Processing apparatus and wafer processing method

Abstract

Reduce power consumption at the suction source. [Solution] The control unit performs idling processes (S3, S8) of the processing apparatus, including the chuck table and grinding unit, before and after the grinding process (S4-S7), stopping the power supply and water supply to the suction pump at the suction source, thereby stopping the suction pump. Therefore, compared to a configuration in which the suction pump is driven continuously, the power consumption and water consumption of the suction source, including the suction pump, can be reduced. As a result, the cost of grinding in the grinding apparatus can be reduced.

Description

【Technical Field】 【0001】 The present invention relates to a processing apparatus and a method for processing a wafer. 【Background Art】 【0002】 In a grinding apparatus for grinding a wafer with a grinding wheel, as disclosed in Patent Document 1, the wafer is sucked and held by a holding surface of a chuck table communicated with a suction source. 【0003】 Further, the grinding apparatus holds the wafer by a transfer pad and transfers it to each unit. This transfer pad also sucks and holds the wafer by a holding surface communicated with the suction source, similar to the chuck table. 【Prior Art Documents】 【Patent Documents】 【0004】 【Patent Document 1】 Japanese Patent Application Laid-Open No. 2003-326458 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0005】 As described above, in a processing apparatus such as a grinding apparatus, the wafer is sucked and held by a holding surface communicated with a suction source. Therefore, the suction pump for generating the suction force in the suction source is constantly driven by constantly supplying electric power to ensure the suction and holding of the wafer. However, a large amount of electric power is consumed to constantly drive the suction pump. 【0006】 Therefore, an object of the present invention is to reduce the power consumption in the suction source. 【Means for Solving the Problems】 【0007】 The processing apparatus of the present invention (this processing apparatus) comprises a suction source that generates suction force by supplying power to a suction pump and driving the suction pump, a chuck table that holds a wafer with a holding surface communicating with the suction source, a processing unit that processes the wafer held on the chuck table, a transport mechanism that transports the wafer to the chuck table, and a control unit, wherein the control unit stops supplying power to the suction pump when the chuck table and the processing unit are in an idling state. 【0008】 The wafer processing method of the present invention is a wafer processing method using the processing apparatus, comprising: an idling step of putting the chuck table and the processing unit into an idling state and stopping the power supply to the suction pump; and a processing step of supplying power to the suction pump to drive the suction pump and processing the wafer held by suction on the chuck table with the processing unit. [Effects of the Invention] 【0009】 In this invention, when the chuck table and processing unit are idling, the power supply to the suction pump of the suction source is stopped, thereby stopping the suction pump. Therefore, the power consumption of the suction source can be reduced compared to a configuration in which the suction pump is driven continuously. [Brief explanation of the drawing] 【0010】 [Figure 1] This is a perspective view showing the configuration of the grinding device. [Figure 2] This is a flowchart showing a wafer processing method using a grinding device. [Modes for carrying out the invention] 【0011】 As shown in Figure 1, the grinding apparatus 1 according to this embodiment is an example of a processing apparatus, and is an apparatus for grinding a wafer 100. The wafer 100 is an example of a workpiece, for example, a circular semiconductor wafer. In Figure 1, a device (not shown) is formed on the surface 101 of the wafer 100, which is facing downwards. The back surface 102 of the wafer 100 is the workpiece surface to be ground. 【0012】 The grinding device 1 includes a first device base 10 and a second device base 11 positioned behind the first device base 10 (towards the +Y direction). 【0013】 A first cassette stage 160 and a second cassette stage 162 are provided on the -Y direction side of the first apparatus base 10. A first cassette 161 and a second cassette 163, which contain wafers 100, are placed on the first cassette stage 160 and the second cassette stage 162, respectively. 【0014】 The first cassette 161 and the second cassette 163 each have multiple shelves inside, with one wafer 100 housed in each shelf. In other words, the first cassette 161 and the second cassette 163 house multiple wafers 100 in a shelf-like manner. 【0015】 The openings (not shown) of the first cassette 161 and the second cassette 163 face the +Y direction. A robot 15 is positioned on the +Y side of these openings. The robot 15 is equipped with a robot hand 151 having a holding surface for holding the wafer 100. The robot hand 151 is connected to a suction source 80 to suction and hold the wafer 100. The robot 15 holds the processed wafer 100 with its robot hand 151 and loads it into the first cassette 161 or the second cassette 163. The robot 15 also uses its robot hand 151 to remove the unprocessed wafer 100 from the first cassette 161 or the second cassette 163 and places it on the temporary storage table 154 of the temporary storage mechanism 152. 【0016】 The temporary storage mechanism 152 is used to temporarily store wafers 100 taken out of the first cassette 161 or the second cassette 163, and is located adjacent to the robot 15. The temporary storage mechanism 152 includes a temporary storage table 154 and an alignment member 153. 【0017】 The alignment member 153 comprises a plurality of alignment pins arranged on the outside so as to surround the temporary placement table 154, and a slider that moves the alignment pins in the radial direction of the temporary placement table 154. In the alignment member 153, as the alignment pins are moved radially toward the center of the temporary placement table 154, the circle connecting the plurality of alignment pins is reduced in diameter. As a result, the wafer 100 placed on the temporary placement table 154 is aligned (centered) to a predetermined position. 【0018】 Adjacent to the temporary placement mechanism 152, a loading mechanism 17 is provided. The loading mechanism 17 is an example of a loading mechanism for transporting wafers 100 to the chuck table 20, and has a loading pad 171 having a holding surface for holding wafers 100. The loading pad 171 is connected to a suction source 80 to suction and hold the wafers 100. The loading mechanism 17 suction and holds the wafers 100 that have been aligned in the temporary placement mechanism 152, and places them on the holding surface 22 of the chuck table 20 with the back surface 102 facing upward. 【0019】 An opening 13 is provided on the upper side of the second device base 11. A wafer holding mechanism 30 is positioned inside the opening 13. 【0020】 The wafer holding mechanism 30 includes a chuck table 20 having a holding surface 22 for holding wafers 100, a chuck table base 29 supporting the chuck table 20, a drive unit 26 connected to the base end of the chuck table base 29 via an endless belt 25, a support member 28 that rotatably supports the chuck table base 29, and a plurality of support columns 27 that support the support member 28. 【0021】 The chuck table 20 includes a porous member 21 and a frame body 23 that houses the porous member 21 such that the upper surface of the porous member 21 is exposed. The upper surface of the porous member 21 is a holding surface 22 that sucks and holds the wafer 100. The holding surface 22 sucks and holds the wafer 100 by being communicated with a suction source 80. That is, the chuck table 20 holds the wafer 100 by the holding surface 22 communicated with the suction source 80. 【0022】 Also, a frame surface 24 that is the upper surface of the frame body 23 surrounds the holding surface 22 and is formed to be flush with the holding surface 22 (flush surface). 【0023】 The drive unit 26 includes a motor and a drive pulley, and rotates the chuck table base 29 by rotating an endless belt 25. Thereby, the chuck table 20 supported by the chuck table base 29 rotates about a table rotation axis that extends through the center of the holding surface 22. 【0024】 A cover plate 39 that moves along the Y-axis direction together with the chuck table 20 is provided around the chuck table 20. Also, a bellows cover 14 that expands and contracts in the Y-axis direction is connected to the cover plate 39. And a Y-axis direction movement mechanism 40 is disposed below the wafer holding mechanism 30. 【0025】 The Y-axis direction movement mechanism 40 relatively moves the chuck table 20 and the grinding wheel 77 of the grinding unit 70 in the Y-axis direction parallel to the holding surface 22. In the present embodiment, the Y-axis direction movement mechanism 40 is configured to move the chuck table 20 in the Y-axis direction with respect to the grinding wheel 77 of the grinding unit 70. 【0026】 In this embodiment, the wafer holding mechanism 30 is moved along the Y-axis direction by the Y-axis movement mechanism 40 between a wafer holding position on the -Y direction side for holding the wafer 100 on the holding surface 22 of the chuck table 20 and a grinding position on the +Y direction side for grinding the wafer 100 held on the holding surface 22. 【0027】 Furthermore, a column 12 is erected on the +Y direction side of the second device base 11. A grinding unit 70 for grinding the wafer 100 and a grinding feed unit 60 are provided on the front surface of the column 12. 【0028】 The grinding feed unit 60 moves the chuck table 20 and the grinding wheel 77 of the grinding unit 70 relative to each other in the Z-axis direction (grinding feed direction) perpendicular to the holding surface 22. In this embodiment, the grinding feed unit 60 is configured to move the grinding wheel 77 in the Z-axis direction relative to the chuck table 20. 【0029】 The grinding feed unit 60 includes a pair of Z-axis guide rails 61 parallel to the Z-axis direction, a Z-axis moving table 63 that slides on the Z-axis guide rails 61, a Z-axis ball screw 62 parallel to the Z-axis guide rails 61, a Z-axis motor 64, a Z-axis encoder 65 for detecting the amount of rotation (number of rotations and rotation angle) of the Z-axis ball screw 62, and a holder 66 attached to the Z-axis moving table 63. The holder 66 supports the grinding unit 70. 【0030】 The Z-axis moving table 63 is slidably mounted on the Z-axis guide rail 61. A nut (not shown) is fixed to the Z-axis moving table 63. A Z-axis ball screw 62 is screwed into this nut. The Z-axis motor 64 is connected to one end of the Z-axis ball screw 62. 【0031】 In the grinding feed unit 60, the Z-axis motor 64 rotates the Z-axis ball screw 62, causing the Z-axis moving table 63 to move in the Z-axis direction along the Z-axis guide rail 61. As a result, the holder 66 attached to the Z-axis moving table 63, and the grinding unit 70 supported by the holder 66, also move in the Z-axis direction along with the Z-axis moving table 63. 【0032】 The Z-axis encoder 65 is rotated by the Z-axis motor 64 rotating the Z-axis ball screw 62, and can recognize the amount of rotation of the Z-axis ball screw 62 (number of rotations and rotation angle). In this embodiment, the control unit 7 recognizes the amount of rotation of the Z-axis ball screw 62 recognized by the Z-axis encoder 65, and based on the recognition result, can detect the height position of the grinding wheel 77 of the grinding unit 70 that is moving in the Z-axis direction. 【0033】 The grinding unit 70 is an example of a processing unit for processing a wafer 100 held on a chuck table 20, and grinds the wafer 100 held on the chuck table 20 with a grinding wheel 77. The grinding unit 70 includes a spindle housing 71 fixed to a holder 66, a spindle 72 rotatably held in the spindle housing 71, a spindle motor 73 for rotationally driving the spindle 72, a wheel mount 74 attached to the lower end of the spindle 72, and a grinding wheel 75 supported by the wheel mount 74. 【0034】 The spindle housing 71 is held in the holder 66 so as to extend in the Z-axis direction. The spindle 72 extends in the Z-axis direction so as to be perpendicular to the holding surface 22 of the chuck table 20 and is rotatably supported in the spindle housing 71. 【0035】 The spindle motor 73 is connected to the upper end of the spindle 72. This spindle motor 73 causes the spindle 72 to rotate around a rotation axis that extends in the Z-axis direction. 【0036】 The wheel mount 74 is formed in a disc shape and is fixed to the lower end of the spindle 72. The wheel mount 74 supports the grinding wheel 75. 【0037】 The grinding wheel 75 is formed to have an outer diameter approximately the same as the outer diameter of the wheel mount 74. The grinding wheel 75 includes an annular wheel base 76 made of a metal material. Multiple grinding wheels 77 are fixed to the underside of the wheel base 76, arranged in an annular pattern around its entire circumference. The grinding wheels 77 are rotated by a spindle motor 73 together with a spindle 72 around their center axis to grind the back surface 102 of the wafer 100 held in the chuck table 20. 【0038】 Furthermore, a thickness measuring instrument 67 is provided on the side of the opening 13 in the second apparatus base 11. The thickness measuring instrument 67 has a holding surface height gauge 68 and a top surface height gauge 69. The holding surface height gauge 68 measures the height of the holding surface 22 by measuring the height of the frame surface 24 of the frame 23, which is on the same plane as the holding surface 22 of the chuck table 20. The top surface height gauge 69 measures the height of the top surface of the wafer 100 held on the holding surface 22. The thickness measuring instrument 67 measures the thickness of the wafer 100 by calculating the difference between the measurement value of the holding surface height gauge 68 and the measurement value of the top surface height gauge 69. 【0039】 After grinding, the wafer 100 is removed from the chuck table 20 by the removal mechanism 18. The removal mechanism 18 is an example of a transport mechanism that transports the wafer 100 to the chuck table 20, and has a transport pad 181 having a holding surface for holding the wafer 100. The transport pad 181 is connected to a suction source 80 to suction and hold the wafer 100. The removal mechanism 18 suction and holds the wafer 100 on the chuck table 20 and transports it to the spinner table 157 of the single-wafer spinner cleaning mechanism 156. 【0040】 The spinner cleaning mechanism 156 is a spinner cleaning unit for cleaning the wafer 100. The spinner cleaning mechanism 156 includes a spinner table 157 having a holding surface for holding the wafer 100, and a nozzle 158 for spraying cleaning water and drying air toward the spinner table 157. The spinner table 157 is connected to a suction source 80 to hold the wafer 100 by suction. 【0041】 In the spinner cleaning mechanism 156, the spinner table 157 holding the wafer 100 rotates, and cleaning water is sprayed towards the wafer 100, so the wafer 100 is spinner cleaned. After that, drying air is blown onto the wafer 100 to dry it. 【0042】 The wafer 100, cleaned by the spinner cleaning mechanism 156, is then loaded by the robot 15 into either the first cassette 161 or the second cassette 163 (for example, the cassette from which the wafer 100 was removed). 【0043】 Furthermore, the grinding device 1 is equipped with a touch panel 9 on the side of its housing (not shown). The touch panel 9 displays various information related to the grinding device 1, such as processing conditions. The touch panel 9 is also used to set various information. Thus, the touch panel 9 functions as both an input component for inputting information and a display unit for displaying information managed by the grinding device 1. 【0044】 The suction source 80 includes a water-sealed suction pump (vacuum pump) 81 as a vacuum generator, a power supply unit 82 that supplies power to the suction pump 81, and a water tank 83 that stores wastewater from the suction pump 81 and supplies water to the suction pump 81. 【0045】 The suction pump 81 is connected to the power supply unit 82, the water tank 83, and the water source 201. The suction pump 81 is driven by power supplied from the power supply unit 82 and generates suction force using water supplied from the water source 201 or the water tank 83. In this embodiment, regarding the supply of water to the suction pump 81, for example, if the water temperature in the water tank 83 is below a set value, water is supplied to the suction pump 81 from the water tank 83, while when the water temperature in the water tank 83 rises above the set value, water is supplied to the suction pump 81 from the water source 201. The suction force generated by the suction pump 81 is supplied via the suction passage 85 to wafer holding members such as the holding surface 22 of the chuck table 20 of the grinding device 1, the robot hand 151 of the robot 15, the transport pad 171 of the loading mechanism 17, the transport pad 181 of the unloading mechanism 18, and the spinner table 157 of the spinner cleaning mechanism 156. 【0046】 Thus, the suction source 80 is configured to generate suction force by supplying power to the suction pump 81 and driving the suction pump 81. Note that the suction pump 81 is not limited to a water-sealed type. 【0047】 Furthermore, the grinding device 1 has a control unit 7 inside for controlling the grinding device 1. The control unit 7 is equipped with a CPU that performs calculations according to a control program, and a storage medium such as memory. The control unit 7 executes various processes and provides overall control over each component of the grinding device 1. 【0048】 For example, the control unit 7 controls each of the aforementioned components of the grinding apparatus 1 to perform grinding on the wafer 100. The following describes a method for processing a wafer 100 using a grinding device 1, which is controlled by a control unit 7. 【0049】 Figure 2 shows a flowchart of this processing method (processing). As shown in this figure, in the processing of wafer 100 in grinding apparatus 1, when the power of grinding apparatus 1 is turned ON by the operator (S1), the control unit 7 performs the initial process of grinding apparatus 1 (S2). In the initial process, the control unit 7, for example, verifies the origin position of each axis. Examples of axes whose origin position is verified in this process include the rotation axis of the chuck table 20 and the rotation axis of the Z-axis motor 64 in the grinding feed unit 60. 【0050】 After the initial process, the control unit 7 performs an idling process (S3) to put the grinding apparatus 1 into an idling state. In the idling state, for example, all wafers 100 are stored in the first cassette 161 and the second cassette 163, and the wafer holding members that hold the wafers 100 using the suction force from the suction source 80, namely the robot 15, transport pad 171, chuck table 20, transport pad 181 and spinner table 157, are positioned in predetermined standby positions without holding the wafers 100. The grinding unit 70 is also positioned in a predetermined standby position by, for example, the grinding feed unit 60, and the spindle motor 73 is stopped. 【0051】 Furthermore, during this idling process, the control unit 7 stops the supply of water from the water tank 83 or water source 201 to the suction pump 81, and the supply of power from the power supply unit 82 to the suction pump 81, thereby stopping the suction pump 81. Therefore, the idling process is a process of putting the grinding apparatus 1, including the chuck table 20 and the grinding unit 70, into an idling state, and stopping the supply of power and water to the suction pump 81. In other words, the control unit 7 stops the supply of power and water to the suction pump 81 when the grinding apparatus 1, including the chuck table 20 and the grinding unit 70, is in an idling state. 【0052】 In this state, when the operator presses the processing start button 91 (see Figure 1) displayed on the touch panel 9 (S4), the control unit 7 starts supplying water from the water tank 83 or water source 201 to the suction pump 81 and supplying power from the power supply unit 82 to the suction pump 81 at the suction source 80, thereby starting the suction pump 81 (S5). As a result, suction force is generated at the suction source 80. Then, the control unit 7 starts grinding the wafer 100 using each component of the grinding apparatus 1 (S6). 【0053】 In other words, the control unit 7 connects the robot hand 151 of the robot 15 to the suction source 80, and for example, uses the robot hand 151 to suction and hold the wafer 100 in the first cassette 161 before processing, and places it on the temporary storage table 154 of the temporary storage mechanism 152. 【0054】 Furthermore, the control unit 7 connects the transport pad 171 of the loading mechanism 17 to the suction source 80, and uses the transport pad 171 to hold the wafer 100, which has been aligned in the temporary placement mechanism 152, and places it on the holding surface 22 of the chuck table 20. Subsequently, the control unit 7 connects the holding surface 22 to the suction source 80, thereby using the holding surface 22 to hold the wafer 100 by suction. 【0055】 Furthermore, the control unit 7 controls the wafer holding mechanism 30, grinding feed unit 60, grinding unit 70, and thickness measuring instrument 67 to grind the wafer 100 held on the holding surface 22 of the chuck table 20 until it reaches a predetermined thickness. After that, the control unit 7 connects the transport pad 181 of the discharge mechanism 18 to the suction source 80, and holds the ground wafer 100 by suction using the transport pad 181, and places it on the spinner table 157 of the spinner cleaning mechanism 156. 【0056】 Furthermore, the control unit 7 connects the spinner table 157 to the suction source 80, thereby using the spinner table 157 to suction and hold the wafer 100, and performs cleaning on the wafer 100. After that, the control unit 7 connects the robot hand 151 of the robot 15 to the suction source 80, and uses the robot hand 151 to suction and hold the cleaned wafer 100, and loads it into the first cassette 161. 【0057】 Thus, after the idling process, the control unit 7 supplies power and water to the suction pump 81 to drive the suction pump 81 and performs the processing steps (S5, S6) in which the wafer 100 held by the chuck table 20 is processed by the grinding unit 70. 【0058】 In this manner, the control unit 7 grinds a plurality of wafers 100 in the first cassette 161 and / or the second cassette 163, and then terminates the grinding process (S7). The control unit 7 terminates the grinding process, for example, when the grinding of a predetermined number of wafers 100 is completed, or when the grinding of all wafers 100 in one or two cassettes is completed. 【0059】 After the grinding process is completed, the control unit 7 performs the idling process described above. Specifically, the control unit 7 puts the grinding device 1 into an idling state and stops the suction pump 81 by stopping the supply of water from the water tank 83 or water source 201 to the suction pump 81 and the supply of power from the power supply unit 82 to the suction pump 81 at the suction source 80 (S8). 【0060】 Subsequently, the control unit 7 waits for an instruction from the operator to resume machining (S9). The instruction to resume machining is transmitted to the control unit 7, for example, when the operator presses the machining start button 91 (or a machining restart button not shown) displayed on the touch panel 9. When the control unit 7 receives the instruction to resume machining (YES in S9), it drives the suction pump 81 to resume grinding (S5, S6). 【0061】 On the other hand, if the control unit 7 does not receive an instruction to resume processing (NO in S9), it either continues the idling state of the grinding device 1 or turns off the power to the grinding device 1 to terminate the grinding process of the wafer 100. If the control unit 7 does not receive an instruction to resume processing, it may be, for example, when it receives an instruction from the operator via the touch panel 9 to terminate the grinding process (or an instruction to turn off the power to the grinding device 1), or when a predetermined time has elapsed since the end of processing. 【0062】 As described above, in this embodiment, the control unit 7 performs idling processes (S3, S8) of the grinding device 1 before and after the grinding process (S4 to S7), stopping the power supply and water supply to the suction pump 81 from the suction source 80, and stopping the suction pump 81. Therefore, compared to a configuration in which the suction pump 81 is driven continuously, the power and water consumption of the suction source 80 can be reduced. As a result, the cost of grinding in the grinding device 1 can be reduced. 【0063】 In this embodiment, the idling process (S3, S8) in which the suction pump 81 is stopped is performed before and after the processing process (S5, S6). However, the idling process may be performed only before the processing process. Even in this case, it is possible to reduce the power and water consumption of the suction source 80 compared to a configuration in which the suction pump 81 is constantly driven. 【0064】 Furthermore, during the idling process, the control unit 7 only needs to put the chuck table 20 and the grinding unit 70 into an idling state; it is not necessary to put other components of the grinding apparatus 1 into an idling state. Therefore, the idling process only needs to involve putting the chuck table 20 and the grinding unit 70 into an idling state and stopping the power supply (and water supply) to the suction pump 81. 【0065】 Furthermore, in this embodiment, a water-sealed pump is used as the suction pump 81. However, the suction pump 81 may be a pump of a type other than the water-sealed type. In this case, when the control unit 7 stops the suction pump 81 during the idling process, it stops the power supply to the suction pump 81 but does not stop the water supply. Even with this configuration, the power consumption of the suction source 80 can be reduced, making it possible to reduce the processing cost of the grinding apparatus 1. 【0066】 Furthermore, in this embodiment, grinding apparatus 1 is shown as an example of a processing apparatus. In this regard, the processing apparatus according to this embodiment may be any processing apparatus that has a suction source including a suction pump, a holding member (for example, a chuck table) that holds the wafer by suction with a holding surface communicating with the suction source, and a processing unit that processes the wafer. The processing apparatus according to this embodiment may be, for example, a polishing apparatus for polishing a wafer, or a cutting apparatus for dividing a wafer into chips, etc. [Explanation of symbols] 【0067】 1: Grinding device, 7: Control unit, 9: Touch panel, 10: First device base, 11: Second device base, 12: Column, 13: Opening, 14: Bellows cover, 15: Robot, 17: Loading mechanism, 18: Unloading mechanism, 20: Chuck table, 21: Porous member, 22: Holding surface, 23: Frame, 24: Frame surface, 25: Endless belt, 26: Drive unit, 27: Support column, 28: Support member, 29: Chuck table base, 30: Wafer holding mechanism, 39: Cover plate, 40:Y-axis direction movement mechanism, 60: Grinding feed unit, 61: Z-axis guide rail, 62: Z-axis ball screw, 63: Z-axis moving table, 64: Z-axis motor, 65: Z-axis encoder, 66: Holder, 67: Thickness measuring instrument, 68: Holding surface height gauge, 69: Top surface height gauge, 70: Grinding unit, 71: Spindle housing, 72: Spindle, 73: Spindle motor, 74: Wheel mount, 75: Grinding wheel, 76: Wheel base, 77: Grinding wheel, 80: Suction source, 81: Suction pump, 82: Power supply unit, 83: Water tank, 85: Suction path, 91: Processing start button, 100: Wafer, 101: Front side, 102: Back side, 151: Robot hand 152: Temporary placement mechanism, 153: Alignment member, 154: Temporary placement table, 156: Spinner cleaning mechanism, 157: Spinner table, 158: Nozzle, 160: First cassette stage, 161: First cassette, 162: Second cassette stage, 163: Second cassette, 171: Conveyor pad, 181: Conveyor pad, 201: Water source

Claims

[Claim 1] A processing apparatus comprising: a suction source that generates suction force by supplying power to a suction pump and driving the suction pump; a chuck table that holds a wafer with a holding surface communicating with the suction source; a processing unit that processes the wafer held on the chuck table; a transport mechanism that transports the wafer to the chuck table; and a control unit, The control unit stops supplying power to the suction pump when the chuck table and the processing unit are in an idling state. Processing equipment. [Claim 2] A method for processing a wafer using the processing apparatus described in claim 1, An idling process is performed in which the chuck table and the processing unit are put into an idling state, and the power supply to the suction pump is stopped. A processing step in which power is supplied to the suction pump to drive the suction pump and the wafer held by the chuck table is processed by the processing unit, A wafer processing method, including [the specified part of the text].

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