Inductor components

Abstract

To provide an inductor component that increases the efficiency of inductance acquisition. [Solution] The inductor component 1 includes a plurality of first coil wirings 11b arranged along axis AX on a plane parallel to the first main surface 100b, a plurality of second coil wirings 11t arranged along axis on a plane parallel to the second main surface, a plurality of first through wirings 13 extending from the first coil wiring toward the second coil wiring and arranged along axis, and a plurality of second through wirings 14 extending from the first coil wiring toward the second coil wiring, provided on the opposite side of axis from the first through wiring, and arranged along axis. The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of a spiral, and the first through wiring and the second through wiring are non-parallel when viewed from the axial direction.

Description

Technical Field

[0001] The present disclosure relates to an inductor component.

Background Art

[0002] Conventionally, as an inductor component, there is one described in Japanese Patent No. 6652280 (Patent Document 1). The inductor component has a base body, a coil provided in the base body and wound along the axial direction, and a first external electrode and a second external electrode provided on the base body and electrically connected to the coil.

[0003] The coil has a plurality of coil patterns laminated along the axis. The coil patterns adjacent to each other in the axial direction are connected via a conductive via. The coil pattern has a wiring portion extending in a direction orthogonal to the axis, and a pad portion provided at an end of the wiring portion and connected to the conductive via. The width of the pad portion is wider than the width of the wiring portion in order to improve the connectivity between the pad portion and the conductive via.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, in the conventional inductor component as described above, since the width of the pad portion is wider than the width of the wiring portion, a part of the pad portion is located inside the coil in the radial direction of the coil compared to the wiring portion. For this reason, the inner diameter of the coil becomes small, and it cannot be said that the acquisition efficiency of inductance is necessarily high.

[0006] Therefore, an object of the present disclosure is to provide an inductor component capable of increasing the acquisition efficiency of inductance.

Means for Solving the Problems

[0007] To solve the aforementioned problems, an inductor component according to one aspect of this disclosure is provided. A base body including a first principal surface and a second principal surface that are opposite to each other, A coil provided on the aforementioned body and wound spirally along the axis, A first external electrode and a second external electrode are provided on the base body and electrically connected to the coil. Equipped with, The shaft of the coil is arranged parallel to the first main surface. The aforementioned coil is A plurality of first coil wirings are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface, A plurality of second coil wirings are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extend from the first coil wiring toward the second coil wiring, are provided on the opposite side of the axis from the first through-wiring, and are arranged along the axis. Includes, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of the helical shape. The first through-wiring and the second through-wiring are non-parallel when viewed from the axial direction.

[0008] In this specification, "axis" refers to the intersection line of a first plane passing through the center between the first coil wiring and the second coil wiring, and a second plane passing through the center between the first through wiring and the second through wiring. "The first through-wiring and the second through-wiring are non-parallel when viewed from the axial direction" means that the centerlines of the first through-wiring and the second through-wiring are not parallel when viewed from the axial direction. The centerlines of the first and second through-wiring refer to lines that pass through the center of a plane perpendicular to the extension direction of each through-wiring. "An external electrode is provided on the base body" specifically means that the external electrode is provided on the outer surface of the base body. For example, this includes cases where the external electrode is provided directly on the outer surface of the base body, where the external electrode is provided on the outside of the base body via another component on the base body, or where a part of the external electrode is embedded in the base body and provided on the outer surface of the external electrode.

[0009] According to one embodiment described above, the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring. The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of a spiral, which allows the inner diameter of the coil to be increased and the efficiency of inductance acquisition to be increased. Furthermore, by increasing the efficiency of inductance acquisition, the Q value can be increased. Furthermore, since the first and second through-wirings are non-parallel when viewed from the axial direction, the design flexibility of the first and second through-wirings can be increased, for example, the Q factor can be increased or the self-resonant frequency can be increased.

[0010] Preferably, in one embodiment of the inductor component, the first through-wiring and the second through-wiring are symmetrical with respect to the axis when viewed from a direction perpendicular to the first main surface.

[0011] According to the above embodiment, symmetry of the coil with respect to the axis can be ensured, and the coil design can be easily performed.

[0012] Preferably, in one embodiment of the inductor component, the first through-wiring and the second through-wiring are symmetrical with respect to a line perpendicular to the first main plane and containing the axis, as viewed from the axial direction.

[0013] According to the above embodiment, symmetry of the coil with respect to the axis can be ensured, and the coil design can be easily performed.

[0014] Preferably, in one embodiment of the inductor component, the line edge roughness of the first through-wiring is greater than the line edge roughness of the first coil wiring.

[0015] Here, the line edge roughness of the first through-wiring refers to the line edge roughness of the inner diameter side surface of the coil among the side surfaces of the first through-wiring in a cross section orthogonal to the axis of the coil and including the center line of the first through-wiring. The line edge roughness of the first coil wiring refers to the line edge roughness of the side surface of the first coil wiring in a cross section orthogonal to the first main surface and including the center line of the first coil wiring.

[0016] According to the above embodiment, the adhesion between the first through-wiring and the element body is improved due to the anchor effect.

[0017] Preferably, in one embodiment of the inductor component, the line edge roughness of the first through-wiring is the same as or smaller than the line edge roughness of the first coil wiring.

[0018] According to the above embodiment, since the side surface of the first through-wiring is smooth, it is possible to suppress an increase in resistance at high frequencies due to the skin effect and improve the Q value.

[0019] Preferably, in one embodiment of the inductor component, the width of the first through-wiring and the width of the second through-wiring are different.

[0020] Here, the width of the first through-wiring is the equivalent circle diameter obtained from the cross-sectional area of the first through-wiring in a cross section parallel to the first main surface and including the center in the extending direction of the first through-wiring. The width of the second through-wiring is the equivalent circle diameter obtained from the cross-sectional area of the second through-wiring in a cross section parallel to the first main surface and including the center in the extending direction of the second through-wiring.

[0021] According to the above embodiment, the design freedom of the first through-wiring and the second through-wiring can be improved.

[0022] Preferably, in one embodiment of the inductor component, the first through-wiring has an outer peripheral portion located on the outer side in the radial direction of the coil than the first coil wiring and the second coil wiring when viewed from the axial direction. The outer peripheral portion is positioned between 0.3 and 0.7 in height in the direction perpendicular to the first main surface of the base body, with respect to the first main surface.

[0023] Here, being located radially outside the coil compared to the first and second coil wiring means that, when viewed from the axial direction, it is located radially outside the coil compared to the tangents that are tangent to the end face of the first coil wiring located parallel to the first main surface and the end face of the second coil wiring located parallel to the first main surface.

[0024] According to the above embodiment, since the first through-wiring has an outer peripheral portion, the inner diameter of the coil can be increased and the Q value can be improved. Furthermore, since the outer peripheral portion is positioned between 0.3 and 0.7 of the height of the base body, the outer peripheral portion can be provided in only a portion of the height of the base body, thereby reducing the possibility that the first through-wiring will be exposed from the base body when the individual pieces are assembled.

[0025] Preferably, in one embodiment of the inductor component, A second coil is provided on the aforementioned body and is wound spirally along a second axis parallel to the aforementioned axis, A third external electrode and a fourth external electrode are provided on the base body and electrically connected to the second coil. Furthermore, The second coil is, A plurality of third coil wirings are provided on the first main surface side with respect to the second axis and are arranged along the second axis on a plane parallel to the first main surface, A plurality of fourth coil wirings are provided on the second main surface side with respect to the second axis and are arranged along the second axis on a plane parallel to the second main surface, A plurality of third through-wirings extending from the third coil wiring toward the fourth coil wiring and arranged along the second axis, A plurality of fourth through-wirings extend from the third coil wiring toward the fourth coil wiring, are provided on the opposite side of the second axis from the third through-wiring, and are arranged along the second axis. Includes, The third coil wiring, the third through wiring, the fourth coil wiring, and the fourth through wiring are connected in this order to constitute at least a portion of the spiral shape of the second coil. The aforementioned second through-wiring and the aforementioned third through-wiring are adjacent to each other.

[0026] According to the above embodiment, the inductance acquisition efficiency can be increased in the second coil as well as in the coil, and the degree of design freedom can be improved.

[0027] Preferably, in one embodiment of the inductor component, Viewed from the axial direction of the coil, the first through-wiring and the second through-wiring, and the third through-wiring and the fourth through-wiring are symmetrical with respect to the center line between the first coil and the second coil.

[0028] According to the above embodiment, a first coil and a second coil with similar characteristics can be easily obtained.

[0029] Preferably, in one embodiment of the inductor component, Viewed from the axial direction of the coil, the second through-wiring and the third through-wiring are arranged in parallel.

[0030] According to the above embodiment, since the second through-wiring and the third through-wiring are arranged in parallel, the distance between adjacent coils and the second coil can be reduced, and the inductor components can be made smaller.

[0031] Preferably, in one embodiment of the inductor component, The first through-wiring and the second through-wiring are non-symmetrical with respect to a straight line that is perpendicular to the first main plane and contains the axis, when viewed from the axial direction.

[0032] According to the above embodiment, in the first coil, the first through-wiring and the second through-wiring are asymmetric with respect to a straight line perpendicular to the first main plane and containing the axis when viewed from the axial direction, thus further improving the design freedom of the first through-wiring and the second through-wiring.

[0033] Preferably, in one embodiment of the inductor component, The third and fourth through-wirings are non-parallel when viewed from the second axial direction.

[0034] According to the above embodiment, the distance between the third through-wiring and the fourth through-wiring can be increased, the inner diameter of the second coil can be increased, and the Q value can be improved.

[0035] Preferably, in one embodiment of the inductor component, The first through-wiring has a first connection surface connected to the first coil wiring and a second connection surface connected to the second coil wiring. The first external electrode is provided on the first main surface side and, when viewed from a direction perpendicular to the first main surface, overlaps at least a portion of the first connecting surface. Viewed from the axial direction, the axial inclination angle between the line connecting the center of the first connection surface and the center of the second connection surface and the connection surface connected to the first through-wiring of the second coil wiring is 60° or more and less than 90°.

[0036] According to the above embodiment, since the tilt angle is less than 90°, the area of ​​the first coil wiring that overlaps with the first external electrode when viewed from a direction perpendicular to the first main surface can be reduced. This reduces the parasitic capacitance between the first external electrode and the first coil wiring, thereby increasing the self-resonant frequency. Furthermore, since the tilt angle is 60° or more, the inner diameter of the coil can be secured, and the Q value can be secured.

[0037] Preferably, in one embodiment of the inductor component, when viewed from a direction perpendicular to the first main surface, a portion of the first connection surface and a portion of the second connection surface overlap.

[0038] According to the above embodiment, when viewed from a direction perpendicular to the first main surface, a part of the first connecting surface and a part of the second connecting surface overlap. Therefore, when a through hole is formed in the base body, a seed layer is provided on the inner surface of the through hole, and the first through wiring is formed on the seed layer by electroplating, the formation of the seed layer becomes easier.

[0039] Preferably, in one embodiment of the inductor component, the center of the first connection surface is closer to the axis than the center of the second connection surface when viewed from a direction perpendicular to the first main surface.

[0040] According to the above embodiment, when viewed from a direction perpendicular to the first main surface, the first connection surface is positioned inside the coil compared to the second connection surface. This makes it possible to reduce the area of ​​the first coil wiring that overlaps with the first external electrode when viewed from a direction perpendicular to the first main surface, thereby reducing the parasitic capacitance between the first external electrode and the first coil wiring and increasing the self-resonant frequency.

[0041] Preferably, in one embodiment of the inductor component, the first through-wiring has a conductive layer located on the outer periphery when viewed from the direction in which the first through-wiring extends, and a non-conductive layer located inside the conductive layer.

[0042] According to the above embodiment, when used in the high-frequency band, the current mainly flows along the surface of the first through-wiring due to the skin effect, so providing a conductive layer on the outer periphery does not lower the Q value. Furthermore, providing a non-conductive layer on the inside relieves stress, and manufacturing costs can be reduced by not using a conductor.

[0043] Preferably, in one embodiment of the inductor component, the cross-sectional area of ​​at least one of the ends of the first through-wiring in the extending direction is larger than the cross-sectional area of ​​the central part of the first through-wiring in the extending direction.

[0044] According to the above embodiment, the cross-sectional area of ​​the end of the first through-wiring can be increased, and the connectivity between the first through-wiring and at least one of the first coil wiring and the second coil wiring can be improved. Furthermore, when forming a hole in the base body and filling this hole with conductive material by fill plating or the like to form the first through-wiring in the base body, it is easier to fill the opening side of the hole with conductive material. And, since the cross-sectional area of ​​the end of the first through-wiring is large and the cross-sectional area of ​​the central part of the first through-wiring is small, it is easy to form the first through-wiring.

[0045] Preferably, in one embodiment of the inductor component, the thickness of the inductor component is 200 μm or less.

[0046] According to the above embodiment, the inductor component can be made thinner.

[0047] Preferably, in one embodiment of the inductor component, the first external electrode and the second external electrode are located inside the outer surface of the base body when viewed from a direction perpendicular to the first main surface.

[0048] According to the above embodiment, since the first external electrode and the second external electrode are not in contact with the outer surface of the base body, the load on the first external electrode and the second external electrode can be reduced when the individual inductor components are assembled, and deformation and peeling of the first external electrode and the second external electrode can be suppressed. For this reason, even if the inductor components are made smaller, deformation and peeling of the first external electrode and the second external electrode can be prevented.

[0049] Preferably, in one embodiment of the inductor component, an organic insulator is provided on the first main surface, wherein the element is an inorganic insulator, and the organic insulator is located inside the outer surface of the inorganic insulator when viewed from a direction perpendicular to the first main surface.

[0050] According to the above embodiment, since it has an organic insulator, the organic insulator is easily given fluidity, and when the first coil wiring is covered with the organic insulator, the organic insulator can be easily filled between adjacent first coil wirings, thereby improving insulation performance. Furthermore, since the organic insulator does not come into contact with the outer surface of the insulator, the load on the organic insulator can be reduced when it is pieced into individual inductor components, and deformation and peeling of the organic insulator can be suppressed. [Effects of the Invention]

[0051] According to an inductor component in one aspect of this disclosure, the efficiency of acquiring inductance can be increased. [Brief explanation of the drawing]

[0052] [Figure 1] This is a schematic bottom view of the inductor component of the first embodiment, viewed from the bottom side. [Figure 2] This is a cross-sectional view taken along line II-II in Figure 1. [Figure 3] This is a cross-sectional view taken along line III-III in Figure 1. [Figure 4] This is a magnified view of a portion of Figure 2. [Figure 5A] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 5B] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 5C] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 5D] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 5E] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 5F] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 5G] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 5H] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 5I] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 5J] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 5K] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 5L] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 5M] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 6A] This is a cross-sectional view showing a first modified example of an inductor component. [Figure 6B] This is a cross-sectional view showing a second modified example of an inductor component. [Figure 6C] This is a cross-sectional view showing a third modified example of an inductor component. [Figure 6D] This is a cross-sectional view showing a fourth modified example of an inductor component. [Figure 6E] This is a cross-sectional view showing a fifth modified example of an inductor component. [Figure 7] This is a schematic bottom view of the inductor component of the second embodiment, viewed from the bottom side. [Figure 8] This is a cross-sectional view taken along line VIII-VIII in Figure 7. [Figure 9] This is a partially enlarged view of Figure 8. [Figure 10A] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 10B] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 10C] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 10D] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 10E] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 10F] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 10G] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 10H] This is a schematic cross-sectional view illustrating a manufacturing method for inductor components. [Figure 11A] This is a cross-sectional view showing a first modified example of an inductor component. [Figure 11B] This is a cross-sectional view showing a second modified example of an inductor component. [Modes for carrying out the invention]

[0053] Hereinafter, an inductor component, which is one aspect of this disclosure, will be described in detail with reference to the illustrated embodiment. Note that the drawings include some schematic representations and may not reflect actual dimensions or proportions.

[0054] <First Embodiment> The inductor component 1 according to the first embodiment will be described below. Figure 1 is a schematic bottom view of the inductor component 1 as seen from the bottom. Figure 2 is a cross-sectional view taken along line II-II in Figure 1. Figure 3 is a cross-sectional view taken along line III-III in Figure 1. In Figure 1, for convenience, the external electrodes are shown as dashed lines. Also, in Figure 1, the element 10 is shown as transparent to allow for easy understanding of its structure, but it may be semi-transparent or opaque.

[0055] 1.Overview configuration The general configuration of inductor component 1 will now be described. Inductor component 1 is a surface-mount type inductor component used, for example, in a high-frequency signal transmission circuit. As shown in Figures 1, 2, and 3, inductor component 1 comprises a base body 10, a coil 110 provided on the base body 10 and wound spirally along axis AX, and a first external electrode 121 and a second external electrode 122 provided on the base body 10 and electrically connected to the coil 110.

[0056] The base body 10 has length, width and height. The base body 10 has first end faces 100e1 and second end faces 100e2 at both ends in the length direction, first side faces 100s1 and second side faces 100s2 at both ends in the width direction, and bottom faces 100b and top faces 100t at both ends in the height direction. In other words, the outer surface 100 of the base body 10 includes the first end faces 100e1 and second end faces 100e2, the first side faces 100s1 and second side faces 100s2, the bottom face 100b and top face 100t. The bottom face 100b corresponds to an example of the "first main face" described in the claims, and the top face 100t corresponds to an example of the "second main face" described in the claims.

[0057] As shown in the drawing, for the sake of explanation, the X direction will be defined as the longitudinal direction of the body 10, from the first end face 100e1 to the second end face 100e2. The Y direction will be defined as the width direction of the body 10, from the first side surface 100s1 to the second side surface 100s2. The Z direction will be defined as the height direction of the body 10, from the bottom surface 100b to the top surface 100t. The X, Y, and Z directions are mutually orthogonal directions, and when arranged in the order X, Y, Z, they form a right-handed system.

[0058] In this specification, the "outer surface 100 of the element 10," including the first end face 100e1, the second end face 100e2, the first side face 100s1, the second side face 100s2, the bottom face 100b, and the top face 100t, does not simply mean a surface facing the outer periphery of the element 10, but rather a surface that forms the boundary between the outside and inside of the element 10. Furthermore, "above the outer surface 100 of the element 10" does not refer to an absolute, unidirectional direction such as vertically upward as defined by the direction of gravity, but rather to a direction toward the outside, with respect to the outer surface 100 as the reference point, between the outside and inside that are bounded by the outer surface 100. Therefore, "above the outer surface 100" is a relative direction determined by the orientation of the outer surface 100. In addition, "above" an element includes not only a position above the element at a distance, i.e., a position above the element via another object or at a distance above it, but also a position directly above the element in contact with it.

[0059] The axis AX of the coil 110 is positioned parallel to the bottom surface 100b. The coil 110 includes a plurality of bottom wirings 11b provided on the bottom surface 100b side with respect to the axis AX and arranged along the axis AX on a plane parallel to the bottom surface 100b, a plurality of top wirings 11t provided on the top surface 100t side with respect to the axis AX and arranged along the axis AX on a plane parallel to the top surface 100t, a plurality of first through wirings 13 extending from the bottom wirings 11b toward the top wirings 11t and arranged along the axis AX, and a plurality of second through wirings 14 extending from the bottom wirings 11b toward the top wirings 11t, provided on the opposite side of the axis AX from the first through wirings 13 and arranged along the axis AX. The bottom wirings 11b, the first through wirings 13, the top wirings 11t, and the second through wirings 14 are connected in this order to form at least a portion of a spiral.

[0060] The bottom wiring 11b corresponds to an example of the "first coil wiring" described in the claims, and the top wiring 11t corresponds to an example of the "second coil wiring" described in the claims. The axis AX is the intersection of a first plane passing through the center between the bottom wiring 11b and the top wiring 11t and a second plane passing through the center between the first through wiring 13 and the second through wiring 14. In other words, the axis AX is a straight line passing through the center of the inner diameter portion of the coil 110. The axis AX of the coil 110 does not have dimensions in the direction perpendicular to the axis AX.

[0061] According to the above configuration, the coil 110 includes bottom wiring 11b, first through wiring 13, top wiring 11t, and second through wiring 14. The bottom wiring 11b, first through wiring 13, top wiring 11t, and second through wiring 14 are connected in this order to form at least a portion of a spiral, which allows the inner diameter of the coil 110 to be increased and the efficiency of inductance acquisition to be increased. Furthermore, by increasing the efficiency of inductance acquisition, the Q value can be increased.

[0062] Specifically, the pad portion of conventional inductor components and the bottom wiring 11b and top wiring 11t of this embodiment are "receiving portions" for wiring that penetrates the main body (conductive vias of conventional inductor components and the first through-wiring 13 and second through-wiring 14 of this embodiment), and therefore have a shape that spreads perpendicular to the direction in which the wiring penetrates the main body. In the configuration of conventional inductor components, since the conductive vias extend in a direction parallel to the coil axis, the pad portion tends to spread in a direction perpendicular to the coil axis, resulting in a structure that blocks the magnetic flux generated in the axial direction of the coil.

[0063] In contrast, in this embodiment, since the first through-wiring 13 and the second through-wiring 14 extend in a direction perpendicular to the axis AX of the coil 110, the bottom wiring 11b and the top wiring 11t spread in a direction parallel to the axis AX of the coil 110. Therefore, the bottom wiring 11b and the top wiring 11t are less likely to have a structure that blocks the magnetic flux generated in the direction of the axis AX. In other words, in this embodiment, a structure that does not easily block the magnetic flux can be made, and the inductance acquisition efficiency and Q value can be improved.

[0064] As shown in Figure 2, the first through-wiring 13 and the second through-wiring 14 are non-parallel when viewed from the direction of axis AX. In other words, the center line 13a of the first through-wiring 13 and the center line 14a of the second through-wiring 14 are not parallel when viewed from the direction of axis AX.

[0065] According to the above configuration, the first through-wiring 13 and the second through-wiring 14 are non-parallel when viewed from the direction of axis AX, which improves the design freedom of the first through-wiring 13 and the second through-wiring 14. For example, the Q value can be increased, or the self-resonant frequency can be increased. Specifically, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110 can be increased, and the Q value can be improved.

[0066] Furthermore, it is preferable that all first through-wirings 13 and all second through-wirings 14 are non-parallel when viewed from the direction of axis AX. It is sufficient that at least one first through-wiring 13 and at least one second through-wiring 14 are non-parallel when viewed from the direction of axis AX. It is preferable that first through-wirings 13 and second through-wirings 14 that intersect in the same plane perpendicular to axis AX are non-parallel when viewed from the direction of axis AX. Furthermore, although all first through-wirings 13 overlap when viewed from the direction of axis AX, there may be some first through-wirings 13 that do not overlap when viewed from the direction of axis AX. The same applies to the second through-wirings 14.

[0067] 2.Each part configuration (Inductor component 1) The volume of inductor component 1 is 0.08 mm³. 3The following conditions apply, and the size of the longest side of the inductor component 1 is 0.65 mm or less. The size of the longest side of the inductor component 1 refers to the largest value among the length, width, and height of the inductor component 1, and in this embodiment, it refers to the length in the X direction. With the above configuration, the volume of the inductor component 1 is small and the longest side of the inductor component 1 is short, so the weight of the inductor component 1 is reduced. Therefore, even if the external electrodes 121 and 122 are small, the required mounting strength can be obtained. In addition, the thickness of the inductor component 1 is preferably 200 μm or less. This makes the inductor component 1 thinner.

[0068] Specifically, the dimensions of inductor component 1 (length (X direction) × width (Y direction) × height (Z direction)) are 0.6 mm × 0.3 mm × 0.3 mm, 0.4 mm × 0.2 mm × 0.2 mm, 0.25 mm × 0.125 mm × 0.120 mm, etc. Also, the width and height do not have to be equal; for example, they may be 0.4 mm × 0.2 mm × 0.3 mm.

[0069] (Base model 10) The base material 10 contains SiO2. This allows the base material 10 to be given insulation and rigidity. The base material 10 is composed of, for example, a glass sintered body. The glass sintered body may also contain alumina, which can further increase the strength of the base material.

[0070] A glass sintered body is constructed, for example, by laminating insulating layers containing multiple glass particles. The lamination direction of the multiple insulating layers is the Z direction. That is, the insulating layers are layered and have main surfaces extending in the XY plane. Note that in the base body 10, the interfaces between the multiple insulating layers may not be clearly defined due to firing or other processes.

[0071] The element 10 may be composed of, for example, a glass substrate. The glass substrate may be a single-layer glass substrate, and since the majority of the element is glass, losses such as eddy current losses at high frequencies can be suppressed.

[0072] (Coil 110) The coil 110 comprises a plurality of bottom wirings 11b, a plurality of top wirings 11t, a plurality of first through wirings 13, and a plurality of second through wirings 14. The bottom wirings 11b, the first through wirings 13, the top wirings 11t, and the second through wirings 14 are connected in order to form at least a portion of the coil 110 wound in the direction of axis AX.

[0073] According to the above configuration, since the coil 110 is a so-called helical coil 110, the area in which the bottom wiring 11b, top wiring 11t, first through wiring 13 and second through wiring 14 run parallel along the winding direction of the coil 110 in a cross section perpendicular to the axis AX can be reduced, and the stray capacitance in the coil 110 can be reduced.

[0074] Here, a helical shape refers to a shape in which the total number of turns of the coil is greater than 1 turn, and the number of turns of the coil in a cross section perpendicular to the axis is less than 1 turn. "One turn or more" means that in a cross section perpendicular to the axis, the coil wiring has portions that run parallel in the winding direction and adjacent to each other in the radial direction when viewed from the axial direction, while "less than 1 turn" means that in a cross section perpendicular to the axis, the coil wiring does not have portions that run parallel in the winding direction and adjacent to each other in the winding direction when viewed from the axial direction.

[0075] The bottom wiring 11b extends in only one direction. Specifically, the bottom wiring 11b is slightly tilted in the X direction and extends in the Y direction. All bottom wiring 11b are arranged parallel to each other along the X direction. In the photolithography process, if modified illumination such as annular illumination or dipole illumination is used, the pattern resolution in a specific direction can be increased, and a finer pattern can be formed. With the above configuration, since the bottom wiring 11b extends in only one direction and all bottom wiring 11b are arranged parallel to each other, finer bottom wiring 11b can be formed by using modified illumination, for example, in the photolithography process, and the inductor component 1 can be miniaturized.

[0076] The top surface wiring 11t extends in only one direction. Specifically, the top surface wiring 11t has a shape that extends in the Y direction. All top surface wiring 11t is arranged parallel to the X direction. With the above configuration, since the top surface wiring 11t extends in only one direction and all top surface wiring 11t is arranged parallel to each other, fine top surface wiring 11t can be formed by using, for example, deformed illumination in the photolithography process, and the inductor component 1 can be miniaturized.

[0077] The bottom wiring 11b and top wiring 11t are made of good conductive materials such as copper, silver, gold, or alloys thereof. The bottom wiring 11b and top wiring 11t may be metal films formed by plating, vapor deposition, sputtering, etc., or they may be metal sintered bodies formed by applying and sintering a conductive paste. Furthermore, the bottom wiring 11b and top wiring 11t may have a multilayer structure in which multiple metal layers are laminated. The thickness of the bottom wiring 11b and top wiring 11t is preferably 5 μm or more and 50 μm or less.

[0078] The first through-hole 13 is positioned within the through-hole V of the base body 10, on the first side surface 100s1 side with respect to the axis AX, and the second through-hole 14 is positioned within the through-hole V of the base body 10, on the second side surface 100s2 side with respect to the axis AX. The first through-hole 13 and the second through-hole 14 extend in directions perpendicular to the bottom surface 100b and the top surface 100t, respectively. This allows the lengths of the first through-hole 13 and the second through-hole 14 to be shortened, thereby suppressing the DC resistance (Rdc). All of the first through-hole 13 and all of the second through-hole 14 are positioned parallel to each other along the X direction.

[0079] The first through-wiring 13 and the second through-wiring 14 are non-parallel when viewed from the direction of axis AX. Specifically, the first through-wiring 13 and the second through-wiring 14 are bent at the center such that the distance between them increases towards the center in the Z direction. In other words, the first through-wiring 13 and the second through-wiring 14 each have a shape that widens radially outward from the coil 110 towards the center in the Z direction. Furthermore, the first through-wiring 13 and the second through-wiring 14 each have a stepped shape along the Z direction. According to the above configuration, when the first through-wiring 13 and the second through-wiring 14 are each formed by stacking multiple conductor layers, the first through-wiring 13 and the second through-wiring 14 can be easily formed in a stepped shape by stacking the conductor layers of each layer with a staggered arrangement.

[0080] Preferably, as shown in Figure 1, the first through-wiring 13 and the second through-wiring 14 are symmetrical with respect to the axis AX when viewed from a direction perpendicular to the bottom surface 100b. This ensures the symmetry of the coil 110 with respect to the axis AX, and facilitates the design of the coil 110. Furthermore, it reduces the possibility of some through-wiring entering the inner diameter of the coil 110, thereby improving the Q value.

[0081] Preferably, as shown in Figure 2, the first through-wiring 13 and the second through-wiring 14 are symmetrical with respect to a straight line L1 that is perpendicular to the bottom surface 100b and contains axis AX, when viewed from the direction of axis AX. This ensures the symmetry of the coil 110 with respect to axis AX, and facilitates the design of the coil 110. Furthermore, it reduces the possibility of some through-wiring entering the inner diameter of the coil 110, thereby improving the Q value.

[0082] Preferably, the line edge roughness (hereinafter also referred to as LER (Line Edge Roughness)) of the first through-wiring 13 is greater than the line edge roughness of the bottom wiring 11b. Specifically, the line edge roughness of the first through-wiring 13 refers to the line edge roughness of the side surface of the first through-wiring 13 that is on the inner diameter side of the coil 110, in a cross-section that is perpendicular to the axis AX of the coil 110 and includes the center line 13a of the first through-wiring 13. The line edge roughness of the bottom wiring 11b refers to the line edge roughness of the side surface of the bottom wiring 11b, in a cross-section that is perpendicular to the bottom surface 100b and includes the center line 14a of the bottom wiring 11b. According to this, the adhesion between the first through-wiring 13 and the base body 10 is improved by the anchoring effect.

[0083] The LER of the first through-wiring 13 refers to the dimensional variation in the width of the first through-wiring 13. The width of the first through-wiring 13 is the dimension perpendicular to the center line 13a in the cross-section containing the center line 13a of the first through-wiring 13. The measurement method for LER conforms to the SEMI standard (SEMI Standard P47-0307, ​​Test Method for Evaluation of Line-Edge Roughness and Line Width Roughness). In this embodiment, an SEM image (or optical image) of the first through-wiring 13 is acquired at a magnification that captures at least one-third of the length of the first through-wiring 13 in its extending direction, and the LER of the first through-wiring 13 is calculated using the image processing software WinROOF2018. Similarly, an SEM image of the bottom wiring 11b is acquired at a magnification that captures at least one-third of the length of the bottom wiring 11b in its extending direction, and the LER of the bottom wiring 11b is calculated. In this specification, LER refers to the average value of the LER calculated at three or more points in the image acquired as described above, and these three or more calculation points include at least two points where the distance between the two points is at least half of the acquired image.

[0084] Similarly, the line edge roughness of the first through-wiring 13 may be greater than that of the top surface wiring 11t, as the anchoring effect improves the adhesion between the first through-wiring 13 and the base body 10. Similarly, the line edge roughness of the second through-wiring 14 may be greater than that of the bottom wiring 11b, and the anchoring effect improves the adhesion between the second through-wiring 14 and the base body 10.

[0085] Here, the line edge roughness of the first through-wiring 13 may be the same as or less than the line edge roughness of the bottom wiring 11b. In this case, since the side surface of the first through-wiring 13 is smooth, the increase in resistance at high frequencies due to the skin effect can be suppressed, and the Q value can be improved. Similarly, the line edge roughness of the first through-wiring 13 may be the same as or less than the line edge roughness of the top wiring 11t. Also, similarly, the line edge roughness of the second through-wiring 14 may be the same as or less than the line edge roughness of the bottom wiring 11b, and since the side surface of the second through-wiring 14 is smooth, the increase in resistance at high frequencies due to the skin effect can be suppressed, and the Q value can be improved. Similarly, the line edge roughness of the second through-wiring 14 may be the same as or less than the line edge roughness of the top wiring 11t.

[0086] Preferably, the width of the first through-wiring 13 and the width of the second through-wiring 14 are different. The width of the first through-wiring 13 is the equivalent circle diameter obtained from the cross-sectional area of ​​the first through-wiring 13 in a section parallel to the bottom surface 100b that includes the center of the first through-wiring 13 in the extension direction of the first through-wiring 13. The width of the second through-wiring 14 is the equivalent circle diameter obtained from the cross-sectional area of ​​the second through-wiring 14 in a section parallel to the bottom surface 100b that includes the center of the second through-wiring 14 in the extension direction of the second through-wiring 14. Specifically, the first through-wiring 13 is divided into three equal parts in the height direction: upper, middle, and lower, and the width is the average value of the equivalent circle diameter of the cross-sectional area of ​​each of the three equal parts. Note that the widths of the first through-wiring 13 and the second through-wiring 14 are considered different if their relative differences are 10% or more.

[0087] The above configuration improves the design flexibility of the first through-wiring 13 and the second through-wiring 14. For example, if the through-wiring is inclined or curved, the DC resistance will increase, so the width of the through-wiring on the longer side can be increased so that the DC resistance of through-wirings of different shapes and different track lengths becomes the same.

[0088] Figure 4 is an enlarged view of a part of Figure 2. As shown in Figure 4, the first through-wiring 13 has an outer peripheral portion 131 that is located radially outside the coil 110, as viewed from the axis AX direction, compared to the bottom wiring 11b and the top wiring 11t. The outer peripheral portion 131 is located radially outside the coil 110, as viewed from the axis AX direction, compared to the tangent line L2 that touches the end face 11b1 of the bottom wiring 11b, which is located parallel to the bottom surface 100b, and the end face 11t1 of the top wiring 11t, which is located parallel to the bottom surface 100b. The outer peripheral portion 131 is positioned between 0.3 and 0.7 of the height Z1 of the base body 10 in the direction perpendicular to the bottom surface 100b, with the bottom surface 100b as the reference. The height Z1 of the base body 10 is the distance from the bottom surface 100b to the top surface 100t. The position of 1.0 in the height Z1 of the base body 10 corresponds to the top surface 100t.

[0089] According to the above configuration, since the first through-wiring 13 has an outer peripheral portion 131, the inner diameter of the coil 110 can be increased and the Q value can be improved. Furthermore, since the outer peripheral portion 131 is positioned between 0.3 and 0.7 of the height Z1 of the base body, the outer peripheral portion 131 can be provided only in a part of the height Z1 of the base body 10, thereby reducing the possibility that the first through-wiring 13 will be exposed from the base body 10 when the individual pieces are assembled.

[0090] Similarly, the second through-wiring 14 has an outer peripheral portion that, when viewed from the axis AX direction, is located radially outside the coil 110 compared to the bottom wiring 11b and the top wiring 11t, and the outer peripheral portion is positioned between 0.3 and 0.7 of the height Z1 of the base body 10. This allows the inner diameter of the coil 110 to be increased, improving the Q value, and also reduces the possibility of the second through-wiring 14 being exposed from the base body 10 when the individual pieces are assembled.

[0091] Preferably, the first through-wiring 13 contains SiO2. This allows the coefficient of thermal expansion of the first through-wiring 13 to match that of the base material 10 when the base material 10 contains SiO2, thereby suppressing cracks between the first through-wiring 13 and the base material 10. The first through-wiring 13 uses, for example, a conductive paste. The conductive material can be Ag, Cu, etc. Preferably, similarly, the second through-wiring 14 also contains SiO2.

[0092] Preferably, as shown in Figure 2, when viewed from a direction perpendicular to the bottom surface 100b, the first end of the bottom wiring 11b and the first end of the top wiring 11t overlap, and the angle θ between the bottom wiring 11b and the top wiring 11t is acute. The angle θ is the angle between the center line of the width of the bottom wiring 11b (dotted line in Figure 2) and the center line of the width of the top wiring 11t (dotted line in Figure 2), when viewed from a direction perpendicular to the bottom surface 100b.

[0093] Preferably, as shown in Figure 2, the angle θ between the bottom wiring 11b and the top wiring 11t, both connected to the same first through-wiring 13, when viewed from a direction perpendicular to the bottom surface 100b, is 5° or more and 45° or less. The angle θ is the angle between the center line of the width of the bottom wiring 11b (the dashed line in Figure 2) and the center line of the width of the top wiring 11t (the dashed line in Figure 2), when viewed from a direction perpendicular to the bottom surface 100b.

[0094] According to the above configuration, the coil 110 is tightly wound, thereby improving the inductance. Since the angle θ is 45° or less, the coil length is shortened, leakage flux is reduced, and the Q value is increased. The coil length refers to the distance between the outermost ends of the bottom wiring 11b, top wiring 11t, first through wiring 13, and second through wiring 14 in the direction of axis AX. Since the angle θ is 5° or more, the possibility of two adjacent first through wirings 13 in the direction of axis AX contact is reduced, and the possibility of two adjacent second through wirings 14 in the direction of axis AX contact is also reduced. Note that for at least one pair of bottom wirings 11b and top wirings 11t, the angle θ should be between 5° and 45°.

[0095] Preferably, when viewed from a direction perpendicular to the bottom surface 100b, the angle θ between the bottom surface wiring 11b and the top surface wiring 11t, both connected to the same second through-wiring 14, is between 5° and 45°. This allows the coil 110 to be wound more densely, thereby improving its inductance.

[0096] Preferably, at least one of the bottom wiring 11b, top wiring 11t, first through wiring 13, and second through wiring 14 includes a void or resin portion. This allows the void or resin portion to absorb stress caused by the difference in the coefficient of thermal expansion between the wiring and the base body 10, thereby relieving the stress. As a method for forming the void, for example, a material that burns away by sintering can be used for the wiring material, and the void can be formed by sintering the wiring. As a method for forming the resin portion, for example, a conductive paste can be used for the wiring material to form the resin portion.

[0097] Preferably, at least one of the bottom wiring 11b and the top wiring 11t contains SiO2. This allows the coefficient of thermal expansion of the wiring to be matched with the coefficient of thermal expansion of the base material 10 when the base material 10 contains SiO2, thereby suppressing cracks between the wiring and the base material 10.

[0098] (First external electrode 121 and second external electrode 122) The first external electrode 121 is connected to the first end of the coil 110, and the second external electrode 122 is connected to the second end of the coil 110. The first external electrode 121 is positioned on the first end face 100e1 side with respect to the center in the X direction of the body 10 so as to be exposed from the outer surface 100 of the body 10. The second external electrode 122 is positioned on the second end face 100e2 side with respect to the center in the X direction of the body 10 so as to be exposed from the outer surface 100 of the body 10.

[0099] When viewed from a direction perpendicular to the bottom surface 100b, the first external electrode 121 and the second external electrode 122 are located inside the outer surface 100 of the base body 10. In other words, the first external electrode 121 and the second external electrode 122 are located inside the first end face 100e1, the second end face 100e2, the first side surface 100s1, and the second side surface 100s2 of the base body 10.

[0100] According to the above configuration, since the first external electrode 121 and the second external electrode 122 do not come into contact with the outer surface 100 of the base body 10, the load on the first external electrode 121 and the second external electrode 122 can be reduced when the inductor components are separated into individual pieces, and deformation and peeling of the first external electrode 121 and the second external electrode 122 can be suppressed. For this reason, even if the inductor components are made smaller, deformation and peeling of the first external electrode 121 and the second external electrode 122 can be prevented.

[0101] The first external electrode 121 may be provided continuously with the bottom surface 100b and the first end surface 100e1. In this case, since the first external electrode 121 is a so-called L-shaped electrode, a solder fillet can be formed on the first external electrode 121 when mounting the inductor component 1 onto the mounting board. Similarly, the second external electrode 122 may be provided continuously with the bottom surface 100b and the second end surface 100e2.

[0102] The first external electrode 121 has a bottom portion 121b provided on the bottom surface 100b and a via portion 121v embedded in the bottom surface 100b. The via portion 121v is connected to the bottom portion 121b. The via portion 121v is connected to the end of the bottom wiring 11b located on the first end surface 100e1 side in the axial AX direction.

[0103] The second external electrode 122 has a bottom portion 122b provided on the bottom surface 100b and a via portion 122v embedded in the bottom surface 100b. The via portion 122v is connected to the bottom portion 122b. The via portion 122v is connected to the end of the bottom wiring 11b located on the second end surface 100e2 side in the axial AX direction.

[0104] The first external electrode 121 has a base layer 121e1 and a plating layer 121e2 covering the base layer 121e1. The base layer 121e1 contains, for example, a conductive material such as Ag or Cu. The plating layer 121e2 contains, for example, a conductive material such as Ni or Sn. Part of the bottom portion 121b and the via portion 121v are made of the base layer 121e1. The other part of the bottom portion 121b is made of the plating layer 121e2. Similarly, the second external electrode 122 has a base layer and a plating layer covering the base layer. Note that the first external electrode 121 and the second external electrode 122 may be made of a single layer of conductive material.

[0105] (Manufacturing method for inductor component 1) Next, the manufacturing method of the inductor component 1 will be explained using Figures 5A to 5M. Figures 5A to 5H, 5K, and 5L correspond to the II-II cross section of Figure 1. Figures 5I, 5J, and 5M correspond to the III-III cross section of Figure 1.

[0106] As shown in Figure 5A, a first insulating layer 1011 is provided on the base substrate 1000 by printing. The material of the base substrate 1000 is, for example, a glass substrate, a silicon substrate, or an alumina substrate, and the material of the first insulating layer 1011 is, for example, a resin such as epoxy or polyimide, or an inorganic insulating film such as SiO or SiN.

[0107] As shown in Figure 5B, a second insulating layer 1012 is provided on the first insulating layer 1011 by printing. A groove 1012a is provided in the second insulating layer 1012. At this time, the groove 1012a is formed by, for example, a photolithography process. Alternatively, the groove may be formed from the beginning as a printed pattern.

[0108] As shown in Figure 5C, a top conductor layer 1011t is formed in the groove 1012a by printing. The material of the top conductor layer 1011t is, for example, Ag, Cu, Au, Al, or an alloy containing at least one of these elements, or solder paste. In this case, for example, the top conductor layer 1011t is formed as a printed pattern so that it remains only in the groove 1012a. Alternatively, the top conductor layer 1011t may be printed on the second insulating layer 1012 and then left only in the groove 1012a by a photolithography process.

[0109] As shown in Figure 5D, a third insulating layer 1013 is provided on the second insulating layer 1012 by printing. A first groove 1013a and a second groove 1013b are provided in the third insulating layer 1013. The first groove 1013a and the second groove 1013b are formed in the same manner as in Figure 5B.

[0110] As shown in Figure 5E, the first through-conductor layer 1131 is printed into the first groove 1013a, and the second through-conductor layer 1141 is printed into the second groove 1013b. The first through-conductor layer 1131 and the second through-conductor layer 1141 are formed in the same manner as in Figure 5C.

[0111] Repeating the above process, as shown in Figure 5F, a fourth insulating layer 1014 is provided on the third insulating layer 1013, and a second first through-conductor layer 1132 and a second second through-conductor layer 1142 are provided in each of the two grooves provided in the fourth insulating layer 1014. Furthermore, a fifth insulating layer 1015 is provided on the fourth insulating layer 1014, and a third first through-conductor layer 1133 and a third second through-conductor layer 1143 are provided in each of the two grooves provided in the fifth insulating layer 1015. Furthermore, a sixth insulating layer 1016 is provided on the fifth insulating layer 1015, and a fourth first through-conductor layer 1134 and a fourth second through-conductor layer 1144 are provided in each of the two grooves provided in the sixth insulating layer 1016. Furthermore, a seventh insulating layer 1017 is provided on the sixth insulating layer 1016, and a fifth first through-conductor layer 1135 and a fifth second through-conductor layer 1145 are provided in each of the two grooves provided in the seventh insulating layer 1017.

[0112] At this time, the first through-conductor layer 1131, the second first through-conductor layer 1132, and the third first through-conductor layer 1133 are stacked in order, shifted radially outward from the coil, and the third first through-conductor layer 1133, the fourth first first through-conductor layer 1134, and the fifth first through-conductor layer 1135 are stacked in order, shifted radially inward from the coil. Similarly, the first second through-conductor layer 1141, the second second through-conductor layer 1142, and the third second through-conductor layer 1143 are stacked in order, shifted radially outward from the coil, and the third second through-conductor layer 1143, the fourth second second through-conductor layer 1144, and the fifth second through-conductor layer 1145 are stacked in order, shifted radially inward from the coil.

[0113] As shown in Figure 5G, an eighth insulating layer 1018 is provided on the seventh insulating layer 1017, and a bottom conductor layer 1011b is provided in a groove in the eighth insulating layer 1018. The material of the bottom conductor layer 1011b is the same as the material of the top conductor layer 1011t. As shown in Figure 5H, a ninth insulating layer 1019 is provided on the eighth insulating layer 1018.

[0114] As shown in Figure 5I, a groove 1019a is provided in the ninth insulating layer 1019 so that a portion of the bottom conductor layer 1011b is exposed. As shown in Figure 5J, a base conductor layer 1121e1 is provided on the ninth insulating layer 1019 and within the groove 1019a. The material of the base conductor layer 1121e1 is, for example, a resin paste such as Ag or Cu.

[0115] As shown in Figure 5K, the entire laminate is sintered in a furnace at a high temperature (e.g., 500°C or higher). The first to ninth insulating layers 1011 to 1019 are sintered to form the base body 10, the top conductor layer 1011t is sintered to form the top wiring 11t, the bottom conductor layer 1011b is sintered to form the bottom wiring 11b, the first through-conductor layers 1131 to 1135 from the first to fifth layers are sintered to form the first through-conductor 13, the second through-conductor layers 1141 to 1145 from the first to fifth layers are sintered to form the second through-conductor 14, and the base conductor layer 1121e1 is sintered to form the base layer 121e1. Therefore, the strength can be improved by sintering the insulating layers, and by sintering the conductor layers, unwanted resin components contained in the conductor layers are volatilized, and the conductor materials contained in the conductor layers fuse together, achieving high conductivity. The base substrate 1000 may be removed by decomposing its surface during sintering, or by mechanically removing it by grinding before or after sintering, or by chemically removing it by etching before or after sintering.

[0116] As shown in Figure 5L, the parts are separated along the cut line C. As shown in Figure 5M, a plating layer 121e2 is formed by barrel plating to cover the base layer 121e1, thereby forming the first external electrode 121. This completes the manufacture of the inductor component 1, as shown in Figure 2.

[0117] 3. Variant (First variation) Figure 6A is a diagram corresponding to the II-II cross-section in Figure 1, showing a first modified example of the inductor component. As shown in Figure 6A, in the inductor component 1A of the first modified example, the first through-wiring 13 and the second through-wiring 14 are not parallel when viewed from the axis AX direction. This allows the distance between the first through-wiring 13 and the second through-wiring 14 to be increased, the inner diameter of the coil 110 can be increased, and the Q value can be improved.

[0118] Specifically, the first through-wiring 13 and the second through-wiring 14 are bent at the center such that the distance between them increases towards the center in the Z direction. In other words, the first through-wiring 13 and the second through-wiring 14 each have a shape that spreads outwards radially from the coil 110 towards the center in the Z direction.

[0119] Furthermore, the first through-wiring 13 and the second through-wiring 14 each have an arc shape along the Z direction. That is, the inner surface of the first through-wiring 13 has a concave curved surface, and the outer surface of the first through-wiring 13 has a convex curved surface. The inner surface of the second through-wiring 14 has a concave curved surface, and the outer surface of the second through-wiring 14 has a convex curved surface. The inner surfaces of the first through-wiring 13 and the second through-wiring 14 are the inner diameter side surfaces of the coil 110, and the outer surfaces of the first through-wiring 13 and the second through-wiring 14 are the outer diameter side surfaces of the coil 110.

[0120] According to the above configuration, the inner surfaces of the first through-wiring 13 and the second through-wiring 14, as well as the outer surfaces of the first through-wiring 13 and the second through-wiring 14, can be made smooth, thereby reducing DC resistance. In particular, since the inner surfaces of the first through-wiring 13 and the second through-wiring 14 are smooth, the increase in resistance at high frequencies due to the skin effect can be suppressed, and the Q factor can be improved.

[0121] (Second variation) Figure 6B is a diagram corresponding to the II-II cross-section in Figure 1, showing a second modified example of the inductor component. As shown in Figure 6B, in the inductor component 1B of the second modified example, the first through-wiring 13 and the second through-wiring 14 are not parallel when viewed from the direction of axis AX. This allows the distance between the first through-wiring 13 and the second through-wiring 14 to be increased, the inner diameter of the coil 110 can be increased, and the Q value can be improved.

[0122] Specifically, the first through-wiring 13 and the second through-wiring 14 are inclined such that the distance between them increases towards the top surface wiring 11t in the Z direction. In other words, the first through-wiring 13 and the second through-wiring 14 each have a shape that extends radially outward from the coil 110 by the length of the top surface wiring 11t in the Z direction. Thus, the coil 110 has a trapezoidal shape when viewed from the axis AX direction.

[0123] According to the above configuration, the first through-wiring 13 and the second through-wiring 14 can be formed in a straight line and shortened, thereby reducing the DC resistance of the first through-wiring 13 and the second through-wiring 14.

[0124] (Third variation) Figure 6C is a diagram corresponding to the II-II cross-section in Figure 1, showing a third modified example of the inductor component. As shown in Figure 6C, the inductor component 1C of the third modified example includes a first coil 110A and a second coil 110B, compared to the inductor component 1 shown in Figure 2. The first coil 110A corresponds to coil 110 of the inductor component 1 shown in Figure 2.

[0125] The second coil 110B, like the first coil 110A, is mounted on the base body 10, wound spirally along axis AX (an example of the second axis), and connected to a third external electrode and a fourth external electrode (not shown). The third and fourth external electrodes have the same configuration as the first external electrode 121 and the second external electrode 122 of the inductor component 1 shown in Figure 1.

[0126] The second coil 110B, like the first coil 110A, includes bottom wiring 11b (an example of third coil wiring), top wiring 11t (an example of fourth coil wiring), first through wiring 13 (an example of third through wiring), and second through wiring 14 (an example of fourth through wiring).

[0127] In the first coil 110A, the first through-wiring 13 and the second through-wiring 14 are not parallel when viewed from the direction of axis AX. This allows the distance between the first through-wiring 13 and the second through-wiring 14 to be increased, the inner diameter of the coil 110A can be increased, and the Q value can be improved.

[0128] Specifically, the first through-wiring 13 has the same configuration as the first through-wiring 13 of the inductor component 1 in Figure 2. On the other hand, the second through-wiring 14 has a straight shape parallel to the Z direction. In other words, the first through-wiring 13 is bent in the center such that the distance between the first through-wiring 13 and the second through-wiring 14 widens towards the center in the Z direction. The first through-wiring 13 has a stepped shape along the Z direction. With the above configuration, when the first through-wiring 13 is formed by stacking multiple conductor layers, the first through-wiring 13 can be easily formed in a stepped shape by stacking the conductor layers of each layer with a staggered arrangement.

[0129] In the second coil 110B, the first through-wiring 13 and the second through-wiring 14 are not parallel when viewed from the direction of axis AX. This allows the distance between the first through-wiring 13 and the second through-wiring 14 to be increased, thereby increasing the inner diameter of the coil 110B and improving the Q value.

[0130] Specifically, the second through-wiring 14 has the same configuration as the second through-wiring 14 of inductor component 1 in Figure 2. On the other hand, the first through-wiring 13 has a straight shape parallel to the Z direction. In other words, the second through-wiring 14 is bent in the center such that the distance between the first through-wiring 13 and the second through-wiring 14 widens towards the center in the Z direction. The second through-wiring 14 has a stepped shape along the Z direction. With the above configuration, when the second through-wiring 14 is formed by stacking multiple conductor layers, the second through-wiring 14 can be easily formed in a stepped shape by stacking the conductor layers of each layer with a staggered arrangement.

[0131] Preferably, as shown in Figure 6C, the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged parallel to each other. Viewed from the direction of the axis AX of the first coil 110A, the first through-wiring 13 and second through-wiring 14 of the first coil 110A and the first through-wiring 13 and second through-wiring 14 of the second coil 110B are symmetrical with respect to the center line M between the first coil 110A and the second coil 110B. The center line M is the line that passes through the center between the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B, as viewed from the direction of the axis AX of the first coil 110A. Specifically, the first through-wiring 13 of the first coil 110A and the second through-wiring 14 of the second coil 110B are symmetrical with respect to the center line M, and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are symmetrical with respect to the center line M. This makes it easy to obtain the first coil 110A and the second coil 110B with the same characteristics.

[0132] Preferably, as shown in Figure 6C, the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged parallel to each other. Viewed from the direction of the axis AX of the first coil 110A, the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are adjacent to each other, and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are arranged parallel to each other. As a result, since the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are arranged parallel to each other, the distance between adjacent first coils 110A and 210B can be reduced, and the inductor component 1C can be made smaller.

[0133] Preferably, as shown in Figure 6C, the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged parallel to each other. Viewed from the direction of axis AX of the first coil 110A, the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are adjacent, and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are arranged parallel to each other. In the first coil 110A, the first through-wiring 13 and the second through-wiring 14 are asymmetric with respect to a line L1 that is perpendicular to the bottom surface 100b and contains axis AX, as viewed from the direction of axis AX.

[0134] According to the above configuration, the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are arranged in parallel, so the distance between adjacent first coils 110A and second coils 110B can be reduced, and the inductor component 1C can be made smaller. Furthermore, in the first coil 110A, the first through-wiring 13 and the second through-wiring 14 are asymmetric with respect to a straight line L1 that is perpendicular to the bottom surface 100b and contains axis AX when viewed from the direction of axis AX, so the design freedom of the first through-wiring 13 and the second through-wiring 14 can be further improved. Similarly, in the second coil 110B, the first through-wiring 13 and the second through-wiring 14 may be asymmetrical with respect to a straight line L1 that is perpendicular to the bottom surface 100b and contains axis AX, when viewed from the direction of axis AX.

[0135] (Fourth variation) Figure 6D is a diagram corresponding to the II-II cross-section in Figure 1, showing a fourth modified example of the inductor component. As shown in Figure 6D, the inductor component 1D of the fourth modified example includes a first coil 110A and a second coil 110B, compared to the inductor component 1A shown in Figure 6A.

[0136] In the first coil 110A, the first through-wiring 13 and the second through-wiring 14 are not parallel when viewed from the direction of axis AX. This allows the distance between the first through-wiring 13 and the second through-wiring 14 to be increased, the inner diameter of the coil 110A can be increased, and the Q value can be improved.

[0137] Specifically, the first through-wiring 13 has the same configuration as the first through-wiring 13 of inductor component 1A in Figure 6A. On the other hand, the second through-wiring 14 has a straight shape parallel to the Z direction. In other words, the first through-wiring 13 is bent in the center such that the distance between the first through-wiring 13 and the second through-wiring 14 widens towards the center in the Z direction. The first through-wiring 13 has an arc shape along the Z direction. With the above configuration, the side surface of the first through-wiring 13 can be made smooth, and the DC resistance of the first through-wiring 13 can be reduced.

[0138] In the second coil 110B, the first through-wiring 13 and the second through-wiring 14 are not parallel when viewed from the direction of axis AX. This allows the distance between the first through-wiring 13 and the second through-wiring 14 to be increased, thereby increasing the inner diameter of the coil 110B and improving the Q value.

[0139] Specifically, the second through-wiring 14 has the same configuration as the second through-wiring 14 of inductor component 1A in Figure 6A. On the other hand, the first through-wiring 13 has a straight shape parallel to the Z direction. That is, the second through-wiring 14 is bent in the center such that the distance between the first through-wiring 13 and the second through-wiring 14 widens towards the center in the Z direction. The second through-wiring 14 has an arc shape along the Z direction. With the above configuration, the side surface of the second through-wiring 14 can be made smooth, and the DC resistance of the second through-wiring 14 can be reduced.

[0140] Preferably, as shown in Figure 6D, the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged parallel to each other. Viewed from the direction of the axis AX of the first coil 110A, the first through-wiring 13 and second through-wiring 14 of the first coil 110A and the first through-wiring 13 and second through-wiring 14 of the second coil 110B are symmetric with respect to the center line M between the first coil 110A and the second coil 110B. Specifically, the first through-wiring 13 of the first coil 110A and the second through-wiring 14 of the second coil 110B are symmetric with respect to the center line M, and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are symmetric with respect to the center line M. This makes it easy to obtain the first coil 110A and the second coil 110B with the same characteristics.

[0141] Preferably, as shown in Figure 6D, the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged parallel to each other. Viewed from the direction of the axis AX of the first coil 110A, the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are adjacent to each other, and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are arranged parallel to each other. As a result, since the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are arranged parallel to each other, the distance between adjacent first coils 110A and 210B can be reduced, and the inductor component 1D can be made smaller.

[0142] Preferably, as shown in Figure 6D, the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged parallel to each other. Viewed from the direction of axis AX of the first coil 110A, the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are adjacent, and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are arranged parallel to each other. In the first coil 110A, the first through-wiring 13 and the second through-wiring 14 are asymmetric with respect to a line L1 that is perpendicular to the bottom surface 100b and contains axis AX, as viewed from the direction of axis AX.

[0143] According to the above configuration, the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are arranged in parallel, so the distance between adjacent first coils 110A and second coils 110B can be reduced, and the inductor component 1D can be made smaller. Furthermore, in the first coil 110A, the first through-wiring 13 and the second through-wiring 14 are asymmetric with respect to a straight line L1 that is perpendicular to the bottom surface 100b and contains axis AX when viewed from the direction of axis AX, so the design freedom of the first through-wiring 13 and the second through-wiring 14 can be further improved. Similarly, in the second coil 110B, the first through-wiring 13 and the second through-wiring 14 may be asymmetrical with respect to a straight line L1 that is perpendicular to the bottom surface 100b and contains axis AX, when viewed from the direction of axis AX.

[0144] (Fifth variation) Figure 6E is a diagram corresponding to the II-II cross-section in Figure 1, showing a fifth modified example of the inductor component. As shown in Figure 6E, the inductor component 1E of the fifth modified example includes a first coil 110A and a second coil 110B, compared to the inductor component 1B of the second modified example shown in Figure 6B.

[0145] In the first coil 110A, the first through-wiring 13 and the second through-wiring 14 are not parallel when viewed from the direction of axis AX. This allows the distance between the first through-wiring 13 and the second through-wiring 14 to be increased, the inner diameter of the coil 110A can be increased, and the Q value can be improved.

[0146] Specifically, the first through-wiring 13 has the same configuration as the first through-wiring 13 of the inductor component 1B of the second modified example. On the other hand, the second through-wiring 14 has a linear shape parallel to the Z direction. In other words, the first through-wiring 13 is inclined such that the distance between the first through-wiring 13 and the second through-wiring 14 becomes wider towards the top surface wiring 11t side in the Z direction. With the above configuration, the first through-wiring 13 and the second through-wiring 14 can be formed in a linear shape and shortened, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0147] In the second coil 110B, the first through-wiring 13 and the second through-wiring 14 are not parallel when viewed from the direction of axis AX. This allows the distance between the first through-wiring 13 and the second through-wiring 14 to be increased, thereby increasing the inner diameter of the coil 110B and improving the Q value.

[0148] Specifically, the second through-wiring 14 has the same configuration as the second through-wiring 14 of the inductor component 1B of the second modified example. On the other hand, the first through-wiring 13 has a linear shape parallel to the Z direction. That is, the second through-wiring 14 is inclined such that the distance between the first through-wiring 13 and the second through-wiring 14 becomes wider towards the top surface wiring 11t side in the Z direction. With the above configuration, the first through-wiring 13 and the second through-wiring 14 can be formed in a linear shape, and the electrical resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0149] Preferably, as shown in Figure 6E, the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged parallel to each other. Viewed from the direction of the axis AX of the first coil 110A, the first through-wiring 13 and second through-wiring 14 of the first coil 110A and the first through-wiring 13 and second through-wiring 14 of the second coil 110B are symmetric with respect to the center line M between the first coil 110A and the second coil 110B. Specifically, the first through-wiring 13 of the first coil 110A and the second through-wiring 14 of the second coil 110B are symmetric with respect to the center line M, and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are symmetric with respect to the center line M. This makes it easy to obtain the first coil 110A and the second coil 110B with the same characteristics.

[0150] Preferably, as shown in Figure 6E, the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged parallel to each other. Viewed from the direction of the axis AX of the first coil 110A, the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are adjacent to each other, and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are arranged parallel to each other. As a result, since the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are arranged parallel to each other, the distance between adjacent first coils 110A and 210B can be reduced, and the inductor component 1E can be made smaller.

[0151] Preferably, as shown in Figure 6E, the axis AX of the first coil 110A and the axis AX of the second coil 110B are arranged parallel to each other. Viewed from the direction of the axis AX of the first coil 110A, the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are adjacent, and the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are arranged parallel to each other. In the first coil 110A, the first through-wiring 13 and the second through-wiring 14 are asymmetric with respect to a line L1 that is perpendicular to the bottom surface 100b and contains axis AX, as viewed from the direction of axis AX.

[0152] According to the above configuration, the second through-wiring 14 of the first coil 110A and the first through-wiring 13 of the second coil 110B are arranged in parallel, so the distance between adjacent first coils 110A and second coils 110B can be reduced, and the inductor component 1E can be made smaller. Furthermore, in the first coil 110A, the first through-wiring 13 and the second through-wiring 14 are asymmetric with respect to a straight line L1 that is perpendicular to the bottom surface 100b and contains axis AX when viewed from the direction of axis AX, so the design freedom of the first through-wiring 13 and the second through-wiring 14 can be further improved. Similarly, in the second coil 110B, the first through-wiring 13 and the second through-wiring 14 may be asymmetrical with respect to a straight line L1 that is perpendicular to the bottom surface 100b and contains axis AX, when viewed from the direction of axis AX.

[0153] <Second Embodiment> Figure 7 is a schematic bottom view of the second embodiment of the inductor component, viewed from the bottom. Figure 8 is a cross-sectional view taken along line VIII-VIII in Figure 7. In Figure 7, for convenience, the insulating layer is omitted, and the external electrodes are shown with dashed lines. Also, in Figure 7, the component 10 is depicted transparently to facilitate understanding of its structure. The second embodiment differs from the first embodiment mainly in the position of the coil axis, the material of the component, and the presence of an insulating layer. These differing configurations will be described below. Other configurations are the same as those of the first embodiment, and their description will be omitted.

[0154] 1.Each part configuration (Inductor component 1F) As shown in Figure 7, in the inductor component 1F, the axis AX of the coil 110 is perpendicular to the X direction. More specifically, the axis AX is parallel to the Y direction and passes through the center of the element 10 in the X direction. This reduces interference of the magnetic flux of the coil 110 by the first external electrode 121 and the second external electrode 122, thereby improving the efficiency of inductance acquisition.

[0155] The length of coil 110 in the axial direction AX is shorter than the inner diameter of coil 110. The length of coil 110 in the axial direction AX is also called the coil length. According to this, the Q value can be improved because the coil length is short and the coil inner diameter is large. The inner diameter of the coil refers to the equivalent diameter of a circle based on the minimum area of ​​the region enclosed by coil 110 when viewed through from the axial direction AX.

[0156] (Base model 10) The element 10 is an inorganic insulator. Preferably, the material of the element 10 is glass, as glass has high insulating properties, which can suppress eddy currents and increase the Q value. Preferably, the element 10 contains the element Si, which increases the thermal stability of the element 10, thereby suppressing changes in the dimensions of the element 10 due to heat and reducing variations in electrical properties.

[0157] The base body 10 is preferably a single-layer glass plate. This ensures the strength of the base body 10. In addition, since a single-layer glass plate has low dielectric loss, the Q value at high frequencies can be increased. Furthermore, since there is no sintering process like in a sintered body, deformation of the base body 10 during sintering can be suppressed, which suppresses pattern misalignment and allows for the provision of an inductor component with a small inductance tolerance.

[0158] From the viewpoint of manufacturing methods, a photosensitive glass plate, such as Foturan II (a registered trademark of Schott AG), is preferred as the material for the single-layer glass plate. In particular, it is preferable that the single-layer glass plate contains cerium oxide (ceria: CeO2), in which case the cerium oxide acts as a sensitizer, making processing by photolithography easier.

[0159] However, since single-layer glass plates can be processed by mechanical processes such as drilling and sandblasting, dry / wet etching using photoresist / metal masks, and laser processing, they may be glass plates that do not have photosensitivity. Furthermore, single-layer glass plates may be made by sintering glass paste or by known methods such as the float method.

[0160] (Insulator 22) As shown in Figure 8, the inductor component 1F has an insulator 22. The insulator 22 covers the bottom surface 100b and the top surface 100t of the main body 10, respectively. Note that the insulator 22 may be provided only on the bottom surface 100b of the two top surfaces 100t.

[0161] The insulator 22 is a component that protects the wiring (bottom wiring 11b, top wiring 11t) from external forces by covering it, preventing damage to the wiring and improving the insulation properties of the wiring. Preferably, the insulator 22 is an organic insulator. For example, the insulator 22 may be a resin film such as epoxy or polyimide, which is easy to form. In particular, it is preferable that the insulator 22 be made of a material with a low dielectric constant, so that when the insulator 22 is present between the coil 110 and the external electrodes 121, 122, the stray capacitance formed between the coil 110 and the external electrodes 121, 122 can be reduced. The insulator 22 can be formed, for example, by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine Techno Co., Ltd.), or by applying and heat-curing a paste-like resin. The insulator 22 may also be an inorganic film such as an oxide, nitride, or oxynitride of silicon or hafnium, which has excellent insulating properties and can be made into a thin film.

[0162] Preferably, when the base material 10 is an inorganic insulator and the insulator 22 is an organic insulator, the organic insulator is located inside the outer surface 100 of the inorganic insulator when viewed from a direction perpendicular to the bottom surface 100b. As a result, because an organic insulator is present, it is easy to impart fluidity to the organic insulator, and when wiring (bottom wiring 11b, top wiring 11t) is covered with the organic insulator, the organic insulator can be easily filled between adjacent wiring, thereby improving insulation performance. Furthermore, since the organic insulator is not in contact with the outer surface of the inorganic insulator, the load on the organic insulator can be reduced when individual inductor components are formed, and deformation and peeling of the organic insulator can be suppressed.

[0163] (Coil 110) As shown in Figure 7, the bottom wiring 11b extends in only one direction. Specifically, the bottom wiring 11b has a shape that extends in the X direction. All bottom wiring 11b is arranged parallel to the Y direction. The top wiring 11t extends in only one direction. Specifically, the top wiring 11t extends in the X direction with a slight inclination in the Y direction. All top wiring 11t is arranged parallel to the Y direction.

[0164] As shown in Figures 7 and 8, the first through-hole 13 is positioned within the through-hole V of the base body 10 on the side of the first end face 100e1 relative to the axis AX, and the second through-hole 14 is positioned within the through-hole V of the base body 10 on the side of the second end face 100e2 relative to the axis AX. The first through-hole 13 and the second through-hole 14 extend in directions perpendicular to the bottom surface 100b and the top surface 100t, respectively. Multiple first through-holes 13 and multiple second through-holes 14 are arranged parallel to each other along the Y direction.

[0165] The first through-wiring 13 and the second through-wiring 14 are non-parallel when viewed from the direction of axis AX. Specifically, the first through-wiring 13 and the second through-wiring 14 are inclined such that the distance between them increases towards the top surface wiring 11t in the Z direction. The first through-wiring 13 and the second through-wiring 14 each have a shape that extends radially outward from the coil 110 by the amount of the top surface wiring 11t in the Z direction. The coil 110 has a trapezoidal shape when viewed from the direction of axis AX. With the above configuration, the first through-wiring 13 and the second through-wiring 14 can be formed in a straight line and shortened, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0166] Figure 9 is a partially enlarged view of Figure 8. As shown in Figures 7, 8, and 9, the first through-wiring 13 has a first connection surface 13y1 connected to the bottom wiring 11b and a second connection surface 13y2 connected to the top wiring 11t. The first external electrode 121 is provided on the bottom surface 100b side, and when viewed from a direction perpendicular to the bottom surface 100b, the first external electrode 121 overlaps with at least a portion of the first connection surface 13y1. When viewed from the direction of axis AX, the inclination angle α on the axis AX side between the straight line L3 connecting the center of the first connection surface 13y1 and the center of the second connection surface 13y2 and the connection surface 11t2 of the top wiring 11t connected to the first through-wiring 13 is 60° or more and less than 90°.

[0167] With the above configuration, since the tilt angle α is less than 90°, the area of ​​the bottom wiring 11b that overlaps with the first external electrode 121 when viewed from a direction perpendicular to the bottom surface 100b can be reduced. This reduces the parasitic capacitance between the first external electrode 121 and the bottom wiring 11b, thereby increasing the self-resonant frequency. Also, since the tilt angle α is 60° or more, the inner diameter of the coil 110 can be secured, and the Q value can be secured.

[0168] Similarly, the second through-wiring 14 has a first connection surface 14y1 connected to the bottom wiring 11b and a second connection surface 14y2 connected to the top wiring 11t. The second external electrode 122 is provided on the bottom surface 100b side, and when viewed from a direction perpendicular to the bottom surface 100b, the second external electrode 122 may overlap at least a portion of the first connection surface 14y1. In this case, when viewed from the direction of axis AX, the inclination angle β on the axis AX side between the straight line L4 connecting the center of the first connection surface 14y1 and the center of the second connection surface 14y2 and the connection surface 11t3 connected to the second through-wiring 14 of the top wiring 11t may be 60° or more and less than 90°.

[0169] With the above configuration, since the tilt angle β is less than 90°, the area of ​​the bottom wiring 11b that overlaps with the second external electrode 122 when viewed from a direction perpendicular to the bottom surface 100b can be reduced. This reduces the parasitic capacitance between the second external electrode 122 and the bottom wiring 11b, thereby increasing the self-resonant frequency. Also, since the tilt angle β is 60° or more, the inner diameter of the coil 110 can be secured, and the Q value can be secured.

[0170] Preferably, as shown in Figure 7, in the first through-wiring 13, when viewed from a direction perpendicular to the bottom surface 100b, a portion of the first connection surface 13y1 and a portion of the second connection surface 13y2 overlap. This makes it easier to form the seed layer when a through-hole V is formed in the base body 10, a seed layer is provided on the inner surface of the through-hole V, and the first through-wiring 13 is formed on the seed layer by electroplating. Similarly, in the second through-wiring 14, when viewed from a direction perpendicular to the bottom surface 100b, a portion of the first connection surface 14y1 and a portion of the second connection surface 14y2 may overlap.

[0171] Preferably, as shown in Figure 7, in the first through-wiring 13, when viewed from a direction perpendicular to the bottom surface 100b, the center of the first connection surface 13y1 is closer to the axis AX than the center of the second connection surface 13y2. As a result, when viewed from a direction perpendicular to the bottom surface 100b, the first connection surface 13y1 is positioned further inside the coil 110 than the second connection surface 13y2. This makes it possible to reduce the area of ​​the bottom wiring 11b that overlaps with the first external electrode 121 when viewed from a direction perpendicular to the bottom surface 100b, thereby reducing the parasitic capacitance between the first external electrode 121 and the bottom wiring 11b and increasing the self-resonant frequency. Similarly, in the second through-wiring 14, when viewed from a direction perpendicular to the bottom surface 100b, the center of the first connection surface 14y1 may be closer to the axis AX than the center of the second connection surface 14y2.

[0172] (Manufacturing method for inductor component 1F) Next, the manufacturing method of inductor component 1F will be explained using Figures 10A to 10H. Figures 10A to 10H correspond to the VIII-VIII cross-section in Figure 7.

[0173] As shown in Figure 10A, copper foil 2001 is printed onto the base substrate 2000. The material of the base substrate 2000 is the same as that of the base substrate 1000 in the first embodiment.

[0174] As shown in Figure 10B, a glass substrate 2010, which will become the base body 10, is placed on a base substrate 2000. For example, the base substrate 2000 and the glass substrate 2010 are brought into close contact using conductive tape, pins, frames, or other jigs. The glass substrate 2010 has a first through hole V1 and a second through hole V2. The first through hole V1 and the second through hole V2 are non-parallel. The glass substrate 2010 is, for example, a TGV (Through Glass Via) substrate. A TGV substrate is a substrate in which through holes have been formed in advance by a laser or photolithography. The glass substrate 2010 may also be, for example, a TSV (Through Silicon Via) substrate, or any other material. Furthermore, Ti / Cu or other necessary conductive materials may be deposited on the surface of the glass substrate 2010 in advance as a seed by sputtering or other methods.

[0175] As shown in Figure 10C, a first through-conductor layer 2013, which will become the first through-wiring 13, is formed in the first through-hole V1. A second through-conductor layer, which will become the second through-wiring 14, is formed in the second through-hole V2. Specifically, by supplying power from the copper foil 2001 on the base substrate 2000, the first through-conductor layer 2013 is formed by electroplating the first through-hole V1, and the second through-conductor layer 2014 is formed by electroplating the second through-hole V2. Alternatively, a seed layer may be formed on the surface of the glass substrate 2010 or on the inner surfaces of the through-holes V1 and V2 by sputtering, and the through-conductor layer may be formed using known methods such as filled plating, conformal plating, or a printed filling method of conductive paste. If there is unwanted plating growth on the surface of the glass substrate 2010, the unwanted parts are removed by polishing, CMP, wet etching (etch back), or dry etching.

[0176] As shown in Figure 10D, the base substrate 2000 is peeled off from the glass substrate 2010. At this time, the base substrate 2000 may be removed mechanically by grinding or other means, or chemically by etching or other means.

[0177] As shown in Figure 10E, a bottom conductor layer 2011b, which will become the bottom wiring 11b, and a top conductor layer 2011t, which will become the top wiring 11t, are formed on the glass substrate 2010. Specifically, a seed layer (not shown) is provided over the entire surface of the glass substrate 2010, and a patterned photoresist is formed on the seed layer. A copper layer is formed on the seed layer at the openings of the photoresist by electroplating. The photoresist and seed layer are removed by wet etching or dry etching. This forms a bottom conductor layer 2011b and a top conductor layer 2011t patterned in any shape. At this time, the bottom conductor layer 2011b and the top conductor layer 2011t may be formed one at a time, or both may be formed simultaneously.

[0178] As shown in Figure 10F, an insulating layer 2022, which will serve as an insulator 22, is provided on the top and bottom surfaces of the glass substrate 2010 so as to cover the conductive layer. At this time, the insulating layer 2022 on the bottom surface and the insulating layer 2022 on the top surface may be formed one at a time, or both may be formed simultaneously. Subsequently, holes 2022a are made on the bottom conductive layer 2011b of the insulating layer 2022 on the bottom surface using photolithography or laser processing.

[0179] As shown in Figure 10G, a first external electrode conductor layer 2121, which will become the first external electrode 121, is provided on the bottom insulating layer 2022. At this time, the first external electrode conductor layer 2121 is connected to the bottom conductor layer 2011b. Specifically, a Pd catalyst (not shown) is provided on the bottom insulating layer 2022, and Ni and Au plating layers are formed by electroless plating. A patterned photoresist is formed on the plating layers. The plating layer at the openings of the photoresist is removed by wet etching or dry etching. This forms the first external electrode conductor layer 2121 patterned in any shape. Alternatively, a seed layer (not shown) is provided on the bottom insulating layer 2022, and a patterned photoresist is formed on the seed layer. Next, the seed layer at the openings of the photoresist is removed by wet etching or dry etching. A Ni and Au plating layer may be formed on the remaining seed layer by electroless plating. Similarly, a second external electrode conductor layer 2122, which will serve as the second external electrode 122, is provided on the bottom insulating layer 2022.

[0180] As shown in Figure 10H, the components are separated along the cut line C. This allows for the manufacture of the inductor component 1F, as shown in Figure 8.

[0181] 2. Variations (First variation) Figure 11A is a diagram corresponding to a portion of the VIII-VIII cross-section in Figure 7, showing a first modified example of the inductor component. As shown in Figure 11A, in the inductor component 1G of the first modified example, the cross-sectional area of ​​each end 13e in the extending direction of the first through-wiring 13 is larger than the cross-sectional area of ​​the central part 13m in the extending direction of the first through-wiring 13. The cross-sectional area of ​​the first through-wiring 13 is the area of ​​the cross-section in the direction perpendicular to the bottom surface 100b of the first through-wiring 13. In the cross-section along the extending direction of the first through-wiring 13, the width in the direction perpendicular to the bottom surface 100b of the first through-wiring 13 increases continuously from the central part 13m toward both ends 13e.

[0182] According to this, the cross-sectional area of ​​the end portion 13e of the first through-wiring 13 can be increased, and the connectivity between the first through-wiring 13 and at least one of the bottom wiring 11b and the top wiring 11t can be improved. Furthermore, when forming a through-hole V as a hole portion in the base body 10 and filling this through-hole V with conductive material by fill plating or the like to form the first through-wiring 13 in the through-hole V, it is easier to fill the opening side of the through-hole V with conductive material. And since the cross-sectional area of ​​the end portion 13e of the first through-wiring 13 is large and the cross-sectional area of ​​the central portion 13m of the first through-wiring 13 is small, it is easy to form the first through-wiring 13.

[0183] Furthermore, the cross-sectional area of ​​one end 13e of the first through-wiring 13 may be larger than the cross-sectional area of ​​the central part 13m of the first through-wiring 13. Similarly, the cross-sectional area of ​​at least one end of the second through-wiring 14 may be larger than the cross-sectional area of ​​the central part 13m of the first through-wiring 13.

[0184] (Second variation) Figure 11B is a diagram corresponding to a portion of the VIII-VIII cross-section in Figure 7, showing a second modified example of the inductor component. As shown in Figure 11B, in the inductor component 1H of the second modified example, the first through-wiring 13 has a conductive layer 13s located on the outer circumference when viewed from the direction in which the first through-wiring 13 extends, and a non-conductive layer 13u located inside the conductive layer 13s. With this configuration, when used in the high-frequency band, the current mainly flows on the surface of the first through-wiring 13 due to the skin effect, so providing the conductive layer 13s on the outer circumference does not lower the Q value. In addition, by providing the non-conductive layer 13u on the inside, stress can be relieved, and manufacturing costs can be reduced by not using a conductor.

[0185] An example of a method for forming conductive layers 13s and non-conductive layers 13u is described. A seed layer is provided on the inner surface of the through-hole V of the base body 10 by sputtering or electroless plating. Then, a plating layer is formed on the seed layer by electroplating. In this way, multiple conductive layers 13s, such as Ti / Cu / electrolytic Cu or Pd / electroless Cu / electrolytic Cu, can be formed on the outer circumference of the first through-wiring 13. Subsequently, the inside of the conductive layers 13s is sealed with resin by printing or heat pressing to form a non-conductive layer 13u made of resin. In this way, while current is flowing through the surface (conductive layer 13s) of the first through-wiring 13, stress can be relieved by the non-conductive layer 13u inside the first through-wiring 13.

[0186] Similarly, the second through-wiring 14 may have a conductive layer located on the outer periphery when viewed from the direction in which the second through-wiring 14 extends, and a non-conductive layer located inside the conductive layer. Note that the cross-sectional area of ​​each end of the first through-wiring 13 in the direction of extension is larger than the cross-sectional area of ​​the central part of the first through-wiring 13 in the direction of extension, but the cross-sectional area of ​​each end of the first through-wiring 13 in the direction of extension may be the same as the cross-sectional area of ​​the central part of the first through-wiring 13 in the direction of extension.

[0187] This disclosure is not limited to the embodiments described above, and design modifications are possible without departing from the gist of this disclosure. For example, the features of the first and second embodiments may be combined in various ways.

[0188] This disclosure includes the following aspects: <1> A base body including a first principal surface and a second principal surface that are opposite to each other, A coil provided on the aforementioned body and wound spirally along the axis, A first external electrode and a second external electrode are provided on the base body and electrically connected to the coil. Equipped with, The shaft of the coil is arranged parallel to the first main surface. The aforementioned coil is A plurality of first coil wirings are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface, A plurality of second coil wirings are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extend from the first coil wiring toward the second coil wiring, are provided on the opposite side of the axis from the first through-wiring, and are arranged along the axis. Includes, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of the helical shape. An inductor component in which the first through-wiring and the second through-wiring are non-parallel when viewed from the axial direction. <2> The first through-wiring and the second through-wiring are symmetrical with respect to the axis when viewed from a direction perpendicular to the first main surface. <1> The inductor components listed below. <3> The first through-wiring and the second through-wiring are symmetrical with respect to a line perpendicular to the first main plane and containing the axis, as viewed from the axial direction. <1> or <2> The inductor components listed below. <4> The line edge roughness of the first through-wiring is greater than the line edge roughness of the first coil wiring. <1> from <3> An inductor component listed in any one of the following. <5> The line edge roughness of the first through-wiring is the same as or less than the line edge roughness of the first coil wiring. <1> from <3> An inductor component listed in any one of the following. <6> The width of the first through-wiring and the width of the second through-wiring are different. <1> The inductor components listed below. <7> The first through-wiring has an outer peripheral portion that, when viewed from the axial direction, is located radially outside the coil than the first coil wiring and the second coil wiring. The outer peripheral portion is positioned between 0.3 and 0.7 in height in the direction perpendicular to the first main surface of the base body, with respect to the first main surface. <1> from <6> An inductor component listed in any one of the following. <8> A second coil is provided on the aforementioned body and is wound spirally along a second axis parallel to the aforementioned axis, A third external electrode and a fourth external electrode are provided on the base body and electrically connected to the second coil. Furthermore, The second coil is, A plurality of third coil wirings are provided on the first main surface side with respect to the second axis and are arranged along the second axis on a plane parallel to the first main surface, A plurality of fourth coil wirings are provided on the second main surface side with respect to the second axis and are arranged along the second axis on a plane parallel to the second main surface, A plurality of third through-wirings extending from the third coil wiring toward the fourth coil wiring and arranged along the second axis, A plurality of fourth through-wirings extend from the third coil wiring toward the fourth coil wiring, are provided on the opposite side of the second axis from the third through-wiring, and are arranged along the second axis. Includes, The third coil wiring, the third through wiring, the fourth coil wiring, and the fourth through wiring are connected in this order to constitute at least a portion of the spiral shape of the second coil. The aforementioned second through-wiring and the aforementioned third through-wiring are adjacent to each other. <1> from <7> An inductor component listed in any one of the following. <9> Viewed from the axial direction of the coil, the first through-wiring and the second through-wiring, and the third through-wiring and the fourth through-wiring are symmetrical with respect to the center line between the coil and the second coil. <8> The inductor components listed below. <10> Viewed from the axial direction of the coil, the second through-wiring and the third through-wiring are arranged in parallel. <8> or <9> The inductor components listed below. <11> The first through-wiring and the second through-wiring are, when viewed from the axial direction, non-symmetric with respect to a line perpendicular to the first main plane and containing the axis. <9> The inductor components listed below. <12> The third and fourth through-wirings are non-parallel when viewed from the second axial direction. <8> The inductor components listed below. <13> The first through-wiring has a first connection surface connected to the first coil wiring and a second connection surface connected to the second coil wiring. The first external electrode is provided on the first main surface side and, when viewed from a direction perpendicular to the first main surface, overlaps at least a portion of the first connecting surface. Viewed from the axial direction, the axial inclination angle between the line connecting the center of the first connection surface and the center of the second connection surface and the connection surface of the second coil wiring connected to the first through-wiring is 60° or more and less than 90°. <1> from <12> An inductor component listed in any one of the following. <14> Viewed from a direction perpendicular to the first main surface, a portion of the first connecting surface and a portion of the second connecting surface overlap. <13> The inductor components listed below. <15> Viewed from a direction perpendicular to the first main surface, the center of the first connecting surface is closer to the axis than the center of the second connecting surface. <13> or <14> The inductor components listed below. <16> The first through-wiring comprises a conductive layer located on the outer periphery when viewed from the direction in which the first through-wiring extends, and a non-conductive layer located inside the conductive layer. <1> from <15> An inductor component listed in any one of the following. <17> The cross-sectional area of ​​at least one of the ends of the first through-wiring in the direction of extension is greater than the cross-sectional area of ​​the central part of the first through-wiring in the direction of extension. <1> from <16> An inductor component listed in any one of the following. <18> The thickness of the inductor component is 200 μm or less. <1> from <17> An inductor component listed in any one of the following. <19> Viewed from a direction perpendicular to the first main surface, the first external electrode and the second external electrode are located inside the outer circumferential surface of the body. <1> from <18> An inductor component listed in any one of the following. <20> Furthermore, the first main surface is provided with an organic insulator, The aforementioned element is an inorganic insulator, and the organic insulator is located inside the outer surface of the inorganic insulator when viewed from a direction perpendicular to the first main surface. <1> from <19> An inductor component listed in any one of the following. [Explanation of Symbols]

[0189] 1.1A-1H Inductor Component 10 Base Body 11b Bottom wiring (first coil wiring) 11b1 End face 11t Top-mounted wiring (second coil wiring) 11t1 End face 11t2 connection surface 11t3 connection surface 13. First Through Wiring 131 Outer area 13a center line 13e end 13m central part 13s conductive layer 13u non-conductive layer 13y1 First connection surface 13y2 Second connection surface 14. Second through-wiring 14a center line 14y1 First connection surface 14y2 Second connection surface 22 Insulator 100b Base (First main surface) 100t Top surface (second main surface) 110, 110A, 110B coils 121 1st external electrode 121b Bottom part 121V via section 121e1 Base layer 121e2 Plating layer 122 2nd external electrode 122b Bottom part 122V via section AX axis L1,L2,L4 straight line L3 tangent M Chuo Line V through hole Z1 Height θ Angle between the bottom wiring and the top wiring α,β Tilt angle

Claims

1. A base body including a first principal surface and a second principal surface that are opposite to each other, A coil provided on the aforementioned body and wound spirally along the axis, A first external electrode and a second external electrode are provided on the aforementioned body and electrically connected to the coil. Equipped with, The shaft of the coil is arranged parallel to the first main surface. The aforementioned coil is A plurality of first coil wirings are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface, A plurality of second coil wirings are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extend from the first coil wiring toward the second coil wiring, are provided on the opposite side of the shaft from the first through-wiring, and are arranged along the shaft. Includes, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of the helical shape. An inductor component in which the first through-wiring and the second through-wiring are non-parallel when viewed from the axial direction.

2. The inductor component according to claim 1, wherein the first through-wiring and the second through-wiring are symmetrical with respect to the axis when viewed from a direction perpendicular to the first main surface.

3. The inductor component according to claim 1 or 2, wherein the first through-wiring and the second through-wiring are symmetrical with respect to a line perpendicular to the first main surface and containing the axis, as viewed from the axial direction.

4. The inductor component according to any one of claims 1 to 3, wherein the line edge roughness of the first through-wiring is greater than the line edge roughness of the first coil wiring.

5. The inductor component according to any one of claims 1 to 3, wherein the line edge roughness of the first through-wiring is the same as or less than the line edge roughness of the first coil wiring.

6. The inductor component according to claim 1, wherein the width of the first through-wiring and the width of the second through-wiring are different.

7. The first through-wiring has an outer peripheral portion that, when viewed from the axial direction, is located radially outside the coil than the first coil wiring and the second coil wiring. The inductor component according to any one of claims 1 to 6, wherein the outer peripheral portion is arranged between 0.3 and 0.7 in height in a direction perpendicular to the first main surface of the base body, with reference to the first main surface.

8. A second coil is provided on the aforementioned body and is wound spirally along a second axis parallel to the aforementioned axis, A third external electrode and a fourth external electrode are provided on the base body and electrically connected to the second coil. Furthermore, The second coil is, A plurality of third coil wirings are provided on the first main surface side with respect to the second axis and are arranged along the second axis on a plane parallel to the first main surface, A plurality of fourth coil wirings are provided on the second main surface side with respect to the second axis and are arranged along the second axis on a plane parallel to the second main surface, A plurality of third through-wirings extending from the third coil wiring toward the fourth coil wiring and arranged along the second axis, A plurality of fourth through-wirings extend from the third coil wiring toward the fourth coil wiring, are provided on the opposite side of the second axis from the third through-wiring, and are arranged along the second axis. Includes, The third coil wiring, the third through wiring, the fourth coil wiring, and the fourth through wiring are connected in this order to constitute at least a portion of the spiral shape of the second coil. The inductor component according to any one of claims 1 to 7, wherein the second through-wiring and the third through-wiring are adjacent to each other.

9. The inductor component according to claim 8, wherein, with respect to the axial direction of the coil, the first through-wiring and the second through-wiring, and the third through-wiring and the fourth through-wiring are symmetrical with respect to the center line between the coil and the second coil.

10. The inductor component according to claim 8 or 9, wherein, when viewed from the axial direction of the coil, the second through-wiring and the third through-wiring are arranged in parallel.

11. The inductor component according to claim 9, wherein the first through-wiring and the second through-wiring are asymmetric with respect to a straight line perpendicular to the first main surface and containing the axis, as viewed from the axial direction.

12. The inductor component according to claim 8, wherein the third through-wiring and the fourth through-wiring are non-parallel when viewed from the second axial direction.

13. The first through-wiring has a first connection surface connected to the first coil wiring and a second connection surface connected to the second coil wiring. The first external electrode is provided on the first main surface side and, when viewed from a direction perpendicular to the first main surface, overlaps at least a portion of the first connecting surface. The inductor component according to any one of claims 1 to 12, wherein, when viewed from the axial direction, the inclination angle on the axial side between the line connecting the center of the first connection surface and the center of the second connection surface and the connection surface connected to the first through-wiring of the second coil wiring is 60° or more and less than 90°.

14. The inductor component according to claim 13, wherein, when viewed from a direction perpendicular to the first main surface, a portion of the first connecting surface and a portion of the second connecting surface overlap.

15. The inductor component according to claim 13 or 14, wherein, when viewed from a direction perpendicular to the first main surface, the center of the first connection surface is closer to the axis than the center of the second connection surface.

16. The inductor component according to any one of claims 1 to 15, wherein the first through-wiring has a conductive layer located on the outer circumference when viewed from the direction in which the first through-wiring extends, and a non-conductive layer located inside the conductive layer.

17. The inductor component according to any one of claims 1 to 16, wherein the cross-sectional area of ​​at least one end of the first through-wiring in the extending direction is greater than the cross-sectional area of ​​the central part of the first through-wiring in the extending direction.

18. The inductor component according to any one of claims 1 to 17, wherein the thickness of the inductor component is 200 μm or less.

19. The inductor component according to any one of claims 1 to 18, wherein, when viewed from a direction perpendicular to the first main surface, the first external electrode and the second external electrode are located inside the outer circumferential surface of the base body.

20. Furthermore, the first main surface is provided with an organic insulator, The inductor component according to any one of claims 1 to 19, wherein the base material is an inorganic insulator, and the organic insulator is located inside the outer surface of the inorganic insulator when viewed from a direction perpendicular to the first main surface.

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