System and method for determining hole properties

Abstract

This invention provides a system and method for determining the hole characteristics of a hole. [Solution] The system for determining the hole characteristics of a hole includes a measuring tool and a controller. The measuring tool is configured to measure the hole and generate data representing the hole. The controller communicates with the measuring tool and is configured to determine at least one hole characteristic based on the data from the measuring tool.

Description

Technical Field

[0001] Claim of Priority This application claims priority based on U.S. Patent Application No. 63 / 718,799 filed on November 11, 2024, the entire content of which is incorporated herein by reference.

[0002] This disclosure generally relates to manufacturing and inspection, and more particularly to systems and methods for determining the hole characteristics of holes formed through manufactured parts.

Background Art

[0003] Parts manufactured from laminated structures of material layers such as composite materials, metallic materials, or polymeric materials are often fixed together using fasteners that extend through holes aligned with the material layers. However, such material laminates can exhibit misaligned holes, gaps in the interface regions, or other inconsistencies. Such inconsistencies may be small, but depending on the field of use of the resulting part, even small inconsistencies may be outside the allowable range. For example, in aerospace parts, particularly strict tolerances may be provided. Therefore, it may be desirable to identify and address such inconsistencies. Unfortunately, identifying such inconsistencies and determining the hole characteristics of the holes remains a complex and time-consuming task. Accordingly, those skilled in the art continue to make research and development efforts in the field of inspection and analysis during the manufacturing and assembly of parts.

Summary of the Invention

Means for Solving the Problems

[0004] Examples of a system for determining hole characteristics of a hole, a measurement tool for measuring a hole, and a method for determining hole characteristics of a hole are disclosed. The following is a non-exhaustive list of examples of the subject matter according to this disclosure, some of which are claimed and some of which are not.

[0005] In one example, the disclosed system includes a measuring tool and a controller. The measuring tool is configured to measure a hole and generate data representing the hole. The controller communicates with the measuring tool and is configured to determine at least one hole characteristic based on the data from the measuring tool.

[0006] In another example, the disclosed measuring tool includes a housing, a collet, an optical probe, a linear drive, and a rotary drive. The collet is coupled to the housing and configured to engage with a portion of the hole. The optical probe extends through the collet into the hole, scans the hole walls, and generates data representing the hole walls. The linear drive positions the optical probe along the scanning axis. The rotary drive positions the optical probe about the scanning axis.

[0007] In one example, the disclosed method includes (1) extending an optical probe into a hole along a scanning axis; (2) rotating the optical probe within the hole about the scanning axis; (3) scanning the walls of the hole; (4) generating data representing the walls of the hole; and (5) determining at least one of a plurality of hole characteristics based on the data.

[0008] Other examples of systems, measuring tools, and methods will become apparent from the following detailed description, accompanying drawings, and accompanying claims. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic block diagram of an example of a system for determining the hole characteristics of a hole. [Figure 2] This is a flowchart illustrating one example of a method for determining the hole characteristics. [Figure 3] This is a schematic diagram of an example system. [Figure 4] This is a schematic diagram of an example of a system measurement tool. [Figure 5] This is a schematic diagram showing an example of a measuring tool's probe drive in the retracted position. [Figure 6] This is a schematic diagram illustrating an example of a measuring tool's probe drive being in an extended state. [Figure 7] This is a schematic diagram of one example of a probe drive. [Figure 8] This is a schematic diagram of one example of a probe drive. [Figure 9] This is a schematic exploded perspective view of one example of a measurement tool. [Figure 10] This is a schematic cross-sectional view of an example of a measuring tool. [Figure 11] This is a schematic diagram illustrating an example of how a measuring tool interacts with a hole. [Figure 12] This is a schematic diagram showing an example of multiple interchangeable collets for a measuring tool. [Figure 13] This is a schematic diagram of an example system. [Figure 14] This is a point cloud diagram generated based on data collected by the system. [Figure 15] This is a schematic diagram of an example of a pore with a gap at the interface. [Figure 16] This is a schematic diagram of an example of a hole with an offset. [Figure 17] This is a schematic diagram of an example of a pore with debris at its interface. [Figure 18] This is a schematic diagram of an example of a hole with a sealant at the interface. [Figure 19] This is a schematic diagram of an example of a pore with debris at its interface. [Figure 20] This is a flowchart illustrating an example of a dynamic start origin method. [Figure 21] This is a flowchart illustrating one example of a coordinate resolution method. [Figure 22] This is a schematic diagram of an example aircraft. [Figure 23] This is a flowchart illustrating an example of an aircraft manufacturing and maintenance procedure. [Modes for carrying out the invention]

[0010] Referring to FIGS. 1 through 21, by way of example, the present disclosure relates to a system 100, a measurement tool 102, and a method 1000 for determining hole characteristics 200 of a hole 300 formed through a component 310. The component 310 generally includes a laminated structure of materials. As described in more detail herein, examples of the system 100, the measurement tool 102, and the method 1000 utilize an insertable probe that measures the surface of the wall 302 of the hole 300 to determine various hole characteristics 200 of the hole 300. The techniques provided by the system 100, the measurement tool 102, and the method 1000 enable the determination of the hole characteristics 200 of the hole 300 and the identification of inconsistencies to be performed reliably and automatically in a substantially shorter period compared to manual measurement and inspection systems and methods. In one or more examples, the techniques provided by the system 100, the measurement tool 102, and the method 1000 can correct for the influence of environmental conditions 252 on the measured values of the hole.

[0011] Figure 1 schematically shows an example of a manufacturing environment 250 in which the system 100, measuring tool 102, and method 1000 are implemented to determine one or more of the hole characteristics 200 of a hole 300 formed through a part 310. Figure 11 schematically shows an example of the interaction between the part 310 and the measuring tool 102 and the hole 300. Figures 15 to 19 schematically show various example parts 310, showing holes 300 having various example hole characteristics 200 identified using the system 100, the measuring tool 102, and / or method 1000. The part 310 includes multiple components assembled and joined to each other using mechanical fasteners (e.g., bolts, rivets, etc.) mounted through the hole 300 (fasteners are not shown). In a descriptive example, the part 310 includes a first component 312 and a second component 314 that are positioned (e.g., stacked) and fastened to each other. The first component 312 has at least one first hole 304 having a first wall 316. The second component 314 has at least one second hole 306 having a second wall 318. The first hole 304 and the second hole 306 are aligned to form a hole 300 (for example, the first hole 304 and the second hole 306 are combined to form a hole 300, and the first wall 316 and the second wall 318 are combined to form a wall 302). Although the example of part 310 is shown as having two components, in other examples part 310 may include any number of feasible components, each having a hole that is aligned with a hole in a directly adjacent component. The various parts described herein can be manufactured from composite parts, metal parts, polymer parts, or combinations thereof.

[0012] In various examples disclosed herein, the measurements of the holes 300 and the hole characteristics of the holes 300 can be measurements of holes within a single component, holes within two components (e.g., a stack), such as holes formed by two aligned holes, or holes within any number of two or more components (e.g., a stack), such as holes formed by any number of two or more aligned holes. As an example, the system 100 and method 1000 can be used to measure and characterize holes 300 at major joints having more than two material layers.

[0013] Referring now to FIGS. 1 and 3-19, the following is an example of a system 100 according to the present disclosure. The example of the system 100 includes several elements, features, and components. Not all of the elements, features, and / or components described or illustrated in an example are required in that example. Some or all of the elements, features, and / or components described or illustrated in an example can be combined in various ways with other examples and other elements, features, and / or components described in those other examples without necessarily including them, although one or more such combinations are not explicitly described or illustrated as examples herein.

[0014] As shown in Figures 1, 3-7 and 13, in one or more examples, the system 100 includes a measuring tool 102 and a controller 104. The measuring tool 102 is configured to measure a hole 300 and generate data representing the hole 300, more specifically data representing the wall 302 of the hole 300. The controller 104 communicates with the measuring tool 102. The controller 104 is configured to determine at least one hole characteristic 200 based on the data 110 from the measuring tool 102. The system 100 is operable to measure and inspect the hole 300 of the part 310 and determine the hole characteristic 200 of the hole 300. In one or more examples, the system 100 is operable to compensate for the effects of various environmental conditions 252. The controller 104 is configured to perform various operational functions corresponding to the data processing and analysis steps of method 1000 (e.g., adapt or program) (Figures 2, 20 and 21).

[0015] As shown in Figures 1, 3, 4, and 13, in one or more examples, the measurement tool 102 includes an optical probe 114 and a probe drive 116. The optical probe 114 is configured to be positioned within the hole 300. The optical probe 114 is configured to scan the walls 302 of the hole 300, more specifically, the first wall 316 of the first hole 304 and the second wall 318 of the second hole 306. The optical probe 114 is configured to generate data 110 representing the hole 300 (e.g., at least a portion of the walls 302 of the hole 300). The probe drive 116 is configured to translate and rotate the optical probe 114 within the hole 300. In these examples, by simultaneously performing the linear and rotational motion of the optical probe 114 with the probe drive 116, it is possible to easily scan any portion of the hole 300 or the entire hole 300 in a single stroke of extending and retracting the optical probe 114, thereby reducing the measurement cycle time. By performing multiple strokes to extend and retract the optical probe 114, the amount of measurement data can be increased, thereby improving accuracy.

[0016] As shown in Figures 1, 4, and 7, in one or more examples, the probe drive 116 includes a linear drive 132 and a rotary drive 134. The linear drive 132 positions the optical probe 114 along the scanning axis 130. The rotary drive 134 positions the optical probe 114 about the scanning axis 130. As an example, the linear drive 132 extends the optical probe 114 into the hole 300, and the rotary drive 134 rotates the optical probe 114 within the hole 300 to measure the wall 302 of the hole 300. By rotating the optical probe 114 while adjusting its depth-direction position within the hole 300, it becomes possible to scan the wall 302 of the hole 300 360 degrees in a single stroke of the optical probe 114 (e.g., extending and retracting). In one or more examples, the probe drive 116 is configured to adjust the depth-direction position of the optical probe 114 (e.g., position along the depth or length of the hole 300). During the measurement of hole 300, measurements of the wall 302 of hole 300 are performed at each of several positions in the depth direction.

[0017] As shown in Figure 1, in one or more examples, the optical probe 114 includes or takes the form of a laser interferometer 120. In one or more examples, the optical probe 114 includes an optical fiber probe used for low-coherence interferometry (LCI). In one or more examples, the optical probe 114 is configured to emit optical energy and direct that optical energy toward the wall 302 of the hole 300. In one or more examples, the optical probe 114 performs a scanning operation of the wall 302 of the hole 300 (e.g., LCI scanning) as it extends and / or retracts within the hole 300 by a linear drive 132 and rotates within the hole 300 by a rotary drive 134 to acquire data 110 representing the wall 302 of the hole 300. In one or more examples, the optical probe 114 acts as a conduit for optical energy, such as an optical fiber, and optical energy enters and leaves the controller 104 (e.g., via one or more umbilical codes 106) for measurement and analysis by the controller 104.

[0018] As shown in Figures 1, 3, and 13, in one or more examples, the controller 104 receives data 110 from the optical probe 114. In one or more examples, the data 110 is stored in memory 194. The data 110 is used by the controller 104 to generate a three-dimensional point cloud 150 (e.g., a digital 3D model) representing the hole 300. In one or more examples, the controller 104 is configured to determine various characteristics and / or parameters of the hole 300 and / or wall 302, referred herein to as hole characteristics 200, based on the data 110. In one or more examples, the controller 104 includes a processor 192, memory 194, and program code 196 stored in memory 194. In one or more examples, the controller 104 is implemented as a custom circuit, as a hardware processor that executes program instructions stored in memory, or as some combination thereof.

[0019] As shown in Figures 1 and 14, in one or more examples, the controller 104 is configured, fitted, or programmed to generate a three-dimensional point cloud 150 based on data 110 provided by the measuring tool 102. The three-dimensional point cloud 150 includes XYZ coordinates 152 and reflectance 154 for at least a portion of the wall 302 of the hole 300. In one or more examples, the controller 104 is configured, fitted, or programmed to process and analyze the three-dimensional point cloud 150 to determine one or more of the hole characteristics 200. In one or more examples, the three-dimensional point cloud 150 includes XYZ coordinates 152 and reflectance 154 for at least a portion of the collet 118 positioned within the hole 300. In these examples, the controller 104 is configured, fitted, or programmed to perform a transformation of the three-dimensional point cloud 150 with a known geometric shape (e.g., model 156) of the collet 118. The controller 104 is configured, adapted, or programmed to determine at least one of the hole characteristics 200 based on the three-dimensional point cloud 150 to fit the model 156 of the collet 118.

[0020] Figure 14 shows an example of a three-dimensional point cloud 150 generated by the controller 104 using data 110 provided by a measurement tool 102 (e.g., an optical probe 114). In one or more examples, the three-dimensional point cloud 150 includes multiple data points, each data point including XYZ coordinates 152 and reflectance 154 representing a point on the wall 302. In the illustrated example, the three-dimensional point cloud 150 represents the first hole 304 of the first component 312, the second hole 306 of the second component 314, and the interface 320 between the first component 312 and the second component 314. The data points of the three-dimensional point cloud 150 are processed and analyzed by the controller 104 to determine various hole characteristics 200. In one or more examples, the three-dimensional point cloud 150 also includes data points, each data point including XYZ coordinates 152 and reflectance 154 representing a point on the inner surface of the collet 118.

[0021] As shown in Figures 1 and 3, in one or more examples, the system 100 includes a user interface 108. The user interface 108 communicates with a controller 104 (e.g., wirelessly or via a wired connection). The user interface 108 is configured to visually display at least one of the hole characteristics 200. In one or more examples, the controller 104 is configured to generate a report based on the analysis of the data 110 and / or the three-dimensional point cloud 150. The report shows various hole characteristics 200 and is displayed to the operator using the user interface 108. In one or more examples, the user interface 108 displays a visual representation of the hole 300 (e.g., the three-dimensional point cloud 150 shown in Figure 14).

[0022] As shown in Figures 1 and 4-8, in one or more examples, the linear drive 132 includes at least one of a motor 142, a transmission 144, a pair of limiting switches 146, and an encoder 148. The transmission 144 transmits motion from the motor 142 to the optical probe 114. The pair of limiting switches 146 limit the linear motion of the optical probe 114 along the scanning axis 130. The encoder 148 measures the linear position of the optical probe 114 along the scanning axis 130.

[0023] As shown in Figures 5 to 8, in one or more examples, the motor 142 includes one of the following: a direct current (DC) motor, a linear actuator, or another device configured to drive the optical probe 114 from the measuring tool 102 into the hole 300 of the part 310 and to position the optical probe 114 along the scanning axis 130. In one or more examples, during inspection of the hole 300, the optical probe 114 extends outward through the barrel and collet 118 of the housing 112. The transmission 144 is coupled to the motor 142 by a flexible coupling or the like. In one or more examples, the transmission 144 includes a worm drive, lead screw, or other mechanism configured to transmit motion from the motor 142 to the optical probe 114. In one or more examples, the rotary drive 134 is coupled to the linear drive 132 by a linear rail and carriage or the like. In these examples, the linear drive 132 is configured to move the rotary drive 134 linearly (e.g., translationally) along the scanning axis 130 (e.g., as shown in Figures 5 and 6). In one or more examples, the optical probe 114 is coupled to the rotary drive 134. In one or more examples, the rotary drive 134 is configured to rotate the optical probe 114 about the scanning axis 130 (e.g., as shown in Figure 6). In one or more examples, the rotary drive 134 and the optical probe 114 are integrated into a single functional component, such as the rotary probe commercially available from Novacam Technologies Inc. in Quebec, Canada. In one or more examples, the limit switch 146 is a magnetic proximity switch that detects the linear position of the optical probe 114 or the linear drive 132. In one or more examples, the limit switch 146 provides a signal to the controller 104 indicating that the linear drive 132 or the optical probe 114 has reached its extension or retraction limit. In one or more examples, the encoder 148 includes, or takes the form of, a magnetic encoder (such as a Renishaw magnetic encoder) that detects changes in the magnetic field of the scale to determine the position and motion of the optical probe 114.

[0024] As shown in Figures 1, 4 and 9-11, in one or more examples the measuring tool 102 includes a housing 112. In one or more examples the measuring tool 102 takes the form of a hand tool configured to be operated by a technician. In one or more examples the housing 112 includes a barrel and a handle. In one or more examples the measuring tool 102 includes a collet 118. The collet 118 is coupled to the housing 112. The collet 118 is configured to selectively engage and disengage a portion of the hole 300. While using the measuring tool 102 to scan the hole 300, the optical probe 114 extends through the collet 118. In one or more examples the collet 118 is configured to expand radially to contact and engage with the wall 302 of the hole 300 when it is inserted into the hole 300. As the collet 118 expands radially, the measuring tool 102 is fixed in place within the hole 300, while the optical probe 114 extends and retracts within the hole 300 to scan the wall 302 of the hole 300. As the collet 118 contracts radially, the measuring tool 102 is released from the hole 300.

[0025] In other examples, the measuring tool 102 is incorporated into the end effector of a fully automated or partially automated robot (e.g., a cobot). In these examples, the measuring tool 102 includes substantially the same operating components as those described and illustrated herein.

[0026] As shown in Figure 4, in one or more examples, the measuring tool 102 includes a trigger 172 located on the handle of the housing 112. The trigger 172 enables the operation and control of the measuring tool 102, such as the control of the optical probe 114, the probe drive 116, and the collet 118. In one or more examples, the trigger 172 includes two or more triggers or switches that control individual operating components, features, or functions of the measuring tool 102. In one or more examples, the measuring tool 102 includes one or more ports 174 configured to connect to the umbilical cord 106. In one or more examples, pressing the trigger 172 (e.g., the first trigger or switch) is configured to activate or activate an actuator 126 that extends the mandrel 124 and extends the collet 118 into the hole 300. This causes the collet 118 to grip the hole 300. In one or more examples, the mandrel 124 is biased to a retracted position by an internal spring or the like. In these examples, releasing the trigger 172 allows the mandrel 124 to return to its retracted position, thereby retracting the collet 118. In one or more examples, pressing the trigger 172 (e.g., a second trigger or switch) is configured to activate the probe drive 116, which extends the optical probe 114 into the hole 300, rotates the optical probe 114 within the hole 300, and emits optical energy to scan the wall 302 of the hole 300.

[0027] As shown in Figures 1, 9, and 10, in one or more examples, the measuring tool 102 includes at least one of a sleeve 122, a mandrel 124, and an actuator 126. The sleeve 122 connects the collet 118 to the housing 112. In one or more examples, the sleeve 122 provides a threaded connection of the measuring tool 102 to the housing 112. In one or more examples, the sleeve 122 includes a hollow tubular body. When the sleeve 122 is connected to the housing 112, the sleeve 122 is configured to clamp and secure the collet 118 to the housing 112 inside the tubular body of the sleeve 122. The mandrel 124 moves linearly relative to the collet 118 to extend it (for example, is configured to move). The actuator 126 positions the mandrel 124 relative to the collet 118. In these examples, extending the mandrel 124 radially expands the collet 118 (e.g., increases the diameter of the collet 118), and retracting the mandrel 124 radially contracts the collet 118 (e.g., returns the collet 118 to its unexpanded state). In one or more examples, the actuator 126 includes an actuator housing coupled to the housing 112 of the measuring tool 102. In one or more examples, the actuator 126 includes a piston (e.g., a pneumatic piston) located within the actuator housing. In these examples, the mandrel 124 is coupled to the piston. In one or more examples, the actuator 126 also includes a spring and a spring preload lock nut that transmit motion from the piston to the extended portion of the mandrel 124 to radially expand the collet 118, and bias the mandrel 124 back to the retracted position to radially contract the collet 118 (e.g., automatically return).

[0028] As shown in Figure 11, in one or more examples, a portion of the collet 118 is inserted into the hole 300 while the measuring tool 102 is operating to measure the hole 300. In one or more examples, the sleeve 122 is configured to contact the surface of the first component 312 surrounding the hole 300.

[0029] As shown in Figures 9 and 12, in one or more examples, the collet 118 includes a body 136 and a slit 138 extending for part of the length of the body 136. The body 136 is tubular and tapered. The tubular body 136 can be expanded by the slit 138 as the mandrel 124 moves into the tapered portion of the body 136. In one or more examples, the measuring tool 102 includes a plurality of collets 128. Each of the plurality of collets 128 is configured to be interchangeably coupled to the housing 112. In one or more examples, each of the plurality of collets 128 includes a different geometric shape or contraction diameter depending on the hole 300 having a different diameter.

[0030] As shown in Figures 3 and 13, in one or more examples, the measuring tool 102 is coupled to and communicates with a controller 104 via a plurality of umblical codes 106. In one or more examples, the controller 104 includes a cart (or takes the form of a cart) 162 coupled to the measuring tool 102 by the umblical codes 106. In these examples, the system 100 includes one or more of a pressure system, a power system, and / or a communication system, which are housed in the cart and controlled by the controller 104. Thus, in these examples, power, pressure (e.g., pneumatic), and commands (e.g., instructions) are transmitted to the measuring tool 102 via the umblical codes 106. In other examples, wireless communication technologies, such as wireless networking or protocols for Bluetooth® communication, may be implemented to facilitate communication between the measuring tool 102 and the controller 104.

[0031] As shown in Figure 13, in one or more examples, connecting the measuring tool 102 to the cart 162 via the umblical code 106 helps reduce the volume of the measuring tool 102 and allows other functional components of system 100, such as the server 164 (Figure 14), a pressure system (e.g., via the compressed air line 166), a power supply (e.g., via the power line 168), and / or other components, to be incorporated into the cart 162. In one or more examples, the controller 104 receives power via the power line 168. In one or more examples, the controller 104 is pneumatically connected to a pressurized air supply source (e.g., store air) via the compressed air line 166. In one or more examples, the umblical code 106 includes the compressed air line 166 that provides pneumatic pressure, the power line 168 that provides power, and one or more data lines 188 that provide input / output (I / O) instructions and / or exchange data with the programmable logic controller 182. In one or more examples, the umblical code 106 includes an optical fiber line 186 for transmitting optical energy between the interferometer 184 and the measuring tool 102 (e.g., an optical probe 114). In one or more examples, the umblical code 106 includes a data line 188 for transmitting scale data between the interferometer 184 and the measuring tool 102 (e.g., an encoder 148). In one or more examples, the umblical code 106 includes a data line 188 for transmitting rotational control between the rotation controller 176 and the measuring tool 102 (e.g., a rotary drive 134).

[0032] In one or more examples, the controller 104 includes a data processing system (e.g., a computer), which may take the form of a server 164 or other suitable computing device. In one or more examples, the controller 104 includes a display (e.g., a screen, touchscreen, etc.). In other examples, the user interface 108 may take the form of a tablet computer or other mobile device incorporating a display. In one or more examples, the server 164 processes input from the interferometer 184 via data lines (e.g., data 110) to determine measurements and correlates the measurements with data received from the programmable logic controller 182 via data lines.

[0033] As shown in Figures 1 and 15-19, in one or more examples, one or more of the hole characteristics 200 are determined based on data 110 (e.g., a three-dimensional point cloud 150) representing the hole 300. In one or more examples, the hole characteristics 200 include at least one of the following: the diameter 202 of the hole 300, the offset 206 of the hole 300, the gap 322 of the interface 320 of the hole 300, the length 208 of the hole 300 (e.g., the depth), the straightness 212 of the hole 300 (e.g., based on the center hole angle), the orientation 214 of the hole 300 (e.g., based on the center hole angle), the smoothness 216 of the hole 300, the debris 326 of the interface 320 of the hole 300, and the sealant 324 of the interface 320 of the hole 300. In other examples, the hole characteristics 200 also include at least one of the following: the diameter of the countersunk hole located at one end of the hole 300, the center hole angle of the countersunk hole (e.g., straightness), and the depth of the countersunk hole (e.g., length) (e.g., in the inlet or outlet layer of the part 310).

[0034] In one or more examples, the optical probe 114 is inserted into the hole 300 and moves linearly along the scanning axis 130 and rotated around the scanning axis 130 to scan or measure the wall 302 of the hole 300 at multiple depth-direction positions. In one or more examples, the optical probe 114 measures distances (e.g., distance to the wall 302 of the hole 300 and / or distance to the inner surface of the collet 118) at each of the multiple depth-direction positions. In one or more examples, these distances are expressed as XYZ coordinates 152 (e.g., points on the wall 302 of the hole 300 and / or points on the inner surface of the collet 118). In one or more examples, the optical probe 114 also measures reflectance 154 at each of the multiple depth-direction positions (e.g., points on the wall 302 of the hole 300 and / or points on the inner surface of the collet 118).

[0035] Figure 15 schematically shows an example of a part 310 in which a gap 322 exists at the interface 320 between a first component 312 and a second component 314 (for example, the interface between a first hole 304 and a second hole 306). As used herein, an interface gap (interface gap) includes any space at the interface between two or more components of a part. Depending on the part 310, a gap 322 (for example, an interference gap) may not be present at the interface 320. In one or more examples, the thickness of the gap 322 is uniform or tapered within the hole 300. In one or more examples, when any one of the depth-direction positions of the gap 322 is reached, the measurement by the optical probe 114 deviates from the measurement obtained at other depth-direction positions of the wall 302 of the hole 300.

[0036] Figure 16 schematically shows an example of a part 310 in which an offset 206 exists between a first hole 304 and a second hole 306 (for example, between the first central hole axis of the first hole 304 and the second central hole axis of the second hole 306). As used herein, the offset includes any non-coaxial relationship or any misalignment between the first central hole axis of the first hole 304 and the second central hole axis of the second hole 306, or a situation in which the interface of either component extends beyond the boundary of the wall 302 of the hole 300 when viewed along the hole axis of the hole 300. In some parts 310, there may be no offset 206 between the holes forming the hole 300. In one or more examples, the presence of an offset 206 can be indicated if a measurement from the optical probe 114 at one or more depth-direction positions of the wall 302 of the hole 300 deviates from a measurement obtained at other depth-direction positions of the wall 302 of the hole 300.

[0037] Figures 17 and 19 schematically illustrate an example of a component 310 in which debris 326 (e.g., FOD: foreign object) is present at the interface 320 of the hole 300. In some component 310, debris 326 may not be present at the interface 320. In one or more examples, thresholding can be performed on the measured values ​​to infer the presence of debris 326. If the measured value exceeds the threshold, this may indicate the presence of debris 326. These operations can be performed based on a comparison between the actual measured value from the optical probe 114 and the expected measured value. Examples of debris 326 may include burrs at the interface 320 (e.g., Figure 17), chips trapped at the interface 320 (e.g., Figure 19), or other FOD at the interface 320.

[0038] Figure 18 schematically shows an example of a part 310 in which sealant 324 is present at the interface 320 of a hole 300. In some parts 310, sealant 324 may not be present at the interface 320. In one or more examples, thresholding can be performed on the measured values ​​to infer the presence of sealant 324. If the measured value exceeds the threshold, this may indicate the presence of sealant 324. These operations can be performed based on a comparison between the actual measured value from the optical probe 114 and the expected measured value. An example of sealant 324 is a bonding sealant applied between the mating surfaces of the components of part 310. In some examples, some of the sealant 324 may not reach the hole 300. In other examples, some of the sealant 324 may penetrate into the hole 300.

[0039] Referring to Figures 1 and 3-19, as an example, this disclosure also relates to a measuring tool 102 for measuring a hole 300. The following are examples of the measuring tool 102 according to this disclosure. In one or more examples, the measuring tool 102 is implemented using or forms part of a system 100 (Figures 1, 3 and 13). Examples of the measuring tool 102 include several elements, steps, actions, or processes. Not all elements, steps, actions, or processes described or illustrated in an example are required in that example. Some or all of the elements, steps, actions, and / or processes described or illustrated in an example can be combined with other examples in various ways without requiring the inclusion of other elements, steps, actions, and / or processes described in those other examples, but one or more such combinations are not expressly described or illustrated by examples herein.

[0040] As shown in Figures 1 and 3-13, in one or more examples, the measuring tool 102 includes a housing 112, a collet 118, an optical probe 114, a linear drive 132, and a rotary drive 134. The collet 118 is coupled to the housing 112 and configured to engage with a portion of the hole 300. The optical probe 114 is configured to extend into the hole 300 through the collet 118. The optical probe 114 is configured to scan the wall 302 of the hole 300. The optical probe 114 is configured to generate data 110 representing the wall 302 of the hole 300. The linear drive 132 positions the optical probe 114 along the scanning axis 130. The rotary drive 134 positions the optical probe 114 about the scanning axis 130. In one or more examples, the measuring tool 102 includes an actuator 126, a mandrel 124, a sleeve 122, a trigger 172, a port 174, a motor 142, a transmission 144, a limiting switch 146, an encoder 148, and one or more of any other functional components, elements, or features described herein and shown with reference to system 100.

[0041] Referring to Figure 2, as an example, the Disclosure further relates to a method 1000 for determining the hole characteristics 200 of a hole 300. The following are examples of the method 1000 according to the Disclosure. In one or more examples, the method 1000 is carried out using a system 100 and / or measuring tool 102 (Figure 1). An example of the method 1000 includes several elements, steps, actions, or processes. Not all elements, steps, actions, or processes described or illustrated in an example are required in that example. Some or all elements, steps, actions, and / or processes described or illustrated in an example can be combined with other examples in various ways without requiring the inclusion of other elements, steps, actions, and / or processes described in those other examples, but one or more such combinations are not expressly described or illustrated by examples herein.

[0042] In one or more examples, Method 1000 includes the step (1002) of positioning a portion of the collet 118 within the hole 300. In one or more examples, Method 1000 includes the step (1004) of extending the collet 118. In one or more examples, Method 1000 includes the step (1006) of engaging the wall 302 of the hole 300 with the collet 118. In one or more examples, Method 1000 includes the step (1008) of extending and / or retracting the optical probe 114 into the hole 300 along the scanning axis 130. Method 1000 includes the step (1010) of rotating the optical probe 114 within the hole 300 about the scanning axis 130. In one or more examples, the stretching and / or retracting steps (1008) and the rotating steps (1010) are performed simultaneously, sequentially, or intermittently, depending on the portion of the wall 302 of the hole 300 being measured and / or the amount of measurement to be obtained. In one or more examples, method 1000 includes a step (1012) of scanning the wall 302 of the hole 300. In one or more examples, method 1000 includes a step 1014 of scanning a portion of the collet 118 positioned within the hole 300. In one or more examples, the scanning step 1014 includes performing laser interferometry. In one or more examples, method 1000 includes a step 1016 of generating data 110. In one or more examples, the data 110 includes data representing the wall 302 of the hole 300. In one or more examples, the data 110 includes data representing the inner surface of the collet 118. In one or more examples, method 1000 includes a step 1018 of filtering a portion of the data 110 to remove outlier data points or noise. In one or more examples, method 1000 includes a step (1020) of processing the data 110. In one or more examples, the step (1020) of processing the data 110 includes a step of generating a three-dimensional point cloud 150. In one or more examples, method 1000 includes a step (1022) of processing the hole 300 using the data 110. In these examples, the data 110 is used to generate a three-dimensional point cloud 150, which includes the XYZ coordinates 152 and reflectance 154 of the wall 302 of the hole 300.In one or more examples, method 1000 includes the step of processing the collet 118 using data 110. In these examples, data 110 is used to generate a three-dimensional point cloud 150, which includes the XYZ coordinates 152 and reflectance 154 of the inner surface of the collet 118. In one or more examples, method 1000 includes a correction step (1026) for the environment (e.g., environmental conditions 252). In these examples, the three-dimensional point cloud 150 is transformed or modified using a known geometric shape of the collet 118 (e.g., model 156). In one or more examples, method 1000 includes the step (1028) of determining at least one of the hole characteristics 200 based on data 110.

[0043] In one or more examples, according to method 1000, the determining step (1028) includes determining at least one of the following: the diameter 202 of the hole 300, the offset 206 of the hole 300, the gap 322 of the interface 320 of the hole 300, the length 208 of the hole 300, the straightness 212 of the hole, the orientation 214 of the hole, the smoothness 216 of the hole 300, the debris 326 of the interface 320, and the sealant 324 of the interface 320.

[0044] In one or more examples, the step of correcting for environmental conditions 252 (1026) involves obtaining the measured diameter of the collet 118 and subtracting the known diameter of the collet 118 to obtain a diameter offset. This diameter offset is subtracted from the measured diameter of the hole 300, as determined by method 1000. In these examples, the obtained diameter is used as the compensated diameter of the hole 300. In some cases, various environmental conditions such as temperature, humidity, and atmospheric pressure may affect the measurement results (e.g., data) of the optical probe 114. This correcting step takes into account environmental variations and substantially zeros the measurement using the collet 118 each time the system 100 is used for hole measurement.

[0045] In one or more examples, according to method 1000, the step of processing data 110 (1020), such as the step of processing a hole (1022) and / or the step of processing a collet 118 (1024), includes the step of performing a dynamic start origin motion and the step of further performing a coordinate resolution motion.

[0046] In one or more examples, the test method includes the step of capturing a three-dimensional point cloud 150 containing the XYZ coordinates 152 and reflection intensity 154 of a multilayer stack in order to determine a lateral mismatch (e.g., offset 206) between the center of a first hole 304 and the center of a second hole 306. In one or more examples, the diameter 202 of the hole 300 is determined. In one or more examples, the presence of a gap 322 is determined. In one or more examples, method 1000 utilizes a dynamic start origin method 2000 and a coordinate resolution method 3000. In one or more examples, the dynamic start origin method 2000 is implemented using an algorithm embodied by a dynamic start origin module 362 stored in memory 194 and executed by the processor 192 of the controller 104. In one or more examples, the coordinate resolution method 3000 is implemented using an algorithm embodied by a coordinate solver module 364 stored in memory 194 and executed by the processor 192 of the controller 104.

[0047] Generally, the dynamic start origin method 2000 is used to obtain rough estimates of the cylinders of the first layer (e.g., upper) and the second layer (e.g., lower), representing the first hole 304 and the second hole 306. After obtaining these rough estimates, the coordinate solving method 3000 is used to determine the cylinder that best fits the given three-dimensional point cloud 150. The importance of the dynamic start origin method 2000 lies in the presence of significant artifacts in the point cloud. These artifacts, namely radially extending collets 118, provide relatively strong features that interfere with the features of the hole 300. This makes it possible to preserve the artifacts without affecting the result processing. Furthermore, by finding the interface, diameter, and rough X / Y origin of each layer, the time required for the coordinate solver to function is significantly reduced, resulting in a significant reduction in processing time. In the dynamic start origin method 2000, the cylinder is divided into several sections. The section creates a smaller cylinder, and for each section, the average X, Y, Z, radius, and intensity values ​​are detected. The lower part of the scan, i.e., the area where collet 118 is located, can be ignored. The section with the lowest average intensity value is determined to be the location of interface 320. The section is divided into upper and lower parts of the interface. The average of the X / Y positions is used as the default origin for the upper and lower layers. The median of the cylinder radius is used as the radius for the upper and lower layers. In one or more examples, the angular direction of the hole center axes (e.g., angles A and B) of the cylinder (e.g., first hole 304 and second hole 306) is set to 0 degrees by default. The results from the dynamic starting origin method 2000 include the X / Y origin, interface height, radius, and A / B angles. The results are then sent to the coordinate solver.

[0048] In one or more examples, the coordinate solution method 3000 obtains a starting origin value (e.g., a result from the dynamic starting origin method 2000) and searches for a range of possible values ​​that optimize the cylinder fitting function. The cylinder fitting function is designed to report a better score the more points it passes through a given cylinder. The coordinate solver works by creating a group of cylinder candidates for each cylinder, where all parameters except one are the same. The solver uses the fit function to determine which of these candidates is optimal, selecting the optimal parameters and overriding the starting origin value for that cylinder. The coordinate solution method 3000 moves on to the next parameter and repeats this process. Once all parameters have been changed, the coordinate solution method 3000 checks if the results have converged. If not, the coordinate solution method 3000 repeats the process, varying the parameters by different amounts. When the solution converges, the discrepancies and diameters of the results are reported.

[0049] In one or more examples, the results are displayed in the user interface 108, and the operator can select scan details to view the detected point cloud and cylinder. In one or more examples, the scan (e.g., three-dimensional point cloud 150) has two different views: distance (e.g., XYZ coordinates 152) and intensity (e.g., reflection intensity 154). The distance view shows how far each point is from the resulting cylinder. The intensity view shows the intensity of each point.

[0050] Figure 20 shows an example of the dynamic start origin method 2000. In one or more examples, the dynamic start origin method 2000 represents one or more operational steps of method 1000 (Figure 2), such as a step (1020) of processing data. In one or more examples, the dynamic start origin method 2000 is implemented using the controller 104 of system 100. The examples of the dynamic start origin method 2000 include several elements, steps, operations, or processes. Not all elements, steps, operations, or processes described or illustrated in an example are required in that example. Some or all elements, steps, operations, and / or processes described or illustrated in an example can be combined with other examples in various ways without requiring the inclusion of other elements, steps, operations, and / or processes described in those other examples, but one or more such combinations are not expressly described or illustrated by examples herein.

[0051] In one or more examples, a dynamic starting origin method or operation referred to herein as method 2000 includes the step (2002) of dividing the three-dimensional point cloud 150 into a plurality of sections. In one or more examples, the three-dimensional point cloud 150 is divided into any number (e.g., n) sections. In one or more examples, each section of the three-dimensional point cloud 150 extends over a range of at least approximately equal distances along the Z direction or Z axis.

[0052] In one or more examples, Method 2000 includes a step of filtering outliers (2004) (e.g., noise 336 in Figure 14). In one or more examples, the outliers represent noise or artifacts that do not represent hole 300. In one or more examples, a portion of a section of the three-dimensional point cloud 150 (e.g., a percentage) starting with a lower Z value is removed from the three-dimensional point cloud 150. This step removes artifacts that do not represent hole 300, such as data points representing collets 118 and sleeves 122.

[0053] In one or more examples, Method 2000 includes the step (2006) of determining the XYZ coordinates 152 (e.g., XYZ position) for each data point in the three-dimensional point cloud 150. In one or more examples, Method 2000 includes the step (2008) of determining the reflectance 154 for each data point in the three-dimensional point cloud 150. In one or more examples, Method 2000 includes the step (2010) of averaging the X position (e.g., X coordinate). In one or more examples, the X position of all data points in the three-dimensional point cloud 150 is averaged to determine the X average for each section of the three-dimensional point cloud 150.

[0054] In one or more examples, Method 2000 includes a step (2012) of averaging the Y position (e.g., Y coordinate). In one or more examples, the Y position of all data points in the three-dimensional point cloud 150 is averaged, and a Y average is determined for each section of the three-dimensional point cloud 150. In one or more examples, Method 2000 includes a step (2014) of averaging the Z position (e.g., Z coordinate). In one or more examples, the Z position of all data points in the three-dimensional point cloud 150 is averaged, and a Z average is determined for each section of the three-dimensional point cloud 150. In one or more examples, Method 2000 includes a step (2016) of averaging the reflectance intensity 154. In one or more examples, the reflectance intensity 154 of all data points in the three-dimensional point cloud 150 is averaged, and an I average (intensity average) is determined for each section of the three-dimensional point cloud 150.

[0055] In one or more examples, Method 2000 includes a step (2018) of determining the radius of each section. In one or more examples, the X-mean and Y-mean are used to form or define the center of each section. The distance from the center of the section to each point in the section is determined. Each determined distance becomes the radius corresponding to the points of the section in the three-dimensional point cloud 150. In one or more examples, Method 2000 includes a step (2020) of averaging the radii. In one or more examples, the radius of the points is averaged for each section, and an R-mean (radius mean) is determined for each section in the three-dimensional point cloud 150. In one or more examples, Method 2000 includes a step (2022) of determining the starting mean (mean radius). In one or more examples, the median of the R-means of the sections is determined. The determined median is used as the starting radius for the corresponding section in the three-dimensional point cloud 150. In one or more examples, the starting radius is stored as one of the hole parameters (2044) determined by method 2000 (2024).

[0056] In one or more examples, Method 2000 includes a step (2026) of separating sections. In one or more examples, each section of the three-dimensional point cloud 150 is separated into an upper stack 332 (e.g., the upper section stack in Figure 14) and a lower stack 334 (e.g., the lower section stack in Figure 14). In one or more examples, the upper stack includes multiple sections representing a first component 312 and a first hole 304. In one or more examples, the lower stack includes multiple sections representing a second component 314 and a second hole 306. In one or more examples, Method 2000 includes a step (2028) of averaging the upper stacks of sections. In one or more examples, the X-mean and Y-mean of the upper sections are averaged to determine the upper X-mean (e.g., mean X coordinate or position) and upper Y-mean (e.g., mean Y coordinate or position). In one or more examples, method 2000 includes the step (2030) of averaging the lower stack of the section. In one or more examples, the X-mean and Y-mean of the lower section are averaged to determine the lower X-mean (e.g., mean X coordinate or position) and the lower Y-mean (e.g., mean Y coordinate or position). In one or more examples, the upper X position is stored (2032) and the upper Y position is stored (2034) as hole parameters (2044) determined by method 2000. In one or more examples, the lower X position is stored (2036) and the lower Y position is stored (2038) as hole parameters (2044) determined by method 2000.

[0057] In one or more examples, method 2000 includes the step (2040) of determining an interface (e.g., interface 320). In one or more examples, the section with the lowest I-mean is identified. This section is used to identify or indicate the location of the interface. In one or more examples, the Z-mean (e.g., the average of the Z-positions of the section with the lowest I-mean) is used for this section and is used as the starting Z-position of the interface. In one or more examples, the interface height is determined based on the Z-position of the section with the lowest I-mean. In one or more examples, the upper and lower stacks of the section are separated at the Z-position that identifies the interface height (e.g., the upper stack is above the interface and the lower stack is below the interface). In one or more examples, the interface height is stored as a hole parameter (2044) determined by method 2000 (2042).

[0058] In one or more examples, the results determined by method 2000 (e.g., the resulting hole parameters) are provided as input parameters for coordinate resolution method 3000.

[0059] Referring to Figures 2, 20, and 21, in one or more examples, the dynamic starting origin method and coordinate resolution method 3000 can also be used to determine the hole characteristics of the collet 118 (e.g., the step of processing the collet 118), and can be an implementation of the step 1024 of processing the collet 118. In these examples, the operating steps described herein and shown in Figures 20 and 21 can be applied to the collet 118.

[0060] Figure 21 shows an example of the coordinate resolution method 3000. In one or more examples, the coordinate resolution method 3000 represents one or more operational steps of method 1000 (Figure 2), such as step (1020) to process. In one or more examples, the coordinate resolution method 3000 is performed using the controller 104 of system 100. Examples of the coordinate resolution method 3000 include several elements, steps, operations, or processes. Not all elements, steps, operations, or processes described or illustrated in an example are required in that example. Some or all elements, steps, operations, and / or processes described or illustrated in an example can be combined with other examples in various ways without requiring the inclusion of other elements, steps, operations, and / or processes described in those other examples, but one or more such combinations are not expressly described or illustrated by examples herein.

[0061] In one or more examples, a coordinate resolution method or operation referred herein as Method 3000 includes a step (3002) of inputting parameters. In one or more examples, the input parameters for Method 3000 include the resulting hole parameters determined by Method 2000. In one or more examples, the input parameters include any combination (e.g., one or more) of the radius, upper X position, upper Y position, lower X position, lower Y position, interface height, upper first opening center point (upper A), upper second opening center point (upper B), lower first opening center point (lower A), and lower second opening center point (lower B) of each section of the three-dimensional point cloud 150 (e.g., the upper section represents the first hole 304 and the lower section represents the second hole 306).

[0062] In one or more examples, method 3000 includes a step 3004 to select a parameter. In one or more examples, one of the parameters (e.g., a first parameter such as radius) is selected and set as the focus of the operation. In one or more examples, method 3000 includes a step 3006 to adjust the parameter. In one or more examples, the selected or focused parameter (e.g., a first parameter) is adjusted by creating several (e.g., one or more) candidate solutions. In one or more examples, method 3000 includes a step 3008 to score the solutions. In one or more examples, each of the created candidate solutions is scored. In one or more examples, method 3000 includes a step (3010) to select a solution. In one or more examples, the parameter of the solution with the highest score is selected and saved as the new current parameter value (3012).

[0063] In one or more examples, method 3000 includes a step (3014) to verify the parameters. In one or more examples, it is determined whether all parameters are selected and focused (e.g., process steps 3006 to 3012 are performed). If all parameters are not focused, method 3000 includes a step (3016) to change the parameters. In one or more examples, different parameters (e.g., a second parameter such as the upper X position, a third parameter such as the upper Y position, etc.) are selected to focus (e.g., the focus shifts to the next parameter), and process steps 3006 to 3012 are repeated for each parameter. If all parameters are not focused, method 3000 includes a step (3018) to determine or check whether the parameters have converged. If the parameters have not converged, method 3000 includes a step (3020) to adjust the solution. In one or more examples, the range of candidate solutions is adjusted based on the difference between the current parameter and the previous parameter. Once the parameters converge, method 3000 includes the step (3022) of determining the hole characteristics 200 using the current parameters that have been adjusted and selected according to method 3000.

[0064] In one or more examples, the controller 104 (Figure 1) includes, or takes the form of, a data processing system. In one or more examples, the data processing system includes at least one processor 192, one or more storage devices such as memory 194 and / or persistent storage, a communication unit, an input / output unit (I / O unit), and a communication framework that provides communication between the system and a display (e.g., user interface 108). In this example, the communication framework takes the form of a bus system. The processor 192 functions to execute instructions from software or other applications that can be loaded into memory 194. In one or more examples, the processor 192 is several processor units, a multiprocessor core, or some other type of processor, depending on the particular embodiment. Memory 194 and any persistent storage are examples of storage devices. A storage device is any hardware that can store at least one of the following information, such as, for example, data, program code in executable form, or other suitable information, temporarily, persistently, or both temporarily and persistently. In one or more examples, a storage device may also be called a computer-readable storage device. Memory 194 is, for example, random access memory or any other suitable volatile or non-volatile storage device. Persistent storage can take various forms depending on the particular embodiment. For example, persistent storage includes one or more components or devices. For example, persistent storage is a hard drive, a solid-state hard drive, flash memory, a rewritable optical disk, a rewritable magnetic tape, or any combination thereof. The medium used by persistent storage can also be removable. For example, a removable hard drive can be used as persistent storage. Instructions for at least one of an operating system, an application, or a program can be placed in the storage device and communicate with the processor 194 via a communication framework.The various examples and processes of operation described herein can be implemented by the processor 192 using computer implementation instructions, which can be placed in memory such as memory 194. Instructions that can be read and executed by the processor 192 may be referred to as program code 196, computer-usable program code, or computer-readable program code. The program code 196 in different examples may be embodied on different physical or computer-readable media, such as memory 194 or persistent storage.

[0065] In one or more examples, the program code 196 is arranged in a form that functions on a selectively removable computer-readable medium and can be loaded or transferred to a data processing system for execution on the processor 192. In one or more examples, the program code 196 and the computer-readable medium form a computer program product. In one or more examples, the computer-readable medium is a computer-readable storage medium. In one or more examples, the computer-readable storage medium is not a medium for propagating or transmitting the program code 196, but a physical or tangible storage device used to store the program code 196. The program code 196 can also be transferred to a data processing system using a computer-readable signal medium. The computer-readable signal medium can be, for example, a propagating data signal containing the program code 196. For example, the computer-readable signal medium can be at least one of electromagnetic signals, optical signals, or any other suitable type of signal. These signals can be transmitted over at least one of communication links, such as wireless communication links, fiber optic cables, coaxial cables, wired, or any other suitable type of communication link.

[0066] Furthermore, various components of the controller 104 and / or the data processing system may be represented as modules or applications (e.g., the dynamic start origin module 362 and the coordinate solver module 364). For the purposes of this disclosure, the term “module” includes hardware, software, or combinations of hardware and software. As an example, a module may include one or more circuits configured to perform or execute the functions or operations described in the execution processes described herein (e.g., Method 1000, Method 2000, and / or Method 3000). As another example, a module may include a processor, a storage device (e.g., memory), and a computer-readable storage medium having instructions that, when executed by the processor, cause the processor to perform or execute the described functions and operations. In one or more examples, a module may take the form of program code 196 and a computer-readable medium, which together form a computer program product.

[0067] Referring here to Figures 22 and 23, the system 100, measuring tool 102, and method 1000 described herein may be related to and used in connection with an aircraft 1200, as schematically shown in Figure 22, and an aerospace manufacturing and maintenance inspection method 1100, as shown in the flowchart of Figure 23. As an example, the hole characteristics of one or more holes in the components of the aircraft 1200 can be determined using the system 100, measuring tool 102, and / or according to method 1000 during any part of the manufacturing and maintenance inspection method 1100.

[0068] Refer to Figure 22, which shows an example of aircraft 1200. Aircraft 1200 can be any aerospace vehicle or platform. In one or more examples, aircraft 1200 includes a fuselage 1202 having an interior 1206. Aircraft 1200 includes several onboard systems 1204 (e.g., high-level systems). Examples of onboard systems 1204 of aircraft 1200 include a propulsion system 1208, a hydraulic system 1212, an electrical system 1210, and an environmental system 1214. In other examples, onboard systems 1204 also include one or more control systems coupled to the fuselage 1202 of aircraft 1200. In yet another example, onboard systems 1204 also include one or more other systems 1216, but are not limited to, a communications system, an avionics system, a software distribution system, a network communications system, a passenger information / entertainment system, a guidance system, a radar system, a weapons system, etc. The aircraft 1200 may have any number of components that are manufactured and / or installed using any number of holes. The holes in the components of the aircraft 1200 can be measured, and the hole characteristics of those holes can be determined using system 100, measuring tool 102, and / or method 1000.

[0069] Referring to Figure 23, during the pre-production of aircraft 1200, the manufacturing and maintenance method 1100 includes the specification and design of aircraft 1200 (block 1102) and material procurement (block 1104). During the production of aircraft 1200, the manufacturing of components and subassemblies (block 1106) and the system integration of aircraft 1200 (block 1108) are carried out. Subsequently, aircraft 1200 is brought into service 1112 after certification and transport 1110. Periodic maintenance and inspection (block 1114) includes the modification, reconfiguration, and refitting of one or more systems of aircraft 1200.

[0070] Each of the processes of the manufacturing and maintenance inspection method 1100 shown in Figure 23 may be carried out by a system integrator, a third party, and / or an operator (e.g., a customer). For the purposes of this description, the system integrator may include, but is not limited to, any number of aircraft manufacturers and major system subcontractors; the third party may include, but is not limited to, any number of vendors, subcontractors, and suppliers; and the operator may be an airline, leasing company, military organization, flight operations organization, etc.

[0071] Examples of the system 100, measuring tool 102, and method 1000 shown and described herein may be employed at any one or more stages of the manufacturing and maintenance inspection method 1100 in the flow chart shown by Figure 23. In one example, during the manufacturing of components and subassemblies 1106 and / or part of system integration 1108, holes in the components of the aircraft 1200 can be measured and hole characteristics determined using the system 100, measuring tool 102, and / or according to method 1000. Furthermore, during the operational period 1112 of the aircraft 1200, holes in the components of the aircraft 1200 can be measured and hole characteristics can be determined using the system 100, measuring tool 102, and / or according to method 1000. Also, during system integration 1108 and certification and transport 1110, holes in the components of the aircraft 1200 can be measured and hole characteristics can be determined using the system 100, measuring tool 102, and / or according to method 1000. Similarly, using system 100, measuring tool 102, and / or method 1000, holes in the components of the aircraft 1200 can be measured and hole characteristics can be determined during the aircraft 1200's operational period 1112, as well as during maintenance and inspection 1114.

[0072] For further details, refer to the accompanying drawings illustrating specific examples described herein. Other examples having different structures and functions will not deviate from the scope of this disclosure. The same reference numeral may refer to the same feature, element, or component in different drawings. Throughout this disclosure, several items may be referred to individually, several items collectively as such, and they may be referred to by the same reference numeral. Furthermore, as used herein, a feature, element, component, or step preceding the words "one (a)" or "one (an)" should be understood as not excluding multiple features, elements, components, or steps unless explicitly stated otherwise.

[0073] Exemplary and non-exclusive examples of the subject matter of this disclosure are provided above, but are not necessarily claimed. References to “examples” in this specification mean that one or more features, structures, elements, components, characteristics, and / or operating steps described in relation to an example are included in at least one aspect, embodiment, and / or implementation of the subject matter of this disclosure. Thus, throughout this disclosure, the phrases “one example,” “another example,” “one or more examples,” and similar statements may, but not necessarily, refer to the same example. Furthermore, the subject matter characterizing any one example may, but not necessarily, include the subject matter characterizing any other example. Also, the subject matter characterizing any one example may, but not necessarily, be combined with the subject matter characterizing any other example.

[0074] As used herein, a system, apparatus, device, structure, article, element, component, or hardware “configured to perform” a specified function is capable of actually performing the specified function without modification, rather than merely having the potential to perform the specified function after further modification. In other words, a system, apparatus, device, structure, article, element, component, or hardware “configured to perform” a specified function is specifically selected, created, implemented, utilized, programmed, and / or designed for the purpose of performing the specified function. As used herein, “configured to” means an existing characteristic of the system, apparatus, structure, article, element, component, or hardware that enables the system, apparatus, structure, article, element, component, or hardware to perform the specified function without further modification. For the purposes of this disclosure, a system, apparatus, device, structure, article, element, component, or hardware described as “configured to perform” a particular function may additionally or alternatively be described as “adapted to” and / or “operating to” perform that function.

[0075] Unless otherwise specified, terms such as “first,” “second,” and “third” are used herein solely as labels and are not intended to impose any order, arrangement, or hierarchical requirements on the items they refer to. Furthermore, a reference to, for example, “second” item does not require or exclude the presence of, for example, “first” item or items with lower numbers, and / or, for example, “third” item or items with higher numbers.

[0076] As used herein, the phrase “at least one of” means, when used with a list of items, that any combination of one or more of the listed items may be used, or that only one of each item in the list may be required. For example, “at least one of item A, item B, and item C” may include, but not limited to, item A, or item A and item B. This example may also include item A, item B, and item C, or item B and item C. In other examples, “at least one of” may be, for example, two of item A, one of item B, and ten of item C, or four of item B and seven of item C, or any other suitable combination. As used herein, the terms “and / or” and the “ / ” symbol include any combination of one or more of the related enumerated items.

[0077] For the purposes of this disclosure, the terms “joined,” “joined,” and similar terms refer to two or more elements that are joined, connected, fastened, attached, connected, communicated, or otherwise related to each other (e.g., mechanically, electrically, fluidly, optically, or electromagnetically). In various examples, elements may be related directly or indirectly. For example, element A may be directly related to element B. For another example, element A may be indirectly related to element B, for example, through another element C. It will be understood that not all relationships between various disclosed elements are necessarily represented. Therefore, other combinations not shown may also exist.

[0078] As used herein, the term “approximately” refers to or represents a state that is close to the described state but not exactly identical, yet performs the desired function or achieves the desired result. For example, “approximately” refers to a condition that is within a certain acceptable tolerance or precision, for example, a condition that is within 10% of the described condition. However, the term “approximately” does not exclude conditions that exactly match the described condition. As used in the specification, the term “substantially” refers essentially to the described condition that performs the desired function or achieves the desired result.

[0079] Figures 1 and 3-19, referenced above, may represent functional elements, features, or components and do not necessarily imply a specific structure. Therefore, modifications, additions, and / or omissions may be made to the exemplary structures. In addition, those skilled in the art will understand that not all elements, features, and / or components described and illustrated in Figures 1 and 3-19 are necessarily included in all examples, and not all elements, features, and / or components described herein are necessarily shown in each exemplary example. Therefore, some of the elements, features, and / or components described and illustrated in Figures 1 and 3-19 may be combined in various ways without including other features described and illustrated in Figures 1 and 3-19, other drawings, and / or accompanying disclosures, even if such one or more combinations are not explicitly shown herein. Similarly, additional features, not limited to those presented, may be combined with some or all of the features shown and described herein. Unless otherwise specified, the schematic diagrams of the examples shown in Figures 1 and 3-19 above do not imply any structural limitations relating to those exemplary examples. Rather, it should be understood that while one exemplary structure is shown, that structure may be modified where appropriate. Thus, modifications, additions, and / or omissions may be made to the exemplary structures. Furthermore, elements, features, and / or components that serve similar, or at least substantially similar, purposes are labeled with the same numbers in each of Figures 1 and 3-19, and such elements, features, and / or components may not be described in detail herein with reference to each of Figures 1 and 3-19. Similarly, not all elements, features, and / or components are labeled in each of Figures 1 and 3-19, but the reference numerals associated with them may be used herein for consistency.

[0080] In Figures 2, 20, 21, and 23 mentioned above, blocks may represent operations, steps, and / or parts thereof, and the lines connecting the various blocks do not imply a specific order or dependency of the operations or parts thereof. It will be understood that not all dependencies between the various operations disclosed are necessarily represented. Figures 2, 20, 21, and 23, and the accompanying disclosures describing the operations of the methods described herein, should not be construed as necessarily determining the order in which the operations are performed. Rather, one exemplary order is shown, but it should be understood that the order of operations may be modified where appropriate. Thus, modifications, additions, and / or omissions may be made to the illustrated operations, and certain operations may be performed in different orders or simultaneously. In addition, those skilled in the art will understand that not all of the described operations need to be performed.

[0081] Furthermore, throughout this specification, references to features, benefits, or similar terms used herein do not imply that all features and benefits that may be realized in the examples disclosed herein are any single example, or are contained within any single example. Rather, terms referring to features and benefits should be understood to mean that a particular feature, benefit, or characteristic described in relation to an example is contained in at least one example. Accordingly, descriptions of features, benefits, and similar terms used throughout this disclosure may, but not necessarily, refer to the same example.

[0082] Features, advantages, and characteristics described in one example may be combined in any suitable manner in one or more other examples. Those skilled in the art will recognize that the examples described herein may be practiced without one or more of the particular features or advantages of a particular example. In other examples, additional features and advantages that may be recognized in a particular example may not be present in all examples. Furthermore, various examples of System 100, Measuring Tool 102, and Method 1000 are shown and described, and those skilled in the art will be able to recall modifications by reading this specification. This application includes such modifications and is limited only by the claims. [Explanation of Symbols]

[0083] 100 System, 102 Measurement Tool, 104 Controller, 106 Umbilical Cord, 108 User Interface, 110 Data, 112 Housing, 114 Optical Probe, 116 Probe Drive, 118 Collet, 120 Laser Interferometer, 122 Sleeve, 124 Mandrel, 126 Actuator, 128 Multiple Collets, 130 Scanning Axis, 132 Linear Drive, 134 Rotary Drive, 136 Main Unit, 138 Slit, 142 Motor, 144 Gearbox, 146 Limit Switch, 148 Encoder, 150 Three-Dimensional Point Cloud, 152 XYZ Coordinates, 154 Reflectance, 156 Model, 162 Cart, 164 Server, 166 Compressed Air Line, 168 Power Line, 172 Trigger, 174 Port, 176 Rotary Controller, 182 Programmable Logic Controller, 184 Interferometer, 186 Optical fiber, 188 Data line, 192 Processor, 194 Memory, 196 Program code, 200 Hole characteristics, 202 Diameter, 204 Radius, 206 Offset, 208 Length, 212 Straightness, 214 Orientation, 216 Smoothness, 250 Manufacturing environment, 252 Environmental conditions, 300 Hole, 302 Wall, 304 First hole, 306 Second hole, 310 Part, 312 First component, 314 Second component, 316 First wall, 318 Second wall, 320 Interface, 322 Gap, 324 Sealant, 326 Debris, 332 Upper stack, 334 Lower stack, 336 Noise, 362 Dynamic start origin module, 364 Coordinate solver module, 1000 Method, 1002 Positioning a portion of the collet within the hole, 1004 Expanding the collet, 1006 Engaging with the hole, 1008 Extending and / or retracting the optical probe, 1010 Rotating the optical probe, 1012 Scanning the hole, 1014 Scanning the collet, 1016 Generating data, 1018 Filtering a portion of the data, 1020 Processing the data, 1022 Processing the hole, 1024 Processing the collet, 1026 Compensating for the environment, 1028 Determining hole characteristics, 1100 Manufacturing and maintenance inspection methods, 1102 Specifications and design, 1104 Material procurement, 1106 Manufacturing of components and subassemblies, 1108 System integration, 1110Certification and transport, 1112 Commencement of service, 1114 Maintenance and inspection, 1200 Aircraft, 1202 Airframe, 1204 Onboard systems, 1206 Interior, 1208 Propulsion systems, 1210 Electrical systems, 1212 Hydraulic systems, 1214 Environmental systems, 1216 Other systems, 2000 Method, 2002 Point cloud division, 2004 Outlier filtering, 2006 XYZ coordinate determination, 2008 Reflectance determination, 2010 X position averaging, 2012 Y position averaging, 2014 Z position averaging, 2016 Reflectance averaging, 2018 Radius determination, 2020 Radius averaging, 2022 Starting radius averaging, 2024 Radius storage, 2026 Section separation, 2028 Upper stack averaging, 2030 2032 Averaging of the lower stack, 2032 Storage of upper X position, 2034 Storage of upper Y position, 2036 Storage of lower X position, 2038 Storage of lower Y position, 2040 Determination of interface, 2042 Storage of interface height, 2044 Determination of hole parameters, 3000 Method, 3002 Input of parameters, 3004 Selection of parameters, 3006 Adjustment of parameters, 3008 Scoring of solution, 3010 Selection of solution, 3012 Storage of parameters, 3014 Verification of parameters, 3016 Modification of parameters, 3018 Parameters have converged, 3020 Adjustment of solution, 3022 Determination of hole characteristics

Claims

1. A system (100) for determining the hole characteristics (200) of a hole (300), wherein the system (100) A measuring tool (102) that measures the hole (300) and generates data (110) representing the hole (300), A controller (104) communicates with the measuring tool (102) and determines at least one of the hole characteristics (200) based on the data (110) from the measuring tool (102). System (100), including the system.

2. The system (100) according to claim 1, further comprising a user interface (108) that communicates with the controller (104) and visually displays at least one of the hole characteristics (200).

3. The aforementioned measuring tool (102) An optical probe (114) is positioned within the hole (300) and scans the wall (302) of the hole (300) to generate the data (110), A probe drive (116) that translates and rotates the optical probe (114) within the hole (300) and The system (100) according to claim 1, including the system described in claim 1.

4. The system (100) according to claim 3, wherein the optical probe (114) includes a laser interferometer (120).

5. The probe drive (116) A linear drive (132) that positions the optical probe (114) along the scanning axis (130), A rotary drive (134) that positions the optical probe (114) around the scanning axis (130) and The system (100) according to claim 3, including the system described in claim 3.

6. The linear drive (132) Motor (142) and, A transmission (144) that transmits motion from the motor (142) to the optical probe (114), A pair of limit switches (146), An encoder (148) for measuring the linear position of the optical probe (114) and The system (100) according to claim 5, including the system described in claim 5.

7. The aforementioned measuring tool (102) Housing (112) and, A collet (118) is coupled to the housing (112) and engages with a portion of the hole (300). It further includes, The system (100) according to claim 3, wherein the optical probe (114) extends through the collet (118).

8. The aforementioned measuring tool (102) A sleeve (122) connects the collet (118) to the housing (112), A mandrel (124) moves relative to the collet (118) in order to expand the collet (118), An actuator (126) that positions the mandrel (124) relative to the collet (118) and The system (100) according to claim 7, further comprising:

9. The system (100) according to claim 7, further comprising a plurality of collets (128) configured to be interchangeably coupled to the housing (112).

10. The controller (104) A three-dimensional point cloud (150) is generated, including the XYZ coordinates (152) and reflection intensity (154) of the wall (302) of the hole (300) and a portion of the collet (118) positioned within the hole (300). The transformation of the three-dimensional point cloud (150) is performed using the collet (118) model (156). Determine at least one of the hole characteristics (200) based on the three-dimensional point cloud (150) to fit the model (156) of the collet (118). The system (100) according to claim 7, configured as follows.

11. The system (100) according to claim 10, wherein the hole characteristics (200) include at least one of the diameter (202) of the hole (300), the offset (206) of the hole (300), the gap (322) at the interface (320) of the hole (300), the length (208) of the hole (300), the straightness (212) of the hole, and the orientation (214) of the hole.

12. The system (100) according to claim 9, wherein the hole characteristics (200) further include at least one of the smoothness (216) of the hole (300), debris (218) on the interface (320), and sealant (222) on the interface (320).

13. A measuring tool (102) for measuring a hole (300), wherein the measuring tool (102) is Housing (112) and A collet (118) is coupled to the housing (112) and engages with a portion of the hole (300), An optical probe (114) extends through the collet (118) into the hole (300), scans the wall (302) of the hole (300), and generates data (110) representing the wall (302) of the hole (300), A linear drive (132) that positions the optical probe (114) along the scanning axis (130), A rotary drive (134) that positions the optical probe (114) around the scanning axis (130) and Includes measuring tools (102).

14. A method (1000) for determining the hole characteristics (200) of a hole (300), wherein the method (1000) is The steps include extending the optical probe (114) into the hole (300) along the scanning axis (130), The steps include rotating the optical probe (114) within the hole (300) around the scanning axis (130), The steps include scanning the wall (302) of the hole (300), The steps include generating data (110) representing the wall (302) of the hole (300), A step of determining at least one of the hole characteristics (200) based on the data (110), A method including (1000).

15. The method according to claim 14 (1000), wherein the scanning step includes the step of performing laser interferometry.

16. The method according to claim 14 (1000), wherein the generating step includes generating a three-dimensional point cloud (150) including the XYZ coordinates (152) and reflection intensity (154) of the wall (302) of the hole (300).

17. The steps include positioning a portion of the collet (118) within the hole (300), The steps include expanding the collet (118), The steps include engaging the wall (302) of the hole (300) with the collet (118), The steps include scanning a portion of the collet (118) positioned within the hole (300), The steps include generating the data (110) that represents the portion of the collet (118) and The method according to claim 16, further comprising (1000).

18. The aforementioned step of making a decision is, A step of processing the data (110) using dynamic start origin motion, A step of further processing the data (110) using coordinate resolution operations and The method according to claim 17 (1000), including the method according to claim 17.

19. The method according to claim 18 (1000), further comprising the step of correcting environmental conditions (252).

20. The method according to claim 18 (1000), wherein the determining step includes determining at least one of the following: the diameter of the hole (300) (202), the offset of the hole (300) (206), the gap of the interface (320) of the hole (300) (322), the length of the hole (300) (208), the straightness of the hole (212), the orientation of the hole (214), the smoothness of the hole (300) (216), the debris of the interface (320) (218), and the sealant of the interface (320) (222).

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