Method for manufacturing a light-emitting device and a light-emitting device

Abstract

The present invention provides a method for manufacturing a light-emitting device and a light-emitting device that can keep the bonding strength low during the temporary bonding of the substrate and the light-emitting element, while increasing the bonding strength during the final bonding. [Solution] The method for manufacturing a light-emitting device comprises the steps of: preparing a light-emitting element including a plurality of electrodes arranged on its lower surface; preparing an intermediate body including a substrate arranged on its upper surface and having a plurality of terminals corresponding to the plurality of electrodes, wherein a first groove reaching the side surface of the terminals is formed on the upper surface of the terminals; and an insulating member arranged in the region between the plurality of terminals on the upper surface of the substrate; temporarily bonding the light-emitting element to the substrate by bringing the plurality of electrodes into contact with the plurality of terminals; and permanently bonding the light-emitting element to the substrate by forming a conductive member in contact with the terminals and electrodes in the first groove by a plating method.

Description

Technical Field

[0001] Embodiments relate to a method for manufacturing a light-emitting device and a light-emitting device.

Background Art

[0002] A light-emitting device in which a large number of light-emitting elements are mounted on a substrate has been developed. When manufacturing such a light-emitting device, the light-emitting elements may be temporarily bonded to the substrate to determine the quality of the light-emitting elements. After removing the defective light-emitting elements, the non-defective light-emitting elements may be permanently bonded to the substrate. In this case, the bonding strength between the substrate and the light-emitting elements during temporary bonding is required to be low enough to remove the defective light-emitting elements, but the bonding strength between the substrate and the light-emitting elements after permanent bonding is required to be sufficiently high.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the embodiments is to provide a method for manufacturing a light-emitting device and a light-emitting device capable of reducing the bonding strength between a substrate and a light-emitting element during temporary bonding while increasing the bonding strength during permanent bonding.

Means for Solving the Problems

[0005] A method for manufacturing a light-emitting device according to an embodiment includes the steps of: preparing a light-emitting element including a plurality of electrodes arranged on its lower surface; preparing an intermediate body including a substrate arranged on its upper surface and including a plurality of terminals corresponding to the plurality of electrodes, wherein a first groove reaching the side surface of the terminals is formed on the upper surface of the terminals; and an insulating member arranged in the region between the plurality of terminals on the upper surface of the substrate; temporarily bonding the light-emitting element to the substrate by bringing the plurality of electrodes into contact with the plurality of terminals; and permanently bonding the light-emitting element to the substrate by forming a conductive member in contact with the terminals and electrodes in the first groove by a plating method.

[0006] The light-emitting device according to the embodiment comprises a substrate having a plurality of terminals arranged on its upper surface, the upper surface of which a first groove reaching the side surface of the terminals is formed; a light-emitting element having a plurality of electrodes in contact with the plurality of terminals; and a conductive member arranged in the first groove and in contact with the terminals and electrodes. [Effects of the Invention]

[0007] According to the embodiment, it is possible to realize a method for manufacturing a light-emitting device and a light-emitting device that can suppress the bonding strength during the temporary bonding of the substrate and the light-emitting element to a low level while increasing the bonding strength during the final bonding. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a cross-sectional view showing a light-emitting element of a light-emitting device according to the first embodiment. [Figure 2A] Figure 2A is a cross-sectional view showing the process of preparing the substrate in the first embodiment. [Figure 2B] Figure 2B is a cross-sectional view showing the process of preparing the substrate in the first embodiment. [Figure 2C] Figure 2C is a cross-sectional view showing the process of preparing the substrate in the first embodiment. [Figure 2D] Figure 2D is a cross-sectional view showing the process of preparing the substrate in the first embodiment. [Figure 2E]Figure 2E is a cross-sectional view showing the process of preparing the substrate in the first embodiment. [Figure 2F] Figure 2F is a cross-sectional view showing the process of preparing the substrate in the first embodiment. [Figure 3] Figure 3 is a cross-sectional view showing the manufacturing method of a light-emitting device according to the first embodiment. [Figure 4] Figure 4 is a cross-sectional view showing a process for manufacturing a light-emitting device according to the first embodiment. [Figure 5] Figure 5 is a cross-sectional view showing the manufacturing method of the light-emitting device according to the first embodiment. [Figure 6] Figure 6 is a cross-sectional view showing the manufacturing method of a light-emitting device according to the first embodiment. [Figure 7] Figure 7 is a cross-sectional view showing the process for manufacturing a light-emitting device according to the first embodiment. [Figure 8] Figure 8 is a top view showing a light-emitting device according to the first embodiment. [Figure 9] Figure 9 is a cross-sectional view taken along the line IX-IX shown in Figure 8. [Figure 10A] Figure 10A is a cross-sectional view showing a process for manufacturing a light-emitting device according to a comparative example. [Figure 10B] Figure 10B is a partially enlarged cross-sectional view showing region XB in Figure 10A. [Figure 10C] Figure 10C is a partially enlarged cross-sectional view showing region XC in Figure 10B. [Figure 11A] Figure 11A is a cross-sectional view showing a process for preparing a light-emitting element in a second embodiment. [Figure 11B] Figure 11B is a cross-sectional view showing a process for preparing a light-emitting element in a second embodiment. [Figure 11C] Figure 11C is a cross-sectional view showing the process for preparing a light-emitting element in a second embodiment. [Figure 11D] Figure 11D is a cross-sectional view showing the process for preparing a light-emitting element in a second embodiment. [Figure 12] Figure 12 is a cross-sectional view showing a process for manufacturing a light-emitting device according to a second embodiment. [Figure 13] FIG. 13 is a cross-sectional view showing a method of manufacturing a light-emitting device according to the second embodiment. [Figure 14] FIG. 14 is a cross-sectional view showing a light-emitting device according to the second embodiment. [Figure 15] FIG. 15 is a cross-sectional view showing a method of manufacturing a light-emitting device according to the first modification of the second embodiment. [Figure 16] FIG. 16 is a cross-sectional view showing a method of manufacturing a light-emitting device according to the second modification of the second embodiment. [Figure 17] FIG. 17 is a cross-sectional view showing a method of manufacturing a light-emitting device according to the third modification of the second embodiment. [Figure 18] FIG. 18 is a cross-sectional view showing a method of manufacturing a light-emitting device according to the fourth modification of the second embodiment. [Figure 19] FIG. 19 is a cross-sectional view showing a method of manufacturing a light-emitting device according to the fifth modification of the second embodiment. [Figure 20] FIG. 20 is a cross-sectional view showing a method of manufacturing a light-emitting device according to the sixth modification of the second embodiment. [Figure 21] FIG. 21 is a bottom view showing a light-emitting element in the third embodiment. [Figure 22A] FIG. 22A is a top view showing a base material and terminals in the third embodiment. [Figure 22B] FIG. 22B is a partially enlarged top view showing region XXIIB of FIG. 22A. [Figure 23A] FIG. 23A is a top view showing a substrate and an insulating member in the third embodiment. [Figure 23B] FIG. 23B is a partially enlarged top view showing region XXIIIB of FIG. 23A. [Figure 24] FIG. 24 is a top view showing a method of manufacturing a light-emitting device according to the third embodiment. [Figure 25] FIG. 25 is a top view showing a method of manufacturing a light-emitting device according to the third embodiment.

MODE FOR CARRYING OUT THE INVENTION

[0009] <First Embodiment> Figure 1 is a cross-sectional view showing the light-emitting element of the light-emitting device according to this embodiment. Figures 2A to 2F are cross-sectional view steps showing the substrate preparation method in the first embodiment. Figures 3 to 7 are cross-sectional views showing the manufacturing process of the light-emitting device according to this embodiment. Figure 8 is a top view showing the light-emitting device according to this embodiment. Figure 9 is a cross-sectional view taken along the line IX-IX shown in Figure 8.

[0010] Please note that each diagram is schematic and has been exaggerated and simplified as appropriate. Furthermore, even for the same component, the dimensional ratios and shapes may not strictly match between diagrams. The same applies to the other diagrams described later. First, the manufacturing method of the light-emitting device according to this embodiment will be described.

[0011] (Steps to prepare the light-emitting element 10) As shown in Figure 1, a light-emitting element 10 is prepared. The light-emitting element 10 is held on the lower surface of a transport substrate 101 via an adhesive layer 102. The transport substrate 101 is, for example, a glass substrate. The adhesive layer 102 is, for example, made of silicone resin. Multiple light-emitting elements 10 are arranged on the lower surface of the transport substrate 101.

[0012] Each light-emitting element 10 is provided with a semiconductor laminate 11 and a plurality of electrodes 12. The plurality of electrodes 12 are arranged on the lower surface 10a of the light-emitting element 10. The upper surface 10b of the light-emitting element 10 is adhered to an adhesive layer 102. An insulating film is provided on a portion of the lower surface 10a and the side surface 10c of the light-emitting element 10.

[0013] In this specification, "bottom surface," "top surface," and "side surface" are merely convenient designations and are unrelated to the direction of gravity. In a given member, the surface opposite the "bottom surface" is called the "top surface." Also, the surface that intersects both the bottom surface and the top surface is called the "side surface."

[0014] In the semiconductor stack 11, a p-type semiconductor layer, an active layer, and an n-type semiconductor layer are stacked in this order, and the p-type and n-type semiconductor layers are connected to different electrodes 12. In this specification, "connection" means electrical connection. The electrodes 12 are formed of, for example, gold (Au). In this embodiment, an example is shown in which one light-emitting element 10 has two electrodes 12, but the invention is not limited to this.

[0015] (Step to prepare intermediate 40) As shown in Figure 2A, a substrate 21 is prepared. The substrate 21 is, for example, a wiring board in which wiring is arranged in an insulating base material, and is, for example, an ASIC (Application Specific Integrated Circuit) substrate. Multiple terminals 22 are arranged on the upper surface 21b of the substrate 21. Multiple terminals 22 correspond to multiple electrodes 12 of the light-emitting element 10. That is, in this embodiment, two terminals 22 are arranged on the upper surface 21b of the substrate 21 in the area where the light-emitting element 10 is to be mounted in a process described later. Each terminal 22 is provided with a core portion 25 made of, for example, copper (Cu), and a covering portion 26 made of, for example, gold that covers the core portion 25.

[0016] Next, as shown in Figure 2B, an unexposed resist film 103 is placed on the upper surface 21b of the substrate 21, for example, by coating. The thickness of the resist film 103 is such that it covers the terminals 22. Next, as shown in Figure 2C, the resist film 103 is exposed and developed to form an opening 103a on a portion of the terminal 22.

[0017] Next, as shown in Figure 2D, etching is performed using the resist film 103 as a mask to remove a portion of the terminal 22 in the area directly below the opening 103a. This forms a first groove 24 on the upper surface 22b of the terminal 22. The first groove 24 is formed only in the covering portion 26 and is of a depth that does not reach the core portion 25. The first groove 24 also reaches at least one side surface 22c of the terminal 22, for example, two opposing side surfaces 22c.

[0018] Next, as shown in Figure 2E, the resist film 103 is removed. This forms the substrate 20. Next, as shown in Figure 2F, an insulating member 23 is formed between the multiple terminals 22 on the upper surface 21b of the substrate 21. The insulating member 23 is formed from an insulating material, for example, from a soft resin material, for example, from a resist material.

[0019] In this way, the intermediate body 40 is prepared. The intermediate body 40 includes a substrate 20 and an insulating member 23. The substrate 20 includes a base material 21 and a plurality of terminals 22. The plurality of terminals 22 are arranged on the upper surface 20b of the substrate 20 and correspond to the plurality of electrodes 12 of the light-emitting element 10. A first groove 24 is formed on the upper surface 22b of the terminals 22. The first groove 24 reaches the side surface 22c of the terminal 22. The insulating member 23 is arranged between the plurality of terminals 22 on the upper surface 20b of the substrate 20.

[0020] Note that the order of the manufacturing process for the light-emitting element 10 shown in Figure 1 and the manufacturing process for the intermediate 40 shown in Figures 2A to 2F is not significant. Furthermore, the light-emitting element 10 and the intermediate 40 may be prepared by manufacturing them, for example, by the method described above, or by obtaining them from another party.

[0021] (Temporary joining process) As shown in Figure 3, the lower surface 10a of the light-emitting element 10 is placed opposite the upper surface 20b of the substrate 20. Then, each electrode 12 of the light-emitting element 10 is brought into contact with the corresponding terminals 22 of the substrate 20. This loosely connects the electrodes 12 of the light-emitting element 10 to the terminals 22 of the substrate 20. In this way, the light-emitting element 10 is temporarily bonded to the substrate 20. At this time, if the insulating member 23 is made of a soft material, the insulating member 23 may be deformed by pressing it with the light-emitting element 10. Note that in Figures 3 and later, the core portion 25 and the covering portion 26 may not be distinguished and may be depicted as a single terminal 22.

[0022] In the temporarily bonded state, the light-emitting element 10 is weakly connected to the substrate 20 to the extent that it can maintain its position, and although current can be conducted between the light-emitting element 10 and the substrate 20, the light-emitting element 10 can be detached from the substrate 20 without damaging it by applying an appropriate external force to the light-emitting element 10. Subsequently, the transport substrate 101 is detached from the light-emitting element 10 by removing the adhesive layer 102.

[0023] (Step to inspect the light-emitting element 10) Next, as shown in Figure 4, the light-emitting element 10 is inspected while it is temporarily bonded to the substrate 20. For example, the position and orientation of the light-emitting element 10 relative to the substrate 20 are evaluated by visual inspection, and any light-emitting element 10 that deviates significantly from the designed position and orientation is determined to be "defective". In addition, the electrical characteristics of the light-emitting element 10 are evaluated by supplying power to the light-emitting element 10 via the substrate 20. For example, the intensity of the light emitted from the light-emitting element 10 is measured, and any light-emitting element 10 whose light intensity is below a standard value is determined to be "defective". On the other hand, any light-emitting element 10 whose position and orientation are within the design tolerance range and whose light intensity is above the standard value is determined to be "good". Hereinafter, a light-emitting element 10 determined to be "defective" will be referred to as "light-emitting element 10x".

[0024] (Step of removing defective light-emitting elements 10 from the substrate 20) Next, as shown in Figure 5, in the process of inspecting the light-emitting element 10 shown in Figure 4, any light-emitting element 10x that is determined to be "defective" is removed from the substrate 20. For example, the light-emitting element 10x is removed from the substrate 20 by attaching it to a suction jig 104 and applying a force in the direction away from the substrate 20. At this time, the terminals 22 and insulating member 23 to which the light-emitting element 10x was temporarily attached remain on the substrate 20 side.

[0025] (Step of temporarily bonding other light-emitting elements 10r to the substrate 20) Next, as shown in Figure 6, the electrode 12 of another light-emitting element 10r is brought into contact with the terminal 22 that the electrode 12 of the light-emitting element 10x that was determined to be defective was in contact with, for example, using a suction jig 105. The suction jig 105 may be the same jig as the suction jig 104 shown in Figure 5, or it may be a different jig. At this time, if the insulating member 23 is made of a soft material, the insulating member 23 may be deformed by pressing the insulating member 23 with the other light-emitting element 10r. This temporarily bonds the other light-emitting element 10r to the substrate 20.

[0026] Afterward, the other light-emitting elements 10r may be inspected, and if they are defective, they may be removed from the substrate 20 and other light-emitting elements may be temporarily bonded. In this way, the temporary bonding and inspection may be repeated until all light-emitting elements 10 are determined to be good, or until a predetermined ratio or more of the light-emitting elements 10 are determined to be good.

[0027] (Step of permanently bonding the light-emitting element 10 to the substrate 20) Next, as shown in Figure 7, a conductive member 30 is formed in the first groove 24 by a plating method. For example, the conductive member 30 may be formed by electroplating gold. Alternatively, the conductive member 30 may be formed by electroplating copper (Cu). In this case, after electroplating copper, a protective film made of an inorganic material such as aluminum oxide (Al2O3) or silicon oxide (SiO2) may be formed on the exposed surface of the conductive member 30 as a measure against sulfidation.

[0028] The conductive member 30 contacts the terminals 22 of the substrate 20 and the electrodes 12 of the light-emitting element 10 within the first groove 24. The conductive member 30 is also formed on the side surface 22c of the terminals 22 and the side surface 12c of the electrodes 12. This improves the bonding strength between the electrodes 12 of the light-emitting element 10 and the terminals 22 of the substrate 20, thereby permanently bonding the light-emitting element 10 to the substrate 20. Since insulating members 23 are placed between the terminals 22, the terminals 22 separated by the insulating members 23 are not connected by the conductive member 30.

[0029] (Step to remove the insulating material 23) Next, as shown in Figures 8 and 9, the insulating member 23 is removed from the intermediate 40. For example, if the insulating member 23 is made of a resist material, it is removed by dissolving it with a solvent. If the insulating member 23 is made of a chemically stable material such as an inorganic material, it is not necessary to remove the insulating member 23. In this way, the light-emitting device 1 is manufactured.

[0030] (Light-emitting device 1) Next, the configuration of the light-emitting device 1 will be described. As shown in Figures 8 and 9, the light-emitting device 1 according to this embodiment includes a substrate 20, a light-emitting element 10, and a conductive member 30. For example, a plurality of light-emitting elements 10 are provided on a single substrate 20 and are arranged in a matrix.

[0031] The substrate 20 has a base material 21 and a plurality of terminals 22 arranged on the upper surface 21b of the base material 21. The base material 21 is, for example, a wiring board in which wiring is arranged in an insulating base material, for example, an ASIC substrate. The terminals 22 are provided with a core portion 25 made of, for example, copper, and a covering portion 26 made of, for example, gold that covers the core portion 25. A first groove 24 is formed on the upper surface 22b of the terminal 22. The first groove 24 is formed only in the covering portion 26 and does not reach the core portion 25, but it reaches a pair of mutually opposing side surfaces 22c of the terminal 22.

[0032] Each light-emitting element 10 has a semiconductor laminate 11 and a plurality of electrodes 12. The electrodes 12 are located on the lower surface 10a of the light-emitting element 10. The electrodes 12 are made of, for example, gold. The lower surface 12a of each electrode 12 is in contact with the area of ​​the upper surface 22b of each terminal 22 of the substrate 20, excluding the first groove 24. As a result, the plurality of electrodes 12 are in contact with the plurality of terminals 22.

[0033] The conductive member 30 is positioned within the first groove 24 of the terminal 22 and is in contact with the inner surface of the first groove 24 of the terminal 22 and the lower surface 12a of the electrode 12. As described above, the conductive member 30 is made of, for example, gold or copper and is formed, for example, by an electroplating method. The conductive member 30 is also positioned on the side surface 22c of the terminal 22 and the side surface 12c of the electrode 12. On the other hand, there are regions between the substrate 20 and the light-emitting element 10 where the conductive member 30 is not present, between the multiple electrodes 12 of each light-emitting element 10 and between the multiple terminals 22 connected to these electrodes 12.

[0034] (effect) In this embodiment, in the steps shown in Figures 2A to 2F, a first groove 24 is formed on the upper surface 22b of the terminal 22 of the substrate 20, and in the step shown in Figure 3, the electrode 12 is brought into contact with the terminal 22 via the first groove 24, thereby temporarily bonding the light-emitting element 10 to the substrate 20. At this time, because the contact area between the electrode 12 and the terminal 22 is small, the bonding strength between the light-emitting element 10 and the substrate 20 is low. As a result, the light-emitting element 10x that is determined to be defective in the step shown in Figure 4 can be easily removed from the substrate 20 in the step shown in Figure 5.

[0035] On the other hand, in the process shown in Figure 7, the light-emitting element 10 is permanently bonded to the substrate 20 by forming a conductive member 30 that contacts the terminal 22 and electrode 12 within the first groove 24 using a plating method. As a result, in addition to the contact area between the electrode 12 and terminal 22, contact areas are generated between the electrode 12 and conductive member 30, and contact areas are generated between the conductive member 30 and terminal 22, thereby improving the bonding strength between the light-emitting element 10 and the substrate 20.

[0036] Furthermore, even if minute irregularities are formed on the lower surface 12a of the electrode 12 and the inner surface of the first groove 24 of the terminal 22, these minute irregularities can be filled by the conductive member 30 formed by the plating method. As a result, the microscopic contact area between the electrode 12 and the conductive member 30, and the microscopic contact area between the conductive member 30 and the terminal 22 are increased, further improving the bonding strength between the light-emitting element 10 and the substrate 20. In addition, the conductive member 30 is also formed on the side surface 22c of the terminal 22 and the side surface 12c of the electrode 12. This further improves the bonding strength between the light-emitting element 10 and the substrate 20. As a result, the illumination rate of the light-emitting element 10 is improved, and the reliability of the light-emitting device 1 is improved.

[0037] Furthermore, in this embodiment, in the process shown in Figure 2F, an insulating member 23 is formed between multiple terminals 22 on the upper surface 21b of the substrate 21. As a result, when the conductive member 30 is formed by the plating method in the process shown in Figure 7, regions where the conductive member 30 is not present can be formed between multiple electrodes 12 of each light-emitting element 10, and between multiple terminals 22 connected to these electrodes 12. As a result, it is possible to avoid short-circuiting of multiple electrodes 12 through the conductive member 30.

[0038] Furthermore, in this embodiment, the insulating member 23 is removed in the steps shown in Figures 8 and 9. As a result, the insulating member 23 does not remain on the light-emitting device 1. This allows the insulating member 23 to be formed from a chemically unstable but soft resin material such as a resist material, and in the step shown in Figure 3, when the light-emitting element 10 is temporarily bonded to the substrate 20, the insulating member 23 can be compressed and deformed by the light-emitting element 10. As a result, the contact area between the light-emitting element 10 and the insulating member 23 increases, and the adhesive strength between the light-emitting element 10 and the insulating member 23 increases. As a result, when the transport substrate 101 is removed, the chances of the light-emitting element 10 being removed from the substrate 20 together with the transport substrate 101 while still adhered to it can be reduced.

[0039] Furthermore, in this embodiment, an inspection process is performed between the temporary bonding process and the final bonding process, and any light-emitting element deemed defective is replaced with another light-emitting element. This improves the overall illumination rate of the light-emitting device 1.

[0040] <Comparative Example> Figure 10A is a cross-sectional view showing the process for manufacturing the light-emitting device according to this comparative example. Figure 10B is a partially enlarged cross-sectional view showing region XB in Figure 10A. Figure 10C is a partially enlarged cross-sectional view showing region XC in Figure 10B.

[0041] As shown in Figures 10A to 10C, in this comparative example, the terminal 22 does not have a first groove 24. Therefore, when temporarily bonding the light-emitting element 10 to the substrate 20, the entire lower surface 12a of the electrode 12 comes into contact with the upper surface 22b of the terminal 22, resulting in increased bonding strength. As a result, when removing a light-emitting element 10x that has been determined to be defective from the substrate 20, there is a possibility of damaging the terminal 22 of the substrate 20.

[0042] Furthermore, during this bonding process, the light-emitting element 10 is pressed toward the substrate 20, thereby thermocompressing and solid-state bonding the electrode 12 to the terminal 22. However, since fine irregularities are inevitably formed on the lower surface 12a of the electrode 12 and the upper surface 22b of the terminal 22, the interface between the electrode 12 and the terminal 22 becomes a collection of point contact areas at a microscopic level. As a result, migration may occur at the point contact areas, which may reduce the reliability of the light-emitting device 1.

[0043] <Second Embodiment> This embodiment is an example in which, in addition to the first embodiment, a second groove 14 is also formed on the electrode 12 of the light-emitting element 16. For this embodiment, the same parts as in the first embodiment will be omitted or simplified in their description. The same applies to other embodiments and modifications described later.

[0044] Figures 11A to 11D are cross-sectional views showing the process for preparing a light-emitting element in the second embodiment. Figures 12 and 13 are cross-sectional views showing the manufacturing method of the light-emitting device according to this embodiment. Figure 14 is a cross-sectional view showing a light-emitting device according to this embodiment. First, the manufacturing method of the light-emitting device according to this embodiment will be described.

[0045] (Steps to prepare the light-emitting element 16) First, as shown in Figure 1, the light-emitting element 10 is placed on the lower surface of the transport substrate 101 via an adhesive layer 102. Next, as shown in Figure 11A, the transport substrate 101 is oriented so that the light-emitting element 10 is positioned upwards, and a resist film 106 covering the light-emitting element 10 is formed on the adhesive layer 102, for example, by a coating method. At this stage, the resist film 106 has not been exposed to light.

[0046] Next, as shown in Figure 11B, the resist film 106 is exposed and developed to form an opening 106a in a portion of the area directly above the electrode 12. Next, as shown in Figure 11C, the electrode 12 is etched using the resist film 106 as a mask. As a result, a second groove 14 is formed on the lower surface 12a of the electrode 12 in the region directly below the opening 106a of the resist film 106.

[0047] The second groove 14 does not penetrate the electrode 12 in the vertical direction. The second groove 14 reaches the side surface 12c of the electrode 12, for example, a pair of opposing side surfaces 12c. The second groove 14 is formed in a position corresponding to the first groove 24 formed on the terminal 22 of the substrate 20 when the light-emitting element 16 is temporarily bonded to the substrate 20 in a later process. Next, as shown in Figure 11D, the resist film 106 is removed. In this way, the light-emitting element 16 in this embodiment is prepared.

[0048] (Temporary joining process) As shown in Figure 12, each electrode 12 of the light-emitting element 16 is brought into contact with the corresponding terminals 22 of the substrate 20. This temporarily bonds the light-emitting element 16 to the substrate 20. At this time, the first groove 24 formed on the upper surface 22b of the terminal 22 of the substrate 20 and the second groove 14 formed on the lower surface 12a of the electrode 12 of the light-emitting element 16 face each other, forming a single cavity 31. Subsequently, the light-emitting element 16 is separated from the transport substrate 101 by removing the adhesive layer 102.

[0049] Next, similar to the first embodiment, the light-emitting elements 16 are inspected, any light-emitting elements 16 determined to be defective are removed from the substrate 20, and the remaining light-emitting elements 16 are temporarily bonded to the substrate 20. The temporary bonding and inspection process may be repeated until all light-emitting elements 16 are determined to be good, or until a predetermined ratio or more of the light-emitting elements 16 are determined to be good.

[0050] (The final joining process) Next, as shown in Figure 13, conductive members 30 are formed in the first groove 24 and the second groove 14 by a plating method. For example, the conductive members 30 are formed by electroplating gold or copper. The conductive members 30 are formed in the cavity 31 and come into contact with the terminals 22 and electrodes 12. The conductive members 30 are also formed on the side surface 22c of the terminals 22 and the side surface 12c of the electrodes 12. This improves the bonding strength between the electrodes 12 of the light-emitting element 16 and the terminals 22 of the substrate 20, and the light-emitting element 16 is permanently bonded to the substrate 20.

[0051] Next, as shown in Figure 14, the insulating member 23 is removed from the substrate 20. This completes the manufacturing of the light-emitting device 2.

[0052] (Light-emitting device 2) As shown in Figure 14, in the light-emitting device 2 according to this embodiment, a second groove 14 is formed on the lower surface 12a of the electrode 12 of the light-emitting element 16. The second groove 14 is opposite to the first groove 24 formed on the upper surface 22b of the terminal 22 of the substrate 20, forming a single cavity 31. The conductive member 30 is also placed inside the second groove 14. That is, the conductive member 30 is filled inside the cavity 31 formed by the first groove 24 and the second groove 14.

[0053] (effect) According to this embodiment, forming a second groove 14 in the electrode 12 increases the contact area between the electrode 12 and the conductive member 30, thereby improving the bonding strength between the electrode 12 and the conductive member 30. Furthermore, by connecting the first groove 24 and the second groove 14 to form a single cavity 31, the plating solution can easily enter the cavity 31, allowing the conductive member 30 to be formed efficiently. As a result, the productivity of the light-emitting device 2 is improved. The manufacturing method, configuration, and effects of this embodiment other than those described above are the same as those of the first embodiment.

[0054] <First modified example of the second embodiment> Figure 15 is a cross-sectional view showing the process for manufacturing the light-emitting device according to this modified example. As shown in Figure 15, in this modified example, the inner surface 24c of the first groove 24 formed on the terminal 22 of the substrate 20 is inclined with respect to a direction V perpendicular to the upper surface 21b of the substrate 21, such that the width of the first groove 24 increases as it approaches the substrate 21 of the substrate 20. In other words, the inner surface 24c has an inverse tapered shape.

[0055] As a result, when the conductive member 30 is formed in the first groove 24, the contact area between the terminal 22 and the conductive member 30 increases, and the bonding strength between the terminal 22 and the conductive member 30 is further improved by the anchoring effect. The manufacturing method, configuration, and effects of this modified example other than those described above are the same as in the second embodiment.

[0056] <Second modified example of the second embodiment> Figure 16 is a cross-sectional view showing the process for manufacturing the light-emitting device according to this modified example. As shown in Figure 16, in this modified example, an inclined surface 24d, a stepped surface 24e, and a curved surface 24f are formed inside the first groove 24.

[0057] The inclined surface 24d is in contact with the upper surface 22b of the terminal 22 on both sides in the width direction of the first groove 24. The inclined surface 24d is approximately parallel to the direction V perpendicular to the upper surface 21b of the base material 21. The stepped surface 24e is in contact with the inclined surface 24d. The stepped surface 24e is approximately parallel to the upper surface 21b of the base material 21. The angle between the upper surface 21b of the base material 21 and the stepped surface 24e is smaller than the angle between the upper surface 21b and the inclined surface 24d. The curved surface 24f is positioned between the two stepped surfaces 24e located on both sides in the width direction of the first groove 24 and is in contact with these two stepped surfaces 24e. The curved surface 24f is concave towards the base material 21.

[0058] As a result, when the electrode 12 is brought into contact with the terminal 22, the portion of the lower surface 12a of the electrode 12 excluding the second groove 14 comes into contact with the stepped surface 24e of the terminal 22, making it less likely for the position of the light-emitting element 16 to shift relative to the substrate 20. As a result, defects caused by misalignment of the light-emitting element 16 are less likely to occur. The manufacturing method, configuration, and effects of this modified example other than those described above are the same as those of the second embodiment.

[0059] <Third modified example of the second embodiment> Figure 17 is a cross-sectional view showing the process for manufacturing the light-emitting device according to this modified example. As shown in Figure 17, this modified example differs from the second modified example in that the inclined surface 24d is inclined with respect to direction V such that the first groove 24 widens as it moves away from the base material 21.

[0060] As a result, when the electrode 12 is brought into contact with the terminal 22, even if the position of the electrode 12 is misaligned relative to the terminal 22 and the portion of the lower surface 12a of the electrode 12 excluding the second groove 14 comes into contact with the inclined surface 24d of the terminal 22, the inclination of the inclined surface 24d corrects the position in which the electrode 12 makes contact so that it approaches the stepped surface 24e. As a result, defects caused by misalignment of the light-emitting element 16 are less likely to occur. The manufacturing method, configuration, and effects of this modified example other than those described above are the same as those of the second modified example of the second embodiment.

[0061] <Fourth modified example of the second embodiment> Figure 18 is a cross-sectional view showing the process for manufacturing the light-emitting device according to this modified example. As shown in Figure 18, this modified example is a combination of the first and third modified examples. That is, this modified example differs from the third modified example in that, instead of the curved surface 24f of the first groove 24, a pair of inclined surfaces 24g and one flat surface 24h are provided. The inclined surfaces 24g are in contact with the stepped surface 24e. The flat surface 24h is positioned between the pair of inclined surfaces 24g. The inclined surfaces 24g are inclined with respect to direction V such that the width of the first groove 24 widens as it approaches the base material 21.

[0062] This increases the contact area between the terminal 22 and the conductive member 30, resulting in both improved bonding strength in this bonding process and reduced likelihood of defects caused by misalignment of the light-emitting element 16. The manufacturing method, configuration, and effects of this modified example, other than those described above, are the same as those of the third modified example of the second embodiment. The first to fourth modified examples of the second embodiment may be combined with those of the first embodiment. That is, the second groove 14 does not need to be formed in the electrode 12.

[0063] <Fifth Modification of the Second Embodiment> Figure 19 is a cross-sectional view showing the process for manufacturing the light-emitting device according to this modified example. As shown in Figure 19, this modified example differs from the second embodiment in that the side surface 14c of the second groove 14 formed on the lower surface 12a of the electrode 12 of the light-emitting element 16 is inclined with respect to direction V such that the second groove 14 widens as it approaches the semiconductor laminate 11.

[0064] As a result, when the conductive member 30 is formed in the second groove 14, the contact area between the electrode 12 and the conductive member 30 increases, and the bonding strength between the light-emitting element 16 and the substrate 20 is improved due to the anchoring effect. The manufacturing method, configuration, and effects of this modified example other than those described above are the same as in the second embodiment.

[0065] <Sixth variation of the second embodiment> Figure 20 is a cross-sectional view showing the process for manufacturing the light-emitting device according to this modified example. As shown in Figure 20, in this modified example, two second grooves 14 are formed along the side surface 12c of the electrode 12 of the light-emitting element 16. This reduces the abnormal growth of the conductive member 30 and prevents it from extending significantly beyond the terminal 22 and electrode 12 when the conductive member 30 is formed by the plating method. The manufacturing method, configuration, and effects of this modified example other than those described above are the same as in the second embodiment. The fifth and sixth modified examples of the second embodiment can be implemented in combination with any of the first to fourth modified examples.

[0066] <Third Embodiment> Figure 21 is a bottom view showing the light-emitting element in this embodiment. Figure 22A is a top view showing the substrate and terminals in this embodiment. Figure 22B is a partially enlarged top view showing region XIIB of Figure 22A. Figure 23A is a top view showing the substrate and insulating member in this embodiment. Figure 23B is a partially enlarged top view showing region XXIIIB in Figure 23A. Figures 24 and 25 are top views showing a method for manufacturing the light-emitting device according to this embodiment.

[0067] Figures 22A, 23A, 24, and 25 show the regions where four light-emitting elements are mounted. Figures 22B and 23B show the regions where one light-emitting element is mounted. In Figures 22A to 25, an XY Cartesian coordinate system is used for ease of explanation. The XY plane is parallel to the upper surface 21b of the substrate 21, and the X and Y directions are mutually orthogonal.

[0068] (Steps to prepare the light-emitting element 17) As shown in Figure 21, in the light-emitting element 17 of this embodiment, four anode electrodes 18a and one cathode electrode 18c are provided on the lower surface of the semiconductor laminate 11. In a view from below, the shape of the light-emitting element 17 is, for example, a square, with the four anode electrodes 18a positioned at the four corners of the lower surface of the light-emitting element 17, and the one cathode electrode 18c positioned in the center of the lower surface of the light-emitting element 17.

[0069] In a view from below, the shape of each anode electrode 18a is approximately a pentagon, as if one corner of a rectangle opposite the cathode electrode 18c had been cut off. Two second grooves 19a are formed on the lower surface of each anode electrode 18a. The two second grooves 19a are perpendicular to each other and each extends in a direction parallel to the outer edge of the light-emitting element 17. The two second grooves 19a reach mutually different sides of the anode electrode 18a. The cathode electrode 18c is not located on the extension lines of the two second grooves 19a.

[0070] In a view from below, the cathode electrode 18c is approximately square in shape. However, the square forming the outer edge of the cathode electrode 18c is inclined at 45° with respect to the square forming the outer edge of the light-emitting element 17. Two second grooves 19c are formed on the lower surface of the cathode electrode 18c. The two second grooves 19c are orthogonal to each other and each extends in a direction parallel to the outer edge of the light-emitting element 17. The two second grooves 19c reach mutually different corners of the cathode electrode 18c. The anode electrode 18a is not positioned on the extension lines of the two second grooves 19c.

[0071] (Process of preparing substrate 27) As shown in Figures 22A and 22B, multiple regions 21e are set on the upper surface 21b of the substrate 21, where one light-emitting element 17 is to be placed. The regions 21e are arranged in a matrix along the X and Y directions.

[0072] Each region 21e is provided with four anode terminals 28a and one cathode terminal 28c. In a top view, the four anode terminals 28a are located at the four corners of region 21e, and the one cathode terminal 28c is located in the center of region 21e.

[0073] In a top view, the shape of each anode terminal 28a is a polygon formed by cutting off three corners of a rectangle, for example, a roughly pentagon with a large corner cut off opposite the cathode terminal 28c. Two first grooves 29a are formed on the lower surface of each anode terminal 28a. The two first grooves 29a are orthogonal to each other and extend in a direction parallel to the outer edge of region 21e. The two first grooves 29a reach mutually different sides of the anode terminal 28a. The cathode terminal 28c is not located on the extension of the two first grooves 29a.

[0074] In a top view, the cathode terminal 28c has a roughly octagonal shape, like a rectangle with its Y-direction length longer than its X-direction length, with all four corners cut off. Two first grooves 29c are formed on the underside of the cathode terminal 28c. The two first grooves 29c are perpendicular to each other and extend in directions parallel to the outer edge of region 21e. The two first grooves 29c reach mutually different sides of the cathode terminal 28c. The anode terminal 28a is not located on the extensions of the two first grooves 29c.

[0075] As shown in Figures 23A and 23B, an insulating member 23 is placed in a portion of the area on the upper surface 21b of the substrate 21 where the anode terminal 28a and cathode terminal 28c are not located. The insulating member 23 is formed, for example, by exposing and developing a resist material and then patterning it. In Figures 23A, 23B, and 24, thin dots are added to the insulating member 23 for clarity.

[0076] The insulating member 23 is provided with a first portion 23a that extends in the X direction along the boundary of region 21e. The first portion 23a is formed across multiple regions 21e arranged in the X direction. The first portion 23a is in contact with the anode terminal 28a. The insulating member 23 is also provided with a second portion 23b that extends from the first portion 23a inwards in the Y direction on both sides. The sides of the second portion 23b in the X direction on both sides are in contact with the anode terminal 28a, and the side of the tip of the second portion 23b in the Y direction is in contact with the cathode terminal 28c. Furthermore, the insulating member 23 is provided with a third portion 23c that extends in the X direction on both sides from the corner of the tip of the second portion 23b. The third portion 23c is positioned between the anode terminal 28a and the cathode terminal 28c, but is not in contact with either the anode terminal 28a or the cathode terminal 28c. Also, the third portion 23c does not reach the boundary of region 21e.

[0077] As a result, at least two ends of the two first grooves 29a formed in the anode terminal 28a are not blocked by the insulating member 23. Similarly, at least two ends of the two first grooves 29c formed in the cathode terminal 28c are not blocked by the insulating member 23. Alternatively, the insulating member 23 may be positioned so that it does not come into contact with the anode terminal 28a and the cathode terminal 28c, so that all ends of the first grooves 29a and 29c are not blocked by the insulating member 23. In this way, the substrate 27 is prepared.

[0078] (Temporary joining process) Next, as shown in Figure 24, the light-emitting elements 17 are temporarily bonded to the substrate 27. Specifically, each light-emitting element 17 is placed in each region 21e, and each anode electrode 18a of the light-emitting element 17 is brought into contact with the corresponding anode terminal 28a of the substrate 27, and the cathode electrode 18c of the light-emitting element 17 is brought into contact with the cathode terminal 28c of the substrate 27.

[0079] At this time, as shown in Figures 21 and 23B, the second groove 19a of the anode electrode 18a of the light-emitting element 17 communicates with the first groove 29a of the anode terminal 28a of the substrate 27 to form a cavity, and the second groove 19c of the cathode electrode 18c of the light-emitting element 17 communicates with the first groove 29c of the cathode terminal 28c of the substrate 27 to form a cavity.

[0080] Next, if necessary, the light-emitting elements 17 are inspected, any light-emitting elements 17 deemed defective are removed, and other light-emitting elements 17 are temporarily joined using the method described in the first embodiment.

[0081] (The final joining process) Next, as shown in Figure 25, conductive members 30 are formed by electroplating, for example, gold or copper, using a plating method. At this time, the plating solution 30a enters the space between adjacent light-emitting elements 17 and the substrate 27 in the X direction, reaches the junction between the anode electrode 18a and the anode terminal 28a, and the junction between the cathode electrode 18c and the cathode terminal 28c, and enters each cavity. As a result, conductive members 30 are formed inside each cavity and around each junction. On the other hand, since insulating members 23 are interposed between the junction between the anode electrode 18a and the anode terminal 28a and the junction between the cathode electrode 18c and the cathode terminal 28c, short circuits at these junctions due to the conductive members 30 are suppressed.

[0082] Subsequently, the insulating member 23 is removed, for example, by contact with a solvent. This completes the production of the light-emitting device according to this embodiment. According to this embodiment, since each terminal is provided with two first grooves and each electrode is provided with two second grooves, the contact area with the conductive member 30 after bonding is increased and the bonding strength is improved compared to the case where one first groove and one second groove are provided. In addition, in this embodiment, each light-emitting element 17 can be divided into four regions for each cathode electrode 18c, and each region can be made to emit light independently. The manufacturing method, configuration, and effects of this embodiment other than those described above are the same as in the second embodiment.

[0083] The above examples are merely illustrative examples for explaining the present invention, and the present invention is not limited to these examples. For example, each light-emitting element may be provided with two anode electrodes and two cathode electrodes. In this case, the region on the substrate on which each light-emitting element is mounted may be provided with two anode terminals and two cathode terminals. However, the number of electrodes of the light-emitting element and the number of terminals in each region do not have to match. Furthermore, three or more first grooves may be formed on each terminal of the substrate, and three or more second grooves may be formed on the electrodes of the light-emitting element. Multiple first grooves formed on the same terminal may intersect each other, for example, orthogonally, but they may also be independent of each other, or for example, arranged in parallel. The same applies to the second grooves. The first grooves and second grooves do not necessarily have to be in communication; it is sufficient that each reaches the side surface of the terminal or electrode.

[0084] The embodiments and their modifications described above are examples that embody the present invention, and the present invention is not limited to these embodiments and modifications. For example, the present invention also includes the addition, deletion, or modification of some components or processes in the embodiments and modifications described above. Furthermore, the embodiments and modifications described above can be implemented in combination with each other.

[0085] The present invention includes the following embodiments.

[0086] (Note 1) A step of preparing a light-emitting element including multiple electrodes arranged on the lower surface, A step of preparing an intermediate body comprising: a substrate having a plurality of terminals corresponding to the plurality of electrodes arranged on its upper surface, with a first groove formed on the upper surface of the terminals that reaches the side surface of the terminals; and an insulating member arranged in the region between the plurality of terminals on the upper surface of the substrate; The steps include bringing the plurality of electrodes into contact with the plurality of terminals to temporarily bond the light-emitting element to the substrate, The process of bonding the light-emitting element to the substrate by forming a conductive member in contact with the terminal and the electrode within the first groove by a plating method, A method for manufacturing a light-emitting device equipped with a light-emitting device.

[0087] (Note 2) After the above joining process, The method for manufacturing a light-emitting device according to Appendix 1, further comprising the step of removing the insulating member from the intermediate.

[0088] (Note 3) After the temporary joining step, and before the final joining step, A step of inspecting the light-emitting element, A step of removing the light-emitting element that was determined to be defective in the inspection step from the substrate, The process of temporarily joining the other light-emitting element to the substrate by bringing the electrode of the other light-emitting element into contact with the terminal that the electrode of the light-emitting element determined to be defective was in contact with; A method for manufacturing a light-emitting device as described in Appendix 1 or 2, further comprising:

[0089] (Note 4) A method for manufacturing a light-emitting device according to any one of the appendices 1 to 3, wherein in the step of temporary joining, the light-emitting element presses the insulating member to deform the insulating member.

[0090] (Note 5) A method for manufacturing a light-emitting device according to any one of the appendices 1 to 4, wherein two or more of the first grooves are formed on the upper surface of the terminal.

[0091] (Note 6) A method for manufacturing a light-emitting device according to Appendix 5, wherein the two first grooves intersect each other.

[0092] (Note 7) A method for manufacturing a light-emitting device according to any one of the appendices 1 to 6, wherein a second groove corresponding to the first groove and reaching the side surface of the electrode is formed on the lower surface of the electrode.

[0093] (Note 8) A method for manufacturing a light-emitting device according to any one of the appendices 1 to 7, wherein the inner surface of the first groove is inclined with respect to a direction perpendicular to the upper surface of the substrate such that the width of the first groove increases as it approaches the substrate.

[0094] (Note 9) A stepped surface is formed on the inside of the first groove. A method for manufacturing a light-emitting device according to any one of the appendices 1 to 7, wherein in the step of temporary joining, the electrode is in contact with the stepped surface.

[0095] (Note 10) A substrate having a plurality of terminals arranged on its upper surface, wherein a first groove is formed on the upper surface of the terminals, reaching the side surface of the terminals, A light-emitting element having a plurality of electrodes in contact with the plurality of terminals, A conductive member is disposed within the first groove and is in contact with the terminal and the electrode, A light-emitting device.

[0096] (Note 11) The light-emitting device according to Appendix 10, wherein a second groove opposite to the first groove is formed on the lower surface of the electrode, and the conductive member is also arranged within the second groove.

[0097] (Note 12) The light-emitting device according to appendix 10 or 11, wherein the conductive member is also arranged on the side of the terminal and the side of the electrode.

[0098] (Note 13) The light-emitting device according to any one of appendices 10 to 12, wherein between the substrate and the light-emitting element, there are regions between the plurality of electrodes and between the plurality of terminals in which the conductive member is absent. [Industrial applicability]

[0099] The present invention can be used, for example, in automotive lighting devices and display devices. [Explanation of symbols]

[0100] 1, 2 Light-emitting devices 10, 10r, 10x light-emitting element 10a Bottom side 10b Top surface 10c side 11. Semiconductor Stack 12 electrodes 12a Bottom side 12c side 14 Second groove 14c side 16, 17 Light-emitting elements 18a Anode electrode 18c cathode electrode 19a, 19c 2nd groove 20 circuit boards 20b Top surface 21 Base material 21b Top surface 21e Region where the light-emitting element 17 is to be placed 22 terminals 22a Bottom side 22b Top surface 22c side 23 Insulating material 23a Part 1 23b Part 2 23c Part 3 24 First groove 24c inner surface 24d slope 24e Step surface 24f curved surface 24g sloped surface 24h flat surface 25 Core section 26 Covering part 27 circuit boards 28a Anode terminal 28c cathode terminal 29a, 29c 1st groove 30 Conductive material 30a Plating solution 31 Cavity 40 Intermediates 101 Transport substrate 102 Adhesive layer 103 Resist film 103a opening 104, 105 Suction jigs 106 Resist film 106a opening V Direction perpendicular to the upper surface 21b of the substrate 21

Claims

1. A step of preparing a light-emitting element including multiple electrodes arranged on the lower surface, A step of preparing an intermediate body comprising: a substrate having a plurality of terminals corresponding to the plurality of electrodes arranged on its upper surface, with a first groove formed on the upper surface of the terminals that reaches the side surface of the terminals; and an insulating member arranged in the region between the plurality of terminals on the upper surface of the substrate; The steps include bringing the plurality of electrodes into contact with the plurality of terminals to temporarily bond the light-emitting element to the substrate, The process of formally bonding the light-emitting element to the substrate by forming a conductive member in contact with the terminal and the electrode within the first groove by a plating method, A method for manufacturing a light-emitting device equipped with a light-emitting device.

2. After the above joining process, The method for manufacturing a light-emitting device according to claim 1, further comprising the step of removing the insulating member from the intermediate.

3. After the temporary joining step, and before the final joining step, A step of inspecting the light-emitting element, A step of removing the light-emitting element that was determined to be defective in the inspection step from the substrate, The process of temporarily joining the other light-emitting element to the substrate by bringing the electrode of the other light-emitting element into contact with the terminal that the electrode of the light-emitting element determined to be defective was in contact with; A method for manufacturing a light-emitting device according to claim 1 or 2, further comprising:

4. The method for manufacturing a light-emitting device according to claim 1 or 2, wherein in the step of temporary joining, the light-emitting element presses the insulating member to deform the insulating member.

5. The method for manufacturing a light-emitting device according to claim 1 or 2, wherein two or more of the first grooves are formed on the upper surface of the terminal.

6. A method for manufacturing a light-emitting device according to claim 5, wherein the two first grooves intersect each other.

7. A method for manufacturing a light-emitting device according to claim 1 or 2, wherein a second groove corresponding to the first groove and reaching the side surface of the electrode is formed on the lower surface of the electrode.

8. A method for manufacturing a light-emitting device according to claim 1 or 2, wherein the inner surface of the first groove is inclined with respect to a direction perpendicular to the upper surface of the substrate such that the width of the first groove increases as it approaches the substrate.

9. A stepped surface is formed on the inside of the first groove. The method for manufacturing a light-emitting device according to claim 1 or 2, wherein in the step of temporary bonding, the electrode is in contact with the stepped surface.

10. A substrate having a plurality of terminals arranged on its upper surface, wherein a first groove is formed on the upper surface of the terminals, reaching the side surface of the terminals, A light-emitting element having a plurality of electrodes in contact with the plurality of terminals, A conductive member is disposed within the first groove and is in contact with the terminal and the electrode, A light-emitting device.

11. The light-emitting device according to claim 10, wherein a second groove opposite to the first groove is formed on the lower surface of the electrode, and the conductive member is also arranged in the second groove.

12. The light-emitting device according to claim 10, wherein the conductive member is also arranged on the side surface of the terminal and the side surface of the electrode.

13. The light-emitting device according to any one of claims 10 to 12, wherein between the substrate and the light-emitting element, there are regions between the plurality of electrodes and between the plurality of terminals in which the conductive member is not present.

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