Adjustment method, processing method, wafer manufacturing method and processing apparatus

The adjustment method addresses shape discrepancies between holding surfaces by measuring and adjusting angles, ensuring flatness and consistency in wafer manufacturing, resulting in high-quality wafers.

JP2026084202APending Publication Date: 2026-05-21DISCO CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
DISCO CORP
Filing Date
2024-11-11
Publication Date
2026-05-21

AI Technical Summary

Technical Problem

The difference in shapes between holding surfaces of different holding parts during the transfer of an ingot for laser irradiation and grinding leads to issues in achieving a flat surface for laser incidence, affecting the quality of wafers.

Method used

An adjustment method involving multiple holding steps, surface shape measurement, and angle adjustment between the grinding wheel and holding surfaces to ensure flatness before and after grinding, followed by forming modified layers and separation.

Benefits of technology

Prevents problems caused by surface shape discrepancies, enabling high-quality, uniform thickness wafers by ensuring flatness and consistency during the wafer manufacturing process.

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Abstract

The present invention provides an adjustment method, a processing method, a wafer manufacturing method, and a processing apparatus that can prevent problems caused by differences in the shapes of two holding surfaces (e.g., first and second holding surfaces) when transferring an ingot (workpiece, object to be processed) between two holding parts (e.g., first and second holding parts). [Solution] In the shape measurement step, the surface shape of the first surface (110) of the ingot (100) held on the second holding surface (22) in the second holding step is measured. In the angle adjustment step, the angle between the rotation axis of the grinding wheel (19) and the first holding surface (12) is adjusted based on the surface shape measured in the shape measurement step.
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