support device

Abstract

The present invention provides a support device suitable for placement inside a semiconductor container, which can reduce the sliding phenomenon of the semiconductor substrate in the forward and backward directions and increase the contact area with the semiconductor substrate. [Solution] A support device 200A suitable for placement inside a semiconductor container comprises a main body 1 and a mounting surface 2, the mounting surface being located on the upper surface of the main body. The mounting surface has a first inclined surface 2a that gradually protrudes obliquely toward the opening of the semiconductor container from the mounting surface and a second inclined surface 2b that gradually protrudes obliquely toward the inner rear wall of the semiconductor container. The mounting surface places the contact surface of the semiconductor substrate in contact with the different inclined surfaces of the first and second inclined surfaces. As a result, the support device can effectively reduce the amount of deformation during placement and contamination due to frictional contact.

Description

Technical Field

[0001] The present invention relates to components of a semiconductor container, and particularly to a support device that can be incorporated into a semiconductor container for mounting a semiconductor substrate.

Background Art

[0002] During the manufacturing and transportation of semiconductors, semiconductor containers are generally used to store and accommodate semiconductor substrates such as wafers, photomasks, PCBs, and glass substrates. With the development of the semiconductor manufacturing process, the requirements for manufacturing efficiency, yield, and cost are becoming increasingly high. How to improve the structure of the semiconductor container, enhance the usage efficiency, and / or reduce the vibration of the semiconductor substrate during transportation to improve the yield of the manufacturing process and reduce the overall cost has become an increasingly important issue.

[0003] Conventional semiconductor containers usually include a container body, a door, and a support member. The container body has a space for accommodating a semiconductor substrate. The door is provided at an opening to the outside in the space of the container body and seals the accommodation space of the semiconductor substrate by covering the opening so that it can be opened and closed. The support member is provided in the space of the container body and supports the semiconductor substrate.

Summary of the Invention

[0004] However, when the semiconductor substrate accommodated in the semiconductor container is large in size, thin in thickness, or low in rigidity, the semiconductor substrate is likely to slide with respect to the support members on both sides, and furthermore, dust may be generated due to friction, and ultimately, collisions may occur.

[0005] Based on research using Figure 1, one of the causes of the above phenomenon is that the semiconductor substrate P deforms slightly due to gravity, causing warping at the contact point with the support rib R of the support member. This reduces the contact area with the support rib R, resulting in only line contact. Furthermore, adding a central support member M to the space of the container body has only a limited effect in improving this phenomenon.

[0006] Length 60cm, width 60cm, thickness 1mm, density 2.38g / cm³ 3 Taking the substrate as an example, its weight is approximately 856.8g. When this is placed in a semiconductor container having support ribs R on both sides and a central support member M, the amount of warping of the substrate on both sides relative to the support ribs R can increase to about 0.05mm. Under the same conditions, if the thickness of the substrate is reduced to 0.5mm, the amount of warping of the substrate relative to the support ribs R on both sides increases even further to about 0.07mm.

[0007] In light of the shortcomings of the prior art described above, the inventors identified areas for improvement and diligently conducted research to overcome these shortcomings. As a result, they succeeded in developing a support device that can reduce the sliding phenomenon of the semiconductor substrate in the forward and backward directions and / or increase the contact area with the semiconductor substrate.

[0008] Furthermore, the support device of the present invention can reduce dust generated by friction, or reduce the amount of dust that falls onto the underlying semiconductor substrate.

[0009] Throughout the text of this invention, directional terms and similar terms such as "front," "back," "left," "right," "top," "bottom," "inside," "outside," and "side" primarily refer to the directions shown in the accompanying drawings. Each directional term and similar term is merely for the purpose of assisting in the explanation and understanding of each embodiment of this invention and is not intended to limit the invention.

[0010] Throughout the entire text of this invention, the quantifiers "one" and "one" used for parts and components are merely for convenience to provide the usual meaning within the scope of this invention, and should be interpreted in this invention as including one or at least one, and unless explicitly stated otherwise, a single concept also includes multiple cases.

[0011] Throughout the text of this invention, similar terms such as "to join," "to combine," and "to assemble" primarily include forms in which the components can be separated without damaging them after connection, or in which the components cannot be separated after connection, and can be selected by a person with ordinary skill in the art according to the material of the components to be connected and the requirements for assembly.

[0012] To achieve the aforementioned and other objectives, the present invention provides a support device suitable for placement inside a semiconductor container, comprising: a main body; and a mounting surface located on the upper surface of the main body, having a first inclined surface that gradually protrudes obliquely from the mounting surface toward the opening of the semiconductor container, and a second inclined surface that gradually protrudes obliquely toward the inner rear wall of the semiconductor container, wherein the mounting surface places on the contact surface of a semiconductor substrate that contacts the different inclined surfaces of the first and second inclined surfaces.

[0013] In the support device, the first inclined surface and the second inclined surface may each form an angle of less than 7 degrees with the horizontal plane.

[0014] Furthermore, the present invention provides a support device suitable for placement inside a semiconductor container, comprising: a main body; and a mounting surface having at least a stepped portion, located on the upper surface of the main body, and having a first inclined surface that gradually protrudes obliquely from the mounting surface toward the opening of the semiconductor container, and a second inclined surface that gradually protrudes obliquely toward the inner rear wall of the semiconductor container, wherein the mounting surface provides a support device on which the contact surface of a semiconductor substrate is placed so as to be in contact with the different inclined surfaces of the first inclined surface and the second inclined surface.

[0015] In the support device, there may be multiple stepped sections, in which case the aforementioned mounting surface may have stepped sections of different heights and areas for mounting the contact surface of the semiconductor substrate.

[0016] In the support device described above, the main body has a lower surface which is opposite to the mounting surface described above, and the lower surface has a thickness between it and the mounting surface described above, and the thickness between the multiple stepped portions and the lower surface may gradually decrease so that the stepped portions have different heights and different areas relative to the lower surface.

[0017] In the support device, the height between adjacent stepped portions may be less than 1 mm, and the width may be less than 2 mm.

[0018] In the support device, the first inclined surface and the second inclined surface may each form an angle of less than 7 degrees with the horizontal plane.

[0019] Furthermore, the present invention provides a support device suitable for placement inside a semiconductor container, comprising: a main body; and a mounting surface located on the upper surface of the main body, having a flat surface and at least one extension portion extending upward from the flat surface, with at least one dust collection groove defined between the flat surface and the extension portion, and having a first inclined surface that gradually protrudes obliquely from the mounting surface toward the opening of the semiconductor container, and a second inclined surface that gradually protrudes obliquely toward the inner rear wall of the semiconductor container, wherein the mounting surface places the contact surface of a semiconductor substrate in contact with the different inclined surfaces of the first inclined surface and the second inclined surface.

[0020] In the support device, the support device may be positioned on the side wall inside the semiconductor container, in which case the extended portion may extend upward from the center and outside of the plane and define at least two dust collection grooves.

[0021] In the support device, the support device may be disposed at the central position within the semiconductor container. In this case, the extending portion may extend upward from the center and both outer sides of the plane to define at least two of the dust collection grooves.

[0022] Thus, in the support device of the present invention, the semiconductor substrate is in a form where the center is slightly recessed according to the guidance of the first inclined surface and the second inclined surface, making it difficult for a sliding phenomenon to occur and effectively reducing dust caused by friction. Also, due to the placement surface of the support device, the contact area with the semiconductor substrate is increased to more firmly support the semiconductor substrate, reducing the sliding risk of the semiconductor substrate due to insufficient support area, and reducing dust caused by friction. Further, in the support device, by providing the dust collection grooves, it is possible to reduce the falling of dust onto the underlying semiconductor substrate and improve the production yield.

Brief Description of the Drawings

[0023] [Figure 1] It is a schematic diagram when a semiconductor substrate is placed by a support device in a conventional semiconductor container. [Figure 2] It is a perspective structural diagram of a semiconductor container according to a first embodiment of the present invention. [Figure 3] It is a cross-sectional structural diagram taken along line A-A of FIG. 2. [Figure 4] It is a schematic diagram showing the forward and backward inclination changes of the placement surface of the support device according to a first embodiment of the present invention. [Figure 5] It is a schematic diagram when the placement surface of the support device according to a first embodiment of the present invention is inclined downward. [Figure 6] It is a schematic diagram when a semiconductor substrate is placed by the support device according to a first embodiment of the present invention. [Figure 7] It is a partially enlarged perspective structural diagram of the support device according to a first embodiment of the present invention. [Figure 8] It is a perspective structural diagram of the support device according to a second embodiment of the present invention. [Figure 9] It is a partial plan structural diagram of the support device according to a second embodiment of the present invention. [Figure 10] It is a schematic diagram of a cross-sectional structure along line B-B in FIG. 9 and when a semiconductor substrate is placed. [Figure 11] It is a schematic diagram when a semiconductor substrate is placed by the support device according to the third embodiment of the present invention. [Figure 12] It is a schematic diagram when a semiconductor substrate is placed by the support device according to the fourth embodiment of the present invention.

Mode for Carrying Out the Invention

[0024] In order to fully understand the object, features, and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings by means of the following specific examples. The description is as follows.

[0025] Referring to FIG. 2, FIG. 2 shows a support device 200A according to the first embodiment of the present invention. The support device 200A is suitable for being arranged in a semiconductor container 100 and is for supporting a semiconductor substrate. The semiconductor container 100 may be, for example, a loading facility such as a substrate cassette, a mask cassette, a load board cassette, or a carrier of other members in a semiconductor manufacturing process, a processing device, etc., and is not limited in the present invention.

[0026] In one embodiment of the present invention, the support device 200A can be applied to a front-opening type semiconductor container, for example, a front-opening unified pod (FOUP). The semiconductor container 100 has an opening 111 and has an inner rear wall 112 facing the opening 111 inside the semiconductor container 100. The opening 111 and the inner rear wall 112 face each other in the Y direction in the front-rear direction, the height direction of the semiconductor container 100 is the Z direction, and inside the semiconductor container 100, on the left and right sides facing each other in the X direction, a plurality of support devices 200A according to the present embodiment spaced apart from each other in the vertical direction can be defined to be arranged.

[0027] Refer to Figures 2 and 3 for details. The support device 200A according to this embodiment comprises a main body 1 and a mounting surface 2. The mounting surface 2 is located on the upper surface of the main body 1 and is used to bring the contact surface of the semiconductor substrate into contact with it. In some embodiments, the semiconductor container 100 may further comprise a plurality of other forms of support devices 200D (central support members), which are provided within the semiconductor container 100 at intervals in the vertical direction (e.g., the Z direction) and each is connected at one end to the inner rear wall 112 of the semiconductor container 100, thereby supporting the semiconductor substrate together with each support device 200D and the support devices 200A on both sides.

[0028] To facilitate the explanation and display of some of the structural features of the details of the support device 200A, the present invention shows a schematic diagram in Figure 4 illustrating the forward and backward inclination changes of the mounting surface of the support device according to the first embodiment of the present invention, showing the view of the support device 200A from the front in the X direction. However, Figure 4 is for illustrative purposes only, and the form of the support device 200A according to this embodiment is not limited by the proportional relationship between the parts shown in Figure 4.

[0029] Referring to Figures 2, 3, and 4, in this embodiment, the mounting surface 2 of the support device 200A may have a first inclined surface 2a and a second inclined surface 2b. The first inclined surface 2a is closer to the opening 111 of the semiconductor container 100 than the second inclined surface 2b. The first inclined surface 2a gradually protrudes obliquely from the mounting surface 2 toward the opening 111 of the semiconductor container 100, and the second inclined surface 2b gradually protrudes obliquely toward the inner rear wall 112 of the semiconductor container 100.

[0030] In other words, the first inclined surface 2a slopes downward from front to back, the second inclined surface 2b slopes upward from front to back, and the lowest point 21 of the mounting surface 2 is located between the first inclined surface 2a and the second inclined surface 2b. Figure 4 shows a horizontal plane L passing through the lowest point 21, and most of the first inclined surface 2a and the second inclined surface 2b are located on the horizontal plane L. The first inclined surface 2a and the second inclined surface 2b may be directly connected at the lowest point 21, or they may be separated by only a small distance from each other, and are not limited in this invention.

[0031] As a result, even if the semiconductor substrate is slightly deformed by gravity after being placed in the semiconductor container 100 according to this embodiment, the contact surface of the semiconductor substrate will be guided by the first inclined surface 2a and the second inclined surface 2b so as to align with the different inclined surfaces of the first inclined surface 2a and the second inclined surface 2b, allowing the semiconductor substrate to be in a shape where the center is slightly concave between the front and rear ends. Therefore, the potential energy and contact area required for the semiconductor substrate to slide forward and backward can be increased, improving stability, effectively reducing the occurrence of situations in which the semiconductor substrate slides back and forth, and effectively reducing dust (particles) caused by friction due to the sliding of the semiconductor substrate.

[0032] In one embodiment of the present invention, the first inclined surface 2a and the second inclined surface 2b of the mounting surface 2 each have an angle θ1 of less than 7 degrees with the horizontal plane L, and the inclination angles of the first inclined surface 2a and the second inclined surface 2b may be the same or different, and are not limited by the present invention. In this way, the structural design of the mounting surface 2 according to this embodiment can improve upon the shortcomings of the prior art by reducing the effect of the semiconductor substrate sliding back and forth without causing excessive deformation to the semiconductor substrate.

[0033] Furthermore, in one embodiment of the present invention, when the mounting surface 2 is projected onto a horizontal plane L along the Z direction, it has a center point 22 between its front and rear ends. Preferably, the lowest point 21 of the mounting surface 2 is located between the rear end of the mounting surface 2 and the center point 22. In this way, even when the semiconductor substrate slides within the semiconductor container 100, it tends to slide inward into the semiconductor container 100 rather than towards the opening of the semiconductor container 100.

[0034] Please refer to Figure 5. Figure 5 shows a schematic cross-section of the support device 200A along the XZ direction when the mounting surface of the support device according to the first embodiment of the present invention is inclined downwards. Similarly, it is a schematic diagram intended to facilitate the explanation and display of some of the structural features of the details of the support device 200A, and is for illustrative purposes only. The form of the support device 200A according to this embodiment is not limited by the proportional relationship between the parts shown in Figure 5.

[0035] In one embodiment of the present invention, the mounting surface 2 of each support device 200A may be a downward-sloping surface that slopes downward toward the free end, and the downward angle θ2 of the downward-sloping surface may be 3 degrees or less (including 3 degrees) and greater than 0 degrees, for example, 0.5 degrees. In this way, the mounting surface 2 of the support device 200A according to this embodiment can be easily manufactured and molded, and it is possible to ensure that the contact surface of the semiconductor substrate housed in the semiconductor container 100 (shown in Figure 2) is in close contact with the corresponding mounting surface 2 to achieve surface contact. As a result, the contact area between the support device 200A and the semiconductor substrate is increased, the semiconductor substrate is supported more firmly, and the semiconductor substrate is less likely to slide within the semiconductor container 100.

[0036] Refer to Figure 6. The dimensions are 60 cm in length, 60 cm in width, 1 mm in thickness, and have a density of 2.38 g / cm³. 3 Taking the substrate as an example, its weight is approximately 856.8g. When this is placed in a semiconductor container having support devices 200A and 200D on both sides, the amount of warping on both sides of the substrate is only about 0.01mm. Under the same conditions, if the thickness of the substrate is reduced to 0.5mm, the amount of warping on both sides of the substrate is only about 0.03mm. Compared to the conventional structure described above, the amount of warping on both sides of the substrate is significantly reduced, and the contact area between the substrate and the support device 200A is also significantly increased. The data regarding the substrate is merely a preferred embodiment and is not data that limits the present invention.

[0037] Referring to Figures 2 and 7, in one embodiment of the present invention, the mounting surface 2 of the support device 200A is provided with at least a stepped portion 23. For example, in an embodiment in which the semiconductor container 100 is in a forward-facing configuration, a plurality of support devices 200A according to this embodiment may be coupled to each of the left and right sides facing each other in the X direction inside the semiconductor container 100, and each support device 200A may be provided with at least one stepped portion 23, and the number of stepped portions 23 may be at least one. When there are multiple stepped portions 23, the mounting surface 2 becomes a stepped portion with different heights and different areas, and all of the stepped portions can support the contact surface of the semiconductor substrate.

[0038] More specifically, the main body 1 has a bottom surface 3 opposite to the mounting surface 2, and the bottom surface 3 has a thickness H between it and the mounting surface 2. The multiple stepped portions 23 are arranged with the bottom surface 3 as the reference point, and the thickness between the multiple stepped portions 23 and the bottom surface 3 gradually decreases, forming stepped portions of different heights and areas. The height in the Z direction between adjacent stepped portions 23 is less than approximately 1 mm, for example, 0.5 to 0.8 mm, and the width in the X direction is less than approximately 2 mm, for example, 1 to 1.5 mm, forming the mounting surface 2 of the support device 200A.

[0039] As a result, each semiconductor substrate housed in the semiconductor container 100 can be placed on the stepped portion 23 on the support device 200A that best fits its size, thus solving the problem of the semiconductor substrate sliding on the support device 200A due to size errors.

[0040] Furthermore, each stepped portion 23 is preferably formed in an L-shape or U-shape that opens toward the center of the inside of the semiconductor container 100. The side walls of each stepped portion 23 limit the position of the semiconductor substrate, which helps to reduce sliding of the semiconductor substrate on the support device 200A, especially sliding in the X and Y directions, thus achieving a more favorable fixing effect.

[0041] Referring to Figures 8 to 10, a second embodiment of the support device 200B in the present invention is shown. The support device 200B in this embodiment may be provided with at least one dust collection groove 4 that receives dust T generated when the semiconductor substrate P slides and prevents the dust T from falling onto the lower support device 200B.

[0042] For example, referring to Figure 2, in an embodiment where the semiconductor container 100 is a front-opening unified pod, a plurality of support devices 200B according to this embodiment may be connected to each of the left and right sides facing each other in the X direction inside the semiconductor container 100. In the embodiments shown in Figures 8 to 10, the plurality of support devices 200B are integrally connected to the connecting plate 5 and may protrude from the inner surface 51 of the connecting plate 5, and the plurality of support devices 200B are provided spaced apart from each other in the vertical direction. The connecting plate 5 is detachably connected to the left or right side inside the semiconductor container 100.

[0043] The support device 200B is provided with at least one dust collection groove 4 on the inside and / or outside of its mounting surface 2. The inside of the mounting surface 2 refers to the side of the mounting surface 2 that faces the connecting plate 5, and the other side of the mounting surface 2 is the outside, that is, the outside of the mounting surface 2 faces the internal center of the semiconductor container 100.

[0044] As shown in Figure 10, let's assume that the dust collection groove 4 is located outside the mounting surface 2. The mounting surface 2 is located on the upper surface of the main body 1 and has a flat surface 24 and at least one extended portion 25 extending upward from the flat surface 24, with at least one dust collection groove 4 defined between the flat surface 24 and the extended portion 25. For example, near the free end of the extended portion 25, the flat surface 24 and the extended portion 25 are in different regions. If the extended portion 25 is slightly lower than the flat surface 24, a step is formed, and the extended portion 25 extends slightly upward toward the internal center of the semiconductor container 100. As a result, the flat surface 24 becomes the mounting position for the semiconductor substrate P, the extended portion 25 becomes the dust collection position, and the step between the flat surface 24 and the extended portion 25 becomes the dust collection groove 4. Thus, when the semiconductor substrate P comes into contact with the mounting surface 2 of the support device 200B, or when dust T is generated due to sliding of the semiconductor substrate P during transport, the dust T does not fall directly onto the semiconductor substrate P below, but can fall downward into the dust collection groove 4. This effectively avoids cross-contamination of each layer of semiconductor substrate P and improves production yield.

[0045] The flat surface 24 and the extended portion 25 may be integrally molded and connected, or they may be two interchangeable parts.

[0046] In one embodiment, the dust collection groove 4 may be located on the inside of the mounting surface 2. For example, the dust collection groove 4 may be formed between the mounting surface 2 and the inner surface 51 of the connecting plate 5, or, as shown in Figure 11, the dust collection groove 4 may be formed between the mounting surface 2 and the side wall inside the semiconductor container 100. At least a portion of the area adjacent to the edge of the semiconductor substrate P is located on the inside of the mounting surface 2 and above the dust collection groove 4.

[0047] Referring to Figure 11, a support device 200C according to a third embodiment of the present invention is shown. The support device 200C may have one dust collection groove 4 formed on the inside and one on the outside of the mounting surface 2, but the form and amount of dust collection grooves 4 are not limited to this in the present invention.

[0048] The mounting surface 2 may have a flat surface 24 and two extensions 25 extending upward from the flat surface 24. The extensions 25 may define dust collection grooves 4a and 4b by extending upward from the center and outside of the flat surface 24. To improve the dust collection effect, the projection of the free end of the extension 25 extending upward from the center of the flat surface 24 in the Z direction may be located in the dust collection groove 4b further outwards. The dust collection groove 4b acts as an auxiliary dust collection section to more reliably prevent dust T from falling downward into the lower support device 200C.

[0049] Similarly, referring to Figures 2 and 12, the support device 200D according to the fourth embodiment may be positioned in the center of the semiconductor container 100, that is, the support device 200D may be the central support member described above. The support device 200D may be processed and treated to form a groove, trench, or mountain-shaped structure such as forming at least one dust collection groove in the upper half of the support device 200D.

[0050] For example, the extension portion 25 of the support device 200D may define at least two dust collection regions, namely dust collection grooves 4a and 4b, by extending upward from the center and both outer sides of the plane 24. The extension portion 25 contacts the lower surface of the semiconductor substrate P, and the step between the plane 24 and the extension portion 25 becomes a dust collection region. Both dust collection grooves 4a and 4b serve as dust collection areas, more reliably preventing dust T from falling downward onto the lower support device 200D. As a result, whether the semiconductor substrate P slides leftward or rightward, the dust T generated by friction can fall into approximately the two dust collection grooves 4a and 4b, further improving the overall dust collection effect.

[0051] Notably, the extended portion 25 may have a slightly inclined surface so that dust T is efficiently collected in the dust collection grooves 4a and 4b along the inclined surface. The present invention is applicable not only to semiconductor containers of front-opening unified pods but also to semiconductor containers of top-opening unified pods, such as top-opening carriers. Furthermore, as long as they do not contradict each other, the support devices according to each embodiment of the present invention may simultaneously have multiple of the above-described structural features, so the present invention is not limited to the forms disclosed in the drawings of each embodiment.

[0052] Although the present invention has been disclosed above by preferred embodiments, those skilled in the art should understand that these embodiments are merely illustrative and should not be construed as limiting the scope of the invention. Notably, all equivalent modifications and substitutions to those in the embodiments should be included within the scope of the invention. Therefore, the scope of protection of the present invention should be limited by the claims, which should be interpreted in the broadest sense to include all modifications, similar arrangements and processes, etc. [Explanation of symbols]

[0053] 100 semiconductor containers 111 Aperture 112 Medial posterior wall 200A~200D Support device 1 Main unit 2 Mounting surface 2a 1st slope 2b Second slope 21 Lowest point 22 Center point 23 Stepped section 24 plane 25 Stretching section 3 Bottom surface 4,4a,4b Dust collection grooves 5. Connecting plate 51 Inner surface L horizontal plane M Central support member P Semiconductor substrate R support rib T Dust θ1 angle θ2 Downward angle

Claims

1. A support device suitable for placement inside a semiconductor container, The main unit and The mounting surface is located on the upper surface of the main body and has a first inclined surface that gradually protrudes obliquely from the mounting surface toward the opening of the semiconductor container, and a second inclined surface that gradually protrudes obliquely toward the inner rear wall of the semiconductor container, A support device on which the contact surface of a semiconductor substrate is placed so that the mounting surface is in contact with the different inclined surfaces of the first inclined surface and the second inclined surface.

2. The support device according to claim 1, wherein the first inclined surface and the second inclined surface each form an angle of less than 7 degrees with the horizontal plane.

3. A support device suitable for placement inside a semiconductor container, The main unit and The mounting surface comprises at least a stepped portion, located on the upper surface of the main body, a first inclined surface that gradually protrudes obliquely from the mounting surface toward the opening of the semiconductor container, and a second inclined surface that gradually protrudes obliquely toward the inner rear wall of the semiconductor container, A support device on which the contact surface of a semiconductor substrate is placed so that the mounting surface is in contact with the different inclined surfaces of the first inclined surface and the second inclined surface.

4. The support device according to claim 3, wherein, if there are multiple stepped portions, the aforementioned mounting surface becomes a stepped portion of different heights and areas for mounting the contact surface of the semiconductor substrate.

5. The support device according to claim 4, wherein the main body has a lower surface which is opposite to the previously described mounting surface, the lower surface has a thickness between it and the previously described mounting surface, and the thickness between the multiple stepped portions and the lower surface gradually decreases so that the multiple stepped portions become stepped portions of different heights and different areas relative to the lower surface.

6. The support device according to claim 4, wherein the height between adjacent stepped portions is less than 1 mm and the width is less than 2 mm.

7. The support device according to claim 3, wherein the first inclined surface and the second inclined surface each form an angle of less than 7 degrees with the horizontal plane.

8. A support device suitable for placement inside a semiconductor container, The main unit and The mounting surface is located on the upper surface of the main body and has a flat surface and at least one extension portion extending upward from the flat surface, with at least one dust collection groove defined between the flat surface and the extension portion, and has a first inclined surface that gradually protrudes obliquely from the mounting surface toward the opening of the semiconductor container, and a second inclined surface that gradually protrudes obliquely toward the inner rear wall of the semiconductor container, A support device on which the contact surface of a semiconductor substrate is placed so that the mounting surface is in contact with the different inclined surfaces of the first inclined surface and the second inclined surface.

9. The support device according to claim 8, wherein when the support device is positioned on the side wall inside the semiconductor container, the extended portion extends upward from the center and outside of the plane and defines at least two dust collection grooves.

10. The support device according to claim 8, wherein when the support device is positioned in the center of the semiconductor container, the extended portion extends upward from the center and both outer sides of the plane and defines at least two dust collection grooves.

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