Liquid dispensing substrate, liquid dispensing head, and method for manufacturing the liquid dispensing substrate

Abstract

The objective is to provide a liquid discharge substrate that can distribute liquid evenly to multiple individual flow channels. [Solution] The liquid discharge substrate has a plurality of discharge ports, a plurality of pressure chambers, a plurality of energy generating elements, a plurality of individual flow channels, a common flow channel, and a damper membrane. The plurality of individual flow channels are arranged along a first direction, the common flow channel extends along the first direction and supplies liquid in a second direction intersecting the first direction, and a connection section is provided in the middle of the common flow channel, which consists of a plurality of connecting flow channels that supply liquid in the second direction and are arranged along the first direction.

Description

Technical Field

[0001] The present disclosure relates to a liquid ejection substrate, a liquid ejection head, and a method for manufacturing a liquid ejection substrate.

Background Art

[0002] Patent Document 1 discloses a recording head (liquid ejection substrate) including a plurality of pressure chambers, supply paths (parts of individual flow paths) connected to each of these pressure chambers, and one reservoir (part of a common flow path) connected to the supply paths. According to the recording head of Patent Document 1, each supply path communicating with one end of each pressure chamber is formed shallower than the pressure chamber, and it is realized to keep the flow path resistance of the liquid flowing into the pressure chamber constant.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] [[ID=3⑤]]In the recording head of Patent Document 1, when liquid is taken in from one inlet, the liquid is distributed to a plurality of supply paths through one reservoir connected to the inlet. And the distances from one inlet to each of the plurality of supply paths are different for each supply path.

[0005] For this reason, the timing at which the liquid reaches the supply path located at a relatively distant position from the inlet among the plurality of supply paths is delayed compared to the timing at which the liquid reaches the supply path located at a relatively close position to the inlet. If the liquid cannot be evenly distributed to each of the plurality of supply paths at the same timing, there is a risk of affecting the liquid ejection performance of the liquid ejection substrate.

[0006] Therefore, the present disclosure aims to provide a liquid discharge substrate that can distribute liquid evenly to a plurality of individual flow channels. [Means for solving the problem]

[0007] The liquid discharge substrate comprises a plurality of discharge ports, a plurality of pressure chambers for containing the liquid discharged from each of the plurality of discharge ports, a plurality of energy generating elements for generating energy to discharge the liquid from the discharge ports, a plurality of individual channels for supplying liquid to each of the plurality of pressure chambers, a common channel for supplying liquid to the plurality of individual channels in common, and a damper membrane provided so as to face a part of the common channel, wherein the plurality of individual channels are arranged along a first direction, the common channel extends in the first direction and supplies liquid in a second direction intersecting the first direction, and a connection portion is provided in the middle of the common channel, the connection portion being made up of a plurality of connecting channels that supply liquid in the second direction arranged in the first direction. [Effects of the Invention]

[0008] According to the liquid discharge substrate of this disclosure, liquid can be distributed evenly to multiple individual channels. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic perspective view of a liquid dispensing device. [Figure 2] A diagram illustrating the liquid dispensing head. [Figure 3] Cross-sectional view of line III-III in Figure 2. [Figure 4] An enlarged view of the area around the discharge port 130 in Figure 3. [Figure 5] Figure 4 shows an exploded perspective view of the cross-sectional region A. [Figure 6] (a) to (q) are diagrams showing examples of methods for manufacturing liquid-dispensing substrates. [Figure 7] (a) to (k) are diagrams showing modified examples of the method for manufacturing a liquid discharge substrate. [Figure 8]An enlarged view of the vicinity of the discharge port applicable to one embodiment. [Figure 9] Exploded perspective view of the cross-sectional area B shown in FIG. 8. [Figure 10] An enlarged view of the vicinity of the discharge port applicable to one embodiment. [Figure 11] Exploded perspective view of the cross-sectional area C shown in FIG. 10. [Figure 12] An enlarged view of the vicinity of the discharge port applicable to one embodiment. [Figure 13] Exploded perspective view of the cross-sectional area D shown in FIG. 12. [Figure 14] An enlarged view of the vicinity of the discharge port applicable to one embodiment. [Figure 15] Exploded perspective view of the cross-sectional area E shown in FIG. 14. [Figure 16] Exploded perspective view of a liquid discharge substrate applicable to one embodiment.

Embodiments for Carrying Out the Invention

[0010] Hereinafter, preferred embodiments of the present disclosure will be described. Note that the specific expressions of the names of substances and materials represented in the description do not particularly limit the scope of the present disclosure and are used to fully explain the embodiments.

[0011] [First Embodiment] <Liquid discharge device 100> FIG. 1 is a schematic perspective view of a liquid discharge device 100 applicable to this embodiment. In this embodiment, an inkjet head is adopted as a preferred example of the liquid discharge head 1.

[0012] As shown in FIG. 1, the liquid ejection device 100 includes a conveyance unit 110 that conveys a recording medium P in the conveyance direction (the direction indicated by -Y), and a one-pass type liquid ejection head 1 that moves the recording medium P at once to record an image on the recording medium P. The liquid ejection head 1 has a width longer than the width of the recording medium P (the length in the X direction). A plurality of ejection ports 130 (see FIG. 2 etc.) are formed along the width direction (X direction) of the liquid ejection head 1. A row of ejection ports is formed by these ejection ports 130.

[0013] In the present embodiment, the liquid ejection head 1 can eject four colors of liquids (for example, inks), cyan, magenta, yellow, and black, from the ejection ports 130.

[0014] To eject cyan ink, the liquid ejection head 1 includes a first liquid ejection head 1Ca corresponding to cyan ink and a second liquid ejection head 1Cb. To eject magenta ink, the liquid ejection head 1 includes a third liquid ejection head 1Ma corresponding to magenta ink and a fourth liquid ejection head 1Mb. To eject yellow ink, the liquid ejection head 1 includes a fifth liquid ejection head 1Ya corresponding to yellow ink and a sixth liquid ejection head 1Yb. To eject black ink, the liquid ejection head 1 includes a seventh liquid ejection head 1Ka corresponding to black ink and an eighth liquid ejection head 1Kb.

[0015] The recording medium P is conveyed in the conveyance direction (-Y direction) by the conveyance unit 110, and recording is performed by the liquid ejection head 1.

[0016] Note that the example of the liquid ejection device 100 is not limited to the above example. For example, the liquid ejection device 100 may be configured to be able to mount a liquid ejection head 1 of any form. As another example, the liquid ejection device 100 may include one type of liquid ejection head 1, or may include multiple types of liquid ejection heads 1 other than four types.

[0017] <Liquid ejection head 1> Figure 2 illustrates a liquid ejection head 1 applicable to this embodiment. Figure 2 shows a perspective view of one liquid ejection head 1 that ejects ink for any one of the eight liquid ejection heads 1 shown in Figure 1. In the figure, the X direction is the longitudinal direction of the liquid ejection head 1 and the direction in which the multiple ejection ports 130 are arranged. Hereinafter, the X direction will also be referred to as the first direction. The Y direction is the short direction of the liquid ejection head 1, and the recording medium P is transported in the -Y direction. Hereinafter, the Y direction will also be referred to as the second direction. The Z direction is the direction in which the liquid is ejected from the multiple ejection ports 130.

[0018] As shown in Figure 2, the liquid discharge head 1 comprises a head body 4. The head body 4 comprises a plurality (four in this embodiment) of liquid discharge substrates 2. Each of the plurality of liquid discharge substrates 2 has a plurality of discharge ports 130 formed therein.

[0019] The ink ejected from the liquid ejection head 1 is supplied from an ink tank (not shown) to the liquid ejection substrate 2 via a common supply port (not shown) of the head body 4. On the liquid ejection substrate 2, a plurality of ejection ports 130 formed at the X-direction end are arranged to overlap along the Y-direction. By arranging the liquid ejection substrate 2 in this manner, recording using a long row of ejection ports becomes possible.

[0020] <Liquid discharge board 2> Figure 3 is a cross-sectional view taken along line III-III in Figure 2.

[0021] As shown in Figure 3, the liquid discharge substrate 2 is formed by stacking multiple substrates.

[0022] The liquid discharge substrate 2 comprises a first laminate 171 including an elastic damper film 124, and a second laminate 172 including discharge ports 130. In the second laminate 172, pressure chambers 128 are formed to correspond to each of the multiple discharge ports 130 formed along the longitudinal direction (X direction) of the liquid discharge substrate 2. That is, in the second laminate 172, multiple pressure chambers 128 are formed along the longitudinal direction (X direction) of the liquid discharge substrate 2.

[0023] Furthermore, a plurality of common electrodes 300 are provided on the surface of the second substrate 102 constituting the second laminate 172 that faces the -Z direction, and are connected to the piezoelectric element 129 (see Figure 4). The common electrodes 300 are connected to a drive circuit (not shown) via a wiring member (e.g., a flexible cable).

[0024] Figure 4 is a magnified view of the area around the discharge port 130 in Figure 3. It shows the liquid discharge mechanism corresponding to one discharge port 130.

[0025] As shown in Figure 4, the liquid discharge substrate 2 includes a first laminate 171 in which multiple components are stacked, and a second laminate 172 in which multiple components are stacked. The second laminate 172 is constructed by stacking and fixing (e.g., bonding) the first substrate 101, the second substrate 102, the diaphragm 131, and the third substrate 103 in this order. The first laminate 171 is constructed by stacking and fixing (e.g., bonding) the fourth substrate 104, the damper film 124, and the fifth substrate 105 in this order.

[0026] The liquid discharge substrate 2 is created by fixing (for example, bonding) the lower surface (the surface facing downward in Figure 4) of the first laminate 171 to the upper surface (the surface facing upward in Figure 4) of the second laminate 172. The first laminate 171 has a common channel that is connected in common to a plurality of individual channels that are individually provided corresponding to each discharge port. This common channel includes an inlet 120 for introducing liquid into the liquid discharge substrate 2, a reservoir 121 for flowing the liquid introduced from the inlet 120, a connecting channel 132 connected to the reservoir 121, and a first space 125 connected to the connecting channel 132. The first space 125 becomes a common supply channel 125a for supplying liquid in common to a plurality of pressure chambers 128.

[0027] Furthermore, although not shown in the figures, the first laminate 171 is also provided with a flow channel for recovering liquid that has the same configuration as shown in Figure 4. As a result, on the recovery side, the flow channel having the same shape as the flow channel shown in Figure 4 functions as a discharge flow channel, and the inlet having the same shape as the flow channel shown in Figure 4 functions as an outlet.

[0028] In this embodiment, the reservoir 121 includes a first reservoir portion 105a formed on the fifth substrate 105, a second reservoir portion 124a formed on the damper film 124, and a third reservoir portion 104a formed on the fourth substrate 104.

[0029] Furthermore, the second laminate 172 has a discharge port 130 for discharging liquid and individual channels connected to the discharge port 130. Examples of individual channels include an individual supply opening 131a, an individual supply channel 127a, an individual recovery opening 131b, and an individual recovery channel 127b.

[0030] Although not shown in Figure 4, multiple discharge ports 130 and individual flow paths are formed along the depth direction (X direction) in Figure 4. Hereinafter, the first substrate 101, the second substrate 102, the third substrate 103, the fourth substrate 104, and the fifth substrate 105 are assumed to be silicon substrates containing silicon.

[0031] A discharge port 130 for discharging liquid is formed in the first substrate 101. When the first substrate 101 and the second substrate 102 are stacked, the discharge port 130 is formed to penetrate the first substrate 101 in the thickness direction (Z direction in Figure 4). When the second substrate 102 and the diaphragm 131 are stacked, the diaphragm 131 is formed with individual supply openings 131a and individual recovery openings 131b that penetrate the diaphragm 131 in the thickness direction.

[0032] With the diaphragm 131 and the third substrate 103 stacked, the third substrate 103 has individual supply channels 127a and individual recovery channels 127b that penetrate the third substrate 103 in the thickness direction. Furthermore, the third substrate 103 has a housing space 135 for housing an energy generating element that generates energy for discharging liquid.

[0033] In this embodiment, a piezoelectric element 129 is used as the energy generating element, whose volume changes when an electrical signal for discharging liquid is transmitted to it. With the diaphragm 131 and the third substrate 103 stacked, the housing space 135 is formed to be recessed from the bottom surface to the top surface of the third substrate 103.

[0034] With the third substrate 103 and the fourth substrate 104 stacked, the fourth substrate 104 has a common supply channel 125a, a third reservoir section 104a, and a common recovery channel 125b that penetrate the fourth substrate 104 in the thickness direction. Furthermore, the fourth substrate 104 has a common supply channel 125a and a connecting section 126 that connects to the reservoir 121.

[0035] In this disclosure, a connection is defined as a portion of a liquid supply channel that connects one region to another with multiple channels. The multiple channels within a connection are referred to as connecting channels.

[0036] In this embodiment, the connection portion 126 connects the common supply channel 125a and the third reservoir portion 104a. The connection portion 126 is formed downstream of the reservoir 121 and upstream of the multiple individual supply channels 127a in the liquid supply direction.

[0037] The connection section 126 has a common supply channel 125a and a connecting channel 132 that connects to the reservoir 121. Although not shown in Figure 4, multiple connecting channels 132 are formed along the depth direction (X direction) of Figure 4.

[0038] Furthermore, the fourth substrate 104 has a discharge channel 125c formed therein for discharging the liquid to the outside of the liquid discharge substrate 2.

[0039] For example, liquid that is not discharged from the discharge port 130 passes through the individual recovery opening 131b, the individual recovery channel 127b, the common recovery channel 125b, and the discharge channel 125c in that order. Then, it is circulated between the pressure chamber 128 and a circulation pump (not shown) located outside the liquid discharge substrate 2, and supplied again to the inlet 120. In this way, the common supply channel 125a and the common recovery channel 125b of the liquid discharge substrate 2 shown in Figure 4 are in communication with the common supply channel 125a and the common recovery channel 125b of the liquid discharge mechanism (not shown) adjacent to the liquid discharge substrate 2 shown in Figure 4.

[0040] With the fourth substrate 104 and the damper film 124 stacked, a second reservoir portion 124a is formed in the damper film 124, penetrating the damper film 124 along its thickness direction. With the damper film 124 and the fifth substrate 105 stacked, a recess 123 is formed in the fifth substrate 105, extending from the bottom surface to the top surface. Furthermore, an atmospheric communication port 122 is formed penetrating the fifth substrate 105 from the deepest part of the recess 123 toward the top surface of the fifth substrate 105. Note that no liquid flows through the atmospheric communication port 122 or the recess 123.

[0041] The fifth substrate 105 has a first reservoir portion 105a that is recessed from the lower surface to the upper surface of the fifth substrate 105, and an inlet 120 that penetrates the fifth substrate 105 from the deepest part of the first reservoir portion 105a toward the upper surface of the fifth substrate 105.

[0042] The following describes the connection of the flow path in this embodiment.

[0043] With the first substrate 101 and the second substrate 102 stacked together, the discharge port 130 is connected to the pressure chamber 128.

[0044] With the second substrate 102 and the diaphragm 131 stacked, one end of the pressure chamber 128 (the left end in the example of Figure 4) is connected to the individual supply opening 131a. On the other hand, the other end of the pressure chamber 128 (the right end in the example of Figure 4) is connected to the individual recovery opening 131b.

[0045] With the diaphragm 131 and the third substrate 103 stacked, the individual supply opening 131a is connected to the individual supply channel 127a. The individual recovery opening 131b is connected to the individual recovery channel 127b.

[0046] With the first substrate 101, the second substrate 102, the diaphragm 131, and the third substrate 103 stacked in this order, the piezoelectric element 129 is positioned at a location corresponding to the discharge port 130 (for example, approximately in the center of the pressure chamber 128).

[0047] With the third substrate 103 and the fourth substrate 104 stacked, the multiple individual supply channels 127a are connected to one common supply channel 125a. The multiple individual recovery channels 127b are connected to one common recovery channel 125b.

[0048] With the fourth substrate 104 and the damper film 124 stacked, the third reservoir section 104a is connected to the second reservoir section 124a.

[0049] With the damper film 124 and the fifth substrate 105 stacked, the second reservoir section 124a is connected to the first reservoir section 105a.

[0050] In this configuration, liquid is supplied in the following order: inlet 120, first reservoir section 105a, second reservoir section 124a, third reservoir section 104a, connecting channel 132, common supply channel 125a, individual supply channel 127a, individual supply opening 131a, and pressure chamber 128.

[0051] Furthermore, the lower surface of the diaphragm 131 is exposed inside the pressure chamber 128. When a drive electrical signal is transmitted from the drive circuit (not shown) to the piezoelectric element 129, the volume of the piezoelectric element 129 changes. This changes the pressure inside the pressure chamber 128 via the diaphragm 131. As a result, the liquid filling the pressure chamber 128 is discharged as droplets from the outlet 130.

[0052] Furthermore, the liquid discharge device 100 of this embodiment (see Figure 1) is configured to recover liquid that is not discharged from the discharge port 130. When recovering liquid, the liquid flows in the following order: pressure chamber 128, individual recovery opening 131b, individual recovery flow path 127b, common recovery flow path 125b, and discharge flow path 125c, and is discharged outside the liquid discharge substrate 2. The liquid discharged outside the liquid discharge substrate 2 passes through a recovery flow path (not shown) and is returned to the inlet 120 by a pump (not shown). In this way, the liquid discharge device 100 of this embodiment is configured to circulate liquid between the pressure chamber 128 and a pump (not shown).

[0053] Furthermore, in order to achieve higher quality printing, multiple discharge ports 130 may be formed at high density. When multiple discharge ports 130 are formed at high density, the pressure chambers 128 connected to each of these discharge ports 130 are also formed at high density. Moreover, as the pressure chambers 128 are formed at high density, the common supply channel 125a and the inlet 120 are also formed at high density.

[0054] As a result, pressure fluctuations generated when discharging liquid may be transmitted from the pressure chamber 128 to the common supply channel 125a and common recovery channel 125b via the individual supply channel 127a and individual recovery channel 127b, and there is a risk that these fluctuations may be transmitted to the pressure chamber 128 of an adjacent liquid discharge mechanism. If pressure fluctuations generated in one liquid discharge mechanism are transmitted to an adjacent liquid discharge mechanism, the liquid discharge operation in that liquid discharge mechanism will be affected. Therefore, in order to mitigate the effects of such pressure fluctuations, a damper membrane 124 is provided on the liquid discharge substrate 2 of this embodiment.

[0055] When the discharge ports 130 are formed at high density, the individual supply channels 127a shown in Figure 4 are configured to be close together with adjacent individual supply channels 127a in the X direction. However, the damper membrane 124 attenuates the pressure fluctuations received from each individual supply channel 127a, thereby suppressing pressure fluctuations to other individual supply channels 127a and enabling stable discharge operation in each liquid discharge mechanism.

[0056] The damper film 124 is preferably a thin metal film or an inorganic film in order to attenuate this pressure fluctuation and normalize the discharge of the adjacent liquid discharge mechanism. The thickness of the damper film 124 is preferably, for example, 10 μm or less.

[0057] Furthermore, the material of the damper film 124 is preferably a resin that has resistance to organic solvents. Examples of materials that can be applied to the damper film 124 include polyimide, epoxy, silicon, and benzocyclobutene.

[0058] Figure 5 is an exploded perspective view of the cross-sectional region A shown in Figure 4.

[0059] As shown in Figure 5, the fifth substrate 105 has an inlet 120 and a first reservoir portion 105a that is connected to the inlet 120 and extends along a first direction (X direction). The length of the first reservoir portion 105a in the first direction is longer than the length of the inlet 120 in the first direction.

[0060] A second reservoir portion 124a is formed in the damper membrane 124, which is connected to the first reservoir portion 105a. The size of the opening of the second reservoir portion 124a is the same as the size of the opening of the first reservoir portion 105a.

[0061] A third reservoir portion 104a is formed on the fourth substrate 104, which is connected to the second reservoir portion 124a. The size of the opening of the third reservoir portion 104a is the same as the size of the opening of the second reservoir portion 124a.

[0062] In other words, the length of the reservoir 121 (see Figure 4, etc.) in the first direction (X direction) is longer than the length of the inlet 120 in the first direction. This makes it possible to spread the flow of liquid taken in from the relatively small inlet 120 along the first direction in which the row of discharge ports extends.

[0063] In the fourth substrate 104, the connection portion 126 extends along the first direction. The length of the connection portion 126 in the first direction is the same as the length of the reservoir 121 in the first direction. With this configuration, even when the liquid supplied from the reservoir 121 passes through the connection portion 126, it is possible to maintain the width of the liquid flow (length in the first direction).

[0064] In this embodiment, a plurality of connecting channels 132 are arranged in the connection portion 126 along the first direction. Each of the plurality of connecting channels 132 extends along a second direction (the Y direction in Figure 5) that intersects (specifically, is perpendicular to) the first direction in a plane.

[0065] Furthermore, the number of connecting channels 132 is not limited as long as it is greater than the number of inlets 120. On the other hand, the number of inlets 120 is not limited as long as it is less than the number of connecting channels 132.

[0066] With the fourth substrate 104 and the damper film 124 stacked, the connecting portion 126 functions as a support portion that supports the damper film 124 from bottom to top.

[0067] In this embodiment, in this state, each of the multiple connection channels 132 is formed to be recessed from the upper surface to the lower surface of the fourth substrate 104. In this configuration, a portion of the upper surface of the connection portion 126 will not be in contact with the damper film 124, but sufficient adhesive area is secured on the upper surface of the connection portion 126 to fix the damper film 124.

[0068] Furthermore, each of the multiple connecting channels 132 is formed such that its length in the first direction is shorter than that of a single reservoir 121 (in this embodiment, the third reservoir section 104a).

[0069] Furthermore, each of the multiple connecting channels 132 connected to one end of the common supply channel 125a (the right end in the example of Figure 4) is formed to be shallower than the common supply channel 125a. That is, the height (length in the Z direction) of the connecting channels 132 is lower (smaller) than the height (length in the Z direction) of the common supply channel 125a. Moreover, each of the multiple connecting channels 132 is formed to be shorter in the first direction than a single common supply channel 125a.

[0070] In this configuration, when liquid flows from one third reservoir section 104a into each of the multiple connecting channels 132, the liquid strikes the right side of the connection section 126 (the side facing inward in the Y direction in the example of Figure 5), and the flow velocity is reduced. As a result, the flow velocity is equalized in each of the multiple connecting channels 132 arranged along the first direction. This suppresses the variation in flow velocity in the first direction of the flow flowing in the second direction. With this variation in flow velocity in the first direction eliminated, liquid is supplied from each of the multiple connecting channels 132 to one common supply channel 125a.

[0071] As described above, a plurality of individual channels arranged along the first direction are connected to the downstream side of a single common supply channel 125a. By supplying liquid to the common supply channel 125a in a state where variations in flow velocity in the first direction are eliminated, it becomes possible to supply liquid with substantially uniform flow velocity and flow pressure in each of the plurality of individual channels arranged along the first direction.

[0072] Furthermore, as described above, each of the multiple individual flow paths is connected to a pressure chamber 128 (see Figure 4, etc.), and a discharge port 130 (see Figure 4, etc.) is connected to the pressure chamber 128. Therefore, by supplying liquid to each of the multiple individual flow paths with equal flow velocity and flow pressure, it becomes possible to supply liquid to each of the multiple pressure chambers 128 with equal flow velocity and flow pressure. This makes it possible to suppress, for example, the failure of liquid to be discharged (dry firing) from the discharge port 130 formed at the end in the X direction.

[0073] [First manufacturing method] Figures 6(a) to 6(q) show examples of methods for manufacturing a liquid discharge substrate 2 that can be applied to this embodiment. The upward-facing surface of the member shown in Figures 6(a) to 6(q) is called the top surface, and the downward-facing surface is called the bottom surface.

[0074] As shown in Figure 6(a), a fifth substrate 105 is prepared.

[0075] As shown in Figure 6(b), the fifth substrate 105 has an atmospheric communication port 122, an inlet 120, a recess 123, and a first reservoir portion 105a.

[0076] As shown in Figure 6(c), the first adhesive 152 is applied to the lower surface of the fifth substrate 105. However, the first adhesive 152 is not applied to the recess 123.

[0077] As shown in Figure 6(d), a support substrate 106 is prepared to support the fifth substrate 105 (see Figure 6(c), etc.). The support substrate 106 will be removed in a later step.

[0078] As shown in Figure 6(e), an oxide film 151 is formed on the upper surface of the support substrate 106. The oxide film 151 preferably contains SiO2. Examples of the oxide film 151 include a thermal oxide film or a CVD oxide film. The oxide film 151 is removed in a subsequent step.

[0079] As shown in Figure 6(f), a damper film 124 is formed on the upper surface of the oxide film 151. For example, the damper film 124 can be formed by processing a thermoplastic polyimide into a film and fixing it to the upper surface of the oxide film 151. When fixing polyimide to the upper surface of the oxide film 151, polyamic acid may be used as a precursor. However, curing polyamic acid is preferable to processing polyimide into a film and fixing it, as it is easier to increase the bonding strength. The method for forming the damper film 124 is not particularly limited, as long as the damper film 124 can be formed.

[0080] As shown in Figure 6(g), a second reservoir portion 124a is formed from the upper surface to the lower surface of the damper membrane 124.

[0081] As shown in Figure 6(h), with the position of the second reservoir portion 124a aligned with the position of the first reservoir portion 105a, the upper surface of the damper film 124 and the lower surface of the fifth substrate 105 are bonded together via the first adhesive 152. In this way, a bonded substrate including the support substrate 106, the damper film 124, and the fifth substrate 105 is formed.

[0082] As shown in Figure 6(i), the support substrate 106 is removed from the bonded substrate which includes the fifth substrate 105 and the support substrate 106. When the support substrate 106 is removed, the oxide film 151 functions as a stop layer. The plug portion of the support substrate 106 can be removed by grinding and thinning the support substrate 106, and then performing dry etching or wet etching on the thinned support substrate 106, while allowing the oxide film 151 to function as a stop layer. When performing dry etching or wet etching on the support substrate 106, it is preferable to use a method that has a selectivity ratio for the oxide film 151. This is to ensure that the oxide film 151 protecting the damper film 124 remains after the support substrate 106 is removed. In this way, a bonded substrate is formed in which the oxide film 151, damper film 124, first adhesive 152, and fifth substrate 105 are laminated in this order.

[0083] As shown in Figure 6(j), the oxide film 151 formed on the lower surface of the damper film 124 is removed by etching. Examples of methods for removing the oxide film 151 include dry etching and wet etching. However, considering the protection of the damper film 124, wet etching, which stops the etching process, is preferable to dry etching.

[0084] As shown in Figure 6(k), a fourth substrate 104 is prepared.

[0085] As shown in Figure 6(l), first, the upper portion of the common supply channel 125a, the connecting channel 132, the upper portion of the third reservoir section 104a, the upper portion of the common recovery channel 125b, and the discharge channel 125c are formed from the upper surface to the lower surface of the fourth substrate 104. Next, the lower portion of the common supply channel 125a, the lower portion of the third reservoir section 104a, and the lower portion of the common recovery channel 125b are formed from the lower surface to the upper surface of the fourth substrate 104. In this way, the common supply channel 125a, the third reservoir section 104a, and the common recovery channel 125b are formed in the fourth substrate 104, penetrating the main body of the fourth substrate 104 in the Z direction. Then, the connecting section 126 of the fourth substrate 104 has a connecting channel 132 and a discharge channel 125c that are recessed from the upper surface to the lower surface of the fourth substrate 104.

[0086] As shown in Figure 6(m), the second adhesive 153 is applied to the upper surface of the fourth substrate 104. The second adhesive 153 can be applied in the same manner as the first adhesive 152 (see Figure 6(c)).

[0087] As shown in Figure 6(n), with the first reservoir portion 105a, the second reservoir portion 124a, and the third reservoir portion 104a aligned, the lower surface of the damper film 124 is bonded to the upper surface of the fourth substrate 104 via the second adhesive 153. In this way, the first laminate 171 is created.

[0088] As shown in Figure 6(o), the third adhesive 154 is applied to the lower surface of the first laminate 171 (specifically, the fourth substrate 104). The third adhesive 154 can be applied in the same manner as the first adhesive 152 (see Figure 6(c)) and the second adhesive 153 (see Figure 6(m)).

[0089] As shown in Figure 6(p), a second laminate 172 is prepared. In the second laminate 172, an ejection port 130 is formed on the first substrate 101 by etching. A diaphragm 131 is formed on the upper surface of the second substrate 102 by etching. A silicon oxide film or the like can be used as the material for the diaphragm 131. A piezoelectric element 129 is provided on the upper surface of the diaphragm 131. The main component of the material constituting the piezoelectric element is a polycrystalline ferroelectric ceramic. Examples of materials for the piezoelectric element include barium titanate (BaTiO3) or lead zirconate titanate (PZT). Individual supply channels 127a, a containment space 135, and an individual recovery channel 127b are formed on the third substrate 103 by etching.

[0090] As shown in Figure 6(q), the upper surface of the second laminate 172 and the lower surface of the first laminate 171 are bonded together via the third adhesive 154. When bonding the upper surface of the second laminate 172 and the lower surface of the first laminate 171, the positions of the individual supply channels 127a and the common supply channel 125a, and the positions of the individual recovery channels 127b and the common recovery channel 125b are aligned. In this way, the liquid discharge substrate 2 is manufactured.

[0091] [Manufacturing method] The following describes an example of the manufacturing method for the first laminate 171. The following description corresponds to each step shown in Figures 6(a) to 6(n) above.

[0092] First, a silicon substrate suitable for use as the fifth substrate 105 (see Figure 6(a)) was prepared. The silicon substrate prepared as the fifth substrate 105 had a diameter of 200 mm and a thickness of 625 μm.

[0093] Next, a photosensitive positive resist was applied to the upper surface of the fifth substrate 105 (see Figure 6(b)). A predetermined pattern was formed when the photosensitive positive resist was applied to the upper surface of the fifth substrate 105.

[0094] By combining known photolithography and known etching techniques, openings (recesses) and through-holes can be formed in the fifth substrate 105. For example, after forming a mask on the fifth substrate 105 with a resist or the like, processing with plasma etching using SF6 gas can etch the silicon and form openings in the fifth substrate 105.

[0095] When forming a through-hole in the fifth substrate 105, etching is performed on both the upper and lower surfaces of the fifth substrate 105. Then, by connecting the upper and lower surfaces of the fifth substrate 105 so as to penetrate the bottom of the recesses formed opposite each other, a through-hole can be formed.

[0096] In this embodiment, the coated resist is subjected to a semiconductor exposure apparatus at a rate of 4800 mJ / m². 2 Exposure was performed through an exposure mask to form the atmospheric communication port 122 and the inlet port 120 using the specified exposure dose. Then, development was performed using an aqueous TMAH solution to form a resist pattern layer. Furthermore, etching and passivation were repeated using SF6 gas and C4F8 gas alternately.

[0097] Specifically, the upper surface of the fifth substrate 105 was etched to a predetermined position using reactive ion etching of the Bosch process, which is capable of anisotropic etching, to form the atmospheric communication port 122 and the inlet port 120.

[0098] Then, patterning and etching to a predetermined position were performed on the lower surface of the fifth substrate 105 in the same manner as performed on the upper surface, thereby forming the first reservoir portion 105a and the recess 123.

[0099] As a result, through holes consisting of the atmospheric communication port 122 and the recess 123, and through holes consisting of the inlet port 120 and the first reservoir portion 105a are formed in the fifth substrate 105.

[0100] Furthermore, the first substrate 101 to the fourth substrate 104 (see Figure 4, etc.) are also silicon substrates. Therefore, by combining known photolithography and known etching, openings and through holes can be formed in the first substrate 101 to the fourth substrate 104, similar to the fifth substrate 105.

[0101] Next, the first adhesive 152 (see Figure 6(c)) applied to the film was transferred and applied to the lower surface of the fifth substrate 105. The thickness of the layer made of the first adhesive 152 formed on the lower surface of the fifth substrate 105 was 2 μm.

[0102] Examples of methods for applying the first adhesive 152 include using a dispenser, applying by screen printing, or applying by transferring a dry film of the bonding member.

[0103] Furthermore, the second adhesive 153 (see Figure 6(m)) and the third adhesive 154 (see Figure 6(0)) can also be applied in the same manner as the first adhesive 152.

[0104] The material of the first adhesive 152 preferably includes one resin selected from the group consisting of acrylic resin, epoxy resin, silicone resin, benzocyclobutene resin, polyamide resin, polyimide resin, and urethane resin. To obtain higher bonding strength, the material of the first adhesive 152 is more preferably benzocyclobutene resin.

[0105] Furthermore, the materials for the second adhesive 153 and the third adhesive 154 may be the same as those for the first adhesive 152.

[0106] Next, a silicon substrate suitable for use as a support substrate 106 (see Figure 6(d)) was prepared. The support substrate 106 had a diameter of 200 mm and a thickness of 725 μm.

[0107] Next, an oxide film 151 (see Figure 6(e)) was formed on the upper surface of the support substrate 106 by CVD deposition. The thickness of the oxide film 151 was 500 nm.

[0108] Next, polyimide was spin-coated onto the upper surface of the oxide film 151. This polyimide can be used as the material for the damper film 124 (see Figure 6(f)). By setting the temperature of the clean oven to 350°C and baking the polyimide coated on the oxide film 151 using the clean oven, a damper film 124 with a thickness of 3 μm was formed on the upper surface of the oxide film 151.

[0109] Next, an etching mask was formed on the upper surface of the damper film 124 using a positive-type photoresist, and etching was performed using a mixed gas containing O2 gas and CF4 gas to form a second reservoir portion 124a (see Figure 6(g)).

[0110] Next, the upper surface of the damper film 124 and the lower surface of the fifth substrate 105 were bonded together using the first adhesive 152 (see Figure 6(h)).

[0111] Next, using a backgrinding apparatus, the support substrate 106 was thinned from the bottom surface to the top surface until its thickness reached 50 μm. Then, the thinned support substrate 106 was further dry-etched using SF6 gas to expose the oxide film 151 (see Figure 6(i)).

[0112] Next, the oxide film 151 was removed using BHF (buffered hydrofluoric acid solution), exposing the damper film 124 (see Figure 6(j)).

[0113] Next, a silicon substrate suitable for use as the fourth substrate 104 (see Figure 3(k)) was prepared. The fourth substrate 104 had a diameter of 200 mm and a thickness of 625 μm.

[0114] Next, a common supply channel 125a, a connecting channel 132, an inlet 120, a common recovery channel 125b, and an outlet channel 125c were formed on the fourth substrate 104 (see Figure 6(l)).

[0115] Specifically, a photosensitive positive resist was applied to the upper surface of the fourth substrate 104 in a predetermined pattern. The applied resist was exposed to a semiconductor lithography apparatus at a rate of 4800 mJ / m². 2 Exposure was performed through an exposure mask to form the upper portion of the common supply channel 125a, the upper portion of the inlet 120, and the upper portion of the common recovery channel 125b, using the specified exposure amount.

[0116] Furthermore, the substrate was developed using an aqueous TMAH solution to form a resist pattern layer. Then, etching and passivation were repeated using SF6 gas and C4F8 gas alternately. Furthermore, the silicon substrate was etched to a predetermined position by reactive ion etching of the Bosch process, which is capable of anisotropic etching. For example, the connection channel 132 was formed by applying a predetermined pattern to the upper surface of the connection portion 126 of the fourth substrate 104 and etching it to a position where it does not penetrate the main body of the fourth substrate 104 in the height direction. As a result, the upper part of the common supply channel 125a, the connection channel 132, the upper part of the inlet 120, the upper part of the common recovery channel 125b, and the discharge channel 125c were formed.

[0117] Then, the lower portion of the common supply channel 125a, the lower portion of the inlet 120, and the lower portion of the common recovery channel 125b were formed. These were formed on the lower surface of the fourth substrate 104 by patterning and etching to a predetermined position in the same manner as the upper surface of the fourth substrate 104.

[0118] Next, the second adhesive 153 (see Figure 6(m)) was applied to the upper surface of the fourth substrate 104.

[0119] Next, the upper surface of the fourth substrate 104 and the lower surface of the damper film 124 were bonded together via the second adhesive 153 (see Figure 6(n)).

[0120] The above is a detailed explanation of the manufacturing method for the first laminate 171.

[0121] As described above, in the liquid discharge substrate 2 of this embodiment, when liquid is taken in from one inlet 120, the liquid is supplied from one reservoir 121 connected to the inlet 120 to one common supply channel 125a via multiple connecting channels 132. When liquid is supplied from one reservoir 121 to one common supply channel 125a, the flow of the liquid is restricted by the connection part 126.

[0122] In this embodiment, the liquid flowing from the reservoir 121 hits the wall of the connection section 126, reducing its flow velocity. With this configuration, the liquid flowing out of a single reservoir 121 can be distributed to multiple connection channels 132 arranged along the first direction (X direction) while maintaining a certain degree of uniformity in its flow velocity.

[0123] Therefore, liquid can be supplied from multiple connecting channels 132 to a single common supply channel 125a extending along the first direction, while reducing the variation in the flow velocity of the liquid supplied in the second direction in the first direction. Then, liquid is supplied from the single common supply channel 125a to multiple individual supply channels 127a arranged along the first direction. Furthermore, liquid is supplied to each of the multiple individual supply channels 127a with a uniform flow velocity.

[0124] Therefore, according to the liquid discharge substrate of this embodiment, liquid can be distributed evenly to multiple individual channels.

[0125] Subsequently, the liquid is supplied to the pressure chamber 128 and the discharge port 130 via the individual supply openings 131a. With this configuration, when supplying liquid from one inlet 120 to multiple discharge ports 130, stagnation of the liquid flow at the connection part 126 is mitigated, and the liquid can be supplied to all discharge ports 130 at the same flow rate.

[0126] Therefore, liquid can be supplied equally to all outlets 130 regardless of their position in the X direction. As a result, differences in the amount of liquid discharged between multiple outlets are eliminated, and an image without density unevenness can be recorded on the recording medium.

[0127] [Examples of manufacturing methods] The following describes a modified version of the manufacturing method described above with reference to the drawings. In the following description, components that are the same as or corresponding to the manufacturing method described above will be denoted by the same reference numerals and their descriptions will be omitted, with the differences being the main focus of the explanation.

[0128] Figures 7(a) to 7(k) show modified examples of the manufacturing method for the liquid discharge substrate 2.

[0129] As shown in Figure 7(a), a fifth substrate 105 is prepared.

[0130] As shown in Figure 7(b), an atmospheric communication port 122, a recess 123, an inlet 120, and a first reservoir portion 105a are formed on the fifth substrate 105.

[0131] As shown in Figure 7(c), the first adhesive 152 is applied to the lower surface of the fifth substrate 105.

[0132] As shown in Figure 7(d), a fourth substrate 104 is prepared. In the example in Figure 6(d), a support substrate 106 was prepared. However, in the manufacturing method of this embodiment, the liquid discharge substrate 2 (see Figure 7(k)) can be manufactured without using the support substrate 106.

[0133] As shown in Figure 7(e), a common supply channel 125a, a connection section 126, a connection channel 132, a third reservoir section 104a, a common recovery channel 125b, and a discharge channel 125c are formed on the fourth substrate 104.

[0134] As shown in Figure 7(f), a damper film 124 is formed on the upper surface of the fourth substrate 104 using the second adhesive 153. The material for the damper film 124 is preferably polyimide. As an example of a method for forming the damper film 124 on the upper surface of the fourth substrate 104, the second adhesive 153 is applied to the upper surface of the fourth substrate 104, and a polyimide tape is attached to the upper surface of the second adhesive 153. As another example, the second adhesive 153 is applied to the upper surface of the fourth substrate 104, and a polyimide film formed on a dry film is transferred to the upper surface of the second adhesive 153.

[0135] As shown in Figure 7(g), a second reservoir portion 124a is formed on the damper film 124. The second reservoir portion 124a can be formed by photolithography resist patterning and dry etching using O2 gas or an O2CF4 mixed gas.

[0136] As shown in Figure 7(h), the upper surface of the damper film 124 and the lower surface of the fifth substrate 105 are bonded together using the first adhesive 152. This creates the first laminate 171.

[0137] As shown in Figure 7(i), the third adhesive 154 is applied to the lower surface of the fourth substrate 104.

[0138] As shown in Figure 7(j), a second laminate 172 is prepared.

[0139] As shown in Figure 7(k), the upper surface of the second laminate 172 and the lower surface of the first laminate 171 are bonded together using the third adhesive 154. This creates the liquid discharge substrate 2.

[0140] This method also allows for the manufacture of a liquid ejection substrate 2 that can suppress the degradation of image quality. Furthermore, since the manufacturing method of this embodiment does not use a support substrate 106, the number of steps can be reduced compared to the manufacturing method of the first embodiment.

[0141] [Second Embodiment] A second embodiment of the technology of this disclosure will be described below with reference to the drawings. In the following description, components that are the same as or corresponding to the first embodiment will be denoted by the same reference numerals and their descriptions will be omitted, and the differences will be described mainly. The object of this embodiment is to provide a liquid discharge substrate that can more firmly support the damper membrane.

[0142] Figure 8 is an enlarged view of the area around the discharge port 130, which can be applied to this embodiment.

[0143] As shown in Figure 8, in this embodiment, the connecting channel 132 is formed so as to be recessed from the lower surface to the upper surface of the connecting portion 126 when the first laminate 171 and the second laminate 172 are bonded together.

[0144] Figure 9 is an exploded perspective view of the cross-sectional region B shown in Figure 8.

[0145] As shown in Figure 9, in this embodiment, no connecting channels 132 are formed on the bonding surface that adheres the connecting portion 126 and the damper film 124 (see Figure 7, etc.). In this embodiment, multiple connecting channels 132 are formed in the connecting portion 126 along the longitudinal direction (X direction), recessed from the bottom surface toward the top surface. With this configuration, the bonding area between the upper surface of the connecting portion 126 and the lower surface of the damper film 124 becomes larger than in the first embodiment. As a result, the adhesion between the fourth substrate 104 and the damper film 124 is improved compared to the first embodiment.

[0146] Therefore, the liquid discharge substrate of this embodiment can provide more robust support for the damper film.

[0147] [Third Embodiment] A third embodiment of the technology of this disclosure will be described below with reference to the drawings. In the following description, components that are the same as or corresponding to those in the first and second embodiments will be denoted by the same reference numerals and their descriptions will be omitted, with the differences being the main focus of the description. The object of this embodiment is to provide a liquid discharge substrate that can more firmly support the damper membrane.

[0148] Figure 10 is an enlarged view of the area around the discharge port 130, which can be applied to this embodiment.

[0149] As shown in Figure 10, the fourth substrate 104 of this embodiment does not have a third reservoir section 104a. In the fourth substrate 104 of this embodiment, a connection section 126 is directly connected to the reservoir 121. The connection section 126 has a plurality of connection channels 132 and a region that connects these plurality of connection channels 132 in common in the Y direction to a common supply channel 125a. Each connection channel 132 has an opening that connects to the reservoir 121 and a channel that extends in the Z direction. The reservoir 121 of this embodiment is composed of a first reservoir section 105a and a second reservoir section 124a.

[0150] Figure 11 is an exploded perspective view of the cross-sectional region C shown in Figure 10.

[0151] As shown in Figure 11, in this embodiment, each connecting channel 132 has an opening that connects to the second reservoir 124a, and each of these openings is connected to a channel that extends along the first direction (X direction).

[0152] With the upper surface of the fourth substrate 104 and the lower surface of the damper film 124 in adhesion, each of the multiple openings is connected to one second reservoir portion 124a.

[0153] Furthermore, in this embodiment, the fourth substrate 104 has a thick portion 1001 and a thin portion 1002 that is smaller in height than the thick portion 1001. Multiple openings for connecting channels 132 are formed so as to penetrate the main body of the thin portion 1002 from the upper surface to the lower surface. With this configuration, the bonding area between the upper surface of the fourth substrate 104 and the lower surface of the damper film 124 is larger than in the second embodiment.

[0154] Therefore, the liquid discharge substrate of this embodiment can support the damper membrane more firmly than the second embodiment.

[0155] [Fourth Embodiment] A fourth embodiment of the technology of this disclosure will be described below with reference to the drawings. In the following description, components that are the same as or corresponding to those in the first, second, and third embodiments will be denoted by the same reference numerals and their descriptions will be omitted, with the differences being the main focus of the description. The object of this embodiment is to provide a liquid discharge substrate that can firmly support a damper membrane and ensure the rigidity of the connection portion.

[0156] Figure 12 is an enlarged view of the area around the discharge port 130, which can be applied to this embodiment.

[0157] As shown in Figure 12, in this embodiment as well, the third reservoir portion 104a (see Figure 4, etc.) is not formed, similar to the third embodiment.

[0158] Figure 13 is an exploded perspective view of the cross-sectional region D shown in Figure 12.

[0159] As shown in Figure 13, in this embodiment, each connecting channel 132 has an opening connected to the second reservoir 124a, a region extending in the Z direction from the opening, and a region extending in the Y direction from the region and connected to the common supply channel 125a. The fourth substrate 104 of this embodiment has a plurality of openings arranged in the X direction, and a plurality of channels connected to each opening, each having a portion extending in the Z direction and a portion extending in the Y direction. With this configuration, the thickness of the connecting portion 126 is increased compared to the third embodiment, and the rigidity of the connecting portion 126 is improved. In addition, since the channel length of each connecting channel is longer compared to the above embodiment, the effect of reducing variations in flow velocity in the first direction can be further enhanced.

[0160] Furthermore, similar to the third embodiment, the adhesive area between the upper surface of the fourth substrate 104 and the lower surface of the damper film 124 is ensured.

[0161] Therefore, the liquid discharge substrate of this embodiment can firmly support the damper membrane and ensure the rigidity of the connection portion.

[0162] [Fifth Embodiment] A fifth embodiment of the technology of this disclosure will be described below with reference to the drawings. In the following description, components that are the same as or corresponding to those in the first, second, third, and fourth embodiments will be denoted by the same reference numerals and their descriptions will be omitted, with the differences being the main focus of the description. The object of this embodiment is to provide a liquid ejection substrate that can suppress the degradation of image quality.

[0163] Figure 14 is an enlarged view of the area around the discharge port 130, which can be applied to this embodiment.

[0164] As shown in Figure 14, the connection portion 126 of this embodiment is formed on the third substrate 103. The connection channel 132 is formed so as to be recessed from the upper surface to the lower surface of the third substrate 103, with the upper surface of the third substrate 103 and the lower surface of the fourth substrate 104 in adhesion. That is, the connection portion 126 of this embodiment is provided between the common supply channel 125a and the individual supply channel 127a.

[0165] With the upper surface of the third substrate 103 and the lower surface of the fourth substrate 104 bonded together, the upper opening of the connecting channel 132 is connected to the third reservoir 104a and the common supply channel 125a. With the lower surface of the third substrate 103 and the upper surface of the diaphragm 131 bonded together, the individual supply channel 127a is formed to extend from the bottom surface of the connecting channel 132 toward the lower surface of the third substrate 103.

[0166] This configuration suppresses variations in the flow velocity of the liquid supplied from the reservoir 121 between the common supply channel and the individual supply channels, making it possible to equalize the flow velocity of the liquid supplied to each of the multiple individual supply channels 127a. In this way, the connecting channel 132 of this embodiment has the function of regulating the flow of liquid.

[0167] In this embodiment, the discharge channel 125c is formed in the third substrate 103. Therefore, in this embodiment, liquid is discharged to the outside from the third substrate 103.

[0168] Figure 15 is an exploded perspective view of the cross-sectional region E shown in Figure 14.

[0169] As shown in Figure 15, the connection portion 126 in this embodiment is formed on the third substrate 103. That is, the multiple connection channels 132 included in the connection portion 126 are formed between the common supply channel 125a and the multiple individual supply channels in the circulation direction.

[0170] Furthermore, multiple openings for individual supply channels 127a are formed on the bottom surface of the connecting channel 132 along the first direction. In this manner, in this embodiment, liquid is distributed from one supply channel (one reservoir 121 and one connecting channel 132) to each of the multiple individual supply channels 127a at the bottom surface of the connecting channel 132.

[0171] As described above, in the liquid discharge substrate of this embodiment, the liquid taken in from one inlet 120 has its flow velocity adjusted by the connecting channel 132. Then, it is supplied to the pressure chamber 128 via multiple individual supply channels 127a and individual supply openings 131a. With this configuration, stagnation of the liquid flow when supplying liquid from one inlet 120 to multiple pressure chambers 128 is mitigated, and liquid can be supplied to all pressure chambers 128 at the same flow velocity. Therefore, when discharging liquid, differences in the amount of liquid supplied to the pressure chambers 128 are eliminated, and the same amount of liquid can be discharged from all discharge ports 130.

[0172] Therefore, even with a liquid ejection head of this configuration, it is possible to suppress the deterioration of image quality.

[0173] [Sixth Embodiment] A sixth embodiment of the technology of this disclosure will be described below with reference to the drawings. In the following description, components that are the same as or corresponding to those in the first, second, third, fourth, and fifth embodiments will be denoted by the same reference numerals and their descriptions will be omitted, with the differences being the main focus of the description.

[0174] The objective of this embodiment is to provide a liquid ejection substrate that can suppress the degradation of image quality.

[0175] Figure 16 is an exploded perspective view of a liquid discharge substrate 2 applicable to this embodiment. In Figure 16, for ease of explanation, the fifth substrate 105 (see Figure 4, etc.) is not shown.

[0176] As shown in Figure 16, in the liquid discharge substrate 2 of this embodiment, a first substrate 101, a second substrate 102, a diaphragm 131, a common flow path member 501, and a damper membrane 124 are stacked in this order. A discharge port 130 is formed in the first substrate 101. Multiple pressure chambers 128 and multiple individual supply channels 127a and individual recovery channels 127b are formed in the second substrate 102. A piezoelectric element 129 is provided in the diaphragm 131.

[0177] In this embodiment, the diaphragm 131 has a plurality of first through holes 513 that penetrate the diaphragm 131 in the height direction while the diaphragm 131 is sandwiched between the second substrate 102 and the common flow channel member 501. With the upper surface of the first substrate 101 and the lower surface of the second substrate 102 bonded together, each of the plurality of first through holes 513 is connected to each of the plurality of individual supply channels 127a or individual recovery channels 127b formed in the second substrate 102. In this embodiment, a part of the individual supply channels 127a or individual recovery channels 127b is formed in this way.

[0178] The common flow channel member 501 has the function of the third substrate 103 and the function of the fourth substrate 104 (see Figure 4, etc.). The common flow channel member 501 has one first common supply channel 1501, a plurality of second common supply channels 510, one first common recovery channel 1502, and a plurality of second common recovery channels 511 formed thereon. The first common supply channel 1501 and the first common recovery channel 1502 extend along the longitudinal direction (X direction) of the common flow channel member 501.

[0179] Multiple second common supply channels 510 are connected to one first common supply channel 1501 via connecting channels 132 formed in the connecting portion 126 and extend along the short direction (Y direction) of the common channel member 501. Multiple second common recovery channels 511 are connected to one first common recovery channel 1502 via connecting channels 132 formed in the connecting portion 126 and extend along the short direction (Y direction) of the common channel member 501.

[0180] Multiple second common supply channels 510 and multiple second common recovery channels 511 are arranged alternately along the longitudinal direction (X direction) of the common channel member 501. A second common supply channel 510 and an adjacent second common recovery channel 511 are separated by a partition wall 58.

[0181] With the upper surface of the diaphragm 131 and the lower surface of the common flow channel member 501 in adhesion, a second through-hole 514 is formed in the bottom of the second common supply channel 510 and the bottom of the second common recovery channel 511, penetrating these bottoms in the height direction. In this embodiment, a part of the individual supply channel 127a or the individual recovery channel 127b is formed in this manner.

[0182] With the upper surface of the diaphragm 131 and the lower surface of the common flow channel member 501 bonded together, the first through-hole 513 is connected to the second through-hole 514. This makes it possible to supply liquid from the second through-hole 514 to the first through-hole 513, or to collect liquid from the first through-hole 513 to the second through-hole 514 at another location. The lower surface of the damper membrane 124 is bonded to the upper surface of the common flow channel member 501.

[0183] With the upper surface of the common flow channel member 501 and the lower surface of the damper membrane 124 in adhesion, a filter 505 is formed on the damper membrane 124 to trap dust and other particles contained in the liquid supplied to the first common supply channel 1501. With the upper surface of the common flow channel member 501 and the lower surface of the damper membrane 124 in adhesion, the second common supply channel 510 is sealed by the first damper region 503 provided on the damper membrane 124.

[0184] When the upper surface of the common flow channel member 501 and the upper surface of the damper membrane 124 are viewed from above, the second common supply flow channel 510 and the first damper region 503 have the same shape. When the periphery of the upper surface of the common flow channel member 501 and the lower surface of the damper membrane 124 are bonded together, the second common recovery flow channel 511 is sealed by the second damper region 504 provided on the damper membrane 124. When the upper surface of the common flow channel member 501 and the upper surface of the damper membrane 124 are viewed from above, the second common recovery flow channel 511 has the same shape.

[0185] Furthermore, the fifth substrate 105 (not shown in Figure 16) of this embodiment has openings of the same shape as the first damper region 503 and openings of the same shape as the second damper region 504. As a result, with the damper film 124 sandwiched between the common flow channel member 501 and the fifth substrate 105, the first damper region 503 and the second damper region 504 can bend in the height direction.

[0186] To efficiently obtain the vibration suppression effect (damper effect) of the liquid, it is undesirable for wrinkles to occur in the first damper region 503 and the second damper region 504. Furthermore, it is undesirable for the damper film 124 to peel off from the common flow channel member 501. Therefore, in this embodiment, the connecting flow channel 132 is formed such that its opening faces the side surface of the common flow channel member 501 (in the -Y direction in the figure).

[0187] With this configuration, the pressure propagated by the discharge operation from the discharge port 130 can be released in the -Y direction, and the pressure received by the first damper region 503 and the second damper region 504 in the +Z direction can be suppressed.

[0188] By efficiently achieving a vibration suppression effect (damper effect) in this way, pressure fluctuations that occur when discharging liquid can be efficiently suppressed. Consequently, liquid can be stably supplied to the pressure chamber 128.

[0189] According to this embodiment, a connection section 126 equipped with multiple connecting channels 132 is provided between the first common supply channel 1501 and the second common supply channel 510. Furthermore, a connection section 126 equipped with multiple connecting channels 132 is provided between the first common recovery channel 1502 and the second common recovery channel 511. This allows for the uniform supply rate of liquid to multiple second common supply channels 510 arranged in the X direction.

[0190] Therefore, the liquid ejection substrate of this embodiment can suppress the deterioration of image quality.

[0191] [Other embodiments] In the above embodiment, the connection section and the connecting channel were formed in the supply channel, but they may also be formed in the recovery channel. This configuration also allows for adjustment of the flow velocity.

[0192] In the embodiments described above, a piezoelectric element 129 (see Figure 4, etc.) was used as the energy generating element. However, piezoelectric elements are not the only elements that can be used as energy generating elements. It is also possible to use a heater that changes the pressure inside the pressure chamber by heat as the energy generating element. When a heater is used as the energy generating element, it is not necessary to provide a diaphragm 131 (see Figure 4, etc.).

[0193] In this case, the second substrate 102 and the third substrate 103 (see Figure 4, etc.) may be directly bonded together.

[0194] In the embodiments described above, silicon was used as the material for the first substrate 101 to the fifth substrate 105 and the support substrate 106. However, as long as the elastic modulus is equal to or greater than that of silicon, the materials that can be used for the first substrate 101 to the fifth substrate 105 and the support substrate 106 are not limited to silicon.

[0195] Other examples of materials that can be used as materials for the first substrate 101 to the fifth substrate 105 and the support substrate 106 include silicon carbide and silicon nitride. Further examples include various types of glass (quartz glass, borosilicate glass, alkali-free glass, and soda glass, etc.) and various types of ceramics (alumina, cermet, boron carbide, zirconia, mullite, gallium nitride, and aluminum nitride, etc.). Even when the first substrate 101 to the fifth substrate 105 and the support substrate 106 are constructed from these materials, it is possible to avoid problems caused by deformation.

[0196] This disclosure includes the following configurations or methods:

[0197] [Configuration 1] Multiple outlets, Each of the aforementioned multiple discharge ports contains a plurality of pressure chambers that contain the liquid discharged from it, Multiple energy generating elements that generate energy to discharge liquid from the aforementioned outlet, Multiple individual channels for supplying liquid to each of the aforementioned multiple pressure chambers, A common channel that supplies liquid to the aforementioned multiple individual channels, A damper membrane is provided so as to face a part of the common flow path, Equipped with, The aforementioned plurality of individual flow paths are arranged along the first direction, The common channel extends in the first direction and supplies liquid in a second direction intersecting the first direction. A connection section is provided in the middle of the common flow path, the connection section being made up of a plurality of connecting flow paths that supply liquid in the second direction, arranged in the first direction. A liquid dispensing substrate characterized by the following features.

[0198] [Configuration 2] The aforementioned connection portion supports a part of the damper membrane. Liquid dispensing substrate as described in Configuration 1.

[0199] [Configuration 3] The connecting channel is not formed on the bonding surface that adheres the connecting portion and the damper membrane. The connecting channel is formed on the surface opposite to the adhesive surface. Liquid discharge substrate as described in Configuration 2.

[0200] [Structure 4] The common channel is further provided with an inlet for supplying liquid from the outside. A liquid dispensing substrate as described in any one of configurations 1 to 3.

[0201] [Composition 5] The height of the connecting channel is lower than the height of the common channel. A liquid dispensing substrate as described in any one of configurations 1 to 4.

[0202] [Composition 6] The length in the first direction of the connecting channel is shorter than the length in the first direction of the region other than the connecting portion in the common channel. A liquid dispensing substrate as described in any one of items 1 to 5 of the configuration.

[0203] [Composition 7] Individual recovery channels connected to the pressure chamber, A common recovery channel connected to the individual recovery channels, A discharge channel connected to the aforementioned common recovery channel, Furthermore, The liquid that is not discharged from the discharge port passes through the individual recovery channel, the common recovery channel, and the discharge channel in that order, and is circulated between the pressure chamber and a pump provided outside the liquid discharge substrate, thereby being supplied back to the common channel. A liquid dispensing substrate as described in any one of items 1 to 6 of the configuration.

[0204] [Structure 8] The common flow path includes a reservoir that supplies liquid along the first direction and a third direction intersecting the second direction. The aforementioned connection channel is connected to the reservoir. A liquid dispensing substrate as described in any one of items 1 to 7 of the configuration.

[0205] [Composition 9] The common channel includes a recess, The connecting channel extends from an opening formed in the bottom surface of the recess along the direction of the individual channel. A liquid dispensing substrate as described in any one of items 1 to 8 of the configuration.

[0206] [Configuration 10] The energy generating element is a piezoelectric element whose volume changes upon receiving a predetermined electrical signal. A liquid dispensing substrate as described in any one of items 1 to 9 of the configuration.

[0207] [Composition 11] The device comprises a liquid discharge substrate as described in any one of configurations 1 to 10. A liquid dispensing head characterized by the following features.

[0208] [Method 12] A method for manufacturing a liquid dispensing substrate, comprising a first substrate, a second substrate, a third substrate, a fourth substrate, and a fifth substrate, and dispensing a liquid, A fifth substrate forming step in which an inlet for introducing liquid and a first reservoir portion connected to the inlet are formed on the fifth substrate, A damper film forming step in which a second reservoir portion penetrating the damper film is formed in an elastic damper film, A first fixing step involves aligning the positions of the second reservoir portion and the first reservoir portion and fixing the lower surface of the fifth substrate to the upper surface of the damper film, A fourth substrate forming step in which a common supply channel penetrating the fourth substrate, a third reservoir section penetrating the fourth substrate, and a connecting channel connecting the third reservoir section and the common supply channel are formed on the fourth substrate, A first laminate formation step involves aligning the positions of the third reservoir portion and the second reservoir portion, fixing the lower surface of the damper film to the upper surface of the fourth substrate, and creating a first laminate including the fourth substrate, the damper film, and the fifth substrate. A second laminate preparation step of preparing a second laminate including a first substrate having a discharge port formed thereon for discharging liquid, a second substrate connected to the discharge port and having a pressure chamber formed thereon that receives pressure, and a third substrate provided at a position corresponding to the discharge port and having an energy generating element for generating energy to discharge liquid, and having an individual channel formed thereon that is connected to the end of the pressure chamber, A second fixing step of fixing the lower surface of the first laminate to the upper surface of the second laminate, Includes, In the fourth substrate formation step, the connecting channels are formed in multiple locations along the first direction, and the number of connecting channels is greater than the number of inlets. A method for manufacturing a liquid discharge substrate, characterized by the following:

Claims

1. Multiple outlets, Each of the aforementioned multiple discharge ports contains a plurality of pressure chambers that contain the liquid discharged from it, Multiple energy generating elements that generate energy to discharge liquid from the aforementioned outlet, Multiple individual channels for supplying liquid to each of the aforementioned multiple pressure chambers, A common channel that supplies liquid to the aforementioned multiple individual channels, A damper membrane is provided so as to face a part of the common flow path, Equipped with, The aforementioned plurality of individual flow paths are arranged along the first direction, The common flow path extends in the first direction and supplies liquid in a second direction intersecting the first direction. A connection section is provided in the middle of the common flow path, in which a plurality of connecting channels for supplying liquid in the second direction are arranged in the first direction. A liquid dispensing substrate characterized by the following features.

2. The aforementioned connection portion supports a part of the damper membrane. The liquid dispensing substrate according to claim 1.

3. The connecting channel is not formed on the bonding surface that adheres the connecting portion and the damper membrane. The connecting channel is formed on the surface opposite to the adhesive surface. The liquid dispensing substrate according to claim 2.

4. The common channel is further provided with an inlet for supplying liquid from the outside. The liquid dispensing substrate according to claim 1.

5. The height of the connecting channel is lower than the height of the common channel. The liquid dispensing substrate according to claim 1.

6. The length in the first direction of the connecting channel is shorter than the length in the first direction of the region other than the connecting portion in the common channel. The liquid dispensing substrate according to claim 1.

7. Individual recovery channels connected to the pressure chamber, A common recovery channel connected to the individual recovery channels, A discharge channel connected to the aforementioned common recovery channel, Furthermore, The liquid that is not discharged from the discharge port passes through the individual recovery channel, the common recovery channel, and the discharge channel in that order, and is circulated between the pressure chamber and a pump provided outside the liquid discharge substrate, thereby being supplied back to the common channel. The liquid dispensing substrate according to claim 1.

8. The common flow path includes a reservoir that supplies liquid along the first direction and a third direction intersecting the second direction. The aforementioned connection channel is connected to the reservoir. The liquid dispensing substrate according to claim 1.

9. The common channel includes a recess, The connecting channel extends from an opening formed in the bottom surface of the recess along the direction of the individual channel. The liquid dispensing substrate according to claim 1.

10. The energy generating element is a piezoelectric element whose volume changes upon receiving a predetermined electrical signal. The liquid dispensing substrate according to claim 1.

11. A liquid discharge substrate as described in claim 1, A liquid dispensing head characterized by the following features.

12. A method for manufacturing a liquid dispensing substrate, comprising a first substrate, a second substrate, a third substrate, a fourth substrate, and a fifth substrate, and dispensing a liquid, A fifth substrate forming step in which an inlet for introducing liquid and a first reservoir portion connected to the inlet are formed on the fifth substrate, A damper film forming step in which a second reservoir portion that penetrates the damper film is formed in an elastic damper film, A first fixing step involves aligning the positions of the second reservoir portion and the first reservoir portion and fixing the lower surface of the fifth substrate to the upper surface of the damper membrane, A fourth substrate forming step in which a common supply channel penetrating the fourth substrate, a third reservoir section penetrating the fourth substrate, and a connecting channel connecting the third reservoir section and the common supply channel are formed on the fourth substrate, A first laminate formation step involves aligning the positions of the third reservoir portion and the second reservoir portion, fixing the lower surface of the damper film to the upper surface of the fourth substrate, and creating a first laminate including the fourth substrate, the damper film, and the fifth substrate. A second laminate preparation step of preparing a second laminate including a first substrate having a discharge port formed thereon for discharging liquid, a second substrate connected to the discharge port and having a pressure chamber formed thereon that receives pressure, and a third substrate provided at a position corresponding to the discharge port and having an energy generating element for generating energy to discharge liquid, and having an individual channel formed thereon that is connected to the end of the pressure chamber, A second fixing step of fixing the lower surface of the first laminate to the upper surface of the second laminate, Includes, In the fourth substrate formation step, the connecting channels are formed in multiple locations along the first direction, and the number of connecting channels is greater than the number of inlets. A method for manufacturing a liquid discharge substrate, characterized by the following:

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