Manufacturing equipment for magnetic molded bodies
The magnetic molded body manufacturing apparatus addresses inefficiencies in anisotropic bonded magnet production by circulating a concave mold through supply, heating, and molding units, enhancing productivity through parallel processing and timing adjustments.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- RESONAC CORP
- Filing Date
- 2024-11-26
- Publication Date
- 2026-06-05
Smart Images
Figure 2026092263000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to an apparatus for manufacturing a magnetic molded body.
Background Art
[0002] As a permanent magnet, there is an anisotropic bonded magnet. For example, since the crystal structure of a Sm-Fe-N-based permanent magnet is liable to deteriorate at a high temperature (about 500°C), it is difficult to manufacture a sintered magnet from a Sm-Fe-N-based permanent magnet. Therefore, a Sm-Fe-N-based permanent magnet is used as a raw material for an anisotropic bonded magnet that can be manufactured by heating at a low temperature at which the crystal structure is maintained (thermosetting of a thermosetting resin mixed with magnet powder). Further, for example, in addition to a Sm-Fe-N-based permanent magnet, an anisotropic bonded magnet using a magnet such as a Nd-Fe-B-based permanent magnet (neodymium-iron-boron-based permanent magnet) is known.
[0003] As a raw material for an anisotropic bonded magnet, a compound containing magnet powder (a large number of magnet powders made of a permanent magnet) and a thermosetting resin is used. In the manufacture of an anisotropic bonded magnet, the compound is supplied into a mold. While applying a magnetic field generated by a coil to the compound in the mold, the compound is compressed by the mold, whereby a molded body is formed from the compound. Each magnet particle (magnetic domain in each magnet particle) in the molded body is magnetized and oriented along the magnetic field. The molded body is demagnetized, the demagnetized molded body is cured by heating, and by magnetization of the cured molded body, an anisotropic bonded magnet is obtained. The residual magnetic flux density (Br), which is one of the important magnetic properties of an anisotropic bonded magnet, is improved by the orientation of magnet particles in the molded body and an increase in the filling rate of magnet particles in the molded body.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] Manufacturing anisotropic bonded magnets requires various processes, such as supplying the compound into a mold and heating and applying a magnetic field to the compound. Therefore, there is a need for improvements to increase the productivity of anisotropic bonded magnets.
[0006] Therefore, this disclosure describes a manufacturing apparatus for magnetic molded articles that can improve the productivity of magnetic molded articles. [Means for solving the problem]
[0007] One aspect of the present disclosure is [1] "a magnetic molded body manufacturing apparatus comprising: a supply unit for supplying a compound containing magnetic powder and a thermosetting resin into a concave mold; a heating unit for heating the compound in the concave mold; a molding unit for applying a magnetic field to the heated compound in the concave mold and compressing the compound to form a magnetic molded body; an extraction unit for removing the magnetic molded body from the concave mold; and a transport mechanism for transporting the concave mold, wherein the transport mechanism transports the concave mold supplied with the compound by the supply unit to the heating unit, the concave mold containing the compound heated by the heating unit to the molding unit, the concave mold containing the magnetic molded body molded by the molding unit to the extraction unit, and the concave mold from which the magnetic molded body has been removed by the extraction unit to the supply unit."
[0008] In this magnetic molded body manufacturing apparatus, the concave mold is transported by a conveying mechanism from the supply section to the heating section, molding section, and removal section in that order, and then transported back to the supply section. In other words, the conveying mechanism transports the concave mold in a circulating manner through the supply section, heating section, molding section, and removal section. As a result, the magnetic molded body manufacturing apparatus can efficiently manufacture magnetic molded bodies by using the circulating concave mold and performing processing at each section. Furthermore, the manufacturing apparatus includes a heating section for heating the compound in the concave mold and a molding section for molding a magnetic molded body by compressing the compound while applying a magnetic field. The compound, heated by the heating section, is transported to the molding section. Therefore, as soon as the concave mold containing the heated compound is transported by the transport mechanism, the molding section can immediately begin molding the magnetic molded body (compression and application of a magnetic field). In this way, the manufacturing equipment can improve the productivity of magnetic molded products.
[0009] The above-described magnetic molded body manufacturing apparatus may also be [2] "the magnetic molded body manufacturing apparatus according to [1] above, wherein the transport mechanism transports one of the concave molds to one of the supply unit, the heating unit, the molding unit, and the removal unit, while transporting another concave mold to one of the others." In this case, the magnetic molded body manufacturing apparatus can perform processing in parallel in each unit, thereby improving the productivity of the magnetic molded body.
[0010] The above-described magnetic molded body manufacturing apparatus may also be [3] "the magnetic molded body manufacturing apparatus described in [1] or [2] above, wherein the concave mold is transported from the supply unit to the output unit via the heating unit and the molding unit, and a waiting position is provided on the transport path of the concave mold from the output unit to the supply unit, and the transport mechanism transports the concave mold to the waiting position and stops the transported concave mold at the waiting position." In this case, the transport mechanism can, for example, temporarily hold the concave mold at a waiting position provided before a predetermined transport destination such as the molding unit, and then transport the concave mold to the predetermined transport destination. This allows the magnetic molded body manufacturing apparatus to adjust the timing of the transport of the concave mold to each part such as the supply unit.
[0011] The above-described magnetic molded body manufacturing apparatus may also be [4] "the magnetic molded body manufacturing apparatus according to any one of [1] to [3] above, wherein at least one of the conveying speeds among the conveying speed of the concave mold in the conveying mechanism from the supply unit to the heating unit, the conveying speed of the concave mold in the conveying mechanism from the heating unit to the molding unit, the conveying speed of the concave mold in the conveying mechanism from the molding unit to the removal unit, and the conveying speed of the concave mold in the conveying mechanism from the removal unit to the supply unit is different from the other conveying speeds." In this case, the conveying mechanism can convey the concave mold to each unit such as the supply unit at an appropriate timing.
[0012] The above-described apparatus for manufacturing a magnetic molded body may also be [5] "the molding unit compresses the compound using a first punch set in the concave mold, and the first punch is set in the concave mold in any of the supply unit, the heating unit, and the molding unit, as described in any of [1] to [4] above." In this case, the molding unit can easily mold the compound using the first punch set in the concave mold.
[0013] The above-described magnetic molded body manufacturing apparatus may also be [6] "the magnetic molded body manufacturing apparatus according to [5] above, wherein the removal unit removes the first punch from the concave mold to remove the magnetic molded body, and the transport mechanism transports the concave mold with the first punch removed to the supply unit." In this case, the removal unit can easily remove the magnetic molded body from the concave mold by removing the first punch. The concave mold with the first punch removed is then transported to the supply unit. This allows the supply unit to easily supply the compound into the transported concave mold. Thus, in the magnetic molded body manufacturing apparatus, there is no need to remove the first punch in the supply unit, which improves the production efficiency of the magnetic molded body.
[0014] The above-described apparatus for manufacturing a magnetic molded body may also be [7] "the apparatus for manufacturing a magnetic molded body according to [5] or [6] above, wherein the concave mold comprises a die having a through hole into which the compound is supplied, and a second punch inserted into one end of the through hole, the first punch being inserted into the other end of the through hole, the molding unit molding the magnetic molded body by compressing the compound supplied into the through hole of the die with the first punch and the second punch, and the removal unit removing the magnetic molded body from the concave mold by pushing the magnetic molded body out with the second punch." In this case, the removal unit can easily remove the magnetic molded body from the concave mold by pushing it out with the second punch.
[0015] The above-described magnetic molded body manufacturing apparatus may also be [8] "a magnetic molded body manufacturing apparatus according to any one of [1] to [7] above, further comprising a demagnetization unit for demagnetizing the magnetic molded body molded in the molding unit, wherein the transport mechanism transports the concave mold containing the magnetic molded body molded in the molding unit to the demagnetization unit, and transports the concave mold containing the demagnetized magnetic molded body to the removal unit." In this case, the magnetic molded body manufacturing apparatus can suppress deformation of the magnetic molded body due to the magnetic force of the magnetic molded body itself.
[0016] The above-described magnetic molded body manufacturing apparatus may also be [9] "the magnetic molded body manufacturing apparatus according to [8] above, further comprising a cooling unit for cooling the magnetic molded body molded in the molding unit, wherein the transport mechanism transports the concave mold containing the magnetic molded body molded in the molding unit to the cooling unit, and transports the concave mold containing the magnetic molded body cooled by the cooling unit to the demagnetization unit." In this case, the magnetic molded body is cooled and solidified by the cooling unit before being removed from the concave mold in the removal unit. This makes it possible to suppress deformation of the removed magnetic molded body in the magnetic molded body manufacturing apparatus. [Effects of the Invention]
[0017] According to one aspect of the present disclosure, the productivity of the magnetic molded body can be improved.
Brief Description of the Drawings
[0018] [Figure 1] FIG. 1 is a diagram showing an example of the schematic configuration of a manufacturing apparatus for a magnetic molded body according to an embodiment. [Figure 2] FIG. 2(a) is a cross-sectional view showing a concave mold. FIG. 2(b) is a cross-sectional view showing a mold unit in a state where an upper punch is set in the concave mold. [Figure 3] FIG. 3(a) is a cross-sectional view showing a state where a compound is accommodated in the concave mold. FIG. 3(b) is a cross-sectional view showing a state where an upper punch is set in the concave mold in which the compound is accommodated. [Figure 4] FIG. 4 is a cross-sectional view showing a state where a magnetic molded body is molded by a molding unit.
Modes for Carrying Out the Invention
[0019] Hereinafter, exemplary embodiments will be described with reference to the drawings. In each figure, the same or corresponding elements are denoted by the same reference numerals, and redundant descriptions are omitted.
[0020] (Overall Configuration of the Manufacturing Apparatus) A manufacturing apparatus 1 for a magnetic molded body shown in FIG. 1 manufactures a magnetic molded body from a compound supplied into a concave mold K1. The manufacturing apparatus 1 includes a supply unit 10, a heating unit 20, a molding unit 30, a cooling unit 40, a demagnetizing unit 50, a take-out unit 60, and a transfer mechanism 70.
[0021] The supply unit 10 supplies a compound containing magnetic powder and thermosetting resin into the recessed mold K1. The heating unit 20 heats the compound in the recessed mold K1. The molding unit 30 applies a magnetic field to the heated compound in the recessed mold K1 and compresses the compound to form a magnetic molded body. The cooling unit 40 cools the magnetic molded body formed in the molding unit 30. The demagnetization unit 50 demagnetizes the magnetic molded body formed in the molding unit 30 and cooled in the cooling unit 40. The removal unit 60 removes the magnetic molded body from the recessed mold K1.
[0022] The conveying mechanism 70 conveys the concave mold K1. In this embodiment, the conveying mechanism 70 conveys the concave mold K1 in the following order: from the supply unit 10 to the heating unit 20, molding unit 30, cooling unit 40, demagnetization unit 50, and removal unit 60, and then conveys the concave mold K1 from the removal unit 60 back to the supply unit 10. In this way, the conveying mechanism 70 conveys the concave mold K1 in a circulating manner from the supply unit 10 to the removal unit 60.
[0023] The concave mold K1 constitutes part of the mold unit K (see Figure 2(b)) for molding the magnetic molded body. As shown in Figure 2(a), the concave mold K1 comprises a die K11 and a lower punch (second punch) K12. The die K11 has a through hole K1a into which the compound is supplied. The lower punch K12 is inserted into one end of the through hole K1a. As a result, a recess is formed in the concave mold K1 by the inner circumferential surface of the through hole K1a of the die K11 and the end face of the lower punch K12 into which the compound is supplied.
[0024] As shown in Figure 2(b), the conveying mechanism 70 can also convey the concave mold K1 with the upper punch (first punch) K2 set. The upper punch K2 constitutes part of the mold unit K that forms the magnetic molded body. In other words, the mold unit K is composed of the concave mold K1 and the upper punch K2. The conveying mechanism 70 can convey the concave mold K1 with the upper punch K2 removed, or it can convey the concave mold K1 (i.e., the mold unit K) with the upper punch K2 set. The conveying mechanism 70 conveying the concave mold K1 includes both conveying the concave mold K1 with the upper punch K2 removed and conveying the concave mold K1 (i.e., the mold unit K) with the upper punch K2 set. The upper punch K2 is inserted into the other end of the through hole K1a of the die K11 (the end opposite to the side into which the lower punch K12 is inserted) while the compound is contained within the concave mold K1 (the recess formed by the die K11 and the lower punch K12). Within the through hole K1a of the die K11, the compound is positioned between the lower punch K12 and the upper punch K2.
[0025] The following describes the details of each part of manufacturing apparatus 1. As shown in Figure 3(a), the supply unit 10 supplies (feeds) the compound 2 into the concave mold K1, which has been transported by the transport mechanism 70. The concave mold K1, with the upper punch K2 removed, is transported to the supply unit 10 by the transport mechanism 70. The supply unit 10 is equipped with a supply mechanism that supplies the compound 2 into the concave mold K1. The configuration of the supply mechanism is not limited as long as it can supply the compound 2. Various mechanisms capable of supplying the compound 2 may be used as the supply mechanism.
[0026] Compound 2 contains magnetic powder and thermosetting resin. The magnetic powder is, for example, Nd-Fe-B magnet (Nd2Fe 14 (alloys such as B), samarium-iron-nitrogen magnets (Sm2Fe 17The magnet may be an alloy such as N3, or a ferrite magnet. Compound 2 may contain, in addition to the magnet powder and thermosetting resin, components such as a curing agent, a curing accelerator (curing catalyst), a silane coupling agent, a wax (lubricant), a flame retardant, and an organic solvent. Compound 2 may further contain a thermoplastic resin in addition to the thermosetting resin. The temperature of the compound itself supplied into the concave mold K1 may be room temperature. Compound 2 supplied into the concave mold K1 may be in the form of a powder, tablet, or paste.
[0027] In this embodiment, the supply unit 10 supplies the compound 2 into the concave mold K1, and then sets the upper punch K2 into the concave mold K1 as shown in Figure 3(b). The conveying mechanism 70 conveys the concave mold K1, into which the compound 2 has been supplied by the supply unit 10, to the heating unit 20. Here, the conveying mechanism 70 conveys the concave mold K1, into which the compound 2 has been supplied by the supply unit 10 and into which the upper punch K2 has been set, to the heating unit 20. In other words, the conveying mechanism 70 conveys the mold unit K containing the compound 2 to the heating unit 20.
[0028] The heating unit 20 heats the compound 2 inside the concave mold K1 (mold unit K). The heating temperature T at which the heating unit 20 heats the compound may be equal to or higher than the thermosetting temperature of the thermosetting resin contained in the compound 2. The thermosetting temperature can be rephrased as the temperature at which the thermosetting resin begins to cure. The heating unit 20 can heat the compound by various methods, such as using a heater. The conveying mechanism 70 conveys the mold unit K containing the compound 2 heated by the heating unit 20 to the molding unit 30. In other words, the conveying mechanism 70 conveys the concave mold K1 containing the heated compound 2 and with the upper punch K2 set inside to the molding unit 30.
[0029] As shown in Figure 4, the molding section 30 is composed of a first pressurizing mechanism P1, a second pressurizing mechanism P2, a first coil C1, and a second coil C2. The first pressurizing mechanism P1 and the second pressurizing mechanism P2 are mechanisms for compressing the compound 2 in the mold unit K. The mold unit K, which contains the compound 2, is positioned between the first pressurizing mechanism P1 and the second pressurizing mechanism P2. For example, the mold unit K may be transported (positioned) by the transport mechanism 70 to a position between the first pressurizing mechanism P1 and the second pressurizing mechanism P2. For example, the mold unit K may be transported (positioned) from the transport mechanism 70 to a position between the first pressurizing mechanism P1 and the second pressurizing mechanism P2 by a transport device provided in the molding section 30.
[0030] The mold unit K is arranged such that the lower punch K12 of the concave mold K1 faces the first pressurizing mechanism P1 and the upper punch K2 faces the second pressurizing mechanism P2. The compression direction of the compound 2 by the first pressurizing mechanism P1 and the second pressurizing mechanism P2 is in the opposing direction of the first pressurizing mechanism P1 and the second pressurizing mechanism P2. The first pressurizing mechanism P1 presses the lower punch K12 of the mold unit K toward the upper punch K2. The second pressurizing mechanism P2 presses the upper punch K2 of the mold unit K toward the lower punch K12. As a result, the compound 2 is compressed inside the die K11 by the lower punch K12 and the upper punch K2. For example, the first pressurizing mechanism P1 and the second pressurizing mechanism P2 may each be hydraulic devices. For example, only one of the first pressurizing mechanism P1 and the second pressurizing mechanism P2 may be driven, and the other may be fixed. It is sufficient that the distance between the first pressurizing mechanism P1 and the second pressurizing mechanism P2 is relatively close.
[0031] The first coil C1 and the second coil C2 are positioned to sandwich the mold unit K when the mold unit K is placed between the first pressurizing mechanism P1 and the second pressurizing mechanism P2. When the mold unit K is placed between the first pressurizing mechanism P1 and the second pressurizing mechanism P2, the mold unit K is located between the first coil C1 and the second coil C2. The molding section 30 further includes a power supply mechanism. The power supply mechanism is electrically connected to the first coil C1 and the second coil C2, respectively. The direction and absolute value of the first current generated in the first coil C1 and the direction and absolute value of the second current generated in the second coil C2 are freely controlled by the power supply mechanism. The power supply mechanism is not shown in the figure.
[0032] A magnetic field H is generated from the magnetic field generated in the first coil C1 and the magnetic field generated in the second coil C2. The combined magnetic field H may be applied to the compound 2 in the mold unit K. Alternatively, the magnetic field H generated by only one of the coils, the first coil C1 and the second coil C2, may be applied to the compound 2 in the mold unit K. For example, the direction of the magnetic field H may be perpendicular to the opposing directions of the first pressurizing mechanism P1 and the second pressurizing mechanism P2. However, the direction of the magnetic field H is not limited. The direction of the magnetic field H may be changed by changing the arrangement of the first coil C1 and the second coil C2, respectively.
[0033] When molding compound 2, the molding unit 30 applies a magnetic field H to the compound 2 in the mold unit K, which has been heated by the heating unit 20, using the first coil C1 and the second coil C2, while compressing the compound 2 in the mold unit K using the first pressurizing mechanism P1 and the second pressurizing mechanism P2. Each magnetic particle in compound 2 is magnetized and rotated by the magnetic field H, and the easy magnetization axis of the magnetic domain in each magnetic particle is oriented along the magnetic field H. In other words, each magnetic particle in compound 2 is oriented so that its magnetization direction is approximately parallel to the magnetic field H. If each magnetic particle is a single crystal grain (single magnetic domain), the magnetization direction of each magnetic particle is the same as the direction in which the easy magnetization axis of each magnetic particle extends. The heat applied to compound 2 by the heating unit 20 causes the thermosetting resin to cure, forming a magnetic molded body 2A containing magnetic particles (multiple magnetic particles) oriented along the magnetic field H and a cured product of the thermosetting resin. In other words, a magnetic molded body 2A is formed from the cured compound 2. The magnetization direction of the entire magnetic molded body 2A is approximately or perfectly parallel to the direction of the magnetic field H applied to the compound 2 by the first coil C1 and the second coil C2.
[0034] The molding unit 30 may start applying the magnetic field H to the compound 2 in the mold unit K at the same time as the compression of the compound 2 in the mold unit K. The molding unit 30 may start applying the magnetic field H to the compound 2 in the mold unit K earlier than the compression of the compound 2 in the mold unit K. The molding unit 30 may stop applying the magnetic field H to the compound 2 in the mold unit K at the same time as the molding pressure reaches its maximum value. The molding unit 30 may stop applying the magnetic field H to the compound 2 in the mold unit K when the molding pressure begins to decrease. The molding unit 30 may stop applying the magnetic field H to the compound 2 in the mold unit K at the same time as the compression of the compound in the mold unit K ends. The magnetic field H applied to the compound 2 in the mold unit K may be a static magnetic field (a continuous, constant magnetic field). The magnetic field H may also be a pulsed magnetic field (a pulsed magnetic field).
[0035] In this manner, the molding unit 30 applies a magnetic field H to the compound 2 using the first coil C1 and the second coil C2, and compresses the compound 2 using the upper punch K2 and the lower punch K12 to form a magnetic molded body 2A. After the magnetic molded body 2A is formed, the transport mechanism 70 transports the mold unit K containing the magnetic molded body 2A formed by the molding unit 30 to the cooling unit 40. In other words, the transport mechanism 70 transports the concave mold K1 containing the formed magnetic molded body 2A and with the upper punch K2 set in place to the cooling unit 40.
[0036] The cooling unit 40 cools the magnetic molded body 2A by cooling the mold unit K. For example, the cooling unit 40 may cool the mold unit K containing the magnetic molded body 2A to room temperature. For example, the cooling unit 40 can cool the magnetic molded body 2A by various cooling methods such as air cooling, water cooling, or natural cooling. When the magnetic molded body 2A is naturally cooled, the cooling unit 40 may be a cooling location. The magnetic molded body 2A inside the mold unit K becomes more solid when cooled. As a result, the mechanical strength of the magnetic molded body 2A inside the mold unit K is increased, and deformation and damage to the magnetic molded body 2A in each process after the cooling process are suppressed.
[0037] After the magnetic molded body 2A has cooled, the transport mechanism 70 transports the mold unit K containing the magnetic molded body 2A, which has been cooled by the cooling unit 40, to the demagnetization unit 50. In other words, the transport mechanism 70 transports the concave mold K1, which contains the cooled magnetic molded body 2A and has the upper punch K2 set in it, to the demagnetization unit 50.
[0038] The demagnetization unit 50 demagnetizes the magnetic molded body 2A by applying a magnetic field (reverse magnetic field) in the opposite direction to the magnetic field H applied by the molding unit 30 to the magnetic molded body 2A in the mold unit K. For example, the demagnetization unit 50 may perform demagnetization using coils similar to the first coil C1 and second coil C2 of the molding unit 30. Demagnetization of the magnetic molded body 2A suppresses deformation of the magnetic molded body 2A caused by the magnetic force of the magnetic molded body 2A itself. For example, deformation of the magnetic molded body 2A caused by the magnetic force of the magnetic molded body 2A itself is a phenomenon in which each magnet particle located near the surface of the magnetic molded body 2A protrudes from the surface of the magnetic molded body 2A along with the resin composition, and one or more protrusions containing the magnet particles and resin composition are formed on the surface of the magnetic molded body 2A. When demagnetization is performed by the demagnetization unit 50 while the magnetic molded body 2A is housed in the mold unit K, deformation and damage of the magnetic molded body 2A when the magnetic molded body 2A is removed from the mold unit K are suppressed.
[0039] After the magnetic molded body 2A is demagnetized, the transport mechanism 70 transports the mold unit K containing the demagnetized magnetic molded body 2A to the removal unit 60. In other words, the transport mechanism 70 transports the concave mold K1 containing the demagnetized magnetic molded body 2A and with the upper punch K2 set in place to the removal unit 60.
[0040] The removal unit 60 removes the upper punch K2 from the recessed mold K1 and removes the magnetic molded body 2A from the recessed mold K1. After removing the upper punch K2 from the recessed mold K1, the removal unit 60 may also remove the magnetic molded body 2A from the recessed mold K1 by pushing it out with the lower punch K12.
[0041] After the magnetic molded body 2A is removed, the transport mechanism 70 transports the concave mold K1, which has had the magnetic molded body 2A removed and the upper punch K2 removed, to the supply unit 10.
[0042] Furthermore, the magnetic molded body 2A removed from the mold unit K may undergo a further thermosetting process. In the thermosetting process, the magnetic molded body 2A is heated to a temperature above the thermosetting temperature of the thermosetting resin. As a result, the thermosetting of the epoxy resin in the magnetic molded body 2A progresses further, and the bulk density, mechanical strength, and residual magnetic flux density of the magnetic molded body 2A tend to increase further. The magnetic molded body 2A may undergo a further magnetization process. After performing the thermosetting process on the magnetic molded body 2A removed from the mold unit K, a magnetization process may be performed. In the magnetization process, a magnetic field in the same direction as the magnetic field H applied by the molding unit 30 may be applied to the magnetic molded body 2A. As a result, the magnetic molded body 2A is magnetized and becomes an anisotropic bonded magnet.
[0043] The conveying mechanism 70 may be, for example, a belt conveyor, a roller conveyor, etc. The mechanism of the conveying mechanism 70 is not limited. The conveying mechanism 70 conveys at least the concave mold K1 of the mold unit K so as to circulate between the supply unit 10 and the extraction unit 60. In this embodiment, the upper punch K2 is set in the concave mold K1 by the supply unit 10. Therefore, the conveying mechanism 70 conveys the concave mold K1 (i.e., the mold unit K) with the upper punch K2 set between the supply unit 10 and the heating unit 20, between the heating unit 20 and the molding unit 30, between the molding unit 30 and the cooling unit 40, between the cooling unit 40 and the demagnetization unit 50, and between the demagnetization unit 50 and the extraction unit 60. The conveying mechanism 70 conveys the concave mold K1 with the upper punch K2 removed between the extraction unit 60 and the supply unit 10. The conveying mechanism 70 may convey the upper punch K2, which has been removed from the concave mold K1 by the removal unit 60, to the supply unit 10 together with the concave mold K1. The upper punch K2, which has been removed from the concave mold K1 by the removal unit 60, may be conveyed to the supply unit 10 by a device other than the conveying mechanism 70.
[0044] The conveying mechanism 70 transports the concave mold K1 from the supply unit 10, through the heating unit 20, molding unit 30, cooling unit 40, and demagnetization unit 50 to the extraction unit 60, and then along the conveying path 70L from the extraction unit 60 back to the supply unit 10. The conveying path 70L is an endless conveying path where the start and end points of the conveying path are connected. The conveying path 70L may be, for example, annular (or nearly annular).
[0045] The conveying mechanism 70 may convey one concave mold K1 to one of the supply unit 10, heating unit 20, molding unit 30, cooling unit 40, demagnetization unit 50, and removal unit 60, while simultaneously conveying another concave mold K1 to one of the others. In other words, multiple concave molds K1 may exist on the conveying path 70L, and each concave mold K1 may be conveyed by the conveying mechanism 70. In this case, the conveying mechanism 70 may move multiple concave molds K1 simultaneously. Alternatively, the conveying mechanism 70 may stop one of the multiple concave molds K1 while moving another concave mold K1.
[0046] A standby position S may be provided on the transport path 70L. There may be only one standby position S, or there may be multiple standby positions S. The location of the standby position S on the transport path 70L is not particularly limited. In this embodiment, as an example, two are provided on the transport path 70L between the heating section 20 and the molding section 30. The transport mechanism 70 can also transport the concave mold K1 to the standby position S. The transport mechanism 70 may transport the concave mold K1 to the standby position S and stop the transported concave mold K1 at the standby position S. The transport mechanism 70 transports the concave mold K1 stopped at the standby position S to the next transport destination (the molding section 30 in the example of Figure 1) at a predetermined transport start timing.
[0047] The arrival timings of the multiple concave molds K1 on the transport path 70L to each of the supply unit 10 to the extraction unit 60 may be different from each other, or two or more arrival timings may be the same. The transport speed at which the transport mechanism 70 transports the concave molds K1 may be different from each other in each section (each position) on the transport path 70L. That is, at least one of the transport speeds of the concave molds K1 from the supply unit 10 to the heating unit 20, from the heating unit 20 to the molding unit 30, from the molding unit 30 to the cooling unit 40, from the cooling unit 40 to the demagnetization unit 50, from the demagnetization unit 50 to the extraction unit 60, and from the extraction unit 60 to the supply unit 10 may be different from the other transport speeds.
[0048] Along the transport path 70L, at least one of the transport distances between the supply unit 10 and the heating unit 20, the heating unit 20 and the molding unit 30, the molding unit 30 and the cooling unit 40, the cooling unit 40 and the demagnetization unit 50, the demagnetization unit 50 and the extraction unit 60, and the extraction unit 60 and the supply unit 10 may differ from the other transport distances, and all of these transport distances may be the same as each other.
[0049] As described above, in the manufacturing apparatus 1, the concave mold K1 is transported by the transport mechanism 70 in the following order from the supply unit 10 to the heating unit 20, molding unit 30, cooling unit 40, demagnetization unit 50, and removal unit 60, and then the concave mold K1 is transported again from the removal unit 60 to the supply unit 10. In other words, the transport mechanism 70 transports the concave mold K1 so that it circulates from the supply unit 10 to the removal unit 60. As a result, the manufacturing apparatus 1 can efficiently manufacture magnetic molded bodies 2A by using the concave mold K1 that circulates through each unit, such as the supply unit 10, and performing processing at each unit. Furthermore, in this embodiment, the manufacturing apparatus 1 includes a heating unit 20 for heating the compound 2 in the concave mold K1, and a molding unit 30 for molding a magnetic molded body 2A by compressing the compound 2 while applying a magnetic field. The compound 2, heated by the heating unit 20, is transported to the molding unit 30. Therefore, as soon as the mold unit K (concave mold K1) containing the heated compound 2 is transported by the transport mechanism 70, the molding unit 30 can immediately start molding (compression and application of a magnetic field) the magnetic molded body 2A. In this way, the manufacturing apparatus 1 can improve the production efficiency of the magnetic molded body 2A.
[0050] The conveying mechanism 70 may convey one concave mold K1 to one of the supply section 10 to the output section 60 while simultaneously conveying another concave mold K1 to one of the other. In other words, multiple concave molds K1 may exist along the conveying path 70L. In this case, the manufacturing apparatus 1 can process each section, such as the supply section 10, in parallel with each other, thereby improving the productivity of the magnetic molded body 2A.
[0051] A waiting position S may be provided on the transport path 70L. The transport mechanism 70 may transport the concave mold K1 to the waiting position S and stop the transported concave mold K1 at the waiting position S. In this case, the transport mechanism 70 can temporarily hold the concave mold K1 at the waiting position S provided before a predetermined transport destination, such as the molding section 30, and then transport the concave mold K1 to the predetermined transport destination. This allows the manufacturing apparatus 1 to adjust the timing at which the concave mold is transported to each part, such as the supply section 10.
[0052] The conveying speed at which the conveying mechanism 70 conveys the concave mold K1 may differ from one another in each section along the conveying path 70L. In this case, the conveying mechanism 70 can convey the concave mold to each part, such as the supply unit 10, at an appropriate timing.
[0053] In this embodiment, the supply unit 10 supplies the compound 2 to the concave mold K1 and sets the upper punch K2 in the concave mold K1. As a result, the molding unit 30 can easily mold the compound 2 using the upper punch K2 set in the concave mold K1.
[0054] The extraction unit 60 removes the upper punch K2 from the concave mold K1 to extract the magnetic molded body 2A. In this case, the extraction unit 60 can easily extract the magnetic molded body 2A from the concave mold K1 by removing the upper punch K2. The transport mechanism 70 then transports the concave mold K1, with the upper punch K2 removed by the extraction unit 60, to the supply unit 10. This allows the supply unit 10 to easily supply the compound 2 into the transported concave mold K1. Thus, in the manufacturing apparatus 1, there is no need to remove the upper punch K2 in the supply unit 10, which improves the production efficiency of the magnetic molded body 2A.
[0055] The concave mold K1 comprises a die K11 and a lower punch K12. The removal unit 60 removes the magnetic molded body 2A from the concave mold K1 by pushing the magnetic molded body 2A out with the lower punch K12. In this case, the removal unit 60 can easily remove the magnetic molded body 2A from the concave mold K1 by pushing it out with the lower punch K12.
[0056] The manufacturing apparatus 1 includes a demagnetizing unit 50 for demagnetizing the magnetic molded body 2A formed by the molding unit 30. In this case, the manufacturing apparatus 1 can suppress deformation of the magnetic molded body 2A due to the magnetic force of the magnetic molded body 2A itself.
[0057] The manufacturing apparatus 1 includes a cooling unit 40 for cooling the magnetic molded body 2A formed in the molding unit 30. In this case, the magnetic molded body 2A is cooled and solidified by the cooling unit 40 before being removed from the concave mold K1 in the removal unit 60. This allows the manufacturing apparatus 1 to suppress deformation of the removed magnetic molded body 2A.
[0058] Although embodiments of the present disclosure have been described above, the present disclosure is not limited to the above embodiments. For example, the magnetic molded body 2A molded by the molding unit 30 may be a completed anisotropic bonded magnet. The magnetization direction of the entire anisotropic bonded magnet is substantially or perfectly parallel to the direction of the magnetic field H applied to the compound 2 by the first coil C1 and second coil C2 of the molding unit 30, the magnetization direction of the entire magnetic molded body 2A, and the magnetization direction of each magnetic particle in the bonded magnet. If the magnetic molded body 2A molded by the molding unit 30 is a completed anisotropic bonded magnet, demagnetization by the demagnetization unit 50 is not required.
[0059] The manufacturing apparatus 1 may not have a cooling unit 40 and a demagnetizing unit 50. In this case, the transport mechanism 70 only needs to transport the mold unit K (concave K1) containing the magnetic molded body 2A formed by the molding unit 30 to the removal unit 60.
[0060] In the above embodiment, the case in which the supply unit 10 sets the upper punch K2 in the concave mold K1 was described as an example. The upper punch K2 is not limited to being set in the concave mold K1 by the supply unit 10. For example, the upper punch K2 may be set in the concave mold K1 by the heating unit 20. In this case, the conveying mechanism 70 conveys the concave mold K1, in which the compound 2 has been supplied to the inside by the supply unit 10 and the upper punch K2 has been removed, to the heating unit 20. Alternatively, the upper punch K2 may be set in the concave mold K1 by the molding unit 30. In this case, the conveying mechanism 70 conveys the concave mold K1, in which the compound 2 has been supplied to the inside by the supply unit 10 and the upper punch K2 has been removed, to the heating unit 20. The conveying mechanism 70 then conveys the concave mold K1, in which the compound 2 heated by the heating unit 20 has been contained and the upper punch K2 has been removed, to the molding unit 30. Even in these cases, the molding unit 30 can easily mold the compound 2 using the upper punch K2 set in the concave mold K1.
[0061] The upper punch K2 only needs to be set in the concave mold K1 at least when the molding unit 30 is molding the compound 2. For example, the molding unit 30 may remove the upper punch K2 from the concave mold K1 after molding the magnetic molded body 2A. In this case, the transport mechanism 70 transports the concave mold K1 containing the magnetic molded body 2A and with the upper punch K2 removed to the cooling unit 40. The upper punch K2 may be mounted on the second pressurizing mechanism P2 of the molding unit 30. In other words, the conveying mechanism 70 may be configured to convey the concave mold K1 but not the upper punch K2. The molding unit 30 may use the upper punch K2 mounted on the second pressurizing mechanism P2 to compress the compound 2 inside the concave mold K1. [Explanation of Symbols]
[0062] 1...Manufacturing equipment (manufacturing equipment for magnetic molded bodies), 2...Compound, 2A...Magnetic molded body, 10...Supply unit, 20...Heating unit, 30...Molding unit, 40...Cooling unit, 50...Demagnetization unit, 60...Removal unit, 70...Conveying mechanism, 70L...Conveying path, K1...Concave mold, K1a...Through hole, K2...Upper punch (first punch), K11...Die, K12...Lower punch (second punch), S...Standby position, H...Magnetic field.
Claims
1. A supply unit that supplies a compound containing magnetic powder and thermosetting resin into a concave mold, A heating section for heating the compound in the concave mold, A molding section that applies a magnetic field to the compound in the heated concave mold and compresses the compound to form a magnetic molded body, A removal section for removing the magnetic molded body from the concave mold, A conveying mechanism for conveying the aforementioned concave shape, Equipped with, The aforementioned transport mechanism is The concave mold, to which the compound has been supplied by the supply unit, is conveyed to the heating unit. The concave mold containing the compound heated by the heating section is transported to the molding section. The concave mold containing the magnetic molded body formed by the molding section is transported to the removal section. A magnetic molded body manufacturing apparatus that transports the concave mold from which the magnetic molded body has been removed by the extraction unit to the supply unit.
2. The apparatus for manufacturing a magnetic molded body according to claim 1, wherein the conveying mechanism conveys one of the concave molds to one of the supply unit, the heating unit, the molding unit, and the removal unit, while conveying another concave mold to one of the others.
3. A waiting position is provided on the concave transport path from the supply unit, through the heating unit and the molding unit, to the extraction unit, and from the extraction unit to the supply unit. The apparatus for manufacturing a magnetic molded body according to claim 1, wherein the transport mechanism transports the concave mold to the standby position and stops the transported concave mold at the standby position.
4. The apparatus for manufacturing a magnetic molded body according to claim 1, wherein at least one of the conveying speeds of the concave mold in the conveying mechanism from the supply unit to the heating unit, the conveying speed of the concave mold in the conveying mechanism from the heating unit to the molding unit, the conveying speed of the concave mold in the conveying mechanism from the molding unit to the removal unit, and the conveying speed of the concave mold in the conveying mechanism from the removal unit to the supply unit is different from the other conveying speeds.
5. The molding section compresses the compound using the first punch set in the concave mold. The apparatus for manufacturing a magnetic molded body according to claim 1, wherein the first punch is set in the concave mold in any of the supply unit, the heating unit, and the molding unit.
6. The removal unit removes the first punch from the concave mold and removes the magnetic molded body. The apparatus for manufacturing a magnetic molded body according to claim 5, wherein the conveying mechanism conveys the concave mold with the first punch removed to the supply unit.
7. The aforementioned concave shape is A die having a through hole through which the compound is supplied, A second punch is inserted into one end of the through hole, It consists of, The first punch is inserted into the other end of the through hole, The molding section molds the magnetic molded body by compressing the compound supplied into the through hole of the die with the first punch and the second punch. The apparatus for manufacturing a magnetic molded body according to claim 5 or 6, wherein the removal unit removes the magnetic molded body from the concave mold by pushing the magnetic molded body out with the second punch.
8. The system further comprises a demagnetizing unit for demagnetizing the magnetic molded body formed in the molding unit, The apparatus for manufacturing a magnetic molded body according to claim 1, wherein the transport mechanism transports the concave mold containing the magnetic molded body molded in the molding section to the demagnetization section, and transports the concave mold containing the magnetic molded body that has been demagnetized by the demagnetization section to the removal section.
9. The system further includes a cooling section for cooling the magnetic molded body formed in the molding section, The apparatus for manufacturing a magnetic molded body according to claim 8, wherein the transport mechanism transports the concave mold containing the magnetic molded body molded in the molding section to the cooling section, and transports the concave mold containing the magnetic molded body cooled by the cooling section to the demagnetization section.