conductive sheet

Abstract

To provide a conductive sheet that allows for good soldering between a conductive wire and a terminal. [Solution] The conductive sheet (1) comprises a base sheet (2) including a functional area (A1) and a connection area (A2), a conductive wire (3) having a coating layer and arranged in the functional area and the connection area, an external device arranged in the connection area and supplying power to the conductive wire, a terminal portion (4) electrically connecting the conductive wire and the terminal portion, and a first solder for joining the conductive wire and the terminal portion. The terminal portion includes a first joining area to which the conductive wire is joined by the first solder, an external connection area connected to the external device, and a first boundary area located between the first joining area and the external connection area. The width dimension of the first boundary area is 30 to 70% of the maximum width dimension of the first joining area.

Description

[Technical Field]

[0001] The present invention relates to a conductive sheet equipped with terminals for connecting to the outside. [Background technology]

[0002] Japanese Patent Publication No. 2023-67011 (Patent Document 1) discloses a heater film comprising a film substrate, a heating element disposed on the film substrate that generates heat when electricity is applied, and a terminal element connected to the heating element and supplied with power from an external device. Patent Document 1 also discloses soldering a part of the terminal element to the heating element. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2023-67011 [Overview of the project] [Problems that the invention aims to solve]

[0004] In this case, when soldering a portion of the terminal to a heat-generating part such as a conductive wire, the heat from the solder would escape to the terminal, preventing the solder from reaching a proper temperature and resulting in unsuccessful soldering.

[0005] The present invention was made to solve the above-mentioned problems, and its objective is to provide a conductive sheet that can properly solder together a conductive wire and a terminal portion. [Means for solving the problem]

[0006] A conductive sheet according to one aspect of the present invention comprises a base sheet including a functional region and a connection region; a conductive wire having a coating layer and arranged in the functional region and the connection region; an external device arranged in the connection region and supplying power to the conductive wire; a terminal portion for electrically connecting the conductive wire and the terminal portion; and a first solder for joining the conductive wire and the terminal portion. The terminal portion includes a first joining region to which the conductive wire is joined by the first solder; an external connection region connected to the external device; and a first boundary region located between the first joining region and the external connection region. The width dimension of the first boundary region is 30 to 70% of the maximum width dimension of the first joining region.

[0007] Preferably, the terminal portion further includes a heat propagation relaxation region located between the first bonding region and the external connection region. The first boundary region is located between the first bonding region and the heat propagation relaxation region, and the width dimension of the first boundary region is 30 to 70% of the maximum width dimension of the heat propagation relaxation region.

[0008] Preferably, the terminal portion further includes a second joining region adjacent to the first joining region and joined to a conductive wire by a second solder, and a third boundary region located between the second joining region and the first joining region. The width dimension of the third boundary region is 30 to 70% of the maximum width dimension of the second joining region.

[0009] Preferably, the base sheet has an opening in the connection area. The conductive wire is positioned on the lower surface of the base sheet so as to pass through the opening, and the terminal portion is positioned on the upper surface of the base sheet so as to cover the opening.

[0010] Preferably, the first joining region is 75 mm 2 170mm or more 2 The following applies:

[0011] Preferably, the thickness of the terminal portion is 150 μm or more and 250 μm or less.

[0012] Preferably, the area of ​​the region where the first solder is provided is 20% to 40% of the area of ​​the first bonding region.

[0013] Preferably, the area of the terminal portion is 400 mm 2 or more and 800 mm 2 or less.

[0014] Preferably, the terminal portion is provided at an intermediate position of the conductive wire.

[0015] Preferably, the terminal portion is flat.

Advantages of the Invention

[0016] According to the conductive sheet of the present invention, the conductive wire and the terminal portion can be satisfactorily soldered.

Brief Description of the Drawings

[0017] [Figure 1] It is a diagram showing a conductive sheet according to an embodiment of the present invention. [Figure 2] (a) is a cross-sectional view taken along the line a-a of FIG. 1, and (b) is a cross-sectional view taken along the line b-b of FIG. 1. [Figure 3] It is a plan view of the terminal portion in the first embodiment of the present invention. [Figure 4] It is a plan view of the terminal portion in the second embodiment of the present invention. [Figure 5] It is a plan view of the terminal portion in the third embodiment of the present invention.

Modes for Carrying Out the Invention

[0018] Embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and their description will not be repeated.

[0019] 〈Regarding the Configuration〉 (Embodiment 1) Referring to FIGS. 1 to 3, the conductive sheet 1 according to the present embodiment will be described. In the figures, the horizontal direction indicated by the X arrow is the lateral direction, the vertical direction indicated by the Y arrow is the longitudinal direction, and the direction indicated by the Z arrow is the thickness direction.

[0020] The conductive sheet 1 in this embodiment comprises a base sheet 2, a conductive wire 3, a terminal portion 4, and a first solder 5 for joining the conductive wire 3 and the terminal portion 4.

[0021] The base sheet 2 includes a functional area A1 and a connection area A2. Functional area A1 is the area where a wiring pattern is formed by conductive wires 3. Functional area A1 typically has a heater function, but can have various functions such as sensing, light transmission, and antenna functions. Connection area A2 is the area where the terminal portion 4 connects to an external device to supply power to the conductive wires 3.

[0022] The base sheet 2 is typically rectangular in plan view, and a conductive wire 3 is provided on either the upper surface 21 or the lower surface 22. In this embodiment, the conductive wire 3 is provided on the lower surface 22, and the terminal portion 4 is provided on the upper surface 21. The base sheet 2 has an opening 20 in the connection area A2, which enables electrical connection between the conductive wire 3 and the terminal portion 4. The opening 20 is typically circular, but its size and shape are not limited as long as it can solder the conductive wire 3 and the terminal portion 4 together.

[0023] The base sheet 2 is formed from a thermoplastic resin, such as polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polypropylene, PC-ABS, polyvinyl chloride, or acrylic resin. Furthermore, it is preferable that the base sheet 2 has a heat shrinkage rate of 2.5% or less and possesses suitable stretchability for use as a conductive film in injection molding. In this case, the material is not limited to the above. This not only improves moldability during injection molding but also prevents warping deformation during the molding of the conductive sheet 1.

[0024] From the viewpoint of good moldability, the thickness of the base sheet 2 is preferably 0.2 mm to 0.5 mm. If it is thinner than 0.2 mm, when the conductive wire 3 is embedded in the base sheet 2, the shape of the conductive wire 3 may protrude from the bottom surface 22, which may result in poor appearance. If it is thicker than 0.5 mm, molding may become difficult, especially when forming a three-dimensional shape.

[0025] The conductive wire 3 is arranged on the lower surface 22 of the base sheet 2, extending from the functional area A1 to the connection area A2. The conductive wire 3 has one or more copper wires 30 and a covering layer 31 that surrounds the outermost circumference of the copper wires 30. Here, "outermost circumference" includes the state in which the outer circumference of a single copper wire 30 is covered, and the state in which one or more copper wires 30 are bundled together and covered. Furthermore, the conductive wire 3 in this embodiment is arranged to pass through the opening 20 and the terminal portion 4. Here, "passing through" means that the end of the conductive wire 3 passes through without being placed on the opening 20 and the terminal portion 4. In other words, the terminal portion 4 is provided at an intermediate position of the conductive wire 3.

[0026] The conductive wire 3 can be patterned in various ways depending on the function of the functional area A1. For example, a shape in which wires are arranged at equal intervals in the vertical direction (meander shape) can be used. In this embodiment, one conductive wire 3 is provided on the base sheet 2, but a pattern may be formed using multiple conductive wires 3.

[0027] The diameter of the conductive wire 3 is preferably 0.05 mm to 0.5 mm, and more preferably 0.2 mm to 0.5 mm. If it is thinner than 0.05 mm, it will be prone to breakage, and the resistance will become too high, reducing the heater function. If it is thicker than 0.5 mm, the transmission performance of visible light or radio waves will be poor when a light source or antenna is placed on the lower side of the functional area A1.

[0028] The copper wire 30 is typically a copper wire, but may also be made of an alloy of copper and other conductive materials. Examples of other conductive materials include silver, lead, aluminum, beryllium, zirconium, iron, nickel, and manganese.

[0029] The coating layer 31 is composed of an insulating material such as enamel or a thermoplastic resin tape. In this embodiment, the coating layer 31 is made of polyurethane. Referring particularly to Figures 2(a) and (b), the coating layer 31 in this embodiment melts with the heat of the first solder 5, so it can be easily joined to the terminal portion 4 even at locations other than the end of the conductive wire 3. In other words, the conductive wire 3 can be joined to the terminal portion 4 at an intermediate position without prior positioning.

[0030] Referring particularly to Figure 3, the terminal portion 4 is located in connection area A2 and electrically connects the conductive wire 3 to an external device that supplies power to the conductive wire 3. In this embodiment, the terminal portion 4 is located on the upper surface 21 of the base sheet 2 so as to cover the opening 20. Here, "covering" means that the terminal portion 4 and the conductive wire 3 are covered so as to be electrically connectable, and it is sufficient to cover at least a part of the opening 20.

[0031] The terminal portion 4 is preferably formed of a conductive material with low resistance and that can be soldered. The material of the terminal portion 4 is typically copper, but may also be an alloy containing one or more metals from brass, iron, and copper. The surface of the terminal portion 4 may be plated with nickel or the like to prevent the formation of an oxide film.

[0032] The terminal portion 4 is flat. In other words, the terminal portion 4 has a shape that conforms to the surface of the base sheet 2. As a result, the shape of the terminal portion 4 has almost no effect during processing such as injection molding, thus improving operability during processing.

[0033] The thickness dimension of the terminal portion 4 is, for example, 0.15 mm or more and 0.25 mm or less, preferably 0.18 mm or more and 0.22 mm or less. By setting it to 0.15 mm or more, breakage and deformation of the terminal portion 4 can be prevented, and handling performance can be improved. By setting it to 0.25 mm or less, it is possible to prevent the difficulty of solder joining due to an increase in the thermal conductivity.

[0034] The area of the terminal portion 4 is 400 mm 2 or more and 800 mm 2 or less. By setting it to 400 mm 2 or more, even if the external device and the conductive wire are separated by a predetermined distance or more, electrical connection can be easily performed. However, if the terminal portion 4 is too large, the design property of the conductive sheet deteriorates or unnecessary costs are incurred. Therefore, the upper limit value of the size of the terminal portion 4 is preferably set to 800 mm 2 or less. Note that in the terminal portion 4 of the present embodiment, although the thickness is thin, since the area of the terminal portion 4 is large, the resistance value of the terminal portion 4 can be kept low.

[0035] The terminal portion 4 includes a first bonding region B1 to which the conductive wire 3 is bonded by the first solder 5, an external connection region D connected to the external device, and a first boundary region C1 located between the first bonding region B1 and the external connection region D.

[0036] The first bonding region B1 is typically substantially circular, and its area is 75 mm 2 or more and 170 mm 2 or less. If the area of the first bonding region B1 is larger than 170 mm 2 , the heat of the first solder 5 spreads within the region, so that the temperature of the solder does not rise appropriately, and there is a risk that the coating layer 31 of the conductive wire 3 cannot be completely melted. In the first bonding region B1 of the present embodiment, by setting its area to 75 mm 2 or more, a sufficient region for adhering to the base material sheet 2 while covering the opening 20 of the base material sheet 2 can be ensured. Also, by setting it to 170 mm 2 or less, the coating layer 31 can be melted by the heat of the first solder 5, and the conductive wire 3 can be solder-bonded.

[0037] The first boundary region C1 is a "constricted" region that narrows from both sides in the width direction X of the terminal portion 4. In other words, the first boundary region C1 is a region that connects the endpoints of substantially tapered recesses 40 and 41 formed on both sides in the width direction X of the terminal portion 4. In this specification, an "endpoint" is defined as the point located at the narrowest part of the boundary region. By providing the first boundary region C1 in this way, separating the first bonding region B1 from adjacent regions, it is possible to prevent the heat of the first solder 5 from spreading to other areas of the terminal portion 4. In other words, the first boundary region C1 can function to retain the heat of the first solder 5 within the first bonding region B1. As a result, the terminal portion 4 can sufficiently melt the coating layer 31 by soldering and bond with the conductive wire 3.

[0038] The external connection area D is the area connected to an external device that supplies power. In this embodiment, the external connection area D is larger than a typical soldered terminal. This allows for a good electrical connection even when there is a distance between the conductive wire 3 and the external device. The shape of the external connection area D is typically a roughly rectangular shape with a curve, but its shape is not limited as long as it can be connected to the external device.

[0039] The width dimension X1 of the first boundary region is 30-70% of the maximum width dimension X2 of the first joint region. Note that the width dimension X1 of the first boundary region is the dimension X1 between recesses 40 and 41. If it is less than 30%, the first boundary region C1 may be damaged, potentially reducing handling performance. If it is greater than 70%, the heat of the first solder 5 may spread to the adjacent region via the first boundary region C1. The ratio of the width dimension X1 of the first boundary region to the maximum width dimension X2 of the first joint region is 0.3-0.7:1, which prevents the heat of the first solder 5 from escaping from the first joint region B1, thus preventing solder joint defects.

[0040] Furthermore, the width dimension X1 of the first boundary region C1 is determined by the maximum width dimension X2 of the first joint region, but is preferably 7 mm or less, and more preferably 5 mm or less. This prevents the heat of the first solder 5 from escaping to the first joint region B1 and the adjacent region.

[0041] The area of ​​the external connection region D is preferably 1.0 to 2.5 times the area of ​​the first bonding region B1. This is because, through diligent research, the inventors of this application discovered that if the area of ​​the region adjacent to the first bonding region B1 (in this embodiment, the external connection region D) is too large, too much heat escapes from the first solder 5, making solder bonding impossible. By making the area of ​​the external connection region D 1.0 to 2.5 times larger, the heat from the first bonding region B1 can be less likely to spread, thereby preventing solder bonding defects.

[0042] The first solder 5 is an alloy mainly composed of tin (Sn) and melts at, for example, 190°C or higher. The temperature during soldering can be appropriately determined considering the melting temperature of the coating layer 31, and is typically 380°C or higher, preferably 400°C or higher. As a result, as shown in Figure 2(b), the heat of the first solder 5 melts the coating layer 31, and the copper wire 30 and the terminal portion 4 can be joined.

[0043] The area H1 of the region where the first solder is applied is 20% to 40% of the area B1 of the first bonding region. If it is less than 20%, the heat from the solder escapes to the first bonding region B1, and the temperature of the first solder 5 in area H1 does not rise properly, which may prevent the coating layer 31 of the conductive wire 3 from melting. If it is more than 40%, the first solder 5 may spill out of the terminal portion 4, which may cause a cosmetic defect.

[0044] As described above, in this embodiment, the terminal portion 4 has a larger area than conventional solder-joined terminal portions because the solder-joining area B1 is demarcated by a constricted first boundary area C1. Because the terminal portion 4 has the first boundary area C1, even though the overall area of ​​the terminal portion 4 is large, it is possible to prevent the heat of the first solder 5 from spreading to areas other than the first solder-joining area B1. As a result, the terminal portion 4 can be solder-joined well with the conductive wire 3 having a coating layer 31. In addition, because the terminal portion 4 has a larger area than conventional solder-joined terminal portions, the degree of freedom in the arrangement relationship between the conductive sheet 1 and the external device can be improved.

[0045] Furthermore, because the conductive sheet 1 of this embodiment is equipped with the terminal portion 4, soldering can be performed in a short time even with a conductive wire 3 having a coating layer 31. This prevents the effects that can occur due to the heat of soldering, such as deformation of the base sheet 2 due to the heat of soldering or changes in the physical properties of the conductive wire 3.

[0046] (Embodiment 2) Next, with reference to Figure 4, the terminal portion 4A of the conductive sheet according to Embodiment 2 will be described. Figure 4 is a plan view of the terminal portion 4A in Embodiment 2. The conductive sheet of Embodiment 2 basically has the same configuration as conductive sheet 1, but differs in that the terminal portion 4A has a heat propagation mitigation region E that can prevent the conduction of heat from the first solder 5.

[0047] The terminal portion 4A of this embodiment further includes a heat propagation mitigation region E located between the first bonding region B1 and the external connection region D. The "heat propagation mitigation region" is a region that prevents the heat of the first solder 5 from spreading into the terminal portion 4. The shape of the heat propagation mitigation region E is not particularly limited, but for example, it is approximately circular in shape and has an area of ​​170 mm². 2 The present inventors, through diligent research, have found that in order to achieve good solder joints, the area of ​​the joint region and the adjacent region must be less than or equal to a predetermined area. The area of ​​the heat propagation relaxation region E is 170 mm². 2By doing the following, it is possible to prevent the heat from the first solder 5 from the first bonding region B1 from spreading too much into the heat propagation relaxation region E, which would result in a solder joint failure. The lower limit of the area of ​​the heat propagation relaxation region E is not particularly limited, but from the viewpoint of forming the width dimension X4 of the first boundary region, for example, 50 mm 2 That's all you need.

[0048] The terminal portion 4A further includes a second boundary region C2 located between the heat propagation mitigation region E and the external connection region D. The second boundary region C2 is a constricted region provided so as to narrow from both sides in the width direction X of the terminal portion 4A. In other words, the second boundary region C2 is a region connecting the endpoints of substantially tapered recesses 40A and 41A formed on both sides in the width direction X of the terminal portion 4A. By providing the second boundary region C2 in this way to separate the heat propagation mitigation region E from the adjacent external connection region D, the area of ​​the external connection region D can be made larger than in Embodiment 1. In other words, the second boundary region C2 can prevent the heat of the first solder 5 from spreading to the external connection region D. As a result, the terminal portion 4A can be soldered to the conductive wire 3 well, regardless of the area of ​​the external connection region D.

[0049] The first boundary region C1 is located between the first bonding region B1 and the heat propagation relaxation region E, and the width dimension X4 of the first boundary region is 30-70% of the maximum width dimension X5 of the heat propagation relaxation region. If it is less than 30%, the first boundary region C1 may be damaged, potentially reducing handling performance. If it is greater than 70%, the heat from the first solder 5 will be more easily transferred to the heat propagation relaxation region E, potentially causing solder joint failure. The ratio of the width dimension X4 of the first boundary region to the maximum width dimension X5 of the heat propagation relaxation region is 0.3-0.7:1, which prevents excessive heat transfer from the first solder 5 from the first bonding region B1 to the heat propagation relaxation region E, thus preventing solder joint failure.

[0050] (Embodiment 3) Next, with reference to Figure 5, the terminal portion 4B of the conductive sheet according to Embodiment 3 will be described. Figure 5 is a plan view of the terminal portion 4B in Embodiment 3. The conductive sheet according to Embodiment 3 basically has the same configuration as conductive sheet 1, but differs in that the terminal portion 4B has two bonding regions B1 and B2.

[0051] The terminal portion 4B further includes a second bonding region B2 adjacent to the first bonding region B1 and bonded to a conductive wire by a second solder 5B, and a third boundary region C3 located between the second bonding region B2 and the first bonding region B1.

[0052] The second bonding region B2 is typically roughly circular in shape, with an area of ​​170 mm². 2 The following applies: The area of ​​the second bonding region B2 is 170 mm². 2 If it is larger than this, the heat from the second solder 5B will spread within the region, preventing the solder temperature from rising properly and potentially failing to completely melt the coating layer 31 of the conductive wire 3. The second bonding region B2 in this embodiment is 170 mm 2 By doing the following, the heat from the second solder 5B sufficiently melts the coating layer 31, allowing the conductive wire 3 to be soldered. Furthermore, the lower limit of the area of ​​the second bonding region B2 is not particularly limited, but from the viewpoint of forming the width dimension X6 of the third boundary region, for example, 50 mm 2 That's all you need.

[0053] The terminal portion 4B further includes a third boundary region C3 located between the second bonding region B2 and the first bonding region B1. The third boundary region C3 is a constricted region provided so as to narrow from both sides in the width direction X of the terminal portion 4B. In other words, the third boundary region C3 is a region that connects the endpoints of substantially tapered recesses 40B and 41B formed on both sides in the width direction X of the terminal portion 4B. By providing the third boundary region C3 in this way to separate the first bonding region B1 from the adjacent second bonding region B2, it is possible to prevent the heat of the solder 5 in the first bonding region B1 from spreading in both directions, that is, to both the external connection region D and the second bonding region B2.

[0054] Referring to Figure 5, the second joining region B2 is provided in a position opposite the external connection region D, as an example of an configuration adjacent to the first joining region B1. However, the location where the second joining region B2 is provided is not particularly limited, as long as it is not in a region adjacent to the first connection region B1 and the external connection region D.

[0055] The width dimension X6 of the third boundary region is 30-70% of the maximum width dimension X7 of the second joint region. If it is less than 30%, the third boundary region C3 may be damaged, potentially reducing handling performance. If it is greater than 70%, the heat from the solder in the first joint region B1 may be easily transferred to the second joint region B2, potentially causing solder joint failure. The ratio of the width dimension X6 of the third boundary region to the maximum width dimension X7 of the second joint region is 0.3-0.7:1, which prevents the transfer of solder heat between the first joint region B1 and the second joint region B2, thus preventing solder joint failure.

[0056] The preferred ratio of the area H2 of the region where the second solder 5B is provided in the second bonding region B2 is the same as the area H1 of the region where the solder is provided. That is, area H2 is 20% or more and 40% or less of the area B2 of the second bonding region. If it is less than 20%, the heat from the second solder 5B escapes into the second bonding region B2, causing the temperature of the second solder 5B in area H2 to drop, which may prevent it from melting the coating layer 31 of the conductive wire 3. If it is more than 40%, the second solder 5B may spill out of the terminal portion 4B, which may cause a defect in appearance.

[0057] In this example, the conductive sheet 1 has terminals 4 on its upper surface 21 and conductive wires 3 on its lower surface 22, but both may be provided on the same surface. Note that in this case, the opening 20 would not be necessary.

[0058] Furthermore, the configurations of each embodiment may be combined as appropriate. That is, the terminal portion may include all of the first bonding region B1, the second bonding region B2, and the heat propagation relaxation region E.

[0059] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims rather than by the foregoing description, and all modifications within the meaning and scope equivalent to the claims are intended to be included. [Explanation of Symbols]

[0060] 1 Conductive sheet, 2 Base sheet, 3 Conductive wire, 4 Terminal section, 5 First solder, 20 Opening, 21 Top surface, 22 Bottom surface, 30 Copper wire, 31 Coating layer, A1 Functional area, A2 Connection area, B1 First bonding area, B2 Second bonding area, C1 First boundary area, C2 Second boundary area, C3 Third boundary area, D External connection area, E Heat propagation relaxation area.

Claims

1. A base sheet including a functional area and a connection area, A conductive wire having a coating layer is arranged in the functional region and the connection region, An external device arranged in the connection area and supplying power to the conductive wire, and a terminal portion that electrically connects the conductive wire, The device comprises a first soldering iron that joins the conductive wire and the terminal portion, The aforementioned terminal portion is A first bonding region in which the conductive wire is joined by the first solder, An external connection area connected to the aforementioned external device, The first junction region and the first boundary region located between them are included, A conductive sheet wherein the width dimension of the first boundary region is 30 to 70% of the maximum width dimension of the first bonding region.

2. The aforementioned terminal portion is The heat propagation relaxation region located between the first bonding region and the external connection region is further included. The first boundary region is located between the first bonding region and the heat propagation relaxation region. The conductive sheet according to claim 1, wherein the width dimension of the first boundary region is 30 to 70% of the maximum width dimension of the heat propagation relaxation region.

3. The aforementioned terminal portion is A second bonding region adjacent to the first bonding region, which is bonded to the conductive wire by a second solder, The present invention further includes a third boundary region located between the second joining region and the first joining region, The conductive sheet according to claim 1, wherein the width dimension of the third boundary region is 30 to 70% of the maximum width dimension of the second joining region.

4. The base sheet has an opening in the connection region, The conductive wire is arranged on the lower surface of the base sheet so as to pass through the opening. The conductive sheet according to any one of claims 1 to 3, wherein the terminal portion is arranged on the upper surface of the base sheet so as to cover the opening.

5. The first joining region is 75 mm ２ 170mm or more ２ The conductive sheet according to any one of claims 1 to 3, which is as follows:

6. The conductive sheet according to any one of claims 1 to 3, wherein the thickness dimension of the terminal portion is 150 μm or more and 250 μm or less.

7. The conductive sheet according to any one of claims 1 to 3, wherein the area of ​​the region where the first solder is provided is 20% or more and 40% or less of the area of ​​the first bonding region.

8. The area of ​​the terminal portion is 400 mm². ２ 800mm or more ２ The conductive sheet according to any one of claims 1 to 3, which is as follows:

9. The conductive sheet according to any one of claims 1 to 3, wherein the terminal portion is provided at an intermediate position of the conductive wire.

10. The conductive sheet according to any one of claims 1 to 3, wherein the terminal portion is flat.

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