Heat pump module

Abstract

We provide a heat pump module that ensures sealing at all connection points. [Solution] In a heat pump module 1 comprising a plurality of heat exchangers 22, 27, 28 for exchanging heat between a refrigerant and a heat transfer medium, a flow path forming member 10 through which a refrigerant passage is formed and to which the heat exchangers are connected, and a heat transfer medium module 300 through which a heat transfer medium passage is formed and to which the heat exchangers are connected, the seal portion at the connection between the flow path forming member 10 and the plurality of heat exchangers is defined as the refrigerant side seal portion, and the seal portion at the connection between the heat transfer medium module 300 and the plurality of heat exchangers is defined as the heat transfer medium side seal portion. In this configuration, a cylindrical seal is used for one of the refrigerant side seal portion and the heat transfer medium side seal portion, where the sealing surface is cylindrical, and a flat seal is used for the other of the refrigerant side seal portion and the heat transfer medium side seal portion, where the axial direction of the cylindrical surface is perpendicular to the direction of the flat surface.

Description

Technical Field

[0001] The present invention relates to a heat pump module in which a plurality of component devices constituting a heat pump cycle are integrated.

Background Art

[0002] Conventionally, as a technology related to a heat pump module in which at least a part of the component devices of a heat pump cycle device is integrated, the technology described in Patent Document 1 is known. In the technology described in Patent Document 1, the heat pump module has a flow path forming member in which a refrigerant flow path is formed. A heat exchanger for exchanging heat between the refrigerant and the heat medium is connected to the flow path forming member.

Prior Art Documents

Patent Documents

[0003] .

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, it has been considered to directly attach a heat medium module to the heat exchanger connected to the flow path forming portion. The heat medium module is a component in which a heat medium flow path is formed and component parts (for example, valves, pumps, etc.) necessary for the heat medium circuit are modularized.

[0005] However, when component parts necessary for the heat medium circuit are modularized, the connection portions between the heat medium module and the heat exchanger increase, so it is desired to ensure sealing performance at a plurality of connection portions.

[0006] In view of the above points, an object of the present invention is to provide a heat pump module capable of ensuring sealing performance at a plurality of connection portions.

Means for Solving the Problems

[0007] To achieve the above objective, the heat pump module described in claim 1 includes a plurality of heat exchangers (22, 27, 28) that exchange heat between a refrigerant and a heat transfer medium, A flow path forming member (10) through which a refrigerant passage is formed and to which a heat exchanger is connected, A heat pump module comprising a heat transfer medium module (300) through which a heat transfer medium flows and to which a heat exchanger is connected, When the seal portion at the connection between the flow path forming member and the multiple heat exchangers is defined as the refrigerant side seal portion, and the seal portion at the connection between the heat transfer medium module and the multiple heat exchangers is defined as the heat transfer medium side seal portion, A cylindrical seal is used on one of the refrigerant-side seal portion and the heat transfer medium-side seal portion, with a cylindrical sealing surface, while a flat seal is used on the other of the refrigerant-side seal portion and the heat transfer medium-side seal portion, with a flat sealing surface. The axial direction of the cylindrical surface is perpendicular to the direction of the flat surface.

[0008] According to this, by employing a flat seal in either the refrigerant-side seal or the heat transfer fluid-side seal, the positional tolerance of the connection can be absorbed by the flat seal portion. As a result, it becomes possible to ensure sealing performance at the connection portion between the refrigerant-side seal and the heat transfer fluid-side seal.

[0009] The reference numerals in parentheses next to each means described in this section and in the claims indicate the correspondence with the specific means described in the embodiments described later. [Brief explanation of the drawing]

[0010] [Figure 1] This is an external perspective view of a heat pump module according to one embodiment. [Figure 2] This is a diagram showing the configuration of a heat pump system in one embodiment. [Figure 3] This is a diagram showing the configuration of an indoor air conditioning unit in one embodiment. [Figure 4]Block diagram showing the control system of a heat pump system in one embodiment. [Figure 5] This is an explanatory diagram illustrating the configuration of the flow path forming member, the connection part of a plurality of heat exchangers and heat transfer module in one embodiment. [Modes for carrying out the invention]

[0011] One embodiment of the present invention will be described with reference to Figures 1 to 5. In this embodiment, the heat pump module 1 according to the present invention is applied to a heat pump system 100 mounted on an electric vehicle. An electric vehicle is a vehicle that obtains driving force for driving from an electric motor. The heat pump system 100 has a heat pump cycle 20 and a plurality of heat transfer fluid circuits, and performs air conditioning of the vehicle interior, which is the space to be air-conditioned, and also adjusts the temperature of the on-board equipment. Therefore, the heat pump system 100 can be called an air conditioning device with an on-board equipment cooling function, or an on-board equipment cooling device with an air conditioning function.

[0012] More specifically, the heat pump system 100, as an in-vehicle device, cools the battery. The battery is a secondary battery that stores power supplied to multiple electrically operated in-vehicle devices. The battery is a battery pack formed by electrically connecting multiple stacked battery cells in series or parallel. The battery cells in this embodiment are lithium-ion batteries.

[0013] Batteries generate heat during operation (i.e., during charging and discharging). Batteries have the characteristic that their output tends to decrease at low temperatures and deteriorates more rapidly at high temperatures. For this reason, the battery temperature needs to be maintained within an appropriate temperature range (in this embodiment, 15°C or higher and 55°C or lower). Therefore, the heat pump system 100 of this embodiment cools the battery when its temperature rises.

[0014] Therefore, the heat pump system 100 is configured to be able to cool the battery with the chilled heat generated by the heat pump cycle 20. The objects to be cooled in the heat pump system 100 of the present embodiment are air and the battery.

[0015] As shown in FIG. 1, the heat pump module 1 according to the present embodiment includes a refrigerant module 200 and a heat medium module 300.

[0016] The refrigerant module 200 is formed by assembling a plurality of constituent devices constituting the heat pump cycle 20 to a channel forming member 10 formed in a flat plate shape. A refrigerant flow path through which the refrigerant flows is formed in the channel forming member 10.

[0017] In the present embodiment, the constituent devices of the heat pump cycle 20 assembled to the channel forming member 10 include a compressor 21, a heat medium refrigerant heat exchanger 22, a receiver 23, a first expansion valve 25, a second expansion valve 26, a first chiller 27, and a second chiller 28. By assembling the constituent devices of the heat pump cycle 20 including the compressor 21 to the channel forming member 10, a part of the configuration of the heat pump system 100 can be modularized. In the present embodiment, the heat medium refrigerant heat exchanger 22, the first chiller 27, and the second chiller 28 are also collectively referred to as "a plurality of heat exchangers 22, 27, 28".

[0018] The heat medium module 300 is an integrated unit of a part of the constituent devices of a high-temperature side heat medium circuit 30, a first low-temperature side heat medium circuit 40, and a second low-temperature side heat medium circuit 50, which will be described later. A heat medium flow path through which the heat medium flows is formed in the heat medium module 300. A plurality of heat exchangers 22, 27, 28 are connected to the heat medium module 300.

[0019] In the following description, when the directions of front, rear, left, right, up, and down are used, the state in which the longitudinal direction of the channel forming member 10 extends vertically is used as a reference, and the state indicated by the arrow in FIG. 1 is defined. The same definition is used for the arrows appropriately shown in each figure.

[0020] Next, the schematic configuration of the heat pump system 100 including the heat pump module 1 according to the present embodiment will be described with reference to the drawings. In FIG. 2, a portion of the heat pump system 100 constituted by the refrigerant module 200 of the present embodiment is shown surrounded by a broken line.

[0021] As shown in FIG. 2, the heat pump system 100 according to the present embodiment includes a heat pump cycle 20, a high-temperature-side heat medium circuit 30, a first low-temperature-side heat medium circuit 40, and a second low-temperature-side heat medium circuit 50. Further, the heat pump system 100 includes an indoor air-conditioning unit 60 for supplying conditioned air whose temperature is adjusted by the heat or cold generated in the heat pump cycle 20, and a control device 70 for controlling each component of the heat pump system 100.

[0022] First, the configuration of the heat pump cycle 20 in the heat pump system 100 will be described. The heat pump cycle 20 is a vapor compression refrigerator including a compressor 21, a heat medium refrigerant heat exchanger 22, a receiver 23, a first expansion valve 25, a second expansion valve 26, a first chiller 27, and a second chiller 28.

[0023] In the heat pump cycle 20 of the present embodiment, a fluorocarbon refrigerant is used as the refrigerant, and a subcritical refrigeration cycle is configured in which the high-pressure-side refrigerant pressure does not exceed the critical pressure of the refrigerant. Refrigerant oil (specifically, PAG oil or POE oil) for lubricating the compressor 21 is mixed in the refrigerant. A part of the refrigerant oil circulates in the cycle together with the refrigerant.

[0024] The compressor 21 is an electric compressor driven by electricity, which inhales, compresses, and discharges the refrigerant circulating in the heat pump cycle 20. The compressor 21 houses a compression mechanism for compressing the gaseous refrigerant in the heat pump cycle 20 and a drive unit for operating the compression mechanism, both within a substantially cylindrical housing. As shown in Figure 1, the compressor 21 according to this embodiment constitutes a part of the heat pump module 1 and is attached to the left side surface of the flat flow path forming member 10.

[0025] The discharge port side of the compressor 21 is connected to the refrigerant inlet side of the heat transfer medium refrigerant heat exchanger 22 via a high-pressure side flow path 11 and a first connection part 15A formed as a refrigerant flow path in the flow path forming member 10. The heat transfer medium refrigerant heat exchanger 22 has a refrigerant passage 22A for circulating the high-pressure refrigerant discharged from the compressor 21, and a heat transfer medium passage 22B for circulating the high-temperature side heat transfer medium that circulates in the high-temperature side heat transfer medium circuit 30.

[0026] The heat transfer medium refrigerant heat exchanger 22 is a condenser that condenses the high-pressure refrigerant flowing through the refrigerant passage 22A by exchanging heat with the high-temperature side heat transfer medium flowing through the heat transfer medium passage 22B. That is, the heat transfer medium refrigerant heat exchanger 22 releases the heat contained in the high-pressure refrigerant discharged from the compressor 21 to the high-temperature side heat transfer medium circulating in the high-temperature side heat transfer medium circuit 30, thereby heating the high-temperature side heat transfer medium. The heat transfer medium refrigerant heat exchanger 22 according to this embodiment constitutes a part of the heat pump module 1 and is attached to the right side surface of the flow path forming member 10.

[0027] A receiver 23 is connected to the refrigerant outlet side of the heat transfer medium refrigerant heat exchanger 22 via a high-pressure side flow path 11 and a second connection part 15B formed in the flow path forming member 10. The receiver 23 is a gas-liquid separation unit that separates the gas-liquid refrigerant flowing out from the refrigerant passage 22A of the heat transfer medium refrigerant heat exchanger 22, allowing the liquid phase refrigerant to flow downstream, and also stores excess refrigerant from the cycle. The receiver 23 according to this embodiment constitutes part of the heat pump module 1 and is attached to the left side of the flow path forming member 10.

[0028] A refrigerant branching section 24A is connected to the outlet of the receiver 23. In the refrigerant branching section 24A, one of the three inlet / outlet ports is used as the refrigerant inlet, and the remaining two are used as the refrigerant outlets. In other words, the refrigerant branching section 24A is a branching section that divides the flow of liquid phase refrigerant that flows out of the receiver 23.

[0029] The refrigerant inlet side of the first expansion valve 25 is connected to one of the refrigerant outlets of the refrigerant branch section 24A via the high-pressure side flow path 11 of the flow path forming member 10. The refrigerant inlet side of the second expansion valve 26 is connected to the other refrigerant outlet of the refrigerant branch section 24A via the high-pressure side flow path 11 of the flow path forming member 10.

[0030] The first expansion valve 25 is a pressure reducing unit that reduces the pressure and expands the liquid phase refrigerant flowing out from one outlet of the refrigerant branching section 24A. The first expansion valve 25 is an electrically operated variable throttling mechanism and has a valve body and an electric actuator. The valve body is configured to change the opening degree of the refrigerant flow path (in other words, the throttling opening degree). The electric actuator has a stepping motor that changes the throttling opening degree of the valve body.

[0031] The first expansion valve 25 is composed of a variable throttling mechanism with a fully closing function that completely closes the refrigerant flow path. In this embodiment, the first expansion valve 25 constitutes part of the heat pump module 1. The operation of the first expansion valve 25 is controlled by a control signal output from the control device 70 shown in Figure 4.

[0032] The refrigerant outlet of the first expansion valve 25 is connected to the refrigerant inlet side of the first chiller 27 via the low-pressure side flow path 12 and the third connection part 15C of the flow path forming member 10. The first chiller 27 has a refrigerant passage 27A through which the low-pressure refrigerant, which has been reduced in pressure by the first expansion valve 25, flows, and a heat transfer medium passage 27B through which the low-temperature side heat transfer medium that circulates in the first low-temperature side heat transfer medium circuit 40 flows. The first chiller 27 is an evaporator that causes heat exchange between the low-pressure refrigerant flowing through the refrigerant passage 27A and the low-temperature side heat transfer medium flowing through the heat transfer medium passage 27B, thereby evaporating the low-pressure refrigerant and exhibiting an endothermic effect.

[0033] In the first chiller 27, a refrigerant confluence section 24B is connected to the outlet side of the refrigerant passage 27A via the low-pressure side passage 12 and the fourth connection section 15D of the flow path forming member 10. In the refrigerant confluence section 24B, two of the three inlet and outlet ports are used as refrigerant inlets, and the remaining one is used as a refrigerant outlet. In other words, the refrigerant confluence section 24B is a confluence section that combines the refrigerant flows that branched off at the refrigerant branching section 24A.

[0034] A second expansion valve 26 is connected to the other refrigerant outlet in the refrigerant branching section 24A. The second expansion valve 26 is a pressure reducing unit that reduces the pressure and expands the liquid phase refrigerant flowing out from the other outlet of the receiver 23. Similar to the first expansion valve 25, the second expansion valve 26 is configured to allow the opening degree (in other words, the throttle opening degree) of the refrigerant flow path to be changed.

[0035] Furthermore, the second expansion valve 26 is configured with a variable throttling mechanism that has a fully closing function to completely close the refrigerant flow path. In this embodiment, the second expansion valve 26 constitutes a part of the heat pump module 1. The second expansion valve 26 is arranged adjacent to the first expansion valve 25 in the heat pump module 1. The operation of the second expansion valve 26 is controlled by a control signal output from the control device 70.

[0036] The refrigerant outlet of the second expansion valve 26 is connected to the refrigerant inlet side of the second chiller 28 via the low-pressure side flow path 12 and the fifth connection part 15E of the flow path forming member 10. The second chiller 28 has a refrigerant passage 28A through which the low-pressure refrigerant, which has been reduced in pressure by the second expansion valve 26, flows, and a heat transfer medium passage 28B through which the low-temperature side heat transfer medium that circulates in the second low-temperature side heat transfer medium circuit 50 flows. The second chiller 28 is an evaporator that causes heat exchange between the low-pressure refrigerant flowing through the refrigerant passage 28A and the low-temperature side heat transfer medium flowing through the heat transfer medium passage 28B, thereby evaporating the low-pressure refrigerant and exhibiting an endothermic effect.

[0037] The refrigerant confluence section 24B is connected to the outlet side of the refrigerant passage 28A in the second chiller 28 via the low-pressure side passage 12 and the sixth connection section 15F of the flow path forming member 10. Therefore, the refrigerant confluence section 24B combines the flow of refrigerant that has flowed out from the first chiller 27 with the flow of refrigerant that has flowed out from the second chiller 28. The inlet side of the compressor 21 is connected to the outlet of the refrigerant confluence section 24B via the low-pressure side passage 12 of the flow path forming member 10.

[0038] In the heat pump cycle 20 of this embodiment, the refrigerant is compressed and pressurized by the compressor 21, then depressurized by the first expansion valve 25 or the second expansion valve 26 before being drawn into the compressor 21. For this reason, the refrigerant flow path from the discharge port of the compressor 21 to the inlet of the first expansion valve 25 or the second expansion valve 26 can be called the high-pressure side flow path. Also, the refrigerant flow path from the outlet of the first expansion valve 25 or the second expansion valve 26 to the suction port of the compressor 21 can be called the low-pressure side flow path.

[0039] Next, the high-temperature side heat transfer medium circuit 30 of the heat pump system 100 will be described. The high-temperature side heat transfer medium circuit 30 is a circuit that circulates the high-temperature side heat transfer medium. In the high-temperature side heat transfer medium circuit 30, an aqueous solution of ethylene glycol is used as the high-temperature side heat transfer medium. The high-temperature side heat transfer medium circuit 30 is equipped with the heat transfer medium passage 22B of the heat transfer medium refrigerant heat exchanger 22, the high-temperature side pump 31, and the heater core 32.

[0040] Furthermore, the high-temperature side heat transfer medium can be any fluid capable of transferring heat heated by the heat transfer medium refrigerant heat exchanger 22, and various forms can be adopted. For example, the high-temperature side heat transfer medium can be a liquid containing at least ethylene glycol, dimethylpolysiloxane, or a nanofluid, or an antifreeze liquid.

[0041] The high-temperature pump 31 is the heat transfer unit in the high-temperature heat transfer circuit 30 that sucks in and pressurizes the high-temperature heat transfer medium. The discharge port side of the high-temperature pump 31 is connected to the inlet side of the heat transfer passage 22B in the heat transfer refrigerant heat exchanger 22 via the high-temperature heat transfer passage 13 and the 7th connection part 15G formed as a heat transfer passage in the heat transfer module 300. Therefore, the high-temperature pump 31 pressurizes the high-temperature heat transfer medium to the inlet side of the heat transfer passage 22B in the heat transfer refrigerant heat exchanger 22. The high-temperature pump 31 is an electric water pump whose rotational speed (i.e., pressurizing capacity) is controlled by a control voltage output from the control device 70.

[0042] The outlet side of the heat transfer medium passage 22B in the heat transfer medium refrigerant heat exchanger 22 is connected to the heat transfer medium inlet side of the heater core 32 via the high-temperature side heat transfer medium passage 13 and the eighth connection part 15H of the heat transfer medium module 300. The heater core 32, as will be described later, is located inside the casing 61 of the indoor air conditioning unit 60 and is a heating heat exchange unit that exchanges heat between the high-temperature side heat transfer medium heated in the heat transfer medium refrigerant heat exchanger 22 and the blown air. In the heater core 32, the heat contained in the high-temperature side heat transfer medium is released into the blown air to heat the blown air. The outlet side of the heat transfer medium of the heater core 32 is connected to the suction port side of the high-temperature side pump 31.

[0043] Therefore, in the heat pump system 100 according to this embodiment, the components of the heat transfer medium refrigerant heat exchanger 22 and the high-temperature side heat transfer medium circuit 30 heat the blown air using the high-pressure refrigerant discharged from the compressor 21 as a heat source, thereby heating the conditioned air.

[0044] Next, the first low-temperature side heat transfer medium circuit 40, which constitutes the heat pump system 100, will be described. The first low-temperature side heat transfer medium circuit 40 is a circuit that circulates the low-temperature side heat transfer medium. In the first low-temperature side heat transfer medium circuit 40, the same type of fluid as the high-temperature side heat transfer medium is used as the low-temperature side heat transfer medium. The first low-temperature side heat transfer medium circuit 40 is equipped with the heat transfer medium passage 27B of the first chiller 27, the first low-temperature side pump 41, and the heat exchange unit 42 for the battery.

[0045] The first low-temperature pump 41 is a heat transfer unit that sucks in and pressurizes the low-temperature heat transfer medium circulating in the first low-temperature heat transfer circuit 40. The discharge port side of the first low-temperature pump 41 is connected to the inlet side of the heat transfer passage 27B in the first chiller 27 via the low-temperature heat transfer passage 14 and the ninth connection part 15I formed as a heat transfer passage in the heat transfer module 300. Therefore, the first low-temperature pump 41 pressurizes the low-temperature heat transfer medium to the inlet side of the heat transfer passage 27B in the first chiller 27. The first low-temperature pump 41 is an electric water pump whose rotational speed (i.e., pressurizing capacity) is controlled by a control voltage output from the control device 70.

[0046] The outlet side of the heat transfer medium passage 27B in the first chiller 27 is connected to the heat transfer medium inlet side of the battery heat exchange unit 42 via the low-temperature side heat transfer medium passage 14 and the 10th connection part 15J of the heat transfer medium module 300. The battery heat exchange unit 42 is a heat exchange unit that exchanges heat between multiple battery cells constituting the battery and the low-temperature side heat transfer medium. The battery heat exchange unit 42 is configured by forming a passage through which the low-temperature side heat transfer medium flows within a battery case that houses multiple battery cells. Furthermore, the outlet side of the heat transfer medium of the battery heat exchange unit 42 is connected to the suction port side of the first low-temperature side pump 41.

[0047] Therefore, in the heat pump system 100 according to this embodiment, a temperature control function can be realized by adjusting the temperature of the battery using the components of the first chiller 27 and the first low-temperature side heat transfer medium circuit 40.

[0048] Next, the second low-temperature side heat transfer medium circuit 50, which constitutes the heat pump system 100, will be described. The second low-temperature side heat transfer medium circuit 50 is a circuit that circulates the low-temperature side heat transfer medium. In the second low-temperature side heat transfer medium circuit 50, the same type of fluid as the high-temperature side heat transfer medium can be used as the low-temperature side heat transfer medium. The second low-temperature side heat transfer medium circuit 50 is equipped with the heat transfer medium passage 28B of the second chiller 28, the second low-temperature side pump 51, and the cooler core 52.

[0049] The second low-temperature pump 51 is a heat transfer unit that sucks in and pressurizes the low-temperature heat transfer medium circulating in the second low-temperature heat transfer circuit 50. The discharge port side of the second low-temperature pump 51 is connected to the inlet side of the heat transfer passage 28B in the second chiller 28 via the low-temperature heat transfer flow path 14 and the 11th connection part 15K of the heat transfer module 300. Therefore, the second low-temperature pump 51 pressurizes the low-temperature heat transfer medium to the inlet side of the heat transfer passage 28B in the second chiller 28. The second low-temperature pump 51 is an electric water pump whose rotational speed (i.e., pressurizing capacity) is controlled by a control voltage output from the control device 70.

[0050] The outlet side of the heat transfer medium passage 28B in the second chiller 28 is connected to the heat transfer medium inlet side of the cooler core 52 via the low-temperature side heat transfer medium passage 14 and the 12th connection part 15L of the heat transfer medium module 300. The cooler core 52 is a cooling heat exchange unit that exchanges heat between the low-temperature side heat transfer medium circulating in the second low-temperature side heat transfer medium circuit 50 and the blown air supplied to the passenger compartment, which is the space to be air-conditioned, and cools the blown air. The cooler core 52 is located inside the passenger compartment air conditioning unit 60, which will be described later, and absorbs heat from the blown air supplied to the passenger compartment into the low-temperature side heat transfer medium. Therefore, the cooler core 52 is an example of a cooling unit that cools blown air. The outlet side of the heat transfer medium of the cooler core 52 is connected to the intake side of the second low-temperature side pump 51.

[0051] Therefore, in the heat pump system 100 according to this embodiment, the blown air can be cooled using the low-pressure refrigerant, which has been reduced in pressure by the second expansion valve 26, as a cooling source, through the components of the second chiller 28 and the second low-temperature side heat transfer medium circuit 50.

[0052] Next, the interior air conditioning unit 60 of the heat pump system 100 will be described with reference to Figure 3. The interior air conditioning unit 60 is a unit that integrates multiple components to blow air adjusted to an appropriate temperature for air conditioning inside the cabin of an electric vehicle to the appropriate location inside the cabin. The interior air conditioning unit 60 is located inside the instrument panel at the very front of the cabin of the electric vehicle.

[0053] The indoor air conditioning unit 60 is formed by housing an indoor blower 62, a cooler core 52, a heater core 32, etc., within a casing 61 that forms an air passage for the supplied air. The casing 61 is molded from a resin (for example, polypropylene) that has a certain degree of elasticity and excellent strength.

[0054] An internal / external air switching device 63 is located at the upstream end of the airflow within the casing 61. The internal / external air switching device 63 switches between introducing internal air (i.e., air from inside the vehicle) and external air (i.e., air from outside the vehicle) into the casing 61. The operation of the internal / external air switching device 63 is controlled by a control signal output from the control device 70.

[0055] An interior blower 62 is positioned downstream of the airflow from the interior / exterior air switching device 63. The interior blower 62 blows the air drawn in via the interior / exterior air switching device 63 into the vehicle interior. The rotational speed (i.e., the blowing capacity) of the interior blower 62 is controlled by a control voltage output from the control device 70.

[0056] Downstream of the airflow from the indoor blower 62, the cooler core 52 and the heater core 32 are arranged in this order relative to the airflow. In other words, the cooler core 52 is positioned upstream of the heater core 32 in the airflow. Inside the casing 61, a cold air bypass passage 65 is formed that allows the airflow, after passing through the cooler core 52, to bypass the heater core 32.

[0057] An air mix door 64 is positioned downstream of the airflow through the cooler core 52 within the casing 61, and upstream of the airflow through the heater core 32 and the cold air bypass passage 65. The air mix door 64 adjusts the ratio of the airflow volume of the air that passes through the heater core 32 and the airflow volume of the air that passes through the cold air bypass passage 65, after the air has passed through the cooler core 52. The operation of the drive unit of the air mix door 64 is controlled by a control signal output from the control device 70.

[0058] A mixing space is located downstream of the airflow from the heater core 32 and the cold air bypass passage 65. The mixing space is a space where the air heated by the heater core 32 is mixed with the air that has passed through the cold air bypass passage 65 and has not been heated. Therefore, the indoor air conditioning unit 60 can adjust the temperature of the air mixed in the mixing space (i.e., the conditioned air) by adjusting the opening of the air mix door 64.

[0059] At the downstream end of the airflow path of the casing 61, multiple openings are formed to direct conditioned air to various locations within the vehicle interior. Each of these openings is equipped with a discharge mode door that opens and closes it. The operation of the discharge mode door is controlled by a control signal output from the control device 70. Therefore, the interior air conditioning unit 60 can blow conditioned air adjusted to the appropriate temperature to the appropriate location within the vehicle interior by switching which opening the discharge mode door opens and closes.

[0060] With the heat pump system 100 configured in this way, the operation of the heat pump cycle 20, the high-temperature side heat transfer medium circuit 30, the first low-temperature side heat transfer medium circuit 40, and the second low-temperature side heat transfer medium circuit 50 can be controlled to appropriately adjust the temperature of the air conditioning inside the vehicle and the onboard equipment.

[0061] Next, an overview of the electrical control unit of the heat pump system 100 will be explained using Figure 4. The control device 70 consists of a well-known microcomputer including a CPU, ROM, and RAM, and its peripheral circuits. The control device 70 performs various calculations and processes based on the control program stored in the ROM, and controls the operation of various controlled devices connected to the output side. The control device 70 is an example of a control unit.

[0062] The various controlled devices include the compressor 21, the first expansion valve 25, the second expansion valve 26, the high-temperature side pump 31, the first low-temperature side pump 41, the second low-temperature side pump 51, the indoor blower 62, the indoor / outdoor air switching device 63, and the air mix door 64. Of these, the compressor 21, the first expansion valve 25, and the second expansion valve 26 are components of the heat pump module 1, so control commands from the control device 70 are transmitted to the heat pump module 1.

[0063] As shown in Figure 4, various control sensors are connected to the input side of the control device 70. The control sensors connected are an indoor temperature sensor 72A, an outdoor temperature sensor 72B, a solar radiation sensor 72C, and an air conditioning air temperature sensor 72D. In addition, the first refrigerant temperature sensor 73A, the second refrigerant temperature sensor 73B, the third refrigerant temperature sensor 73C, the first heat transfer medium temperature sensor 74A, the second heat transfer medium temperature sensor 74B, and the third heat transfer medium temperature sensor 74C are also connected as control sensors.

[0064] The interior temperature sensor 72A is an interior temperature detection unit that detects the interior temperature Tr, which is the temperature inside the vehicle. The exterior temperature sensor 72B is an exterior temperature detection unit that detects the exterior temperature Tam, which is the temperature outside the vehicle. The solar radiation sensor 72C is a solar radiation detection unit that detects the amount of solar radiation As that irradiates into the vehicle interior. The air conditioning air temperature sensor 72D is an air conditioning air temperature detection unit that detects the temperature TAV of the air blown out from the mixing space into the vehicle interior.

[0065] The first refrigerant temperature sensor 73A is a refrigerant temperature detection unit that detects the temperature of the high-pressure refrigerant discharged from the compressor 21. The first refrigerant temperature sensor 73A is located, for example, on the inlet side of the refrigerant passage 22A of the heat transfer medium refrigerant heat exchanger 22.

[0066] The second refrigerant temperature sensor 73B is a refrigerant temperature detection unit that detects the temperature of the low-pressure refrigerant flowing out of the first chiller 27. The second refrigerant temperature sensor 73B is located, for example, on the outlet side of the refrigerant passage 27A of the first chiller 27.

[0067] The third refrigerant temperature sensor 73C is a refrigerant temperature detection unit that detects the temperature of the low-pressure refrigerant flowing out of the second chiller 28. The third refrigerant temperature sensor 73C is located, for example, on the outlet side of the refrigerant passage 28A of the second chiller 28.

[0068] The first refrigerant temperature sensors 73A to the third refrigerant temperature sensors 73C are installed in the heat pump module 1, and the detection results from each sensor are output from the heat pump module 1 to the control device 70.

[0069] Furthermore, the sensors incorporated into the heat pump module 1 are not limited to the first refrigerant temperature sensors 73A to the third refrigerant temperature sensors 73C. A refrigerant pressure sensor that detects the pressure of the refrigerant circulating in the heat pump cycle 20 may also be included as a control sensor incorporated into the heat pump module 1. In this case, a configuration in which multiple refrigerant pressure sensors are incorporated into the heat pump module 1 is also possible.

[0070] The first heat transfer medium temperature sensor 74A is a heat transfer medium temperature detection unit that detects the temperature of the high-temperature side heat transfer medium circulating in the high-temperature side heat transfer medium circuit 30. The first heat transfer medium temperature sensor 74A is located, for example, on the outlet side of the heat transfer medium passage 22B in the heat transfer medium refrigerant heat exchanger 22.

[0071] The second heat transfer medium temperature sensor 74B is a heat transfer medium temperature detection unit that detects the temperature of the low-temperature heat transfer medium circulating in the first low-temperature heat transfer medium circuit 40. The second heat transfer medium temperature sensor 74B is located, for example, on the outlet side of the heat transfer medium passage 27B in the first chiller 27.

[0072] The third heat transfer medium temperature sensor 74C is a heat transfer medium temperature detection unit that detects the temperature of the low-temperature heat transfer medium circulating in the second low-temperature heat transfer medium circuit 50. The third heat transfer medium temperature sensor 74C is located, for example, on the outlet side of the heat transfer medium passage 28B in the second chiller 28.

[0073] Furthermore, the flow path forming member 10 of the heat pump module 1 has a portion of the heat transfer fluid flow paths that constitute the high-temperature side heat transfer fluid circuit 30, the first low-temperature side heat transfer fluid circuit 40, and the second low-temperature side heat transfer fluid circuit 50 formed therein. Therefore, the first heat transfer fluid temperature sensor 74A to the third heat transfer fluid temperature sensor 74C can be used as control sensors constituting the heat pump module 1, and the heat pump module 1 can be integrated into a single unit.

[0074] Furthermore, the control device 70 is connected to an operation panel 71 located near the instrument panel at the front of the passenger compartment in an electric vehicle. The control device 70 receives operation signals from various operation switches provided on this operation panel 71.

[0075] The various control switches provided on the control panel 71 include, specifically, an auto switch, an air conditioner switch, an airflow setting switch, a temperature setting switch, and the like. The auto switch is an operation switch that sets or cancels the automatic control operation of the heat pump cycle 20.

[0076] The air conditioning switch is an operating switch that requests the cooling of the blown air by the cooler core 52. The airflow setting switch is an operating switch that is operated when manually setting the airflow of the interior blower 62. The temperature setting switch is an operating switch that sets the target temperature Tset inside the vehicle.

[0077] Furthermore, the control device 70 of this embodiment is configured with an integrated control unit that controls various controlled devices connected to its output side. Therefore, the configuration (i.e., hardware and software) that controls the operation of each controlled device constitutes the control unit that controls the operation of each controlled device.

[0078] For example, within the control device 70, the configuration that controls the refrigerant discharge capacity (e.g., rotational speed) of the compressor 21 in the heat pump cycle 20 corresponds to the compressor control unit. Also, within the control device 70, the configuration that controls the amount of pressure reduction (i.e., throttle opening) in the first expansion valve 25 and the second expansion valve 26 of the heat pump cycle 20 corresponds to the pressure reduction control unit.

[0079] Next, the connections between the flow path forming member 10, the multiple heat exchangers 22, 27, 28, and the heat transfer medium module 300 in the heat pump module 1 of this embodiment will be described. Here, the seal portion at the connection between the flow path forming member 10 and the multiple heat exchangers 22, 27, 28 is defined as the refrigerant side seal portion. Also, the seal portion at the connection between the heat transfer medium module 300 and the multiple heat exchangers 22, 27, 28 is defined as the heat transfer medium side seal portion.

[0080] As shown in Figure 5, the flow path forming member 10 is provided with a first connection part 15A, a second connection part 15B, a third connection part 15C, a fourth connection part 15D, a fifth connection part 15E (see Figure 2), and a sixth connection part 15F (see Figure 2). The first to sixth connection parts 15A to 15F are circular holes that open toward the multiple heat exchangers 22, 27, and 28.

[0081] The first connection portion 15A of the flow path forming member 10 has the refrigerant inlet 221 of the heat transfer medium refrigerant heat exchanger 22 inserted into it. The second connection portion 15B of the flow path forming member 10 has the refrigerant outlet 222 of the heat transfer medium refrigerant heat exchanger 22 inserted into it.

[0082] The refrigerant inlet 221 and refrigerant outlet 222 of the heat transfer medium refrigerant heat exchanger 22 are each formed in a cylindrical shape that protrudes from the main body 223 of the heat transfer medium refrigerant heat exchanger 22 toward the flow path forming member 10. The outer diameter of the refrigerant inlet 221 of the heat transfer medium refrigerant heat exchanger 22 is slightly smaller than the inner diameter of the first connection portion 15A of the flow path forming member 10. The outer diameter of the refrigerant outlet 222 of the heat transfer medium refrigerant heat exchanger 22 is slightly smaller than the inner diameter of the second connection portion 15B of the flow path forming member 10.

[0083] The refrigerant inlet 271 of the first chiller 27 is inserted into the third connection portion 15C of the flow path forming member 10. The refrigerant outlet 272 of the first chiller 27 is inserted into the fourth connection portion 15D of the flow path forming member 10.

[0084] The refrigerant inlet 271 and refrigerant outlet 272 of the first chiller 27 are each formed in a cylindrical shape that protrudes from the main body 273 of the first chiller 27 toward the flow path forming member 10. The outer diameter of the refrigerant inlet 271 of the first chiller 27 is slightly smaller than the inner diameter of the third connection portion 15C opening of the flow path forming member 10. The outer diameter of the refrigerant outlet 272 of the first chiller 27 is slightly smaller than the inner diameter of the fourth connection portion 15D of the flow path forming member 10.

[0085] Although not shown in the diagram, the refrigerant inlet of the second chiller 28 is inserted into the fifth connection portion 15E of the flow path forming member 10. The refrigerant inlet of the second chiller 28 is inserted into the sixth connection portion 15F of the flow path forming member 10.

[0086] The refrigerant inlet and outlet of the second chiller 28 are each formed in a cylindrical shape that protrudes from the main body of the second chiller 28 toward the flow path forming member 10. The outer diameter of the refrigerant inlet of the second chiller 28 is slightly smaller than the inner diameter of the opening of the fifth connection portion 15E of the flow path forming member 10. The outer diameter of the refrigerant outlet of the second chiller 28 is slightly smaller than the inner diameter of the sixth connection portion 15F of the flow path forming member 10.

[0087] On the outer circumference of the refrigerant inlet 221 and refrigerant outlet 222 of the heat transfer medium refrigerant heat exchanger 22, a first groove 224 is formed, which holds an elastically deformable first refrigerant-side O-ring 81. On the outer circumference of the refrigerant inlet 271 and refrigerant outlet 272 of the first chiller 27, a second groove 274 is formed, which holds an elastically deformable second refrigerant-side O-ring 82. Although not shown in the figures, on the outer circumference of the refrigerant inlet and refrigerant outlet of the second chiller 28, a third groove is formed, which holds an elastically deformable third refrigerant-side O-ring.

[0088] The first refrigerant-side O-ring 81, the second refrigerant-side O-ring 82, and the third refrigerant-side O-ring each constitute a cylindrical seal with a cylindrical sealing surface. In other words, a cylindrical seal is used for the refrigerant-side sealing portion. In this embodiment, the first refrigerant-side O-ring 81, the second refrigerant-side O-ring 82, and the third refrigerant-side O-ring are each made of rubber material.

[0089] The heat transfer module 300 is provided with a 7th connection part 15G, an 8th connection part 15H, a 9th connection part 15I, a 10th connection part 15J, an 11th connection part 15K (see Figure 2), and a 12th connection part 15L (see Figure 2). The 7th to 12th connection parts 15G to 15L are holes that open toward the multiple heat exchangers 22, 27, and 28, respectively. In this embodiment, the 7th to 12th connection parts 15G to 15L are each formed in a circular shape.

[0090] The seventh connection part 15G of the heat transfer module 300 is connected to the heat transfer inlet 225 of the heat transfer refrigerant heat exchanger 22. The eighth connection part 15H of the heat transfer module 300 is connected to the heat transfer outlet 226 of the heat transfer refrigerant heat exchanger 22.

[0091] The ninth connection part 15I of the heat transfer module 300 is connected to the heat transfer inlet 275 of the first chiller 27. The tenth connection part 15J of the heat transfer module 300 is connected to the heat transfer outlet 276 of the first chiller 27.

[0092] Although not shown in the diagram, the 11th connection 15K of the heat transfer module 300 is connected to the heat transfer inlet 285 (see Figure 1) of the second chiller 28. The 12th connection 15L of the heat transfer module 300 is connected to the heat transfer outlet 286 (see Figure 1) of the second chiller 28.

[0093] More specifically, as shown in Figures 1 and 5, a heat exchanger-side inlet / outlet forming portion 91 is connected to the surface of the main body portion 223 of the heat transfer medium refrigerant heat exchanger 22 that faces the heat transfer medium module 300. The heat exchanger-side inlet / outlet forming portion 91 has a heat exchanger-side cylindrical portion 92 and a heat exchanger-side plate-shaped portion 93. Inside the heat exchanger-side cylindrical portion 92, a heat exchanger-side cylindrical passage 920 is formed through which the heat transfer medium flows. One end of the heat exchanger-side cylindrical portion 92 is connected to the main body portion 223 of the heat transfer medium refrigerant heat exchanger 22.

[0094] In this embodiment, the heat exchanger-side cylindrical portion 92 is formed in a cylindrical shape. The heat exchanger-side cylindrical internal passage 920 is formed in a circular cross-section.

[0095] The heat exchanger-side cylindrical portion 92 has a heat exchanger inlet-side cylindrical portion 92A that allows the heat transfer medium to flow into the main body portion 223 of the heat transfer medium refrigerant heat exchanger 22, and a heat exchanger outlet-side cylindrical portion 92B that allows the heat transfer medium to flow out from the main body portion 223 of the heat transfer medium refrigerant heat exchanger 22. Here, the heat exchanger-side internal cylindrical passage 920 formed inside the heat exchanger inlet-side cylindrical portion 92A is defined as the heat exchanger inlet-side internal cylindrical passage 920A. The heat exchanger-side internal cylindrical passage 920 of the heat exchanger outlet-side cylindrical portion 92B is defined as the heat exchanger outlet-side internal cylindrical passage 920B.

[0096] The heat exchanger side plate portion 93 is formed in a plate shape that extends perpendicular to the axial direction of the cylindrical surface of the cylindrical seal in the refrigerant side seal portion. The other end of the heat exchanger side cylindrical portion 92 is connected to one surface of the heat exchanger side plate portion 93. The other surface of the heat exchanger side plate portion 93, located on the back side of the one surface, is in contact with the heat transfer medium module 300.

[0097] The heat exchanger side plate-shaped portion 93 is provided with a heat exchanger side through-hole 930 that communicates with the heat exchanger side cylinder passage 920. Here, of the heat exchanger side through-holes 930, the heat exchanger side through-hole 930 that communicates with the heat exchanger inlet side cylinder passage 920A is defined as the heat exchanger inlet side through-hole 930A. Of the heat exchanger side through-holes 930, the heat exchanger side through-hole 930 that communicates with the heat exchanger outlet side cylinder passage 920B is defined as the heat exchanger outlet side through-hole 930B.

[0098] The heat exchanger-side through-hole 930 and the heat exchanger-side in-cylinder passage 920 constitute the heat transfer medium inlet 225 and heat transfer medium outlet 226 of the heat transfer medium refrigerant heat exchanger 22. Specifically, the heat exchanger inlet-side in-cylinder passage 920A and the heat exchanger inlet-side through-hole 930A constitute the heat transfer medium inlet 225 of the heat transfer medium refrigerant heat exchanger 22. The heat exchanger outlet-side in-cylinder passage 920B and the heat exchanger outlet-side through-hole 930B constitute the heat transfer medium outlet 226 of the heat transfer medium refrigerant heat exchanger 22.

[0099] Here, the connection point between the second chiller 28 and the heat transfer module 300 is configured in the same way as the connection point between the first chiller 27 and the heat transfer module 300. For this reason, the connection point between the first chiller 27 and the heat transfer module 300 will be described below, and the description of the connection point between the second chiller 28 and the heat transfer module 300 will be omitted.

[0100] A chiller-side inlet / outlet forming portion 95 is connected to the surface of the main body portion 273 of the first chiller 27 that faces the heat transfer medium module 300. The chiller-side inlet / outlet forming portion 95 has a chiller-side cylindrical portion 96 and a chiller-side plate-shaped portion 97. Inside the chiller-side cylindrical portion 96, a chiller-side cylindrical passage 960 is formed through which the heat transfer medium flows. One end of the chiller-side cylindrical portion 96 is connected to the main body portion 273 of the first chiller 27.

[0101] In this embodiment, the chiller-side cylindrical portion 96 is formed in a cylindrical shape. The chiller-side cylindrical internal passage 960 is formed in a circular cross-section.

[0102] The chiller-side cylindrical portion 96 has a chiller inlet-side cylindrical portion 96A that allows a heat transfer medium to flow into the main body portion 273 of the first chiller 27, and a chiller outlet-side cylindrical portion 96B that allows the heat transfer medium to flow out from the main body portion 273 of the first chiller 27. Here, the chiller-side internal passage 960 formed inside the chiller inlet-side cylindrical portion 96A is defined as the chiller inlet-side internal passage 960A. The chiller-side internal passage 960 of the chiller outlet-side cylindrical portion 96B is defined as the chiller outlet-side internal passage 960B.

[0103] The chiller side plate-like portion 97 is formed as a plate that extends perpendicular to the axial direction of the cylindrical surface of the cylindrical seal in the refrigerant side seal portion. The other end of the chiller side cylindrical portion 96 is connected to one surface of the chiller side plate-like portion 97. The other surface of the chiller side plate-like portion 97, located on the back side of one surface, is in contact with the heat transfer medium module 300.

[0104] The chiller side plate-like portion 97 is provided with a chiller-side through-hole 970 that communicates with the chiller-side internal passage 960. Here, of the chiller-side through-holes 970, the one that communicates with the chiller inlet-side internal passage 960A is defined as the chiller inlet-side through-hole 970A. Of the chiller-side through-holes 970, the one that communicates with the chiller outlet-side internal passage 960B is defined as the chiller outlet-side through-hole 970B.

[0105] The chiller-side through-hole 970 and the chiller-side internal passage 960 constitute the heat transfer medium inlet 275 and heat transfer medium outlet 276 of the first chiller 27. More specifically, the chiller inlet-side internal passage 960A and the chiller inlet-side through-hole 970A constitute the heat transfer medium inlet 275 of the first chiller 27. The chiller outlet-side internal passage 960B and the chiller outlet-side through-hole 970B constitute the heat transfer medium outlet 276 of the first chiller 27.

[0106] As shown in Figure 5, an annular heat exchanger side groove 931 is formed on the other side of the heat exchanger side plate-like portion 93, surrounding the heat exchanger side through hole 930. The heat exchanger side groove 931 holds the first heat transfer medium side O-ring 85, which is an elastically deformable elastic member.

[0107] On the other side of the chiller side plate-like portion 97, an annular chiller side groove portion 971 is formed, surrounding the chiller side through hole 970. The chiller side groove portion 971 holds a second heat transfer medium side O-ring 86, which is an elastically deformable elastic member.

[0108] By pressing (i.e., tightly sealing) the heat transfer medium-side O-rings 85 and 86 against the heat transfer medium module 300, a flat seal is formed where the sealing surface is a flat surface. In other words, a flat seal is used in the heat transfer medium-side sealing portion. The direction perpendicular to the flat surface of the flat seal is the axial direction of the cylindrical surface of the cylindrical seal in the refrigerant-side sealing portion described above. In this embodiment, the heat transfer medium-side O-rings 85 and 86 are made of rubber material.

[0109] Here, the first chiller 27 and the second chiller 28 are collectively referred to as "chillers 27 and 28." As described above, a high-temperature heat transfer medium flows through the refrigerant heat exchanger 22, and a low-temperature heat transfer medium flows through the chillers 27 and 28. Therefore, the temperature of the heat transfer medium flowing through the refrigerant heat exchanger 22 is higher than the temperature of the heat transfer medium flowing through the chillers 27 and 28. Thus, the refrigerant heat exchanger 22 corresponds to an example of a high-temperature heat exchanger, and the chillers 27 and 28 correspond to an example of a low-temperature heat exchanger. The heat pump module 1 of this embodiment has multiple heat exchangers, including a refrigerant heat exchanger 22 and chillers 27 and 28, through which the temperatures of the heat transfer medium flowing are different from each other.

[0110] The heat pump module 1 of this embodiment includes a bracket 75 for fixing the heat transfer medium module 300 to the flow path forming member 10. The bracket 75 has a refrigerant-side portion 76 that is fastened and fixed to the flow path forming member 10, and a heat transfer medium-side portion 77 that is fastened and fixed to the heat transfer medium module 300.

[0111] The bracket 75 is fastened and fixed to the flow path forming member 10 and the heat transfer module 300 by refrigerant-side bolts 78 and heat transfer-side bolts 79. The refrigerant-side bolts 78 are fastening members that fasten and fix the bracket 75 to the flow path forming member 10 at the refrigerant-side portion 76. The heat transfer-side bolts 79 are fastening members that fasten and fix the bracket 75 to the heat transfer module 300 at the heat transfer-side portion 77.

[0112] The refrigerant-side portion 76 of the bracket 75 has a refrigerant-side through-hole 760 through which a refrigerant-side bolt 78 is inserted. The heat transfer medium-side portion 77 of the bracket 75 has a heat transfer medium-side through-hole 770 through which a heat transfer medium-side bolt 79 is inserted.

[0113] The heat transfer medium side through hole 770 is formed as an elongated hole shape that extends in the direction perpendicular to the sealing surface (i.e., the flat surface) of the flat seal in the heat transfer medium side seal portion described above (the left-right direction in the plane of the paper in Figure 5). The bracket 75 and the heat transfer medium module 300 are fastened and fixed together by the heat transfer medium side bolt 79, with the heat transfer medium module 300 pressed against the side of the multiple heat exchangers 22, 27, and 28 (the left side in the plane of the paper in Figure 5).

[0114] As described above, the heat pump module 1 according to this embodiment employs a cylindrical seal in the refrigerant-side seal portion and a flat seal in the heat transfer medium-side seal portion. This allows the flat seal portion of the heat transfer medium-side seal portion to absorb the positional tolerance of the connection between the heat transfer medium module 300 and the multiple heat exchangers 22, 27, 28. As a result, it becomes possible to ensure sealing performance at all connection portions of both the refrigerant-side seal portion and the heat transfer medium-side seal portion.

[0115] In this case, cylindrical seals offer superior sealing performance compared to flat seals because it is easier to ensure sufficient sealing pressure. In this embodiment, a cylindrical seal is used for the refrigerant-side sealing portion, making it possible to reliably seal the refrigerant-side sealing portion where pressure is high.

[0116] Furthermore, in this embodiment, the heat transfer medium side through hole 770 is formed in the shape of an elongated hole extending perpendicularly to the sealing surface of the planar seal in the heat transfer medium side seal portion. In addition, the bracket 75 and the heat transfer medium module 300 are fastened and fixed together by heat transfer medium side bolts 79 while the heat transfer medium module 300 is pressed against the multiple heat exchangers 22, 27, and 28. This allows a load to be applied to the heat transfer medium side O-rings 85 and 86, making them tightly adhere to the outer wall surface of the heat transfer medium module 300. As a result, the sealing surface pressure of the planar seal in the heat transfer medium side seal portion can be secured, thereby improving the sealing performance of the heat transfer medium side seal portion.

[0117] (Other embodiments) The present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the spirit of the invention. Furthermore, the means disclosed in each of the above embodiments may be combined as appropriate to the extent that they are feasible.

[0118] (1) For example, in the above-described embodiment, an example was given in which a cylindrical seal with a cylindrical sealing surface was used as the refrigerant-side seal portion, but the configuration of the refrigerant-side seal portion is not limited to this embodiment. The refrigerant-side seal portion may be any cylindrical seal with a cylindrical sealing surface, for example, a rectangular tubular seal with a rectangular tubular sealing surface may be used.

[0119] (2) In the embodiments described above, an example was described in which a cylindrical seal was used for the refrigerant side seal and a flat seal was used for the heat transfer medium side seal, but the invention is not limited to this embodiment. That is, a flat seal may be used for the refrigerant side seal and a cylindrical seal may be used for the heat transfer medium side seal. [Explanation of symbols]

[0120] 10 Flow channel forming member 22 Heat medium refrigerant heat exchanger (heat exchanger) 27. First chiller (heat exchanger) 28. Second chiller (heat exchanger) 300 Heat Transfer Modules

Claims

1. Multiple heat exchangers (22, 27, 28) for exchanging heat between a refrigerant and a heat transfer medium, A flow path forming member (10) is formed in which a refrigerant passage through which the refrigerant flows is formed and the heat exchanger is connected, A heat pump module comprising: a heat medium module (300) having a heat medium passage through which the heat medium flows and to which the heat exchanger is connected, When the seal portion at the connection between the flow path forming member and the plurality of heat exchangers is defined as the refrigerant side seal portion, and the seal portion at the connection between the heat transfer medium module and the plurality of heat exchangers is defined as the heat transfer medium side seal portion, A cylindrical seal is used in one of the refrigerant-side seal portion and the heat transfer medium-side seal portion, with a cylindrical sealing surface, and a flat seal is used in the other of the refrigerant-side seal portion and the heat transfer medium-side seal portion, with a flat sealing surface. A heat pump module in which the axial direction of the cylindrical surface is perpendicular to the direction of the flat surface.

2. The heat pump module according to claim 1, wherein a cylindrical seal is used for the refrigerant side seal portion and a surface seal is used for the heat transfer medium side seal portion.

3. Furthermore, the bracket (75) has a refrigerant-side portion (76) that is fastened and fixed to the flow path forming member and a heat transfer medium-side portion (77) that is fastened and fixed to the heat transfer medium module, The bracket is fastened and secured to the heat transfer module at the heat transfer side portion, The heat transfer medium side portion has a through hole (770) formed in the shape of an elongated hole extending perpendicular to the flat surface, through which the fastening member is inserted. The heat pump module according to claim 1 or 2, wherein the bracket and the heat transfer medium module are fastened and fixed together by the fastening member while the heat transfer medium module is pressed against the heat exchanger side.

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