Processing apparatus and processing method

Abstract

It is possible to suppress the accumulation of processing debris inside the processing chamber cover. [Solution] The processing apparatus 1 comprises a holding table unit 10 for holding a workpiece 200, a processing unit 20 for performing cutting on the workpiece 200 held by the holding table unit 10, and a processing chamber cover that houses an X-axis moving unit 41 for moving the holding table unit 10 and the processing unit 20 relative to each other in the X-axis direction. The holding table unit 10 has a fluid supply unit 60 that supplies fluid to the processing chamber cover, and the processing chamber cover is cleaned by the fluid supply unit 60 as the holding table unit 10 moves in the X-axis direction.

Description

Technical Field

[0001] The present invention relates to a processing apparatus and a processing method.

Background Art

[0002] As a processing apparatus for processing a wafer having a device formed on its surface, a grinding apparatus for grinding and thinning the wafer from the back surface, a cutting apparatus for cutting the thinned wafer along a division planned line on the surface into chips, etc. are known (for example, see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In these processing apparatuses, since processing is performed while supplying processing water to the wafer, the processing chips mixed with the processing water become mist and scatter into the processing chamber cover. The processing chips that have scattered in a mist form adhere to the inner surface of the processing chamber cover, and when they fall onto the wafer, the quality of the device is deteriorated, and when they accumulate in the processing chamber cover, cleaning becomes difficult.

[0005] An object of the present invention is to provide a processing apparatus and a processing method capable of suppressing the accumulation of processing chips in a processing chamber cover.

Means for Solving the Problems

[0006] To solve the above-mentioned problems and achieve the objective, the present invention provides a processing apparatus comprising a processing chamber cover that houses a holding table unit for holding a workpiece, a processing unit for processing the workpiece held by the holding table unit, and a processing feed unit for moving the holding table unit and the processing unit relative to each other in the processing feed direction, wherein the holding table unit has a fluid supply unit for supplying fluid to the processing chamber cover, and the processing chamber cover is cleaned by the fluid supply unit in conjunction with the processing feed.

[0007] In the processing apparatus described above, the holding table unit consists of a holding table for holding a workpiece and a holding table support base that rotatably supports the holding table, and the fluid supply unit may be disposed on the holding table support base.

[0008] In the aforementioned processing apparatus, the fluid supply unit may be arranged on the holding table provided in the holding table unit.

[0009] The processing method of the present invention is a processing method using the processing apparatus described above, and is characterized by comprising: a holding step of holding a workpiece with a holding table unit; a processing step of processing the workpiece held by the holding table unit with a processing unit; and a cleaning step of supplying fluid from the fluid supply unit in conjunction with the processing feed in the processing step to clean the processing chamber cover. [Effects of the Invention]

[0010] This invention has the effect of suppressing the accumulation of processing debris inside the processing chamber cover. [Brief explanation of the drawing]

[0011] [Figure 1] Figure 1 is a perspective view showing an example of the configuration of a processing apparatus according to Embodiment 1. [Figure 2] Figure 2 is a schematic side view showing the holding table unit of the processing apparatus shown in Figure 1. [Figure 3]Figure 3 is a schematic plan view showing the holding table unit of the processing apparatus shown in Figure 1. [Figure 4] Figure 4 is a flowchart showing the flow of the processing method according to Embodiment 1. [Figure 5] Figure 5 is a schematic side view showing the holding table unit of the processing apparatus according to Embodiment 2. [Modes for carrying out the invention]

[0012] Embodiments for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by those skilled in the art, and those that are substantially the same. In addition, the components described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the components can be made without departing from the spirit of the present invention.

[0013] [Embodiment 1] A processing apparatus according to Embodiment 1 of the present invention will be described based on the drawings. Figure 1 is a perspective view showing an example of the configuration of the processing apparatus according to Embodiment 1. Figure 2 is a schematic side view showing the holding table unit of the processing apparatus shown in Figure 1. Figure 3 is a schematic top view showing the holding table unit of the processing apparatus shown in Figure 1.

[0014] (Workpiece) The processing apparatus 1 shown in Figure 1 according to Embodiment 1 is a cutting apparatus for cutting a workpiece 200. The workpiece 200 to be processed by the processing apparatus 1 according to Embodiment 1 is a wafer such as a disc-shaped semiconductor wafer or optical device wafer with a substrate of silicon, gallium arsenide, SiC (silicon carbide), or sapphire. As shown in Figure 1, the workpiece 200 has a device 203 formed in a grid-like region partitioned by a plurality of division lines 202 formed in a grid pattern on the surface 201.

[0015] The device 203 is, for example, an integrated circuit such as an IC (Integrated Circuit) or LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor), a MEMS (Micro Electro Mechanical Systems), or various memories (semiconductor memory devices).

[0016] Further, the workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer in which the central portion is thinned and a thick portion is formed on the outer peripheral portion. In addition to the wafer, a resin package substrate such as a rectangular QFN (Quad Flat No leaded) package substrate having a plurality of devices sealed with resin, a ceramic substrate, a ferrite substrate, or a substrate containing at least one of nickel and iron, a glass substrate, etc. may also be used.

[0017] In Embodiment 1, the workpiece 200 is supported within the opening 207 of the annular frame 205 by attaching the central portion of the tape 206 to which the annular frame 205 is attached to the outer peripheral edge on the back surface 204.

[0018] (Processing device) The processing device 1 according to Embodiment 1 is a cutting device that holds the workpiece 200 on the holding table 11 of the holding table unit 10 and cuts the division planned line 202 with the cutting blade 21 to divide the workpiece 200 along the division planned line 202 into individual devices 203.

[0019] As shown in FIG. 1, the processing device 1 includes a holding table unit 10 that holds the workpiece 200, a processing unit 20 that performs cutting processing on the workpiece 200 held by the holding table unit 10 with the cutting blade 21, an imaging unit that images the workpiece 200 held by the holding table unit 10, and a control unit 100.

[0020] Further, as shown in FIG. 2, the processing apparatus 1 includes a moving unit 40 that relatively moves the holding table unit 10 and the processing unit 20. The moving unit 40 includes an X-axis moving unit 41 (shown in FIG. 2) that is a processing feed unit for feeding the holding table unit 10 in the X-axis direction (corresponding to the processing feed direction) parallel to the horizontal direction, a Y-axis moving unit (not shown) that is an indexing feed unit for indexing and feeding the processing unit 20 in the Y-axis direction parallel to the horizontal direction and orthogonal to the X-axis direction, a Z-axis moving unit (not shown) that is a cutting feed unit for cutting and feeding the processing unit 20 in the Z-axis direction parallel to the vertical direction orthogonal to both the X-axis direction and the Y-axis direction, and at least a rotational moving unit 44 (shown in FIG. 2) that rotates the holding table unit 10 about an axis parallel to the Z-axis direction.

[0021] The X-axis moving unit 41 is installed on the apparatus main body 2. The X-axis moving unit 41 relatively moves the holding table unit 10 and the processing unit 20 in the X-axis direction by moving the holding table support base 13 of the holding table unit 10 in the X-axis direction, which is the processing feed direction, together with the rotational moving unit 44.

[0022] The Y-axis moving unit is installed on a gantry-shaped support frame (not shown) erected from the apparatus main body 2. The Y-axis moving unit moves the processing unit 20 in the Y-axis direction with respect to the holding table unit 10 that holds the workpiece 200.

[0023] The Z-axis moving unit is installed on a moving frame (not shown) that is moved in the Y-axis direction by the Y-axis moving unit. The Z-axis moving unit moves the processing unit 20 in the Z-axis direction with respect to the holding table unit 10 that holds the workpiece 200.

[0024] The X-axis moving unit 41, the Y-axis moving unit, and the Z-axis moving unit each include a well-known ball screw rotatably mounted around its axis, a well-known motor for rotating the ball screw around its axis, and a well-known guide rail for supporting the holding table unit 10 or the machining unit 20 so that it can move in the X-axis, Y-axis, or Z-axis direction.

[0025] The rotary movement unit 44 is installed on the holding table support base 13 of the holding table unit 10. The rotary movement unit 44 is equipped with a well-known motor or the like that rotates the holding table 11 of the holding table unit 10 around its axis.

[0026] The holding table unit 10 comprises a holding table 11, a frame clamp 12, and a holding table support base 13. The holding table 11 is disc-shaped, and its holding surface 14 for holding the workpiece 200 is formed from porous ceramic or the like. The holding surface 14 of the holding table 11 is connected to a vacuum suction source (not shown), and the workpiece 200 placed on the holding surface 14 is held in place by suction from the vacuum suction source. In Embodiment 1, the holding table 11 suctions and holds the back surface 204 of the workpiece 200 via a tape 206.

[0027] Furthermore, the holding table 11 is mounted on the rotary movement unit 44. The holding table 11 is provided by the X-axis movement unit 41 so as to be movable in the X-axis direction across the machining area below the machining unit 20 and the loading / unloading area where the workpiece 200 is loaded and unloaded, separated from below the machining unit 20. The holding table 11 is provided by the rotary movement unit 44 so as to be rotatable around an axis parallel to the Z-axis direction.

[0028] Multiple frame clamps 12 are provided around the holding table 11. The frame clamps 12 clamp the frame 205.

[0029] The holding table support base 13 is moved in the X-axis direction by the X-axis movement unit 41. The holding table support base 13 has a rotational movement unit 44 installed on its upper surface. The holding table support base 13 supports the holding table 11 so that it can rotate around its axis by installing the rotational movement unit 44 on its upper surface, which rotates the holding table 11 around its axis.

[0030] Furthermore, retractable bellows 15 are attached to both ends of the holding table support base 13 in the X-axis direction, covering the X-axis movement unit 41.

[0031] The machining unit 20 is a cutting unit to which a cutting blade 21 for cutting a workpiece 200 held by the holding table 11 is detachably mounted. The machining unit 20 is attached to a second moving frame 5 (shown in Figure 1) which is movable in the Z-axis direction by a Z-axis moving unit. The machining unit 20 is provided to be movable in the Y-axis direction by a Y-axis moving unit and also movable in the Z-axis direction by a Z-axis moving unit relative to the workpiece 200 held by the holding table 11. The machining unit 20 allows the cutting blade 21 to be positioned at any position on the holding surface 14 of the holding table 11 by the Y-axis moving unit and the Z-axis moving unit.

[0032] As shown in Figure 2, the machining unit 20 includes a cutting blade 21, a spindle housing 22 (shown in Figure 1) attached to the lower end of the second moving frame 5 and movable in the Y-axis and Z-axis directions by a Y-axis moving unit and a Z-axis moving unit, a spindle 23 which serves as a rotation axis and is rotatably mounted in the spindle housing 22 around its axis, a spindle motor (not shown) that rotates the spindle 23 around its axis, and a cutting fluid supply nozzle 24 that supplies cutting fluid to the cutting blade 21.

[0033] The cutting blade 21 is an extremely thin cutting wheel having a substantially ring shape for cutting the workpiece 200. In Embodiment 1, as shown in Figure 2, the cutting blade 21 is a so-called hub blade having an annular cutting edge 211 for cutting the workpiece 200 and an annular base 212 on which the cutting edge 211 is provided at the outer edge. The cutting edge 211 is made of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material (binder) such as metal or resin, and is formed to a predetermined thickness. In this invention, the cutting blade 21 may also be a so-called washer blade consisting only of the cutting edge 211.

[0034] The spindle housing 22 is attached to the lower end of the second moving frame 5 and is supported so as to be movable in the Z-axis direction by the Z-axis moving unit, and is also supported so as to be movable in the Y-axis direction by the Y-axis moving unit via the Z-axis moving unit and the moving frame. The spindle housing 22 houses the portion of the spindle 23 excluding the tip and a spindle motor (not shown), and supports the spindle 23 so as to be rotatable around its axis.

[0035] The spindle 23 has a cutting blade 21 detachably fixed to its tip. The spindle 23 is rotated by a spindle motor (not shown), and the cutting blade 21 is mounted on its tip. The axes of the spindle 23 and the cutting blade 21 of the processing unit 20 are parallel to the Y-axis direction.

[0036] The imaging unit images the workpiece 200 held on the holding table 11 and acquires the image. The imaging unit is fixed to the machining unit 20 so as to move integrally with the machining unit 20. The imaging unit is equipped with an image sensor that images the area to be machined on the workpiece 200 held on the holding table 11 before machining. The image sensor is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor. The imaging unit images the workpiece 200 held on the holding table 11 to acquire an image for performing alignment, such as aligning the workpiece 200 with the cutting blade 21, and outputs the acquired image to the control unit 100.

[0037] Furthermore, the processing apparatus 1 is equipped with a processing chamber cover 50, as shown in Figures 1 and 3. The processing chamber cover 50 covers and houses the holding table unit 10, the processing unit 20, and the X-axis moving unit 41. As shown in Figure 3 and other figures, the processing chamber cover 50 is equipped with a plurality of upright walls 51 erected from the apparatus body 2, and a ceiling wall 52 (shown in Figure 1) connected to the upper ends of the upright walls 51.

[0038] The vertical walls 51 of the processing chamber cover 50 include a pair of X-axis vertical walls 511 that are parallel to the X-axis direction in a plan view, and a pair of Y-axis vertical walls 512 that are parallel to the Y-axis direction in a plan view and are connected to the ends of the pair of X-axis vertical walls 511.

[0039] Furthermore, the holding table unit 10 of the processing apparatus 1 has a fluid supply unit 60, as shown in Figure 2. The fluid supply unit 60 supplies fluid 62 (shown in Figure 3, and in Embodiment 1, pure water) to the inner surface of the processing chamber cover 50. In Embodiment 1, the fluid supply unit 60 has a plurality of holes 61 that open on both outer surfaces 131, 132 (shown in Figure 3) of the holding table support base 13 that are parallel to the X-axis direction. Thus, in Embodiment 1, the fluid supply unit 60 is disposed on the holding table support base 13.

[0040] The fluid supply unit 60 sprays fluid 62 from the holes 61 as the holding table 11 moves in the X-axis direction (i.e., as the machine feed progresses), thereby spraying the fluid 62 towards the inner surface of the machine chamber cover 50, particularly the X-axis vertical wall 511. The fluid supply unit 60 cleans the inner surface of the machine chamber cover 50, particularly the X-axis vertical wall 511, by spraying fluid 62 from the holes 61 as the holding table 11 moves in the X-axis direction.

[0041] Furthermore, the processing apparatus 1 includes a cassette elevator 70 on which a cassette 6 containing the workpiece 200 before and after cutting is placed and which moves the cassette 6 in the Z-axis direction, a cleaning unit (not shown) for cleaning the workpiece 200 after cutting, and a transport unit (not shown) for transporting the workpiece 200 between the cassette 6, the holding table unit 10, and the cleaning unit.

[0042] The control unit 100 controls each component of the processing device 1 to cause the processing device 1 to perform processing operations on the workpiece 200. The control unit 100 is a computer having an arithmetic processing unit with a microprocessor such as a CPU (central processing unit), a storage device with memory such as ROM (read-only memory) or RAM (random access memory), and an input / output interface device. The arithmetic processing unit of the control unit 100 performs calculations according to the computer program stored in the storage device and outputs control signals for controlling the processing device 1 to each component of the processing device 1 via the input / output interface device.

[0043] The control unit 100 is connected to a display unit 110, which consists of a liquid crystal display device that displays the status of the machining operation and captured images, an input unit 120 used by the operator to register machining conditions, and a notification unit (not shown). The input unit 120 includes a touch panel provided on the display unit 110. The notification unit notifies the operator by emitting at least one of sound and / or light.

[0044] (Processing method) Next, the processing method according to Embodiment 1 will be described. Figure 4 is a flowchart showing the flow of the processing method according to Embodiment 1. The processing method according to Embodiment 1 is a method for processing a workpiece 200 using the processing apparatus 1 with the configuration described above. The processing method according to Embodiment 1 is also the processing operation of the processing apparatus 1 with the configuration described above.

[0045] First, in Embodiment 1, the processing apparatus 1 has a cassette 6 containing multiple workpieces 200 placed on a cassette elevator 70, and the control unit 100 receives processing conditions input by the operator using an input unit 120, etc., and stores the processing conditions in the control unit 100. In Embodiment 1, when the control unit 100 receives a processing start instruction input by the operator using an input unit 120, etc., the processing apparatus 1 starts the processing operation, that is, the processing method according to Embodiment 1. As shown in Figure 4, the processing method according to Embodiment 1 includes a holding step 301, a processing step 302, a cleaning step 303, and a discharge step 304.

[0046] (Holding step) Next, the holding step 301 will be described. The holding step 301 is the step of holding the workpiece 200 with the holding table unit 10. In Embodiment 1, in the holding step 301, the processing apparatus 1 has a control unit 100 that starts the rotation of the spindle 23, i.e., the cutting blade 21, of the processing unit 20 and starts supplying cutting fluid to the cutting blade 21.

[0047] In Embodiment 1, during the holding step 301, the processing apparatus 1 controls the cassette elevator 70 and the transport unit, etc., with the control unit 100 to remove one workpiece 200 before cutting from the cassette 6 and place it on the holding surface 14 of the holding table 11 of the holding table unit 10 located in the loading / unloading area, with the back surface 204 side of the workpiece 200 facing upwards.

[0048] In Embodiment 1, during the holding step 301, the processing apparatus 1, through the control unit 100, suction-holds the back surface 204 of the workpiece 200 to the holding surface 14 of the holding table 11 of the holding table unit 10 positioned in the loading / unloading area via tape 206, and clamps the frame 205 with frame clamp 12.

[0049] (Processing step) The machining step 302 is a step in which the machining unit 20 performs cutting on the workpiece 200 held in the holding table unit 10. In Embodiment 1, in the machining step 302, the machining apparatus 1 has the control unit 100 control the moving unit 40 to position the holding table 11 of the holding table unit 10, which holds the workpiece 200, in the machining area, and has the imaging unit image the workpiece 200, and performs alignment based on the image acquired and the machining conditions.

[0050] In Embodiment 1, in processing step 302, the processing apparatus 1 controls the movement unit 40 via the control unit 100 to move the cutting blade 21 and the workpiece 200 relative to each other along the planned division line 202, causing the cutting edge 211 of the cutting blade 211 to cut into the planned division line 202 until it reaches the tape 206, thereby cutting the planned division line 202. In Embodiment 1, the processing apparatus 1 cuts all of the planned division lines 202 of the workpiece 200. When the cutting blade 21 cuts the workpiece 200 in processing step 302, processing debris is generated, and the generated processing debris is scattered within the processing chamber cover 50 along with a mist consisting of cutting water.

[0051] (Washing step) The cleaning step 303 is a step in which the processing chamber cover 50 is cleaned by supplying fluid 62 from the fluid supply unit 60 in conjunction with the movement of the holding table unit 10 in the X-axis direction, which is the processing feed in the processing step 302. In Embodiment 1, the cleaning step 303 is performed simultaneously with the processing step 302.

[0052] In Embodiment 1, during the cleaning step 303, the processing apparatus 1 has a control unit 100 that sprays fluid 62 from the holes 61 of the fluid supply unit 60 toward the inner surface of the processing chamber cover 50, particularly the vertical wall 511 in the X-axis direction. That is, in Embodiment 1, during the cleaning step 303, the processing apparatus 1 has a control unit 100 that sprays fluid 62 from the holes 61 of the fluid supply unit 60 at the start of the processing step 302 to clean the inner surface of the processing chamber cover 50, particularly the vertical wall 511 in the X-axis direction, and remove processing debris from the inner surface.

[0053] In Embodiment 1, during the cleaning step 303, the processing apparatus 1 injects fluid 62 from the holes 61 of the fluid supply unit 60 while the control unit 100 moves the holding table unit 10 in the X-axis direction during the processing step 302.

[0054] (Removal step) The unloading step 304 is the step of unloading the machined workpiece 200 from the holding table 11 of the holding table unit 10 and storing the workpiece 200 in the cassette 6. In Embodiment 1, in the unloading step 304, the processing apparatus 1 is controlled by the control unit 100, which controls the moving unit 40 to move the processing unit 20 away from the holding table unit 10.

[0055] In Embodiment 1, during the unloading step 304, the control unit 100 of the processing apparatus 1 positions the holding table unit 10 in the loading / unloading area, stops the suction holding of the workpiece 200 on the holding table 11 of the holding table unit 10, and releases the clamp of the frame clamp 12 on the frame 205. The control unit 100 of the processing apparatus 1 transports the workpiece 200 to the washing unit using the transport unit, washes the workpiece 200 in the washing unit, and loads the workpiece 200 into the cassette 6. In Embodiment 1, during the processing method, the control unit 100 of the processing apparatus 1 repeats the holding step 301, processing step 302, washing step 303, and unloading step 304 to cut all the workpieces 200 in the cassette 6 and completes the processing operation.

[0056] As described above, the processing apparatus 1 and processing method according to Embodiment 1 spray fluid 62 from the holes 61 of the fluid supply unit 60 provided on the holding table unit 10 which moves in the X-axis direction toward the X-axis vertical wall 511 while the processing step 302 is being performed. As a result, while the processing apparatus 1 and processing method according to Embodiment 1 are performing the processing step 302, the fluid sprayed from the holes 61 of the fluid supply unit 60 collides with the X-axis vertical wall 511, and the inner surface of the processing chamber cover 50 is cleaned by the fluid.

[0057] As a result, the processing apparatus 1 and processing method according to Embodiment 1 have the effect of suppressing processing debris that adheres to the inner surface of the processing chamber cover 50, particularly the inner surface of the vertical wall 511 in the X-axis direction, and suppressing the accumulation of processing debris inside the processing chamber cover 50, thereby suppressing the adhesion of processing debris to the device 203, i.e., suppressing the deterioration of the quality of the device 203.

[0058] Furthermore, the processing apparatus 1 and processing method according to Embodiment 1 have a fluid supply unit 60 installed on the holding table support base 13 which moves in the X-axis direction of the holding table unit 10. This allows for cleaning of the inner surface of the processing chamber cover 50 over a wide area without adding a new operating axis, and also has the effect of preventing a decrease in productivity by cleaning the inner surface of the processing chamber cover 50 simultaneously with the cutting process.

[0059] [Embodiment 2] The processing apparatus according to Embodiment 2 will be described based on the drawings. Figure 5 is a schematic side view showing the holding table unit of the processing apparatus according to Embodiment 2. In Figure 5, the same reference numerals are used for the same parts as in Embodiment 1, and their descriptions are omitted.

[0060] The processing apparatus according to Embodiment 2 is the same as Embodiment 1, except that the holes 61 of the fluid supply unit 60 are arranged on the outer circumferential surface 111 of the holding table 11 of the holding table unit 10, as shown in Figure 5. In the processing apparatus 1 according to Embodiment 2, while the processing step 302 is being performed, in the cleaning step 303, fluid 62 is injected from the holes 61 of the fluid supply unit 60, which is arranged on the outer circumferential surface 111 of the holding table 11 of the holding table unit 10 that moves in the X-axis direction.

[0061] The processing apparatus 1 and processing method according to Embodiment 2 spray fluid 62 from holes 61 of a fluid supply unit 60 provided on a holding table unit 10 that moves in the X-axis direction toward the X-axis vertical wall 511 while the processing step 302 is being performed. Therefore, similar to Embodiment 1, processing debris adhering to the inner surface of the processing chamber cover 50, especially the inner surface of the X-axis vertical wall 511, can be suppressed, the accumulation of processing debris inside the processing chamber cover 50 can be suppressed, and the adhesion of processing debris to the device 203, i.e., the deterioration of the quality of the device 203 can be suppressed.

[0062] It should be noted that the present invention is not limited to the embodiments described above. That is, it can be implemented with various modifications without departing from the core principles of the present invention. [Explanation of Symbols]

[0063] 1 Processing equipment 10 Holding Table Unit 11 Retention Table 13. Holding table support base 20 processing units 41 X-axis movement unit (machining feed unit) 50 Processing chamber cover 60 Fluid supply section 62 Fluid 200 Workpiece 301 Holding step 302 Machining Steps 303 Cleaning Step X Machining feed direction

Claims

1. A machining apparatus comprising a holding table unit for holding a workpiece, a machining unit for machining the workpiece held by the holding table unit, and a machining chamber cover that houses the holding table unit and the machining unit relative to each other in the machining feed direction, The processing apparatus is characterized in that the holding table unit has a fluid supply unit that supplies fluid to the processing chamber cover, and the processing chamber cover is cleaned by the fluid supply unit as the material is fed through the processing chamber.

2. The holding table unit consists of a holding table for holding the workpiece and a holding table support base that rotatably supports the holding table. The processing apparatus according to claim 1, characterized in that the fluid supply unit is disposed on the holding table support base.

3. The processing apparatus according to claim 1, characterized in that the fluid supply unit is disposed on the holding table provided in the holding table unit.

4. A processing method using the processing apparatus described in claim 1, A holding step in which the workpiece is held by a holding table unit, A processing step in which a workpiece held in the holding table unit is processed by a processing unit, A cleaning step in which fluid is supplied from the fluid supply unit in conjunction with the processing feed in the processing step to clean the processing chamber cover, A processing method having the following characteristics.

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