Carrier tape and taping for electronic components

Abstract

To provide a carrier tape and taped electronic component chain that can prevent tearing of the bottom surface of the storage recess of the carrier tape for electronic components and improve mounting efficiency on the mounting board. [Solution] The carrier tape 2 comprises a strip-shaped paper tape body 3, a storage recess 30 having an opening 31 on one side of the tape body 3, and a bottom tape 5 provided on the other side of the tape body 3 at a position corresponding to the bottom surface 32 of the storage recess 30.

Description

Technical Field

[0001] The present invention relates to a carrier tape and a taped electronic component connection.

Background Art

[0002] In an apparatus for mounting an electronic component on a circuit board, a carrier tape containing the electronic component is used to easily supply the electronic component.

[0003] In the prior art, a plurality of recesses for storing electronic components are formed in a strip-shaped tape base material (made of cardboard) to form storage recesses (see, for example, Patent Document 1).

[0004] In the above prior art, when the strength of the bottom surface of the storage recess is weak, when the electronic component is adsorbed by the adsorption nozzle of the mounting machine, the bottom surface of the storage recess comes off, and as a result, the electronic component falls out of the storage recess. As a result, the mounting efficiency on the mounting substrate has decreased.

[0005] Also, a technique for forming a plurality of through holes for storing electronic components in a strip-shaped tape base material (made of cardboard) and attaching a bottom tape to the bottom surface side of the through holes to form storage recesses is also known (see, for example, Patent Document 2).

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0007] In the technique of attaching bottom tape to the bottom surface of a through-hole, the adhesive surface of the bottom tape becomes the bottom surface of the storage recess, causing electronic components to stick to the bottom surface, resulting in poor workability and mounting efficiency.

[0008] The present invention aims to provide a carrier tape and taped electronic component string that can suppress tearing of the bottom surface of the storage recess of the carrier tape for electronic components and improve mounting efficiency on a mounting substrate. [Means for solving the problem]

[0009] (1) A carrier tape according to the first view of the present invention is It is strip-shaped, and consists of a paper tape body and One side of the tape body has a storage recess having an opening, A reinforcing member provided on the other side of the tape body at a position corresponding to the bottom surface of the storage recess, It is equipped with.

[0010] (2) A carrier tape according to the second view of the present invention is It is strip-shaped, and consists of a paper tape body and One side of the tape body has a bottomed storage recess with an opening, A reinforcing member provided on the other side of the tape body at a position corresponding to the bottom surface of the storage recess, A sealing member that seals the opening of the storage recess, It is equipped with.

[0011] (3) A carrier tape according to the third view of the present invention is It is strip-shaped, and consists of a paper tape body and The tape body has an opening on one side, and a bottomed storage recess that is recessed in the thickness direction of the tape body, A reinforcing member provided on the other side of the tape body at a position corresponding to the bottom surface of the storage recess, It is equipped with.

[0012] (4) The taping electronic component association according to the fourth view of the present invention is A paper tape body having a plurality of storage recesses formed in a strip shape with openings formed on one surface, electronic components stored in the plurality of storage recesses, a top tape for sealing the openings, and a bottom tape pasted on the other surface of the tape body and opposite to the plurality of storage recesses. It is provided with.

Effect of the Invention

[0013] According to the present invention, it is possible to provide a carrier tape and a taping electronic component set that suppress breakage of the bottom surface of the storage recess of the carrier tape for electronic components and improve the mounting efficiency on the mounting substrate.

Brief Description of the Drawings

[0014] [Figure 1] It is a perspective view showing a taping electronic component set according to the first embodiment of the present invention. [Figure 2] It is a plan view of the taping electronic component set. [Figure 3] It is a cross-sectional view taken along line III-III of FIG. 1. [Figure 4] It is a schematic cross-sectional view of a base tape manufacturing apparatus. [Figure 5] It is a cross-sectional view of a taping electronic component set according to the second embodiment of the present invention.

Modes for Carrying Out the Invention

[0015] (First Embodiment) Using FIGS. 1 to 3, the taping electronic component set 1 according to the first embodiment of the present invention will be described. FIG. 1 is a partial perspective view of the taping electronic component set of the first embodiment. FIG. 2 is a partial plan view of the taping electronic component set. FIG. 3 is a cross-sectional view taken along line III-III of FIG. 1.

[0016] In Figures 1 to 3, mutually orthogonal arrows X, Y, and Z are shown. In the following explanation, arrow X corresponds to the longitudinal direction X of the taped electronic component string 1, arrow Y corresponds to the short direction (width direction) Y of the taped electronic component string 1, and arrow Z corresponds to the direction Z perpendicular to the plane of the taped electronic component string 1.

[0017] The taped electronic component string 1 is a package in which chip-type electronic components are housed in a long storage tape. The taped electronic component string 1 is usually stored and used in a state wound on a reel.

[0018] The taped electronic component group 1 mainly comprises a carrier tape 2 and a plurality of electronic components S1.

[0019] Electronic component S1 is, for example, a resistor, capacitor, inductor, switch, connector, or coil.

[0020] The carrier tape 2 is a component for packaging multiple electronic components S1, and mainly consists of a tape body 3, a top tape 4, and a bottom tape 5.

[0021] The tape body 3 is a long, strip-shaped component also called a base tape or tape substrate, extending long in the longitudinal direction X. The tape body 3 is a paper tape, for example, a cardboard tape.

[0022] On the first side portion of the surface 6 of the tape body 3 in the width direction Y, storage recesses 30 are formed in a row at predetermined intervals in the longitudinal direction X. The storage recesses 30 are structures for housing electronic components S1. Specifically, the storage recesses 30 are bottomed structures recessed in the thickness direction of the tape body 3, and a roughly rectangular parallelepiped space is formed inside. The storage recesses 30 have an opening 31, a bottom surface 32, and an inner side wall 34, and are roughly rectangular in plan view. The opening 31 is the portion of the storage recesses 30 that opens near the surface 6. The position of the opening 31 in the direction perpendicular to the surface Z is the same as the position of the surface 6 as a horizontal plane. The storage recesses 30 have a bottom portion 33. The bottom portion 33 is the portion from the bottom surface 32 to the back surface 7.

[0023] On the back surface 7 of the tape body 3, a protrusion 40 is provided at a position corresponding to the bottom surface 32 of the storage recess 30. In other words, the bottom 33 of the storage recess 30 is formed from the bottom surface 32 to the tip of the protrusion 40.

[0024] Specifically, the protrusions 40 are formed on the back surface 7 of the tape body 3 along its entire length in the longitudinal direction. The protrusions 40 function as a rib structure on the back surface 7 of the tape body 3. As a result, the tape body 3 can increase its tensile strength and bending rigidity in the longitudinal direction X by forming the protrusions 40.

[0025] In the second side portion of the tape body 3 in the width direction Y, feed holes 73 are formed in a row at predetermined intervals in the longitudinal direction X. The feed holes 73 are provided in parallel with a plurality of storage recesses 30. The feed holes 73 are provided to automatically transport the taped electronic component string 1 by engaging with the pins of the transport mechanism of the automatic component supply machine.

[0026] The top tape 4 (sealing member) is a long, strip-shaped piece extending parallel to the longitudinal direction X of the tape body 3, and is attached to cover the storage recess 30 of the tape body 3. The top tape 4 seals the opening 31 of the storage recess 30 of the tape body 3. The top tape 4 is a resin tape, and for example, has a base material made of a polyester layer or a polyethylene layer and an adhesive layer, and is heat-pressed to the tape body 3.

[0027] The bottom tape 5 (reinforcement member) is a long, strip-shaped piece extending parallel to the longitudinal direction of the tape body 3, and is provided on the back surface 7 of the tape body 3 at a position corresponding to the bottom surface 32 of the storage recess 30. As a result, the bottom tape 5 is applied so as to cover the protrusion 40.

[0028] The bottom tape 5 is a resin tape, for example, the same as the top tape 4, and is attached to the tape body 3. The bottom tape 5 may have a base material made of paper and an adhesive layer provided on the base material. It is heat-pressed to the tape body 3. However, the bottom tape 5 may also be attached to the tape body 3 using adhesive tape.

[0029] Furthermore, the area on the tape body 3 to which the top tape 4 is applied is defined as the first long area 8, and the area to which the top tape 4 is not applied is defined as the second long area 9. The first long area 8 has a first long area surface 8A which is part of the surface 6, and a first long area back surface 8B which is part of the back surface 7. The second long area 9 has a second long area surface 9A which is part of the surface 6, and a second long area back surface 9B which is part of the back surface 7.

[0030] As is clear from the above description, the bottom tape 5 is provided on the entire surface of the back surface 8B of the first long area of ​​the tape body 3, but not on the back surface 9B of the second long area. Alternatively, the bottom tape 5 may be provided only on the portion of the back surface 8B of the first long area corresponding to the bottom surface 32 of the storage recess 30. By providing the bottom tape 5 only on specific parts, the material of the bottom tape 5 can be saved.

[0031] The application of the bottom tape 5 increases the strength of the bottom surface 32 of the storage recess 30, thereby making it less likely for the electronic component S1 to fall out of the storage recess 30.

[0032] Since the bottom surface 32 of the storage recess 30 in contact with the electronic component S1 is made of paper, the electronic component S1 will not stick to it. Therefore, workability and mounting efficiency are not reduced.

[0033] While a certain thickness is required to provide strength to the bottom surface 32 of the storage recess 30, the bottom tape 5 allows for a reduction in the thickness of the tape body 3. As a result, the amount of paper material used in the tape body 3 can be reduced.

[0034] The width of the tape body 3 is, for example, 4 to 12 mm. The thickness T of the tape body 3 is, for example, 0.3 to 1.1 mm.

[0035] The width of top tape 4 is, for example, 2.5 to 9 mm. The thickness of top tape 4 is, for example, 0.03 to 0.07 mm.

[0036] The width of bottom tape 5 is, for example, 4 to 6 mm. The thickness of bottom tape 5 is, for example, 0.03 to 0.07 mm.

[0037] In the direction Z perpendicular to the surface of the tape body 3, the length of the bottom 33 of the storage recess 30 (the distance from the bottom surface 32 to the apex of the protrusion 40) is defined as the "recess bottom surface thickness Tb". The recess bottom surface thickness Tb is within the range of 0.05 mm or more and 0.22 mm or less.

[0038] In the direction Z perpendicular to the surface of the tape body 3, the length from the horizontal surface on the back surface 7 of the tape body 3 where the storage recess 30 is not formed to the apex of the protrusion 40 is defined as the "protrusion thickness Tc". The protrusion thickness Tc is within the range of 0.030 mm to 0.28 mm. Preferably, the protrusion thickness Tc is less than the thickness Tb of the bottom surface of the recess.

[0039] In the direction Z perpendicular to the surface of the tape body 3, the distance from the opening 31 of the storage recess 30 to the bottom surface 32 is defined as the "storage recess depth Ko" of the storage recess 30.

[0040] (How to use carrier tape) An automatic component feeder (not shown) moves the taped electronic component string 1 using the feed holes 73 and sequentially supplies the electronic components S1 stored in the storage recesses 30 to the component mounting device. Specifically, the feeder peels off one side of the top tape 4 of the taped electronic component string 1 to expose the storage recesses 30 of the tape body 3. The electronic components S1 stored in the storage recesses 30 are then picked up (for example, by suction) by the nozzle of the component mounting device and mounted on the substrate.

[0041] (Method for manufacturing carrier tape and taped electronic component strings) This section describes the manufacturing method for carrier tape 2 and taped electronic component string 1. Note that while actual manufacturing involves a tape cutting process, this process is omitted in the following description.

[0042] The manufacturing method of the tape body 3 will be explained using Figure 4. Figure 4 is a cross-sectional view of the base tape manufacturing apparatus. Note that the explanation of the structure and operation of forming the feed holes 73 will be omitted in the following explanation.

[0043] As shown in Figure 4, the upper die 80 includes a punch 81, a punch holder 82 and punch plate 83 that hold the punch 81, and a stripper plate 85 connected to the punch plate 83 via a spring 84. The stripper plate 85 is a member that holds the tape body 3 in place so that it does not move when the punch 81 is pulled out from the tape body 3 after the tape body 3 has been compressed by the punch 81.

[0044] The lower die 90 is equipped with a die plate 91 on which the tape body 3 is placed. The material of the punch 81 and the die plate 91 is, for example, cemented carbide. The upper die 80, although not shown, has multiple punches 81, which are held in parallel by a punch holder 82 and a punch plate 83.

[0045] The lower die 90 has a groove 92 on the surface of the die plate 91 on which the tape body 3 is placed. The groove 92 is parallel to the longitudinal direction X of the tape body 3 and is provided continuously from one end to the other of the die plate 91 along the entire length of the tape body 3 in the longitudinal direction, at the position where the punch 81 of the upper die 80 compresses the tape body 3.

[0046] First, the carrier tape manufacturing apparatus supplies the tape body 3 between the upper mold 80 and the lower mold 90, and places the tape body 3 in a predetermined position on the lower mold 90. Next, the carrier tape manufacturing apparatus fits the upper mold 80 and the lower mold 90 together as shown in Figure 4.

[0047] The punch 81 of the upper die 80 forms a plurality of storage recesses 30 on the surface 6 of the tape body 3. At the same time, the die plate 91 of the lower die 90 forms a protrusion 40 on the back surface of the tape body 3, extending along the entire length of the tape body 3 in the longitudinal direction, where a portion of the tape body 3 compressed by the punch 81 has escaped.

[0048] Next, by heat-pressing the bottom tape 5 onto the back surface 7 of the tape body 3, the mechanical strength of the bottom 33 of the storage recess 30 is improved. In other words, the bottom 33 of the storage recess 30 becomes less likely to tear.

[0049] Next, for example, an insertion jig is used to place the electronic component S1 into the storage recess 30 of the tape body 3. At this time, the position of the insertion jig is fixed, and the tape body 3 is intermittently transported by engaging the pins of the transport mechanism with the feed holes 73 of the tape body 3, thereby placing the electronic component S1 into each of the storage recesses 30 of the tape body 3.

[0050] Finally, the top tape 4 is placed on the surface and heat-pressed onto the tape body 3.

[0051] As a result of the above, the taped electronic component assembly 1 is completed.

[0052] (Example of experiment) A mounting substrate for mounting multilayer ceramic capacitors was prepared, and the multilayer ceramic capacitors were picked up using a suction nozzle with mounting equipment (mounter). The bottom of the storage recess in the carrier tape was checked for any tears. During the pick-up process, the contact load between the multilayer ceramic capacitor and the suction nozzle was varied and evaluated. 200 samples were checked for each example.

[0053] The common elements of each example are as follows: • Base tape width 8mm, thickness T0.6mm • Storage recess length: 0.60 mm, width: 1.10 mm • Pitch between multiple adjacent storage recesses: 1.0 mm • Width of the protrusion (length perpendicular to the longitudinal direction of the tape body): 2.5 mm • Electronic component dimensions: 0.5mm length, 1.0mm width, 0.5mm height

[0054] The following items were differed in each example. • Presence or absence of bottom tape (width 5.2mm, height 0.05mm) • Thickness Tc of the convex part on the opposite side of the storage recess • Thickness Tb of recessed bottom • Storage recess depth Ko

[0055] [Table 1]

[0056] For carrier tape tears, visual inspection was performed to check for tears at the bottom of the storage recess. Examples where no tears were found in any sample (Examples 1-8) were marked with ○ (Excellent), and examples where even one tear was found in a sample (Comparative Examples 1-8) were marked with × (Poor). In Examples 1-8, it was determined that multilayer ceramic capacitors could be continuously mounted on the mounting board. In Comparative Examples 1-8, it was determined that multilayer ceramic capacitors could not be continuously mounted, meaning that some kind of trouble occurred in the mounting machine.

[0057] Experimental data showed that in cases where no bottom tape was applied (Comparative Examples 1-8), the bottom of the carrier tape storage recess was torn by the suction nozzle of the mounting machine in all examples. It was confirmed that the thinner the bottom surface thickness Tb of the recess (for example, Comparative Examples 1 and 7), the more times it tore.

[0058] On the other hand, when bottom tape was applied (Examples 1-8), it was confirmed that the bottom of the carrier tape storage recess was not torn by the suction nozzle of the mounting machine in all samples. In particular, it was confirmed that the bottom of the carrier tape storage recess was not torn even when the thickness Tb of the recess bottom surface was thin (Examples 1 and 7).

[0059] (Second Embodiment) In the first embodiment, a protrusion is formed on the surface of the base tape opposite to the recess. However, the present invention relates to an embodiment in which no protrusion is formed on the surface of the base tape opposite to the recess. Using Figure 5, we will describe an embodiment in which the surface opposite the recess for storing the base tape is a flat surface. Note that the basic structure of the second embodiment is the same as that of the first embodiment, so the following description will focus on the differences.

[0060] In the taped electronic component group 1A, the carrier tape 2 is a component that packages multiple electronic components S1, and mainly comprises a tape body 3, a top tape 4, and a bottom tape 5A.

[0061] The tape body 3 is a long, strip-shaped component that extends long in the longitudinal direction X. The tape body 3 is a paper tape, for example, a cardboard tape.

[0062] On the first side portion in the width direction Y of the surface 6 of the tape body 3, storage recesses 30 are formed in a row at predetermined intervals in the longitudinal direction X. The storage recesses 30 are structures for housing electronic components S1. Specifically, the storage recesses 30 are bottomed structures recessed in the thickness direction of the tape body 3, and a roughly rectangular parallelepiped space is formed inside. The storage recesses 30 have an opening 31, a bottom surface 32, and an inner side wall 34, and are roughly rectangular in plan view. The opening 31 is the portion of the storage recess 30 that opens near the surface 6. The storage recesses 30 have a bottom portion 33A. The bottom portion 33A is the portion from the bottom surface 32 to the back surface 7.

[0063] The back surface 7 of the tape body 3 is a completely flat surface. In other words, unlike the first embodiment, no protrusions are formed on the back surface 7.

[0064] The bottom tape 5A (reinforcement member) is a long strip extending parallel to the longitudinal direction of the tape body 3, and is provided on the back surface 7 of the tape body 3 at a position corresponding to the bottom surface 32 of the storage recess 30. In this embodiment as well, the same effects as in the first embodiment can be obtained.

[0065] (Other embodiments) In the first and second embodiments, a bottom tape 5 is attached to the back surface of the tape body as a reinforcing member. However, the reinforcing member does not need to be tape; it just needs to reinforce the bottom surface of the storage recess.

[0066] For example, an adhesive may be applied to the back surface of the tape body as a reinforcing material. In that case, the adhesive may be a thermosetting resin-based adhesive such as epoxy resin, a vinyl acetate-based adhesive, or a rubber-based adhesive. [Explanation of symbols]

[0067] 1: Taping Electronic Components Association 2: Carrier Tape 3: Tape body 4: Top tape (sealing material) 5: Bottom tape (reinforcement material) 30: Storage recess 31: Opening 32: Bottom 33: Bottom 40: Convex part Ko: Depth of storage recess S1: Electronic components Tb: Thickness of the bottom surface of the recess Tc: Thickness of the protruding part

Claims

1. It is strip-shaped, and consists of a paper tape body and One side of the tape body has a storage recess having an opening, A reinforcing member provided on the other side of the tape body at a position corresponding to the bottom surface of the storage recess, A carrier tape equipped with this feature.

2. It is strip-shaped, and consists of a paper tape body and One side of the tape body has a bottomed storage recess with an opening, A reinforcing member provided on the other side of the tape body at a position corresponding to the bottom surface of the storage recess, A sealing member that seals the opening of the storage recess, A carrier tape equipped with this feature.

3. It is strip-shaped, and consists of a paper tape body and The tape body has an opening on one side, and a bottomed storage recess that is recessed in the thickness direction of the tape body, A reinforcing member provided on the other side of the tape body at a position corresponding to the bottom surface of the storage recess, A carrier tape equipped with this feature.

4. The other surface of the tape body is provided with a protrusion at a position corresponding to the bottom surface of the storage recess, The reinforcing member is provided along the protrusion, A carrier tape according to any one of claims 1 to 3.

5. The other surface of the tape body is provided with a protrusion at a position corresponding to the bottom surface of the storage recess, The bottom of the storage recess is formed from the bottom surface to the apex of the protrusion, In the direction perpendicular to the surface of the tape body, the thickness of the bottom of the storage recess is within the range of 0.050 mm or more and 0.22 mm or less. A carrier tape according to any one of claims 1 to 4.

6. In the direction perpendicular to the surface of the tape body, the length from the surface of the other surface of the tape body where the storage recess is not formed to the apex of the protrusion is within the range of 0.030 mm or more and 0.28 mm or less. The carrier tape according to claim 5.

7. In the direction perpendicular to the surface of the tape body, the depth of the storage recess, which is the distance from the opening of the storage recess to the bottom surface of the storage recess, is within a range that does not exceed the thickness of the tape body. A carrier tape according to any one of claims 1 to 6.

8. The reinforcing member is a tape. A carrier tape according to any one of claims 1 to 7.

9. A cardboard tape body that is strip-shaped and has multiple storage recesses with openings formed on one side, The electronic components housed in the aforementioned plurality of storage recesses, A top tape that seals the aforementioned opening, The other side of the tape body, the bottom tape attached to the opposing surface of the plurality of storage recesses, A taping-type electronic component assembly equipped with this.

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