Liquid dispensing head, head module, and device for dispensing liquid

Abstract

The present invention provides a liquid dispensing head, a head module, and a liquid dispensing device that can effectively suppress the deterioration of liquid dispensing performance. [Solution] The liquid discharge head 1 comprises a MEMS component 10 which is a substrate component having at least a nozzle for discharging liquid, a flow path communicating with the nozzle, and a piezoelectric element, and a frame member 5 which is bonded to the MEMS component 10 with adhesive. The space between the frame member 5 and the MEMS component 10 has a bonded region which is bonded with adhesive and a non-bonded region which is not bonded with adhesive. The bonded region is provided at least around the upper part 20a of the main common supply flow path and the upper part 20b of the main common recovery flow path which are communicating parts of the frame member 5, and at the end of the frame member 5. In addition, all non-bonded regions 9b are not filled with material and are cavities with predetermined gaps.

Description

Technical Field

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[0001] The present invention relates to a liquid ejection head, a head module, and a liquid ejection device.

Background Art

[0002] Conventionally, a liquid ejection head including at least a nozzle for ejecting a liquid, a flow path communicating with the nozzle, a substrate component having a piezoelectric element, and a frame member having a communication portion communicating with the flow path and joined to the substrate component with an adhesive is known.

[0003] [[ID=…]]特許文献1には、上記液体吐出ヘッドとして、基板部品たるヘッド本体と、フレーム部材たるヘッドケースとの間には、ヘッドケースを接着剤により接合された接合領域と、接着剤により接合されていない非接合領域とを有している。また、ヘッドケースに設けられた開口部に充填され圧電素子を駆動する駆動IC等を保護するポッティング剤が、ヘッド本体とヘッドケースとの間の非接合領域の一部に流れ込み、ヘッドケースは、非接合領域に流れ込んだポッティング剤によってもヘッド本体に接合される。

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, there was a risk that the liquid ejection performance would deteriorate.

Means for Solving the Problems

[0005] 注:原文中编号为16的段落内容不完整,翻译时保留了原文格式。你可补充完整后继续向我提问。To solve the above-mentioned problems, the present invention provides a liquid dispensing head comprising a substrate component having at least a nozzle for dispensing liquid, a flow path communicating with the nozzle, and a piezoelectric element, and a frame member having a communication portion communicating with the flow path and being joined to the substrate component by adhesive, wherein the space between the frame member and the substrate component has a joined region joined by the adhesive and a non-joined region not joined by the adhesive, the joined region is provided at least around the communication portion of the frame member and at the end of the frame member, and all non-joined regions are cavities not filled with material. [Effects of the Invention]

[0006] According to the present invention, the deterioration of liquid dispensing performance can be effectively suppressed. [Brief explanation of the drawing]

[0007] [Figure 1] An external perspective view illustrating the liquid dispensing head in this embodiment. [Figure 2] This figure illustrates the joining of MEMS components and frame members in this embodiment. [Figure 3] (a) is a perspective view showing a conventional bonding region, (b) is a cross-sectional view of (a) AA, and (c) is a diagram showing the stress distribution in the nozzle formation region of a conventional MEMS component. [Figure 4] This diagram illustrates the joining of the frame member and MEMS component in this embodiment. [Figure 5] (a) is a perspective view showing the joining region of this embodiment, (b) is a cross-sectional view of (a) at BB, and (c) is a diagram showing the stress distribution in the nozzle formation region of the MEMS component in this embodiment. [Figure 6] This diagram illustrates an example in which a non-jointed region is divided into multiple jointed regions. [Figure 7] This figure illustrates an embodiment in which the joint region at the longitudinal end is not continuous with the joint region surrounding the main common supply channel and the main common recovery channel. [Figure 8]This figure illustrates an embodiment in which grooves are formed in areas corresponding to the non-joined regions of the frame members. [Figure 9] This figure illustrates an embodiment in which an opening is made in the area corresponding to the non-joined region 9b of the frame member 5. [Figure 10] An exploded perspective view of the head module of this embodiment. [Figure 11] This is an exploded perspective view of the head module of this embodiment, as seen from the nozzle side. [Figure 12] A schematic diagram illustrating the printing apparatus in the embodiment. [Figure 13] A plan view of an example of a print head unit. [Figure 14] A plan view illustrating the main components of an example of a printing apparatus. [Figure 15] Side view of the main components of an example of a printing apparatus. [Figure 16] A plan view illustrating the main components of an example of a liquid dispensing unit. [Figure 17] Front view diagram of an example of a liquid dispensing unit. [Modes for carrying out the invention]

[0008] The following describes one embodiment in which the present invention is applied to a liquid dispensing head provided in a liquid dispensing device. Figure 1 is an external perspective view illustrating the liquid dispensing head in this embodiment.

[0009] The liquid discharge head 1 of this embodiment comprises a MEMS (Micro Electro Mechanical Systems) component 10 which is a substrate component, a frame member 5, and a substrate (flexible wiring board) 101 on which a drive circuit 102 is mounted. The MEMS component 10 includes a nozzle substrate 11, an actuator substrate 12, a damper member 13, and a flow path substrate 14.

[0010] The nozzle substrate 11 is provided with a plurality of nozzles for discharging liquid. The actuator substrate 12 has an individual flow path substrate, a diaphragm, a piezoelectric element, and a common flow path substrate. The individual flow path substrate forms a plurality of pressure chambers (individual liquid chambers) each communicating with a plurality of nozzles, a plurality of individual supply flow paths each leading to the plurality of pressure chambers, and a plurality of individual recovery flow paths each leading to the plurality of pressure chambers. One pressure chamber, the individual supply flow path communicating therewith, and the individual recovery flow path are collectively referred to as an individual flow path.

[0011] The diaphragm forms a deformable wall surface of the pressure chamber, and a piezoelectric element is integrally provided on the diaphragm. Further, a supply-side opening communicating with the individual supply flow path and a recovery-side opening communicating with the individual recovery flow path are formed on the diaphragm. The piezoelectric element is an electromechanical conversion element and is a pressure generating means for deforming the diaphragm to pressurize the liquid in the pressure chamber.

[0012] The individual flow path substrate and the diaphragm are not limited to being separate members as components. For example, an SOI (Silicon On Insulator) substrate can be used to integrally form the individual flow path substrate and the diaphragm as the same member. That is, an SOI substrate formed with a silicon oxide film, a silicon layer, and a silicon oxide film in this order on a silicon substrate is used, the silicon substrate is used as the individual flow path substrate, and the diaphragm can be formed by the silicon oxide film, the silicon layer, and the silicon oxide film. In this configuration, the layer structure of the silicon oxide film, the silicon layer, and the silicon oxide film of the SOI substrate becomes the diaphragm. Thus, the diaphragm includes those composed of a material formed on the surface of the individual flow path substrate.

[0013] The common flow path substrate forms a plurality of common supply flow path branches and a plurality of common recovery flow path branches adjacent to each other alternately in the longitudinal direction of the head. The common supply flow path branches lead to the plurality of individual supply flow paths through the supply-side openings provided on the diaphragm. The common recovery flow path branches lead to the plurality of individual recovery flow paths through the recovery-side openings provided on the diaphragm.

[0014] On one end side in the short side direction of the head of the common flow path substrate, a lower part of a main common supply flow path extending in the longitudinal direction of the head that communicates with a plurality of common supply flow path branches is provided. Further, on the other end side in the short side direction of the head of the common flow path substrate, a lower part of a main common recovery flow path extending in the longitudinal direction of the head that communicates with a plurality of common recovery flow path branches is provided. The main common supply flow path and the main common recovery flow path are configured by laminating the common flow path substrate, the flow path substrate 14, and the frame member 5.

[0015] The damper member 13 has a supply side damper that forms a deformable wall surface of the common supply flow path branch of the common flow path substrate and a recovery side damper that forms a deformable wall surface of the common recovery flow path branch.

[0016] The common supply flow path branches and the common recovery flow path branches are configured by sealing groove portions alternately arranged side by side on the same common flow path substrate with a damper member 13 made of a thin plate.

[0017] As the damper member 13, it is preferable to use a metal thin film or an inorganic thin film that is resistant to organic solvents, and its thickness is preferably 10 [μm] or less. Further, the damper member 13 preferably has a laminated structure composed of a plurality of layers. Also, the damper member 13 preferably has a compliance of 7×10-17 [m / N] or more, a Young's modulus of 3 [GPa] or more and 200 [GPa] or less, and a thickness of 2 [μm] or more and 10 [μm] or less in order to satisfy the functions required as a damper.

[0018] The damper member 13 suppresses the influence (e.g., crosstalk) of the pressure fluctuation of a flow path (e.g., an individual supply flow path) generated during liquid discharge from a nozzle on the liquid discharge from other nozzles. Specifically, by the damper member 13 appropriately exerting the damper function, the occurrence of crosstalk, in which vibrations (pressure fluctuations) during liquid discharge are transmitted through the liquid and affect the liquid discharge of adjacent nozzles, can be suppressed, and the liquid discharge accuracy from each nozzle can be stabilized.

[0019] The flow path substrate 14 also serves as a damper holding substrate for holding the damper member 13. The middle section of the common supply flow path is formed at one end of the flow path substrate 14 in the direction of the head's short side. The middle section of the common recovery flow path is formed at the other end of the flow path substrate 14 in the direction of the head's short side, along the long side of the head. Furthermore, grooves are formed on the lower surface of the flow path substrate 14 in the portion of the damper member 13 facing the supply-side damper and the portion facing the recovery-side damper, respectively, to create a space in which the supply-side damper and the recovery-side damper can vibrate.

[0020] The nozzle substrate 11, the individual channel substrates of the actuator substrate 12, the diaphragm and common channel substrate, and the channel substrate 14 are all silicon substrates.

[0021] The frame member 5 is made of resin or metal, and at one end of the joining surface 8 (see Figure 3(a)) to the MEMS component 10 in the direction of the short side of the head, the upper part 20a (see Figure 3) of the groove-shaped common supply channel main flow extending in the direction of the longitudinal side of the head is formed. At the other end of the joining surface 8 in the direction of the short side of the head, the upper part 20b (see Figure 3) of the groove-shaped common recovery channel main flow extending in the direction of the longitudinal side of the head is formed.

[0022] In this embodiment, the lower part of the common supply channel main flow provided on the common channel substrate of the actuator substrate 12, the middle part of the common supply channel main flow provided on the channel substrate 14, and the upper part 20a of the common supply channel main flow provided on the frame member 5 are stacked to form a common supply channel main flow that leads to multiple common supply channel branches. Furthermore, the lower part of the common recovery channel main flow provided on the common channel substrate of the actuator substrate 12, the middle part of the common recovery channel main flow provided on the channel substrate 14, and the upper part 20b of the common recovery channel main flow provided on the frame member 5 are stacked to form a common recovery channel main flow that leads to multiple common supply channel branches.

[0023] A channel is formed at one end of the frame member 5 in the longitudinal direction of the head, which connects to the main common supply channel. This channel penetrates vertically in the figure, and its upper opening is the supply port 6a. At the other end of the frame member 5 in the longitudinal direction of the head, a channel is formed that connects to the main common recovery channel. This channel penetrates vertically in the figure, and its upper opening is the recovery port 6b.

[0024] The MEMS component 10, which is formed by joining multiple silicon substrates together, and the resin or metal frame member 5 are joined together with a thermosetting adhesive. Figure 2 illustrates the connection between the MEMS component 10 and the frame member 5. As shown in Figure 2, when joining the MEMS component 10 and the frame member 5, a thermosetting adhesive is applied to the joining surface 8 of the frame member 5, and the adhesive is heated and cured while applying pressure from above and below, as shown by arrow A in the figure.

[0025] After the thermosetting adhesive hardens and joins the MEMS component 10 and the frame member 5, the MEMS component 10 and the frame member 5 undergo thermal contraction as they return to room temperature. The coefficient of thermal expansion of the resin-based adhesive and the resin or metal-based frame member 5 is greater than that of the MEMS component 10, which is mainly composed of a silicon substrate. As a result, the amount of thermal contraction of the adhesive and the frame member 5 is greater than that of the MEMS component 10. The MEMS component 10 experiences stress at the bonding interface in the direction indicated by arrow B in the figure due to the difference in the amount of thermal contraction of the adhesive and the frame member 5.

[0026] Figure 3(a) is a perspective view of the joint region 9a in the conventional configuration, and Figure 3(b) is a cross-sectional view of AA in Figure 3(a). Figure 3(c) is a diagram showing the stress distribution in the nozzle formation region (≒ piezoelectric element arrangement region) of the MEMS component 10 after joining the frame member 5 in the conventional configuration. In Figure 3(c), darker colors indicate higher stress.

[0027] As shown in Figure 3(a), conventionally, adhesive was applied to the entire joining surface 8 of the frame member 5 to join it to the surface of the flow channel substrate 14 of the MEMS component 10. As shown in Figure 3(c), in the conventional configuration, the stress on the MEMS component 10 is high on the longitudinal center side, resulting in a large difference in stress on the MEMS component 10 between the longitudinal center and the ends. This is because, after joining the frame member 5 and the MEMS component 10, the temperature drops to room temperature, causing the frame member 5, which has a high coefficient of linear expansion, to contract more than the MEMS component 10, which has a low coefficient of linear expansion. At this time, the joint surface 8 of the frame member 5 is constrained by being joined to the MEMS component 10, making it difficult for it to displace in the longitudinal direction, but the side of the frame member 5 opposite the joint surface is not constrained, making it easier for it to displace in the longitudinal direction. Thus, the difference in ease of contraction between the joint surface side and the side opposite the joint surface of the frame member 5 causes the frame member 5 to deform so that its longitudinal center protrudes towards the MEMS component 10. This deformation causes the longitudinal center of the MEMS component 10 to be pressed towards the nozzle substrate 11. As a result, it is thought that the stress on the longitudinal center side of the MEMS component 10 has increased.

[0028] Furthermore, stress acts on the entire surface of the MEMS component 10 that is bonded to the flow channel substrate 14, from the adhesive and the frame member, causing the MEMS component 10 to shrink. Due to this stress causing the MEMS component 10 to shrink, and the pressing force generated by the deformation of the frame member 5 described above, a warp occurs in which the central side in the longitudinal direction of the MEMS component 10 protrudes in the direction of liquid discharge, as shown in Figure 2.

[0029] When the MEMS component 10 warps, the vibration characteristics of the diaphragm differ in the longitudinal direction, causing differences in droplet discharge speed in the longitudinal direction, and also causing differences in the discharge direction of the liquid discharged from the nozzle in the longitudinal direction. As a result, the discharge characteristics change in the longitudinal direction, affecting the discharge performance.

[0030] Therefore, in this embodiment, a bonding region is provided between the frame member 5 and the MEMS component 10, where the frame member 5 and the MEMS component 10 are joined by adhesive, and a non-bonding region is provided where the frame member 5 is not joined by adhesive, so that the frame member 5 is partially joined to the MEMS component 10.

[0031] Figure 4 illustrates the joining of the frame member 5 and the MEMS component 10 in this embodiment, where (a) is a schematic diagram showing the joining surface 8 of the frame member 5, and (b) is a cross-sectional view AA of Figure 4(a) in the liquid discharge head. As shown in Figure 4(a), in this embodiment, adhesive is applied only to both sides of the joint surface 8 of the frame member 5 in the longitudinal direction of the head, and around the upper part 20a of the common supply channel main flow and the upper part 20b of the common recovery channel main flow, which serve as communication points. As a result, the joint area 9a that joins to the MEMS component 10 consists only of the joint areas 9a-1 on both sides in the longitudinal direction of the head, and the joint areas 9a-2 around the common supply channel main flow and the common recovery channel main flow. The central part of the joint surface 8 of the frame member 5 is left as a non-joined area 9b, and a predetermined gap (cavity) is formed between it and the MEMS component 10. As shown in Figure 4(b), in this embodiment, the joint areas 9a-1 on both sides in the longitudinal direction extend to the longitudinal end side of the piezoelectric element arrangement area 22 (≒ nozzle formation area).

[0032] The above-mentioned bonding region 9a can be controlled by controlling the amount of adhesive applied and the pressure applied during bonding, thereby controlling the wetting spread during pressurization. For example, by controlling the amount of adhesive applied to the bonding surface 8 of the frame member 5 during dispensing and controlling the adhesive film thickness by controlling the pressure applied during heating, the width of the wetting spread of the adhesive can be controlled, and the bonding region 9a can be controlled.

[0033] It is preferable to use an adhesive whose Young's modulus after heat curing is 2 GPa or higher. By using an adhesive whose Young's modulus after heat curing is 2 GPa or higher, the frame member 5 can be firmly bonded to the MEMS component 10 even if the bonding area is small.

[0034] Figure 5(a) is a perspective view showing the joining region 9a of this embodiment, and Figure 5(b) is a cross-sectional view of AA in Figure 5(a). Figure 5(c) is a diagram showing the stress distribution in the nozzle formation region (≒ piezoelectric element arrangement region 22) of the MEMS component 10 after joining the frame member 5 in this embodiment.

[0035] In this embodiment, as shown in Figure 5(c), the stress on the MEMS component 10 in the nozzle formation region was made almost uniform. This is because the central part of the head is a non-jointed region 9b, as shown in Figures 5(a) and 5(b), with a predetermined gap between the frame member 5 and the MEMS component 10, forming a cavity. Therefore, even if the frame member 5 deforms so that the center of the frame member 5 in the longitudinal direction protrudes toward the MEMS component 10 due to the difference in thermal contraction between the frame member 5 and the MEMS component 10, the center of the MEMS component 10 in the longitudinal direction is not pressed toward the nozzle substrate 11. As a result, the stress on the center of the MEMS component 10 in the longitudinal direction is reduced, and it is considered that the stress on the MEMS component 10 was made almost uniform.

[0036] Furthermore, compared to Figure 3(c), the stress on the nozzle formation region is reduced compared to the conventional configuration. This is because, in the non-joined region 9b, no stress acts to contract the MEMS component 10 from the frame member 5 via the adhesive. Also, the joining regions 9a-2, which are intended for liquid sealing around the main common supply channel and the main common recovery channel on both sides in the short direction, are located outside the nozzle formation region. As a result, the stress on the MEMS component 10 in the joining region 9a around the main common supply channel and the main common recovery channel on both sides in the short direction does not extend to the nozzle formation region. Consequently, as shown in Figure 5(c), it is considered that the stress on the MEMS component 10 in the nozzle formation region has been reduced.

[0037] Thus, in this embodiment, by making the stress on the nozzle formation region, which affects the discharge performance, uniform, it is possible to suppress differences in the vibration characteristics of the diaphragm in the longitudinal direction. In addition, warping of the MEMS component can be suppressed, and droplet discharge performance can be stabilized.

[0038] Furthermore, in this embodiment, the frame member 5 is joined only with a thermosetting adhesive and not with any other material. As a result, the stress on the MEMS component 10 due to the thermal contraction of the frame member 5 is distributed on both sides in the longitudinal direction of the head, around the main flow of the common supply channel, and around the main flow of the common recovery channel, thereby effectively reducing the stress on the MEMS component 10.

[0039] When the degree of deformation of the frame member 5 during thermal contraction is small, or when the difference in the coefficient of linear expansion between the frame member 5 and the MEMS component 10 is small, and the stress on the central part in the longitudinal direction of the MEMS component 10 is not very strong, the configuration shown in Figure 6 may be used. The configuration shown in Figure 6 has multiple joining regions 9a-3 that extend in the short direction of the head and connect the joining region 9a-2 for sealing the main flow of the common supply channel and the joining region 9a-2 for sealing the main flow of the common recovery channel, and the non-joined region 9b is divided into multiple parts. By using the configuration shown in Figure 6, the joining area is increased compared to the configuration shown in Figure 4, and the frame member 5 can be joined to the MEMS component 10 well.

[0040] Furthermore, as shown in Figure 7, the longitudinal length of the joint region at the longitudinal end may be shortened compared to the configuration shown in Figure 4, and the joint region 9a-1 at the longitudinal end may not be connected to the joint region 9a-2 surrounding the main common supply channel and the main common recovery channel. In this configuration, the joint region 9a-1 at the longitudinal end does not extend to the piezoelectric element arrangement region 22, and the area of ​​the joint region 9a-1 at the longitudinal end is reduced compared to the configurations shown in Figures 4 and 6. As a result, the stress on the MEMS component 10 can be reduced compared to the configurations shown in Figures 4 and 6. Therefore, when the difference in the coefficient of thermal expansion between the frame member 5 and the MEMS component 10 is large, the warping of the MEMS component 10 can be effectively suppressed by adopting the configuration shown in Figure 7.

[0041] Figure 8 shows an embodiment in which a groove 15 is provided in the area corresponding to the non-joined region 9b of the joint surface 8 of the frame member 5 to prevent the adhesive from wetting and spreading. Figure 8(a) shows the joint surface 8 of the frame member 5, and Figure 8(b) is a cross-sectional view of Figure 8(a). As shown in Figure 8, by providing grooves 15 in the frame member 5, a joint area 9a can be formed in a desired area. In addition, the volume of the frame member 5 can be reduced, and the thermal shrinkage of the frame member 5 when it returns to room temperature after the adhesive has cured can be reduced. As a result, the stress on the MEMS component 10 via the adhesive can be reduced, and the occurrence of warping of the MEMS component 10 can be further suppressed.

[0042] Figure 9 shows an embodiment in which the portion corresponding to the non-joined area 9b of the frame member 5 is opened. Figure 9(a) shows the joint surface 8 of the frame member 5, and Figure 9(b) is a cross-sectional view of Figure 9(a). As shown in Figure 9, even in a configuration where the portion of the frame member 5 corresponding to the non-joined area 9b is opened to form an opening 16, the spreading of adhesive can be prevented, as in Figure 8, and a joined area 9a can be formed in the desired area. Furthermore, by creating an opening 16, the volume of the frame member 5 can be reduced compared to the configuration shown in Figure 8. As a result, thermal shrinkage of the frame member 5 when it returns to room temperature after the adhesive has heat-cured can be reduced compared to the configuration shown in Figure 8.

[0043] Next, an example of a head module equipped with the liquid discharge head 1 of this embodiment will be described with reference to Figures 10 and 11. Figure 10 is an exploded perspective view illustrating the head module of this embodiment. Figure 11 is an exploded perspective view of the head module of this embodiment, as seen from the nozzle side.

[0044] The head module 100 includes a liquid discharge head (hereinafter also simply referred to as "head") 1 for discharging liquid, a base member 103 for holding a plurality of liquid discharge heads 1, and a cover member 113 that serves as a nozzle cover for the plurality of liquid discharge heads 1. The head module 100 also includes a heat dissipation member 104, a manifold 105 that forms a flow path for supplying liquid to the plurality of liquid discharge heads 1, a printed circuit board (PCB) 106 connected to a flexible wiring member 101, and a module case 107.

[0045] Next, an example of a liquid dispensing apparatus according to the present invention will be described with reference to Figures 12 and 13. Figure 12 is a schematic diagram illustrating a printing apparatus, which is an inkjet recording apparatus used as a liquid ejection device in this embodiment. Figure 11 is a plan view illustrating an example of a head unit of the printing apparatus according to this embodiment.

[0046] The printing apparatus 500, which is a device for discharging this liquid, includes a loading means 501 for loading the continuous body 510, a guiding and transporting means 503 for guiding and transporting the continuous body 510 loaded from the loading means 501 to the printing means 505, a printing means 505 for discharging liquid onto the continuous body 510 to form an image, a drying means 507 for drying the continuous body 510, and an unloading means 509 for unloading the continuous body 510.

[0047] The continuous body 510 is fed out from the main winding roller 511 of the loading means 501, guided and transported by the rollers of the loading means 501, the guiding and transporting means 503, the drying means 507, and the unloading means 509, and then wound up by the winding roller 591 of the unloading means 509. In the printing means 505, this continuous body 510 is transported on the transport guide member 559 facing the head unit 550, and an image is printed by the liquid discharged from the head unit 550.

[0048] In the printing apparatus 500 of this embodiment, the head unit 550 is equipped with the two head modules 100A and 100B described above in this embodiment on a common base member 552.

[0049] Then, when the direction in which the liquid discharge heads 1 are arranged in a direction perpendicular to the transport direction of head modules 100A and 100B is defined as the head array direction, the head rows 1A1 and 1A2 of head module 100A discharge liquid of the same color. Similarly, the head rows 1B1 and 1B2 of head module 100A are paired, the head rows 1C1 and 1C2 of head module 100B are paired, and the head rows 1D1 and 1D2 are paired, and the required color liquid is discharged from each.

[0050] Next, other examples of printing apparatus as a liquid dispensing device according to the present invention will be described with reference to Figures 14 and 15. Figure 14 is a plan view illustrating the main components of the printing apparatus in this example. Figure 15 is a side view illustrating the main components of the printing apparatus in this example.

[0051] The printing apparatus 500 in this example is a serial type apparatus, and the carriage 403 reciprocates in the main scanning direction by the main scanning movement mechanism 493. The main scanning movement mechanism 493 includes a guide member 401, a main scanning motor 405, a timing belt 408, etc. The guide member 401 is stretched across the left and right side plates 491A and 491B and holds the carriage 403 in a movable position. The carriage 403 is then reciprocated in the main scanning direction by the main scanning motor 405 via the timing belt 408 stretched between the drive pulley 406 and the driven pulley 407.

[0052] The carriage 403 is equipped with a liquid discharge unit 440, which integrates a liquid discharge head 1 and a head tank 441, both of which are liquid discharge heads according to the present invention. The liquid discharge head 1 of the liquid discharge unit 440 discharges liquids of various colors, such as yellow (Y), cyan (C), magenta (M), and black (K). The liquid discharge head 1 has a nozzle row consisting of multiple nozzles arranged in a sub-scanning direction perpendicular to the main scanning direction, and is mounted with the discharge direction facing downward. The liquid discharge head 1 is connected to a liquid circulation device, which circulates and supplies liquids of the required colors.

[0053] The printing apparatus 500 is equipped with a transport mechanism 495 for transporting paper 410. The transport mechanism 495 includes a transport belt 412, which is a transport means, and a sub-scanning motor 416 for driving the transport belt 412. The transport belt 412 picks up the paper 410 and transports it to a position facing the liquid discharge head 1. This transport belt 412 is an endless belt and is stretched between a transport roller 413 and a tension roller 414. Pickup can be performed by electrostatic attraction or air suction. The transport belt 412 moves in a circular motion in the sub-scanning direction as the transport roller 413 is rotationally driven by the sub-scanning motor 416 via a timing belt 417 and a timing pulley 418.

[0054] Furthermore, a maintenance and recovery mechanism 420 for maintaining and restoring the liquid discharge head 1 is positioned on one side of the carriage 403 in the main scanning direction, next to the transport belt 412. The maintenance and recovery mechanism 420 consists of, for example, a cap member 421 that caps the nozzle surface of the liquid discharge head 1, and a wiper member 422 that wipes the nozzle surface. The main scanning movement mechanism 493, the maintenance and recovery mechanism 420, and the transport mechanism 495 are mounted on a housing that includes side plates 491A, 491B, and a back plate 491C.

[0055] In the printing apparatus 500 configured in this way, the paper 410 is fed onto the transport belt 412 and held in place, and the paper 410 is transported in the sub-scanning direction by the circular movement of the transport belt 412. Then, by moving the carriage 403 in the main scanning direction and driving the liquid ejection head 1 in accordance with the image signal, liquid is ejected onto the stationary paper 410 to form an image.

[0056] Next, another example of the liquid dispensing unit according to the present invention will be described with reference to Figure 16. Figure 16 is a plan view illustrating the main components of the liquid dispensing unit in this example.

[0057] The liquid discharge unit 440 consists of a housing portion comprising side plates 491A, 491B and a back plate 491C, a main scanning movement mechanism 493, a carriage 403, and a liquid discharge head 1, which are components of the device that discharges the liquid.

[0058] Furthermore, a liquid dispensing unit can also be configured by attaching the aforementioned maintenance and recovery mechanism 420 to, for example, the side plate 491B of the liquid dispensing unit 440.

[0059] Next, yet another example of the liquid dispensing unit according to the present invention will be described with reference to Figure 17. Figure 17 is a front view of the liquid dispensing unit in this example.

[0060] This liquid discharge unit 440 consists of a liquid discharge head 1 to which a flow path component 444 is attached, and a tube 456 connected to the flow path component 444.

[0061] The flow path component 444 is located inside the cover 442. A head tank 441 can be included instead of the flow path component 444. Furthermore, a connector 443 for electrical connection to the liquid discharge head 1 is provided on the upper part of the flow path component 444.

[0062] In this application, the discharged liquid is not particularly limited as long as it has a viscosity and surface tension that can be discharged from the head, but it is preferable that its viscosity becomes 30 mPa·s or less at room temperature and atmospheric pressure, or when heated or cooled. More specifically, it is a solution, suspension, emulsion, etc. containing a solvent such as water or an organic solvent, a colorant such as a dye or pigment, a polymerizable compound, a resin, a functional material such as a surfactant, a biocompatible material such as DNA, amino acids or proteins, calcium, or an edible material such as a natural pigment. These can be used, for example, as inkjet inks, surface treatment liquids, liquids for forming components of electronic elements and light-emitting elements or electronic circuit resist patterns, and material liquids for 3D molding.

[0063] The energy source for discharging liquid includes piezoelectric actuators (multilayer piezoelectric elements and thin-film piezoelectric elements), thermal actuators using electrothermal conversion elements such as heating resistors, and electrostatic actuators consisting of a diaphragm and a counter electrode.

[0064] A "liquid discharge unit" is a liquid discharge head with integrated functional components and mechanisms, and includes an assembly of parts related to liquid discharge. For example, a "liquid discharge unit" may include a combination of a liquid discharge head with at least one of the following components: a head tank, carriage, supply mechanism, maintenance and recovery mechanism, main scanning movement mechanism, and liquid circulation device.

[0065] Here, integration includes, for example, cases where the liquid dispensing head and functional components or mechanisms are fixed to each other by fastening, bonding, engaging, etc., or where one is held movably relative to the other. Furthermore, the liquid dispensing head and functional components or mechanisms may be configured to be detachable from each other.

[0066] For example, some liquid dispensing units have a liquid dispensing head and head tank integrated into one unit. Others have a liquid dispensing head and head tank integrated into one unit, connected to each other by tubes or similar means. In these liquid dispensing units, a unit including a filter can also be added between the head tank and the liquid dispensing head.

[0067] Additionally, some liquid dispensing units have an integrated liquid dispensing head and carriage.

[0068] Furthermore, some liquid dispensing units integrate the liquid dispensing head and the scanning mechanism by movably holding the liquid dispensing head in a guide member that constitutes part of the scanning mechanism. Others integrate the liquid dispensing head, carriage, and main scanning mechanism.

[0069] Furthermore, some liquid dispensing units integrate the liquid dispensing head, carriage, and maintenance / recovery mechanism by fixing a cap component, which is part of the maintenance / recovery mechanism, to a carriage to which the liquid dispensing head is attached.

[0070] Furthermore, some liquid discharge units have a head tank or a liquid discharge head to which flow path components are attached, to which a tube is connected, integrating the liquid discharge head and the supply mechanism. Through this tube, the liquid from the liquid storage source is supplied to the liquid discharge head.

[0071] The main scanning movement mechanism shall include the guide member alone. The supply mechanism shall also include the tube alone and the loading section alone.

[0072] Here, the "liquid dispensing unit" is described in combination with a liquid dispensing head, but the "liquid dispensing unit" also includes a head module or head unit that includes the liquid dispensing head mentioned above, as well as the functional components and mechanisms described above, all integrated together.

[0073] "Liquid dispensing devices" include devices that have a liquid dispensing head, liquid dispensing unit, head module, head unit, etc., and drive the liquid dispensing head to dispense liquid. Liquid dispensing devices include not only devices that can dispense liquid onto surfaces to which liquid can adhere, but also devices that dispense liquid into air or into liquid.

[0074] This "liquid dispensing device" may also include means for feeding, transporting, and dispensing paper onto materials to which liquid can adhere, as well as pre-treatment devices, post-treatment devices, etc.

[0075] For example, "devices that dispense liquids" include image forming machines, which dispense ink to form images on paper, and three-dimensional molding machines, which dispense molding liquid into a powder layer formed in layers to create three-dimensional objects.

[0076] Furthermore, "devices that dispense liquid" are not limited to those that visualize meaningful images such as letters or figures through the dispensed liquid. For example, devices that form patterns that do not have meaning in themselves, or devices that create three-dimensional images, are also included.

[0077] The term "materials to which liquid can adhere" above refers to materials to which liquid can adhere, at least temporarily, including materials that adhere and solidify, or materials that adhere and penetrate. Specific examples include recording media such as paper, recording paper, film, and cloth; electronic components such as electronic circuit boards and piezoelectric elements; powder layers; organ models; and inspection cells. Unless otherwise specified, it includes all materials to which liquid can adhere.

[0078] The materials referred to as "materials to which liquid can adhere" above include paper, thread, fibers, fabrics, leather, metal, plastic, glass, wood, ceramics, etc., as long as liquid can adhere to them, even temporarily.

[0079] Furthermore, "liquid dispensing devices" include devices in which the liquid dispensing head and the surface to which the liquid can adhere move relative to each other, but are not limited to these. Specific examples include serial-type devices in which the liquid dispensing head moves, and line-type devices in which the liquid dispensing head does not move.

[0080] Other examples of "devices that dispense liquids" include processing liquid coating devices that dispense processing liquid onto the surface of paper for purposes such as modifying the surface of the paper, and injection granulation devices that granulate fine particles of raw materials by spraying a compositional solution, in which raw materials are dispersed in a solution, through a nozzle.

[0081] In this application, the terms image formation, recording, printing, copying, printing, and shaping are all considered synonymous.

[0082] The above is just one example; each of the following embodiments produces its own unique effects. (Aspect 1) The liquid discharge head 1 comprises a substrate component such as a MEMS component 10 having at least a nozzle for discharging liquid, a flow path (individual flow path or common flow path) communicating with the nozzle, and a piezoelectric element, and a frame member 5 having a communication portion communicating with the flow path (in this embodiment, the upper part 20a of the main flow of the common supply flow path and the upper part 20b of the main flow of the common recovery flow path) and being joined to the substrate component by adhesive, wherein the space between the frame member 5 and the substrate component has a bonded region 9a joined by adhesive and an unbonded region 9b, the bonded region 9a is provided at least around the communication portion of the frame member 5 and at the end of the substrate component, and the substrate component and the frame member 5 are joined by only one adhesive. Generally, substrate components are made mainly of silicon, while frame members 5 are made of resin or metal with a higher coefficient of thermal expansion than the substrate components. Because the coefficient of thermal expansion of frame members 5 is greater than that of the substrate components, the amount of thermal expansion and contraction of frame members 5 is greater than that of the substrate components. Thermosetting adhesives are commonly used to join the substrate components and frame members 5. After heating the substrate components and frame members 5 to cure the adhesive and join them, when the substrate components and frame members are returned to room temperature, the amount of thermal contraction of frame members 5 is greater than that of the substrate components. As a result, stress is generated in the substrate components through the joint area between them, causing them to contract. This stress can cause the substrate components to warp convexly, with the central part on the nozzle side protruding in the discharge direction, potentially affecting the liquid discharge performance from the nozzle. Patent Document 1 describes a configuration in which a frame member 5 and a substrate component are bonded together by an adhesive in a bonded region and an unbonded region that is not bonded by an adhesive. By partially bonding the frame member to the substrate component, stress due to the difference in thermal contraction between the frame member 5 and the substrate component is eliminated in the unbonded region, thereby reducing warping of the substrate component. However, in Patent Document 1, the potting agent flows into a part of the non-bonded region, and a part of the non-bonded region is filled with the potting agent. Therefore, in the non-bonded region filled with the potting agent, stress due to differences in the amount of thermal shrinkage acts on the substrate component to some extent through the potting agent, and there was a risk that the stress acting on the substrate component could not be as intended. In contrast, in Embodiment 1, all non-jointed regions are cavities not filled with material, so no stress is applied to the substrate component due to the difference in the amount of thermal contraction between the frame member 5 and the substrate component in all non-jointed regions. This allows for good control of the stress acting on the substrate component. Furthermore, joining regions are provided at least around the connecting portion of the frame member necessary for liquid sealing and at the ends of the frame member. As explained with reference to Figure 3, the stress due to the difference in thermal expansion between the frame member and the substrate component via the adhesive increases towards the center of the substrate component. Therefore, by firmly joining the frame member to the substrate component at the ends of the frame member where the stress on the substrate component is weaker than at the center, it is possible to secure a non-jointed region with as large an area as possible towards the center and reduce the area of ​​the joined region at the center. This reduces the stress on the substrate component, effectively suppresses warping of the substrate component, and effectively suppresses the deterioration of liquid discharge performance.

[0083] (Aspect 2) In embodiment 1, the joining region 9a is only the area around the connecting portion of the frame member 5 (in this embodiment, the upper part 20a of the main common supply channel and the upper part 20b of the main common recovery channel) and the longitudinal end of the frame member 5. According to this, as explained in Figure 7, compared to a configuration that has bonding areas other than around the connecting portion of the frame member 5 (in this embodiment, the upper part 20a of the main common supply channel and the upper part 20b of the main common recovery channel) and the longitudinal ends of the frame member 5, the bonding area can be reduced, and the stress on substrate components such as MEMS components 10 through the bonding area due to the thermal contraction of the frame member when it returns to room temperature after the adhesive has been heat-cured can be reduced. Therefore, even when there is a large difference in the coefficient of linear expansion between the frame member 5 and the substrate component, the occurrence of warping of the substrate component can be well suppressed, and the decrease in discharge performance can be suppressed.

[0084] (Aspect 3) In embodiment 2, the joining region 9a-2 around the connecting portion (in this embodiment, the upper part 20a of the main common supply channel and the upper part 20b of the main common recovery channel) and the joining region 9a-1 at the longitudinal end are discontinuous. As explained using Figure 7, compared to a configuration where the bonding area 9a-2 around the connecting portion (in this embodiment, the upper part 20a of the main common supply channel and the upper part 20b of the main common recovery channel) and the bonding area 9a-1 at the longitudinal end are continuous, the bonding area can be reduced, and the stress on substrate components such as MEMS components 10 through the bonding area due to the thermal contraction of the frame member when it returns to room temperature after the adhesive has been heat-cured can be reduced. Therefore, even when there is a large difference in the coefficient of linear expansion between the frame member 5 and the substrate component, the occurrence of warping of the substrate component can be effectively suppressed, and the decrease in discharge performance can be suppressed.

[0085] (Aspect 4) In embodiment 1, the end joint region 9a-1 is provided at the longitudinal end of the frame member 5, and in a cross section perpendicular to the short direction of the liquid discharge head, the end joint region overlaps with the longitudinal end side of the piezoelectric element arrangement region where the piezoelectric element is arranged. According to this, as explained using Figures 4 and 5, even if a part of the bonding area overlaps with the longitudinal end of the piezoelectric element arrangement area 22, the stress applied to the nozzle formation area of ​​the substrate component such as the MEMS component 10 can be made nearly uniform, and the stress applied to the nozzle formation area can be reduced compared to when the entire surface of the frame member is bonded to the substrate component. As a result, the occurrence of warping of the substrate component can be effectively suppressed, and the deterioration of ejection performance can be suppressed.

[0086] (Appendix 5) In any of embodiments 1 to 4, the communication section (in this embodiment, the upper part 20a of the main common supply channel and the upper part 20b of the main common recovery channel) is provided on both sides of the frame member 5 in the short direction, and the end joint region 9a-1 is provided at the end of the frame member in the longitudinal direction, and the central side that overlaps with the piezoelectric element arrangement region 22 where piezoelectric elements are arranged between the frame member 5 and substrate components such as MEMS components 10 has a joint region 9a-3 that connects the joint region 9a-2 around the communication section provided on one side in the short direction and the joint region 9a-2 around the communication section provided on the other side in the short direction, and one or more non-joint regions 9b. According to this, as explained with reference to Figure 6, a plurality of non-bonded regions 9b are provided on the longitudinal center side of the frame member, each having a predetermined gap between the frame member and the substrate component such as the MEMS component 10. Therefore, the stress on the substrate component when the longitudinal center side of the frame member deforms to protrude towards the substrate component side when it returns to room temperature after the adhesive has been heat-cured, and the stress on the substrate component that tries to shrink the substrate component through the adhesive can be reduced. This suppresses the occurrence of warping in the substrate component. Furthermore, compared to a design without a bonding region 9a-3 that connects the bonding region 9a-2 around the communication portion on one side in the short direction and the bonding region 9a-2 around the communication portion on the other side in the short direction, the bonding area can be increased, and the frame member 5 can be joined to the substrate component more effectively.

[0087] (Aspect 6) In any of embodiments 1 to 5, a groove 15 is provided at the location of the frame member 5 corresponding to the non-joined area 9b. According to this, as explained using Figure 8, it is possible to prevent the adhesive applied to the joining region of the frame member 5 from wetting and spreading into the non-joining region 9b, thus preventing the non-joining region 9b from becoming joined. This makes it possible to make the desired region the joining region. In addition, the volume of the frame member is reduced, and the amount of thermal shrinkage of the frame member when it returns to room temperature after the adhesive has been heat-cured can be suppressed, thereby reducing the stress on substrate components such as the MEMS component 10.

[0088] (Aspect 7) In any of embodiments 1 to 5, an opening 16 is provided at the location of the frame member 5 corresponding to the non-joined area 9b. According to this, as explained using Figure 9, it is possible to prevent the adhesive applied to the joining region of the frame member 5 from wetting and spreading into the non-joining region 9b, thus preventing the non-joining region 9b from becoming joined. This makes it possible to make the desired region the joining region. In addition, the volume of the frame member is reduced, and the amount of thermal shrinkage of the frame member when it returns to room temperature after the adhesive has been heat-cured can be suppressed, thereby reducing the stress on substrate components such as the MEMS component 10.

[0089] (Pattern 8) In any of embodiments 1 to 7, the coefficient of thermal expansion of substrate components such as MEMS components 10 is smaller than the coefficient of thermal expansion of frame members 5. According to this, as described in the embodiment, stress is applied to substrate components such as the MEMS component 10 due to the thermal contraction of the frame member when it returns to room temperature after the adhesive has been heat-cured. However, by having any of the configurations in embodiments 1 to 7, the occurrence of warping of the substrate components due to this stress can be effectively suppressed.

[0090] (Aspect 9) In any of embodiments 1 to 8, substrate components such as MEMS components are formed mainly from silicon. According to this, substrate components such as MEMS components can be manufactured using microfabrication technologies for MEMS and semiconductor devices.

[0091] (Aspect 10) In any of embodiments 1 to 9, the adhesive is a thermosetting resin, and its coefficient of thermal expansion is greater than that of the substrate component such as the MEMS component 10. According to this, when the adhesive returns to room temperature after heat curing, stress is applied to substrate components such as the MEMS component 10 due to thermal shrinkage of the adhesive. However, by having any of the configurations in embodiments 1 to 7, the occurrence of warping of the substrate components due to this stress can be effectively suppressed.

[0092] (Aspect 11) In any of embodiments 1 to 10, the Young's modulus of the adhesive after curing is 2 GPa or higher. According to this, as described in the embodiment, the frame member 5 can be firmly bonded to substrate components such as the MEMS component 10.

[0093] (Aspect 12) A head module 100 is provided with a liquid discharge head 1, wherein the liquid discharge head is one of the liquid discharge heads of embodiment 1 to 11. According to this, a head module 100 with good discharge performance can be provided.

[0094] (Aspect 13) A device for dispensing liquid, comprising a liquid dispensing head according to any of embodiments 1 to 11 or a head module according to embodiment 12. According to this, it is possible to provide a device that dispenses liquid with good dispensing performance. [Explanation of Symbols]

[0095] 1: Liquid dispensing head 5: Frame members 6a: Supply port 6b: Collection port 8: Joint surface 9a: Junction area 9b: Non-bonded area 10: MEMS components 11: Nozzle substrate 12: Actuator board 13: Damper component 14: Flow channel substrate 15: Groove 16: Opening 20a: Upper part of the main stream of the common supply channel 20b: Upper part of the main stream of the common recovery channel 22: Piezoelectric element arrangement area 100: Head Module 101: Flexible wiring components 102: Drive Circuit 103: Base component 104: Heat dissipation component 105: Manifold 107: Module Case 113: Cover component 401: Guide member 403: Carriage 405: Main scanning motor 406: Drive pulley 407: Driven pulley 408: Timing belt 410: Paper 412: Conveyor belt 413: Conveyor roller 414: Tension Roller 416: Sub-scanning motor 417: Timing belt 418: Timing pulley 420: Maintenance and recovery mechanism 421: Cap component 422: Wiper component 440: Liquid Dispensing Unit 441: Head Tank 442: Cover 443: Connector 444: Flow channel component 456: Tube 493: Main scanning movement mechanism 495: Conveying mechanism 500:Printing device 501: Delivery method 503: Guidance and transport means 505: Printing means 507 :Drying means 509:Export means 510: Continuum 511: Original winding roller 550: Head Unit 552: Common base component 559: Conveyor guide member 591: Winding roller [Prior art documents] [Patent Documents]

[0096] [Patent Document 1] Patent No. 4735819

Claims

1. A substrate component having at least a nozzle for discharging liquid, a flow path communicating with the nozzle, and a piezoelectric element, A liquid discharge head comprising a frame member having a communication portion that communicates with the aforementioned flow path and is joined to the substrate component by adhesive, The space between the frame member and the substrate component has a bonded area joined by the adhesive and a non-bonded area not joined by the adhesive. The joining region is provided at least around the communication portion of the frame member and at the end of the frame member. A liquid dispensing head characterized in that all non-jointed areas are cavities not filled with material.

2. A liquid dispensing head according to claim 1, The liquid discharge head is characterized in that the joining region is only the area around the communication portion of the frame member and the longitudinal end of the frame member.

3. A liquid dispensing head according to claim 2, A liquid dispensing head characterized in that the joining region around the communication portion and the joining region at the longitudinal end are discontinuous.

4. A liquid dispensing head according to claim 1, The aforementioned end joint region is provided at the longitudinal end of the frame member, A liquid discharge head characterized in that, in a cross-section perpendicular to the short direction of the liquid discharge head, the joining region at the end overlaps with the longitudinal end side of the piezoelectric element arrangement region where the piezoelectric element is arranged.

5. A liquid dispensing head according to claim 1, The aforementioned communication portion is provided on both sides of the frame member in the short direction, The aforementioned end joint region is provided at the longitudinal end of the frame member, A liquid discharge head is characterized in that, on the longitudinal central side between the frame member and the substrate component, there is a joining region that connects a joining region around a communication portion provided on one side in the short direction with a joining region around a communication portion provided on the other side in the short direction, and one or more non-jointed regions.

6. A liquid dispensing head according to claim 1, A liquid dispensing head characterized in that grooves are provided in the portion of the frame member corresponding to the non-joined area.

7. A liquid dispensing head according to claim 1, A liquid dispensing head characterized in that an opening is provided in the portion of the frame member corresponding to the non-joined area.

8. A liquid dispensing head according to claim 1, A liquid dispensing head characterized in that the coefficient of thermal expansion of the substrate component is smaller than the coefficient of thermal expansion of the frame member.

9. A liquid dispensing head according to claim 1, The liquid dispensing head is characterized in that the substrate component is formed mainly of a material made of silicon.

10. A liquid dispensing head according to claim 1, The adhesive is a thermosetting resin, and the liquid dispensing head is characterized in that its coefficient of linear expansion is greater than that of the substrate component.

11. A liquid dispensing head according to claim 1, A liquid dispensing head characterized in that the Young's modulus of the adhesive after curing is 2 GPa or more.

12. A head module equipped with a liquid dispensing head, A head module characterized in that the liquid discharge head used is the liquid discharge head described in claim 1.

13. A device for dispensing liquid, A liquid dispensing device characterized by comprising a liquid dispensing head according to claim 1 or a head module according to claim 12.

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