Photocurable composition, cured product of the composition, and image display device comprising the cured product

Abstract

The present invention relates to a photocurable composition, a cured product of the composition, and an image display device comprising the cured product, and more particularly, to a photocurable composition of high functionality, a cured product of the composition, and an image display device comprising the cured product, which has very excellent adhesion strength, adhesion reliability, and moisture resistance even under severe high-temperature and high-humidity environmental conditions.

Description

Technical Field

[0001] This invention relates to a photocurable composition, a cured product of the composition, and an image display device containing the cured product. More specifically, it relates to a highly functional photocurable composition, a cured product of the composition, and an image display device containing the cured product, which exhibits excellent adhesive strength, adhesive reliability, and moisture resistance even under harsh high-temperature and high-humidity environmental conditions. Background Technology

[0002] Image display devices may include organic light-emitting devices (OLEDs), wherein the light-emitting layer of the OLED disposed between opposing electrodes is formed of a thin film of organic compound. When electrons injected from one electrode and holes injected from the other electrode recombine in the light-emitting layer, an electroluminescence phenomenon occurs if current passes through the fluorescent or phosphorescent organic compound of the light-emitting layer.

[0003] Organic light-emitting devices (OLEDs) are more susceptible to moisture than other electroluminescent devices. Moisture and impurities that penetrate into OLEDs can cause oxidation of electrodes or modification of inorganic materials, resulting in a significant reduction in light-emitting properties. Therefore, technologies are being applied that use cured compositions that prevent moisture penetration and exhibit adhesive properties to protect OLEDs. Summary of the Invention

[0004] The technical problem to be solved This invention relates to a photocurable composition for organic light-emitting devices, a cured product of the composition, and an image display device containing the cured product. The purpose is to provide a high-functionality resin composition and an image display device containing the cured product of the composition, which significantly improves the adhesive strength, adhesive strength durability, adhesive strength under high temperature and high humidity environments, and moisture resistance. Therefore, it does not cause any adverse effects on the appearance of the organic light-emitting device and can protect the organic light-emitting device from the effects of moisture, etc.

[0005] The objectives of this invention are not limited to those described above. Other objectives and advantages not mentioned herein will become clearer from the following description and from the embodiments of the invention. Furthermore, it will be apparent that the objectives and advantages of this invention can be achieved through the schemes and combinations thereof indicated in the claims.

[0006] Technical solutions to solve technical problems According to one embodiment of the present invention, a curing composition may be provided comprising: a resin represented by the following chemical formula (1); a resin represented by the following chemical formula (2); a (meth)acrylate curing agent; an adhesion promoter; and a photoinitiator, satisfying the following condition 1.

[0007] Condition 1: 0.02 ≤ B / A ≤ 0.35 In condition 1, A refers to the content (parts by weight) of resin represented by chemical formula (1), and B refers to the content (parts by weight) of resin represented by chemical formula (2). Chemical formula (1) Chemical formula (2)

[0008] (In the chemical formulas (1) and (2), n, m and p are each integers greater than or equal to 1.) The resin represented by the chemical formula (2) can satisfy the following condition 2.

[0009] Condition 2: 10 ≤ {m / (m+p)} × 100 ≤ 40% The content of the (meth)acrylate curing agent may be 30 to 60 parts by weight per 100 parts by weight of the photocurable composition.

[0010] The content of the adhesion promoter may be 0.1 to 5.0 parts by weight per 100 parts by weight of the photocurable composition.

[0011] The content of the photoinitiator can be 0.1 to 5.0 parts by weight per 100 parts by weight of the photocurable composition.

[0012] The (meth)acrylate curing agent may include one or more of isoborneol acrylate (IBOA), isoborneol methacrylate (IBOMA), dicyclopentadiene methacrylate, 4-tetrabutylcyclohexyl methacrylate, and 1-adamantyl methacrylate.

[0013] The adhesive accelerator may include one or more of silane adhesive accelerators, hydroxyl-substituted acrylic adhesive accelerators, and hydrogenated hydrocarbon adhesive accelerators.

[0014] The photoinitiator may include one or more of the following: phenyl bis(2,4,6-trimethylbenzoyl)-phosphine oxide (IGM I819), 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide (TPO), phenyl bis(2,4,6-trimethylbenzoyl)-phosphine (I-819), and 2,2-Dimethoxy-1,2-diphenylethan-1-one (I651).

[0015] The photocurable composition can satisfy conditions 3 and 4 below.

[0016] Condition 3: {(V 25℃ -V i ) / V i}×100<1% Condition 4: {(V 40℃ -V i ) / V i}×100<3% In conditions 3 and 4, V i V is the initial viscosity. 25℃ V represents the viscosity after standing at 25°C for 7 days. 40℃ To determine the viscosity after standing for 7 days at 40°C, the viscosity was measured at 25°C and 2.5 rpm under these conditions.

[0017] The initial viscosity (V) i The value can be 150,000 to 250,000 mPa·s.

[0018] According to another embodiment of the present invention, a cured material can be provided, which is formed by photocuring a photocurable composition according to an embodiment of the present invention.

[0019] The solidified material can meet the following condition 5.

[0020] Condition 5: 0.5 ≤ D / C ≤ 1.1 In condition 5, C is the initial adhesive strength (N / cm). 2 D represents the post-bonding strength (N / cm) after standing at 85℃ and 85% humidity for 1000 hours. 2In this case, the cured material is bonded to the glass, and then the bond strength is measured using a Universal Testing Machine (UTM) in compression mode at a speed of 5 mm / min.

[0021] The initial adhesive strength (C) of the cured material can be 700 N / cm. 2 above.

[0022] The cured material can achieve a high-temperature / high-humidity adhesive strength of more than 50% of the initial adhesive strength (C) at 60°C.

[0023] The water vapor transmission ratio (WVTR) of the solidified material can be 9.0 gm / m. 2 • Days and below.

[0024] According to another embodiment of the present invention, an image display device may be provided, which includes a cured material according to yet another embodiment of the present invention.

[0025] Invention Effects The photocurable composition and cured product of the present invention can significantly improve the bonding strength, bonding strength durability, bonding strength and moisture resistance under high temperature and high humidity conditions, thereby exhibiting excellent functionality. Therefore, it can effectively protect organic light-emitting devices even under harsh conditions and extend the life of image display devices.

[0026] In addition to the effects described above, the specific effects of the present invention can be explained and demonstrated by referring to the following embodiments for carrying out the invention. Detailed Implementation

[0027] The aforementioned objectives, features, and advantages will be described in detail below, thus enabling those skilled in the art to readily implement the technical concept of this invention. In describing this invention, detailed descriptions of well-known techniques related to this invention will be omitted if it is determined that such detailed descriptions may unnecessarily obscure the main points of the invention.

[0028] In explaining this specification, if it is determined that a detailed description of relevant prior art may unnecessarily obscure the main points of this specification, such detailed description will be omitted.

[0029] In this specification, "(meth)acrylate" can mean both acrylate and methacrylate.

[0030] In this manual, “viscosity” can be the value (unit: mPa·s) measured using a Cone-Plate Type viscometer (Toki-sangyo, TVE-35H) at 25°C and 2.5 rpm.

[0031] In this specification, the unit "parts by weight" may refer to the weight ratio between the components.

[0032] In this specification, when using terms such as "including," "having," "constituting," "setting," or "possessing" to express structural elements, other parts may be added unless "only" is used. When structural elements are expressed in a singular form, unless otherwise explicitly stated, the inclusion of the plural form is covered.

[0033] In this specification, the explanation of structural elements should be interpreted as including the range of errors, even if not explicitly stated separately.

[0034] In this specification, the term "any structure configured on the upper (or lower) part" or "above (or below)" of a structural element not only means that any structure is configured to contact the upper (or lower) surface of the structural element, but may also mean that other structures may be located between the structural element and any structure configured on (or below) the structural element.

[0035] In this specification, unless otherwise specified, all units are in weight (wt). For example, if it is stated as "%", it is interpreted as "weight % (wt%)".

[0036] Photocurable Composition The photocurable composition of the present invention may comprise: a resin represented by the following chemical formula (1); a resin represented by the following chemical formula (2); a (meth)acrylate curing agent; an adhesion promoter; and a photoinitiator.

[0037] In particular, in this invention, a resin represented by the following chemical formula (1) as an isobutylene resin and a resin represented by the following chemical formula (2) as an isobutylene resin containing aromatic groups are mixed and used within the range of satisfying the following condition 1, thereby experimentally confirming that the moisture resistance properties can be improved and the adhesive strength can be improved, and the invention is completed.

[0038] Condition 1: 0.02 ≤ B / A ≤ 0.35 In condition 1, A refers to the content (parts by weight) of resin represented by chemical formula (1), and B refers to the content (parts by weight) of resin represented by chemical formula (2). When B / A in condition 1 is less than the lower limit of the range, the content of resin represented by chemical formula (2) may be relatively reduced, resulting in a decrease in adhesive properties. When it is greater than the upper limit of the range, the content of resin represented by chemical formula (1) may be relatively reduced, resulting in a decrease in moisture resistance. Therefore, in order to improve both adhesive properties and moisture resistance, preferably, B / A is in the range of 0.02 to 0.35, for example, more preferably, it is in the range of 0.05 to 0.33.

[0039] Chemical formula (1):

[0040] Chemical formula (2):

[0041] In the chemical formula (1), n ​​can be an integer greater than or equal to 1. The weight-average molecular weight of the resin represented by the chemical formula (1) can be in the range of 5000 to 50000 (g / mol), for example, 7000 to 40000 (g / mol), or for example, 9000 to 30000 (g / mol). When the weight-average molecular weight of the resin represented by the chemical formula (1) is less than the range, there may be a problem of reduced moisture resistance; when it is greater than the range, there may be a problem of reduced adhesive strength.

[0042] In the chemical formula (2), m and p can each be an integer greater than or equal to 1. The weight-average molecular weight of the resin represented by the chemical formula (2) can be in the range of 30,000 to 120,000 (g / mol), for example, 40,000 to 110,000 (g / mol), or for example, 50,000 to 100,000 (g / mol). When the weight-average molecular weight of the resin represented by the chemical formula (2) is less than the range, there may be a problem that the improvement effect on adhesive strength is minimal. When it is greater than the range, there may be a problem that the solubility of the acrylic monomer decreases, leading to a reduction in the processability of the preparation.

[0043] The resin represented by the chemical formula (2) has a structure formed by copolymerization of a first unit and a second unit. The first unit is formed by linking a styrene group containing an aromatic phenyl group with a methylene group, and the second unit is an isobutylene group. There are m first units and p second units. In this case, there is no particular limitation on the form formed by copolymerization of m first units and p second units. For example, the first unit and the second unit can be alternately and repeatedly combined in the resin represented by the chemical formula (2), or the first unit can be continuously combined and the second unit can be combined in the middle.

[0044] According to an example of the present invention, in the total of the first unit and the second unit (m+p) in the resin represented by the chemical formula (2), the content of the first unit (m) is preferably 10 to 40%. When the range of the first unit that imparts adhesion is satisfied, the adhesive strength and adhesive reliability pursued by the present invention can be ensured, which can be represented by the following condition 2.

[0045] Condition 2: 10 ≤ {m / (m+p)} × 100 (%) ≤ 40 The photocurable composition of the present invention contains a (meth)acrylate curing agent to exhibit high adhesion properties (functions, properties, etc.).

[0046] Specific examples of the (meth)acrylate curing agent may include, but are not limited to, one or a mixture of two or more selected from methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, pentyl methacrylate, 2-ethylhexyl methacrylate, 2-ethylbutyl methacrylate, n-octyl methacrylate, isooctyl methacrylate, isononyl methacrylate, dodecyl methacrylate, tetradecyl methacrylate, isobornyl acrylate (IBOA), isobornyl methacrylate (IBOMA), cyclohexyl acrylate, cyclohexyl methacrylate, dicyclopentadiene acrylate, dicyclopentadiene methacrylate, 4-tetrabutylcyclohexyl methacrylate, 1-adamantyl methacrylate, (meth)acrylate compounds containing hydroxyl groups, (meth)acrylate compounds containing carboxyl groups, and (meth)acrylate compounds containing amino groups.

[0047] According to one example, based on 100 parts by weight of the aforementioned photocurable composition, the content of the (meth)acrylate curing agent may be 30 to 60 parts by weight, for example, it may contain 40 to 50 parts by weight. When the content of the (meth)acrylate curing agent is less than the aforementioned range, there may be a problem of reduced reliability due to insufficient curing density; when it is greater than the aforementioned range, there may be a problem of reduced moisture resistance.

[0048] The photocurable composition of the present invention comprises a photoinitiator that is inactive under heating conditions but generates free radicals when exposed to photochemical rays such as ultraviolet (UV). The photoinitiator can be suitably selected from photoinitiators commonly used in the art, for example, phenyl bis(2,4,6-trimethylbenzoyl)-phosphine oxide (IGM I819), 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide (TPO), monoacylphosphine, bisacylphosphine, α-hydroxyketone, α-aminoketone, phenylglyoxylate, benzyl dimethylketal, etc., but is not limited thereto.

[0049] According to one example, based on 100 parts by weight of the photocurable composition, the content of the curable photoinitiator can be 0.1 to 5.0 parts by weight, for example, it can contain 0.5 to 3.0 parts by weight, for example, it can contain 1.0 to 2.0 parts by weight. When the content of the photoinitiator is less than the range, there may be a problem of poor heat resistance due to poor ultraviolet (UV) curing; when it is greater than the range, there may be a problem of poor heat resistance due to reduced curing density.

[0050] This invention includes an adhesion promoter to improve adhesive strength and reliability, especially adhesive durability under high temperature and high humidity conditions. For example, the adhesion promoter may include silane-based adhesion promoters, hydrogenated hydrocarbon-based adhesion promoters, titanate-based adhesion promoters, acrylic-based adhesion promoters, and preferably hydroxyl-substituted acrylic-based adhesion promoters.

[0051] Specific examples of the silane-based adhesion promoter may include, but are not limited to, one or a mixture of two or more selected from vinyltriethoxysilane, 3-methacryloyloxypropyltriethoxysilane, 3-acryloyloxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, phenyltrimethoxysilane, and 3,3,3-trifluoropropyltrimethoxysilane.

[0052] Specific examples of the titanate-based adhesion promoter may include, but are not limited to, one or a mixture of two or more selected from isopropyl triisostearoyl titanate, isopropyl tris(dioctyl pyrophosphate) titanate, bis(dioctyl pyrophosphate)oxyacetic acid titanate, tris(dioctyl pyrophosphate)vinyl titanate, isopropyl dioctyl pyrophosphate titanate, and isopropyl tris(dodecylbenzenesulfonyl) titanate.

[0053] According to one example, based on 100 parts by weight of the photocurable composition, the content of the adhesion promoter can be 0.1 to 5.0 parts by weight, for example, it can contain 0.5 to 3.0 parts by weight, for example, it can contain 1.5 to 2.5 parts by weight, for example, it can contain 1.0 to 2.0 parts by weight. When the amount of adhesion promoter is less than the range, there may be problems with reduced adhesion strength and adhesion strength durability under high temperature and high humidity. When it is greater than the range, there may be problems with the remaining components being released in gaseous form and reduced reliability.

[0054] The viscosity of the photocurable composition of the present invention can be varied according to the application and method of the organic light-emitting device. Preferably, the viscosity (V) of the high-functionality resin composition of the present invention is... i The value is above 150,000 mPa·s, for example, it can be 160,000 to 250,000 mPa·s, for example, it can be 180,000 to 230,000 mPa·s.

[0055] On the other hand, the viscosity of photocurable resin compositions changes over time. The less the viscosity changes, the better the storage stability and storability. Excellent viscosity stability over time is required as an indicator to achieve this. Therefore, high viscosity stability over time at room temperature of about 25°C is natural. Considering the heating conditions in subsequent processes used to prepare organic light-emitting devices, high viscosity stability over time at a relatively high temperature of about 40°C is also preferred.

[0056] From these perspectives, the viscosity-time stability evaluation value of the photocurable composition of the present invention at a temperature of 25°C calculated according to condition 3 below can be less than 1%, and the viscosity-time stability evaluation value at a temperature of 40°C calculated according to condition 4 can be less than 3%.

[0057] Condition 3: {(V 25℃ -V i ) / V i}×100<1% Condition 4: {(V 40℃ -V i ) / V i}×100<3% In conditions 3 and 4, V iV is the initial viscosity. 25℃ V represents the viscosity after standing at 25°C for 7 days. 40℃ To determine the viscosity after standing for 7 days at 40°C, the viscosity was measured at 25°C and 2.5 rpm under these conditions.

[0058] Cured product of photocurable composition According to one aspect of the invention, a cured product of the photocurable composition can be provided, for example, by photochemical rays such as ultraviolet (UV).

[0059] The cured product of the photocurable composition needs to exhibit excellent adhesion strength to glass. It is well known that performing simulated evaluations of adhesion strength to glass is a standard method for evaluating the adhesion strength to organic light-emitting devices.

[0060] From the perspective of ensuring excellent adhesive strength to organic light-emitting devices, preferably, the initial adhesive strength (C) of the cured product of the photocurable composition of the present invention is 700 N / cm. 2 .

[0061] On the other hand, adhesive strength decreases over time. Since electronic products using organic light-emitting devices may be subjected to harsh conditions such as high temperature and high humidity, excellent adhesive reliability and minimal variation in adhesive strength are required even under these conditions. Even in harsh environments such as high temperature and high humidity, excessive variation in adhesive strength can significantly degrade the performance of electronic products using organic light-emitting devices.

[0062] From this perspective, the cured product of the photocurable composition of the present invention satisfies the following condition 5, thereby exhibiting excellent adhesive strength and durability.

[0063] Condition 5: 0.5 ≤ D / C ≤ 1.1 In condition 5, C is the initial adhesive strength (N / cm). 2 D represents the adhesive strength (N / cm²) after standing at 85°C and 85% humidity for 1000 hours. 2 In this case, the cured material is bonded to the glass, and then the bond strength is measured using a Universal Testing Machine (UTM) in compression mode at a speed of 5 mm / min.

[0064] The photocurable composition of this invention exhibits excellent adhesive strength even under conditions of 60°C and 90% humidity, i.e., high temperature / high humidity conditions. The adhesive strength is measured using the same method as the initial adhesive strength measurement method described above, but under high temperature / high humidity conditions of 60°C. The sample is placed in a chamber and stabilized for 30 minutes before measurement. In this invention, when the adhesive strength under high temperature / high humidity conditions is 50% or more of the initial adhesive strength (C) under conventional conditions, it is considered to have excellent adhesive strength under high temperature / high humidity conditions. Unlike the adhesive strength durability evaluation, the high temperature / high humidity adhesive strength is measured under conditions of 60°C and 90% humidity, rather than after standing at 85°C and 85% humidity for 1000 hours.

[0065] To significantly improve water resistance, the water vapor transmission ratio (WVTR) of the photocurable composition of the present invention is preferably 9.0 gm / m. 2 For durations of less than one day, 8.0 gm / m is preferred. 2 For durations of less than 1 day, 7.0 gm / m is preferred. 2 • Less than a day. This means that the water vapor transmittance of existing organic light-emitting devices is approximately 10 gm / m². 2 Compared to the day level, it exhibits significantly improved moisture resistance.

[0066] The composition and function of the present invention will be described in more detail below through preferred embodiments. However, these embodiments are presented only as preferred examples of the present invention and should not be construed in any way as limiting the present invention to these embodiments.

[0067] Examples 1 to 5 and Comparative Examples 1 to 5 In this invention, photocurable resin compositions of Examples 1 to 5 and Comparative Examples 1 to 5 were prepared by mixing according to the compositions and contents shown in Tables 1 and 2 below.

[0068] In Tables 1 and 2 below, the resin represented by chemical formula (1) is a resin having the structure of chemical formula (1) and a weight-average molecular weight of 17,000 g / mol, and the resin represented by chemical formula (2) is a resin having the structure of chemical formula (2) and a weight-average molecular weight of 70,000 g / mol. 3-Methacryloxypropyltriethoxysilane was used as an adhesion promoter in Examples 1 to 3 and Comparative Examples 1 to 2, Sukorez SU-90 (hydrogenated hydrocarbon resin) from Kolon was used as an adhesion promoter in Example 4, and 2-hydroxyethyl methacrylate (2-HEMA) was used as an adhesion promoter in Example 5. The physical properties described in Tables 1 and 2 below were evaluated according to Experimental Examples 1 to 6.

[0069] Experimental Example 1: Viscosity The initial viscosity (V0.05) of the high-functionality resin composition was determined using an E-type cone-plate viscometer (Toki-sangyo, TVE-35H) at 25°C and 2.5 rpm. i (mPa·s).

[0070] Experimental Example 2: Evaluation of stability over time (@25℃ and @40℃) The initial viscosity (V) of the high-functionality resin composition measured in Experimental Example 1 was determined. i The viscosity (V) was measured after standing for 7 days at 25°C and 40°C, respectively. 40℃ and V 25℃ Substitute the following conditions 3 and 4 into the value of the stability evaluation over time.

[0071] Condition 3: {(V 25℃ -V i ) / V i}×100<1% Condition 4: {(V 40℃ -V i ) / V i}×100<3% Evaluation criteria for 25℃: If the value calculated according to the formula in condition 3 is less than 1%, it is evaluated as “○”; if it is more than 1% but less than 2%, it is evaluated as “△”; if it is more than 2%, it is evaluated as “×”.

[0072] Evaluation criteria for 40℃: If the value calculated according to the above formula 1 is less than 3%, it is evaluated as "○"; if it is more than 3% but less than 5%, it is evaluated as "△"; if it is more than 5%, it is evaluated as "×".

[0073] Experiment Example 3: Determining Adhesion Strength 1 mg of the photocurable composition was applied to Gorilla Glass A (100 mm × 50 mm × 2.0 T). Gorilla Glass B (100 mm × 50 mm × 2.0 T) was then placed on Gorilla Glass A in a cross shape, and pressure was applied until the cured composition reached a thickness of 20–30 μm. The photocurable composition was positioned centered between Gorilla Glass A and Gorilla Glass B. Ultraviolet (UV) light at a wavelength of 365 nm was applied at 1000 mJ / cm². 2 The samples were cured by irradiation under pressure, thereby bonding Gorilla Glass A and B together. The initial bond strength (C) of the bonded samples was determined using a Universal Testing Machine (UTM) in compression mode at a speed of 5 mm / min.

[0074] Experiment Example 4: Evaluation of Adhesive Strength and Durability The late-stage bond strength (D) was measured after the sample was placed in a reliability evaluation chamber at a set temperature of 85°C and a relative humidity of 85% for 1000 hours. The bond strength durability (D / C) was then calculated by dividing the D value by the C value.

[0075] Evaluation criteria: When the value calculated based on the D / C is between 0.5 and 1.1, it is judged to meet the adhesion strength durability requirement.

[0076] Experiment Example 5: Determination of high temperature / high humidity adhesive strength 1 mg of the photocurable composition was applied to Gorilla Glass A (100 mm × 50 mm × 2.0 T). Gorilla Glass B (100 mm × 50 mm × 2.0 T) was then placed on Gorilla Glass A in a cross shape, and pressure was applied until the cured composition reached a thickness of 20–30 μm. The photocurable composition was positioned centered between Gorilla Glass A and Gorilla Glass B. Ultraviolet (UV) light at a wavelength of 365 nm was applied at 1000 mJ / cm². 2The samples were cured by irradiation under pressure, thereby bonding Gorilla Glass A and B together. The bond strength of the bonded samples was measured using a universal testing machine (UTM) in compression mode at a speed of 5 mm / min. In this case, the UTM chamber was set at 60°C / 90% humidity; the samples were placed in the chamber and allowed to stabilize for 30 minutes before measurement.

[0077] Experimental Example 6: Measurement of Water Vapor Transmission Rate (WVTR) 2g of the photocurable composition was coated between release PET layers and rolled to achieve a thickness of 100μm. Ultraviolet (UV) irradiation was then performed using a UV irradiator at a wavelength of 365nm and a concentration of 1000mJ / cm². 2 A thin film sample was prepared by curing a pressurized sample under irradiation. The water vapor transmission rate (in gm / m²) of the prepared sample was measured using an oxygen permeability meter under ASTM F1219 conditions. 2 • The moisture resistance characteristics were confirmed by measuring the water vapor transmission rate in days, when the water vapor transmission rate met the requirement of 9.0 gm / m. 2 • When the humidity is below 1 day, it is judged to have excellent moisture resistance.

[0078] Table 1

[0079] Table 2

[0080] Referring to Tables 1 and 2, it can be seen that the water vapor transmission rate of Comparative Example 1, in which the ratio of the resin represented by chemical formula (1) to the resin represented by chemical formula (2) of the present invention (B / A in condition 1) is greater than 0.35, is 11.84 gm / m. 2 • Days, therefore the moisture resistance deteriorates.

[0081] Comparative Example 2, which does not contain the resin represented by chemical formula (2) of the present invention, has an initial adhesive strength of 475 N / cm. 2 It exhibits a value far lower than the 700 N / cm required by this invention. 2 The above adhesive strength.

[0082] The D / C value of Comparative Example 3, which does not contain an adhesion promoter, under condition 5 is calculated to be 0.27. This means that the adhesive strength is significantly reduced when left to stand in a high temperature and high humidity environment, thus reducing the durability of the adhesive strength. The adhesive strength measured under high temperature / high humidity conditions is 45 N / cm. 2 It can be seen that this is far lower than the initial adhesive strength of 928 N / cm. 2 50%.

[0083] It can be confirmed that the moisture permeability of Comparative Example 4, which uses the resin represented by chemical formula (2) of the present invention and contains an aromatic portion exceeding the upper limit of condition 2, is reduced, and the initial adhesive strength of Comparative Example 5, which uses the resin below the lower limit of condition 2, is reduced.

[0084] The embodiments of this specification have been described in more detail above, but this specification is not necessarily limited to these embodiments. Various modifications can be made without departing from the technical spirit of this specification. Therefore, the embodiments disclosed in this specification are only for illustrating the technical spirit of the specification and are not intended to limit the technical spirit of this specification, and the scope of the technical spirit of this specification is not limited to these embodiments. Therefore, it should be understood that the above embodiments are exemplary in any respect and not restrictive.

Claims

1. A photocurable composition, characterized in that, Include: Resins represented by the following chemical formula (1); resins represented by the following chemical formula (2); (meth)acrylate curing agents; adhesion promoters; and photoinitiators, The following condition 1 must be met: Condition 1: 0.02 ≤ B / A ≤ 0.35 In condition 1, A refers to the content (parts by weight) of resin represented by chemical formula (1), and B refers to the content (parts by weight) of resin represented by chemical formula (2). Chemical formula (1): Chemical formula (2): In the chemical formulas (1) and (2), n, m and p are each integers greater than or equal to 1.

2. The photocurable composition according to claim 1, characterized in that, The resin represented by the chemical formula (2) satisfies the following condition 2: Condition 2: 10 ≤ {m / (m+p)} × 100 ≤ 40%.

3. The photocurable composition according to claim 1, characterized in that, The content of the (meth)acrylate curing agent is 30 to 60 parts by weight per 100 parts by weight of the photocurable composition.

4. The photocurable composition according to claim 1, characterized in that, The content of the adhesion promoter is 0.1 to 5.0 parts by weight per 100 parts by weight of the photocurable composition.

5. The photocurable composition according to claim 1, characterized in that, The content of the photoinitiator is 0.1 to 5.0 parts by weight per 100 parts by weight of the photocurable composition.

6. The photocurable composition according to claim 1, characterized in that, The (meth)acrylate curing agent includes one or more of isoborneol acrylate, isoborneol methacrylate, dicyclopentadiene methacrylate, 4-tetrabutylcyclohexyl methacrylate, and 1-adamantyl methacrylate.

7. The photocurable composition according to claim 1, characterized in that, The adhesive accelerator includes one or more of silane adhesive accelerators, hydroxyl-substituted acrylic adhesive accelerators, and hydrogenated hydrocarbon adhesive accelerators.

8. The photocurable composition according to claim 1, characterized in that, The photoinitiator includes one or more of phenylbis(2,4,6-trimethylbenzoyl)-phosphine oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, phenylbis(2,4,6-trimethylbenzoyl)phosphine, and 2,2-dimethoxy-1,2-diphenylethane-1-one.

9. The photocurable composition according to claim 1, characterized in that, Conditions 3 and 4 must be met: Condition 3: { ( V 25℃ - V i ) / V i } × 100 < 1% Condition 4: { (V 40℃ - V i ) / V i} × 100 < 3% In conditions 3 and 4, V i V is the initial viscosity (mPa•s). 25℃ V represents the viscosity (mPa•s) after standing at 25°C for 7 days. 40℃ The viscosity (mPa•s) after standing at 40°C for 7 days was measured at 25°C and 2.5 rpm.

10. The photocurable composition according to claim 9, characterized in that, Initial viscosity (V) i The value is 150,000–250,000 mPa•s.

11. A solidified product, characterized in that, It is formed by photocuring the photocurable composition according to any one of claims 1 to 10.

12. The cured product according to claim 11, characterized in that, Condition 5 must be met: Condition 5: 0.5 ≤ D / C ≤ 1.1 In condition 5, C is the initial adhesive strength (N / cm). 2 D represents the post-bonding strength (N / cm) after standing at 85℃ and 85% humidity for 1000 hours. 2 In this case, the cured material is bonded to the glass, and then the bond strength is measured using a universal testing machine in compression mode at a speed of 5 mm / min.

13. The cured product according to claim 12, characterized in that, The initial bond strength (C) is 700 N / cm. 2 above.

14. The cured product according to claim 11, characterized in that, The high-temperature / high-humidity adhesive strength at 60°C / 90% is more than 50% of the initial adhesive strength (C).

15. The cured product according to claim 11, characterized in that, Water vapor transmission rate is 9.0 gm / m 2 Below the heavens.

16. An image display device, characterized in that, It includes a cured product according to any one of claims 11 to 15.

Images