Electromagnetic wave shielding laminate film, adhesive electromagnetic wave shielding laminate, method for manufacturing articles, method for manufacturing inverters, and method for manufacturing batteries

Abstract

According to this disclosure, a means may be provided for an electromagnetic wave shielding laminate film that is less prone to breakage when bonded to an object having a bent portion, and that achieves a high electromagnetic wave shielding effect when the object has a bent portion. [Solution] This disclosure relates to an electromagnetic wave shielding laminate film comprising a resin layer and a conductive layer, wherein the resin layer contains at least one compound selected from the group consisting of elastomers and cellulosic polymers and a magnetic material, the conductive layer contains a conductor, and the magnetic material comprises at least one selected from the group consisting of permalloy, ferrite and sendust, and the elongation at break at 170°C is 110% or more and 200% or less.

Description

Technical Field

[0001] The present invention relates to an electromagnetic wave shielding laminate film, an electromagnetic wave shielding laminate for adhesion, a method for manufacturing an article, a method for manufacturing an inverter, and a method for manufacturing a battery.

Background Art

[0002] Currently, communication is becoming faster and the amount of communication is increasing, and also, everything is being electrified. Especially in the automotive industry, where there is a change from gasoline vehicles to electrification and / or autonomous driving, significant changes are occurring in electromagnetic wave control. For example, due to the development of communication systems in the past compared to conventional ones, in sensing applications, millimeter-wave radars and / or CMOS sensors are beginning to be adopted. Also, with the electrification of automobiles, electromagnetic waves with relatively low frequencies generated from EV motors and / or electromagnetic waves with relatively low frequencies generated from around the inverter, which is a peripheral member, cause problems such as malfunction of other devices, effects on the human body, and / or large-area leakage.

[0003] Inverter housings have complex shapes, and as a method of post-attaching a film to a member having such a shape, a three-dimensional lamination method (TOM molding method) and the like are known.

[0004] Also, as a technique for controlling electromagnetic waves, from the viewpoint of corresponding to electromagnetic waves in various frequency bands, an electromagnetic wave control film including an electromagnetic wave absorber and a conductive substance layer laminated on one side thereof described in Patent Document 1, and an electromagnetic wave interference suppression sheet made of a resin composition containing conductive carbon and soft magnetic powder described in Patent Document 2 are considered.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

[0006] However, the electromagnetic wave control film described in Patent Document 1 often uses a metal layer as the conductive material layer, but such electromagnetic wave control films have the problem that they do not stretch well at the lamination process temperature, which leads to a decrease in shielding efficiency when laminating. In addition, with conventional electromagnetic wave shielding laminate films, including the electromagnetic wave control film described in Patent Document 1, when the film is laminated to the corners of the housing, wrinkles and air bubbles may form in the film, reducing the electromagnetic wave shielding effect. Furthermore, in the 3D lamination method, the film is heated and then depressurized, and the film is laminated to a housing with a complex shape while being stretched in a depressurized chamber, so that it conforms well to the shape of the housing. At this time, with conventional electromagnetic wave shielding laminate films, including the electromagnetic wave control film described in Patent Document 1, when the film is laminated while being stretched with heat, there is a problem that the film is prone to tearing due to the difficulty of stretching the conductive material layer. On the other hand, the electromagnetic interference suppression sheet described in Patent Document 2 has the problem that, because it is a single layer, it is difficult to increase the total addition ratio of conductive carbon and soft magnetic powder, making it difficult to improve the electromagnetic shielding effect.

[0007] Therefore, the present invention aims to provide a means for an electromagnetic wave shielding laminate film that is less prone to breakage when bonded to an object having a bent portion, and that achieves a high electromagnetic wave shielding effect when the object has a bent portion. [Means for solving the problem]

[0008] The inventors diligently studied to solve the above problems. In the process, they surprisingly discovered that the above problems could be solved when the electromagnetic wave shielding laminate film includes a resin layer and a conductive layer, the resin layer contains a specific compound and a specific magnetic material, and the electromagnetic wave shielding laminate film has a breaking elongation within a specific range, thus completing the present invention.

[0009] According to one aspect of the present invention, It includes a resin layer and a conductive layer, The resin layer contains at least one compound selected from the group consisting of elastomers and cellulosic polymers, and a magnetic material. The conductive layer contains a conductor, The magnetic material comprises at least one selected from the group consisting of permalloy, ferrite, and sendust. The elongation at break at 170°C is between 110% and 200%. Electromagnetic wave shielding laminate films may be provided. [Effects of the Invention]

[0010] According to one aspect of the present invention, it is possible to provide a means for an electromagnetic wave shielding laminate film that is less prone to breakage when bonded to an object having a bent portion, and that achieves a high electromagnetic wave shielding effect when the object has a bent portion. [Brief explanation of the drawing]

[0011] The advantages and features provided by one or more embodiments of the present invention will be better understood from the following detailed description and accompanying drawings, which are for illustrative purposes only and are not intended to define any limitations of the present invention. [Figure 1] Figure 1 is a schematic diagram illustrating the grid pattern to be printed on the film sample. [Figure 2] Figure 2 is a perspective view of the enclosure used in test method 1. [Figure 3] Figure 3 is a view of the housing shown in Figure 2, taken from the direction indicated by 3 in Figure 2, and is a front view when the surface viewed from the direction indicated by 3 in Figure 2 is considered the front. [Figure 4] Figure 4 is a view of the housing shown in Figure 2, taken from direction 4 in Figure 2, and is a left side view when the side taken from direction 3 in Figure 2 is considered the front. [Figure 5]FIG. 5 is a view of the housing shown in FIG. 2 as seen from the direction of 5 in FIG. 2, and is a right side view when the front view is taken from the direction of 3 in FIG. 2. [Figure 6] FIG. 6 is a view of the housing shown in FIG. 2 as seen from the direction of 6 in FIG. 2, and is a plan view (top view) when the surface viewed from the direction of 3 in FIG. 2 is taken as the front. [Figure 7] FIG. 7 is a view of the housing shown in FIG. 2 as seen from the direction of 7 in FIG. 2, and is a bottom view (bottom surface view) when the surface viewed from the direction of 3 in FIG. 2 is taken as the front. [Figure 8] FIG. 8 is a cross-sectional view at the position indicated by A-A of the housing shown in FIG. 3. [Figure 9] FIG. 9 is a schematic diagram of a metal plate jig for measuring the electromagnetic wave shielding effect.

MODE FOR CARRYING OUT THE INVENTION

[0012] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings as necessary. In the description of the drawings, the same reference numerals are given to the same elements, and duplicate descriptions are omitted. Also, the dimensional ratios in the drawings are exaggerated for the convenience of explanation and may be different from the actual ratios.

[0013] The present invention is not limited only to the following embodiments and can be variously modified within the scope of the claims. The embodiments described in this specification can be combined arbitrarily to form other embodiments.

[0014] In this specification, "X~Y" indicating a range means "X or more and Y or less". In this specification, "A and / or B" means each of A and B and combinations thereof. In this specification, unless otherwise specified, measurements of operations and physical properties are performed under the conditions of room temperature (20°C or more and 25°C or less) / relative humidity 40%RH or more and 50%RH or less.

[0015] In this specification, the term "(meth)acryl" includes both acryl and methacryl. For example, the term "(meth)acrylic elastomer" includes both acrylic elastomers and methacrylic elastomers. For example, the term "(meth)acrylic acid" includes both acrylic acid and methacrylic acid. For example, the term "(meth)acrylic acid ester" includes both acrylic acid esters and methacrylic acid esters. For example, the term "(meth)acrylate" includes both acrylates and methacrylates. For example, the term "(meth)acrylonitrile" includes both acrylonitrile and methacrylonitrile.

[0016] In this specification, the term "(co)polymer" includes both homopolymers and copolymers.

[0017] <Electromagnetic wave shielding laminate film> One aspect of the present invention is including a resin layer and a conductive layer, the resin layer contains at least one compound selected from the group consisting of an elastomer and a cellulose-based polymer and a magnetic material, the conductive layer contains a conductor, the magnetic material includes at least one selected from the group consisting of permalloy, ferrite, and sendust, the elongation at break at 170 °C is 110% or more and 200% or less, relates to an electromagnetic wave shielding laminate film.

[0018] <第 According to this aspect, in the electromagnetic wave shielding laminate film, it is possible to provide a means that hardly causes breakage when bonded to an object to be bonded having a bent portion, and realizes a high electromagnetic wave shielding effect when having a shape with a bent portion.

[0019] In the electromagnetic wave shielding laminate film according to this embodiment, since the resin layer and the conductive layer are separate layers, the magnetic material and the conductive material can be included in sufficient quantities compared to the case where both magnetic material and conductive material are added to a single layer. Therefore, it becomes easier to achieve a high electromagnetic wave shielding effect. Furthermore, since the electromagnetic wave shielding laminate film according to this embodiment is capable of moderate deformation, it is less likely to break when laminated to an object having a bent portion, and it is also less likely to deform to the point where a sufficient electromagnetic wave shielding effect cannot be obtained.

[0020] The resin layer and the conductive layer may be in contact with each other, or they may be laminated with one or more other layers in between.

[0021] The electromagnetic wave shielding laminate film according to this embodiment will be described in detail below.

[0022] [Resin layer] The resin layer contains at least one compound selected from the group consisting of elastomers and cellulosic polymers. That is, the resin layer contains a resin, and the resin contains at least one compound selected from the group consisting of elastomers and cellulosic polymers. In one embodiment, the resin layer preferably contains an elastomer or a cellulosic polymer. In one embodiment, the resin layer more preferably contains an elastomer. In one embodiment, the resin layer more preferably contains a cellulosic polymer.

[0023] In one embodiment, it is preferable that the resin layer does not contain polymers other than elastomers and cellulose-based polymers. In one embodiment, it is preferable that the resin layer does not contain polymers other than elastomers. In one embodiment, it is preferable that the resin layer does not contain polymers other than cellulose-based polymers. In one embodiment, it is preferable that the resin layer does not contain cellulose-based polymers. In one embodiment, it is preferable that the resin layer does not contain elastomers.

[0024] (Elastomer) The elastomer is not particularly limited. Preferred examples of elastomers include thermoplastic elastomers. Examples of thermoplastic elastomers are not particularly limited. Examples of thermoplastic elastomers include styrene elastomers, olefin elastomers, urethane elastomers, polyester elastomers, polyamide elastomers, (meth)acrylic elastomers, silicone elastomers, and derivatives thereof. The elastomer may be a single type or two or more types may be used in combination. The elastomer preferably contains a thermoplastic elastomer, more preferably contains at least one selected from the group consisting of the thermoplastic elastomers exemplified above, and even more preferably contains a (meth)acrylic elastomer.

[0025] The styrene-based elastomer is not particularly limited as long as it is a thermoplastic elastomer having structural units derived from a styrene-based compound. Preferred examples of styrene-based elastomers include thermoplastic elastomers having structural units derived from styrene. Examples of thermoplastic elastomers having structural units derived from styrene are not particularly limited. Examples of thermoplastic elastomers having structural units derived from styrene include hydrogenated styrene-butadiene-styrene block copolymers (SEBS, SBBS), hydrogenated styrene-isoprene-styrene block copolymers (SEPS), and styrene-maleic anhydride copolymers (SMA). The styrene-based elastomer may be used alone or in combination of two or more types.

[0026] The olefin-based elastomer is not particularly limited. Preferred examples of olefin-based elastomers include (co)polymers of α-olefins and copolymers of α-olefins and non-conjugated dienes. Specific examples of olefin-based elastomers are not particularly limited, but include ethylene-propylene copolymers (EPR) and ethylene-propylene-diene copolymers (EPDM). The olefin-based elastomer may be used alone or in combination of two or more types.

[0027] The urethane elastomer is not particularly limited. A preferred example of a urethane elastomer is one having a hard segment consisting of a low molecular weight (short chain) diol and a diisocyanate, and a soft segment consisting of a high molecular weight (long chain) diol and a diisocyanate. The urethane elastomer may be used alone or in combination of two or more types.

[0028] The polyester elastomer is not particularly limited. Preferred examples of polyester elastomers include those obtained by polycondensation of a dicarboxylic acid or its derivative with a diol compound or its derivative. Specific examples of polyester elastomers include multiblock copolymers in which the aromatic polyester portion is the hard segment and the aliphatic polyester portion is the soft segment. Examples of aromatic polyesters include polybutylene terephthalate. The polyester elastomer may be used alone or in combination of two or more types.

[0029] Polyamide elastomers are not particularly limited. Preferred examples of polyamide elastomers include those having a polyamide portion as a hard segment and further having a soft segment. Examples of compounds for constituting the soft segment include polybutadiene, butadiene-acrylonitrile copolymer, styrene-butadiene copolymer, polyisoprene, ethylene-propylene copolymer, polyether, polyester, polybutadiene, polycarbonate, polyacrylate, polymethacrylate, polyurethane, and silicone rubber. Polyamide elastomers may be used alone or in combination of two or more types.

[0030] The (meth)acrylic elastomer is not particularly limited. Preferred examples of (meth)acrylic elastomers include polymers obtained by polymerizing raw material monomers mainly composed of (meth)acrylic acid ester. In this specification, "raw material monomers mainly composed of (meth)acrylic acid ester" means that the mass of (meth)acrylic acid ester is the largest among the monomers used as raw material monomers. The ratio of the mass of (meth)acrylic acid ester to the total mass of the raw material monomer is preferably 50% by mass or more, more preferably 90% by mass or more, and even more preferably 100% by mass. Examples of (meth)acrylic acid esters are not particularly limited. Examples of (meth)acrylic acid esters include ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, methoxyethyl acrylate, methoxyethyl methacrylate, ethoxyethyl acrylate, ethoxyethyl methacrylate, etc. The (meth)acrylic acid ester may be used alone or in combination of two or more types. Specific examples of (meth)acrylic elastomers include (meth)acrylate (co)polymers, (meth)acrylonitrile-butyl (meth)acrylate copolymers, (meth)acrylonitrile-butyl (meth)acrylate-ethyl (meth)acrylate copolymers, and (meth)acrylonitrile-butyl (meth)acrylate-glycidyl (meth)acrylate copolymers. Preferred specific examples of (meth)acrylic elastomers include acrylonitrile-butyl acrylate copolymers, acrylonitrile-butyl acrylate-ethyl acrylate copolymers, acrylonitrile-butyl acrylate-glycidyl methacrylate copolymers, and methyl methacrylate-butyl acrylate copolymers. Examples of methyl methacrylate-butyl acrylate copolymers are not particularly limited, but include methyl methacrylate-n-butyl acrylate-methyl methacrylate triblock copolymers. (Meth)acrylic elastomers may be used alone or in combination of two or more types. The (meth)acrylic elastomer preferably contains at least one compound selected from the group consisting of the (meth)acrylic elastomers exemplified above.The (meth)acrylic elastomer more preferably contains a methyl methacrylate-butyl acrylate copolymer, and even more preferably contains a methyl methacrylate-n-butyl acrylate-methyl methacrylate triblock copolymer.

[0031] The silicone elastomer is not particularly limited. Preferred examples of silicone elastomers include those mainly composed of organopolysiloxanes. Silicone elastomers mainly composed of organopolysiloxanes are classified into polydimethylsiloxane-based, polymethylphenylsiloxane-based, polydiphenylsiloxane-based, etc., depending on the structure of their skeleton. Silicone elastomers may be used alone or in combination of two or more types.

[0032] The elastomer may be a modified elastomer. The modified elastomer is not particularly limited. Examples of modified elastomers include copolymer resins of the elastomer exemplified above and an acid anhydride. Examples of acid anhydrides are not particularly limited, but include maleic anhydride.

[0033] The elastomer is not particularly limited, but may have reactive functional groups at its molecular ends or in its molecular chains. Examples of reactive functional groups are not particularly limited, but include epoxy groups, hydroxyl groups, carboxyl groups, amino groups, amide groups, isocyanate groups, (meth)acryloyl groups, methacryloyl groups, vinyl groups, etc. The reactive functional group may be used alone or in combination of two or more types.

[0034] The weight-average molecular weight (Mw) of the elastomer is not particularly limited, but is preferably 5,000 or more. The Mw of the elastomer is more preferably 5,000 to 1,500,000, and even more preferably 20,000 to 1,000,000. The Mw of the elastomer is even more preferably 30,000 to 80,000, and particularly preferably 40,000 to 700,000.

[0035] The number-average molecular weight (Mn) and weight-average molecular weight (Mw) of elastomers can be measured using gel permeation chromatography (GPC) (on a standard polystyrene basis). The measurement conditions are as follows: (Measurement conditions) Solvent: tetrahydrofuran Guard column and column: TSK Guardcolumn HHR-L + TSKgel G4000HHR + TSKgel G2000HHR (all manufactured by Tosoh Corporation) Column temperature: 40℃ Column oven: L-655A-52 (manufactured by Hitachi High-Technologies Corporation) Sample concentration: 0.6% by mass Detector: L-3300 type RI (manufactured by Hitachi High-Technologies Corporation) Pump: L-6200 model (manufactured by Hitachi High-Technologies Corporation) Flow rate: 1.0mL / min.

[0036] In one embodiment, the elastomer is preferably a thermoplastic elastomer, and more preferably at least one thermoplastic elastomer selected from the group consisting of the thermoplastic elastomers exemplified above. In one embodiment, the elastomer is even more preferably a (meth)acrylic elastomer, and even more preferably at least one compound selected from the group consisting of the (meth)acrylic elastomers exemplified above. In one embodiment, the elastomer is even more preferably a methyl methacrylate-butyl acrylate copolymer, and particularly preferably a methyl methacrylate-n-butyl acrylate-methyl methacrylate triblock copolymer.

[0037] The elastomer may be a synthetic product, a commercially available product, or a combination of both. Examples of commercially available elastomers are not limited to, but include, for example, Clarity® LA4285 manufactured by Kuraray Co., Ltd.

[0038] (Cellulose-based polymer) The cellulose polymer may be a single type or a combination of two or more types. The cellulose polymer preferably contains a cellulose ester, and more preferably contains a cellulose acylate.

[0039] Specific examples of cellulose acylates are not particularly limited. Examples of cellulose acylates include cellulose acetate, cellulose acetate propionate, cellulose acetate butyrate, cellulose acetate benzoate, cellulose propionate, and cellulose butyrate. Examples of cellulose acetates are not particularly limited, but include cellulose triacetate (abbreviated as TAC). These cellulose acylates may be used individually or in combination of two or more. The cellulose polymer preferably contains at least one compound selected from the group consisting of the above specific examples, and more preferably contains cellulose triacetate.

[0040] The total degree of substitution of acetyl groups in cellulose acetate is preferably 2.00 to 3.00, and more preferably 2.60 to 3.00 (i.e., cellulose triacetate).

[0041] The cellulose polymer is preferably a cellulose ester, and more preferably a cellulose acylate. The cellulose polymer is even more preferably at least one compound selected from the group consisting of specific examples of the above-mentioned cellulose acylates, even more preferably a cellulose acetate, and particularly preferably a cellulose triacetate.

[0042] Furthermore, the unsubstituted portions of cellulose acylate typically exist as hydroxyl groups. Cellulose acylate can be synthesized by known methods.

[0043] The degree of substitution of acetyl groups and other acyl groups can be determined by the method specified in ASTM-D817-96.

[0044] The weight-average molecular weight (Mw) of the cellulose polymer is not particularly limited, but is preferably 75,000 or more, and more preferably 75,000 to 500,000. The Mw of the cellulose polymer is even more preferably 100,000 to 350,000, and particularly preferably 160,000 to 350,000.

[0045] The number-average molecular weight (Mn) and weight-average molecular weight (Mw) of cellulosic polymers can be measured using gel permeation chromatography (GPC). The measurement conditions are as follows: (Measurement conditions) Solvent: Dichloromethane Columns: Shodex K806, K805, K803G (all manufactured by Showa Denko Corporation; these three columns are used connected together.) Column temperature: 25℃ Sample concentration: 0.1% by mass Detector: RI Model 504 (manufactured by GL Sciences) Pump: L6000 (manufactured by Hitachi, Ltd.) Flow rate: 1.0mL / min Calibration curve: Standard polystyrene STK (manufactured by Tosoh Corporation). A calibration curve based on 13 samples with Mw values ​​ranging from 1,000,000 to 500 is used. The 13 samples are used at approximately equal intervals.

[0046] Cellulose polymers may be synthetic, commercially available, or used in combination.

[0047] (Content of at least one selected from the group consisting of elastomers and cellulosic polymers in the resin layer) The content of at least one compound selected from the group consisting of elastomers and cellulosic polymers in the resin layer is not particularly limited. Preferably, the content of at least one compound selected from the group consisting of elastomers and cellulosic polymers in the resin layer is 10% to 95% by volume relative to the total volume of the resin layer. More preferably, the content of at least one compound selected from the group consisting of elastomers and cellulosic polymers in the resin layer is 50% to 95% by volume relative to the total volume of the resin layer, and even more preferably, 55% to 90% by volume relative to the total volume of the resin layer. Particularly preferably, the content of at least one compound selected from the group consisting of elastomers and cellulosic polymers in the resin layer is 60% to 85% by volume relative to the total volume of the resin layer. The content of at least one compound selected from the group consisting of elastomers and cellulosic polymers in the resin layer may be 10% to 90% by volume relative to the total volume of the resin layer. When elastomers and cellulosic polymers are used in combination, the amount of at least one compound selected from the group consisting of elastomers and cellulosic polymers represents the total amount of these compounds. When two or more elastomers are used in combination, the amount of elastomer represents the total amount of each elastomer. When two or more cellulosic polymers are used in combination, the amount of cellulosic polymer represents the total amount of each cellulosic polymer.

[0048] (magnetic material) The resin layer contains a magnetic material, and the magnetic material includes at least one selected from the group consisting of permalloy, ferrite, and sendust. Preferably, the magnetic material includes permalloy, ferrite, or sendust. In one embodiment, the magnetic material may include at least one selected from the group consisting of ferrite and permalloy, or it may include ferrite or permalloy. In one embodiment, the magnetic material may include at least one selected from the group consisting of permalloy and sendust, or it may include permalloy or sendust. In one embodiment, the magnetic material may include permalloy. In one embodiment, the resin layer may contain ferrite. In one embodiment, the magnetic material may contain sendust. The magnetic material may be a single material or two or more materials may be used in combination.

[0049] The magnetic material is preferably in the form of particles. Permalloy, ferrite, and Sendust are each preferably in the form of particles.

[0050] Permalloy is not particularly limited. In this specification, permalloy refers to a Ni-Fe alloy. Permalloy may consist only of Ni and Fe, or it may further contain other metallic elements (metallic elements other than Ni and Fe) in addition to Ni and Fe. Examples of other metallic elements, but not particularly limited, include Mo, Cu, Cr, Nb, Ta, Si, Mn, etc. Permalloy may be a single type or a combination of two or more types.

[0051] Examples of permalloy are not particularly limited. Examples of permalloy include Fe-75~85%Ni, Fe-70~90%Ni-1~10%Cu, Fe-70~90%Ni-0.5~10%Cu-1~10%Mo, Fe-70~90%Ni-1~10%Mo, Fe-30~50%Ni, etc. Specific examples of permalloy are not particularly limited. Specific examples of permalloy include Fe-78.5%Ni, Fe-42~49%Ni, Fe-75~78%Ni-4~6%Cu, Fe-75~80%Ni-1~6%Cu-3~5%Mo, Fe-79~82%Ni-3.5~6%Mo, Fe-36%Ni, etc. In this paragraph, % represents mass%. These may be used individually or in combination of two or more types. The permalloy preferably contains at least one compound selected from the group consisting of the compounds exemplified above.

[0052] The ferrite is not particularly limited. In this specification, ferrite refers to ceramics whose main component is iron oxide. The ferrite may be a single type or two or more types may be used in combination.

[0053] Examples of ferrites are not particularly limited, but include Ni-Zn ferrite (nickel-zinc ferrite), Mn-Zn ferrite (manganese-zinc ferrite), etc. Examples of Mn-Zn ferrites are not particularly limited. Examples of Mn-Zn ferrites include compounds containing 51 to 58 mol% iron oxide (in terms of Fe2O3), 3 to 18 mol% zinc oxide (in terms of ZnO), and the remainder being manganese oxide (MnO). These may be used individually or in combination of two or more. The magnetic material preferably contains at least one compound selected from the group consisting of the compounds exemplified above, and more preferably contains Mn-Zn ferrite. In one embodiment, the magnetic material is preferably at least one compound selected from the group consisting of the compounds exemplified above, and more preferably Mn-Zn ferrite.

[0054] Sendust is not particularly limited. In this specification, sendust represents an Fe-Si-Al-based alloy. Sendust may consist only of Fe, Si, and Al, or may further contain other metal elements (metal elements excluding Fe, Si, and Al) in addition to Fe, Si, and Al. Examples of other metal elements are not particularly limited, but include Ni and the like. Sendust may be a single type or a combination of two or more types.

[0055] The mass ratio (%) of each component contained in the Fe-Si-Al-based alloy is not particularly limited. The mass ratio (%) of each component contained in the Fe-Si-Al-based alloy is preferably 82 < Fe < 86.5, 9.0 < Si < 11.0, and 4.5 < Al < 7.0. The mass ratio (%) of each component contained in the Fe-Si-Al-based alloy is more preferably 83 < Fe < 85.6, 9.4 < Si < 10.6, and 5.0 < Al < 6.4. The mass ratio (%) of other metal elements (metal elements excluding Fe, Si, and Al) in the Fe-Si-Al-based alloy may be less than 5.0%, may be less than 4.0%, or may be 0% (lower limit 0%). For example, the mass ratio (%) of Ni in the Fe-Si-Al-based alloy may be Ni < 5.0, may be Ni < 4.0, or may be Ni = 0 (lower limit 0%). In this paragraph, % represents mass%.

[0056] Examples of sendust are not particularly limited. Examples of sendust include Fe-9.0 to 11.0% Si-4.0 to 6.0% Al, Fe-5.0 to 7.0% Si-4.0 to 6.0% Al-0 to 2.0% Ni, and the like. Specific examples of sendust are not particularly limited. Specific examples of sendust include Fe-10% Si-5% Al, Fe-9.6% Si-5.4% Al, Fe-9.5% Si-5.5% Al, Fe-6.0% Si-4.0% Al-3.2% Ni, Fe-6.2% Si-5.4% Al-1.0% Ni, and the like. In this paragraph, % represents mass%. These may be a single type or a combination of two or more types. Sendust preferably contains at least one selected from the group consisting of the compounds exemplified above.

[0057] Sendust is preferably in the form of particles. Examples of the shape of Sendust are not particularly limited, but include flake-like particles. In this specification, flake-like particles refer to thin, plate-like particles resembling scales. Examples of flake-like particles are not particularly limited, but include flake-shaped and flattened particles. Examples of the planar shape of flake-like particles are not particularly limited, but include circular, elliptical, angular, and irregular shapes. The planar shape of flake-like particles is preferably circular or elliptical.

[0058] The magnetic material may be surface-treated particles obtained by surface-treating at least one particle selected from the group consisting of permalloy particles, ferrite particles, and sendust particles. Examples of surface-treated particles are not particularly limited, but include particles in which a silicon compound such as silica is coated on the surface of at least one particle selected from the group consisting of permalloy particles, ferrite particles, and sendust particles. The silicon compound can be easily formed using a silicon-based surface treatment agent. The silicon compound may also be an organic surface treatment agent.

[0059] In one embodiment, the magnetic material is preferably at least one selected from the group consisting of permalloy, ferrite, and sendust, and more preferably permalloy, ferrite, or sendust. In one embodiment, the magnetic material may be at least one selected from the group consisting of ferrite and permalloy, or it may be ferrite or permalloy. In one embodiment, the magnetic material may be at least one selected from the group consisting of permalloy and sendust, or it may be permalloy or sendust. In one embodiment, the magnetic material may be permalloy. In one embodiment, the magnetic material may be ferrite. In one embodiment, the magnetic material may be sendust.

[0060] The volume-based particle size D50 of the magnetic material is not particularly limited, but is preferably 1 μm or more and 100 μm or less, more preferably 10 μm or more and 80 μm or less, and even more preferably 20 μm or more and 70 μm or less. The volume-based particle size D50 of the magnetic material can be obtained, for example, as the particle size (D50) corresponding to 50% of the cumulative distribution curve when a volume-based particle size distribution is created in accordance with JIS R 1629:1997 using a particle size distribution analyzer (MT3000II, manufactured by Microtrac Bell).

[0061] The magnetic material may be a synthetic product, a commercially available product, or a combination of both. Examples of commercially available permalloy include, but are not limited to, AKT-PB5 manufactured by Mitsubishi Steel Works, Ltd. Examples of commercially available ferrite include, but are not limited to, LD-M manufactured by JFE Chemical Corporation. Examples of commercially available Sendust include, but are not limited to, GNPS-P-260 manufactured by POCO.

[0062] The amount of magnetic material in the resin layer is not particularly limited. Preferably, the amount of magnetic material in the resin layer is 5% to 90% by volume relative to the total volume of the resin layer. More preferably, the amount of magnetic material in the resin layer is 5% to 50% by volume relative to the total volume of the resin layer, and even more preferably, it is 10% to 45% by volume relative to the total volume of the resin layer. Particularly preferably, the amount of magnetic material in the resin layer is 15% to 40% by volume relative to the total volume of the resin layer. When two or more types of magnetic material are used in combination, the amount of magnetic material represents the sum of these amounts.

[0063] In one embodiment, it is preferable that the magnetic material is at least one selected from the group consisting of permalloy and sendust, and the content of the magnetic material in the resin layer is 5% by volume or more and 50% by volume or less of the total volume of the resin layer. In another embodiment, it is preferable that the magnetic material is at least one selected from the group consisting of permalloy and ferrite, and the content of the magnetic material in the resin layer is 15% by volume or more and 40% by volume or less of the total volume of the resin layer.

[0064] (Other ingredients) The resin layer may further contain components other than the elastomer, cellulose polymer, and magnetic material. That is, the resin layer may further contain one or more other components. The resin layer may consist only of the elastomer, cellulose polymer, and magnetic material. Examples of components other than the elastomer, cellulose polymer, and magnetic material include, but are not limited to, additives. Additives may be used alone or in combination of two or more.

[0065] (film thickness) The thickness of the resin layer is not particularly limited. Preferably, the thickness of the resin layer is 1 μm or more and 1,000 μm or less, more preferably 10 μm or more and 500 μm or less, and even more preferably 20 μm or more and 200 μm or less.

[0066] (Method for forming a resin layer) The method for forming the resin layer is not particularly limited. Examples of methods for forming the resin layer are not particularly limited, but include solution deposition and melt deposition. Known methods can be appropriately employed for both solution deposition and melt deposition.

[0067] Preferred examples of solution film formation methods include methods comprising the following (I), (II), and (III).

[0068] (I) A mixing step of preparing a coating solution for forming a resin layer, comprising at least one compound selected from the group consisting of elastomers and cellulosic polymers, and a magnetic material.

[0069] (II) A coating step of applying a coating solution for forming a resin layer onto a support.

[0070] (III) A drying step in which the coating liquid for forming a resin layer applied to the support is dried to form a resin layer.

[0071] The details of each step are explained below.

[0072] In the mixing step (I) described above, at least one compound selected from the group consisting of elastomers and cellulosic polymers is mixed with a magnetic material. The mixing step may further include mixing one or more other components as needed. A coating solution for forming a resin layer, which is a liquid mixture, may be prepared by blending at least one compound selected from the group consisting of elastomers and cellulosic polymers, a magnetic material, one or more other components as needed, and a solvent as needed, in predetermined ratios. Examples of solvents are not particularly limited, but include water, organic solvents, etc. Examples of organic solvents are not particularly limited, but include known organic solvents, etc. Specific examples of organic solvents are not particularly limited, but include methanol, ethanol, dichloromethane, benzene, toluene, xylene, methyl ethyl ketone, cyclohexanone, methyl isobutyl ketone, dichloromethane, etc. The organic solvent may be used alone or in combination of two or more.

[0073] In the coating step (II) described above, the resin layer forming coating solution prepared in the mixing step is applied to one surface of the support. Examples of coating methods for the resin layer forming coating solution are not particularly limited, but include coating methods using a coating coater and coating methods using a doctor blade. Examples of coating coaters are not particularly limited, but include slide coaters, slot die coaters, curtain coaters, roll coaters, bar coaters, gravure coaters, etc. At this time, it is preferable to adjust the coating thickness of the resin layer forming coating solution to a desired thickness. The support is not particularly limited. Examples of support are glass substrates, metal supports, base films, etc. Examples of base films are not particularly limited, but include films of the same type as the base film used as a support in the formation of the conductive layer described later. Examples of the thickness of the base film are not particularly limited, but include 1 μm to 1,000 μm. In one embodiment, when a base film is used to form the resin layer, the electromagnetic wave shielding laminate film may further contain the base film. Furthermore, when a base film is used as a support for forming the resin layer, the base film used for forming the resin layer and the base film used for forming the conductive layer, as described later, may be the same. In the coating process, when applying the coating solution for forming the resin layer to the support, a magnetic field may be applied to orient the magnetic material contained in the coating solution for forming the resin layer in a predetermined direction.

[0074] In the above (III) drying step, the resin layer forming coating liquid applied to the support is dried to remove the solvent. The drying temperature is not particularly limited. Drying may be carried out at room temperature or by heating. In the drying step, the curing reaction may be advanced by heating as needed. After peeling the sheet from the support, the sheet may be heated. It is preferable to heat the sheet to the boiling point of the solvent or a temperature near it. Examples of heating temperatures are not particularly limited, but include 80°C to 200°C, 80°C to 150°C, etc.

[0075] [Conductive layer] (conductor) The conductive layer contains a conductor. The conductor is not particularly limited. Examples of conductors include metals, metal oxides, inorganic substances other than metals and metal oxides, conductive polymers, and organic water-soluble salts. The conductor may be a single type or two or more types may be used in combination. The conductor preferably contains at least one selected from the group consisting of metals, metal oxides, inorganic substances other than metals and metal oxides, conductive polymers, and organic salts, and more preferably contains a conductive polymer. In one embodiment, the conductive layer is preferably a resin layer containing a conductive polymer.

[0076] Examples of metals include, but are not limited to, metal nanorods and metal nanowires. The metal may be used alone or in combination of two or more. Examples of metal oxides include indium tin oxide (ITO), tin oxide, antimond-doped tin oxide, zinc-doped tin oxide, and zinc oxide. The metal oxide may be used alone or in combination of two or more. Examples of inorganic substances other than metals and metal oxides include, but are not limited to, carbon nanotubes. The inorganic substances other than metals and metal oxides may be used alone or in combination of two or more. Examples of conductive polymers include, but are not limited to, PEDOT / PSS, polyaniline, polypyrrole, polythiophene, and polyisothianaphthene. Here, PEDOT / PSS is a composite material in which poly(3,4-ethylenedioxythiophene) (abbreviation: PEDOT) and polystyrene sulfonic acid (abbreviation: PSS) coexist. The conductive polymer may be used alone or in combination of two or more. The conductor preferably contains at least one compound selected from the group consisting of conductive polymers exemplified above, and more preferably contains PEDOT / PSS.

[0077] The weight-average molecular weight (Mw) of the conductive polymer is not particularly limited.

[0078] In one embodiment, the conductor is preferably a conductive polymer, more preferably at least one compound selected from the group consisting of the conductive polymers exemplified above, and even more preferably PEDOT / PSS.

[0079] The conductor may be a commercially available product, a synthetic product, or a combination of both. Examples of commercially available conductive polymers are not limited to Heraeus' product name H-1000.

[0080] The content of the conductor in the conductive layer is not particularly limited. Preferably, the content of the conductor in the conductive layer is 1% by mass or more and 100% by mass or less, relative to the total mass of the conductive layer. More preferably, the content of the conductor in the conductive layer is 5% by mass or more and 50% by mass or less, relative to the total mass of the conductive layer, and even more preferably, it is 10% by mass or more and 40% by mass or less, relative to the total mass of the conductive layer. When two or more types of conductors are used in combination, the amount of conductors represents the sum of these amounts.

[0081] (Other ingredients) The conductive layer may further contain components other than the conductor. That is, the conductive layer may further contain one or more other components. The conductive layer may consist only of a conductor. Examples of components other than the conductor are, but are not limited to, nonconductive polymers, latex, additives, etc. The nonconductive polymer may be a single type or two or more types may be used in combination. The latex may be a single type or two or more types may be used in combination. The additive may be a single type or two or more types may be used in combination. In one embodiment, the conductive layer may be a resin layer comprising at least one selected from the group consisting of nonconductive polymers, latex, and additives, and a conductor (preferably a conductive polymer).

[0082] (film thickness) The thickness of the conductive layer is not particularly limited. Preferably, the thickness of the conductive layer is 0.01 μm or more and 100 μm or less, more preferably 0.1 μm or more and 50 μm or less, and even more preferably 0.1 μm or more and 10 μm or less.

[0083] (Method for forming a conductive layer) The method for forming the conductive layer is not particularly limited. The conductive layer may be formed directly on the aforementioned resin layer, or it may be formed on a support. After forming the conductive layer on the support, a laminate including the support and the conductive layer may be laminated with the resin layer or a laminate including the resin layer. After forming the conductive layer on the support, the support may be peeled off from the laminate including the support and the conductive layer. The support is not particularly limited. Examples of supports are not particularly limited, but include glass substrates, metal supports, and base films. Examples of base films are not particularly limited. Examples of base films include polyethylene terephthalate film (PET film), polyethylene naphthalate film, polyethylene naphthalate film, polyimide film, polyphenylene sulfide film, polyethylene film, polypropylene film, and polyamide film. Examples of the thickness of the base film are not particularly limited, but include 1 μm to 1,000 μm. When the electromagnetic wave shielding laminate film includes a base film, the thickness of the base film is not particularly limited. The thickness of the base film is preferably 1 μm or more and 1,000 μm or less, more preferably 10 μm or more and 200 μm or less, and even more preferably 20 μm or more and 50 μm or less. In one embodiment, when a base film is used to form the conductive layer, the electromagnetic wave shielding laminate film may further contain the base film. Examples of methods for forming the conductive layer are not particularly limited, but include vapor deposition, coating, and printing. Examples of vapor deposition methods are not particularly limited, but include vapor deposition, sputtering, and ion plating. In coating or printing methods, a coating solution for forming the conductive layer containing a conductor and a solvent may be used. Examples of solvents are not particularly limited, but include water and organic solvents. Examples of coating or printing methods are not particularly limited, but include coating methods using a coating coater, coating methods using a doctor blade, and screen printing. Examples of coating coaters are not particularly limited, but include slide coaters, slot die coaters, curtain coaters, roll coaters, bar coaters, and gravure coaters. It is preferable to dry the coating after application or printing. The coating may also be heated after application or printing.If necessary, the curing reaction may be advanced by heating. Examples of heating temperatures are not limited to 80°C to 200°C, or 80°C to 150°C.

[0084] [Other layers] An electromagnetic wave shielding laminate film according to one embodiment may further include layers other than the resin layer and the conductive layer. That is, an electromagnetic wave shielding laminate film according to one embodiment may further include one or more other layers. An electromagnetic wave shielding laminate film according to one embodiment may consist only of a resin layer and a conductive layer. Examples of layers other than the resin layer and the conductive layer are not particularly limited, but include a base film, an adhesive layer, etc. It is preferable that an electromagnetic wave shielding laminate film according to one embodiment further includes an adhesive layer disposed between the resin layer and the conductive layer. In one embodiment, it is preferable that the adhesive layer is in contact with the resin layer and also in contact with the conductive layer or the base film. In one embodiment, it is preferable that the adhesive layer is in contact with the resin layer and also in contact with the conductive layer. The adhesive layer may be formed by transferring an adhesive sheet. The adhesive layer may be formed, for example, by applying an adhesive. The adhesive sheet and adhesive may each be commercially available products, synthetic products, or used in combination. Examples of commercially available adhesive sheets are not particularly limited, but include NCF-N632 manufactured by Lintec Corporation. An electromagnetic wave shielding laminate film according to one embodiment may further include a base film on the side opposite to the side of the conductive layer where the resin layer exists. The base film is preferably in contact with the conductive layer. The base film is preferably a base film used for forming the conductive layer.

[0085] In one embodiment, the electromagnetic wave shielding laminate film does not necessarily have an adhesive layer between the resin layer and the conductive layer.

[0086] In this specification, the electromagnetic wave shielding laminate film is treated as not including the adhesive electromagnetic wave shielding laminate described later. Therefore, in this specification, the electromagnetic wave shielding laminate film does not include an adhesive layer, which is disposed on at least one side of the film, for attaching the electromagnetic wave shielding laminate film to other components. When an adhesive layer is disposed on at least one side of the electromagnetic wave shielding laminate film, this laminate becomes the adhesive electromagnetic wave shielding laminate described later.

[0087] An electromagnetic wave shielding laminate film according to one embodiment may consist only of a resin layer, a conductive layer, an adhesive layer disposed between the resin layer and the conductive layer, and a base film. In this case, the resin layer, the adhesive layer disposed between the resin layer and the conductive layer, the conductive layer and the base film may be laminated in this order.

[0088] [Elongation at break of electromagnetic wave shielding laminate film] The elongation at break of the electromagnetic wave shielding laminate film according to this embodiment at 170°C is 110% or more and 200% or less. The lower limit of the elongation at break of the electromagnetic wave shielding laminate film according to one embodiment is preferably 115% or more, more preferably 125% or more, even more preferably 130% or more, even more preferably 135% or more, and particularly preferably 140% or more. The upper limit of the elongation at break of the electromagnetic wave shielding laminate film according to one embodiment at 170°C is preferably 190% or less, more preferably 180% or less, even more preferably 170% or less, even more preferably 160% or less, and particularly preferably 150% or less. Preferred examples of the range of elongation at break of the electromagnetic wave shielding laminate film according to one embodiment are not particularly limited. Preferred examples of the range of elongation at break at 170°C for an electromagnetic wave shielding laminate film according to one embodiment include 115% to 190%, 125% to 190%, 125% to 180%, 130% to 170%, 135% to 160%, and 140% to 150%. The elongation at break at 170°C can be measured using a Tensilon tester in accordance with JIS K 7127:1999. A constant temperature bath covering the measurement area can be used during measurement. Measurements are taken in four directions: 0°, 45°, 90°, and 135° (-45°), with one of the in-plane directions (directions parallel to the plane) of the film being defined as the 0° direction, and the maximum value of these measurement results is taken as the elongation at break at 170°C. The 0° direction may be, for example, the longitudinal direction of the film. Details of the measurement method are described in the examples.

[0089] [Thickness of electromagnetic wave shielding laminate film] The thickness (film thickness D0) of the electromagnetic wave shielding laminate film according to one embodiment is not particularly limited. The thickness of the electromagnetic wave shielding laminate film is preferably 1 μm or more and 1,500 μm or less, more preferably 10 μm or more and 500 μm or less, and even more preferably 50 μm or more and 200 μm or less. The thickness of the electromagnetic wave shielding laminate film can be measured using a contact-type film thickness gauge. Details of the measurement method are described in the examples.

[0090] [Evaluation of film thickness in specific shapes] In one embodiment of the electromagnetic wave shielding laminate film, it is preferable that the average film thickness D1 of the portion of the processed film where the change in size of the film surface before and after processing is small, and the average film thickness D2 of the processed film where the stretching is most extreme, satisfy the following formula (1). It is preferable that the average film thickness D1 and the average film thickness D2 satisfy the following formula (1-1).

[0091]

number

[0092] The average film thickness D1 of the processed electromagnetic shielding laminate film, specifically the portion with the smallest change in film surface size before and after processing, is determined as follows: Select the portion of the processed electromagnetic shielding laminate film with the smallest change in film surface size before and after processing. Then, measure the film thickness at five points in the selected portion, and the average value of these measurements is taken as the average film thickness D1. In this specification, the portion of the processed electromagnetic shielding laminate film with the smallest change in film surface size before and after processing refers to the portion of the grid pattern of the electromagnetic shielding laminate film before processing that constituted a 10mm x 10mm square, where the sum of the lengths of the four sides changes the smallest before and after processing. The portion with the smallest change in film surface size before and after processing may also be a portion where no change in film surface size is observed before and after processing. That is, it may be a portion of the grid pattern of the electromagnetic shielding laminate film before processing that constituted a 10mm x 10mm square, where no change in the sum of the lengths of the four sides is observed before and after processing.

[0093] The average film thickness D2 of the most stretched portion of the processed electromagnetic shielding laminate film is determined as follows: Select the most stretched portion of the processed electromagnetic shielding laminate film. Then, measure the film thickness at five points in the selected portion, and the average value of these measurements is taken as the average film thickness D2. In this specification, the most stretched portion of the processed electromagnetic shielding laminate film refers to the portion that, when an electromagnetic shielding laminate film with a grid pattern is processed (either hypothetically or actually), constitutes a 10mm x 10mm square in the grid pattern of the electromagnetic shielding laminate film before processing, and where the change in the sum of the lengths of the four sides before and after processing is largest in the direction of increasing value.

[0094] The average film thickness D1 and average film thickness D2 can be measured using a contact-type film thickness gauge.

[0095] Each square in the grid pattern is 10mm x 10mm in size. Figure 1 is a schematic diagram illustrating the grid pattern shown on the film sample. In the grid pattern shown on film sample F, each square S has a side length of 10mm.

[0096] In one embodiment, the electromagnetic wave shielding laminate film is preferably used in applications where the average film thickness D1 and average film thickness D2 are processed to satisfy formula (1) above. In one embodiment, the electromagnetic wave shielding laminate film is more preferably used in applications where the average film thickness D1 and average film thickness D2 are processed to satisfy formula (1-1) above.

[0097] In one embodiment, it is preferable that the processed electromagnetic wave shielding laminate film has a shape in which the average film thickness D1 and average film thickness D2 satisfy formula (1). In one embodiment, it is more preferable that the processed electromagnetic wave shielding laminate film has a shape in which the average film thickness D1 and average film thickness D2 satisfy formula (1-1).

[0098] The processing to obtain a processed electromagnetic wave shielding laminate film that satisfies formula (1) (preferably formula (1-1)) is not particularly limited. In one embodiment, the processing preferably includes shaping the electromagnetic wave shielding laminate film to conform to the shape of the housing. In one embodiment, the processing preferably includes shaping the electromagnetic wave shielding laminate film to conform to the shape of the housing of at least one component selected from the group consisting of an inverter and a battery. In one embodiment, the processing preferably includes shaping the electromagnetic wave shielding laminate film to conform to the shape of a housing having the shape shown in Figures 2 to 8, which will be described later.

[0099] When formula (1) (preferably formula (1-1)) is satisfied, the shape of the processed electromagnetic shielding laminate film is not particularly limited. In one embodiment, it is preferable that the processed electromagnetic shielding laminate film has a shape that conforms to the housing. In one embodiment, it is preferable that the processed electromagnetic shielding laminate film has a shape that conforms to the housing of at least one component selected from the group consisting of an inverter and a battery. In one embodiment, it is preferable that the processed electromagnetic shielding laminate film has a shape that conforms to a housing having the shape shown in Figures 2 to 8, which will be described later.

[0100] In one embodiment, it is preferable that the electromagnetic wave shielding laminate film, when processed in test method 1, has the characteristic that D1, which is the average film thickness of the portion of the film after processing where the change in size of the film surface before and after processing is smallest, and D2, which is the average film thickness of the most stretched portion of the film after processing, satisfy formula (1) above. In one embodiment, it is more preferable that the electromagnetic wave shielding laminate film, when processed in test method 1, has the characteristic that the average film thickness D1 and the average film thickness D2 satisfy formula (1-1) above.

[0101] In this specification, Test Method 1 refers to the following method.

[0102] (i) Prepare a 200mm x 300mm sample from the electromagnetic shielding laminate film, and draw a grid pattern on the surface of the sample (electromagnetic shielding laminate film) with an oil-based marker. The size of each square that makes up the grid pattern shall be 10mm x 10mm. Figure 1 is a schematic diagram to explain the grid pattern drawn on the film sample, as described above. In the grid pattern drawn on film sample F, the square S has a side length of 10mm.

[0103] (ii) The housing is placed on an upper and lower lifting table installed inside a double-sided vacuum forming apparatus consisting of upper and lower boxes. The housing used in Test Method 1 is a polycarbonate housing having the shape shown in Figures 2 to 8. Details of the housing used in Test Method 1 are described in the Examples. Then, the sample with the grid pattern is set on the sheet clamp frame located above the placed housing in the double-sided vacuum forming apparatus. Next, the vacuum in the upper and lower boxes is reduced to 1.0 kPa, and the sample is heated for 2 minutes using a near-infrared heater until its temperature reaches a specific temperature T, and the housing is raised to press the housing and sample together. Then, compressed air at 200 kPa is introduced only into the upper box and this state is maintained for 35 seconds. The upper and lower boxes are opened to atmospheric pressure to obtain a molded product in which the sample (electromagnetic wave shielding laminate film) is laminated on the housing. The specific temperature T is selected as 190°C when the resin layer contains a cellulose polymer, and as 120°C when the resin layer does not contain a cellulose polymer.

[0104] (iii) From the molded product in which the electromagnetic wave shielding laminate film is laminated on the housing, an electromagnetic wave shielding laminate film having a shape conforming to the shape of the housing (processed electromagnetic wave shielding laminate film) is removed.

[0105] (iv) In the processed electromagnetic wave shielding laminate film, select the portion where the change in film surface size before and after processing is small. Then, measure the film thickness at five points in the selected portion, and the average value of these measurements is taken as the average film thickness D1. The method for measuring the average film thickness D1 is as described above.

[0106] (v) Select the most stretched portion of the electromagnetic shielding laminate film after processing. Then, measure the film thickness at five points in the selected portion and define the average value of these measurements as the average film thickness D2. The method for measuring the average film thickness D2 is as described above.

[0107] Furthermore, the portion of the film surface that shows the smallest change in size before and after processing, and the portion that is most stretched, is determined from the portion of the molded product obtained in (ii) above that is laminated on the housing of the electromagnetic wave shielding laminate film. Therefore, if there is a portion of the molded product obtained in (ii) above that is not laminated on the housing of the electromagnetic wave shielding laminate film, this portion is not used to determine the portion of the film surface that shows the smallest change in size before and after processing, and the portion that is most stretched.

[0108] Further details of Test Method 1 are described in the Examples.

[0109] [Manufacturing method for electromagnetic wave shielding laminate film] The method for manufacturing an electromagnetic wave shielding laminate film according to one embodiment is not particularly limited. Examples of methods for manufacturing an electromagnetic wave shielding laminate film according to one embodiment include a method that includes forming a conductive layer on a resin layer, a method that includes forming a resin layer on a conductive layer, and a method that involves forming a resin layer and a conductive layer separately and then laminating them. In the method of forming a resin layer and a conductive layer separately and then laminating them, it is preferable to include laminating a laminate of the resin layer, the conductive layer, and a base film. The method of laminating a resin layer and a conductive layer, and the method of laminating a laminate of the resin layer, the conductive layer, and a base film are not particularly limited. The method of laminating a resin layer and a conductive layer, and the method of laminating a laminate of the resin layer, the conductive layer, and a base film, each preferably includes laminating them via the adhesive layer described above.

[0110] [Applications of electromagnetic wave shielding laminate films] An electromagnetic wave shielding laminate film according to one embodiment has a film thickness D0 and is preferably used in a specific shape. The specific shape is not particularly limited. Preferably, the specific shape is such that the film thickness D0 and the average film thickness D2 of the most stretched portion in the specific shape satisfy the following formula (2). More preferably, the specific shape is such that the film thickness D0 and the average film thickness D2 satisfy the following formula (2-1). The film thickness D0 and the average film thickness D2 can be measured using a touch film thickness gauge.

[0111]

number

[0112] The specific shape is not particularly limited. Preferably, the specific shape is such that D1, which is the average film thickness of the part where the size change of the film surface is smallest before and after processing, and D2, which is the average film thickness of the most stretched part, satisfy formula (1) above. More preferably, the specific shape is such that the average film thickness D1 and the average film thickness D2 satisfy formula (1-1) above.

[0113] An electromagnetic wave shielding laminate film according to one embodiment is preferably attached to another member. Therefore, one embodiment of the present invention can also be said to relate to an adhesive electromagnetic wave shielding laminate, which includes the above-mentioned electromagnetic wave shielding laminate film and an adhesive layer for attachment disposed on at least one side of the electromagnetic wave shielding laminate film. In this specification, the adhesive layer for attachment refers to an adhesive layer used to attach the electromagnetic wave shielding laminate film to another member. The adhesive layer for attachment is preferably provided on the side opposite to the side where the conductive layer of the resin layer of the electromagnetic wave shielding laminate film exists. Alternatively, the adhesive layer for attachment is preferably provided on the side opposite to the side where the conductive layer of the resin layer of the electromagnetic wave shielding laminate film exists. Alternatively, the adhesive layer for attachment is preferably provided on the side opposite to the side where the conductive layer of the resin layer of the electromagnetic wave shielding laminate film exists and on the side opposite to the side where the resin layer of the conductive layer of the electromagnetic wave shielding laminate film exists. Among these, it is more preferable that the adhesive layer for attachment is provided on the side opposite to the side where the conductive layer of the resin layer of the electromagnetic wave shielding laminate film exists. The adhesive layer for attachment is provided on the side of the resin layer of the electromagnetic wave shielding laminate film opposite to the side where the conductive layer exists, and it is even more preferable that it is in contact with the resin layer.

[0114] An electromagnetic wave shielding laminate for attachment according to one embodiment includes a main part and an adhesive layer for attachment disposed on at least one side of the main part, wherein the main part is preferably the electromagnetic wave shielding laminate film described above. In this case, it is preferable that the electromagnetic wave shielding laminate film, which is the main part, does not have an adhesive layer, or does not have an adhesive layer in any part other than between the resin layer and the conductive layer.

[0115] In one embodiment of the adhesive electromagnetic wave shielding laminate, it is preferable that at least one surface of the electromagnetic wave shielding laminate film is in contact with the adhesive layer.

[0116] In one embodiment, the adhesive electromagnetic shielding laminate preferably further includes a laminate film. In this case, it is preferable that the laminate film is provided in contact with the adhesive layer. The laminate film is usually removed when the adhesive electromagnetic shielding laminate is attached to another member. The adhesive layer can be formed, for example, by applying an adhesive. The adhesive may be a commercially available product, a synthetic product, or a combination of both. Examples of commercially available products are not particularly limited, but include product name: SK-2057 manufactured by Soken Chemical Co., Ltd.

[0117] The applications of the electromagnetic wave shielding laminate film and the adhesive electromagnetic wave shielding laminate according to one embodiment are not particularly limited. Preferably, the electromagnetic wave shielding laminate film and the adhesive electromagnetic wave shielding laminate according to one embodiment are used in at least one selected from the group consisting of an inverter and a battery.

[0118] One embodiment of the present invention can also be said to relate to the processed electromagnetic shielding laminate film or the processed adhesive electromagnetic shielding laminate. Another embodiment of the present invention can also be said to relate to an article comprising the processed electromagnetic shielding laminate film or the processed adhesive electromagnetic shielding laminate and other components. Another embodiment of the present invention can also be said to relate to an inverter including the processed electromagnetic shielding laminate film or the processed adhesive electromagnetic shielding laminate. Another embodiment of the present invention can also be said to relate to a battery including the processed electromagnetic shielding laminate film or the processed adhesive electromagnetic shielding laminate.

[0119] One embodiment of the present invention also relates to a method for manufacturing an article, which includes laminating the above-described electromagnetic wave shielding laminate film or the above-described adhesive electromagnetic wave shielding laminate onto another member. Preferred examples of the other member, though not particularly limited, include a housing. One embodiment of the present invention also relates to a method for manufacturing an inverter, which includes laminating the above-described electromagnetic wave shielding laminate film or the above-described adhesive electromagnetic wave shielding laminate onto another member (preferably a housing). One embodiment of the present invention also relates to a method for manufacturing a battery, which includes laminating the above-described electromagnetic wave shielding laminate film or the above-described adhesive electromagnetic wave shielding laminate onto another member (preferably a housing). It is preferable that the above-described electromagnetic wave shielding laminate film or the above-described adhesive electromagnetic wave shielding laminate is laminated onto the other member in a shape that conforms to the shape of the other member. The manufacturing methods according to these embodiments preferably include laminating the above-described electromagnetic wave shielding laminate film or the above-described adhesive electromagnetic wave shielding laminate with the other member while processing it into a specific shape. It is preferable that the above-described electromagnetic wave shielding laminate film or the above-described adhesive electromagnetic wave shielding laminate is laminated onto the other member via an adhesive layer.

[0120] In some of the above embodiments, the manufacturing method preferably involves laminating the electromagnetic wave shielding laminate film or the adhesive electromagnetic wave shielding laminate described above with other members while processing it, such that D1, which is the average film thickness of the portion of the processed electromagnetic wave shielding laminate film where the size change of the film surface before and after processing is smallest, and D2, which is the average film thickness of the processed electromagnetic wave shielding laminate film where the most stretched portion satisfies formula (1) (preferably formula (1-1)). In some of the above embodiments, the manufacturing method preferably involves laminating the electromagnetic wave shielding laminate film or the adhesive electromagnetic wave shielding laminate described above with other members while processing it, such that D0, which is the film thickness of the electromagnetic wave shielding laminate film before processing, and D2, which is the average film thickness of the portion of the processed electromagnetic wave shielding laminate film where the most stretched portion satisfies formula (2) (preferably formula (2-1)). The other members are not particularly limited, but a housing is preferred. In one embodiment, it is preferable that the housing is for at least one member selected from the group consisting of an inverter and a battery. In one embodiment, the housing is preferably made of polycarbonate.

[0121] The manufacturing methods according to some of the above embodiments are not particularly limited, but methods including molding by a three-dimensional lamination method (TOM molding) are preferred. Laminating the above electromagnetic wave shielding laminate film or the above adhesive electromagnetic wave shielding laminate with other members while processing it into a specific shape is preferably done by a method including molding by a three-dimensional lamination method (TOM molding). TOM molding is preferably done by the following method: The housing is placed on an upper and lower lifting table equipped in a double-sided vacuum forming apparatus consisting of upper and lower boxes. Then, the adhesive electromagnetic wave shielding laminate is set in the sheet clamp frame located above the placed housing in the double-sided vacuum forming apparatus, with the adhesive layer facing downwards. Subsequently, the pressure inside the upper and lower boxes is reduced, the adhesive electromagnetic wave shielding laminate is heated using a heater (e.g., a near-infrared heater), and the housing is raised to press the housing and the adhesive electromagnetic wave shielding laminate together. Then, compressed air is introduced only into the upper box and this state is maintained. Finally, the upper and lower boxes are opened to atmospheric pressure. A molded product is obtained in which an adhesive electromagnetic wave shielding laminate is laminated on a housing by a method including these operations.

[0122] While embodiments of the present invention have been described in detail, these are descriptive and illustrative, and not limiting, and it is clear that the scope of the present invention should be interpreted by the appended claims.

[0123] The present invention includes, but is not limited to, the following embodiments and forms: [1]: comprising a resin layer and a conductive layer, The resin layer contains at least one compound selected from the group consisting of elastomers and cellulosic polymers, and a magnetic material. The conductive layer contains a conductor, The magnetic material comprises at least one selected from the group consisting of permalloy, ferrite, and sendust. The elongation at break at 170°C is between 110% and 200%. Electromagnetic wave shielding laminate film; [2]: The conductor comprises a conductive polymer and is an electromagnetic wave shielding laminate film as described in [1]; [3]: The electromagnetic wave shielding laminate film according to [1] or [2], wherein the magnetic material is at least one selected from the group consisting of permalloy and sendust, and the content of the magnetic material in the resin layer is 5% by volume or more and 50% by volume or less with respect to the total volume of the resin layer; [4]: An electromagnetic wave shielding laminate film according to any of [1] to [3], wherein D1, the average film thickness of the portion of the processed film where the change in size of the film surface before and after processing is smallest, and D2, the average film thickness of the most stretched portion of the processed film, satisfy the following formula (1);

number

[0124] The present invention will be described in more detail using the following examples and comparative examples. However, the technical scope of the present invention is not limited to the following examples. Unless otherwise specified, "%" and "parts" mean "mass%" and "parts by mass," respectively.

[0125] <Manufacturing of electromagnetic wave shielding laminate film> [Examples 1-3] (Formation of resin layer) A solution was prepared by blending a (meth)acrylic elastomer (methyl methacrylate-n-butyl acrylate-methyl methacrylate triblock copolymer, methyl methacrylate:n-butyl acrylate = 50:50 (mass ratio), Mn = 51,527, Mw = 58,000, product name: Clarity® LA4285, manufactured by Kuraray Co., Ltd.) in a solvent (methyl ethyl ketone). Next, ferrite particles (product name: LD-M, manufactured by JFE Chemical Corporation), which are magnetic materials, were added to the prepared solution so that the magnetic material content, based on the total volume of the resin layer, was the value shown in Table 1 (unit: volume %), to prepare a coating solution for resin layer formation. The solid content concentration of the coating solution for resin layer formation was 35% by mass. The coating solution for resin layer formation was applied to a support using a coater and dried at room temperature for 10 minutes. The obtained sheet was peeled from the support, and after peeling, it was heated and dried at 100°C for 30 minutes to obtain a sheet-like resin layer. The thickness of the obtained resin layer was as shown in Table 1.

[0126] (Formation of conductive layer) The following (a) to (f) were prepared and mixed to prepare a coating solution for forming a conductive layer; (a) Conductive polymer dispersion 36.7 parts by mass (Heraeus conductive polymer (PEDOT / PSS): Product name: H-1000, Solid content concentration: 1.2% by mass) (b) PVDF (polyvinylidene fluoride) dispersion 5.6 parts by mass (Arkema Corporation, Product name: KYNAR LATEX32, Solids content: 20% by mass, Solvent: Water); (c) Water-soluble polyester aqueous solution 0.6 parts by mass (Manufactured by Go-o Chemical Industry Co., Ltd., Product name: Pluscoat Z561, Solid content concentration: 25% by mass) (d) Organic solvent (dimethyl sulfoxide) 9.9 parts by mass (e) Water-soluble solvent (ethanol) 30.0 parts by mass (f) Water 17.2 parts by mass.

[0127] Next, a conductive layer-forming coating solution was applied to a 25 μm thick polyethylene terephthalate film (PET film, unoriented A-PET, product name: Bell FLL, manufactured by Towa Chemical Co., Ltd.), which served as the base film, by bar coating. The mixture was then heated at 120°C for 10 minutes to form a conductive layer. The resulting conductive layer thickness was as shown in Table 1. In this manner, a laminate of polyethylene terephthalate film and conductive layer was obtained.

[0128] (Formation of a layered structure) An adhesive sheet (product name: NCF-N632, manufactured by Lintec Corporation) was transferred to the conductive layer side of the polyethylene terephthalate film and conductive layer laminate obtained above to form an adhesive layer. Next, the resin layer obtained above was laminated to the adhesive layer side of the obtained adhesive layer laminate to obtain the electromagnetic wave shielding laminate film of Example 1. The thickness of the adhesive layer was as shown in Table 1.

[0129] [Example 4] An electromagnetic wave shielding laminate film of Example 4 was manufactured in the same manner as in Example 1, except that the resin layer was changed to a resin layer formed by the following method. The thickness of the obtained resin layer was as shown in Table 1.

[0130] (Formation of the resin layer in Example 4) A solution was prepared by blending a cellulose polymer (cellulose triacetate synthesized from linter cotton, acetyl group substitution degree = 2.86, Mn = 150,000, Mw = 310,000, abbreviation: TAC) in a solvent (a mixed solvent of dichloromethane and ethanol). Next, ferrite particles (product name: LD-M, manufactured by JFE Chemical Corporation), which are magnetic materials, were added to the prepared solution so that the magnetic material content, based on the total volume of the resin layer, was as shown in Table 1 (unit: volume %), to prepare a coating solution for forming a resin layer. The solid content concentration of the coating solution for forming a resin layer was 20% by mass. The coating solution for forming a resin layer was applied to a support using a coater, dried at room temperature, the resulting sheet was peeled from the support, and an additional drying was performed at 140°C for 30 minutes to obtain a sheet-like resin layer. The film thickness of the obtained resin layer was as shown in Table 1.

[0131] [Example 5] In forming the coating solution for resin layer formation, the type of magnetic material was changed from ferrite particles (product name: LD-M, manufactured by JFE Chemical Corporation) to permalloy (product name: AKT-PB5, manufactured by Mitsubishi Steel Ltd.), and the amount of magnetic material was changed so that the magnetic material content relative to the entire resin layer (total volume of the resin layer) was the value shown in Table 1 (unit: volume %). Except for these changes, the electromagnetic wave shielding laminate film of Example 5 was manufactured in the same manner as in Example 1. The solid content concentration of the coating solution for resin layer formation used in Example 5 was 35% by mass.

[0132] [Example 6] In forming the coating solution for resin layer formation, the type of magnetic material was changed from ferrite particles (product name: LD-M, manufactured by JFE Chemical Corporation) to Sendust (product name: GNPS-P-260, manufactured by POCO), and the amount of magnetic material was changed so that the magnetic material content relative to the entire resin layer (total volume of the resin layer) was the value shown in Table 1 (unit: volume %). Except for these changes, the electromagnetic wave shielding laminate film of Example 6 was manufactured in the same manner as in Example 1. The solid content concentration of the coating solution for resin layer formation used in Example 6 was 35% by mass.

[0133] [Comparative Example 1] In the formation of the coating solution for forming the resin layer, the (meth)acrylic elastomer was changed to a urethane-modified copolymer polyester resin (product name: Byron® UR-3200, manufactured by Toyobo Co., Ltd.), tris(2,3-dibromopropyl) isocyanurate was added as an additive, and the amount of magnetic material was changed so that the magnetic material content based on the entire resin layer (total volume of the resin layer) was the value shown in Table 1 (unit: volume %). Except for these changes, the formation of the resin layer in Comparative Example 1 was carried out in the same manner as in Example 1, and an electromagnetic wave shielding laminate film consisting only of a resin layer was produced. The solid content concentration of the coating solution for forming the resin layer used in Comparative Example 1 was 35% by mass. The thickness of the obtained resin layer was as shown in Table 1.

[0134] [Comparative Example 2] In the formation of the coating solution for forming the resin layer, the (meth)acrylic elastomer was changed to chlorinated polyethylene (product name: Elaslene 402NA, manufactured by Showa Denko K.K.), and the amount of magnetic material was changed so that the magnetic material content relative to the entire resin layer (total volume of the resin layer) was the value shown in Table 1 (unit: volume %). Except for these changes, the electromagnetic wave shielding laminate film of Comparative Example 2, consisting only of a resin layer, was manufactured in the same manner as in Example 1. The solid content concentration of the coating solution for forming the resin layer used in Comparative Example 2 was 35% by mass. The thickness of the obtained resin layer was as shown in Table 1.

[0135] (Thickness of electromagnetic wave shielding laminate film) The film thickness of the electromagnetic shielding laminate obtained above was measured at five points using a contact-type film thickness gauge (Nikon Corporation, product name: Digimicro, main unit: MH-15M, stand: MS-5C, counter: TC-101A), and the average value of these measurements was defined as the film thickness D0 of the electromagnetic shielding laminate. The values ​​of D0 are shown in Table 1.

[0136] <Evaluation of electromagnetic wave shielding laminate film> [Elongation at break at 170°C] The elongation at break of the electromagnetic shielding laminate film obtained above was measured using a Tensilon tester (RTC-1225A, ORIENTEC) manufactured by A&D Co., Ltd., in accordance with the method compliant with JIS K 7127:1999. The measurement was performed on a sample in a constant temperature chamber (Tensile testing chamber, TKC-R3T-C, ORIENTEC Co., Ltd.) covering the measurement area, at a temperature of 170°C. The measurement was started only after confirming that the temperature in the constant temperature chamber reached 170°C. In this measurement, the sample size was 10 mm in width and 100 mm in length, the test length was 50 mm, and the tensile speed was 50 mm / min. The elongation at break (unit: %) was calculated by stretching the test piece and measuring the length it stretched until it broke (the amount the device moved until it broke), using the formula (test length + amount the device moved until it broke) / test length × 100. For example, when the device moves 5 mm before breaking, the elongation at break is calculated as 110% using the formula (50 mm + 5 mm) / 50 mm × 100. Measurements were taken in four directions: 0°, 45°, 90°, and 135° (-45°), with the longitudinal direction of the electromagnetic wave shielding laminate film being the 0° direction. The elongation at break at 170°C was taken as the maximum value of these measurement results. The values ​​of the elongation at break at 170°C are shown in Table 2.

[0137] [Evaluation based on specific shapes] (TOM molding) A 200mm x 300mm sample was prepared from the electromagnetic shielding laminate film obtained above. A grid pattern was drawn on the surface of the polyethylene terephthalate film of the sample (electromagnetic shielding laminate film) using an oil-based marker. The size of each square constituting the grid pattern was 10mm x 10mm.

[0138] A polycarbonate housing was placed on a vertically adjustable table installed inside a double-sided vacuum forming machine (product name: NGF-0409, manufactured by Fuse Vacuum Co., Ltd.) consisting of upper and lower boxes.

[0139] The enclosure used in this evaluation can also be said to be the enclosure used in Test Method 1. The shape of the enclosure used in this evaluation is shown in Figures 2 to 8. Figure 2 is a perspective view of the enclosure. Figure 3 is a view of the enclosure shown in Figure 2 from the direction indicated by 3 in Figure 2, and is a front view when the surface viewed from the direction indicated by 3 in Figure 2 is considered the front. Figure 4 is a view of the enclosure shown in Figure 2 from the direction indicated by 4 in Figure 2, and is a left side view when the surface viewed from the direction indicated by 3 in Figure 2 is considered the front. Figure 5 is a view of the enclosure shown in Figure 2 from the direction indicated by 5 in Figure 2, and is a right side view when the surface viewed from the direction indicated by 3 in Figure 2 is considered the front. Figure 6 is a view of the enclosure shown in Figure 2 from the direction indicated by 6 in Figure 2, and is a top view when the surface viewed from the direction indicated by 3 in Figure 2 is considered the front. Figure 7 is a view of the enclosure shown in Figure 2 from the direction indicated by 7 in Figure 2, and is a bottom view when the surface viewed from the direction indicated by 3 in Figure 2 is considered the front. Figure 8 is a cross-sectional view of the enclosure shown in Figure 3 at the position indicated by AA. The values ​​in these figures represent lengths (in mm). In the enclosures shown in Figures 2 to 8, the radius of curvature of each corner is 2 mm.

[0140] Subsequently, the sample with the grid pattern was placed on the sheet clamp frame located at the top of the mounted housing in the double-sided vacuum forming apparatus described above. Next, the vacuum level in the upper and lower boxes was reduced to 1.0 kPa, and the sample was heated for 2 minutes using a near-infrared heater until its temperature reached a specific temperature T. The housing was then raised to press the housing and sample together. After that, compressed air at 200 kPa was introduced only into the upper box and this state was maintained for 35 seconds. The upper and lower boxes were opened to atmospheric pressure, and a molded product was obtained in which the sample (electromagnetic wave shielding laminate film) was laminated on the housing. The specific temperature T was set to 120°C in the evaluations of Examples 1-3, 5 and 6, and Comparative Examples 1 and 2, and to 190°C in the evaluation of Example 4.

[0141] From the molded product obtained above, in which the electromagnetic wave shielding laminate film is laminated on the housing, an electromagnetic wave shielding laminate film having a shape conforming to the shape of the housing (processed electromagnetic wave shielding laminate film) was removed.

[0142] (Film thickness evaluation (Film thickness evaluation according to test method 1)) In the processed electromagnetic shielding laminate film, the portion with the smallest change in film surface size before and after processing was selected. The film thickness of the selected portion was measured at five points using a contact-type film thickness gauge (Nikon Corporation, product name: Digimicro, main unit: MH-15M, stand: MS-5C, counter: TC-101A), and the average of these measurements was defined as the average film thickness D1. Here, the portion of the processed electromagnetic shielding laminate film with the smallest change in film surface size before and after processing was defined as the portion within the grid pattern of the electromagnetic shielding laminate film before processing that formed a 10mm x 10mm square, and where the sum of the lengths of the four sides changed the smallest before and after processing.

[0143] Furthermore, the most stretched portion of the processed electromagnetic shielding laminate film was selected. The film thickness of the selected portion was measured at five points using a contact-type film thickness gauge (Nikon Corporation, product name: Digimicro, main unit: MH-15M, stand: MS-5C, counter: TC-101A), and the average value of these measurements was defined as the average film thickness D2. Here, the most stretched portion of the processed electromagnetic shielding laminate film was defined as the portion that formed a 10mm x 10mm square in the grid pattern of the electromagnetic shielding laminate film before processing, and where the change in the sum of the lengths of the four sides before and after processing was the largest in the direction of increasing value.

[0144] Then, the ratio of the average film thickness D2 to the average film thickness D1 (D2 / D1) was calculated. The values ​​of D2 / D1 are shown in Table 2.

[0145] Furthermore, in molded products in which samples are laminated on a housing, the portion of the electromagnetic wave shielding laminate film that was not laminated on the housing was not used to determine the portion with the smallest change in film surface size before and after processing, nor to determine the portion that was stretched the most.

[0146] (Electromagnetic wave shielding performance) The shielding performance (dB) of the processed electromagnetic shielding laminate film against low-frequency electromagnetic waves was evaluated using a KEC method electromagnetic shielding evaluation device.

[0147] The KEC method is a well-known method, and its explanation is described, for example, in paragraphs "0153" to "0157" of Japanese Patent Publication No. 2007-294808. The KEC method in the KEC electromagnetic wave shielding evaluation apparatus is a method developed by the Kansai Electronic Industry Development Center. The shielding performance quantified by the KEC method is expressed as the difference between the received intensity with the sample in place and the received intensity without the sample. More specifically, a film-like sample is placed in the opening, and an electromagnetic wave (incident wave; incident electric field or incident magnetic field) having a predetermined frequency (MHz) is incident on one side of the film-like sample with a predetermined energy (sometimes referred to as "E1"), and the energy (sometimes referred to as "E2") of the transmitted wave (transmitted electric field or transmitted magnetic field) that passes through to the other side of the film-like sample is measured, and the shielding effect (dB) is determined by the following formula (3).

[0148]

number

[0149] In this evaluation, measurements were performed using a metal plate jig for this evaluation, as described later, in accordance with the method described in paragraphs "0153" to "0157" of Japanese Patent Publication No. 2007-294808. The measuring apparatus used was an amplifier and a spectrum analyzer, along with shield boxes (a shield box for electric fields and a shield box for magnetic fields). The shield box for electric fields is described in paragraph "0155" and Figure 7(a) of Japanese Patent Publication No. 2007-294808. The shield box for magnetic fields is described in Figure 7(b) in paragraph "0155" of Japanese Patent Publication No. 2007-294808.

[0150] First, samples slightly larger than 10mm x 20mm were cut from both the unprocessed and processed electromagnetic shielding laminate film. For the unprocessed electromagnetic shielding laminate film, the sample was cut at an arbitrary position. For the processed electromagnetic shielding laminate film, the sample was cut at a position that included as much area as possible of the portion with the smallest change in film surface size before and after processing, and also included as much area as possible of the most stretched portion.

[0151] Here, a sample of the electromagnetic shielding laminate film before processing was designated as Sample 1. A sample of the processed electromagnetic shielding laminate film containing the portion with the smallest change in film surface size before and after processing was designated as Sample 2. And a sample of the processed electromagnetic shielding laminate film containing the most stretched portion was designated as Sample 3.

[0152] Next, a metal plate jig (made of copper) with a 10 mm x 20 mm hole (opening), as shown in Figure 9, was prepared. Measurements were taken using the KEC electromagnetic wave shielding evaluation device with only this metal plate jig in place, and the resulting shielding effect value was used as a blank.

[0153] Next, Sample 2 was attached to the metal plate jig described above, covering the holes in the jig. The metal plate jig with the sample attached was then measured using a KEC electromagnetic wave shielding evaluation device to obtain the shielding effect value. The shielding effect of Sample 2 was then obtained by subtracting the blank value from the obtained value.

[0154] Next, sample 3 was attached to the metal plate jig so as to cover the holes in the metal plate jig. The metal plate jig with the sample attached was then measured using a KEC electromagnetic wave shielding evaluation device to obtain the shielding effect value. The shielding effect of sample 3 was then obtained by subtracting the blank value from the obtained value.

[0155] Furthermore, Sample 1 was attached to the metal plate jig described above, covering the holes in the jig. The metal plate jig with the sample attached was then measured using a KEC electromagnetic shielding evaluation device to obtain the shielding effect value. The blank value was then subtracted from the obtained value to obtain the shielding effect of Sample 1. As a result, it was confirmed that the electromagnetic shielding laminate films of Examples 1 to 6 exhibited excellent electromagnetic shielding effects even in their unprocessed state.

[0156] The wavelength used in this evaluation was 10 MHz, and the measurement range was 0.1 to 1,000 MHz. Furthermore, in this evaluation, measurements were performed by incidenting electromagnetic waves onto the resin layer side of the sample.

[0157] Electromagnetic shielding performance was evaluated according to the following criteria. A result of A to C indicates a good result, A and B indicate a better result, and A indicates a particularly good result. These results are shown in Table 2.

[0158] ≪Evaluation Criteria≫ A: The value (%) calculated using the formula (Shield effect of Sample 3) / (Shield effect of Sample 2) × 100 was between 95% and 105%; B: The value (%) calculated using the formula (Shield effect of Sample 3) / (Shield effect of Sample 2) × 100 was between 85% and 95%; C: The value (%) calculated using the formula (Shield effect of Sample 3) / (Shield effect of Sample 2) × 100 was between 75% and 85%; D: The value (%) calculated using the formula (Shield effect of sample 3) / (Shield effect of sample 2) × 100 was less than 75%; E: Samples could not be obtained due to fracture during the molding process.

[0159] If the value calculated using the formula (shielding effect of sample 3) / (shielding effect of sample 2) × 100 is 75% or higher, then even in films with curved sections, the electromagnetic shielding performance will not be significantly reduced in some areas. In such cases, a high overall electromagnetic shielding effect will be obtained.

[0160] Furthermore, in the processing method of Test Method 1, the casing used is significantly bent, and the shape change of the film before and after processing is also large. From this, it can be inferred that the electromagnetic wave shielding laminate film that shows good results in Evaluation Method 1 will also show excellent electromagnetic wave shielding effect when processed into a shape with gentler bending.

[0161] [Evaluation of molded products] (Manufacturing of adhesive-type electromagnetic shielding laminates) An adhesive (product name: SK-2057, manufactured by Soken Chemical Co., Ltd.) was applied to the surface of the resin layer of the electromagnetic wave shielding laminate film obtained above to form an adhesive layer for attachment. In this way, an electromagnetic wave shielding laminate for attachment was obtained. The formed adhesive layer was used as an adhesive layer for attachment to the housing, as will be described later.

[0162] (TOM molding) A sample measuring 200 mm x 300 mm was prepared from the adhesive electromagnetic shielding laminate obtained above.

[0163] A polycarbonate housing, the same as that used in "TOM molding" in the "Evaluation of Specific Shapes" described above, was placed on a vertically adjustable table inside a double-sided vacuum forming apparatus (product name: NGF-0409, manufactured by Fuse Vacuum Co., Ltd.) consisting of upper and lower boxes. Then, the sample was set in the sheet clamp frame located above the placed housing in the double-sided vacuum forming apparatus, with the adhesive layer facing downwards. Next, the vacuum level inside the upper and lower boxes was reduced to 1.0 kPa, and the sample was heated for 2 minutes using a near-infrared heater until its temperature reached a specific temperature T. The housing was then raised to press the housing and sample together. After that, compressed air at 200 kPa was introduced only into the upper box and this state was maintained for 35 seconds. The upper and lower boxes were opened to atmospheric pressure, and a molded product was obtained in which the sample (adhesive electromagnetic shielding laminate) was laminated on top of the housing.

[0164] The specific temperature T was set to 120°C in the evaluations of Examples 1-3, 5 and 6, and Comparative Examples 1 and 2, and to 190°C in the evaluation of Example 4.

[0165] (exterior) The appearance of the molded product, in which the adhesive electromagnetic shielding laminate obtained above was laminated onto the housing, was visually observed. If no obvious abnormalities were found in the appearance of the molded product, such as wrinkles, bubbles, whitening, poor adhesion, and / or fracture of the adhesive electromagnetic shielding laminate, the appearance was judged to be good. These results are shown in Table 2.

[0166] [Table 1]

[0167] [Table 2]

[0168] The results in Table 2 show that the electromagnetic wave shielding laminate film of the example did not break when bonded to an object having a bent portion, and a high electromagnetic wave shielding effect was obtained in a shape with a bent portion.

[0169] On the other hand, the comparative example's electromagnetic shielding laminate film fractured when bonded to an object having a bent portion. It is clear that electromagnetic wave leakage occurs from the fractured portion. From this, it is also clear that the comparative example's electromagnetic shielding laminate film is inferior in its electromagnetic shielding effect in shapes with bent portions.

[0170] While embodiments of the present invention have been described and illustrated in detail, the disclosed embodiments are for illustrative purposes only and are not limiting. The scope of the present invention should be interpreted in accordance with the language of the appended claims. [Explanation of Symbols]

[0171] F Film Sample S Square in a grid pattern 3, 4, 5, 6, 7 directions

Claims

1. It includes a resin layer and a conductive layer, The resin layer contains at least one compound selected from the group consisting of elastomers and cellulosic polymers, and a magnetic material. The conductive layer contains a conductor, The magnetic material comprises at least one selected from the group consisting of permalloy, ferrite, and sendust. The elongation at break at 170°C is between 110% and 200%. Electromagnetic wave shielding laminate film.

2. The electromagnetic wave shielding laminate film according to claim 1, wherein the conductor comprises a conductive polymer.

3. The electromagnetic wave shielding laminate film according to claim 1, wherein the magnetic material is at least one selected from the group consisting of permalloy and sendust, and the content of the magnetic material in the resin layer is 5% by volume or more and 50% by volume or less with respect to the total volume of the resin layer.

4. The electromagnetic wave shielding laminate film according to claim 1, wherein D1, which is the average film thickness of the portion of the processed film where the change in size of the film surface before and after processing is smallest, and D2, which is the average film thickness of the most stretched portion of the processed film, satisfy the following formula (1). [Math 1]

5. An electromagnetic wave shielding laminate film according to claim 1, used in at least one selected from the group consisting of an inverter and a battery.

6. An adhesive electromagnetic wave shielding laminate comprising an electromagnetic wave shielding laminate film according to claim 1 and an adhesive layer for attachment disposed on at least one side of the electromagnetic wave shielding laminate film.

7. A method for manufacturing an article, comprising laminating an electromagnetic wave shielding laminate film according to any one of claims 1 to 5 or an adhesive electromagnetic wave shielding laminate according to claim 6 onto another member.

8. A method for manufacturing an inverter, comprising laminating an electromagnetic wave shielding laminate film according to any one of claims 1 to 5 or an adhesive electromagnetic wave shielding laminate according to claim 6 onto a housing.

9. A method for manufacturing a battery, comprising laminating an electromagnetic wave shielding laminate film according to any one of claims 1 to 5 or an adhesive electromagnetic wave shielding laminate according to claim 6 onto a housing.

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