Multilayer electronic components

Abstract

We provide multilayer electronic components with excellent moisture resistance and reliability. [Solution] A stacked electronic component according to one embodiment of the present disclosure includes a ceramic body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, an external electrode disposed on an exposed surface of the ceramic body where the ends of the internal electrodes are exposed, a first organic layer disposed to cover at least a portion of the outer surface of the ceramic body, and a second organic layer disposed on the exposed surface to cover at least a portion of the outer surface of the external electrode, wherein the first organic layer and the second organic layer may contain different organic materials.

Description

[Technical Field]

[0001] This disclosure relates to a stacked electronic component. [Background technology]

[0002] Multilayer ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), computers, smartphones, and mobile phones to charge or discharge electricity. Due to their small size, guaranteed high capacitance, and ease of mounting, these multilayer ceramic capacitors can be used as components in a wide variety of electronic devices.

[0003] Recently, one method being considered to improve the moisture resistance reliability of multilayer ceramic capacitors is to coat the surface of the capacitor with a water-repellent agent. Silane coupling agents are mainly used as water-repellent agents for coating multilayer ceramic capacitors, but research into the thermal and chemical stability of the water-repellent agent is necessary to improve the lifespan of the water-repellent coating. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2017-135239 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] One of the various objectives of this disclosure is to provide a multilayer electronic component with excellent moisture resistance reliability.

[0006] However, the purpose of this disclosure is not limited to what is described above, and this will become clearer in the course of describing specific embodiments of this disclosure. [Means for solving the problem]

[0007] A stacked electronic component according to one embodiment of the present disclosure includes a ceramic body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, an external electrode disposed on an exposed surface of the ceramic body where the ends of the internal electrodes are exposed, a first organic layer disposed to cover at least a portion of the outer surface of the ceramic body, and a second organic layer disposed on the exposed surface to cover at least a portion of the outer surface of the external electrode, wherein the first organic layer and the second organic layer may contain different organic materials.

[0008] A stacked electronic component according to one embodiment of the present disclosure includes a ceramic body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, an external electrode disposed on the body and connected to the internal electrode, a first organic layer disposed to cover at least a portion of the outer surface of the ceramic body, and a second organic layer disposed to cover at least a portion of the outer surface of the external electrode, wherein the first organic layer is a self-assembled monolayer of a first organic material, and the second organic layer may be a self-assembled monolayer of a second organic material. [Effects of the Invention]

[0009] One of the various effects of this disclosure is that it is possible to provide a multilayer electronic component with excellent moisture resistance reliability. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present disclosure. [Figure 2] This is a perspective view showing the appearance of the ceramic body and external electrodes, with the organic layer removed from Figure 1. [Figure 3]It is a cross-sectional view schematically showing a cross-section along the line I-I' of FIG. 1. [Figure 4] It is a cross-sectional view schematically showing a cross-section along the line II-II' of FIG. 1. [Figure 5] It is a cross-sectional view schematically showing a cross-section along the line III-III' of FIG. 1. [Figure 6] It is a schematic diagram schematically showing the structure of the first organic layer. [Figure 7] It is a schematic diagram schematically showing the structure of the second organic layer.

Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present disclosure will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present disclosure can be modified into several other forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, the embodiments of the present disclosure are provided to more fully explain the present disclosure to ordinary technicians. Therefore, the shape and size of elements in the drawings may be enlarged, reduced (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0012] In addition, parts not related to the explanation are omitted in the drawings for clearly explaining the present disclosure, and the sizes and thicknesses of the illustrated components are arbitrarily shown for convenience of explanation, so the present disclosure is not necessarily limited by the illustration. Also, components having the same function within the scope of the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a certain part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0013] In the drawings, the first direction X can be defined as the thickness T direction, the second direction Y as the length L direction, and the third direction Z as the width W direction.

[0014] Stacked electronic component Figure 1 is a schematic perspective view of a stacked electronic component according to one embodiment of the present disclosure; Figure 2 is a perspective view of Figure 1 with the organic layer removed, schematically showing the appearance of the ceramic body and external electrodes; Figure 3 is a schematic cross-sectional view showing a cross section along line I-I' in Figure 1; Figure 4 is a schematic cross-sectional view showing a cross section along line II-II' in Figure 1; Figure 5 is a schematic cross-sectional view showing a cross section along line III-III' in Figure 1; Figure 6 is a schematic diagram showing the structure of the first organic layer; and Figure 7 is a schematic diagram showing the structure of the second organic layer.

[0015] Hereinafter, with reference to Figures 1 to 7, a multilayer electronic component 100 according to one embodiment of this disclosure will be described in detail. While a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, this disclosure is not limited to this and can be applied to a variety of multilayer electronic components, such as inductors, piezoelectric elements, varistors, or thermistors.

[0016] A stacked electronic component 100 according to one embodiment of the present disclosure may include a ceramic body 110, external electrodes 131 and 132, a first organic layer 140, and a second organic layer 150.

[0017] There are no particular restrictions on the specific shape of the ceramic body 110, but as shown in the figure, the ceramic body 110 can be hexahedral or a similar shape. Due to the shrinkage of the ceramic powder contained in the ceramic body 110 during the firing process, and the polishing process on the corners of the ceramic body 110, the ceramic body 110 may not be a perfectly straight hexahedron, but it can be substantially hexahedral.

[0018] The ceramic body 110 may include a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and facing each other in a third direction.

[0019] The ceramic body 110 can include a dielectric layer 111 and internal electrodes 121 and 122 that are alternately arranged with the dielectric layer 111 in the first direction. The plurality of dielectric layers 111 forming the ceramic body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so as to be difficult to confirm without using a scanning electron microscope (SEM).

[0020] The dielectric layer 111 can contain, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 is, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5), and can contain one or more of them.

[0021] The average thickness td of the dielectric layer 111 is not particularly limited. The average thickness td of the dielectric layer 111 can be, for example, 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0022] The internal electrodes 121 and 122 may include, for example, a first internal electrode 121 and a second internal electrode 122 that are alternately arranged in a first direction with the dielectric layer 111 in between. The first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having opposite polarities, can be arranged to face each other with the dielectric layer 111 in between. The first internal electrode 121 and the second internal electrode 122 can be electrically isolated from each other by the dielectric layer 111 placed between them.

[0023] The first internal electrode 121 is separated from the fourth surface 4, and the end of the first internal electrode 121 is exposed to the third surface 3 and can be connected to the first external electrode 131. The second internal electrode 122 is separated from the third surface 3, and the end of the second internal electrode 122 is exposed to the fourth surface 4 and can be connected to the second external electrode 132.

[0024] The conductive metals contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and more preferably Ni, but the present invention is not limited thereto.

[0025] The average thickness te of the internal electrodes 121 and 122 is not particularly limited. The average thickness te of the internal electrodes 121 and 122 can be, for example, 0.01 μm to 3.0 μm, 0.01 μm to 1.0 μm, or 0.01 μm to 0.4 μm.

[0026] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 refer to the average thickness of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction, respectively. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the ceramic body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness td of the dielectric layer 111 can be measured by taking the average value after measuring the thickness at multiple points on one dielectric layer 111, for example, five points equally spaced in the second direction. Similarly, the average thickness te of one internal electrode 121 and 122 can be measured by taking the average value after measuring the thickness at multiple points on one internal electrode 121 and 122, for example, five points equally spaced in the second direction. The five equally spaced points can be specified in the capacitance forming section Ac. On the other hand, if such average value measurements are performed for 10 dielectric layers 111 and 10 internal electrodes 121 and 122, and then the average value is measured, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be further generalized.

[0027] The ceramic body 110 may include a capacitance forming portion Ac which is disposed inside the ceramic body 110 and includes first internal electrodes 121 and second internal electrodes 122 which are alternately arranged with respect to the dielectric layer 111 in between, and cover portions 112 and 113 which are disposed on both sides of the capacitance forming portion Ac facing the first direction. The cover portions 112 and 113 may have a configuration similar to the dielectric layer 111, except that they do not include internal electrodes.

[0028] The average thickness tc of the cover portions 112 and 113 is not particularly limited. The average thickness tc of the cover portions 112 and 113 may be, for example, 150 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. The average thickness tc of the cover portions 112 and 113 may be, for example, 1 μm or more, 5 μm or more, or 10 μm or more. Here, the average thickness tc of the cover portions 112 and 113 refers to the average thickness of the first cover portion 112 and the second cover portion 113, respectively.

[0029] The average thickness tc of the cover portions 112 and 113 can mean the average thickness of the cover portions 112 and 113 in the first direction, and can be the average value of the thickness in the first direction measured at five equally spaced points in the cross-section of the ceramic body 110 in the first and second directions.

[0030] The ceramic body 110 may include margin portions 114 and 115 arranged on both sides of the capacitance forming portion Ac facing the third direction. That is, the margin portions 114 and 115 can represent the regions between both ends of the internal electrodes 121 and 122 and the interface of the ceramic body 110 in cross-sections obtained by cutting the ceramic body 110 in the first and third directions. The margin portions 114 and 115 may have a configuration similar to the dielectric layer 111, except that they do not include the internal electrodes 121 and 122.

[0031] The average thickness tm of the margin portions 114 and 115 is not particularly limited. The average thickness tm of the margin portions 114 and 115 may be, for example, 100 μm or less, 20 μm or less, or 15 μm or less. The average thickness tm of the margin portions 114 and 115 may be, for example, 5 μm or more, or 10 μm or more. Here, the average thickness tm of the margin portions 114 and 115 refers to the average thickness of the first margin portion 114 and the second margin portion 115, respectively.

[0032] The average thickness tm of the margin portions 114 and 115 can mean the average thickness of the margin portions 114 and 115 in the third direction, and can be the average value of the thickness in the third direction measured at five equally spaced points in the cross-section of the ceramic body 110 in the first and third directions.

[0033] The external electrodes 131 and 132 can be positioned on exposed surfaces of the ceramic body 110 where the ends of the internal electrodes 121 and 122 are exposed. For example, the external electrodes 131 and 132 may be positioned on the third surface 3 and the fourth surface 4, or they may extend over parts of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The third surface 3 and the fourth surface 4 can be defined as the first exposed surface and the second exposed surface, respectively. The external electrodes 131 and 132 may include a first external electrode 131 positioned on the first exposed surface and connected to the first internal electrode 121, and a second external electrode 132 positioned on the second exposed surface and connected to the second internal electrode 122.

[0034] The external electrodes 131 and 132 may include connecting portions CP1 and CP2 arranged on the exposed surface, and band portions BP1 and BP2 arranged on both sides of the ceramic body 110 facing each other in the first direction at the connecting portions CP1 and CP2.

[0035] The first external electrode 131 may include a first connection portion CP1 located on the third surface 3, and a first band portion BP1 extending from the first connection portion CP1 onto the first surface 1 and the second surface 2. The second external electrode 132 may include a second connection portion CP2 located on the fourth surface 4, and a second band portion BP2 extending from the second connection portion CP2 onto the first surface 1 and the second surface 2. The band portions BP1 and BP2 may extend from the connection portions CP1 and CP2 onto the fifth surface 5 and the sixth surface 6.

[0036] The type and form of the external electrodes 131 and 132 are not particularly limited and can have a multilayer structure. For example, the external electrodes 131 and 132 may include base electrode layers 131a and 132a that come into contact with the internal electrodes 121 and 122, and plating layers 131b and 132b placed on the base electrode layers 131a and 132a.

[0037] The base electrode layers 131a and 132a may be fired electrode layers containing metal and glass. The metal contained in the base electrode layers 131a and 132a may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or alloys containing these. The glass contained in the base electrode layers 131a and 132a may include, for example, one or more oxides of Ba, Ca, Zn, Al, B, and Si.

[0038] On the other hand, while the base electrode layers 131a and 132a can consist only of fired electrode layers, the present invention is not limited thereto, and the base electrode layers 131a and 132a may include a fired electrode layer containing metal and glass, and a resin electrode layer disposed on the fired electrode layer containing metal particles and resin.

[0039] The metal particles contained in the resin electrode layer may include one or more spherical particles and flake-shaped particles. The metal particles contained in the resin electrode layer may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn and / or alloys containing these. The resin contained in the resin electrode layer may include, for example, one or more epoxy resin, acrylic resin, and ethylcellulose.

[0040] The plating layers 131b and 132b may include, for example, Ni, Sn, Pd, and / or alloys containing these, and may be formed from multiple layers. The plating layers 131b and 132b may be, for example, a Ni plating layer or a Sn plating layer, and may be in a form in which the Ni plating layer and the Sn plating layer are formed sequentially. The plating layers 131b and 132b may include multiple Ni plating layers and / or multiple Sn plating layers.

[0041] The drawing illustrates a structure in which the stacked electronic component 100 has two external electrodes 131 and 132, but it is not limited to this, and the number and shape of the external electrodes 131 and 132 can be changed depending on the form of the internal electrodes 121 and 122 or other purposes.

[0042] The multilayer electronic component 100 may include a first organic layer 140 that is arranged to cover at least a portion of the outer surface of the ceramic body 110. The first organic layer 140 may be arranged on, for example, at least one of the first surface 1, second surface 2, fifth surface 5, and sixth surface 6. The first organic layer 140 may be arranged continuously on, for example, the first surface 1, second surface 2, fifth surface 5, and sixth surface 6.

[0043] In one embodiment, the first organic layer 140 can be arranged to be in contact with the outer surface of the ceramic body 110. The first organic layer 140 can be arranged to be in contact with, for example, at least one of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The first organic layer 140 can be arranged to be in contact with, for example, the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, respectively.

[0044] The stacked electronic component 100 may include a second organic layer 150 disposed on the exposed surface so as to cover at least a portion of the outer surfaces of the external electrodes 131 and 132. The second organic layer 150 may include, for example, a first coating film 151 disposed on the third surface 3 so as to cover at least a portion of the outer surface of the first external electrode 131, and a second coating film 152 disposed on the fourth surface 4 so as to cover at least a portion of the outer surface of the second external electrode 132.

[0045] In one embodiment, the second organic layer 150 can be positioned in contact with the outer surfaces of the external electrodes 131 and 132. For example, the first coating film 151 can be positioned in contact with the outer surface of the first external electrode 131, and the second coating film 152 can be positioned in contact with the outer surface of the second external electrode 132.

[0046] In one embodiment of the present disclosure, the first organic layer 140 and the second organic layer 150 may contain different organic materials. The ceramic body 110 and the external electrodes 131 and 132 may have different main components constituting their surfaces. For example, the main component constituting the outer surface of the ceramic body 110 may be ceramic, and the main component constituting the outer surface of the external electrodes 131 and 132 may be metal. The types of organic materials contained in the first organic layer 140 and the second organic layer 150 must be determined by appropriately considering the main components of the outer surfaces on which the first organic layer 140 and the second organic layer 150 are arranged, in order to ensure the thermal and chemical stability of the first organic layer 140 and the second organic layer 150. Since the first organic layer 140 and the second organic layer 150 may contain different organic materials, they can be determined by considering an organic material suitable for the first organic layer 140 and an organic material suitable for the second organic layer 150, respectively.

[0047] For example, a first organic layer 140, which is arranged to cover the outer surface of the ceramic body 110, can be made by adding a first organic substance that has excellent bonding strength with the ceramic. That is, the first organic substance contained in the first organic layer 140 may have a bonding strength with the ceramic that is greater than the bonding strength with the metal. For example, a second organic layer 150, which is arranged to cover the outer surfaces of the external electrodes 131 and 132, can be made by adding a second organic substance that has excellent bonding strength with the metal. That is, the second organic substance contained in the second organic layer 150 may have a bonding strength with the metal that is greater than the bonding strength with the ceramic. In some embodiments, the bonding strength can be measured experimentally or theoretically using methods such as temperature-programmed desorption (TPD), X-ray photoelectron spectroscopy (XPS), and density-function theory (DFT).

[0048] In one embodiment, the first organic layer 140 may contain a phosphate compound. In this disclosure, "phosphate compound" can mean a compound whose molecular structure contains at least one phosphate group. The phosphate compound may have a greater bonding force to the ceramic than to the metal. This can improve the thermal and chemical stability of the first organic layer 140, which is arranged to cover the outer surface of the ceramic body 110.

[0049] In one embodiment, the second organic layer 150 may contain a thiol compound. In this disclosure, "thiol compound" can mean a compound whose molecular structure contains at least one thiol group. The thiol compound may have a greater bonding force to the metal than to the ceramic. This can improve the thermal and chemical stability of the second organic layer 150, which is arranged to cover the outer surfaces of the external electrodes 131 and 132.

[0050] In one embodiment, at least one of the first organic layer 140 and the second organic layer 150 may be a self-assembled monolayer. For example, the first organic layer 140 may be a self-assembled monolayer of a first organic material, and the second organic layer 150 may be a self-assembled monolayer of a second organic material. A self-assembled monolayer can mean an organic monolayer that is spontaneously aligned and formed on the surface of the ceramic body 110 or the external electrodes 131, 132.

[0051] The self-assembled monolayer may include, for example, a head group chemically bonded to the surface of the ceramic body 110 or external electrodes 131, 132, a linker group linked to the head group, and functional groups linked to the ends of the linker group.

[0052] For example, the first organic layer 140 may be a phosphate-based self-assembled monolayer containing phosphate groups as head groups. That is, the first organic substance can contain phosphate groups. The second organic layer 150 may be a thiol-based self-assembled monolayer containing thiol groups as head groups. That is, the second organic substance can contain thiol groups.

[0053] For example, the phosphate groups of the phosphate compound contained in the first organic layer 140 can chemically bond to the outer surface of the ceramic body 110, and the thiol groups of the thiol compound contained in the second organic layer 150 can chemically bond to the outer surfaces of the external electrodes 131 and 132. The chemical bonds between the phosphate compound and the ceramic body 110, and the chemical bonds between the thiol compound and the external electrodes 131 and 132, may be, for example, covalent bonds. That is, the first organic layer 140 may be chemically adsorbed on the surface of the ceramic body 110, and the second organic layer 150 may be chemically adsorbed on the surface of the external electrodes 131 and 132.

[0054] The linker group of the self-assembled monolayer described above may contain aliphatic compounds and / or aromatic compounds to impart hydrophobic properties to the first organic layer 140 and the second organic layer 150. The linker group may, for example, be an alkyl group having 5 or more carbon atoms and / or a phenyl group. That is, as shown in Figure 6, the phosphoric acid compound contained in the first organic layer 140 is the linker group (R1) and may contain one or more alkyl groups having 5 or more carbon atoms and phenyl groups. Also, as shown in Figure 7, the thiol compound contained in the second organic layer 150 is the linker group (R2) and may contain one or more alkyl groups having 5 or more carbon atoms and phenyl groups.

[0055] The functional groups of the above self-assembled monolayer may be hydrophobic functional groups, and are not particularly limited, in order to improve the moisture resistance reliability of the multilayer electronic component 100. For example, the hydrophobic functional groups may include methoxy groups, benzene groups, and / or 2PACz.

[0056] The above-mentioned phosphate compound may be, for example, an alkanephosphonic acid, and the above-mentioned thiol compound may be, for example, an alkanethiol.

[0057] On the other hand, the presence, type, and characteristics of organic substances contained in the first organic layer 140 and the second organic layer 150 were determined by infrared absorption spectroscopy, ultraviolet-visible absorption spectroscopy, MS spectroscopy, 1 Measurement can be performed using methods such as 1H NMR spectroscopy and elemental analysis, but is not limited to these methods; it can be measured using general analytical techniques widely used in this industry.

[0058] The first organic layer 140 may be arranged to cover only a portion of the outer surface of the ceramic body 110. However, in order to more effectively improve the moisture resistance reliability of the multilayer electronic component 100, the first organic layer 140 may be arranged to completely cover the area of ​​the outer surface of the ceramic body 110 that is not covered by the external electrodes 131 and 132. Here, the area of ​​the outer surface of the ceramic body 110 that is not covered by the external electrodes 131 and 132 can mean, for example, the area of ​​the ceramic body 110 that is exposed to the outside between the first band portion BP1 and the second band portion BP2.

[0059] Furthermore, the second organic layer 150 may be arranged to cover only a portion of the outer surface of the external electrodes 131 and 132. However, in order to more effectively improve the moisture resistance reliability of the multilayer electronic component 100, the second organic layer 150 may be arranged to cover at least a portion of the connection portions CP1 and CP2 and at least a portion of the band portions BP1 and BP2. That is, the first coating film 151 may be arranged to cover at least a portion of the first connection portion CP1 and at least a portion of the first band portion BP1, and the second coating film 152 may be arranged to cover at least a portion of the second connection portion CP2 and at least a portion of the second band portion BP2.

[0060] More preferably, the second organic layer 150 can be arranged to completely cover the connection portions CP1, CP2 and the band portions BP1, BP2. That is, the first coating film 151 may be arranged to completely cover the first connection portion CP1 and the first band portion BP1, and the second coating film 152 may be arranged to completely cover the second connection portion CP2 and the second band portion BP2.

[0061] On the other hand, the bonding force of the first organic layer 140 to the external electrodes 131 and 132 may be lower than the bonding force of the first organic layer 140 to the ceramic body 110. That is, the first organic layer 140 formed on the external electrodes 131 and 132 may have relatively low thermal and chemical stability. Therefore, it is preferable that the first organic layer 140 is not placed on the connection portions CP1 and CP2. Also, the first organic layer 140 may be in partial contact with the ends of the band portions BP1 and BP2, but may not completely cover the band portions BP1 and BP2. For example, the band portions BP1 and BP2 may include a rounded end region and a generally flat extension region placed between the connection portions CP1 and CP2 and the end region, and the first organic layer 140 may be placed to cover a part of the end region, but may not be placed on the extension region.

[0062] Furthermore, the bonding force of the second organic layer 150 to the ceramic body 110 may be lower than the bonding force of the second organic layer 150 to the external electrodes 131 and 132. In other words, the second organic layer 150 formed on the ceramic body 110 may have relatively low thermal and chemical stability. Therefore, it is preferable that the second organic layer 150 does not come into direct contact with the ceramic body 110. The second organic layer 150 can be positioned to cover the edges of the first organic layer 140, but it is also possible that it does not completely cover the first organic layer 140.

[0063] The following describes an example of a method for manufacturing a multilayer electronic component 100. An example of a method for forming the ceramic body 110 is described. However, the method for manufacturing the multilayer electronic component 100 is not limited to this.

[0064] First, prepare ceramic powder for forming the dielectric layer 111. The ceramic powder may include, for example, one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5). The BaTiO3 powder can be synthesized, for example, by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. Examples of the synthesis method of the above ceramic powder include a solid-phase method, a sol-gel method, a hydrothermal synthesis method, etc., but the present invention is not limited thereto. Next, after drying and pulverizing the prepared ceramic powder, an organic solvent such as ethanol and a binder such as polyvinyl butyral are mixed to produce a ceramic slurry, and the ceramic slurry is applied and dried on a carrier film to prepare a ceramic green sheet.

[0065] Next, an internal electrode pattern is formed by printing a conductive paste for an internal electrode containing metal powder, binder, organic solvent, etc. on the ceramic green sheet with a predetermined thickness using a screen printing method or a gravure printing method.

[0066] After this, the ceramic green sheet with the printed internal electrode pattern is peeled off the carrier film, and then a predetermined number of layers of the ceramic green sheet with the printed internal electrode pattern are laminated and pressed together to form a ceramic laminate. A predetermined number of ceramic green sheets without the printed internal electrode pattern may be laminated on the upper and lower parts of the ceramic laminate to form cover portions 112 and 113 after firing. After this, the ceramic laminate can be cut to have a predetermined chip size, and the cut chips can be fired at a temperature of 1000°C to 1400°C to form the ceramic body 110.

[0067] On the other hand, the margin portions 114 and 115 may be formed by applying a conductive paste for internal electrodes to the ceramic green sheet, except where the margin portions are formed, and then firing it. Alternatively, in order to suppress the step caused by the internal electrodes 121 and 122, the ceramic laminate may be cut so that the internal electrode pattern is exposed on both sides of the cut chip in the third direction, then a sheet for forming the margin portion may be attached to both sides of the cut chip in the third direction, and then fired to form the margin portions 114 and 115.

[0068] Next, external electrodes 131 and 132 are formed. For example, if the base electrode layers 131a and 132a include a fired electrode layer, the ceramic body 110 can be dipped in a conductive paste for external electrodes containing metal powder, glass frit, binder, and organic solvent, and then the conductive paste for external electrodes can be fired at a temperature of 500°C to 900°C to form a fired electrode layer.

[0069] For example, if the base electrode layers 131a and 132a include a resin electrode layer, the main body can be dipped in a conductive resin composition containing metal powder, resin, binder, and organic solvent, and then cured at a temperature of 250°C to 550°C to form the resin electrode layer.

[0070] Furthermore, electroplating and / or electroless plating may be performed to form plating layers 131b and 132b on the underlying electrode layers 131a and 132a.

[0071] Next, organic layers 140 and 150 are formed. For example, a first organic substance, which is a phosphate-based compound having phosphate groups, can be coated onto the ceramic body 110 on which the external electrodes 131 and 132 are formed, using a liquid phase deposition method or a vapor phase deposition method. As a result, the phosphate groups are chemically adsorbed onto the ceramic body 110, forming the first organic layer 140 in the form of a self-assembled monolayer.

[0072] On the other hand, the first organic substance may also be partially applied to the external electrodes 131 and 132. However, since the bonding force between the first organic substance and the external electrodes 131 and 132 is weak, the first organic substance applied to the external electrodes 131 and 132 can be removed through processes such as cleaning.

[0073] Next, a second organic substance, which is a thiol-based compound having thiol groups, can be coated onto the external electrodes 131 and 132 using a liquid-phase method or a gas-phase method. As a result, the thiol groups are chemically adsorbed onto the external electrodes 131 and 132, forming a second organic layer 150 in the form of a self-assembled monolayer.

[0074] On the other hand, the second organic substance can also be partially applied to the first organic layer 140, but because the bonding force between the second organic substance and the first organic layer 140 is weak, the second organic substance applied to the first organic layer 140 can be removed by processes such as washing or naturally.

[0075] This disclosure is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims attached. Therefore, within the scope of the technical idea of ​​this disclosure as described in the claims, various forms of substitution, modification, and alteration are possible by a person with ordinary skill in the art, and these also fall within the scope of this disclosure.

[0076] Furthermore, the expression "one embodiment" does not mean that each embodiment is identical to the others, but is provided to highlight and explain the unique and distinct characteristics of each embodiment. However, the above-presented embodiments do not preclude their implementation in combination with the features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description in the other embodiment that contradicts or inconsists with that matter.

[0077] In this disclosure, the term "connected" includes not only direct connection but also indirect connection via an adhesive layer or the like. Furthermore, the term "electrically connected" includes both physically connected and non-connected cases. In addition, expressions such as "first," "second," etc., are used to distinguish one component from another and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the rights, the first component may be named the second component, and similarly, the second component may be named the first component. [Explanation of Symbols]

[0078] 100 Stacked Electronic Components 110 Main Unit 111 Dielectric layer 112, 113 Cover section 114, 115 Margin section 121, 122 Internal electrode 131, 132 External electrode CP1, CP2 connection BP1, BP2 band section 131a, 132a Base electrode layer 131b, 132b Plating layer 140 1st organic layer 150 2nd organic layer 151, 152 Coating film

Claims

1. A ceramic body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, An external electrode is disposed on the exposed surface of the ceramic body where the end of the internal electrode is exposed, A first organic layer is disposed to cover at least a portion of the outer surface of the ceramic body, The exposed surface includes a second organic layer disposed to cover at least a portion of the outer surface of the external electrode, A multilayer electronic component in which the first organic layer and the second organic layer contain different organic materials.

2. The stacked electronic component according to claim 1, wherein the first organic layer contains a phosphate-based compound.

3. The stacked electronic component according to claim 1, wherein the second organic layer contains a thiol compound.

4. The stacked electronic component according to claim 2, wherein the second organic layer comprises a thiol compound.

5. The stacked electronic component according to claim 1, wherein at least one of the first organic layer and the second organic layer is a self-assembled monolayer.

6. The phosphate group of the phosphate compound is chemically bonded to the outer surface of the ceramic body. The thiol group of the thiol compound is chemically bonded to the outer surface of the external electrode, as described in claim 4.

7. The stacked electronic component according to claim 4, wherein the phosphate compound and the thiol compound have one or more alkyl groups having 5 or more carbon atoms and phenyl groups.

8. The organic material contained in the first organic layer has a greater bonding force with the ceramic than with the metal. The stacked electronic component according to claim 1, wherein the organic substance contained in the second organic layer has a greater bonding force to the metal than to the ceramic.

9. The first organic layer is arranged so as to be in contact with the outer surface of the ceramic body. The stacked electronic component according to claim 1, wherein the second organic layer is arranged to be in contact with the outer surface of the external electrode.

10. The stacked electronic component according to claim 1, wherein the first organic layer is arranged to completely cover the area of ​​the outer surface of the ceramic body that is not covered by the external electrode.

11. The dielectric layer and the internal electrodes are arranged alternately in the first direction. The external electrode includes a connecting portion disposed on the exposed surface, and band portions that extend and are arranged on both sides of the ceramic body facing each other in the first direction at the connecting portion. The stacked electronic component according to any one of claims 1 to 10, wherein the second organic layer is arranged to cover at least a portion of the connection portion and at least a portion of the band portion.

12. The stacked electronic component according to claim 11, wherein the second organic layer is arranged to completely cover the connection portion and the band portion.

13. A ceramic body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer, An external electrode is placed on the ceramic body and connected to the internal electrode, A first organic layer is disposed to cover at least a portion of the outer surface of the ceramic body, It includes a second organic layer disposed to cover at least a portion of the outer surface of the external electrode, A multilayer electronic component in which the first organic layer is a self-assembled monolayer of a first organic material, and the second organic layer is a self-assembled monolayer of a second organic material.

14. The multilayer electronic component according to claim 13, wherein the first organic substance comprises a phosphate group.

15. The multilayer electronic component according to claim 13 or 14, wherein the second organic substance comprises a thiol group.

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