Integrated liquid-cooled heat release device

Abstract

The present invention provides an integrated liquid cooling and heat dissipation device in which the liquid flows uniformly through the liquid heat dissipation tubes, and the flow velocity is not too high. [Solution] The integrated liquid cooling heat dissipation device according to the present invention includes a liquid cooling train 100 and a liquid cooling head 200. The liquid cooling train 100 includes a first liquid box 10, a second liquid box 20, and a heat dissipation tube assembly 30 connected between the first liquid box 10 and the second liquid box 20. The liquid cooling head 200 is connected to the first liquid box 10 and is used for bonding processors. A low-temperature liquid chamber 14 and a high-temperature liquid chamber 15 are formed inside the first liquid box 10 of the liquid cooling train 100, and a flow divider plate 16 is provided inside the low-temperature liquid chamber 14. The flow divider plate 16 has a plurality of through holes 164 on both sides.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling and heat dissipation devices, and particularly to an integrated liquid cooling and heat dissipation device for cooling and dissipating heat from servers and the like.

Background Art

[0002] Currently, liquid cooling devices used in computers and servers are generally of a separated type, including elements and units such as a separated liquid cooling row, a liquid cooling head, and a liquid pump, and are connected by multiple liquid tubes to form a closed-loop system. However, the separated structure is not compact and is inconvenient to install. The inventor has previously applied for the design of an integrated liquid cooling and heat dissipation device. In the integrated liquid cooling and heat dissipation device, a liquid pump is provided inside the liquid cooling row, a liquid cooling head is provided at the bottom of the bottom cooling row, and the liquid cooling head can be attached to the processor to realize the liquid cooling function for the processor.

Summary of the Invention

Problems to be Solved by the Invention

[0003] In the known liquid cooling row structure design, liquid cannot flow uniformly into each heat dissipation tube, resulting in non-uniform heat dissipation efficiency. Specifically, when the flow rate of the cooling liquid in some heat dissipation tubes is large and the flow rate in other heat dissipation tubes is small, heat cannot be effectively carried out, and the heat dissipation efficiency decreases in some areas. Such non-uniform flow causes the temperature distribution in the processor to become unbalanced, affecting the stability and performance of the processor.

[0004] On the other hand, if the flow rate of the liquid is too fast, although the total flow rate of the heat dissipation device increases, the liquid flowing through the heat dissipation tube and the liquid cooling head does not have sufficient residence time for heat absorption. As a result, heat may not be fully transferred to the cooling liquid, and overall heat dissipation may be insufficient. It is ideal to ensure that the liquid has sufficient residence time for heat absorption and that the slow flow rate of the cooling liquid does not affect the circulation efficiency.

Means for Solving the Problems

[0005] The main objective of the present invention is to solve the problems of conventional heat dissipation devices, such as uneven flow velocity and excessively high flow velocity in the heat dissipation tubes, and to provide an integrated liquid-cooled heat dissipation device that allows for uniform flow into the liquid heat dissipation tube and has a moderate flow velocity.

[0006] The next objective of the present invention is to provide an integrated liquid cooling and heat dissipation device that solves the problem of high-temperature liquid flowing from a liquid cooling head being diverted to an adjacent coolant, and that ensures the coolant flows to the liquid cooling head at a low temperature.

[0007] To achieve the above objective, the present invention provides an integrated liquid-cooled heat dissipation device. The integrated liquid cooling heat dissipation device includes a liquid cooling train and a liquid cooling head. The liquid cooling train includes a first liquid box, a second liquid box, and a heat dissipation tube assembly. The heat dissipation tube assembly includes a plurality of first heat dissipation tubes, second heat dissipation tubes, and heat dissipation fins. Both ends of the first and second heat dissipation tubes are connected to the flat metal tubes of the first and second liquid boxes, respectively, and the heat dissipation fins are positioned on the outer surfaces of the first and second heat dissipation tubes, respectively. The top surface of the liquid cooling head is bonded to the outer surface of the bottom wall of the first liquid box, and the bottom surface of the liquid cooling head is bonded to the surface of the processor. The first liquid box includes a first box body and a first box cover. A first chamber is recessed in the upper surface of the first box body, and the inside of the first chamber is divided into a low-temperature liquid chamber and a high-temperature liquid chamber by a thermal barrier structure. The bottoms of the low-temperature liquid chamber and the high-temperature liquid chamber are connected to the inside of the liquid cooling head via low-temperature liquid holes and high-temperature liquid holes, respectively. The first box cover covers the upper end of the first box body. The upper wall of the first box cover is provided with a number of first heat dissipation tube insertion holes that connect to the low-temperature liquid chamber and the high-temperature liquid chamber, and the lower ends of the first heat dissipation tube and the second heat dissipation tube are inserted into the first heat dissipation tube insertion holes, respectively. A flow divider plate is provided in the cryogenic liquid chamber, and through holes are provided on both sides of the flow divider plate. Due to the flow divider plate, the liquid entering the cryogenic liquid chamber from the first heat dissipation tube first passes through multiple through holes before flowing into the inside of the liquid cooling head through the cryogenic liquid holes. [Effects of the Invention]

[0008] 1. Multiple through holes provided in the flow divider plate slow down the flow velocity of the cryogenic liquid as it flows to the liquid cooling head. This increases the residence time of the liquid in the first heat dissipation tube, improves the heat exchange efficiency between the liquid and the heat dissipation fins, and ensures that the liquid is sufficiently cooled.

[0009] 2. The flow divider plate uniformly disperses the liquid into the first heat dissipation tubes and allows the coolant to flow uniformly into each of the first heat dissipation tubes, thereby uniformly dissipating heat from the liquid and improving the overall cooling efficiency.

[0010] 3. The thermal barrier structure is designed to prevent heat transfer from the high-temperature liquid flowing into the high-temperature liquid chamber to the adjacent low-temperature liquid chamber, thereby preventing the cooled liquid from being reheated. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic three-dimensional view of an integrated liquid-cooled heat dissipation device according to the present invention. [Figure 2] This is a schematic exploded view of the liquid cooling train and liquid cooling head according to the present invention. [Figure 3] This is an exploded schematic diagram of the liquid-cooled train according to the present invention. [Figure 4] Figure 1 is a schematic vertical cross-sectional view of the integrated liquid-cooled heat dissipation device according to the present invention. [Figure 5] This is an exploded schematic diagram of the first liquid box area of ​​the liquid-cooled train according to the present invention. [Figure 6] This is an exploded schematic diagram of the entire first liquid box of the liquid cooling train according to the present invention. [Figure 7] This is a schematic diagram of the flow-dividing partition plate and thermal barrier structure according to the present invention. [Figure 8] This is a schematic exploded view of the second liquid box of the liquid cooling train according to the present invention. [Modes for carrying out the invention] [Examples]

[0012] Refer to Figure 1, which shows a preferred specific embodiment of the integrated liquid-cooled heat dissipation device of the present invention. The integrated liquid-cooled heat dissipation device of the present invention includes a liquid cooling train 100, a liquid cooling head 200, and a liquid pump 300.

[0013] Refer to Figures 1 and 3 together. The liquid cooling train 100 includes a first liquid box 10, a second liquid box 20, and a heat dissipation tube assembly 30. The first liquid box 10 and the second liquid box 20 are formed as hollow boxes from a heat dissipation metal (aluminum alloy), and working liquid (water or other coolant) is injected into the interior of the first liquid box 10 and the second liquid box 20. The heat dissipation tube assembly 30 includes a plurality of parallel, spaced-apart first heat dissipation tubes 31, second heat dissipation tubes 32, and heat dissipation fins 33. The first heat dissipation tubes 31 and the second heat dissipation tubes 32 form flat metal tubes, with both ends connected to the first liquid box 10 and the second liquid box 20, respectively, and the heat dissipation fins 33 are arranged on the outer surfaces of the first heat dissipation tubes 31 and the second heat dissipation tubes 32.

[0014] One surface of the liquid cooling head 200 is connected to the outer surface of the bottom wall of the first liquid box 10, thereby directly connecting the liquid cooling head 200 to the bottom wall of the first liquid box 10 through a connected structure, while the other surface of the liquid cooling head 200 is in contact with the processor (not shown) to cool the processor. A liquid pump 300 is installed inside the second liquid box 20, causing the working liquid inside the liquid cooling train 100 to circulate sequentially between the first liquid box 10, the second liquid box 20, the heat dissipation tube assembly 30, and the liquid cooling head 200 (Figure 4).

[0015] Refer to Figures 5 and 6. In a preferred embodiment of the first liquid box 10 of the present invention, a first box body 11 and a first box cover 12 are included. The first box body 11 is formed by press-forming an aluminum alloy into a single box body, with the upper end recessed to form a first chamber, and the inside of the first chamber is divided into a low-temperature liquid chamber 14 and a high-temperature liquid chamber 15 by a thermal barrier structure 13. The bottoms of the low-temperature liquid chamber 14 and the high-temperature liquid chamber 15 are connected to the inside of the liquid cooling head 200 via low-temperature liquid holes 141 and high-temperature liquid holes 151, respectively (Figure 4). The first box cover 12 is formed by press-forming an aluminum alloy into a single lid body, and is welded to cover the box opening at the top of the first box body 11. By providing a plurality of first heat dissipation tube insertion holes 121 in the upper wall of the first box cover 12, which are connected to the low-temperature liquid chamber 14 and the high-temperature liquid chamber 15, the lower ends of the first heat dissipation tube 31 and the second heat dissipation tube 32 are inserted into the first heat dissipation tube insertion holes 121, respectively. Thus, one end (lower end) of the first heat dissipation tube 31 is connected to the low-temperature liquid chamber 14, and one end (lower end) of the second heat dissipation tube 32 is connected to the high-temperature liquid chamber 15. In this invention, a flow divider plate 16 is provided in the low-temperature liquid chamber 14, and a plurality of through holes 164 are provided on both sides of the flow divider plate 16. With the installation of the flow divider plate 16, the liquid (low-temperature liquid) entering the low-temperature liquid chamber 14 from the first heat dissipation tube 31 first passes through the plurality of through holes 164, has its flow velocity controlled, and then flows into the liquid cooling head 200 through the low-temperature liquid holes 141.

[0016] Refer to FIGS. 6 and 7 together. A preferred embodiment of the flow-dividing partition plate 16 is a bent and integrally formed aluminum alloy plate, including a first plate 161 of the first heat dissipation tube 31 corresponding to the first box cover 12, a second plate 162 connected to one end of the first plate 161, and a third plate 163 connected to the other end of the first plate 161. The bending direction and angle of the second plate 162 and the third plate 163 can be adjusted according to the space inside the first box body 11. However, regardless of this. In a preferred embodiment, the second plate 162 is fixed to one side of the heat blocking structure 13, and the end of the third plate 163 is fixed (for example, welded) to the inner surface of the first box cover 12 (FIG. 4). A plurality of through holes 164 are provided in the first plate 161, and the plurality of through holes 164 correspond to the first heat dissipation tube insertion holes 121 (one end of the first heat dissipation tube 31). The arrangement and range of the plurality of through holes 164 can be modified according to the requirements of flow rate control, and the plurality of through holes 164 can also be arranged on the second plate 162 or the third plate 163.

[0017] The second plate 162 on one side of the aforementioned flow-dividing partition plate 16 is welded to one side of the heat blocking structure 13 by welding. Welding means such as CAB in-furnace brazing or aluminum alloy cavity welding can be used, or as shown in FIGS. 6 and 7, two fixing holes 165 are provided on one side of the second plate 162 corresponding to the heat blocking structure 13, and two fixing protrusions 133 are provided on one side of the heat blocking structure 13. When assembling, such fixing protrusions are inserted into the fixing holes 165 to fix the flow-dividing partition plate 16 to one side of the heat blocking structure 13. If necessary, welding can be performed using the aforementioned welding means.

[0018] Continuing as shown in FIGS. 4, 5 and 6, preferably, the heat blocking structure 13 includes a low-temperature liquid partition plate 131 and a high-temperature liquid partition plate 132. The low-temperature liquid partition plate 131 and the high-temperature liquid partition plate 132 are arranged in parallel with each other at a certain interval in the first chamber of the first box body 11 to partition the low-temperature liquid chamber 14 and the high-temperature liquid chamber 15. Further, the periphery of the low-temperature liquid partition plate 131 and the high-temperature liquid partition plate 132 is welded to the inner wall of the first chamber and the inner wall of the first box cover 12 by using the welding means described above. Thereby, the second plate 162 of the flow dividing partition plate 16 can be fixed to one surface of the low-temperature liquid partition plate 131 by the assembly or welding structure described above.

[0019] According to the above-described structural design of the present invention, the flow rate of the liquid (low-temperature liquid) to the liquid cooling head 200 can be controlled by the plurality of through holes 164 of the flow dividing partition plate 16. Such flow rate control can increase the residence time of the liquid in the first heat radiation tube 31, improve the heat exchange efficiency between the liquid and the heat radiation fins 33, sufficiently cool the liquid, and improve the cooling effect of the processor. In addition, the flow dividing partition plate 16 distributes the liquid uniformly to the first heat radiation tube 31, and ensures that the liquid (coolant) flows uniformly to the first heat radiation tube 31 respectively. By uniformly controlling the flow of the liquid, it is possible to avoid a situation where the flow rate of the liquid is too fast in some heat radiation tubes, uniformly radiate the liquid, and improve the overall heat radiation effect. In addition, according to the design of the heat blocking structure 13 of the present invention, a heat blocking space in which heat is not transferred between the low-temperature liquid partition plate 131 and the high-temperature liquid partition plate 132 is formed, and the high-temperature liquid flowing in the high-temperature liquid chamber 15 does not flow into the low-temperature liquid in the adjacent low-temperature liquid chamber 14, and the low-temperature liquid whose temperature has once dropped is prevented from being reheated, thereby improving the cooling effect of the liquid cooling head 200.

[0020] Refer to Figures 2 to 4 and Figure 8. Preferably, the present invention provides a structure in which a liquid pump 300 is attached to a second liquid box 20, and includes a second box body 21, a second partition plate 22, and a second box cover 23. The upper end of the second box body 21 is recessed to form a second chamber. The second partition plate 22 is provided inside the second chamber to divide the second chamber into a liquid output chamber 24 and a liquid input chamber 25. Multiple second heat dissipation tube insertion holes 211 are provided in the bottom wall of the second box body 21, which are connected to the liquid output chamber 24 and the liquid input chamber 25. The upper ends of the first heat dissipation tube 31 and the second heat dissipation tube 32 are inserted into the second heat dissipation tube insertion holes 211, respectively, so that one end of the first heat dissipation tube 31 and the second heat dissipation tube 32 are connected to the liquid output chamber 24 and the liquid input chamber 25, respectively. The second box cover 23 covers the opening at the upper end of the second box body 21, and the second box cover 23 has a base that extends to the liquid input chamber 25, forming a liquid pump mounting chamber 26 inside the base. The liquid pump mounting chamber 26 is provided with a liquid input hole 261 that connects to the liquid input chamber 25 and a liquid output hole 262 that connects to the liquid output chamber 24. The liquid pump 300 is a known component, and by placing the liquid pump 300 in the liquid pump mounting chamber 26, the liquid pump 300 is placed in the liquid input chamber 25 of the second liquid box 20, causing the liquid transported by the pump to circulate and flow, thereby forming an integrated liquid cooling and heat dissipation device including the liquid pump 300. [Explanation of Symbols]

[0021] 100 liquid cooling row 10. First liquid box 11. First Box Body 12. Box Cover 121 First heat dissipation tube insertion hole 13 Heat blocking structure 131 Low-temperature liquid partition plate 132 High-temperature liquid partition plate 133 Fixed protrusion 14. Cryogenic liquid chamber 141 Cryogenic liquid hole 15 High-temperature liquid chamber 151 High temperature liquid hole 16 Dividing partition plates 161 Plate 1 162 Plate 2 163 Third Plate 164 holes 165 Fixed hole 20 Second liquid box 21. Second Box Body 211 Second heat dissipation tube insertion hole 22 Second partition plate 23. Second Box Cover 24 Liquid output chambers 25 Liquid Input Chamber 26 Liquid pump mounting chamber 261 Liquid Inlet Port 262 liquid output holes 30 Heat dissipation tube set 31. First heat dissipation tube 32. Second heat dissipation tube 33 heat dissipation fins 200 liquid cooling heads 300 liquid pump

Claims

1. An integrated liquid cooling heat dissipation device including a liquid cooling train and a liquid cooling head, The liquid cooling train includes a first liquid box, a second liquid box, and a heat dissipation tube assembly, the heat dissipation tube assembly includes a plurality of first heat dissipation tubes, second heat dissipation tubes, and heat dissipation fins, the ends of the first heat dissipation tubes and the second heat dissipation tubes are connected to the flat metal tubes of the first liquid box and the second liquid box, respectively, and the heat dissipation fins are arranged on the outer surfaces of the first heat dissipation tubes and the second heat dissipation tubes, respectively. The upper surface of the liquid cooling head is bonded to the outer surface of the bottom wall of the first liquid box, and the bottom surface of the liquid cooling head is bonded to the surface of the processor. The first liquid box includes a first box body and a first box cover, a first chamber is recessed in the upper surface of the first box body, the inside of the first chamber is divided into a low-temperature liquid chamber and a high-temperature liquid chamber by a thermal barrier structure, and the bottoms of the low-temperature liquid chamber and the high-temperature liquid chamber are connected to the inside of the liquid cooling head via low-temperature liquid holes and high-temperature liquid holes, respectively. The first box cover covers the upper end of the first box body, and the upper wall of the first box cover is provided with a plurality of first heat dissipation tube insertion holes that connect to the low-temperature liquid chamber and the high-temperature liquid chamber, and the lower ends of the first heat dissipation tube and the second heat dissipation tube are respectively inserted into the first heat dissipation tube insertion holes. An integrated liquid cooling and heat dissipation device characterized in that a flow divider plate is provided in the cryogenic liquid chamber, the flow divider plate is provided with through holes that connect both sides, and the liquid entering the cryogenic liquid chamber from the first heat dissipation tube flows through a plurality of through holes before entering the inside of the liquid cooling head through the cryogenic liquid holes, as a result of the flow divider plate.

2. The flow divider plate is formed from a bent metal plate and includes a first plate corresponding to the first heat dissipation tube insertion hole of the first box cover, a second plate connected to one end of the first plate, and a third plate connected to the other end of the first plate. The integrated liquid cooling heat dissipation device according to claim 1, characterized in that the second plate is fixed to one surface of the heat blocking structure, and the end of the third plate is bonded and fixed to the inner surface of the first box cover.

3. The integrated liquid-cooled heat dissipation device according to claim 2, characterized in that the plurality of through holes are arranged in the first plate, the second plate, or the third plate.

4. The integrated liquid-cooled heat dissipation device according to claim 2, characterized in that the second plate is welded to one surface of the heat-blocking structure.

5. The thermal barrier structure includes a low-temperature liquid partition plate and a high-temperature liquid partition plate. The integrated liquid cooling and heat dissipation device according to claim 4, characterized in that the low-temperature liquid partition plate and the high-temperature liquid partition plate are arranged parallel to each other in the first chamber, the areas around the low-temperature liquid partition plate and the high-temperature liquid partition plate are arranged on the inner wall of the first chamber and the inner wall of the first box cover, and the second plate is fixed to one surface of the low-temperature liquid partition plate.

6. The integrated liquid cooling heat dissipation device according to claim 2, characterized in that two fixing holes are provided on the side of the second plate corresponding to the heat blocking structure, two fixing protrusions are provided on one side of the heat blocking structure, and the fixing protrusions are fitted into the fixing holes.

7. The thermal barrier structure includes a low-temperature liquid partition plate and a high-temperature liquid partition plate. The integrated liquid cooling and heat dissipation device according to claim 6, characterized in that the low-temperature liquid partition plate and the high-temperature liquid partition plate are arranged parallel to each other in the first chamber, the low-temperature liquid partition plate and the high-temperature liquid partition plate are welded to the inner wall of the first chamber and the inner wall of the first box cover, and the second plate is fixed to one surface of the low-temperature liquid partition plate.

8. The aforementioned second liquid box includes a second box body, a second partition plate, and a second box cover. A second chamber is recessed in the upper surface of the second box body, a second partition plate is provided inside the second chamber, the second chamber is divided into a liquid output chamber and a liquid input chamber by the second partition plate, a plurality of second heat dissipation tube insertion holes are provided in the bottom wall of the second box body that connect to the liquid output chamber and the liquid input chamber, the upper ends of the first heat dissipation tube and the second heat dissipation tube are inserted into the second heat dissipation tube insertion holes, the upper ends of the first heat dissipation tube and the second heat dissipation tube connect to the liquid output chamber and the liquid input chamber, The integrated liquid-cooled heat dissipation device according to claim 1, characterized in that the second box cover covers the opening at the upper end of the second box body.

9. The integrated liquid cooling heat dissipation device according to claim 8, further comprising a liquid pump, wherein the liquid pump is located in the liquid input chamber of the second box body.

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