Support structure for electrical contacts, electrical contacts, and electrical connection devices

Abstract

This prevents wall collapse between the support hole of an electrical contact and other adjacent support holes, thereby preventing short circuits. [Solution] The electrical contact support structure of the present invention comprises a main body portion, a plurality of electrical contacts having a first contact portion and a second contact portion, and a first support plate and a second support plate having a plurality of support holes, wherein the opening shape of each support hole of the first and second support plates is such that, at least the second support plate has a pair of support holes that are adjacent to each other in the deformation direction of the electrical contact, and each has a pair of support holes that support an electrical contact with the position of the first contact portion shifted to one side, and the direction of the shifting of the first contact portion is opposite to that of the pair of support holes, and the shifted sides of the first contact portion are facing each other.

Description

Technical Field

[0001] The present invention relates to a support structure for an electrical contact, an electrical contact, and an electrical connection device, and can be applied, for example, to an electrical contact and an electrical connection device used for electrical inspection of a semiconductor integrated circuit (hereinafter also referred to as a "semiconductor device") on a semiconductor wafer.

Background Art

[0002] For inspecting the electrical characteristics of semiconductor devices on a semiconductor wafer, a probe card having a plurality of electrical contacts such as probes is used. The probe card is attached to the test head of a semiconductor inspection device (tester), and the electrode terminals of the semiconductor device are electrically contacted with the electrical contacts of the probe card, so that the semiconductor inspection device inspects the electrical characteristics of the semiconductor device through the probe card.

[0003] For example, when using vertical probes, after the probes are brought into contact with the electrode terminals of the semiconductor device, the semiconductor wafer is further moved closer to the probe card to elastically deform the probes, and the elastic force ensures contact between the electrode terminals of the semiconductor device and the probes.

[0004] Patent Document 1 discloses a probe that is likely to bend and deform in a specific direction when a compressive force is applied in the longitudinal direction of the vertical probe during contact.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] Incidentally, as the pitch between electrode terminals of semiconductor devices narrows, probes that bend and deform in a specific direction may come into contact with other adjacent probes, causing a short circuit.

[0007] For example, guide holes may be provided in the upper and lower guide plates, and vertical probes may be inserted and supported through the corresponding guide holes. In this case, the wall thickness between one guide hole and another adjacent guide hole becomes thin, and during inspection, the wall may break due to friction with the probe, and if the probes come into contact with each other, a short circuit may occur.

[0008] This is just one example, but while the pitch is becoming narrower, it is desirable to make the wall thickness between adjacent guide holes as thick as possible in order to stably support the probe.

[0009] Therefore, in view of the above-mentioned problems, the present invention aims to provide an electrical contact support structure, an electrical contact, and an electrical connection device that prevent the collapse of the wall between one guide hole and another adjacent guide hole that supports the electrical contact, thereby preventing short circuits. [Means for solving the problem]

[0010] To solve the above problems, the first electrical contact support structure according to the present invention comprises: (1) a main body portion, a plurality of electrical contacts having a first contact portion that contacts the electrode terminal of an object under test, and a second contact portion that connects to the connection terminal of a wiring board; (2) a first support plate having a plurality of support holes for each electrical contact that support the vicinity of the first contact portion of the electrical contact; and (3) a second support plate having a plurality of support holes for each electrical contact that support the vicinity of the second contact portion of the electrical contact, wherein the opening shape of each support hole in the first support plate and the second support plate is a shape corresponding to the cross-sectional shape of the electrical contact, and at least the first support plate has a pair of support holes that are adjacent to each other and each supports an electrical contact with the position of the first contact portion shifted to one side, wherein the direction of shifting of the first contact portion is opposite to that of the pair of support holes that supports an electrical contact with the shifted side of the first contact portion facing each other.

[0011] The second electrical contact according to the present invention comprises (1) a main body, (2) a first contact portion provided at one end of the main body and in contact with the electrode terminal of the object to be inspected, and (3) a second contact portion provided at the other end of the main body and in connection with the connection terminal of the wiring board, wherein the first contact portion and the second contact portion are each provided at a position offset from the longitudinal central axis of the electrical contact.

[0012] A third electrical connection device according to the present invention is an electrical connection device for electrically connecting an inspection device and an object to be inspected, comprising: (1) a wiring board connected to the inspection device; and (2) a connection unit having a plurality of electrical contacts that electrically contact the electrode terminals of the object to be inspected and electrically connect the connection terminals of the wiring board and the electrode terminals of the object to be inspected; and (3) the connection unit having the support structure of the electrical contacts of the first present invention. [Effects of the Invention]

[0013] According to the present invention, it is possible to prevent wall collapse between one guide hole supporting an electrical contact and another adjacent guide hole, thereby preventing short circuits.

Brief Description of the Drawings

[0014] [Figure 1] It is a front view and a plan view showing the configuration of an electrical contact according to an embodiment. [Figure 2] It is a configuration diagram showing the configuration of a probe card according to an embodiment. [Figure 3] It is a configuration diagram showing the configuration of a connection unit according to an embodiment. [Figure 4] In an embodiment, it is an explanatory diagram for explaining the arrangement structure of electrode terminals disposed on a semiconductor wafer and electrical contacts. [Figure 5] It is an explanatory diagram showing the arrangement of electrical contacts with respect to the peripheral arrangement of electrode terminals on a conventional semiconductor wafer. [Figure 6] In an embodiment, it is an explanatory diagram showing the arrangement of electrical contacts with respect to the peripheral arrangement of electrode terminals on a semiconductor wafer. [Figure 7] It is a configuration diagram showing the configuration of an electrical contact of a modified embodiment. [Figure 8] It is an explanatory diagram for explaining a conventional electrical contact and the arrangement structure of electrical contacts. [Figure 9] It is an explanatory diagram for explaining an electrical contact according to a modified embodiment and the arrangement of electrical contacts (Part 1). [Figure 10] It is an explanatory diagram for explaining an electrical contact according to a modified embodiment and the arrangement of electrical contacts (Part 2). [Figure 11] It is an explanatory diagram for explaining an electrical contact according to a modified embodiment and the arrangement of electrical contacts (Part 3).

Modes for Carrying Out the Invention

[0015] (A) Main Embodiment Hereinafter, embodiments of a support structure for an electrical contact, an electrical contact, and an electrical connection device according to the present invention will be described in detail with reference to the drawings.

[0016] In this embodiment, a case where the electrical connection device of the present invention is applied to a probe card used for inspecting the electrical characteristics of a plurality of semiconductor devices formed on a semiconductor wafer is illustrated. Further, a case where the electrical contact according to the present invention is applied to a probe mounted on a probe card is illustrated.

[0017] Note that the electrical contact and the electrical connection device according to the present invention are not limited to probes and probe cards.

[0018] (A-1) Configuration of Probe Card FIG. 2 is a configuration diagram showing the configuration of a probe card according to an embodiment.

[0019] Although each figure illustrates main constituent members, it is not limited to the illustrated members and actually includes members not illustrated. In each figure, the same or corresponding constituent elements are denoted by the same or corresponding reference numerals. It should be noted that each figure is a schematic diagram, and the dimensions, thicknesses, etc. of each constituent element are different from those in reality. Also, the dimensions and ratios of corresponding constituent elements are different between the drawings. The embodiments shown below illustrate devices and methods for embodying the technical idea of the present invention, and do not limit the materials, shapes, structures, arrangements, etc. of the constituent elements of the present invention.

[0020] In FIG. 2, a probe card 10 according to an embodiment mainly includes a main substrate 2, a connection substrate 4, and a connection unit 100 having a plurality of electrical contacts 1.

[0021] The probe card 10 is used for inspecting the electrical characteristics of semiconductor devices on a semiconductor wafer 30. The probe card 10 is mounted on a test head of a semiconductor inspection device TE, and during inspection, each electrode terminal 31 on the semiconductor wafer 30 is electrically contacted with a corresponding electrical contact (hereinafter also referred to as a "probe") 1 to electrically connect between the semiconductor inspection device TE and the electrode terminal 31 of the semiconductor wafer 30.

[0022] For example, during testing, the probe card 10 supplies electrical signals from the semiconductor testing apparatus TE to each electrode terminal 31 of the semiconductor device via the electrical contact 1, and also receives electrical signals output by the semiconductor device via the electrical contact 1 and provides them to the semiconductor testing apparatus TE. As a result, the semiconductor testing apparatus TE can test the electrical characteristics of the semiconductor device via the probe card 10.

[0023] The object under inspection is an object whose electrical characteristics are to be inspected by the semiconductor inspection apparatus TE, and in this embodiment, for example, it is a semiconductor device formed on a semiconductor wafer 30 before dicing.

[0024] The semiconductor wafer 30 is placed, for example, on one surface 82a of the chuck 82, and the position of the semiconductor wafer 30 on the chuck 82 can be adjusted by driving a drive unit 81 such as a multi-axis stage. During inspection, each electrode terminal 84 of the semiconductor device is made to make electrical contact with the corresponding electrical contact 1.

[0025] [Main board 2, connection board 4] The main substrate 2 is a printed circuit board formed from a synthetic resin material such as polyimide. The main substrate 2 is formed from, for example, a roughly circular plate-shaped member.

[0026] Printed wiring is formed on the first surface 2a of the main board 2, and electronic components such as resistors and capacitors are provided. Multiple tester connection points are provided on the outer edge of the first surface 2a of the main board 2. The semiconductor testing device TE and the main board 2 are connected via each of the multiple tester connection points.

[0027] The connection board 4 is a board that connects the main board 2 and the connection unit 100. The connection board 4 is also called a space transformer. The connection board 4 is provided with connection terminals 41 that connect to the electrical contacts 1. This allows for an electrical connection between the printed circuit board on the first surface 2a of the main board 2 and the electrical contacts 1 via the connection board 4.

[0028] [Connection unit 100, electrical contact 1] The connection unit 100 supports multiple electrical contacts 1. A detailed description of the configuration of the connection unit 100 will be given later.

[0029] The electrical contactor 1 can be used with a vertical probe, and the other end of the electrical contactor 1 (e.g., the upper end) is connected to a connection terminal 41 disposed on the connection substrate 4. During inspection, one end of the electrical contactor 1 (e.g., the lower end) is electrically in contact with the electrode terminal 31 of the semiconductor wafer 30.

[0030] (A-2) Configuration of the connection unit Figure 3 is a configuration diagram showing the configuration of a connection unit according to an embodiment.

[0031] In Figure 3, the connecting unit 100 has a first guide plate 21, a second guide plate 22, and a third guide plate 23.

[0032] The third guide plate 23 has a plurality of guide holes (also called "support holes") 25 that support the vicinity of the first contact portion 111 of each electrical contact 1. In other words, the third guide plate 23 is a guide plate provided on the side that contacts the electrode terminals 31 on the semiconductor wafer 30. This corresponds to the "first support plate" in the claims.

[0033] The first guide plate 21 has a plurality of guide holes (support holes) 25 that support the vicinity of the second contact portion 112 of each electrical contact 1. In other words, the first guide plate 21 is a guide plate provided on the side that contacts the connection terminal 41 of the connection board 4. This corresponds to the "second support plate" in the claim.

[0034] The first guide plate 21 is also called the top guide plate, the second guide plate 22 is also called the middle guide plate, and the third guide plate 23 is also called the bottom guide plate. In this embodiment, a structure with three guide plates is illustrated, but the number of guide plates is not limited to the structure shown in Figure 3. It may also be a two-plate structure, or a structure with four or more plates.

[0035] Each of the first guide plate 21, the second guide plate 22, and the third guide plate 23 has a guide hole 25 for supporting a plurality of electrical contacts 1, for each electrical contact 1.

[0036] For example, since the number of electrical contacts 1 is the same as the number of electrode terminals 31 on the semiconductor wafer 30, the guide holes 25 are also the same number as the number of electrical contacts 1 (i.e., the number of electrode terminals 31). In other words, each of the first guide plate 21, the second guide plate 22, and the third guide plate 23 has the same number of guide holes 25 as the number of electrical contacts 1. Furthermore, the positions of the guide holes 25 in the second guide plate 22 and the third guide plate 23 correspond to the positions of the electrode terminals 31 on the semiconductor wafer 30.

[0037] The guide holes 25 of the first guide plate 21, the second guide plate 22, and the third guide plate 23 are shaped to match the cross-sectional shape of the electrical contact 1.

[0038] For example, in this embodiment, the cross-sectional shape of the electrical contact 1 is a horizontally elongated rectangle (a rectangle having a short side and a long side). Therefore, the plan view shape of the guide hole 25 is also a rectangle having a short side and a long side, and the size of the plan view shape of the guide hole 25 is made slightly larger than the cross-sectional shape of the electrical contact 1. This makes it possible to insert the electrical contact 1 into the guide hole 25.

[0039] Here, focusing on a guide hole 25 through which an electrical contact 1 is inserted, we will explain the support structure for the electrical contact 1 using a first guide plate 21, a second guide plate 22, and a third guide plate 23.

[0040] With respect to a guide hole 25 through which an electrical contact 1 passes, the positions of the guide holes 25 of the second guide plate 22 and the third guide plate 23 are offset in a direction F parallel to the main surface of the first guide plate 21 with respect to the position of the guide hole 25 of the first guide plate 21.

[0041] In other words, the positions of the guide holes 25 of the second guide plate 22 and the third guide plate 23 are offset from the positions of the guide holes 25 of the first guide plate 21. Here, the offsetting of the positions of the guide holes 25 between the first guide plate 21 and the second guide plate 22 (or the third guide plate 23) is called "offset," and the arrangement in which the positions of the guide holes 25 are offset is called an "offset arrangement."

[0042] In this way, the offset arrangement allows the electrical contact 1 to be supported between the first guide plate 21 and the second guide plate 22 (or third guide plate 23) in a roughly S-shaped curved state. That is, in the hollow region 200 between the first guide plate 21 and the second guide plate 22, the electrical contact 1 is curved in a roughly S-shape due to elastic deformation.

[0043] Furthermore, when the electrical contactor 1 comes into contact with the electrode terminal 31 of the semiconductor device during inspection, the electrical contactor 1 is compressed in the longitudinal direction due to the contact load, resulting in greater elastic deformation (buckling, deflection).

[0044] In other words, when the electrical contact 1 is in contact with the electrode terminal 31 (contact state), the electrical contact 1 is further curved due to deflection deformation from its curved shape when it is not in contact with the electrode terminal 31 (non-contact state).

[0045] Further curvature of the electrical contact 1 ensures reliable contact between the electrical contact 1 and the electrode terminal 31.

[0046] As a result, the offset arrangement allows for stable measurement of the electrical characteristics of the semiconductor device. When the electrical contact 1 becomes non-contact, contact with the electrode terminal 31 is released, and it returns to its shape before contact.

[0047] The direction F in which the position of the guide hole 25 is shifted is also called the "offset direction," and in this embodiment, for example, the offset direction is the direction in which the longer side of the electrical contact 1, which has a rectangular cross-section, is facing.

[0048] Furthermore, the positions of the guide holes 25 in the second guide plate 22 and the third guide plate 23 coincide when viewed from the direction of the surface normal of the guide plates.

[0049] (A-3) Configuration and support structure of the electrical contact 1 Figure 1 is a front view and a top view showing the configuration of the electrical contact 1 according to an embodiment.

[0050] In Figures 1(A) and 1(B), the electrical contact 1 according to the embodiment has a main body portion 12 and a first contact portion 111 and a second contact portion 112 provided at each end of the main body portion 12.

[0051] Note that the electrical contactor 1 illustrated in Figures 1(A) and 1(B) has the same basic configuration, although the direction of misalignment of the first contact portion 111 and the second contact portion 112 is different.

[0052] The electrical contact 1 has an irregular cross-section and is electrically conductive, made of a conductive material such as metal. Generally, vertical electrical contacts typically have a circular or square cross-section, but the electrical contact 1 in this embodiment has a cross-sectional shape different from the usual cross-sectional shape. This is called an "irregular cross-section." In this embodiment, a rectangle (rectangle) with a short side and a long side is given as an example of an irregular cross-section.

[0053] As shown in the plan view of Figure 1, the overall shape of the electrical contact 1 is exemplified by the case where its cross-sectional shape is a rectangle having a short side and a long side. Here, the direction of the short side (more precisely, the direction parallel to the short side) is also referred to as the "first direction," and the direction of the long side (more precisely, the direction parallel to the long side) is also referred to as the "second direction." The electrical contact 1 is assumed to be curved in the first direction (short side direction).

[0054] The main body portion 12 is a columnar member with an irregular cross-section. A first contact portion 111 and a second contact portion 112, which serve as contact pins, are provided at both ends of the main body portion 12. The main body portion 12 has a first connecting portion 121, a curved portion 123, and a second connecting portion 122, arranged from below along the longitudinal central axis P of the electrical contactor 1.

[0055] In this embodiment, the first contact portion 111 and the second contact portion 112, which serve as contact pins, and the main body portion 12 are shown as examples of different materials. However, the first contact portion 111 and the second contact portion 112 and the main body portion 12 may be physically integrated.

[0056] For example, the main body 12 is made of nickel or a nickel-based alloy, and the first contact portion 111 and the second contact portion 112 are made of a precious metal such as rhodium.

[0057] The first contact portion 111 contacts the electrode terminal 31 on the semiconductor wafer 30. The first contact portion 111 is fixed by the first connecting portion 121 of the main body portion 12. The first contact portion 111 may be detachable from the main body portion 12.

[0058] The first connecting portion 121 supports the first contact portion 111 and is the portion that connects the first contact portion 111 and the curved portion 123.

[0059] The second contact portion 112 connects to the connection terminal 41 of the connection board 4. The second contact portion 112 is fixed by the second connecting portion 122 of the main body portion 12. The second contact portion 112 may also be detachable from the main body portion 12.

[0060] The second connecting portion 122 supports the second contact portion 112 and also connects the second contact portion 112 to the curved portion 123.

[0061] The curved portion 123 is the part that undergoes elastic deformation due to the offset arrangement when the electrical contactor 1 is set in the connection unit 100. For example, the curved portion 123 is designed to undergo elastic deformation in a roughly S-shape in the first direction (the direction parallel to the short side). Furthermore, during inspection, the curved portion 123 undergoes a larger deformation in the first direction (the direction parallel to the short side) upon receiving a contact load.

[0062] For example, the curved portion 123, by curving in a roughly S-shape, ensures the straightness of the first contact portion 111 connected to the first connecting portion 121. As a result, the alignment accuracy of the first contact portion 111 with respect to the electrode terminal 31 of the semiconductor device can be improved. Similarly, the straightness of the second contact portion 112 connected to the second connecting portion 122 can also be ensured, improving the alignment accuracy.

[0063] Here, the installation positions of the first contact portion 111 and the second contact portion 112 relative to the main body portion 12 will be explained with reference to the drawings.

[0064] Figure 8 is an explanatory diagram illustrating a conventional electrical contact and the arrangement structure of the electrical contact.

[0065] As illustrated in Figure 8(A), a conventional electrical contact 9 has a first contact portion 911 and a second contact portion 912, and a main body portion 92. The main body portion 92 also has a first connecting portion 921, a curved portion 923, and a second connecting portion 922.

[0066] Figure 8(B) schematically shows the positional relationship between the electrode terminals 31 and the electrical contacts 9 arranged on the semiconductor wafer 30. The electrical contacts 9 are offset and supported by the first guide plate 21, the second guide plate 22, and the third guide plate 23. Guide holes 25 are provided in each of the first guide plate 21, the second guide plate 22, and the third guide plate 23, but for the sake of explanation, Figure 8(B) shows the electrical contacts 9 inserted through one of the guide holes 25 on one of the guide plates.

[0067] Here, in order to ensure that the electrical contactor 9 makes electrical contact with the electrode terminal 31 on the semiconductor wafer 30, it is desirable that the tip of the electrical contactor 9 be positioned at the center of the electrode terminal 31.

[0068] Therefore, it is desirable that the guide hole 25 be designed so that the position of the center of the electrode terminal 31 and the position of the center of the guide hole 25 are approximately the same.

[0069] As shown above, when designing the position of the guide holes 25 on the guide plate, the spacing between them becomes narrow, as shown for guide holes 25-1 and 25-2 in Figure 8(B).

[0070] In particular, as the pitch between the electrode terminals 31 of semiconductor devices is becoming narrower, if the position of the guide holes 25 is designed to match the pitch between the electrode terminals 31, the wall thickness separating adjacent guide holes 25 becomes thinner.

[0071] For example, consider the electrical contacts 9-1 and 9-2 in Figure 8(B). Both are rectangles with a short side and a long side in cross-section. If we consider the first direction (parallel to the short side) and the second direction (parallel to the long side), the wall separating adjacent guide holes 25-1 and 25-2 in the second direction becomes thin, leading to insufficient wall strength. In other words, if the distance between adjacent guide holes 25 is small on a plane parallel to the surface of the semiconductor wafer 30 in a direction that intersects (orthogonal to) the deformation direction of the electrical contact 9 (first direction) (in this example, the second direction), wall collapse may occur.

[0072] Therefore, if the elastic deformation of the electrical contacts 9 is repeated during inspection, the walls between the guide holes 25 may break. If this happens, the electrical contacts 9 may come into contact with each other, causing a short circuit and affecting the inspection.

[0073] Therefore, in this embodiment, as illustrated in Figures 1(A) and 1(B), the positions of the first contact portion 111 and the second contact portion 112 are offset from the central axis P of the electrical contact 1. In other words, the axes P1 of the first contact portion 111 and the second contact portion 112 are offset from the central axis P of the electrical contact 1, thereby arranging the first contact portion 111 and the second contact portion 112.

[0074] In this way, by using an electrical contact 1 in which the first contact portion 111 and the second contact portion 112 are offset to one side, even if the electrical contact 1 is placed in the center of the electrode terminal 31, the wall thickness between adjacent guide holes 25 can be increased (the spacing becomes larger) in the direction intersecting the deformation direction of the electrical contact 1, thereby preventing wall collapse and preventing short circuits. At this time, the multiple first contact portions 111 are arranged in positions that meet the pitch conditions of the multiple electrode terminals 31.

[0075] Here, the electrical contact 1 illustrated in Figure 1(A) has its first contact portion 111 and second contact portion 112 offset from the central axis P to the first side of the main body portion 12 (the right side in Figure 1(A)). This is also called the first electrical contact.

[0076] On the other hand, the electrical contact 1 illustrated in Figure 1(B) has its first contact portion 111 and second contact portion 112 shifted to the second side (left side in Figure 1(B)) opposite to the first side of the main body portion 12 from the central axis P. This is also called the second electrical contact.

[0077] Figure 4 is an explanatory diagram illustrating the support structure between the electrode terminal 31 and the electrical contact 1, which are arranged on the semiconductor wafer 30, in an embodiment.

[0078] The square electrode terminals 31 are arranged on the XY plane at the same pitch (spacing) as other adjacent electrode terminals 31. This embodiment is an example of an electrical contact 1 with an irregular cross-section, and illustrates a case where the electrical contact 1 is tilted on the XY axis to accommodate a narrower pitch.

[0079] Here, we will focus on electrode terminals 31-1 and 31-2, which are adjacent to each other in a direction perpendicular to the first direction.

[0080] The first contact portion 111 and the second contact portion 112 are configured such that the electrical contact 1-1, which is offset to the right from the central axis P in Figure 1(A), is positioned on the electrode terminal 31-1, and the electrical contact 1-2, which is offset to the left from the central axis P in Figure 1(B), is positioned on the electrode terminal 31-2.

[0081] To ensure electrical contact, the first contact portion 111 of the electrical contactor 1-1 is positioned in the center of the electrode terminal 31-1. Similarly, the first contact portion 111 of the electrical contactor 1-2 is positioned in the center of the electrode terminal 31-2.

[0082] In other words, the electrode terminals 31-1 and 31-2, which are adjacent to each other in a direction perpendicular to the deformation direction of the electrical contact 1, are arranged such that the first contact portion 111 is offset in the second direction from the central axis P.

[0083] To achieve this arrangement, the guide holes 25-1 and 25-2 in each guide plate (first guide plate 21, second guide plate 22, third guide plate 23) are also designed to be positioned in accordance with the locations of electrical contacts 1-1 and 1-2.

[0084] In other words, a pair of guide holes 25-1 and 25-2 adjacent to each other in a direction perpendicular to the deformation direction of the electrical contact 1 can be designed to support the electrical contact 1 with the offset sides of the first contact portion 111 facing each other, with the offset directions of the first contact portion 111 being opposite to each other. Since the offset directions of the first contact portion 111 of each of the electrical contacts 1-1 and 1-2 are opposite to each other and the offset sides are facing each other, the spacing between guide holes 25-1 and 25-2 can be designed to be large.

[0085] To explain in detail using Figure 4, for example, one guide hole 25-1 supports a first electrical contact 1-1 whose first contact portion 111 is offset from the central axis P of the electrical contact 1 to the first side of the main body portion 12, while the other guide hole 25-2 supports a second electrical contact 1-2 whose first contact portion 111 is offset from the central axis P of the electrical contact 1 to the second side of the main body portion 12. Therefore, the pair of guide holes 25-1 and 25-2 are designed to support the first side of the first electrical contact and the second side of the second electrical contact facing each other.

[0086] This allows the distance L between guide holes 25-1 and 25-2 in the long-side direction to be increased (i.e., the wall thickness can be increased), thus preventing wall collapse.

[0087] Figure 5 is an explanatory diagram showing the arrangement of electrical contacts 9 relative to the peripheral arrangement of electrode terminals 31 on a conventional semiconductor wafer 30. Figure 6 is an explanatory diagram showing the arrangement of electrical contacts 1 relative to the peripheral arrangement of electrode terminals 31 on a semiconductor wafer 30 in an embodiment.

[0088] As semiconductor devices become more multifunctional, the number of electrode terminals 31 increases to connect with peripheral functions. This arrangement of multiple electrode terminals 31 required by functional expansion is called peripheral arrangement.

[0089] In the peripheral arrangement of electrode terminals 31 illustrated in Figure 5, as the number of electrode terminals 31 increases, the number of adjacent guide holes 25 in the direction perpendicular to the first direction of the electrical contact 9 also increases. As a result, there are more places where the spacing between adjacent guide holes 25 becomes narrow (wall thickness becomes thin), which may lead to wall collapse. In other words, when designing guide holes 25 to match the peripheral arrangement, the wall thickness between adjacent guide holes 25 becomes significantly thinner, which can easily lead to short circuits.

[0090] In contrast, as illustrated in Figure 6, by using an electrical contact 1 in which the first contact portion 111 and the second contact portion 112 are shifted to one side and offset from the central axis P, the spacing between the guide holes 25 in the second direction can be widened (the wall thickness can be increased). Therefore, even in a peripheral arrangement, the wall thickness between adjacent guide holes 25 can be increased, preventing short circuits due to wall collapse.

[0091] By combining the electrical contact 1 on the right in Figure 1(A) and the electrical contact 1 on the left in Figure 1(B), the spacing between adjacent guide holes 25 can be efficiently maintained at a large distance.

[0092] (A-4) Effects of the Embodiment As described above, according to the embodiment, by providing the first contact portion 111 and the second contact portion 112 at positions offset from the longitudinal central axis P of the electrical contact 1, the spacing between the guide holes 25 can be maintained, wall collapse can be avoided, and short circuits can be prevented.

[0093] (B) Other embodiments Although various modified embodiments have been mentioned in the embodiments described above, the present invention can also be applied to the following modified embodiments.

[0094] (B-1) Figure 7 is a configuration diagram showing the configuration of an electrical contact in a modified embodiment.

[0095] As illustrated in Figure 7, the first contact portion 111 may be located offset from the central axis P to the first side (left side) of the main body portion 12, and the second contact portion 112 may be located offset from the central axis P to the second side (left side), which is opposite to the first side of the main body portion 12. The two contact portions (the first contact portion 111 and the second contact portion 112) may be offset to different sides.

[0096] Even with this arrangement, the wall thickness between adjacent guide holes 25 in the second direction can be increased, preventing wall collapse and preventing short circuits.

[0097] (B-2) An example was given of the cross-sectional shape of an electrical contact being a rectangle with a short side and a long side. In other words, as an example of an irregular cross-section, an example was given of a rectangle with a horizontally elongated cross-section.

[0098] However, the cross-sectional shape of the electrical contact (i.e., the irregular cross-section) is not limited to a rectangle. By using irregular rolling or other processes, the cross-section of the electrical contact may be made into shapes such as a horizontally elongated ellipse, a horizontally elongated trapezoid, a horizontally elongated rhombus, or a horizontally elongated polygon. The same effect can be obtained in these cases as well.

[0099] Furthermore, although the example given illustrates a case where the electrical contact has an irregular cross-section, the method can also be applied when the cross-section of the electrical contact is not irregular, but rather circular, square, rectangular, etc., and the same effects as those of the embodiments described above can be obtained in that case as well.

[0100] (B-3) Modified embodiment when the cross-sectional shape of the electrical contact 1 is square Figures 9 to 11 are explanatory diagrams illustrating an electrical contact according to a modified embodiment and the arrangement of the electrical contacts.

[0101] Assume that the cross-sectional shapes of the electrical contacts 1A, 1B, and 1C in Figures 9 to 11 are all square.

[0102] In Figures 9(A) and 9(B), the first tip 111A and the second tip 112A of the electrical contact 1A are both positioned to the left (second side) and facing each other, close to one of the four corners (the lower left corner in Figure 9(A)). Of course, the first tip 111A and the second tip 112A may also be positioned to the right (first side) and close to the lower right corner.

[0103] The first tip portion 111A is square or rectangular in plan view. To ensure contact between the first tip portion 111A and the electrode terminal 31, the first contact portion 111A is positioned in the center of the square electrode terminal 31, and the guide holes 25 (25-1, 25-2) are designed to match this arrangement.

[0104] In Figure 9(B), we focus on electrical contact 1A-1 with its first tip 111A close to the lower left corner, and electrical contact 1A-2 with its first tip 111A close to the upper left corner.

[0105] Both first tip portions 111A are located in the center of the square electrode terminals 31-1 and 31-2, but by shifting the position of the first tip portions 111A to one side, a larger gap can be maintained between the guide holes 25-1 and 25-2. In other words, the wall thickness between the guide holes 25-1 and 25-2 can be increased, thereby preventing the wall from collapsing due to friction with the electrical contact 1A.

[0106] In Figures 10(A) and 10(B), the cross-sectional shape of the electrical contact 1B is square, and the plan view of the first tip portion 111B and the second tip portion 112B is rectangular, and they are connected to one side of the square cross-section of the electrical contact 1B.

[0107] In this example, both the first tip 111B and the second tip 112B are positioned to the left (second side). Of course, the first tip 111B and the second tip 112B may also be positioned to the right (first side) and closer to the lower right corner.

[0108] In Figure 10(B), we focus on electrical contact 1B-1, which has a first tip portion 111B that is positioned to the left and connected to the bottom edge, and electrical contact 1B-2, which has a first tip portion 111B that is positioned to the left and connected to the top edge.

[0109] The side to which the first tip 111B of electrical contact 1B-1 is connected and the side to which the first tip 111B of electrical contact 1B-2 is connected are positioned opposite each other. In other words, the direction in which the first tips are shifted is opposite, and the sides to which the first tips are connected are positioned opposite each other. Of course, both first tips 111B are located in the center of the square electrode terminals 31-1 and 31-2.

[0110] As a result, by positioning the first tip portion 111B with the offset side facing each other, the distance between guide hole 25-1 and guide hole 25-2 can be kept large, and the wall thickness can be increased, thereby preventing the wall from collapsing.

[0111] In Figures 11(A) and 11(B), the cross-sectional shape of the electrical contact 1C is square, and the plan view of the first tip portion 111C and the second tip portion 112C is rectangular, and they are connected to two opposing sides of the square cross-section of the electrical contact 1C.

[0112] In this example, both the first tip 111C and the second tip 112C are positioned to the left (second side). Of course, the first tip 111C and the second tip 112C may also be positioned to the right (first side) and closer to the lower right corner.

[0113] In this case as well, similar to the case in Figure 10(B), the side to which the first tip 111C of electrical contact 1C-1 is connected and the side to which the first tip 111C of electrical contact 1C-2 is connected are positioned opposite each other. In other words, the direction in which the first tips are shifted is opposite, and the sides to which the first tips are connected are positioned opposite each other. Of course, both first tips 111C are located in the center of the square electrode terminals 31-1 and 31-2.

[0114] By doing this, the side with the offset position of the first tip portion 111C is positioned opposite to the other, which allows for a larger gap between the guide hole 25-1 and the guide hole 25-2, and thus increases the wall thickness, preventing the wall from collapsing. [Explanation of Symbols]

[0115] 10: Probe card, 100: Connection unit, 2: Main board, 2a: First side of main board, 2b: Second side of main board, 4: Connection board, 41: Connection terminal, TE: Semiconductor testing equipment 1, 1A, 1B, 1C: Electrical contacts, 12: Main body, 111, 111A, 111B, 111C: First contact parts, 112, 112A, 112B, 112C: Second contact parts, 121: First connecting part, 122: Second connecting part, 123: Curved part, 21: First guide plate, 22: Second guide plate, 23: Third guide plate, 25 (25-1, 25-2): Guide hole, 200: Hollow region, 30: Semiconductor wafer, 31 (31-1, 31-2): Electrode terminals, 81: Drive unit, 82: Chuck, 82a: Surface of the chuck, 84: Electrode terminal, 9: Electrical contact, 92: Main body, 911: First contact part, 912: Second contact part, 921: First connecting part, 922: Second connecting part, 923: Curved part.

Claims

1. A main body, a plurality of electrical contacts having a first contact portion that contacts the electrode terminals of the object under test, and a second contact portion that connects to the connection terminals of the wiring board, Each of the aforementioned electrical contacts is provided with a first support plate having a plurality of support holes that support the vicinity of the first contact portion of the electrical contact, Each of the aforementioned electrical contacts is provided with a second support plate having a plurality of support holes that support the vicinity of the second contact portion of the electrical contact, Equipped with, The opening shape of the support hole in the first support plate and the second support plate is a shape corresponding to the cross-sectional shape of the electrical contact, At least the first support plate is Among the plurality of support holes, there are pairs of support holes that are adjacent to each other and each supports the electrical contact with the position of the first contact portion shifted to one side. The pair of support holes supports the electrical contacts with the first contact portions facing each other, with the offset directions of the first contact portions being opposite to each other. An electrical contact support structure characterized by the following:

2. The support holes in the first support plate and the second support plate are for supporting the electrical contacts having an irregular cross-section. Each pair of support holes adjacent to each other in a direction intersecting the deformation direction of the electrical contact supports the electrical contact having the first contact portion positioned off-center from the midpoint axis of the electrical contact having an irregular cross-section. The support structure for an electrical contact according to claim 1.

3. Of the pair of support holes, One of the support holes supports the first electrical contact whose first contact portion is offset from the central axis of the electrical contact towards the first side of the main body. The other support hole supports a second electrical contact whose first contact portion is offset from the central axis of the electrical contact to the second side opposite the first side of the main body. The pair of support holes supports the first side of the first electrical contact and the second side of the second electrical contact, facing each other. The support structure for an electrical contact according to feature 2.

4. The first support plate is, Among the plurality of support holes, there are pairs of support holes that are adjacent to each other in a direction intersecting the deformation direction of the electrical contact, and each pair supports the electrical contact with the position of the first contact portion shifted to one side. The pair of support holes supports the electrical contacts with the first contact portions facing each other, with the offset directions of the first contact portions being opposite to each other. The support structure for an electrical contact according to feature 2.

5. The support holes in the first support plate and the second support plate are for supporting the electrical contacts having a square cross-section. Each of the adjacent pairs of support holes supports the electrical contact having the first contact portion, which is positioned offset from the end axis of the electrical contact having a square cross-section. The support structure for an electrical contact according to claim 1.

6. The support holes in the first support plate and the second support plate support the electrical contact, which has a square shape in plan view, and is positioned to one corner of the main body, which has a square cross-section. Each pair of adjacent support holes supports the electrical contacts with their first contact portions facing each other, with the direction in which the first contact portion is shifted to the corner portion of the main body being opposite to the direction in which the first contact portion is shifted to the corner portion of the main body being opposite to each other. The support structure for an electrical contact according to claim 5.

7. The support holes in the first support plate and the second support plate support the electrical contacts, which have a rectangular shape in plan view of the first contact portion and are offset to connect with one of the sides of the main body portion which has a square cross-section. Each pair of adjacent support holes supports the electrical contact, which is positioned with the sides connecting the first contact portion facing each other. The support structure for an electrical contact according to claim 5.

8. The main body and A first contact portion is provided at one end of the main body portion and contacts the electrode terminals of the object to be inspected, A second contact portion is provided at the other end of the main body and connects to the connection terminals of the wiring board. Equipped with, The first contact portion and the second contact portion are each provided at a position offset from the longitudinal central axis of the electrical contactor. An electrical contact characterized by the following features.

9. The electrical contactor according to claim 8, characterized in that both the first contact portion and the second contact portion are located offset from the central axis toward the first side of the main body portion.

10. The electrical contactor according to claim 8, characterized in that one of the first contact portion and the second contact portion is located at a position offset from the central axis toward the first side of the main body portion, and the other is located at a position offset from the central axis toward the second side, which is the opposite side of the first side of the main body portion.

11. The cross-sectional shape of the main body is a rectangle having a short side and a long side. The main body is deformable in a direction that intersects with a second direction, which is parallel to the long side and perpendicular to a first direction, which is parallel to the short side. The electrical contact according to feature 8.

12. An electrical connection device that electrically connects an inspection device and an object to be inspected, A wiring board connected to the aforementioned inspection device, A connection unit having a plurality of electrical contacts that electrically contact the electrode terminals of the object under test and electrically connect the connection terminals of the wiring board and the electrode terminals of the object under test. Equipped with, The connection unit has an electrical contact support structure according to any one of claims 1 to 7. An electrical connection device characterized by the following features.

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