Manufacturing method for semiconductor devices

Abstract

This prevents misalignment and omission of electrode terminals during insert molding of semiconductor device cases. [Solution] The semiconductor device case (1) has multiple electrode terminal blocks (20) consisting of a group of electrode terminals (10). In the process of forming the case (1), a connected electrode terminal block (30) is prepared, which is formed by connecting multiple electrode terminal blocks (20) via connecting bars (11). The connected electrode terminal block (30) is placed in a mold, and the case (1) is insert molded by filling the mold with resin. After that, the connected electrode terminal block (30) is separated into individual electrode terminals (10) by cutting off the connecting bars (11) from the connected electrode terminal block (30).

Description

Technical Field

[0006] , ,

[0001] The present disclosure relates to a method for manufacturing a semiconductor device.

Background Art

[0002] For example, insert molding is known as a method for forming a case used for a semiconductor device for power control or the like. In insert molding, an electrode terminal is placed in a mold, and the mold is filled with resin to form a case in which the electrode terminal is inserted. For example, Patent Document 1 below shows a case having a plurality of blocks of electrode terminals (hereinafter referred to as "electrode terminal blocks") as a case formed by insert molding.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Since the operation of placing the electrode terminal in the mold is generally performed manually, there are concerns about displacement or omission of the electrode terminal. In particular, in the formation of a case having a plurality of electrode terminal blocks, since many electrode terminals need to be arranged at narrow intervals, such concerns become greater.

[0005] The present disclosure has been made to solve the above problems, and an object thereof is to prevent displacement and omission of electrode terminals in insert molding of a case having a plurality of electrode terminal blocks.

Means for Solving the Problems

[0006] A method for manufacturing a semiconductor device according to the present disclosure is a method for manufacturing a semiconductor device comprising a case having a plurality of electrode terminal blocks consisting of a group of electrode terminals, comprising: (a) a step of preparing a connected electrode terminal block in which a plurality of the electrode terminal blocks are connected via a connecting bar; (b) a step of insert molding the case by placing the connected electrode terminal block in a mold and filling the mold with resin; and (c) a step after step (b) of dividing the connected electrode terminal block into individual electrode terminals by cutting off the connecting bar from the connected electrode terminal block. [Effects of the Invention]

[0007] According to this disclosure, in insert molding of a case having multiple electrode terminal blocks, misalignment and omission of electrode terminals can be prevented. [Brief explanation of the drawing]

[0008] [Figure 1] This diagram shows the configuration of the case of the semiconductor device according to Embodiment 1. [Figure 2] This diagram shows the configuration of the ladder-shaped connecting electrode terminal according to Embodiment 1. [Figure 3] This diagram shows the configuration of the connecting electrode terminal block according to Embodiment 1. [Figure 4] This figure shows the case immediately after insert molding. [Figure 5] This figure shows the case immediately after insert molding. [Figure 6] This diagram shows the configuration of the ladder-shaped connecting electrode terminal according to Embodiment 2. [Figure 7] This diagram shows the configuration of the connecting electrode terminal block according to Embodiment 2. [Modes for carrying out the invention]

[0009] <Embodiment 1> Figure 1 shows the configuration of the case 1 of the semiconductor device according to Embodiment 1. As shown in Figure 1, the case 1 has multiple electrode terminal blocks 20, each consisting of a group of electrode terminals 10. In this embodiment, an example is shown in which three electrode terminal blocks 20, each consisting of four electrode terminals 10, are arranged inside the case 1. However, the arrangement and number of electrode terminals 10 and electrode terminal blocks 20 are not limited to this example.

[0010] A method for manufacturing a semiconductor device according to Embodiment 1, particularly a method for forming case 1, will be described. First, as shown in Figure 2, a ladder-shaped connected electrode terminal 40 is prepared, in which a plurality of electrode terminals 10 are connected in a ladder-like manner between two connecting bars 11. In other words, in the ladder-shaped connected electrode terminal 40, each end of the plurality of electrode terminals 10 is connected by a connecting bar 11. In the ladder-shaped connected electrode terminal 40 of Figure 2, electrode terminals 10 equivalent to two cases 1 (i.e., six electrode terminal blocks 20) are connected by two connecting bars 11.

[0011] Next, as shown in Figure 3, the ladder-shaped connecting electrode terminal 40 is divided into two, forming two connecting electrode terminal blocks 30, each consisting of one electrode terminal block 20 from case 1 connected via a connecting bar 11. Here, one of the two connecting electrode terminal blocks 30 separated from the ladder-shaped connecting electrode terminal 40 is defined as "connecting electrode terminal block 30a," and the other as "connecting electrode terminal block 30b." As can be seen from Figure 3, the electrode terminal block 20 belonging to connecting electrode terminal block 30a and the electrode terminal block 20 belonging to connecting electrode terminal block 30b are complementaryly arranged in the ladder-shaped connecting electrode terminal 40. This arrangement allows two connecting electrode terminal blocks 30 to be obtained from one ladder-shaped connecting electrode terminal 40. Another advantage is that the electrode terminals 10 included in the ladder-shaped connecting electrode terminal 40 can be used without waste.

[0012] Next, the connecting electrode terminal block 30 is placed in the mold with the connecting bar 11 still attached. Then, the case 1 is insert molded by filling the mold with resin. Figures 4 and 5 show the case 1 immediately after insert molding. Figure 4 shows the case 1 with the connecting electrode terminal block 30a inserted, and Figure 5 shows the case 1 with the connecting electrode terminal block 30b inserted.

[0013] Subsequently, the connecting bar 11 is removed from the connecting electrode terminal block 30 inserted into case 1. This separates the connecting electrode terminal block 30 into individual electrode terminals 10, completing case 1 as shown in Figure 1.

[0014] Although not shown in the diagram, a semiconductor device is manufactured by housing semiconductor elements, substrates on which they are mounted, wiring, etc., inside the completed case 1.

[0015] Thus, in the semiconductor device manufacturing method according to Embodiment 1, the step of placing the electrode terminals 10 in the mold for insert molding the case 1 is performed by placing the connecting electrode terminal block 30, with the connecting bar 11 still attached, in the mold. Since one connecting electrode terminal block 30 is connected to one electrode terminal block 20 for the case 1 via the connecting bar 11, misalignment and omission of the electrode terminals 10 are prevented. Furthermore, it can be expected that the quantity management of the electrode terminals 10 will be made easier.

[0016] In this embodiment, the ladder-shaped connecting electrode terminal 40 includes two sets of electrode terminals 10 for each connecting electrode terminal block 30, so that two connecting electrode terminal blocks 30 can be obtained from one ladder-shaped connecting electrode terminal 40. However, the number of electrode terminals 10 included in the ladder-shaped connecting electrode terminal 40 may be increased so that three or more connecting electrode terminal blocks 30 can be obtained from one ladder-shaped connecting electrode terminal 40.

[0017] In addition, the ladder-shaped connected electrode terminal 40 has a uniform structure in which a plurality of electrode terminals 10 are connected at regular intervals. Therefore, by changing the cutting position of the connecting bar 11, it is also possible to obtain connecting electrode terminal blocks 30 with different numbers and arrangements of electrode terminals 10 from the same ladder-shaped connected electrode terminal 40.

[0018] <Embodiment 2> FIG. 6 is a diagram showing the configuration of the ladder-shaped connected electrode terminal 40 in Embodiment 2, and FIG. 7 is a diagram showing two connected electrode terminal blocks 30 (connected electrode terminal blocks 30a and 30b) separated from the ladder-shaped connected electrode terminal 40 of FIG. 6.

[0019] As shown in FIGS. 6 and 7, in Embodiment 2, a mark 12 for distinguishing individual electrode terminal blocks 20 is provided on the connecting bar 11 of the ladder-shaped connected electrode terminal 40. The marks 12 shown in FIGS. 6 and 7 are in a protruding shape, but the marks 12 can be in any shape.

[0020] By providing the mark 12 on the connecting bar 11 of the ladder-shaped connected electrode terminal 40, the location where the connecting bar 11 should be cut when separating the connected electrode terminal block 30 from the ladder-shaped connected electrode terminal 40 becomes clear, preventing an incorrect cutting position. Thereby, the effect of preventing displacement and omission of the electrode terminals 10 is further improved.

[0021] It should be noted that the respective embodiments can be freely combined, or each embodiment can be appropriately modified or omitted.

[0022] <Supplementary Note> Hereinafter, various aspects of the present disclosure will be summarized and described as supplementary notes.

[0023] (Supplementary Note 1) A method for manufacturing a semiconductor device including a case having a plurality of electrode terminal blocks each composed of a group of electrode terminals, (a) A step of preparing a connected electrode terminal block in which a plurality of the electrode terminal blocks are connected via a connecting bar, (b) A step of insert molding the case by placing the connecting electrode terminal block in the mold and filling the mold with resin, (c) After step (b), a step of dividing the connecting electrode terminal block into individual electrode terminals by cutting off the connecting bar from the connecting electrode terminal block, A method for manufacturing a semiconductor device comprising the same equipment.

[0024] (Note 2) The above step (a) is, A step of preparing a ladder-shaped connecting electrode terminal, wherein at least two electrode terminals of the connecting electrode terminal block are connected in a ladder-like manner between two of the connecting bars, The steps include dividing the ladder-shaped connecting electrode terminal into at least two connecting electrode terminal blocks, including, A method for manufacturing a semiconductor device as described in Appendix 1.

[0025] (Note 3) The electrode terminal block belonging to one of the at least two connecting electrode terminal blocks separated from the ladder-shaped connecting electrode terminal and the electrode terminal block belonging to the other are arranged complementaryly in the ladder-shaped connecting electrode terminal. The method for manufacturing a semiconductor device as described in Appendix 2.

[0026] (Note 4) The connecting bar of the ladder-shaped connecting electrode terminal is provided with a mark that can distinguish each of the electrode terminal blocks. A method for manufacturing a semiconductor device as described in Appendix 2 or Appendix 3. [Explanation of Symbols]

[0027] 1 case, 10 electrode terminals, 11 connecting bars, 12 markers, 20 electrode terminal blocks, 30, 30a, 30b connecting electrode terminal blocks, 40 ladder-shaped connecting electrode terminals.

Claims

1. A method for manufacturing a semiconductor device comprising a case having multiple electrode terminal blocks consisting of a group of electrode terminals, (a) A step of preparing a connected electrode terminal block in which a plurality of the electrode terminal blocks are connected via a connecting bar, (b) A step of insert molding the case by placing the connecting electrode terminal block inside the mold and filling the mold with resin, (c) After step (b), a step of dividing the connecting electrode terminal block into individual electrode terminals by cutting off the connecting bar from the connecting electrode terminal block, A method for manufacturing a semiconductor device comprising the same equipment.

2. The above step (a) is, The process involves preparing a ladder-shaped connecting electrode terminal, in which at least two electrode terminals of the connecting electrode terminal block are connected in a ladder-like manner between two of the connecting bars, The steps include dividing the ladder-shaped connecting electrode terminal into at least two connecting electrode terminal blocks, including, A method for manufacturing a semiconductor device according to claim 1.

3. The electrode terminal block belonging to one of the at least two connecting electrode terminal blocks separated from the ladder-shaped connecting electrode terminal and the electrode terminal block belonging to the other are arranged complementaryly in the ladder-shaped connecting electrode terminal. The method for manufacturing a semiconductor device according to claim 2.

4. The connecting bar of the ladder-shaped connecting electrode terminal is provided with a mark that can distinguish each of the electrode terminal blocks. A method for manufacturing a semiconductor device according to claim 2 or claim 3.

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