.

[0122] In the light-emitting device 1, the third wiring section 12A3 is electrically connected to multiple third light-emitting elements 20C on one of the two electrodes of each third light-emitting element 20C. The fourth wiring section 12A4 is electrically connected to multiple third light-emitting elements 20C on the other electrode of each third light-emitting element 20C.

[0123] The first current path is formed between the first wiring section 12A1 and the fourth wiring section 12A4. The second current path is formed between the second wiring section 12A2 and the fourth wiring section 12A4. The third current path is formed between the third wiring section 12A3 and the fourth wiring section 12A4. The fourth wiring section 12A4 is a common wiring section 12A that is electrically connected to the other electrode of the first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C.

[0124] The multiple wirings 60 include a first wiring 60A that connects to the first wiring section 12A1. The multiple wirings 60 include a second wiring 60B that connects to the second wiring section 12A2. The multiple wirings 60 include a third wiring 60C that connects to the third wiring section 12A3. The multiple wirings 60 include a fourth wiring 60D that connects to the fourth wiring section 12A4.

[0125] The first wire 60A is connected to the first light-emitting element 20A or the first submount 30A. The second wire 60B is connected to the second light-emitting element 20B or the second submount 30B. The third wire 60C is connected to the third light-emitting element 20C or the third submount 30C. The fourth wire 60D is connected to the submount 30.

[0126] In the light-emitting device 1, of the first submount 30A and the second submount 30B, the first submount 30A is closer to the fourth wiring section 12A4, and of the first submount 30A and the third submount 30C, the third submount 30C is closer to the fourth wiring section 12A4. The fourth wiring 60D is connected to either the adjacent first submount 30A or the third submount 30C.

[0127] In the light-emitting device 1, the difference in width between the first submount 30A and the first light-emitting element 20A in the second direction is 200 μm or more. The difference in width between the third submount 30C and the third light-emitting element 20C in the second direction is 300 μm or more. The difference in width between the second submount 30B and the second light-emitting element 20B in the second direction is less than 100 μm.

[0128] The multiple wirings 60 include wirings 60 that connect to the fourth wiring section 12A4 and the third submount 30C, and wirings 60 that connect to the third submount 30C and the first submount 30A. Each of these wirings 60 is connected to the submount 30 at a position away from the side surface 21C opposite to the light-emitting surface 22 of the light-emitting element 20 arranged on the submount 30, in the direction opposite to the second direction. By selecting the first submount 30A and the third submount 30C, it is easy to secure an area on the submount 30 for connecting the wirings 60 in this way, resulting in excellent mounting stability of the wirings 60.

[0129] The wiring 60 that connects the fourth wiring section 12A4 to the third submount 30C does not connect to the third submount 30C that is located closest to the fourth wiring section 12A4 among the multiple third submounts 30C. In other words, the other end connects to a third submount 30C other than the third submount 30C that is located closest to the fourth wiring section 12A4. This reduces the number of wires 60 used.

[0130] The first submount 30A has areas on both sides of the first light-emitting element 20A with respect to the first direction for connecting wiring 60. Of these two areas, the area secured on the side of the second light-emitting element 20B that is closer to the first light-emitting element 20A is used for connecting wiring 60 to the second submount 30B, which is located next to the first submount 30A. Also, of these two areas, the area secured on the side of the third light-emitting element 20C that is closer to the first light-emitting element 20A is used for connecting wiring 60 to the third submount 30C, which is located next to the first submount 30A. The position of the first light-emitting element 20A is adjusted in order to secure these areas for connecting wiring 60.

[0131] The third submount 30C has a region for connecting wiring 60 at a position away from the third light-emitting element 20C in the direction opposite to the second direction. Wiring 60 that connects to the first submount 30A, which is located next to the third submount 30C, is connected to this region. Wiring 60 that connects to the fourth wiring section 12A4 is also connected to this region. With respect to the first direction, the third submount 30C has a region for connecting wiring 60 on only one side of the third light-emitting element 20C, rather than both sides. This makes it possible to narrow the width of the third submount 30C in the first direction, so that the number of light-emitting elements 20 arranged in the first direction can be increased, and a high-output light-emitting device 1 can be realized.

[0132] On the upper surface 31A of the first submount 30A, one or more wirings 60 are joined in the region between the virtual plane containing the light-emitting surface 22 of the first light-emitting element 20A and the virtual plane containing the side surface 21C opposite to the light-emitting surface 22. On the upper surface 31A of the third submount 30C, there are no wirings 60 joined in the region between the virtual plane containing the light-emitting surface 22 of the third light-emitting element 20C and the virtual plane containing the side surface 21C opposite to the light-emitting surface 22.

[0133] To increase output power, the width of the submount 30 in the first direction is adjusted, and in the third submount 30C, the wiring 60 is not provided at a position away from the third light-emitting element 20C in the first direction, and the wiring 50 is provided at a position away from the third light-emitting element 20C in the direction opposite to the second direction, thereby reducing the risk of contact with the third light-emitting element 20C and enabling stable connection of the wiring 60.

[0134] In the light-emitting device 1, the shape of the wiring layer 33 of the first submount 30A and the shape of the wiring layer 33 of the second submount 30B are the same when viewed from above. Also, the external shape of the first submount 30A and the external shape of the second submount 30B are the same when viewed from above. In the light-emitting device 1, the first submount 30A and the second submount 30B are submounts 30 that are the same in material, shape, and structure. In this way, by designing the wiring layers 33 etc. so that the same submount 30 can be used for mounting the first light-emitting element 20A and the second light-emitting element 20B, the light-emitting device 1 can be manufactured efficiently.

[0135] In the light-emitting device 1, the second wiring section 12A2 is provided at a position separated from the first wiring section 12A1 in a second direction. This avoids interference with the wiring 60 connected to the second light-emitting element 20B and the wiring 60 connected to the second submount 30B, making it easier to connect the wiring 60 connected to the first light-emitting element 20A or the first submount 30A.

[0136] In the light-emitting device 1, the third wiring section 12A3 is provided at a position away from the fourth wiring section 12A4 in the second direction. This makes it easier to connect the wiring 60 that connects to the first light-emitting element 20A or the first submount 30A, while avoiding interference with the wiring 60 that connects to the third light-emitting element 20C and the wiring 60 that connects to the third submount 30C.

[0137] Viewed from above, the distance from the center of the second submount 30B to the second wiring section 12A2 is shorter than the distance from this center to the first wiring section 12A1. This makes it easier to connect the second wiring 60B. Viewed from above, the distance from the center of the third submount 30C to the third wiring section 12A3 is shorter than the distance from this center to the fourth wiring section 12A4. This makes it easier to connect the third wiring 60C.

[0138] By arranging a plurality of light-emitting elements 20, including a first light-emitting element 20A, a plurality of second light-emitting elements 20B, and a plurality of third light-emitting elements 20C, on a base 11, and by arranging the first light-emitting element 20A between the plurality of second light-emitting elements 20B and the plurality of third light-emitting elements 20C when electrically connecting the plurality of light-emitting elements 20 to the base 11, a light-emitting device 1 with excellent manufacturing stability, for example, a light-emitting device 1 with excellent stability when joining a plurality of wires 60, is realized. This point will be explained in detail.

[0139] Figures 14A and 14B show an example of a wiring configuration when multiple second light-emitting elements 20B are arranged between a first light-emitting element 20A and multiple third light-emitting elements 20C. In a light-emitting device 99 with this type of wiring configuration, there is wiring 60X connected to two submounts 30 with one or more submounts 30 in between, so that the second light-emitting elements 20B and the third light-emitting elements 20C do not pass through the current path, but the first light-emitting element 20A passes through. On the other hand, in the light-emitting device 1, there is no wiring 60 connected to two submounts 30 with one or more submounts 30 in between, resulting in superior wiring connection stability.

[0140] Furthermore, since the wiring 60X passes directly above these two submounts 30 (the second submount 30B in Figure 14A), the area in which the wiring 60 is joined is limited in order to avoid contact with this wiring 60X. As a result, there are wirings 60Y that are close to other wirings 60. If the wirings 60 are too close together when viewed from above, measures such as joining the wirings 60 with a sufficient height difference to avoid the risk of contact become necessary. Therefore, the risk of contact with other components, such as the cover 14, is relatively higher in the light-emitting device 99 than in the light-emitting device 1, negatively impacting the stability of the mounting. Alternatively, it could lead to a larger light-emitting device. In other words, it can be said that the light-emitting device 1 enables the miniaturization of the light-emitting device.

[0141] Furthermore, while the submount 30 to which the wiring 60X is joined (the first submount 30A in Figure 14A) can also be joined to the wiring 60Z that is joined to the adjacent submount 30, the area in which this wiring 60Z can be joined is limited to avoid contact with the wiring 60X. When joining multiple wirings 60 to the upper surface 21A of the semiconductor laser element, which is the light-emitting element 20, it is preferable to join the wirings 60 evenly in the resonator direction (Y direction in the figure) considering the current distribution. Also, the joining position of the wiring 60 closest to the light-emitting surface 22 should not be too far from the light-emitting surface 22. For this reason, in the wiring connection configuration shown in Figure 14B, when viewed from above, the wiring 60Z is close to the wiring 60X, and the light-emitting device 99 has a relatively higher risk of contact than the light-emitting device 1, thus negatively impacting the stability of the mounting. Alternatively, it may lead to a larger light-emitting device. In other words, it can be said that the light-emitting device 1 enables miniaturization of the light-emitting device.

[0142] In the light-emitting device 1, three or more wires 60 are connected to the light-emitting element 20. Although three or more wires 60 may be connected to each light-emitting element 20, it is not necessary for all light-emitting elements 20 to have three or more wires 60 connected to them, due to differences in performance and characteristics among the light-emitting elements 20.

[0143] In the light-emitting device 1, one or more reflective members 40 are arranged in the internal space of the package 10. One or more reflective members 40 are arranged on the base 11. One or more reflective members 40 are arranged on the first upper surface 11A. One or more reflective members 40 are arranged at a position away from the plurality of light-emitting elements 20 in a second direction.

[0144] One or more reflective members 40 reflect light emitted from multiple light-emitting elements 20. One or more light-reflecting surfaces 41B reflect light emitted from the light-emitting surfaces 22 of the multiple light-emitting elements 20. The light reflected by one or more reflective members 40 travels upward. The light reflected by one or more reflective members 40 passes through the cover 14 and is emitted from the top surface 14A.

[0145] In the light-emitting device 1, one or more protective elements 50 are arranged in the internal space of the package 10. One or more protective elements 50 are bonded to the substrate 11 or the submount 30. One or more protective elements 50 are provided to protect the light-emitting element 20.

[0146] In the light-emitting device 1, the optical member 70 is fixed to the package 10. The optical member 70 is positioned so that light emitted from the multiple light-emitting elements 20 irradiates its optical surface. The optical member 70 is bonded to the package 10 via an adhesive. The optical member 70 imparts an optical effect to the light irradiated onto its optical surface, causing the light to be emitted to the outside of the optical member 70. In the illustrated light-emitting device 1, light emitted from the multiple light-emitting elements 20 passes through multiple lens surfaces 71D. The light that has passed through the lens surfaces 71D becomes collimated light and is emitted from the optical member 70.

[0147] <Second Embodiment> A light-emitting device 2 according to the second embodiment will now be described. Figures 1 to 3, 7 to 13, and 15 are drawings illustrating an exemplary embodiment of the light-emitting device 2. Figure 1 is a perspective view of the light-emitting device 2. Figure 2 is a top view of the light-emitting device 2. Figure 3 is a cross-sectional view of the light-emitting device 2 along the line III-III in Figure 2. Figure 7 is a top view of the package 10. Figure 8 is a cross-sectional view of the package 10 along the line VIII-VIII in Figure 7. Figure 9 is a cross-sectional view of the substrate 11 corresponding to the cross-sectional view of the package 10 in Figure 8. Figure 10 is a top view of the substrate 11. Figure 11 is a bottom view of the substrate 11. Figure 12 is a top view showing a submount 30 on which the light-emitting element 20 and the protective element 50 are mounted. Figure 13 is a side view showing the submount 30 on which the light-emitting element 20 and the protective element 50 are mounted. Figure 15 is a top view showing the connection configuration of the wiring 60 in the light-emitting device 2.

[0148] All of the above-described descriptions of the light-emitting device 1 and its components in the first embodiment, excluding any content that can be said to contradict the drawings of the light-emitting device 2 (Figures 1 to 3, 7 to 13, and 15), also apply to the description of the light-emitting device 2. All non-contradictory content will not be repeated here to avoid redundancy.

[0149] (Light-emitting device 2) Light-emitting device 2 is an example of a light-emitting device in which the arrangement positions of the multiple second light-emitting elements 20B and the multiple third light-emitting elements 20C are reversed compared to light-emitting device 1. In light-emitting device 2, when viewed from above, the multiple third light-emitting elements 20C are arranged between the first wiring section 12A1 and the second wiring section 12A2 and the first light-emitting element 20A, and the multiple second light-emitting elements 20B are arranged between the third wiring section 12A3 and the fourth wiring section 12A4 and the first light-emitting element 20A. Although there are differences from light-emitting device 1 regarding the connection method of the wiring 60, even with the arrangement of multiple light-emitting elements 20 in this way, it is possible to realize a high-output light-emitting device with excellent manufacturing stability, similar to light-emitting device 1.

[0150] In the light-emitting device 2, the fourth wiring 60D connects the fourth wiring section 12A4 and the first submount 30A. By connecting the fourth wiring section 12A4 and the first submount 30A with a single wire 60, the number of wires 60 can be reduced.

[0151] <Third Embodiment> A light-emitting module 901 according to a third embodiment will now be described. Figures 1 to 13 and 15 to 18 are drawings illustrating an exemplary form of the light-emitting module 901. Figures 1 to 13 and 15 are diagrams illustrating the light-emitting device provided by the light-emitting module 901. Figure 16 is a perspective view of the light-emitting module 901. Figure 17 is a top view of the light-emitting module 901. Figure 18 is a top view of the wiring board 101.

[0152] The light-emitting module 901 comprises multiple components. These components include a light-emitting device and a wiring board 101. The light-emitting module 901 may also have other components. For example, the light-emitting module 901 may include a temperature measuring element such as a thermistor.

[0153] The light-emitting device included in the light-emitting module 901 can be either the light-emitting device 1 of the first embodiment or the light-emitting device 2 of the second embodiment. Therefore, the descriptions of the first and second embodiments apply to the light-emitting devices 1 and 2 included in the light-emitting module 901.

[0154] (Wiring board 101) The wiring board 101 has a top surface 101A, a bottom surface 101B, and one or more sides 101C. The wiring board 101 has a plate-like shape. In a top view, the outer edge shape of the wiring board 101 is rectangular. This rectangle can be a rectangle with a long side and a short side. In the illustrated package 10, the direction of the short side of this rectangle is the same as the X direction, and the direction of the long side is the same as the Y direction.

[0155] The wiring board 101 includes a heat dissipation section 101D, an electrode section 101E, and an insulating section 101F. The heat dissipation section 101D functions as a heat dissipation path for heat emitted from other components mounted on the wiring board 101. The electrode section 101E is electrically connected to the other components mounted on the wiring board 101.

[0156] The insulating portion 101F insulates the heat dissipation portion 101D from the electrode portion 101E. The insulating portion 101F is provided on the wiring board 101 to insulate the electrical connection between the heat dissipation portion 101D and the electrode portion 101E.

[0157] The wiring board 101 is provided with one or more through holes 101H. These one or more through holes 101H include holes for fixing the wiring board 101 to other members (components). For example, screws are inserted into the through holes 101H to fix the wiring board 101 to other members. These one or more through holes 101H include holes 101H used to determine the position of the wiring board 101 when it is fixed to other members.

[0158] (Light-emitting module 901) In the light-emitting module 901, light-emitting devices 1 and 2 are mounted on the wiring board 101. The light-emitting devices 1 and 2 are mounted on the upper surface 101A of the wiring board 101. The wiring section 12A provided on the lower surface 11B of the light-emitting devices 1 and 2 is joined to the electrode section 101E of the wiring board 101, thereby electrically connecting the light-emitting devices 1 and 2 to the wiring board 101.

[0159] The light-emitting devices 1 and 2 are arranged on the wiring board 101 such that, when viewed from above, the long side of the package 10 aligns with the long side of the wiring board 101. This makes it possible to realize a small light-emitting module 901. By mounting the small light-emitting module 901, for example, a small projector can be realized.

[0160] The light-emitting devices 1 and 2 can be, for example, a single light-emitting device that emits three colors of light: red, green, and blue. For example, the first light-emitting element 20A is a semiconductor laser element that emits blue light, the second light-emitting element 20B is a semiconductor laser element that emits red or green light, and the third light-emitting element 20C is a semiconductor laser element that emits red or green light, which is a different color from that of the second light-emitting element 20B.

[0161] Thus, the light-emitting module 901 can function as an RGB light source on its own, and can be a suitable light source for RGB light source projectors, especially small projectors such as pico projectors.

[0162] In particular, by employing semiconductor laser elements, which generally have higher brightness and output than light-emitting diodes (LEDs), as the light-emitting elements 20, and by increasing the number of light-emitting elements 20 that emit green light and red light compared to the number of light-emitting elements 20 that emit blue light, the light-emitting module 901 achieves a substantial increase in output as an RGB light source. This can greatly contribute to the realization of an ideal pico projector that combines compactness, high output, and low power consumption.

[0163] Such a light-emitting module 901 can be installed in a projector that employs an RGB light source and has a light output [lm] of 350 lm or more. Furthermore, such a light-emitting module 901 makes it possible to realize a projector with a light output [lm] of 350 lm or more and 600 lm or less, using only one light-emitting module 901 as the light source.

[0164] Although various embodiments of the present invention have been described above, the light-emitting devices and light-emitting modules of the present invention are not strictly limited to the light-emitting devices and light-emitting modules of each embodiment. In other words, the present invention is not limited to the external form and structure of the light-emitting devices and light-emitting modules disclosed in each embodiment. The present invention can be applied without requiring all components to be present. For example, if some of the components of the light-emitting device disclosed in the embodiment are not described in the claims, a degree of design freedom for those skilled in the art is permitted for those components, such as substitution, omission, modification of shape, and change of material, and the invention described in the claims is then specified to be applicable.

[0165] Through the information described herein so far, the following technical matters are disclosed: (Section 1) A plurality of light-emitting elements, each comprising a first light-emitting element, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, each having two electrodes, an anode electrode and a cathode electrode, A base having a first wiring section, a second wiring section, a third wiring section, and a fourth wiring section, and a mounting surface provided in a plan view between two of the first, second, third, and fourth wiring sections, Multiple wirings electrically connect the multiple light-emitting elements to the substrate, Equipped with, In the plan view, the plurality of light-emitting elements are arranged on the mounting surface such that the first light-emitting element is located between the plurality of second light-emitting elements and the plurality of third light-emitting elements. The first wiring section is electrically connected to the first light-emitting element on one of the two electrodes, The second wiring section is electrically connected to the plurality of second light-emitting elements on the side of one of the two electrodes. The third wiring section is electrically connected to the plurality of third light-emitting elements on the side of one of the two electrodes. The fourth wiring section is electrically connected to the first light-emitting element, the plurality of second light-emitting elements, and the plurality of third light-emitting elements on the other electrode side of the two electrodes. A first current path is formed between the first wiring section and the fourth wiring section, through which the first light-emitting element passes, but through which none of the plurality of second light-emitting elements and the plurality of third light-emitting elements pass. Between the second wiring section and the fourth wiring section, a second current path is formed through which the plurality of second light-emitting elements pass, but through which none of the first light-emitting elements or the plurality of third light-emitting elements pass. A light-emitting device in which a third current path is formed between the third wiring section and the fourth wiring section, through which the plurality of third light-emitting elements pass, but through which none of the first light-emitting elements or the plurality of second light-emitting elements pass. (Section 2) The light-emitting apparatus according to item 1, wherein the first light-emitting element, the second light-emitting element, and the third light-emitting element emit light with different peak wavelengths from each other. (Section 3) The light-emitting device according to claim 1 or 2, wherein the first light-emitting element, the second light-emitting element, and the third light-emitting element emit light of a different color from each other, which is red, green, and blue. (Section 4) The light-emitting device according to any one of claims 1 to 3, wherein each of the plurality of light-emitting elements is a semiconductor laser element. (Section 5) A light-emitting device according to any one of claims 1 to 4, further comprising a plurality of submounts, each having a wiring layer, including a first submount on which the first light-emitting element is disposed, a plurality of second submounts each on which the second light-emitting element is disposed, and a plurality of third submounts each on which the third light-emitting element is disposed. (Section 6) The light-emitting device according to item 5, wherein in the plan view, the shape of the wiring layer of the first submount and the shape of the wiring layer of the second submount are the same. (Section 7) The aforementioned plurality of wires include: The first wiring section, the first light-emitting element or the first submount, and the first wiring connected to them, The second wiring section, the second light-emitting element or the second submount, and the second wiring connected to them, The third wiring section, the third light-emitting element or the third submount, and the third wiring connected to them, The fourth wiring section and the submount, and the fourth wiring connected to them, A light-emitting device as described in item 5 or 6, including the device described in item 5 or 6. (Section 8) In the aforementioned plan view, the plurality of light-emitting elements are arranged in a line in the first direction, The width of the first light-emitting element in the first direction is smaller than the width of the third light-emitting element in the first direction. The light-emitting apparatus according to item 5, wherein the difference between the width of the first submount in the first direction and the width of the third submount in the first direction is smaller than the difference between the width of the first light-emitting element in the first direction and the width of the third light-emitting element in the first direction. (Section 9) In the aforementioned plan view, the plurality of light-emitting elements are arranged in a line in the first direction, The first wiring section and the second wiring section are arranged side by side in a second direction perpendicular to the first direction. The third wiring section and the fourth wiring section are arranged side by side in the second direction. The light-emitting device according to any one of claims 1 to 8, wherein the plurality of light-emitting elements are arranged between the first wiring section and the second wiring section, which are aligned in the second direction, and the third wiring section and the fourth wiring section, which are aligned in the second direction. (Section 10) The second wiring section is provided at a position away from the first wiring section in the second direction, The light-emitting device according to item 9, wherein the third wiring section is provided at a position away from the fourth wiring section in the second direction. (Section 11) The light-emitting device according to item 10, wherein each of the plurality of light-emitting elements emits light in the second direction. (Section 12) A light-emitting device as described in any one of items 1 to 11, A light-emitting module comprising a wiring board on which the light-emitting device is mounted. (Section 13) The first light-emitting element is a semiconductor laser element that emits blue light, The second light-emitting element is a semiconductor laser element that emits red or green light. The light-emitting module according to claim 12, wherein the third light-emitting element is a semiconductor laser element that emits red or green light, which is a different color from the second light-emitting element. (Section 14) A light-emitting module as described in item 12 or 13, which is installed in a projector that employs an RGB light source and has a light output of 350 lm or more. [Industrial applicability]

[0166] The light-emitting device and light-emitting module described in the embodiment can be used in a projector. In other words, a projector can be considered one application of the present invention. However, the present invention is not limited to this and can be used in various applications such as lighting, exposure, in-vehicle headlights, head-mounted displays, and backlights for other displays. [Explanation of Symbols]

[0167] 1, 2 Light-emitting devices 10 packages 11 Base 11A 1st top surface 11B Bottom side 11C 2nd top surface 11D External surface 11E Inside surface 11th floor step section 11F1 First step section 11F2 Second step section 11G top surface 11H side 11M base 11N frame 12A wiring section 12A1 1st wiring section 12A2 2nd wiring section 12A3 3rd wiring section 12A4 4th wiring section 14 Lid 14A Top 14B Bottom 14C side 20 Light-emitting elements 20A First light-emitting element 20B Second light-emitting element 20C Third Light-Emitting Device 21A Top 21B Bottom side 21C side 22 Light exit surface 30 Submount 30A First Submount 30B Second Submount 30C Third Submount 31A Top 31B Bottom surface 31C side 32A circuit board 32B Upper metal member 32C Lower metal component 33 Wiring layer 40 Reflective material 41A Bottom 41B Light reflective surface 50 protective elements 51A Top 51B Bottom side 51C side 60 Wiring 60A First Wiring 60B 2nd wiring 60C 3rd wiring 60D 4th wiring 70 Optical components (lens components) 71A Top 71B Bottom side 71C side 71D Lens surface (optical surface) 72A Lens section 72B Non-lens section 101 Wiring board 101A Top 101B Bottom surface 101C side 101D Heat dissipation part 101E Electrode part 101F Insulation 101H Through hole 901 Light-emitting module

Claims

1. A plurality of light-emitting elements, each comprising a first light-emitting element, a plurality of second light-emitting elements, and a plurality of third light-emitting elements, each having two electrodes, an anode electrode and a cathode electrode, A base having a first wiring section, a second wiring section, a third wiring section, and a fourth wiring section, and a mounting surface provided in a plan view between two of the first, second, third, and fourth wiring sections, Multiple wirings electrically connect the multiple light-emitting elements to the substrate, Equipped with, In the plan view, the plurality of light-emitting elements are arranged on the mounting surface such that the first light-emitting element is located between the plurality of second light-emitting elements and the plurality of third light-emitting elements. The first wiring section is electrically connected to the first light-emitting element on one of the two electrodes, The second wiring section is electrically connected to the plurality of second light-emitting elements on the side of one of the two electrodes. The third wiring section is electrically connected to the plurality of third light-emitting elements on the side of one of the two electrodes. The fourth wiring section is electrically connected to the first light-emitting element, the plurality of second light-emitting elements, and the plurality of third light-emitting elements on the other electrode side of the two electrodes. Between the first wiring section and the fourth wiring section, a first current path is formed through which the first light-emitting element passes, but through which none of the plurality of second light-emitting elements and the plurality of third light-emitting elements pass. Between the second wiring section and the fourth wiring section, a second current path is formed through which the plurality of second light-emitting elements pass, but through which none of the first light-emitting elements or the plurality of third light-emitting elements pass. A light-emitting device in which a third current path is formed between the third wiring section and the fourth wiring section, through which the plurality of third light-emitting elements pass, but through which none of the first light-emitting elements or the plurality of second light-emitting elements pass.

2. The light-emitting device according to claim 1, wherein the first light-emitting element, the second light-emitting element, and the third light-emitting element emit light with different peak wavelengths from each other.

3. The light-emitting device according to claim 1, wherein the first light-emitting element, the second light-emitting element, and the third light-emitting element emit light of a different color from each other, which is red, green, and blue.

4. The light-emitting device according to claim 1, wherein all of the plurality of light-emitting elements are semiconductor laser elements.

5. The light-emitting device according to claim 1, further comprising a plurality of submounts, each having a wiring layer, including a first submount on which the first light-emitting element is disposed, a plurality of second submounts each on which the second light-emitting element is disposed, and a plurality of third submounts each on which the third light-emitting element is disposed.

6. The light-emitting device according to claim 5, wherein in the plan view, the shape of the wiring layer of the first submount and the shape of the wiring layer of the second submount are the same.

7. The aforementioned plurality of wires include: The first wiring section, the first light-emitting element or the first submount, and the first wiring connected to them, The second wiring section, the second light-emitting element or the second submount, and the second wiring connected to them, The third wiring section, the third light-emitting element or the third submount, and the third wiring connected to them, The fourth wiring section and the submount, and the fourth wiring connected to them, The light-emitting device according to claim 5, including the above.

8. In the aforementioned plan view, the plurality of light-emitting elements are arranged in a line in the first direction. The width of the first light-emitting element in the first direction is smaller than the width of the third light-emitting element in the first direction. The light-emitting device according to claim 5, wherein the difference between the width of the first submount in the first direction and the width of the third submount in the first direction is smaller than the difference between the width of the first light-emitting element in the first direction and the width of the third light-emitting element in the first direction.

9. In the aforementioned plan view, the plurality of light-emitting elements are arranged in a line in the first direction. The first wiring section and the second wiring section are arranged side by side in a second direction perpendicular to the first direction. The third wiring section and the fourth wiring section are arranged side by side in the second direction. The light-emitting device according to claim 1, wherein the plurality of light-emitting elements are arranged between the first wiring section and the second wiring section, which are aligned in the second direction, and the third wiring section and the fourth wiring section, which are aligned in the second direction.

10. The second wiring section is provided at a position away from the first wiring section in the second direction, The light-emitting device according to claim 9, wherein the third wiring section is provided at a position away from the fourth wiring section in the second direction.

11. The light-emitting device according to claim 10, wherein each of the plurality of light-emitting elements emits light in the second direction.

12. A light-emitting device according to any one of claims 1 to 11, A light-emitting module comprising a wiring board on which the light-emitting device is mounted.

13. The first light-emitting element is a semiconductor laser element that emits blue light, The second light-emitting element is a semiconductor laser element that emits red or green light. The light-emitting module according to claim 12, wherein the third light-emitting element is a semiconductor laser element that emits red or green light, which is a different color from the second light-emitting element.

14. The light-emitting module according to claim 13, which is mounted on a projector that employs an RGB light source as a light source and has a light output of 350 lm or more.

Images