Power supply device

Abstract

This technology provides a way to reduce the possibility of solder cracks while more efficiently dissipating heat from power supply units. [Solution] A power supply device 100 is provided, comprising: a mounting substrate 110 having a first surface 110T located on one side in a first direction and a second surface 110B located on the other side in a first direction; an electronic component 111 arranged on the first surface; a conductive material 112 electrically connecting the electronic component and the mounting substrate; a heat dissipation component 120 having a connection portion 121 connected to the electronic component and a heat dissipation portion 122 located further from the mounting substrate than the connection portion.

Description

Technical Field

[0001] The present invention relates to a power supply device, and particularly to a technology for heat dissipation of the power supply device.

Background Art

[0002] Conventionally, in order to reduce the temperature of high-temperature components, a heat sink is brought into close contact with the high-temperature components to reduce the component temperature. For example, Japanese Patent Application Laid-Open No. 2018-29026 (Patent Document 1) discloses a lighting power supply device. According to Patent Document 1, a power supply circuit includes a rectifying unit that rectifies alternating current, a first filter having a capacitor, a second switching circuit that switches the waveform output via the first filter, and a third filter having a capacitor that filters the high-frequency components of the waveform output from the second switching circuit and supplies the filtered waveform to a connected load. These capacitors are film capacitors or ceramic capacitors, and the voltage output from the third filter is set higher than in the case of an electrolytic capacitor. The substrate that realizes the power supply circuit is housed in a housing made of an aluminum extrusion material. A filler for transmitting the heat of the heat-generating components mounted on the substrate to the housing is injected into the internal space of the housing.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, because the thermal expansion coefficient of the resin filler differs from that of the substrate and solder, solder cracking is likely to occur due to thermal expansion and contraction. In addition, while the heat sink can transfer heat from high-temperature components to the inside of the power supply unit, the solder joints also become hot due to the heat from the heat sink, making them prone to solder cracking due to the heat cycle. Therefore, the objective of the present invention is to provide a technology that reduces the possibility of solder cracking while more efficiently dissipating heat from the power supply unit. [Means for solving the problem]

[0005] According to one aspect of this invention, a power supply device is provided, comprising: a mounting substrate having a first surface located on one side in a first direction and a second surface located on the other side in the first direction; an electronic component disposed on the first surface; a conductive material electrically connecting the electronic component and the mounting substrate; a heat dissipation component having a connection portion connected to the electronic component and a heat dissipation portion located further from the mounting substrate than the connection portion. [Effects of the Invention]

[0006] As described above, the present invention provides a technology for more efficiently dissipating heat from a power supply while reducing the possibility of solder cracking. [Brief explanation of the drawing]

[0007] [Figure 1] This is an overhead perspective view showing the external appearance of the power supply unit according to the first embodiment. [Figure 2] This is a right side view of the power supply unit with the right wall panel removed, according to the first embodiment. [Figure 3] This is an overhead perspective view of the power supply unit with the upper wall panel removed, according to the first embodiment. [Figure 4] This is an overhead perspective view showing the inside of a power supply unit near the heatsink according to the first embodiment. [Figure 5] This is a side view showing the inside of a power supply unit near a heat sink according to the first embodiment. [Modes for carrying out the invention]

[0008] Embodiments of the present invention will be described below with reference to the drawings. In the following description, identical parts are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed descriptions of them will not be repeated.

[0009] Figure 1 is an overhead perspective view showing the external appearance of the power supply unit 100 according to this embodiment. As shown in Figure 1, the power supply unit 100 according to this embodiment is covered by a roughly rectangular metal case 101. The case 101 consists of an upper wall surface 101T, a lower wall surface 101B, a right wall surface 101R, a left wall surface 101L, a front wall surface 101F, and a rear wall surface 101C. Power cables 105 and signal cables enter the power supply unit 100 from the front wall surface 101F and exit to the outside from the rear wall surface 101C.

[0010] Next, the internal structure of the power supply unit 100 according to this embodiment will be described with reference to Figures 2 to 5. The power supply unit 100 mainly includes, in order from bottom to top, a bottom wall surface 101B, an insulating sheet 116, a mounting board 110, a heat sink 120, electronic components 111, a heat dissipation sheet 115, an insulating sheet 116, and an upper wall surface 101T.

[0011] In this embodiment, the electronic components 111 are arranged on the upper surface 110T side of the mounting substrate 110. The electronic components 111 include FETs and diode bridges, and are driven by power supplied from outside the power supply unit 100. As a result, the electronic components 111 tend to generate heat.

[0012] The electronic component 111 is electrically connected to the mounting board 110 via a conductor 112. Generally, the electronic component 111 is soldered to the mounting board 110.

[0013] In this embodiment, the electronic component 111 is connected to a heat sink 120 located on the upper surface 110T side of the mounting substrate 110 and fixed to the upper surface 110T side of the mounting substrate 110.

[0014] The heat sink 120 is erected on the upper surface 110T side of the mounting substrate 110. The heat sink 120 mainly includes a connection portion 121, a planar heat radiating portion 122, an extension portion 123, and a support portion 124.

[0015] The connection portion 121 is arranged perpendicular to the upper surface 110T of the mounting substrate 110. The connection portion 121 is arranged parallel to the plane spanned by the front-rear direction and the up-down direction of the power supply device 100. An electronic component 111 is fixed to the right side surface of the connection portion 121.

[0016] The planar heat radiating portion 122 extends rightward from the upper end portion of the connection portion 121. That is, the planar heat radiating portion 122 is arranged parallel to the upper surface 110T of the mounting substrate 110.

[0017] The extension portion 123 extends rightward from the rear end portion of the connection portion 121. The extension portion 123 is arranged at a position separated from the mounting substrate 110 by being supported by the connection portion 121 on the left side and the support portion 124 on the right side.

[0018] The support portion 124 extends forward from the right end portion of the extension portion 123.

[0019] In the present embodiment, a convex portion 121X directed downward is provided at the front end portion of the lower side of the connection portion 121, and a convex portion 121Y directed downward is provided at the rear end portion of the lower side of the connection portion 121. Further, a convex portion 124X directed downward is provided at the front end portion of the lower side of the support portion 124. And when the two convex portions 121X and 124X abut against the upper surface 110T of the mounting substrate 110, other portions including the extension portion 123 are maintained at positions separated from the mounting substrate 110. More specifically, the connection portion 121, the extension portion 123, and the support portion 124 are fixed in a state separated from the mounting substrate 110 and perpendicular to the upper surface 110T of the mounting substrate 110.

[0020] An electronic component 111 is fixed to the right surface of the connection part 121. The fixed electronic component 111 is formed such that its thickness in the left-right direction (second direction) is shorter than the length in the up-down direction (first direction) and the length in the front-back direction (third direction). As a result, the heat of the electronic component 111 is easily transmitted to the connection part 121, that is, the heat sink 120.

[0021] A heat dissipation sheet 115 is attached to the upper surface of the planar heat dissipation part 122. An insulating sheet 116 is provided on the upper surface of the heat dissipation sheet 115. In other words, the heat dissipation sheet 115 is sandwiched between the upper surface of the planar heat dissipation part 122 and the insulating sheet 116. An upper wall surface 101T is provided on the upper surface of the insulating sheet 116.

[0022] The heat dissipation sheet 115 is made of a material with high thermal conductivity and viscosity. Alternatively, the heat dissipation sheet 115 is made of a material with high thermal conductivity and elasticity. As a result, a gap is less likely to occur between the insulating sheet 116 and the heat dissipation part 122, and the heat of the heat dissipation part 122 is easily transmitted to the insulating sheet 116 and the upper wall surface 101T.

[0023] With the above configuration, most of the heat generated by the electronic component 111 is first transmitted to the connection part 121. Then, most of the heat is transmitted to the heat dissipation part 122. The heat is transmitted to the upper wall surface 101T through the heat dissipation sheet 115 and released to the outside of the power supply device 100. That is, regarding the power supply device 100 according to the present embodiment, the degree to which the heat generated by the electronic component 111 is transmitted to the conductor 112 and solder can be reduced.

[0024] In other words, in the present embodiment, the heat sink 120 can transmit the heat generated by the high-temperature electronic component 111 to the upper wall surface 101T on the opposite side of the solder part to suppress the temperature rise of the solder part.

[0025] Also, in the present embodiment, the heat sink 120 has a planar heat dissipation part 122 in the direction opposite to the solder part, and by closely attaching the heat dissipation sheet 115 to the planar heat dissipation part 122, heat can be efficiently discharged to the outside through the upper wall surface 101T.

[0026] Furthermore, in order to reduce the amount of heat transferred from the heat sink 120 to the solder joint, a space is provided between the heat sink 120 and the mounting board 110. In addition, a support portion 124 is provided in the direction in which the flat heat dissipation portion 122 of the heat sink 120 extends, so that the heat sink 120 does not tilt even if force is applied to the flat heat dissipation portion 122 of the heat sink 120.

[0027] With the above configuration, the power supply unit 100 according to this embodiment can reduce the temperature rise of electronic components and solder joints while driving, and reduce cracking of solder joints due to heat cycling. <Summary>

[0028] In the above embodiment, a power supply device 100 is provided, comprising: a mounting substrate 110 having an upper surface (first surface) 110T located on one side in the first direction and a lower surface (second surface) 110B located on the other side in the first direction; an electronic component 111 disposed on the upper surface 110T; a conductor (conductive material) 112 electrically connecting the electronic component 111 and the mounting substrate 110; a connection portion 121 connected to the electronic component 111; and a heat sink (heat dissipation component) 120 having a planar heat dissipation portion (heat dissipation portion) 122 located further from the mounting substrate than the connection portion 121.

[0029] Preferably, the heat dissipation section 122 is formed in a plate shape parallel to the mounting substrate 110.

[0030] Preferably, the power supply unit 100 further comprises a case 101 having an upper wall surface (first wall portion) 101T facing the upper surface 110T of the mounting substrate 110 and a lower wall surface (second wall portion) 101B facing the lower surface 110B of the mounting substrate 110. The heat dissipation unit 122 is directly or indirectly connected to the upper wall surface 101T.

[0031] Preferably, the power supply unit 100 further includes a viscous heat dissipation sheet (viscous body) 115 disposed between the heat dissipation section 122 and the upper wall surface 101T.

[0032] Preferably, the viscous heat dissipation sheet 115 is placed inside the case 101 so as to be compressed by the heat dissipation section 122 and the upper wall surface 101T.

[0033] Preferably, the electronic component 111 has a shape in which the dimension in the second direction intersecting the first direction is shorter than the dimension in the third direction intersecting the first and second directions. The connector 121 is connected to the electronic component 111 in the second direction. The heat dissipation portion 122 is formed to extend from the connector 121 toward the second direction.

[0034] Preferably, the heat dissipation portion 122 is formed to extend from the connection portion 121 toward one side in the second direction. The heat sink 120 has a support portion 124 located toward one side in the second direction from the connection portion 121 and in contact with the mounting substrate 110.

[0035] Preferably, the heat sink 120 further has an extension 123 connecting the connection portion 121 and the support portion 124. The extension 123 is separated from the mounting substrate 110.

[0036] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims rather than by the foregoing description, and all modifications within the meaning and scope equivalent to the claims are intended to be included. [Explanation of Symbols]

[0037] 100: Power supply 101: Case 101T: Upper wall surface 101B: Lower wall surface 101L: Left wall 101R: Right wall 101F: Front wall 101A: Rear wall surface 105: Power cable 110: Mounted circuit board 110T:Top surface 110B: Bottom surface 111: Electronic components 112: Conductor 115: Heat dissipation sheet 116: Insulating sheet 120: Heatsink 121: Connection part 121X: Convex part 122: Planar heat dissipation part 123: Extension part 124: Support part 124X: Convex part

Claims

1. A mounting substrate having a first surface located on one side of the first direction and a second surface located on the other side of the first direction, Electronic components arranged on the first surface, A conductive material electrically connects the aforementioned electronic component and the aforementioned mounting substrate, A heat dissipation component having a connection portion connected to the aforementioned electronic component and a heat dissipation portion located further away from the mounting substrate than the connection portion, A power supply unit equipped with the following features.

2. The power supply device according to claim 1, wherein the heat dissipation section is formed in the shape of a plate parallel to the mounting substrate.

3. The case further comprises a first wall portion facing the first surface of the mounting substrate and a second wall portion facing the second surface of the mounting substrate, The power supply device according to claim 1, wherein the heat dissipation section is directly or indirectly connected to the first wall section.

4. The power supply device according to claim 3, further comprising a viscous body disposed between the heat dissipation section and the first wall section.

5. The power supply device according to claim 4, wherein the viscous body is arranged in the case so as to be compressed by the heat dissipation portion and the first wall portion.

6. The electronic component has a shape in which the dimension in the second direction intersecting the first direction is shorter than the dimension in the third direction intersecting the first and second directions. The aforementioned connection portion is connected to the electronic component in the second direction, The power supply device according to claim 1, wherein the heat dissipation portion is formed to extend from the connection portion toward the second direction.

7. The heat dissipation portion is formed to extend from the connection portion toward one side in the second direction, The power supply device according to claim 6, wherein the heat dissipation component is located on one side of the second direction from the connection portion and has a support portion that is in contact with the mounting substrate.

8. The heat dissipation component further has an extension that connects the connection part and the support part, The power supply device according to claim 7, wherein the extension portion is separated from the mounting substrate.

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