Vehicle electronic unit and corresponding assembly method

Abstract

We provide an electronic unit for vehicles that enables efficient heat dissipation. [Solution] In the vehicle electronic unit 1, the casing 15 comprises a first cooling system 25 for cooling the electronic module, which includes at least one electronic module 100, at least one electronic substrate 3A, 3B supporting the electronic module, a frame 7 releasably connected to the substrate, a heat sink 27, and a ventilation device 29 that transports airflow through the heat sink. The frame comprises a molded portion 43 defining a second heat sink 45 that provides heat exchange with at least one electronic module, and the molded portion 43 of the frame 7 defining the second heat sink comprises at least one channel 47, 51, 65, 67 that fluidly communicates with the environment outside the casing 15 of the electronic unit.

Description

Technical Field

[0001] This specification relates to the field of vehicle electronic units. In particular, the present solution relates to an in-vehicle electronic unit that exchanges data with peripheral devices of a vehicle and the data to be exchanged.

Background Art

[0002] In the automotive industry, electronic units of the above type are generally used to control one or more devices of a vehicle.

[0003] To do so, the electronic unit has one or more modules configured to exchange data with a vehicle system external to the electronic unit, such as sensors associated with respective devices of the vehicle or other electronic units. The one or more modules may also include a processor module configured to process data exchanged with the system.

[0004] Moreover, electronic units known in the art generally comprise at least one electronic substrate configured to carry the above modules and implement electrical connections between the modules of the electronic unit.

[0005] As is known per se, during operation of the electronic unit, the modules can be heated up to a high temperature within a range, for example, included between 80 and 110 °C, which can cause damage or malfunction of the electronic unit itself.

[0006] Therefore, there is a need to provide a system for cooling the modules.

[0007] In this regard, the electronic unit described in Italian Patent Application Publication No. 102017000104682 (A1) of the same applicant comprises a cooling system including a heat sink and a ventilation device in the form of a fan associated therewith.

[0008] In this solution, heat dissipation is achieved by generating convective heat transfer between a heat sink having a layered structure that defines multiple passages and an incident airflow that is transported through these passages by a fan.

[0009] The electronic unit disclosed in Italian Patent Application Publication No. 102017000104682(A1) further comprises a frame made of a polymer material, such as a combination of polycarbonate and acrylonitrile-butadiene-styrene (so-called ABS (Acrylonitrile-butadiene-styrene)), which is removably connected to an electronic substrate, and an outer casing which defines the outer wall of the electronic unit and is configured to house the module, the electronic substrate, and the cooling system.

[0010] With respect to the solutions described above, or more generally, to electronic units known in the art, the applicant identified a series of drawbacks.

[0011] In fact, as the performance of modern modules used in automotive applications increases, and as a result the power required during the operation of electronic units increases, the amount of heat released by the modules within the electronic units inevitably increases, and therefore more efficient heat dissipation becomes necessary.

[0012] This problem is exacerbated by increasingly stringent requirements regarding the simplicity and dimensions of electronic units. [Overview of the project]

[0013] The objective of one or more embodiments is to contribute to providing a solution that enables more efficient heat dissipation in vehicle electronic units.

[0014] According to one or more embodiments, the object is achieved via an electronic vehicle unit having the features described in the following claims.

[0015] The claims are an integral part of the technical teachings provided relating to embodiments.

[0016] The solution described herein is an electronic unit for a vehicle, comprising a casing containing the following: - At least one electronic module, - At least one electronic substrate supporting at least one electronic module, - A frame releasably connected to at least one circuit board, - A casing housing a first cooling system configured to cool at least one electronic module, comprising a heatsink and a ventilation device configured to transport airflow through the heatsink, The frame comprises a molded portion defining a second heatsink configured to provide heat exchange with at least one electronic module, The present invention includes an electronic vehicle unit characterized in that a molded portion of the frame defining a second heat sink comprises at least one channel that fluidly communicates with the environment outside the casing of the electronic unit.

[0017] In various embodiments, the frame is made from a metallic material, preferably aluminum or a magnesium alloy.

[0018] In various embodiments, the electronic unit includes a second cooling system comprising a molded portion defined by a frame and a second ventilation device associated therewith and configured to transport airflow through at least one channel defined by the frame.

[0019] In various embodiments, at least one channel defined by the frame includes an inlet port that fluidically communicates with the environment outside the electronic unit. The inlet port is positioned facing the second ventilation device to receive the airflow from the second ventilation device. At least one channel comprises an outlet port arranged to be in fluid communication with the environment outside the electronic unit. The outlet port is arranged downstream of the inlet port and is configured to discharge the airflow conveyed through the outlet port to the outside of the electronic unit.

[0020] In various embodiments, at least one channel is an open channel having a substantially U-shaped geometry.

[0021] In various embodiments, the frame - comprises at least one surface, - and at least one rib and / or at least one ridge protruding with respect to the surface. At least one rib and / or at least one ridge and the surface delimit the at least one channel in the lateral and bottom directions respectively, thereby defining the substantially U-shaped geometry of the at least one channel.

[0022] In various embodiments, at least one electronic substrate comprises first and second electronic substrates arranged on opposite sides of the frame.

[0023] In various embodiments, the frame comprises at least one platform, the platform defining a contact surface configured to abut each respective module of at least one module in the assembled configuration of the electronic unit. In various embodiments, the platform comprises a heat pad arranged at its free end, the heat pad defining the aforementioned contact surface.

[0024] In various embodiments, the casing comprises a first metal part and a second metal part, each metal part being releasably connected to the frame.

[0025] In various embodiments, the first and second electronic substrates, and the first and second metal components are releasably connected to the frame by a plurality of fixing elements arranged in the peripheral portion of the frame.

[0026] In various embodiments, the plurality of fixing elements are - a first group of fixing elements configured to connect the first electronic substrate and the first metal component to the frame, where the first fixing element extends through respective through holes arranged on the frame and the first electronic substrate and engages with respective fixing seats arranged on the first metal component, the first group of fixing elements; - a second group of fixing elements configured to connect the second electronic substrate and the second metal component to the frame, where the second fixing element extends through respective through holes arranged on the second metal component and the second electronic substrate and engages with respective fixing seats arranged on the frame, the second group of fixing elements.

[0027] In various embodiments, the electronic module comprises a module configured to exchange data with a system external to the electronic unit and / or to process said data.

[0028] The solution described herein also refers to a method of assembling an electronic unit, the method comprising - providing a first metal component; - stacking the first electronic substrate and the frame on the first metal component such that the first electronic substrate is disposed between the first metal component and the frame; - connecting the frame to the first metal component via the first group of fixing elements, where connecting the frame to the first metal component includes inserting the first group of fixing elements through the through holes of the frame along a first insertion direction. - The second electronic circuit board and the second metal component are stacked on the frame 7 such that the second electronic circuit board is positioned between the second metal component and the frame. -Includes connecting the second metal part to the frame via the second group of fixed elements, Connecting the second metal component to the frame via a second group of fixing elements is characterized by inserting the second group of fixing elements through through holes in the second metal component along a second insertion direction parallel to the first insertion direction.

[0029] The solutions described herein facilitate the achievement of more efficient heat dissipation within electronic units.

[0030] In particular, a frame that defines at least one channel for fluid communication with the external environment of the electronic unit enhances heat dissipation from one or more modules.

[0031] One or more of the above characteristics further enhances the heat dissipation released by the module.

[0032] For example, the metal structure of the frame increases heat conduction from the module to at least one channel.

[0033] Furthermore, providing a second ventilation device configured to force airflow through at least one channel enhances convective heat transfer from the frame to the incoming airflow.

[0034] Finally, by providing the platform that contacts each module, the contact surface between the module and the frame is increased, thereby improving the heat flow from the module. [Brief explanation of the drawing]

[0035] One or more embodiments are described herein, merely as examples, with reference to the accompanying drawings. [Figure 1A]This is a front perspective view of the electronic unit described herein. [Figure 1B] Figure 1 is a rear perspective view of the electronic unit. [Figure 2] Figure 1A is an exploded view of the electronic unit. [Figure 3] This is a top perspective view of the frame of the electronic unit described herein. [Figure 4] This is a bottom perspective view of the frame of the electronic unit described herein. [Figure 5] This is an exploded view illustrating the assembly modes of the electronic units described herein. [Figure 6] This is an exploded view illustrating the assembly modes of the electronic units described herein. [Figure 7] This is an exploded view illustrating the assembly modes of the electronic units described herein.

[0036] In different drawings, corresponding numbers and symbols generally refer to the corresponding parts unless otherwise indicated.

[0037] The drawings are provided to clearly illustrate relevant aspects of the embodiment and are not necessarily drawn to scale.

[0038] The edges of features depicted in the diagram do not necessarily indicate the end of the feature's range. [Modes for carrying out the invention]

[0039] In the following description, one or more specific details are illustrated for the purpose of providing a deeper understanding of the examples of the embodiments described herein. Embodiments may be realized without one or more of the specific details, or by other means, components, materials, etc. In other cases, known structures, materials, or operations are not illustrated or described in detail so as not to obscure any particular aspect of the embodiment.

[0040] Any reference to “an embodiment” or “one embodiment” within the framework of this specification is intended to indicate that a particular configuration, structure, or characteristic described in relation to that embodiment is included in at least one embodiment. Therefore, phrases such as “in an embodiment” or “in one embodiment” that may appear in one or more places in this specification do not necessarily refer to the same single embodiment.

[0041] Furthermore, specific configurations, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0042] The headings / references used herein are provided solely for convenience and therefore do not define the scope of protection or the scope of embodiments.

[0043] For the sake of simplicity and ease of explanation, throughout this explanation, unless otherwise indicated in context, similar parts or elements are shown with the same reference numerals in various figures, and corresponding explanations are not repeated for each figure.

[0044] According to Figures 1A to 2, reference numeral 1 denotes an electronic unit for a vehicle according to one embodiment of this solution.

[0045] For example, the aforementioned unit could be designed to control the vehicle's cluster display, HUD display, central display, passenger display, loudspeaker, and microphone.

[0046] As is known, the electronic unit 1 comprises at least one electronic module (indicated by reference numeral 100 in Figure 2). Preferably, at least one electronic module 100 comprises one or more data exchange modules configured to exchange data with systems outside the electronic unit 1 (hereinafter referred to as vehicle peripherals). The electronic module 100 may also comprise one or more modules operating as processor modules, configured to process the data exchanged by the data exchange modules.

[0047] For example, the data exchanged by the data exchange module may include information or measurements of any device or equipment in the vehicle, such as data on the status of vehicle components or measurements obtained by the vehicle's sensors.

[0048] Data transfer, or more generally, electrical connections, within the electronic unit 1 are implemented by at least one electronic circuit board configured to carry the aforementioned module. Referring to Figure 2, an exemplary electronic circuit board is shown as 3A.

[0049] In one or more embodiments, the electronic substrate 3A is a printed circuit board (PCB) that is known in itself.

[0050] In particular, the modules of the electronic unit 1, collectively represented by a single module 100, are securely connected to the electronic substrate 3A by any technique known to those skilled in the art, for example, by welding. In Figure 2, modules 100 representing one or more electronic modules are fixed to the lower surface of the electronic substrate 3A and are therefore shown by dashed lines.

[0051] To establish the electrical connection, the electronic substrate 3A has a layered structure that extends substantially flat along a first plane P and includes a central layer of insulating material, such as glass fiber, stacked between two conductive layers, for example, made of copper, which are arranged on either side of the central layer.

[0052] The conductive layer of the electronic substrate 3A defines multiple traces (not illustrated) that extend across the entire electronic substrate 3A, thereby implementing electrical connections between modules of the electronic unit.

[0053] In various embodiments, the electronic substrate 3A may include a number of vias (not illustrated) that extend along the width direction of the substrate 3A and are configured to electrically connect conductive layers of the substrate 3A.

[0054] As illustrated, the electronic unit 1 further comprises an electrical connector 5 supported by an electronic circuit board 3A and located around its periphery.

[0055] Each such connector 5 is provided with a seat, each seat configured to receive its respective end connector, which is carried by a connecting wire associated with the vehicle's peripheral equipment, and is electrically connected to the end of a trace on the electronic circuit board 3A.

[0056] Therefore, by providing connector 5, an electrical connection is implemented between the modules of the electronic unit 1 (collectively represented as 100) and the peripheral equipment of the vehicle.

[0057] In the preferred embodiment shown in Figure 2, the electronic unit 1 comprises a first electronic substrate 3A as discussed and a second electronic substrate 3B arranged parallel to each other.

[0058] In this embodiment, each electronic circuit board 3A, 3B supports at least one of the electronic modules 100 of the electronic unit 1 and at least one connector 5.

[0059] As illustrated, the electronic unit 1 further comprises a support structure 6 having a frame 7, and at least a casing 15 having at least a first portion 11, in particular a first sheet designed or molded to define one or more outer walls 9 of the casing 15 and thus the electronic unit, and a second portion 13, in particular a second sheet designed or molded to define one or more further outer walls 9.

[0060] Specifically, the first portion 11 and the second portion 13 are configured to cooperate with each other, thereby defining the outer casing 15 of the electronic unit 1.

[0061] Preferably, at least one of the first portion 11 and the second portion 13 of the casing 15 is made from a metallic material.

[0062] More preferably, both the first portion 11 and the second portion 13 of the casing 15 are made from a metallic material.

[0063] In the embodiment shown in Figure 2, the frame 7 extends substantially parallel to the plane P and defines a first side 7A and a second side 7B opposite to each other with respect to the plane P.

[0064] Preferably, the frame 7 is positioned at an intermediate location between the first electronic substrate 3A and the second electronic substrate 3B, so that in the assembled configuration of the electronic unit 1, the frame 7 is stacked between the first electronic substrate 3A and the second electronic substrate 3B, and the first electronic substrate 3A and the second electronic substrate 3B face the first side 7A and the second side 7B of the frame 7, respectively.

[0065] Preferably, the electronic modules of the electronic unit 1 are arranged between the respective electronic substrates 3A and 3B and the frame 7.

[0066] In other words, in the assembled configuration of the electronic unit 1 described above, each module is separated by the frame 7 and the respective electronic boards 3A and 3B along a direction perpendicular to the plane P.

[0067] As shown in Figures 1A and 1B, the outer casing 15 has an opening 17 located in one of its outer walls 9, which is configured to allow access to the electrical connector 5 from the outside of the electronic unit 1, so that it is engaged, for example, by the aforementioned connecting wires associated with the peripheral equipment of the vehicle.

[0068] Preferably, the opening 17 of the outer casing 15 is shaped to outline the outer contour of the connector 5.

[0069] In other words, on the one hand, the metal parts 11 and 13 define the overall dimensions of the electronic unit 1 and define the housing for the other components of the electronic unit 1 inside.

[0070] On the other hand, frame 7 constitutes an internal framework that strengthens the structure of the electronic unit 1.

[0071] For this purpose, the metal components 11 and 13 and the electronic substrates 3A and 3B are releasably connected to the frame 7 by a plurality of interlocking elements.

[0072] In the embodiments considered, the interlocking elements include, for example, fasteners, such as screws, which are coupled to each fastener structure via screw connections.

[0073] In particular, the fixing elements include a first group of fixing elements 19A that extend from the peripheral portion of the frame 7 through each through hole 23A provided on the first electronic substrate 3A and engage with each fixing seat portion 21A provided on the first metal part 11.

[0074] Similarly, the fixing elements further comprise a second group of fixing elements 19B that extend through the respective through holes 23B provided in the second metal component 11 and the second electronic substrate 3B and engage with the respective fixing structures 21B provided in the peripheral portion of the frame 7.

[0075] In various embodiments shown in Figure 2, the electronic unit 1 is configured to cool the electronic module during operation and includes a cooling system 25, which includes a heatsink 27 and a ventilation device 29, such as a fan 29.

[0076] As is known, the heat sink 27 comprises a base portion 28 configured to be fixed to the support structure 6 of the electronic unit 1, and a stacked portion 30 that protrudes from the base portion 28 and is arranged parallel to each other and spaced apart, thereby comprising a plurality of flaps 31 that define a plurality of channels 33.

[0077] As illustrated, the heat sink 27 is positioned at an intermediate location between the first electronic substrate 3A and the first metal component 11, and is oriented so that the channel 33 extends parallel to the plane P.

[0078] In particular, in the assembled configuration of the electronic unit 1, the heat sink 27 is received in a recess 35 located on the first metal component 11, and the base portion 28 of the heat sink 27 is releasably connected to the first metal component 11.

[0079] Specifically, the connection of the base portion 28 of the heat sink 27 to the first metal component 11 is achieved by a connecting element 37 that extends through each fixing hole 38 located on the base portion 28 and engages with each fixing seat portion 39 provided on the first metal component 11.

[0080] Referring to the cooling system 25, the ventilation device 29 is positioned facing a channel 33 defined by the flap 31 of the heat sink 27 and is configured to push airflow through it to induce convective heat transfer between the flap 31, which has a higher temperature due to the heat released by the electronic module, and the fresh air pushed into the electronic unit 1.

[0081] As illustrated, the first metal component 11 has a through-opening 41 located on the outer wall 9 of the casing 15, which allows the ventilation device 29 to be in fluid communication with the environment outside the electronic unit 1.

[0082] In various embodiments, the outer wall 9, preferably on the opposite side from the outer wall 9 having the opening 41, may have a perforated portion 42 (illustrated in Figure 1B) for the outflow of air from the channel 33 of the heat sink 27.

[0083] According to this solution, referring to Figures 3 and 4, the frame 7 includes a molded portion 43 that defines the second heat sink 45.

[0084] Specifically, the molded portion 43 of the frame 7 defines at least one channel 47, which is configured to transport airflow through the channel to cool the electronic module of the electronic unit 1.

[0085] In various embodiments, at least one channel 47 of the molded portion 43 comprises a plurality of channels 47 extending substantially parallel to the plane P.

[0086] In particular, each channel 47 extends from its respective inlet port 49, which is arranged to communicate fluidly with the environment outside the electronic unit 1.

[0087] Preferably, the inlet ports 49 of each channel 47 are located on the same edge 50 of the frame 7, and the term “edge” refers to the peripheral portion of the frame 7, i.e., the boundary of the frame 7.

[0088] In the embodiments shown in Figures 3 and 4, the channel 47 is located on the same side of the frame 7, i.e., the first side 7A. However, the channel 47 of the molded portion 43 may be provided on either side 7A, 7B of the frame 7, and on both sides thereof.

[0089] In the embodiments considered, the channel 47 comprises a pair of central channels 51 that extend substantially linearly from their respective inlet ports 49 along a first direction A.

[0090] More specifically, the central channel 49 extends within a recessed portion 53 located within the frame 7.

[0091] As shown in Figures 3 and 4, the recessed portion 53 includes a bottom wall 55 that extends parallel to the plane P and is offset from the surfaces 57 and 59 defined by the first and second sides 7A and 7B of the frame, respectively.

[0092] Specifically, the recessed portion 53 is such that the bottom wall 55 is set back relative to the surface 57 of the frame 7 and protrudes relative to the surface 59 of the frame 7.

[0093] In the embodiments considered, the recessed portion 53 further comprises a pair of transverse ribs 60 connecting the bottom wall 55 to the surface 59 of the frame 7, and a third rib 61 extending parallel to the two transverse ribs 60 at an intermediate position between the two transverse ribs 60, thereby defining two central channels 51.

[0094] In one embodiment, the third rib 61 has an extension along a first direction A that is smaller than the lateral rib 60, such that the two central channels 51 merge at the second edge 64 of the frame 7 into a single channel 51A having an exit port 62 positioned peripherally relative to the frame 7.

[0095] Preferably, the second edge 64 of the frame 7 is positioned on the opposite side of the frame 7 from the edge 50 associated with the corresponding inlet port 49.

[0096] In various embodiments, the molded portion 43 of the frame 7 includes reinforcing ribs 63 that extend along and project from the surfaces 57, 59 of the frame 7.

[0097] As shown in Figure 3, in one embodiment, the first pair of reinforcing ribs 63 define a third channel 65 that extends from each inlet port 49 to the outlet port 67, and the third channel 65 is located at the edge 64 of the frame 7, similar to the central channel 51A.

[0098] Furthermore, the outlet ports 62 and 67 of channels 51A and 65 are positioned facing the perforated portions of the outer casing 15, respectively. Therefore, the incident airflow passing through channels 51A and 65 can be directly discharged outwards from the electronic unit 1.

[0099] In the embodiment shown in Figure 3, the third channel 65 comprises an upstream portion 65A extending substantially parallel to the first direction A along the central channel 51, and a downstream portion 65B extending along a second direction B incident on the first direction A and connected to the upstream portion 65A by an elbow portion 65C.

[0100] In one embodiment, the molded portion 43 further comprises a fourth channel 67 that is laterally separated on one side by a ridge 63 of the frame 7 and on the other side by one of the aforementioned lateral ribs 60 of the recessed portion 53.

[0101] As illustrated, the fourth channel 67 extends parallel to the first direction A from each inlet port 49 to an outlet port 69 positioned set back relative to the edge 64 of the frame 7, so that the airflow carried by the channel 67 flows into a portion 70 of the surface 57, 59 of the frame 7.

[0102] In summary, the channel 47 has a substantially U-shaped cross-section, separated laterally by ribs 60, 61 and / or ridges 63 and separated at the bottom by the bottom wall 55 or the surfaces 57, 59 of the frame 7.

[0103] Therefore, in the assembled configuration of the electronic unit 1, the open side of each channel 47 faces the respective electronic substrates 3A and 3B, and thus the modules supported by the electronic substrates 3A and 3B are directly exposed to the air flowing through the channel 47.

[0104] Furthermore, on the frame 7, the channels are open channels; that is, the boundaries of the unassembled channels 47, as seen in cross-section, are not solid and rigid boundaries (the cross-section is C-shaped or U-shaped with an open side facing the electronic substrate 3A). For each channel 47, in the assembled configuration, the surfaces of the electronic substrates 3A and 3B facing the channel 47 substantially form the walls of the channel 47, and it is emphasized that such channels 47 take the form of ducts or conduits. Thus, in the assembled state, the channels 47 with the substrate 3A particularly identify as conduits for airflow from one side of the casing 15 to the other.

[0105] In other words, in the assembled configuration of the electronic unit 1, the electronic substrates 3A and 3B cooperate with the ribs 60 and 61, the ridge 63, the bottom wall 55, and the surfaces 57 and 59 of the frame 7 to form a closed conduit, the term of which refers to a channel demarcated by a solid wall along any direction.

[0106] In various embodiments of this solution, the electronic unit 1 comprises a second cooling system including a second heat sink defined by a channel 47 of a frame 7 and a second ventilation device 71, for example, a second fan 29 associated therewith.

[0107] As illustrated in Figure 2, the second ventilation device 71 is positioned facing the inlet port 49 of the channel 47, similar to the first ventilation device 29 of the first cooling system 25, in order to force the airflow through.

[0108] In particular, the second ventilation device 71 is in fluid communication with the environment outside the electronic unit through a through-opening 73 located on the outer wall 9 of the casing 15.

[0109] According to Figure 1A, in one embodiment, the first and second ventilation devices 29, 71 are arranged side by side, or in other words, both the first and second ventilation devices 29, 71 face the same outer wall 9 of the outer casing 15.

[0110] As illustrated in Figures 3 and 4, in various embodiments, the frame 7 is provided with a plurality of platforms 75 that protrude from the surfaces 57, 59 of the frame 7.

[0111] In particular, the platform 75 defines each contact surface 77, preferably a flat contact surface 77, which is configured to contact each electronic module in order to exchange heat with each electronic module in the assembled configuration of the electronic unit 1.

[0112] In the example shown in Figure 4, the recessed portion 53 may also function as a further platform 75, and the bottom wall 55 defines a further contact surface configured to abut against one or more modules supported by the second electronic substrate 3B.

[0113] Therefore, providing the contact surface 77 enhances conductive heat exchange between the electronic module and the frame 7 during the operation of the electronic unit 1.

[0114] In one embodiment, each platform 75 may be provided with a thermal pad 79 at its free end. The thermal pad 79 defines the aforementioned contact surface 77 and is preferably made of a material having lower rigidity than the material constituting the frame 7 in order to achieve better adhesion between the platform and each module.

[0115] In fact, when manufacturing the frame 7, the contact surface 77 may contain surface defects that result in a surface that is not perfectly flat, which can lead to uneven contact with each module. Similarly, the surface of the electronic module facing the platform 75 may not be perfectly flat.

[0116] Therefore, the localized yielding of the thermal pad 79 ensures a uniform contact surface, and thus ensures more effective heat transfer from the module to the platform 75.

[0117] In one embodiment, the base portion 28 of the heatsink 27 may include a recessed portion 81 (illustrated in Figures 5 and 6) provided with at least one platform 83.

[0118] The platform 83 of the base portion 28 of the heatsink 27 is the same as the platform 75 of the frame 7 described above. Therefore, the same considerations made for platform 75 are also valid for platform 83.

[0119] In particular, the platform 83 protrudes from the bottom surface 85 of the recessed portion 81 of the base portion 28, and therefore, in the assembled configuration of the electronic unit, the platform 83 abuts against each module 100 which is positioned midway between the first electronic substrate 3A and the heat sink 27.

[0120] In one embodiment, the frame is made from a thermally conductive material such as a metal. Preferably, the frame 7 is made from aluminum or a magnesium alloy.

[0121] Frame 7 can be manufactured using any technique known to those skilled in the art, for example, by die casting or metal sheet stamping.

[0122] The metallic composition of frame 7 offers a significant advantage in dissipating the heat released within the electronic unit 1.

[0123] In fact, fabricating the metal frame 7 not only enhances heat transfer from the module to the platform 75 through the contact surface 77, but also enhances heat exchange between the channel 47 and the incident airflow transported through it.

[0124] As illustrated in Figures 3 and 4, in various embodiments, the frame 7 may have at least one through-opening 87 configured to perform a dual function: on the one hand, to reduce the weight of the frame 7, especially when made from a metallic material; and on the other hand, to provide a seat for modules of electronic units 1 that protrude from the electronic substrates 3A, 3B beyond the respective surfaces 57, 59 of the frame 7 facing them.

[0125] Referring to Figures 5 to 7, the method for assembling the electronic unit 1 using this solution is described below.

[0126] In particular, the method for assembling the electronic unit 1 includes a first step (illustrated in Figure 5) which involves placing the heatsink 27 of the first cooling system 25 into a recess 35 of the first metal part 11 and connecting the heatsink 27 by a connecting element 37.

[0127] At the same time, the first and second ventilation devices 29, 71 are fixed to the exterior wall 9 by any preferred method, for example, by screws.

[0128] A further step of the assembly method (illustrated in Figure 6) includes positioning the first electronic circuit board 3A such that it contacts the base portion 28 of the heat sink 27.

[0129] Subsequently, the frame 7 is positioned such that the platform 75 provided on the first side portion 7A of the frame 7 contacts each module supported by the electronic substrate 3A.

[0130] In other words, in the assembled configuration of frame 7, the electronic circuit board 3A is separated on one side by the heat sink 27 and the first metal component 11, and on the other side by frame 7.

[0131] At this stage, the frame 7 is connected to the first electronic substrate 3A and the first metal component 11 by the first group of fixed elements 19A.

[0132] In particular, as described earlier in this disclosure, the fixing element 19A extends through the respective through holes 23A of the frame 7 and the first electronic substrate 3A and engages with the respective fixing seats 21A provided on the first metal component 11.

[0133] Specifically, during the step of connecting the frame 7 to the first metal component 11, the first group of fixing elements 19A are inserted through their respective through holes 23A from the second side 7B of the frame 7 along the insertion direction (indicated by arrow C in Figures 6 and 7).

[0134] Referring to Figure 7, a further step in the assembly method includes positioning the second electronic circuit board 3B such that each module supported thereon abuts against the platform 75 on the second side 7B of the frame 7.

[0135] Subsequently, the second metal component 13, together with the first metal component 11, defines the outer casing 15 and is connected to the frame 7 by a second group of fixing elements 19B to house the frame 7, the electronic circuit boards 3A and 3B, and the cooling system inside.

[0136] In particular, as described earlier in this disclosure, the fixing element 19B extends through the respective through holes 23B of the second metal component 13 and the second electronic substrate 3B and engages with the respective fixing seats 21B provided on the frame 7.

[0137] Similar to the fixing elements 19A of the first group, the fixing elements 19B of the second group are inserted through their respective through holes 23B from the outer surface 87 of the second metal component 13 (corresponding to the base surface of the electronic unit 1 in the assembled configuration) along a second insertion direction D parallel to the first insertion direction C, during the step of connecting the second metal component 13 to the frame 7.

[0138] Therefore, based on the above, the solutions described herein refer to a method for assembling an electronic unit (e.g., 1) as described above, and this method is - To provide a first metal part (e.g., 11), - The first electronic substrate (e.g., substrate 3A) and the frame (e.g., 7) are stacked on the first metal component such that the first electronic substrate (e.g., 3A) is positioned between the first metal component (e.g., 11) and the frame (e.g., 7). - Connecting the frame (e.g., 7) to the first metal part (e.g., 11) via the fixing elements (e.g., 19A) of the first group, Connecting the frame (e.g., 7) to the first metal component (e.g., 11) includes inserting the fixing element (e.g., 19A) of the first group through the through hole (e.g., 23A) of the frame (e.g., 7) along a first insertion direction (e.g., C), - The second electronic substrate (e.g., 3B) and the second metal component (e.g., 13) are stacked on the frame (e.g., 7) such that the second electronic substrate (e.g., 3B) is positioned between the second metal component (e.g., 13) and the frame (e.g., 7). -This includes connecting the second metal part (e.g., 13) to the frame (e.g., 7) via the fixing elements (e.g., 19B) of the second group.

[0139] In such a method, connecting the second metal part (e.g., 13) to the frame (e.g., 7) via the fixing elements (e.g., 19B) of the second group includes inserting the fixing elements (e.g., 19B) of the second group through the through-hole (e.g., 23B) of the second metal part (e.g., 13) along a second insertion direction D parallel to the first insertion direction C.

[0140] The assembly method described above refers to the assembly of an electronic unit 1 having the structure described in accordance with this solution, in particular comprising a molded portion (e.g., 43) having an additional heat sink (e.g., 45) to provide heat exchange with an electronic module (e.g., 100), wherein such a molded portion comprises at least one channel (e.g., 47, or 51, 65, 67) that fluidly communicates with the environment outside the casing (e.g., 15) of the electronic unit. However, the method can be carried out to assemble any electronic unit including a frame (such as a frame 7), and it should be noted that the frame 7 is provided with through holes (e.g., 23A) for connecting the frame 7 to a first metal part (e.g., 11) via a first group 19A of fixing elements, and fixing seats 21B for connecting a second metal part 13 to the frame 7. As can be inferred, the assembly method according to the solution described herein can be carried out regardless of the geometry of the frame 7 described herein, in particular with and without the molded portion 43 of the frame 7.

[0141] Therefore, the solutions described herein enhance the dissipation of heat released by the electronic module during the operation of the electronic unit 1.

[0142] In particular, as is known to those skilled in the art, effective techniques for enhancing heat dissipation from an object are, - In order to increase the heat flow through the surface itself, the surface of the object is expanded and exposed to a colder medium (e.g., air, water, a second object), -When manufacturing an object, use thermally conductive materials such as metal materials, - This includes exposing an object to an incident flow of a cooling fluid (e.g., air or water) to thereby enhance convective heat exchange between the object and the incident flow.

[0143] As can be understood from the above explanation, this solution implements all of the above techniques to enhance heat dissipation within the electronic unit 1 compared to known solutions.

[0144] In particular, by providing a frame 7 having a molded portion 43 that defines a second heat sink 45, it becomes possible to enlarge the surface area of ​​the frame 7 and, at the same time, define a channel for receiving fresh air coming from outside the electronic unit 1.

[0145] Such advantages are further enhanced by providing a second ventilation device 71 that pushes the airflow through the channel 47 of the frame 7, thereby contributing to convective heat transfer from the frame 7 to the incoming airflow.

[0146] Furthermore, using metallic materials such as aluminum or magnesium alloy as the constituent material of frame 7 enhances the absorption of heat released by the module by frame 7.

[0147] Conductive heat transfer from the module to the frame 7 is further enhanced by the provision of a platform 75 that protrudes from the surfaces 57, 59 of the frame 7 and abuts against the module of the electronic unit 1.

[0148] Another advantage of this solution relates to the sustainability of the manufacturing of the electronic unit 1.

[0149] In fact, by using metal materials as the constituent materials for the first and second parts 11 and 13 of the casing 15, the need for plastic parts is reduced, thereby facilitating more sustainable production and a more sustainable end-of-life disposal of the electronic unit 1.

[0150] A further advantage of this solution lies in the simplicity of the assembly method for electronic unit 1.

[0151] In fact, because the fixing elements 19A and 19B of the first and second groups are insertable along their respective insertion directions C and D which are parallel to each other, the assembly of the electronic unit 1 can be performed by simply stacking the first metal part 11, the first electronic substrate 3A, the frame 7, the second electronic substrate 3B, and the second metal part 13 on top of each other by the assembly method described herein, without the need to turn the electronic unit upside down during an intermediate step of the assembly process.

[0152] Furthermore, since each electronic circuit board 3A and / or 3B and each metal component 11, 13 constituting the outer casing 15 are connected to the frame 7 via either the first or second group of fixing elements 19A, 19B, the frame 7 itself becomes a reference member during the assembly of the electronic unit 1, ensuring the accurate positioning of each of the above components.

[0153] In other words, the frame 7 provided by this solution allows for the assembly of the electronic unit 1 without requiring a series of dimensional determinations for the parts and without the need for additional reference elements that result in wider geometric tolerances.

[0154] Without compromising the underlying principles, details and embodiments may vary significantly, even substantially, from those described only as examples, without departing from the scope of the embodiments.

[0155] The scope of protection is determined by the attached claims.

Claims

1. An electronic unit for a vehicle (1), comprising a casing (15), the following inside: - At least one electronic module (100) and - At least one electronic substrate (3A, 3B) supporting the at least one electronic module (100), - A frame (7) detachably connected to at least one of the substrates (3A, 3B), - A casing (15) housing a first cooling system (25) configured to cool the at least one electronic module (100), comprising a heat sink (27) and a ventilation device (29) configured to transport airflow through the heat sink (27), The frame (7) includes a molded portion (43) that defines a second heat sink (45) configured to provide heat exchange with the at least one electronic module (100), An electronic unit for a vehicle, characterized in that the molded portion (43) of the frame (7) defining the second heat sink (45) is provided with at least one channel (47; 51, 65, 67) that fluidly communicates with the environment outside the casing (15) of the electronic unit (1).

2. The electronic unit according to claim 1, wherein the frame (7) is made of a metallic material, preferably aluminum or a magnesium alloy.

3. The electronic unit according to claim 1, comprising a second cooling system including the molded portion (43) defined by the frame (7) and a second ventilation device (71) associated therewith, wherein the second ventilation device (71) is configured to transport airflow through the at least one channel (47) defined by the frame (7).

4. The frame (7) defines at least one channel (47) which includes an inlet port (49) that fluidly communicates with the environment outside the electronic unit (1), The inlet port (49) is positioned facing the second ventilation device (71) so as to receive the airflow transported by the second ventilation device (71), The at least one channel (47) is provided with outlet (67, 62) ports arranged to fluidly communicate with the environment outside the electronic unit (1), The electronic unit according to claim 3, wherein the outlet ports (67, 62) are located downstream of the inlet port (49) and are configured to discharge the airflow transported through the outlet ports (67, 62) toward the outside of the electronic unit (1).

5. The electronic unit according to claim 1, wherein at least one channel (47; 51, 65, 67) is an open channel having a substantially U-shaped geometry.

6. The aforementioned frame (7) - At least one surface (55, 57, 59) and - comprising at least one rib (60) and / or at least one ridge (63) protruding from the aforementioned surface (55, 57, 59), - The electronic unit according to claim 5, wherein the at least one rib (60) and / or at least one ridge (63) and the surfaces (55, 58, 59) divide the at least one channel (47; 51, 65, 67) laterally and at the bottom, respectively, thereby defining the substantially U-shaped geometry of the at least one channel (47; 51, 65, 67).

7. The at least one channel (47; 51, 65, 67) has an open side configured to face the at least one electronic substrate (3A, 3B), The electronic unit according to claim 6, wherein in the assembled configuration of the electronic unit (1), the at least one electronic substrate (3A, 3B) cooperates with the at least one rib (60) and / or at least one ridge (63), and the surfaces (55, 58, 59) to form a conduit together with them.

8. The electronic unit according to claim 1, wherein the at least one electronic circuit board (3A, 3B) comprises first and second electronic circuit boards (3A, 3B) arranged on opposing sides (7A, 7B) of the frame (7).

9. The frame (7) comprises at least one platform (75), The electronic unit according to claim 8, wherein the at least one platform (75) defines a contact surface (77) configured to abut against each of the at least one module in the assembled configuration of the electronic unit (1).

10. The electronic unit according to claim 9, wherein the platform (75) comprises a thermal pad (79) positioned at its free end, and the thermal pad (79) defines the contact surface (77).

11. The electronic unit according to any one of claims 1 to 10, wherein the casing (15) comprises a first metal part (11) and a second metal part (13), and each metal part (11, 13) is removably connected to the frame (7).

12. The electronic unit according to claim 11, wherein the first and second electronic substrates (3A, 3B) and the first and second metal components (11, 13) are removably connected to the frame (7) by a plurality of fixing elements (19) arranged in the peripheral portion of the frame (7).

13. The aforementioned plurality of fixed elements (19) - A first group of fixing elements (19A) configured to connect the first electronic substrate (3A) and the first metal component (11) to the frame (7), The first group of fixing elements (19A) extends through through holes (23A) located on the frame (7) and the first electronic substrate (3A), and engages with fixed seat portions (21A) located on the first metal part (11), - A second group of fixing elements (19B) configured to connect the second electronic circuit board (3B) and the second metal component (13) to the frame, The electronic unit according to claim 12, comprising a second group of fixing elements (19B) wherein the second fixing element (19B) extends through through holes (23B) located on the second metal component and the second electronic substrate (3B) and engages with fixing seats (21B) located on the frame (7).

14. The electronic unit according to any one of claims 1 to 13, wherein the electronic module (100) is configured to exchange data with and / or process data with an external system of the electronic unit (1).

15. A method for assembling an electronic unit (1) according to any one of claims 12 to 14, - To provide a first metal part (11), - The first electronic circuit board (3A) and the frame (7) are stacked on the first metal component such that the first electronic circuit board (3A) is positioned between the first metal component (11) and the frame (7), - Connecting the frame (7) to the first metal part (11) via the first group of fixing elements (19A), Connecting the frame (7) to the first metal part (11) includes inserting the first group of fixing elements (19A) through the through hole (23A) of the frame (7) along the first insertion direction (C), - The second electronic circuit board (3B) and the second metal component (13) are stacked on the frame (7) such that the second electronic circuit board (3B) is positioned between the second metal component (13) and the frame (7), - Includes connecting the second metal part (13) to the frame (7) via the second group of fixing elements (19B), A method for connecting the second metal component (13) to the frame (7) via the second group of fixing elements (19B) is characterized by including inserting the second group of fixing elements (19B) through the through hole (23B) of the second metal component (13) along a second insertion direction D parallel to the first insertion direction C.

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