Light-emitting device

Abstract

To provide a light-emitting device that can improve the heat dissipation of the package. [Solution] The light-emitting device comprises a first light-emitting element, a second light-emitting element, a plurality of upper submounts, and a lower submount. The plurality of upper submounts include a first submount having a first upper surface and a first side surface intersecting the first upper surface and located on the side of the emission end face of the first light-emitting element, and a second submount having a second upper surface and a second side surface intersecting the second upper surface and located on the side of the emission end face of the second light-emitting element. The lower submount has an upper surface on which the first and second submounts are arranged, and a front side surface located on the same side as the first and second side surfaces and intersecting the upper surface. In a top view, the first side surface is located in front of the second side surface, and the emission end face of the first light-emitting element is located in front of the emission end face of the second light-emitting element. At least a portion of the first side surface protrudes forward beyond the edge where the upper surface and front side surface of the lower submount intersect.

Description

Technical Field

[0001] The present disclosure relates to a light-emitting device.

Background Art

[0002] Conventionally, a light-emitting device including a light-emitting element and a mirror having a reflecting surface that reflects light emitted laterally from the light-emitting element upward is known. Patent Document 1 discloses a semiconductor laser light source device including a plurality of semiconductor laser elements, a plurality of submounts for fixing the plurality of semiconductor laser elements respectively, a mirror that reflects light emitted laterally from the plurality of semiconductor laser elements upward, and a heat sink on which the plurality of submounts and the mirror are disposed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] To provide a light-emitting device capable of improving the heat dissipation of a package.

Means for Solving the Problems

[0005] A light-emitting device according to one aspect of the present disclosure, in an exemplary and non-limiting embodiment, comprises: a first light-emitting element having a first exit end face, each including one or more first light-emitting points that emit first light; a second light-emitting element having a second exit end face, each including one or more second light-emitting points that emit second light; a plurality of upper submounts; and a lower submount. The plurality of upper submounts include: a first submount having a first upper surface on which the first light-emitting elements are arranged, and a first side surface intersecting the first upper surface and located on the side of the first exit end face of the first light-emitting element; a second submount having a second upper surface on which the second light-emitting elements are arranged, and a second side surface intersecting the second upper surface and located on the side of the second exit end face of the second light-emitting element. The lower submount has an upper surface on which the first and second submounts are arranged, and a front side surface located on the same side as the first side of the first submount and the second side of the second submount, and intersecting the upper surface. In a top view of the lower submount as seen from the direction normal to the upper surface, when the direction in which light on the optical axis of the first light travels is forward, the first side surface of the first submount is located forward of the second side surface of the second submount, the first emission end surface of the first light-emitting element is located forward of the second emission end surface of the second light-emitting element, and at least a portion of the first side surface of the first submount protrudes forward of the edge where the upper surface and the front side surface of the lower submount intersect.

[0006] A light-emitting device according to another aspect of the present disclosure, in an exemplary and non-limiting embodiment, comprises: a first light-emitting element having a first exit end face, each including one or more first light-emitting points that emit first light; a second light-emitting element having a second exit end face, each including one or more second light-emitting points that emit second light; a first submount having a first upper surface on which the first light-emitting element is disposed, and a first side surface intersecting the first upper surface and located on the side of the first exit end face of the first light-emitting element; a second submount having a second upper surface on which the second light-emitting element is disposed, and a second side surface intersecting the second upper surface and located on the side of the second exit end face of the second light-emitting element; a base having a mounting surface; a side wall portion surrounding the periphery of the mounting surface and extending upward; and the The package comprises a base portion having an upper surface located above the mounting surface, wherein the first submount and the second submount are arranged on the upper surface, and the base portion further has a front surface located on the same side as the first side and the second side and intersecting the upper surface, and in a top view taken from the direction normal to the upper surface, when the direction in which light on the optical axis of the first light travels is forward, the first side of the first submount is located in front of the second side of the second submount, the first emission end face of the first light-emitting element is located in front of the second emission end face of the second light-emitting element, and at least a portion of the first side of the first submount protrudes forward from the edge where the upper surface and the front surface of the base portion intersect. [Effects of the Invention]

[0007] According to embodiments of this disclosure, a light-emitting device with high heat dissipation can be provided. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view of the light-emitting device according to the first to third embodiments. [Figure 2] Figure 2 is a perspective view of the light-emitting device according to the first embodiment, with the package lid removed. [Figure 3] Figure 3 is a top view of the light-emitting device according to the first embodiment, with the package lid removed. [Figure 4] Figure 4 is a top view illustrating an example of internal wiring within the package. [Figure 5] Figure 5 is a cross-sectional view along the VV section line in Figure 3. [Figure 6] Figure 6 is a cross-sectional view taken along the VI-VI section in Figure 3. [Figure 7] Figure 7 is a cross-sectional view taken along the VII-VII line in Figure 3. [Figure 8] Figure 8 is a schematic diagram illustrating the far-field pattern formed on a plane parallel to the output end face by light emitted from a multi-emitter light-emitting element. [Figure 9A] Figure 9A is a top view illustrating the shape of the lower submount. [Figure 9B] Figure 9B is a top view illustrating another shape of the lower submount. [Figure 10A] Figure 10A is a top view of a submount with multiple light-emitting elements mounted on it. [Figure 10B] Figure 10B is a magnified top view of the vicinity of the light-emitting points of multiple light-emitting elements mounted on a submount. [Figure 11A] Figure 11A is a plan view illustrating the shape of a submount with multiple light-emitting elements mounted on it, as viewed from the positive Z-axis direction. [Figure 11B] Figure 11B is a plan view illustrating another shape of a submount with multiple light-emitting elements mounted on it, as viewed from the positive Z-axis direction. [Figure 12] Figure 12 is a perspective view of the photodetector. [Figure 13] Figure 13 is a top view of another structural example of the light-emitting device according to the first embodiment, with the package lid removed. [Figure 14] Figure 14 is an enlarged view of part X in the top view of Figure 13. [Figure 15] Figure 15 is a cross-sectional view taken along the XV-XV section in Figure 13. [Figure 16] Figure 16 is a perspective view of the light-emitting device according to the second embodiment, with the package lid removed. [Figure 17] Fig. 17 is a top view of the light-emitting device according to the second embodiment with the lid of the package removed. [Figure 18] Fig. 18 is a cross-sectional view taken along the XVIII-XVIII cross-section line of Fig. 17. [Figure 19] Fig. 19 is an exploded perspective view of the members according to the second embodiment. [Figure 20] Fig. 20 is a top view of the light-emitting device according to the third embodiment with the lid of the package removed. [Figure 21] Fig. 21 is a cross-sectional view taken along the XXI-XXI cross-section line of Fig. 20. [Figure 22] Fig. 22 is a plan view of the light-emitting device according to the fourth embodiment as viewed from the negative direction of the Z-axis.

Embodiments for Carrying Out the Invention

[0009] In this specification or the claims, polygons such as triangles and quadrilaterals are not limited to polygons with a mathematically strict meaning, but also include shapes with rounded corners, chamfers, corner cuts, round cuts, etc. applied to the corners of the polygon. Also, not only the corners (ends of the sides) of the polygon, but also shapes with processing applied to the middle part of the side shall be similarly called polygons. That is, shapes with partial processing while leaving the polygon as a base are included in the "polygons" described in this specification and the claims.

[0010] The same applies not only to polygons, but also to words representing specific shapes such as trapezoids, circles, and concavities and convexities. The same also applies when dealing with each side forming the shape. That is, even if a side has processing applied to its corner or middle part, the "side" includes the processed part. When distinguishing a "polygon" or "side" without partial processing from the processed shape, "strict" shall be added, for example, described as "strict quadrilateral", etc.

[0011] In this specification or in the claims, when there are multiple elements identified by a certain name, and each element is to be expressed in a distinct manner, an ordinal number such as "first" or "second" may be added to the beginning of each element. For example, if the claim states that "a light-emitting element is arranged on a substrate," the specification may state that "a first light-emitting element and a second light-emitting element are arranged on a substrate." The ordinal numbers "1st" and "2nd" are simply used to distinguish between two light-emitting elements. The order of these ordinal numbers has no special meaning. Element names with the same ordinal number may not refer to the same element in the specification and the claims. For example, if elements are described in the specification as "1st light-emitting element," "2nd light-emitting element," and "3rd light-emitting element," then "1st light-emitting element" and "2nd light-emitting element" in the claims may correspond to "1st light-emitting element" and "3rd light-emitting element" in the specification. Also, if the term "1st light-emitting element" is used in claim 1 of the claims, but the term "2nd light-emitting element" is not, the invention according to claim 1 only needs to have one light-emitting element, and that light-emitting element is not limited to "1st light-emitting element" in the specification, but could be "2nd light-emitting element" or "3rd light-emitting element."

[0012] In this specification or in the claims, terms indicating specific directions or positions (e.g., “up,” “down,” “right,” “left,” “front,” “back,” and other terms including these terms) may be used. These terms are used solely for the purpose of clarifying the relative directions or positions in the referenced drawings. If the relative directional or positional relationships expressed by terms such as “up,” “down,” etc., in the referenced drawings are the same, then drawings other than those disclosed, actual products, manufacturing equipment, etc., do not need to be arranged in the same way as in the referenced drawings.

[0013] The dimensions, dimensional ratios, shapes, and spacing of elements or components shown in the drawings may be exaggerated for clarity. Furthermore, some elements may be omitted from the drawings to avoid excessive complexity.

[0014] Embodiments of the present invention will be described below with reference to the drawings. While these embodiments embody the technical concept of the present invention, they do not limit it. The numerical values, shapes, materials, steps, and the order of those steps shown in the description of the embodiments are merely examples, and various modifications are possible as long as they do not create a technical inconsistency. In the following description, elements identified by the same name and reference numerals are identical or of the same type, and redundant explanations of these elements may be omitted.

[0015] <First Embodiment> The structure of the light-emitting device 100 according to this embodiment will be described with reference to Figures 1 to 12. Figures 1 to 12 are drawings illustrating an exemplary embodiment of the light-emitting device 100. For reference, mutually orthogonal X, Y, and Z axes are shown in the attached drawings.

[0016] Figure 1 is a perspective view of the light-emitting device 100. Figure 2 is a perspective view of the light-emitting device 100 with the lid 16 of the package 10 removed. Figure 3 is a top view of the light-emitting device 100 with the lid 16 of the package 10 removed. In Figure 3, the light-irradiated area formed in the light-receiving area 53 of the photodetector 50 is shown by a dashed line. Figure 4 is a top view illustrating an example of internal wiring in the package 10. Figure 5 is a cross-sectional view along the VV section in Figure 3. Figure 6 is a cross-sectional view along the VI-VI section in Figure 3. Figure 7 is a cross-sectional view along the VII-VII section in Figure 3. In Figures 5 to 7, the light emitted from the light-emitting element 20 is shown by a dashed line. Figure 8 is a schematic diagram illustrating the far-field pattern formed on a plane P parallel to the emission end face 20E by the light emitted from the light-emitting element 20 of the multi-emitter. Figure 9A is a top view illustrating the shape of the lower submount 32. Figure 9B is a top view illustrating another shape of the lower submount 32. Figure 10A is a top view of the lower submount 32 and multiple upper submounts 31 on which multiple light-emitting elements 20 are mounted. Figure 10B is a magnified top view of the vicinity of the light-emitting points of the multiple light-emitting elements 20 mounted on the multiple upper submounts 31. Figure 11A is a plan view illustrating the configuration of multiple upper submounts 31 and lower submounts 32 on which multiple light-emitting elements 20 are mounted, as viewed from the positive Z-axis direction. Figure 11B is a plan view illustrating another configuration of multiple upper submounts 31 and lower submounts 32 on which multiple light-emitting elements 20 are mounted, as viewed from the positive Z-axis direction. Figure 12 is a perspective view of the photodetector 50.

[0017] The light-emitting device 100 according to this embodiment comprises a package 10, a plurality of light-emitting elements 20, one or more submounts, and a member 90 including a support base 40 and a photodetector 50. The one or more submounts may include a plurality of upper submounts 31 and a lower submount 32. The light-emitting device 100 may further include one or more protective elements and / or temperature measuring elements. An example of a protective element is a constant voltage diode such as a Zener diode. An example of a temperature measuring element is a thermistor.

[0018] In the illustrated example of the light-emitting device 100, multiple light-emitting elements 20, multiple upper submounts 31, lower submounts 32, a support base 40, and a photodetector 50 are arranged in the space inside the package 10. Light emitted from the multiple light-emitting elements 20 in the positive Z-axis direction is reflected in the positive Y-axis direction, i.e., upward, by the light-receiving area 53 of the photodetector 50 fixed to the support base 40, and passes through the light-transmitting area of ​​the package 10 to be emitted to the outside from the light-extraction surface 17. At this time, the Z-axis is parallel to a line perpendicular to the emission end face of the light-emitting elements 20, and the Y-axis is parallel to a line perpendicular to the upper surface of the light-emitting elements 20.

[0019] First, let's explain each component.

[0020] (Package 10) Package 10 includes a base 11 having a mounting surface 11M on which other components are placed, a side wall portion 12 surrounding the mounting surface 11M, and a lid portion 16 fixed to the upper surface 10A of the side wall portion 12. Package 10 has a recess defined by the mounting surface 11M and the side wall portion 12. The recess is recessed from the top to the bottom of Package 10. Here, the surface that forms the bottom of the recess is called the bottom surface. The bottom surface can be the main part of the mounting surface 11M.

[0021] In a top view from the normal direction of the mounting surface 11M, that is, from the positive direction of the Y-axis, the outer shape of the package 10 is rectangular. Hereafter, unless otherwise specified, "top view" means a top view from the positive direction of the Y-axis, or a top view from the normal direction of the top surface 32A of the lower submount 32, which will be described later. The outer shape of the bottom surface of the package 10 is rectangular. The outer shape of the package 10 includes the outer shape of the bottom surface of the package 10. Note that none of these outer shapes are rectangular.

[0022] The base portion 11 is the part that constitutes the mounting surface 11M of the package 10. The base portion 11 includes the bottom surface and the lower surface of the package 10. The side wall portion 12 is the part that surrounds the mounting surface 11M of the package 10 and constitutes a side wall that extends upward from the mounting surface 11M. The side wall portion 12 includes one or more outer surfaces, one or more inner surfaces, and the upper surface 10A that intersects the outer surface and the inner surface of the package 10.

[0023] The package 10 may have one or more stepped portions 13. The stepped portions 13 are provided in recesses of the package 10. Here, the stepped portion 13 refers to the portion composed of the upper surface 13A and the inner surface 13B that intersects with the upper surface 13A and extends downward. In other words, the stepped portion 13 does not include the inner surface that intersects with the upper surface 13A and extends upward. The stepped portion 13 is part of the side wall portion 12 of the package 10. The stepped portion 13 is located below the upper surface 10A of the package 10. The stepped portion 13 has a stepped structure and may be formed along the side wall of the package 10. Furthermore, the stepped portion 13 may be formed along the entire circumference of the side wall surrounding the mounting surface 11M. Note that the stepped portion 13 does not have to be formed along the entire circumference.

[0024] In the illustrated example, the top surface 13A of the stepped portion 13 has regions of different widths. The width of the top surface 13A of the stepped portion 13 is, for example, the length in the direction perpendicular to the side wall when viewed from above, when the portion is formed along the side wall of the package 10. The stepped portion 13 has regions of different widths when viewed from above, and the wider portion is called the wide region, and the narrower portion is called the narrow region. In the illustrated example of the package 10, the stepped portion 13 is formed along the four sides of the rectangle when viewed from above, with the portion along three of the sides being the wide region and the portion along the remaining side being the narrow region. Note that the stepped portion 13 does not necessarily have a wide region and a narrow region on its top surface. In that case, when viewed from above, each portion along the four sides of the rectangle has the same width.

[0025] In the example shown in Figure 3 or Figure 4, one or more wiring areas 14 are provided on the upper surface 13A of the stepped portion 13. One or more wiring areas 14 are provided in the wider portion of the upper surface 13A. However, no wiring areas 14 are provided in the narrower portion of the upper surface 13A. Here, in Figure 3 or Figure 4, instead of assigning reference numerals to all of the multiple wiring areas, the same hatching is applied. In the illustrated example of the package 10, multiple wiring areas 14 are provided in the wider portion of the stepped portion 13. These wiring areas 14 pass through the interior of the package 10 and can be electrically connected to wiring areas provided on the lower surface of the package 10. Note that the wiring areas electrically connected to the wiring areas 14 are not limited to the lower surface of the package 10, but can be provided on other outer surfaces (upper surface or outer side surface) of the package 10.

[0026] The base 11 and sidewall 12 of the package 10 can be formed using, for example, ceramic as the main material. Examples of ceramics include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide.

[0027] Package 10 may have a structure in which the base portion 11 and the side wall portion 12 are formed integrally. For example, it is possible to manufacture a component in which the base portion 11 and the side wall portion 12 are integrated using processing techniques such as molding or etching. Alternatively, package 10 may be manufactured by joining a base portion 11 and a side wall portion 12 that are separately formed from different materials as main materials. In this case, for example, the base portion 11 may be formed with metal as the main material, and the side wall portion 12 may be formed with ceramic as the main material. In this case, it is preferable that the base portion 11 contains a material with better heat dissipation properties (a material with high thermal conductivity) than the ceramic used as the main material for the side wall portion 12. Examples of such materials may include copper, aluminum, iron, copper molybdenum, copper tungsten, and copper-diamond composite materials.

[0028] The lid portion 16 has a bottom surface and an top surface, and is a rectangular parallelepiped flat plate-shaped member. However, the lid portion 16 does not have to be a rectangular parallelepiped. The lid portion 16 is fixed to the upper surface 10A of the side wall portion 12 above the base portion 11.

[0029] The lid portion 16 has a light extraction surface 17 that includes a light-transmitting region. The lid portion 16 may also have a non-light-transmitting region in part. The light extraction surface 17 is included in the upper surface of the lid portion 16. Note that "light-transmitting" means that the transmittance of the main light incident thereon is 80% or more.

[0030] The lid 16 can be formed from, for example, sapphire. Sapphire is a translucent material with a relatively high refractive index and relatively high strength. In addition to sapphire, the lid 16 can be formed from other translucent materials such as glass, plastic, or quartz.

[0031] Package 10 may have dimensions such as a height of 3 mm or less in the Y-axis direction, and, when viewed from above, the length of one side in the X and Z axes of the rectangular outer shape is 10 mm or less, respectively. Alternatively, package 10 may have dimensions such as a height of 2 mm or less, and, when viewed from above, the length of one side of the rectangular outer shape is 7 mm or less.

[0032] (Light-emitting element 20) An example of the light-emitting element 20 is a semiconductor laser element (or laser diode). The light-emitting element 20 may have a rectangular shape when viewed from above. If the light-emitting element 20 is an end-emitting type semiconductor laser element, the side that intersects with one of the two shorter sides of this rectangle is the output end face 20E. The top and bottom surfaces of the light-emitting element 20 have a larger area than the output end face 20E. The light-emitting element 20 is not limited to an end-emitting type semiconductor laser element, but may also be a surface-emitting type semiconductor laser element such as a vertical-cavity surface-emitting laser (VCSEL), or a light-emitting diode (LED).

[0033] In this embodiment, the light-emitting element 20 has an emitting end face 20E which includes one or more light-emitting points, each of which emits light. In other words, the light-emitting element 20 has one or more light-emitting points. The light-emitting element 20 may be a single emitter having one light-emitting point, or a multi-emitter having two or more light-emitting points. The light-emitting element 20 may have two, three, four or more light-emitting points. In the example shown in Figure 8, a multi-emitter light-emitting element 20 having four light-emitting points is shown.

[0034] Here, let's add some explanation regarding the case where the light-emitting element 20 is an end-face emitting semiconductor laser element. The light (laser light) emitted from the exit end face 20E of the semiconductor laser element is divergent light with a broad spread. The laser light forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the exit end face 20E. FFP is the shape and light intensity distribution of the emitted light at a position away from the exit end face.

[0035] Light passing through the elliptical center of an FFP, in other words, light showing peak intensity in the FFP's light intensity distribution, is called light traveling along the optical axis. The optical path of light traveling along the optical axis is called the optical axis of that light. In the FFP's light intensity distribution, the peak intensity value is 1 / e 2 Light with the above intensity is called "primary part" light.

[0036] In the elliptical shape of the FFP of light emitted from the light-emitting element 20, which is a semiconductor laser element, the direction of the minor axis of the ellipse is called the slow axis direction, and the direction of the major axis is called the fast axis direction. Multiple layers, including the active layer, that constitute the semiconductor laser element can be stacked in the direction of the fast axis direction.

[0037] Based on the light intensity distribution of FFP, 1 / e of the light intensity distribution 2 The angle corresponding to this is defined as the angle of light divergence of the semiconductor laser element. The angle of light divergence in the fast axis direction is called the angle of light divergence in the fast axis direction, and the angle of light divergence in the slow axis direction is called the angle of light divergence in the slow axis direction.

[0038] As illustrated in Figure 8, the light L emitted from each of the four light-emitting points of the light-emitting element 20, which are arranged in the X-axis direction, spreads out and forms FFPs corresponding to each of the four light-emitting points in a plane P parallel to the emission end face 20E. Figure 8 illustrates the four FFPs 1 to 4 formed on the optical axis O of the light L and in plane P. The X-axis direction is the slow axis direction, and the Y-axis direction is the fast axis direction. The shape formed by the overlapping of FFPs 1 to 4 in plane P can approximate an ellipse. The closer the distance between two adjacent light-emitting points is, the closer the overall shape of the overlapping FFPs 1 to 4 can be to an ellipse. Here, the X-axis is parallel to the emission end face 20E of the light-emitting element 20 and also parallel to the upper surface of the light-emitting element 20.

[0039] When the light-emitting element 20 is a multi-emitter, multiple light-emitting points within a single light-emitting element 20 are arranged along a straight line on the emission end face 20E. For each of the light-emitting elements 20A to 20C illustrated in Figures 11A and 11B, the multiple light-emitting points within a single light-emitting element are all at the same height from the bottom surface of the light-emitting element and are arranged at the same intervals.

[0040] As the light-emitting element 20, for example, a semiconductor laser element that emits blue light, a semiconductor laser element that emits green light, or a semiconductor laser element that emits red light can be used. Alternatively, a semiconductor laser element that emits other types of light may be used.

[0041] Here, blue light is defined as light whose emission peak wavelength is in the range of 420 nm to 494 nm. Green light is defined as light whose emission peak wavelength is in the range of 495 nm to 570 nm. Red light is defined as light whose emission peak wavelength is in the range of 605 nm to 750 nm.

[0042] Examples of semiconductor laser elements that emit blue light or green light include semiconductor laser elements containing nitride semiconductors. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN. Examples of semiconductor laser elements that emit red light include those containing InAlGaP, GaInP, GaAs, and AlGaAs semiconductors.

[0043] (Upper sub-mount 31 and lower sub-mount 32) The light-emitting device 100 in this embodiment has one or more upper submounts 31 and lower submounts 32. The shape of each of the upper submounts 31 and lower submounts 32 is, for example, a hexahedron. In the illustrated example, the upper submount 31 has the shape of a rectangular parallelepiped.

[0044] As illustrated in Figure 11A or Figure 11B, the upper submount 31 has an upper surface 35 on which other components may be placed, and a lower surface 34 located opposite the upper surface 35. Similarly, the lower submount 32 has an upper surface 32A on which multiple upper submounts 31 may be placed, and a lower surface 32B located opposite the upper surface 32A. The upper surfaces 35, 32A, lower surfaces 34, and 32B can each function as joining surfaces.

[0045] In the upper submount 31, the distance between the upper surface 35 and the lower surface 34, that is, the thickness of the submount in the Y-axis direction, is shorter than the distance between the other two opposing surfaces. Similarly, in the lower submount 32, the distance between the upper surface 32A and the lower surface 32B, that is, the thickness of the submount in the Y-axis direction, is shorter than the distance between the other two opposing surfaces. In a top view, the shape of the outer edge of the upper surface 32A of the lower submount 32 is, for example, a parallelogram. However, as will be described later, the shape of this outer edge is not limited to a parallelogram.

[0046] In the example shown in Figure 10A, the areas of the upper surfaces 35A, 35B, and 35C of the multiple upper submounts 31A, 31B, and 31C are smaller than the area of ​​the upper surface 32A of the lower submount 32. Also, in the example shown in Figure 11A, in the Y-axis direction, the lower submount 32 is thicker than the individual upper submounts 31. The thickness of an individual upper submount 31 may be, for example, about 0.2 mm. The thickness of the lower submount 32 may be, for example, 1.5 to 4 times the thickness of an individual upper submount 31, and is for example about 0.4 mm.

[0047] In the example shown in Figure 11B, in the Y-axis direction, each upper submount 31 is thicker than the lower submount 32. The thickness of the lower submount 32 may be, for example, about 0.2 mm. The thickness of each upper submount 31 may be, for example, 1.5 to 4 times the thickness of the lower submount 32, and is for example about 0.4 mm.

[0048] One or more upper submounts 31 and lower submounts 32 can be formed from, for example, aluminum nitride or silicon carbide, respectively. The upper surfaces 35, 32A or lower surfaces 34, 32B may be provided with, for example, a metal film for bonding. An example of the material for the metal film is Au. The upper submount 31 and lower submount 32 are formed from the same material. However, the upper submount 31 and lower submount 32 may be formed from different materials. In this case, the thermal conductivity of the upper submount 31 may differ from that of the lower submount 32.

[0049] The lower surfaces 34 of each of the multiple upper submounts 31 are joined to the upper surface 32A of the lower submount 32 via a metal adhesive. This metal adhesive may be, for example, AuSn. As illustrated in Figure 10A, each of the upper surfaces 35 of the multiple upper submounts 31 is provided with multiple wiring areas that are electrically connected to other components. The structure of the multiple upper submounts 31 and lower submounts 32 will be described in detail later.

[0050] (Component 90) Member 90 is a member having an inclined surface 91. The inclined surface 91 may be, for example, a light-reflecting surface that reflects light, a light-transmitting surface that transmits light, or a light-receiving surface. In this embodiment, member 90 has a support base 40 and a photodetector 50.

[0051] (Support stand 40) The support base 40 has a lower surface 42 and a support surface 41 inclined with respect to the lower surface 42. The support surface 41 is a plane inclined with respect to the lower surface 42 within a certain range of inclination angles. The inclination angle is, for example, in the range of 10 degrees to 80 degrees, and preferably in the range of 40 degrees to 50 degrees. In the illustrated example of the light-emitting device 100, the support surface 41 has an inclination angle of 45 degrees with respect to the lower surface 42. The support surface 41 may include one or more inclined surfaces inclined with respect to the lower surface 42. In that case, the support surface 41 is the inclined surface with the largest area among the multiple inclined surfaces.

[0052] The support base 40 can be formed from, for example, ceramic, glass, or metal. For example, ceramics such as aluminum nitride, glass such as quartz or borosilicate glass, or metals such as aluminum can be used. The support base 40 can also be formed from silicon or the like.

[0053] (Photodetector 50) The photodetector 50 has a bonding surface 51, a light-receiving surface 52, and one or more sides. The bonding surface 51 is located on the opposite side of the light-receiving surface 52 and is the surface to which the photodetector 50 is bonded to other components. The light-receiving surface 52 is provided on the upper surface of the photodetector 50. In the illustrated example, the shape of the photodetector 50 is a rectangular parallelepiped. However, its shape is not limited to a rectangular parallelepiped.

[0054] Multiple light-receiving regions 53 are provided on the light-receiving surface 52 of the photodetector 50. In the photodetector 50 illustrated in Figure 12, three light-receiving regions 53 are provided on the light-receiving surface 52. An example of the outer shape of the light-receiving surface 52 is rectangular, and similarly, each light-receiving region 53 has a rectangular outer shape on the light-receiving surface 52. The shape of the light-receiving region 53 is not limited to a rectangle and can be appropriately designed according to the shape of the light incident on the light-receiving region 53.

[0055] The photodetector 50 has one or more wiring regions 54. One or more wiring regions 54 may be provided on the light-receiving surface 52. One or more wiring regions 54 may be provided on surfaces other than the light-receiving surface 52. Each wiring region 54 is electrically connected to the light-receiving region 53.

[0056] In the example shown in Figure 12, four wiring areas 54 are provided on the light-receiving surface 52 to ensure electrical connection between the three light-receiving areas 53.

[0057] (Wiring 70) The wiring 70 is composed of a conductor having a linear shape with joints at both ends. In other words, the wiring 70 has joints at both ends of the linear portion for joining to other components. The wiring 70 is, for example, a wire, and may be a metal wire. Examples of metals include gold, aluminum, silver, and copper.

[0058] (Light-emitting device 100) Next, the light-emitting device 100 will be described.

[0059] In the example of the light-emitting device 100 described below, each of the multiple light-emitting elements 20 is an end-face emitting semiconductor laser element. Furthermore, as illustrated in Figure 8, the light-emitting element 20 is a multi-emitter semiconductor laser element having four light-emitting points on its exit end face 20E. However, the number of light-emitting points is not limited to four, and the light-emitting element 20 may be a single-emitter semiconductor laser element.

[0060] In this embodiment, the plurality of light-emitting elements 20 include first to third light-emitting elements 20A, 20B, and 20C, each having different emission peak wavelengths. The first light-emitting element 20A emits first light having an emission peak at a first wavelength. The second light-emitting element 20B emits second light having an emission peak at a second wavelength. The third light-emitting element 20C emits third light having an emission peak at a third wavelength. The first, second, and third wavelengths are different from each other. The first wavelength is longer than the second wavelength, and the second wavelength is longer than the third wavelength.

[0061] As illustrated in Figure 11A or Figure 11B, the first light-emitting element 20A has an exit end face 20E-A that includes four first light-emitting points 23A that emit first light. The second light-emitting element 20B has an exit end face 20E-B that includes four second light-emitting points 23B that emit second light. The third light-emitting element 20C has an exit end face 20E-C that includes four third light-emitting points 23C that emit third light.

[0062] In this embodiment, the first light is red light, the second light is green light, and the third light is blue light. The optical axes of the first light, the second light, and the third light are parallel to the Z-axis direction. Here, parallelism includes an error of ±2 degrees.

[0063] In the example shown in Figure 10A, the second light-emitting element 20B is positioned between the first light-emitting element 20A and the third light-emitting element 20C in a top view. The length of the first light-emitting element 20A in the Z-axis direction is greater than the length of the second or third light-emitting element 20B or 20C in the Z-axis direction. The output of the laser light can be adjusted by adjusting the length of the light-emitting elements 20 in the Z-axis direction. However, the relationship between the lengths is not limited to this example. A configuration in which the three light-emitting elements 20 emit light of three colors, RGB, can be used, for example, for color image display applications. Note that the color of the light emitted by each light-emitting element 20 is not limited to this, and depending on the application, it is not limited to visible light.

[0064] A lower submount 32 and a component 90 are arranged on the mounting surface 11M of the base 11 of the package 10. Each of the multiple light-emitting elements 20 is arranged on a plurality of upper submounts 31. The plurality of upper submounts 31 are arranged on the upper surface of the lower submount 32 and include a first submount 31A, a second submount 31B, and a third submount 31C. Thus, in this embodiment, there are the same number of upper submounts 31 as there are light-emitting elements 20. Each of the three light-emitting elements 20 is arranged on one of the three upper submounts 31.

[0065] The first submount 31A has a first upper surface 35A on which the first light-emitting element 20A is positioned, and a first side surface 36A that intersects with the first upper surface 35A and is located on the side of the first emission end surface 20E-A of the first light-emitting element 20A. The second submount 31B has a second upper surface 35B on which the second light-emitting element 20B is positioned, and a second side surface 36B that intersects with the second upper surface 35B and is located on the side of the second emission end surface 20E-B of the second light-emitting element 20B. The third submount 31C has a third upper surface 35C on which the third light-emitting element 20C is positioned, and a third side surface 36C that intersects with the third upper surface 35C and is located on the side of the third emission end surface 20E-C of the third light-emitting element 20C. The first side surface 36A and the first emission end surface 20E-A are located on the same side. The second side surface 36B and the second emission end surface 20E-B are located on the same side. The third side surface 36C and the third exit end surface 20E-C are located on the same side.

[0066] The first light-emitting element 20A, the second light-emitting element 20B, and the third light-emitting element 20C are bonded to the first upper surface 35A, the second upper surface 35B, and the third upper surface 35C, respectively, via a metal adhesive. The material of the metal adhesive may be, for example, AuSn.

[0067] The lower submount 32 has an upper surface 32A, a lower surface 32B, and a front side surface 32C. The front side surface 32C intersects with the upper surface 32A. The first lower surface 34A of the first submount 31A, the second lower surface 34B of the second submount 31B, and the third lower surface 34C of the third submount 31C are joined to the upper surface 32A of the lower submount 32 via a metal adhesive.

[0068] The lower surface 32B of the lower submount 32 is joined to the mounting surface 11M of the base 11 via a metal adhesive. Preferably, this metal adhesive contains a metal with a higher melting point than AuSn and a lower bonding temperature. Using a metal adhesive with a low bonding temperature allows the bonding temperature to be relatively low. Therefore, when multiple light-emitting elements 20 and multiple upper submounts 31 are joined to the lower submount 32, and then the lower submount 32 is joined to the mounting surface 11M, it is possible to suppress the heat generated during bonding from damaging the light-emitting elements mounted on the submount or affecting the temperature characteristics of the light-emitting elements. The material of the metal adhesive may be, for example, Au particles.

[0069] The front side surface 32C of the lower submount 32 is located on the same side as the first side surface 36A of the first submount 31A, the second side surface 36B of the second submount 31B, and the third side surface 36C of the third submount 31C.

[0070] In a top view, the direction in which light travels along the optical axis of the first light source, i.e., the positive Z-axis direction, is defined as forward. The first emission end face 20E-A of the first light-emitting element 20A is located forward of the second emission end face 20E-B of the second light-emitting element 20B. The second emission end face 20E-B of the second light-emitting element 20B is located forward of the third emission end face 20E-C of the third light-emitting element 20C. Furthermore, the side surface 36A of the first submount 31A is located forward of the second side surface 36B of the second submount 31B. The second side surface 36B of the second submount 31B is located forward of the third side surface 36C of the third submount 31C.

[0071] In the example shown in Figure 9A, the shape of the upper surface 32A of the lower submount 32 is a parallelogram. Of the two pairs of opposite sides that make up this parallelogram, one pair of opposite sides is parallel to the optical axis of the first light, i.e., in the Z-axis direction. The other pair of opposite sides includes the side 32D where the upper surface 32A and the front surface 32C intersect. Side 32D is perpendicular to the optical axis of the first light and is inclined in a direction parallel to the mounting surface 11M, i.e., with respect to the X-axis, and its inclination angle may be, for example, an angle of 5 degrees or more and 20 degrees or less. The four sides of the parallelogram upper surface 32A do not intersect each other at 90 degrees.

[0072] The shape of the lower submount 32 in this disclosure does not necessarily have to be a parallelogram. Various shapes can be adopted depending on the package mounting conditions, as long as, in a top view, the optical axis of the first light, i.e., the Z-axis direction, and the direction in which the side 32D of the lower submount 32 extends intersect at an angle other than 90 degrees. As an example, as shown in Figure 9B, the shape of the top surface 32A of the lower submount 32-1 may be trapezoidal. Only the side 32D of the lower submount 32-1 is inclined with respect to the X-axis, while the opposite side 32E of side 32D is not inclined with respect to the X-axis. The side 32D of the lower submount 32 is inclined at an angle of, for example, 5 degrees or more and 20 degrees or less with respect to the X-axis.

[0073] The first submount 31A, the second submount 31B, and the third submount 31C are arranged side by side on the upper surface 32A of the lower submount 32 in the X-axis direction. The second submount 31B is positioned between the first submount 31A and the third submount 31C. The distance between any two adjacent submounts among the first submount 31A, the second submount 31B, and the third submount 31C may be, for example, between 1 μm and 100 μm. In the example shown in Figure 11A or Figure 11B, the distance d1 between the first submount 31A and the second submount 31B, and the distance d2 between the second submount 31B and the third submount 31C are, for example, between 1 μm and 100 μm.

[0074] As shown in Figure 10A or Figure 10B, the plane containing the first side surface 36A of the first submount 31A is called plane P1. The plane containing the second side surface 36B of the second submount 31B is called plane P2. The plane containing the third side surface 36C of the third submount 31C is called plane P3. Plane P1 and the first exit end surface 20E-A are parallel to each other. Also, planes P1, P2, and P3 are parallel to each other. Furthermore, the first exit end surface 20E-A, the second exit end surface 20E-B, and the third exit end surface 20E-C are parallel to each other. Also, the X-axis and the first exit end surface 20E-A are parallel to each other. Here, parallelism includes an error of ±2 degrees. Here, the plane containing the front side surface 32C of the lower submount 32 is called plane P4. Plane P4 is not parallel to plane P1, but intersects it at an angle other than 90 degrees. The plane P4 can be tilted with respect to the plane P1 at an angle of, for example, 5 degrees to 20 degrees. By setting the tilt angle to 5 degrees or more, it is possible to suppress the irradiation of some of the divergent light emitted from the multiple light-emitting elements 20 onto the upper surface 32A of the lower submount 32. By setting the tilt angle to 20 degrees or less, the contact area between the multiple upper submounts 31 and the lower submount 32 can be increased, thereby providing a light-emitting device with higher heat dissipation.

[0075] In a top view, the line parallel to the Z-axis that bisects the first light-emitting element 20A is called line Q1. The line parallel to the Z-axis that bisects the second light-emitting element 20B is called line Q2. The line parallel to the Z-axis that bisects the third light-emitting element 20C is called line Q3. In a top view, line Q2 and the line parallel to the Z-axis that bisects the top surface 35B of the second submount 31B roughly coincide. Line Q1 is shifted from the line parallel to the Z-axis that bisects the top surface 35A of the first submount 31A towards the second light-emitting element 20B. Line Q3 is shifted from the line parallel to the Z-axis that bisects the top surface 35C of the third submount 31C towards the second light-emitting element 20B. By arranging the first light-emitting element 20A on the upper surface 35A of the first submount 31A in this manner, the first wiring area 38A can be provided to the side of the first light-emitting element 20A. Similarly, by arranging the third light-emitting element 20C on the upper surface 35C of the third submount 31C in this manner, the third wiring area 38C can be provided to the side of the third light-emitting element 20C. Furthermore, on the upper surface of the second submount 31B, the second wiring area 38B is provided behind the second light-emitting element 20B.

[0076] In the example shown in Figure 4, one or more first wiring regions 38A are connected via wiring 70 to a plurality of wiring regions 14 provided in the wide area of ​​the upper surface 13A of the stepped portion 13. Similarly, one or more second wiring regions 38B and one or more third wiring regions 38C are each connected via wiring 70 to a plurality of wiring regions 14 provided in the wide area of ​​the upper surface 13A of the stepped portion 13.

[0077] In Figure 10B, the intersection point where plane P4 and line Q1 intersect is called intersection point R1. The intersection point where plane P4 and line Q2 intersect is called intersection point R2. The intersection point where plane P4 and line Q3 intersect is called intersection point R3. The distance between intersection point R1 and intersection point R2 in the Z-axis direction is smaller than the distance between the first exit end face 20E-A and the second exit end face 20E-B in the Z-axis direction. Also, the distance between intersection point R1 and intersection point R2 in the Z-axis direction is smaller than the distance between plane P1 and plane P2 in the Z-axis direction. Similarly, the distance between the two intersection points R2 and intersection point R3 in the Z-axis direction is smaller than the distance between the second exit end face 20E-B and the third exit end face 20E-C. Also, the distance between the two intersection points R2 and intersection point R3 in the Z-axis direction is smaller than the distance between plane P2 and plane P3 in the Z-axis direction. Furthermore, the distance between intersection R1 and intersection R3 in the Z-axis direction is smaller than the distance between the first emission end face 20E-A and the third emission end face 20E-C in the Z-axis direction. Also, the distance between intersection R1 and intersection R3 in the Z-axis direction is smaller than the distance between plane P1 and plane P3 in the Z-axis direction. This arrangement suppresses the irradiation of some of the emitted light from the first to third light-emitting elements 20A, 20B, and 20C onto the upper surface 32A of the lower submount 32, and increases the contact area between the lower submount 32 and the first to third submounts 31A, 31B, and 31C, thereby realizing a light-emitting device with higher heat dissipation capabilities.

[0078] The angle at which the straight line connecting the midpoint of the edge where the top surface of the first light-emitting element 20A and the first emission end surface 20E-A intersect, and the midpoint of the edge where the top surface of the second light-emitting element 20B and the second emission end surface 20E-B intersect, intersects with plane P1 is in the range of 5 degrees to 50 degrees. More preferably, it is in the range of 10 degrees to 40 degrees. By setting it to 10 degrees or more, the divergent light emitted from the first light-emitting element 20A and the second light-emitting element 20B, especially the first light-emitting element 20A, can be further suppressed from irradiating the upper surface of the lower submount 32. By setting it to 40 degrees or less, the contact area between the first submount 31A and the second submount 31B, especially the second submount 31B, and the lower submount 32 can be increased, making it possible to realize a light-emitting device with higher heat dissipation.

[0079] In a top view, at least a portion of the first side surface 36A of the first submount 31A protrudes forward from the front side surface 32C of the lower submount 32. In other words, in a top view, at least a portion of the first side surface 36A of the first submount 31A protrudes forward from the edge 32D of the lower submount 32. The protrusion of the first side surface 36A from the front side surface 32C suppresses the illumination of the upper surface 32A of the lower submount 32 by the divergent light emitted from the first light-emitting element 20A. Furthermore, the third side surface 36C of the third submount 31C is located inward from the front side surface 32C or the edge 32D. In the example shown in Figure 10A or Figure 10B, the distance between the plane P1 containing the first side surface 36A and point R1 in the Z-axis direction is longer than the distance between the plane P2 containing the second side surface and point R2 in the Z-axis direction. Furthermore, the distance between the plane P3 including the third side surface 36C and point R3 in the Z-axis direction is longer than the distance between the plane P2 including the second side surface and point R2 in the Z-axis direction. This arrangement makes it possible to suppress the irradiation of some of the divergent light emitted from the first, second, and third light-emitting elements 20A, 20B, and 20C, respectively, onto the lower submount 32, while increasing the contact area between the multiple upper submounts 31 and the lower submount 32. As a result, a submount structure with higher heat dissipation can be realized.

[0080] In the example shown in Figure 11A, the four first light-emitting points 23A, the four second light-emitting points 23B, and the four third light-emitting points 23C are aligned along the X-axis. The first light-emitting points 23A are positioned higher than the second light-emitting points 23B and the third light-emitting points 23C with respect to the upper surface 32A. The second light-emitting points 23B and the third light-emitting points 23C are positioned at the same height from the upper surface 32A. However, all light-emitting points may be positioned at the same height from the upper surface 32A.

[0081] The width of the second submount 31B in the direction perpendicular to the direction in which the light on the optical axis of the first light propagates and parallel to the mounting surface 11M of the base 11, i.e., in the X-axis direction, is narrower than the width of the first submount 31A and narrower than the width of the third submount 31C. By setting the width of the second submount 31B in this way, the distance between the second light-emitting element 20B and the first light-emitting element 20A and the third light-emitting element 20C can be shortened. For example, the width of the first submount 31A may be 400 μm or more and 1100 μm or less, the width of the second submount 31B may be 100 μm or more and 800 μm or less, and the width of the third submount 31C may be 400 μm or more and 1100 μm or less.

[0082] By adopting such a numerical range, the first to third light-emitting elements 20A, 20B, and 20C can be positioned on the upper surfaces of the first, second, and third submounts 31A, 31B, and 31C, respectively. Furthermore, by setting the width of the first submount 31A in the X-axis direction to 400 μm or more, a first wiring region 38A can be provided to the side of the first light-emitting element 20A positioned on the upper surface 35A of the first submount 31A. By setting the width of the third submount 31C in the X-axis direction to 400 μm or more, a third wiring region 38C can be provided to the side of the third light-emitting element 20C positioned on the upper surface 35C of the third submount 31C. In addition, by setting the width of the second submount 31B in the X-axis direction to 800 μm or less, the first light-emitting point 23A and the third light-emitting point 23C can be brought closer to the second light-emitting point 23B. By making the width of the first submount 31A and the third submount 31C in the X-axis direction 1100 μm or less, the width of the multiple upper submounts 31 and lower submounts 32 in the X-axis direction can be reduced, thereby miniaturizing the overall size of the light-emitting device.

[0083] In the example shown in the figure, with respect to the side parallel to the Z-axis, the length of the first submount 31A is longer than the lengths of the second submount 31B, the third submount 31C, and the lower submount 32. Also, the length of the side parallel to the Z-axis of the second submount 31B is greater than the length of the side parallel to the Z-axis of the third submount 31C. However, the relative sizes of the submounts are not limited to the above; for example, the length of the side parallel to the Z-axis of the lower submount 32 may be longer than the length of the side parallel to the Z-axis of the first submount 31A.

[0084] In a top view, of the one or more first light-emitting points 23A of the first light-emitting element 20A, there may be at least one that is located outside the edge 32D of the lower submount 32. Of the one or more third light-emitting points 23C of the third light-emitting element 20C, there may be at least one that is located inside the edge 32D. Furthermore, the distance between one or more first light-emitting points 23A and point R1 in the Z-axis direction is longer than the distance between one or more second light-emitting points 23B and point R2 in the Z-axis direction. The distance between one or more third light-emitting points 23C and point R3 in the Z-axis direction is longer than the distance between one or more second light-emitting points 23B and point R2 in the Z-axis direction. This arrangement suppresses the irradiation of the lower submount 32 by some of the divergent light emitted from the first to third light-emitting elements 20A, 20B, and 20C, respectively. Furthermore, in a top view, the overlapping area between the first to third light-emitting elements 20A, 20B, and 20C and the lower submount 32 is increased. This makes it possible to realize a submount structure with high heat dissipation.

[0085] In this embodiment, the distance between plane P1 and plane P2, or the distance between plane P2 and plane P3, may be, for example, 50 μm or more and 500 μm or less.

[0086] The component 90 is positioned on the mounting surface 11M of the base 11. At this time, the component 90 is positioned on the mounting surface 11M such that the inclined surface 91 is on the optical axis of the first light emitted from the first light-emitting element 20A. The inclined surface 91 has three light-irradiated areas to which the first light, the second light, and the third light are irradiated. FFPs defined by each of the first light, the second light, and the third light are formed in the light-irradiated area corresponding to one of the first light, the second light, and the third light. In this embodiment, the component 90 has a support base 40 and a photodetector 50, and the inclined surface 91 may be a light-receiving surface 52.

[0087] The support base 40 is joined to the mounting surface 11M of the base 11 at its lower surface 42. The support base 40 is positioned on the same mounting surface 11M as the lower submount 32. When the lower surface 42 of the support base 40 is joined to the mounting surface 11M, the support surface 41 is tilted with respect to the mounting surface 11M. In the illustrated example, the support surface 41 is tilted at 45 degrees with respect to the mounting surface 11M. The photodetector 50 is positioned on the mounting surface 11M of the base 11 via the support base 40. The photodetector 50 may be positioned on the mounting surface 11M without the support base 40. If the support base 40 is not used, the shape of the photodetector 50's outer form may be changed to adjust the position (height) and / or orientation (tilt) of the light-receiving surface 52.

[0088] The support base 40 is joined to the photodetector 50 on the support surface 41. The photodetector 50 is positioned on the support surface 41. The support base 40 is positioned on the mounting surface 11M such that the support surface 41 faces the side of the light-emitting element 20. By positioning the photodetector 50 via the support base 40, the structure of the photodetector 50 can be simplified. Therefore, it is preferable that the support base 40 be made of a material that is easier to shape than the photodetector 50. In the illustrated example, the light-receiving surface 52 of the photodetector 50 is parallel to the support surface 41.

[0089] As illustrated in Figure 12, the light-receiving surface 52 of the photodetector 50 has first to third light-receiving regions 53A, 53B, and 53C. Divergent light is emitted from the light-emitting element 20 toward the light-receiving surface 52. The optical axis of this divergent light is parallel to the mounting surface 11M. Here, parallelism includes an error of ±2 degrees. As illustrated in Figure 3, each of the multiple light-emitting elements 20A, 20B, and 20C illuminates different regions of the light-receiving surface 52 of the photodetector 50 with the main portion of the light. The first to third light-receiving regions 53A, 53B, and 53C are provided in the three light-irradiated regions illuminated by the main portions of the first, second, and third light, respectively.

[0090] The light-receiving area 53A on the light-receiving surface 52 is illuminated by red light emitted from the first light-emitting element 20A. The light-receiving area 53B on the light-receiving surface 52 is illuminated by green light emitted from the second light-emitting element 20B. The light-receiving area 53C on the light-receiving surface 52 is illuminated by blue light emitted from the third light-emitting element 20C.

[0091] As illustrated in Figures 5 to 7, the divergence angle α in the speed axis direction (or Y axis direction) of the red light emitted from the first light-emitting element 20A is greater than the divergence angle β in the speed axis direction of the green light emitted from the second light-emitting element 20B, and the divergence angle γ in the speed axis direction of the blue light emitted from the third light-emitting element 20C.

[0092] In the illustrated example, the distance between the first emission end face 20E-A of the first light-emitting element 20A and the light-receiving surface 52 in the Z-axis direction is shorter than the distance between the second emission end face 20E-B of the second light-emitting element 20B and the light-receiving surface 52 or the distance between the third emission end face 20E-C of the third light-emitting element 20C and the light-receiving surface 52. By positioning the first submount 31A, which mounts the first light-emitting element 20A that emits red light, the first light with the largest divergence angle in the speed axis direction, furthest forward among the three upper submounts 31, it becomes possible to bring the first emission end face 20E-A of the first light-emitting element 20A closer to the light-receiving region 53A. This prevents the first light emitted from the first light-emitting element 20A from hitting the mounting surface 11M of the base 11 before it reaches the light-receiving region 53A.

[0093] It is preferable to position the upper submount 31 on the lower submount 32 so as to satisfy conditions (1) to (3) described below. (1) The first submount 31A, on which the first light-emitting element 20A has a relatively large angle of light spread in the speed axis direction is mounted, is positioned so as to protrude from the side 32D of the lower submount 32. (2) At least a portion of the second submount 31B on which the second light-emitting element 20B, whose light-spreading angle in the speed axis direction is smaller than that of the first light-emitting element 20A, is mounted, is positioned inside the upper surface 32A of the lower submount 32, beyond the side 32D of the lower submount 32. (3) The third submount 31C, on which the third light-emitting element 20C has a light-spreading angle in the speed axis direction smaller than that of the first light-emitting element 20A, is positioned on the upper surface 32A of the lower submount 32, with respect to the side 32D of the lower submount 32.

[0094] According to the above arrangement, it is possible to provide a light-emitting device with high heat dissipation while suppressing the irradiation of divergent light from the light-emitting element 20 onto the upper surface 32A and mounting surface 11M of the lower submount 32. In addition, because the light divergence angle of the second light-emitting element 20B and the third light-emitting element 20C is small, it is possible to reduce the thickness of the upper submount 31.

[0095] The photodetector 50 receives (absorbs) a portion of the light incident on the light-receiving area 53 and reflects a portion of it. For example, the light-receiving area 53 receives more than 2% of the light from the main illuminated area. Also, the light-receiving area 53 reflects more than 80% of the light from the main illuminated area. The sum of the received light and the reflected light is 100% or less.

[0096] Light emitted from the light-emitting element 20 is reflected upward by the light-receiving area 53, passes through the light-transmitting area of ​​the lid 16 of the package 10, and is emitted to the outside from the light-extracting surface 17. The light emitted to the outside from the light-extracting surface 17 can be used, for example, for screen display. The central axis of the light extracted from the light-extracting surface 17 is perpendicular to the light-extracting surface 17. Here, perpendicularity includes an error of ±2 degrees. However, the central axis of the light does not necessarily have to be perpendicular to the light-extracting surface 17. A portion of the remaining light emitted from the light-emitting element 20 is incident on the light-receiving area 53. The light incident on the light-receiving area 53 can be used as monitoring light to control the intensity of the laser light.

[0097] As illustrated in Figure 5, in the direction normal to the upper surface 32A of the lower submount 32, the height from the mounting surface 11M of the base 11 to the upper surface 32A of the lower submount 32 is greater than the height from the mounting surface 11M to the lowest point 59 of the light-illuminated area relative to the mounting surface 11M. This makes it possible to position the first submount 31A on which the first light-emitting element 20A is mounted close to the light-receiving surface 52 of the photodetector 50 so as not to come into contact with it. This prevents the first light emitted from the first light-emitting element 20A from hitting the mounting surface 11M of the base 11 before it reaches the light-receiving area 53A. Also, in the example of Figure 11A, the height of the lower submount 32 in the Y-axis direction is greater than the height of the multiple upper submounts 31 in the Y-axis direction. This allows the first submount 31 and the first light-emitting element 20A to be stably positioned on the upper surface 32A of the lower submount 32 such that the distance between them and the light-receiving surface 52 of the photodetector 50 is reduced. On the other hand, in the example of Figure 11B, the height of the multiple upper submounts 31 in the Y-axis direction is greater than the height of the lower submount 32 in the Y-axis direction. This suppresses the irradiation of some of the divergent light from the multiple light-emitting elements 20 onto the upper surface 32A of the lower submount 32. The relative height relationship between the multiple upper submounts 31 and the lower submount 32 can be appropriately adjusted to a desired relative height from the viewpoint of the above-mentioned effects and ease of manufacture.

[0098] On the first upper surface 35A of the first submount 31A, one or more first wiring regions 38A are formed in the region opposite to the side where the second light-emitting element 20B is located, relative to the first light-emitting element 20A, to which one or more wirings 70 are connected. In the example shown in Figure 10A, four first wiring regions 38A are provided and connected to four wirings 70. All of these connection points are located on the positive X-axis side of the upper surface 35A of the first submount 31A, which is divided by a straight line Q1. Furthermore, in the example shown in Figure 4, the four wiring regions 14 connected to the four first wiring regions 38A are the four wiring regions 14 located on the positive X-axis side of the wide region on the upper surface 13A of the stepped portion 13 extending in the Z-axis direction.

[0099] Similarly, on the third upper surface 35C of the third submount 31C, one or more third wiring regions 38C are formed in the region opposite to the side where the second light-emitting element 20B is located relative to the third light-emitting element 20C, to which one or more wirings 70 are connected. In the example shown in Figure 10A, four third wiring regions 38C are provided and joined to four wirings 70. All of these joining points are located on the negative X-axis side of the upper surface 35C of the third submount 31C, which is divided by a straight line Q3. Furthermore, in the example shown in Figure 4, the four wiring regions 14 that connect to the third wiring regions 38C are located on the negative X-axis side of the wide region on the upper surface 13A of the stepped portion 13 extending in the Z-axis direction.

[0100] On the second upper surface 35B of the second submount 31B, one or more second wiring regions 38B are formed in the region opposite to the second emission end face 20E-B of the second light-emitting element 20B, with respect to the second light-emitting element 20B, to which one or more wirings 70 are connected. In the example shown in Figure 10A, four second wiring regions 38B are provided and joined to four wirings. In a top view, the four second wiring regions 38B are arranged symmetrically with respect to a straight line Q2 (see Figure 10B) parallel to the Z-axis that bisects the second light-emitting element 20B, with two on the left and two on the right with respect to the straight line Q2. The connection points between the four wirings 70 and the four second wiring regions 38B are located on the upper surface 35B of the second submount 31B, two on the left and two on the right with respect to the straight line Q2. Furthermore, the wiring region 14 that connects to the second wiring region 38B is located in the wide region of the upper surface 13A of the stepped portion 13 that extends in the X-axis direction. In this way, by devising the arrangement of the wiring areas provided on the upper surfaces of the multiple upper submounts 31 and the arrangement of the wiring areas 14 provided on the connecting stepped portions 13, it is possible to reduce the size of the light-emitting device 100.

[0101] As illustrated in Figure 4, the multiple wires 70 electrically connect the light-emitting element 20 and the photodetector 50 to the wiring area 14 of the package 10. One end of the wire 70 is joined to the wiring area 14 provided in the wide area of ​​the stepped portion 13. The other end of the wire 70 is joined to the wiring area provided on the upper surface 35 of the upper submount 31, the p-side electrode, the n-side electrode of the light-emitting element 20, or the wiring area 54 provided on the light-receiving surface 52 of the photodetector 50.

[0102] By using submounts 31 and 32 with the same coefficient of thermal expansion, the bonding performance can be improved. Furthermore, by making the thermal conductivity of the upper submount 31 and the lower submount 32 greater than that of the package 10, the thermal diffusivity can be improved.

[0103] According to the light-emitting device 100 of this embodiment, a light-emitting device is realized in which the emission positions of light emitted from multiple light-emitting elements 20 are precisely implemented.

[0104] Figure 13 is a top view of the light-emitting device 100 with the lid 16 of the package 10 removed, as in another structural example. Figure 14 is an enlarged view of portion X in the top view of Figure 13. Figure 15 is a cross-sectional view of Figure 13 along the XV-XV section.

[0105] In other structures of the light-emitting device 100, in a top view, the first upper surface 35A of the first submount 31A partially overlaps with the inclined surface 91. In other words, a portion of the first upper surface 35A of the first submount 31A overlaps with a portion of the light-receiving surface 52 of the photodetector 50.

[0106] In the cross-sectional view in Figure 15, the plane P5 including the first side surface 36A of the first submount 31A intersects with the light-receiving surface 52. Furthermore, the light-receiving surface 52 is inclined at a predetermined angle with respect to the mounting surface 11M of the base 11. As a result, the first emitting end surface 20E-A of the first light-emitting element 20A can be brought closer to the light-receiving surface 52 to the extent that the first upper surface 35A partially overlaps with the light-receiving surface 52 of the photodetector 50. In particular, because it becomes possible to bring the light-emitting element that emits red light that diverges greatly in the velocity axis direction closer to the light-receiving surface than, for example, in Figure 5, the effect of suppressing the irradiation of a portion of the diverging light onto the mounting surface 11M is achieved.

[0107] In the light-emitting device 100, a sealed, closed space is created inside the package 10. Furthermore, by joining the side wall portion 12 and the lid portion 16 of the package 10 under a predetermined atmosphere, a hermetically sealed closed space is created inside the package 10. By hermetically sealing the space in which the light-emitting element 20 is placed, quality deterioration due to dust collection can be suppressed. Note that if the entire light-emitting device 100 is used in an environment or atmosphere where there is no need to worry about quality deterioration due to the effects of dust collection or moisture in the air, the lid portion 16 is unnecessary. For example, if the entire light-emitting device 100 is sealed by an enclosure, it is not necessary to cover the light-emitting element 20 with the lid portion 16.

[0108] In this embodiment, a reflective element other than the photodetector 50 can be bonded to the support surface 41 of the support base 40. The reflective element may be, for example, a semiconductor element having a surface that obliquely receives at least a portion of the first light, the second light, and the third light. An example of a semiconductor element other than the photodetector is a MEMS element. Alternatively, the reflective element may be a reflective mirror or a diffracting element.

[0109] Multiple upper submounts 31 and lower submounts 32 can be manufactured by dividing a plate-shaped submount substrate into multiple parts. Multiple submounts with the same shape can be obtained from a single submount substrate. Cutting can be done, for example, by dicing. Examples of dicing methods include blade dicing and laser processing. Adopting a submount with a parallelogram shape on its top surface is also advantageous in terms of ease of manufacturing.

[0110] Multiple upper submounts 31 are mounted on the lower submount 32, and multiple light-emitting elements 20 are mounted on each of the multiple upper submounts 31. After mounting the light-emitting elements 20 on each upper submount 31, the multiple upper submounts may be mounted on the lower submount 32, or multiple upper submounts 31 may be mounted on the lower submount 32, and then multiple light-emitting elements 20 may be mounted on each of the multiple upper submounts 31. In this manufacturing example, for example, AlN is used as the material for the upper submount 31 and the lower submount 32.

[0111] <Second Embodiment> The light-emitting device 200 according to the second embodiment will be described with reference to Figure 1 and Figures 16 to 19. Figure 1 shows a perspective view of the light-emitting device 200 according to this embodiment, similar to the light-emitting device 100 according to the first embodiment. Figure 16 is a perspective view of the light-emitting device 200 with the lid 16 of the package 10 removed. Figure 17 is a top view of the light-emitting device 200 with the lid 16 of the package 10 removed. In Figure 17, the light-irradiated area formed on the reflective surface 81 of the optical member 80 is shown by a dashed line. Figure 18 is a cross-sectional view taken along the cross-sectional line XVIII-XVIII in Figure 17. Figure 19 is an exploded perspective view of member 90A.

[0112] The light-emitting device 200 according to the second embodiment differs from the light-emitting device 100 according to the first embodiment in that member 90A includes a photodetector 50 and an optical member 80. The structure of member 90 in this embodiment will be mainly described below, and descriptions common to the first embodiment will be omitted.

[0113] First, let me explain the optical component 80.

[0114] (Optical component 80) An example of the optical member 80 is a prism shape. A prism is a columnar body with a polygon as its base. Examples of bases for a columnar body include triangles, quadrilaterals, and pentagons. However, the shape of the optical member 80 is not limited to a prism. The optical member 80 can be formed from a translucent material such as glass, plastic, or quartz. The optical member 80 may have multiple reflective surfaces. In this embodiment, the optical member 80 has a reflective surface 81, a reflective surface 82, and a bottom surface 83. The bottom surface 83 can function as a bonding surface for fixing to other members.

[0115] The reflective surface 81 is an inclined surface that is inclined with respect to the lower surface 83. The reflective surface 81 is composed of a plane that forms an inclination angle with respect to the lower surface 83, for example, between 25 and 65 degrees. In the illustrated example of the light-emitting device 200, the reflective surface 81 is composed of a plane that forms an inclination angle of 45 degrees with respect to the lower surface 83. The reflective surface 81 is a partially reflective surface that transmits a portion of the incident light and reflects the rest. The reflective surface 82 is a reflective surface that reflects a portion of the light that has been transmitted through the reflective surface 81.

[0116] The reflective surfaces 81 and 82 can be formed, for example, by providing a light-reflection control film that reflects incident light on a translucent material. The light-reflection control film can be formed from a metal film such as Ag or Al. Alternatively, the light-reflection control film may be a dielectric multilayer film formed from Ta2O5 / SiO2, TiO2 / SiO2, Nb2O5 / SiO2, etc. For example, by changing the film thickness and / or material of the light-reflection control film, it is possible to control the reflectance or transmittance of the reflective surface.

[0117] In this embodiment, the light reflected by the reflective surface 81 of the optical element 80 is used as the main light for screen display and the like, and all or part of the light transmitted through the reflective surface 81 can be used as monitor light to control the intensity of this main light. In this case, the intensity of the monitor light is lower than the intensity of the main light.

[0118] When light of different colors is incident, the reflective surface 81 may have, for example, a reflective region with a reflectivity suitable for the wavelength of light in each region where light of each color is incident. The multiple reflective regions corresponding to the incident regions where each light is incident may be separate from each other, or there may be regions that partially overlap among the multiple reflective regions.

[0119] As illustrated in Figure 19, the component 90A in this embodiment includes a photodetector 50 and an optical component 80. The photodetector 50 can be the same as the photodetector 50 described in the first embodiment. In the example shown in Figure 17, the photodetector 50 is positioned on the mounting surface 11M between the lower submount 32 and the side wall portion 12 of the package 10, and is located below the optical component 80. The length of the photodetector 50 in the X-axis direction may be smaller than the length of the lower submount 32 in the X-axis direction. By setting the length of the photodetector 50 in the X-axis direction to such a length, the distance in the Z-axis direction between the lower submount 32 and the photodetector 50 can be reduced. The lower surface 83 of the optical component 80 is joined to the light-receiving surface 52 of the photodetector 50 via an adhesive layer, for example, a resin.

[0120] In this embodiment, the reflective surface 81 of the optical member 80 functions as the inclined surface 91 of member 90A. The reflective surface 81 is positioned to face the side of the light-emitting element 20. The reflective surface 81 is illuminated by the main portion of the light emitted from the light-emitting element 20. The reflective surface 81 transmits a portion of the light emitted from the light-emitting element 20 and reflects the remainder upward. For example, the reflective surface 81 reflects 90% or more of the incident light and transmits the remaining light of less than 10%. The area of ​​the reflective surface 81 is larger than the area of ​​the light-receiving surface 52. With such an area, even if the distance between the reflective surface 81 and the light-emitting point of the light-emitting element 20 is long, most of the emitted light can be illuminated by the reflective surface 81. In addition, the height of the light-receiving surface 52 from the mounting surface 11M is smaller than the height of the upper surface 32A of the lower submount 32 from the mounting surface 11M. This allows the upper submount 31 and the light-emitting element 20 to be brought closer to the reflective surface 81. The reflective surface 82 reflects some or all of the light that has passed through the reflective surface 81. For example, the reflective surface 82 can reflect more than 99% of the incident light. The light reflected by the reflective surface 82 is mainly directed toward the lower surface 83.

[0121] The light-receiving area 53 of the photodetector 50 receives light transmitted through the reflective surface 81 of the optical element 80. In a top view, the area of ​​the light-receiving surface 52 of the photodetector 50 is smaller than the area of ​​the upper surface 32A of the lower submount 32. By setting the area of ​​the light-receiving surface 52 of the photodetector 50 to this size, the heat generated by light reception can be dissipated while the size of the light-emitting device 200 can be reduced.

[0122] <Third Embodiment> The light-emitting device 300 according to the third embodiment will be described with reference to Figures 1, 20, and 21. Figure 1 shows a perspective view of the light-emitting device 300 according to the third embodiment, similar to the light-emitting device 100 according to the first embodiment. Figure 20 is a top view of the light-emitting device 300 with the lid 316 of the package 310 removed. Figure 21 is a cross-sectional view taken along the XXI-XXI section in Figure 20.

[0123] The light-emitting device 300 according to this embodiment comprises a package 310 having a protrusion 332, a plurality of light-emitting elements 20, one or more submounts 31, and a member 90 (or member 90A) including a support base 40 and a photodetector 50. The light-emitting device 300 according to this embodiment differs from the light-emitting device 100 according to the first embodiment in that the package 310 has a protrusion 332 but does not have a lower submount. The following description will focus on the structure of the package 310 of the light-emitting device 300 according to this embodiment, and descriptions common to the first embodiment will be omitted as appropriate.

[0124] First, let's explain the structure of package 310.

[0125] (Package 310) The package 310 includes a base portion 311 having a mounting surface 311M, a side wall portion 312 having an upper surface 310A, a protrusion portion 332 having an upper surface 332A and a front surface portion 332C, and a lid portion 316 (see Figure 1) fixed to the upper surface 310A and having a light extraction surface 317.

[0126] Referring to Figure 21, the various parts that make up the package 310 will be described. In Figure 21, for illustrative purposes, the protruding portion 332 of the package 310 is enclosed in a dashed rectangle. In this embodiment, the mounting surface 311M and the portion of the package 310 located below the mounting surface 311M are referred to as the base portion 311. The portion of the package 310 located above the mounting surface 311M, and the inner surface of the recess of the package 310, and the portion of the package 310 located outside the inner surface are referred to as the side wall portion 312. The stepped portion 313 is included in the side wall portion 312. In the illustrated example, the portion of the package 310 located above the mounting surface 311M, and the inner surface 313B of the stepped portion 313, and the portion of the package 310 located outside the inner surface 313B are referred to as the side wall portion 312. Furthermore, the portion that is located above the mounting surface 311M and inside the inner surface that forms the recess of the package 310 (in the illustrated example, the inner surface 313B of the stepped portion 313) is called the convex portion 332.

[0127] In the illustrated example, the base 311, protrusion 332, and side wall 312 of the package 310 are formed integrally. Alternatively, the base 311 and protrusion 332 may be formed integrally, while the side wall 312 is formed as a separate component. The upper surface 332A of the protrusion 332 is connected to the inner surface of the side wall 312, and the front surface 332C of the protrusion 332 is connected to the mounting surface 311M of the base 311. In the illustrated example, the upper surface 332A of the protrusion 332 is connected to the inner surface 313B of the stepped portion 313 of the side wall 312. The upper surface 313A of the stepped portion 313 is located above the upper surface 332A of the protrusion 332. The protrusion 332 has a side 332D where the upper surface 332A and the front surface 332C are connected. Multiple wiring areas 314 are provided on the upper surface 313A of the stepped portion 313. Note that the upper surface 332A of the protrusion 332 does not necessarily have to be connected to the side wall portion 312. For example, the protrusion 332 may have a rear surface opposite to the front surface 332C, connected to the mounting surface 311M and facing the inner surface 313B.

[0128] (Light-emitting device 300) Next, the light-emitting device 300 according to this embodiment will be described. Multiple submounts 31 are arranged on the upper surface 332A of the protrusion 332. In the example shown in Figure 20, a first submount 31A, a second submount 31B, and a third submount 31C are arranged on the upper surface 332A of the protrusion 332, similar to the first embodiment. The multiple submounts 31 in the light-emitting device 300 can be arranged on the upper surface 332A of the protrusion 332 in the same way as the arrangement of multiple submounts 31 on the lower submount 32 in the light-emitting device 100 according to the first embodiment, and the positional relationship between each submount 31 and the side 32D of the lower submount 32.

[0129] In the light-emitting device 300, as described above, the protrusion 332 is provided on the package 310 such that the inner surface of the side wall 312 and the upper surface 332A of the protrusion 332 are connected. In the illustrated example, the inner surface 313B of the stepped portion 313 and the upper surface 332A of the protrusion 332 are connected. This makes it possible to reduce the size of the light-emitting device 300 in the X and / or Z directions. The following explanation will use the illustrated example.

[0130] More specifically, the upper surface 332A of the protrusion 332 is connected to the inner surface 313B of the stepped portion 313 extending in the X direction. As a result, there is no member or space interposed between the protrusion 332 and the stepped portion 313 extending in the X direction, so the size of the light-emitting device 300 in the Z direction can be reduced. Alternatively, the upper surface 332A of the protrusion 332 may be connected to the inner surface 313B of at least one or both of the pair of portions extending in the Z direction included in the stepped portion 313. As a result, there is no member or space interposed between the protrusion 332 and the portion of the stepped portion 313 extending in the Z direction, so the size of the light-emitting device 300 in the X direction can be reduced. As mentioned above, the protrusion 332 may be provided so that the upper surface 332A of the protrusion 332 is not connected to the side wall portion 312 and / or the stepped portion 313.

[0131] In the illustrated example of the light-emitting device 300, the midpoints of the two sides extending in the Z direction where the inner surface 313B of the stepped portion 313 and the upper surface 313A of the stepped portion 313 intersect are defined as midpoints M1 and M2. In a top view, the straight line passing through midpoints M1 and M2 intersects with side 332D. The angle between this straight line and side 332D is, for example, between 5 degrees and 20 degrees.

[0132] In the example of the light-emitting device 300 shown in Figure 20, the distance in the Z direction between the pair of inner surfaces 313B extending in the X direction and included in the stepped portion 313 is called distance d3. Distance d3 may be, for example, 1.8 times or less the length of the first submount 31A in the Z direction. Also, of the two sides extending in the X direction included in the side where the inner surface 313B of the stepped portion 313 and the upper surface 313A of the stepped portion 313 intersect, the side located on the opposite side from the emission end face of the light-emitting element 20 is called side 332E. The distance between the two points of the longest line segment parallel to the Z direction, connecting a point on the line l1 including side 332E and a point on side 332D, is called distance d4. Distance d3 may be, for example, 2 times or less the distance d4. Furthermore, the distance between the two points of the shortest line segment parallel to the Z direction, connecting a point on the line l1 and a point on side 332D, is called distance d5. The distance d3 can be, for example, three times or less the distance d5.

[0133] A component 90 or component 90A is placed on the mounting surface 311M of the base portion 311. Figure 21 shows an example of placing component 90 on the mounting surface 311M. The positional relationship or length relationship between the multiple submounts 31 and multiple light-emitting elements 20 placed on the protrusion 332 and the component 90 or component 90A placed on the mounting surface 311M may be the same as that described in the first embodiment.

[0134] <Fourth Embodiment> The light-emitting device 400 according to the fourth embodiment will be described with reference to Figure 22. Figure 22 is a plan view of the light-emitting device 400 as seen from the negative direction of the Z axis.

[0135] The light-emitting device 400 according to this embodiment further comprises a beam combiner 95 and a lens member 97 in addition to the one or more components provided by the light-emitting devices 100, 200, or 300 according to the first or second embodiment.

[0136] (Beam combiner 95) The beam combiner 95 emits combined light by coaxially aligning multiple incident light beams. The beam combiner 95 has a structure formed by joining multiple optical members 96. The optical members 96 can be formed from transparent materials such as glass or plastic that transmit visible light. The optical members 96 can be realized, for example, by dichroic mirrors. The dichroic mirrors are formed from dielectric multilayer films having a predetermined wavelength selectivity. Dielectric multilayer films can be formed from Ta2O5 / SiO2, TiO2 / SiO2, Nb2O5 / SiO2, etc.

[0137] (Lens component 97) The lens member 97 may have one or more lens surfaces. The lens member 97 collimates incident light. For example, one or more lens surfaces are designed to receive light diverging from the focal point and convert the diverging light into collimated light through refraction, which then exits the lens member 97. In the illustrated example, the lens member 97 has one lens surface. The lens member 97 may be formed from a light-transmitting material, such as glass or plastic.

[0138] In the illustrated example, the beam combiner 95 coaxially aligns multiple light beams emitted in the Y-axis direction from the light extraction surfaces 17 and 317 of the packages 10 and 310, thereby emitting combined light whose optical axis is parallel to the X-axis direction. The lens member 97 receives divergent light emitted from the light-emitting point 23 of the light-emitting element 20, and converts the divergent light into collimated light through refraction before emitting it.

[0139] As in this embodiment, when optical control such as collimation is performed by injecting multiple light beams of different wavelengths onto a single lens surface, it is sometimes necessary to reduce chromatic aberration and adjust the optical path length of each light beam. According to the light-emitting device of this disclosure, for example, it is possible to shift the light-emitting point of a light-emitting device that emits red light forward relative to the light-emitting point of a light-emitting device that emits blue light. This makes it easier to adjust the optical path lengths of the red and blue light beams. Since adjustment by shifting the light-emitting point can be performed without requiring new optical components, the light-emitting device of this disclosure can contribute to reducing the number of parts.

[0140] While embodiments of the present invention have been described above, the light-emitting device according to the present invention is not strictly limited to the light-emitting devices of the embodiments. In other words, the present invention is not limited to the external shape and structure of the light-emitting device disclosed in the embodiments. Furthermore, it can be applied without requiring all components to be present in sufficient quantities. For example, if some components of the light-emitting device disclosed in the embodiments are not described in the claims, a degree of design freedom for those skilled in the art is permitted for those components, such as substitution, omission, modification of shape, and change of material, and the invention described in the claims is then specified to be applicable. Furthermore, if the technical features and functions of the configurations provided in each embodiment are common, they may be referred to collectively. For example, "member having an inclined surface" includes member 90 according to the first embodiment and member 90A according to the second embodiment. Also, "member having a plane located above the mounting surface of the base" may be referred to as "base portion." In this case, "base portion" includes the lower sub-mount 32 arranged on the base portion 11 according to the first embodiment and the protrusion 332 provided on the base portion 311 according to the third embodiment. [Industrial applicability]

[0141] The light-emitting device according to this embodiment can be used in head-mounted displays, projectors, lighting, displays, and the like. [Explanation of symbols]

[0142] 10, 310: Package 11, 311: Base 11M, 311M: Implementation side 12, 312: Side wall section 13, 313: Stepped section 14, 314: Wiring area 16, 316: Lid part 17, 317: Light extraction surface 20: Light-emitting element 20A: First light-emitting element 20B: Second light-emitting element 20C: Third light-emitting element 20E: Output end face 23A: First light emission point 23B: Second light source 23C: Third light-emitting point 31: Upper submount 31A: First submount 31B: Second submount 31C: Third submount 32: Lower submount 332: Convex part 38A: 1st wiring area 38B: 2nd wiring area 38C: 3rd wiring area 40: Support stand 41 :Support surface 50: Photodetector 51: Joint surface 52: Light receiving surface 53: Light receiving area 54:Wiring area 70: Wiring 80: Optical components 81, 82: Reflective surface 90, 90A: Components 91: Inclined surface 95: Beam Combiner 96: Optical components 97: Lens component 100, 200, 300, 400: Light-emitting devices

Claims

1. A first semiconductor laser element having a first emission end face including a first light emission point that emits first light, A second semiconductor laser element having a second emission end face including a second light emission point that emits a second light, A package that creates a closed space inside in which the first semiconductor laser element and the second semiconductor laser element are arranged, A first reflection region that reflects the first light emitted from the first semiconductor laser element, A second reflection region that reflects the second light emitted from the second semiconductor laser element. Equipped with, The first reflective region and the second reflective region are provided in the closed space of the package. The distance from the first light emission point to the first irradiation point where the optical axis of the first light illuminates the first reflection region is shorter than the distance from the second light emission point to the second irradiation point where the optical axis of the second light illuminates the second reflection region. A light-emitting device in which the first light emitted from the first exit end face of the first semiconductor laser element has a greater divergence angle in the speed axis direction than the second light emitted from the second exit end face of the second semiconductor laser element.

2. The first light is red light, The light-emitting device according to claim 1, wherein the second light is blue or green light.

3. The third semiconductor laser element further comprises a third emitting end face including a third light-emitting point from which a third light is emitted, The light-emitting device according to claim 2, wherein the third light is blue or green light and is of a different color from the second light.

4. A third semiconductor laser element having a third emission end face including a third light emission point that emits a third light, A first submount having a first upper surface on which the first semiconductor laser element is arranged and a first side surface located on the side of the first emission end surface, A second submount having a second upper surface on which the second semiconductor laser element is arranged and a second side surface located on the side of the second emission end surface, A third submount having a third upper surface on which the third semiconductor laser element is arranged and a third side surface located on the side of the third emission end surface, Furthermore, The second semiconductor laser element is positioned between the first semiconductor laser element and the third semiconductor laser element in a top view. In a top view, the midpoint of the edge where the top surface and the first emission end surface of the first semiconductor laser element intersect is located at a position shifted toward the second semiconductor laser element from the midpoint of the edge where the first top surface and the first side surface intersect. The light-emitting device according to claim 1, wherein, in a top view, the midpoint of the edge where the top surface of the third semiconductor laser element and the third emission end surface intersect is located at a position shifted toward the second semiconductor laser element from the midpoint of the edge where the third top surface and the third side surface intersect.

5. A first submount having a first upper surface on which the first semiconductor laser element is arranged and a first side surface located on the side of the first emission end surface, A second submount having a second upper surface on which the second semiconductor laser element is arranged and a second side surface located on the side of the second emission end surface, A third submount having a third upper surface on which the third semiconductor laser element is arranged and a third side surface located on the side of the third emission end surface, Furthermore, The second semiconductor laser element is positioned between the first semiconductor laser element and the third semiconductor laser element in a top view. In a top view, the midpoint of the edge where the top surface and the first emission end surface of the first semiconductor laser element intersect is located at a position shifted toward the second semiconductor laser element from the midpoint of the edge where the first top surface and the first side surface intersect. The light-emitting device according to claim 3, wherein, in a top view, the midpoint of the edge where the top surface of the third semiconductor laser element and the third emission end surface intersect is located at a position shifted toward the second semiconductor laser element from the midpoint of the edge where the third top surface and the third side surface intersect.

6. The package has an inner surface that forms a recess and a protrusion located on the inside of the inner surface, The light-emitting device according to claim 1, wherein the first semiconductor laser element and the second semiconductor laser element are arranged on the upper surface of the protrusion.

7. The light-emitting device according to claim 6, wherein the protrusion is connected to the inner surface.

8. A first submount having a first upper surface on which the first semiconductor laser element is arranged and a first side surface located on the side of the first emission end surface, A second submount having a second upper surface on which the second semiconductor laser element is arranged and a second side surface located on the side of the second emission end surface, Furthermore, The light-emitting device according to claim 1, wherein, in a top view, the length of the first side surface of the first submount is greater than the length of the second side surface of the second submount.

9. A third semiconductor laser element having a third emission end face including a third light emission point that emits a third light, A third submount having a third upper surface on which the third semiconductor laser element is arranged and a third side surface located on the side of the third emission end surface, Furthermore, The light-emitting device according to claim 8, wherein, in a top view, the length of the third side surface of the third submount is greater than the length of the second side surface of the second submount.

10. A first submount having a first upper surface on which the first semiconductor laser element is arranged and a first side surface located on the side of the first emission end surface, A second submount having a second upper surface on which the second semiconductor laser element is arranged and a second side surface located on the side of the second emission end surface, Furthermore, The light-emitting device according to claim 1, wherein, in a top view, the length of the first submount in the direction perpendicular to the first side surface is greater than the length of the second submount in the direction perpendicular to the second side surface.

11. A third semiconductor laser element having a third emission end face including a third light emission point that emits a third light, A third submount having a third upper surface on which the third semiconductor laser element is arranged and a third side surface located on the side of the third emission end surface, Furthermore, The light-emitting device according to claim 10, wherein, in a top view, the length of the third submount in the direction perpendicular to the third side surface is smaller than the length of the second submount in the direction perpendicular to the second side surface.

12. The light-emitting device according to claim 1, wherein the first reflective region and the second reflective region are regions on a single reflective surface.

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