Power converter and method for assembling the power converter

Abstract

To provide power conversion devices and the like that can suppress the soaring costs of manufacturing. [Solution] The power converter 10 comprises a mounting board 50 on which electronic components 51 are mounted, a housing 20 that houses the mounting board 50, a housing base 40, and a heat sink 60 for dissipating heat generated by the electronic components 51 mounted on the mounting board 50. The mounting board 50 is attached to one side 41b of the housing base 40, and the heat sink 60 is attached to the other side 41c of the housing base 40, opposite to the one side 41b, at a position corresponding to the electronic components 51. The housing 20 is frame-shaped, with multiple side sections that penetrate from a front opening 121 to a rear opening 122. The edges of the multiple side sections that form the front opening 121 have bent sections 25, where a part of the multiple side sections is bent to narrow the front opening 121, and the opening area of ​​the rear opening 122 is larger than the opening area of ​​the front opening 121.

Description

Technical Field

[0006] ,

[0001] The present disclosure relates to a power conversion device and a method for assembling a power conversion device, and particularly to a power conversion device that converts at least DC power into AC power and a method for assembling a power conversion device.

Background Art

[0002] Conventionally, a power conversion device that converts at least AC power into DC power is known. For example, Patent Document 1 discloses a power conversion device including a heat radiating portion fixed to the back wall of a housing, a substrate fixed to a shielding plate, a power conversion portion mounted on the substrate, and a main body portion that houses the heat radiating portion, the power conversion portion, and the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

[0007] Furthermore, in order to achieve the above objective, a method for assembling a power converter according to one embodiment of the present disclosure is a method for assembling a power converter, comprising: attaching the mounting substrate on which the electronic components are mounted to one side of the housing base; attaching the heat sink for dissipating heat generated by the electronic components mounted on the mounting substrate to the other side of the housing base; and housing the components consisting of the mounting substrate, the housing base, and the heat sink in the housing and assembling them into the housing. [Effects of the Invention]

[0008] According to this disclosure, power conversion devices and the like that can suppress the soaring costs of manufacturing are provided. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 shows a power system including a power conversion device according to an embodiment. [Figure 2] Figure 2 is a perspective view showing the external appearance of a power conversion device according to an embodiment. [Figure 3] Figure 3 is a six-view drawing of a power conversion device according to an embodiment. [Figure 4A]Figure 4A is an exploded perspective view showing a power conversion device according to an embodiment. [Figure 4B] Figure 4B is a plan view showing the housing of a power converter according to an embodiment. [Figure 5] Figure 5 is a cross-sectional view showing a power converter on the AA line. [Figure 6] Figure 6 is a cross-sectional view showing a power conversion device in a BB line. [Figure 7] Figure 7 is a cross-sectional view showing a power converter in a CC line. [Figure 8] Figure 8 is a flowchart showing the assembly method of a power converter. [Figure 9] Figure 9 shows the assembly process of a power converter. [Figure 10] Figure 10 is a cross-sectional view showing a power conversion device. [Modes for carrying out the invention]

[0010] The embodiments will be described in detail below with reference to the drawings.

[0011] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement positions of components, and connection configurations shown in the following embodiments are examples only and are not intended to limit this disclosure. Furthermore, any components in the following embodiments that are not described in an independent claim will be described as optional components.

[0012] Furthermore, each figure is a schematic diagram and not necessarily a strictly accurate representation. Also, the same component is denoted by the same reference numeral in each figure.

[0013] In the following embodiments, the cover side with respect to the housing is defined as the positive X-axis direction, the arrangement direction of the first mounting portion and the second mounting portion is defined as the positive Y-axis direction, and the direction orthogonal to the positive X-axis direction and the positive Y-axis direction is defined as the positive Z-axis direction. Also, the direction opposite to the positive X-axis direction is defined as the negative X-axis direction, the direction opposite to the positive Y-axis direction is defined as the negative Y-axis direction, and the direction opposite to the positive Z-axis direction is defined as the negative Z-axis direction. The direction of FIG. 1 is also applied to the figures after FIG. 2.

[0014] In the following embodiments, expressions such as the positive Z-axis direction, substantially parallel, and rectangular are used. For example, the positive Z-axis direction, substantially parallel, and rectangular do not only mean completely in the positive Z-axis direction, parallel, and completely rectangular, but also substantially in the positive Z-axis direction, substantially parallel, and substantially rectangular, that is, for example, including an error of about a few percent. Also, the positive Z-axis direction, substantially parallel, and rectangular mean the positive Z-axis direction, parallel, and rectangular within the range where the effects according to the present disclosure can be achieved. The same applies to other expressions using "positive Z-axis direction", "substantially", and "shape".

[0015] (Embodiment) <Configuration> First, the configuration of the power conversion device 10 and the power system 1 will be described while referring to FIGS. 1 to 7.

[0016] FIG. 1 is a diagram showing a power system 1 including a power conversion device 10 according to an embodiment. FIG. 2 is a perspective view showing the appearance of the power conversion device 10 according to the embodiment. FIG. 3 is a six-sided view of the power conversion device 10 according to the embodiment. (a) of FIG. 3 is a top view showing a side surface portion on the plus Z-axis direction side of the power conversion device 10. (b) of FIG. 3 is a side view showing a side surface portion on the minus Y-axis direction side of the power conversion device 10. (c) of FIG. 3 is a front view showing the plus X-axis direction side of the power conversion device 10. (d) of FIG. 3 is a side view showing a side surface portion on the plus Y-axis direction side of the power conversion device 10. (e) of FIG. 3 is a bottom view showing a side surface portion on the minus Z-axis direction side of the power conversion device 10. (f) of FIG. 3 is a rear view showing the minus X-axis direction side of the power conversion device 10. FIG. 4A is an exploded perspective view showing the power conversion device 10 according to the embodiment. FIG. 4B is a plan view showing the housing 20 of the power conversion device 10 according to the embodiment. FIG. 5 is a cross-sectional view showing the power conversion device 10 along line A-A. FIG. 6 is a cross-sectional view showing the power conversion device 10 along line B-B. FIG. 7 is a cross-sectional view showing the power conversion device 10 along line C-C.

[0017] As shown in FIG. 1, the power system 1 has a power generation facility 5 and a power conversion device 10.

[0018] The power generation facility 5 is a solar panel, a fuel cell system, a wind power generation system, etc. The power generation facility 5 can output the generated power to the power conversion device 10.

[0019] The power conversion device 10 is a device that can convert power. Specifically, the power conversion device 10 can convert at least DC power obtained from the power generation facility � into AC power and output the converted AC power to the grid power 7. For example, the power conversion device 10 is composed of a DC-AC inverter that can convert DC power and AC power bidirectionally, a DC-DC converter that converts DC power, etc.

[0020] As shown in Figures 2 to 4A, the power converter 10 comprises a housing 20, an inner cover 39, an outer cover 38, a housing base 40, electronic components 51, a mounting board 50, and a heat sink 60.

[0021] The housing 20 houses the mounting board 50, the housing base 40, and the heat sink 60. The housing 20 is composed of multiple side sections and forms a frame shape that penetrates from the front opening 121 to the rear opening 122. In this embodiment, the housing 20 is a rectangular frame.

[0022] The housing 20 has bent portions 25 provided at the edges of a plurality of side portions that form the front opening 121, where a portion of the plurality of side portions is bent in such a way as to narrow the front opening 121. In other words, each of the plurality of side portions is parallel along the front-rear direction, and the bent portion 25 is a tongue-shaped piece that is bent inward towards the housing 20 in a direction perpendicular to the front-rear direction.

[0023] The bent portion 25 has fastening holes 25a for fastening with a fastening member 91. The fastening member 91 is fastened to the fastening holes 25a of the bent portion 25 through the through-hole 39a of the inner cover 39, thereby attaching the inner cover 39 to the bent portion 25 so as to cover the front opening 121 and placing it in the housing 20. In other words, the inner cover 39 covers the housing base 40, electronic components 51, mounted circuit board 50, and heat sink 60 housed in the housing 20. The inner cover 39 is a shielding cover that blocks electromagnetic waves generated from the mounted circuit board 50 from being radiated to the outside. The inner cover 39 is made of a metallic material. The inner cover 39 is an example of a cover.

[0024] The outer cover 38 covers the inner cover 39 and is positioned on the positive X-axis side of the inner cover 39. The outer cover 38 is fixed to the first handle outer 31 and the second handle outer 32 of the housing 20 by fastening members 96.

[0025] The edges of the multiple side portions that form the rear opening 122 extend in a planar manner so as not to narrow the rear opening 122. In other words, the edges of the housing 20 on the X-axis minus direction side, which is opposite to the X-axis plus direction side where the bent portion 25 is formed, do not have a bent portion 25. For this reason, as shown in Figure 4B, the housing 20 is configured such that the opening area of ​​the rear opening 122, shown by the dashed line V1, is larger than the opening area of ​​the front opening 121, shown by the double dashed line V2. The X-axis plus direction is an example of the front, and the X-axis minus direction is an example of the rear.

[0026] The rear opening 122 is open. Therefore, the housing 20 is configured to allow air from outside the power converter 10 to easily flow in through the rear opening 122.

[0027] The mounting board 50 is attached to one side 41b of the housing base 40. The one side 41b of the housing base 40 is the side in the positive X-axis direction. A spacer is placed between the mounting board 50 and the one side 41b of the housing base 40, creating a gap between the mounting board 50 and the one side 41b of the housing base 40.

[0028] The mounting board 50 has the aforementioned DC-AC inverter and DC-DC converter mounted on it. For example, the mounting board 50 has a modularized IPM, a DC noise filter circuit, an AC noise filter circuit, a DC (direct current) reactor, an AC (alternating current) reactor, and a control circuit mounted on it.

[0029] The mounting board 50 includes a main board 150 and a power supply board 52.

[0030] The main board 150 is a board on which electronic components 51 are mounted. The electronic components 51 are switching elements mounted on the side of the board facing the housing base 40. The switching elements are IPMs (Intelligent Power Modules) and consist of IGBTs (Insulated Gate Bipolar Transistors) or MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors). Multiple relays are electrically connected to the main board 150.

[0031] The power supply board 52 is located on the positive X-axis side of the main board 150 and is electrically connected to the main board 150 by a connector (not shown). The power supply board 52 can supply power to the main board 150. The power supply board 52 is smaller and more compact than the main board 150.

[0032] The heatsink 60 is attached to the other side 41c of the housing base 40, which is opposite to the one side 41b, and is positioned in a location corresponding to the electronic component 51. The other side 41c of the housing base 40 is the side in the negative X-axis direction. The heatsink 60 can dissipate the heat generated by the electronic component 51 mounted on the main board 150 of the mounting board 50.

[0033] The heat sink 60 and the housing base 40 are fixed together by fastening members (not shown). Specifically, the fastening members (not shown) are fastened through holes formed in the housing base 40 to fastening holes formed in the heat sink 60, thereby attaching the heat sink 60 to the other side 41c of the base body 41.

[0034] The housing base 40 has a base body 41 and a mounting wall portion 42.

[0035] The base body 41 is a flat plate shape substantially parallel to the YZ plane and has the aforementioned one surface 41b and the other surface 41c. Therefore, the mounting board 50 is attached to the one surface 41b of the base body 41, and the heat sink 60 is attached to the other surface 41c of the base body 41.

[0036] The mounting board 50 and the base body 41 are fixed together by fastening members 95. Specifically, the fastening members 95 are fastened through through holes 50a formed in the mounting board 50 to fastening holes 45 formed in the housing base 40, thereby attaching the mounting board 50 to one side 41b of the base body 41.

[0037] As shown in Figure 5, the base body 41 has an opening 41a for exposing the electronic component 51. This opening 41a is formed at a position corresponding to the electronic component 51 mounted on the X-axis negative side of the mounting substrate 50. In this embodiment, the electronic component 51 is inserted into the opening 41a and is positioned to easily connect thermally with the heat sink 60. Thermal connection means that the heat sink 60 and the electronic component 51 are in close contact, either directly or indirectly via a heat conductive member, and heat is conducted from the heat-generating electronic component 51 to the heat sink 60. Therefore, even if the electronic component 51 is driven and generates heat, that heat is conducted to the heat sink 60, thus suppressing the temperature rise of the electronic component 51.

[0038] The mounting wall portion 42 rises from the base body 41 toward the rear (in the negative X-axis direction). The mounting wall portion 42 is positioned on the outer edge of the base body 41 and is arranged to surround the heat sink 60, forming a housing space S for the heat sink 60. In other words, the mounting wall portion 42 surrounds the heat sink 60 on the negative X-axis side of the base body 41 so as to form a housing space S for housing the heat sink 60.

[0039] The housing 20 and the mounting wall portion 42 are fixed together by fastening members 92. Specifically, the fastening members 92 are fastened through through holes 120 formed in the side surface of the housing 20 to fastening holes 42b formed in the mounting wall portion 42, thereby attaching the mounting wall portion 42 to the side surface of the housing 20. In this way, the housing base 40 and the housing 20 are fixed together by the fastening members 92.

[0040] Next, we will explain the configuration of the enclosure 20 in more detail.

[0041] The housing 20 includes a first take-out section 31, a second take-out section 32, and a housing body section 20a.

[0042] The first intake section 31 is a plate-shaped member positioned on the negative Z-axis side and substantially parallel to the XY plane.

[0043] The second external access part 32 is positioned on the Z-axis negative side, is bent in an L-shape, and is a component that forms a corner of the housing 20, and forms a wiring port.

[0044] The first and second handle parts 31 and 32 are detachable from the housing body 20a. For example, the first handle part 31 is fastened to the fourth side portion 24 of the housing body 20a by a fastening member 93, and the second handle part 32 is fastened to the first handle part 31 by a fastening member 93, and the engaging portion 32a of the second handle part 32 engages with the housing body 20a, thereby attaching it to the housing body 20a. The first and second handle parts 31 and 32 can be removed from the housing body 20a by removing the fastening member 93.

[0045] As described above, the mounting board 50, the housing base 40, and the heat sink 60 are housed inside the housing 20. Even after the mounting board 50, the housing base 40, and the heat sink 60 are assembled into the housing 20, the condition of the mounting board 50, the housing base 40, and the heat sink 60 housed inside the housing 20 can be checked by removing at least the first attachment part 31 from the housing body 20a.

[0046] The housing body 20a is U-shaped or C-shaped when viewed along the X-axis direction. The housing body 20a is composed of a plurality of side portions. In this embodiment, the housing body 20a has a first side portion 21 positioned on the Z-axis positive side and substantially parallel to the XY plane, a second side portion 22 positioned on the Y-axis positive side of the first side portion 21 and substantially parallel to the XZ plane extending from the first side portion 21 in the Z-axis negative direction, a third side portion 23 positioned on the Y-axis negative side of the first side portion 21 and substantially parallel to the XZ plane extending from the first side portion 21 in the Z-axis negative direction, and a fourth side portion 24 positioned on the Z-axis negative side of the third side portion 23 and substantially parallel to the XY plane extending from the third side portion 23 in the Y-axis positive direction. The Y-axis negative direction is an example of a first direction. The Y-axis positive direction is an example of a second direction.

[0047] As described above, the mounting wall portion 42 is arranged to surround the heat sink 60, but at least a part of the mounting wall portion 42 may have a first communication hole 44a formed therein. The first communication hole 44a is a hole for air to flow in and out. The first communication hole 44a is formed in the mounting wall portion 42 located on the Z-axis positive side of the housing base 40 and in the mounting wall portion 42 located on the Z-axis negative side of the housing base 40.

[0048] A second communication hole 26 is formed in the side surface of the housing 20 opposite to the first communication hole 44a. Specifically, the first communication hole 44a of the mounting wall portion 42 located on the Z-axis positive side of the housing base 40 is formed to face the second communication hole 26 formed in the first side surface portion 21 of the housing 20. Furthermore, the first communication hole 44a of the mounting wall portion 42 located on the Z-axis negative side of the housing base 40 is formed to face the second communication hole 26 formed in the first mounting outer portion 31 of the housing 20. Therefore, outside air passes through the second communication hole 26 formed in the first side portion 21 and the first communication hole 44a in the mounting wall portion 42 located on the Z-axis positive side by natural convection, through the housing space S inside the housing 20, through the second communication hole 26 formed in the first outer portion 31 and the first communication hole 44a in the mounting wall portion 42 located on the Z-axis negative side, and is discharged to the outside of the power converter 10.

[0049] Next, as shown in Figures 4A and 6, the power converter 10 can be mounted on the wall surface of a structure. Specifically, the power converter 10 can be mounted on the wall surface using the mounting plate 72 and connecting member 71, with the heat sink 60 side (the side in the negative X-axis direction) facing the wall surface.

[0050] More specifically, the power converter 10 may further include a connecting member 71. The connecting member 71 is a plate-shaped member that is substantially parallel to the YZ plane and elongated in the Y-axis direction.

[0051] In this case, as shown in Figures 4A and 7, the mounting wall portion 42 of the base body 41 has a plurality of fastening pieces 42a formed thereon for fastening with the connecting member 71. Each of the plurality of fastening pieces 42a is a tongue-shaped piece that is bent inward toward the housing 20 relative to the mounting wall portion 42. The plurality of fastening pieces 42a are formed on the mounting wall portion 42 located on the Z-axis positive side, the Y-axis positive side, and the Y-axis negative side. Since the plurality of fastening pieces 42a are formed on these mounting wall portions 42, the connecting member 71 is positioned on the Z-axis positive side of the housing 20.

[0052] Each of the multiple fastening pieces 42a has a fastening hole 42b formed therein for fastening with a fastening member 94. The connecting member 71 is placed on top of the multiple fastening pieces 42a, and the fastening member 94 is fastened to the fastening hole 42b formed in the fastening piece 42a via a through hole 71a formed in the connecting member 71, thereby attaching the connecting member 71 to the mounting wall portion 42 of the base body 41.

[0053] A guide portion 71b for attaching the mounting plate 72 is formed on the edge of the connecting member 71 on the Z-axis negative side. The guide portion 71b is a notch formed on the edge of the connecting member 71 on the Z-axis negative side, and can be connected to the mounting plate 72.

[0054] The mounting plate 72 is attached to the wall surface of the structure. A hook piece 72a is formed on the upper edge of the mounting plate 72, which is the edge on the Z-axis positive side, for hooking onto the connecting member 71. By hooking the guide portion 71b of the connecting member 71 onto the hook piece 72a, the power converter 10 having the connecting member 71 can be positioned on the wall surface.

[0055] <Assembly Instructions> Next, the assembly method of the power converter 10 will be described with reference to Figures 8 and 9.

[0056] Figure 8 is a flowchart showing the assembly method of the power converter 10. Figure 9 is a diagram showing the assembly process of the power converter 10.

[0057] First, as shown in Figures 8 and 9, a mounting board 50 on which the electronic component 51 is mounted, a housing base 40, a heat sink 60, and a housing body 20a are prepared. Then, the worker aligns the electronic component 51 with one side 41b of the housing base 40 so that the electronic component 51 is exposed through the opening 41a of the housing base 40. For example, the worker fastens the fastening member 95 through the through hole 50a formed in the mounting board 50 to the fastening hole 45 formed in the housing base 40, and attaches the mounting board 50 on which the electronic component 51 is mounted to one side 41b of the housing base 40 (S11).

[0058] Next, the worker aligns the heat sink 60 with the other side 41c of the housing base 40 so that the electronic components 51 exposed through the opening 41a of the housing base 40 are thermally connected to the heat sink 60. For example, the worker fastens a fastening member (not shown) through a through hole formed in the base body 41 of the housing base 40 to a fastening hole formed in the heat sink 60, thereby attaching the heat sink 60 to the other side 41c of the housing base 40 (S12).

[0059] In this way, a component can be obtained in which a mounting board 50 is attached to one side 41b of the enclosure base 40, and a heat sink 60 is attached to the other side 41c of the enclosure base 40, which is opposite to the one side 41b.

[0060] Next, the components consisting of the mounting board 50, the housing base 40, and the heat sink 60 are inserted through the rear opening 122 of the housing body 20a and housed in the housing body 20a (S13).

[0061] Next, the worker fastens the fastening member 92 through the through hole 120 formed on the side of the housing body 20a to the fastening hole 42b formed in the mounting wall 42, thereby attaching the mounting wall 42 to the housing body 20a and housing the components in the housing body 20a (S14).

[0062] Although this explanation uses the main enclosure unit 20a, the same applies to the enclosure unit 20.

[0063] <Effects and Effects> Next, the effects and benefits of the power converters 10 and 10a and the assembly method for the power converters 10 and 10a will be explained.

[0064] The power conversion devices 10 and 10a according to Technology 1 of this embodiment are power conversion devices 10 and 10a for converting power, comprising a mounting board 50 on which electronic components 51 are mounted, a housing 20 housing the mounting board 50, a housing base 40, and a heat sink 60 for dissipating heat generated by the electronic components 51 mounted on the mounting board 50, wherein the mounting board 50 is attached to one side 41b of the housing base 40, and the other side 41c of the housing base 40 opposite to the one side 41b is attached to the electronic components A heatsink 60 is attached to a position corresponding to part 51. The housing 20 is composed of multiple side sections and forms a frame shape that penetrates from the front opening 121 on the front side (X-axis positive direction) to the rear opening 122 on the rear side (X-axis negative direction). Bend sections 25 are provided at the edges of the multiple side sections that form the front opening 121, and a portion of the multiple side sections is bent to narrow the front opening 121. The opening area of ​​the rear opening 122 is larger than the opening area of ​​the front opening 121.

[0065] For example, compared to a configuration in which the heat sink 60 and the mounting board 50 are attached to separate bases, according to this embodiment, the heat sink 60 and the mounting board 50 are attached to the housing base 40, which helps to suppress an increase in the number of parts and an increase in assembly man-hours.

[0066] Furthermore, since the opening area of ​​the rear opening 122 of the housing 20 is larger than the opening area of ​​the front opening 121, the components with the mounted circuit board 50 and heat sink 60 attached to the housing base 40 can be easily inserted into the housing 20 through the rear opening 122. Therefore, it is expected that the components will be easier to assemble into the housing 20.

[0067] Therefore, with these power conversion devices 10 and 10a, it is possible to suppress the soaring manufacturing costs.

[0068] In particular, compared to a configuration in which the bent portion is folded outwards from the housing 20, in this embodiment the bent portion 25 is configured to narrow the front opening 121 of the housing 20, thus suppressing an increase in the size of the power converters 10 and 10a. Furthermore, since the size of the mounting substrate 50 can be designed to be close to the opening area of ​​the rear opening 122, an increase in the size of the power converters 10 and 10a can be suppressed.

[0069] Furthermore, the power converters 10 and 10a according to Technology 2 of this embodiment are the same as the power converters 10 and 10a described in Technology 1. In this case, the edges of the multiple side portions that form the rear opening 122 extend in a planar manner so as not to narrow the rear opening 122.

[0070] According to this, since no protrusions that narrow the rear opening 122 are formed on the edges of the multiple side portions that form the rear opening 122, when assembling components into the housing 20, the components can be easily accommodated into the housing 20 through the rear opening 122. Therefore, it is expected that the components will be easier to assemble into the housing 20.

[0071] Furthermore, the power converters 10 and 10a according to Technology 3 of this embodiment are power converters 10 and 10a according to Technology 1 or 2, further comprising a cover (inner cover 39) attached to the bent portion 25 so as to cover the front opening 121.

[0072] According to this, since the mounted circuit board 50 inside the housing 20 can be covered, it is expected that electromagnetic waves emitted by the mounted circuit board 50 can be blocked.

[0073] Furthermore, the power converters 10 and 10a according to Technology 4 of this embodiment are the power converters 10 and 10a described in any one of Technologies 1 to 3. In this case, the housing base 40 has a base body 41 having one side 41b and the other side 41c, and an opening 41a formed therein for exposing the electronic components 51. When the heat sink 60 is attached to the other side 41c of the base body 41, the heat sink 60 is thermally connected to the electronic components 51 through the opening 41a.

[0074] According to this, even if the electronic component 51 generates heat, the heat from the electronic component 51 can be directly conducted to the heat sink 60. Therefore, the temperature of the electronic component 51 can be suppressed.

[0075] Furthermore, the power converters 10 and 10a according to Technology 5 of this embodiment are the same as the power converters 10 and 10a described in Technology 4. In this case, the housing base 40 further has a mounting wall portion 42 that rises from the base body 41 toward the rear (in the negative X-axis direction), and the housing 20 and the mounting wall portion 42 are fixed together by a fastening member 92.

[0076] According to this, a mounting wall portion 42 can be provided at the rear of the base body 41, similar to the heat sink 60 which is located at the rear of the base body 41. This suppresses the enlargement of the housing 20 in a direction perpendicular to the front-to-back direction (X-axis direction), and the housing 20 and the mounting wall portion 42 of the housing base 40 can be connected by fastening members 92.

[0077] Furthermore, the power converters 10 and 10a according to Technology 6 of this embodiment are the same as the power converters 10 and 10a described in Technology 5. In this case, the mounting wall portion 42 is arranged to surround the heat sink 60 by forming a housing space S for the heat sink 60.

[0078] According to this, a mounting wall portion 42 can be provided at the rear of the base body 41, which suppresses the enlargement of the housing 20 in a direction perpendicular to the front-to-back direction (X-axis direction).

[0079] Furthermore, since the heat sink 60 becomes difficult to see from the outside of the power converters 10 and 10a, it is possible to suppress the deterioration of the appearance of the power converters 10 and 10a.

[0080] Furthermore, the power converters 10 and 10a according to Technology 7 of this embodiment are the same as the power converters 10 and 10a described in Technology 6. In this case, the mounting wall portion 42 has a first communication hole 44a formed in the side portion located above the housing 20, and a second communication hole 26 formed in the side portion located below the housing 20, opposite the first communication hole 44a.

[0081] According to this, even if the electronic components 51 generate heat inside the housing 20, outside air flows in through natural convection, for example, the second communication hole 26 and the first communication hole 44a located on the Z-axis positive side, and reaches the heat sink 60. As a result, the heat from the heat sink 60 is dissipated into the air, and this heated air can be discharged through the second communication hole 26 and the first communication hole 44a located on the Z-axis negative side. Therefore, the heat from the heat sink 60 can be dissipated efficiently.

[0082] Furthermore, the power converters 10 and 10a according to Technology 8 of this embodiment are the power converters 10 and 10a described in any one of Technologies 1 to 7. In this case, the housing base 40 is attached to the housing 20 with fastening members 92.

[0083] According to this, the housing base 40 can be easily assembled to the housing 20 by the fastening member 92. Therefore, it is not necessary to perform hemming on multiple side surfaces, and the increase in manufacturing costs can be further suppressed.

[0084] Furthermore, the power conversion devices 10 and 10a according to Technology 9 of this embodiment are the power conversion devices 10 and 10a described in any one of Technologies 1 to 8. In this case, the power conversion devices further include a mounting plate 72 attached to the wall surface of the structure, and a connecting member 71 arranged on the rear opening 122 side, connected from a side portion (third side portion 23 on the Y-axis negative direction side) of the plurality of side portions arranged on the first direction side (Y-axis positive direction side) to a side portion (second side portion 22 on the Y-axis positive direction side) of the plurality of side portions arranged on the second direction side (Y-axis positive direction side) opposite to the first direction, and connected to the mounting plate 72.

[0085] According to this, power converters 10 and 10a can be easily attached to the wall surface of a structure. Therefore, power converters 10 and 10a become more practical.

[0086] Furthermore, the strength of the housing 20 can be increased by the connecting member 71 which is arranged from the third side portion 23 to the second side portion 22.

[0087] Furthermore, the power converters 10 and 10a according to technology 10 of this embodiment are the power converters 10 and 10a described in any one of technologies 1 to 9. In this case, the rear opening 122 is open.

[0088] Therefore, external air from the power converters 10 and 10a can easily flow in through the rear opening 122, which is expected to help dissipate heat from the heat sink 60.

[0089] Furthermore, the assembly method for the power converters 10 and 10a according to technology 11 of this embodiment is an assembly method for the power converters 10 and 10a described in any one of technologies 1 to 9, wherein a mounting board 50 on which electronic components 51 are mounted is attached to one side 41b of a housing base 40, a heat sink 60 for dissipating heat generated by the electronic components 51 mounted on the mounting board 50 is attached to the other side 41c of the housing base 40, and the components consisting of the mounting board 50, housing base 40 and heat sink 60 are housed in a housing 20 and assembled into the housing 20.

[0090] According to this, before the components are housed in the enclosure 20, if, for example, a power supply board 52 is assembled to the main board 150 of the components, the connection status of the connector for electrically connecting the power supply board 52 and the main board 150 can be checked through the gap between the power supply board 52 and the main board 150. Therefore, the connection status can be easily checked.

[0091] Furthermore, the components can be easily inserted into the housing 20 through the rear opening 122. This makes it easier to assemble the components into the housing 20.

[0092] (Other variations) The power conversion device and the like related to this disclosure have been described above based on the embodiments described above, but this disclosure is not limited to these embodiments. Various modifications to the embodiments that a person skilled in the art can conceive of may also be included in the scope of this disclosure, as long as they do not deviate from the spirit of this disclosure.

[0093] For example, the power converter according to this disclosure may have the configuration shown in Figure 10. Figure 10 is a cross-sectional view showing the power converter 10a. A first hole 139 is formed on the Z-axis positive side of the inner cover 39, communicating with the housing space K inside the housing 20. Furthermore, a first hole 139 is formed on the Z-axis negative side of the inner cover 39, communicating with the housing space K inside the housing 20. The outer cover 38 of the power converter 10a has a vertical wall portion 138b that rises from the outer peripheral edge in the X-axis negative direction. The vertical wall portion 138b is frame-shaped. The vertical wall portion 138b has a second hole 138d formed on the Z-axis positive side of the first hole 139. The second hole 138d connects the gap E1 between the outer cover 38 and the inner cover 39 to the outside of the power converter 10a. Therefore, the heat generated inside the housing 20 is discharged along with the air through the first hole 139 and the gap E1 to the second hole 138d.

[0094] Furthermore, this disclosure also includes forms obtained by applying various modifications to each of the above embodiments that a person skilled in the art could conceive, as well as forms realized by arbitrarily combining the components and functions of each embodiment without departing from the spirit of this disclosure. [Explanation of symbols]

[0095] 10, 10a power converter 20 cabinets 21 First side part (side part) 22 Second side part (side part) 23 Third side part (side part) 24 4th side part (side part) 25 Folded section 26 2nd communication hole 31 1st removal part (side part) 32 2nd removal part (side part) 39. Inner cover (cover) 40 base of cabinet 41 Base Body 41a aperture 41b One side 41c other side 42 Mounting wall section 44a 1st communication hole 50 mounted circuit boards 51 Electronic Components 52 Power supply board (mounted board) 60 Heatsink 71 Connecting member 72 Mounting plate 91, 92, 93, 94, 95, 96 Fastening members 121 Front opening 122 Rear opening 150 Main board (mounted board) S Containment space

Claims

1. A power conversion device for converting electricity, A circuit board on which electronic components are mounted, A housing for the aforementioned mounting board, The base of the enclosure, The mounting substrate includes a heat sink for dissipating heat generated by the electronic components mounted on the substrate, The mounting circuit board is attached to one side of the housing base. On the other side of the housing base, which is opposite to the aforementioned one side, the heat sink is attached at a position corresponding to the electronic component. The aforementioned enclosure is It is composed of multiple side sections, It has a frame-like structure that penetrates from the front opening on the front side to the rear opening on the rear side. Provided at the edges of the plurality of side portions that form the front opening, the plurality of side portions have a bent portion that is bent in such a way as to narrow the front opening, The opening area of ​​the rear opening is larger than the opening area of ​​the front opening. Power converter.

2. The edges of the multiple side portions that form the rear opening extend in a planar manner so as not to narrow the rear opening. The power conversion device according to claim 1.

3. Furthermore, it includes a cover attached to the folded portion so as to cover the front opening. The power conversion device according to claim 1.

4. The housing base has the one side and the other side, and has a base body with an opening formed therein for exposing the electronic components. When the heat sink is attached to the other side of the base body, the heat sink is thermally connected to the electronic component through the opening. The power conversion device according to claim 1.

5. The aforementioned housing base further has a mounting wall portion that rises from the base body toward the rear, The housing and the mounting wall are fixed together by fastening members. The power conversion device according to claim 4.

6. The mounting wall portion is positioned to surround the heat sink, forming a housing space for the heat sink. The power conversion device according to claim 5.

7. The mounting wall portion has a first communication hole formed in the side portion located above the housing, and a second communication hole formed in the side portion located below the housing, opposite the first communication hole. The power conversion device according to claim 6.

8. The housing base is attached to the housing by fastening members. A power conversion device according to any one of claims 1 to 7.

9. moreover, A mounting plate that is attached to the wall surface of a structure, The device comprises a connecting member positioned on the rear opening side, connected from the side portion positioned on the first direction side of the plurality of side portions to the side portion positioned on the second direction side opposite to the first direction of the plurality of side portions, and connected to the mounting plate. A power conversion device according to any one of claims 1 to 7.

10. The aforementioned rear opening is open. A power conversion device according to any one of claims 1 to 7.

11. A method for assembling a power converter according to any one of claims 1 to 7, The mounting board on which the electronic components are mounted is attached to one side of the housing base. The heat sink for dissipating heat generated by the electronic components mounted on the aforementioned mounting board is attached to the other side of the housing base. The components consisting of the mounting board, the housing base, and the heat sink are housed in the housing and assembled into the housing. How to assemble a power converter.

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