Film forming apparatus, film forming method, and article manufacturing method

Abstract

This technology offers advantages in preventing foreign matter from adhering to the upper surface of the mold. [Solution] The film forming apparatus forms a film by bringing a curable composition on a substrate into contact with a mold and curing the curable composition. The film forming apparatus includes a substrate holding part for holding the substrate, a mold holding part for holding the mold, a mold operating mechanism for placing the mold on the curable composition on the substrate, and a purification part for purifying the upper surface of the mold when the mold is placed on the curable composition on the substrate and the mold holding part is separated from the mold.

Description

Technical Field

[0001] The present invention relates to a film forming apparatus, a film forming method, and an article manufacturing method.

Background Art

[0002] There is a film forming apparatus that forms a film made of a cured product of a curable composition on a substrate by curing the curable composition while a mold is disposed on the substrate via the curable composition. For example, Patent Document 1 describes a planarizing apparatus that forms a planarizing film on a substrate by curing a curable composition while a mold is disposed on the substrate via the curable composition. More specifically, in this planarizing apparatus, after a mold is brought into contact with a curable composition on a substrate held by a substrate holding unit by a head driving unit, the mold holding unit is separated from the mold, and then the substrate holding unit holding the substrate is moved to an exposure unit. Thereafter, after the curable composition is cured in the exposure unit, the substrate holding unit is moved under the head driving unit, and the mold is separated from the cured product of the curable composition on the substrate by the head driving unit.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the film forming apparatus as described above, for example, when the mold holding unit is separated from the mold after the mold is brought into contact with a curable composition on a substrate held by a substrate holding unit by a head driving unit, the upper surface of the mold may be charged. Due to this charging, foreign matter may be attracted to the upper surface of the mold and adhere to the mold. If foreign matter adheres to the upper surface of the mold, poor holding may occur when the mold is held by the mold holding unit.

[0005] The present invention aims to provide a technology that is advantageous for preventing foreign matter from adhering to the upper surface of a mold. [Means for solving the problem]

[0006] One aspect of the present invention relates to a film forming apparatus for forming a film by bringing a curable composition on a substrate into contact with a mold and curing the curable composition, the film forming apparatus comprising a substrate holding part for holding the substrate, a mold holding part for holding the mold, a mold operating mechanism for placing the mold on the curable composition on the substrate, and a purification part for purifying the upper surface of the mold when the mold is placed on the curable composition on the substrate and the mold holding part is separated from the mold. [Effects of the Invention]

[0007] According to the present invention, an advantageous technique is provided for preventing foreign matter from adhering to the upper surface of the mold. [Brief explanation of the drawing]

[0008] [Figure 1] A schematic diagram showing the configuration and operation of a film forming apparatus according to one embodiment. [Figure 2] A schematic diagram showing the configuration and operation of a film forming apparatus according to one embodiment. [Figure 3] A schematic diagram showing the configuration and operation of a film forming apparatus according to one embodiment. [Figure 4] A schematic diagram showing the configuration and operation of a film forming apparatus according to one embodiment. [Figure 5] A schematic diagram showing the configuration and operation of a film forming apparatus according to one embodiment. [Figure 6] A diagram illustrating the general flow of the film formation process using a film formation apparatus. [Figure 7] A flowchart showing the flow of the film formation process using a film formation apparatus. [Modes for carrying out the invention]

[0009] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0010] In the following description and attached drawings, the shape of each component and the relative positions of multiple components are described according to the XYZ coordinate system. In the XYZ coordinate system, the XY plane can be the horizontal plane. The direction in which gravity acts on the mold or substrate is defined as the Z direction. The directions parallel to the X, Y, and Z axes in the XYZ coordinate system are defined as the X direction, Y direction, and Z direction, respectively, and the rotations around the X, Y, and Z axes are defined as θX, θY, and θZ, respectively. Control or driving related to the X, Y, and Z axes means control or driving related to the direction parallel to the X-axis, the Y-axis, and the Z-axis, respectively. Control or driving related to the θX, θY, and θZ axes means control or driving related to the rotation around the axis parallel to the X-axis, the Y-axis, and the Z-axis, respectively. Furthermore, position is information that can be determined based on the coordinates of the X, Y, and Z axes, while orientation is information that can be determined by the values ​​of the θX, θY, and θZ axes. Alignment means controlling the position and / or orientation.

[0011] Figures 1 to 5 schematically show an example configuration of a film forming apparatus 100 according to one embodiment. Figures 1 to 5 show different states of the film forming apparatus 100 according to one embodiment. The film forming apparatus 100 may be configured to form a film made of a cured product CP of a curable composition CM by bringing a mold 11 into contact with a curable composition CM on a substrate 1 and curing the curable composition CM. The mold 11 may have a first surface (bottom surface) 11a and a second surface (top surface) 11b. Thus, in the film forming apparatus 100 according to one embodiment, the first surface (bottom surface) 11a is located in the -Z direction relative to the second surface (top surface) 11b. The first surface 11a is the surface that contacts the curable composition CM and may be, for example, a flat surface, but may also have a pattern. When the first surface 11a is a flat surface, the film made of the cured product CP is understood as a planarization film, and the film forming apparatus 100 may be understood as a planarization apparatus.

[0012] The film forming apparatus 100 may include a first processing unit 101 and a second processing unit 102. The film forming apparatus 100 may also include a substrate transport mechanism (not shown) for transporting the substrate 1 and a mold transport mechanism (not shown) for transporting the mold 11. The film forming apparatus 100 may also include an interface unit 34 and a control unit 200.

[0013] In the first processing unit 101, a coating step may be performed in which a curable composition CM is applied onto the substrate 1. In the second processing unit 102, a film forming step may be performed in which a film is formed on the substrate 1 after the coating step. The film forming step may include a first operation step in which a laminated structure ST consisting of the substrate 1, the curable composition CM, and the mold 11 is formed by placing the mold 11, held by the mold holding unit 12, onto the curable composition CM on the substrate 1, and then the mold holding unit 12 is separated from the mold 11. The film forming step may also include a curing step in which the curable composition CM of the laminated structure ST is cured by applying curing energy CE to the curable composition CM after the first operation step, and a separation step in which the mold 11 is separated from the laminated structure ST after the curing step.

[0014] A curable composition CM is a composition that hardens when a hardening energy CE is applied. The hardening energy CE can be electromagnetic waves, heat, etc. Electromagnetic waves may be, for example, infrared light, visible light, ultraviolet light, etc., with wavelengths selected from the range of 10 nm to 1 mm. A curable composition CM may also be understood as a composition that hardens by light irradiation or heating. A photocurable composition that hardens by light contains a polymerizable compound and a photopolymerization initiator, and may optionally contain a non-polymerizable compound or a solvent. The non-polymerizable compound is at least one selected from the group consisting of sensitizers, hydrogen donors, internal release agents, surfactants, antioxidants, polymer components, etc. The curable composition is applied to a substrate in a film-like manner by a spin coater or slit coater. Alternatively, the curable composition CM may be applied to a substrate by a liquid spray head in the form of droplets, islands formed by multiple connected droplets, or a film. The viscosity of the curable composition (viscosity at 25°C) is, for example, 1 mPa·s to 100 mPa·s. The curable composition CM may be a monomer such as acrylate or methacrylate.

[0015] Substrate 1 is typically a silicon wafer, but is not limited to this. Substrate 1 can be arbitrarily selected from among those known as semiconductor device substrates, such as aluminum, titanium-tungsten alloy, aluminum-silicon alloy, aluminum-copper-silicon alloy, silicon oxide, and silicon nitride. Substrate 1 may also be a substrate in which an adhesion layer has been formed by surface treatments such as silane coupling treatment, silazane treatment, or organic thin film deposition to improve adhesion with the curable composition. Substrate 1 is typically circular with a diameter of 300 mm, but is not limited to this.

[0016] When light is used as the curing energy CE, mold 11 is made of a material that transmits light. For example, mold 11 is made of at least one of the following: a light-transmitting resin such as glass, quartz, PMMA (Polymethylmethacrylate), or polycarbonate resin; a transparent metal vapor-deposited film; a flexible film such as polydimethylsiloxane; a photocurable film; and a metal film. It is preferable, but not limited to, that mold 11 has the same dimensions and shape as the substrate 1 (for example, a circle with a diameter of 300 mm). Also, the thickness of mold 11 may be 0.25 mm or more and less than 2 mm in one example, but is not limited to this.

[0017] The first processing unit 101 may include, for example, a base unit 40, a plurality of support columns 41, a top plate 43, a substrate holding unit 45, a substrate stage 46, a substrate stage drive unit 47, and a dispenser 48. The base unit 40 supports the substrate stage 46 and the substrate stage drive unit 47, and may also support the top plate 43 via the plurality of support columns 41. The top plate 43 may support the dispenser 48. The substrate holding unit 45 includes a chuck such as a vacuum chuck or an electrostatic chuck, and holds the substrate 1 by the chuck. The substrate stage 46 is supported by the base unit 40 and holds the substrate holding unit 45. The substrate stage 46 may also be driven in the X-axis and Y-axis directions to position the substrate 1 held by the substrate holding unit 45 at a target position. The substrate stage drive unit 47 includes, for example, a linear motor and / or an air cylinder, and may drive the substrate stage 46 in at least the X-axis and Y-axis directions. The substrate stage drive unit 47 may include a rotation mechanism and drive the substrate holding unit 45 with respect to the θZ axis. The substrate stage drive unit 47 may also have the function of driving the substrate stage 46 with respect to more axes (e.g., 6 or more axes).

[0018] The dispenser 48 can be configured to apply or dispose the curable composition CM onto the substrate 1 held by the substrate holding part 45. In one example, while the substrate 1 is being driven by the substrate stage driving part 47, the dispenser 48 discharges droplets of the curable composition CM, whereby a plurality of droplets of the curable composition CM can be applied or disposed onto the substrate 1. The dispenser 48 can have, for example, one or more discharge ports (nozzles) for discharging the curable composition CM. The dispenser 20 can supply droplets of the curable composition with a minute volume (for example, 1 picoliter) onto the substrate 1 by a method such as a piezo jet method or a microsyringe method. In one example, the dispenser 20 can have 100 or more discharge ports. The arrangement of such a plurality of discharge ports is arranged, for example, in one or more lines.

[0019] The second processing unit 102 can include, for example, a base part 5, a plurality of support columns 6, a top plate 7, a substrate holding part 2, a substrate stage 4, and a substrate driving mechanism 31. The substrate holding part 2 includes a chuck such as a vacuum chuck or an electrostatic chuck, and holds the substrate 1 by the chuck. The substrate stage 4 is supported by the base part 5 and holds the substrate holding part 2. Further, the substrate stage 4 can be driven in the X-axis direction and the Y-axis direction in order to position the substrate 1 held by the substrate holding part 2 at a target position. The substrate driving mechanism 31 includes, for example, a linear motor and / or an air cylinder, and can drive the substrate stage 4 at least in the X-axis direction and the Y-axis direction. The substrate driving mechanism 31 can include a rotation mechanism and drive the substrate holding part 2 with respect to the θZ axis. The substrate driving mechanism 31 can have a function of driving the substrate stage 4 with respect to more axes (for example, 6 axes or more).

[0020] The second processing unit 102 may also include a mold manipulation mechanism 30. The mold manipulation mechanism 30 may have, for example, a mold holding unit 12 that holds a mold 11 and may be operative to place the mold 11 on the curable composition CM on the substrate 1. Further, the mold manipulation mechanism 30 may separate the mold holding unit 12 from the mold 11 after placing the mold 11 on the curable composition CM on the substrate 1. Also, the mold manipulation mechanism 30 may separate the mold 11 from the cured product CP of the curable composition CM on the substrate 1. The mold manipulation mechanism 30 may include a guide bar plate 8, a guide bar 9, a head drive unit 10, a mold holding unit 12, and a head 13.

[0021] The mold holding unit 12 includes a chuck such as a vacuum chuck or an electrostatic chuck and holds the mold 11 by the chuck. The head 13 holds and drives the mold holding unit 12. The head drive unit 10 drives the mold holding unit 12 by driving the head 13, thereby driving the mold 11. The head drive unit 10 may be configured to drive the mold 11 with respect to a plurality of axes.

[0022] The guide bar 9 is disposed to penetrate the top plate 7. One end of the guide bar 9 may be fixed to the guide bar plate 8, and the other end may be fixed to the head 13. The head drive unit 10 may drive the head 13 in the Z-axis direction by driving the guide bar 9. Thereby, the mold 11 held by the mold holding unit 12 can be brought into contact with the curable composition CM on the substrate 1 or the mold 11 can be separated from the cured product CP of the curable composition CM on the substrate 1. The head drive unit 10 may include a mechanism for driving the head 13 with respect to axes other than the Z-axis. Alternatively, the head drive unit 10 may include a mechanism for driving the head 13 with respect to a plurality of axes (for example, three axes of θX-axis, θY-axis, and Z-axis, or six axes of X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis).

[0023] The second processing unit 102 may also include an off-axis alignment (OA) scope 21, an alignment scope 22, a hardening unit 23, a purification unit 33, and a detection unit 300. The alignment scope 22 may include an optical system and imaging system for observing a reference mark provided on the substrate stage 4 and an alignment mark provided on the mold 11. The alignment scope 22 may be used for alignment to correct misalignment of the mold 11 by measuring the relative position of the reference mark provided on the substrate stage 4 and the alignment mark provided on the mold 11. The detection unit 35 may be used to detect a reference position such as a notch or orientation flat on the substrate 1 held by the substrate holding unit 2. Specifically, the detection unit 35 may be an optical sensor for detecting the outline profile of the substrate 1, or a camera for acquiring the shape of the substrate 1.

[0024] The curing unit 23 cures the curable composition CM in the laminated structure ST by applying curing energy CE (e.g., light such as UV light) to the curable composition CM. This can form a film consisting of the cured product CP of the curable composition CM. Here, the mold operating mechanism 30 may be located at a first position P1, and the curing unit 23 may be located at a second position P2, which is away from the first position P1. The substrate holding unit 2 (substrate stage 4) may be configured to move between a plurality of positions, including the first position P1 and the second position P2. The mold operating mechanism 30 may operate the mold 11 to separate it from the laminated structure ST held by the substrate holding unit 2, which has moved from the second position P2 to the first position P1.

[0025] The OA scope 21 is supported by the top plate 7. The OA scope 21 can be used in a global alignment process to detect alignment marks provided in multiple shot areas of the substrate 1 and determine the position of each of the multiple shot areas. By determining the positional relationship between the mold 11 and the substrate stage 4 using the alignment scope 22, and the positional relationship between the substrate stage 4 and the substrate 1 using the OA scope 21, relative alignment between the mold 11 and the substrate 1 can be performed.

[0026] The purification unit 33 may be configured and positioned to purify the upper surface 11b of the mold 11 (the surface held by the mold holding unit 12) when the mold holding unit 12 is separated from the mold 11. The meaning of purification is broadly interpreted and includes, for example, removing foreign matter such as particles from the object to be purified (in this example, the upper surface 11b of the mold 11), as well as removing any electric charge accumulated on the object to be purified. The purification unit 33 may include, for example, an irradiation unit that irradiates the upper surface 11b of the mold 11 with ultraviolet light. The purification unit 33 may include, for example, an ionizer. The purification unit 33 may include, for example, an irradiation unit that irradiates the upper surface 11b of the mold 11 with ultraviolet light, and an ionizer. Alternatively, the purification by the purification unit 33 may include at least one of wet cleaning, plasma cleaning, and vacuum suction. The objects to be purified by the purification unit 33 may include the mold holding surface of the mold holding unit 12 and the substrate holding surface of the substrate holding unit 2. The purification unit 33 may be located at a third position P3 between the first position P1 and the second position P2.

[0027] The film forming apparatus 100 may further include more purification units, for example, a second purification unit 36. The second purification unit 36 ​​may be arranged such that, for example, a first position P1 is located between the second purification unit 36 ​​and a second position P2. The second purification unit 36 ​​may include, for example, an ionizer. The second purification unit 36 ​​may include, for example, an irradiation unit that irradiates ultraviolet light onto at least one of the mold holding surface of the mold holding unit 12 and the upper surface 11b of the mold 11. Alternatively, the second purification unit 36 ​​may include, for example, an irradiation unit that irradiates ultraviolet light onto the mold holding surface of the mold holding unit 12. Alternatively, the purification by the second purification unit 36 ​​may include at least one of wet cleaning, plasma cleaning, and vacuum suction. The object to be purified by the second purification unit 36 ​​may include the substrate holding surface of the substrate holding unit 2.

[0028] The upper surface 11b of the mold 11 and the mold holding surface of the mold holding part 12 are considered to be areas in the film forming apparatus 100 where foreign matter is likely to be generated due to friction between the upper surface 11b of the mold 11 and the mold holding surface of the mold holding part 12. Furthermore, the upper surface 11b of the mold 11 and the mold holding surface of the mold holding part 12 are areas that are easily charged by the above friction, and foreign matter may be attracted to and adhere to the upper surface 11b of the mold 11 and the mold holding surface of the mold holding part 12 due to the charging.

[0029] If foreign matter adheres to the upper surface 11b of the mold 11 and curing energy CE is applied to the curable composition CM through the mold 11 to cure the curable composition CM, curing defects may occur in areas hidden by the foreign matter. In this case, the quality of the film formed by the cured product CP of the curable composition CM may be insufficient. Furthermore, if curing defects occur, uncured curable composition CM may remain on the side of the mold 11 during the separation process, potentially causing problems when processing the next substrate 1.

[0030] If foreign matter adheres to the mold holding surface of the mold holding part 12 and the mold holding part 12 holds the mold 11, the foreign matter may get trapped between the mold holding surface of the mold holding part 12 and the mold 11, which may affect the shape of the lower surface 11a of the mold 11 (for example, it may affect the flatness of the lower surface 11a of the mold 11).

[0031] The control unit 200 includes a processing unit and a storage unit such as memory, and controls the entire film deposition apparatus 100. For example, it may consist of a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), or an A SIC (Application Specific Integrated Circuit), or a general-purpose or dedicated computer with a program installed, or a combination of all or some of these. The control unit 200 comprehensively controls the above-mentioned multiple components of the film deposition apparatus 100.

[0032] To facilitate understanding of the operation of the film forming apparatus 100, the flow of the film forming process by the film forming apparatus 100 will be briefly explained with reference to Figure 6. In the example described below, the substrate 1 has a base pattern 1a. First, as schematically shown in Figure 6(a), a plurality of droplets of the curable composition CM can be applied or placed on the substrate 1 (base pattern 1a) by the dispenser 48. Next, as schematically shown in Figures 6(a) and (b), the mold operating mechanism 30 brings the lower surface 11a of the mold 11 into contact with the plurality of droplets of the curable composition CM on the substrate 1 (base pattern 1a). By waiting for a suitable amount of time to pass in this state, the curable composition CM fills the space between the upper surface of the substrate 1 (base pattern 1a) and the lower surface 11a of the mold 11, and a liquid film of the composition CM is formed. Next, as schematically shown in Figures 6(b) and (c), a film made of the cured product CP of the curable composition CM is formed by applying curing energy to the curable composition CM with the curing unit 23. The curing unit 23 can apply curing energy to the curable composition CM, for example, through the mold 11. Then, as schematically shown in Figure 6(c), the mold 11 is separated from the film made of the cured product CP of the curable composition CM by the mold operating mechanism 30.

[0033] The following outlines the flow of the film formation process performed by the second processing unit 102 of the film formation apparatus 100 with reference to Figures 1, 2, 3, 4, 5, and 7. This film formation process is controlled by the control unit 200. First, in step S701, the mold 11 is loaded into the mold holding unit 12 by a mold transport mechanism (not shown), and the mold 11 is held by the mold holding unit 12 as shown in Figure 1. In step S702, the substrate 1 coated with the curable composition CM in the first processing unit 101 is loaded into the substrate holding unit 2 of the second processing unit 102 by a substrate transport mechanism (not shown), and the substrate 1 is held by the substrate holding unit 2 as shown in Figure 1. In step S703, the mold 11 is lowered by the mold operating mechanism 30, bringing the curable composition CM on the substrate 1 into contact with the lower surface 11a of the mold 11 (contact step). This forms a laminated structure ST consisting of the substrate 1, the curable composition CM, and the mold 11.

[0034] In step S704, the mold holding unit 12 may release the mold 11 from being held. In step S705, the purification unit 33 is activated, which may cause the purification unit 33 to start operating. Similarly, in step S705, the second purification unit 36 ​​is activated, which may cause the second purification unit 36 ​​to start operating. In step S706, the mold holding unit 12 is separated from the mold 11, which is placed on the substrate 1 via the curable composition CM, by raising the mold 11 with the mold operating mechanism 30. In this state, the upper surface 11b of the mold 11, which is placed on the substrate 1 via the curable composition CM, is exposed, so the upper surface 11b of the mold 11 may be purified by the purification unit 33 and the second purification unit 36.

[0035] Steps S703 and S706 can be understood as operation steps to separate the mold holder 12 from the mold after forming a laminated structure ST consisting of substrate 1 / curable composition CM / mold 11 by placing the mold 11 held by the mold holder 12 onto the curable composition on the substrate 1. Step S708 can be understood as a curing step to cure the curable composition CM of the laminated structure ST by applying curing energy CE to the curable composition CM after the operation steps. Step S712 can be understood as a separation step to separate the mold 11 from the laminated structure ST after the curing steps. The period after step S705 and before step S711 can be understood as a purification step to purify the upper surface 11b of the mold 11 after step S706 (operation steps) and before step S712 (separation steps).

[0036] In step S707, as shown in Figure 3, the substrate drive mechanism 31 moves the substrate stage 4 from the first position P1 to the second position P2 via the third position P3. As a result, the laminated structure ST held by the substrate holder 2 mounted on the substrate stage 4 also moves from the first position P1 to the second position P2 via the third position P3. The purification unit 33 is positioned at the third position P3, and when the laminated structure ST held by the substrate holder 2 mounted on the substrate stage 4 moves from the first position P1 to the second position P2 via the third position P3, the upper surface of the laminated structure ST, i.e., the upper surface 11b of the mold 11, can be purified. The second purification unit 36 ​​may be positioned to purify the mold holding surface (lower surface) of the mold holding unit 12, and the mold holding surface (lower surface) of the mold holding unit 12 can be purified by the second purification unit 36 ​​while exposed to the space below.

[0037] The substrate holding unit 2 may be driven by the substrate driving mechanism 31 to temporarily stop at the third position P3 when moving from the first position P1 to the second position P2. This can improve the efficiency of purifying the upper surface 11b of the mold 11 held by the substrate holding unit 2. Alternatively, the substrate holding unit 2 may move continuously from the first position P1 to the second position P2. This is advantageous for improving the throughput of processing the substrate 1. The area that the purification unit 33 can purify is preferably larger than the mold 11. When the substrate holding unit 2 is moved continuously from the first position P1 to the second position P2, the driving speed of the substrate holding unit 2 by the substrate driving mechanism 31 may be, for example, 500 mm / second or more and 1000 mm / second or less. When the purification unit 33 is composed of an ionizer, the distance between the ionizer and the structure ST may be, for example, 10 mm or more and 300 mm or less, and the irradiation angle may be 150 degrees or more.

[0038] In step S708, as shown in Figure 4, the curing unit 23 applies curing energy CE to the curable composition CM of the laminated structure ST located at the second position P2 via the mold 11, thereby curing the curable composition CM (curing step). This forms a film consisting of the cured product CP of the curable composition CM.

[0039] In step S709, as shown in Figure 5, the substrate drive mechanism 31 moves the substrate stage 4 from the second position P2 to the first position P1 via the third position P3. As a result, the laminated structure ST held by the substrate holding part 2 mounted on the substrate stage 4 also moves from the second position P2 to the first position P1 via the third position P3. The purification unit 33 may be located at the third position P3. In this case, when the laminated structure ST held by the substrate holding part 2 mounted on the substrate stage 4 moves from the first position P1 to the second position P2 via the third position P3, the upper surface of the laminated structure ST, i.e., the upper surface 11b of the mold 11, is purified.

[0040] The substrate holder 2 may be driven by the substrate drive mechanism 31 to temporarily stop at the third position P3 when moving from the second position P2 to the first position P1. This can improve the efficiency of cleaning the upper surface 11b of the mold 11 held by the substrate holder 2. Alternatively, the substrate holder 2 may move continuously from the second position P2 to the first position P1. This is advantageous for improving the throughput of processing the substrate 1.

[0041] In step S710, the mold holding part 12 is lowered by the mold operating mechanism 30, bringing the mold 11 of the laminated structure ST into contact with the mold holding part 12, and the mold 11 is held by the mold holding part. In step S711, the purification part 33 is deactivated, and the purification part 33 may stop operating. Similarly, in step S711, the second purification part 36 is deactivated, and the second purification part 36 may stop operating. In step S712, the mold 11 is raised by the mold operating mechanism 30, separating the mold 11 from the structure ST (a film consisting of a cured film CP of a curable composition CM on the substrate 1) (separation step).

[0042] In step S713, the substrate 1 is unloaded from the substrate holding unit 2. In step S714, it is determined whether there is another substrate 1 to be processed. If there is another substrate 1 to be processed, steps S702 to S713 are performed for that substrate 1. On the other hand, if there is no other substrate 1 to be processed, in step S715, the mold 11 is unloaded from the mold holding unit 12.

[0043] In the example shown in Figure 7, the purification unit 33 is activated between steps S704 and S706, and deactivated between steps S710 and S712. However, the purification unit 33 may be activated between the time the mold 11 is placed on the curable composition CM on the substrate 1 at the first position P1, and the time the laminated structure ST moves from the second position P2 to the first position P1. Also, the purification unit 33 may be deactivated between the time the substrate holding unit 2 moves from the second position P2 to the first position P1, and the time a new substrate 1 is placed on the substrate holding unit 2 in place of the substrate 1 held by the substrate holding unit 2. Furthermore, the second purification unit 36 ​​may be activated between the time the mold 11 is placed on the curable composition CM on the substrate 1 at the first position P1, and the time the laminated structure ST moves from the second position P2 to the first position P1. Furthermore, the second purification unit 36 ​​may be deactivated between the time the substrate holding unit 2 moves from the second position P2 to the first position P1, and the time a new substrate 1 is placed on the substrate holding unit 2 in place of the substrate 1 held by the substrate holding unit 2.

[0044] The purification unit 33 may remain in an active state during the process of forming a hardened film on multiple substrates 1, but it may also be repeatedly activated and deactivated as described above, thereby reducing power consumption and extending the lifespan of the purification unit 33. Similarly, the second purification unit 36 ​​may remain in an active state during the process of forming a hardened film on multiple substrates 1, but it may also be repeatedly activated and deactivated as described above, thereby reducing power consumption and extending the lifespan of the second purification unit 36.

[0045] The following describes a method for manufacturing articles using a film forming apparatus 100. The article manufacturing method may include a film forming step of forming a film on a substrate 1 using the film forming apparatus 100, and a processing step of processing the substrate 1 after the film forming step to obtain an article. The processing step may include, for example, a photolithography step, an etching step, other film forming steps, a dicing step, a sealing step, etc.

[0046] This specification and accompanying drawings include the following disclosures: (Item 1) A film forming apparatus that forms a film by bringing a curable composition on a substrate into contact with a mold and curing the curable composition, A substrate holding portion for holding the substrate, A mold operating mechanism having a mold holding portion for holding the mold, and for placing the mold on the curable composition on the substrate, A mold is placed on the curable composition on the substrate, and a purification unit cleans the upper surface of the mold while the mold holding unit is separated from the mold, A film forming apparatus characterized by comprising the following: (Item 2) The system further comprises a curing unit that cures the curable composition by applying curing energy to the curable composition in a laminated structure consisting of the substrate, the curable composition, and the mold. The film forming apparatus according to item 1, characterized by the features described above. (Item 3) The hardening section is located at a second position, away from the first position where the mold operating mechanism is located. The substrate holding portion is movable between a plurality of positions, including the first position and the second position. A film forming apparatus according to item 2, characterized in that it is a film forming apparatus. (Item 4) The mold operating mechanism operates the mold in such a way that it separates the mold from the laminated structure held by the substrate holding portion that has moved from the second position to the first position. A film forming apparatus as described in item 3, characterized by the features described herein. (Item 5) The purification unit is located at a third position between the first position and the second position. The film forming apparatus according to item 4, characterized by the features described herein. (Item 6) The purification unit includes an irradiation unit that irradiates ultraviolet light onto the upper surface. A film forming apparatus as described in item 5, characterized by the features described herein. (Item 7) The purification unit further includes an ionizer. A film forming apparatus according to item 6, characterized by the features described therein. (Item 8) The purification unit is activated between the time the mold is placed on the curable composition on the substrate at the first position and the time the laminated structure moves from the second position to the first position. A film forming apparatus according to item 6, characterized by the features described therein. (Item 9) The purification unit is deactivated between the time the substrate holding unit moves from the second position to the first position and the time a new substrate is placed on the substrate holding unit in place of the substrate held by the substrate holding unit. A film forming apparatus as described in item 8, characterized by the features described herein. (Item 10) The purification unit is activated between the time the mold is placed on the curable composition on the substrate at the first position and the time the laminated structure moves from the second position to the first position. A film forming apparatus as described in item 7, characterized by the features described herein. (Item 11) The purification unit is deactivated between the time the substrate holding unit moves from the second position to the first position and the time a new substrate is placed on the substrate holding unit in place of the substrate held by the substrate holding unit. A film forming apparatus according to item 10, characterized by the features described herein. (Item 12) The area that the purification unit can purify is larger than the mold. A film forming apparatus according to any one of items 5 to 11, characterized in that it is a film forming apparatus. (Item 13) The substrate holding portion temporarily stops at the third position when moving from the first position to the second position. A film forming apparatus according to item 12, characterized by the features described herein. (Item 14) The substrate holding portion moves continuously from the first position to the second position. A film forming apparatus according to item 12, characterized by the features described herein. (Item 15) The substrate holding portion temporarily stops at the third position when moving from the second position to the first position. A film forming apparatus according to item 12, characterized by the features described herein. (Item 16) The substrate holding portion moves continuously from the second position to the first position. A film forming apparatus according to item 12, characterized by the features described herein. (Item 17) The system further includes a second purification unit for purifying the substrate holding unit and the mold holding unit. The first position is positioned between the second purification unit and the second position. A film forming apparatus according to any one of items 3 to 16, characterized by the features described herein. (Item 18) The second purification unit includes an ionizer, A film forming apparatus as described in item 17, characterized by the features described herein. (Item 19) A film formation step in which a film is formed on a substrate using a film formation apparatus described in any one of items 1 to 17, A processing step to obtain an article by processing the substrate that has undergone the film formation step, A method for manufacturing articles, characterized by including the following: (Item 20) A film forming method comprising bringing a curable composition on a substrate into contact with a mold and curing the curable composition to form a film, A process comprising: 1. A mold held by a mold holding part is placed on top of the curable composition on the substrate to form a laminated structure consisting of the substrate, the curable composition, and the mold, and 2. A third step is to separate the mold holding part from the mold. A curing step is performed after the above operating step by applying curing energy to the curable composition of the laminated structure to cure the curable composition, A separation step is performed after the curing step to separate the mold from the laminated structure, A purification step, which cleans the upper surface of the mold after the operation step and before the separation step, A film formation method characterized by including the following. (others) The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of symbols]

[0047] 100: Film forming apparatus, 101: First processing unit, 102: Second processing unit, 2: Substrate holding unit, 4: Substrate stage, 11: Mold, 12: Mold holding unit, 33: Purification unit, 36: Second purification unit,

Claims

1. A film forming apparatus that forms a film by bringing a curable composition on a substrate into contact with a mold and curing the curable composition, A substrate holding portion for holding the substrate, A mold operating mechanism having a mold holding portion for holding the mold, and for placing the mold on the curable composition on the substrate, A mold is placed on the curable composition on the substrate, and a purification unit cleans the upper surface of the mold while the mold holding unit is separated from the mold, A film forming apparatus characterized by comprising the following:

2. The system further comprises a curing unit that cures the curable composition by applying curing energy to the curable composition in a laminated structure consisting of the substrate, the curable composition, and the mold. The film forming apparatus according to feature 1.

3. The hardening section is located at a second position, away from the first position where the mold operating mechanism is located. The substrate holding portion is movable between a plurality of positions, including the first position and the second position. The film forming apparatus according to feature 2.

4. The mold operating mechanism operates the mold in such a way that it separates the mold from the laminated structure held by the substrate holding portion that has moved from the second position to the first position. The film forming apparatus according to feature 3.

5. The purification unit is located at a third position between the first position and the second position. The film forming apparatus according to feature 4.

6. The purification unit includes an irradiation unit that irradiates ultraviolet light onto the upper surface. The film forming apparatus according to feature 5.

7. The purification unit further includes an ionizer. The film forming apparatus according to feature 6.

8. The purification unit is activated between the time the mold is placed on the curable composition on the substrate at the first position and the time the laminated structure moves from the second position to the first position. The film forming apparatus according to feature 6.

9. The purification unit is deactivated between the time the substrate holding unit moves from the second position to the first position and the time a new substrate is placed on the substrate holding unit in place of the substrate held by the substrate holding unit. The film forming apparatus according to feature 8.

10. The purification unit is activated between the time the mold is placed on the curable composition on the substrate at the first position and the time the laminated structure moves from the second position to the first position. The film forming apparatus according to feature 7.

11. The purification unit is deactivated between the time the substrate holding unit moves from the second position to the first position and the time a new substrate is placed on the substrate holding unit in place of the substrate held by the substrate holding unit. The film forming apparatus according to feature 10.

12. The area that the purification unit can purify is larger than the mold. The film forming apparatus according to feature 5.

13. The substrate holding portion temporarily stops at the third position when moving from the first position to the second position. The film forming apparatus according to feature 12.

14. The substrate holding portion moves continuously from the first position to the second position. The film forming apparatus according to feature 12.

15. The substrate holding portion temporarily stops at the third position when moving from the second position to the first position. The film forming apparatus according to feature 12.

16. The substrate holding portion moves continuously from the second position to the first position. The film forming apparatus according to feature 12.

17. The system further includes a second purification unit for purifying the substrate holding unit and the mold holding unit. The first position is positioned between the second purification unit and the second position. The film forming apparatus according to feature 3.

18. The second purification unit includes an ionizer, The film forming apparatus according to feature 17.

19. A film forming step of forming a film on a substrate using a film forming apparatus according to any one of claims 1 to 17, A processing step to obtain an article by processing the substrate that has undergone the film formation step, A method for manufacturing articles, characterized by including the following:

20. A film forming method comprising bringing a curable composition on a substrate into contact with a mold and curing the curable composition to form a film, A process comprising:

1. A mold held by a mold holding part is placed on top of the curable composition on the substrate to form a laminated structure consisting of the substrate, the curable composition, and the mold, and 2. The process of separating the mold holding part from the mold; A curing step is performed after the above operating step by applying curing energy to the curable composition of the laminated structure to cure the curable composition, A separation step is performed after the curing step to separate the mold from the laminated structure, A purification step, which cleans the upper surface of the mold after the operation step and before the separation step, A film formation method characterized by including the following.

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