Multilayer ceramic capacitor

Abstract

One embodiment of the present invention aims to provide a multilayer ceramic capacitor that can prevent the mooning phenomenon. [Solution] A multilayer ceramic capacitor according to one embodiment of the present invention includes a body comprising a plurality of dielectric layers and a plurality of internal electrodes stacked in the first direction, including a first surface and a second surface facing a first direction, a third surface and a fourth surface facing a second direction intersecting the first direction, and a fifth surface and a sixth surface facing a third direction intersecting the first and second directions simultaneously, and an external electrode disposed outside the body, wherein the external electrode may include a connecting portion connected to the plurality of internal electrodes, a band portion connected to the connecting portion and covering a portion of the first surface, the second surface, the fifth surface, and the sixth surface, and a protrusion portion spaced apart from the connecting portion and disposed on the band portion on the first surface, the second surface, the fifth surface, and the sixth surface, respectively.

Description

[Technical Field]

[0001] This disclosure relates to multilayer ceramic capacitors. [Background technology]

[0002] Electronic components that use ceramic materials include capacitors, inductors, piezoelectric elements, varistors, and thermistors. Among these ceramic electronic components, multilayer ceramic capacitors (MLCCs) can be used in a wide variety of electronic devices due to their advantages of being small, having guaranteed high capacitance, and being easy to mount.

[0003] A multilayer ceramic capacitor may include a body containing multiple dielectric layers and multiple internal electrodes, and external electrodes positioned outside the body and connected to the internal electrodes. When attempting to selectively form a coating layer only on the external electrodes, the coating material may diffuse to the sides of the body. In this case, a so-called mooning phenomenon may occur, where the boundary between the external electrodes and the body becomes an arc shape rather than a straight line. [Overview of the project] [Problems that the invention aims to solve]

[0004] One embodiment of the present invention aims to provide a multilayer ceramic capacitor that can prevent the mooning phenomenon. [Means for solving the problem]

[0005] A multilayer ceramic capacitor according to one embodiment of the present invention includes a body comprising a plurality of dielectric layers and a plurality of internal electrodes stacked in the first direction, including a first and second surface facing a first direction, a third and fourth surface facing a second direction intersecting the first direction, and a fifth and sixth surface facing a third direction intersecting the first and second directions simultaneously, and an external electrode disposed outside the body, wherein the external electrode may include a connecting portion connected to the plurality of internal electrodes, a band portion connected to the connecting portion and covering a portion of the first, second, fifth, and sixth surfaces, respectively, and a protruding portion spaced apart from the connecting portion and disposed on the band portion on the first, second, fifth, and sixth surfaces, respectively.

[0006] The protruding portion may be spaced apart from the body side edge of the band portion.

[0007] The protruding portion may be positioned on the side edge of the body of the band portion.

[0008] The band portion includes a first subband portion on the first surface, a second subband portion on the second surface, a third subband portion on the fifth surface, and a fourth subband portion on the sixth surface, and the protrusion portion includes a first sub-protrusion portion disposed on the first subband portion, a second sub-protrusion portion disposed on the second subband portion, a third sub-protrusion portion disposed on the third subband portion, and a fourth sub-protrusion portion disposed on the fourth subband portion, and the first sub-protrusion portion, the second sub-protrusion portion, the third sub-protrusion portion, and the fourth sub-protrusion portion may be connected to each other.

[0009] The first sub-protrusion and the second sub-protrusion may protrude in a direction parallel to the first direction.

[0010] The third sub-protrusion and the fourth sub-protrusion may protrude in a direction parallel to the third direction.

[0011] The external electrode may further include a corner portion that connects the connection portion and the band portion.

[0012] The plurality of internal electrodes may include a plurality of first internal electrodes and a plurality of second internal electrodes that are offset from each other in the first direction.

[0013] The external electrodes may include a first external electrode disposed on the third surface and connected to the plurality of first internal electrodes, and a second external electrode disposed on the fourth surface and connected to the plurality of second internal electrodes.

[0014] According to the multilayer ceramic capacitor of the embodiment, the mooning phenomenon can be prevented by arranging a protrusion in the band portion of the external electrode. [Brief explanation of the drawing]

[0015] [Figure 1] Figure 1 is a schematic perspective view showing a multilayer ceramic capacitor according to one embodiment. [Figure 2] Figure 2 is a plan view of Figure 1. [Figure 3] Figure 3 is a side view of Figure 1. [Figure 4] Figure 4 is another side view of Figure 1. [Figure 5] Figure 5 is a separated perspective view schematicly showing the layered structure of the internal electrodes of the multilayer ceramic capacitor shown in Figure 1. [Figure 6] Figure 6 is a schematic plan view showing the first internal electrode of the multilayer ceramic capacitor shown in Figure 1. [Figure 7] Figure 7 is a schematic plan view showing the second internal electrode of the multilayer ceramic capacitor shown in Figure 1. [Figure 8] Figure 8 is a cross-sectional view taken along the line I-I' in Figure 1. [Figure 9] Figure 9 is a cross-sectional view taken along the line II-II' in Figure 1. [Figure 10] Figure 10 is a magnified view of area A in Figure 8. [Figure 11]FIG. 11 is a plan view schematically showing a multilayer ceramic capacitor according to another embodiment. [Figure 12] FIG. 12 is a schematic cross-sectional view of FIG. 11. [Figure 13] FIG. 13 is a diagram schematically showing a process of forming a coating layer on a multilayer ceramic capacitor according to an embodiment. [Figure 14] FIG. 14 is a diagram schematically showing a process of forming a coating layer on a multilayer ceramic capacitor according to a comparative example.

DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those having ordinary knowledge in the technical field to which the present invention pertains can easily implement it. In the drawings, in order to clearly explain the present invention, unnecessary parts for explanation are omitted, and the same reference numerals are given to the same or similar components throughout the specification. Also, in the accompanying drawings, some components are exaggerated, omitted, or shown schematically, and the sizes of each component do not fully reflect the actual sizes.

[0017] The accompanying drawings are only for facilitating the understanding of the examples disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the accompanying drawings, and it must be understood that they include any modifications, equivalents, or alternatives included in the spirit and technical scope of the present invention.

[0018] Terms including ordinal numbers such as "first", "second", etc. can be used to describe various components, but the components are not limited by the terms. The terms are only used for the purpose of distinguishing one component from another.

[0019] Furthermore, when we say that a layer, membrane, region, plate, or other part is "on top of" another part, this includes not only the case where it is "directly above" the other part, but also the case where the other part is in between. Conversely, when we say that one part is "directly above" another part, it means that there is no other part in between. Also, being "on top of" a reference part means being located above or below the reference part, and does not necessarily mean being located "above" in the opposite direction of gravity.

[0020] Throughout the specification, terms such as “includes” or “have” are intended to specify the presence of features, figures, steps, actions, components, parts, or combinations thereof described in the specification, and should not be understood to preemptively exclude the presence or possibility of adding one or more other features, figures, steps, actions, components, parts, or combinations thereof. Therefore, when a part “includes” a component, this means that, unless otherwise stated, it does not exclude other components and may further include other components.

[0021] Furthermore, throughout the specification, "on a plane" refers to the view of the part in question from above, and "on a cross-section" refers to the view of a cross-section obtained by cutting the part in question perpendicularly, viewed from the side.

[0022] Furthermore, throughout the specification, the term "connected" does not only mean that two or more components are directly connected, but may also mean that two or more components are indirectly connected through other components, that they are not only physically connected but also electrically connected, or that they are a single unit, even though they are referred to by different names depending on their location or function.

[0023] Figure 1 is a schematic perspective view of a multilayer ceramic capacitor according to one embodiment, Figure 2 is a plan view of Figure 1, Figure 3 is a side view of Figure 1, and Figure 4 is another side view of Figure 1.

[0024] Referring to Figures 1, 2, 3, and 4, the multilayer ceramic capacitor 1000 according to this embodiment includes a body 110, a first external electrode 200, and a second external electrode 300.

[0025] First, to clearly explain this embodiment, the directions are defined as follows: the T-axis, L-axis, and W-axis shown in the drawing represent the first, second, and third directions of the multilayer ceramic capacitor 1000, respectively.

[0026] The first direction (T-axis direction) may be a direction perpendicular to the broad surface (main surface) of the sheet-shaped component. For example, the first direction (T-axis direction) can be used with the same concept as the direction in which the dielectric layer 140 is stacked. Hereafter, for the sake of explanation, the "first direction" will be referred to as the "thickness direction".

[0027] The second direction (L-axis direction) may be a direction parallel to the broad surface (main surface) of the sheet-shaped component, intersecting (or perpendicular to) the thickness direction (T-axis direction). For example, the second direction (L-axis direction) may be the direction in which the first external electrode 200 and the second external electrode 300 face each other. Hereafter, for the sake of explanation, the "second direction" will be referred to as the "length direction".

[0028] The third direction (W-axis direction) may be a direction parallel to the wide surface (main surface) of the sheet-shaped component, intersecting (or perpendicular to) the thickness direction (T-axis direction) and the length direction (L-axis direction) simultaneously. For the sake of explanation, the "third direction" will be referred to as the "width direction" below.

[0029] The body 110 may have a substantially hexahedral shape, but this embodiment is not limited to this. Due to shrinkage during sintering, the body 110 may not have a perfect hexahedral shape, but may have a substantially hexahedral shape. For example, the body 110 may have a substantially orthogonal hexahedral shape, but the corners and vertices may have a rounded shape.

[0030] In this embodiment, for the sake of explanation, the surfaces of the body 110 that face each other in the thickness direction (T-axis direction) are defined as the first surface S1 and the second surface S2, the surfaces of the body 110 that face each other in the length direction (L-axis direction) and connect the first surface S1 and the second surface S2 are defined as the third surface S3 and the fourth surface S4, and the surfaces of the body 110 that face each other in the width direction (W-axis direction) and connect the first surface S1 and the second surface S2 are defined as the fifth surface S5 and the sixth surface S6.

[0031] Therefore, the first direction in which the first surface S1 and the second surface S2 face each other may be the thickness direction (T-axis direction), and the second and third directions, which are perpendicular to the first direction and perpendicular to each other, may be the length direction (L-axis direction) and the width direction (W-axis direction) or the width direction (W-axis direction) and the length direction (L-axis direction), respectively.

[0032] The length of body 110 may represent the maximum length of a plurality of line segments parallel to the length direction (L-axis direction), obtained by connecting the two outermost boundary lines of body 110 facing each other in the length direction (L-axis direction) as shown in the aforementioned cross-sectional photograph of body 110 in the length direction (L-axis direction) at the center of body 110 in the width direction (W-axis direction), based on an optical microscope or scanning electron microscope (SEM) photograph of body 110 in the length direction (L-axis direction). Alternatively, the length of body 110 may represent the minimum length of a plurality of line segments parallel to the length direction (L-axis direction), obtained by connecting the two outermost boundary lines of body 110 facing each other in the length direction (L-axis direction) as shown in the aforementioned cross-sectional photograph.

[0033] The thickness of body 110 may represent the maximum length of a plurality of line segments parallel to the thickness direction (T-axis direction), obtained by connecting the two outermost boundary lines opposite to the thickness direction (T-axis direction) of body 110 as shown in the aforementioned cross-sectional photograph of body 110 in the length direction (L-axis direction) - thickness direction (T-axis direction), based on an optical microscope or scanning electron microscope (SEM) photograph of the cross-section of body 110 in the width direction (W-axis direction). On the other hand, the thickness of body 110 may represent the minimum length of a plurality of line segments parallel to the thickness direction (T-axis direction), obtained by connecting the two outermost boundary lines opposite to the thickness direction (T-axis direction) of body 110 as shown in the aforementioned cross-sectional photograph.

[0034] Alternatively, the thickness of body 110 may mean the arithmetic mean of the lengths of at least two line segments that connect the two outermost boundary lines of body 110 that are opposite each other in the thickness direction (T-axis direction) as shown in the aforementioned cross-sectional photograph, and are parallel to the thickness direction (T-axis direction).

[0035] The width of body 110 may represent the maximum length of a plurality of line segments parallel to the width direction (W-axis direction), obtained by connecting the two outermost boundary lines of body 110 facing each other in the width direction (W-axis direction) as shown in the aforementioned cross-sectional photograph of body 110 in the length direction (L-axis direction) - width direction (W-axis direction), based on an optical microscope or scanning electron microscope (SEM) photograph of the cross-section of body 110 in the length direction (L-axis direction) - width direction (W-axis direction), as shown in the aforementioned cross-sectional photograph. Alternatively, the width of body 110 may represent the minimum length of a plurality of line segments parallel to the width direction (W-axis direction), obtained by connecting the two outermost boundary lines of body 110 facing each other in the width direction (W-axis direction), as shown in the aforementioned cross-sectional photograph.

[0036] FIG. 5 is an exploded perspective view schematically showing the laminated structure of the internal electrodes of the multilayer ceramic capacitor of FIG. 1, FIG. 6 is a plan view schematically showing the first internal electrode of the multilayer ceramic capacitor of FIG. 1, and FIG. 7 is a plan view schematically showing the second internal electrode of the multilayer ceramic capacitor of FIG. 1. FIG. 8 is a cross-sectional view taken along the line I-I' of FIG. 1, FIG. 9 is a cross-sectional view taken along the line II-II' of FIG. 1, and FIG. 10 is a partially enlarged view showing the A region of FIG. 8.

[0037] Referring to FIGS. 5, 6, 7, 8, 9, and 10, the body 110 can include a plurality of dielectric layers 140, a first internal electrode 150, and a second internal electrode 160.

[0038] The plurality of dielectric layers 140 are laminated in the thickness direction (T-axis direction) of the body 110. The boundaries between the dielectric layers 140 may be unclear. For example, the boundaries between the dielectric layers 140 are difficult to confirm without using a scanning electron microscope (SEM), and the plurality of dielectric layers 140 may appear as an integral structure.

[0039] The dielectric layer 140 can include a ceramic material. For example, the ceramic material can include a dielectric ceramic containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3. Further, these components can further include auxiliary components such as manganese (Mn) compounds, iron (Fe) compounds, chromium (Cr) compounds, cobalt (Co) compounds, nickel (Ni) compounds, etc. For example, the dielectric layer is (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zry ) There are O3 (0 < y < 1) etc., but the present invention is not limited thereto.

[0040] The dielectric layer 140 can further contain one or more of a ceramic additive, an organic solvent, a plasticizer, a binder, and a dispersant. The ceramic additive may be, for example, a transition metal oxide or carbide, a rare earth element, magnesium (Mg), aluminum (Al), or the like.

[0041] The first internal electrode 150 and the second internal electrode 160 may be alternately laminated with the dielectric layer 140 interposed therebetween. Such a laminated structure may be repeated within the body 110, and the internal electrode closest to the first surface S1 of the body 110 may be the first internal electrode 150 or the second internal electrode 160. Similarly, the internal electrode closest to the second surface S2 of the body 110 may be the first internal electrode 150 or the second internal electrode 160.

[0042] The first internal electrode 150 and the second internal electrode 160 have different polarities from each other, but can be electrically insulated from each other by the dielectric layer 140 disposed therebetween.

[0043] The first internal electrode 150 and the second internal electrode 160 may be formed by printing a conductive paste containing a metal on the surface of the dielectric layer 140. For example, a conductive paste containing nickel (Ni) or a nickel (Ni) alloy can be printed on the surface of the dielectric layer by a screen printing method or a gravure printing method to form an internal electrode. However, this embodiment is not limited thereto.

[0044] When a voltage is applied to the first external electrode 200 and the second external electrode 300, charge accumulates between the first internal electrode 150 and the second internal electrode 160. In other words, capacitance can be obtained between the first internal electrode 150, which is electrically connected to the first external electrode 200, and the second internal electrode 160, which is electrically connected to the second external electrode 300. The capacitance of the multilayer ceramic capacitor 1000 is proportional to the overlapping area of ​​the first internal electrode 150 and the second internal electrode 160, which overlap each other along the thickness direction (T-axis direction).

[0045] Referring to Figures 7 and 8, a first cover layer 143 and a second cover layer 145 may be arranged on the outermost part of the body 110 in the thickness direction (T-axis direction).

[0046] The first cover layer 143 is positioned between the first surface S1 of the body 110 and the internal electrode closest to it. The second cover layer 145 is positioned between the second surface S2 of the body 110 and the internal electrode closest to it.

[0047] In other words, the first cover layer 143 may be placed on top of the uppermost internal electrode within the body 110, and the second cover layer 145 may be placed on top of the lowermost internal electrode. The first cover layer 143 and the second cover layer 145 may have the same composition as the dielectric layer 140. The first cover layer 143 and the second cover layer 145 can be formed by laminating one or more dielectric layers on the outer surface of the uppermost internal electrode and the outer surface of the lowermost internal electrode, respectively. On the other hand, the first cover layer 143 and the second cover layer 145 may have a different composition from the dielectric layer 140.

[0048] The first cover layer 143 and the second cover layer 145 can serve to prevent damage to the first internal electrode 150 and the second internal electrode 160 due to physical or chemical stress.

[0049] The first external electrode 200 and the second external electrode 300 are positioned outside the body 110.

[0050] The first external electrode 200 is positioned on the third surface S3 of the body 110 and may extend to the first surface S1, the second surface S2, the fifth surface S5, and the sixth surface S6. The second external electrode 300 is positioned on the fourth surface S4 of the body 110 and may extend to the first surface S1, the second surface S2, the fifth surface S5, and the sixth surface S6. In other embodiments, the first external electrode 200 and the second external electrode 300 may extend to a portion of at least one of the first surface S1 and the second surface S2.

[0051] The first external electrode 200 includes a first connecting portion 210, a first band portion 220, a first protruding portion 230, and a first corner portion 240.

[0052] The first connection portion 210 covers the third surface S3 of the body 110 and is connected to a plurality of first internal electrodes 150, thereby being electrically coupled.

[0053] In other embodiments, the first connecting portion 210 can cover a portion of the third surface S3 of the body 110.

[0054] The first band portion 220 extends from the first connection portion 210 and covers a portion of the first surface S1, second surface S2, fifth surface S5, and sixth surface S6 of the body 110. The first band portion 220 can be used to further secure the first external electrode 200 to the body 110.

[0055] The first band section 220 may include a first sub-band section 221, a second sub-band section 222, a third sub-band section 223, and a fourth sub-band section 224.

[0056] The first subband portion 221 is a portion located on the first surface S1 of the body 110, and the second subband portion 222 is a portion located on the second surface S2 of the body 110. The first subband portion 221 and the second subband portion 222 can protrude in a direction parallel to the thickness direction (T-axis direction).

[0057] Furthermore, the third subband portion 223 is located on the fifth surface S5 of the body 110, and the fourth subband portion 224 is located on the sixth surface S6 of the body 110. The third subband portion 223 and the fourth subband portion 224 can protrude in a direction parallel to the width direction (W-axis direction).

[0058] The first subband section 221, the second subband section 222, the third subband section 223, and the fourth subband section 224 are connected to each other. In other words, the first subband section 221, the second subband section 222, the third subband section 223, and the fourth subband section 224 are connected along the first surface S1, the second surface S2, the fifth surface S5, and the sixth surface S6 of the body 110.

[0059] The first protrusion 230 is positioned on the first band portion 220 and is spaced apart from the first connecting portion 210. The first protrusion 230 can also be spaced apart from the side edge of the body 110 of the first band portion 220. For example, the first protrusion 230 can have a shape that protrudes between the side edge of the body 110 of the first band portion 220 and the first connecting portion 210.

[0060] Referring to Figure 10, when the extension line E of the third surface S3 of the body 110 does not pass through the first projection 230, the first projection 230 can be said to be "separated" from the first connection 210. In other words, when the first projection 230 is positioned further inward than the extension line E of the third surface S3 in the longitudinal direction (L-axis direction) of the body 110, the first projection 230 can be said to be "separated" from the first connection 210. In other words, when there is a gap between the outer surface of the first projection 230 on the third surface S3 side and the extension line E of the third surface S3, the first projection 230 can be said to be "separated" from the first connection 210.

[0061] Here, the extension line E of the third surface S3 can be defined based on an optical microscope or scanning electron microscope (SEM) image of the cross-section of the multilayer ceramic capacitor 1000 in the length direction (L direction) - thickness direction (T direction) at the center of the width direction (W direction). In the aforementioned cross-sectional image, seven straight lines P0, P1, P2, P3, P4, P5, and P6 are drawn parallel to the length direction (L direction) and have equal spacing in the thickness direction (T direction) from the first surface S1 to the second surface S2 of the body 110. The straight line passing through the point where P2 touches the third surface S3 and the point where P4 touches the third surface S3 can be defined as the extension line E of the third surface S3. The above explanation can also be applied to the relationship between the second protrusion 330 and the second connection 310, which will be described later.

[0062] The first projection 230 may include a first sub-projection 231, a second sub-projection 232, a third sub-projection 233, and a fourth sub-projection 234.

[0063] The first sub-projection 231 is positioned on the first sub-band section 221, and the second sub-projection 232 is positioned on the second sub-band section 222. The third sub-projection 233 is positioned on the third sub-band section 223, and the fourth sub-projection 234 is positioned on the fourth sub-band section 224. The first sub-projection 231, the second sub-projection 232, the third sub-projection 233, and the fourth sub-projection 234 are connected to each other. In other words, the first sub-projection 231, the second sub-projection 232, the third sub-projection 233, and the fourth sub-projection 234 are connected along the first sub-band section 221, the second sub-band section 222, the third sub-band section 223, and the fourth sub-band section 224.

[0064] The first corner portion 240 may be the portion that connects the first connecting portion 210 and the first band portion 220.

[0065] The second external electrode 300 includes a second connecting portion 310, a second band portion 320, a second protruding portion 330, and a second corner portion 340.

[0066] The second connection portion 310 covers the fourth surface S4 of the body 110 and is connected to a plurality of second internal electrodes 160, thereby being electrically coupled.

[0067] In other embodiments, the second connecting portion 310 can cover a portion of the fourth surface S4 of the body 110.

[0068] The second band portion 320 extends from the second connection portion 310 and covers a portion of the first surface S1, second surface S2, fifth surface S5, and sixth surface S6 of the body 110. The second band portion 320 can be used to further secure the second external electrode 300 to the body 110.

[0069] The second band section 320 may include a first sub-band section 321, a second sub-band section 322, a third sub-band section 323, and a fourth sub-band section 324.

[0070] The first subband portion 321 is located on the first surface S1 of the body 110, and the second subband portion 322 is located on the second surface S2 of the body 110. The third subband portion 323 is located on the fifth surface S5 of the body 110, and the fourth subband portion 324 is located on the sixth surface S6 of the body 110. The first subband portion 321, the second subband portion 322, the third subband portion 323, and the fourth subband portion 324 are connected to each other. In other words, the first subband portion 321, the second subband portion 322, the third subband portion 323, and the fourth subband portion 324 are connected along the first surface S1, the second surface S2, the fifth surface S5, and the sixth surface S6 of the body 110.

[0071] The second protrusion 330 is positioned on the second band portion 320 and is spaced apart from the second connecting portion 310. The second protrusion 330 can also be spaced apart from the side edge of the body 110 of the second band portion 320. For example, the second protrusion 330 can have a shape that protrudes between the side edge of the body 110 of the second band portion 320 and the second connecting portion 310.

[0072] The second projection 330 may include a first sub-projection 331, a second sub-projection 332, a third sub-projection 333, and a fourth sub-projection 334.

[0073] The first sub-projection 331 is positioned on the first sub-band section 321, and the second sub-projection 332 is positioned on the second sub-band section 322. The third sub-projection 333 is positioned on the third sub-band section 323, and the fourth sub-projection 334 is positioned on the fourth sub-band section 324. The first sub-projection 331, the second sub-projection 332, the third sub-projection 333, and the fourth sub-projection 334 are connected to each other. In other words, the first sub-projection 331, the second sub-projection 332, the third sub-projection 333, and the fourth sub-projection 334 are connected along the first sub-band section 321, the second sub-band section 322, the third sub-band section 323, and the fourth sub-band section 324.

[0074] The second corner portion 340 may be the portion that connects the second connecting portion 310 and the second band portion 320.

[0075] Based on an optical microscope or scanning electron microscope (SEM) photograph of the cross section in the length direction (L-axis direction) - thickness direction (T-axis direction) at the center of the width direction (W-axis direction) of the multilayer ceramic capacitor 1000, the first connection portion 210 and the second connection portion 310 of the multilayer ceramic capacitor 1000 shown in the aforementioned cross section photograph may have a shape approximately parallel to the thickness direction (T-axis direction), the first band portion 220 and the second band portion 320 may have a shape approximately parallel to the length direction (L-axis direction), and the first corner portion 240 and the second corner portion 340 may have a curved shape. The aforementioned curved shape may also be a curved shape having a tangent whose slope changes from a direction parallel to the thickness direction (T-axis direction) to a direction parallel to the length direction (L-axis direction) (or in the opposite direction).

[0076] The first external electrode 200 and the second external electrode 300 may include, but are not limited to, conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or alloys thereof.

[0077] As another example, the first external electrode 200 and the second external electrode 300 may include metal and glass. The metal may be a conductive metal including, for example, copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), or alloys thereof. The glass component included in the external electrode may be a composition of mixed oxides. The glass component may include, for example, silicon oxide, boron oxide, aluminum oxide, transition metal oxide, alkali metal oxide, alkaline earth metal oxide, or combinations thereof. Here, the transition metal may be selected from zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), or nickel (Ni); the alkali metal may be selected from lithium (Li), sodium (Na), or potassium (K); and the alkaline earth metal may be selected from magnesium (Mg), calcium (Ca), strontium (Sr), or barium (Ba). The method for forming such an external electrode is not particularly limited. For example, it can be formed by dipping the body into a conductive paste containing metal and glass, or by printing the conductive paste onto the surface of the body using screen printing or gravure printing. In addition, various methods can be used, such as coating the surface of the body with conductive paste or transferring a dried film of the conductive paste to a laminate.

[0078] On the other hand, the first external electrode 200 and the second external electrode 300 may be covered with a plating layer. The plating layer may include a nickel (Ni) plating layer, a copper (Cu) plating layer, a tin (Sn) plating layer, and the like. For example, the plating layers may be arranged in the order of a nickel (Ni) plating layer, a copper (Cu) plating layer, and a tin (Sn) plating layer from the surface of the external electrodes 200 and 300, but this embodiment is not limited to this.

[0079] Figure 11 is a schematic plan view showing a multilayer ceramic capacitor according to another embodiment, and Figure 12 is a schematic cross-sectional view of Figure 11.

[0080] Referring to Figures 11 and 12, the multilayer ceramic capacitor 2000 includes a body 1110, a first external electrode 1200, and a second external electrode 1300.

[0081] The body 1110 may include a plurality of dielectric layers 1140, a first internal electrode 1150, and a second internal electrode 1160.

[0082] The first external electrode 1200 includes a first connecting portion 1210, a first band portion 1220, and a first protruding portion 1230.

[0083] The first projection 1230 is positioned on the first band portion 1220 and spaced apart from the first connecting portion 1210. The first projection 1230 may also be positioned on the side edge of the body 1110 of the first band portion 1220. For example, the side edge of the body 1110 of the first projection 1230 may not be separated from the side edge of the body 1110 of the first band portion 1220.

[0084] The second external electrode 1300 includes a second connecting portion 1310, a second band portion 1320, and a second protruding portion 1330.

[0085] The second projection 1330 is positioned on the second band portion 1320 and is separated from the second connecting portion 1310. The second projection 1330 may also be positioned on the side edge of the body 1110 of the second band portion 1320. For example, the side edge of the body 1110 of the second projection 1330 may not be separated from the side edge of the body 1110 of the second band portion 1320.

[0086] The remaining components, excluding those mentioned above, are identical to or correspond to the components of the multilayer ceramic capacitor shown in Figure 1, so repeated explanations regarding them will be omitted.

[0087] Figure 13 is a schematic diagram showing the process of forming a coating layer on a multilayer ceramic capacitor according to the example, and Figure 14 is a schematic diagram showing the process of forming a coating layer on a multilayer ceramic capacitor according to the comparative example.

[0088] Referring to Figure 13, since the external electrode 200 of the multilayer ceramic capacitor according to this embodiment has a protrusion 230, the coating material 500 does not diffuse to the body 110. Therefore, according to this embodiment, the mooning phenomenon can be prevented.

[0089] In contrast, as shown in Figure 14, since the external electrode 200' of the multilayer ceramic capacitor in the comparative example does not have a protrusion, the coating material 500 may diffuse to the body 110', and a mooning phenomenon may occur in which the coating layer 600 is formed in an undesirable area.

[0090] As described above, embodiments of the present invention have been explained, but the present invention is not limited thereto, and can be implemented in various ways within the scope of the claims, description of the invention, and attached drawings, and these also naturally fall within the scope of the present invention. [Explanation of Symbols]

[0091] 1000: Multilayer ceramic capacitor 110: Body 200: 1st external electrode 210: First connection section 220: First Band 230: 1st protrusion 300: 2nd external electrode 310: Second connection section 320: 2nd Band 330:Second protrusion 140: Dielectric layer 143: First Cover Layer 145: Second Cover Layer 150: 1st internal electrode 160: 2nd internal electrode

Claims

1. It includes a first and second surface facing a first direction, a third and fourth surface facing a second direction intersecting the first direction, and a fifth and sixth surface facing a third direction that intersects the first and second directions simultaneously, A body comprising a plurality of dielectric layers stacked in the first direction and a plurality of internal electrodes, External electrodes positioned outside the body, Includes, The aforementioned external electrode is A connection portion connected to the plurality of internal electrodes, A band portion connected to the connecting portion and covering a portion of the first surface, second surface, fifth surface, and sixth surface, A protrusion is provided which is spaced apart from the connecting portion and is positioned on the band portion on the first, second, fifth, and sixth surfaces, Multilayer ceramic capacitors, including those mentioned above.

2. The multilayer ceramic capacitor according to claim 1, wherein the protruding portion is separated from the side edge of the body of the band portion.

3. The multilayer ceramic capacitor according to claim 1, wherein the protruding portion is arranged on the side edge of the body of the band portion.

4. The aforementioned band portion is The first subband portion on the first surface, The second subband portion on the second surface, The third subband portion on the fifth surface, The fourth subband portion on the sixth surface, Includes, The aforementioned protrusion is A first sub-projection is disposed on the first sub-band portion, A second sub-projection is disposed on the second sub-band portion, A third sub-projection is disposed on the third sub-band portion, A fourth sub-projection is disposed on the fourth sub-band portion, Includes, The multilayer ceramic capacitor according to claim 1, wherein the first sub-protrusion, the second sub-protrusion, the third sub-protrusion, and the fourth sub-protrusion are connected to each other.

5. The multilayer ceramic capacitor according to claim 4, wherein the first sub-protrusion and the second sub-protrusion protrude in a direction parallel to the first direction.

6. The multilayer ceramic capacitor according to claim 4, wherein the third sub-protrusion and the fourth sub-protrusion protrude in a direction parallel to the third direction.

7. The multilayer ceramic capacitor according to claim 1, wherein the external electrode further includes a corner portion that connects the connection portion and the band portion.

8. The aforementioned plurality of internal electrodes are The multilayer ceramic capacitor according to claim 1, comprising a plurality of first internal electrodes and a plurality of second internal electrodes arranged offset from each other in the first direction.

9. The aforementioned external electrode is A first external electrode is arranged on the third surface and connected to the plurality of first internal electrodes, A second external electrode is arranged on the fourth surface and connected to the plurality of second internal electrodes, The multilayer ceramic capacitor according to claim 8, including the above.

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