Curable compositions and insulating films

JP2026101651APending Publication Date: 2026-06-22DUPONT ELECTRONICS INC
View PDF 1 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
DUPONT ELECTRONICS INC
Filing Date
2025-12-10
Publication Date
2026-06-22

AI Technical Summary

Technical Problem

Conventional via fabrication techniques for printed circuit boards (PCBs) generate resin smears during drilling, requiring wet processes that produce harmful waste and are not cost-effective due to slow plasma etching rates.

Method used

A curable composition comprising maleimide resin, cyanate ester, polyphenylene ether oligomer, thermoplastic elastomer, epoxy resin, curing catalyst, additives, and boron nitride particles is used to enhance plasma etching rates without compromising electrical and mechanical properties.

Benefits of technology

The composition achieves higher plasma etching rates, reducing production time and environmental impact while maintaining low dielectric loss tangent and coefficient of thermal expansion, suitable for high-density PCB manufacturing.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2026101651000005
    Figure 2026101651000005
  • Figure 2026101651000001
    Figure 2026101651000001
  • Figure 2026101651000002
    Figure 2026101651000002
Patent Text Reader

Abstract

The present invention provides a curable composition and an insulating film. [Solution] This disclosure provides a curable composition comprising (a) a maleimide resin, (b) a cyanate ester, (c) a polyphenylene ether oligomer, (d) a thermoplastic elastomer, (e) an epoxy resin, (f) a curing catalyst, (g) an additive, and (h) an inorganic filler, particularly boron nitride particles. This disclosure also provides an insulating film comprising the aforementioned curable composition, which is particularly suitable for manufacturing printed circuit boards (PCBs). The insulating film exhibits excellent electrical properties, including a low dielectric loss tangent (Df) and a low coefficient of thermal expansion (CTE). Furthermore, the insulating film offers significant advantages in reducing production time in PCB manufacturing processes involving plasma etching steps.
Need to check novelty before this filing date? Find Prior Art