Electronic devices

Abstract

The goal is to eliminate the negative impact on the performance of an electronic device caused by miniaturization when various circuits or modules are incorporated into a single electronic device, such as an audio device (e.g., earphones or wireless earphones). [Solution] In the electronic device, the semiconductor device package 1 includes a substrate 20, a microphone 10, a controller 11, a sensor 12, a connector 13, an electronic component 16 placed below the substrate, a sealing material for sealing the electronic component, a power supply structure 14 placed on the substrate, and a grounding pad 15. The central axis of the first surface of the substrate passes through the power supply structure in a plan view.

Description

Technical Field

[0001] The present invention relates to an electronic device.

Background Art

[0002] As technology advances, various circuits or modules are incorporated into a single electronic device such as an acoustic device (e.g., earphone or wireless earphone) to perform multiple functions. However, the miniaturization of the electronic device may have an adverse effect on the performance of the electronic device.

Summary of the Invention

Problems to be Solved by the Invention

[0003] An object of the present invention is to eliminate the adverse effect on the performance of an electronic device due to the miniaturization of the electronic device when various circuits or modules are incorporated into a single electronic device such as an acoustic device (e.g., earphone or wireless earphone).

Means for Solving the Problems

[0004] One embodiment of the present invention includes a semiconductor package having a substrate, an electronic component disposed under the substrate, a sealing material for sealing the electronic component, and a power supply structure disposed on the substrate, wherein a central axis of a first surface of the substrate passes through the power supply structure in a plan view, and the electronic device is an electronic device.

Brief Description of the Drawings

[0005] Aspects of some embodiments of the present invention will be readily understood from the following detailed description with reference to the accompanying drawings. Note that for clarity of explanation, various structures may not be drawn to scale or their dimensions may be arbitrarily enlarged or reduced.

[0006] [Figure 1]Figure 1 shows the layout of a semiconductor device package according to several embodiments of the present invention.

[0007] [Figure 2A] Figure 2A is a cross-sectional view of the semiconductor device package shown in Figure 1, taken along the line A-A'.

[0008] [Figure 2B] Figure 2B is a cross-sectional view of the semiconductor device package shown in Figure 1, taken along the line A-A'.

[0009] [Figure 2C] Figure 2C is a cross-sectional view of the semiconductor device package shown in Figure 1, taken along the line A-A'.

[0010] [Figure 2D] Figure 2D shows a method for manufacturing a semiconductor device package according to several embodiments of the present invention. [Figure 2E] Figure 2E shows a method for manufacturing a semiconductor device package according to several embodiments of the present invention. [Figure 2F] Figure 2F shows a method for manufacturing a semiconductor device package according to several embodiments of the present invention.

[0011] [Figure 3] Figure 3 shows the use of the semiconductor device package shown in Figure 1 according to several embodiments of the present invention.

[0012] [Figure 4A] Figure 4A is an exploded view of an acoustic device according to several embodiments of the present invention.

[0013] [Figure 4B] Figure 4B is a perspective view of the acoustic device assembly shown in Figure 4A.

[0014] [Figure 5A]FIG. 5A is an exploded view of the electronic components of an acoustic device according to some embodiments of the present invention.

[0015] [Figure 5B] FIG. 5B shows an assembly of the electronic components of an acoustic device according to some embodiments of the present invention.

[0016] [Figure 5C] FIG. 5C is a side view of an assembly of the electronic components of an acoustic device according to some embodiments of the present invention.

[0017] [Figure 5D] FIG. 5D is an exploded view of an acoustic device according to some embodiments of the present invention.

[0018] [Figure 5E] FIG. 5E is a side view of the assembly of the acoustic device shown in FIG. 5D.

[0019] [Figure 6A] FIG. 6A shows an acoustic device according to some embodiments of the present invention inserted into a human ear.

[0020] [Figure 6B] FIG. 6B shows an acoustic device according to other embodiments of the present invention inserted into a human ear.

[0021] [Figure 6C] FIG. 6C shows the acoustic device shown in FIG. 6B falling out of a human ear.

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] FIG. 1 shows the layout of a semiconductor device package 1. The semiconductor device package 1 can include a substrate 20, a microphone 10, a controller 11, a sensor 12, a connector 13, a power supply structure 14, a ground pad 15, and an electronic component 16.

[0023] The microphone 10, controller 11, sensor 12, connector 13, power supply structure 14, grounding pad 15, and electronic components 16 can be formed on the same side of the semiconductor device package 1.

[0024] The microphone 10 is exposed on the circuit board 20. The controller 11 is exposed on the circuit board 20. The sensor 12 is exposed on the circuit board 20. The connector 13 is exposed on the circuit board 20. The power supply structure 14 is exposed on the circuit board 20. The grounding pad 15 is exposed on the circuit board 20. The electronic component 16 is exposed on the circuit board 20. The conductive pad 17 is placed on the circuit board 20. The conductive pad 18 is placed on the circuit board 20. The conductive pad 17 is exposed on the circuit board 20. The conductive pad 18 is exposed on the circuit board 20. The conductive pad 17 can be configured or used to connect the battery and the semiconductor device package 1. The conductive pad 18 can be configured or used to connect the speaker and the semiconductor device package 1. The semiconductor device package 1 may include an assembly of printed circuit boards. Multiple semiconductor devices or multiple semiconductor device packages can be mounted on the semiconductor device package 1. The semiconductor device package 1 may be called a system-on-a-module (SOM).

[0025] The A-A' line may pass through the center of the semiconductor device package 1. The A-A' line may pass through the center of the surface of the substrate 20 (e.g., the top surface, not shown in Figure 1). The A-A' line may pass through the microphone 10 of the substrate 20. The A-A' line may pass through the power supply structure 14 of the substrate 20.

[0026] The B-B' line may pass through the center of the semiconductor device package 1. The B-B' line may also pass through the center of the surface of the substrate 20. The B-B' line may also pass through the microphone 10 on the substrate 20. As shown in Figure 1, the microphone 10 can be positioned adjacent to the A-A' line on the surface of the substrate 20. Alternatively, the microphone 10 can be positioned adjacent to the B-B' line on the surface of the substrate 20. The power supply structure 14 may also be positioned adjacent to the A-A' line on the surface of the substrate 20.

[0027] The component layout of the semiconductor device package 1 has the advantage of being positioned at the center (not shown in Figure 1) of the top surface of the substrate 20 of the microphone 10, or adjacent to its center, so that it can be adapted to different housings (e.g., a housing for the right ear and a housing for the left ear), or used or assembled in different housings.

[0028] The component layout of the semiconductor device package 1 has the advantage of being positioned at the center (not shown in Figure 1) of the top surface of the substrate 20 or adjacent to the center, so that it can be adapted to different housings (e.g., a housing for the right ear and a housing for the left ear) or used or assembled in different housings.

[0029] Figure 2A is a cross-sectional view along the line A-A' shown in Figure 1. The semiconductor device package 1a may include a substrate 20, an electronic component 21, another electronic component 22, a encapsulating material 23, and a power supply structure 14.

[0030] The substrate 20 has a surface 20b and a surface 20u opposite to surface 20b.

[0031] The semiconductor device 21 can be placed on the surface 20b of the substrate 20. The electronic component 22 can be placed on the surface 20b of the substrate 20. The encapsulating material 23 can encapsulate the electronic component 21 on the surface 20b of the substrate 20. The encapsulating material 23 can encapsulate the electronic component 22 on the surface 20b of the substrate 20.

[0032] The power supply structure 14 can be located on the surface 20u of the substrate 20 and has no encapsulating or molding material. The power supply structure 14 is exposed on the surface 20u of the substrate 20. The surface 20u of the substrate 20 has no encapsulating or molding material. Electronic components 25 are located on both the surfaces 20b and 20u of the substrate 20. The microphone 10 is located on surface 20u. The microphone 10 may include a semiconductor device package. The microphone 10 may include a micro-electromechanical system (MEMS) device. The microphone 10 may include a micro-electromechanical system (MEMS) device package. The microphone 10 is exposed. The sensor 12 is located on the surface 20u of the substrate 20. The connector 13 is located on the surface 20u of the substrate 20. Surface 20b includes conductive pads for battery connection. Surface 20b includes conductive pads for speaker driver connection. The power supply structure 14 has a surface 14u that is higher than the electronic microphone 10. Surface 14u is higher than sensor 12. Surface 14u is higher than connector 13. Power supply structure 14 is the highest element among those arranged on surface 20u of substrate 20.

[0033] Electronic components 21 and 22 may include one or more of the following: application processor, memory, digital signal processor, coder / decoder, power management integrated circuit, DC converter, low dropout output, or filter. The encapsulant 23 may include different types of molding materials. The power supply structure 14 includes a spring or conductive pin. The power supply structure 14 includes a POGO pin. The power supply structure 14 also includes an anti-oxidation layer. The power supply structure 14 can be configured and used to send radio frequency (RF) signals to an antenna. Electronic component 25 may include one or more of the following: resistor, inductor, or capacitor. The sensor 12 may include a G-type sensor or other sensors. The connector 13 includes a zero-insertion force connector or board-to-board connector for flexible printed circuit (FPC) connection of peripheral functions.

[0034] Figure 2B is another cross-sectional view of the semiconductor device package shown in Figure 1 along the line A-A'. Electronic component 21' is located on surface 20'b of substrate 20'. Electronic component 22' is located on surface 20'b of substrate 20'. Surface 20'u is opposite to surface 20'b of substrate 20'. Electronic component 25 is located on both surfaces 20'b and 20'u of substrate 20'. Encapsulation material 23 surrounds the elements located on surface 20'b of substrate 20'. Substrate 20 has surface 20b and surface 20u opposite to surface 20b. Power supply structure 14 is located on surface 20u of substrate 20. Power supply structure 14 is exposed. Surface 20u of substrate 20 has no encapsulation material or molding material. Electronic component 25 is located on both surfaces 20b and 20u of substrate 20. Microphone 10 is located on surface 20u. Microphone 10 is also exposed. The sensor 12 is located on the surface 20u of the substrate 20. The connector 13 is located on the surface 20u of the substrate 20. The sealing material 23 surrounds the elements located between the surface 20b of the substrate 20 and the surface 20'u of the substrate 20'.

[0035] Figure 2C is a further cross-sectional view of the semiconductor device package shown in Figure 1 along the line A-A'. Electronic component 21'' is located on surface 20''b of substrate 20''. Electronic component 22'' is located on surface 20''b of substrate 20''. Surface 20''u is opposite to surface 20''b of substrate 20''. Electronic component 25 is located on both surfaces 20''b and 20''u of substrate 20''. Encapsulation material 23 surrounds the elements located on surface 20''b of substrate 20''. Electronic component 21' is located on surface 20'b of substrate 20''. Electronic component 22' is located on surface 20'b of substrate 20''. Surface 20'u is opposite to surface 20'b of substrate 20''. Electronic component 25 is located on both surfaces 20'b and 20'u of substrate 20''. Encapsulation material 23 surrounds the elements located on surface 20'b of substrate 20''. The substrate 20 has a surface 20b and a surface 20u opposite to surface 20b. The power supply structure 14 is located on surface 20u of the substrate 20. The power supply structure 14 is exposed. Surface 20u of the substrate 20 is free of encapsulating or molding material. Electronic components 25 are located on both surfaces 20b and 20u of the substrate 20. The microphone 10 is located on surface 20u. The microphone 10 is also exposed. The sensor 12 is located on surface 20u of the substrate 20. The connector 13 is located on surface 20u of the substrate 20. The encapsulating material 23 surrounds elements located between surface 20b of the substrate 20 and surface 20'u of the substrate 20'. The encapsulating material 23 also surrounds elements located between surface 20'b of the substrate 20' and surface 20''u of the substrate 20''.

[0036] Figures 2D, 2E, and 2F illustrate a method for manufacturing the semiconductor device package 1a shown in Figure 2A.

[0037] As shown in Figure 2D, a substrate 20 is provided having a surface 20b and a surface 20u opposite to surface 20b.

[0038] As shown in Figure 2E, electronic component 21 is placed on the surface 20b of substrate 20. The other electronic component 22 is also placed on the surface 20b of substrate 20. Electronic component 25 is placed on both the surface 20b and 20u of substrate 20.

[0039] As shown in Figure 2F, the electronic component 21 is sealed to the surface 20b of the substrate 20 with the sealing material 23. The other electronic component 22 is sealed to the surface 20b of the substrate 20 with the sealing material 23. The electronic component 25 is sealed to the surface 20b of the substrate 20 with the sealing material 23. The power supply structure 14 is placed on the surface 20u of the substrate 20. The power supply structure 14 is exposed. The microphone 10 is placed on the surface 20u of the substrate 20. The microphone 10 is exposed. The surface 20u of the substrate 20 is also exposed. The electronic component 25 is placed on the surface 20u of the substrate 20. The sensor 12 is placed on the surface 20u of the substrate 20. The connector 13 is placed on the surface 20u of the substrate 20 to form the semiconductor device package shown in Figure 2A.

[0040] Figure 3 shows the use of semiconductor device packages in earphones. The acoustic device (e.g., earphone) 30R is inserted into the human ear 31R. The acoustic device 30L is inserted into the human ear 31L. The right acoustic device 30R includes a semiconductor device package 32R. The left acoustic device 30L includes a semiconductor device package 32L. The layout of the semiconductor device package 32R is such that, after assembly, the semiconductor device package 32R is rotated approximately 180 degrees relative to the semiconductor device package 32L, and the layout of the semiconductor device package 32L is different from that of the semiconductor device package 32L. They are similar or identical. This allows only one semiconductor device package layout to be required for both acoustic devices 30R and 30L, thereby reducing costs. Acoustic devices 30R and 30L may include semiconductor device packages 1a, 1b, or 1c as shown in Figures 1A, 1B, and 1C.

[0041] Figure 4A is an exploded view of an acoustic device 4 according to several embodiments of the present invention. The acoustic device 4 includes a speaker 40, a battery 41, a semiconductor device package 42, an interconnection structure 43, and a housing 44. The speaker has a surface 40a and a surface 40b opposite to surface 40a. The battery 41 has a surface 41a, a surface 41b opposite to surface 41a, and a surface 41c extending between surfaces 41a and 41b. The speaker 40 is positioned adjacent to surface 41a of the battery 41. Surface 40a of the speaker 40 faces surface 41a of the battery 41. The structure of the semiconductor device package 42 is shown in cross-sectional views of semiconductor device packages 1a, 1b, or 1c in Figures 2A to 2C, respectively. The speaker 40 is connected to the semiconductor device package 42 via a wire 45. The wire 45 does not penetrate the battery 41. The speaker 40 is separated from the battery 41 by a space S1. There is no turbulence in space S1. The space S1 can affect the acoustic performance of the acoustic device 4. The housing 44 surrounds the speaker 40, the battery 41, the semiconductor device package 42, and the interconnection structure 43. The interconnection structure 43 connects the battery 41 and the semiconductor device package 42. The interconnection structure 43 includes a flexible printed circuit (FPC) or other interconnection structure.

[0042] Figure 4B is a perspective view of the assembly of the acoustic device 4 shown in Figure 4A. The semiconductor device package 42 is positioned adjacent to the surface 41c of the battery 41. The semiconductor device package 42 is electrically connected to the surface 41c of the battery 41 by an interconnection structure 43. The speaker 40 is separated from the surface 41a of the battery 41 in space S1. Space S1 is free of electronic components. Space S1 may contain a plate separating the speaker and the battery 41. Space S1 may contain wires, or only wires. Space S1 may not contain active members, nor may it contain passive members.

[0043] The semiconductor device package 42 is positioned between the housing 44 and the surface 41c of the battery 41. The speaker 40 has a surface 40a facing the surface 41a of the battery 41. The semiconductor device package 42 is positioned between the housing 44, the surface 41c of the battery 41 and the surface 40a of the speaker 40. The semiconductor device package 42 is surrounded by the housing 44, the surface 41c of the battery 41 and the surface 40a of the speaker 40. The semiconductor device package 42 is positioned in the space partitioned by the housing 44, the surface 41c of the battery 41 and the speaker 40. The housing 44 surrounds the speaker 40, the battery 41 and the semiconductor device package 42. The housing 44 has an end 44a and an end 44b opposite to the end 44a. An antenna pattern 46 is formed on the housing 44 and acts as an antenna. The feeding structure 14 may contact the antenna pattern 46 of the housing 44 of the acoustic device 4.

[0044] Returning to Figure 4B, assuming the width or diameter of the speaker 40 is approximately 6 mm, the maximum distance Z1 along the z-axis between end 44a (which can be fitted or inserted into the ear) and end 44b can be 23 mm or less. For example, assuming the width or diameter of the speaker 40 is approximately 6 mm, the distance Z1 along the z-axis between end 44a (which can be fitted or inserted into the ear) and end 44b can be 20 mm or less. Therefore, the semiconductor device package 42 can facilitate the miniaturization of the acoustic device 4. By arranging the semiconductor device package 42, acoustic This makes it easier to miniaturize device 4.

[0045] For example, assuming that the width or diameter of speaker 40 is approximately 10 mm, the distance Z1 along the z-axis between end 44a (which can be fitted or inserted into the ear) and end 44b could be approximately 23 mm.

[0046] Figure 5A is an exploded view of the electronic components of an acoustic device. Circuit boards 51, 52, and 53 of the acoustic device are connected by an interconnection structure 54. Electronic components are formed on circuit boards 51, 52, and 53. The interconnection structure 54 may include an FPC or other interconnection structure. A battery 55 can be provided in the acoustic device.

[0047] The acoustic device, including circuit boards 51, 52, and 53, can be fitted or inserted into the left ear. However, other acoustic devices fitted or inserted into the right ear may each include circuit boards with different layouts than circuit boards 51, 52, and 53, inevitably increasing costs.

[0048] Figure 5B shows an assembly of electronic components of an acoustic device according to several embodiments of the present invention. Circuit boards 51, 52, and 53 are stacked. The stack thickness is T1. Circuit boards 51 and 52 and interconnection structure 54 surround a battery 55. Circuit boards 52 and 53 and interconnection structure 54 surround a mechanical component 56.

[0049] Figure 5C is a side view of an assembly of electronic components for an acoustic device. Figure 5C shows that circuit board 51 may be located above the battery 55. Circuit board 52 may be located below the battery 55. Circuit boards 51 and 52 and interconnection structure 54 surround the battery 55. Circuit board 53 is located away from the battery 55. Mechanical components 56 may be omitted as shown in Figure 5C.

[0050] Figure 5D is an exploded view of the acoustic device 5, including the stack shown in Figure 5C. The acoustic device 5 may include a speaker 50, circuit boards 51, 52, 53, an interconnect structure 54, a battery 55, and a housing 57. The circuit board 53 is located between the speaker 50 and the battery 55 and causes electromagnetic interference with the speaker 50, thereby degrading the acoustic performance of the acoustic device 5. The housing 57 surrounds the speaker 50, circuit boards 51, 52, 53, the interconnect structure 54, and the battery 55. An antenna pattern 58 is formed on the housing 57. A feed point on the circuit board 53 (not shown in Figure 5D) is in contact with the antenna pattern 58.

[0051] Figure 5E is a side view of the assembly of the acoustic device 5 shown in Figure 5D. In some embodiments, assuming that the diameter of the speaker inside the acoustic device 5 is 6 mm, the maximum distance Z2 between end 57a (which can be fitted or inserted into the ear) and end 57b is 23 mm or more. Because the thickness T1 shown in Figure 5B is greater than the distance along the z-axis in Figure 4B between end 42A of the semiconductor device package 42 and end 41a of the battery 41, the maximum distance Z2 of the acoustic device 5 is greater than the maximum distance Z1 of the acoustic device 4.

[0052] Referring to Figure 6A, the acoustic device 4 shown in Figure 4B is inserted into a human ear. The center of gravity CM1 may be adjacent to or close to the end 44b. To miniaturize the acoustic device 4, when the acoustic device 4 is inserted into the ear, it can make contact with point P on the ear. Therefore, the acoustic device 4 is well supported by the ear. Consequently, even if the person wearing the acoustic device 4 moves or sweats, the acoustic device 4 is less likely to fall out.

[0053] Referring to Figure 6B, the acoustic device 5 shown in Figure 5E is inserted into a human ear. The center of gravity CM2 may be adjacent to or near the end 57b.

[0054] A relatively large acoustic device 5 may have a floating part (excluding the plug). The acoustic device 5 may be spaced apart from point P on the human ear. Distance D1 is the distance between the top surface of the acoustic device 5 and the human ear.

[0055] Figure 6C shows that the acoustic device 5 begins to detach from the ear when the person wearing it sweats, moves, or changes posture. The detachment of the acoustic device 5 may be due to the unstable condition shown in Figure 6B. In this condition, the acoustic device 5, lacking support from the ear due to the center of gravity CM2, is relatively more likely to detach from the ear.

[0056] The distance D2 between the top surface of the acoustic device 5 and the human ear is thought to increase due to the detachment of the acoustic device 5. Distance D2 is greater than distance D1.

[0057] Spatial descriptions such as "directly above," "directly below," "up," "left," "right," "down," "top," "bottom," "vertical," "horizontal," "side," "higher," "lower," "upper," and "downward" are indicated relative to the directions shown in the drawings, unless otherwise specified. It is understood that the spatial descriptions used herein are illustrative only, and in practical implementation, the structures described herein can be spatially arranged in any direction or manner, provided that the advantages of the embodiments of the present invention do not deviate from such arrangements.

[0058] The terms “almost,” “substantially,” “effectively,” and “about” used herein are used to describe and mean small variations. When used with circumstances or situations, these terms refer to cases where the circumstances or situations occur exactly as they are, and cases where they occur approximately as they are. For example, when used with numbers, these terms refer to a range of variation of that number of ±10%, such as ±5%, ±4%, ±3%, ±2%, ±1%, ±0.5%, ±0.1%, or ±0.05%. For example, a first number may be considered “substantially” the same as a second number if its variation is within a range of ±10%, such as ±5%, ±4%, ±3%, ±2%, ±1%, ±0.5%, ±0.1%, or ±0.05%. For example, "effectively" vertical means an angle variation of ±10° or less, such as ±5° or less, ±4° or less, ±3° or less, ±2° or less, ±1° or less, ±0.5° or less, ±0.1° or less, or ±0.05° or less relative to 90°.

[0059] Two surfaces may be considered coplanar or substantially coplanar if the displacement between them is 5 μm or less, 2 μm or less, 1 μm or less, or 0.5 μm or less. A surface may be considered "substantially" planar if the displacement between its highest and lowest points is 5 μm or less, 2 μm or less, 1 μm or less, or 0.5 μm or less.

[0060] As used herein, singular forms may also include plural forms unless otherwise specified in the context.

[0061] The terms "conductivity," "electrical conductivity," and "electrical conductivity" used herein refer to the ability to conduct electric current. Conductive materials are typically materials that have little or no resistance to the flow of electric current. One unit of measurement for conductivity is siemens per meter (S / m). Typically, conductive materials have a conductivity of approximately 10⁴ S / m or higher, for example, at least 10⁵ S / m or at least 10⁶ S / m. The conductivity of a material may vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0062] Furthermore, quantities, ratios, and other numerical values ​​may be expressed in range form as described herein. Such range forms are used for convenience and conciseness, and should be understood to be interpreted flexibly to include not only the numerical values ​​explicitly stated as limits to the range, but also all individual numerical values ​​or subranges contained within that range, as if each numerical value or subrange were explicitly stated.

[0063] The present invention has been described and illustrated with reference to specific embodiments, but these descriptions and drawings are not intended to limit the invention. It will be apparent to those skilled in the art that various modifications are possible in embodiments and that equivalent components can be substituted without departing from the spirit and scope of the invention as limited by the appended claims. The drawings are not necessarily to scale. Manufacturing processes and tolerances may cause distinctions between the drawing representation of the invention and the actual product. There are other embodiments of the invention that are not specifically illustrated. The specifications and drawings are to be considered illustrative, not limiting. Modifications may be made to specific situations, materials, compositions, methods, or processes without departing from the object, spirit, and scope of the invention. All such modifications are intended to fall within the scope of the appended claims. The methods disclosed herein are described with reference to specific operations performed in a specific order, but it is acknowledged that these operations can be combined, subdivided, or rearranged to form equivalent methods without departing from the teachings of the invention. Thus, unless otherwise stated herein, the order and classification of operations are not intended to limit the invention.

[0064] The spatially relative terms used herein, such as “down,” “directly below,” “lower,” “directly above,” “higher,” “lower,” “left,” and “right,” are used here to facilitate the description of the relationship between one element or feature and another element or feature shown in the drawings. The spatially relative terms are intended to include different orientations of the device in use or operation, in addition to the orientation shown in the drawings. The device may be oriented in a different direction (rotated by 90 degrees or oriented in a different direction), and the spatially relative descriptions used herein shall be interpreted accordingly. It should be understood that when one element is “connected” or “linked” to another element, this element may be directly connected or linked to the other element, or there may be an intervening element.

[0065] The terms “approximately,” “substantially,” “effectively,” and “about” as used herein are used to describe and mean small variations. When used with circumstances or situations, these terms refer to cases where the circumstances or situations occur exactly as they are, and cases where the circumstances or situations occur approximately as they are. As used herein for a specific number or range, the term “about” means that it is approximately ±10%, ±5%, ±1%, or ±0.5% of that number or range. A range is expressed herein as the range from one endpoint to the other or between two endpoints. All ranges disclosed herein include their endpoints unless otherwise specified. The term "substantially coplanar" refers to two planes that lie on the same plane and have a difference of micrometers (μm), for example, a difference of 10 μm, 5 μm, 1 μm, or 0.5 μm along the same plane. When we say that numerical values ​​or characteristics are "substantially" the same, this term refers to values ​​whose difference is within ±10%, ±5%, ±1%, or ±0.5% of the mean.

[0066] The features and detailed forms of several embodiments of the present invention have been outlined above. The embodiments described herein can be readily used as a basis for designing or modifying other processes and structures to perform the same or similar purposes and / or achieve the same or similar advantages of the embodiments described herein. Such equivalent structures will not depart from the spirit and scope of the invention, and various modifications, substitutions, and alterations are possible that do not depart from the spirit and scope of the invention.

Claims

1. circuit board and A connector placed on the aforementioned substrate, A power supply structure is placed on the aforementioned substrate and configured to send radio frequency (RF) signals to the antenna, A speaker electrically connected to the circuit board via the connector and Includes, An electronic device in which the height of the connector from the first surface of the substrate is lower than the height of the power supply structure.

2. The electronic device according to claim 1, wherein the substrate has a substantially rectangular outer shape, the power supply structure is disposed on a first surface of the substrate, the first surface of the substrate has a first side surface, the power supply structure is closer to the first side surface than the connector, and the central axis of the first surface of the substrate passes through the power supply structure in a direction substantially perpendicular to the elongation direction of the first side surface of the first surface and the normal direction of the first surface in a plan view.

3. Housing and The battery housed in the aforementioned housing, A conductive pad is disposed adjacent to the first surface of the substrate and connected to the battery, The electronic device according to claim 2, further comprising:

4. The electronic device according to claim 3, further comprising a flexible printed circuit for connecting the connector to the battery.

5. The electronic device according to claim 4, wherein the battery has a first surface, a second surface opposite to the first surface, and a third surface extending between the first surface and the second surface, and the flexible printed circuit is disposed adjacent to the third surface of the battery.

6. The electronic device according to claim 5, wherein the substrate is closer to the first surface of the battery than the second surface of the battery, and the speaker is closer to the second surface of the battery than the first surface of the battery.

7. The electronic device according to claim 3, further comprising an antenna pattern adjacent to the housing, wherein the substrate is disposed between the antenna pattern and the battery.

8. The electronic device according to claim 7, wherein the power supply structure is in contact with the antenna pattern, and the substrate has a second surface opposite to the first surface that faces the battery.

9. A sealing material disposed on the second surface of the substrate, The electronic device according to claim 8, further comprising an electronic component disposed on the second surface of the substrate and sealed by the sealing material.

10. The power supply structure includes a spring, as described in claim 1.

11. Antenna and, A semiconductor package including a power supply structure adjacent to the first surface and facing the antenna, and an electronic component adjacent to the second surface, A battery located closer to the second surface than the first surface of the semiconductor package, An electronic device including a speaker located on the opposite side of the battery from the semiconductor package.

12. The electronic device according to claim 11, wherein the power supply structure is in contact with the antenna.

13. The electronic device according to claim 11, further comprising a housing for housing the semiconductor package, the battery, and the speaker, wherein the antenna is disposed between the semiconductor package and the housing.

14. The electronic device according to claim 13, wherein the semiconductor package includes a connector and a substrate supporting the connector and the power supply structure, and the speaker is electrically connected to the substrate via the connector.

15. The electronic device according to claim 14, wherein the connector has a substantially rectangular outer shape, the side surface of the connector faces the power supply structure, and the central axis of the side surface of the connector passes through the power supply structure in a direction substantially perpendicular to the extension direction of the side surface of the connector in a plan view.

16. The electronic device according to claim 14, further comprising a flexible printed circuit for connecting the speaker to the connector.

17. The electronic device according to claim 16, wherein the flexible printed circuit partially surrounds the battery.

18. The electronic device according to claim 15, further comprising a sealing material for sealing the electronic component, wherein the sealing material is disposed between the battery and the antenna.

19. The electronic device according to claim 15, wherein the connector is adjacent to the first surface of the semiconductor package.

20. The electronic device according to claim 15, wherein the height of the connector from the surface of the substrate is lower than the height of the power supply structure.

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