Component mounting equipment and component mounting system

Abstract

To provide a component mounting device that can reduce the power consumption of a negative pressure supply pump. [Solution] This component mounting apparatus 1d includes a mounting head 131 that attracts components E to be mounted on a substrate P using negative pressure, a negative pressure supply pump 15 that supplies negative pressure to the mounting head 131, and a control unit 21 that controls the rotation speed of the negative pressure supply pump 15 to decrease based on the state of the apparatus.

Description

Technical Field

[0001] This invention relates to a component mounting apparatus and a component mounting system, and particularly to a component mounting apparatus and a component mounting system provided with a negative pressure supply pump.

Background Art

[0002] Conventionally, a component mounting apparatus provided with a negative pressure supply pump has been known (see, for example, Patent Document 1).

[0003] Patent Document 1 discloses a component mounting apparatus including a mounting head that sucks a component to be mounted on a substrate by negative pressure, and a vacuum pump that supplies negative pressure to the mounting head. This component mounting apparatus adjusts the rotation speed of the vacuum pump based on whether the suction state of the component by the mounting head can be regarded as stable. Specifically, when the component mounting apparatus cannot regard the suction state of the component by the mounting head as stable, the rotation speed of the vacuum pump is increased.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the component mounting apparatus described in Patent Document 1, when the suction state of the component by the mounting head cannot be regarded as stable, it is possible to stabilize the suction state by increasing the rotation speed of the vacuum pump. However, during the production of the substrate, the vacuum pump is always driven at a relatively high rotation speed that allows the component to be sucked by the mounting head, so the power consumption of the vacuum pump (negative pressure supply pump) increases. Therefore, it is desired to reduce the power consumption of the negative pressure supply pump.

[0006] This invention was made to solve the above-mentioned problems, and one of its objectives is to provide a component mounting device and component mounting system that can reduce the power consumption of a negative pressure supply pump. [Means for solving the problem]

[0007] A component mounting apparatus according to the first aspect of this invention comprises a mounting head that attracts components to be mounted on a substrate using negative pressure, a negative pressure supply pump that supplies negative pressure to the mounting head, and a control unit that controls the rotation speed of the negative pressure supply pump to decrease based on the state of the apparatus.

[0008] In the component mounting apparatus according to the first aspect of this invention, as described above, a control unit is provided that controls the rotation speed of the negative pressure supply pump based on the state of the apparatus. As a result, the rotation speed of the negative pressure supply pump can be reduced based on the state of the component mounting apparatus, and the power consumption of the negative pressure supply pump can be reduced compared to when the negative pressure supply pump is always driven at a relatively high rotation speed that allows the mounting head to pick up components during substrate production. Reducing the power consumption of the negative pressure supply pump, which consumes a relatively large amount of power in a component mounting apparatus, is extremely effective.

[0009] In a component mounting apparatus according to the first aspect of this invention, preferably, the control unit controls the rotation speed of the negative pressure supply pump to decrease when it determines that the mounting head is not picking up components and mounting the picked-up components onto the substrate. With this configuration, the rotation speed of the negative pressure supply pump can be reduced when it is not necessary to drive the negative pressure supply pump at a relatively high rotation speed in order to pick up components with the mounting head, thereby effectively reducing the power consumption of the negative pressure supply pump.

[0010] In a component mounting apparatus according to the first aspect of this invention, preferably, the control unit controls the rotation speed of the negative pressure supply pump to decrease when it is determined that the timing set by the operator has arrived. With this configuration, the rotation speed of the negative pressure supply pump can be reduced at any timing at which the operator thinks it is appropriate to suppress the rotation speed of the negative pressure supply pump, such as when the production of substrates is stopped and the operator leaves the component mounting apparatus, thereby effectively reducing the power consumption of the negative pressure supply pump.

[0011] In a component mounting apparatus according to the first aspect of this invention, preferably, the control unit controls the rotation speed of the negative pressure supply pump to decrease when it determines that substrate production has stopped. With this configuration, if substrate production is stopped due to, for example, abnormal stoppage, setup changeover, or waiting for processing by other devices other than the component mounting apparatus, the rotation speed of the negative pressure supply pump can be reduced by taking advantage of the fact that it is not necessary to drive the negative pressure supply pump at a relatively high rotation speed in order to pick up components with the mounting head. As a result, the power consumption of the negative pressure supply pump can be effectively reduced.

[0012] In a component mounting apparatus according to the first aspect of this invention, preferably, the mounting head repeatedly performs a cycle of picking up components and mounting the picked-up components onto a substrate, and the control unit controls the rotation speed of the negative pressure supply pump to decrease when it is determined that it is between cycles. With this configuration, since the mounting head is not picking up components during the timing between cycles, it is not necessary to drive the negative pressure supply pump at a relatively high rotation speed to pick up components with the mounting head, and thus the rotation speed of the negative pressure supply pump can be reduced. As a result, the power consumption of the negative pressure supply pump can be effectively reduced.

[0013] In a component mounting apparatus according to the first aspect of this invention, preferably, the control unit controls the rotation speed of the negative pressure supply pump to decrease when it determines that the device is in a warm-up state. With this configuration, the rotation speed of the negative pressure supply pump can be reduced by taking advantage of the fact that, during a warm-up state, it is not necessary to drive the negative pressure supply pump at a relatively high rotation speed to attract components with the mounting head. As a result, the power consumption of the negative pressure supply pump can be effectively reduced.

[0014] In a component mounting apparatus according to the first aspect of this invention, preferably, when the control unit controls the reduction of the rotational speed of the negative pressure supply pump based on the state of the apparatus, it controls the reduction of the rotational speed of the negative pressure supply pump to multiple levels according to multiple states of the apparatus. With this configuration, the power consumption of the negative pressure supply pump can be reduced while appropriately adjusting the level to which the rotational speed of the negative pressure supply pump is reduced in accordance with multiple states of the apparatus.

[0015] In this case, preferably, the control unit reduces the rotational speed of the negative pressure supply pump to zero when it determines that the state of the device is in a first state, and reduces the rotational speed of the negative pressure supply pump to a rotational speed greater than zero when it determines that the state of the device is in a second state. With this configuration, for example, when the state of the device is such that there is a relatively long time until the next component is picked up by the mounting head (i.e., there is a relatively large amount of time before the negative pressure supply pump is driven at a relatively high rotational speed), reducing the rotational speed of the negative pressure supply pump to zero enhances the effect of reducing the power consumption of the negative pressure supply pump. Also, for example, when the state of the device is such that there is a relatively short time until the next component is picked up by the mounting head (i.e., there is relatively little time before the negative pressure supply pump is driven at a relatively high rotational speed), reducing the rotational speed of the negative pressure supply pump to a rotational speed greater than zero allows for preparation for driving the negative pressure supply pump at a relatively high rotational speed while reducing the power consumption of the negative pressure supply pump.

[0016] In a component mounting apparatus according to the first aspect of this invention, preferably, the control unit controls the rotation speed of the negative pressure supply pump to increase when it determines that the component suction state by the mounting head is unstable. With this configuration, the suction force of the component by the mounting head can be increased by increasing the rotation speed of the negative pressure supply pump, thereby stabilizing the component suction state by the mounting head.

[0017] In a component mounting apparatus according to the first aspect of this invention, preferably, the control unit controls the rotation speed of the negative pressure supply pump to increase when it determines that it is time to maintain the filter located in the negative pressure supply path. With this configuration, increasing the rotation speed of the negative pressure supply pump increases the suction force of the component by the mounting head, thereby compensating for the decrease in suction force caused by filter clogging. As a result, the timing of filter maintenance can be delayed, and the number of times when substrate production cannot be continued due to filter clogging can be reduced.

[0018] A component mounting system according to the second aspect of this invention comprises a component mounting device including a mounting head that attracts components to be mounted on a substrate using negative pressure, a negative pressure supply pump that supplies negative pressure to the mounting head, and a control device that controls the rotation speed of the negative pressure supply pump to decrease based on the state of the component mounting device.

[0019] In the component mounting system according to the second aspect of this invention, as described above, a control device is provided that controls the rotation speed of the negative pressure supply pump to decrease based on the state of the component mounting device. As a result, the rotation speed of the negative pressure supply pump can be reduced based on the state of the component mounting device, and the power consumption of the negative pressure supply pump can be reduced compared to when the negative pressure supply pump is always driven at a relatively high rotation speed that allows components to be attracted by the mounting head during substrate production.

[0020] In the component mounting system according to the second aspect of the present invention, preferably, the control device performs control to reduce the rotational speed of the negative pressure supply pump based on the state of the component mounting device based on the state of the device upstream or downstream of the component mounting device. With this configuration, for example, when the production of the substrate is stopped due to an abnormal stop of the device upstream or downstream of the component mounting device, when it is not necessary to drive the negative pressure supply pump at a relatively high rotational speed to suck the component by the mounting head, the rotational speed of the negative pressure supply pump can be reduced, so that the power consumption of the negative pressure supply pump can be effectively reduced.

[0021] In the component mounting system according to the second aspect of the present invention, preferably, the control device performs control to reduce the rotational speed of the negative pressure supply pump based on the state of the component mounting device based on the timing set by the operator. With this configuration, for example, when the production of the substrate is stopped and the operator leaves the component mounting device, the rotational speed of the negative pressure supply pump can be reduced at any timing when the operator considers that the rotational speed of the negative pressure supply pump may be suppressed, so that the power consumption of the negative pressure supply pump can be effectively reduced.

Advantages of the Invention

[0022] According to the present invention, as described above, the power consumption of the negative pressure supply pump can be reduced.

Brief Description of the Drawings

[0023] [Figure 1] It is a block diagram showing a component mounting system according to an embodiment. [Figure 2] It is a plan view showing a component mounting device according to an embodiment. [Figure 3] It is a block diagram showing a control configuration of a component mounting device according to an embodiment. [Figure 4] It is a diagram for explaining the configuration of an inverter according to an embodiment. [Figure 5]This figure illustrates a first example of rotational speed reduction control according to one embodiment. [Figure 6] This figure illustrates a second example of rotational speed reduction control according to one embodiment. [Figure 7] This figure illustrates a third example of rotational speed reduction control according to one embodiment. [Figure 8] This figure illustrates a first example of rotational speed increase control according to one embodiment. [Figure 9] This figure illustrates a second example of rotational speed increase control according to one embodiment. [Modes for carrying out the invention]

[0024] The following describes embodiments of the present invention based on the drawings.

[0025] Referring to Figures 1 to 9, the configuration of a component mounting system 100 according to one embodiment of the present invention will be described.

[0026] (Configuration of the component mounting system) The component mounting system 100 is configured to mount components E onto a substrate P to manufacture a substrate P with components E mounted on it. Components E include small electronic components such as LSIs, ICs, transistors, capacitors, and resistors.

[0027] As shown in Figure 1, the component mounting system 100 comprises a component mounting line 1 and a server device 2. The component mounting line 1 includes a printer 1a, a print inspection machine 1b, a dispenser device 10c, a plurality of component mounting devices 1d, a visual inspection device 1e, and a reflow device 1f. The component mounting line 1 is configured to transport substrates P from the upstream side (left side) to the downstream side (right side) along the manufacturing line. The server device 2 is an example of a "control device" as defined in the claims.

[0028] Printer 1a is a screen printing machine and has the function of applying solder paste onto the mounting surface of the circuit board P.

[0029] The printing inspection machine 1b has the function of inspecting the condition of the solder paste printed by the printing machine 1a.

[0030] The dispenser device 10c has the function of applying solder paste, adhesive, etc., to the substrate P.

[0031] The component mounting device 1d has the function of mounting components E onto a substrate P on which solder paste has been printed. Multiple component mounting devices 1d are arranged along the transport direction of the substrate P.

[0032] The visual inspection device 1e has the function of inspecting the appearance of the substrate P on which components E have been mounted by the component mounting device 1d.

[0033] The reflow apparatus 1f has the function of melting solder by heat treatment and joining components E to the electrode portions of the substrate P. The reflow apparatus 1f is configured to perform the heat treatment while transporting the substrate P on a lane.

[0034] Server device 2 manages each device on component mounting line 1. Server device 2 is connected to each device on component mounting line 1 in a way that allows them to communicate with each other. Server device 2 includes a control unit 2a, a display unit 2b, and an operation unit 2c. The control unit 2a is a control circuit that controls each part of server device 2 and includes a memory where a program is stored and a processor such as a CPU (Central Processing Unit) that executes the program stored in the memory. The display unit 2b includes a monitor such as an LCD monitor and displays various information. The operation unit 2c includes input devices such as a keyboard and mouse and accepts operations from the operator.

[0035] (Configuration of component mounting equipment) As shown in Figures 2 and 3, the component mounting apparatus 1d comprises a base 11, a substrate transport unit 12, a head unit 13, a head horizontal movement mechanism unit 14, a negative pressure supply pump 15, an inverter 16, a negative pressure state detection unit 17, a component imaging unit 18, a substrate imaging unit 19, a side imaging unit 20, and a control unit 21. In the following description, the substrate transport direction is defined as the X direction, the direction perpendicular to the X direction in the horizontal plane is defined as the Y direction, and the vertical direction perpendicular to both the X and Y directions is defined as the Z direction.

[0036] The base 11 is a platform that serves as the foundation for arranging each component in the component mounting device 1d. A substrate transport unit 12, a rail unit 142, and a component imaging unit 18 are provided on the base 11. A control unit 21 is also provided inside the base 11. In addition, multiple component supply units 22 for supplying components E are provided on both sides of the base 11 in the Y direction (Y1 direction side and Y2 direction side), arranged along the X direction.

[0037] The component supply unit 22 is a tape feeder that supplies component E by feeding component supply tape containing component E. The component supply tape is wound on a reel, which is set in the component supply unit 22. The component supply unit 22 is configured to intermittently feed the component supply tape in response to the component picking operation by the head unit 13.

[0038] The substrate transport unit 12 is configured to receive a substrate P before mounting, transport it in the X direction, and unload the substrate P after mounting. The substrate transport unit 12 is also configured to transport the received substrate P to a stopping position and to fix it at the stopping position using a substrate fixing mechanism (not shown), such as a clamping mechanism. The substrate transport unit 12 also includes a pair of conveyor units 121 and a transport motor 122 that drives the pair of conveyor units 121. The substrate transport unit 12 is configured to transport the substrate P in the X direction with both ends of the substrate P in the width direction (Y direction) supported from below (Z2 direction side) by the pair of conveyor units 121.

[0039] The head unit 13 is a head unit for component mounting. The head unit 13 mounts components E onto a circuit board P that is fixed in a stopping position. The head unit 13 includes a plurality (five) of mounting heads 131. The mounting heads 131 are configured to attract components E using negative pressure supplied from a negative pressure supply pump 15. The tip of each mounting head 131 is fitted with an attraction nozzle for attracting components E.

[0040] The head unit 13 includes a Z-axis motor 132 that moves the mounting head 131 in the Z direction, and an R-axis motor 133 that rotates the mounting head 131 around a rotation axis extending in the Z direction. The mounting head 131 is configured to move in the Z direction between a predetermined lowered position and a predetermined raised position by the Z-axis motor 132. Furthermore, the mounting head 131 is configured to adjust the orientation of the attached part E by rotating it with the R-axis motor 133 while holding the part E.

[0041] The head horizontal movement mechanism 14 is configured to move the head unit 13 horizontally (in the X and Y directions). The head horizontal movement mechanism 14 includes a support portion 141 that supports the head unit 13 so as to be movable in the X direction, and a rail portion 142 that supports the support portion 141 so as to be movable in the Y direction. The support portion 141 has a ball screw shaft 141a extending in the X direction and an X-axis motor 141b that rotates the ball screw shaft 141a. The head unit 13 is provided with a ball nut (not shown) that engages with the ball screw shaft 141a of the support portion 141. The head unit 13 is configured to move along the support portion 141 in the X direction when the ball screw shaft 141a is rotated by the X-axis motor 141b, together with the ball nut that engages with the ball screw shaft 141a.

[0042] The rail section 142 includes a pair of guide rails 142a that support the X-direction ends of the support section 141 so as to be movable in the Y-direction, a ball screw shaft 142b extending in the Y-direction, and a Y-axis motor 142c that rotates the ball screw shaft 142b. The support section 141 is provided with a ball nut (not shown) that engages with the ball screw shaft 142b of the rail section 142. The support section 141 is configured to be movable in the Y-direction along the pair of guide rails 142a of the rail section 142, together with the ball nut that engages with the ball screw shaft 142b, as the ball screw shaft 142b is rotated by the Y-axis motor 142c.

[0043] The head unit 13 is configured to move horizontally on the base 11 by the support portion 141 and rail portion 142 of the head horizontal movement mechanism 14. As a result, the mounting head 131 of the head unit 13 can move above the component supply unit 22 and pick up components E supplied from the component supply unit 22. Also, the mounting head 131 of the head unit 13 can move above the substrate P which is fixed in the stopping position and mount the picked-up components E onto the substrate P. The mounting head 131 of the head unit 13 repeats the cycle of picking up components E and mounting the picked-up components E onto the substrate P. In this way, the necessary components E are mounted on the substrate P.

[0044] The negative pressure supply pump 15 supplies negative pressure to the mounting head 131. The negative pressure supply pump 15 is a vacuum pump. The negative pressure supply pump 15 includes an electric motor that converts electricity into power. The negative pressure supply pump 15 generates negative pressure by driving the electric motor. The negative pressure supply pump 15 is also connected to the mounting head 131 via a negative pressure supply path. The negative pressure supply path extends from the negative pressure supply pump 15 to the tip of the mounting head 131 (the tip of the suction nozzle). A valve is also located in the negative pressure supply path to control the on / off switching of the negative pressure supply. Switching the opening and closing of the valve switches the negative pressure supply on and off. A filter is also located in the negative pressure supply path to restrict foreign matter that is sucked in by the negative pressure.

[0045] The inverter 16 is connected to the negative pressure supply pump 15 and controls the frequency of the power supplied to the negative pressure supply pump 15 under the control of the control unit 21. The negative pressure supply pump 15 is driven at a rotational speed corresponding to the frequency of the power supplied from the inverter 16. As the rotational speed of the negative pressure supply pump 15 increases, the negative pressure (suction force that attracts component E) supplied to the mounting head 131 increases. As the rotational speed of the negative pressure supply pump 15 decreases, the negative pressure (suction force that attracts component E) supplied to the mounting head 131 decreases.

[0046] As shown in Figure 4, the inverter 16 includes a converter circuit 161, a capacitor 162, and an inverter circuit 163. The converter circuit 161 is configured to convert AC power supplied from the commercial power supply 200 into pulsating DC power. The capacitor 162 is configured to smooth the pulsating DC power converted by the converter circuit 161. The inverter circuit 163 is configured, for example by pulse width modulation (PWM), to convert the DC power smoothed by the capacitor 162 into AC power of a predetermined frequency that is higher or lower than the frequency of the AC power supplied from the commercial power supply 200. The inverter 16 controls the frequency of the power supplied to the negative pressure supply pump 15 by the converter circuit 161, the capacitor 162, and the inverter circuit 163.

[0047] As shown in Figure 3, the negative pressure state detection unit 17 is located in the negative pressure supply path formed from the negative pressure supply pump 15 to the tip of the mounting head 131 (the tip of the suction nozzle). The negative pressure state detection unit 17 is a sensor that detects the negative pressure state in the negative pressure supply path. For example, the negative pressure state detection unit 17 may be a pressure sensor that detects pressure as a negative pressure state, or a flow rate sensor that detects flow rate as a negative pressure state.

[0048] As shown in Figures 2 and 3, the component imaging unit 18 is a camera for component recognition. The component imaging unit 18 images the component E that is attracted to the mounting head 131 while the component E is being transported to the substrate P by the mounting head 131 of the head unit 13. The component imaging unit 18 is fixed on the upper surface of the base 11 and images the component E that is attracted to the mounting head 131 from below (Z2 direction side). Based on the image of the component E captured by the component imaging unit 18, the control unit 21 acquires (recognizes) the holding state of the component E (rotational orientation and attraction position relative to the mounting head 131).

[0049] The substrate imaging unit 19 is a camera for substrate recognition. Before the mounting of components E onto the substrate P by the mounting head 131 of the head unit 13 begins, the substrate imaging unit 19 captures a position recognition mark (not shown) on the upper surface of the substrate P, which is fixed in the stop position, from above. The position recognition mark is a mark for recognizing the position of the substrate P. Based on the image of the position recognition mark captured by the substrate imaging unit 19, the control unit 21 acquires (recognizes) the precise position and orientation of the substrate P, which is fixed in the stop position. The substrate imaging unit 19 is also attached to the head unit 13. The substrate imaging unit 19 is configured to be movable horizontally together with the head unit 13.

[0050] The side imaging unit 20 is a camera for component recognition. The side imaging unit 20 images the component E from the side while the component E is being transported to the substrate P by the mounting head 131 of the head unit 13, after the component imaging unit 18 has captured an image of the component E that has been picked up by the mounting head 31. Based on the image of the component E captured by the side imaging unit 20, the control unit 21 acquires (recognizes) the state of the component E, such as the presence or absence of the component E, the thickness of the component E, and whether the component E is inverted. The side imaging unit 20 is attached to the head unit 13. The side imaging unit 20 is configured to be movable in the horizontal direction together with the head unit 13.

[0051] The control unit 21 is a control circuit that controls each part of the component mounting device 1d, and includes a memory in which a program is stored and a processor such as a CPU (Central Processing Unit) that executes the program stored in the memory. Based on the program stored in the memory, the control unit 21 controls the board transport unit 12, the component supply unit 22, the X-axis motor 141b and the Y-axis motor 142c, etc., so that the head unit 13 mounts components E onto the board P and produces the board P.

[0052] (Control of reduced rotational speed of negative pressure supply pump) In this embodiment, as shown in Figures 5 to 7, the control unit 21 of the component mounting device 1d controls the rotation speed of the negative pressure supply pump 15 based on the state of its own device. The control unit 2a of the server device 2 also controls the rotation speed of the negative pressure supply pump 15 based on the state of the component mounting device 1d. That is, the control unit 2a of the server device 2 controls the rotation speed of the negative pressure supply pump 15 by outputting a command to the component mounting device 1d based on the state of the component mounting device 1d. The control unit 21 of the component mounting device 1d may also control the rotation speed of the negative pressure supply pump 15 by determining the state of its own device independently of a command from the server device 2, or it may control the rotation speed of the negative pressure supply pump 15 by determining the state of its own device based on a command from the server device 2. Furthermore, the control unit 2a of the server device 2 may individually control multiple component mounting devices 1d according to the state of multiple component mounting devices 1d.

[0053] For example, as shown in Figure 5, the control unit 21 of the component mounting device 1d controls the rotation speed of the negative pressure supply pump 15 to decrease when it determines that the production of substrates P has stopped. The control unit 21 of the component mounting device 1d monitors the status of the device itself and determines that the production of substrates P has stopped if it is in a state such as abnormal stop, setup change, or waiting for processing by another device other than the component mounting device 1d (itself). The state in which the production of substrates P has stopped means that the supply of substrates P to the component mounting device 1d (itself) has stopped. An abnormal stop means that the production of substrates P in the component mounting device 1d (itself) has stopped due to an abnormality that occurred in the component mounting device 1d (itself) or another device other than the component mounting device 1d (itself). Setup change means stopping the production of substrates P (stopping the component mounting line 1) to perform various operations in order to change the type of substrates P. Furthermore, waiting for processing by other equipment besides component mounting equipment 1d (the device itself) means that production of substrate P in component mounting equipment 1d (the device itself) is stopped due to the time taken by processing (printing, component mounting, visual inspection, or reflow) performed by other equipment besides component mounting equipment 1d (the device itself).

[0054] Furthermore, if the control unit 21 of the component mounting device 1d determines that production of the substrate P has been stopped, it determines whether or not the mounting head 131 has picked up a component E. If the control unit 21 of the component mounting device 1d determines that the mounting head 131 has not picked up a component E, it controls the rotation speed of the negative pressure supply pump 15 to decrease. In this case, the control unit 21 of the component mounting device 1d controls the rotation speed of the negative pressure supply pump 15 to decrease to zero. That is, the control unit 21 of the component mounting device 1d controls the negative pressure supply pump 15 to turn off. Then, at the timing when the production of the substrate P is released (the timing when production of the substrate P is resumed), the control unit 21 of the component mounting device 1d controls the rotation speed of the reduced negative pressure supply pump 15 to return to the normal rotation speed. Furthermore, if the control unit 21 of the component mounting device 1d determines that the mounting head 131 has picked up a component E, it does not control the rotation speed of the negative pressure supply pump 15 to decrease.

[0055] Furthermore, for example, if the control unit 2a of the server device 2 determines that the production of the substrate P has stopped, it controls the rotation speed of the negative pressure supply pump 15 to decrease. Specifically, the control unit 2a of the server device 2 monitors the status of the upstream or downstream equipment of the target component mounting device 1d, and determines that the production of the substrate P has stopped if the equipment is in a state such as abnormal stop, changeover, or waiting for processing by equipment other than the target component mounting device 1d. Then, if the control unit 2a of the server device 2 determines that the production of the substrate P has stopped, it controls the rotation speed of the negative pressure supply pump 15 by outputting a command to the target component mounting device 1d. The control unit 21 of the target component mounting device 1d determines the status of its own equipment based on the command from the server device 2 and controls the rotation speed of the negative pressure supply pump 15 to decrease as described above. In this way, the server device 2 controls the rotation speed of the negative pressure supply pump 15 to decrease based on the status of the component mounting device 1d, which is determined by the status of the upstream or downstream equipment of the component mounting device 1d.

[0056] Furthermore, if the control unit 21 of the component mounting device 1d or the control unit 2a of the server device 2 determines that the production of the substrate P has been stopped, it may obtain (calculate) the expected downtime for stopping the production of the substrate P. In this case, the control unit 21 of the component mounting device 1d or the control unit 2a of the server device 2 may decide how much to reduce the rotational speed of the negative pressure supply pump 15 based on the expected downtime. For example, the control unit 21 of the component mounting device 1d or the control unit 2a of the server device 2 may determine the rotational speed of the negative pressure supply pump 15 to be reduced such that the longer the expected downtime, the lower the rotational speed of the negative pressure supply pump 15 becomes.

[0057] If control is not performed to reduce the rotational speed of the negative pressure supply pump 15, the negative pressure supply pump 15 will always be driven at a relatively high rotational speed that allows the mounting head 131 to pick up the component E, thus increasing the power consumption of the negative pressure supply pump 15. On the other hand, if control is performed to reduce the rotational speed of the negative pressure supply pump 15, the rotational speed of the negative pressure supply pump 15 can be reduced while the production of the substrate P is stopped, thereby reducing the power consumption of the negative pressure supply pump 15.

[0058] Furthermore, as shown in Figure 6, for example, the control unit 21 of the component mounting device 1d controls the rotation speed of the negative pressure supply pump 15 to decrease when it determines that it is the timing between the cycle in which the mounting head 131 picks up a component E and mounts the picked-up component E onto the substrate P. In other words, the control unit 21 of the component mounting device 1d controls the rotation speed of the negative pressure supply pump 15 to decrease when it determines that it is the timing between the mounting of a component E in one cycle and the picking up of a component E in the next cycle. In this case, the control unit 21 of the component mounting device 1d controls the rotation speed of the negative pressure supply pump 15 to decrease to a rotation speed greater than zero. That is, the control unit 21 of the component mounting device 1d controls the rotation speed of the negative pressure supply pump 15 to decrease without turning off the negative pressure supply pump 15. For example, the rotation speed of the negative pressure supply pump 15 is reduced to 1 / 2 or 1 / 3 of the normal rotation speed when the mounting head 131 picks up a component E. Then, the control unit 21 of the component mounting device 1d controls the reduced rotation speed of the negative pressure supply pump 15 back to its normal rotation speed at a predetermined time before the suction of component E for the next cycle begins.

[0059] Furthermore, the control unit 21 of the component mounting device 1d may determine whether or not to reduce the rotational speed of the negative pressure supply pump 15 by comparing the time between cycles with a predetermined time threshold. In this case, the control unit 21 of the component mounting device 1d will reduce the rotational speed of the negative pressure supply pump 15 if the time between cycles is greater than or equal to the predetermined time threshold, and will not reduce the rotational speed of the negative pressure supply pump 15 if the time between cycles is less than the predetermined time threshold. This makes it possible to avoid reducing the rotational speed of the negative pressure supply pump 15 when the time between cycles is relatively short and there is not enough time to do so.

[0060] If no control is performed to reduce the rotational speed of the negative pressure supply pump 15, the negative pressure supply pump 15 will always be driven at a relatively high rotational speed that allows the mounting head 131 to attract component E, thus increasing the power consumption of the negative pressure supply pump 15. On the other hand, if control is performed to reduce the rotational speed of the negative pressure supply pump 15, the rotational speed of the negative pressure supply pump 15 can be reduced during the cycle, thus reducing the power consumption of the negative pressure supply pump 15.

[0061] Furthermore, as shown in Figure 6, for example, the control unit 21 of the component mounting device 1d controls the reduction of the rotational speed of the negative pressure supply pump 15 when it determines that it is in a warm-up operation. For example, the control unit 21 of the component mounting device 1d controls the reduction of the rotational speed of the negative pressure supply pump 15 at a timing from the start of production of the substrate P until a predetermined time before the start of the adsorption of components E in the first cycle. In the case of a warm-up operation, the control unit 21 of the component mounting device 1d controls the reduction of the rotational speed of the negative pressure supply pump 15 so that it is greater than zero. That is, the control unit 21 of the component mounting device 1d controls the reduction of the rotational speed of the negative pressure supply pump 15 without turning off the negative pressure supply pump 15. For example, the rotational speed of the negative pressure supply pump 15 is reduced to 1 / 2 or 1 / 3 of the normal rotational speed when components E are adsorbed by the mounting head 131. Then, the control unit 21 of the component mounting device 1d controls the reduced rotation speed of the negative pressure supply pump 15 back to its normal rotation speed at a predetermined time before the suction of component E in the first cycle begins.

[0062] If control is not performed to reduce the rotational speed of the negative pressure supply pump 15, the negative pressure supply pump 15 will always be driven at a relatively high rotational speed that allows the mounting head 131 to attract component E, thus increasing the power consumption of the negative pressure supply pump 15. On the other hand, if control is performed to reduce the rotational speed of the negative pressure supply pump 15, the rotational speed of the negative pressure supply pump 15 can be reduced during warm-up, thereby reducing the power consumption of the negative pressure supply pump 15.

[0063] Furthermore, if the control unit 21 of the component mounting device 1d determines that it is near the end of production for the substrate P, it controls the rotation speed of the negative pressure supply pump 15 to decrease. For example, the control unit 21 of the component mounting device 1d controls the rotation speed of the negative pressure supply pump 15 to decrease from the time of mounting of the last cycle of component E until the end of production for the substrate P. If it is near the end of production, the control unit 21 of the component mounting device 1d controls the rotation speed of the negative pressure supply pump 15 to decrease to a rotation speed greater than zero. That is, the control unit 21 of the component mounting device 1d controls the rotation speed of the negative pressure supply pump 15 to decrease without turning off the negative pressure supply pump 15. For example, the rotation speed of the negative pressure supply pump 15 is reduced to 1 / 2 or 1 / 3 of the normal rotation speed when the mounting head 131 picks up component E. Then, at the time of the end of production for the substrate P, the control unit 21 of the component mounting device 1d controls the rotation speed of the reduced negative pressure supply pump 15 to decrease further to zero. In other words, the control unit 21 of the component mounting device 1d performs control to turn off the negative pressure supply pump 15.

[0064] If no control is performed to reduce the rotational speed of the negative pressure supply pump 15, the negative pressure supply pump 15 will always be driven at a relatively high rotational speed that allows the mounting head 131 to attract the component E, thus increasing the power consumption of the negative pressure supply pump 15. On the other hand, if control is performed to reduce the rotational speed of the negative pressure supply pump 15, the rotational speed of the negative pressure supply pump 15 can be reduced at the timing before the end of production of the substrate P, thereby reducing the power consumption of the negative pressure supply pump 15.

[0065] Furthermore, as shown in Figure 7, for example, the control unit 21 of the component mounting device 1d controls the reduction of the rotation speed of the negative pressure supply pump 15 when it determines that the timing set by the operator has arrived. For example, when the operator leaves the component mounting device 1d to stop board production in order to determine the cause of an abnormality, the operator can set an energy-saving mode using the server device 2 to control the reduction of the rotation speed of the negative pressure supply pump at any timing at which the operator deems it appropriate to suppress the rotation speed of the negative pressure supply pump. Specifically, the operator displays a screen for setting the energy-saving mode on the display unit 2b of the server device 2 and performs the operation to set the energy-saving mode using the operation unit 2c. At this time, the operator sets the rotation speed level to reduce the rotation speed of the negative pressure supply pump 15 (off level, 1 / 2 level, 1 / 3 level, etc.) and the control time for controlling the reduction of the rotation speed of the negative pressure supply pump 15 (1 hour, 2 hours, etc.). The rotation speed level may be set to a specific level selected by the operator from a plurality of pre-registered candidate levels, or it may be set to a specific level arbitrarily entered by the operator. Furthermore, the control time may be set to a specific time selected by the operator from a pre-registered list of candidate times, or it may be set to a specific time arbitrarily entered by the operator. Alternatively, instead of setting a specific time, the control may start when the operator performs a control start operation and end when the operator performs a control end operation.

[0066] The control unit 2a of the server device 2 controls the reduction of the rotational speed of the negative pressure supply pump 15 based on the state of the component mounting device 1d, which is determined to be at a timing set by the operator. Specifically, when the operator sets an energy-saving mode that reduces the rotational speed of the negative pressure supply pump 15, the control unit 2a of the server device 2 outputs a command to the target component mounting device 1d to reduce the rotational speed of the negative pressure supply pump 15. The control unit 21 of the target component mounting device 1d determines the state of its own device based on the command from the server device 2 and controls the reduction of the rotational speed of the negative pressure supply pump 15 based on the energy-saving mode setting (rotational speed level, control time, etc.). The control unit 21 of the target component mounting device 1d also controls the reduction of the rotational speed of the negative pressure supply pump 15 based on the energy-saving mode setting to return it to the normal rotational speed.

[0067] If no control is performed to reduce the rotational speed of the negative pressure supply pump 15, the negative pressure supply pump 15 will always be driven at a relatively high rotational speed that allows the mounting head 131 to attract component E, thus increasing the power consumption of the negative pressure supply pump 15. On the other hand, if control is performed to reduce the rotational speed of the negative pressure supply pump 15, the rotational speed of the negative pressure supply pump 15 can be reduced at the timing set by the operator, thereby reducing the power consumption of the negative pressure supply pump 15.

[0068] As described above, the control unit 21 of the component mounting device 1d controls the rotation speed of the negative pressure supply pump 15 to decrease when it determines that production of the substrate P has stopped, when it is determined to be between cycles, when it is determined to be in warm-up mode, and when it is determined to be at a timing set by the operator. In other words, the control unit 21 of the component mounting device 1d controls the rotation speed of the negative pressure supply pump 15 to decrease when it determines that the mounting head 131 is not picking up components E and not performing the operation of mounting the picked-up components E onto the substrate P. Similarly, the control unit 2a of the server device 2 controls the rotation speed of the negative pressure supply pump 15 to decrease when it determines that the mounting head 131 is not picking up components E and not performing the operation of mounting the picked-up components E onto the substrate P.

[0069] Furthermore, in this embodiment, when the control unit 21 of the component mounting device 1d controls the reduction of the rotational speed of the negative pressure supply pump 15 based on the state of the device, it controls the reduction of the rotational speed of the negative pressure supply pump 15 to multiple levels according to multiple states of the device. Specifically, when the control unit 21 of the component mounting device 1d determines that the state of the device is a first state (in the case of Figure 5 and Figure 7), it reduces the rotational speed of the negative pressure supply pump 15 to zero, and when the state of the device is determined to be a second state (in the case of Figure 6), it controls the reduction of the rotational speed of the negative pressure supply pump 15 to a rotational speed greater than zero.

[0070] Furthermore, in all cases where it is determined that production of substrate P has stopped, that it is during a cycle, that it is warming up, and that it is at a timing set by the operator, control may be performed to reduce the rotational speed of the negative pressure supply pump 15. Alternatively, control may be performed to reduce the rotational speed of the negative pressure supply pump 15 in one or more of these cases, rather than in all of these cases.

[0071] Furthermore, it may be possible to set an operating mode that controls the rotational speed of the negative pressure supply pump 15 in at least one of the following cases: when it is determined that production of the substrate P has stopped, when it is determined that it is during a cycle, and when it is determined that it is in a warm-up state. In this case, it is possible to switch between an operating mode that controls the rotational speed of the negative pressure supply pump 15 and an operating mode (normal mode) that does not control the rotational speed of the negative pressure supply pump 15. The control unit 21 of the component mounting device 1d controls the rotational speed of the negative pressure supply pump 15 based on the operating mode of its own device. Also, the control unit 2a of the server device 2 controls the rotational speed of the negative pressure supply pump 15 based on the operating mode of the component mounting device 1d.

[0072] (Control of increasing the rotational speed of the negative pressure supply pump) Furthermore, in this embodiment, the control unit 21 of the component mounting device 1d performs control to increase the rotational speed of the negative pressure supply pump 15 in predetermined cases.

[0073] For example, as shown in Figure 8, the control unit 21 of the component mounting device 1d increases the rotation speed of the negative pressure supply pump 15 when it determines that the suction state of component E by the mounting head 131 is unstable. For example, if the control unit 21 of the component mounting device 1d determines that the suction state of component E by the mounting head 131 is unstable when multiple consecutive suction errors of component E occur, it increases the rotation speed of the negative pressure supply pump 15. Also, for example, if the control unit 21 of the component mounting device 1d determines that the suction state of component E by the mounting head 131 is unstable when multiple misalignments of component E on the substrate P occur during inspection of the substrate P by the visual inspection device 1e, it increases the rotation speed of the negative pressure supply pump 15. Figure 8 shows the case where multiple consecutive suction errors of component E occur by the mounting head 131.

[0074] Furthermore, for example, if the control unit 21 of the component mounting device 1d detects, based on the recognition results of the component E using the component imaging unit 18 and the recognition results of the component E using the side imaging unit 20, that the suction posture of the component E has deteriorated due to the inertia of the mounting head 131 during movement (the positional deviation in the X direction, the positional deviation in the Y direction, or the angular deviation exceeds an allowable value), it determines that the suction state of the component E by the mounting head 131 is unstable and controls the rotation speed of the negative pressure supply pump 15 to increase.

[0075] The control unit 21 of the component mounting device 1d controls the rotation speed of the negative pressure supply pump 15 to a speed greater than the normal rotation speed. For example, the rotation speed of the negative pressure supply pump 15 is increased to a speed that is about 10% or 15% higher than the normal rotation speed when the mounting head 131 picks up the component E. Furthermore, if the control unit 21 of the component mounting device 1d determines that the unstable state of the component E being picked up by the mounting head 131 has not improved despite the control to increase the rotation speed of the negative pressure supply pump 15, it controls the operator to notify them of information prompting them to replace or clean the suction nozzle of the mounting head 131.

[0076] If it is determined that the unstable state of component E being held by the mounting head 131 does not improve, the control may be performed to further increase the rotation speed of the negative pressure supply pump 15. In this case, if it is determined that the unstable state of component E being held by the mounting head 131 does not improve even after repeating the control to increase the rotation speed of the negative pressure supply pump 15 several times, the control unit 21 of the component mounting apparatus 1d will perform control to notify the operator of information prompting them to replace or clean the suction nozzle of the mounting head 131.

[0077] Furthermore, as shown in Figure 9, for example, the control unit 21 of the component mounting device 1d increases the rotation speed of the negative pressure supply pump 15 when it determines that it is time to maintain the filter located in the negative pressure supply path. For example, the control unit 21 of the component mounting device 1d increases the rotation speed of the negative pressure supply pump 15 when it determines that it is time to maintain the filter based on information regarding the deterioration of the filter (information on the number of times the mounting head 131 has attracted component E, the detection result of the negative pressure state detection unit 17, etc.).

[0078] Furthermore, for example, if the control unit 21 of the component mounting device 1d determines that it is time for filter maintenance, it will increase the rotational speed of the negative pressure supply pump 15 if set by the operator. For example, if it is time for filter maintenance but there is a shortage of operators due to night shifts or other reasons, the operator will use the server device 2 to set an operating mode that increases the rotational speed of the negative pressure supply pump 15. Specifically, the operator will display a screen for setting the operating mode on the display unit 2b of the server device 2 and perform the operation to set the operating mode using the operation unit 2c. When the operator sets an operating mode that increases the rotational speed of the negative pressure supply pump 15, the control unit 2a of the server device 2 will output a command to the target component mounting device 1d to increase the rotational speed of the negative pressure supply pump 15.

[0079] The control unit 21 of the component mounting device 1d controls the rotation speed of the negative pressure supply pump 15 to be higher than the normal rotation speed. For example, the rotation speed of the negative pressure supply pump 15 is increased to a speed that is about 10% or 15% higher than the normal rotation speed when the mounting head 131 picks up the component E.

[0080] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0081] In this embodiment, as described above, the rotational speed of the negative pressure supply pump 15 can be reduced based on the state of the component mounting device 1d. Therefore, compared to the case where the negative pressure supply pump 15 is always driven at a relatively high rotational speed that allows the mounting head 131 to pick up components E during the production of the substrate P, the power consumption of the negative pressure supply pump 15 can be reduced. Reducing the power consumption of the negative pressure supply pump 15, which has a relatively high power consumption in the component mounting device 1d, is highly effective.

[0082] Furthermore, in this embodiment, as described above, if the control unit 21 determines that the mounting head 131 is not picking up a component E and is not mounting the picked-up component E onto the substrate P, it controls the rotation speed of the negative pressure supply pump 15 to decrease. With this configuration, when it is not necessary to drive the negative pressure supply pump 15 at a relatively high rotation speed to pick up the component E with the mounting head 131, the rotation speed of the negative pressure supply pump 15 can be reduced, thereby effectively reducing the power consumption of the negative pressure supply pump 15.

[0083] Furthermore, in this embodiment, as described above, the control unit 21 controls the rotation speed of the negative pressure supply pump 15 to decrease when it determines that the timing set by the operator has arrived. With this configuration, the rotation speed of the negative pressure supply pump 15 can be reduced at any timing at which the operator deems it appropriate to suppress the rotation speed of the negative pressure supply pump 15, such as when production of the substrate P is stopped and the operator leaves the component mounting device 1d, thereby effectively reducing the power consumption of the negative pressure supply pump 15.

[0084] Furthermore, in this embodiment, as described above, when the control unit 21 determines that the production of the substrate P has stopped, it controls the rotation speed of the negative pressure supply pump 15 to decrease. With this configuration, if the production of the substrate P is stopped due to, for example, an abnormal stop, a changeover, or waiting for processing by another device other than the component mounting device 1d, the rotation speed of the negative pressure supply pump 15 can be reduced by taking advantage of the fact that it is not necessary to drive the negative pressure supply pump 15 at a relatively high rotation speed in order to attract the components E with the mounting head 131. As a result, the power consumption of the negative pressure supply pump 15 can be effectively reduced.

[0085] Furthermore, in this embodiment, as described above, the mounting head 131 repeatedly performs a cycle of picking up components E and mounting the picked-up components E onto the substrate P. When the control unit 21 determines that it is between cycles, it controls the rotation speed of the negative pressure supply pump 15 to decrease. With this configuration, since the mounting head 131 is not picking up components E during the timing between cycles, it is not necessary to drive the negative pressure supply pump 15 at a relatively high rotation speed to pick up components E, and thus the rotation speed of the negative pressure supply pump 15 can be reduced. As a result, the power consumption of the negative pressure supply pump 15 can be effectively reduced.

[0086] Furthermore, in this embodiment, as described above, the control unit 21 controls the rotation speed of the negative pressure supply pump 15 to decrease when it determines that the system is in a warm-up state. With this configuration, the rotation speed of the negative pressure supply pump 15 can be reduced by taking advantage of the fact that, during a warm-up state, it is not necessary to drive the negative pressure supply pump 15 at a relatively high rotation speed in order to attract the component E with the mounting head 131. As a result, the power consumption of the negative pressure supply pump 15 can be effectively reduced.

[0087] Furthermore, in this embodiment, as described above, when the control unit 21 controls the reduction of the rotational speed of the negative pressure supply pump 15 based on the state of the device, it controls the reduction of the rotational speed of the negative pressure supply pump 15 to multiple levels according to the multiple states of the device. With this configuration, it is possible to reduce the power consumption of the negative pressure supply pump 15 while appropriately adjusting the level to which the rotational speed of the negative pressure supply pump 15 is reduced according to the multiple states of the device.

[0088] Furthermore, in this embodiment, as described above, when the control unit 21 determines that the state of the device is in the first state, it reduces the rotational speed of the negative pressure supply pump 15 to zero, and when the state of the device is determined to be in the second state, it controls the rotational speed of the negative pressure supply pump 15 to a rotational speed greater than zero. With this configuration, for example, when the state of the device is such that the time until the next time the mounting head 131 picks up a component E is relatively long (i.e., there is a relatively large amount of time before the negative pressure supply pump 15 is driven at a relatively high rotational speed), reducing the rotational speed of the negative pressure supply pump 15 to zero enhances the effect of reducing the power consumption of the negative pressure supply pump 15. Furthermore, for example, if the state of the device is such that the time until the next component E is picked up by the mounting head 131 is relatively short (i.e., there is relatively little time before the negative pressure supply pump 15 is driven at a relatively high rotational speed), the power consumption of the negative pressure supply pump 15 can be reduced by decreasing the rotational speed of the negative pressure supply pump 15 to a rotational speed greater than zero, while still being prepared to drive the negative pressure supply pump 15 at a relatively high rotational speed.

[0089] Furthermore, in this embodiment, as described above, if the control unit 21 determines that the suction state of the component E by the mounting head 131 is unstable, it controls the rotation speed of the negative pressure supply pump 15 to increase. With this configuration, by increasing the rotation speed of the negative pressure supply pump 15, the suction force of the component E by the mounting head 131 can be increased, thereby stabilizing the suction state of the component E by the mounting head 131.

[0090] Furthermore, in this embodiment, as described above, when the control unit 21 determines that it is time to maintain the filter located in the negative pressure supply path, it controls the rotation speed of the negative pressure supply pump 15 to increase. With this configuration, increasing the rotation speed of the negative pressure supply pump 15 increases the suction force of the component E by the mounting head 131, thereby compensating for the decrease in suction force caused by filter clogging. As a result, the timing of filter maintenance can be delayed, and the number of times when production of the substrate P cannot be continued due to filter clogging can be reduced.

[0091] Furthermore, in this embodiment, as described above, a server device 2 is provided that controls the rotation speed of the negative pressure supply pump 15 to decrease based on the state of the component mounting device 1d. As a result, the rotation speed of the negative pressure supply pump 15 can be reduced based on the state of the component mounting device 1d, thereby reducing the power consumption of the negative pressure supply pump 15 compared to the case where the negative pressure supply pump 15 is always driven at a relatively high rotation speed that allows the mounting head 131 to pick up components E during the production of the substrate P.

[0092] Furthermore, in this embodiment, as described above, the server device 2 controls the rotation speed of the negative pressure supply pump 15 based on the state of the component mounting device 1d, which is determined by the state of the upstream or downstream device of the component mounting device 1d. With this configuration, for example, if the production of the substrate P is stopped due to an abnormal shutdown of the upstream or downstream device of the component mounting device 1d, the rotation speed of the negative pressure supply pump 15 can be reduced when it is not necessary to drive the negative pressure supply pump 15 at a relatively high rotation speed in order to attract the components E with the mounting head 131. This effectively reduces the power consumption of the negative pressure supply pump 15.

[0093] Furthermore, in this embodiment, as described above, the server device 2 controls the rotation speed of the negative pressure supply pump 15 based on the state of the component mounting device 1d, which is determined by the timing set by the operator. With this configuration, the rotation speed of the negative pressure supply pump 15 can be reduced at any timing at which the operator thinks it is acceptable to suppress the rotation speed of the negative pressure supply pump 15, such as when production of the substrate P is stopped and the operator leaves the component mounting device 1d, thereby effectively reducing the power consumption of the negative pressure supply pump 15.

[0094] (modified version) It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims rather than by the description of the embodiments above, and further includes all modifications (exceptions) within the meaning and scope equivalent to the claims.

[0095] For example, the above embodiment shows an example in which the control device of the present invention is configured by a server device, but the present invention is not limited thereto. The control device of the present invention may be configured by any of the multiple devices that constitute a component mounting line.

[0096] Furthermore, while the above embodiment shows an example in which the control unit controls the reduction of the rotational speed of the negative pressure supply pump by multiple levels according to multiple states of the device, the present invention is not limited to this. In the present invention, the control unit may control the reduction of the rotational speed of the negative pressure supply pump by the same level regardless of any of the multiple states of the device.

[0097] Furthermore, in the above embodiment, an example was shown in which the control unit controls the rotation speed of the negative pressure supply pump to be reduced to zero when substrate production is stopped, but the present invention is not limited to this. In the present invention, when substrate production is stopped, the control unit may control the rotation speed of the negative pressure supply pump to be reduced to a rotation speed greater than zero.

[0098] Furthermore, in the above embodiment, an example was shown in which the control unit controls the rotation speed of the negative pressure supply pump to be greater than zero when it is between cycles or during warm-up operation, but the present invention is not limited to this. In the present invention, the control unit may control the rotation speed of the negative pressure supply pump to be reduced to zero when it is between cycles or during warm-up operation.

[0099] Furthermore, in the above embodiment, an example was shown in which the control unit increases the rotation speed of the negative pressure supply pump when it determines that the component suction state by the mounting head is unstable, but the present invention is not limited to this. In the present invention, the control unit does not need to increase the rotation speed of the negative pressure supply pump when it determines that the component suction state by the mounting head is unstable.

[0100] Furthermore, in the above embodiment, an example was shown in which the control unit increases the rotational speed of the negative pressure supply pump when it determines that it is time to maintain the filter located in the negative pressure supply path, but the present invention is not limited to this. In the present invention, the control unit does not have to increase the rotational speed of the negative pressure supply pump when it determines that it is time to maintain the filter located in the negative pressure supply path. [Explanation of Symbols]

[0101] 1d Component mounting device 2. Server device (control device) 15. Negative pressure supply pump 21 Control Unit 131 Mounting Head 100-component mounting system E parts P board

Claims

1. A mounting head that uses negative pressure to attract components to be mounted on a circuit board, A negative pressure supply pump that supplies negative pressure to the mounting head, A component mounting apparatus comprising: a control unit that controls the rotation speed of the negative pressure supply pump to decrease based on the state of the apparatus; and

2. The component mounting apparatus according to claim 1, wherein the control unit determines that it is not performing the operation of picking up the component with the mounting head and mounting the picked-up component onto the substrate, and performs control to reduce the rotation speed of the negative pressure supply pump.

3. The component mounting apparatus according to claim 1, wherein the control unit performs control to reduce the rotational speed of the negative pressure supply pump when it is determined that the timing set by the operator has been reached.

4. The component mounting apparatus according to claim 1, wherein the control unit determines that the production of the substrate has been stopped and performs control to reduce the rotation speed of the negative pressure supply pump.

5. The mounting head repeatedly performs a cycle of picking up the component and mounting the picked-up component onto the substrate. The component mounting apparatus according to claim 1, wherein the control unit performs control to reduce the rotational speed of the negative pressure supply pump when it is determined that the timing is between cycles.

6. The component mounting apparatus according to claim 1, wherein the control unit performs control to reduce the rotational speed of the negative pressure supply pump when it determines that the device is in a warm-up state.

7. The component mounting apparatus according to claim 1, wherein when the control unit performs control to reduce the rotational speed of the negative pressure supply pump based on the state of the apparatus, it performs control to reduce the rotational speed of the negative pressure supply pump at multiple levels according to multiple states of the apparatus.

8. The component mounting apparatus according to claim 7, wherein the control unit controls the reduction of the rotational speed of the negative pressure supply pump to zero when it determines that the state of the apparatus is in a first state, and controls the reduction of the rotational speed of the negative pressure supply pump to a rotational speed greater than zero when it determines that the state of the apparatus is in a second state.

9. The component mounting apparatus according to claim 1, wherein the control unit controls the rotation speed of the negative pressure supply pump when it determines that the suction state of the component by the mounting head is unstable.

10. The component mounting apparatus according to claim 1, wherein the control unit controls the rotation speed of the negative pressure supply pump to increase when it determines that it is time to perform maintenance on the filter located in the negative pressure supply path.

11. A component mounting apparatus including a mounting head that attracts components to be mounted on a substrate using negative pressure, and a negative pressure supply pump that supplies negative pressure to the mounting head, A component mounting system comprising: a control device that controls the rotation speed of the negative pressure supply pump based on the state of the component mounting device; and

12. The component mounting system according to claim 11, wherein the control device controls the reduction of the rotational speed of the negative pressure supply pump based on the state of the component mounting device, which is determined by the state of the upstream or downstream device of the component mounting device.

13. The component mounting system according to claim 11, wherein the control device controls the reduction of the rotational speed of the negative pressure supply pump based on the state of the component mounting device, which is based on a timing set by the operator.

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