socket

Abstract

This invention provides a socket that can prevent situations where a portion of the bumps on a semiconductor package does not make contact with the energized pins. [Solution] The socket is used for inspecting semiconductor packages and comprises a support, a pressing body, a plurality of energizing pins, and a cover. The semiconductor package has a substrate including a first surface and a second surface located opposite the first surface, a plurality of semiconductor chips of different heights arranged on the first surface, and a plurality of bumps arranged on the second surface. The support has a third surface, a fourth surface located opposite the third surface, and a recess formed on the third surface so as to be recessed toward the fourth surface. The pressing body is placed on the semiconductor package in the state where the semiconductor package is placed in the recess such that the plurality of bumps face the bottom surface of the recess. Each of the plurality of energizing pins has a first end and is arranged in the support so as to protrude from the bottom surface of the recess at the first end and contact each of the plurality of bumps.

Description

Technical Field

[0001] The present disclosure relates to a socket.

Background Art

[0002] The socket disclosed in Japanese Patent Application Laid-Open No. 2012-202843 (Patent Document 1) is used for inspecting a semiconductor package. The semiconductor package has a substrate, a semiconductor chip disposed on the upper surface of the substrate, and a plurality of bumps disposed on the lower surface of the substrate. The socket has a pedestal and a plurality of contact pins. A recess that recesses toward the lower surface of the pedestal is formed on the upper surface of the pedestal. A plurality of pocket portions are formed on the bottom surface of the recess. The tip of the contact pin protrudes from the bottom surface of the pocket portion. The semiconductor package is disposed on the bottom surface of the recess such that each of the plurality of bumps contacts the tip of the contact pin. By energizing each of the contact pins, an inspection of the semiconductor package is performed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the socket disclosed in Patent Document 1, when a plurality of semiconductor chips having different heights are disposed on the substrate, there is a possibility that some of the plurality of bumps do not contact the contact pins. Other problems and novel features will become apparent from the description of this specification and the accompanying drawings.

Means for Solving the Problems

[0005] The socket of this disclosure is used for testing semiconductor packages. The socket comprises a support, a pressing element, a plurality of energizing pins, and a cover. The semiconductor package has a substrate including a first face and a second face located opposite the first face, a plurality of semiconductor chips of different heights arranged on the first face, and a plurality of bumps arranged on the second face. The support has a third face, a fourth face located opposite the third face, and a recess formed on the third face so as to be recessed toward the fourth face. The pressing element is placed on the semiconductor package with the semiconductor package placed in the recess such that the plurality of bumps face the bottom surface of the recess. Each of the plurality of energizing pins has a first end and is arranged in the support such that the first end protrudes from the bottom surface of the recess and contacts each of the plurality of bumps. The cover is mounted on the support so as to press the pressing element toward the semiconductor package. The pressing element is divided into a plurality of parts in plan view. [Effects of the Invention]

[0006] The socket of this disclosure can avoid a situation in which a portion of the bumps of the semiconductor package does not make contact with the energized pins. [Brief explanation of the drawing]

[0007] [Figure 1] This is a plan view of a semiconductor package (PKG). [Figure 2] This is a cross-sectional view of the semiconductor package (PKG) at line II-II in Figure 1. [Figure 3] This is a cross-sectional view of socket SCK1. [Figure 4] This is a magnified view of a portion of Figure 3. [Figure 5] This is a cross-sectional view of the pressure pin PIN2. [Figure 6] This is a cross-sectional view of socket SCK2. [Figure 7] This is a magnified cross-sectional view of socket SCK3. [Figure 8] This is a magnified cross-sectional view of socket SCK4. [Figure 9] This is a block diagram of socket SCK4. [Modes for carrying out the invention]

[0008] The details of the embodiments will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and redundant descriptions will not be repeated.

[0009] (First Embodiment) The socket SCK1 according to the first embodiment will be described.

[0010] <Configuration of Socket SCK1> The configuration of socket SCK1 is described below.

[0011] Socket SCK1 is used for testing semiconductor packages (PKG). As shown in Figures 1 and 2, a semiconductor package (PKG) has a substrate (SUB), multiple semiconductor chips (CHP), and multiple bumps (BMP).

[0012] The substrate SUB has a first surface F1 and a second surface F2 located on the opposite side of the first surface F1. The substrate SUB is, for example, a glass epoxy substrate. However, the material of the substrate SUB is not limited to this. The substrate SUB has a plurality of lands LND1 located on the first surface F1 and a plurality of lands LND2 located on the second surface F2.

[0013] The semiconductor chip CHP is placed on the first surface F1. More specifically, the semiconductor chip CHP has a plurality of bumps on its underside, and each of these bumps is bonded to each of the plurality of lands LND1. The plurality of bumps on the semiconductor chip CHP are sealed with underfill UFL. One of the plurality of semiconductor chip CHPs has a different height from at least one of the other semiconductor chip CHPs.

[0014] The plurality of bumps BMP are disposed on the second surface F2. More specifically, each of the plurality of bumps BMP is disposed on each of the plurality of lands LND2. The semiconductor package PKG may further have a stiffener STF. The stiffener STF is formed of, for example, a metallic material. The stiffener STF is disposed on the outer peripheral edge of the first surface F1 so as to surround the plurality of semiconductor chips CHP in a plan view. The stiffener STF is higher than any of the plurality of semiconductor chips CHP. That is, the upper surface of the stiffener STF is farther from the first surface F1 than the upper surface of any of the plurality of semiconductor chips CHP. A part of each of the plurality of bumps BMP overlaps with the stiffener STF in a plan view.

[0015] As shown in FIGS. 3 and 4, the socket SCK1 has a support SUP, a plurality of power pins PIN1, a pressing body PRE, and a lid LID.

[0016] The support SUP has a third surface F3 and a fourth surface F4 located on the opposite side of the third surface F3. A recess CAV is formed in the third surface F3. The recess CAV is formed to be recessed toward the fourth surface F4. The support SUP may be assembled from a plurality of members.

[0017] The power pins PIN1 are disposed within the support SUP. The number of the power pins PIN1 is determined according to the number of the bumps BMP. The power pin PIN1 has an end PIN1a and an end PIN1b located on the opposite side of the end PIN1a. The end PIN1a protrudes from the bottom surface of the recess CAV. The end PIN1b protrudes from the fourth surface F4. The semiconductor package PKG is disposed within the recess CAV such that the plurality of bumps BMP face the bottom surface of the recess CAV. Thereby, each of the plurality of bumps BMP contacts each of the plurality of power pins PIN1. By energizing each of the plurality of power pins PIN1 in a state where each of the plurality of bumps BMP contacts each of the plurality of power pins PIN1, an electrical inspection of the semiconductor package PKG can be performed.

[0018] The pressing body PRE is disposed on the semiconductor package. The pressing body PRE is divided into a plurality of parts in a plan view. The lid LID is disposed on the third surface F3 with the pressing body PRE interposed between the lid LID and the semiconductor package PKG. The lid LID presses the pressing body PRE toward the semiconductor package PKG.

[0019] The pressing force from the lid LID to the pressing body PRE is applied by the pressing mechanism PM. More specifically, the pressing mechanism PM has a rotating body RB and an elastic member SPR1. The rotating body RB is attached to the lid LID by a rotating shaft RA. The rotating body RB is rotatable about the rotating shaft RA. The rotating body RB has a first part RB1 and a second part RB2. The tip of the first part RB1 is bent and can be hooked on the side surface of the support SUP. The elastic member SPR1 is disposed between the second part RB2 and the lid LID and generates an elastic force that rotates the rotating body RB in the direction of the arrow in the figure. Thereby, the lid LID and the support SUP are pressed against each other, generating a pressing force from the pressing body PRE to the semiconductor package PKG. The elastic member SPR1 is, for example, a coil spring.

[0020] In the socket SCK1, the pressing body PRE has a plurality of pressing pins PIN2. The plurality of pressing pins PIN2 are arranged in a plane parallel to the bottom surface of the recess CAV. The pressing pin PIN2 has an end PIN2a and an end PIN2b located on the opposite side of the end PIN2a. The end PIN2a contacts the semiconductor package PKG. More specifically, the end PIN2a contacts the upper surface or the first surface F1 of the semiconductor chip CHP. The pressing pin PIN2 contacts the lid LID at the end PIN2b.

[0021] As shown in Figure 5, the pressure pin PIN2 comprises a cylindrical body CYL, end members EM1 and EM2, and an elastic member SPR2. The cylindrical body CYL extends in the direction from end PIN2a to end PIN2b. The inside of the cylindrical body CYL is hollow. End member EM1 has end PIN2a and is positioned inside the cylindrical body CYL such that end PIN2a protrudes from one end of the cylindrical body CYL. End member EM2 has end PIN2b and is positioned inside the cylindrical body CYL such that end PIN2b protrudes from the other end of the cylindrical body CYL.

[0022] The elastic member SPR2 is positioned within the cylindrical body CYL between end members EM1 and EM2. The elastic member SPR2 generates an elastic force that presses end PIN2a against the semiconductor package PKG when the distance between end PIN2a and end PIN2b decreases. The elastic modulus of one elastic member SPR2 of the multiple pressing pins PIN2 may differ from the elastic modulus of another elastic member SPR2 of the multiple pressing pins PIN2. The elastic member SPR2 is, for example, a coil spring.

[0023] The press body PRE further has a retainer HLD that holds a plurality of press pins PIN2. The upper surface of the retainer HLD is in contact with the lid LID. The lower surface of the retainer HLD is in contact with the stiffener STF and not with any of the plurality of semiconductor chips CHP. Each of the plurality of press pins PIN2 is held within the retainer HLD such that its end PIN2a protrudes from the lower surface of the retainer HLD. More specifically, the retainer HLD has through holes formed therein that penetrate the retainer HLD in a direction from the upper surface of the retainer HLD toward the lower surface of the retainer HLD, and each of the plurality of press pins PIN2 is inserted into these through holes.

[0024] <Effects of Socket SCK1> The effects of socket SCK1 are explained below in comparison with socket SCK2, which is used in the comparative example.

[0025] As shown in Figure 6, in socket SCK2, the press body PRE is not divided into multiple parts in a plan view. Therefore, in socket SCK2, the lower surface of the press body PRE contacts the semiconductor package PKG. However, in the semiconductor package PKG, one of the multiple semiconductor chips CHP has a different height from at least one of the other semiconductor chips CHP. In addition, the semiconductor package PKG may have a stiffener STF, and the stiffener STF is higher than the multiple semiconductor chips CHP. Therefore, in socket SCK2, some or all of the multiple semiconductor chips CHP cannot be brought into contact with the lower surface of the press body PRE. As a result, some of the multiple bumps BMP may not contact the energized pin PIN1.

[0026] On the other hand, in socket SCK1, the press body PRE has multiple press pins PIN2. The height of one end PIN2a of the multiple press pins PIN2 can be made different from the height of another end PIN2a of the multiple press pins PIN2. Therefore, in socket SCK1, all of the multiple semiconductor chips CHP can be made to contact the press pins PIN2 (end PIN2a). In addition, in socket SCK1, the press pins PIN2 (end PIN2a) can also be made to contact the portion of the first surface F1 where no semiconductor chips CHP are placed. Therefore, with socket SCK1, it is possible to avoid a situation where some of the multiple bumps BMP do not contact the energized pins PIN1.

[0027] The warpage of a semiconductor package (PKG) can vary depending on its position in a plan view. In socket SCK1, if the elastic modulus of one elastic member SPR2 among multiple press pins PIN2 differs from that of another elastic member SPR2 among multiple press pins PIN2, then different elastic forces can be applied to the semiconductor package (PKG) from the press pins PIN2 depending on their position in a plan view. Therefore, in this case, the flatness of the semiconductor package (PKG) can be further ensured, and the situation where some of the multiple bumps BMP do not contact the energized pins PIN1 can be more reliably avoided.

[0028] (Second Embodiment) The socket SCK3 according to the second embodiment will be described. Here, we will mainly explain the differences from socket SCK2, and will avoid repeating redundant explanations.

[0029] <Configuration of Socket SCK3> The configuration of socket SCK3 is described below.

[0030] As shown in Figure 7, the socket SCK3 comprises a support SUP, a plurality of energizing pins PIN1, a pressing body PRE, and a cover LID. In the socket SCK3, the pressing body PRE has a plurality of pressing blocks BLK.

[0031] The pressure block BLK has a fifth surface F5 and a sixth surface F6 located opposite the fifth surface F5. The pressure block BLK contacts the semiconductor package PKG (more specifically, the upper surface of the semiconductor chip CHP) on the fifth surface F5 and contacts the lid LID on the sixth surface F6. The pressure block BLK includes a press piece BLK1, a press plate BLK2, a press plate BLK3, and an elastic member SPR3. Multiple pressure blocks BLK are arranged in parallel planes within the recess CAV.

[0032] The press plate BLK2 forms the fifth surface F5, and the press plate BLK3 forms the sixth surface F6. The press block BLK1 is positioned between the press plates BLK2 and BLK3. The elastic member SPR3 is positioned inside the press block BLK1. More specifically, the press block BLK1 has a through hole formed that penetrates it in the direction from the fifth surface F5 to the sixth surface F6, and the elastic member SPR3 is positioned inside this through hole. The elastic member SPR3 is in contact with the press plate BLK2 at one end and with the press plate BLK3 at the other end.

[0033] The elastic member SPR2 generates an elastic force that presses the fifth surface F5 against the semiconductor package PKG when the distance between the fifth surface F5 and the sixth surface F6 decreases. The elastic modulus of one elastic member SPR3 among the multiple pressing blocks BLK may differ from the elastic modulus of another elastic member SPR3 among the multiple pressing blocks BLK. The elastic member SPR3 is, for example, a coil spring. One pressing block BLK contacts, for example, one semiconductor chip CHP. However, if two or more semiconductor chip CHPs are of the same height and are arranged adjacent to each other in a plan view, one pressing block BLK may contact two or more semiconductor chip CHPs.

[0034] <Effects of Socket SCK3> The effects of socket SCK3 are explained below.

[0035] The height of the fifth face F5 of one of the multiple pressure blocks BLK can be made different from the height of the fifth face F5 of another of the multiple pressure blocks BLK. Therefore, in socket SCK2, all of the multiple semiconductor chip CHP can be in contact with the pressure block BLK (fifth face F5), and the situation in which some of the multiple bump BMPs do not contact the energized pin PIN1 can be avoided.

[0036] In socket SCK3, if the elastic modulus of one elastic member SPR3 among the multiple pressure blocks BLK differs from that of another elastic member SPR3 among the multiple pressure blocks BLK, different elastic forces can be applied to the semiconductor package PKG from the pressure blocks BLK at different positions in a plan view. Therefore, in this case, the flatness of the semiconductor package PKG can be further ensured, and the situation in which some of the multiple bumps BMP do not contact the energized pin PIN1 can be more reliably avoided.

[0037] <Variation> The following describes a modified version of the second embodiment of socket SCK4.

[0038] As shown in Figure 8, the socket SCK4 further includes a temperature sensor SEN. The temperature sensor SEN is located, for example, in the press plate BLK2 and measures the temperature of the semiconductor chip CHP that the press block BLK contacts. As shown in Figure 9, the temperature sensor SEN outputs a signal to the controller CTR corresponding to the temperature of the semiconductor chip CHP detected by the temperature sensor SEN. As shown in Figure 8, a flow path FP is formed in the press piece BLK1. A coolant flows through the flow path FP. The coolant is, for example, air or water.

[0039] The controller CTR is configured to control whether or not to flow refrigerant through the flow path FP, or the flow rate of refrigerant through the flow path FP, based on a signal corresponding to the temperature of the semiconductor chip CHP input from the temperature sensor SEN. During semiconductor packaging (PKG), the temperature rise differs for each semiconductor chip CHP. According to socket SCK4, temperature control can be performed for each semiconductor chip CHP based on the temperature rise for each semiconductor chip CHP.

[0040] Although the present invention has been specifically described above based on embodiments, it goes without saying that the present invention is not limited to the above embodiments and can be modified in various ways without departing from its essence. [Explanation of Symbols]

[0041] BLK Pressing block, BLK1 Pressing die, BLK2 Pressing plate, BLK3 Pressing plate, BMP Bump, CAV Recess, CHP Semiconductor chip, CTR Controller, CYL Cylindrical body, EM1 End member, F1 First face, F2 Second face, F3 Third face, F4 Fourth face, F5 Fifth face, F6 Sixth face, FP Flow channel, HLD Holder, LID Cover, LND1, LND2 Land, PIN1a, PIN1b End, PIN2a, PIN2b End, PIN1 Powered pin, PIN2 Pressing pin, PRE Pressing body, RA Rotating shaft, RB Rotating body, RB1 First part, RB2 Second part, SCK1, SCK2, SCK3, SCK4 Socket, SEN Temperature sensor, SPR1, SPR2, SPR3 Elastic member, STF Stiffener, SUB Substrate, SUP Support, UFL Underfill.

Claims

1. A socket used for testing semiconductor packages, Support and Pressing body and Multiple powered pins, Equipped with a lid, The semiconductor package includes a substrate including a first surface and a second surface located opposite the first surface, a plurality of semiconductor chips of different heights arranged on the first surface, and a plurality of bumps arranged on the second surface. The support has a third surface, a fourth surface located opposite to the third surface, and a recess formed on the third surface so as to be recessed toward the fourth surface. The pressing body is positioned on the semiconductor package such that the plurality of bumps face the bottom surface of the recess, with the semiconductor package positioned within the recess. Each of the plurality of current-carrying pins has a first end and is positioned within the support such that the first end protrudes from the bottom surface of the recess and contacts each of the plurality of bumps. The lid is mounted on the support such that the pressing body is pressed toward the semiconductor package. The aforementioned pressing body is a socket that is divided into multiple parts in a plan view.

2. The socket according to claim 1, wherein the plurality of parts are a plurality of pressing pins.

3. Each of the plurality of pressing pins has a second end that contacts the semiconductor package, a third end located on the opposite side of the second end, and an elastic member that generates an elastic force that presses the second end against the semiconductor package when the distance between the second end and the third end decreases. The socket according to claim 2, wherein the elastic modulus of one of the plurality of pressure pins is different from the elastic modulus of another of the plurality of pressure pins.

4. The socket according to claim 3, wherein each of the plurality of pressing pins comprises a cylindrical body, a first end member including the second end and disposed inside the cylindrical body such that the second end protrudes outside the cylindrical body, a second end member including the third end and disposed inside the cylindrical body such that the third end protrudes outside the cylindrical body, and an elastic member disposed inside the cylindrical body between the first end member and the second end member.

5. The socket according to claim 1, wherein the aforementioned plurality of parts are a plurality of pressing blocks.

6. Each of the plurality of pressing blocks has a fifth surface that contacts the semiconductor package, a sixth surface located on the opposite side of the fifth surface, and an elastic member that generates an elastic force that presses the fifth surface against the semiconductor package when the distance between the fifth surface and the sixth surface decreases. The socket according to claim 5, wherein the elastic modulus of one of the plurality of pressing blocks is different from the elastic modulus of another of the plurality of pressing blocks.

7. The socket according to claim 6, wherein each of the plurality of pressing blocks has a first pressing plate forming the fifth surface, a second pressing plate forming the sixth surface, a pressing die disposed between the first pressing plate and the second pressing plate, and the elastic member disposed between the first pressing plate and the second pressing plate within the pressing die.

8. The socket according to claim 5, wherein each of the plurality of pressing blocks has a temperature sensor for detecting the temperature of the portion of the semiconductor package that each of the plurality of pressing blocks is in contact with.

9. With additional controllers, A flow path for the refrigerant is formed within the aforementioned plurality of pressing blocks. The socket according to claim 8, wherein the controller is configured to control the temperature of each of the plurality of pressing blocks based on the temperature detected by the temperature sensor.

10. The semiconductor package further comprises a stiffener located on the outer peripheral edge of the first surface, The socket according to claim 1, wherein some of the multiple bumps overlap the stiffener in a plan view.

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