Method for manufacturing resin-encapsulated objects

Abstract

It is not possible to accurately position and process the polished sample within the resin encapsulation. [Solution] A marking line 507 is formed on the polished sample 102. A holder 601 is attached to the back surface of the plate-shaped polished sample 102 to make it self-supporting. The polished sample 102 with the holder 601 attached is positioned inside the sealing pipe 103, liquid resin is filled into the sealing pipe 103, and the resin is hardened to resin-seal the polished sample 102. The resin-sealed sample 105 is removed from the sealing pipe 103 using a pressing tool 104. The periphery of the upper surface of the resin-sealed sample 105 is polished.

Description

Technical Field

[0001] The present invention relates to a polishing method, a polishing sample, a method for evaluating a polishing sample, a polishing apparatus, and a method for producing a polishing sample, which observe the surface state and polishing position of a polishing object (polishing sample) and achieve good cross-section polishing. Further, the present invention relates to an observation device for a polished surface of a polishing object and a polishing apparatus equipped with the same.

Background Art

[0002] The miniaturization of semiconductor devices has been continuously progressing without showing any limits, and various technologies and methods have been developed to achieve miniaturization.

[0003] With the miniaturization, defects such as poor connection of the terminal portion of the semiconductor device, peeling of the terminal portion, and crack generation occur. For the analysis of the defective portion, it is necessary to perform cross-section polishing and observation of the defective portion. However, with the high definition of semiconductor devices, it is difficult to perform polishing with high precision.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Patent Document 1 discloses a polishing apparatus having a light transmitter and receiver, a transparent window provided in a polishing table, and a reflecting mirror provided on a polishing body and facing the light transmitter and receiver. However, the polishing body needs to be composed of a member having light transmissivity, and there is a problem that the transmission window is contaminated with the abrasive and the polishing portion of the polishing body cannot be observed.

[0006] Although polishing is sometimes performed while visually observing the polishing state of the polished body at all times, it is difficult to observe the polishing area, and as a result, it has been difficult to perform polishing with high precision. [Means for solving the problem]

[0007] The polishing apparatus of the present invention comprises a sealed object on which an object to be polished is sealed, a polishing table for polishing the sealed object, an illumination light irradiator for irradiating the object to be polished with illumination light, a polarizing plate positioned on the light output side of the illumination light irradiator, and optical observation means for observing the light reflected by the object to be polished.

[0008] The polishing apparatus of the present invention comprises a sealed object on which an object to be polished is sealed, a polishing table for polishing the sealed object, an illumination light irradiator for irradiating the object to be polished with illumination light, a first polarizing plate disposed on the light-emitting side of the illumination light irradiator, a first λ / 4 plate disposed on the light-emitting side of the polarizing plate, an optical observation means for observing the light reflected by the object to be polished, a second λ / 4 plate disposed between the optical observation means and the sealed object, and a second polarizing plate disposed between the second λ / 4 plate and the optical observation means.

[0009] The polishing apparatus of the present invention comprises a sealed object on which an object to be polished is sealed, a polishing table for polishing the sealed object, an illumination light irradiator for irradiating the object to be polished with illumination light, a polarizing beam splitter disposed on the light output side of the illumination light irradiator, a λ / 4 plate disposed on the light output side of the polarizing beam splitter, and an optical observation means for observing the light reflected from the object to be polished. The illumination light is reflected by the light separation surface of the polarizing beam splitter, then passes through the λ / 4 plate and irradiates the object to be polished, and the light reflected from the object to be polished is emitted from the sealed object, passes through the λ / 4 plate, passes through the light separation surface of the polarizing beam splitter and enters the optical observation means.

[0010] In the polishing apparatus of the present invention, the light irradiator 201 is mounted on a moving (rotating) stage 603a. The angle of the incident light 205a that is incident on the resin-encapsulated sample 105 is adjusted by the moving (rotating) stage 603a. The incident light 205a passes through the polarizing plate 202a and becomes linearly polarized. The optical image detection and capture means 206 is mounted on a moving (rotating) stage 603b. The angle is adjusted so that the light 205d reflected from the polishing sample 102 and the processed surface 602a is incident on the optical image detection and capture means 206. The incident light 205d is phase-shifted by the λ / 2 plate 210 or the λ / 4 plate 204 and converted to linearly polarized light by the polarizing plate 202b.

[0011] The polishing method of the present invention is characterized by cleaning the polishing surface of a sealed object containing the object to be polished, forming a solution film or cleaning liquid film on the polishing surface to create a mirror-like surface, irradiating the sealed object with polarized light, and observing the optical image of the object to be polished on the polishing surface.

[0012] The polishing method of the present invention uses the object to be polished as a reflective surface, forms an optical image of the object to be polished on the reflective surface, and performs the polishing process while simultaneously observing the object to be polished and the optical image.

[0013] The polishing method of the present invention is characterized by cleaning the polishing surface of a sealed object containing the object to be polished, forming a solution film on the polishing surface, irradiating the sealed object with polarized light from the side, and observing the optical image of the object to be polished on the polishing surface from the top surface of the polished object. [Effects of the Invention]

[0014] By creating a light-reflecting surface on the polished surface and illuminating it with polarized light, the polishing state of the resin-encapsulated sample can be observed clearly, enabling high-precision polishing. [Brief explanation of the drawing]

[0015] [Figure 1] This is an explanatory diagram of the method for preparing polished samples in the polishing method of the present invention. [Figure 2] This is an explanatory diagram of the method for preparing polished samples in the polishing method of the present invention. [Figure 3]It is an explanatory diagram of a method for producing a polishing sample in the polishing method of the present invention. [Figure 4] It is an explanatory diagram of a method for producing a polishing sample in the polishing method of the present invention. [Figure 5] It is an explanatory diagram of the polishing apparatus of the present invention. [Figure 6] It is an explanatory diagram of the polishing apparatus of the present invention. [Figure 7] It is an explanatory diagram of the polishing method of the present invention. <000,It is an explanatory diagram of the polishing method of the present invention. [Figure 9] It is an explanatory diagram of the polishing apparatus of the present invention. [Figure 10] It is an explanatory diagram of the polishing apparatus of the present invention. [Figure 11] It is an explanatory diagram of the polishing apparatus of the present invention. [Figure 12] It is an explanatory diagram of the polishing apparatus of the present invention. [Figure 13] It is an explanatory diagram of the polishing apparatus of the present invention. [Figure 14] It is an explanatory diagram of the polishing apparatus of the present invention. [Figure 15] It is an explanatory diagram of the polishing apparatus of the present invention. [Figure 16] It is an explanatory diagram of the polishing apparatus of the present invention.s [Figure 17] It is an explanatory diagram of the polishing apparatus of the present invention. s [Figure 18] It is an explanatory diagram of the polishing apparatus of the present invention. [Figure 19] It is an explanatory diagram of the polishing method of the present invention. [Figure 20] It is an explanatory diagram of the polishing method of the present invention. <00001,

Embodiments for Carrying Out the Invention

[0016] Hereinafter, the present invention will be described based on the drawings showing the embodiments. In the embodiments described in the specification and drawings, there may be cases of omission, enlargement, or reduction for the purpose of facilitating understanding or facilitating drawing. The embodiments of the present invention described herein and in the drawings can be combined in part or in whole.

[0017] Figure 1 is an explanatory diagram of the method for preparing a polished sample in the polishing method of the present invention. Figure 1(a) is a model diagram (schematic diagram) of a polished sample for explaining an embodiment of the present invention. It represents a part of a semiconductor chip (object to be polished, polished sample) 102, with electrode terminals 101 formed on one side of the semiconductor chip (object to be polished, polished sample) 102. In this embodiment, as one embodiment, it will be explained that cross-sectional polishing is performed along the AA' line, which is the central part of the electrode terminal 101.

[0018] The polished sample 102 has marking lines 507 formed on it, as shown in Figure (a). The marking lines 507 are marked in the X and Y directions using a laser marker device (not shown). The marking lines 507 are marked parallel to the cutting line AA' in the X direction and parallel to the electrode terminal 101 in the Y direction. The marking lines in the X and Y directions are formed to be perpendicular to each other. When polishing sample 102, the marking line 507 is monitored or detected, and the polishing work is performed using the marking line 507 as a reference.

[0019] After the polishing sample 102 is cut into small pieces, a sample holding block 601, formed or constructed from acrylic resin or the like, is attached to the back of the chip or the like. The attachment is done using adhesive, glue, or double-sided tape.

[0020] The sample holding block 601 ensures that the polished sample 102 is stably positioned in the polished sample sealing pipe 103, and that the polished sample 102 is also stably held when the sealing resin is injected.

[0021] Figure 1(b) is a perspective view of the polished sample sealing pipe 103 used to prepare the resin-sealed sample 105. Examples of polished sample sealing pipes 103 include acrylic pipes, polycarbonate pipes, stainless steel pipes, aluminum pipes, and polyvinyl chloride pipes.

[0022] It is preferable to coat or form the inner surface of the polishing sample sealing pipe with a resin such as fluororesin (fluorocarbon resin) that has excellent properties of lubricity, non-stickiness, chemical resistance, and low friction.

[0023] For example, polytetrafluoroethylene (PTE) is a polymer of tetrafluoroethylene and is a fluoropolymer (fluorocarbon resin) composed only of fluorine and carbon atoms. It is chemically stable and has excellent heat resistance and chemical resistance.

[0024] The polishing sample 102, which is the object to be polished, is placed inside the polishing sample sealing pipe 103, and a sealing resin (molding resin) is injected or filled into the polishing sample sealing pipe 103. The sealing resin (molding resin) is a liquid sealing material (thermosetting or UV curing resin, etc.), and liquid sealing materials are classified into thermosetting / thermoplastic, solvent / solvent-free, one-component / two-component types, etc., depending on the type of resin and formulation.

[0025] The main components of liquid sealing materials are acrylic resins and epoxy resins. Additives such as plastic polymers, coupling agents, diluents, flame retardants, and defoamers are used as needed.

[0026] The sealing resin (molding resin) is a resin mainly composed of epoxy resin. Epoxy resin has a high refractive index, and the difference in refractive index between the polished surface 602 and air (refractive index 1.0) is large. Therefore, it is preferable because a good mirror surface (reflective surface) is formed or constructed on the polished surface 602. It is preferable to use a light-transmitting epoxy resin with a refractive index of 1.55 or more and 1.7 or less as the sealing resin.

[0027] Other examples include silicone resins. Compared to epoxy resins, silicone resins can slow down the rate at which the material degrades and the light transmittance decreases. Epoxy resins absorb up to several percent of light, while silicone resins absorb less than 1%. This slows down the rate of resin degradation, making it easier to observe the polished object using polarized light irradiation.

[0028] A plastic polymer may be mixed or added as needed. Examples of plastic polymers include polyamide resins, polyimide resins, urethane resins, silicone resins, and phenoxy resins.

[0029] The polished sample 102 is placed inside the polished sample sealing pipe 103, and after the sealing resin is filled in, the sealing resin is cured. Examples of sealing resin curing methods include light curing and heat curing.

[0030] Figure 2 is an explanatory diagram for removing the resin-sealed sample 105, which contains the polished sample 102, from the polished sample sealing pipe 103. Removal is easy. As shown in Figure 2(a), the resin-sealed sample 105 is pressed from above the polished sample sealing pipe 103 with a cylindrical extruder 104. Due to the pressing, the resin-sealed sample 105 separates from the polished sample sealing pipe 103, and as shown in Figure 2(b), the polished sample 102 is removed in a resin-sealed state.

[0031] Figure 3(a) is a schematic explanatory diagram showing a cross-section of the resin-encapsulated sample 105 from Figure 2(b) cut perpendicularly along line AA'. Figure 3(b) is a schematic explanatory diagram showing a cross-section of the resin-encapsulated sample 105 from Figure 2(b) cut perpendicularly along line BB'. As shown in Figure 3, the polished sample 102 is encapsulated in the encapsulating resin.

[0032] Figure 5 shows one embodiment of the polishing apparatus. As shown in Figure 5, the polishing apparatus of the present invention comprises a polishing table 107 to which a polishing pad 506 having a polishing surface 505 is attached. A resin-encapsulated sample 105 is attached to a polishing sample holder 106.

[0033] The polishing sample holder 106 can be moved upward (U1) and downward (D1), as shown in Figure 5. By raising the polishing sample holder 106 (U1), the polishing sample 102 can be moved away from the polishing surface 505. By lowering the polishing sample holder 106 (D1), the polishing sample 102 can be pressed against the polishing surface 505. Furthermore, by adjusting the amount of downward (D1) or upward (U1) movement of the polishing sample holder 106, the pressure applied to the polishing sample 102 against the polishing surface 505 can be adjusted.

[0034] The polishing apparatus of the present invention comprises a polishing head 106 for polishing a polishing sample 102 while pressing it against a polishing pad 506 on a polishing table 107, a polishing liquid supply nozzle 307 for supplying a polishing liquid (e.g., slurry) to the polishing pad 506, a cleaning liquid supply nozzle 207 for supplying a cleaning liquid, and a polishing control unit (not shown) for controlling the polishing of the polishing sample 102.

[0035] The polishing table 107 is connected via a table shaft 108 to a table motor 509 located below it, which rotates the polishing table 107 in the direction indicated by the arrow.

[0036] A polishing pad 506 is attached to the pad support surface 508 of the polishing table 107. The pad support surface 508 is located on the upper surface of the polishing table 107. The upper surface of the polishing pad 506 constitutes the polishing surface 505 for polishing the polishing sample 102.

[0037] As shown in Figure 5, the polishing table 107 can move in an upward direction (U2) and a downward direction (D2). By lowering the polishing table 107 (in the D2 direction), the polishing sample 102 can be moved away from the polishing surface 505. By raising the polishing table 107 (in the U2 direction), the polishing sample 102 can be pressed against the polishing surface 505. Furthermore, by adjusting the amount of downward (D1 direction) or upward (U1 direction) movement of the polishing table 107, the pressure applied to the polishing sample 102 against the polishing surface 505 can be adjusted.

[0038] Furthermore, by forming a space between the resin-encapsulated sample 105 and the polished surface 505 and supplying a cleaning solution such as water from the cleaning solution supply nozzle 207 into the space, the polished surface of the resin-encapsulated sample 105 is cleaned, and a film consisting of water, cleaning solution, oil, surfactant, etc. is formed on the polished surface, thereby generating a reflective surface (mirror surface, optical image surface) as described in Figures 7 and 8.

[0039] The polishing head 106 is configured to rotate in the direction of the arrow. By rotating the polishing head 106 at high speed and supplying cleaning solution at high pressure to the polishing surface of the polishing sample 102, the polishing surface can be cleaned.

[0040] As shown in Figure 6, the polishing head 106 is connected to the lower end of the polishing head shaft 301. The polishing head 106 is configured to hold the polishing sample 102 on its lower surface by vacuum suction. The polishing head shaft 301 is configured to allow adjustment of the angle of the resin-encapsulated sample 105 by the angle adjustment section (rotation section, position setting section) 302. The polishing head shaft 301 moves up and down and left and right by the operation of the up and down and left and right movement mechanism.

[0041] The polishing head 106 and the polishing table 107 are rotated in the directions indicated by the arrows, and polishing fluid (slurry) (not shown) is supplied from the polishing fluid supply nozzle 307 onto the polishing pad 506. In this state, the polishing head 106 presses the polishing sample 102 against the polishing surface 505 of the polishing pad 506. The surface of the polishing sample 102 is polished by the mechanical action of the abrasive grains contained in the polishing fluid, or by the mechanical action of the abrasive grains and the chemical action of the polishing fluid.

[0042] The polishing apparatus is equipped with an optical image detection and capture means 206a that detects and captures an optical image from the side of the polishing sample 102, and an optical image detection and capture means 206b that detects and captures an optical image from above the polishing sample 102. The optical image detection and capture means 206 corresponds to the observer's eye, camera, video camera, photosensor, or other optical components / elements, imaging device, vision, etc.

[0043] Furthermore, if necessary, an optical measuring instrument (thickness measuring device) (not shown) is provided to measure the thickness of the polished sample 102. The optical measuring instrument (not shown) comprises a sensor module (not shown) that acquires an optical signal that changes according to the thickness of the polished sample 102, and a processing unit that determines the thickness from the optical signal.

[0044] A sensor module (not shown) is located inside the polishing table 107, and the processing unit is connected to a polishing control unit (not shown). The sensor module (not shown) includes a sensor head that guides light to the surface of the polishing sample 102 and receives reflected light from the polishing sample 102.

[0045] The sensor head rotates integrally with the polishing table 107 and acquires the optical signal of the polishing sample 102 held by the polishing head 106. A sensor module (not shown) is connected to a processing unit, and the optical signal acquired by the sensor module (not shown) is sent to the processing unit.

[0046] This is a schematic cross-sectional view showing a polishing apparatus equipped with an optical measuring instrument (not shown). The polishing head shaft 301 is connected to the polishing head motor 509 via a connecting means such as a belt, and is rotated by the polishing head motor 509. The rotation of the polishing head shaft 301 causes the polishing head 106 to rotate in the direction indicated by the arrow.

[0047] The rotation speed of the polishing head 106 differs between polishing the polishing sample 102 and cleaning the polished surface of the polishing sample 102. When cleaning the polished surface of the polishing sample 102, it rotates at high speed to clean the polished surface, form a film of moisture on the polished surface, and remove moisture and abrasive material from the polished surface. During cleaning of the polished surface, etc., cleaning water is supplied from the cleaning liquid supply nozzle 207. Furthermore, when forming a coating on the polished surface, cleaning water mixed with a surfactant is supplied from the cleaning solution supply nozzle 207. Examples of surfactants include soap and detergent.

[0048] When polishing, a smooth finish can be achieved by starting with coarser grits (lower number) and gradually moving to grits with higher numbers. Start with #80 or #150, then #400 or #800, and finally finish with #2000 or similar grit.

[0049] The numbers #1000 and #3000 indicate the size of the abrasive grains. Abrasive grains are the abrasive material, and polishing is done by starting with coarser grains with smaller numbers and gradually moving to larger numbers, which allows for a clean finish on the machined surface (polished surface, cut surface) 602.

[0050] When the abrasive grain is #400 or lower, polishing scratches are present on the machined surface 602, and the observation quality of the electrode terminal 101 image on the machined surface (polished surface, cut surface) 602 is poor. When the abrasive grain is #1000 or higher, the polishing scratches on the machined surface (polished surface) 602 decrease, and the observation quality of the electrode terminal 101 image on the machined surface (polished surface, cut surface) 602 becomes good.

[0051] This invention utilizes the machined surface 602 of the polished sample 102 as a mirror surface and performs the polishing process by observing the image of the electrode terminal 101 reflected on the machined surface 602 (mirror or reflective surface). Therefore, it is important to be able to observe the machined surface 602 at a stage where the abrasive grain number is small. This invention makes it possible to observe the machined surface 602 at a stage where the abrasive grain number is small. In this invention, if there are polishing scratches on the machined surface 602, the polishing scratches scatter light, resulting in poor observation of the image of the electrode terminal 101 projected onto the machined surface 602a.

[0052] Cleaning water is supplied from the cleaning solution supply nozzle 207. Alternatively, cleaning water mixed with a surfactant is supplied. The cleaning water washes away the abrasive particles from the machined surface 602. After cleaning, the cleaning water or the solution mixed with the surfactant forms a film on the polished scratches, causing the machined surface 602 to become mirror-like or making the polished scratches less noticeable. Therefore, the machined surface 602 becomes closer to a mirror surface at a stage where the abrasive particles are small, and the image of the electrode terminal 101 reflected on the mirror surface can be observed.

[0053] After washing away the abrasive particles from the machined surface 602, cleaning water or the like is supplied between the polishing table 107 and the machined surface 602, filling or interposing the polishing table 107 and the machined surface 602 with the cleaning solution, thereby reducing polishing scratches on the machined surface 602. In addition, a light-reflecting surface is generated due to the difference in refractive index between the cleaning solution and the polished sample 102. Therefore, the machined surface 602 becomes mirror-like or damage caused by polishing scratches is reduced, and the image of the electrode terminal 101 reflected on the machined surface 602a (mirror surface, optical image-forming surface) can be observed clearly.

[0054] Instead of cleaning solutions, petroleum jelly, lubricating oil, etc., may be applied. For example, colored petroleum jelly is one such example. White petroleum jelly is obtained by decolorizing and refining a mixture of hydrocarbons derived from petroleum.

[0055] Vaseline is a mixture of hydrocarbons obtained from petroleum that has been decolorized and refined, and it mainly contains branched-chain paraffins (isoparaffins) and alicyclic hydrocarbons (cycloparaffins, naphthenes). In other words, a viscous, light-transmitting material is applied or formed on the processed surface 602.

[0056] Other examples of substances applied to or formed on the processed surface 602 include oil. Oil is a hydrophobic chemical substance that separates from water, obtained from animals, plants, minerals, etc., and is usually a mixture of many compounds. In a narrow sense, it refers to fats and oils, but in a broader sense, substances other than fats and oils, such as petroleum which is mainly composed of hydrocarbons, and essential oils which are mainly composed of terpenoids, are also called oil.

[0057] As the polishing process of the polishing sample progresses, polishing scratches on the machined surface 602 disappear during the polishing stage with high-grain abrasive particles. In this case, an air layer can be placed between the polishing sample 102 (resin-encapsulated sample 105) and the polishing surface 505 by lowering the polishing table 107 (in the D2 direction) or raising the polishing head 106 (in the U1 direction).

[0058] The air layer has a refractive index of 1.0, while the resin-sealed sample 105, composed of epoxy resin, has a refractive index of 1.55. Due to the refractive index difference between the air layer and the resin-sealed sample 105, and the refractive index difference with the polished sample 102, a light-reflecting surface is generated.

[0059] Therefore, the machined surface 602 becomes a mirror surface, and the image of the electrode terminal 101 reflected on the mirror surface can be observed clearly. Any moisture or solution adhering to the machined surface 602 can be removed by centrifugal force by rotating the polishing head 106 at high speed.

[0060] As schematically illustrated in Figure 3, the area indicated by the arrow at the top of the resin-sealed sample 105 shows a raised area of ​​sealing resin. This is because the sealing resin adheres to the periphery of the polished sample sealing pipe.

[0061] The resin-encapsulated sample 105 is first polished at the portion indicated by the arrow in Figure 3. As shown in Figure 6(a), the resin-encapsulated sample 105 is held by the polishing head 106. The polishing head 106 is attached to the polishing head shaft 301, and the polishing angle is adjusted, set, or changed by the angle adjustment unit 302. The polishing head 106 also rotates.

[0062] The polishing table 107 rotates, and polishing fluid (slurry) (not shown) is supplied from the polishing fluid supply nozzle 307. The resin-encapsulated sample 105 is pressed against the polishing surface 505, and the area indicated by the arrow in Figure 3 is polished. Figure 4 shows the area after polishing.

[0063] Figure 4(a) is a side view of the resin-encapsulated sample 105, and Figure 4(b) is a top view of the resin-encapsulated sample 105. After polishing the area indicated by the arrow in Figure 3, the processed surface 602b shown in Figure 4(a) is polished to a mirror finish.

[0064] Next, as shown in Figure 6(b), the resin-encapsulated sample 105 is inverted and attached to the polishing head 106. The polishing head 106 or the polishing head shaft 301 is moved to position the resin-encapsulated sample 105 so that the processed surface 602a contacts the polishing surface 505, and the polishing surface 602a is processed. The polishing head 106 also rotates.

[0065] The polishing table 107 rotates, and polishing fluid (slurry) (not shown) is supplied from the polishing fluid supply nozzle 307. The resin-encapsulated sample 105 is pressed against the polishing surface 505, causing the processed surface 602a to be polished.

[0066] During the polishing process, as shown in Figure 5(b), the processing state of the electrode terminals 101 is observed from the side of the resin-encapsulated sample 105 using the optical image detection and capture means 206a. The optical image detection and capture means 206a may be the observer's vision (eyes), or it may be an imaging and display device consisting of a camera and monitor.

[0067] Furthermore, the optical image detection and imaging means 206b observes an image of the electrode terminals 101 on the bottom surface (processed surface 602b) of the resin-encapsulated sample 105 from the top surface of the resin-encapsulated sample 105. As shown in Figures 1 and 4, in the embodiment of the present invention, cross-sectional polishing is performed at CC', which is the central part of the electrode terminal 101.

[0068] The polishing process for polishing sample 102 requires knowing the actual dimensions or relative dimensions of the polishing sample. Therefore, it is necessary to measure the height H and width W of polishing sample 102.

[0069] As shown in Figure 4, the resin-encapsulated sample 105 is cylindrical. Since the H2 direction is the planar direction of the cylinder, the length H2 can be measured. On the other hand, as shown in Figure 4(b), the length W2 is in the cylindrical direction and is a curved surface, so W2 cannot be measured.

[0070] However, if the length of H2 can be measured, the relative length of W2 can be determined from the length of H2. Also, if the length H1, which is known as the length formed by the laser marker device, is known, the actual length of H2 can be determined from H1.

[0071] If the length W1, which is determined by the laser marker device, is known, the actual length of W2 can be determined from W1. Lengths H2 and W2 can be measured by the optical image detection / imaging means 206. The length A of the electrode terminal 101 can be determined from length H2 or H1. Since the resin-encapsulated sample 105 is cylindrical, and the area surrounding the cylindrical resin-encapsulated sample 105 is air, the image is distorted when observing the polished sample 102.

[0072] As shown in Figure 12, when a rectangular container is filled with a solution and the resin-sealed sample 105 is immersed in it, the refractive index difference between the resin constituting the resin-sealed sample 105 and the solution disappears or becomes smaller, and the actual dimensions of W(W1, W2), H(H1, H2), and A in Figure 4 can be measured or determined.

[0073] The sealing resin used in sealing sample 105 is either epoxy resin or acrylic resin. The refractive index of epoxy resin is 1.55 to 1.61, and the refractive index of acrylic is generally 1.49. Therefore, it is preferable to use a solution whose refractive index is close to that of the sealing resin being used.

[0074] Examples of high refractive index solutions 200 include edible oil, 2-propanol, methyl salicylate (refractive index 1.538), ethylene glycol (refractive index 1.431), carbon tetrachloride (refractive index 1.46), benzene (refractive index 1.50), and paraffin oil (refractive index 1.48). Note that the refractive index of water is 1.33.

[0075] The container 109 is made of soda glass and light lime glass. The container 109 is filled with a high refractive index solution 200 (optical coupling solution), and the resin-encapsulated sample 105 is immersed in the high refractive index solution 200. The outer or inner surface (Sa, Sb, Sc, Sd) of the container 109 is coated or coated with a light-absorbing film such as black paint to absorb stray light.

[0076] Examples of black paints and light-absorbing films include those made by incorporating carbon into organic materials such as acrylic resin, or those in which black beads are dispersed in similar organic materials. Other examples include those containing cyanine black, a phthalocyanine-based pigment with high electrical insulation properties, in a resin vehicle, and polarizing films.

[0077] By forming a black paint or light-absorbing film on the outer or inner surface (Sa, Sb, Sc, Sd) of the container 109, stray light and reflected light at the interface of the container 109 are reduced, allowing for good observation of the polished sample or resin-sealed sample 105. In particular, when using polarized light, it is effective to configure the polarizing film 202 so that its absorption axis is perpendicular to the absorption axis of the polarizing film placed on the outer surface of the container 109.

[0078] By using the method shown in Figure 12, the influence of the cylindrical shape of the resin-encapsulated sample 105 is eliminated, and the actual dimensions of W(W1, W2), H(H1, H2), and A in Figure 4 can be measured or determined.

[0079] Figure 7 is an explanatory diagram of the polishing method of the present invention. As an example, the electrode terminal 101 is polished in cross-section with a CC' line. The polishing apparatus is explained in Figures 5 and 6, so it is omitted here.

[0080] In Figure 7, image 308a is an image of the resin-encapsulated sample 105 viewed from the side. Image 308b is an image of the processed surface 602b of the resin-encapsulated sample 105.

[0081] The resin-encapsulated sample 105 is polished at the processing surface 602a as shown in Figure 6(b). As shown in Figure 7, the polishing process proceeds from the processing surface 602a in the direction of the arrow. The length of the electrode terminal 101 is denoted as A. At the start of the polishing process, as shown in Figure 7(a), the distance between the electrode terminal 101 in the captured image 308a and the reflected image 208 of the electrode terminal 101 in the captured image 308b is denoted as D. As the polishing process progresses, the distance D decreases.

[0082] In Figure 7(b), the distance D is 0. At this time, the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 appear to be connected, and the length obtained by adding the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 is 2A.

[0083] Further polishing results in a length A, as shown in Figure 7(c), where the electrode terminal 101 and its reflected image 208 are added together. Figure 7(c) shows the electrode terminal 101 after being polished to half its length. This is the state after the electrode terminal 101 has been cross-sectionally polished with CC'. Therefore, when the polishing process is completed in Figure 7(c), the electrode terminal 101 has been cross-sectionally polished at the halfway point (center).

[0084] As described above, by observing or understanding the image of the electrode terminal 101 and the reflected image 208 of the electrode terminal 101, and performing polishing, a cross-sectional polished sample of the central part of the electrode terminal 101 can be obtained. As shown in Figure 7(d), by performing further polishing from Figure 7(c), polished samples can be obtained from locations other than the electrode terminal 101.

[0085] Figure 7 is an explanatory diagram showing the case where the polished sample 102 is placed vertically on the resin-encapsulated sample 105. Figure 8 is an explanatory diagram showing the case where the polished sample 102 is placed diagonally on the resin-encapsulated sample 105.

[0086] The case in Figure 8 is the same as in Figure 7. The resin-encapsulated sample 105 is polished on the processed surface 602a as shown in Figure 6(b). As shown in Figure 8(a), the polishing process proceeds from the processed surface 602a in the direction of the arrow.

[0087] As shown in Figure 8(a), the distance between electrode terminal 101a and the reflected image 208a of electrode terminal 101 is D1, and the distance between electrode terminal 101b and the reflected image 208b of electrode terminal 101 is D2. Therefore, D2 > D1. For this reason, it is necessary to shorten the distance D2 so that electrode terminal 101 and the reflected image 208 of electrode terminal 101 are in a linear relationship as shown in Figure 7.

[0088] Therefore, the angle of the angle adjustment section 302 of the polishing apparatus of the present invention shown in Figure 6 is adjusted to shorten the distance D2 compared to D1, as shown in Figures 8(a)->8(b)->8(c)->8(d), and polishing is performed so that the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 are in a linear relationship as shown in Figure 7.

[0089] In Figure 8(c), the electrode terminal 101b and the reflected image 208b of electrode terminal 101 are almost in a straight line. In Figure 8(d), similar to Figure 7(c), if the polishing process is completed in Figure 8(d), the electrode terminal 101 will have been cross-sectionally polished at the 1 / 2 position (center).

[0090] As shown in Fig. 8(d), the length obtained by adding the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 is A. Fig. 7(c) shows the state where the electrode terminal 101 is polished to a distance of 1 / 2. The electrode terminal 101 is in a state of being polished in cross section along CC'. Therefore, when the polishing process is completed in Fig. 8(d), it means that the electrode terminal 101 has been polished in cross section at the 1 / 2 position (central part).

[0091] As described above, by observing or grasping the image of the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 and performing the polishing process, a cross-section polished sample of the central part of the electrode terminal 101 can be obtained.

[0092] The electrode terminal 101 etc. described in Figs. 7 and 8 are illuminated by the light irradiator 201 and detected or observed by the optical image detection / photographing means 206. The light emitted from the light irradiator 201 is polarized light, and the polarized light is irradiated onto the polished sample 102. Also, wave plates (λ / 2 plate 210, λ / 4 plate 204) are used. The 1 / 2 wavelength plate 210 rotates the polarization direction of linearly polarized light. The 1 / 4 wavelength plate 204 converts linearly polarized light into circularly polarized light.

[0093] The wave plate functions by shifting the phase between the two perpendicular polarization components of the light wave. As a typical wave plate, there is a birefringent crystal whose optical axis direction and thickness are determined. When the crystal direction is selected so that the optical axis of the crystal is parallel to the surface of the plate and the crystal is cut into a plate, two axes, a normal axis with a refractive index of no and an extraordinary axis with a refractive index of ne, are obtained in the cut surface.

[0094] The normal axis is perpendicular to the optical axis, and the extraordinary axis is parallel to the optical axis. In the case of a light wave incident perpendicularly to the plate, the polarization component along the normal axis travels through the crystal at a speed of vo = c / no, while the polarization component along the extraordinary axis moves at a speed of ve = c / ne. When the incident light exits the crystal, a phase difference occurs between the two components. When ne < no as in calcite, the extraordinary axis is called the fast axis and the normal axis is called the slow axis. When ne > no, the fast axis and the slow axis are reversed.

[0095] A half-wave plate (λ / 2 plate) imparts a phase difference of π (=λ / 2) to the direction of electric field oscillation (plane of polarization) of incident light. When the plane of polarization of incident light is incident at an azimuthal angle of θ° with respect to the high-speed axis (or low-speed axis) of the waveplate, its direction of oscillation can be rotated by (2 × θ°).

[0096] Therefore, the maximum rotation angle (=90°) is obtained when the light is incident at an azimuth angle of 45°. If you want to change the orientation of the polarization plane of the irradiated light, you can move the polarization plane using only the half-wave plate without physically rotating it. A half-wave plate can reverse the direction of polarization when circularly polarized light is incident on it.

[0097] A half-wave plate causes incident light to exit with a phase difference of π (=λ / 2) between its two perpendicular polarization components. If the polarization direction of the incident light is at an azimuth angle θ with respect to the speed axis (or slow axis) of the wave plate, the polarization direction can be rotated by 2θ before exit. That is, the maximum rotation angle is 90° when the incident light is at an azimuth angle of 45°. If the polarization component of the incident light is circularly polarized or elliptically polarized, passing it through a half-wave plate can reverse its direction.

[0098] A quarter-wave plate (λ / 4 plate) imparts a phase difference of =λ / 4 to the direction of electric field oscillation (plane of polarization) of incident light. When the plane of polarization of the incident light is incident at an azimuth angle of 45° with respect to the high-speed axis (or low-speed axis) of the wave plate, linearly polarized light can be converted to circularly polarized light. Conversely, circularly polarized light can also be converted back to linearly polarized light. If the incident light is incident at an azimuth angle other than 45°, it becomes elliptically polarized light. A quarter-wave plate can be used in conjunction with a polarizing filter to construct an optical isolator. This invention is used to eliminate unwanted back reflections and glare.

[0099] A quarter-wave plate emits incident light with a phase difference of π / 2 (=λ / 4) between the two perpendicular polarization components. If the polarization direction of the incident light is at an azimuth angle other than 45° with respect to the speed axis (or slow axis) of the wave plate, the emitted light will be elliptically polarized; if it is incident at an azimuth angle of 45°, it will be circularly polarized.

[0100] When the polarization axis of the incident light is 0° to the fast or slow axis, the polarization does not change, so the emitted light is linearly polarized. If it is greater than 0° and less than 45°, it is elliptically polarized, and if it is 45°, it is circularly polarized. Furthermore, it is possible to reversibly convert circularly polarized or elliptically polarized incident light into linearly polarized light for emission. Figure 9 is an explanatory diagram of the polishing apparatus of the present invention. The polishing sample 102 inside the resin-encapsulated sample 105 is illuminated by light emitted from the light irradiator 201.

[0101] Examples of light irradiators 201 include monochromatic laser devices, white laser devices, xenon lamp irradiators, tungsten lamp irradiators, LED irradiators, backlighting fixtures, fiber optic irradiators, and the like.

[0102] Because the resin-encapsulated sample 105 is cylindrical, light from the light irradiator 201 is diffusely reflected inside the resin-encapsulated sample 105, generating stray light. As a result, a variation in light intensity occurs in the illumination of the polished sample 102, making it difficult to observe the condition of the electrode terminals 101 and the polishing process of the polished sample 102.

[0103] To address this issue, in the embodiment shown in Figure 4(a) of the present invention, a polarizing plate (polarizing film, polarizing sheet) 202a is placed on the light emission side of the light irradiator 201. Light 205a from the light irradiator 201 passes through the polarizing plate 202a and becomes polarized light 205b, and the light 205b illuminates the polished sample 102.

[0104] In the diagram, as an example, vertical linear polarization is illustrated with up-and-down arrows, and horizontal linear polarization is illustrated with left-and-right arrows. It goes without saying that the polarization direction can be freely set and changed not only in the up-and-down and left-and-right directions, but also in diagonal directions by adjusting the angle of the polarization axis of the polarizer.

[0105] As shown in Figure 9(c), the polarizing plate 202, the quarter-wave plate (λ / 4 plate) 204, and the half-wave plate (λ / 2 plate) 210 are configured to be arbitrarily adjusted or set to a positive angle (+θ) or a negative angle (-θ) with respect to 0° (DEG.).

[0106] The quarter-wave plate 204 emits incident light with a phase difference of π / 2 (=λ / 4) between the two perpendicular polarization components. If the polarization direction of the incident light is at an azimuth angle other than 45° with respect to the speed axis (or slow axis) of the wave plate, the emitted light will be elliptically polarized, and if it is incident at an azimuth angle of 45°, it will be circularly polarized.

[0107] Therefore, as shown in Figure 9(c), the polarized light can be changed from elliptic to circular by rotating the speed axis (or slow axis) of the quarter-wave plate 204. By changing the polarized light state, the polished sample 102 can be adjusted to be most easily observed.

[0108] A half-wave plate emits incident light with a phase difference of π (=λ / 2) between its two perpendicular polarization components. When the polarization direction of the incident light is at an azimuth angle θ with respect to the speed axis (or slow axis) of the wave plate, the polarization direction can be rotated by 2θ before emission. That is, the maximum rotation angle is 90° when the incident light is at an azimuth angle of 45°.

[0109] If the polarization component of the incident light is circularly polarized or elliptically polarized, its direction can be reversed by passing it through a half-wave plate. By rotating the speed axis (or slow axis) of the half-wave plate 204, the polarization can be changed from elliptically polarized to circularly polarized. By rotating the polarization direction by 2θ and changing the state from elliptically polarized to circularly polarized, the polished sample 102 can be adjusted to be most easily observed.

[0110] As shown in Figure 9(a), light 205b becomes reflected light 205c at the polished sample 102. A portion of the light 205c reflected at the polished sample 102 becomes stray light and undergoes diffuse reflection within the resin-encapsulated sample 105. Additionally, the phase axis of light 205c rotates.

[0111] In Figure 9(a), the λ / 2 plate 210 is positioned and set up so that the light is incident at an azimuth angle of approximately 45°. The polarization axes of polarizer 202a and polarizer 202b are positioned orthogonally.

[0112] The reflected light 205c is rotated by 90° on the λ / 2 plate 210. Therefore, the reflected light 205c passes through the polarizing plate 202b and becomes reflected light 205d. The reflected light 205d is detected by the optical image detection / imaging means 206, and the polishing state of the polished sample 102 is observed.

[0113] Optical image detection and imaging means include optical detection means such as cameras, cameras, and imaging devices, as well as light-receiving members and light-receiving elements. Display devices such as LCDs and organic ELs, monitors, and combinations of cameras with these display devices are also included. Furthermore, the act of grasping, recognizing, and evaluating an object through human vision or observation is also included.

[0114] The polarization axes of polarizer 202a and polarizer 202b are orthogonal, and by rotating the reflected light 205c by λ / 2 plate 210 by 90°, stray light within the resin-sealed sample 105 is blocked by polarizer 202b. The stray light is not in phase and does not coincide with the polarization axis of polarizer 202b.

[0115] Therefore, stray light reaching the optical image detection / imaging means 206 is reduced, and the polishing condition can be observed clearly. Furthermore, to obtain the best possible observation, the angle θ of the phase axis of the λ / 2 plate 210 (λ / 4 plate 204) is adjusted or set as shown in Figure 9(c).

[0116] It goes without saying that the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204) may be bonded together to form a single unit. The same applies to other embodiments of the present invention.

[0117] Figure 9(b) is a configuration diagram and explanatory diagram of a polishing apparatus in another embodiment of the present invention. In Figure 9(b), the λ / 4 plate 204a is placed on the light emission side of the polarizing plate 202a. The λ / 4 plate 204b is placed on the light incidence side of the polarizing plate 202b.

[0118] The quarter-wave plate is positioned at approximately 45° (DEG.) relative to the polarization axis of the polarizer 202. The quarter-wave plate causes the incident light to emit with a phase difference of π / 2 (=λ / 4) between the two perpendicular polarization components. When the polarization direction of the incident light is at an azimuth angle of 45°, it becomes circularly polarized.

[0119] When circularly polarized light is reflected, its direction of rotation reverses. The light transmitted through a circular polarizer rotates in the opposite direction at the reflective surface (clockwise rotation -> counterclockwise rotation). This is because the direction of polarization rotation remains the same, but the direction of light propagation is reversed. When this light passes through the quarter-wave plate mentioned earlier, it returns to linear polarization, but the direction of the polarization plane changes by 90° relative to the outward path.

[0120] When the polarization axis of the incident light is 0° to the fast or slow axis, the polarization does not change, so the emitted light is linearly polarized. If it is greater than 0° and less than 45°, it is elliptically polarized, and if it is 45°, it is circularly polarized. Furthermore, it is possible to reversibly convert circularly polarized or elliptically polarized incident light into linearly polarized light for emission.

[0121] In the embodiments of the present invention, the rotation direction of circularly polarized light is indicated by the rotational arrows in Figure 9, etc. The λ / 4 plate 204 is positioned and set so that it is incident at an azimuth angle of approximately 45°. The polarization axis of polarizer 202a and the polarization axis of polarizer 202b are arranged orthogonally.

[0122] Light 205a emitted from the light irradiator 201 is converted to linearly polarized light (vertical direction) by the polarizer 202a. Linearly polarized light is converted to circularly polarized light 205b by the λ / 4 plate 204a. When the circularly polarized light 205b is reflected by the polished sample 102, it becomes circularly polarized light 205c in the opposite direction of rotation to the circularly polarized light 205b. Circularly polarized light 205c is converted back to linearly polarized light by the λ / 4 plate 204b. The polarization axis of the linearly polarized light 205d is perpendicular to the polarization axis of the polarized light emitted from the polarizer 202a. Therefore, after passing through the λ / 4 plate 204b, the light becomes linearly polarized and passes through the polarizer 202b. Linearly polarized light 205d is detected by the optical image detection / imaging means 206, and the polishing state of the polished sample 102 is observed.

[0123] The polarization axes of polarizer 202a and polarizer 202b are orthogonal, and the rotation direction of the circularly polarized reflected light 205c is reversed by the λ / 4 plate 204b, thereby blocking stray light within the resin-sealed sample 105 by polarizer 202b. Consequently, the amount of stray light reaching the optical image detection / imaging means 206 is reduced, allowing for better observation of the polishing condition.

[0124] Figure 9 shows a configuration in which light is irradiated perpendicularly from a light irradiator 201 onto a polishing sample 102, and the reflected light is detected by an optical image detection / capture means 206 positioned perpendicularly to the polishing sample 102. The present invention is not limited to this configuration.

[0125] As shown in Figure 10, the device may be configured to irradiate the polishing sample 102 with light from the light irradiator 201 in an oblique direction, and to detect the light reflected from the polishing sample 102 with an optical image detection / imaging means 206 positioned obliquely.

[0126] In Figure 9(a), polarizers 202a and 202b may be combined into a single polarizer 202, and the polarization axis of polarizer 202 may be configured to be the same polarization axis with respect to the incident light 205a and the outgoing light 205c.

[0127] In Figure 9(a), the λ / 2 plate 210 may be placed on the light-emitting side of the polarizer plate 202a. Alternatively, in Figure 9(a), the λ / 2 plate 210 may be placed on the light-emitting side of the polarizer plate 202a, and the λ / 2 plate 210 on the light-incident side of the polarizer plate 202b may be removed.

[0128] In Figure 9(b), the λ / 4 plates 204a and 204b may be treated as a single λ / 4 plate 204, and the phase (optical axis) axis of the skewed λ / 4 plate 204 may be configured in the same direction with respect to the incident light 205a and the outgoing light 205c.

[0129] In Figure 9(b), polarizers 202a and 202b may be combined into a single polarizer 202, and the polarization axis of polarizer 202 may be configured to be the same polarization axis with respect to the incident light 205a and the outgoing light 205c. In Figure 9(b), the λ / 4 plate 204 may be placed on either the light-emitting side of the polarizing plate 202a or the light-indicating side of the polarizing plate 202b. It goes without saying that the above points can also be applied to Figure 10 and other embodiments of the present invention as described in the drawings and specification.

[0130] In the embodiment shown in Figure 13(a), light 205d is emitted from the machined surface 602b, and in the embodiment shown in Figure 13(b), light 205a is incident on the machined surface 602b. The machined surface 602b is mirror-finished in the embodiment shown in Figure 6, etc., so as not to interfere with the emission of light 205d and the incidence of light 205a.

[0131] The light irradiator 201 shown in Figure 10 is positioned or mounted on a moving (rotating) stage 603a. The moving (rotating) stage 603a moves in the X-axis and Y-axis directions, and also rotates the angle of the light emitted from the light irradiator 201.

[0132] The optical image detection and capture means 206 is positioned or installed on the moving (rotating) stage 603b. The moving (rotating) stage 603a moves in the X-axis and Y-axis directions, and also rotates its angle so that reflected light 205d is incident on the optical image detection and capture means 206.

[0133] The light irradiator 201a is mounted on the moving (rotating) stage 603 and adjusts, sets, or changes the angle of light incident on the resin-encapsulated sample 105. The optical image detection and capture means 206 is mounted on the moving (rotating) stage 603 and adjusts, sets, or changes the angle at which the light emitted from the resin-encapsulated sample 105 is incident. In Figure 10(a), similar to Figure 9(a), the polarization axes of polarizer 202a and polarizer 202b are arranged orthogonally.

[0134] Figure 10(a) shows that the optical axis of light 205d is incident on the λ / 2 plate 210 at an azimuth angle of approximately 45°. The polarization axes of polarizer 202a and polarizer 202b are positioned to be perpendicular to each other.

[0135] The reflected light 205c undergoes a 90° polarization axis rotation at the λ / 2 plate 210. Therefore, the reflected light 205c passes through the polarizer plate 202b and becomes reflected light 205d. The reflected light 205d is detected by the optical image detection / imaging means 206, and the polishing state of the polished sample 102 is observed.

[0136] The polarization axes of polarizer 202a and polarizer 202b are orthogonal, and by rotating the reflected light 205c by 90° with the λ / 2 plate 210, stray light within the resin-sealed sample 105 is blocked by polarizer 202b.

[0137] The stray light generated within the resin-sealed sample 105 is not in phase and does not coincide with the polarization axis of the polarizer plate 202b. Therefore, the amount of stray light reaching the optical image detection / imaging means 206 is reduced, the contrast of the optical image is improved, and the polishing condition can be observed clearly.

[0138] Furthermore, to ensure optimal observation, the phase axis angle θ of the λ / 2 plate 210 (λ / 4 plate 204) is adjusted or set as shown in Figure 9(c). The angle θ is adjusted or set while monitoring the captured image with the optical image detection / capture means 206.

[0139] It goes without saying that the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204) may be bonded together to form a single unit. By bonding the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204), the interface between the polarizing plate 202, the λ / 2 plate, etc., and the air is reduced, and the light transmittance is improved. In Figure 10(a), a configuration is also shown in which at least one of the λ / 2 plate 210 and the polarizing plate 202b is omitted. The same applies to other embodiments of the present invention.

[0140] Figure 10(b) is a configuration diagram and explanatory diagram of a polishing apparatus in another embodiment of the present invention. In Figure 10(b), the λ / 4 plate 204a is placed on the light emission side of the polarizing plate 202a. The λ / 4 plate 204b is placed on the light incidence side of the polarizing plate 202b.

[0141] The quarter-wave plate is positioned at approximately 45° (DEG.) relative to the polarization axis of the polarizer 202. The quarter-wave plate's θ is varied as shown in Figure 9(c) to appropriately adjust the display contrast, etc. The quarter-wave plate emits the incident light with a phase difference of π / 2 (=λ / 4) between the two perpendicular polarization components. Ideally, when the incident light is incident at an azimuth angle of 45°, it becomes circularly polarized.

[0142] When circularly polarized light is reflected, its direction of rotation reverses. The light transmitted through the circular polarizer rotates in the opposite direction at the reflective surface (clockwise rotation -> counterclockwise rotation). When this light passes through the quarter-wave plate, it returns to linear polarization, but the direction of the polarization plane changes by 90° relative to the outward path.

[0143] When the polarization axis of incident light is 0° to the fast or slow axis, the polarization does not change. The emitted light is linearly polarized; if it is greater than 0° and less than 45°, it is elliptically polarized; and if it is 45°, it is circularly polarized. Therefore, it is possible to convert circularly polarized or elliptically polarized incident light into linearly polarized light for emission. The λ / 4 plate 204 is positioned and set so that the light is incident at an azimuth angle of approximately 45°. The polarization axes of polarizer 202a and polarizer 202b are positioned orthogonally. Light 205a emitted from the light irradiator 201 passes through the polarizer plate 202a and becomes linearly polarized (vertical direction). The linearly polarized light becomes circularly polarized 205b through the λ / 4 plate 204a.

[0144] When circularly polarized light 205b is reflected by polished sample 102, it becomes circularly polarized light 205c with a rotation direction opposite to that of circularly polarized light 205b. Circularly polarized light 205c is converted to linearly polarized light by λ / 4 plate 204b. The polarization axis of linearly polarized light 205d is perpendicular to the polarization axis of the polarized light emitted from polarizer plate 202a. After passing through λ / 4 plate 204b, the light becomes linearly polarized and passes through polarizer plate 202b. Linearly polarized light 205d is detected by the optical image detection / imaging means 206, and the polishing state of the polished sample 102 is observed.

[0145] The polarization axes of polarizer 202a and polarizer 202b are orthogonal, and the rotation direction of the circularly polarized reflected light 205c is reversed by the λ / 4 plate 204b. As a result, stray light within the resin-sealed sample 105 is blocked by polarizer 202b and does not enter the optical image detection / imaging means 206, or is reduced. Therefore, the amount of stray light reaching the optical image detection / imaging means 206 is reduced, and the polishing condition can be observed clearly.

[0146] Figures 9(a), 9(b), 10(a), and 10(b) primarily describe the process of irradiating the electrode terminal 101 with light from a light irradiator, observing the electrode terminal 101 or its vicinity, and observing the polishing state.

[0147] As shown in Figures 10(c) and 10(d), by moving the moving (rotating) stage 603 and changing or adjusting the direction of light irradiation to the polishing sample 102 and the light detection direction of the optical image detection / capture means 206, the reflected image 208 can be observed, and the reflected image 208 and the electrode terminal 101, as explained in Figures 7 and 8, can be observed simultaneously.

[0148] In Figures 10(c) and 10(d), light is incident from the side of the resin-encapsulated sample 105 to illuminate the polished sample 102, and light is emitted from the side of the resin-encapsulated sample 105 to be detected and observed by the optical image detection and imaging means 206.

[0149] Figure 10(c) shows that light 205a emitted from the light irradiator 201 is polarized by the polarizer 202a, and the polarized light 205b is incident on the side of the resin-encapsulated sample 105. The polarized light 205b is reflected by the polished sample 102. The polished sample 102 is illuminated by the polarized light 205, and a reflected image 208 of the electrode terminal 101 is generated on the processed surface 602a.

[0150] The reflected image 208 becomes clearer as the mirror-finishing of the machined surface 602 progresses. When the abrasive grain is #400 or lower, polishing scratches are present on the machined surface 602a, and the observation quality of the electrode terminal 101 image on the machined surface 602a is poor. When the abrasive grain is #1000 or higher, the polishing scratches on the machined surface 602a decrease, and the observation quality of the electrode terminal 101 image on the machined surface 602 becomes good.

[0151] The present invention is characterized in that, even if the machined surface 602a has scratches, a film of water or the like is generated on the machined surface 602a during polishing, etc., filling the scratches with water, cleaning solution, oil, petroleum jelly, etc., bringing the machined surface 602a closer to a mirror surface, or reducing the effect of the existing scratches, thereby enabling the machined surface 602a to be used as a mirror to generate a reflected image 208 (optical image). Therefore, the machined surface 602a can be observed well even at the stage where the abrasive grain number (#) is small.

[0152] As the abrasive grains approach the target cross-sectional polishing position, the abrasive grain number (#) increases, reducing polishing scratches on the machined surface 602a. Furthermore, by generating a protective film on the machined surface 602a, the mirror-like finish of the machined surface 602a is improved, enabling polishing with high precision in machining position.

[0153] When the polishing position is near the target position, the processed surface 602a becomes mirror-like. The processed surface 602a is cleaned, the polishing head 106 is raised in the U1 direction in Figure 5(b), and the polishing head 106 is rotated at high speed to remove water or other substances from the processed surface 602a, or to form a thin film of water or other substances. The processed surface 602a of the resin-encapsulated sample 105 is brought into contact with the air layer.

[0154] The refractive index of the epoxy resin in the resin-encapsulated sample 105 is approximately 1.55, while the refractive index of air is 1.0. Alternatively, the refractive index of water in the water film on the processed surface 602a of the resin-encapsulated sample 105 is approximately 1.33, while the refractive index of air is 1.0. The water film, etc., has the function of reducing or making less noticeable the step height caused by polishing scratches. Because the water film, etc., is thin, even if there is a slight difference in the refractive index of the encapsulating resin, the reflection image of the polished sample, etc., is formed well. Therefore, the processed surface 602a can reflect light well, and a good reflection image 208 is generated. As a result, the reflection image of the polishing position can be observed well, and polishing with good processing position accuracy can be achieved.

[0155] The polarizers are arranged, set up, and configured so that the light is incident on the λ / 2 plate 210 at an azimuth angle of approximately 45° with respect to the polarization axis. The polarization axes of polarizer 202a and polarizer 202b are arranged to be perpendicular to each other.

[0156] The reflected light 205d undergoes a 90° polarization axis rotation at the λ / 2 plate 210. Therefore, the reflected light 205d passes through the polarizer plate 202b. The reflected light 205e is detected by the optical image detection / imaging means 206, and the polishing state of the polished sample 102 is observed.

[0157] The polarization axes of polarizer 202a and polarizer 202b are orthogonal, and by rotating the reflected light 205e by 90° with the λ / 2 plate 210, stray light within the resin-encapsulated sample 105 is blocked by polarizer 202b.

[0158] The stray light generated within the resin-sealed sample 105 has out-of-phase light or does not coincide with the polarization axis of the polarizer plate 202b. Therefore, the amount of stray light reaching the optical image detection / imaging means 206 is reduced, the contrast of the optical image is improved, and the polishing condition can be observed more clearly.

[0159] To ensure optimal observation, the phase axis angle θ of the λ / 2 plate 210 is adjusted or set as shown in Figure 9(c). The angle θ is adjusted or set while monitoring the captured image with the optical image detection / imaging means 206.

[0160] It goes without saying that the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204) can be bonded together to form a single unit. By bonding the polarizing plate 202 and the λ / 2 plate 210 together, the interface between the polarizing plate 202, the λ / 2 plate, etc., and the air is reduced, improving the light transmittance.

[0161] Figure 10(d) is a configuration diagram and explanatory diagram of a polishing apparatus in another embodiment of the present invention. In Figure 10(d), the λ / 4 plate 204a is placed on the light emission side of the polarizing plate 202a. The λ / 4 plate 204b is placed on the light incidence side of the polarizing plate 202b.

[0162] In Figure 10(d), light is incident from the side of the resin-encapsulated sample 105 to illuminate the polished sample 102, and light is emitted from the side of the resin-encapsulated sample 105 to be detected and observed by the optical image detection and imaging means 206.

[0163] Figure 10(d) shows that light 205a emitted from the light irradiator 201 is polarized by the polarizer 202a, and the polarized light 205b is incident on the side of the resin-encapsulated sample 105. The polarized light 205b is reflected by the polished sample 102. The polished sample 102 is illuminated by the polarized light 205, and a reflected image 208 of the electrode terminal 101 is generated on the processed surface 602a.

[0164] The quarter-wave plate is positioned at a 45° angle to the polarization axis of polarizer 202. When circularly polarized light is reflected, its direction of rotation reverses. The light transmitted through the circular polarizer rotates in the opposite direction at the reflective surface (clockwise rotation -> counterclockwise rotation). When this light passes through the quarter-wave plate, it returns to linear polarization. The direction of the polarization plane changes by 90° relative to the forward path. Therefore, incident circularly polarized or elliptically polarized light can be converted to linearly polarized light and emitted. The λ / 4 plate 204 is positioned and set so that the light is incident at an azimuth angle of approximately 45°. The polarization axes of polarizer 202a and polarizer 202b are positioned orthogonally. Light 205a emitted from the light irradiator 201 passes through the polarizer plate 202a and becomes linearly polarized (vertical direction). The linearly polarized light becomes circularly polarized 205b through the λ / 4 plate 204a.

[0165] When circularly polarized light 205b is reflected by the polished sample 102, it becomes circularly polarized light 205c with a rotation direction opposite to that of circularly polarized light 205b. Circularly polarized light 205c is converted to linearly polarized light by the λ / 4 plate 204b. After passing through the λ / 4 plate 204b, the light becomes linearly polarized and passes through the polarizer plate 202b. Linearly polarized light 205d is detected by the optical image detection / imaging means 206, and the polishing state of the polished sample 102 is observed.

[0166] The reflected image 208 becomes clearer as the mirror-like finish of the machined surface 602 progresses. If there are polishing scratches on the machined surface 602a, the clarity decreases. By cleaning the machined surface 602a and forming a film of cleaning water or the like on the machined surface 602a, the machined surface 602a can be made mirror-like or its light reflectivity can be improved.

[0167] The polarization axes of polarizer 202a and polarizer 202b are orthogonal, and the rotation direction of the circularly polarized reflected light 205c is reversed by the λ / 4 plate 204b, thereby blocking stray light within the resin-sealed sample 105 by polarizer 202b. Consequently, the amount of stray light reaching the optical image detection / imaging means 206 is reduced, allowing for better observation of the polishing condition.

[0168] In Figures 9 and 10, it was explained that the polarization axis of polarizer 202a and the polarization axis of polarizer 202b are orthogonal, but the present invention is not limited to this. For example, the polarization axis of polarizer 202a and the polarization axis of polarizer 202b may be configured to be approximately the same.

[0169] The azimuth angles of the λ / 2 plate 210 and the λ / 4 plate 204 may be set to -θ, and the rotation axis of the circularly polarized light may be reversed. Furthermore, it is not limited to circularly polarized light; elliptically polarized light may also be used.

[0170] In Figures 10(c) and 10(d), the λ / 2 plate 210 may be omitted. The λ / 4 plate 204 may also be omitted. The polarization axis of polarizer 202a and polarizer 202b may be configured to approximately coincide.

[0171] As shown in Figures 10(c) and 10(d), by positioning the aperture 504 and making the light incident on the optical image detection / imaging means 206 narrowly directional, stray light is eliminated, and images of polished samples 102, etc., can be observed with high contrast. Furthermore, the image becomes sharper. In the embodiments shown in Figures 2, 4, 9, and 10, the resin-encapsulated sample 105 is described as cylindrical, but the present invention is not limited thereto.

[0172] Figure 19 is an explanatory diagram of the resin-encapsulated sample 105 in the polishing apparatus of the present invention. In Figure 19, Figure 19(a) is an explanatory diagram of the resin-encapsulated sample 105 viewed from the side, Figure 19(b) is an explanatory diagram of the resin-encapsulated sample 105 viewed from the front, and Figure 19(c) is an explanatory diagram of the resin-encapsulated sample 105 viewed from above.

[0173] The resin-encapsulated sample 105 in Figure 2(b) is cut or polished at an angle θ on its upper side. The angle θ is preferably between 40° and 60° due to the angle of incidence of light. The cut surface 602b is polished or otherwise finished to a mirror-like surface. The polishing method is the same as for the processed surface 602a.

[0174] As shown in Figure 19, by cutting the resin-encapsulated sample 105 at an angle θ, the light 205a from the light irradiator 201 is less attenuated by surface reflection of the resin-encapsulated sample 105 and can be incident on the resin-encapsulated sample 105. The light 205a illuminates the polished sample 102. The light reflected by the polished sample 102 is emitted from the resin-encapsulated sample 105 as light 205b. The emitted light 205b is incident on the optical image detection / imaging means 206.

[0175] Light incident on the resin-encapsulated sample 105 is scattered within the resin-encapsulated sample 105, generating stray light. When stray light occurs, observation of the electrode terminals 101 and the polished sample 102 becomes difficult or impaired.

[0176] In this embodiment, in order to counteract stray light, as shown in Figure 20, a light-absorbing film 606 is formed on the resin-encapsulated sample 105 in areas other than the processed surface 602, the light incident surface that illuminates the polished sample 102, and the light emission surface for observing the optical image of the polished sample 102.

[0177] Examples of the light-absorbing film 606 include an organic material such as acrylic resin containing carbon, or a similar organic material in which black beads are dispersed. Another example is a resin vehicle containing cyanine black, a phthalocyanine-based pigment with high electrical insulation properties. As shown in Figure 4, after preparing the resin-encapsulated sample 105, a light-absorbing film 606 is formed on the surface of the resin-encapsulated sample 105, and processing such as the processed surface 602 is carried out.

[0178] Figure 11 is a configuration diagram and explanatory diagram of the polishing apparatus of the present invention. The resin-encapsulated sample 105 is held by the polishing head 106. The polishing head 106 presses the resin-encapsulated sample 105 against the polishing surface 505, and the polishing head 106 also rotates.

[0179] The optical image detection and capture means 206 observes the polishing state. To observe the state of the polished sample 102 inside the resin-sealed sample 105, the optical image detection and capture means 206 synchronizes with the rotational position of the resin-sealed sample 105.

[0180] The optical image detection and imaging means 206a photographs or observes the polished sample 102 when it is facing forward (point C). Similarly, the optical image detection and imaging means 206b photographs or observes the reflected image 208 of the electrode terminal 101 of the polished sample 102 when it is facing forward (point C). The reflected image 208 is projected onto the processed surface 602a.

[0181] A space is formed between the resin-encapsulated sample 105 and the polished surface 505, and a cleaning solution such as water is supplied to the space from the cleaning solution supply nozzle 207, thereby cleaning the polished surface (processed surface 602a) of the resin-encapsulated sample 105 and forming a film of water or the like on the polished surface (processed surface 602a). The polished surface (processed surface 602a) can be cleaned by rotating the polishing head 106 at high speed and supplying the cleaning solution to the polished surface of the polished sample 102 at high pressure. The solution supplied during polishing and the solution supplied during cleaning may be the same, but it is preferable to use different solutions.

[0182] As shown in Figure 6, the polishing head 106 is connected to the lower end of the polishing head shaft 301. The polishing head shaft 301 has an opening so that the optical image detection and imaging means 206b can observe the reflected image 208.

[0183] Figure 11(a) shows the case where the electrode terminal 101 and the reflected image 208 are arranged in a straight line, as in Figure 7, and Figure 11(b) shows the case where the electrode terminal 101 and the reflected image 208 are arranged at an angle, as in Figure 8. In either case, the rotational position of the resin-encapsulated sample 105 and the optical image detection / capture means 206 are synchronized to observe or detect the polishing state. Figure 13 is a configuration diagram and explanatory diagram of the polishing apparatus of the present invention. It describes a method for observing the reflected image 208 of the processed portion 602a on the bottom surface of the resin-encapsulated sample 105.

[0184] An aperture (light shield) 504 is positioned in front of the light irradiator 201. Additionally, an aperture (light shield) 504 is positioned on the light incident side of the optical image detection / imaging means 206 as needed.

[0185] Examples of apertures (light-shielding devices) 504 include the Waterhouse aperture, which uses a perforated plate inserted through a slit on the side of the lens; the sluice gate aperture, which uses a flat rod with large and small holes that moves up and down in front of or inside the lens; the rotary aperture, which uses a disc with small holes that rotates in front of or inside the lens; and the iris aperture, which is made by stacking multiple plates (aperture blades) to allow for fine adjustment.

[0186] In this embodiment, it is preferable to use an iris diaphragm as the aperture 504. The center position of the iris diaphragm is positioned or configured as the center of the light beam of the light (optical path) 205. By changing the aperture of the iris diaphragm, the directivity of the light 205 in the optical path can be controlled. Therefore, control equivalent to changing the F-number of the lens 605 can be achieved. By changing the aperture of the iris diaphragm, the contrast and sharpness of the optical image can be adjusted or set.

[0187] In the embodiment shown in Figure 13(a), light 205a emitted from the light irradiator 201 is polarized by the polarizer 202a, becomes circularly polarized by the λ / 4 plate, and is incident obliquely on the side of the resin-encapsulated sample 105 to become light 205b. The incident angle θ1 is θ2 (θ1 > θ2) according to Snell's law, because the refractive index of the resin-encapsulated sample 105 is higher than that of air. The circularly polarized light 205b illuminates the polished sample 102, and some of the light is reflected to become circularly polarized light 205c with rotation in the opposite direction.

[0188] The processed surface 602a is in contact with air or with an interface with water, which has a refractive index lower than that of the resin-encapsulated sample 105. Therefore, the circularly polarized light 205c undergoes total internal reflection or reflection at the processed surface 602a. The circularly polarized light 205c forms a reflected image 208 of the electrode terminal 101 on the processed surface 602a.

[0189] The circularly polarized light 205c and 205b are reflected inside the resin-sealed sample 105, and some of the light becomes reflected light 205d, which enters the optical image detection / imaging means 206, where the optical image detection / imaging means 206 detects or observes the reflected image 208. In addition, the aperture 504b makes the light 205d narrowly directional, reducing the amount of stray light entering the optical image detection / imaging means 206.

[0190] The light irradiator 201 is mounted on the moving (rotating) stage 603, and the angle of light incident on the resin-encapsulated sample 105 is changed to optimize the observation image obtained by the optical image detection and capture means 206.

[0191] The reflected light 205d is converted to linear polarization by the λ / 4 plate 204b and transmitted through the polarizer 202b. The polarization axes of polarizers 202ba and 202b are configured to be orthogonal. As described above, the present invention utilizes the machined surface 602a as a reflective surface.

[0192] When the abrasive grain is #400 or lower, polishing scratches are present on the machined surface 602a, and the observation quality of the electrode terminal 101 image on the machined surface 602 is poor. When the abrasive grain is #1000 or higher, the polishing scratches on the machined surface 602 decrease, and the observation quality of the electrode terminal 101 image on the machined surface 602 becomes good. At the beginning of the polishing process, use abrasives with a low abrasive number, and as the polishing process nears completion, use abrasives with a higher abrasive number.

[0193] The key to polishing is to ensure the cross-sectional position is precisely where it is intended as the polishing process nears completion. Therefore, precision in the polishing position is not necessary in the initial stages of the polishing process. Precision in the polishing position becomes necessary in the final stages of the polishing process.

[0194] This invention utilizes the machined surface 602 of the polished sample 102 as a mirror surface and performs the polishing process by observing the image of the electrode terminal 101 reflected on the mirror surface. Therefore, it is important to be able to observe the machined surface 602 at a stage where the abrasive grain number is small.

[0195] At the beginning of the polishing process, if there are polishing scratches on the machined surface 602, the scratches will scatter light, resulting in poor observation of the image of the electrode terminal 101 projected onto the machined surface 602a. However, since this is far from the polishing target position, confirmation of the polishing position is unnecessary.

[0196] Cleaning water is supplied from the cleaning water supply nozzle 207. It is preferable to supply cleaning water mixed with a surfactant. The cleaning water washes away abrasive particles and the like from the machined surface 602a. After cleaning, the cleaning water or a solution mixed with a surfactant forms a film on the machined surface 602a in the areas of polishing scratches. The film covers the polishing scratches on the machined surface 602a, reducing the unevenness of the polishing scratches and making the machined surface 602a mirror-like. Alternatively, it increases the specular reflectance of light on the machined surface 602a and reduces stray light.

[0197] When a coating is formed on the machined surface 602a and the machined surface 602a becomes mirror-like, polishing scratches become less noticeable. Therefore, at the stage when the abrasive grains are small, the machined surface 602a becomes closer to a mirror surface, and the reflected image 208 of the electrode terminal 101 reflected on the mirror surface can be observed.

[0198] After washing away the abrasive particles from the machined surface 602, cleaning water or the like is supplied between the polishing table 107 and the machined surface 602a, filling or interposing the polishing table 107 and the machined surface 602 with the cleaning solution, thereby reducing polishing scratches on the machined surface 602a. In addition, a light-reflecting surface is generated due to the difference in refractive index between the cleaning solution and the polished sample 102. As a result, the machined surface 602a becomes more mirror-like, allowing for better observation of the electrode terminals 101 and the reflected image 208 of the electrode terminals 101 reflected on the machined surface 602a.

[0199] As the polishing process of the polishing sample progresses, in the polishing stage where larger abrasive grains (number 200 or higher) are used, the polishing scratches on the processed surface 602 become smaller and shallower. By forming a film of cleaning solution or the like on the processed surface 602a, the processed surface 602a becomes mirror-like, improving the contrast and clarity of the reflected image 208. As the polishing process on the polishing sample progresses, in the final stage of the polishing process using larger abrasive grains (number 200 or higher), the polishing scratches on the machined surface 602 disappear.

[0200] At this stage, an air layer can be placed between the polishing sample 102 (resin-encapsulated sample 105) and the polishing surface 505 by lowering the polishing table 107 (in the D2 direction) or raising the polishing head 106 (in the U1 direction).

[0201] The air layer has a refractive index of 1.0, while the resin-encapsulated sample 105, made of epoxy resin or similar material, has a refractive index of approximately 1.55. The difference in refractive index between the air layer and the resin-encapsulated sample 105, along with the difference in refractive index with the polished sample 102, creates a light-reflecting surface. Consequently, the processed surface 602 becomes a mirror surface, allowing for clear observation of the reflected image 208 of the electrode terminal 101 reflected on the mirror surface. Any moisture or solution adhering to the processed surface 602a can be removed by centrifugal force by rotating the polishing head 106 at high speed. Furthermore, a thin film of water or solution can be formed on the processed surface 602a, eliminating polishing scratches and resulting in a mirror-like surface on the processed surface 602a.

[0202] By placing the aperture 504a on the light output side of the light irradiator 201, and the aperture 504b on the light input side of the optical image detection / imaging means 206, the light can be made narrowly directional or its directionality can be defined, thereby suppressing the generation and reception of stray light, and enabling the detection and observation of optical images with high contrast.

[0203] Furthermore, by positioning the aperture 504b on the light incident side of the optical image detection / imaging means 206 and adjusting the aperture diameter of the aperture 504b, the F-number of the incident light can be controlled, thereby enabling good contrast adjustment of the observed image.

[0204] In the embodiment shown in Figure 13(a), the light emitted by the light irradiator 201 is incident on the resin-encapsulated sample 105 from the side, and the light 205d emitted from the top surface of the resin-encapsulated sample 105 is received by the optical image detection and capture means 206. However, the present invention is not limited to this. For example, the light emitted by the light irradiator 201 may be incident on the resin-encapsulated sample 105 from the top surface (processing surface 602b), and the light 205dc emitted from the side surface of the resin-encapsulated sample 105 may be received by the optical image detection and capture means 206.

[0205] In Figure 13(a), the configuration with λ / 4 plates 204a and 204b removed may still be sufficient for practical purposes. Furthermore, the polarization axes of polarizers 202a and 202b may be in the same direction. As shown in Figure 13(a), light 205b becomes reflected light 205c from the polished sample 102, etc. A portion of the light 205c reflected from the polished sample 102 becomes stray light.

[0206] The λ / 4 plate 204a is positioned and set at an azimuth angle of approximately 45° with respect to the polarization axis of the polarizer plate 202a. The polarization axes of polarizer plate 202a and polarizer plate 202b are positioned orthogonally.

[0207] Polarized light transmitted through the λ / 4 plate 204a becomes circularly polarized light 205a. The circularly polarized light 205a is incident from the side of the resin-sealed sample 105, becomes light 205b, and is reflected by the polished sample 102, etc. The reflected circularly polarized light 205c becomes circularly polarized light that rotates in the opposite direction to the circularly polarized light 205b. A portion of the circularly polarized light 205c undergoes total internal reflection at the processed surface 602a, and a reflected image 208 of the electrode terminal 101 is formed on the processed surface 602a. Light from inside the resin-encapsulated sample 105 is emitted out of the resin-encapsulated sample 105 as reflected light 205d.

[0208] The reflected light 205d is converted to linearly polarized light by the λ / 4 plate 204b. Therefore, the reflected light 205b passes through the polarizer plate 202b and is detected by the optical image detection / imaging means 206, allowing observation of the polishing state of the polished sample 102.

[0209] When circularly polarized light is reflected, its direction of rotation reverses. The light transmitted through a circular polarizer rotates in the opposite direction at the reflective surface (clockwise rotation -> counterclockwise rotation). This is because the direction of polarization rotation remains the same, but the direction of light propagation is reversed. When this light passes through the quarter-wave plate mentioned earlier, it returns to linear polarization, but the direction of the polarization plane changes by 90° relative to the outward path.

[0210] By converting the light to circularly polarized light 205a using the λ / 4 plate 204a, and then converting it to circularly polarized light with the opposite rotation of the circularly polarized light 205a using the λ / 4 plate 204b, the stray light within the resin-sealed sample 105 is blocked by the polarizer plate 202b. Therefore, the amount of stray light reaching the optical image detection / imaging means 206 is reduced, and the polishing condition can be observed clearly. Furthermore, to achieve the best possible observation, the angle θ of the phase axis of the λ / 4 plate 204 is adjusted or set as shown in Figure 9(c).

[0211] It goes without saying that the polarizing plate 202 and the λ / 4 plate 204 may be bonded together to form a single unit. The same applies to other embodiments of the present invention.

[0212] The polishing table 107 can be moved upward (U2) and downward (D2), as shown in Figure 5. By lowering the polishing table 107 (D2), the polishing sample 102 can be moved away from the polishing surface 505. By raising the polishing table 107 (U2), the polishing sample 102 can be pressed against the polishing surface 505. Furthermore, by adjusting the amount of downward (D1) or upward (U1) movement of the polishing table 107, the pressure applied to the polishing sample 102 against the polishing surface 505 can be adjusted.

[0213] A space is formed between the resin-encapsulated sample 105 and the polished surface 505, and a cleaning solution such as water is supplied to the space from the cleaning solution supply nozzle 207, thereby cleaning the polished surface of the resin-encapsulated sample 105 and forming a film of water or the like on the processed surface 602a. The film of water or the like reduces the optical scattering of light by polishing scratches on the processed surface 602a, bringing the processed surface 602a closer to a mirror surface. The mirror surface becomes a reflective surface, and a reflective surface as described in Figures 7 and 8 can be generated.

[0214] The polishing head 106 is configured to rotate in the direction of the arrow. By rotating the polishing head 106 at high speed and supplying cleaning fluid at high pressure to the polishing surface of the polishing sample 102, the polishing surface (processed surface 602a) can be cleaned.

[0215] As shown in Figure 6, the polishing head 106 is connected to the lower end of the polishing head shaft 301. The polishing head 106 is configured to hold the polishing sample 102. The polishing head shaft 301 is configured to allow adjustment of the angle of the resin-encapsulated sample 105 by the angle adjustment section 302. The polishing head shaft 301 moves up and down and left and right by the operation of the up and down and left and right movement mechanism.

[0216] The polishing apparatus of the present invention, as shown in Figure 13(a), comprises an optical image detection and capture means 206a that detects and captures an optical image from the top of the resin-encapsulated sample 105, and a light irradiator 201 that irradiates light from the side of the resin-encapsulated sample 105. However, the present invention is not limited thereto.

[0217] Figure 13(b) shows a configuration in which light 205a emitted from the light irradiator 201 from the top surface of the resin-encapsulated sample 105 is incident on the resin-encapsulated sample 105, and light 205d emitted from the side of the resin-encapsulated sample 105 is detected by the optical image detection / capture means 206.

[0218] Figure 14(a) is a diagram showing the state in which water (washing water) 209 is sandwiched between the processed surface 602a of the resin-encapsulated sample 105 and the polishing table 107. The refractive index of the epoxy resin constituting the resin-encapsulated sample 105 is 1.55 to 1.65, and the refractive index of water (washing water) is 1.33. Therefore, there is a difference in refractive index between the epoxy resin and the water (washing water) 209, and light is reflected at the processed surface 602a. The reflected light is emitted from the resin-encapsulated sample 105 as reflected light 205c and incident on the optical image detection / imaging means 206.

[0219] A solution mixed with cleaning water or a surfactant forms a film on the polished surface, causing the processed surface 602 to become mirror-like or making the polishing scratches less noticeable. Therefore, the smaller the abrasive particles, the closer the processed surface 602 becomes to a mirror-like surface, and the image of the electrode terminal 101 reflected on the mirror surface can be observed.

[0220] As the polishing process of the polishing sample progresses, the polishing scratches on the machined surface 602 become smaller and shallower during the polishing stage where larger abrasive grains are used. By forming a film of cleaning solution or the like on the machined surface 602a, the machined surface 602a becomes mirror-like, improving the contrast and clarity of the reflected image 208. As the polishing process on the polishing sample progresses, the polishing scratches on the machined surface 602 disappear in the final stage of the polishing process, which uses larger numbered abrasive grains.

[0221] After washing away the abrasive particles from the machined surface 602, cleaning water is supplied between the polishing table 107 and the machined surface 602, and the cleaning solution 209 is filled or interposed between the polishing table 107 and the machined surface 602. This reduces polishing scratches on the machined surface 602, and a light-reflecting surface is generated due to the difference in refractive index between the cleaning solution and the polished sample 102. As a result, the machined surface 602 becomes a mirror surface, and the image of the electrode terminal 101 reflected on the mirror surface can be observed clearly. Figure 14(b) shows a configuration in which an air layer (gap, space) is placed between the resin-encapsulated sample 105 and the polishing table 107.

[0222] As the polishing process of the polishing sample progresses, polishing scratches on the machined surface 602 disappear during the polishing stage with high-grain abrasive particles. In this case, an air layer (gap, space) can be placed between the polishing sample 102 (resin-encapsulated sample 105) and the polishing surface 505 by lowering the polishing table 107 (in the D2 direction) or raising the polishing head 106 (in the U1 direction).

[0223] The air layer has a refractive index of 1.0, while the resin-sealed sample 105, being made of epoxy resin, has a refractive index of 1.55 to 1.65. Due to the refractive index difference between the air layer and the resin-sealed sample 105, and the refractive index difference with the polished sample 102, a light-reflecting surface is generated on the processed surface 602a.

[0224] Therefore, the machined surface 602 becomes a mirror surface, and the image of the electrode terminal 101 reflected on the mirror surface can be observed clearly. Any moisture or solution adhering to the machined surface 602a can be removed by centrifugal force by rotating the polishing head 106 at high speed. Alternatively, a thinner water film can be formed on the machined surface 602a.

[0225] Figure 14(b) shows a configuration in which an air layer (gap, space) is placed between the resin-encapsulated sample 105 and the polishing table 107. However, it is also preferable to form a coating (film) 604 made of a cleaning solution or water on the processed surface 602a of the resin-encapsulated sample 105, and configure the system so that the coating (film) 604 is in contact with the air.

[0226] The coating (water film) penetrates the polishing scratches on the processed surface 602, flattening them. As a result, the processed surface 602 becomes mirror-like. The resin-encapsulated sample 105 has a refractive index of 1.5 to 1.65, while the coating (water film) has a refractive index of 1.33 to 1.5. The refractive index of air is 1.0.

[0227] The coating (water film) uses a solution or material that has affinity with the sealing resin constituting the resin-sealed sample 105. It is preferable to use a solution or material with a refractive index lower than that of the sealing resin constituting the resin-sealed sample 105. Needless to say, the coating may also be formed by applying petrolatum or the like.

[0228] For resin-encapsulated sample 105, it is preferable to use a encapsulating resin with a refractive index of 1.5 to 1.65. When forming a coating (water film) by application, it is preferable to use a material with a refractive index of 1.45 to 1.55.

[0229] The coating 604 is not limited to a cleaning solution. The coating 604 may also be formed on the processed surface 602 by spraying or applying cleaning water mixed with a surfactant or a surfactant.

[0230] Furthermore, it is preferable to use a material with good wettability. Wettability primarily refers to the affinity (ease of adhesion) of a liquid to a solid surface. When the liquid is a solution, wettability can also be expressed using terms such as hydrophilicity or hydrophobicity.

[0231] Alternatively, a coating agent such as wax may be applied to or formed on the processed surface 602. For example, a photocurable resin made of acrylic resin may be applied and cured with ultraviolet light.

[0232] The present invention relates to a method or configuration for improving the specular reflectivity of a machined surface 602 by filling polishing scratches on the machined surface 602 with a liquid or solid, thereby flattening the machined surface 602 or reducing light scattering.

[0233] As the polishing process of the polishing sample progresses, polishing scratches on the machined surface 602 disappear during the polishing stage with high-grain abrasive particles. In this case, an air layer (gap, space) can be placed between the polishing sample 102 (resin-encapsulated sample 105) and the polishing surface 505 by lowering the polishing table 107 (in the D2 direction) or raising the polishing head 106 (in the U1 direction).

[0234] The air layer has a refractive index of 1.0, while the resin-sealed sample 105, being made of epoxy resin, has a refractive index of 1.55 to 1.65. Due to the refractive index difference between the air layer and the resin-sealed sample 105, and the refractive index difference with the polished sample 102, a light-reflecting surface is generated on the processed surface 602a.

[0235] The same applies to the machined surface 602b. By forming a coating (water film) 604b on the machined surface 602b, the effect of polishing scratches on the surface of the machined surface 602b is reduced, and the machined surface 602b becomes mirror-like. As a result of the mirror-like surface, no attenuation occurs in the incidence and emission of light 205.

[0236] Figure 15 shows that the light 205 emitted from the light irradiator 201 is separated into P-polarized 205P and S-polarized 205S by the polarization separation surface 501 of the polarizing beam splitter (PBS) 502.

[0237] The PBS502 is a polarizer that extracts light with specific vibrations (P-polarization, S-polarization) from natural light (random polarization). It comes in cube and plate types, either of which is acceptable. The wavelength band should be matched to the wavelength of the light emitted by the light irradiator 201.

[0238] Lens 605 is a relay lens. Lens 605 is positioned to focus light 205, illuminate the polishing sample 102, and ensure that the light from the polishing sample 102 is properly incident on the optical image detection / imaging means 206.

[0239] At the separation surface 501, light 205S is reflected as S-polarized light 205S, while the P-polarized light 205P is transmitted. The S-polarized light 205S is converted to circularly polarized light 205b by the λ / 4 plate 204. The circularly polarized light 205b is incident on the resin-sealed sample 105 and irradiates the polished sample 102.

[0240] The circularly polarized light 205b reflected by the polished sample 102, etc., becomes circularly polarized light 205c, which is in the opposite direction to the circularly polarized light 205b, and is emitted from the resin-sealed sample 105. The circularly polarized light 205c is converted to P-polarized light 205d by the λ / 4 plate 204. The P-polarized light 205d passes through the separation surface 501 and is incident on the optical image detection / imaging means 206.

[0241] In the embodiment shown in Figure 15, light 205b is incident on the resin-encapsulated sample 105 from one side, and light 205c is emitted from the same side. Furthermore, the incident light 205b and the emitted light 205c pass through the same λ / 4 plate 204. Therefore, linear polarization to circular polarization and circular polarization to linear polarization can be reversibly converted. Additionally, the optical paths of the light entering and leaving the resin-encapsulated sample 105 can be aligned.

[0242] When the aperture 504a is completely closed, the light 205 from the light illuminator 201 is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / imaging means 206.

[0243] By adjusting the aperture diameter of the diaphragm 504a, the directivity of the light incident on the optical image detection and shooting means 206 can be adjusted. Reducing the aperture diameter of the diaphragm 504a narrows the directivity of the light. Therefore, this is equivalent to increasing the F-number of the lens, and the contrast of the optical image can be increased. Increasing the aperture diameter of the diaphragm 504a widens the directivity of the light. Therefore, this is equivalent to decreasing the F-number of the lens, and the brightness of the optical image can be increased. Figure 15 shows a configuration in which incident light 205b and outgoing light 205c are incident on or outgoing from the side of the resin-encapsulated sample 105. The present invention is not limited to this.

[0244] As shown in Figure 16, the configuration may also involve injecting light 205c from the side of the resin-encapsulated sample 105, emitting light 205d from the side of the resin-encapsulated sample 105, injecting light 205a from the top surface of the resin-encapsulated sample 105, and emitting light 205b from the top surface of the resin-encapsulated sample 105.

[0245] Light 205a emitted from light emitter 201a is linearly polarized by polarizer 202a, focused by relay lens 605a, and reflected by total internal reflection mirror 503. Reflected by total internal reflection mirror 503, the direction of the light is changed and it enters the resin-encapsulated sample 105 from the top surface.

[0246] Linearly polarized light is converted to circularly polarized light 205a by the λ / 4 plate 204a. The circularly polarized light 205a is incident on the resin-encapsulated sample 105. The light 205b reflected by the resin-encapsulated sample 105 becomes circularly polarized light 205b with the opposite polarity to the circularly polarized light 205a, and is emitted from the resin-encapsulated sample 105.

[0247] The circularly polarized light 205b is converted to linearly polarized light by the λ / 4 plate 204a, reflected by the total internal reflection mirror 503, focused by the relay lens 605b, transmitted through the polarizing plate 202b, and incident on the optical image detection / imaging means 206a. The polarization axes of the polarizing plates 202a and 202b are arranged to be perpendicular to each other.

[0248] Light 205 emitted from light emitter 201b becomes linearly polarized by polarizer 202c. Linearly polarized light is converted to circularly polarized light 205c by λ / 4 plate 204a. Circularly polarized light 205c is incident on the resin-encapsulated sample 105 from the side.

[0249] The light 205d reflected within the resin-encapsulated sample 105 becomes circularly polarized light 205, which is opposite to the circularly polarized light 205c, and is emitted from the resin-encapsulated sample 105. The circularly polarized light 205c is converted to linearly polarized light by the λ / 4 plate 204b, passes through the polarizer plate 202d, and is incident on the optical image detection / imaging means 206b.

[0250] When the aperture 504a is completely closed, the light 205a from the light illuminator 201a is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / imaging means 206a.

[0251] When the aperture 504b is completely closed, the light 205c from the light illuminator 201b is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection and imaging means 206b. By adjusting the aperture diameters of apertures 504a and 504b, the directionality of the light from light irradiators 201a and 201b can be adjusted.

[0252] Reducing the aperture diameter of f / 504a and f / 504b narrows the directivity of light. Therefore, this is equivalent to increasing the F-number of the lens, and the contrast of the optical image can be increased. Increasing the aperture diameter of f / 504a and f / 504b widens the directivity of light. Therefore, this is equivalent to decreasing the F-number of the lens, and the brightness of the optical image can be increased.

[0253] Figure 17 is an explanatory diagram of the polishing apparatus of the present invention in another embodiment. As shown in Figure 17, light 205d is incident on the resin-encapsulated sample 105 from the side, and light 205e is emitted from the side of the resin-encapsulated sample 105. Light 205b is incident on the resin-encapsulated sample 105 from the top surface, and light 205c is emitted from the top surface of the resin-encapsulated sample 105.

[0254] Light 205a emitted from the light emitter 201a is separated into P-polarized and S-polarized light by the light separation surface 501 of the PBS 502. The S-polarized light 205b is reflected by the separation surface 501, and the linearly polarized light is converted to circularly polarized light by the λ / 4 plate 204a.

[0255] Furthermore, at the separation surface 501, S-polarized light 205S is reflected, while P-polarized light 205P is transmitted. Although it is stated that S-polarized light 205S is reflected by the total internal reflection mirror 503b, this is not the only option. A PBS502 may also be used at the separation surface 501, in which P-polarized light 205P is reflected and S-polarized light 205S is transmitted.

[0256] The circularly polarized light 205b is incident on the resin-encapsulated sample 105. The light 205c reflected by the resin-encapsulated sample 105 becomes circularly polarized in the opposite direction to the circularly polarized light 205b and is emitted from the resin-encapsulated sample 105. The circularly polarized light 205c is converted to linearly polarized light by the λ / 4 plate 204a, passes through the separation surface 501, and is incident on the optical image detection / imaging means 206a.

[0257] Light 205 emitted from light emitter 201b becomes linearly polarized by polarizer 202c. Linearly polarized light is converted to circularly polarized light by λ / 4 plate 204b. Circularly polarized light is incident on the resin-encapsulated sample 105 from the side.

[0258] The light 205e reflected within the resin-encapsulated sample 105 becomes circularly polarized light in the opposite direction to the circularly polarized light 205d and is emitted from the resin-encapsulated sample 105. The circularly polarized light 205e is converted to linearly polarized light by the λ / 4 plate 204b, passes through the polarizer plate 202b, and is incident on the optical image detection / imaging means 206a.

[0259] When the aperture 504a is completely closed, the light 205a from the light illuminator 201a is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / imaging means 206a.

[0260] When the aperture 504b is completely closed, the light 205c from the light illuminator 201b is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection and imaging means 206b.

[0261] Figure 18 is an explanatory diagram and configuration diagram of a polishing apparatus in another embodiment. Light 205 emitted from the light irradiator 201 is separated into P-polarized 205P and S-polarized 205S by the polarization separation surface 501 of the polarizing beam splitter (PBS) 502.

[0262] Lens 605 (lenses 605a, lenses 605b) are relay lenses. Lens 605 is positioned to focus light 205, illuminate the polishing sample 102, and ensure that the light from the polishing sample 102 is properly incident on the optical image detection / imaging means 206.

[0263] Light 205 is reflected as S-polarized 205S at the separation surface 501, while P-polarized 205P is transmitted. The S-polarized 205S is reflected by the total internal reflection mirror 503b. The S-polarized 205S is converted to circularly polarized light by the λ / 4 plate 204b. The circularly polarized light is incident on the resin-sealed sample 105 from the processed surface 602b. The light reflected from the sealed sample 105, polished sample 102, and processed surface 602a becomes circularly polarized light 205c, which is the opposite rotation of the incident circularly polarized light.

[0264] The circularly polarized light 205c is converted to linearly polarized light by the λ / 4 plate 204a, reflected by the total internal reflection mirror 503a, and incident on the PBS 502. The light incident on the PBS 502 is incident on the optical image detection / imaging means 206 via the light separation surface 501. Light that is not converted to linear polarization by the λ / 4 plate 204a, specifically circularly polarized light 205c, is transmitted through the light separation surface 501 of PBS 502.

[0265] When the light 205c is made to enter the optical image detection / photographing means 206, the aperture 504a is opened and the aperture 504b is closed. When the light 205d is made to enter the optical image detection / photographing means 206, the aperture 504b is opened and the aperture 504a is closed.

[0266] When the aperture 504a is completely closed, the light 205c that is mainly reflected by the processed surface 602a is blocked from light. When the aperture 504b is opened, the light reflected by the polished sample 102 can be made to enter the optical image detection / photographing means 206.

[0267] When the aperture 504b is completely closed, the light 205d that is mainly reflected by the polished sample 102 is blocked from light. When the aperture 504a is opened, the light mainly reflected by the processed surface 602a can be made to enter the optical image detection / photographing means 206.

[0268] In the embodiment of FIG. 18, the light 205S is made to enter from the side surface of the resin-sealed sample 105, and the light 205d exits from the same side surface. Therefore, linearly polarized light -> circularly polarized light and circularly polarized light -> linearly polarized light can be reversibly converted. Also, the optical path of the light entering and exiting the resin-sealed sample 105 can be made to coincide with the optical axis.

[0269] Also, the light 205P is made to enter from the upper surface of the resin-sealed sample 105, and the light 205c exits from the same upper surface. Therefore, linearly polarized light -> circularly polarized light and circularly polarized light -> linearly polarized light can be reversibly converted. Also, the optical path of the light entering and exiting the resin-sealed sample 105 can be made to coincide with the optical axis. When both the aperture 504a and the aperture 504b are completely closed, the dark level can be measured by measuring the amount of light entering the optical image detection / photographing means 206.

[0270] Also, by adjusting the aperture diameters of the aperture 504a and the aperture 504b, the directivity of the light entering the optical image detection / photographing means 206 can be adjusted. When the aperture diameter of the aperture 504 is made smaller, the directivity of the light becomes narrower. Therefore, it is equivalent to increasing the F number of the lens, and the contrast of the optical image can be increased.

[0271] Increasing the aperture diameter of 504 widens the directivity of light. Therefore, it is equivalent to decreasing the lens's F-number, which can increase the brightness of the optical image.

[0272] Figures 16, 17, and 18 show that light is incident on the resin-encapsulated sample 105 from two directions, the top surface and the side surface, but the present invention is not limited to this. It goes without saying that light may also be incident on the resin-encapsulated sample 105 from one direction, either the top surface or the side surface, and the light emitted from the resin-encapsulated sample 105 may be detected or observed by the optical image detection / imaging means 206.

[0273] In this invention, the polished surface of the polished sample 105, which is resin-encapsulated, is cleaned during the polishing process. The polished surface is cleaned, the polishing scratches are covered with the cleaning solution 604a, and the polished surface 602a is made mirror-like.

[0274] The refractive index of the resin-encapsulated polished sample 105 is high, ranging from 1.55 to 1.65. Furthermore, the large difference in refractive index between the resin-encapsulated resin and the air covered with the cleaning solution results in a high reflectivity of the illumination light within the resin-encapsulated polished sample 105. The optical image of the component is projected onto the polished surface 602a, and by simultaneously observing the real image 101 of the component and the optical image (reflected image, mirror image) 208 of the polished surface, the polished sample can be processed with high precision.

[0275] Light emitted from the light irradiator 201 is polarized by the polarizing plate 202a, and the polarized light is converted to circularly polarized light 205a by the λ / 4 plate 204a to illuminate the polished sample 102. Light 205d emitted from the resin-sealed polished sample 105 is converted to polarized light by the λ / 4 plate 204b, and the light transmitted through the polarizing plate 202b is observed by an imaging camera (camera, monitor screen, display monitor) 206, etc. By polarizing the illumination light and converting it to circular polarization with the λ / 4 plate, stray light within the resin-sealed sample 105 is reduced, and the polished surface can be observed clearly.

[0276] The embodiments disclosed herein are illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims, not in the sense described above, and all modifications are intended to be within the sense and scope equivalent to the claims. Needless to say, the matters or contents described herein and in the drawings can be combined with each other. [Explanation of symbols]

[0277] 101 Electrode terminals (cross-sectional area) 102 Object to be polished (polishing sample) 103 Polished sample sealing pipe 104 Extrusion tool 105 Resin-encapsulated samples 106 Polishing head 107 Polishing Table 108 Table axis 109 Container 200 Optical coupling fluid (water, etc.) 201 Light irradiator 202 Polarizing plate (polarizing film) 204 λ / 4 plate (phase plate, wave plate, phase film) 205 Light (light path) 206 Optical image detection and imaging means (optical detection means, camera, light-receiving member, camera, light-receiving element, display device, monitor, vision) 207 Cleaning fluid supply nozzle 208 Reflected image (mirror image, optical image) 209 Cleaning solution 210 λ / 2 plate (phase plate, wave plate, phase film) 211 Wavelength axis (optical axis) 301 Polished Head Shaft 302 Angle adjustment section (rotating section) 307 Polishing fluid supply nozzle 308 Photograph 501 Separation plane 502 Polarizing Beam Splitters (PBS) 503 Mirror 504 Aperture (light shield) 505 Grinding surface 506 Grinding pad 507 Marking line (positioning marker) 508 Pad support surface 509 Grinding motor 601 Sample holding block 602 Processing surface (grinding surface, cutting surface) 603 Moving (rotating) stage 604 Film (solution film, etc.) 605 Lens (relay lens, condenser lens) 606 Light absorption film

Claims

1. A method for producing a resin encapsulation having a top surface, a bottom surface, and cylindrical sides, in which a polished object is sealed with a light-transmitting resin, The first step is to place the abrasive material inside the pipe, A second step involves filling the pipe with the liquid resin and curing the resin, A third step is to remove the resin-sealed object, in which the polished material is sealed with the resin, from the pipe, A method for producing a resin encapsulant, characterized by comprising a fourth step of polishing the peripheral portion of the upper surface of the resin encapsulant.

2. A method for producing a resin encapsulation having a top surface, a bottom surface, and cylindrical sides, in which a polished object is sealed with a light-transmitting resin, A fifth step of forming a first marking line and a second marking line substantially perpendicular to the first marking line on the polished work, The first step is to place the abrasive material inside the pipe, A second step involves filling the pipe with the liquid resin and curing the resin, A method for producing a resin encapsulant, characterized by comprising a third step of removing the resin encapsulant, in which the polished material is sealed with the resin, from the pipe.

3. A method for producing a resin encapsulation having a top surface, a bottom surface, and cylindrical sides, in which a polished object is sealed with a light-transmitting resin, A sixth step involves attaching a holder for holding the polished object, The first step is to place the abrasive material inside the pipe, A second step involves filling the pipe with the liquid resin and curing the resin, A method for producing a resin encapsulant, characterized by comprising a third step of removing the resin encapsulant, in which the polished material is sealed with the resin, from the pipe.

4. The method for producing a resin encapsulant according to claim 1, claim 2, or claim 3, characterized in that the resin is an epoxy resin having a refractive index of 1.55 or more and 1.7 or less.

5. In the third step of removing the resin-sealed object in which the polished material is sealed with the resin from the pipe, A method for producing a resin sealant according to claim 1, claim 2, or claim 3, characterized in that the resin sealant is removed from the pipe using an extruder.

6. A resin encapsulation manufacturing apparatus for producing a resin encapsulation having a top surface, a bottom surface, and cylindrical sides, in which a polished object is sealed with a light-transmitting resin, A curing device for curing the liquid resin filled into the pipe on which the abrasive material is placed, An extruder for removing a resin-sealed object from the pipe, in which the polished material is sealed with the resin, A apparatus for manufacturing resin encapsulants, characterized by comprising a polishing device for polishing the peripheral portion of the upper surface of the resin encapsulant.

7. A resin encapsulation manufacturing apparatus for producing a resin encapsulation having a top surface, a bottom surface, and cylindrical sides, in which a polished object is sealed with a light-transmitting resin, A curing device for curing the liquid resin filled into the pipe on which the abrasive material is placed, An extruder for removing a resin-sealed object from the pipe, in which the polished material is sealed with the resin, From the cylindrical side surface, an illumination device is provided that generates illumination light to illuminate the polished object, An apparatus for manufacturing resin-sealed products, characterized by comprising observation means for observing reflected light reflected by the polished product.

8. A resin encapsulation manufacturing apparatus for producing a resin encapsulation having a top surface, a bottom surface, and cylindrical sides, in which a polished object is sealed with a light-transmitting resin, A curing device for curing the liquid resin filled into the pipe on which the abrasive material is placed, An extruder for removing a resin-sealed object from the pipe, in which the polished material is sealed with the resin, A polishing device for polishing the bottom surface of the resin-encapsulated object, An apparatus for manufacturing a resin-sealed object, characterized by comprising a coating formed on the bottom surface and an observation means for observing the reflected light reflected from the bottom surface from the cylindrical side surface.

9. The reflected light is polarized, The polishing method according to claim 7 or 8, characterized in that it is configured to allow rotation of the polarization direction of the polarization.

10. The aforementioned resin is an epoxy resin with a refractive index of 1.55 or more and 1.7 or less. The polishing apparatus according to claim 8, characterized in that the refractive index of the coating is lower than the refractive index of the resin.

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