Indication device

The method addresses thickness and equipment challenges in display device manufacturing by using sacrificial layers and resist masks to form uniform light-emitting layers, resulting in high-definition, high-resolution, and large-scale display devices with improved reliability and yield.

JP2026086571APending Publication Date: 2026-05-26SEMICON ENERGY LAB CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SEMICON ENERGY LAB CO LTD
Filing Date
2026-02-05
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

The manufacturing of high-definition, high-resolution, and large-scale display devices with organic EL devices faces challenges such as thickness variation in island-shaped light-emitting layers due to blurred outlines and deformation of metal masks, requiring multiple production lines and high initial investment.

Method used

A method involving the formation of island-shaped pixel electrodes with sacrificial layers and resist masks to uniformly deposit light-emitting layers, followed by processing to form counter electrodes and protective layers, which are then connected via a conductive layer to ensure uniform thickness and electrical isolation, reducing the need for multiple production lines.

Benefits of technology

This method enables the production of high-definition, high-resolution, and large-scale display devices with improved reliability and yield by minimizing layer thickness variation and reducing equipment requirements, enhancing manufacturing efficiency and quality.

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Abstract

To provide a high-definition or high-resolution display device. [Solution] A display device is manufactured by arranging a plurality of first pixel electrodes and a plurality of second pixel electrodes, each arranged in a first direction, in a second direction, forming a first layer and a first sacrificial layer, processing the first layer and the first sacrificial layer to expose at least a portion of the second pixel electrodes, forming a second layer and a second sacrificial layer, processing the second layer and the second sacrificial layer to expose at least a portion of the first sacrificial layer, removing the first and second sacrificial layers, forming a third layer and a counter electrode, removing at least a portion of the third layer and the counter electrode that are included in the region between adjacent pixel electrodes in a top view, forming a protective layer on the counter electrode, processing the protective layer to expose at least a portion of the portion of the counter electrode that overlaps with the pixel electrode, and forming a conductive layer on the counter electrode and the protective layer.
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