Optical components, light-emitting devices

Abstract

To improve heat dissipation of optical components while ensuring safety. [Solution] The optical member comprises a wavelength conversion member having a wavelength conversion section and a light-reflecting section surrounding the side surface of the wavelength conversion section; a light-transmitting member joined to the lower surface of the light-reflecting section and encompassing the wavelength conversion section when viewed from below; a conductive film disposed on the lower surface of the light-reflecting section and surrounding the wavelength conversion section; and a heat dissipation section disposed on the lower surface of the light-reflecting section, between the wavelength conversion section and the conductive film, and spaced apart from the conductive film.

Description

Technical Field

[0001] The present disclosure relates to an optical member and a light-emitting device.

Background Art

[0002] A light-emitting element such as a semiconductor laser element can emit light with high output. Therefore, safety considerations may be required for an optical member used in combination with such a light-emitting element.

[0003] For example, in Patent Document 1, in an optical member including a wavelength conversion member having a wavelength conversion portion and a translucent member that covers the wavelength conversion portion in a bottom view, safety measures are taken when an abnormality such as cracking occurs in the wavelength conversion portion. Specifically, a technique is disclosed in which the periphery of the wavelength conversion portion is surrounded by a conductive film, and an abnormality in the wavelength conversion portion is detected based on a change in an electrical connection state that occurs in the conductive film.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] On the other hand, since a light-emitting element such as a semiconductor laser element can emit light with high output, when the light from the light-emitting element enters the wavelength conversion portion, the wavelength conversion portion may generate heat and the light-emitting efficiency of the wavelength conversion portion may decrease.

[0006] An object of the present disclosure is to improve the heat dissipation performance of an optical member while ensuring safety.

Means for Solving the Problems

[0007] An optical member according to one embodiment of the present disclosure comprises: a wavelength conversion member having a wavelength conversion portion and a light-reflecting portion surrounding the side surface of the wavelength conversion portion; a light-transmitting member joined to the lower surface of the light-reflecting portion and encompassing the wavelength conversion portion when viewed from below; a conductive film disposed on the lower surface of the light-reflecting portion and surrounding the wavelength conversion portion; and a heat dissipation portion disposed on the lower surface of the light-reflecting portion, between the wavelength conversion portion and the conductive film, and spaced apart from the conductive film.

[0008] A light-emitting device according to one embodiment of the present disclosure comprises a base having a mounting surface and a frame surrounding the mounting surface, a light-emitting element disposed on the mounting surface, and an optical member according to one embodiment of the present disclosure, wherein the light-transmitting member is joined to the base, and the wavelength conversion unit converts the light emitted by the light-emitting element into light of a different wavelength. [Effects of the Invention]

[0009] According to one embodiment of this disclosure, it is possible to improve the heat dissipation of an optical component while ensuring safety. Furthermore, a light-emitting device using this optical component can be provided. [Brief explanation of the drawing]

[0010] [Figure 1] This is a perspective view of the optical component according to the first embodiment. [Figure 2] This is a bottom view of the wavelength conversion member according to the first embodiment. [Figure 3] This is a top view of a translucent member according to the first embodiment. [Figure 4] This diagram shows a modified example of the heat dissipation section. [Figure 5] This is a perspective view of the light-emitting device according to the second embodiment. [Figure 6] This is a perspective view of the light-emitting device according to the second embodiment, with the light-shielding member removed. [Figure 7] Figure 5 shows a cross-sectional view along the line VII-VII. [Figure 8] This is a perspective view of the light-emitting device according to the second embodiment, with the optical member and light-shielding member removed. [Figure 9]This is a top view of the optical member according to the third embodiment. [Figure 10] This is a bottom view of the wavelength conversion member according to the third embodiment. [Figure 11] This is a top view of the light-transmitting member according to the third embodiment. [Figure 12] This is a top view of the light-emitting device according to the fourth embodiment. [Figure 13] This is a top view of the light-emitting device according to the fourth embodiment, with the optical member and light-shielding member removed. [Modes for carrying out the invention]

[0011] The following description will explain embodiments for carrying out the invention with reference to the drawings. In the following description, terms indicating specific directions or positions (e.g., "up," "down," and other terms including these) will be used as needed. However, the use of these terms is solely to facilitate understanding the invention with reference to the drawings, and the meaning of these terms does not limit the technical scope of the present invention. Furthermore, parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts or components.

[0012] Furthermore, in this disclosure, the term "polygon" refers to polygons such as triangles and quadrilaterals, including shapes where the corners of the polygon have been rounded, chamfered, or otherwise modified. Similarly, shapes where modifications have been made not only to the corners (ends of the sides) but also to the middle parts of the sides will also be referred to as polygons. In other words, shapes that retain the shape of a polygon but have been partially modified are included in the interpretation of "polygon" as described in this disclosure.

[0013] Furthermore, the same applies not only to polygons, but also to words describing specific shapes such as trapezoids, circles, and concave shapes. The same also applies when dealing with each side that forms such a shape. In other words, even if a side has been processed at a corner or in the middle, the interpretation of "side" includes the processed part. When distinguishing a "polygon" or "side" without partial processing from a processed shape, the term "strictly" should be added, for example, "strictly quadrilateral."

[0014] Furthermore, the following embodiments illustrate a light-emitting device or the like for embodying the technical idea of the present invention, and do not limit the present invention thereto. In addition, the dimensions, materials, shapes, relative arrangements, etc. of the constituent parts described below are not intended to limit the scope of the present invention only thereto, but are intended to be illustrative unless specifically described. Also, the content described in one embodiment is applicable to other embodiments and modifications. Also, the sizes and positional relationships of the members shown in the drawings may be exaggerated for clarity of explanation. Furthermore, in order to avoid making the drawings overly complex, schematic diagrams omitting the illustration of some elements may be used, or end views showing only the cut surfaces as cross-sectional views may be used.

[0015] <First Embodiment> FIG. 1 is a perspective view of an optical member according to the first embodiment. FIG. 2 is a bottom view of a wavelength conversion member according to the first embodiment. FIG. 3 is a top view of a light-transmitting member according to the first embodiment. As shown in FIGS. 1 to 3, the optical member 10 includes a wavelength conversion member 20, a light-transmitting member 30, a conductive film 40, and a heat radiating portion 50. The optical member 10 may further include a conductive metal film 60 and an outer metal film 70.

[0016] Each component of the optical member 10 will be described.

[0017] (Wavelength conversion member 20, conductive film 40, heat radiating portion 50, conductive metal film 60, outer metal film 70) The wavelength conversion member 20 has a wavelength conversion portion 21 and a light reflection portion 22. The wavelength conversion portion 21 has an upper surface, a lower surface that is the opposite surface of the upper surface, and one or more side surfaces that intersect the upper surface and the lower surface. The one or more side surfaces connect to the outer edge of the upper surface and the outer edge of the lower surface. The wavelength conversion portion 21 is, for example, a rectangular parallelepiped or a cube. In this case, both the upper surface and the lower surface of the wavelength conversion portion 21 are rectangular, and the wavelength conversion portion 21 has four rectangular side surfaces. The rectangle referred to here is a rectangle or a square.

[0018] Furthermore, the wavelength conversion unit 21 is not limited to a rectangular prism or a cube. In other words, when viewed from above, the wavelength conversion unit 21 is not limited to a rectangle, but can be any shape such as a circle, ellipse, or polygon.

[0019] The wavelength conversion unit 21 converts light of a predetermined wavelength incident from the bottom surface into light of a different wavelength and emits the converted light from the top surface. The wavelength conversion unit 21 may emit only a portion of the incident light. The wavelength conversion unit 21 may convert all of the incident light into light of a different wavelength. In this case, the light incident on the wavelength conversion unit 21 is not emitted from the wavelength conversion unit 21. The wavelength conversion unit 21 can be formed by incorporating a phosphor into the main material.

[0020] Since the wavelength conversion section 21 is irradiated with light, it is preferable that the base material of the wavelength conversion section 21 be formed using an inorganic material that is not easily decomposed by light irradiation as the main material. The main material is, for example, ceramics. Examples of ceramics that can be used as the main material include aluminum oxide, aluminum nitride, silicon oxide, yttrium oxide, zirconium oxide, or magnesium oxide. For the main ceramic material, it is preferable to select a material with a melting point of 1300°C to 2500°C so that the wavelength conversion section 21 does not undergo deformation or discoloration due to heat. The wavelength conversion section 21 is, for example, a sintered body formed with ceramics as the main material.

[0021] The wavelength conversion section 21 can be formed, for example, by sintering a phosphor with a translucent material such as aluminum oxide. The phosphor content can be 0.05% to 50% by volume relative to the total volume of the ceramics. Alternatively, ceramics consisting substantially only of phosphor, obtained by sintering phosphor powder, may be used. Furthermore, the wavelength conversion section 21 may be formed from a single crystal of phosphor.

[0022] Examples of phosphors include cerium-activated yttrium aluminum garnet (YAG), cerium-activated lutetium aluminum garnet (LAG), europium-activated silicate ((Sr,Ba)2SiO4), α-sialon phosphors, and β-sialon phosphors. Among these, YAG phosphors exhibit good heat resistance.

[0023] For example, if the wavelength conversion unit 21 has a YAG phosphor, when blue excitation light is incident from the bottom, the blue excitation light and yellow fluorescence are combined to emit white light from the top.

[0024] The light-reflecting portion 22 is, for example, a frame-shaped member having a rectangular opening. The light-reflecting portion 22 has an upper surface, a lower surface which is the opposite surface of the upper surface, one or more inner surfaces connecting the inner edge of the upper surface and the inner edge of the lower surface, and one or more outer surfaces connecting the outer edge of the upper surface and the outer edge of the lower surface. The outer and inner edges of the upper surface and the outer and inner edges of the lower surface are, for example, rectangular. In this case, the light-reflecting portion 22 has four rectangular inner surfaces and four rectangular outer surfaces. Note that the outer and inner edges of the upper surface and the outer and inner edges of the lower surface are not limited to rectangles, but can be any shape such as circles, ellipses, polygons, etc.

[0025] The light-reflecting portion 22 is, for example, a sintered body formed primarily from ceramics. Examples of ceramics that can be used as the main material include aluminum oxide, aluminum nitride, silicon oxide, yttrium oxide, zirconium oxide, and magnesium oxide. Among these, aluminum oxide is preferred because of its high reflectivity. Furthermore, aluminum oxide is also preferred as a main material because it has relatively high thermal conductivity among these ceramics. The light-reflecting portion 22 does not necessarily have to be made primarily from ceramics. The light-reflecting portion 22 may be formed using, for example, metal or a composite of ceramics and metal.

[0026] In the wavelength conversion member 20, the light reflecting portion 22 surrounds the side surface of the wavelength conversion portion 21. That is, the inner surface of the light reflecting portion 22 is connected to the side surface of the wavelength conversion portion 21. The wavelength conversion member 20 is flat in shape, for example, a rectangular parallelepiped.

[0027] The upper surface of the wavelength conversion section 21 and the upper surface of the light reflection section 22 may form, for example, a single continuous plane. Similarly, the lower surface of the wavelength conversion section 21 and the lower surface of the light reflection section 22 may form, for example, a single continuous plane. The upper and / or lower surfaces of the wavelength conversion section 21 may protrude more than the upper and / or lower surfaces of the light reflection section 22. In this case, a part of the side surface of the wavelength conversion section 21 connects to the inner surface of the light reflection section 22.

[0028] In the wavelength conversion member 20, the wavelength conversion section 21 and the light reflection section 22 can be formed integrally. Alternatively, the wavelength conversion section 21 and the light reflection section 22 may be formed separately and then joined together to form the wavelength conversion member 20. The wavelength conversion section 21 and the light reflection section 22 can be formed integrally, for example, by a sintered body. For example, an integral sintered body can be formed by first forming the sintered body of the wavelength conversion section 21 and then integrally forming the sintered body of the light reflection section 22 with the wavelength conversion section 21. In this case, it is also possible to adjust the proportion of voids (porosity) contained in the formed sintered body in each of the processes for forming the wavelength conversion section 21 and the light reflection section 22. The porosity can be adjusted by sintering conditions (sintering temperature, sintering time, heating rate), material type and particle size, concentration of sintering aid, etc.

[0029] For example, when forming the wavelength conversion section 21 and the light reflection section 22 using the same ceramic material as the main material, the porosity of the light reflection section 22 is made greater than that of the wavelength conversion section 21. In other words, the wavelength conversion member 20 is formed such that the light reflection section 22 contains more voids than the wavelength conversion section 21. In this case, it is preferable to adjust the sintering conditions so that the porosity of the light reflection section 22 is about 10%. This creates a reflection region due to air at the boundary between the side surface of the wavelength conversion section 21 and the inner surface of the light reflection section 22, allowing light that strikes the inner surface of the light reflection section 22 from the wavelength conversion section 21 side to be reflected back to the wavelength conversion section 21 side.

[0030] The conductive film 40 is positioned on the lower surface of the light-reflecting portion 22. The conductive film 40 surrounds the wavelength conversion portion 21 when viewed from below. The conductive film 40 is preferably in the shape of a thin line. A thin line means, for example, a line whose width is narrower than the width of the wavelength conversion portion 21 when viewed from below, and whose length is longer than the outer circumference of the wavelength conversion portion 21. The line width of the conductive film 40 may be 1 / 2 or less of the width of the wavelength conversion portion 21. The width of the wavelength conversion portion 21 here is, for example, the width of the shorter side if the outer shape of the wavelength conversion portion 21 is rectangular, and for example, the width of the shorter axis if the outer shape of the wavelength conversion portion 21 is elliptical. Furthermore, if the outer diameter of the wavelength conversion portion 21 is a shape other than rectangle or ellipse, the width is substantially determined based on these examples.

[0031] The conductive film 40 can be formed using indium tin oxide (ITO). ITO has high transmittance to visible light. The conductive film 40 formed with ITO is translucent and can therefore be considered a translucent conductive film.

[0032] The heat dissipation section 50 is positioned on the lower surface of the light reflection section 22, between the wavelength conversion section 21 and the conductive film 40, and spaced apart from the conductive film 40. The heat dissipation section 50 is an inner metal film provided inside the conductive film 40. This inner metal film may include a plurality of independent metal film portions 51, 52, 53, and 54 (hereinafter referred to as the plurality of metal film portions 51, etc.). The plurality of metal film portions 51, etc. are arranged to surround the wavelength conversion section 21. The heat dissipation section 50 can also be formed from a single metal film portion surrounding the wavelength conversion section 21.

[0033] The two metal film portions 51 and 52 are arranged facing each other with the wavelength conversion section 21 in between, for example, when viewed from below. Similarly, the two metal film portions 53 and 54 are arranged facing each other with the wavelength conversion section 21 in between, for example, when viewed from below. The areas of metal film portion 51 and metal film portion 52 may be approximately equal, and the areas of metal film portion 53 and metal film portion 54 may be approximately equal. The sum of the areas of each of the multiple metal film portions 51, etc. is greater than the area of ​​the conductive film 40. Also, the sum of the areas of each of the multiple metal film portions 51, etc. is greater than the area of ​​the bottom surface of the wavelength conversion section 21.

[0034] The outer shapes of the metal film portions 51 and 52 are, for example, rectangular. In this case, if the outer shape of the wavelength conversion section 21 is rectangular, the metal film portions 51 and 52 and the wavelength conversion section 21 are arranged with their long sides facing the same direction. The outer shapes of the metal film portions 53 and 54 are, for example, square. In this case, if the outer shape of the wavelength conversion section 21 is rectangular, the length of the short side of the wavelength conversion section 21 and the length of one side of the metal film portions 53 and 54 may be equal. The metal film portions 53 and 54 are arranged, for example, within the opposing regions of the metal film portions 51 and 52. In a view from below, the distance between the long sides of the metal film portions 51 and 52 and the long side of the wavelength conversion section 21 opposite to them may be equal to the distance between one side of the metal film portions 53 and 54 and the short side of the wavelength conversion section 21 opposite to it. In a view from below, the shortest distance between the heat dissipation section 50 and the wavelength conversion section 21 is 30 μm or more and 300 μm or less.

[0035] The heat dissipation section 50 is preferably made of a material with better heat dissipation properties than the conductive film 40. Here, a material with good heat dissipation properties is a material with good thermal conductivity, such as a metallic material. The heat dissipation section 50 may be made of a single metallic material or a laminated film of multiple metals. If the conductive film 40 is ITO, the heat dissipation section 50 can be made of, for example, Ti / Pt / Au. Note that the conductive film 40 and the heat dissipation section 50 may be made of the same material.

[0036] The heat dissipation section 50 is formed with a width greater than the line width of the conductive film 40. The width of the heat dissipation section 50 can be the length perpendicular to the outer edge of the wavelength conversion section 21 when viewed from below. The width of the heat dissipation section 50 is more than twice the line width of the conductive film 40. This improves the heat dissipation of the optical member 10 compared to placing the conductive film 40 near the wavelength conversion section 21.

[0037] Furthermore, as shown in Figure 4, for example, the heat dissipation section can have a shape that includes a single rectangular annular first metal film portion 55 surrounding the wavelength conversion section 21. By making the heat dissipation section 50 have the shape shown in Figure 4, the total surface area of ​​the metal film portion can be increased compared to when the heat dissipation section 50 includes multiple metal film portions, thereby improving heat dissipation.

[0038] The conductive metal film 60 connects to the conductive film 40 on the lower surface of the light-reflecting portion 22. At least a portion of the conductive metal film 60 is located outside the conductive film 40. The conductive metal film 60 has a first connecting portion 61 connected to one end of the conductive film 40 and a second connecting portion 62 connected to the other end of the conductive film 40. Viewed from below, the first connecting portion 61 has a first recess 61x that opens toward the second connecting portion 62, and viewed from below, the second connecting portion 62 has a second recess 62x that opens toward the first connecting portion 61. A portion of the first connecting portion 61 extends into the second recess 62x. The conductive metal film 60 can be formed using, for example, Ti / Pt / Au.

[0039] The conductive film 40 is provided so as to have one opening when viewed from below. The conductive metal film 60 is provided so as to have two openings when viewed from below. One of the two openings in the conductive metal film 60 connects to the opening in the conductive film 40. The other of the two openings is an opening that connects to the wavelength conversion section 21, which is located inside the conductive film 40 when viewed from below. In the shape formed by the connection of the conductive film 40 and the conductive metal film 60, there is only one opening that connects to the wavelength conversion section 21.

[0040] The outer metal film 70 is positioned on the lower surface of the light-reflecting portion 22, outside the conductive film 40, and at a distance from the conductive film 40. The outer metal film 70 includes a plurality of independent metal film portions 71, 72, and 73 on the outside of the conductive film 40. The conductive metal film 60 and the outer metal film 70 are arranged to surround the conductive film 40. In other words, the conductive metal film 60, as well as the metal film portions 71, 72, and 73, are arranged to surround the conductive film 40.

[0041] The metal film portion 72 and the conductive metal film 60 are arranged, for example, facing each other with the wavelength conversion portion 21, the conductive film 40, and the heat dissipation portion 50 in between, when viewed from below. Similarly, the metal film portions 71 and 73 are arranged, for example, facing each other with the wavelength conversion portion 21, the conductive film 40, and the heat dissipation portion 50 in between, when viewed from below. The areas of the metal film portion 71 and the metal film portion 73 may be approximately equal. The area of ​​each of the metal film portions 71 and 73 may be larger than the area of ​​each of the metal film portion 72 and the conductive metal film 60. By providing the metal film portions 71, 72, and 73 in this way, the force applied when joining the wavelength conversion member 20 to other components using the outer metal film 70 and the conductive metal film 60 can be equalized to some extent, and the joining becomes stable.

[0042] The outer shapes of the metal film portions 71, 72, and 73 are, for example, rectangular. In this case, if the outer shape of the wavelength conversion section 21 is rectangular, the metal film portion 72 and the wavelength conversion section 21 are arranged with their long sides facing the same direction. The metal film portions 71 and 73 are also arranged with their long sides facing the direction of the short side of the rectangle of the wavelength conversion section 21. The metal film portion 72 and the conductive metal film 60 are arranged, for example, within opposing regions of the metal film portions 71 and 73. By providing the outer metal film 70 and the conductive metal film 60 in this way, a wide area can be secured where the conductive metal film 60 can be provided, and the distance from one opening to the other opening of the conductive metal film 60 can be increased. The outer metal film 70 can be formed using, for example, Ti / Pt / Au.

[0043] (Translucent member 30) The translucent member 30 is a translucent member. Here, translucency means that the transmittance to incident light is 80% or more. The translucent member 30 has an upper surface, a lower surface which is the opposite surface of the upper surface, and side surfaces which intersect with the upper and lower surfaces. The side surfaces connect the outer edge of the upper surface and the outer edge of the lower surface. The translucent member 30 is, for example, a rectangular parallelepiped or a cube. In this case, both the upper and lower surfaces of the translucent member 30 are rectangular, and the translucent member 30 has four rectangular side surfaces.

[0044] Furthermore, the translucent member 30 is not limited to a rectangular parallelepiped or a cube. In other words, when viewed from above, the translucent member 30 is not limited to a rectangle, but can be any shape such as a circle, ellipse, or polygon.

[0045] The translucent member 30 has a base material that is composed of a flat plate shape such as a rectangular parallelepiped. The base material of the translucent member 30 can be formed using, for example, sapphire as the main material. Sapphire is a material that has relatively high transmittance and relatively high strength. In addition to sapphire, translucent materials containing, for example, quartz, silicon carbide, or glass may be used as the main material.

[0046] The translucent member 30 has a first joint 31 on its upper surface. The first joint 31 is, for example, rectangular in shape when viewed from above. That is, the outer edge of the first joint 31 is rectangular when viewed from above, and the inner edge of the first joint 31 is a smaller rectangle than the outer edge. The first joint 31 is, for example, located approximately in the center of the translucent member 30 when viewed from above. The translucent member 30 has a second joint 32 on its upper surface. The second joint 32 is located outside the first joint 31 and spaced apart from it. The first joint 31 and the second joint 32 can be formed using, for example, Ti / Pt / Au.

[0047] The second joint 32 includes a plurality of independent metal film portions 32a, 32b, and 32c on the outside of the first joint 31. The outer shape of the metal film portions 32a, 32b, and 32c is, for example, rectangular. In this case, for example, metal film portion 32a and metal film portion 32c are arranged with their long sides of the rectangle facing the same direction. Also, metal film portion 32b and metal film portions 32a and 32c are arranged with their long sides of the rectangle facing different directions. For example, metal film portion 32b is located in the opposing regions of metal film portions 32a and 32c. The areas of metal film portions 32a and 32c may be approximately equal. The area of ​​each of metal film portions 32a and 32c may be larger than the area of ​​metal film portion 32b.

[0048] The translucent member 30 has a conductive metal film 33 on its upper surface, outside the first joint portion 31. The conductive metal film 33, and the metal film portions 32a, 32b, and 32c are arranged to surround the first joint portion 31. The metal film portion 32b and the conductive metal film 33 are arranged, for example, facing each other with the first joint portion 31 in between when viewed from above. Similarly, the metal film portions 32a and 32c are arranged, for example, facing each other with the first joint portion 31 in between when viewed from above.

[0049] The conductive metal film 33 has a first connecting portion 33a and a second connecting portion 33b. In a top view, the first connecting portion 33a has a first recess 33x that opens toward the second connecting portion 33b, and in a top view, the second connecting portion 33b has a second recess 33y that opens toward the first connecting portion 33a. A portion of the first connecting portion 33a extends into the interior of the second recess 33y. The conductive metal film 33 can be formed using, for example, Ti / Pt / Au.

[0050] The translucent member 30 has wiring 34 on its upper surface, outside the first joint 31 and the second joint 32. The wiring 34 includes a first wiring pattern 34a and a second wiring pattern 34b, which are independent of each other. The first wiring pattern 34a and the second wiring pattern 34b are arranged to surround the first joint 31 and the second joint 32. One end of the first wiring pattern 34a is connected to the first connection portion 33a of the conductive metal film 33, and one end of the second wiring pattern 34b is connected to the second connection portion 33b of the conductive metal film 33. The wiring 34 can be formed using, for example, Ti / Pt / Au.

[0051] The light-transmitting member 30 may have a reflective film 35 on its upper surface. The reflective film 35 is positioned on the upper surface of the light-transmitting member 30, inside the first joint 31, and spaced apart from the first joint 31. The reflective film 35 is an optical film that reflects light of a specific wavelength and transmits light of other wavelengths. For example, a dielectric multilayer film can be used as the reflective film 35. The dielectric multilayer film can be formed by comprising, for example, at least one oxide or nitride selected from the group consisting of Si, Ti, Zr, Nb, Ta, and Al.

[0052] (Optical component 10) In the optical component 10, the wavelength conversion member 20 is joined to the upper surface of the light-transmitting member 30. The wavelength conversion member 20 is, for example, smaller than the light-transmitting member 30 when viewed from above. The light-transmitting member 30 is joined to the lower surface of the light-reflecting portion 22 of the wavelength conversion member 20, and the wavelength conversion portion 21 is enclosed when viewed from below.

[0053] The wavelength conversion member 20 has a light incidence region into which light from the main portion is incident, and a peripheral region thereof. In the wavelength conversion member 20, the wavelength conversion section 21 forms the light incidence region. That is, light incident from the lower surface of the translucent member 30 passes through the translucent member 30 and is incident on the lower surface of the wavelength conversion section 21 of the wavelength conversion member 20. The light incident on the lower surface of the wavelength conversion section 21 is then emitted from the upper surface of the wavelength conversion section 21. In this way, the lower surface of the wavelength conversion section 21 becomes the light incidence surface, and the upper surface of the wavelength conversion section 21 becomes the emission surface for light incident from the lower surface of the translucent member 30 and / or light whose wavelength has been converted by the wavelength conversion section 21.

[0054] When light incident on the wavelength conversion unit 21 is converted in wavelength, the wavelength conversion unit 21 generates heat. If the base material of the translucent member 30 is a material with relatively high thermal conductivity, such as sapphire, the heat generated in the wavelength conversion unit 21 can be dissipated from the translucent member 30. Therefore, in order to improve heat dissipation, it is necessary to efficiently transfer the heat generated in the wavelength conversion unit 21 to the translucent member 30.

[0055] In the optical component 10, the heat dissipation section 50 and the first joint section 31 are joined together. In the optical component 10, the metal film portions 51, 52, 53, and 54 of the heat dissipation section 50 are joined to the first joint section 31 by solder such as Au-Sn. Since the metal film portions 51, 52, 53, and 54 of the heat dissipation section 50 are located close to the wavelength conversion section 21, the heat generated in the wavelength conversion section 21 is efficiently transferred to the light-transmitting member 30 via the heat dissipation section 50 and the first joint section 31, and dissipated from the light-transmitting member 30. This improves the heat dissipation performance of the optical component 10. Note that current paths may occur in the optical component 10. For example, in a light-emitting device equipped with the optical component 10, current may flow through a current path provided in the optical component 10. In such cases, it is preferable that the heat dissipation section 50 does not become a current path in the optical component 10. If the heat dissipation section 50 does not become a current path, the heat dissipation section 50 will not generate heat due to the current, thus further improving the heat dissipation performance of the optical component 10.

[0056] Furthermore, in the optical member 10, the outer metal film 70 and the second joint portion 32 are joined. In the optical member 10, the outer metal film 70 is joined to the second joint portion 32 by solder such as Au-Sn. By joining the outer metal film 70 and the second joint portion 32 on the outer circumference side of the wavelength conversion member 20, the bonding strength between the wavelength conversion member 20 and the light-transmitting member 30 can be improved. Note that some of the heat generated in the wavelength conversion section 21 may be transferred to the light-transmitting member 30 via the outer metal film 70 and the second joint portion 32 and then dissipated from the light-transmitting member 30.

[0057] Furthermore, in the optical component 10, the first connection portion 61 of the conductive metal film 60 is joined to the first connection portion 33a of the conductive metal film 33 by solder such as Au-Sn. Also, the second connection portion 62 of the conductive metal film 60 is joined to the second connection portion 33b of the conductive metal film 33 by solder such as Au-Sn. Through these connections, the first wiring pattern 34a is electrically connected to one end of the conductive film 40 via the first connection portion 33a of the conductive metal film 33 and the first connection portion 61 of the conductive metal film 60. The other end of the conductive film 40 is electrically connected to the second wiring pattern 34b via the second connection portion 33b of the conductive metal film 33 and the second connection portion 62 of the conductive metal film 60. Therefore, by connecting the first wiring pattern 34a and the second wiring pattern 34b to an electrical circuit located outside the optical component 10, current can be passed through the conductive film 40.

[0058] The conductive film 40 is a thin, linear film surrounding the wavelength conversion unit 21. Therefore, if an abnormality such as a crack occurs in the wavelength conversion unit 21, the conductive film 40 will also crack in response to the impact, causing a change in the electrical connection state. Consequently, by monitoring this change (for example, a significant increase in the resistance value of the conductive film 40), an abnormality in the wavelength conversion unit 21 can be detected. For example, the conductive film 40 is electrically connected to a detection circuit located outside the optical member 10. The detection circuit then monitors the change in the resistance value of the conductive film 40, and when the resistance value changes beyond a predetermined threshold, the destruction of the wavelength conversion unit 21 can be detected. This ensures the safety of the optical member 10.

[0059] Furthermore, the conductive film 40 does not pass directly beneath the lower surface of the wavelength conversion unit 21, but rather surrounds the wavelength conversion unit 21. In this way, the light incident on the optical member 10 does not pass through the conductive film 40 but is incident on the wavelength conversion unit 21, allowing light to be efficiently incident on the wavelength conversion unit 21.

[0060] Furthermore, if the translucent member 30 has a reflective film 35, it can transmit light of a predetermined wavelength incident on the translucent member 30 from the outside to the wavelength conversion unit 21, and reflect the light whose wavelength has been converted by the wavelength conversion unit 21. As a result, the luminescence efficiency of the wavelength conversion unit 21 can be improved. For example, light of a predetermined wavelength emitted from a light-emitting element such as a light-emitting diode or a semiconductor laser element can be transmitted to the wavelength conversion unit 21.

[0061] <Second Embodiment> The second embodiment shows an example of a light-emitting device using the optical member according to the first embodiment. Figure 5 is a perspective view of the light-emitting device according to the second embodiment. Figure 6 is a perspective view of the light-emitting device according to the second embodiment with the light-shielding member removed. Figure 7 is a cross-sectional view taken along line VII-VII in Figure 5. Note that wiring 271 and 272 are omitted in Figure 7. Figure 8 is a perspective view of the light-emitting device according to the second embodiment with the wavelength conversion member and light-shielding member removed.

[0062] As shown in Figures 5 to 8, the light-emitting device 200 includes an optical member 10, a base 210, a light-emitting element 220, a submount 230, a light-reflecting member 240, a temperature measuring element 260, wiring 271 and 272, and a light-shielding member 280. The light-emitting device 200 only needs to have at least the optical member 10, the base 210, and the light-emitting element 220.

[0063] The components of the light-emitting device 200 will now be described.

[0064] (base 210) The base 210 has an upper surface 210a, a lower surface 210b, one or more inner surfaces 210c, one or more outer surfaces 210d, and a bottom surface 210e. The bottom surface 210e is the mounting surface on which other components are placed. The base 210 has a concave shape that is recessed from the upper surface 210a to the lower surface 210b. In addition, the base 210 has a rectangular outer shape when viewed from above, and the recess is formed inside this outer shape.

[0065] Furthermore, in a top view, a frame is formed by one or more inner surfaces 210c intersecting the upper surface 210a. That is, the base 210 has a bottom surface 210e and a frame surrounding the bottom surface 210e. The bottom surface 210e is surrounded by this frame. Also, the recess of the base 210 is surrounded by the bottom surface 210e and this frame. Note that a top view refers to viewing the object from the direction normal to the upper surface 210a of the base 210.

[0066] The base portion 210 has one or more stepped portions 216 inside the frame. The stepped portion 216 consists only of an upper surface and a side surface that intersects with the upper surface and extends downward. The one or more inner surfaces 210c include the side surface that intersects with the upper surface 210a of the base portion 210 and the side surface of the stepped portion 216.

[0067] The base portion 210 can be formed using, for example, ceramics as the main material. For example, aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide can be used as the ceramic material. However, the base portion 210 is not limited to ceramics; it may also be formed using other insulating materials as the main material.

[0068] One or more metal films 217 are provided on the bottom surface 210e of the base portion 210. One or more metal films 218 are provided on the top surface 210a of the base portion 210. Furthermore, one or more metal films 217 provided on the bottom surface 210e include metal films 217 that are electrically connected to the metal films 218 provided on the top surface 210a. For example, the metal films 217 provided on the bottom surface 210e and the metal films 218 provided on the top surface 210a are electrically connected via a metal material provided in a via hole. Examples of metal films 217 and 218 can be Ni / Au (metal films stacked in the order of Ni, Au) or Ti / Pt / Au (metal films stacked in the order of Ti, Pt, Au).

[0069] (Light-emitting element 220) The light-emitting element 220 is, for example, a semiconductor laser element. However, the light-emitting element 220 is not limited to a semiconductor laser element; it may also be, for example, a light-emitting diode (LED) or an organic light-emitting diode (OLED).

[0070] In the illustrated example of the light-emitting device 200, two light-emitting elements 220 are mounted. Semiconductor laser elements are used as the two light-emitting elements 220. In addition to the two light-emitting elements 220, the light-emitting device 200 may have one or more further light-emitting elements.

[0071] The light-emitting element 220 has, for example, a rectangular shape when viewed from above. The side where it intersects with one of the two shorter sides of the rectangle becomes the light-emitting surface of the light emitted from the light-emitting element 220. The top and bottom surfaces of the light-emitting element 220 have a larger area than the light-emitting surface.

[0072] Here, we will explain the case where the light-emitting element 220 is a semiconductor laser element. The light (laser light) emitted from the light-emitting element 220 has a broadened shape and forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light-emitting surface. Here, FFP refers to the shape and light intensity distribution of the emitted light at a position away from the light-emitting surface.

[0073] Based on the elliptical light emitted from the light-emitting element 220, the direction passing through the major axis of the ellipse is defined as the fast axis direction of the FFP, and the direction passing through the minor axis of the ellipse is defined as the slow axis direction of the FFP. The fast axis direction of the FFP in the light-emitting element 220 may coincide with the stacking direction in which the multiple semiconductor layers, including the active layer of the light-emitting element 220, are stacked.

[0074] Furthermore, based on the light intensity distribution of the FFP of the light-emitting element 220, 1 / e of the peak intensity value 2 Light with the above intensity will be called the main portion of light. Also, in this light intensity distribution, 1 / e 2 The angle corresponding to the intensity of the FFP is called the spreading angle. The spreading angle of the FFP in the fast axis direction is greater than the spreading angle of the FFP in the slow axis direction.

[0075] Furthermore, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the light intensity distribution of the FFP, will be referred to as light traveling along the optical axis, or light passing through the optical axis. The optical path of light traveling along the optical axis will be referred to as the optical axis of that light.

[0076] The light-emitting element 220 can be one in which the emission peak wavelength of the light emitted from the light-emitting element 220 is in the range of 320 nm to 530 nm, typically in the range of 430 nm to 480 nm. Examples of such light-emitting elements 220 include semiconductor laser elements containing nitride semiconductors. Examples of nitride semiconductors that can be used include GaN, InGaN, or AlGaN. However, the emission peak wavelength of the light emitted from the light-emitting element 220 is not limited to these.

[0077] (Submount 230) The submount 230 is, for example, configured in the shape of a rectangular parallelepiped and has a bottom surface, a top surface, and one or more sides. The submount 230 has the smallest width in the vertical direction. Note that the shape is not limited to a rectangular parallelepiped. The submount 230 is formed using, for example, aluminum nitride or silicon carbide, but other materials may be used. In addition, a metal film is provided on the top surface of the submount 230.

[0078] (Light-reflecting member 240) The light-reflecting member 240 has a light-reflecting surface 241 that reflects light. The light-reflecting surface 241 is, for example, a surface whose light reflectance with respect to the peak wavelength of the irradiated light is 90% or more. The light reflectance here may be 100% or less than 100%.

[0079] Furthermore, the light-reflecting member 240 may have a plurality of light-reflecting surfaces 241. The plurality of light-reflecting surfaces 241 may include, for example, two light-reflecting surfaces 241 that are both planar inclined with respect to the lower surface, and have different inclination angles with respect to the lower surface. Neither of these two light-reflecting surfaces 241 is positioned perpendicularly or parallel to the lower surface. Also, the two light-reflecting surfaces 241 are continuously connected, forming a single integrated reflective region. Note that the shape of the light-reflecting surface 241 is not limited to a planar shape, but may also be, for example, a curved shape.

[0080] The light-reflecting member 240 preferably uses a heat-resistant material as its main material. For example, glass such as quartz or BK7 (borosilicate glass), metals such as aluminum, or Si can be used. The light-reflecting surface 241 can be formed using, for example, metals such as Ag or Al, or dielectric multilayer films of Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2. Note that A / B indicates a multilayer film in which film A and film B are stacked in order.

[0081] (Temperature measuring element 260) The temperature measuring element 260 is an element used as a temperature sensor to measure the ambient temperature. For example, a thermistor can be used as the temperature measuring element 260.

[0082] (Wiring 271, 272) Wires 271 and 272 are composed of conductive materials having a linear shape with joints at both ends. In other words, wires 271 and 272 have joints at both ends of the linear portion for joining with other components. Wires 271 and 272 are used for electrical connection between two components. For example, metal wires can be used as wires 271 and 272. Examples of metals include gold, aluminum, silver, and copper.

[0083] (Light-shielding member 280) The light-shielding member 280 can be formed, for example, from a resin having light-shielding properties. Here, light-shielding properties refer to the property of not transmitting light, and in addition to the property of blocking light, light-absorbing properties or reflective properties may also be used to achieve light-shielding. The light-shielding member 280 can be formed, for example, by incorporating fillers such as light-diffusing materials and / or light-absorbing materials into a resin.

[0084] Examples of resins used to form the light-shielding member 280 include epoxy resin, silicone resin, acrylate resin, urethane resin, phenolic resin, and BT resin. Examples of light-absorbing fillers contained in the light-shielding member 280 include dark-colored pigments such as carbon black.

[0085] (Light-emitting device 200) In the light-emitting device 200, two light-reflecting members 240 are arranged on the bottom surface 210e of the base 210. The two light-reflecting members 240 are each placed on different metal films, and their lower surfaces are joined to the bottom surface 210e of the base 210. In a plan view, the upper ends of the light-reflecting surfaces 241 of the two light-reflecting members 240 are parallel or perpendicular to the inner surface 210c or outer surface 210d of the base 210. Here, the difference between parallel and perpendicular is allowed to be within ±5 degrees.

[0086] A temperature measuring element 260 is positioned on the bottom surface 210e of the base portion 210. The temperature measuring element 260 is positioned on and bonded to a metal film different from the metal film on which the two light-reflecting members 240 are arranged.

[0087] Two submounts 230 are positioned on the bottom surface 210e of the base 210. Each of the two submounts 230 is positioned on a different metal film, and its lower surface is joined to the bottom surface 210e of the base 210. Furthermore, each of the two submounts 230 is positioned on a metal film on which a light-reflecting member 240 is positioned. Note that the submounts 230 and the light-reflecting member 240 may be positioned on different metal films.

[0088] The light-emitting element 220 is positioned on the bottom surface 210e of the base 210. Specifically, the light-emitting element 220 is positioned on a submount 230. In the illustrated example of the light-emitting device 200, two light-emitting elements 220 are positioned on the upper surfaces of different submounts 230, with the lower surfaces of the submounts 230 joined to the bottom surface 210e of the base 210. The light-emitting elements 220 are positioned so that their light-emitting surfaces face the same direction as one side of the submount 230.

[0089] In a plan view, the light-emitting surfaces of the two light-emitting elements 220 are not parallel or perpendicular to the inner surface 210c or outer surface 210d of the base 210. Therefore, the light-emitting surfaces are not parallel or perpendicular to the upper end of the light-reflecting surface 241. In other words, in a plan view, the light-emitting surfaces of the light-emitting elements 220 are positioned at an angle to the inner surface 210c and outer surface 210d of the base 210, or to the upper end of the light-reflecting surface 241.

[0090] In each of the two light-emitting elements 220, the light emitted from the light-emitting surface is directed onto the corresponding light-reflecting member 240. The corresponding light-reflecting member 240 is a light-reflecting member 240 located on the same metal film. The light-emitting elements 220 are positioned such that at least the main portion of the light is directed onto the light-reflecting surface 241.

[0091] The submount 230 on which the light-emitting element 220 is arranged can function as a heat dissipation member in the light-emitting device 200 to release the heat generated from the light-emitting element 220. In order for the submount 230 to function as a heat dissipation member, it should be formed from a material with better thermal conductivity than the light-emitting element 220. Furthermore, if it is formed from a material with better thermal conductivity than the bottom surface 210e of the base 210, an even higher heat dissipation effect can be obtained.

[0092] The light-emitting element 220 and the temperature measuring element 260 are electrically connected to a metal film 217 provided on the bottom surface 210e of the base 210 via corresponding wiring 271. The metal film 217 provided on the bottom surface 210e of the base 210 is used for the electrical connection between these elements and the external power supply. This allows these elements to be electrically connected to the external power supply via the metal film 217 on the top surface 210a of the base 210.

[0093] The optical member 10 is joined to the base 210. The light-transmitting member 30 of the optical member 10 is joined to the base 210. In detail, the outer periphery of the lower surface of the light-transmitting member 30 of the optical member 10 is joined to the upper surface of the stepped portion 216 of the base 210. For example, a metal film provided in the outer periphery region of the lower surface of the light-transmitting member 30 and a metal film provided on the upper surface of the stepped portion 216 are joined and fixed via Au-Sn or the like. The light-transmitting member 30 is joined to the base 210 with the wavelength conversion member 20 joined to its upper surface. Therefore, the light-transmitting member 30 is positioned on the upper surface 210a of the base 210, and the wavelength conversion member 20 is positioned on the upper surface of the light-transmitting member 30.

[0094] By joining the translucent member 30 to the base 210, a closed space is formed in which the light-emitting element 220 is located. In this way, the translucent member 30 can function as a lid in the light-emitting device 200. Furthermore, this closed space is formed in an hermetically sealed state. Hermetically sealing prevents organic matter and other particles from accumulating on the light-emitting surface of the light-emitting element 220.

[0095] Six independent metal films 218 are provided on the upper surface 210a of the base portion 210. These six metal films 218 include two metal films 218 for supplying power to the light-emitting element 220, two metal films 218 for supplying power to the temperature measuring element 260, and two metal films 218 for supplying power to the conductive film 40. However, the manner of power supply is not limited to this. For example, if there is no temperature measuring element 260, then these metal films do not need to be provided. Also, for example, the metal films 218 may be used for other purposes.

[0096] The light-emitting device 200 has wiring 272 that is joined to the base 210 and the optical member 10. Specifically, a portion of the wiring 272 electrically connects a metal film provided on one stepped portion 216 of the base 210 to a first wiring pattern 34a provided on the upper surface of the optical member 10. The other portion of the wiring 272 electrically connects another metal film provided on another stepped portion 216 of the base 210 to a second wiring pattern 34b. The conductive film 40 is electrically connected to the metal film provided on the base 210 via the wiring 272. In addition, the one metal film and the other metal film provided on the stepped portion 216 are electrically connected to two of the metal films 218 provided on the upper surface 210a of the base 210. As a result, power can be supplied to the conductive film 40 from two of the metal films 218 via the wiring 272, etc.

[0097] The main portion of the light emitted by the light-emitting element 220 enters the light-transmitting member 30. The main portion of the light emitted by the light-emitting element 220 also passes through the light-transmitting member 30 and enters the wavelength conversion section 21 of the wavelength conversion member 20. The light-transmitting member 30 is transparent to the light emitted by the light-emitting element 220. Here, transparency means that the transmittance to the light emitted by the light-emitting element 220 is 80% or more.

[0098] The wavelength conversion unit 21 converts the light emitted by the light-emitting element 220 into light of a different wavelength. Part or all of the light incident on the wavelength conversion unit 21 is converted into light of a different wavelength by the wavelength conversion unit 21. The light incident on the wavelength conversion unit 21 or the light whose wavelength has been converted by the wavelength conversion unit 21 is emitted from the upper surface of the wavelength conversion unit 21 to the outside of the light-emitting device 200. In other words, the upper surface of the wavelength conversion unit 21 becomes the light output surface of the light-emitting device 200.

[0099] The light-shielding member 280 is formed inside the frame created by the upper surface 210a of the base 210. The light-shielding member 280 is formed to fill the gap between the base 210 and the optical member 10. The light-shielding member 280 can be formed, for example, by pouring in a thermosetting resin and curing it with heat. By providing the light-shielding member 280, light leakage is suppressed.

[0100] The light-shielding member 280 is in contact with the inner surface 210c that intersects with the upper surface 210a of the base 210, the upper surface of the stepped portion 216 of the base 210, the side surface of the light-transmitting member 30, the upper surface of the light-transmitting member 30, and the side surface of the optical member 10. However, it does not reach the upper surface of the optical member 10. Alternatively, even if it reaches the upper surface of the light-reflecting portion 22, it does not reach the upper surface of the wavelength-converting portion 21.

[0101] The resin constituting the light-shielding member 280 may enter the gap between the wavelength conversion member 20 and the light-transmitting member 30 through the gap between the metal film portion 71 and the metal film portion 72, the gap between the metal film portion 72 and the metal film portion 73, the gap between the metal film portion 71 and the first connecting portion 61, and / or the gap between the metal film portion 73 and the second connecting portion 62. The resin constituting the light-shielding member 280 may enter the gap between the wavelength conversion member 20 and the light-transmitting member 30 and cover the side surface of the conductive film 40.

[0102] Furthermore, it is preferable that the resin constituting the light-shielding member 280 does not penetrate inside the conductive film 40. This is because if the resin constituting the light-shielding member 280 reaches the lower surface of the wavelength conversion section 21, it will hinder the extraction of light. In particular, if the light-shielding member 280 is formed from a light-shielding resin, at least a portion of the light traveling from the light-emitting element 220 to the wavelength conversion section 21 may be blocked. The optical member 10 has a conductive film 40 surrounding the wavelength conversion section 21, and further has a heat dissipation section 50 inside the conductive film 40, so it is possible to suppress the resin constituting the light-shielding member 280 from reaching the lower surface of the wavelength conversion section 21.

[0103] The conductive film 40 and the conductive metal film 60 are electrically connected to the outside of the light-emitting device 200 and serve as current paths. On the other hand, the heat dissipation section 50 and the outer metal film 70 do not serve as current paths. Discharge may occur in the conductive film 40 and the conductive metal film 60, which serve as current paths. However, because the conductive film 40 is narrow and thin, when a discharge occurs, it is prone to electrostatic discharge and breakage. The insulating resin constituting the light-shielding member 280 covers the sides of the conductive film 40, thereby suppressing the occurrence of discharge in the conductive film 40 and protecting the conductive film 40 from electrostatic discharge.

[0104] Furthermore, as mentioned above, in the conductive metal film 60, a portion of the first connection portion 61 extends into the inside of the second recess 62x. This structure makes it difficult for the resin constituting the light-shielding member 280 to enter the gap between the first connection portion 61 and the second recess 62x. As a result, discharge is more likely to occur between the first connection portion 61 and the second connection portion 62, which are in close proximity to each other. By actively generating discharge between the first connection portion 61 and the second connection portion 62 in this way, discharge in the conductive film 40 can be suppressed, and the conductive film 40 can be protected from electrostatic discharge damage.

[0105] Furthermore, if the light-emitting element 220 is a semiconductor laser element, the light emission intensity is greater than that of a light-emitting diode, etc., which can lead to increased heat generation in the wavelength conversion unit 21 and a decrease in the luminescence efficiency of the wavelength conversion unit 21. However, as mentioned above, in the optical component 10 of the light-emitting device 200, the metal film portions 51, 52, 53, and 54 of the heat dissipation section 50 are positioned close to the wavelength conversion unit 21. Therefore, the heat generated in the wavelength conversion unit 21 can be efficiently transferred to the light-transmitting member 30 and dissipated from the light-transmitting member 30. As a result, even if the light-emitting element 220 is a semiconductor laser element, a decrease in the luminescence efficiency of the wavelength conversion unit 21 can be suppressed.

[0106] The light-emitting device 200 can be used, for example, in a vehicle's headlight. However, the light-emitting device 200 is not limited to this and can be used as a light source for lighting, projectors, head-mounted displays, and other displays such as backlights.

[0107] <Third Embodiment> The third embodiment shows an example of an optical member equipped with multiple wavelength conversion units. Figure 9 is a top view of the optical member according to the third embodiment. Figure 10 is a bottom view of the wavelength conversion member according to the third embodiment. Figure 11 is a top view of the translucent member according to the third embodiment. In Figures 9 to 11, mutually orthogonal X and Y directions are defined.

[0108] As shown in Figures 9 to 11, the optical member 10A comprises a plurality of wavelength conversion members 20A, a light-transmitting member 30A, a conductive film 40A, and a heat dissipation section 50A. The illustrated optical member 10A, as an example, comprises five wavelength conversion members 20A. The optical member 10A may further comprise a conductive metal film 60A and an outer metal film 70A.

[0109] The individual components of the optical element 10A will now be described.

[0110] (Wavelength conversion component 20A, conductive film 40A, heat dissipation section 50A, conductive metal film 60A, outer metal film 70A) Each wavelength conversion member 20A is rectangular in shape when viewed from above, and is arranged at predetermined intervals in the X direction with the longer side of the rectangle facing the Y direction. Each wavelength conversion member 20A has a wavelength conversion section 23 and a light reflection section 24. Each wavelength conversion section 23 is spaced apart from each other, for example, when viewed from below, the centers of each wavelength conversion section 23 are aligned on a straight line parallel to the X direction. The structure, function, and suitable materials of the wavelength conversion section 23 and the light reflection section 24 are the same as those of the wavelength conversion section 21 and the light reflection section 22.

[0111] The conductive film 40A is positioned on the lower surface of the light-reflecting portion 24. The conductive film 40A surrounds the wavelength conversion portion 23 when viewed from below. The conductive film 40A is preferably in the shape of a thin line. The heat dissipation portion 50A is positioned on the lower surface of the light-reflecting portion 24, between the wavelength conversion portion 23 and the conductive film 40A, and is spaced apart from the conductive film 40A. The heat dissipation portion 50A is an inner metal film provided inside the conductive film 40A. This inner metal film includes one metal film portion that surrounds the wavelength conversion portion 23. One end of the heat dissipation portion 50A and the other end are not connected. When viewed from below, one end of the heat dissipation portion 50A is closer to the wavelength conversion portion 23 than the other end of the heat dissipation portion 50A, and the two ends of the heat dissipation portion 50A have opposing portions. Viewed from below, the shortest distance between the heat dissipation section 50A and the wavelength conversion section 23 is between 30 μm and 300 μm.

[0112] The conductive metal film 60A is connected to the conductive film 40A on the lower surface of the light-reflecting portion 24. At least a portion of the conductive metal film 60A is located on the outside (Y-side) of the conductive film 40A. The conductive metal film 60A has a first connecting portion 63 connected to one end of the conductive film 40A and a second connecting portion 64 connected to the other end of the conductive film 40A. Viewed from below, the first connecting portion 63 has a first recess 63x that opens toward the second connecting portion 64, and viewed from below, the second connecting portion 64 has a second recess 64x that opens toward the first connecting portion 63. A portion of the first connecting portion 63 extends inside the second recess 64x.

[0113] The outer metal film 70A is positioned on the lower surface of the light-reflecting portion 24, outside (Y+ side) of the conductive film 40A, and at a distance from the conductive film 40A. The outer metal film 70A includes mutually independent metal film portions 74 and 75 aligned in the X direction on the outer (Y+ side) of the conductive film 40A. The conductive metal film 60A and the outer metal film 70A are positioned opposite each other, for example, when viewed from below, with the wavelength conversion portion 23, the conductive film 40A, and the heat dissipation portion 50A in between. The areas of metal film portion 74 and metal film portion 75 may be approximately equal. The area of ​​each of the metal film portions 74 and 75 is, for example, larger than the area of ​​the lower surface of the wavelength conversion portion 23.

[0114] The outer metal film 70A is not positioned in the region opposite to the wavelength conversion section 23, the conductive film 40A, and the heat dissipation section 50A in the X direction when viewed from below. The outer metal film 70A is positioned parallel to the X direction when viewed from below, and does not pass through any imaginary lines that pass through the wavelength conversion section 23, the conductive film 40A, and the heat dissipation section 50A. As a result, the multiple wavelength conversion sections 23 aligned in the X direction can be positioned closer together compared to when the outer metal film is provided in this region.

[0115] (Transparent member 30A) The translucent member 30A has an upper surface, a lower surface which is the opposite surface of the upper surface, and side surfaces which intersect with the upper and lower surfaces. The structure, function, and suitable materials of the translucent member 30A are the same as those of the translucent member 30.

[0116] On the upper surface of the translucent member 30A, multiple regions are defined where the first joint portion 131, the second joint portion 132, and the conductive metal film 133 are arranged. In the illustrated example, the translucent member 30A has five regions on its upper surface. Here, each region is conveniently denoted by the symbols A to E. Regions A to E are rectangular in shape when viewed from above, and are arranged at predetermined intervals in the X direction with the longer side of the rectangle facing the Y direction.

[0117] The first joint 131 is positioned, for example, approximately in the center of regions A to E in a top view. In a top view, the first joint 131 includes, for example, a closed rectangular frame-shaped portion and an L-shaped portion connected to one corner of the rectangular frame-shaped portion. Each first joint 131 is spaced apart from the others, and is positioned, for example, such that in a top view, the centers of the rectangular frame-shaped portions lie on a straight line parallel to the X direction.

[0118] The translucent member 30A has a second joint portion 132 located outside (Y+ side) of the first joint portion 131 in the upper surface regions A to E, and spaced apart from the first joint portion 131. The second joint portion 132 includes independent metal film portions 132a and 132b aligned in the X direction. The outer shapes of the metal film portions 132a and 132b are, for example, rectangular. The areas of the metal film portion 132a and the metal film portion 132b may be approximately equal.

[0119] The translucent member 30A has a conductive metal film 133 on the outside (Y-side) of the first joint 131 in regions A to E of its upper surface. The conductive metal film 133 and the second joint 132 are arranged to face each other with the first joint 31 in between. The conductive metal film 133 has a first connecting portion 133a and a second connecting portion 133b. In a top view, the first connecting portion 133a has a first recess 133x that opens toward the second connecting portion 133b, and in a top view, the second connecting portion 133b has a second recess 133y that opens toward the first connecting portion 133a. A part of the first connecting portion 133a extends inside the second recess 133y.

[0120] The translucent member 30A has wiring 134 on its upper surface, outside of regions A to E. The wiring 134 has multiple independent wiring patterns. The number of wiring patterns is one greater than the number of regions. In the illustrated example, for the five regions A to E, the wiring 134 has a first wiring pattern 134a, a second wiring pattern 134b, a third wiring pattern 134c, a fourth wiring pattern 134d, a fifth wiring pattern 134e, and a sixth wiring pattern 134f. The first wiring pattern 134a, the second wiring pattern 134b, the third wiring pattern 134c, the fourth wiring pattern 134d, the fifth wiring pattern 134e, and the sixth wiring pattern 134f extend in the Y direction.

[0121] Multiple wiring patterns 134a, 134b, 134c, 134d, 134e, and 134f (hereinafter referred to as wiring patterns 134a, etc.) are arranged side by side in the X direction. One region is sandwiched between two wiring patterns. Among the multiple wiring patterns 134a, etc., all wiring patterns except those located at both ends are wiring patterns that sandwich one adjacent region and also sandwich the other. In the illustrated example, region A is sandwiched from both sides in the X direction by the first wiring pattern 134a and the second wiring pattern 134b, region B by the second wiring pattern 134b and the third wiring pattern 134c, region C by the third wiring pattern 134c and the fourth wiring pattern 134d, region D by the fourth wiring pattern 134d and the fifth wiring pattern 134e, and region E by the fifth wiring pattern 134e and the sixth wiring pattern 134f.

[0122] A wiring pattern that encloses both adjacent regions is connected to the metal film portion 132b and the second connection portion 133b of one region, and to the metal film portion 132a and the first connection portion 133a of the other region. One end of the wiring patterns positioned at both ends is connected to the metal film portion 132a and the first connection portion 133a of the region, and the other end is connected to the metal film portion 132b and the second connection portion 133b of the region.

[0123] In the illustrated example, the first wiring pattern 134a is connected to the metal film portion 132a and the first connection portion 133a in region A. The second wiring pattern 134b is connected to the metal film portion 132b and the second connection portion 133b in region A, and to the metal film portion 132a and the first connection portion 133a in region B. The third wiring pattern 134c is connected to the metal film portion 132b and the second connection portion 133b in region B, and to the metal film portion 132a and the first connection portion 133a in region C. The fourth wiring pattern 134d is connected to the metal film portion 132b and the second connection portion 133b in region C, and to the metal film portion 132a and the first connection portion 133a in region D. The fifth wiring pattern 134e is connected to the metal film portion 132b and the second connection portion 133b in region D, and to the metal film portion 132a and the first connection portion 133a in region E. The sixth wiring pattern 134f is connected to the metal film portion 132b and the second connection portion 133b of region E.

[0124] The translucent member 30A may have a reflective film 135 in regions A to E on its upper surface. The reflective film 135 is positioned inside the first joint 131, at a distance from the first joint 131, in regions A to E on the upper surface of the translucent member 30A. The function and suitable materials of the reflective film 135 are the same as those of the reflective film 35.

[0125] (Optical component 10A) In the optical component 10A, a wavelength conversion member 20A is joined to the upper surface of the light-transmitting member 30A. The wavelength conversion member 20A is, for example, smaller than the light-transmitting member 30A when viewed from above. The light-transmitting member 30A is joined to the lower surface of the light-reflecting portion 24 of the wavelength conversion member 20A, and the wavelength conversion portion 23 is enclosed when viewed from below. In the optical component 10A, it is possible to independently convert the wavelength of light incident on each wavelength conversion portion 23.

[0126] In the optical component 10A, each heat dissipation section 50A is joined to the first joint 131 in each region of the translucent component 30A by solder such as Au-Sn. Since each heat dissipation section 50A is located close to each wavelength conversion section 23, the heat generated in each wavelength conversion section 23 is efficiently transferred to the translucent component 30A via each heat dissipation section 50A and each first joint 131, and dissipated from the translucent component 30A. This improves the heat dissipation performance of the optical component 10A. It is preferable that the heat dissipation sections 50A do not become current paths when the optical component 10A is mounted on a light-emitting device. If the heat dissipation sections 50A do not become current paths, the heat dissipation sections 50A do not generate heat due to current, and thus the heat dissipation performance of the optical component 10A can be further improved.

[0127] Furthermore, in the optical member 10A, each outer metal film 70A is joined to the second joint portion 132 in each region of the translucent member 30A by solder such as Au-Sn. Each heat dissipation portion 50A and each first joint portion 131 of the translucent member 30A are joined on the central side of each wavelength conversion member 20A, and each outer metal film 70A and the second joint portion 132 in each region of the translucent member 30A are joined on the outer periphery side of the wavelength conversion member 20A, thereby improving the bonding strength between each wavelength conversion member 20A and the translucent member 30A. Note that some of the heat generated in the wavelength conversion portion 23 may be transferred to the translucent member 30A via the outer metal film 70A and the second joint portion 132, and may be dissipated from the translucent member 30A.

[0128] Furthermore, in the optical member 10A, the first connection portion 63 of each conductive metal film 60A is joined to the first connection portion 133a of the conductive metal film 133 in the corresponding region of the translucent member 30A located below each wavelength conversion member 20A. In addition, the second connection portion 64 of each conductive metal film 60A is joined to the second connection portion 133b of the conductive metal film 133 in the corresponding region of the translucent member 30A located below each wavelength conversion member 20A. By joining in this manner, multiple wavelength conversion members 20A can be electrically connected in series.

[0129] Each conductive film 40A is a thin, linear film surrounding each wavelength conversion section 23. Therefore, similar to the conductive film 40 of the optical component 10, the failure of each wavelength conversion section 23 can be detected by monitoring changes in the electrical connection state of each conductive film 40A. This ensures the safety of the optical component 10A. Furthermore, if safety is compromised if any one of the multiple wavelength conversion sections 23 is destroyed, the failure can be detected by electrically connecting multiple wavelength conversion components 20A in series.

[0130] Furthermore, each conductive film 40A does not pass directly beneath the lower surface of each wavelength conversion section 23, but rather surrounds each wavelength conversion section 23. In this way, the light incident on each wavelength conversion section 20A of the optical member 10A does not pass through each conductive film 40A, but instead enters each wavelength conversion section 23, thus allowing light to be efficiently incident on each wavelength conversion section 23.

[0131] <Fourth Embodiment> The fourth embodiment shows an example of a light-emitting device using the optical member according to the third embodiment. Figure 12 is a top view of the light-emitting device according to the fourth embodiment. Figure 13 is a top view of the light-emitting device according to the fourth embodiment with the wavelength conversion member and light-shielding member removed.

[0132] As shown in Figures 12 and 13, the light-emitting device 200A includes an optical member, a base 210, a plurality of light-emitting elements 220, one or more submounts 230, one or more light-reflecting members 240, and a light-shielding member 280. The light-emitting device 200A only needs to have at least an optical member 10A, a base 210, and two or more light-emitting elements 220.

[0133] In the illustrated example of the light-emitting device 200A, five light-reflecting members 240 are arranged on the bottom surface of the base 210. Each of the five light-reflecting members 240 is placed on a different metal film, and its lower surface is joined to the bottom surface of the base 210. The five light-reflecting members 240 are arranged, for example, at predetermined intervals in the X direction when viewed from above.

[0134] In the illustrated example of the light-emitting device 200A, five submounts 230 are arranged on the bottom surface of the base 210. Each of the five submounts 230 is placed on a different metal film, and its lower surface is joined to the bottom surface of the base 210. The five submounts 230 are, for example, rectangular in shape when viewed from above, and are arranged at predetermined intervals in the X direction with the longer side of the rectangle facing the Y direction. Furthermore, each of the five submounts 230 is placed on a metal film on which a light-reflecting member 240 is placed. Note that the submounts 230 and the light-reflecting members 240 may be placed on different metal films.

[0135] Each light-emitting element 220 is positioned on the bottom surface of the base 210. Specifically, the light-emitting elements 220 are positioned on a submount 230. In the illustrated example of the light-emitting device 200A, five light-emitting elements 220 are positioned on the upper surfaces of different submounts 230, with the lower surfaces of the submounts 230 joined to the bottom surface of the base 210. The five light-emitting elements 220 are, for example, rectangular in shape when viewed from above, and are positioned at predetermined intervals in the X direction with the longer side of the rectangle facing the Y direction. When viewed from above, the light-emitting surface of each light-emitting element 220 is parallel or perpendicular to the inner or outer surface 210d of the base 210. Each light-emitting element 220 is positioned with its light-emitting surface facing the same direction.

[0136] Each light-reflecting member 240 has a light-reflecting surface that is inclined toward each light-emitting element 220. In each light-emitting element 220, the light emitted from the light-emitting surface is irradiated onto the light-reflecting surface of the corresponding light-reflecting member 240. The corresponding light-reflecting member 240 is a light-reflecting member 240 located on the same metal film. The light-emitting elements 220 are arranged such that at least the light from the main portion is irradiated onto the light-reflecting surface.

[0137] The main portion of the light emitted by each light-emitting element 220 is reflected by the light-reflecting surface of the corresponding light-reflecting member 240 and incident on the translucent member. The main portion of the light reflected by the light-reflecting surface of each light-reflecting member 240 passes through the translucent member and then incident on each wavelength conversion unit 23. Some or all of the light incident on each wavelength conversion unit 23 is converted into light of a different wavelength by each wavelength conversion unit 23. The light incident on each wavelength conversion unit 23 or the light whose wavelength has been converted by each wavelength conversion unit 23 is emitted from the top surface of each wavelength conversion unit 23 to the outside of the light-emitting device 200A. Each light-emitting element 220 can be driven independently.

[0138] The light-emitting device 200A can be used, for example, in automotive headlights. Furthermore, the light-emitting device 200A can be used as a light source for lighting, projectors, head-mounted displays, and other displays such as backlights.

[0139] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims. [Explanation of symbols]

[0140] 10,10A Optical components 20,20A Wavelength Conversion Component 21, 23 wavelength conversion section 22,24 Light reflecting part 30,30A Translucent material 31,131 1st joint 32,132 2nd joint 32a,32b,32c,51,52,53,54,71,72,73,74,75,132a,132b Metal film part 33,133 Conductive metal film 33a, 61, 63, 133a First connection section 33x, 61x, 63x, 133x First recess 33y, 62x, 64x, 133y Second recess 33b, 62, 64, 133b Second connection section 34,134 wiring 34a, 134a First wiring pattern 34b, 134b Second wiring pattern 35,135 Reflective film 40,40A conductive film 50,50A heat dissipation section 55 First metal film part 60,60A conductive metal film 70,70A outer metal membrane 134c Third wiring pattern 134d Fourth wiring pattern 134e Fifth wiring pattern 134f 6th wiring pattern 200, 200A Light-emitting device 210 base 210a top side 210b Bottom side 210c inner surface 210d outer surface 210e bottom 216 Stepped section 217, 218 Metal film 220 light-emitting elements 230 Submount 240 Light-reflecting member 241 Light reflective surface 260 Temperature measurement buttons 271,272 Wiring 280 Light-shielding material

Claims

1. A wavelength conversion member having a wavelength conversion section and a light reflecting section surrounding the side surface of the wavelength conversion section, A light-transmitting member is joined to the lower surface of the light-reflecting portion and, when viewed from below, encloses the wavelength conversion portion. A conductive film is disposed on the lower surface of the light-reflecting portion and surrounds the wavelength conversion portion, An optical member comprising, on the lower surface of the light-reflecting portion, a heat dissipation portion disposed between the wavelength conversion portion and the conductive film, spaced apart from the conductive film.

2. The optical member according to claim 1, wherein the heat dissipation portion is an inner metal film provided inside the conductive film.

3. The inner metal film includes a plurality of independent metal film portions, The optical member according to claim 2, wherein the plurality of metal film portions are arranged to surround the wavelength conversion portion.

4. The optical member according to claim 2, wherein the inner metal film includes a first metal film portion surrounding the wavelength conversion portion.

5. The optical member according to any one of claims 1 to 4, wherein, when viewed from below, the shortest distance between the heat dissipation portion and the wavelength conversion portion is 30 μm or more and 300 μm or less.

6. The light-transmitting member, on its upper surface, The optical member according to any one of claims 1 to 5, having a first joining portion that joins with the heat dissipation portion.

7. The optical member according to any one of claims 1 to 6, further comprising a conductive metal film connected to the conductive film on the lower surface of the light-reflecting portion.

8. The optical member according to claim 7, wherein at least a portion of the conductive metal film is located on the outside of the conductive film.

9. The optical member according to claim 7 or 8, further comprising an outer metal film disposed on the lower surface of the light-reflecting portion, outside the conductive film and spaced apart from the conductive film.

10. The optical member according to claim 9, wherein the outer metal film includes a plurality of independent metal film portions on the outside of the conductive film.

11. The optical member according to claim 9 or 10, wherein the conductive metal film and the outer metal film are arranged to surround the conductive film.

12. The conductive metal film has a first connecting portion connected to one end of the conductive film and a second connecting portion connected to the other end of the conductive film. Viewed from below, the first connecting portion has a first recess that opens to the side of the second connecting portion. Viewed from below, the second connecting portion has a second recess that opens to the side of the first connecting portion. The optical member according to claim 11, wherein a part of the first connecting portion fits inside the second recess.

13. The light-transmitting member, on its upper surface, The optical member according to any one of claims 9 to 11, having a second bonding portion that bonds with the outer metal film.

14. A base having a mounting surface and a frame surrounding the mounting surface, A light-emitting element arranged on the aforementioned mounting surface, The optical member described in any one of claims 1 to 13, The light-transmitting member is joined to the base, The wavelength conversion unit is a light-emitting device that converts light emitted by the light-emitting element into light of a different wavelength.

15. The base portion and the optical member have wiring that is joined to them. The light-emitting device according to claim 14, wherein the conductive film is electrically connected to the metal film provided on the base via the wiring.

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