Installation history display device, installation history display method, and program

Abstract

To provide a detection device that can offer a display screen that facilitates analysis. [Solution] The mounting history display device 80 includes a first storage unit that stores in association the operation history information of a component mounting line having multiple production devices for mounting components onto a circuit board, inspection information that inspects the mounting status of components, and circuit board information of products produced by mounting components onto a circuit board, and an input / output unit 82 that receives input. The input / output unit 82 displays a first screen 110 containing the input circuit board information, and when the circuit board information displayed on the first screen 110 is selected, it displays a second screen 120 containing operation history information based on the circuit board information, and when the operation history information displayed on the second screen 120 is selected, it displays a third screen 130 containing the operation history information of each of the multiple production devices in the component mounting line.

Description

Technical Field

[0004] , , , , , , , ,

[0006] , , , ,

[0005] , , ,

[0007] , , ,

[0001] The present disclosure relates to an implementation history display device, an implementation history display method, and a program.

Background Art

[0002] In an implementation line including a component mounting device for mounting components on a substrate and an inspection device for inspecting the mounting state of the substrate on which the components are mounted, it is possible to perform cause analysis of defective substrates by checking the history information of the produced substrates and the inspection results.

[0003] For example, Patent Document 1 discloses an appearance inspection device, an image collection device capable of communicating with the appearance inspection device, and an image display device that receives the supply of images from the appearance inspection device and the image collection device and displays these supplied images.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the data obtained from the implementation line is enormous, and for example, there is a demand for providing a display screen that facilitates analysis of defective substrates and the like.

[0006] Therefore, an object of the present disclosure is to provide an implementation history display device and the like that can provide a display screen that facilitates analysis.

Means for Solving the Problems

[0007] An assembly history display device according to one aspect of the present disclosure includes a first storage unit that stores in association the operation history information of a component assembly line having a plurality of production devices for assembling components onto a substrate, inspection information for inspecting the mounting status of the components, and substrate information of products produced by assembling the components onto the substrate; and an input / output unit that receives input. The input / output unit displays a first screen including the input substrate information, and when the substrate information displayed on the first screen is selected, it displays a second screen including the operation history information based on the substrate information, and when the operation history information displayed on the second screen is selected, it displays a third screen including the operation history information of each of the plurality of production devices in the component assembly line.

[0008] Furthermore, a mounting history display method according to one aspect of the present disclosure stores in association the operation history information of a component mounting line having a plurality of production devices for mounting components onto a substrate, inspection information for inspecting the mounting status of the components, and substrate information of products produced with the components mounted on the substrate. It displays a first screen containing the input substrate information, and when the substrate information displayed on the first screen is selected, it displays a second screen containing the operation history information based on the substrate information, and when the operation history information displayed on the second screen is selected, it displays a third screen containing the operation history information of each of the plurality of production devices in the component mounting line.

[0009] Furthermore, a program relating to one aspect of this disclosure is a program for a computer to execute an implementation history display method. [Effects of the Invention]

[0010] According to one aspect of this disclosure, an implementation history display device, etc., can provide a display screen that facilitates analysis. [Brief explanation of the drawing]

[0011] [Figure 1] Figure 1 is a schematic diagram showing a production system according to an embodiment. [Figure 2] Figure 2 is a block diagram showing a production system according to an embodiment. [Figure 3] Figure 3 shows the initial screen of the implementation history display device. [Figure 4] Figure 4 shows the first screen of the implementation history display device. [Figure 5] Figure 5 shows the second screen of the implementation history display device. [Figure 6] Figure 6 shows the third screen of the implementation history display device. [Figure 7] Figure 7 shows the fourth screen of the implementation history display device. [Figure 8] Figure 8 shows the fifth screen of the implementation history display device. [Figure 9] Figure 9 is a flowchart showing an example of the operation of the production system according to the embodiment. [Modes for carrying out the invention]

[0012] The embodiments will be described in detail below with reference to the drawings.

[0013] The embodiments described below are all general or specific examples. The numerical values, shapes, materials, components, arrangement and connection configurations of components, steps, and the order of steps shown in the following embodiments are examples only and are not intended to limit this disclosure. Furthermore, any components in the following embodiments that are not described in an independent claim will be described as optional components.

[0014] Furthermore, each figure is a schematic diagram and not necessarily a strictly accurate representation. Also, the same component is denoted by the same reference numeral in each figure.

[0015] (Embodiment) <Configuration and Function> First, the configuration and functions of the production system 1 according to this embodiment will be described with reference to Figure 1.

[0016] FIG. 1 is a schematic diagram showing a production system 1 according to an embodiment. FIG. 2 is a block diagram showing the production system 1 according to the embodiment.

[0017] As shown in FIG. 1, the production system 1 is a system for producing a product. For example, the product (manufactured product) is a mounted substrate on which components and the like are mounted on a substrate, or a semiconductor product or the like. The substrate is a circuit board for forming an electronic circuit. Mounting components and the like on the substrate means that the solder printed on the substrate and the components mounted on this solder are joined by reflow. Components are a general term for electronic components other than solder.

[0018] The production system 1 includes a component mounting line and a mounting history display system 2.

[0019] First, the component mounting line will be described.

[0020] For example, when the product is a mounted substrate, the component mounting line is a line for mounting components on the substrate. The component mounting line includes a plurality of production apparatuses and can produce a product by sequentially working among the plurality of production apparatuses.

[0021] Each of the plurality of production apparatuses is an apparatus for producing a product. The product is produced through a plurality of processes performed by the plurality of production apparatuses.

[0022] For example, when the product is a mounted substrate, each of the plurality of production apparatuses is a printing apparatus 10, a printing inspection apparatus 20, a component mounting apparatus 30, a mounting inspection apparatus 40, a reflow furnace 50, and a reflow inspection apparatus 60.

[0023] The printing apparatus 10 is an apparatus that prints paste-like cream solder on the electrodes formed on the substrate through a mask. Note that the printing apparatus 10 prints cream solder on the substrate, but is not limited to this method, and other known methods may be used to print solder on the substrate.

[0024] The printing device 10 includes a printing work unit 11, a printing control unit 12, a printing storage unit 13, a printing notification unit 14, a printing display unit 15, and a printing communication unit 16.

[0025] The printing unit 11, under the control of the printing control unit 12, prints solder onto the surface of the substrate. Specifically, the printing unit 11, under the control of the printing control unit 12, brings a mask having openings corresponding to the solder paste pattern into contact with the substrate, supplies solder paste onto the mask, and slides a squeegee across the mask to perform screen printing, thereby transferring the solder paste pattern onto the substrate.

[0026] The printing control unit 12 controls the printing work unit 11 based on control data for printing solder paste, thereby performing tasks such as holding the substrate and mask and sliding the squeegee. The printing control unit 12 can also control the printing speed of the solder paste onto the substrate based on the control data.

[0027] The print control unit 12 stores the print log, including the board ID of the board that was printed and the printing conditions, in the print storage unit 13.

[0028] The printing memory unit 13 stores control data for printing solder paste onto the surface of the substrate. The printing memory unit 13 also stores a printer log, including the substrate ID of the substrate that was printed, printing conditions, etc. The printing memory unit 13 is, for example, a storage medium such as a semiconductor memory or a hard disk drive.

[0029] The printing notification unit 14 notifies of any malfunctions occurring in the printing work unit 11. The printing notification unit 14 also notifies of malfunctions related to expiration dates, such as when a soldering iron, circuit board, or component has exceeded its expiration date or is nearing its expiration date. The printing notification unit 14 may also notify other production equipment of such malfunctions related to expiration dates.

[0030] In this embodiment, notification not only means notifying the surroundings through sound, light, images, etc., but also includes notifying other devices of malfunctions and approaching expiration dates. Therefore, notifications in other production devices have the same meaning.

[0031] The print display unit 15 displays control data, printer logs, etc., stored in the print storage unit 13, and also displays operation screens, input screens, etc., for operating the printing device 10. The print display unit 15 is a display device such as a liquid crystal panel.

[0032] The printing communication unit 16 is a communication module that communicates with other production equipment and the mounting history display system 2. Specifically, the printing communication unit 16 transmits control data and printing machine logs to other production equipment and the mounting history display system 2.

[0033] The printing inspection device 20 is a device that inspects the appearance of solder printed on a circuit board.

[0034] The print inspection device 20 includes a print inspection work unit 21, a print inspection control unit 22, a print inspection storage unit 23, a print inspection notification unit 24, a print inspection display unit 25, and a print inspection communication unit 26.

[0035] The printing inspection unit 21 inspects the solder printed on the substrate under the control of the printing inspection control unit 22. Specifically, the printing inspection unit 21 recognizes the solder printed on the substrate and inspects the appearance of the solder by processing at least one of the two-dimensional or three-dimensional image data acquired via imaging by the inspection camera.

[0036] The printing inspection control unit 22, based on control data, instructs the printing inspection work unit 21 to inspect the appearance of the solder printed on the substrate and analyzes the appearance of the solder printed on the substrate. Specifically, the printing inspection control unit 22 analyzes the presence or absence of solder misalignment, solder area, solder volume, solder height, solder shape, etc., when viewed from above the substrate, and also analyzes the presence or absence of bridge defects connecting two electrodes, unfilled defects, solder streaking defects, solder gouge defects, solder bleeding defects, foreign matter adhesion, etc. Based on this, the printing inspection control unit 22 stores an inspection result log and inspection image showing the analyzed appearance of the solder printed on the substrate in the printing inspection storage unit 23. Hereafter, the inspection result log showing the appearance of the solder may be referred to as the solder inspection result log.

[0037] Furthermore, the printing inspection control unit 22 may, via the printing inspection communication unit 26, create correction information based on the abnormality in the solder inspection result and feed it back to the printing device 10 in order to resolve the malfunction in the control data of the printing device 10. As a result, the printing device 10 may rewrite its control data based on the correction information. Therefore, the printing device 10 can identify the location of the malfunction and perform appropriate feedback control before the malfunction leads to a defective circuit board, thereby improving the yield of the production system 1.

[0038] The print inspection storage unit 23 stores control data for inspecting the solder printed on the circuit board. The print inspection storage unit 23 also stores inspection result logs and inspection images of the solder printed on the circuit board. The print inspection storage unit 23 is, for example, a storage medium such as a semiconductor memory or a hard disk drive.

[0039] The printing inspection notification unit 24 notifies information regarding abnormalities if there are abnormalities in the solder inspection result log and inspection image. In addition, the printing inspection notification unit 24 notifies information indicating that there are defects such as the solder being past its expiration date, or that the solder is nearing its expiration date, based on the solder inspection result log, solder inspection image, and solder expiration date.

[0040] The print inspection display unit 25 displays control data, solder inspection result logs, and inspection images stored in the print inspection storage unit 23, as well as operation screens, input screens, etc., for operating the print inspection device 20. The print inspection display unit 25 is a display device such as a liquid crystal panel.

[0041] The print inspection communication unit 26 is a communication module that communicates with other production equipment and the mounting history display system 2. Specifically, the print inspection communication unit 26 transmits control data, solder inspection result logs, and inspection images to other production equipment and the mounting history display system 2.

[0042] The component mounting device 30 is a device that attaches components, which are held in place by a nozzle on a head, onto solder printed on a circuit board.

[0043] The component mounting device 30 includes a mounting work unit 31, a mounting control unit 32, a mounting storage unit 33, a mounting notification unit 34, a mounting display unit 35, and a mounting communication unit 36.

[0044] The mounting unit 31, under the control of the mounting control unit 32, picks up and holds components from the component supply unit using a nozzle, the head transports the components to the mounting position on the substrate, and the nozzle mounts the components onto the substrate. The mounting unit 31 repeats this process for each component. The component supply unit is equipped with, for example, multiple tape feeders that can be detachably attached, and various components are supplied by the tape feeders. A tape feeder is a device that sequentially supplies components, which are held in a tape-like arrangement, to the component supply unit.

[0045] The mounting control unit 32 controls the movement of the nozzles on the head by controlling the mounting work unit 31 based on control data for mounting components. Specifically, the mounting control unit 32 controls the mounting work unit 31 to move the head to the component supply unit where each component is supplied, and then moves the head to the mounting position on the substrate while the component attached to the head is being held in place. The mounting control unit 32 can also control the speed at which components are mounted on the substrate.

[0046] The mounting control unit 32 stores mounting machine logs, including the component ID of the mounted component, the board ID of the board on which the component is mounted, and mounting conditions, in the mounting storage unit 33.

[0047] The mounting memory unit 33 stores component information and control data for mounting components onto the circuit board. The mounting memory unit 33 also stores mounting machine logs, including component IDs of mounted components, circuit board IDs of the circuit boards on which the components are mounted, and mounting conditions. The mounting memory unit 33 is, for example, a storage medium such as a semiconductor memory or a hard disk drive.

[0048] The mounting notification unit 34 notifies the mounting work unit 31 of any defects that occur. The mounting notification unit 34 also notifies information indicating that there are defects, such as parts exceeding their expiration date, based on the mounting results and the expiration date of the parts. The mounting notification unit 34 may also notify other production equipment of such defects.

[0049] The mounting display unit 35 displays control data stored in the mounting storage unit 33, displays mounting machine logs including the component ID of the mounted component, the board ID of the board on which the component is mounted, and mounting conditions, and displays operation screens, input screens, etc., for operating the component mounting device 30. The mounting display unit 35 is a display device such as a liquid crystal panel.

[0050] The mounting communication unit 36 ​​is a communication module that communicates with other production equipment and the mounting history display system 2. Specifically, the mounting communication unit 36 ​​transmits control data and mounting machine logs to other production equipment and the mounting history display system 2.

[0051] The mounting inspection device 40 is a device that inspects the external appearance of components mounted on a circuit board.

[0052] The mounting inspection device 40 includes a mounting inspection work unit 41, a mounting inspection control unit 42, a mounting inspection storage unit 43, a mounting inspection notification unit 44, a mounting inspection display unit 45, and a mounting inspection communication unit 46.

[0053] The mounting inspection unit 41 inspects components mounted on the substrate under the control of the mounting inspection control unit 42. Specifically, the mounting inspection unit 41 recognizes components mounted on the substrate and inspects their appearance by processing at least one of the two-dimensional or three-dimensional image data acquired via imaging by an inspection camera.

[0054] The mounting inspection control unit 42, based on control data, instructs the mounting inspection work unit 41 to inspect the external appearance of the components mounted on the circuit board and analyzes the external appearance of the components mounted on the circuit board. Specifically, the mounting inspection control unit 42 analyzes the amount of misalignment of the components when viewed from above the circuit board, the amount of rise of the components, and the presence or absence of defects such as inversion of the front and back of the components, missing components, bridge defects connecting two electrodes, adhesion of foreign matter, incorrect mounting of components, duplicate mounting of components, and deformation of component leads. As a result, the mounting inspection control unit 42 stores an inspection result log and inspection images showing the external appearance of the components mounted on the circuit board in the mounting inspection storage unit 43.

[0055] Furthermore, the mounting inspection control unit 42 may, via the mounting inspection communication unit 46, create correction information based on the abnormality in the visual inspection results and feed it back to the component mounting device 30 in order to resolve the malfunction in the control data of the component mounting device 30. As a result, the component mounting device 30 may rewrite its control data based on the correction information. Therefore, the component mounting device 30 can identify the location of the malfunction and perform appropriate feedback control before the malfunction leads to a defective board, thereby improving the yield of the production system 1.

[0056] The mounting inspection storage unit 43 stores control data for inspecting components mounted on the circuit board. The mounting inspection storage unit 43 also stores inspection result logs and inspection images of the components mounted on the circuit board. The mounting inspection storage unit 43 is, for example, a storage medium such as a semiconductor memory or a hard disk drive.

[0057] The mounting inspection notification unit 44 notifies information about any abnormalities in the component inspection result log and inspection image. The mounting inspection notification unit 44 also notifies information indicating defects such as mounting defects or components that have exceeded their expiration date, or notifies that the solder is nearing its expiration date, based on the component inspection result log, component inspection image, and component expiration date.

[0058] The mounting inspection display unit 45 displays control data, component inspection result logs, and inspection images stored in the mounting inspection storage unit 43, as well as displaying operation screens, input screens, etc., for operating the mounting inspection device 40. The mounting inspection display unit 45 is a display device such as a liquid crystal panel.

[0059] The mounting inspection communication unit 46 is a communication module that communicates with other production equipment and the mounting history display system 2. Specifically, the mounting inspection communication unit 46 transmits control data, component inspection result logs, and inspection images to other production equipment and the mounting history display system 2.

[0060] The reflow oven 50 is a device that, when parts such as components are brought in and mounted on a circuit board, heats and melts the printed solder and the solder balls of the components by reflow, thereby joining the components and the circuit board with solder.

[0061] The reflow oven 50 includes a heating work unit 51, a heating control unit 52, a heating memory unit 53, a heating notification unit 54, a heating display unit 55, and a heating communication unit 56.

[0062] The heating unit 51, under the control of the heating control unit 52, heats the components and the substrate on which the components are mounted, and melts the solder printed on the surface of the substrate.

[0063] The heating control unit 52 controls the heating work unit 51 based on the control data, thereby performing appropriate temperature control to ensure that the solder melts when heating the assembled product.

[0064] The heating control unit 52 stores heating log data, including the process from heating to soldering the component to the substrate, in the heating memory unit 53.

[0065] The heating memory unit 53 stores control data for heating the assembled product. The heating memory unit 53 also stores heating machine logs, etc. The mounting memory unit 33 is, for example, a storage medium such as a semiconductor memory or a hard disk drive.

[0066] The heating notification unit 54 notifies information indicating a malfunction such as a transport failure or a substrate dropping, based on the transport status of the substrate. The heating notification unit 54 may also notify other production equipment of such malfunctions related to the expiration date. The components include a substrate, solder, and at least one of non-solder components. In this embodiment, the components are collectively referred to as including solder, non-solder components, and substrates.

[0067] The heating display unit 55 displays control data, heating machine logs, etc., stored in the heating memory unit 53, and also displays operation screens, input screens, etc., for operating the reflow oven 50. The heating display unit 55 is a display device such as a liquid crystal panel.

[0068] The heating communication unit 56 is a communication module that communicates with other production equipment and the mounting history display system 2. Specifically, the heating communication unit 56 transmits control data and heating machine logs to other production equipment and the mounting history display system 2.

[0069] The reflow inspection device 60 is a device that inspects defects in the bonding state between components and substrates using X-rays, ultrasound, etc. In the case of components, the solder joint is hidden by the substrate and the component, so the condition of the solder joint cannot be inspected by mounting inspection devices 40, etc. The reflow inspection device 60 can complement this weakness of visual inspection.

[0070] The reflow inspection apparatus 60 includes a heating inspection work unit 61, a heating inspection control unit 62, a heating inspection storage unit 63, a heating inspection notification unit 64, a heating inspection display unit 65, and a heating inspection communication unit 66.

[0071] The heating inspection unit 61 inspects the bonding state between the component and the substrate under the control of the heating inspection control unit 62. Specifically, the heating inspection unit 61, under the control of the heating inspection control unit 62, irradiates a product in which the component and the substrate are joined with solder with reflow, processes the reflow image captured from the transmitted reflow, and inspects the solder bonding state between the component and the substrate.

[0072] The heating inspection control unit 62 instructs the heating inspection work unit 61 to inspect the solder joint state based on control data and analyzes the state of the components bonded to the substrate. For example, the heating inspection control unit 62 analyzes the amount of solder in the solder between the component and the substrate, and analyzes for the presence or absence of void defects, non-wetting defects, etc. As a result, the heating inspection control unit 62 stores the inspection result log and inspection image of the solder joint state of the solder joint between the substrate and the component in the heating inspection storage unit 63.

[0073] Furthermore, the heating inspection control unit 62 may feed back the inspection result log and inspection image of the solder joint state between the substrate and the component to the component mounting device 30 and the printing device 10 via the heating inspection communication unit 66. This allows the component mounting device 30 and the printing device 10 to rewrite the control data based on the correction information. As a result, the component mounting device 30 and the printing device 10 can identify the location of the defect and perform appropriate feedback control before the product becomes defective after reflow soldering, thereby improving the yield of the production system 1.

[0074] The heating inspection storage unit 63 stores control data for inspecting the solder joint state between the component and the substrate. The heating inspection storage unit 63 also stores inspection result logs and inspection images of the solder joint state between the component and the substrate. The heating inspection storage unit 63 is, for example, a storage medium such as a semiconductor memory or a hard disk drive.

[0075] The heating inspection notification unit 64 notifies information regarding any abnormalities in the inspection result log and inspection image of the solder joint status between the component and the circuit board. Furthermore, based on the inspection result log, inspection image, and the expiration date of the component, the heating inspection notification unit 64 also notifies information indicating defects such as mounting defects or the component being past its expiration date, or notifies that the component's expiration date is approaching.

[0076] The heating inspection display unit 65 displays control data stored in the heating inspection storage unit 63, inspection result logs of the solder joint status between components and the substrate, and inspection images, as well as operation screens, input screens, etc., for operating the reflow inspection device 60. The heating inspection display unit 65 is a display device such as a liquid crystal panel.

[0077] The heating inspection communication unit 66 is a communication module that communicates with other production equipment and the mounting history display system 2. Specifically, the heating inspection communication unit 66 transmits control data, inspection result logs of the solder joint status between components and the substrate, and inspection images to other production equipment and the mounting history display system 2.

[0078] Next, we will describe the implementation history display system 2.

[0079] The implementation history display system 2 comprises a management server 71, an inspection server 72, and an implementation history display device 80. The implementation history display device 80 may have the management server 71, or it may have both the management server 71 and the inspection server 72. In this embodiment, an example is given where the management server 71, the inspection server 72, and the implementation history display device 80 are configured separately.

[0080] The management server 71 is a data server that is communicatively connected to multiple production machines that constitute the component mounting line described above, and manages various data by acquiring various data related to product production from each of the multiple production machines. The management server 71 stores the acquired data in the storage unit 71a. The management server 71 is an example of the first storage unit.

[0081] The various data include circuit board information, quality information, and inspection information.

[0082] Circuit board information refers to information about the circuit board in an assembly or product. This information includes the positional information of components placed on the circuit board and component information related to the component mounting coordinates.

[0083] Quality information refers to information indicating the quality of the circuit board, components, and solder at the time the components are mounted on the circuit board and the product is manufactured. Quality information is generated by the processing unit of the management server 71 based on inspection information.

[0084] Inspection information refers to information obtained by inspecting the mounting status of components on a circuit board. This information includes solder inspection result logs, solder inspection images, component inspection result logs, component inspection images, solder joint inspection result logs, and solder joint inspection images. Inspection information may be included and displayed in the operational history information.

[0085] The management server 71 stores inspection information, board information, and operation history information in association with each other. The operation history information is information that shows the operation history of a component mounting line that has multiple production machines for mounting components onto boards. The operation history information of the management server 71 may include printer logs, mounting machine logs, heating machine logs, etc.

[0086] The inspection server 72 is a data server that manages inspection images by acquiring inspection images associated with inspection result logs from these inspection devices. It is connected to the printing inspection device 20, the mounting inspection device 40, and the reflow inspection device 60, which are among the multiple production devices that make up the component mounting line described above. The inspection server 72 stores each acquired inspection image in the storage unit 72a. The inspection server 72 is an example of a second storage unit.

[0087] Inspection images are images showing the results of inspecting the mounting status of components on a circuit board. These include solder inspection images, images of components mounted on the board, and images of the solder joints between components and the board. Inspection images may be displayed as part of the operational history information.

[0088] The solder inspection images include images indicating that the solder printing condition was judged to be poor during inspection, and images indicating that the solder printing condition was judged to be good during inspection.

[0089] The inspection images of components mounted on the circuit board include images indicating that the component mounting condition was deemed poor during inspection, and images indicating that the component mounting condition was deemed good during inspection.

[0090] The inspection images of the solder joints between components and the circuit board include images indicating that the component mounting condition was deemed poor during inspection, and images indicating that the component mounting condition was deemed good during inspection.

[0091] The mounting history display device 80 is a computer that manages information by being communicatively connected to the management server 71 and the inspection server 72, and by acquiring board information, quality information, and inspection information from the management server 71, and inspection images from the inspection server 72.

[0092] The implementation history display device 80 comprises an information processing unit 81, an input / output unit 82, a history storage unit 83, and a history communication unit 84.

[0093] The information processing unit 81 can acquire board information, quality information, and inspection information from the management server 71 via the history communication unit 84, and inspection images from the inspection server 72, and store and manage the acquired information in the storage unit. The information processing unit 81 may also acquire this information from each of the multiple production devices via the history communication unit 84.

[0094] Furthermore, the information processing unit 81 can output each of these pieces of information managed in the storage unit from the input / output unit 82 in response to a request from the user.

[0095] The input / output unit 82 can receive input from the user. The input / output unit 82 is, for example, a touch panel display in which a touch panel and a display unit such as a monitor are integrated. Alternatively, the input / output unit 82 may consist of an input unit such as a keyboard and a display unit such as a monitor.

[0096] The history storage unit 83 stores UI (User Interface) screens for displaying various information, board information, quality information, inspection information, inspection images, etc. The UI screen is an operation screen or input screen where the input / output unit 82 receives input (instructions) from the user, an information output screen for displaying information corresponding to the input (instructions), etc. The history storage unit 83 is, for example, a storage medium such as semiconductor memory or a hard disk drive.

[0097] <Example Display> Next, an example of the display of the implementation history display system 2 according to this embodiment will be described with reference to Figures 3 to 8.

[0098] Figure 3 shows the initial screen 100 of the mounting history display device 80. Figure 4 shows the first screen 110 of the mounting history display device 80. Figure 5 shows the second screen 120 of the mounting history display device 80. Figure 6 shows the third screen 130 of the mounting history display device 80. Figure 7 shows the fourth screen 140 of the mounting history display device 80. Figure 8 shows the fifth screen 150 of the mounting history display device 80.

[0099] First, as shown in Figure 3, the initial screen 100 displays the company name "ABC Corporation", the system name "Information Visualization System", the current date and time, an arrow back button, the selection items "Current Data" and "Archive Data", and the name "USER". The initial screen 100 also displays a button to select saved test information, "MO2: Comprehensive Test Results List", under "Current Data", a file search button to search for test information, "AO1: Archive File Search", and a file search button to search for test information, "AO2: Comprehensive Test Results List" under "Archive Data".

[0100] The user inputs data to the input / output unit 82 on the initial screen 100. In this embodiment, the user inputs data to the input / output unit 82 by selecting the "MO2: Comprehensive Inspection Results List" button under "Current Data" on the initial screen 100.

[0101] As a result, the input / output unit 82 displays a first screen 110 containing board information, as shown in Figure 4.

[0102] The first screen 110 displays a screen for entering search criteria. Specifically, the first screen 110 displays board information, a button to select the "mounting side," a button to select the "line" which is the component mounting line, and an item to set the "manufacturing date." The board information on the first screen 110 includes a button to select the board name which indicates the part number of the "board," and a button to select the part number of the "ASSY" which indicates the recipe of the integrated line management system.

[0103] Furthermore, the first screen 110 displays a "Execute Search" button 112 for executing the search based on the entered search criteria, a "View Details" button for checking the details of the search results, an "Output" button for outputting the search results in a specified file extension such as CSV, and the name "USER".

[0104] Furthermore, the first screen 110 displays the company name "ABC Corporation," the system name "Information Visualization System," the current date and time, and an arrow back button, similar to the initial screen 100.

[0105] The user inputs information to the input / output unit 82 on the first screen 110. In this embodiment, the user inputs information to the input / output unit 82 by selecting buttons such as the desired "board," "ASSY," "mounting side," "line," and "manufacturing date" on the first screen 110 and making various settings. Then, the user inputs information to the input / output unit 82 by selecting the "execute search" button 112.

[0106] As a result, when the board information displayed on the first screen 110 is selected, the input / output unit 82 displays a second screen 120 containing operation history information, as shown in Figure 5.

[0107] The second screen 120 displays the search results set on the first screen 110. Specifically, the second screen 120 displays board information, selection buttons for the "mounting line" included in the component mounting line, selection buttons for the "inspection line" included in the component mounting line, selection buttons for the "X-ray inspection machine" included in the component mounting line, and an item for setting the "manufacturing date and time". The board information on the second screen 120 includes selection buttons for the board name indicating the part number of the "board", and selection buttons for the part number of the "ASSY" indicating the recipe of the integrated line management system.

[0108] Furthermore, the second screen 120 displays detailed search results 121 for multiple production devices. In Figure 5, multiple lists are displayed as detailed search results 121. Specifically, the second screen 120 displays a list of items including the "board name" set by the "board" selection button, the "ASSY part number" indicating the recipe of the integrated line management system, the "PCB ID" which is the unique serial number of the board, the "mounting side" of the board on which components are mounted, the "mounting line" indicating the printing device 10, the "printing judgment" shown in the solder inspection result log, the "mounting inspection judgment" shown in the component inspection result log, the "mounting line departure date and time" when the assembled product was discharged from the component mounting device 30, the "inspection line" indicating the mounting inspection device 40, the "AOI judgment" which is the result of the visual inspection shown in the component inspection result log, the "visual inspection judgment" which is the result of the visual inspection, the "inspection line departure date and time" when the assembled product was discharged from the mounting inspection device 40, the "X-ray inspection machine" which is an example of a reflow inspection device 60, the "X-ray inspection judgment" shown in the inspection result log of the solder joint state that joins the board and components, and the "X-ray inspection machine departure date and time" when the assembled product was discharged from the X-ray inspection machine. The "AOI judgment" includes the visual inspection results shown in the inspection result log for parts judged as good, the visual inspection results shown in the inspection result log for parts judged as defective, and the results of false reports (visual inspection results that were incorrectly judged as defective). In this way, the input / output unit 82 displays the mounting defects and false reports separately on the second screen 120.

[0109] The "board name" and "assembly part number" are included in the board information. The "PCB ID" may also be included in the board information. The "mounting side", "mounting line", "printing judgment", "mounting inspection judgment", "mounting line removal date and time", "inspection line", "AOI judgment", "visual inspection judgment", "inspection line removal date and time", "X-ray inspection machine", "X-ray inspection judgment", and "X-ray inspection machine removal date and time" are included in the operation history information.

[0110] Furthermore, the second screen 120 displays right and left arrow buttons, a "Execute Search" button 122 for executing the search based on the entered search criteria, a "View Details" button for checking the details of the search results, an "Output" button for outputting the search results in a specified file extension such as CSV, and the name "USER".

[0111] Additionally, the second screen 120 displays the company name "ABC Corporation," the system name "Information Visualization System," the current date and time, and an arrow back button, similar to the first screen 110.

[0112] The user inputs information to the input / output unit 82 on the second screen 120. In this embodiment, the user inputs information to the input / output unit 82 by selecting buttons such as the desired "board," "ASSY," "mounting line," "inspection line," "X-ray inspection machine," and "manufacturing date and time" on the second screen 120 and making various settings. The user then inputs information to the input / output unit 82 by selecting one list R1 from the list of detailed search results 121 for multiple production devices displayed on the second screen 120 and selecting the "execute search" button 122.

[0113] As a result, when the input / output unit 82 selects "Circuit Board," "Assembly," "Mounting Line," "Inspection Line," "X-ray Inspection Machine," "Manufacturing Date and Time," or the relevant list including operational history information in the detailed search results 121, it displays a third screen 130, as shown in Figure 6, which includes operational history information for each of the multiple production devices on the component mounting line.

[0114] The third screen 130 displays the search results set on the second screen 120. Specifically, the third screen 130 displays selection buttons for "Board," "ASSY," "PCB ID" (the unique serial number of the board), "Pattern," "Circuit Number," and "Mounting Side," as well as a selection button for "Lane" (for mounting components on the board), and selection items for displaying the desired search results, such as "SPI," "Pre-Reflow AOI," and "Post-Reflow AOI," and an "OK Exclude" button which includes "All" to select all of these. The "SPI" selection button indicates that the inspection result log of the printing inspection device 20 will be displayed. The "Pre-Reflow AOI" selection button indicates that the inspection result log of the appearance of the assembly before reflow, for example, the inspection result log of the components, will be displayed. The "Post-Reflow AOI" selection button indicates that the inspection result log of the solder joint state of the solder joining the board and components after reflow will be displayed. "Board," "ASSY," and "Mounting Side" on the third screen 130 are the same as described above. "PCB ID," "Pattern," and "Circuit Number" may be included in the board information.

[0115] Furthermore, the third screen 130 displays detailed search results for multiple production devices. In Figure 6, multiple lists 131 are displayed as detailed search results. In other words, the third screen 130 contains operational history information for each of the multiple production devices, including error details corresponding to location information and component information, as multiple lists 131. The location information indicates the "patterns" on the front and back of the circuit board, and the component information indicates the circuit information.

[0116] Specifically, the third screen 130 lists the following: "Printing machine" corresponding to the printing device 10, "SPI" corresponding to the printing inspection device 20, "Mounting machine" corresponding to the component mounting device 30, "AOI (pre-reflow)" corresponding to the mounting inspection device 40, "Reflow" corresponding to the reflow oven 50, "AOI (post-reflow)" and "X-ray inspection" corresponding to the reflow inspection device 60.

[0117] The "printing press" displays information such as "print date and time," "printing direction," "solder," "mask," "front speed," "front printing pressure," "rear speed," "rear printing pressure," "lifter speed," and "clearance."

[0118] The "SPI" section displays information such as "Initial Date and Time," "Initial Result," "Last Date and Time," "Last Result," "Pattern" indicating the solder position on the board, "Circuit Number" indicating component information, and "NG" and "WN" included in the operation history information. "NG" indicates a component judged as defective, and "WN" indicates a component judged as good. In other words, the operation history information includes information indicating component mounting defects on the board on the component mounting line. To put it another way, the operation history information displayed on the third screen 130 includes mounting defects. Naturally, the operation history information also includes information indicating good component mounting on the board on the component mounting line.

[0119] The "mounting machine" displays information such as the "mounting date and time," "number of errors," "pattern" indicating the position of components on the circuit board, "circuit number" indicating component information, and "error details" from the production equipment included in the operating history information.

[0120] The "AOI (Before Reflow)" section displays information such as "Initial Date and Time," "Initial Result," "Last Date and Time," "Last Result," "Pattern" indicating the location of solder and components in the assembly, "Circuit Number" indicating component information, and "NG" and "WN" included in the operation history information.

[0121] Under "Reflow," the following are displayed: "Incoming date and time," "Outgoing date and time," "Passage speed," "Zone," "Category," "Set temperature," and "Measured temperature."

[0122] The "AOI (After Reflow)" section displays "Initial Date and Time," "Initial Result," "Last Date and Time," "Last Result," "Pattern" indicating the location of solder and components in the assembly, "Circuit Number" indicating component information, and "NG" and "WN" included in the operation history information. The "Pattern," "Circuit Number," "NG," and "WN" sections display multiple location information, multiple component information, and multiple operation history information.

[0123] The "X-ray inspection" section displays information such as "Initial Date and Time," "Initial Result," "Last Date and Time," "Last Result," "Pattern" indicating the location of solder and components in the assembly, "Circuit Number" indicating component information, and "NG" and "WN" included in the operation history information.

[0124] Furthermore, the third screen 130 displays right and left arrow buttons, a "Display Image" button to show the desired image, a "Execute Search" button to execute the search using the entered search criteria, and the name "USER".

[0125] Additionally, the third screen (130) displays an item name called "Detailed Confirmation," the current date and time, and an arrow-shaped back button.

[0126] The user inputs information to the input / output unit 82 on the third screen 130. In this embodiment, the user inputs information to the input / output unit 82 by selecting desired buttons such as "Mounting Surface" and "OK Exclude" on the third screen 130 and making various settings. Then, the user selects one list from the list of detailed search results for multiple production devices displayed on the third screen 130 and selects the "Execute Search" button to input information to the input / output unit 82.

[0127] As a result, when the board information displayed on the third screen 130 is selected, the input / output unit 82 displays a fourth screen 140, as shown in Figure 7, for each of the multiple production devices, which includes operation history information including error details corresponding to location information or component information.

[0128] The fourth screen, 140, displays the search results set on the third screen, 130. Specifically, the fourth screen, 140, displays selection buttons for "Board," "ASSY," "PCB ID" (the unique serial number of the board), "Pattern" of the board, "Circuit Number" of the board, "Mounting Side," "Lane" for mounting components on the board, and selection items for displaying the desired search results, such as "SPI," "Pre-reflow AOI," "Post-reflow AOI," "Visual Inspection," and "X-ray Inspection," as well as an "OK Exclude" button which includes "All" to select all of these. "Board," "ASSY," "Mounting Side," "SPI," "Pre-reflow AOI," "Post-reflow AOI," "All," and "OK Exclude" are the same as described above.

[0129] Furthermore, the fourth screen 140 displays detailed search results 141 for multiple production devices. In Figure 7, multiple lists are displayed as detailed search results 141. Specifically, the fourth screen 140 shows the following lists: "Printing machine" corresponding to the printing device 10, "SPI" corresponding to the printing inspection device 20, "Mounting machine" corresponding to the component mounting device 30, "AOI (before reflow)" corresponding to the mounting inspection device 40, "Reflow" corresponding to the reflow oven 50, "AOI (after reflow)" corresponding to the reflow inspection device 60, "Visual inspection", and "X-ray inspection". These multiple lists include image buttons to display good images and defective images. In other words, the input / output unit 82 includes an image button to display defective images.

[0130] The "printing press" displays information such as "print date and time," "delivery date and time," "delivery date and time," "printing direction," "solder," "mask," "front speed," "front printing pressure," "rear speed," "rear printing pressure," "lifter speed," and "clearance."

[0131] The "SPI" section displays information such as "Initial Date and Time," "Initial Result," "Initial Delivery," "Initial Delivery," "Final Date and Time," "Final Result," "Final Delivery," "Final Delivery," "Final Delivery," "Pattern" indicating the solder position on the board, "Circuit Number" indicating component information, "NG" and "WN" included in the operation history information, "ID," and "NG / WN Reason." "NG" indicates a component judged as defective, and "WN" indicates a component judged as good. In other words, the operation history information includes information indicating component mounting defects on the board on the component mounting line. To put it another way, the operation history information displayed on the fourth screen 140 includes mounting defects. Naturally, the operation history information also includes information indicating good component mounting on the board on the component mounting line.

[0132] The "mounting machine" displays information such as the "equipment name," "mounting date and time," "pattern" indicating the position of components on the circuit board, "circuit number" indicating component information, and "errors," "machine number," and "error details" included in the operation history information.

[0133] The "AOI (Before Reflow)" section displays information such as "Initial Date and Time," "Initial Result," "Initial Delivery," "Initial Delivery," "Final Date and Time," "Final Result," "Final Delivery," "Final Delivery," "Pattern" indicating the location of solder and components in the assembly, "Circuit Number" indicating component information, and "NG" and "WN" included in the operation history information, as well as "NG / WN Reason."

[0134] Under "Reflow," the following are displayed: "Incoming date and time," "Outgoing date and time," "Passage speed," "Zone," "Category," "Set temperature," and "Measured temperature."

[0135] The "AOI (After Reflow)" section displays information such as "Initial Date and Time," "Initial Result," "Last Date and Time," "Last Result," "Pattern" indicating the location of solder and components in the assembly, "Circuit Number" indicating component information, "NG" and "WN" included in the operation history information, and "NG / WN Reason."

[0136] The "Visual Inspection" section displays information such as "Initial Date and Time," "Initial Result," "Initial Delivery," "Initial Delivery," "Final Date and Time," "Final Result," "Final Delivery," "Final Delivery," "Pattern" indicating the location of solder and components in the assembled product, "Circuit Number" indicating component information, and "NG" and "WN" included in the operation history information, as well as "NG / WN Reason."

[0137] The "X-ray inspection" section displays information such as "Initial Date and Time," "Initial Result," "Initial Delivery," "Initial Delivery," "Final Date and Time," "Final Result," "Final Delivery," "Final Delivery," "Pattern" indicating the location of solder and components in the assembled product, "Circuit Number" indicating component information, and "NG" and "WN" included in the operation history information, as well as "NG / WN Reason."

[0138] Furthermore, the fourth screen 140 displays right and left arrow buttons, a "Display Image" button to show the desired image, a "Execute Search" button to execute the search using the entered search criteria, and the name "USER".

[0139] Additionally, screen 140 of the fourth screen displays an item name called "Detailed Viewing," the current date and time, and an arrow-shaped back button.

[0140] The user inputs information to the input / output unit 82 on the fourth screen 140. In this embodiment, the user inputs information to the input / output unit 82 by selecting desired buttons such as "Implementation surface" and "OK Exclude" on the fourth screen 140 and making various settings. Then, the user inputs information to the input / output unit 82 by selecting one list, which is an image button, from the list of detailed search results 141 for multiple production devices displayed on the fourth screen 140, and selecting the "Execute Search" button.

[0141] As a result, when an image button is selected, the input / output unit 82 displays a fifth screen 150 containing defective images on each of the multiple production devices, as shown in Figure 8. Specifically, upon receiving a request to display a defective image via the image button, the input / output unit 82 retrieves the defective image corresponding to the position information and part information displayed on the third screen 130 or the fourth screen 140 from the second storage unit and displays it on the fifth screen 150. The input / output unit 82 can also display a fifth screen 150 containing good images on each of the multiple production devices.

[0142] Screen 5, 150, displays the search results set on Screen 4, 140. Specifically, Screen 5, 150 displays selection buttons for "Board," "ASSY," "PCB ID" (the unique serial number of the board), "Pattern," "Circuit Number," "Mounting Side," "Lane" for mounting components on the board, and selection items for displaying the desired search results, such as "SPI," "Pre-reflow AOI," "Post-reflow AOI," "Visual Inspection," and "X-ray Inspection," as well as an "OK Exclude" button which includes "All" to select all of these. "Board," "ASSY," "Mounting Side," "SPI," "Pre-reflow AOI," "Post-reflow AOI," "Visual Inspection," "X-ray Inspection," "All," and "OK Exclude" are the same as described above.

[0143] Furthermore, the fifth screen 150 displays images as detailed search results 151 for multiple production devices. These images include at least one of defective images and good images, but in this embodiment, these images may represent only defective images.

[0144] In the fifth screen 150 of Figure 8, multiple lists and images are displayed as detailed search results 151. Specifically, the fifth screen 150 shows lists such as "Printing machine" corresponding to the printing device 10, "SPI" corresponding to the printing inspection device 20, "Placement machine" corresponding to the component placement device 30, "AOI (before reflow)" corresponding to the placement inspection device 40, "Reflow" corresponding to the reflow oven 50, "AOI (after reflow)" corresponding to the reflow inspection device 60, "Visual inspection", and "X-ray inspection". Images are displayed overlapping these multiple lists. The fifth screen 150 illustrates the case where images are displayed for each of "SPI", "AOI (before reflow)", and "AOI (after reflow)".

[0145] The "printing press" displays information such as "print date and time," "delivery date and time," "delivery date and time," "printing direction," "solder," "mask," "front speed," "front printing pressure," "rear speed," "rear printing pressure," "lifter speed," and "clearance."

[0146] The "SPI" displays "Initial Date and Time," "Initial Result," "Initial Delivery," "Initial Delivery," "Final Date and Time," "Final Result," "Final Delivery," "Final Delivery," "Pattern" indicating the location of solder on the board, "Circuit Number" indicating component information, and operation history information. The operation history information includes images of components on the board in the component mounting line. In other words, the operation history information displayed on the 5th screen 150 includes images of defective solder, but it is also acceptable to include at least one of the defective images and good images.

[0147] The "mounting machine" displays information such as the "equipment name," "mounting date and time," "pattern" indicating the position of components on the circuit board, "circuit number" indicating component information, and "errors," "machine number," and "error details" included in the operation history information.

[0148] The "AOI (Before Reflow)" section displays "Initial Date and Time," "Initial Result," "Initial Loading," "Initial Loading," "Final Date and Time," "Final Result," "Final Loading," "Final Loading," "Final Loading," "Pattern" indicating the position information of solder and components in the assembly, "Circuit Number" indicating component information, and operation history information. The operation history information includes images of components placed on the board by the mounting inspection device 40. In other words, the operation history information displayed on the fifth screen 150 includes images of defective components, but it may also include at least one of images of defective components and images of good components.

[0149] Under "Reflow," the following are displayed: "Export Date and Time," "Passage Speed," "Zone," "Category," "Set Temperature," and "Measured Temperature."

[0150] The "AOI (After Reflow)" section displays "Initial Date and Time," "Initial Result," "Last Date and Time," "Last Result," "Pattern" indicating the position information of solder and components in the assembly, "Circuit Number" indicating component information, and operation history information. The operation history information includes images of the solder joints between the substrate and components in the reflow inspection device 60. In other words, the operation history information displayed on the fifth screen 150 includes images of defective components, but it is also acceptable to include at least one of images of defective components and images of good components.

[0151] The "Visual Inspection" section displays information such as "Initial Date and Time," "Initial Result," "Initial Delivery," "Initial Delivery," "Final Date and Time," "Final Result," "Final Delivery," "Final Delivery," "Pattern" indicating the location of solder and components in the assembled product, "Circuit Number" indicating component information, and "NG" and "WN" included in the operation history information, as well as "NG / WN Reason."

[0152] The "X-ray inspection" section displays information such as "Initial Date and Time," "Initial Result," "Initial Delivery," "Initial Delivery," "Final Date and Time," "Final Result," "Final Delivery," "Final Delivery," "Pattern" indicating the location of solder and components in the assembled product, "Circuit Number" indicating component information, and "NG" and "WN" included in the operation history information, as well as "NG / WN Reason."

[0153] Furthermore, screen 150 displays right and left arrow buttons, a "Display Image" button to show the desired image, a "Execute Search" button to execute the search using the entered search criteria, and the name "USER".

[0154] Additionally, screen 150 of the fifth screen displays the item name "Detailed Confirmation," the current date and time, and an arrow-shaped back button.

[0155] <Example of operation> Next, with reference to Figure 9, an example of the operation of the implementation history display system 2 according to this embodiment will be described.

[0156] Figure 9 is a flowchart showing an example of the operation of the production system 1 according to the embodiment.

[0157] For example, when transitioning from the initial screen 100 to the fourth screen 140, the implementation history display device 80 requests the management server 71 to send inspection information (S11).

[0158] Next, the management server 71 sends inspection information to the implementation history display device 80 in response to the request in step S11 (S12). As a result, the implementation history display device 80 can acquire the inspection information and store the latest inspection information in its storage unit.

[0159] Next, when transitioning from the fourth screen 140 to the fifth screen 150, the implementation history display device 80 requests the inspection server 72 to send the inspection image (S13).

[0160] Next, the inspection server 72 transmits the inspection image to the installation history display device 80 in response to the request in step S13 (S14). As a result, the installation history display device 80 acquires the inspection image and stores the latest inspection image in its storage unit.

[0161] As a result, the implementation history display device 80 can acquire inspection information via the management server 71 and inspection images via the inspection server 72, thereby enabling the acquisition of various data related to product production at each of the multiple production machines.

[0162] <Effects and Effects> Next, the effects and advantages of the implementation history display device 80 according to this embodiment will be described.

[0163] As described above, the mounting history display device 80 according to Technology 1 of this embodiment includes a first storage unit that stores in association the operation history information of a component mounting line having a plurality of production devices for mounting components on a substrate, inspection information that inspects the mounting status of components, and substrate information of products produced by mounting components on a substrate, and an input / output unit 82 that receives input. The input / output unit 82 displays a first screen 110 containing the input substrate information, and when the substrate information displayed on the first screen 110 is selected, it displays a second screen 120 containing operation history information based on the substrate information, and when the operation history information displayed on the second screen 120 is selected, it displays a third screen 130 containing the operation history information of each of the plurality of production devices having a component mounting line.

[0164] According to this, a first screen 110 containing circuit board information can be displayed, followed by a second screen 120 containing operational history information based on the circuit board information, and then a third screen 130 containing operational history information for each production machine. This allows users to view operational history information based on circuit board information in more detail. Furthermore, operational history information can be displayed for each production machine on a single screen, allowing users to grasp the operational history information for each production machine at once.

[0165] Therefore, it is possible to provide a display screen that facilitates analysis.

[0166] Furthermore, the mounting history display device 80 according to Technology 2 of this embodiment is the mounting history display device 80 described in Technology 1. In this case, the operation history information includes mounting defects of components on the substrate at the component mounting line, and the operation history information displayed on the third screen 130 includes mounting defects.

[0167] According to this, operational history information, including mounting defects, can be displayed on a single third screen 130 for each production machine. Users can grasp the mounting defects for each production machine at once via the third screen 130, making it easier to analyze mounting defects.

[0168] Furthermore, the mounting history display device 80 according to Technology 3 of this embodiment is the mounting history display device 80 described in Technology 1 or 2. In this case, the operation history information displayed on the second screen 120 includes false reports that were mistakenly judged as defects, and the input / output unit 82 displays the mounting defects and false reports separately on the second screen 120.

[0169] According to this, false information that was mistakenly identified as a defect and correct information that was identified as an implementation defect can be displayed separately on a single second screen 120. As a result, users can understand implementation defects and false information on a single second screen 120, making it easier to analyze implementation defects and false information.

[0170] Furthermore, the mounting history display device 80 according to Technology 4 of this embodiment is the mounting history display device 80 described in Technology 1 or 2. In this case, the substrate information includes the position information of the substrate and component information relating to the component mounting coordinates, and the third screen 130 includes operation history information corresponding to the position information and component information of each of the multiple production devices.

[0171] According to this, operation history information corresponding to location information and part information can be displayed for each production device on a single third screen 130. Therefore, users can grasp operation history information corresponding to location information and part information on a single third screen 130, making it easier to perform analysis on location information and part information.

[0172] Furthermore, the mounting history display device 80 according to Technology 5 of this embodiment is the mounting history display device 80 described in Technology 4. In this case, the operation history information includes error details from the production equipment, and when board information displayed on the third screen 130 is selected, the input / output unit 82 displays a fourth screen 140 containing operation history information that includes error details corresponding to the position information or component information of each of the multiple production equipment.

[0173] According to this, one third screen 130 can display operational history information, including error details from the production equipment, for each production equipment. When the user selects board information on the third screen 130, one fourth screen 140 can display operational history information, including error details corresponding to location information and component information, for each production equipment. This allows the user to understand the operational history information corresponding to the location information and component information for each production equipment, making it easier to analyze the error details corresponding to the location information and component information.

[0174] Furthermore, the mounting history display device 80 according to Technology 6 of this embodiment further includes a second storage unit that stores defective images indicating that the mounting state of a component has been determined to be defective by inspection, and the input / output unit 82 includes an image button for displaying the defective image, and when the image button is selected, the input / output unit 82 displays a fifth screen 150 containing the defective image on each of the multiple production devices, which is the mounting history display device 80 according to Technology 4 or 5.

[0175] According to this, one fifth screen 150 can display operational history information for each production machine, including defective images indicating that the mounting status of a component was judged to be defective. When the user selects an image button on the fourth screen 140, one fifth screen 150 can display operational history information including defective images for each production machine, making it easier for the user to analyze components based on defective images for each production machine.

[0176] Furthermore, the mounting history display device 80 according to Technology 7 of this embodiment is the mounting history display device 80 described in Technology 6. In this case, the input / output unit 82, upon receiving a request to display a defective image via an image button, acquires a defective image corresponding to the position information and component information displayed on the third screen 130 or the fourth screen 140 from the second storage unit and displays it on the fifth screen 150.

[0177] According to this, a single fifth screen 150 can display operational history information, including defective images corresponding to location information and part information, for each production machine. Since a single fifth screen 150 can display operational history information, including defective images corresponding to location information and part information, for each production machine, it becomes easier for the user to analyze parts based on defective images for each production machine.

[0178] As described above, the mounting history display method according to Technology 8 of this embodiment stores in association the operation history information of a component mounting line having a plurality of production devices for mounting components on a substrate, inspection information that inspects the mounting status of the components, and substrate information of products produced by mounting components on a substrate. It displays a first screen 110 containing the input substrate information, and when the substrate information displayed on the first screen 110 is selected, it displays a second screen 120 containing operation history information based on the substrate information, and when the operation history information displayed on the second screen 120 is selected, it displays a third screen 130 containing the operation history information of each of the plurality of production devices in the component mounting line.

[0179] This implementation history display method also produces the same effects as described above.

[0180] As described above, the program relating to technology 9 of this embodiment is a program for a computer to execute the implementation history display method of technology 8.

[0181] (Other variations) The implementation history display device, implementation history display method, and program relating to this disclosure have been described above based on the embodiments described above, but this disclosure is not limited to these embodiments. Various modifications to the embodiments that a person skilled in the art can conceive of may also be included in the scope of this disclosure, as long as they do not depart from the spirit of this disclosure.

[0182] For example, the implementation history display device according to the above embodiment can be replaced with an implementation history display system. In other words, the implementation history display device includes at least a first storage unit and an input / output unit, but the implementation history display system may consist of a system in which the first storage unit and the input / output unit are distributed, or a system in which the first storage unit and the input / output unit are combined into one.

[0183] Furthermore, the information processing unit and other components included in the implementation history display device according to the above embodiment are typically implemented as an LSI, which is an integrated circuit. These may be individually integrated into a single chip, or some or all of them may be integrated into a single chip.

[0184] Furthermore, integrated circuit implementation is not limited to LSIs; it can also be achieved with dedicated circuits or general-purpose processors. Field Programmable Gate Arrays (FPGAs), which can be programmed after LSI manufacturing, or reconfigurable processors, which allow for the reconfiguration of the connections and settings of circuit cells within the LSI, may also be used.

[0185] In each of the above embodiments, each component may be implemented by dedicated hardware or by executing a software program suitable for each component. Each component may also be implemented by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory.

[0186] Furthermore, all figures used above are illustrative to illustrate the present disclosure, and the embodiments of this disclosure are not limited to the figures exemplified.

[0187] Furthermore, the division of functional blocks in the block diagram is just one example; multiple functional blocks can be implemented as a single functional block, a single functional block can be divided into multiple parts, or some functions can be moved to other functional blocks. In addition, the functions of multiple functional blocks with similar functions can be processed in parallel or time-sharing by a single piece of hardware or software.

[0188] Furthermore, the order in which each step in the flowchart is performed is illustrative for the purpose of specifically illustrating this disclosure, and may be in a different order. Also, some of the above steps may be performed simultaneously (in parallel) with other steps.

[0189] Furthermore, this disclosure also includes forms obtained by applying various modifications to the above embodiments that a person skilled in the art could conceive, and forms realized by arbitrarily combining the components and functions of the embodiments without departing from the spirit of this disclosure. [Industrial applicability]

[0190] The mounting history display device, mounting history display method, and program disclosed herein are useful in the field of mounting components onto a substrate. [Explanation of Symbols]

[0191] Production equipment for 10, 20, 30, 40, 50, and 60 units. 71 Management Server (First Storage Unit) 72. Inspection Server (Second Memory Unit) 80 Implementation History Display Device 82 Input / output section

Claims

1. A first storage unit stores, in association with and storing operational history information of a component mounting line having multiple production machines for mounting components onto a circuit board, inspection information obtained by inspecting the mounting status of the components, and circuit board information of products produced by mounting the components onto the circuit board. It includes an input / output section that accepts input, The input / output unit is, The first screen containing the input board information is displayed, When the board information displayed on the first screen is selected, a second screen containing the operation history information based on the board information is displayed. When the operation history information displayed on the second screen is selected, a third screen is displayed that includes the operation history information for each of the multiple production machines in the component mounting line. Implementation history display device.

2. The aforementioned operational history information includes mounting defects of the components on the circuit board at the component mounting line, The operation history information displayed on the third screen includes the aforementioned implementation defect. The mounting history display device according to claim 1.

3. The operation history information displayed on the second screen includes false information that was mistakenly identified as defective. The input / output unit displays the component mounting defects and the false information separately on the second screen. The mounting history display device according to claim 1 or 2.

4. The aforementioned substrate information includes the position information of the substrate and component information relating to the component mounting coordinates. The third screen includes the operation history information corresponding to the position information and part information of each of the multiple production devices. The mounting history display device according to claim 1 or 2.

5. The aforementioned operation history information includes details of errors in the production equipment. When the circuit board information displayed on the third screen is selected, the input / output unit displays a fourth screen containing the operation history information, which includes the error details corresponding to the position information or component information of each of the multiple production devices. The mounting history display device according to claim 4.

6. Furthermore, it includes a second storage unit that stores a defective image indicating that the mounting state of the aforementioned component was determined to be defective by the inspection. The input / output unit includes an image button for displaying the defective image. When the image button is selected, the input / output unit displays a fifth screen containing the defective image stored in the second storage unit to each of the multiple production devices. The implementation history display device according to claim 5.

7. The input / output unit, upon receiving a notification of the display of the defective image via the image button, retrieves the defective image corresponding to the position information and component information displayed on the third or fourth screen from the second storage unit and displays it on the fifth screen. The implementation history display device according to claim 6.

8. The system stores operational history information of a component mounting line having multiple production machines for mounting components onto a circuit board, inspection information obtained by inspecting the mounting status of the components, and circuit board information of products produced with the components mounted on the circuit board, in association with each other. The first screen containing the input board information is displayed, When the board information displayed on the first screen is selected, a second screen containing the operation history information based on the board information is displayed. When the operation history information displayed on the second screen is selected, a third screen is displayed that includes the operation history information for each of the multiple production machines in the component mounting line. How to display the implementation history.

9. A computer to execute the implementation history display method described in claim 8. program.

Images